Invention content：
In order to overcome the defect of above-mentioned background technology, the utility model to provide a kind of sapphire multistation perforating device, energyIt is enough that supplied materials is accurately positioned, the quantity of punching, position, size are quickly set using the light path control of laserIt sets, realizes efficiently punching.
In order to solve the above-mentioned technical problem the used technical solution of the utility model is：
A kind of sapphire multistation perforating device, including laser assembly, laser assembly include picosecond laser, picosecondThe light beam that laser is sent out is refracted at least two galvanometers arranged side by side by optical path component, and is transmitted away by galvanometer；SwashPositioning table below optical assembly is equipped with sapphire jig identical with galvanometer quantity, and sapphire jig is being located at galvanometer justLower section, and the position of sapphire jig and galvanometer corresponds；It is equipped with close to the position of positioning table and carries module, carry mouldGroup includes sliding rail, and can be along the sapphire raw material grasping mechanism and sapphire finished product grasping mechanism that sliding rail moves, sapphire raw materialThe quantity of grasping mechanism and sapphire finished product grasping mechanism is identical as the quantity of sapphire jig, and blue treasured is respectively set in sliding rail both endsStone feeding module and sapphire discharging module.
Preferably, laser assembly, carrying module, sapphire feeding module, sapphire discharging module and positioning tableIt is arranged on the mounting platform of rack.
Preferably, the sliding rail for carrying module is arranged on mounting platform, sliding rail is equipped with the support platform being slidably connected, branchIt supports platform and is equipped with holder, sapphire raw material grasping mechanism and sapphire finished product grasping mechanism are symmetricly set on the both sides of holder.
Preferably, being additionally provided at least two cleaning mechanisms on holder, two cleaning mechanisms are separately positioned on close to sapphireThe position of raw material grasping mechanism and sapphire finished product grasping mechanism；Cleaning mechanism includes hairbrush.
Preferably, sapphire feeding module and sapphire discharging module include slide unit rebound, slide unit rebound passes through peaceIt fills seat to be arranged on mounting platform, slide unit rebound is equipped with several material baskets.
Preferably, positioning table includes for clamping sapphire sapphire jig, sapphire jig is arranged in jigOn pedestal, jig base is arranged by cushion block on positioning support seat, and the setting of positioning support seat adjusts platform on adjusting platformEquipped with the linear motor regulating mechanism for adjusting positioning support seat X axis and Y-axis position；At least one jig base and cushion blockBetween be equipped with manual fine-tuning platform.
Preferably, mounting platform is equipped with air blower, the vacuum cleaning mouth of air blower passes through on bellows and jig basePumping dirt pipe docking.
Preferably, the light beam that picosecond laser is sent out is refracted to speculum by outer optical path component, speculum is anti-by optical fiberIt is mapped to galvanometer, light path seal sleeve is additionally provided between speculum and galvanometer.
The beneficial effects of the utility model are：A kind of sapphire multistation perforating device is provided, for solving sapphireDifficult problem is punched, it can effectively change, and traditional equipment sapphire perforating efficiency is low, and precision is low, the big present situation of difficulty.This realityUse picosecond laser, the laser beam which sends out that there is ultrashort pulsewidth with novel, its energy is high, and diversity is small.Pass throughSpectroscopical light beam is uniformly divided into two bundles light, which realizes light path Orientation differences by galvanometer, realizes product not with thisWith the processing of position.This device uses double-station automatic loading/unloading, positioning table to walk automatically, double-station rapid processing, energyIt is quickly accurate to realize sapphire punching, and the size, quantity, position of punching can be quickly arranged, blue treasured greatly improvedThe efficiency of stone punching.Using unified mounting platform benchmark, the precision of processing and the stability of equipment processing can guarantee；It carriesEach performs its own functions for module or so station, and left station is finished product grabbing device, and right working position is raw material grabbing device, when right working position feedingWhen, left station can on expect positioning table, when expecting positioning table on right working position, left station can put finished productTo blanking material basket, the efficiency of processing is substantially increased in this way.
Description of the drawings
Fig. 1 is the general structure schematic diagram of the utility model embodiment,
Fig. 2 is the carrying modular structure schematic diagram of the utility model embodiment,
Fig. 3 is the input and output material modular structure schematic diagram of the utility model embodiment,
Fig. 4 is the positioning table structural schematic diagram of the utility model embodiment,
Fig. 5 is the laser module structural schematic diagram of the utility model embodiment.
In figure：1- laser assemblies, 1.1- picosecond lasers, 1.2- optical path components, 1.3- galvanometers, 1.4- speculums,1.5- light path seal sleeves, 2- positioning tables, 2.1- sapphire fixtures, 2.2- manual fine-tuning platforms, 2.3- positioning supportsSeat, 2.4- adjusting platforms, 2.5- sapphire jigs, 2.6- jig bases, 2.7- cushion blocks, 3- carrying modules, 3.1- sliding rails,3.2- sapphire raw material grasping mechanisms, 3.3- sapphire finished product grasping mechanisms, 3.4- support platforms, 3.5- holders, 3.6- cleaningsMechanism, 4- sapphire feeding modules, 5- sapphire discharging modules, 6- slide unit rebounds, 7- material baskets, 8- mounting bases, 9- filter cylinders,10- racks, 11- mounting platforms, 12 air blowers.
Specific implementation mode
The utility model is described further with reference to the accompanying drawings and examples.
A kind of sapphire multistation perforating device, including laser assembly 1, laser assembly 1 include picosecond laser1.1, the light beam that picosecond laser 1.1 is sent out is refracted at least two galvanometers 1.3 arranged side by side by optical path component 1.2, andIt is transmitted away by galvanometer 1.3；Positioning table 2 below laser module is controlled equipped with sapphire identical with 1.3 quantity of galvanometerTool 2.5, sapphire jig 2.5 is located at the underface of galvanometer 1.3, and sapphire jig 2.5 and the position one of galvanometer 1.3 are a pair ofIt answers；It is equipped with close to the position of positioning table 2 and carries module 3, it includes sliding rail 3.1 to carry module 3, and can be moved along sliding rail 3.1Sapphire raw material grasping mechanism 3.2 and sapphire finished product grasping mechanism 3.3, sapphire raw material grasping mechanism 3.2 and sapphireThe quantity of finished product grasping mechanism 3.3 is identical as the quantity of sapphire jig 2.5, and sapphire feeding is respectively set in 3.1 both ends of sliding railModule 4 and sapphire discharging module 5.
Laser assembly 1 carries module 3, sapphire feeding module 4, sapphire discharging module 5 and positioning table 2It is arranged on the mounting platform 11 of rack 10.
The sliding rail 3.1 for carrying module 3 is arranged on mounting platform 11, and sliding rail 3.1 is equipped with the support platform being slidably connected3.4, support platform 3.4 is equipped with holder 3.5, and sapphire raw material grasping mechanism 3.2 and sapphire finished product grasping mechanism 3.3 are symmetricalIt is arranged in the both sides of holder 3.5.
At least two cleaning mechanisms 3.6 are additionally provided on holder 3.5, two cleaning mechanisms 3.6 are separately positioned on close to blue preciousThe position of stone raw material grasping mechanism 3.2 and sapphire finished product grasping mechanism 3.3；Cleaning mechanism 3.6 includes hairbrush.
Sapphire feeding module 4 and sapphire discharging module 5 include slide unit rebound 6, and slide unit rebound 6 passes through mounting base8 are arranged on mounting platform 11, and slide unit rebound 6 is equipped with several material baskets 7.
Positioning table 2 includes for clamping sapphire sapphire jig 2.5, and sapphire jig 2.5 is arranged in jigOn pedestal 2.6, jig base 2.6 is arranged by cushion block 2.7 on positioning support seat 2.3, and the setting of positioning support seat 2.3 is being adjustedOn platform 2.4, adjusts the linear motor that platform 2.4 is equipped with for adjusting positioning support seat 2.3X axis and Y-axis position and adjust machineStructure；Manual fine-tuning platform 2.2 is equipped between at least one jig base 2.6 and cushion block 2.7.Sapphire jig 2.5 includes blue preciousStone fixture 2.1.
Mounting platform 11 is equipped with air blower 12, and the vacuum cleaning mouth of air blower 12 passes through bellows and jig base 2.6On pumping dirt pipe docking.
The light beam that picosecond laser 1.1 is sent out is refracted to speculum 1.4 by outer optical path component 1.2, and speculum 1.4 willFiber reflection is additionally provided with light path seal sleeve 1.5 to galvanometer 1.3 between speculum 1.4 and galvanometer 1.3.
Above-mentioned mounting platform 11 is marble platform, punching size, the optical path component of 1 outgoing laser beam of laser assembly1.2 path, the position of sapphire feeding module 4 and sapphire discharging module 5, positioning table 2 and carrying component are by workControl machine controls.
Optical path component 1.2 includes picosecond light path box, speculum 1.4, firm banking, beam expanding lens, slide, spectroscope, dust-proofCover, z axis module, galvanometer 1.3, are supported on by marble support platform 3.4 on mounting platform 11.
2 component of positioning table includes vacuum absorption device, positioning fixture, product jig, XY linear motors, wherein XYLinear motor is by linear motor driver and included control card control.
Material basket 7 on sapphire feeding module 4 and sapphire discharging module 5 is by Serve Motor Control, along slide unit rebound 6Mobile, action is controlled by PLC and its hardware circuit；
The action that the support platform 3.4 of module 3 is slided along sliding rail 3.1 is carried, sapphire raw material grasping mechanism 3.2 (is carried3 right working position of module) and sapphire finished product grasping mechanism 3.3 (carry module 3 left station) grasping movement, cleaning mechanism 3.6Cleaning action is controlled by motor, motor PLC controls.
PLC connection man-machine interfaces.It includes that dirt pipe is taken out on top to be additionally provided on mounting platform 11 and take out dirt component, takes out dirt fixed plate,Dirt bellows is taken out, Y types take out dirt pipe, air blower 12, filter cylinder 9 etc..
A kind of sapphire multistation perforating device is present embodiments provided, for solving the problems, such as that sapphire punching is difficult,It can effectively change that traditional equipment sapphire perforating efficiency is low, and precision is low, the big present situation of difficulty.The utility model use picosecond swashsLight device 1.1, the laser beam which sends out have ultrashort pulsewidth, its energy is high, and diversity is small.Pass through spectroscopical light beam quiltIt uniformly is divided into two bundles light, which realizes light path Orientation differences by galvanometer 1.3, and adding for product different location is realized with thisWork.This device uses double-station automatic loading/unloading, positioning table 2 to walk automatically, double-station rapid processing, can be quickly accurate realExisting sapphire punching, and the size, quantity, position of punching can be quickly arranged, the effect of sapphire punching greatly improvedRate.Using unified 11 benchmark of mounting platform, the precision of processing and the stability of equipment processing can guarantee；It is taken at punching non-Contact is processed, and scale error is punched caused by avoiding the abrasion such as cutter；The waste residue generated is punched, it is automatic by air blower 12Cleaning.Also it can realize automatic collection by filter cylinder 9.Carrying 3 or so station of module, Each performs its own functions, and left station is finished product crawl dressSet, right working position be raw material grabbing device, when right working position feeding, left station can on expect positioning table 2, work as right working positionOn when expecting positioning table 2, left station can put finished product to blanking material basket 7, substantially increase the efficiency of processing in this way.
First two groups of sapphire raw materials to be processed are respectively charged into two raw material material baskets 7 of sapphire feeding module 4, are placed onOn 4 slide unit rebound 6 of sapphire feeding module, it is controlled by PLC and its hardware circuit and moves to feeding station；
Carry the feeding sucker movement of two sapphire raw material grasping mechanisms 3.2 (carrying 3 right working position of module) of module 3To after feeding position (namely position of 4 material basket 7 of sapphire feeding module)：Tilt cylinder swings (sucker is vertically against product), feeding gasCylinder declines, 4 fine motion (raw material is made to be contacted with sucker) of sapphire feeding module, feeding sucker air-breathing, and feeding cylinder rises, tilt cylinderRotation (keeps sucker horizontal), and feeding sucker is moved to discharge position (while positioning table 2 is moved to discharge position up and down) up and down,Feeding cylinder declines (product is put on positioning table 2), and the positioning fixture vacuum opening of positioning table 2 (sucks productionProduct), feeding cylinder rises, and positioning table 2 is moved to machining position, carries module 3 and returns to feeding position and (while carrying 3 He of moduleFeeding module repeats above-mentioned action).
The positioning fixture vacuum of positioning table 2 disconnects, 2 clamp of positioning table, the locating clip of positioning table 2Tool unclamps, and 2 vacuum of positioning table is opened, the laser beam laser perforation processing that picosecond laser 1.1 is sent out, and positions workMake platform 2 and is moved to feeding position.
It carries the sapphire finished product grasping mechanism 3.3 (carry module 3 left station) on module 3 and reaches feeding position, under cylinderDrop is carried 3 sucker vacuum of module and is opened, and the positioning fixture vacuum of positioning table 2 disconnects, and carries 3 cylinder of module and rises, carriesModule 3 is moved to lower material position (cleaning mechanism 3.6 while cleaning positioning table 2), and sapphire discharging module 5 moves to blanking3 tilt cylinder of module rotation (sucker is vertical) is carried in position, carries 3 cylinder of module and declines (product is put into feeding basket 7), carries mould3 sucker vacuum of group disconnect, and carry 3 right cylinder of module and rise, and carry 3 tilt cylinder of module rotation (sucker is horizontal), carry 3 feeding of moduleStandby position (carries out next flake products processing).
The present apparatus uses double-station loading and unloading, double-station to process simultaneously, substantially increases the efficiency of sapphire perforation processing.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.