The content of the invention
Technical problem to be solved in the utility model is：A kind of frequency chip days of the LTCC Big Dippeves/GPS/GLONASS tri- are providedLine, solves the problems, such as that existing ceramic antenna size is big.
This utility model is employed the following technical solutions to solve above-mentioned technical problem：
A kind of frequency antenna components of the LTCC Big Dippeves/GPS/GLONASS tri-, including cuboid antenna body, antenna body includesSix layers of green body being cascading, and connect with circuit between adjacent two layers, wherein, the surface of ground floor arranges micro-stripLine, the surface of layer 6 sets gradually three pads, and two of two ends are ground pad, and middle one is feed point；4th layerTwo wires are simultaneously set.
The a diameter of 0.08mm of conductive through hole of ground floor to third layer, minimum range of the conductive through hole apart from green body broadsideFor 2.3mm, the minimum range apart from the long side of green body is 0.29mm.
4th layer to layer 6 of a diameter of 0.08mm of conductive through hole, the minimum spacing between adjacent conductive vias is1.39mm, conductive through hole is 0.41mm apart from the minimum range of green body broadside, and the minimum range apart from the long side of green body is0.4mm。
Pass through colloid sintered bonds between adjacent two layers green body.
The overall dimensions of the three frequencies antenna component are long 5.3 ± 0.1mm, wide 2.0 ± 0.1mm, high 1.1 ± 0.1mm.
Described 4th layer of two wires, wherein, one is U-shaped, and another is sector.
Feed point is arranged at 1/3rd of two ground pad connecting lines.
Compared with prior art, this utility model has the advantages that：
1st, using the antenna structure of the utility model, the size of antenna is effectively reduced.
2nd, LTCC process is simples, have saved the coiling time, and circuit connection is simple, effectively reduces interference.
3rd, the antenna precision of the utility model is higher, and performance more preferably, and eliminates the uneven mistake brought of traditional coilingDifference, its consistency is more preferable.
4th, can directly SMT production and processings.
Specific embodiment
Structure of the present utility model and the course of work are described further below in conjunction with the accompanying drawings.
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of frequency antenna components of the LTCC Big Dippeves/GPS/GLONASS tri-, including rectangular body antennaBody, antenna body includes six layers of green body being cascading, and connects with circuit between adjacent two layers, wherein, theOne layer of surface arranges microstrip line, and the surface of layer 6 sets gradually three pads, and two of two ends is ground pad, and middle oneIt is individual for feed point, the second layer and third layer are the complete green body in surface, and the 4th layer to layer 6 is respectively provided with conductive through hole；4th layerOne side arrange two wires, its effect be exactly with the Technology of other layers of whole antenna cooperatively formed uniqueness workSkill, the frequency required for so as to reach the antenna.Different wire shapes can produce different frequencies, be determined according to real needsIt is fixed.
Bonded by colloid between adjacent two layers green body.
The overall dimensions of the three frequencies antenna component are long 5.3 ± 0.1mm, wide 2.0 ± 0.1mm, high 1.1 ± 0.1mm.
Described 4th layer of two wires, as shown in fig. 6, wherein, one is U-shaped, and another is sector.
As shown in fig. 7, feed point is arranged at 1/3rd of two ground pad connecting lines.The shape of the external feed point of the antennaShape is as shown in figure 8, during use, the feed point of the antenna is soldered on the pad shown in Fig. 8.
As shown in figure 4, a diameter of 0.08mm of the conductive through hole of ground floor to third layer, conductive through hole is apart from green body broadsideMinimum range be 2.3mm, apart from the long side of green body minimum range be 0.29mm.
As shown in figure 5, the 4th layer to layer 6 of a diameter of 0.08mm of conductive through hole, the minimum between adjacent conductive viasSpacing is 1.39mm, and conductive through hole is 0.41mm apart from the minimum range of green body broadside, apart from the most narrow spacing on the long side of green bodyFrom for 0.4mm.
This utility model product mainly uses LTCC (Low Temperature Co-fired Ceramic) low temperatureCommon burning porcelain technology.Its Making programme is as shown in Figure 9, Figure 10.
LTCC technology has developed at present the integrated assembly technology in order to attract people's attention, and has become the master of passive integrationFlow Technique, becomes the developing direction in passive element field and the point of economic increase of new element industry.
LTCC technology is to be sufficiently mixed low-temperature sintered ceramics glass powder, and is added after certain colloidal dispersions by streamProlong technology and make the thickness accurately green band of densification.On green band using machinery or laser technology punching, micropore slip casting,The Technologies such as accurate conductor circuit printing make circuit according to necessary requirement, and by multiple passive components (as electric capacity, resistance,Wave filter, bonder etc.) embedment multilayer ceramic substrate in, then overlap together.Internal and external electrode can use silver paste, copperSlurry, gold paste.It is formed in through Technologies such as raw cook cutting, dumping, sintering, plating afterwards non-interfering highly dense under three dimensionsThe three-dimensional circuit substrate of degree circuit or built-in passive element, also can be made passive on its surface by attachment IC and active deviceOr active integrated functional module, and further by circuit miniaturization and densification can be highly suitable for high frequencyCommunication component.Various high-tech LTCC products can be successfully fabricated out using this technology.
The technology that LTCC technology is mainly involved has：It is raw cook casting technology, thick film printing technique, conductor paste technology, lowTemperature common burning technology, IC technologies, multilayer circuit technology, electroplating technology etc..At present LTCC technology is the mainstream technology of passive integration.
LTCC technology feature：
Ceramic material has excellent high-frequency and high-Q characteristic；
Using the high metal material of copper, silver, golden conductivity as conductor material, be conducive to improving the quality of circuit system becauseSon；
High current and high-temperature stability requirement are suitable for, and possess the heat conductivity more excellent than common PCB circuit substrates；
Passive block can be imbedded in Mulitilayer circuit board, be conducive to improving the packing density of circuit；
The high circuit substrate of the number of plies can be as requested made, wherein micropore can reach 0.03mm, and live width can be doneTo 0.05mm, it is possible to achieve very complicated circuit connection.
With preferable temperature characterisitic, such as less thermal coefficient of expansion, less dielectric constant, less temperature coefficient.
The production technology of discontinuous allows to check green sheet, and so as to improve overall yield product is reducedCost.
Due to being that justifying makes, the concordance and stability of product is very high.
LTCC technology application advantage：
The number of plies in theory can be infinitely more, can be according to actual preferably wiring, so as to improve packing density.Can basisNeeds make cavity on ceramic chips, imbed more IC or active device, improve packing density.
The high-frequency and high-Q characteristic of ceramic material, so that product has good high frequency characteristics and high-speed transfer characteristic.
Production process uses Discontinuous manufacture, quality control can be carried out to every one procedure, so as to improve productOverall yield.
The concrete sizing specification of the present embodiment antenna is as follows：
The antenna shapes are a cuboid, and length is L：5.3 ± 0.1mm, width is W：2.0 ± 0.1mm, is highly H：1.1 ± 0.1mm, the distance between back side feed point pad and two ground pads is respectively 2.2 ± 0.1mm and 0.7 ± 0.1mm.
Product structure explanation：
This product is processed by 6 layers of LTCC green bands, from top to down respectively CP1, CP2, CP3, CP4, CP5, CP6,Wherein CP1 surface printings are MP11, and pattern is the printed words with black ink sign.The MPxxx of printed patterns name from top to bottom, such asCP1 surfaces claim MP101 MP11, the CP1 back sides, the like.