技术领域technical field
本实用新型涉及麦克风技术领域，特别涉及一种硅麦克风。The utility model relates to the technical field of microphones, in particular to a silicon microphone.
背景技术Background technique
随着社会经济的发展，人们的生活水平越来越高，麦克风在消费领域已广泛应用于移动手机、便携式媒体播放器、数码相机及笔记本电脑等装置中。其中硅麦克风由于尺寸小巧、稳定性强及可回流焊接的特点被广泛使用。With the development of social economy, people's living standards are getting higher and higher, and microphones have been widely used in devices such as mobile phones, portable media players, digital cameras, and notebook computers in the consumer field. Among them, silicon microphones are widely used due to their small size, strong stability and reflow soldering characteristics.
如图1所示，传统的硅麦克风包括MEMS芯片02、集成电路06、PCB板05及罩设于PCB板05上方的壳体01，其中MEMS芯片02和集成电路06均安装在PCB板05上，且均位于壳体01内腔，壳体01上设有音孔04，壳体01内表面与PCB板05、MEMS芯片02外表面及集成电路06外表面形成前腔03，MEMS芯片02内部与PCB板05之间形成后腔07。As shown in Figure 1, a traditional silicon microphone includes a MEMS chip 02, an integrated circuit 06, a PCB board 05, and a housing 01 covering the top of the PCB board 05, wherein the MEMS chip 02 and the integrated circuit 06 are mounted on the PCB board 05 , and are all located in the inner cavity of the housing 01, the housing 01 is provided with a sound hole 04, the inner surface of the housing 01, the outer surface of the PCB board 05, the outer surface of the MEMS chip 02 and the outer surface of the integrated circuit 06 form the front cavity 03, and the inside of the MEMS chip 02 A rear cavity 07 is formed between the PCB board 05 .
然而，由于前腔03的进音通道容积较大，后腔07只有MEMS芯片02内部空间一部分容积，导致硅麦克风的高频频率响应过高，硅麦克风的灵敏度降低。However, due to the large volume of the sound inlet channel of the front chamber 03, the rear chamber 07 has only a part of the volume inside the MEMS chip 02, resulting in a high frequency response of the silicon microphone and a decrease in the sensitivity of the silicon microphone.
因此，如何提高硅麦克风的灵敏度，是本领域技术人员亟待解决的技术问题。Therefore, how to improve the sensitivity of the silicon microphone is a technical problem to be solved urgently by those skilled in the art.
实用新型内容Utility model content
本实用新型的目的是提供一种硅麦克风，该硅麦克风的灵敏度提高。The purpose of the utility model is to provide a silicon microphone whose sensitivity is improved.
为实现上述目的，本实用新型提供一种硅麦克风，包括MEMS芯片、PCB板及安装在所述PCB板上的第一壳体，其特征在于，还包括第二壳体，所述第二壳体内部设有能够与所述MEMS芯片的芯片腔体连通的壳体腔体，所述芯片腔体和所述壳体腔体形成后腔。In order to achieve the above object, the utility model provides a silicon microphone, comprising a MEMS chip, a PCB board and a first housing mounted on the PCB board, characterized in that it also includes a second housing, the second housing A shell cavity capable of communicating with the chip cavity of the MEMS chip is provided inside the body, and the chip cavity and the shell cavity form a rear cavity.
优选地，所述第二壳体固定在所述PCB板上，且与所述第一壳体相互独立设置。Preferably, the second housing is fixed on the PCB, and is set independently from the first housing.
优选地，所述PCB板内部设有连通所述芯片腔体和所述壳体腔体的导流腔体。Preferably, a flow guide cavity communicating with the chip cavity and the housing cavity is provided inside the PCB board.
优选地，所述第一壳体和所述第二壳体均与所述PCB板焊接。Preferably, both the first shell and the second shell are welded to the PCB board.
优选地，所述第一壳体和所述第二壳体的高度相同。Preferably, the first casing and the second casing have the same height.
优选地，所述第一壳体和所述第二壳体为一体式结构。Preferably, the first housing and the second housing are of an integral structure.
优选地，所述第一壳体中的一个侧壁与所述第二壳体中的一个侧壁共用。Preferably, one side wall in the first housing is shared with one side wall in the second housing.
优选地，沿声音的传递方向，所述芯片腔体渐扩。Preferably, the cavity of the chip gradually expands along the sound transmission direction.
在上述技术方案中，本实用新型提供的硅麦克风包括MEMS芯片、PCB板、安装在PCB板上的第一壳体及第二壳体，第二壳体内部设有能够与MEMS芯片的芯片腔体连通的壳体腔体，芯片腔体和壳体腔体形成后腔。In the above-mentioned technical scheme, the silicon microphone provided by the utility model includes a MEMS chip, a PCB board, a first housing and a second housing installed on the PCB board, and the inside of the second housing is provided with a chip cavity capable of connecting with the MEMS chip. The body is connected to the shell cavity, and the chip cavity and the shell cavity form a back cavity.
通过上述描述可知，在本实用新型提供的硅麦克风中，由于后腔由芯片腔体和壳体腔体形成，相对于上述背景技术中，后腔只有芯片腔体构成的情况，本申请提供的硅麦克风的后腔容积增大，则硅麦克风的振膜容易震动，硅麦克风的灵敏度提高。It can be seen from the above description that in the silicon microphone provided by the present invention, since the back cavity is formed by the chip cavity and the housing cavity, compared with the above-mentioned background technology where the back cavity is only composed of the chip cavity, the silicon microphone provided by the application As the volume of the back chamber of the microphone increases, the diaphragm of the silicon microphone is likely to vibrate, and the sensitivity of the silicon microphone increases.
附图说明Description of drawings
图1为传统的硅麦克风的结构示意图；Fig. 1 is the structural representation of traditional silicon microphone;
图2为本实用新型实施例所提供的硅麦克风的结构示意图。FIG. 2 is a schematic structural diagram of a silicon microphone provided by an embodiment of the present invention.
其中图1-2中：01-壳体、02-MEMS芯片、03-前腔、04-音孔、05-PCB板、06-集成电路、07-后腔；Among them, in Figure 1-2: 01-housing, 02-MEMS chip, 03-front cavity, 04-sound hole, 05-PCB board, 06-integrated circuit, 07-back cavity;
1-第一壳体、2-MEMS芯片、3-前腔、4-音孔、5-PCB板、6-集成电路、7-芯片腔体、8-导流腔体、9-第二壳体、10-壳体腔体、11-焊板。1-First shell, 2-MEMS chip, 3-front cavity, 4-sound hole, 5-PCB board, 6-integrated circuit, 7-chip cavity, 8-guiding cavity, 9-second shell Body, 10-shell cavity, 11-welding plate.
具体实施方式Detailed ways
本实用新型的核心是提供一种硅麦克风，该硅麦克风的灵敏度提高。The core of the utility model is to provide a silicon microphone, and the sensitivity of the silicon microphone is improved.
为了使本领域的技术人员更好地理解本实用新型的技术方案，下面结合附图和实施方式对本实用新型作进一步的详细说明。In order to enable those skilled in the art to better understand the technical solution of the utility model, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments.
请参考图2，在一种具体实施方式中，本实用新型提供的硅麦克风包括MEMS芯片2、PCB板5、集成电路6、安装在PCB板5上方的第一壳体1及第二壳体9，其中第二壳体9可以安装在第一壳体1上，也可以与第一壳体1并列布置，安装在PCB板5上。集成电路6英文简称为ASIC，MEMS芯片2在硅麦克风中又叫做声音传感器，又称为MEMS DIE。MEMS芯片2和集成电路6均安装在PCB板5上，MEMS芯片2与集成电路6连接，MEMS芯片2和集成电路6均位于第一壳体1内，第一壳体1内表面与MEMS芯片2外表面及PCB板5之间形成前腔3，第二壳体9内部设有壳体腔体10，芯片腔体7和壳体腔体10形成后腔，其中芯片腔体7和壳体腔体10可以通过管路连通，优选，PCB板5内部设有连通芯片腔体7和壳体腔体10的导流腔体8。具体的，为了避免前腔3和后腔相互干扰，第一壳体1和第二壳体9可以为相互独立设置的壳体。第一壳体1上设有音孔4，音孔4具体可以为一个，具体的，沿声音在音孔4的传递方向，MEMS芯片2位于音孔4正下方。第一壳体1和第二壳体9可以均与PCB板5过盈密封。Please refer to Fig. 2, in a kind of specific embodiment, the silicon microphone provided by the utility model comprises MEMS chip 2, PCB board 5, integrated circuit 6, the first housing 1 and the second housing that are installed on PCB board 5 tops 9, wherein the second housing 9 can be installed on the first housing 1 , or can be arranged side by side with the first housing 1 and installed on the PCB 5 . The integrated circuit 6 is referred to as ASIC in English, and the MEMS chip 2 is also called a sound sensor in a silicon microphone, also called MEMS DIE. Both the MEMS chip 2 and the integrated circuit 6 are installed on the PCB 5, the MEMS chip 2 is connected to the integrated circuit 6, the MEMS chip 2 and the integrated circuit 6 are all located in the first housing 1, and the inner surface of the first housing 1 is connected to the MEMS chip 2 The front cavity 3 is formed between the outer surface and the PCB board 5, and the second shell 9 is provided with a shell cavity 10, and the chip cavity 7 and the shell cavity 10 form a rear cavity, wherein the chip cavity 7 and the shell cavity 10 It can be connected through pipelines. Preferably, the inside of the PCB 5 is provided with a guide cavity 8 that communicates with the chip cavity 7 and the housing cavity 10 . Specifically, in order to prevent the front chamber 3 and the rear chamber from interfering with each other, the first housing 1 and the second housing 9 may be independent housings. The first housing 1 is provided with a sound hole 4 , and there may be one sound hole 4 , specifically, the MEMS chip 2 is located directly below the sound hole 4 along the sound transmission direction in the sound hole 4 . Both the first housing 1 and the second housing 9 can be interference-sealed with the PCB board 5 .
硅麦克风在工作时，外部的声音由音孔4进入前腔3，传递到MEMS芯片2的振膜上，使膜片振动，产生电信号通过导线，传递到集成电路6上，经过芯片处理后，音频信号从PCB板5输出。When the silicon microphone is working, the external sound enters the front chamber 3 through the sound hole 4, and is transmitted to the diaphragm of the MEMS chip 2, causing the diaphragm to vibrate, and the electrical signal generated is transmitted to the integrated circuit 6 through the wire, and after processing by the chip , the audio signal is output from the PCB board 5 .
通过上述描述可知，在本实用新型具体实施例所提供的硅麦克风中，由于后腔由芯片腔体7和壳体腔体10形成，相对于上述背景技术中，后腔只有芯片腔体7构成的情况，本申请提供的硅麦克风的后腔容积增大，则硅麦克风的振膜容易震动，硅麦克风的灵敏度提高，进而提高了硅麦克风的信噪比。It can be seen from the above description that in the silicon microphone provided by the specific embodiment of the utility model, since the back cavity is formed by the chip cavity 7 and the housing cavity 10, compared with the above-mentioned background technology, the back cavity is only composed of the chip cavity 7 If the volume of the back cavity of the silicon microphone provided by the present application is increased, the diaphragm of the silicon microphone is likely to vibrate, and the sensitivity of the silicon microphone is improved, thereby improving the signal-to-noise ratio of the silicon microphone.
为了便于工作人员加工及组装硅麦克风，优选，第一壳体1和第二壳体9为一体式结构，其中第一壳体1和第二壳体9可以共用一个侧壁，即第一壳体1中的一个侧壁与第二壳体9中的一个侧壁共用。In order to facilitate the staff to process and assemble the silicon microphone, preferably, the first housing 1 and the second housing 9 are of an integrated structure, wherein the first housing 1 and the second housing 9 can share a side wall, that is, the first housing One side wall in the body 1 is shared with one side wall in the second housing 9 .
为了避免外界物质损伤第一壳体1和第二壳体9，优选，第一壳体1和第二壳体9的高度相同。In order to prevent foreign substances from damaging the first casing 1 and the second casing 9, preferably, the heights of the first casing 1 and the second casing 9 are the same.
为了提高第一壳体1和第二壳体9与PCB板5的密封性，第一壳体1和第二壳体9均与PCB板5焊接。由于第一壳体1和第二壳体9均与PCB板5焊接，降低了工作人员对第一壳体1、第二壳体9和PCB板5的加工要求。In order to improve the sealing between the first shell 1 and the second shell 9 and the PCB 5 , both the first shell 1 and the second shell 9 are welded to the PCB 5 . Since both the first shell 1 and the second shell 9 are welded with the PCB board 5 , the processing requirements of the staff on the first shell 1 , the second shell 9 and the PCB board 5 are reduced.
进一步，如图2所示，为了便于声音传播，优选，沿声音的传递方向，芯片腔体7渐扩。Further, as shown in FIG. 2 , in order to facilitate sound transmission, preferably, the chip cavity 7 expands gradually along the sound transmission direction.
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other.
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本实用新型。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本实用新型的精神或范围的情况下，在其它实施例中实现。因此，本实用新型将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments enables those skilled in the art to realize or use the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420670980.1UCN204206461U (en) | 2014-11-11 | 2014-11-11 | silicon microphone |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420670980.1UCN204206461U (en) | 2014-11-11 | 2014-11-11 | silicon microphone |
| Publication Number | Publication Date |
|---|---|
| CN204206461Utrue CN204206461U (en) | 2015-03-11 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420670980.1UExpired - LifetimeCN204206461U (en) | 2014-11-11 | 2014-11-11 | silicon microphone |
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| CN (1) | CN204206461U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104301850A (en)* | 2014-11-11 | 2015-01-21 | 山东共达电声股份有限公司 | Silicon microphone |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104301850A (en)* | 2014-11-11 | 2015-01-21 | 山东共达电声股份有限公司 | Silicon microphone |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | Granted publication date:20150311 | |
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