技术领域technical field
本申请涉及移动通信技术领域，尤其涉及移动设备技术领域，具体涉及一种电子设备。The present application relates to the technical field of mobile communication, in particular to the technical field of mobile equipment, and in particular to an electronic equipment.
背景技术Background technique
随着通信技术的发展，诸如智能手机等电子设备越来越普及。随着全面屏概念的普及，消费者对屏占比的要求越来越高，则窄边框也成为了终端厂商追求的目标。With the development of communication technology, electronic devices such as smartphones are becoming more and more popular. With the popularization of the full screen concept, consumers have higher and higher requirements for the screen ratio, and narrow bezels have also become the goal pursued by terminal manufacturers.
由于智能终端的技术要求，触摸屏与壳体之间通常通过点胶进行固定，以防止触摸屏与壳体分离。然而，受限于窄边框的要求，触摸屏与壳体的点胶接触位置的宽度往往较小，导致触摸屏与壳体的粘接力不够，在使用过程中容易出现触摸屏脱胶的情况。Due to the technical requirements of the smart terminal, the touch screen and the housing are usually fixed by dispensing glue to prevent the touch screen from being separated from the housing. However, limited by the requirement of a narrow frame, the width of the contact position between the touch screen and the housing is usually small, resulting in insufficient adhesion between the touch screen and the housing, and the touch screen is prone to deglue during use.
实用新型内容Utility model content
本申请实施例提供一种电子设备，可以提升屏占比，且防止触摸屏脱胶。The embodiment of the present application provides an electronic device, which can increase the screen ratio and prevent the touch screen from being glued.
本申请实施例提供一种电子设备，包括壳体、玻璃盖板和显示模组，所述壳体包括基板以及自基板周缘延伸的侧壁，所述侧壁围绕形成一收容空间，所述玻璃盖板盖设在所述壳体的侧壁上，所述玻璃盖板与所述壳体的接触面上设置有溢胶槽与突出部分，所述突出部分为沿所述壳体侧壁的周缘在所述接触面上形成的闭合结构，所述玻璃盖板和所述壳体之间设置有胶体，所述壳体的接触面通过所述胶体与所述玻璃盖板粘接。An embodiment of the present application provides an electronic device, which includes a housing, a glass cover and a display module. The housing includes a substrate and a side wall extending from the periphery of the substrate. The cover plate is arranged on the side wall of the housing, and the contact surface between the glass cover plate and the housing is provided with a glue overflow groove and a protruding part, and the protruding part is along the side wall of the housing. The peripheral edge forms a closed structure on the contact surface, colloid is provided between the glass cover plate and the housing, and the contact surface of the housing is bonded to the glass cover plate through the colloid.
本申请实施例提供的电子设备，包括壳体，所述壳体包括基板以及自基板周缘延伸的侧壁，所述侧壁围绕形成一收容空间；玻璃盖板，盖设在所述壳体的侧壁上；显示模组，设置在所述玻璃盖板下方且位于所述收容空间内，所述玻璃盖板与所述壳体的接触面上设置有溢胶槽与突出部分，所述突出部分为沿所述壳体侧壁的周缘在所述接触面上形成的闭合结构，所述玻璃盖板和所述壳体之间设置有胶体，所述壳体的接触面通过所述胶体与所述玻璃盖板粘接。本申请实施例通过在壳体的接触面上设置溢胶槽与突出部分，可以有效的增加触摸屏玻璃盖板与壳体之间的粘接力，以实现超窄边框点胶技术，提升屏占比，且防止触摸屏脱胶，且突出部分可以阻挡液体流入电子设备内腔，以达到防水的效果。The electronic device provided by the embodiment of the present application includes a casing, the casing includes a substrate and a side wall extending from the periphery of the substrate, and the side wall surrounds and forms a receiving space; a glass cover is arranged on the casing On the side wall: the display module is arranged under the glass cover and is located in the receiving space, and the contact surface between the glass cover and the housing is provided with a glue overflow groove and a protruding part, and the protruding Part of it is a closed structure formed on the contact surface along the periphery of the side wall of the housing, a colloid is arranged between the glass cover and the housing, and the contact surface of the housing is passed through the colloid and the housing. The glass cover plate is bonded. In the embodiment of the present application, by setting the glue overflow groove and the protruding part on the contact surface of the housing, the adhesive force between the glass cover of the touch screen and the housing can be effectively increased, so as to realize the ultra-narrow frame dispensing technology and increase the screen occupation. Ratio, and prevent the touch screen from degumming, and the protruding part can prevent liquid from flowing into the inner cavity of the electronic device, so as to achieve the waterproof effect.
附图说明Description of drawings
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。The technical solutions and other beneficial effects of the present application will be apparent through the detailed description of the specific embodiments of the present application below in conjunction with the accompanying drawings.
图1为本申请实施例提供的一种电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
图2为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 2 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图3为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 3 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图4为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 4 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图5为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 5 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图6为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 6 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图7为本申请实施例提供的一种电子设备的接触面的结构示意图。FIG. 7 is a schematic structural diagram of a contact surface of an electronic device provided by an embodiment of the present application.
图8为本申请实施例提供的一种电子设备的接触面的另一结构示意图。FIG. 8 is another schematic structural diagram of a contact surface of an electronic device provided by an embodiment of the present application.
图9为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 9 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图10为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 10 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图11为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 11 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图12为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 12 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图13为本申请实施例提供的一种电子设备的另一结构示意图。FIG. 13 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and arrangements of specific examples are described below. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.
具体的，请参阅图1及图2，图1为本申请实施例提供的一种电子设备的结构示意图，图2为本申请实施例提供的一种电子设备的另一结构示意图。本申请实施例提供一种电子设备，该电子设备可以为智能手机、平板电脑等电子设备。参考图1，该电子设备100包括盖板10、显示模组20、电路板30及壳体50。Specifically, please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application, and FIG. 2 is a schematic structural diagram of another electronic device provided by an embodiment of the present application. An embodiment of the present application provides an electronic device, and the electronic device may be an electronic device such as a smart phone or a tablet computer. Referring to FIG. 1 , the electronic device 100 includes a cover 10 , a display module 20 , a circuit board 30 and a casing 50 .
其中，盖板10安装到显示模组20上，以覆盖显示模组20。盖板10可以为透明玻璃盖板。在一些实施例中，盖板10可以是用诸如蓝宝石等材料制成的玻璃盖板。在一些实施例中，盖板10也可以为能够实现触控的触摸屏玻璃盖板。Wherein, the cover plate 10 is installed on the display module 20 to cover the display module 20 . The cover plate 10 may be a transparent glass cover plate. In some embodiments, the cover plate 10 may be a glass cover plate made of materials such as sapphire. In some embodiments, the cover 10 may also be a touch screen glass cover capable of touch control.
显示模组20安装在壳体50上，以形成电子设备100的显示面。显示模组20作为电子设备100的前壳，与壳体50形成一封闭空间，用于容纳电子设备100的其他电子元件。同时，显示模组20形成电子设备100的显示面，用于显示图像、文本等信息。其中，该显示模组20可以为触摸屏，用于接收触控信号，并相应该触控信号，且在显示面上进行相应输出，以实现人机交互。比如，该显示模组20可以为透明显示屏。例如，该显示模组20可以包括OLED显示屏、LCD显示屏等。The display module 20 is installed on the casing 50 to form a display surface of the electronic device 100 . The display module 20 serves as the front shell of the electronic device 100 and forms a closed space with the casing 50 for accommodating other electronic components of the electronic device 100 . Meanwhile, the display module 20 forms a display surface of the electronic device 100 for displaying information such as images and texts. Wherein, the display module 20 can be a touch screen, which is used to receive touch signals, respond to the touch signals, and output correspondingly on the display surface, so as to realize human-computer interaction. For example, the display module 20 can be a transparent display screen. For example, the display module 20 may include an OLED display, an LCD display and the like.
如图1所示，显示模组20可以包括非显示区域201与显示区域202。该非显示区域201的顶部区域可以开设供声音、及光线传导的开孔，该非显示区域201底部区域可以设置指纹模组、触控按键等功能组件。该显示区域202可以用来显示电子设备100的画面或者供用户进行触摸操控等。其中该盖板10安装到显示模组20上，以覆盖显示模组20，形成与显示模组20相同的显示区域和非显示区域，具体可以参阅显示模组20的显示区域和非显示区域。需要说明的是，该显示模组20的结构并不限于此。比如，显示模组20还可以为异形屏。As shown in FIG. 1 , the display module 20 may include a non-display area 201 and a display area 202 . The top area of the non-display area 201 can be provided with openings for sound and light transmission, and the bottom area of the non-display area 201 can be provided with functional components such as fingerprint modules and touch buttons. The display area 202 can be used for displaying the screen of the electronic device 100 or for the user to perform touch manipulation and the like. Wherein the cover plate 10 is installed on the display module 20 to cover the display module 20 to form the same display area and non-display area as the display module 20 , please refer to the display area and non-display area of the display module 20 for details. It should be noted that the structure of the display module 20 is not limited thereto. For example, the display module 20 can also be a special-shaped screen.
如图2所示，显示模组20可以为全面屏，可以实现全屏显示。As shown in FIG. 2 , the display module 20 can be a full screen, which can realize full screen display.
电路板30安装在壳体50内部，以将电路板30收容在上述封闭空间内。电路板30可以为电子设备100的主板。电路板30上设置有接地点，以实现电路板30的接地。电路板30上可以集成有摄像头、处理器等功能组件。同时，显示模组20可以电连接至电路板30。The circuit board 30 is installed inside the casing 50 to accommodate the circuit board 30 in the above-mentioned closed space. The circuit board 30 may be a main board of the electronic device 100 . A grounding point is provided on the circuit board 30 to realize the grounding of the circuit board 30 . Functional components such as a camera and a processor may be integrated on the circuit board 30 . Meanwhile, the display module 20 can be electrically connected to the circuit board 30 .
在一些实施例中，电路板30上设置有控制电路。其中，该控制电路与显示模组20连接，该控制电路向显示模组20输出电信号，以控制显示模组20显示信息、接收触控信号、亮屏或者息屏等。其中，该控制电路还可以与电子设备100中的处理器连接，以根据处理器的指令控制控制显示模组20显示信息、接收触控信号、亮屏或者息屏等。In some embodiments, a control circuit is disposed on the circuit board 30 . Wherein, the control circuit is connected with the display module 20, and the control circuit outputs electrical signals to the display module 20 to control the display module 20 to display information, receive touch signals, turn on or off the screen, and the like. Wherein, the control circuit can also be connected with the processor in the electronic device 100 to control the display module 20 to display information, receive touch signals, turn on or turn off the screen, etc. according to the instructions of the processor.
壳体50用于形成电子设备100的外部轮廓。壳体50的材质可以为塑料或金属。壳体50可以一体成型。壳体50也可以包括中框和后盖，中框和后盖固定连接形成一壳体50。The housing 50 is used to form the outer contour of the electronic device 100 . The material of the housing 50 can be plastic or metal. The casing 50 can be integrally formed. The housing 50 may also include a middle frame and a rear cover, and the middle frame and the rear cover are fixedly connected to form a housing 50 .
其中，壳体50用于形成电子设备100的外部轮廓。壳体50可以为金属壳体，比如铝合金壳体50。需要说明的是，本申请实施例壳体50的材料并不限于此，还可以采用其它方式，比如：壳体50可以陶瓷中框、玻璃中框。再比如：壳体50可以为塑胶中框。还比如：壳体50可以为金属和塑胶相互配合的结构，可以将塑胶部分注塑到金属板材上形成。Wherein, the casing 50 is used to form the outer contour of the electronic device 100 . The casing 50 may be a metal casing, such as an aluminum alloy casing 50 . It should be noted that the material of the housing 50 in the embodiment of the present application is not limited thereto, and other methods may also be used, for example, the housing 50 may have a ceramic middle frame or a glass middle frame. Another example: the casing 50 may be a plastic middle frame. For another example, the housing 50 may be a structure in which metal and plastic cooperate with each other, and the plastic part may be formed by injection molding onto a metal plate.
在一些实施例中，盖板10与显示模组20可以封装成一个独立的显示装置200，该显示装置200盖设在电子设备100的壳体50上。In some embodiments, the cover plate 10 and the display module 20 can be packaged into an independent display device 200 , and the display device 200 is covered on the casing 50 of the electronic device 100 .
在一些实施例中，盖板10与显示模组20可以不封装成一个独立的电子设备，而是作为电子设备100的独立元件逐一安装在电子设备100的壳体50上。In some embodiments, the cover plate 10 and the display module 20 may not be packaged into an independent electronic device, but installed on the casing 50 of the electronic device 100 as independent components of the electronic device 100 one by one.
请参阅图3、图4及图5，图3为图1中的电子设备100在X-X方向上的视图，图4为图1中另一结构的电子设备100在X-X方向上的视图，图5为图4的局部放大图。Please refer to Fig. 3, Fig. 4 and Fig. 5, Fig. 3 is the view on the X-X direction of the electronic device 100 in Fig. 1, Fig. 4 is the view on the X-X direction of the electronic device 100 of another structure in Fig. 1, Fig. 5 It is a partial enlarged view of Figure 4.
如图3或图4所示，该电子设备100，包括壳体50、玻璃盖板10和显示模组20。As shown in FIG. 3 or FIG. 4 , the electronic device 100 includes a casing 50 , a glass cover 10 and a display module 20 .
其中，壳体50包括基板51以及自基板51周缘延伸的侧壁52，侧壁52围绕形成一收容空间53。Wherein, the casing 50 includes a base plate 51 and a side wall 52 extending from the periphery of the base plate 51 , and the side wall 52 surrounds and forms a receiving space 53 .
玻璃盖板10，盖设在壳体50的侧壁52上。The glass cover 10 is disposed on the side wall 52 of the casing 50 .
显示模组20，设置在玻璃盖板10下方且位于收容空间53内，其中，显示模组20可以通过光学胶80与玻璃盖板10组合在一起。例如显示模组20可以为LCD液晶显示模组或者OLED显示模组，光学胶80可以为OCA光学胶。The display module 20 is disposed under the glass cover 10 and located in the receiving space 53 , wherein the display module 20 can be combined with the glass cover 10 through optical glue 80 . For example, the display module 20 may be an LCD liquid crystal display module or an OLED display module, and the optical adhesive 80 may be an OCA optical adhesive.
在一些实施例中，如图3所示，在壳体50的侧壁52的顶端形成台阶部521，玻璃盖板10搭接在台阶部521上，该台阶部521包覆该玻璃盖板10的周缘。In some embodiments, as shown in FIG. 3 , a step portion 521 is formed at the top of the side wall 52 of the housing 50 , the glass cover 10 is lapped on the step portion 521 , and the step portion 521 covers the glass cover 10 perimeter.
如图5所示，玻璃盖板10与壳体50的接触面54上设置有溢胶槽56与突出部分58，突出部分58为沿着壳体侧壁52的周缘形成的闭合结构，玻璃盖板10和壳体50之间设置有胶体60，壳体50的接触面54通过胶体60与玻璃盖板10粘接。在本申请实施例中，通过在壳体50的接触面54上形成的溢胶槽56与突出部分58，在有限宽度的壳体边框上增大了接触面54与胶体60的接触面积，进而增大了胶体60与壳体50的粘接面积，增大粘接强度，以实现用最窄的点胶胶宽，实现超窄边框设计，提升屏占比，以达到防水的效果。As shown in Figure 5, the contact surface 54 between the glass cover plate 10 and the housing 50 is provided with a glue overflow groove 56 and a protruding part 58, the protruding part 58 is a closed structure formed along the periphery of the housing side wall 52, and the glass cover A glue 60 is provided between the board 10 and the casing 50 , and the contact surface 54 of the casing 50 is bonded to the glass cover 10 through the glue 60 . In the embodiment of the present application, through the glue overflow groove 56 and the protruding part 58 formed on the contact surface 54 of the housing 50, the contact area between the contact surface 54 and the glue 60 is increased on the limited width of the housing frame, and further The bonding area between the glue 60 and the housing 50 is increased, and the bonding strength is increased to realize the narrowest glue dispensing width, realize the ultra-narrow bezel design, increase the screen ratio, and achieve the waterproof effect.
其中，该溢胶槽56，可以设置壳体50的接触面54的边缘位置，该溢胶槽56可用于容纳溢出的胶体60，该溢胶槽56可以增加容胶量，能在一定程度上加强玻璃盖板10与壳体50的可靠连接，并保证胶体60不溢出到显示装置200或者电子设备100的外观面。在接触面54上形成的该溢胶槽56的内凹面可以增大该接触面54与胶体60的接触面积，以此增大胶体60与壳体50的粘接面积，增大粘接强度。Wherein, the overflowing glue groove 56 can be provided at the edge position of the contact surface 54 of the housing 50, and the overflowing glue groove 56 can be used to accommodate the overflowing glue 60, and the overflowing glue groove 56 can increase the glue holding capacity, and can to a certain extent Strengthen the reliable connection between the glass cover plate 10 and the housing 50 , and ensure that the colloid 60 does not overflow to the appearance surface of the display device 200 or the electronic device 100 . The concave surface of the glue overflow groove 56 formed on the contact surface 54 can increase the contact area between the contact surface 54 and the glue 60 , thereby increasing the bonding area between the glue 60 and the housing 50 and increasing the bonding strength.
其中，该突出部分58可以在该溢胶槽56的相邻位置进行设置。该突出部分58沿着壳体侧壁52的周缘形成的闭合结构，即在溢胶槽56围成的包围圈内再形成一个凸起的闭合圈。在接触面54上形成的该突出部分58的外凸面可以增大该接触面54与胶体60的接触面积，以此增大胶体60与壳体50的粘接面积，增大粘接强度。另外，当玻璃盖板10与壳体50之间出现开裂或者脱胶的情形时，该图突出部分58的顶部与盖板10之间距离较小，由于水的表面张力作用，水等液体会受到该突出部分的阻挡，进一步延缓或者避免水浸入到显示屏内，达到较好的防水效果。Wherein, the protruding portion 58 may be disposed adjacent to the glue overflow groove 56 . The protruding portion 58 forms a closed structure along the periphery of the housing side wall 52 , that is, forms a raised closed circle within the surrounding circle surrounded by the glue overflow groove 56 . The convex surface of the protruding portion 58 formed on the contact surface 54 can increase the contact area between the contact surface 54 and the colloid 60 , thereby increasing the bonding area between the colloid 60 and the housing 50 and increasing the bonding strength. In addition, when there is cracking or debonding between the glass cover plate 10 and the housing 50, the distance between the top of the protruding portion 58 and the cover plate 10 in this figure is small, and liquids such as water will be affected by the surface tension of water. The blocking of the protruding part further delays or prevents water from entering the display screen, so as to achieve a better waterproof effect.
其中，该胶体60可以为热熔胶，热熔胶是一种可塑性的粘合剂，在一定温度范围内其物理状态随温度改变而改变，而化学特性不变。相比于一般胶水而言，热熔胶的黏合强度更大，固化效果更佳。且更容易控制胶水的粗细，更能满足电子设备窄边框的设计要求。另外，热熔胶属于热塑性聚氨酯，使用热熔胶粘接的产品更易于拆卸或返修。例如，该热熔胶可以为PUR热熔胶，即为湿气固化反应型聚氨酯热熔胶，主要成分是端异氰酸酯聚氨酯预聚体，PUR热熔胶的粘接性和韧性(弹性)可调节，并有着优异的粘接强度、耐温性、耐化学腐蚀性和耐老化性。Wherein, the colloid 60 can be hot melt adhesive, which is a kind of plastic adhesive, and its physical state changes with temperature within a certain temperature range, but its chemical properties remain unchanged. Compared with ordinary glue, hot melt adhesive has higher bonding strength and better curing effect. And it is easier to control the thickness of the glue, which can better meet the design requirements of the narrow frame of the electronic device. In addition, hot-melt adhesives are thermoplastic polyurethanes, and products bonded with hot-melt adhesives are easier to disassemble or repair. For example, the hot-melt adhesive can be PUR hot-melt adhesive, which is a moisture-curing reactive polyurethane hot-melt adhesive. The main component is isocyanate-terminated polyurethane prepolymer. , and has excellent bonding strength, temperature resistance, chemical resistance and aging resistance.
例如，该胶体60可以为uv(UVglue，无影胶)胶，uv胶又称光敏胶、紫外光固化胶，uv胶是一种必须通过紫外线(Ultraviolet Rays，UV)光照射才能固化的一类胶粘剂，它可以作为粘接剂使用，也可作为油漆、涂料、油墨等的胶料使用。uv胶固化原理是UV固化材料中的光引发剂(或光敏剂)在紫外线的照射下吸收紫外光后产生活性自由基或阳离子，引发单体聚合、交联化学反应，使粘合剂在数秒钟内由液态转化为固态。例如，该胶体60可以采用黑色uv胶，该黑色uv胶可以实现挡光遮光，且具有粘接力强，固化快，点胶薄等特点，通过采用黑色uv胶来粘接玻璃盖板10与壳体50，即可以防止显示模组20漏光，又可以且防止玻璃盖板10脱胶，起到防水作用。For example, the colloid 60 can be uv (UVglue, shadowless glue) glue, uv glue is also called photosensitive glue, ultraviolet light curing glue, and uv glue is a kind of type that must be cured by ultraviolet (Ultraviolet Rays, UV) light irradiation Adhesive, it can be used as a bonding agent, and can also be used as a sizing material for paints, coatings, inks, etc. The principle of uv glue curing is that the photoinitiator (or photosensitizer) in the UV curing material absorbs ultraviolet light under the irradiation of ultraviolet rays to generate active free radicals or cations, triggering monomer polymerization and crosslinking chemical reactions, so that the adhesive can Converts from liquid to solid within the bell. For example, the colloid 60 can use black uv glue, which can block light and light, and has the characteristics of strong adhesion, fast curing, and thin glue dispensing. By using black uv glue to bond the glass cover plate 10 and The housing 50 can not only prevent the display module 20 from leaking light, but also prevent the glass cover plate 10 from degumming, so as to play a waterproof role.
例如，该胶体60可以为OCA(Optically Clear Adhesive，光学胶)胶等。OCA光学胶具有无色透明、高透光性(全光穿透率>99％)、高黏着力、高耐候、耐水性、耐高温、抗紫外线等特点，且具有受控制的厚度，能提供均匀的间距，长时间使用不会产生黄化、剥离及变质的问题。OCA光学胶是重要触摸屏的原材料之一，是一种无基体材料的双面贴合胶带。For example, the colloid 60 may be OCA (Optically Clear Adhesive, optical glue) glue or the like. OCA optical glue has the characteristics of colorless transparency, high light transmittance (total light transmittance >99%), high adhesion, high weather resistance, water resistance, high temperature resistance, UV resistance, etc., and has a controlled thickness, which can provide Uniform spacing, long-term use will not cause yellowing, peeling and deterioration problems. OCA optical adhesive is one of the raw materials for important touch screens, and it is a double-sided adhesive tape without a matrix material.
例如，该胶体60也可以为常温胶水或者背胶。For example, the colloid 60 can also be normal temperature glue or back glue.
本申请实施例提供的电子设备100，通过在玻璃盖板10与壳体50的接触面54上设置有溢胶槽56与突出部分58，玻璃盖板10和壳体50之间设置有胶体60，突出部分58沿壳体侧壁52的周缘形成闭合结构，玻璃盖板10和壳体50之间设置胶体60，可以有效的增加触摸屏玻璃盖板10与壳体50之间的粘接力，以实现超窄边框点胶技术，提升屏占比，且防止触摸屏脱胶，以达到防水的效果。In the electronic device 100 provided in the embodiment of the present application, the glue overflow groove 56 and the protruding part 58 are provided on the contact surface 54 between the glass cover plate 10 and the housing 50 , and the glue 60 is provided between the glass cover plate 10 and the housing 50 , the protruding part 58 forms a closed structure along the periphery of the side wall 52 of the housing, and the colloid 60 is arranged between the glass cover 10 and the housing 50, which can effectively increase the adhesive force between the touch screen glass cover 10 and the housing 50, In order to realize the ultra-narrow bezel dispensing technology, increase the screen ratio, and prevent the touch screen from degumming, so as to achieve the waterproof effect.
在一些实施例中，玻璃盖板10与胶体60之间设有油墨层70。其中，油墨层70可以由亲水性的油墨形成，比如油墨层70可以由高表面能或者低接触角等的亲水性油墨形成。高表面能或者低接触角的油墨具有高粘性，通过在玻璃盖板10与胶体60之间设置高粘性的油墨层70，可以确保玻璃盖板10与胶体60有效可靠粘接。In some embodiments, an ink layer 70 is disposed between the glass cover 10 and the colloid 60 . Wherein, the ink layer 70 may be formed of hydrophilic ink, for example, the ink layer 70 may be formed of hydrophilic ink with high surface energy or low contact angle. Inks with high surface energy or low contact angles have high viscosity. By providing a high-viscosity ink layer 70 between the glass cover 10 and the colloid 60 , effective and reliable bonding between the glass cover 10 and the colloid 60 can be ensured.
其中，粘接的作用是发生在相互接触的界面间，粘接作用的形成，一是湿润性，二是粘接力，两者必须同时兼备。湿润又称润湿，是液体在固体表面分子间力作用下的均匀铺展现象，也就是液体对固体的亲和性。液体的湿润主要由表面张力所引起的，液体和固体皆有表面张力，对液体称为表面张力，而固体称为表面能。湿润性主要由胶粘剂和被粘物的表面能所决定。胶粘剂对被粘物的湿润只是粘接的前提，还必须能够形成粘接力，才能达到粘接的目的。粘接力是指胶粘剂与被粘物之间的连接力，它的产生不仅取决于胶粘剂和被粘物表面的结构和状态，而且还与粘接过程的工艺条件密切相关，粘接力是胶粘剂被粘物在界面上的作用力或结合力，包括机械嵌合力、分子间力和化学键力等。润湿是粘接的先决条件。表面能与润湿性的关系，固体表面能的大小决定了其可润湿性质，液体在固体表面能自发铺展的基本条件是液体的表面能要小于固体的表面能，液体的表面能越低、固体的表面能越高越有利于铺展进行，反之不利于铺展进行。同一液体在表面能大的固体表面润湿性好，因此，表面能是影响粘接强度的重要因素，降低胶粘剂的表面能或增大被粘物的表面能可以增强胶粘剂在被粘物上的润湿性，从而提高粘接强度。在本申请实施例中，胶粘剂为胶体60，被粘物为玻璃盖板10，为了增大玻璃盖板10与胶体60之间的粘结强度，可以在玻璃盖板10下表面上喷涂高表面能的油墨层70。Among them, the role of bonding occurs between the interfaces that are in contact with each other. The formation of the bonding effect is one of wettability and the other of cohesive force. Both must be combined at the same time. Wetting, also known as wetting, is a phenomenon of uniform spreading of a liquid under the action of intermolecular forces on a solid surface, that is, the affinity of a liquid to a solid. The wetting of liquid is mainly caused by surface tension. Both liquid and solid have surface tension, which is called surface tension for liquid and surface energy for solid. The wettability is mainly determined by the surface energy of the adhesive and the adherend. The wetting of the adherend by the adhesive is only the premise of bonding, and it must also be able to form a cohesive force in order to achieve the purpose of bonding. Adhesive force refers to the connecting force between the adhesive and the adherend. Its generation not only depends on the structure and state of the surface of the adhesive and the adherend, but also is closely related to the process conditions of the bonding process. The adhesive force is the adhesive The force or binding force of the adherend on the interface, including mechanical interlocking force, intermolecular force and chemical bond force, etc. Wetting is a prerequisite for bonding. The relationship between surface energy and wettability. The size of the surface energy of a solid determines its wettability. The basic condition for a liquid to spread spontaneously on a solid surface is that the surface energy of the liquid is smaller than that of the solid, and the lower the surface energy of the liquid 1. The higher the surface energy of the solid, the more conducive to spreading, otherwise it is not conducive to spreading. The same liquid has good wettability on solid surfaces with large surface energy. Therefore, surface energy is an important factor affecting the bonding strength. Reducing the surface energy of the adhesive or increasing the surface energy of the adherend can enhance the adhesion of the adhesive on the adherend. wettability, thereby increasing the bond strength. In the embodiment of the present application, the adhesive is the colloid 60, and the adherend is the glass cover plate 10. In order to increase the bonding strength between the glass cover plate 10 and the colloid 60, a high surface can be sprayed on the lower surface of the glass cover plate 10. capable ink layer 70.
其中，水滴角的定义为在固、液、气三相交界面处，气-液相界面与固-液相界面之间的夹角，水滴角是显示固体表面湿度的尺度，利用大部分固着物液滴进行测定，低接触角表示湿度高(亲水性)，表面易粘贴。高接触水滴角表示表面显示疏水性，表面附着力差。在本申请实施例中，为了增大玻璃盖板10与胶体60之间的粘结强度，可以在玻璃盖板10下表面上喷涂低接触角的油墨层70。Among them, the water drop angle is defined as the angle between the gas-liquid phase interface and the solid-liquid phase interface at the three-phase interface of solid, liquid, and gas. The water drop angle is the scale showing the humidity of the solid surface. Droplets are measured, low contact angles indicate high humidity (hydrophilicity), and the surface is easy to stick. A high contact drop angle indicates that the surface exhibits hydrophobicity and poor surface adhesion. In the embodiment of the present application, in order to increase the bonding strength between the glass cover 10 and the colloid 60 , an ink layer 70 with a low contact angle can be sprayed on the lower surface of the glass cover 10 .
在一些实施例中，如图6所示，玻璃盖板10与壳体50之间设置有支撑部90。支撑部90可以确保玻璃盖板10与壳体50之间Z向的胶体填充厚度空间，以保证点胶量在Z向的厚度，一定厚度的点胶量可以在一定程度确保玻璃盖板10与壳体50之间粘接力。该支撑部90可以形成在于溢胶槽56的内凹面相连接的平面上，也可以形成在与突出部分58的的外凸面相连接的平面上。其中，支撑部90的高度可以大于突出部分58的高度。In some embodiments, as shown in FIG. 6 , a support portion 90 is disposed between the glass cover 10 and the housing 50 . The support part 90 can ensure that the glue filling the thickness space between the glass cover plate 10 and the housing 50 in the Z direction, so as to ensure the thickness of the dispensing amount in the Z direction, and the dispensing amount of a certain thickness can ensure to a certain extent that the glass cover plate 10 and Adhesive force between shells 50. The support portion 90 may be formed on a plane connected to the inner concave surface of the overflow groove 56 , or formed on a plane connected to the outer convex surface of the protruding portion 58 . Wherein, the height of the support portion 90 may be greater than the height of the protruding portion 58 .
在一些实施例中，支撑部90的高度可以等于突出部分58的高度。In some embodiments, the height of the support portion 90 may be equal to the height of the protruding portion 58 .
在一些实施例中，支撑部90与壳体50构成一体成型设置，如图6所示。In some embodiments, the supporting portion 90 and the casing 50 are integrally formed, as shown in FIG. 6 .
在一些实施例中，支撑部90还可以与玻璃盖板10构成一体成型设置。In some embodiments, the supporting portion 90 can also be integrally formed with the glass cover 10 .
在一些实施例中，如图7、图8或图9所示，在X-X视图上，突出部分58可以为半圆形，或者长方形等等，通过增加突出部分58的高度来达到防水的效果。其中，接触面54可以包括第一接触面541，第二接触面542以及第三接触面543，其中，第一接触面541由溢胶槽56的内凹面形成，第二接触面542由突出部分58的外凸面形成，第三接触面543为与第二接触面542连接的平面。In some embodiments, as shown in FIG. 7 , FIG. 8 or FIG. 9 , on the X-X view, the protruding portion 58 can be semicircular, or rectangular, etc., and the waterproof effect can be achieved by increasing the height of the protruding portion 58 . Wherein, the contact surface 54 may include a first contact surface 541, a second contact surface 542 and a third contact surface 543, wherein the first contact surface 541 is formed by the concave surface of the glue overflow groove 56, and the second contact surface 542 is formed by a protruding part 58, the third contact surface 543 is a plane connected to the second contact surface 542.
在一些实施例中，第二接触面542与第三接触面543的连接处形成的夹角可以为钝角。例如，如图8所示，在X-X视图上突出部分为半圆形时，第二接触面542与第三接触面543的连接处形成的夹角为钝角。In some embodiments, the angle formed by the connection between the second contact surface 542 and the third contact surface 543 may be an obtuse angle. For example, as shown in FIG. 8 , when the protruding portion is semicircular in view X-X, the angle formed by the connection between the second contact surface 542 and the third contact surface 543 is an obtuse angle.
在一些实施例中，第二接触面542与第三接触面543的连接处形成的夹角可以为锐角。例如，如图9所示，在X-X视图上突出部分为燕尾型时，突出部分的外凸面即第二接触面542与第三接触面543的连接处形成的夹角为锐角。In some embodiments, the angle formed by the connection between the second contact surface 542 and the third contact surface 543 may be an acute angle. For example, as shown in FIG. 9 , when the protruding part is dovetail-shaped in view X-X, the convex surface of the protruding part, that is, the angle formed by the connection between the second contact surface 542 and the third contact surface 543 is an acute angle.
如图10所示，在突出部分58的外凸面，即第二接触面上可以设置粗糙结构，例如,设置多个凸起结构581来增大与胶体60的接触面积等，或者可以把第二接触面设置成粗糙面或者其他易于粘合的平面，例如，磨砂面等，其中，凸起结构581的表面也可以为磨砂面，从而提高粘合度，进而达到防水的效果。As shown in Figure 10, on the outer convex surface of the protruding part 58, that is, the second contact surface can be provided with a rough structure, for example, a plurality of protruding structures 581 are provided to increase the contact area with the colloid 60, etc., or the second contact surface can be placed The contact surface is set as a rough surface or other planes that are easy to bond, such as a frosted surface, etc., wherein the surface of the protruding structure 581 can also be a frosted surface, so as to improve the adhesion and achieve a waterproof effect.
在一些实施例中，该油墨层70可以为黑色油墨层，该油墨层70既可以增加玻璃盖板10与胶体60之间的粘结强度，又可以防止显示模组20漏光。In some embodiments, the ink layer 70 can be a black ink layer, and the ink layer 70 can not only increase the bonding strength between the glass cover 10 and the colloid 60 , but also prevent the display module 20 from leaking light.
在一些实施例中，如图3或图11所示，玻璃盖板10与壳体50之间的接触面54上可设置油墨层70，其中，油墨层70可以由亲水性的油墨形成。该油墨层既可以增加接触面54与胶体60之间的粘结强度。In some embodiments, as shown in FIG. 3 or FIG. 11 , an ink layer 70 may be disposed on the contact surface 54 between the glass cover 10 and the housing 50 , wherein the ink layer 70 may be formed of hydrophilic ink. The ink layer can increase the bonding strength between the contact surface 54 and the colloid 60 .
在一些实施例中，如图3或图11所示，图3与图4的区别或图11与图12的区别在于，在接触面54的第一表面、第二表面和/或第三表面上也可涂抹一层油墨层70，从而增加接触面54与胶体60之间的粘接强度。In some embodiments, as shown in FIG. 3 or FIG. 11, the difference between FIG. 3 and FIG. 4 or the difference between FIG. 11 and FIG. A layer of ink layer 70 can also be applied on the surface, thereby increasing the bonding strength between the contact surface 54 and the colloid 60 .
在一些实施例中，如图11或图12所示，图11与图3的区别或图12与图4的区别在于，油墨层70可以部分覆盖胶体60，以使得部分胶体60与玻璃盖板10直接接触粘接，部分胶体60与油墨层70粘接，其中该胶体60可以为黑色遮光胶，该黑色遮光胶60可以对显示屏边框进行挡光遮光又可以有效粘接玻璃盖板10与壳体50，同时该油墨层70既可以增加玻璃盖板10与胶体60之间的粘结强度，又可以防止显示屏漏光。例如，该黑色遮光胶可以为黑色uv胶。In some embodiments, as shown in FIG. 11 or FIG. 12, the difference between FIG. 11 and FIG. 3 or the difference between FIG. 12 and FIG. 10 direct contact bonding, part of the colloid 60 is bonded to the ink layer 70, wherein the colloid 60 can be a black light-shielding glue, and the black light-shielding glue 60 can shield the frame of the display screen from light and can effectively bond the glass cover plate 10 and the The casing 50, and the ink layer 70 can not only increase the bonding strength between the glass cover 10 and the colloid 60, but also prevent light leakage from the display screen. For example, the black shading glue can be black uv glue.
在一些实施例中，如图13所示，玻璃盖板10可以覆盖整个壳体50。In some embodiments, as shown in FIG. 13 , the glass cover 10 may cover the entire housing 50 .
本申请实施例提供的电子设备100，通过在玻璃盖板10与壳体50的接触面54上设置有溢胶槽56与突出部分58，玻璃盖板10和壳体50之间设置有胶体60，突出部分58沿壳体侧壁52的周缘形成闭合结构，玻璃盖板10和壳体50之间设置胶体60，可以有效的增加触摸屏玻璃盖板10与壳体50之间的粘接力。另外，通过在玻璃盖板10与胶体60之间设置油墨层70，还可以进一步确保玻璃盖板10与胶体60有效可靠粘接。能在一定程度上加强玻璃盖板10与壳体50的可靠连接，并保证胶体60不溢到电子设备100的外观面。综上，本申请实施例提供的电子设备100可以实现超窄边框点胶技术，提升屏占比，且防止触摸屏脱胶，以达到防水的效果。在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。In the electronic device 100 provided in the embodiment of the present application, the glue overflow groove 56 and the protruding part 58 are provided on the contact surface 54 between the glass cover plate 10 and the housing 50 , and the glue 60 is provided between the glass cover plate 10 and the housing 50 , the protruding portion 58 forms a closed structure along the periphery of the housing side wall 52 , and the glue 60 is provided between the glass cover 10 and the housing 50 , which can effectively increase the bonding force between the touch screen glass cover 10 and the housing 50 . In addition, by disposing the ink layer 70 between the glass cover 10 and the colloid 60 , effective and reliable bonding between the glass cover 10 and the colloid 60 can be further ensured. To a certain extent, the reliable connection between the glass cover plate 10 and the housing 50 can be strengthened, and the colloid 60 can not overflow to the appearance surface of the electronic device 100 . To sum up, the electronic device 100 provided by the embodiment of the present application can realize the ultra-narrow bezel dispensing technology, increase the screen ratio, and prevent the touch screen from degumming, so as to achieve the effect of waterproofing. In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments.
以上对本申请实施例所提供的一种电子设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。The above is a detailed introduction to an electronic device provided by the embodiment of the present application. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only used to help understand the technical solution of the present application. and its core idea; those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the corresponding The essence of the technical solutions deviates from the scope of the technical solutions of the embodiments of the present application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820108503.4UCN207854300U (en) | 2018-01-22 | 2018-01-22 | Electronic equipment |
| Application Number | Priority Date | Filing Date | Title |
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| CN201820108503.4UCN207854300U (en) | 2018-01-22 | 2018-01-22 | Electronic equipment |
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| CN207854300Utrue CN207854300U (en) | 2018-09-11 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201820108503.4UExpired - Fee RelatedCN207854300U (en) | 2018-01-22 | 2018-01-22 | Electronic equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder | Address after:Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before:Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. | |
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee | Granted publication date:20180911 |