Utility model content
Main purpose of the present utility model is to provide a kind of flexible nervus array that can reduce contact impedance, effectively can improve the contact area of flexible nervus and detected part, reduces the contact impedance of flexible nervus and detected part.
Further, this utility model can also reduce the mechanical strength of microelectrode site, ensure that with detected part good contact while, any damage can not be caused to detected part.
For achieving the above object, this utility model provides a kind of flexible nervus array, comprise flexible substrates, insulating barrier, microelectrode unit, wire and lead solder-joint, described microelectrode unit, wire and lead solder-joint are arranged in described flexible substrates, be connected by described wire between described microelectrode unit and described lead solder-joint, described insulating barrier covers in described flexible substrates, described microelectrode unit exposes to described insulating barrier, described flexible substrates is provided with multiple hollow shape projection exposing to described insulating barrier, the hollow shape projection of described insulating barrier is provided with adhesion layer, described microelectrode unit is arranged on described adhesion layer.
Preferably, described insulating barrier is provided with opening in the position of described lead solder-joint, and described lead solder-joint is exposed by the opening of described insulating barrier.
Preferably, the hollow shape projection of described insulating barrier is provided with adhesion layer, described microelectrode unit is arranged on described adhesion layer.
Preferably, the material of described adhesion layer comprises titanium, chromium, or comprises one or both the alloy in these two kinds of elements, and the material of described microelectrode unit is gold.
Preferably, the material of described flexible substrates comprises polydimethylsiloxane, and the material of described insulating barrier comprises can the polydimethylsiloxane of photoetching.
Preferably, described insulating barrier is made up of multiple lamellar insulant.
A kind of flexible nervus array is provided in this utility model, it comprises flexible substrates, insulating barrier, microelectrode unit, wire and lead solder-joint, microelectrode unit, wire and lead solder-joint are all arranged on a flexible substrate, connected by wire between microelectrode unit and lead solder-joint, insulating barrier covers on a flexible substrate, microelectrode unit exposes to insulating barrier, flexible substrates in this utility model is provided with multiple hollow shape projection exposing to insulating barrier, microelectrode unit is arranged on the adhesion layer in the hollow shape projection of flexible substrates, compared with traditional flexible nervus array, hollow projection in this utility model in flexible substrates arranges microelectrode unit, compared to the flexible substrates microelectrode at plane formula, microelectrode in projection adds the surface area in electricity irritation site, effectively can reduce contact impedance, and because the projection in the flexible substrates in this utility model is hollow, therefore it can reduce the bulk strength of microelectrode site, it is made not easily to cause damage to measured position in use,
This utility model uses the tabular microelectrode with multiple projection to make template when making, spin coating one deck flexible base layer in template is made at microelectrode, route wires and lead solder-joint in flexible base layer afterwards, at the boss deposition microelectrode unit of flexible base layer, and insulating barrier is laid in flexible base layer, and make the microelectrode unit on the boss of flexible base layer and boss expose to insulating barrier, manufacturing process simple and fast, and with low cost.
Detailed description of the invention
Should be appreciated that specific embodiment described herein only in order to explain this utility model, and be not used in restriction this utility model.
This utility model provides a kind of flexible nervus array (can be called for short microelectrode array below), see figures.1.and.2, Fig. 1 is the perspective view of a kind of flexible nervus array in this utility model, Fig. 2 is the side structure sectional view of a kind of flexible nervus array in this utility model, a kind of flexible nervus array comprises flexible substrates 1, insulating barrier 2, microelectrode unit 3, wire 4 and lead solder-joint 5, described microelectrode unit 3, wire 4 and lead solder-joint 5 are arranged in described flexible substrates 1, be connected by described wire 4 between described microelectrode unit 3 and described lead solder-joint 5, described insulating barrier 2 covers in described flexible substrates 1, described microelectrode unit 3 exposes to described insulating barrier 2, described flexible substrates 1 is provided with multiple hollow shape projection 7 exposing to described insulating barrier 2, hollow shape projection 7 is arranged adhesion layer 6, described microelectrode unit 3 is arranged on the adhesion layer 6 of the hollow shape projection 7 of described flexible substrates, microelectrode unit 3 is more easily combined with adhesion layer 6, improve the stability of microelectrode unit 3, make microelectrode unit 3 more firm.
In this utility model, a kind of flexible nervus array adopts the flexible substrates 1 with hollow shape bulge-structure, microelectrode unit 3 is deposited on the adhesion layer 6 in the hollow shape projection 7 in flexible substrates 1, wire 4 is similar to traditional microelectrode array with the set-up mode of lead solder-joint 5, can arrange accordingly by different types of microelectrode array, connected between microelectrode unit 3 and lead solder-joint 5 by wire 4, insulating barrier 2 is covered in flexible substrates 1, and make microelectrode unit 3 expose to insulating barrier 2, in use, when microelectrode array is attached to detected part, compared with traditional microelectrode unit 3, microelectrode unit 3 in this utility model can form larger contact area with detected part, namely the surface area in electrode stimulating site can be increased at the structural microelectrode unit 3 of the convex shape of flexible substrates 1, reduce contact impedance, and, hollow shape bulge-structure in flexible substrates 1 can also reduce the intensity of microelectrode unit 3 electrode site, any damage can not be brought to measured position.
Wherein in a preferred embodiment, insulating barrier 2 is provided with opening in the position of described microelectrode unit 3 and lead solder-joint 5, and described lead solder-joint 5 is exposed by the opening of insulating barrier 2.Insulating barrier 2 can also use the insulating barrier of multiple independent laminated structure, now, making flexible substrates 1, and lay microelectrode unit 3, wire and lead solder-joint 5 in flexible substrates 1 after, only the insulating barrier 2 of multiple independent laminated structure need be covered in flexible substrates 1 and wire 4 is covered, microelectrode unit 3 and lead solder-joint 5 are exposed.
Wherein in a preferred embodiment, the material of described adhesion layer 6 comprises titanium, chromium, or comprises one or both the alloy in these two kinds of elements, and the material of described microelectrode unit 3 is gold.
Wherein in a preferred embodiment, the material of described flexible substrates 1 comprises polydimethylsiloxane, and the material of described insulating barrier comprises can the polydimethylsiloxane of photoetching.
But be noted that the making material of all parts in this utility model is not limited to above-mentioned given material, the conventional alternative material that any those skilled in that art can expect belongs to the equivalent replacement of above-mentioned cited material.
In this utility model, the shape of the projection in flexible substrates 1 is not limited to the hollow hemispherical provided in accompanying drawing, it can also be hollow taper shape, the shapes such as hollow pyramid, rectangular pyramid, polygonal pyramid, hollow hemispherical projections in its effect and this utility model is similar, belong to for equal replacement of the present utility model, will not enumerate at this.
When preparing this utility model, first the microelectrode shown in Fig. 3 is used to make template, spin coating flexible substrates in template is made at microelectrode, multiple projection is had because microelectrode makes in template, the plurality of projection is mated with the hollow convex shape of a kind of flexible nervus array that will prepare, therefore after spin coating flexible substrates, flexible substrates just defines multiple hollow bulge-structure, microelectrode unit is deposited afterwards on hollow bulge-structure, and route wires and lead solder-joint on a flexible substrate, by wire, microelectrode unit and lead solder-joint are coupled together, lay insulating barrier on a flexible substrate afterwards, by described insulating barrier at described microelectrode unit, the position opening of described lead solder-joint, make described microelectrode unit, described lead solder-joint exposes through described insulating barrier, after flexible substrates and the equal coagulation forming of insulating barrier, microelectrode is made template be separated with flexible base layer, obtain described a kind of flexible nervus array, the preparation method simple and fast of a kind of flexible nervus array in this utility model, easy making, and cost of manufacture is cheap, production efficiency is high.
When making this utility model, spin coating one deck polydimethylsiloxane can be made in template as flexible substrates at microelectrode, shape is used to make the identical metal form of template with microelectrode, and the microelectrode unit that will metal form makes with described microelectrode in template, the position that the predeterminated position of wire and lead solder-joint is corresponding arranges opening, metal form is covered in flexible base layer, afterwards by the opening on described metal form, one deck titanium or chromium is deposited as adhesion layer at the boss of flexible base layer, one deck gold is deposited afterwards as microelectrode unit on adhesion layer, route wires and lead solder-joint in flexible base layer, microelectrode unit and lead solder-joint is connected by wire, then the described flexible base layer that described metal form makes template from described microelectrode is separated, use metal form, according to microelectrode unit in flexible substrates, the predeterminated position of wire and lead solder-joint, metal form offers multiple opening accordingly, then metal form is laid on a flexible substrate, afterwards microelectrode unit is set on a flexible substrate by the opening on metal form, wire and lead solder-joint, metal form is removed after connecting between microelectrode unit and lead solder-joint by wire, can the making of convenient microelectrode array.
As this utility model preferred embodiment, the optional material of the adhesion layer in this utility model comprises titanium, chromium, or one or both the alloy comprised in these two kinds of elements, magnetron sputtering method can be adopted titanium or chromium or comprise the boss of one or both the alloy deposition in these two kinds of elements in flexible substrates, the material of described microelectrode unit is gold, the available material of described flexible substrates is including, but not limited to polydimethylsiloxane, and the available material of described insulating barrier includes but are not limited to: can the polydimethylsiloxane of photoetching.
These are only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize this utility model description and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.