技术领域technical field
本实用新型关于一种发光二极管照明装置，且特别关于一种透明芯柱的发光二极管照明装置。The utility model relates to a light-emitting diode lighting device, in particular to a light-emitting diode lighting device with a transparent stem.
背景技术Background technique
随着发光二极管(Light Emitted Diode)技术持续的进步，越来越多的产品利用发光二极管的特性加以设计。除了取代过去的灯管，各种灯泡也被陆续开发出来。With the continuous advancement of light emitting diode (Light Emitted Diode) technology, more and more products are designed using the characteristics of light emitting diodes. In addition to replacing the light tubes of the past, various light bulbs have also been developed one after another.
发光二极管简称为LED。由含镓(Ga)、砷(As)、磷(P)、氮(N)等的化合物制成。当电子与空穴复合时能辐射出可见光，因而可以用来制成发光二极管。在电路及仪器中作为指示灯，或者组成文字或数字显示。砷化镓二极管发红光，磷化镓二极管发绿光，碳化硅二极管发黄光，氮化镓二极管发蓝光。因化学性质又分有机发光二极管OLED和无机发光二极管LED。Light-emitting diodes are referred to as LEDs for short. Made of compounds containing Gallium (Ga), Arsenic (As), Phosphorus (P), Nitrogen (N), etc. Visible light can be radiated when electrons and holes recombine, so they can be used to make light-emitting diodes. It is used as an indicator light in circuits and instruments, or as a text or number display. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Due to chemical properties, it is divided into organic light-emitting diode OLED and inorganic light-emitting diode LED.
由于照明是人类生活的一个重要部分，虽然发光二极管本身技术相当成熟，人们还是希望能有更多让生活品质提升的照明产品可以被设计出来。为了达到各种不同的产品设计，包括散热、电源连接、驱动、甚至制造成本、复杂度，都有各式各样的技术问题有待解决。Since lighting is an important part of human life, although the technology of light-emitting diodes is quite mature, people still hope that more lighting products that can improve the quality of life can be designed. In order to achieve various product designs, including heat dissipation, power connection, drive, and even manufacturing cost and complexity, there are various technical problems to be solved.
实用新型内容Utility model content
根据本实用新型的实施例，提供一种发光二极管照明装置。这种发光二极管照明装置可以是灯泡、内置电池的灯具、或是其它类型应用的照明装置。这种发光二极管照明装置具有透光罩、透明芯柱、光源板立体结构。透光罩与透明芯柱可以是由玻璃、塑胶等透明材料制成。According to an embodiment of the present utility model, a light emitting diode lighting device is provided. The light-emitting diode lighting device may be a light bulb, a lamp with a built-in battery, or other types of lighting devices for applications. The light-emitting diode lighting device has a three-dimensional structure of a light-transmitting cover, a transparent stem, and a light source plate. The transparent cover and the transparent stem can be made of transparent materials such as glass and plastic.
光源板立体结构可由多个子光源板构成。光源板立体结构安装于所述透光罩内，跟所述透明芯柱连接，并且由所述透明芯柱支撑。所述子光源板包含电路板体与一个或多个发光二极管芯粒。这些发光二极管芯粒可以是等距离排列，也可以根据所安装照明装置的形状跟照明设定，根据预定的方式，以彼此间非固定距离设置。举例来说，为了让侧面跟底面有更多的照明，可以集中在子光源板的部分区域特别密集的配置发光二极管芯粒。此外，这些发光二极管芯粒表面可以涂布用来产生不同色温的荧光粉。在同一个电板板体上可以设置多个不同色温的发光二极管芯粒。The three-dimensional structure of the light source board can be composed of multiple sub-light source boards. The three-dimensional structure of the light source board is installed in the transparent cover, connected with the transparent stem, and supported by the transparent stem. The sub-light source board includes a circuit board body and one or more LED chips. These LED chips can be arranged equidistantly, and can also be arranged at a non-fixed distance from each other according to a predetermined method according to the shape and lighting setting of the installed lighting device. For example, in order to provide more illumination on the side and bottom, the light emitting diode chips can be concentrated in some areas of the sub-light source board. In addition, the surface of these LED chips can be coated with phosphors for producing different color temperatures. A plurality of light-emitting diode chips with different color temperatures can be arranged on the same electric board body.
所述发光二极管芯粒安装于所述电路板体之一面，并且彼此间可以用各种封装与绕线方式进行串接。举例来说，发光二极管芯粒可以用表面贴装器件(SMD)的封装方式固定到电路板体上。本实用新型也可以用在芯片在电路板(COB,Chip on Board)技术封装的发光二极管光源板。然而，对于已经熟悉通过表面贴装器件的工厂来说，不需要一定使用COB技术，可以大幅增加制造的弹性与降低成本。The light-emitting diode chips are installed on one side of the circuit board body, and can be connected in series with each other by various packaging and winding methods. For example, the light-emitting diode chip can be fixed on the circuit board body by using a surface mount device (SMD) package. The utility model can also be used in a light-emitting diode light source board packaged by a chip on a circuit board (COB, Chip on Board) technology. However, for factories that are already familiar with surface mount devices, it is not necessary to use COB technology, which can greatly increase the flexibility of manufacturing and reduce costs.
电源装置，用于供应所述子光源板电源，使得多个子光源板发出光线，并透过所述透光罩提供照明。在灯泡的实施例中，电源装置可以是对应的驱动电路以及导线。其中，驱动电路用以将室内电源的电压转换成适合驱动所述子光源板的发光二极管芯粒发光之电压。在其它的实施例中，电源装置更可以包括电池或只是单纯的导线，用来连接到电力供应的来源。The power supply device is used to supply power to the sub-light source boards, so that a plurality of sub-light source boards emit light and provide illumination through the light-transmitting cover. In an embodiment of the light bulb, the power supply means may be a corresponding driving circuit and wires. Wherein, the driving circuit is used to convert the voltage of the indoor power supply into a voltage suitable for driving the light-emitting diode chips of the sub-light source board to emit light. In other embodiments, the power supply device may further include a battery or simply a wire for connecting to a power supply source.
当这个照明装置的实施例是灯泡时候，照明装置可包括灯头，至于透光罩可以是各种不同形式灯泡所对应的透光罩部分，例如用于T-型泡壳、A-型泡壳、G-型球泡、R-型泡壳、BR-型泡壳、PAR-型泡壳、烛型泡壳或其他现有灯泡形状中的任一种。When the embodiment of this illuminating device is a light bulb, the illuminating device can include a lamp cap, and the light-transmitting cover can be a part of the light-transmitting cover corresponding to various types of light bulbs, such as for T-type bulbs, A-type bulbs, etc. , G-type bulb, R-type bulb, BR-type bulb, PAR-type bulb, candle-type bulb or any of other existing bulb shapes.
在灯泡的实施例中，所述驱动电路可收藏于所述灯头的容纳空间内。换言之，从所述透光罩只会看到所述光源板立体结构跟所述透明芯柱，不会看到所述驱动电路的电路元件。或是，有部分遮蔽，使得驱动电路的元件不会直接暴露出来，影响整体灯泡产品的外观。In an embodiment of the light bulb, the driving circuit can be stored in the accommodation space of the lamp head. In other words, only the three-dimensional structure of the light source board and the transparent stem can be seen from the transparent cover, and the circuit elements of the driving circuit cannot be seen. Or, there is partial shielding, so that the components of the driving circuit are not directly exposed, which affects the appearance of the overall light bulb product.
为了提供更好的散热，增加灯泡或其它照明装置的寿命，也可以安置散热器件，例如散热杯、散热材料或各种内衬，安置于所述灯头内，用于对所述驱动电路与所述子光源板进行散热。In order to provide better heat dissipation and increase the lifespan of bulbs or other lighting devices, heat dissipation devices, such as heat dissipation cups, heat dissipation materials or various inner linings, can also be arranged in the lamp holder to control the driving circuit and the The sub-light source board is used for heat dissipation.
此外，透明芯柱内部可嵌入导线，并于所述导线的两侧分别设置第一组端子与第二组端子。第一组端子用于电连接所述子光源板，第二组端子用于电连接所述电源装置。另一种做法是，导线沿着芯柱的表面或外部连接子光源板跟电源装置。In addition, wires can be embedded inside the transparent stem, and a first group of terminals and a second group of terminals are respectively arranged on both sides of the wires. The first group of terminals is used for electrically connecting the sub-light source board, and the second group of terminals is used for electrically connecting the power supply device. Another method is that the wires are connected to the sub-light source board and the power supply device along the surface of the stem or outside.
此外，这些子光源板可以是一块光源电路板的不同部分。这块光源电路板通过折叠，使得多个子光源板之间具有一折叠角度，以构成所述光源板立体结构。换言之，发光二极管芯粒可以被安装在一大片电路板，接着安装导线，并将这一大片的电路板进行切割成所需的形状，并在上头留下适合折叠用的刻痕。接着，每个光源电路板通过折叠构成光源板立体结构，再跟透明芯柱进行连接。这种做法可以大幅降低成本跟降低安装的难度。In addition, these sub-light source boards can be different parts of a light source circuit board. The light source circuit board is folded so that there is a folding angle between the multiple sub-light source boards to form the three-dimensional structure of the light source board. In other words, LED chips can be mounted on a large piece of circuit board, and then wires are installed, and the large piece of circuit board is cut into a desired shape, and a score suitable for folding is left on it. Next, each light source circuit board is folded to form a three-dimensional structure of the light source board, and then connected to the transparent stem. This approach can greatly reduce the cost and reduce the difficulty of installation.
此外，所述光源电路板的一部分可折叠为所述光源电路板的顶部，并且所述光源电路板的顶部与所述透明芯柱的顶部连接，并由所述透明芯柱的顶部加以承载。In addition, a part of the light source circuit board can be folded as the top of the light source circuit board, and the top of the light source circuit board is connected to the top of the transparent stem and carried by the top of the transparent stem.
所述光源电路板的顶部可进一步设置有发光二极管芯粒。此外，所述光源电路板的顶部可设置有卡扣结构，用于跟所述透明芯柱的顶部扣接。此外，通过黏胶或是焊接，也可以达成光源电路板的顶部跟透明芯柱的连接。The top of the light source circuit board can be further provided with LED chips. In addition, the top of the light source circuit board can be provided with a buckle structure for fastening with the top of the transparent stem. In addition, the top of the light source circuit board and the transparent stem can also be connected by glue or welding.
此外，所述光源电路板的另一部分可折叠为所述光源电路板的底部，并且所述光源电路板的底部与所述透明芯柱的底部连接，并由所述透明芯柱的底部加以承载。In addition, another part of the light source circuit board can be folded into the bottom of the light source circuit board, and the bottom of the light source circuit board is connected to the bottom of the transparent stem and is carried by the bottom of the transparent stem .
光源电路板可以折叠成各种立体结构。举例来说，所述多个子光源板可折叠成一多边形柱体结构。为了确保光源板立体结构的模组化跟稳定性，所述光源电路板在折叠成所述多边形柱体结构时，其中两个所述子光源板之间通过彼此间对应的卡扣连接。换言之，当一片光源电路板折叠成多边形，最后两侧端可通过卡扣结构进行扣接，构成一中空柱体结构。此外，也可以通过黏胶或是焊接来确保光源板立体结构的形状。此外，这些子光源板也可以通过跟透明芯柱之间的连接结构进行连接，提供进一步的支撑跟稳定性。The light source circuit board can be folded into various three-dimensional structures. For example, the plurality of sub-light source panels can be folded into a polygonal column structure. In order to ensure the modularization and stability of the three-dimensional structure of the light source board, when the light source circuit board is folded into the polygonal column structure, the two sub-light source boards are connected by corresponding buckles. In other words, when a light source circuit board is folded into a polygonal shape, the two ends at the end can be buckled by buckle structures to form a hollow cylinder structure. In addition, the shape of the three-dimensional structure of the light source board can also be ensured by glue or welding. In addition, these sub-light source panels can also be connected with the connection structure between the transparent stems to provide further support and stability.
这些子光源板的表面可以是平面的，也可以具有一定的弯曲度。举例来说，所述多个子光源板在面向所述透光罩可具有对应的表面弯曲度。The surfaces of these sub-light source panels can be flat or have a certain degree of curvature. For example, the plurality of sub-light source plates may have a corresponding surface curvature facing the light-transmitting cover.
此外，所述子光源板在面对所述透光罩的背面，可以连接散热材料。换言之，在相对发光二极管芯粒的电路板体背面可以附加铝片、散热胶或其它散热材料，以协助散热。In addition, the sub-light source board can be connected with a heat dissipation material on the back side facing the light-transmitting cover. In other words, an aluminum sheet, heat dissipating glue or other heat dissipating materials can be added on the back of the circuit board opposite to the LED chip to assist heat dissipation.
该光源板材质可为铝基板、弹性电路板FPC(Flexible Printed Circuit)、FPC加铝、陶瓷、玻璃等材料。透光罩可以是透明、磨砂、内涂白、磨砂加内涂白等方式制作。The light source board can be made of aluminum substrate, FPC (Flexible Printed Circuit), FPC plus aluminum, ceramics, glass and other materials. The translucent cover can be made of transparent, frosted, white-coated inside, frosted and white-coated inside.
这些散热材料可进一步连接到所述透明芯柱。换言之，所述子光源板的热可以通过透明芯柱加以传递散热。These heat dissipating materials may be further attached to the transparent stem. In other words, the heat of the sub-light source board can be transferred and dissipated through the transparent stem.
此外，所述电源装置的驱动电路除了安装在灯头部分，也可以藏于所述多个子光源板围绕的内侧。甚至，这个驱动电路的电路板可作为支撑这些子光源板的结构之用。In addition, the drive circuit of the power supply device may be hidden inside the plurality of sub-light source boards besides being mounted on the lamp head. Even, the circuit board of the driving circuit can be used as a structure supporting these sub-light source boards.
此外，所述多个子光源板可分别挂在所述透明芯柱上，而构成立体结构。这些子光源板可以分别跟电源装置连接，取得电力，而不一定要通过折叠的方式来组成所述光源板立体结构。In addition, the plurality of sub-light source panels can be respectively hung on the transparent stem to form a three-dimensional structure. These sub-light source panels can be respectively connected to the power supply device to obtain power, and it is not necessary to form the three-dimensional structure of the light source panel by folding.
此外，散热惰性气体，例如氦气，可以填充于所述透光罩内，协助所述多个子光源板进行散热。In addition, a heat-dissipating inert gas, such as helium, can be filled in the transparent cover to assist the plurality of sub-light source panels to dissipate heat.
根据本实用新型的实施例，提供一种组装灯泡装置的方法。发光二极管芯粒通过表面贴装器件技术安装在电路板上。封装材料及导线被设置在电路板上。电路板被裁切成一个一个的光源电路板。光源电路板通过折叠构成光源板立体结构。光源板立体结构被安装在透明芯柱上，然后作为一个模组外头安装灯泡壳。之后，通过透明芯柱上的入气口，对于灯泡壳内部进行抽气跟灌入惰性气体。通过加热融化封闭入气口。接着安装驱动电路、散热杯或内衬以及灯头等其它组件，完成灯泡的制作。According to an embodiment of the present invention, a method of assembling a light bulb device is provided. LED chips are mounted on circuit boards by surface mount device technology. Packaging material and wires are provided on the circuit board. The circuit board is cut into light source circuit boards one by one. The light source circuit board is folded to form a three-dimensional structure of the light source board. The three-dimensional structure of the light source board is installed on the transparent stem, and then the light bulb shell is installed on the outside of a module. After that, through the air inlet on the transparent stem, the inside of the bulb shell is pumped and inert gas is poured. The air inlet is closed by heating and melting. Then install the drive circuit, cooling cup or lining, and other components such as the lamp holder to complete the production of the bulb.
当然，这些步骤并非全部要按照上面的说明逐步实施。对于不同设计，可以进行个别步骤的调整、省略，或加入其它的步骤。Of course, not all of these steps are to be followed step by step as described above. Individual steps may be adjusted, omitted, or additional steps may be added for different designs.
以上所述的实施例可以降低制造成本，增加照明装置的稳定性，而且可以确保照明装置具有更好的外观质感，提升人们的生活品质跟使用便利性。The above-mentioned embodiments can reduce manufacturing costs, increase the stability of the lighting device, and ensure that the lighting device has a better appearance and texture, improving people's quality of life and convenience of use.
附图说明Description of drawings
图1例示本实用新型的一个灯泡实施例示意图。Fig. 1 illustrates a schematic diagram of a light bulb embodiment of the present invention.
图2例示构成图1实施例的一种元件组成示意图。FIG. 2 illustrates a schematic diagram of components constituting the embodiment of FIG. 1 .
图3例示用可用来折叠的一个光源电路板示意图。Figure 3 illustrates a schematic diagram of a light source circuit board that can be used for folding.
图4例示图3类型光源电路板折叠后的立体示意图。FIG. 4 illustrates a three-dimensional schematic diagram of a folded light source circuit board of the type shown in FIG. 3 .
图5例示图4的光源板立体结构进一步安装在透明芯柱的示意图。FIG. 5 illustrates a schematic diagram of further installing the three-dimensional structure of the light source plate in FIG. 4 on the transparent stem.
图6例示一种灯泡装置实施例的剖面示意图。FIG. 6 illustrates a schematic cross-sectional view of an embodiment of a light bulb device.
图7例示另一种灯泡实施例的剖面示意图。Fig. 7 illustrates a schematic cross-sectional view of another bulb embodiment.
图8A例示另一种光源板立体结构的示意图。FIG. 8A illustrates a schematic diagram of another three-dimensional structure of a light source board.
图8B例示另一种光源板立体结构的示意图。FIG. 8B is a schematic diagram illustrating another three-dimensional structure of a light source board.
图9例示一种制作灯泡的流程图。Figure 9 illustrates a flow chart for making a light bulb.
具体实施方式detailed description
首先，请参考图1及图2。图1例示根据本实用新型的一个灯泡实施例示意图。图2例示构成图1实施例的一种元件组成示意图。First, please refer to Figure 1 and Figure 2. Fig. 1 illustrates a schematic diagram of an embodiment of a light bulb according to the present invention. FIG. 2 illustrates a schematic diagram of components constituting the embodiment of FIG. 1 .
在图1及图2中，例示一种灯泡，作为发光二极管照明装置的范例。除了灯泡，这种发光二极管照明装置还可以是内置电池的灯具、或是其它类型应用的照明装置。这种发光二极管照明装置具有透光罩101、透明芯柱104、光源板立体结构102。透光罩101跟透明芯柱104 可以由玻璃、塑胶等透明材料制成。In FIG. 1 and FIG. 2 , a light bulb is illustrated as an example of an LED lighting device. In addition to light bulbs, this light-emitting diode lighting device can also be a lamp with a built-in battery, or a lighting device for other types of applications. This LED lighting device has a transparent cover 101 , a transparent stem 104 , and a three-dimensional structure 102 of a light source plate. The transparent cover 101 and the transparent stem 104 can be made of transparent materials such as glass and plastic.
光源板立体结构102可由多个子光源板构成。光源板立体结构安装于所述透光罩101内，跟所述透明芯柱104连接，并且由所述透明芯柱104支撑。所述子光源板包含电路板体与一个或多个发光二极管芯粒103。这些发光二极管芯粒103可以是等距离排列，也可以根据所安装照明装置的形状跟照明设定，根据预定的方式，以彼此间非固定距离设置。举例来说，为了让侧面跟底面有更多的照明，可以集中在子光源板的部分区域特别密集的配置发光二极管芯粒103。此外，这些发光二极管芯粒103表面可以涂布用来产生不同色温的荧光粉。在同一个电板板体上可以设置多个不同色温的发光二极管芯粒。The three-dimensional light source board structure 102 may be composed of multiple sub-light source boards. The three-dimensional structure of the light source board is installed in the transparent cover 101 , connected with the transparent stem 104 , and supported by the transparent stem 104 . The sub-light source board includes a circuit board body and one or more LED chips 103 . These LED chips 103 can be arranged equidistantly, or can be arranged at a non-fixed distance from each other according to a predetermined method according to the shape and lighting setting of the installed lighting device. For example, in order to provide more illumination on the side and bottom, the light emitting diode chips 103 can be arranged particularly densely in some areas of the sub-light source board. In addition, the surfaces of these LED chips 103 can be coated with phosphors for producing different color temperatures. A plurality of light-emitting diode chips with different color temperatures can be arranged on the same electric board body.
所述发光二极管芯粒103安装于所述电路板体之一面，并且彼此间可以用各种封装与绕线方式进行串接。举例来说，发光二极管芯粒103可以用表面贴装器件(SMD)的封装方式固定到电路板体上。本实用新型也可以用在芯片在电路板(COB,Chip on Board)技术封装的发光二极管光源板。然而，对于已经熟悉通过表面贴装器件的工厂来说，他们不需要一定使用COB技术，可以大幅增加制造的弹性与降低成本。The light-emitting diode chips 103 are installed on one side of the circuit board body, and can be connected in series with each other by various packaging and winding methods. For example, the light emitting diode chip 103 can be fixed on the circuit board body by using a surface mount device (SMD) package. The utility model can also be used in a light-emitting diode light source board packaged by a chip on a circuit board (COB, Chip on Board) technology. However, for factories that are already familiar with surface mount devices, they do not need to use COB technology, which can greatly increase the flexibility of manufacturing and reduce costs.
电源装置，用于供应所述子光源板电源，使得多个子光源板发出光线，并透过所述透光罩101提供照明。在灯泡的实施例中，电源装置可以是对应的驱动电路1061以及导线。驱动电路1061可安装在驱动板106上。其中，驱动电路1061用以将室内电源的电压转换成适合驱动所述子光源板的发光二极管芯粒103发光之电压。在其它的实施例中，电源装置更可以包括电池或只是单纯的导线，用来连接到电力供应的来源。The power supply device is used to supply power to the sub-light source boards, so that a plurality of sub-light source boards emit light and provide illumination through the light-transmitting cover 101 . In an embodiment of a light bulb, the power supply device may be a corresponding driving circuit 1061 and wires. The driving circuit 1061 may be mounted on the driving board 106 . Wherein, the driving circuit 1061 is used to convert the voltage of the indoor power supply into a voltage suitable for driving the LED chips 103 of the sub-light source board to emit light. In other embodiments, the power supply device may further include a battery or simply a wire for connecting to a power supply source.
当这个照明装置的实施例是灯泡时候，照明装置可包括灯头105，至于透光罩101可以是各种不同形式灯泡所对应的透光罩部分，例如用于T-型泡壳、A-型泡壳、G-型球泡、R-型泡壳、BR-型泡壳、PAR-型泡壳、烛型泡壳或其他现有灯泡形状中的任一种。When the embodiment of this lighting device is a light bulb, the lighting device can include a lamp cap 105, and the light-transmitting cover 101 can be the part of the light-transmitting cover corresponding to various types of light bulbs, such as for T-type bulbs, A-type Bulb, G-Bulb, R-Bulb, BR-Bulb, PAR-Bulb, Candle Bulb or any of the other existing bulb shapes.
在灯泡的实施例中，所述驱动电路1061可收藏于所述灯头105的容纳空间内。换言之，从所述透光罩101只会看到所述光源板立体结构102跟所述透明芯柱104，不会看到所述驱动电路1061的电路元件。或是，有部分遮蔽，使得驱动电路1061的元件不会直接暴露出来，影响整体灯泡产品的外观。In an embodiment of the light bulb, the driving circuit 1061 can be stored in the accommodation space of the lamp head 105 . In other words, only the three-dimensional structure 102 of the light source board and the transparent stem 104 can be seen from the transparent cover 101 , and the circuit components of the driving circuit 1061 cannot be seen. Or, there is partial shielding, so that the components of the driving circuit 1061 are not directly exposed, affecting the appearance of the overall light bulb product.
为了提供更好的散热，增加灯泡或其它照明装置的寿命，也可以安置散热器件，例如散热杯108、散热材料或各种内衬，安置于所述灯头内，用于对所述驱动电路与所述子光源板进行散热。In order to provide better heat dissipation and increase the lifespan of bulbs or other lighting devices, heat dissipation devices, such as heat dissipation cups 108, heat dissipation materials or various inner linings, can also be arranged in the lamp holder for controlling the driving circuit and The sub-light source board performs heat dissipation.
此外，透明芯柱104内部可嵌入导线，并于所述导线的两侧分别设置第一组端子与第二组端子1081、第二组端子1082。第一组端子用于电连接所述子光源板，第二组端子1081、第二组端子1082用于电连接所述电源装置，例如驱动电路1061。驱动电路1061可以另外延伸出对外端子1071、对外端子1072，分别电连接到灯头105的侧壁及底部端子109，以连接外部灯座的电源。另一种做法是，导线沿着芯柱的表面或外部连接子光源板跟电源装置。In addition, wires can be embedded inside the transparent stem 104 , and the first group of terminals, the second group of terminals 1081 , and the second group of terminals 1082 are respectively arranged on two sides of the wires. The first group of terminals is used to electrically connect the sub-light source board, and the second group of terminals 1081 and the second group of terminals 1082 are used to electrically connect the power supply device, such as the driving circuit 1061 . The driving circuit 1061 can also extend external terminals 1071 and 1072 to be electrically connected to the side wall of the lamp holder 105 and the bottom terminal 109 respectively, so as to connect to the power supply of the external lamp holder. Another method is that the wires are connected to the sub-light source board and the power supply device along the surface of the stem or outside.
在这个实施例中，光源板立体结构102为中空结构，透明芯柱104穿过光源板立体结构，并且透明芯柱104的顶部1042支撑光源板立体结构102的顶部，透明芯柱104的底部1044连接跟支撑光源板立体结构102的底部。透明芯柱104的中间部分1043则被光源板立体结构102所环绕。In this embodiment, the three-dimensional structure 102 of the light source plate is a hollow structure, the transparent stem 104 passes through the three-dimensional structure of the light source plate, and the top 1042 of the transparent stem 104 supports the top of the three-dimensional structure 102 of the light source plate, and the bottom 1044 of the transparent stem 104 Connect and support the bottom of the three-dimensional structure 102 of the light source board. The middle part 1043 of the transparent stem 104 is surrounded by the three-dimensional structure 102 of the light source board.
请参照图3，图3例示用可用来折叠的一个光源电路板31示意图。光源电路板的一面可以封装多个发光二极管芯粒32。上述的多个子光源板33可以是一块光源电路板31的不同部分。光源电路板31可以留有沟槽34，便于折叠。这块光源电路板31通过折叠，使得多个子光源板31之间具有一折叠角度，以构成所述光源板立体结构。为了构成一个稳定的立体结构，光源电路板31的两个侧边可以构成卡扣结构381、382、383、384，使得在折叠后，这些卡扣结构可以扣接在一起。必须说明的是，这里图示的卡扣的数量跟造型并非用于限制本实用新型的范围，而可以用各种其它的卡扣结构加以替代。此外，在图3中，光源电路板31还具有顶部35与底部36。顶部35进一步配置发光二极管芯粒，以增加发光总量。底部36则具有端子371、372，用来连接外部电源供应。Please refer to FIG. 3 , which illustrates a schematic diagram of a light source circuit board 31 that can be used for folding. One side of the light source circuit board can be packaged with multiple LED chips 32 . The aforementioned plurality of sub-light source boards 33 may be different parts of one light source circuit board 31 . The light source circuit board 31 may have grooves 34 for easy folding. The light source circuit board 31 is folded so that there is a folding angle among the sub-light source boards 31 to form the three-dimensional structure of the light source board. In order to form a stable three-dimensional structure, the two sides of the light source circuit board 31 can form buckling structures 381 , 382 , 383 , 384 , so that these buckling structures can be buckled together after being folded. It must be noted that the number and shape of the buckles shown here are not intended to limit the scope of the present utility model, but can be replaced by various other buckle structures. In addition, in FIG. 3 , the light source circuit board 31 also has a top 35 and a bottom 36 . The top 35 is further configured with LED chips to increase the total amount of light emitted. The bottom 36 has terminals 371, 372 for connecting to an external power supply.
图4例示图3类型光源电路板折叠后的立体示意图。FIG. 4 illustrates a three-dimensional schematic diagram of a folded light source circuit board of the type shown in FIG. 3 .
图5例示图4的光源板立体结构40进一步安装在透明芯柱50的示意图。光源板立体结构40的电端点跟透明芯柱50的第一组端子连接，并且通过嵌入在透明芯柱内部的导线，连接到透明芯柱的第二组端子52、54。此外，透明芯柱50可具有对应的凸块54等结构用来跟灯头做更稳定的定位连接。FIG. 5 illustrates a schematic diagram of the three-dimensional structure 40 of the light source plate in FIG. 4 being further installed on the transparent stem 50 . The electrical terminals of the three-dimensional structure 40 of the light source board are connected to the first group of terminals of the transparent stem 50 , and are connected to the second group of terminals 52 and 54 of the transparent stem through wires embedded in the transparent stem. In addition, the transparent stem 50 may have structures such as corresponding protrusions 54 for more stable positioning and connection with the lamp cap.
图6例示一种灯泡装置实施例的剖面图。在这个实施例中，光源板立体结构68的顶部被透明芯柱的顶部681所支撑。光源板立体结构68的底部被透明芯柱的底部682所连接支撑。光源板立体结构68朝向透光罩66向外进行照明。透明芯柱具有第一组端子691与光源板立体结构68进行电连接。并且，导线692内嵌在透明芯柱内，并且延伸电连接第二组端子693。第二组端子693与驱动电路65进行电连接，再由驱动电路65对外通过导线或导片64、62，连接导外部电源。Fig. 6 illustrates a cross-sectional view of an embodiment of a light bulb device. In this embodiment, the top of the three-dimensional structure 68 of the light source board is supported by the top 681 of the transparent stem. The bottom of the three-dimensional structure 68 of the light source board is connected and supported by the bottom 682 of the transparent stem. The three-dimensional structure 68 of the light source plate illuminates outwards toward the light-transmitting cover 66 . The transparent stem has a first group of terminals 691 for electrical connection with the three-dimensional structure 68 of the light source board. Moreover, the wire 692 is embedded in the transparent stem, and extends to electrically connect to the second set of terminals 693 . The second group of terminals 693 is electrically connected to the driving circuit 65, and then the driving circuit 65 is connected to an external power supply through wires or guide pieces 64, 62.
图7例示另一种灯泡实施例的剖面图。在这个实施例中，驱动电路板72被光源板立体结构71包围。在光源板立体结构71与驱动电路板72之间填充散热材料72。这个驱动电路板72的下方可连接透明芯柱，再接到灯头的其它结构。Figure 7 illustrates a cross-sectional view of another bulb embodiment. In this embodiment, the driving circuit board 72 is surrounded by the three-dimensional structure 71 of the light source board. The heat dissipation material 72 is filled between the three-dimensional structure 71 of the light source board and the driving circuit board 72 . The bottom of the drive circuit board 72 can be connected to the transparent stem, and then connected to other structures of the lamp cap.
图8A例示另一种光源板立体结构的示意图。在这个图示中，光源板立体结构为四边柱体801。当然，光源板立体结构可以是五边形、三角形或其它多边形柱体。FIG. 8A illustrates a schematic diagram of another three-dimensional structure of a light source board. In this illustration, the three-dimensional structure of the light source board is a quadrangular cylinder 801 . Of course, the three-dimensional structure of the light source board can be a pentagon, a triangle or other polygonal cylinders.
图8B例示另一种光源板立体结构的示意图。这个光源板立体结构由两个表面弯曲的子光源板802构成。FIG. 8B is a schematic diagram illustrating another three-dimensional structure of a light source board. The three-dimensional structure of the light source board is composed of two sub-light source boards 802 with curved surfaces.
换言之，发光二极管芯粒可以被安装在一大片电路板，接着安装导线，并将这一大片的电路板进行切割成所需的形状，并在上头留下适合折叠用的刻痕。接着，每个光源电路板通过折叠构成光源板立体结构，再跟透明芯柱进行连接。这种做法可以大幅降低成本跟降低安装的难度。In other words, LED chips can be mounted on a large piece of circuit board, and then wires are installed, and the large piece of circuit board is cut into a desired shape, and a score suitable for folding is left on it. Next, each light source circuit board is folded to form a three-dimensional structure of the light source board, and then connected to the transparent stem. This approach can greatly reduce the cost and reduce the difficulty of installation.
此外，所述光源电路板的一部分可折叠为所述光源电路板的顶部，并且所述光源电路板的顶部与所述透明芯柱的顶部连接，并由所述透明芯柱的顶部加以承载。In addition, a part of the light source circuit board can be folded as the top of the light source circuit board, and the top of the light source circuit board is connected to the top of the transparent stem and carried by the top of the transparent stem.
所述光源电路板的顶部可进一步设置有发光二极管芯粒。此外，所述光源电路板的顶部可设置有卡扣结构，用于跟所述透明芯柱的顶部扣接。此外，通过黏胶或是焊接，也可以达成光源电路板的顶部跟透明芯柱的连接。The top of the light source circuit board can be further provided with LED chips. In addition, the top of the light source circuit board can be provided with a buckle structure for fastening with the top of the transparent stem. In addition, the top of the light source circuit board and the transparent stem can also be connected by glue or welding.
此外，所述光源电路板的另一部分可折叠为所述光源电路板的底部，并且所述光源电路板的底部与所述透明芯柱的底部连接，并由所述透明芯柱的底部加以承载。In addition, another part of the light source circuit board can be folded into the bottom of the light source circuit board, and the bottom of the light source circuit board is connected to the bottom of the transparent stem and is carried by the bottom of the transparent stem .
光源电路板可以折叠成各种立体结构。举例来说，所述多个子光源板可折叠成一多边形柱体结构。为了确保光源板立体结构的模组化跟稳定性，所述光源电路板在折叠成所述多边形柱体结构时，其中两个所述子光源板之间通过彼此间对应的卡扣连接。换言之，当一片光源电路板折叠成多边形，最后两侧端可通过卡扣结构进行扣接，构成一中空柱体结构。此外，也可以通过黏胶或是焊接来确保光源板立体结构的形状。此外，这些子光源板也可以通过跟透明芯柱之间的连接结构进行连接，提供进一步的支撑跟稳定性。The light source circuit board can be folded into various three-dimensional structures. For example, the plurality of sub-light source panels can be folded into a polygonal column structure. In order to ensure the modularization and stability of the three-dimensional structure of the light source board, when the light source circuit board is folded into the polygonal column structure, the two sub-light source boards are connected by corresponding buckles. In other words, when a light source circuit board is folded into a polygonal shape, the two ends at the end can be buckled by buckle structures to form a hollow cylinder structure. In addition, the shape of the three-dimensional structure of the light source board can also be ensured by glue or welding. In addition, these sub-light source panels can also be connected with the connection structure between the transparent stems to provide further support and stability.
这些子光源板的表面可以是平面的，也可以具有一定的弯曲度。举例来说，所述多个子光源板在面向所述透光罩可具有对应的表面弯曲度。The surfaces of these sub-light source panels can be flat or have a certain degree of curvature. For example, the plurality of sub-light source plates may have a corresponding surface curvature facing the light-transmitting cover.
此外，所述子光源板在面对所述透光罩的背面，可以连接散热材料。换言之，在相对发光二极管芯粒的电路板体背面可以附加铝片、散热胶或其它散热材料，以协助散热。In addition, the sub-light source board can be connected with a heat dissipation material on the back side facing the light-transmitting cover. In other words, an aluminum sheet, heat dissipating glue or other heat dissipating materials can be added on the back of the circuit board opposite to the LED chip to assist heat dissipation.
这些散热材料可进一步连接到所述透明芯柱。换言之，所述子光源板的热可以通过透明芯柱加以传递散热。These heat dissipating materials may be further attached to the transparent stem. In other words, the heat of the sub-light source board can be transferred and dissipated through the transparent stem.
此外，所述电源装置的驱动电路除了安装在灯头部分，也可以藏于所述多个子光源板围绕的内侧。甚至，这个驱动电路的电路板可作为支撑这些子光源板的结构之用。In addition, the drive circuit of the power supply device may be hidden inside the plurality of sub-light source boards besides being mounted on the lamp head. Even, the circuit board of the driving circuit can be used as a structure supporting these sub-light source boards.
此外，所述多个子光源板可分别挂在所述透明芯柱上，而构成立体结构。这些子光源板可以分别跟电源装置连接，取得电力，而不一定要通过折叠的方式来组成所述光源板立体结构。In addition, the plurality of sub-light source panels can be respectively hung on the transparent stem to form a three-dimensional structure. These sub-light source panels can be respectively connected to the power supply device to obtain power, and it is not necessary to form the three-dimensional structure of the light source panel by folding.
此外，散热惰性气体，例如氦气，可以填充于所述透光罩内，协助所述多个子光源板进行散热。In addition, a heat-dissipating inert gas, such as helium, can be filled in the transparent cover to assist the plurality of sub-light source panels to dissipate heat.
请参照图9。图9例示一种制作灯泡的流程图。在这种组装灯泡装置的方法中，发光二极管芯粒通过表面贴装器件技术安装在电路板上。封装材料及导线被设置在电路板上。电路板被裁切成一个一个的光源电路板。光源电路板通过折叠构成光源板立体结构。光源板立体结构被安装在透明芯柱上(步骤901)，然后作为一个模组外头安装灯泡壳(步骤902)。之后，通过透明芯柱上的入气口，对于灯泡壳内部进行抽气跟灌入惰性气体(步骤903)。通过加热融化封闭入气口。接着安装驱动电路(步骤904)、散热杯或内衬以及灯头(步骤905)等其它组件，完成灯泡的制作。Please refer to Figure 9. Figure 9 illustrates a flow chart for making a light bulb. In this method of assembling a light bulb unit, LED chips are mounted on a circuit board by surface mount device technology. Packaging material and wires are provided on the circuit board. The circuit board is cut into light source circuit boards one by one. The light source circuit board is folded to form a three-dimensional structure of the light source board. The three-dimensional structure of the light source board is installed on the transparent stem (step 901), and then the bulb shell is installed as a module outside (step 902). Afterwards, through the air inlet on the transparent stem, the inside of the bulb shell is pumped and inert gas is poured (step 903 ). The air inlet is closed by heating and melting. Then other components such as the drive circuit (step 904 ), heat dissipation cup or inner liner and lamp holder (step 905 ) are installed, and the light bulb is completed.
当然，这些步骤并非全部要按照上面的说明逐步实施。对于不同设计，可以进行个别步骤的调整、省略，或加入其它的步骤。Of course, not all of these steps are to be followed step by step as described above. Individual steps may be adjusted, omitted, or additional steps may be added for different designs.
除了上述例子，其它的修改跟变形只要在本实用新型的概念下，应该也可以属于本实用新型的涵盖范围。In addition to the above examples, other modifications and variations should also fall within the scope of the present invention as long as they are under the concept of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621129340.5UCN206268811U (en) | 2016-10-17 | 2016-10-17 | LED lighting device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621129340.5UCN206268811U (en) | 2016-10-17 | 2016-10-17 | LED lighting device |
| Publication Number | Publication Date |
|---|---|
| CN206268811Utrue CN206268811U (en) | 2017-06-20 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621129340.5UActiveCN206268811U (en) | 2016-10-17 | 2016-10-17 | LED lighting device |
| Country | Link |
|---|---|
| CN (1) | CN206268811U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106402681A (en)* | 2016-10-17 | 2017-02-15 | 漳州立达信光电子科技有限公司 | LED lighting device |
| CN108317414A (en)* | 2018-01-15 | 2018-07-24 | 佛山电器照明股份有限公司 | A kind of manufacturing method and LED bulb of LED bulb |
| CN110030501A (en)* | 2019-04-08 | 2019-07-19 | 浙江生辉照明有限公司 | Lighting device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106402681A (en)* | 2016-10-17 | 2017-02-15 | 漳州立达信光电子科技有限公司 | LED lighting device |
| CN108317414A (en)* | 2018-01-15 | 2018-07-24 | 佛山电器照明股份有限公司 | A kind of manufacturing method and LED bulb of LED bulb |
| CN110030501A (en)* | 2019-04-08 | 2019-07-19 | 浙江生辉照明有限公司 | Lighting device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |