技术领域technical field
本实用新型涉及，利用了发光元件的发光装置以及具备该发光装置的灯。The utility model relates to a light emitting device using a light emitting element and a lamp provided with the light emitting device.
背景技术Background technique
近几年，LED(Light Emitting Diode)等的半导体发光元件，由于高效率以及长寿命，因此，期待成为各种灯的新的光源，以LED为光源的LED灯的研究开发正在进展。In recent years, semiconductor light-emitting elements such as LED (Light Emitting Diode) are expected to become new light sources for various lamps due to their high efficiency and long life, and research and development of LED lamps using LEDs as light sources is progressing.
这样的LED灯有，直管形的LED灯(直管形LED灯)以及灯泡形的LED灯(灯泡形LED灯)。例如，专利文献1公开以往的灯泡形LED灯。并且，专利文献2公开以往的直管形LED灯。而且，在这样的LED灯中，利用具备基板、以及安装在基板上的多个LED的LED模块。Such an LED lamp includes a straight tube-shaped LED lamp (straight tube-shaped LED lamp) and a bulb-shaped LED lamp (bulb-shaped LED lamp). For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp. In addition, Patent Document 2 discloses a conventional straight tube LED lamp. Furthermore, in such an LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
(现有技术文献)(Prior art literature)
(专利文献)(patent documents)
专利文献1：日本特开2006－313717号公报Patent Document 1: Japanese Unexamined Patent Publication No. 2006-313717
专利文献2：日本特开2009－043447号公报Patent Document 2: Japanese Unexamined Patent Publication No. 2009-043447
而且，在用于LED灯的LED模块的基板上，除了LED以外，还设置被图案形成的端子及金属布线等(布线图案)。而且，通过灯头等从LED灯外部供给的电力，通过该布线图案供给到LED。Furthermore, in addition to LEDs, patterned terminals, metal wiring, and the like (wiring pattern) are provided on a substrate of an LED module used for an LED lamp. And, the electric power supplied from the outside of the LED lamp through the cap or the like is supplied to the LED through the wiring pattern.
然而，这样的布线图案的问题是，其表面露出，因此，因外部空气等的影响而容易产生剥离。特别是，在布线图案(金属图案)的边缘部露出的情况下，以该边缘部与基板之间为起点容易产生剥离。作为结果，在产生布线图案的剥离的情况下，向LED的电力供给不稳定，因此，产生LED的发光亮度的降低等的问题。However, such a wiring pattern has a problem in that its surface is exposed, and therefore peeling is likely to occur due to the influence of external air or the like. In particular, when the edge portion of the wiring pattern (metal pattern) is exposed, peeling tends to occur starting from between the edge portion and the substrate. As a result, when peeling of the wiring pattern occurs, the power supply to the LED becomes unstable, thereby causing problems such as a decrease in the emission luminance of the LED.
实用新型内容Utility model content
为了解决这样的问题，本实用新型的目的在于，提供能够抑制布线图案的剥离的的发光装置以及灯。In order to solve such a problem, an object of the present invention is to provide a light emitting device and a lamp capable of suppressing peeling of a wiring pattern.
为了解决所述问题，本实用新型涉及的发光装置的实施方案之一，其中，具备：基板；发光元件，被设置在所述基板上；第一波长变换部，被形成为覆盖所述发光元件，且对所述发光元件发出的光的波长进行变换；第一布线图案，被形成在所述基板上，用于从发光装置外部接受电力并供给到所述发光元件；以及玻璃膜，以连续地覆盖所述第一布线图案以及所述基板的方式而被形成。In order to solve the above problem, one of the embodiments of the light-emitting device according to the present invention includes: a substrate; a light-emitting element disposed on the substrate; a first wavelength conversion part formed to cover the light-emitting element , and convert the wavelength of light emitted by the light-emitting element; a first wiring pattern formed on the substrate for receiving power from outside the light-emitting device and supplying it to the light-emitting element; and a glass film to continuously formed to cover the first wiring pattern and the substrate.
进而，在本实用新型涉及的发光装置的实施方案之一中能够，所述玻璃膜具有透光性，所述第一布线图案，反射从所述发光元件发出的光。Furthermore, in one embodiment of the light-emitting device according to the present invention, the glass film may be light-transmissive, and the first wiring pattern may reflect light emitted from the light-emitting element.
进而，在本实用新型涉及的发光装置的实施方案之一中能够，所述玻璃膜包含无机粒子，且反射从所述发光元件发出的光。Furthermore, in one embodiment of the light-emitting device according to the present invention, the glass film may contain inorganic particles and reflect light emitted from the light-emitting element.
进而，在本实用新型涉及的发光装置的实施方案之一中能够，所述玻璃膜具有使所述第一布线图案露出的开口。Furthermore, in one embodiment of the light-emitting device according to the present invention, the glass film may have an opening exposing the first wiring pattern.
进而，在本实用新型涉及的发光装置的实施方案之一中能够，所述发光装置还具备对所述发光元件发出的光进行变换的第二波长变换部，该第二波长变换部被形成在所述基板与所述发光元件之间，所述基板具有透光性。Furthermore, in one of the embodiments of the light-emitting device according to the present invention, the light-emitting device may further include a second wavelength conversion unit that converts light emitted by the light-emitting element, and the second wavelength conversion unit is formed on the Between the substrate and the light emitting element, the substrate has light transmittance.
进而，在本实用新型涉及的发光装置的实施方案之一中能够，所述发光装置具备多个所述发光元件，所述发光装置还具备将多个所述发光元件串联连接的第二布线图案，所述第二布线图案不与所述玻璃膜以及所述第二波长变换部接触。Furthermore, in one embodiment of the light-emitting device according to the present invention, the light-emitting device may include a plurality of the light-emitting elements, and the light-emitting device may further include a second wiring pattern that connects the plurality of light-emitting elements in series. , the second wiring pattern is not in contact with the glass film and the second wavelength converting portion.
进而，在本实用新型涉及的发光装置的实施方案之一中能够，所述第一波长变换部是由第一波长变换材料和树脂材料构成的密封树脂，所述第一波长变换材料对所述发光元件发出的光的波长进行变换，所述树脂材料含有所述第一波长变换材料，所述第二波长变换部是由第二波长变换材料和无机材料构成的烧结体膜，所述第二波长变换材料对所述发光元件发出的光的波长进行变换，所述无机材料通过烧结而被形成、且含有所述第二波长变换材料。Furthermore, in one of the embodiments of the light-emitting device according to the present invention, the first wavelength conversion part may be a sealing resin composed of a first wavelength conversion material and a resin material, and the first wavelength conversion material may The wavelength of light emitted by the light-emitting element is converted, the resin material contains the first wavelength conversion material, the second wavelength conversion part is a sintered body film composed of the second wavelength conversion material and an inorganic material, and the second The wavelength conversion material converts the wavelength of light emitted from the light emitting element, and the inorganic material is formed by sintering and contains the second wavelength conversion material.
并且，本实用新型涉及的灯的实施方案之一，其中，具备：所述发光装置；中空的球形罩，用于收纳所述发光装置；灯头，接受用于使所述发光装置发光的电力；以及支柱，用于在所述球形罩内支承所述发光装置。Moreover, one of the embodiments of the lamp involved in the present utility model includes: the light emitting device; a hollow spherical cover for accommodating the light emitting device; a lamp base for receiving electric power for making the light emitting device emit light; and a support for supporting the light emitting device within the spherical cover.
进而，在本实用新型涉及的灯的实施方案之一中能够，所述灯还具备与所述灯头电连接的引线，该引线与所述发光装置的所述第一布线图案焊接。Furthermore, in one embodiment of the lamp according to the present invention, the lamp may further include a lead wire electrically connected to the base, and the lead wire is soldered to the first wiring pattern of the light emitting device.
根据本实用新型，能够抑制布线图案的剥离。According to this invention, peeling of a wiring pattern can be suppressed.
附图说明Description of drawings
图1A是本实用新型的实施例1涉及的发光装置的平面图。FIG. 1A is a plan view of a light emitting device according to Embodiment 1 of the present invention.
图1B是本实用新型的实施例1涉及的发光装置的截面图。1B is a cross-sectional view of the light emitting device according to Example 1 of the present invention.
图1C是本实用新型的实施例1涉及的发光装置的截面图。1C is a cross-sectional view of the light emitting device according to Embodiment 1 of the present invention.
图1D是本实用新型的实施例1涉及的发光装置的截面图。1D is a cross-sectional view of the light emitting device according to Example 1 of the present invention.
图2是本实用新型的实施例1涉及的发光装置的制造方法的说明图。2 is an explanatory diagram of a method of manufacturing the light emitting device according to Example 1 of the present invention.
图3是本实用新型的实施例1涉及的发光装置的制造方法的说明图。3 is an explanatory diagram of a method of manufacturing the light-emitting device according to Example 1 of the present invention.
图4A是本实用新型的实施例2涉及的发光装置的平面图。4A is a plan view of a light emitting device according to Example 2 of the present invention.
图4B是本实用新型的实施例2涉及的发光装置的截面图。4B is a cross-sectional view of a light emitting device according to Example 2 of the present invention.
图4C是本实用新型的实施例2涉及的发光装置的截面图。4C is a cross-sectional view of a light emitting device according to Example 2 of the present invention.
图5是本实用新型的实施例2涉及的发光装置的制造方法的说明图。5 is an explanatory diagram of a method of manufacturing a light emitting device according to Example 2 of the present invention.
图6是本实用新型的实施例3涉及的灯泡形灯的侧面图。Fig. 6 is a side view of a light bulb-shaped lamp according to Embodiment 3 of the present invention.
图7是本实用新型的实施例3涉及的灯泡形灯的分解斜视图。Fig. 7 is an exploded perspective view of the bulb-shaped lamp according to Embodiment 3 of the present invention.
图8是本实用新型的实施例3涉及的灯泡形灯的截面图。8 is a cross-sectional view of a light bulb-shaped lamp according to Embodiment 3 of the present invention.
图9是本实用新型的实施例涉及的照明装置的概略截面图。Fig. 9 is a schematic cross-sectional view of the lighting device according to the embodiment of the present invention.
具体实施方式Detailed ways
以下，对于本实用新型的实施例，利用附图进行详细说明。而且，以下说明的实施例，都示出本实用新型的优选的一个具体例子。以下的实施例所示的数值、形状、材料、构成要素、构成要素的配置位置以及连接形态、步骤、步骤的顺序等，是一个例子，而不是限定本实用新型的宗旨。因此，对于以下的实施例的构成要素中的、示出本实用新型的最上位概念的独立权利要求中没有记载的构成要素，作为任意的构成要素来说明。并且，在各个附图中，对于表示实际上相同的结构、工作及效果的要素，附上相同的符号。Hereinafter, embodiments of the present invention will be described in detail using the drawings. In addition, the embodiment described below shows a preferable specific example of this invention. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, steps, order of steps, etc. shown in the following embodiments are examples and do not limit the gist of the present invention. Therefore, among the constituent elements of the following embodiments, the constituent elements not described in the independent claims showing the highest concept of the present invention are described as arbitrary constituent elements. In addition, in each drawing, the same reference numerals are assigned to elements showing substantially the same configuration, operation, and effect.
并且，各个图所示的X轴、Y轴及Z轴是，彼此正交的三个轴。在以下的实施例中，X轴方向是，基板的长度方向(多个LED的排列方向)。并且，Y轴方向是，与X轴正交的方向，且是基板的短方向。并且，Z轴方向是，与X轴及Y轴正交的方向，且是与基板的第一主面垂直的方向。而且，各个图，是模式图，并不是严密示出的图。In addition, the X-axis, Y-axis, and Z-axis shown in each figure are three axes orthogonal to each other. In the following embodiments, the X-axis direction is the length direction of the substrate (arrangement direction of a plurality of LEDs). In addition, the Y-axis direction is a direction perpendicular to the X-axis, and is a short direction of the substrate. In addition, the Z-axis direction is a direction perpendicular to the X-axis and the Y-axis, and is a direction perpendicular to the first main surface of the substrate. In addition, each figure is a schematic figure, and is not a figure shown strictly.
(实施例1)(Example 1)
首先，对于本实用新型的实施例1涉及的发光装置1的结构，利用图1A至图1D进行说明。图1A是示出本实施例涉及的发光装置1的结构的平面图，图1B是示出该发光装置1的结构的截面图(沿着图1A的A－A'线切断的截面图)，图1C是示出该发光装置1的结构的截面图(沿着图1A的B－B'线切断的截面图)，图1D是示出该发光装置1的结构的截面图(沿着图1A的C－C'线切断的截面图)。First, the configuration of a light emitting device 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1A to 1D . 1A is a plan view showing the structure of a light-emitting device 1 according to this embodiment, and FIG. 1B is a cross-sectional view (a cross-sectional view taken along line AA' of FIG. 1A ) showing the structure of the light-emitting device 1 , and FIG. 1C is a cross-sectional view showing the structure of the light-emitting device 1 (a cross-sectional view taken along the BB' line of FIG. 1A ), and FIG. Cross-sectional view cut along line CC').
发光装置1是，放出规定的颜色的光的发光模块(LED模块)，具备：基板10；被设置在基板10上的多个LED20；密封部件30，被形成为覆盖多个LED20，且对LED20发出的光的波长进行变换；第一金属布线51及端子53，被形成在基板10上，用于从发光装置1外部接受电力并供给到LED20；第二金属布线50，被形成在基板10上，且将多个LED20间电连接；玻璃膜52，被形成为连续地覆盖端子53及第一金属布线51和基板10；以及导线60，将LED20和第一金属布线51及第二金属布线50电连接。而且，在图1A中，没有示出导线60。The light-emitting device 1 is a light-emitting module (LED module) that emits light of a predetermined color, and includes: a substrate 10; a plurality of LEDs 20 disposed on the substrate 10; The wavelength of the emitted light is converted; the first metal wiring 51 and the terminal 53 are formed on the substrate 10 for receiving power from the outside of the light emitting device 1 and supplying it to the LED 20; the second metal wiring 50 is formed on the substrate 10 , and electrically connect a plurality of LED20; the glass film 52 is formed to continuously cover the terminal 53 and the first metal wiring 51 and the substrate 10; and the wire 60 connects the LED20 and the first metal wiring 51 and the second metal wiring 50 electrical connection. Also, in FIG. 1A , the wire 60 is not shown.
发光装置1是，在基板10直接安装LED芯片(裸芯片)的COB(Chip OnBoard)型的LED模块。以下，对发光装置1的各构成部件进行详细说明。The light emitting device 1 is a COB (Chip On Board) type LED module in which an LED chip (bare chip) is directly mounted on a substrate 10 . Hereinafter, each component of the light emitting device 1 will be described in detail.
[基板][substrate]
基板10是，例如，由氮化铝以及氧化铝等构成的陶瓷基板、金属基板、树脂基板、玻璃基板、或挠性基板等。基板10是，用于安装LED20的矩形状的安装基板(LED安装用基板)，具有作为安装LED20的面的第一主面(表侧面)10a、以及与该第一主面10a相对的第二主面(背侧面)10b。基板10，若其X轴方向的长度(长边的长度)为L1，Y轴方向的长度(短边的长度)为L2，Z轴方向的基板10的厚度为d，例如，则成为L1＝26mm，L2＝13mm，d＝1mm。The substrate 10 is, for example, a ceramic substrate made of aluminum nitride, alumina, or the like, a metal substrate, a resin substrate, a glass substrate, or a flexible substrate. The substrate 10 is a rectangular mounting substrate (substrate for LED mounting) for mounting the LED 20, and has a first main surface (front side) 10a as a surface on which the LED 20 is mounted, and a second main surface 10a facing the first main surface 10a. Main surface (back surface) 10b. If the length of the substrate 10 in the X-axis direction (the length of the long side) is L1, the length in the Y-axis direction (the length of the short side) is L2, and the thickness of the substrate 10 in the Z-axis direction is d, for example, then L1= 26mm, L2=13mm, d=1mm.
在基板10的X轴方向两端部设置有两个贯通孔11。这些两个贯通孔11，用于将供电用的引线(不图示)与端子53电连接，引线插通贯通孔11。Two through-holes 11 are provided at both ends in the X-axis direction of the substrate 10 . These two through-holes 11 are used to electrically connect lead wires (not shown) for power supply to the terminal 53 , and the lead wires are inserted through the through-holes 11 .
在基板10的中央部设置有一个贯通孔12。该贯通孔12，用于将发光装置1固定到其他的部件(支承部件等)，在贯通孔12嵌合支柱等的支承部件的突起部。One through hole 12 is provided at the center of the substrate 10 . The through-hole 12 is used to fix the light-emitting device 1 to another member (support member, etc.), and a protrusion of a support member such as a pillar is fitted into the through-hole 12 .
而且，即使没有贯通孔11也能够向端子53供电，并且，即使没有贯通孔12也能够将发光装置1固定到支承部件。因此，也可以不设置这样的贯通孔11及12。Furthermore, power can be supplied to the terminal 53 even without the through hole 11 , and the light emitting device 1 can be fixed to the supporting member even without the through hole 12 . Therefore, such through-holes 11 and 12 may not be provided.
[LED][LED]
LED20是，本实用新型的发光元件的一个例子，在基板10的第一主面10a上安装多个LED20。该多个LED20被设置为，X轴方向上以同一间距排列成直线状的元件列，在Y轴方向上排列多条。多个LED20在元件列上串联连接，在元件列彼此之间并联连接。例如，多个LED20被设置为，在元件列内相邻的LED20的间隔(间距)为1.8mm，在相邻的元件列中一方的元件列的LED20和另一方的元件列的LED20的间隔为例如1.8mm。LED20 is an example of the light emitting element of this invention, and some LED20 is mounted on the 1st main surface 10a of the board|substrate 10. As shown in FIG. The plurality of LEDs 20 are provided such that linear element rows are arranged at the same pitch in the X-axis direction, and plural lines are arranged in the Y-axis direction. The some LED20 is connected in series on an element row, and is connected in parallel among element rows. For example, a plurality of LED20 is set such that the interval (pitch) between adjacent LED20 in the element row is 1.8 mm, and the interval between the LED20 of one element row and the LED20 of the other element row in the adjacent element row is For example 1.8mm.
LED20是，向全方位、即侧方、上方及下方发出单色的可见光的裸芯片。LED20，例如，向侧方发出全光量的20％的光，向上方发出全光量的60％的光，向下方发出全光量的20％的光。The LED 20 is a bare chip that emits monochromatic visible light in all directions, that is, laterally, upwardly, and downwardly. For example, the LED 20 emits light of 20% of the total light amount to the side, emits light of 60% of the total light amount upward, and emits light of 20% of the total light amount downward.
LED20是，例如一边的长度为约0.35mm(350μm)的、通电后发出蓝光的矩形状(正方形)的蓝色LED芯片。对于蓝色LED芯片，可以利用例如由InGaN系的材料构成的、中心波长为440nm至470nm的氮化镓系的半导体发光元件。The LED 20 is, for example, a rectangular (square) blue LED chip having a length of about 0.35 mm (350 μm) on one side and emitting blue light when energized. For the blue LED chip, for example, a gallium nitride-based semiconductor light-emitting element with a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.
如图1D示出，LED20具有，蓝宝石基板21、以及层叠在蓝宝石基板21上的、由互不相同的组成构成的多个氮化物半导体层22。As shown in FIG. 1D , LED 20 has a sapphire substrate 21 and a plurality of nitride semiconductor layers 22 stacked on sapphire substrate 21 and composed of mutually different compositions.
在氮化物半导体层22的上面的两端部，设置有阴极电极23和阳极电极24。而且，在阴极电极23上设置有线接合部25，在阳极电极24上设置有线接合部26。在相邻的LED20中，一方的LED20的阴极电极23和另一方的LED20的阳极电极24，通过线接合部25及26，由导线60电连接。A cathode electrode 23 and an anode electrode 24 are provided at both ends of the upper surface of the nitride semiconductor layer 22 . Furthermore, a wire bonding portion 25 is provided on the cathode electrode 23 , and a wire bonding portion 26 is provided on the anode electrode 24 . Among the adjacent LEDs 20 , the cathode electrode 23 of one LED 20 and the anode electrode 24 of the other LED 20 are electrically connected by the wire 60 through the wire bonding portions 25 and 26 .
LED20，以蓝宝石基板21侧的面与基板10的第一主面10a相对的方式，由透光性的芯片接合材料70固定在基板10上。对于芯片接合材料70，可以利用含有由氧化金属构成的填充料的硅树脂等。对芯片接合材料70使用透光性材料，从而能够减少从LED20的侧面发出的光的损失，能够抑制因芯片接合材料70而发生影子。The LED 20 is fixed on the substrate 10 with a translucent die-bonding material 70 such that the surface on the sapphire substrate 21 side faces the first main surface 10 a of the substrate 10 . For the die-bonding material 70, a silicone resin or the like containing a filler made of metal oxide can be used. The loss of the light emitted from the side surface of LED20 can be reduced by using a translucent material for the die-bonding material 70, and generation|occurrence|production of a shadow by the die-bonding material 70 can be suppressed.
[密封部件][Seal Parts]
密封部件30是，本实用新型的第一波长变换部的一个例子，以覆盖的方式密封LED20。密封部件30是，由对LED20发出的光的波长进行变换的第一波长变换材料、和含有第一波长变换材料的树脂材料构成的密封树脂。对于第一波长变换材料，可以利用因LED20发出的光而激励来放出所希望的颜色(波长)的光的荧光体粒子，也可以利用含有半导体、金属错合物、有机染料或颜料等的吸收某波长的光来发出与吸收的光不同的波长的光的物质的材料。而且，在密封部件30中，可以分散二氧化硅粒子等的光扩散材料。The sealing member 30 is an example of the 1st wavelength conversion part of this invention, and seals LED20 so that it may cover. The sealing member 30 is sealing resin which consists of the 1st wavelength conversion material which converts the wavelength of the light which LED20 emits, and the resin material containing a 1st wavelength conversion material. For the first wavelength conversion material, phosphor particles that are excited by the light emitted by the LED 20 to emit light of a desired color (wavelength) can be used, or absorbing materials containing semiconductors, metal complexes, organic dyes, or pigments can also be used. A material of a substance that emits light of a wavelength different from the light absorbed by light of a certain wavelength. In addition, in the sealing member 30, a light diffusion material such as silica particles may be dispersed.
对于这样的荧光体粒子，在LED20是发出蓝光的蓝色LED的情况下，为了从密封部件30射出白光，利用将蓝光波长变换为黄色光的荧光体粒子。例如，对于荧光体粒子可以利用YAG(钇铝石榴石)系的黄色荧光体粒子。据此，LED20发出的蓝光的一部分，由密封部件30中包含的黄色荧光体粒子波长变换为黄色光。而且，没有由黄色荧光体粒子吸收的(没有波长变换的)蓝光、和由黄色荧光体粒子波长变换的黄色光，在密封部件30中扩散并混合，从而成为白光，从密封部件30射出。而且，对于荧光体粒子，可以利用黄色荧光体粒子以外的绿色荧光体粒子或红色荧光体粒子等，在LED20是发出紫外线的LED20的情况下，对于作为第一波长变换材料的荧光体粒子，利用发出三原色(红色，绿色，蓝色)的光的各颜色荧光体粒子的组合。For such phosphor particles, when the LED 20 is a blue LED that emits blue light, in order to emit white light from the sealing member 30 , phosphor particles that convert the wavelength of blue light into yellow light are used. For example, YAG (yttrium aluminum garnet)-based yellow phosphor particles can be used as the phosphor particles. Accordingly, part of the blue light emitted by the LED 20 is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 30 . Then, the blue light not absorbed by the yellow phosphor particles (without wavelength conversion) and the yellow light converted by the yellow phosphor particles diffuse and mix in the sealing member 30 to become white light, which is emitted from the sealing member 30 . Moreover, for phosphor particles, green phosphor particles or red phosphor particles other than yellow phosphor particles can be used. A combination of phosphor particles of each color that emit light of three primary colors (red, green, blue).
另一方面，对于含有荧光体粒子的树脂材料，可以利用硅树脂等的透明树脂材料、氟树脂等的有机材料、或者低熔点玻璃或溶胶凝胶玻璃等的无机材料等。On the other hand, as the resin material containing phosphor particles, transparent resin materials such as silicone resins, organic materials such as fluororesins, inorganic materials such as low-melting glass and sol-gel glass, etc. can be used.
所述的结构的密封部件30，沿着构成元件列的多个LED20的排列方向(X轴方向)被形成为直线状，一并密封LED20的元件列。同时，密封部件30，沿着元件列的排列方向(Y轴方向)形成有多个，个别密封不同的元件列。每一条的密封部件30，例如，长度为24mm，线宽度为1.6mm，中心最大高度为0.7mm。The sealing member 30 of the above-mentioned structure is formed linearly along the arrangement direction (X-axis direction) of the some LED20 which comprises an element row, and seals the element row of LED20 collectively. Meanwhile, a plurality of sealing members 30 are formed along the arrangement direction of the element rows (Y-axis direction), and individually seal different element rows. Each strip of sealing member 30 has, for example, a length of 24 mm, a line width of 1.6 mm, and a maximum center height of 0.7 mm.
[金属布线，端子][metal wiring, terminal]
第一金属布线51是，本实用新型的第一布线图案的一部分的一个例子，为了将LED20的元件列和端子53并联电连接，在基板10的X轴方向的两端部以规定形状且岛状形成有两个。这样的两个第一金属布线51，在第一主面10a，被形成为夹住多个LED20的元件列。The first metal wiring 51 is an example of a part of the first wiring pattern of the present invention. In order to electrically connect the element row of the LED 20 and the terminal 53 in parallel, it is formed at both ends of the X-axis direction of the substrate 10 in a predetermined shape. There are two shapes. Such two first metal wirings 51 are formed so as to sandwich an element row of a plurality of LEDs 20 on the first main surface 10 a.
第一金属布线51，在第一主面10a，被形成为以基板10的Y轴方向为长度方向的略矩形状，该Y轴方向的长度，与位于基板10的Y轴方向的两端的两个元件列的间隔大致相同。The first metal wiring 51 is formed on the first main surface 10a in a substantially rectangular shape with the Y-axis direction of the substrate 10 as the length direction. The spacing of the element columns is approximately the same.
第一金属布线51，在第一主面10a，在与LED20的元件列相邻的部分向元件列(向X轴方向)突出。该第一金属布线51的突出部，成为与来自LED20的导线60的连接部位，由覆盖与自己连接的导线60的密封部件30覆盖。The 1st metal wiring 51 protrudes toward an element row (in the X-axis direction) at the part adjacent to the element row of LED20 in the 1st main surface 10a. The protrusion part of this 1st metal wiring 51 becomes a connection site with the lead wire 60 from LED20, and is covered with the sealing member 30 which covers the lead wire 60 connected to itself.
端子53是，本实用新型的第一布线图案的其他的部的一个例子，作为进行焊接的焊料电极，以围住贯通孔11的方式在第一主面10a被形成为规定形状。端子53，与两个第一金属布线51各自对应来形成有两个。这样的两个端子53，分别与对应的第一金属布线51一体形成，与对应的第一金属布线51接触，从而电连接。由这样的对应的一组第一金属布线51及端子53构成一个第一布线图案。The terminal 53 is an example of another part of the first wiring pattern of the present invention, and is formed in a predetermined shape on the first principal surface 10 a so as to surround the through hole 11 as a solder electrode for soldering. Two terminals 53 are formed corresponding to each of the two first metal wirings 51 . These two terminals 53 are formed integrally with the corresponding first metal wiring 51 , contact the corresponding first metal wiring 51 , and are electrically connected. A set of such corresponding first metal wirings 51 and terminals 53 constitutes one first wiring pattern.
端子53是，发光装置1的供电部，为了使LED20发光，接受来自外部(引线等)的电力，将接受的电力通过第一金属布线51及第二金属布线50供给到各LED20。The terminal 53 is a power supply unit of the light-emitting device 1 , and receives power from the outside (lead wires, etc.) to make the LEDs 20 emit light, and supplies the received power to each LED 20 through the first metal wiring 51 and the second metal wiring 50 .
第二金属布线50是，本实用新型的第二布线图案的一个例子，为了将多个LED20彼此串联电连接，在第一主面10a以规定形状形成有多个。这样的多个第二金属布线50，在第一主面10a，在元件列内的相邻的LED20间被形成为岛状。The 2nd metal wiring 50 is an example of the 2nd wiring pattern of this invention, and in order to electrically connect some LED20 to each other in series, the 2nd metal wiring 50 is formed in some predetermined shape on the 1st main surface 10a. Such a plurality of second metal wirings 50 are formed in an island shape between adjacent LEDs 20 in the element row on the first main surface 10 a.
第二金属布线50，在第一主面10a，被形成为以基板10的Y轴方向为长度方向的矩形状，例如，其X轴方向的长度为0.4mm，Y轴方向的长度为0.5mm，Z轴方向的厚度为0.008mm。The second metal wiring 50 is formed on the first main surface 10a in a rectangular shape with the Y-axis direction of the substrate 10 as its length direction, for example, the length in the X-axis direction is 0.4 mm, and the length in the Y-axis direction is 0.5 mm. , the thickness in the Z-axis direction is 0.008mm.
所述的结构的第一金属布线51、第二金属布线50及端子53由相同的金属材料同时图案形成。对于金属材料，例如，可以利用银(Ag)、钨(W)或铜(Cu)等。而且，在第一金属布线51、第二金属布线50及端子53的表面，可以施行镍(Ni)/金(Au)等的镀金处理。并且，第一金属布线51、第二金属布线50及端子53，可以由不同的金属材料构成，也可以通过不同的工序形成。The first metal wiring 51, the second metal wiring 50, and the terminal 53 of the above-described structure are patterned simultaneously from the same metal material. As the metal material, for example, silver (Ag), tungsten (W), copper (Cu) or the like can be used. Furthermore, the surfaces of the first metal wiring 51, the second metal wiring 50, and the terminal 53 may be subjected to gold plating treatment such as nickel (Ni)/gold (Au). Furthermore, the first metal wiring 51, the second metal wiring 50, and the terminal 53 may be made of different metal materials, or may be formed through different processes.
并且，所述的结构的第一金属布线51及端子53，反射从LED20发出的光。In addition, the first metal wiring 51 and the terminal 53 having the above-described configuration reflect light emitted from the LED 20 .
[导线][wire]
导线60是，用于将LED20和第一金属布线51、或LED20和第二金属布线50电连接的电线，例如，是金电线。如图1D中说明，通过该导线60，被设置在LED20的上面的线接合部25及26各自和在LED20的两侧相邻形成的第一金属布线51或第二金属布线50线接合。The wire 60 is an electric wire for electrically connecting the LED 20 and the first metal wiring 51 or the LED 20 and the second metal wiring 50 , and is, for example, a gold wire. As illustrated in FIG. 1D , each of the wire bonding portions 25 and 26 provided on the upper surface of the LED 20 is wire-bonded to the first metal wiring 51 or the second metal wiring 50 formed adjacent to both sides of the LED 20 through the wire 60 .
导线60，例如，以从密封部件30不露出的方式，整体被埋入在密封部件30中。The lead wire 60 is, for example, entirely embedded in the sealing member 30 so as not to be exposed from the sealing member 30 .
[玻璃膜][glass film]
玻璃膜52是，以氧化硅(SiO2)为主成分的玻璃，例如，由结晶化玻璃构成。玻璃膜52，具有透光性，可见光区域的光的透射率高，因此，能够高效率地使从LED20发出的光向第一金属布线51及端子53透射。玻璃膜52的透射率，例如，相对于可见光区域的光而10％以上，优选的是80％以上，更优选的是90％以上。换而言之，玻璃膜52是，相对于可见光区域的光而透明、即透明看到对面的状态。而且，对于玻璃膜52的透射率，通过变更材料组成来能够调整，但是，通过变更玻璃膜52的厚度也能够调整。The glass film 52 is glass mainly composed of silicon oxide (SiO2 ), for example, crystallized glass. The glass film 52 has translucency and has a high transmittance of light in the visible light region, so it can efficiently transmit the light emitted from the LED 20 to the first metal wiring 51 and the terminal 53 . The transmittance of the glass film 52 is, for example, 10% or more, preferably 80% or more, and more preferably 90% or more with respect to light in the visible light region. In other words, the glass film 52 is transparent to light in the visible light range, that is, the opposite surface is seen transparently. Furthermore, the transmittance of the glass film 52 can be adjusted by changing the material composition, but it can also be adjusted by changing the thickness of the glass film 52 .
玻璃膜52，例如，Z轴方向的厚度为0.01mm，以一并覆盖两组第一金属布线51及端子53的每一个的方式，在第一主面10a以规定形状且岛状形成有两个。这样的两个玻璃膜52被形成为，不与第二金属布线50接触，以使第二金属布线50和导线60能够电连接，并且，仅覆盖对应的第一金属布线51及端子53。The glass film 52 has, for example, a thickness of 0.01 mm in the Z-axis direction, and is formed on the first main surface 10 a in a predetermined shape and in an island shape in such a manner as to cover each of the two sets of first metal wirings 51 and terminals 53 together. indivual. Such two glass films 52 are formed not to be in contact with the second metal wiring 50 so that the second metal wiring 50 and the wire 60 can be electrically connected, and to cover only the corresponding first metal wiring 51 and the terminal 53 .
玻璃膜52，在第一主面10a，被形成为从端子53的边缘部超出，覆盖端子53的边缘部的全部。进而，玻璃膜52，没有被形成在端子53的围住贯通孔11的部分、即设置焊料等的与发光装置1外部的连接部件的连接部分。也就是说，玻璃膜52具有，使端子53的焊接的部分露出到表面的开口。在对端子53进行焊接时在端子53也施加约300℃的温度，因此，对于在端子53上形成的膜，要求对这样的温度具有耐性的膜，玻璃膜52能够满足该要求。因此，玻璃膜52，使端子53和发光装置1外部能够电连接，并且，能够抑制端子53的剥离。例如，在玻璃膜52的开口为半径1.5mm的真圆的情况下，玻璃膜52被形成为，覆盖从端子53的边缘部0.2mm的部分，且从端子53的边缘部超出0.2mm。The glass film 52 is formed on the first main surface 10 a so as to protrude from the edge of the terminal 53 and cover the entire edge of the terminal 53 . Furthermore, the glass film 52 is not formed on the portion of the terminal 53 that surrounds the through hole 11 , that is, the connection portion with a connection member outside the light emitting device 1 where solder or the like is provided. That is, the glass film 52 has openings for exposing the soldered portions of the terminals 53 to the surface. A temperature of about 300° C. is also applied to the terminal 53 when soldering the terminal 53 . Therefore, a film formed on the terminal 53 is required to be resistant to such a temperature, and the glass film 52 can meet this requirement. Therefore, the glass film 52 enables the terminal 53 to be electrically connected to the outside of the light-emitting device 1 , and can suppress peeling of the terminal 53 . For example, when the opening of the glass film 52 is a true circle with a radius of 1.5 mm, the glass film 52 is formed to cover a portion 0.2 mm from the edge of the terminal 53 and protrude 0.2 mm from the edge of the terminal 53 .
玻璃膜52，在第一主面10a，被形成为从第一金属布线51的边缘部超出，覆盖第一金属布线51的突出部(与导线60的连接部位)以外的第一金属布线51的全部。根据这样的结构，玻璃膜52，使LED20和第一金属布线51能够电连接，并且，能够抑制第一金属布线51的剥离。例如，在突出部以外的第一金属布线51的X轴方向的长度(线宽度)为0.5mm的情况下，覆盖第一金属布线51的突出部以外的玻璃膜52的X轴方向的长度为0.9mm，玻璃膜52被形成为，从第一金属布线51的X轴方向的两端分别超出0.2mm。The glass film 52 is formed on the first main surface 10a so as to protrude from the edge of the first metal wiring 51 and cover the first metal wiring 51 other than the protruding portion of the first metal wiring 51 (the connection portion with the wire 60). all. According to such a structure, the glass film 52 can electrically connect LED20 and the 1st metal wiring 51, and can suppress peeling of the 1st metal wiring 51. FIG. For example, when the length (line width) of the X-axis direction of the first metal wiring 51 other than the protruding portion is 0.5 mm, the length of the X-axis direction of the glass film 52 other than the protruding portion covering the first metal wiring 51 is 0.9 mm, and the glass film 52 is formed so as to extend 0.2 mm from both ends of the first metal wiring 51 in the X-axis direction.
在第一金属布线51的突出部近旁上的玻璃膜52上，形成有密封与该突出部对应的LED20的元件列的密封部件30。而且，考虑密封部件30和玻璃膜52的粘合性，可以将密封部件30形成为不与玻璃膜52接触。On the glass film 52 in the vicinity of the protruding part of the first metal wiring 51, the sealing member 30 which seals the element row of the LED20 corresponding to this protruding part is formed. Also, the sealing member 30 may be formed not to be in contact with the glass film 52 in consideration of adhesiveness between the sealing member 30 and the glass film 52 .
而且，在第一主面10a，与两组第一金属布线51及端子53对应来设置两个玻璃膜52，但是，也可以仅设置一个玻璃膜52。在此情况下，可以由玻璃膜52仅覆盖两组第一金属布线51及端子53的某个，也可以由一个玻璃膜52覆盖两组第一金属布线51及端子53。但是，为了不使两组第一金属布线51及端子53短路，需要将玻璃膜52作为绝缘性的膜。Furthermore, two glass films 52 are provided on the first main surface 10 a corresponding to the two sets of first metal wirings 51 and terminals 53 , but only one glass film 52 may be provided. In this case, only one of the two sets of the first metal wiring 51 and the terminal 53 may be covered with the glass film 52 , or the two sets of the first metal wiring 51 and the terminal 53 may be covered with a single glass film 52 . However, in order not to short-circuit the two sets of first metal wirings 51 and terminals 53 , it is necessary to use the glass film 52 as an insulating film.
并且，玻璃膜52，覆盖第一金属布线51及端子53的双方，但也可以是，不覆盖第一金属布线51，而仅覆盖端子53。Furthermore, the glass film 52 covers both the first metal wiring 51 and the terminal 53 , but may cover only the terminal 53 without covering the first metal wiring 51 .
如上所述，本实施例的发光装置1具备：基板10；被设置在基板10上的LED20；以及被形成为覆盖LED20的、对LED20发出的光的波长进行变换的密封部件30。进而，发光装置1具备：第一金属布线51及端子53，被形成在基板10上，用于从发光装置1外部接受电力并供给到LED20；以及玻璃膜52，被形成为连续地覆盖第一金属布线51及端子53和基板10。因此，第一金属布线51及端子53由玻璃膜52涂层，因此，能够抑制第一金属布线51及端子53的剥离。特别是，在第一金属布线51及端子53的边缘部露出的情况下，以边缘部与基板10之间为起点容易产生第一金属布线51及端子53的剥离，但是，通过由玻璃膜52完全覆盖第一金属布线51及端子53的边缘部，从而能够避免它。As described above, the light emitting device 1 of this embodiment includes: the substrate 10 ; the LED 20 provided on the substrate 10 ; and the sealing member 30 formed to cover the LED 20 and convert the wavelength of light emitted by the LED 20 . Furthermore, the light emitting device 1 includes: first metal wiring 51 and terminal 53 formed on the substrate 10 for receiving power from the outside of the light emitting device 1 and supplying it to the LED 20; and a glass film 52 formed to continuously cover the first Metal wiring 51 and terminal 53 and substrate 10 . Therefore, since the first metal wiring 51 and the terminal 53 are coated with the glass film 52 , peeling of the first metal wiring 51 and the terminal 53 can be suppressed. In particular, when the edges of the first metal wiring 51 and the terminals 53 are exposed, peeling of the first metal wiring 51 and the terminals 53 is likely to occur starting from between the edge and the substrate 10. This can be avoided by completely covering the edge portions of the first metal wiring 51 and the terminal 53 .
并且，在利用本实施例的发光装置1构成LED灯的情况下，不是各LED20的光全部直接向LED灯的管内面发出，而是一部分朝向基板10、第一金属布线51及端子53等。同样，对于向管内面发出的光，其一部分不透过管而在管内面反射，也朝向基板10、第一金属布线51及端子53等。但是，在本实施例的发光装置1中，玻璃膜52具有透光性，第一金属布线51以及端子53反射从LED20发出的光。因此，能够由第一金属布线51及端子53使朝向基板10、第一金属布线51及端子53等的光反射来朝向LED灯的管内面，能够提高LED灯的光提取效率。In addition, when the light emitting device 1 of this embodiment is used to form an LED lamp, not all the light of each LED 20 is directly emitted to the inner surface of the LED lamp, but a part of it is directed to the substrate 10, the first metal wiring 51, the terminal 53, and the like. Similarly, a part of the light emitted toward the inner surface of the tube does not pass through the tube but is reflected on the inner surface of the tube, and also goes toward the substrate 10, the first metal wiring 51, the terminal 53, and the like. However, in the light-emitting device 1 of this embodiment, the glass film 52 has light transmission, and the first metal wiring 51 and the terminal 53 reflect light emitted from the LED 20 . Therefore, light directed toward the substrate 10 , the first metal wire 51 , and the terminal 53 can be reflected by the first metal wire 51 and the terminal 53 toward the inner surface of the tube of the LED lamp, and the light extraction efficiency of the LED lamp can be improved.
并且，在本实施例的发光装置1中，玻璃膜52具有，使端子53露出的开口。因此，在端子53露出的部分能够与发光装置1外部电连接。Furthermore, in the light-emitting device 1 of the present embodiment, the glass film 52 has openings for exposing the terminals 53 . Therefore, the exposed portion of the terminal 53 can be electrically connected to the outside of the light emitting device 1 .
而且，在本实施例的发光装置1中，玻璃膜52，被形成为覆盖第一金属布线51及端子53，不被形成在第二金属布线50上。但是，玻璃膜52也可以形成为，以在第二金属布线50的与导线60的连接部位设置开口的方式，连续地覆盖第二金属布线50及基板10。并且，在LED20在第一主面10a上被倒装芯片安装的情况下，玻璃膜52也可以形成为，不设置开口而连续地覆盖第二金属布线50及基板10。据此，能够抑制第二金属布线50的剥离。Furthermore, in the light-emitting device 1 of the present embodiment, the glass film 52 is formed to cover the first metal wiring 51 and the terminal 53 , and is not formed on the second metal wiring 50 . However, the glass film 52 may be formed so as to continuously cover the second metal wiring 50 and the substrate 10 such that an opening is provided at a connection portion of the second metal wiring 50 to the wire 60 . Moreover, when LED20 is flip-chip-mounted on the 1st main surface 10a, the glass film 52 may be formed so that the 2nd metal wiring 50 and the board|substrate 10 may be continuously covered without providing an opening. Accordingly, peeling of the second metal wiring 50 can be suppressed.
接着，对于本实施例涉及的发光装置1的制造方法的一个例子，利用图2及图3进行说明。图2及图3是本实施例涉及的发光装置1的制造方法的说明图。以下，对本实施例的发光装置1的制造方法进行详细说明。Next, an example of a method of manufacturing the light-emitting device 1 according to this embodiment will be described with reference to FIGS. 2 and 3 . 2 and 3 are explanatory views of a method of manufacturing the light-emitting device 1 according to this embodiment. Hereinafter, a method of manufacturing the light emitting device 1 of this embodiment will be described in detail.
首先，如图2的(a)示出，准备设置有贯通孔11及12的基板10。First, as shown in FIG. 2( a ), a substrate 10 provided with through holes 11 and 12 is prepared.
接着，如图2的(b)示出，在基板10的第一主面10a上，将规定形状的第二金属布线50以岛状形成多个，并且，以分别围住两个贯通孔11各自的方式形成两个端子53，进而，以与两个端子53分别接触的方式形成两个第一金属布线51。第一金属布线51、第二金属布线50及端子53，例如，将导电性浆料以规定的图案印刷，以700℃至800℃的温度范围烧制10分钟来能够形成。对于导电性浆料，例如，可以利用以Ag为主成分的银浆料。Next, as shown in FIG. 2( b ), on the first main surface 10 a of the substrate 10 , a plurality of second metal wirings 50 of a predetermined shape are formed in an island shape so as to surround the two through holes 11 respectively. The two terminals 53 are formed individually, and further, the two first metal wirings 51 are formed so as to be in contact with the two terminals 53 respectively. The first metal wiring 51 , the second metal wiring 50 , and the terminal 53 can be formed, for example, by printing a conductive paste in a predetermined pattern and firing at a temperature range of 700° C. to 800° C. for 10 minutes. As the conductive paste, for example, silver paste containing Ag as the main component can be used.
接着，如图2的(c)示出，在基板10的第一主面10a上，以覆盖第一金属布线51及端子53的方式形成玻璃膜52。具体而言，在第一主面10a上，以覆盖端子53的进行焊接等的连接部分以外、和第一金属布线51的与导线60连接的突出部以外的方式形成玻璃膜52。Next, as shown in FIG. 2( c ), a glass film 52 is formed on the first main surface 10 a of the substrate 10 so as to cover the first metal wiring 51 and the terminal 53 . Specifically, the glass film 52 is formed on the first main surface 10 a so as to cover the connection portions of the terminals 53 other than soldering or the like, and the protrusions of the first metal wiring 51 connected to the wires 60 .
接着，如图3的(a)示出，在基板10的第一主面10a上，安装LED20。LED20的安装，由芯片粘合剂等将LED20小片接合而被进行。然后，为了将LED20和第一金属布线51或第二金属布线50电连接，利用导线60对LED20和与该LED20相邻的第一金属布线51或第二金属布线50进行线接合。Next, as shown in (a) of FIG. 3, LED20 is mounted on the 1st main surface 10a of the board|substrate 10. As shown in FIG. Mounting of LED20 is performed by bonding LED20 small pieces with die adhesive etc. Then, in order to electrically connect LED20 and the 1st metal wiring 51 or the 2nd metal wiring 50, LED20 and the 1st metal wiring 51 or the 2nd metal wiring 50 adjacent to this LED20 are wire-bonded by the wire 60.
最后，如图3的(b)示出，在基板10的第一主面10a上，形成密封部件30。这样的密封部件30，通过撒布器方式能够涂布形成。例如，在LED20的上方配置撒布器的排出喷嘴，一边从排出喷嘴排出密封部件材料(含荧光体树脂)，一边使排出喷嘴沿着LED20的元件列移动，从而能够以直线状涂布密封部件材料。然后，通过规定的方法使密封部件材料硬化，从而能够形成规定形状的密封部件30。据此，制造发光装置1。Finally, as shown in FIG. 3( b ), the sealing member 30 is formed on the first main surface 10 a of the substrate 10 . Such a sealing member 30 can be applied and formed by a dispenser method. For example, the discharge nozzle of the dispenser is arranged above the LED 20, and the sealing member material (including phosphor resin) is discharged from the discharge nozzle, and the sealing member material can be applied linearly by moving the discharge nozzle along the element row of the LED 20. . Then, the sealing member material can be cured by a predetermined method to form the sealing member 30 of a predetermined shape. According to this, the light emitting device 1 was manufactured.
在此，具体而言，能够如下形成玻璃膜52。Here, specifically, the glass film 52 can be formed as follows.
首先，准备粉末玻璃，对它添加溶剂来进行混炼，从而制造玻璃膜形成用的浆料。First, powdered glass is prepared, and a solvent is added thereto, kneaded, and a slurry for forming a glass film is produced.
接着，在基板10的第一主面10a上的规定的位置，以规定形状印刷玻璃膜形成用的浆料。而且，对于玻璃膜形成用的浆料，除了印刷以外，还通过涂布也能够涂层。Next, paste for forming a glass film is printed in a predetermined shape on a predetermined position on the first main surface 10 a of the substrate 10 . Furthermore, the paste for forming a glass film can also be coated by coating in addition to printing.
接着，烧制印刷了玻璃膜形成用的浆料的基板10。通过烧制，玻璃膜形成用的浆料的玻璃粉软化，在基板10或布线图案上能够形成作为烧结体膜的玻璃膜52。Next, the substrate 10 printed with the paste for forming a glass film is fired. By firing, the glass frit of the paste for forming the glass film is softened, and the glass film 52 as a sintered body film can be formed on the substrate 10 or the wiring pattern.
如上所述，根据本实施例的发光装置1的制造方法，能够抑制第一金属布线51及端子53的剥离。并且，能够提高LED灯的光提取效率。As described above, according to the method of manufacturing the light emitting device 1 of the present embodiment, it is possible to suppress peeling of the first metal wiring 51 and the terminal 53 . Also, the light extraction efficiency of the LED lamp can be improved.
(变形例)(Modification)
在本实施例中，为了从LED灯提取不朝向LED灯的管内面的LED20的光以及在管内面反射的LED20的光、即从LED灯不被提取的光，而玻璃膜52具有透光性，第一金属布线51以及端子53使LED20的光向管内面反射。然而，即使玻璃膜52本身使LED20的光向管内面反射，也能够得到同样的效果，进而，能够由使LED20的光透过的材料、例如ITO(Indium Tin Oxide)等的透明导电材料构成第一金属布线51及端子53。也就是说，能够提高第一金属布线51及端子53的材料选择的自由度。因此，本变形例的发光装置1与本实施例的发光装置1不同之处是，玻璃膜52包含无机粒子，使从LED20发出的光向管内面反射。以下，以与本实施例的发光装置1不同之处为中心进行详细说明。In this embodiment, in order to extract from the LED lamp the light of the LED 20 that does not go toward the inner surface of the tube of the LED lamp and the light of the LED 20 that is reflected on the inner surface of the tube, that is, the light that is not extracted from the LED lamp, the glass film 52 has translucency. , the first metal wiring 51 and the terminal 53 reflect the light of the LED 20 toward the inner surface of the tube. However, even if the glass film 52 itself reflects the light of the LED 20 to the inner surface of the tube, the same effect can be obtained. Furthermore, the first transparent conductive material such as ITO (Indium Tin Oxide) can be made of a material that allows the light of the LED 20 to pass through. A metal wiring 51 and a terminal 53 . That is, the degree of freedom of material selection for the first metal wiring 51 and the terminal 53 can be increased. Therefore, the difference between the light-emitting device 1 of this modified example and the light-emitting device 1 of this embodiment is that the glass film 52 contains inorganic particles, and reflects the light emitted from the LED 20 toward the inner surface of the tube. Hereinafter, a detailed description will be given centering on differences from the light emitting device 1 of the present embodiment.
[玻璃膜][glass film]
玻璃膜52是，例如，由作为使氧化金属微粒子等的玻璃膜52白色化的白色加添剂的无机粒子、和以氧化硅(SiO2)为主成分的、含有无机粒子的玻璃构成的白色的无机膜。对于无机粒子，例如，可以利用由氧化钛(TiO2)，氧化铝(Al2O3)，氧化硅(SiO2)或氧化镁(MgO)等构成的微粒子。而且，微粒子是，具有数μm以下的粒径的粒子。另一方面，对于含有无机粒子的玻璃，可以利用结晶化玻璃等。The glass film 52 is, for example, a white film composed of inorganic particles as a white additive for whitening the glass film 52 such as metal oxide particles, and glass containing inorganic particles mainly composed of silicon oxide (SiO2 ). inorganic membrane. As the inorganic particles, for example, fine particles made of titanium oxide (TiO2 ), aluminum oxide (Al2 O3 ), silicon oxide (SiO2 ), magnesium oxide (MgO), or the like can be used. In addition, fine particles are particles having a particle diameter of several μm or less. On the other hand, crystallized glass or the like can be used as the glass containing inorganic particles.
玻璃膜52，能够反射从LED20发出的光，具有相对于可见光而高的反射率。调整无机粒子的浓度，从而能够调整玻璃膜52的反射率。也可以将无机粒子的浓度设为，例如80wt％。The glass film 52 can reflect the light emitted from the LED 20 and has a high reflectance with respect to visible light. The reflectance of the glass film 52 can be adjusted by adjusting the concentration of the inorganic particles. The concentration of the inorganic particles can also be set to, for example, 80 wt%.
在此，具体而言，能够如下形成玻璃膜52。Here, specifically, the glass film 52 can be formed as follows.
首先，准备粉末状的无机粒子，并且，准备作为烧结用结合材料的粉末玻璃，对准备的无机粒子及粉末玻璃添加溶剂来进行混炼，从而制造白色的玻璃膜形成用的浆料。First, powdered inorganic particles are prepared, and powdered glass as a binder for sintering is prepared, and a solvent is added to the prepared inorganic particles and powdered glass and kneaded to prepare a white glass film-forming slurry.
接着，在基板10的第一主面10a上的规定的位置，以规定形状印刷白色的玻璃膜形成用的浆料。而且，对于白色的玻璃膜形成用的浆料，除了印刷以外，还通过涂布也能够涂层。Next, a white paste for forming a glass film is printed in a predetermined shape on a predetermined position on the first main surface 10 a of the substrate 10 . Furthermore, the paste for forming a white glass film can also be coated by coating in addition to printing.
接着，对印刷了白色的玻璃膜形成用的浆料的基板10进行烧制。通过烧制，白色的玻璃膜形成用的浆料的玻璃粉软化，能够形成作为无机粒子彼此、并且无机粒子和基板10及布线图案由玻璃粉粘结(接合)的烧结体膜的白色的玻璃膜52。Next, the substrate 10 printed with the paste for forming a white glass film is fired. By firing, the glass frit of the paste for forming a white glass film is softened, and a white glass can be formed as a sintered body film in which inorganic particles, the substrate 10, and the wiring pattern are bonded (joined) by the glass frit. Film 52.
如上所述，根据本变形例的发光装置1，以与实施例1的发光装置1同样的理由，能够抑制第一金属布线51及端子53的剥离。As described above, according to the light emitting device 1 of the present modified example, peeling of the first metal wiring 51 and the terminal 53 can be suppressed for the same reason as that of the light emitting device 1 of the first embodiment.
并且，根据本变形例的发光装置1，玻璃膜52，包含无机粒子，反射从LED20发出的光。因此，能够使朝向第一金属布线51及端子53等的光由第一金属布线51及端子53上的玻璃膜52反射来朝向LED灯的管内面，能够提高LED灯的光提取效率。Furthermore, according to the light-emitting device 1 of this modified example, the glass film 52 includes inorganic particles, and reflects light emitted from the LED 20 . Therefore, light directed toward the first metal wiring 51 and the terminal 53 can be reflected by the glass film 52 on the first metal wiring 51 and the terminal 53 to go toward the inner surface of the tube of the LED lamp, and the light extraction efficiency of the LED lamp can be improved.
(实施例2)(Example 2)
实施例1的发光装置1具有，仅从基板10的单面(第一主面10a)提取光的结构。然而，LED20向下方也射出光，因此，将基板10作为透光性基板，从而能够成为从基板10的另一方的面(第二主面10b)也提取光的结构。在此情况下，在LED20与基板10之间设置与密封部件30不同的波长变换部(第二波长变换部)，从而能够从基板10的双面提取所希望的光。根据这样的结构，不是玻璃膜52，而将第二波长变换部连续地形成在第一金属布线51及端子53和基板10上，由第二波长变换部也能够抑制第一金属布线51及端子53的剥离。然而，若将第二波长变换部形成在第一金属布线51及端子53上，朝向第一金属布线51及端子53的光通过第二波长变换部，因此，产生由第二波长变换部的光的吸收，发生色差以及光提取效率的降低等的问题。The light-emitting device 1 of Example 1 has a structure in which light is extracted from only one surface (first main surface 10 a ) of the substrate 10 . However, since the LED 20 also emits light downward, the board 10 can be configured to extract light from the other surface (second main surface 10 b ) of the board 10 by making the board 10 a translucent board. In this case, desired light can be extracted from both surfaces of the board|substrate 10 by providing the wavelength conversion part (2nd wavelength conversion part) different from the sealing member 30 between LED20 and the board|substrate 10. According to such a structure, instead of the glass film 52, the second wavelength conversion part is continuously formed on the first metal wiring 51, the terminal 53 and the substrate 10, and the first metal wiring 51 and the terminal 53 can also be suppressed by the second wavelength conversion part. 53 stripped. However, if the second wavelength conversion portion is formed on the first metal wiring 51 and the terminal 53, the light directed toward the first metal wiring 51 and the terminal 53 passes through the second wavelength conversion portion, and therefore, light emitted by the second wavelength conversion portion Absorption, chromatic aberration and reduction in light extraction efficiency occur.
于是，本实用新型的实施例2涉及的发光装置2，实现一种发光装置，即，在LED20与基板10之间设置波长变换部的结构中，能够抑制色差以及光提取效率的降低等，并且，能够抑制第一金属布线51及端子53的剥离。Therefore, the light-emitting device 2 according to the second embodiment of the present invention realizes a light-emitting device, that is, in a structure in which a wavelength converting portion is provided between the LED 20 and the substrate 10, chromatic aberration and reduction in light extraction efficiency can be suppressed, and , the peeling of the first metal wiring 51 and the terminal 53 can be suppressed.
首先，对于本实用新型的实施例2涉及的发光装置2的结构，利用图4A至图4C进行说明。图4A是示出本实施例涉及的发光装置2的结构的平面图，图4B是示出该发光装置2的结构的截面图(沿着图4A的A－A'线切断的截面图)，图4C是示出该发光装置2的结构的截面图(沿着图4A的B－B'线切断的截面图)。而且，沿着图4A的C－C'线切断的截面图，与图1D同样。First, the configuration of the light emitting device 2 according to the second embodiment of the present invention will be described using FIGS. 4A to 4C . 4A is a plan view showing the structure of the light emitting device 2 according to this embodiment, and FIG. 4B is a cross-sectional view showing the structure of the light emitting device 2 (a cross-sectional view taken along line AA' in FIG. 4A ), and FIG. 4C is a cross-sectional view showing the structure of the light-emitting device 2 (a cross-sectional view taken along line BB' in FIG. 4A ). Moreover, the cross-sectional view taken along line CC' of FIG. 4A is the same as that of FIG. 1D .
本实施例的发光装置2与实施例1的发光装置1不同之处是，基板10具有透光性，还具备被形成在基板10与多个LED20各自之间的、对LED20发出的光的波长进行变换的第二波长变换部。The difference between the light-emitting device 2 of the present embodiment and the light-emitting device 1 of the first embodiment is that the substrate 10 is light-transmitting, and has a wavelength of light emitted to the LEDs 20 formed between the substrate 10 and each of the plurality of LEDs 20 . A second wavelength conversion section that performs conversion.
发光装置1具备，基板10、多个LED20、密封部件30、荧光体层40、第一金属布线51、第二金属布线50、端子53、玻璃膜52、以及导线60。而且，在图4A中，没有示出导线60。以下，对于发光装置2的各构成部件，以与实施例1的发光装置1不同之处为中心进行详细说明。The light emitting device 1 includes a substrate 10 , a plurality of LEDs 20 , a sealing member 30 , a phosphor layer 40 , a first metal wiring 51 , a second metal wiring 50 , a terminal 53 , a glass film 52 , and a wire 60 . Also, in FIG. 4A , the wire 60 is not shown. Hereinafter, each component of the light emitting device 2 will be described in detail centering on differences from the light emitting device 1 of the first embodiment.
[基板][substrate]
基板10是，具有透光性的透光性基板，使LED20发出的光透过。基板10的透射率，例如相对于可见光区域的光而10％以上，优选的是80％以上，更优选的是90％以上。对于这样的具有透光性的基板10，可以利用由氧化铝以及氮化铝构成的透光性陶瓷基板、透明玻璃基板、水晶基板、蓝宝石基板、或透明树脂基板等。例如，对于基板10，可以利用由透射率为90％的氧化铝构成的透光性陶瓷基板。而且，基板10的透射率，通过变更材料组成来能够调整，但是，通过变更基板10的厚度也能够调整。The board|substrate 10 is a translucent board|substrate which has translucency, and transmits the light which LED20 emits. The transmittance of the substrate 10 is, for example, 10% or more, preferably 80% or more, and more preferably 90% or more with respect to light in the visible light region. As such a translucent substrate 10 , a translucent ceramic substrate made of alumina and aluminum nitride, a transparent glass substrate, a crystal substrate, a sapphire substrate, or a transparent resin substrate can be used. For example, as the substrate 10, a translucent ceramic substrate made of alumina having a transmittance of 90% can be used. Furthermore, the transmittance of the substrate 10 can be adjusted by changing the material composition, but it can also be adjusted by changing the thickness of the substrate 10 .
[LED][LED]
在第一主面10a上，通过荧光体层40安装多个LED20。也就是说，LED20，被安装在荧光体层40上。On the first main surface 10 a, a plurality of LEDs 20 are mounted through the phosphor layer 40 . That is, LED 20 is mounted on phosphor layer 40 .
[荧光体层][phosphor layer]
荧光体层40是，本实用新型的第二波长变换部的一个例子，与各LED20对应以岛状形成多个，被形成在对应的LED20正下面。多个荧光体层40，以同一形状被形成为以基板10的Y轴方向为长度方向的矩形状，例如，该X轴方向的长度为1.0mm，Y轴方向的长度为0.8mm，Z轴方向的厚度为0.045mm。The fluorescent substance layer 40 is an example of the 2nd wavelength conversion part of this invention, and is formed in island shape corresponding to each LED20 in multiple numbers, and is formed directly under the corresponding LED20. A plurality of phosphor layers 40 are formed in the same shape as a rectangular shape with the Y-axis direction of the substrate 10 as the length direction. For example, the length in the X-axis direction is 1.0 mm, the length in the Y-axis direction is 0.8 mm, and the length in the Z-axis direction The thickness in the direction is 0.045mm.
荧光体层40被形成为，不与被形成在相邻的LED20之间的第一金属布线51及第二金属布线50接触。这是因为，若在第一金属布线51及第二金属布线50上形成荧光体层40，则不能将第一金属布线51及第二金属布线50与导线60电连接的缘故。特别是，这是因为，第一金属布线51及第二金属布线50的润湿性高，因此，在印刷糊状的荧光体层40时，若荧光体层40与第一金属布线51及第二金属布线50接触，则扩展在第一金属布线51及第二金属布线50上，由荧光体层40不意图地覆盖。The fluorescent substance layer 40 is formed so that it may not contact the 1st metal wiring 51 and the 2nd metal wiring 50 formed between adjacent LED20. This is because, if the phosphor layer 40 is formed on the first metal wiring 51 and the second metal wiring 50 , the first metal wiring 51 and the second metal wiring 50 cannot be electrically connected to the wire 60 . In particular, this is because the wettability of the first metal wiring 51 and the second metal wiring 50 is high, so when printing the phosphor layer 40 in paste form, if the phosphor layer 40 and the first metal wiring 51 and the second metal wiring 51 The contact between the two metal wirings 50 spreads over the first metal wiring 51 and the second metal wiring 50 , and is covered by the phosphor layer 40 inadvertently.
荧光体层40是，由对LED20发出的光的波长进行变换的第二波长变换材料、和通过烧结而形成的、含有第二波长变换材料的无机材料(烧结用结合材料)构成的烧结体膜。对于第二波长变换材料，与密封部件30同样，可以利用因LED20发出的光而激励来放出所希望的颜色(波长)的光的荧光体粒子，也可以利用含有半导体、金属错合物、有机染料或颜料等的吸收某波长的光来发出与吸收的光不同的波长的光的物质的材料。而且，在密封部件30中，可以分散二氧化硅粒子等的光扩散材料。无机材料是，用于将荧光体粒子粘结到基板10的结合材料(粘结材料)，由相对于可见光而透射率高的材料构成。Phosphor layer 40 is a sintered body film composed of a second wavelength conversion material that converts the wavelength of light emitted by LED 20 , and an inorganic material (bonding material for sintering) that is formed by sintering and contains the second wavelength conversion material. . For the second wavelength conversion material, like the sealing member 30, phosphor particles that are excited by the light emitted by the LED 20 to emit light of a desired color (wavelength) can be used, or materials containing semiconductors, metal complexes, and organic compounds can be used. Materials such as dyes and pigments that absorb light of a certain wavelength and emit light of a different wavelength from the absorbed light. Furthermore, in the sealing member 30, a light-diffusion material, such as a silica particle, can be dispersed. The inorganic material is a bonding material (bonding material) for bonding phosphor particles to the substrate 10, and is made of a material having a high transmittance with respect to visible light.
对于作为第二波长变换材料的荧光体粒子，在LED20是发出蓝光的蓝色LED的情况下，为了从密封部件30射出白光，利用将蓝光波长变换为黄色光或黄绿光的荧光体粒子。对于这样的荧光体粒子，例如，可以利用YAG(钇铝石榴石)系的黄色荧光体粒子、以430nm至470nm激励的Ce(铈)被激活的黄色荧光体粒子或黄绿色荧光体粒子。据此，LED20发出的蓝光的一部分，由荧光体层40中包含的黄色荧光体粒子或黄绿色荧光体粒子波长变换为黄色光或黄绿光。而且，没有由黄色荧光体粒子或黄绿色荧光体粒子吸收的(没有波长变换的)蓝光、和由黄色荧光体粒子或黄绿色荧光体粒子波长变换的黄色光或黄绿光，在密封部件30中扩散并混合，从而成为白光，从荧光体层40射出。而且，对于荧光体粒子，可以利用黄色荧光体粒子以外的绿色荧光体粒子或红色荧光体粒子等，在LED20是发出紫外线的LED20的情况下，对于作为第一波长变换材料的荧光体粒子，利用发出三原色(红色，绿色，蓝色)的光的各颜色荧光体粒子的组合。对于红色荧光体粒子，可以利用以430nm至470nm激励的Eu2+(铕)被激活的红色荧光体粒子。Phosphor particles serving as the second wavelength conversion material, when LED 20 is a blue LED that emits blue light, phosphor particles that convert the wavelength of blue light into yellow light or yellow-green light are used in order to emit white light from sealing member 30 . As such phosphor particles, for example, YAG (yttrium aluminum garnet)-based yellow phosphor particles, Ce (cerium)-activated yellow phosphor particles or yellow-green phosphor particles excited at 430 nm to 470 nm can be used. Accordingly, part of the blue light emitted by the LED 20 is wavelength-converted into yellow light or yellow-green light by the yellow phosphor particles or yellow-green phosphor particles contained in the phosphor layer 40 . Furthermore, the blue light not absorbed by the yellow phosphor particles or the yellow-green phosphor particles (without wavelength conversion) and the yellow light or yellow-green light wavelength-converted by the yellow phosphor particles or the yellow-green phosphor particles diffuse in the sealing member 30. and mixed to become white light, which is emitted from the phosphor layer 40 . Moreover, for phosphor particles, green phosphor particles or red phosphor particles other than yellow phosphor particles can be used. A combination of phosphor particles of each color that emit light of three primary colors (red, green, blue). For the red phosphor particles, Eu2+ (europium) activated red phosphor particles excited at 430 nm to 470 nm can be used.
对于含有荧光体粒子的无机材料，可以利用以氧化硅(SiO2)为主成分的玻璃粉、以及由低熔点结晶构成的SnO2－B2O3等。玻璃粉，将玻璃粉末加热并溶化来能够形成。对于玻璃粉的玻璃粉末，可以利用SiO2－B2O3－R2O系、B2O3－R2O系或P2O5－R2O系(但是，R2O均为Li2O、Na2O、或K2O)。As the inorganic material containing phosphor particles, glass frit mainly composed of silicon oxide (SiO2 ), SnO2 -B2 O3 composed of low-melting crystals, and the like can be used. Glass powder can be formed by heating and melting glass powder. For the glass powder of glass powder, SiO2 -B2 O3 -R2 O system, B2 O3 -R2 O system or P2 O5 -R2 O system can be used (however, R2 O is Li2 O, Na2 O, or K2 O).
而且，在第二波长变换材料是荧光体粒子、基板10是氧化铝基板的情况下，优选的是，荧光体层40的荧光体粒子的浓度为91wt％以下，并且，荧光体层40的厚度为0.035mm以上。这是因为，若荧光体粒子的浓度超过91％，对氧化铝基板产生荧光体层40的剥离的缘故。Moreover, when the second wavelength conversion material is phosphor particles and the substrate 10 is an alumina substrate, it is preferable that the concentration of phosphor particles in the phosphor layer 40 is 91 wt % or less, and that the thickness of the phosphor layer 40 0.035mm or more. This is because, when the concentration of the phosphor particles exceeds 91%, peeling of the phosphor layer 40 occurs on the alumina substrate.
以上，根据本实施例涉及的发光装置2，根据与实施例1的发光装置1同样的理由，能够抑制第一金属布线51及端子53的剥离。As described above, according to the light emitting device 2 according to the present embodiment, peeling of the first metal wiring 51 and the terminal 53 can be suppressed for the same reason as that of the light emitting device 1 of the first embodiment.
并且，本实施例涉及的发光装置2，具备被形成在基板10与LED20之间的、对LED20发出的光的波长进行变换的荧光体层40，基板10具有透光性。因此，LED20的光的一部分通过荧光体层40后，传播在透光性的基板10内朝向第一金属布线51及端子53等。但是，根据发光装置2，能够将这样的光，由第一金属布线51及端子53或玻璃膜52，向LED灯的管内面反射，因此，能够提高LED灯的光提取效率。Furthermore, the light-emitting device 2 according to the present embodiment includes a phosphor layer 40 formed between the substrate 10 and the LED 20 to convert the wavelength of light emitted by the LED 20 , and the substrate 10 has translucency. Therefore, part of the light from the LED 20 propagates through the phosphor layer 40 in the translucent substrate 10 toward the first metal wiring 51 , the terminal 53 , and the like. However, according to the light emitting device 2, such light can be reflected by the first metal wiring 51 and the terminal 53 or the glass film 52 toward the inner surface of the tube of the LED lamp, so that the light extraction efficiency of the LED lamp can be improved.
本实施例涉及的发光装置2，具备多个LED20，还具备将多个LED20串联连接的第二金属布线50，第二金属布线50不与玻璃膜52及荧光体层40接触。为了线接合，需要使第二金属布线50的表面露出，因此，能够避免第二金属布线50由玻璃膜52及荧光体层40不意图地覆盖。The light emitting device 2 according to this embodiment includes a plurality of LEDs 20 and also includes a second metal wiring 50 connecting the plurality of LEDs 20 in series, and the second metal wiring 50 is not in contact with the glass film 52 and the phosphor layer 40 . For wire bonding, it is necessary to expose the surface of the second metal wiring 50 , so that the second metal wiring 50 can be prevented from being unintentionally covered with the glass film 52 and the phosphor layer 40 .
在本实施例涉及的发光装置2中，密封部件30是，由对LED20发出的光的波长进行变换的第一波长变换材料、和含有第一波长变换材料的树脂材料构成的密封树脂。并且，荧光体层40是，由对LED20发出的光的波长进行变换的第二波长变换材料、和通过烧结而形成的、含有第二波长变换材料的无机材料构成的烧结体膜。因此，为了抑制第一金属布线51及端子53的剥离，若由荧光体层40覆盖第一金属布线51及端子53，则发生色差以及光提取效率的降低。但是，对于第一金属布线51及端子53的剥离，由透明或具有反射功能的玻璃膜52抑制，因此，不会发生这样的问题。In the light emitting device 2 according to this embodiment, the sealing member 30 is a sealing resin composed of a first wavelength conversion material that converts the wavelength of light emitted by the LED 20 and a resin material containing the first wavelength conversion material. And the phosphor layer 40 is a sintered body film which consists of the 2nd wavelength conversion material which converts the wavelength of the light which LED20 emits, and the inorganic material containing the 2nd wavelength conversion material formed by sintering. Therefore, in order to suppress peeling of the first metal wiring 51 and the terminal 53 , if the first metal wiring 51 and the terminal 53 are covered with the phosphor layer 40 , chromatic aberration and reduction in light extraction efficiency will occur. However, since the peeling of the first metal wiring 51 and the terminal 53 is suppressed by the transparent or reflective glass film 52, such a problem does not occur.
接着，对于本实施例涉及的发光装置2的制造方法的一个例子，利用图5进行说明。图5是本实施例涉及的发光装置2的制造方法的说明图。Next, an example of a method of manufacturing the light-emitting device 2 according to this embodiment will be described with reference to FIG. 5 . FIG. 5 is an explanatory diagram of a method of manufacturing the light emitting device 2 according to this embodiment.
本实施例涉及的发光装置2的制造方法与实施例1的发光装置1的制造方法不同之处是，在形成玻璃膜52后将LED20安装在基板10上之前，还包括形成荧光体层40的工序。以下，对于本实施例的发光装置2的制造方法以与实施例1的发光装置1的制造方法不同之处为中心进行详细说明。The difference between the manufacturing method of the light-emitting device 2 according to the present embodiment and the method of manufacturing the light-emitting device 1 of the first embodiment is that, after the glass film 52 is formed and before the LED 20 is mounted on the substrate 10, a step of forming the phosphor layer 40 is also included. process. Hereinafter, the method of manufacturing the light-emitting device 2 of the present embodiment will be described in detail focusing on differences from the method of manufacturing the light-emitting device 1 of the first embodiment.
首先，执行图2的(a)至(c)的各个工序，在设置有贯通孔11及12的透光性的基板10上，形成第一金属布线51、第二金属布线50、端子53及玻璃膜52。First, the steps of (a) to (c) in FIG. 2 are performed to form the first metal wiring 51, the second metal wiring 50, the terminals 53 and Glass film 52.
接着，如图5的(a)示出，在基板10的第一主面10a上，以位于相邻的第二金属布线50间的方式形成岛状的多个荧光体层40。然后，在荧光体层40上设置LED20之后，利用导线60对LED20和与该LED20相邻的第一金属布线51或第二金属布线50进行线接合。Next, as shown in FIG. 5( a ), a plurality of island-shaped phosphor layers 40 are formed on the first main surface 10 a of the substrate 10 so as to be located between adjacent second metal wirings 50 . Then, after the LED 20 is provided on the phosphor layer 40 , the LED 20 and the first metal wiring 51 or the second metal wiring 50 adjacent to the LED 20 are wire-bonded by the wire 60 .
最后，如图5的(b)示出，在基板10的第一主面10a上，形成密封部件30。据此，制造发光装置2。Finally, as shown in FIG. 5( b ), the sealing member 30 is formed on the first main surface 10 a of the substrate 10 . According to this, the light emitting device 2 was manufactured.
在此，具体而言，能够如下形成荧光体层40。Here, specifically, the phosphor layer 40 can be formed as follows.
首先，准备作为第二波长变换材料的粉末状的荧光体粒子，并且，准备作为烧结用结合材料的粉末玻璃，对准备的荧光体粒子及粉末玻璃添加溶剂来进行混炼，从而制造烧结体膜形成用的浆料(糊状的荧光体层40)。对于烧结用结合材料，例如，可以利用软化点为520℃的粉末玻璃。可以将黄色荧光体粒子及粉末玻璃的重量比(wt％)设为，例如80:20的比例。将准备的所述材料，例如，通过三根轧辊的混炼机进行混炼(混合)，从而能够成为糊状。而且，对于荧光体粒子的比例，不仅限于80wt％，而可以是20至91wt％的范围的比例。First, powdered phosphor particles are prepared as the second wavelength conversion material, and powdered glass is prepared as a binder for sintering, and a solvent is added to the prepared phosphor particles and powdered glass, and kneaded to manufacture a sintered body film. A paste for formation (paste phosphor layer 40). As the bonding material for sintering, for example, powdered glass having a softening point of 520° C. can be used. The weight ratio (wt %) of the yellow phosphor particles and the powdered glass can be set to, for example, 80:20. The prepared material can be kneaded (mixed) by, for example, a three-roll kneader to form a paste. Furthermore, the ratio of the phosphor particles is not limited to 80 wt%, but may be a ratio in the range of 20 to 91 wt%.
接着，在基板10的第一主面10a上的规定的位置，以规定形状印刷烧结体膜形成用的浆料。而且，对于烧结体膜形成用的浆料，除了印刷以外，还通过涂布也能够涂层。并且，也可以将烧结体膜形成用的浆料涂层在基板10之前，对基板10的第一主面10a施行规定的表面处理。Next, a paste for forming a sintered body film is printed in a predetermined shape on a predetermined position on the first main surface 10 a of the substrate 10 . Furthermore, the paste for sintered body film formation can also be coated by coating in addition to printing. In addition, the slurry for forming the sintered body film may be applied to the first main surface 10 a of the substrate 10 before the substrate 10 to perform a predetermined surface treatment.
接着，将印刷了烧结体膜形成用的浆料的基板10，例如，以150℃的温度干燥30分钟，然后，以约600℃的温度烧制10分钟。通过烧制，玻璃粉软化，能够形成作为荧光体粒子彼此、并且荧光体粒子和基板10由玻璃粉粘结(接合)的烧结体膜(荧光体层40)。而且，对于烧制温度，优选的是，荧光体粒子不劣化的温度，且玻璃粉软化的温度。若超过700℃，则荧光体粒子劣化，因此，优选的是，烧制温度低于700℃。据此，能够将荧光体层40覆盖在基板10的第一主面10a上。Next, the substrate 10 printed with the paste for forming the sintered body film is dried at, for example, 150° C. for 30 minutes, and then fired at about 600° C. for 10 minutes. By firing, the glass frit is softened to form a sintered body film (phosphor layer 40 ) in which the phosphor particles are bonded (bonded) to each other and the substrate 10 by the glass frit. Furthermore, the firing temperature is preferably a temperature at which the phosphor particles do not deteriorate and a temperature at which the glass frit softens. If the temperature exceeds 700°C, the phosphor particles will deteriorate, so the firing temperature is preferably lower than 700°C. Accordingly, the phosphor layer 40 can be covered on the first main surface 10 a of the substrate 10 .
如上所述，根据本实施例的发光装置2的制造方法，能够抑制第一金属布线51及端子53的剥离。并且，能够提高LED灯的光提取效率。As described above, according to the method of manufacturing the light emitting device 2 of the present embodiment, it is possible to suppress peeling of the first metal wiring 51 and the terminal 53 . Also, the light extraction efficiency of the LED lamp can be improved.
而且，根据本实施例的发光装置2的制造方法，对于荧光体层40的形成工序，形成玻璃膜52的工序之后进行，但是，若是准备基板10的工序之后、且安装LED20的工序之前，则不仅限于此。例如，对于荧光体层40的形成工序，也可以在形成第一布线图案的工序之后且形成玻璃膜52的工序之前进行。Furthermore, according to the method of manufacturing the light-emitting device 2 of this embodiment, the phosphor layer 40 is formed after the step of forming the glass film 52, but if it is after the step of preparing the substrate 10 and before the step of mounting the LED 20, then It doesn't stop there. For example, the step of forming the phosphor layer 40 may be performed after the step of forming the first wiring pattern and before the step of forming the glass film 52 .
(实施例3)(Example 3)
接着，对于本实用新型涉及的实施例3涉及的灯泡形灯100，利用图6至图8进行说明。本实施例涉及的灯泡形灯100是，实施例1或2涉及的发光装置的适用例。图6是本实施例涉及的灯泡形灯100的侧面图。图7是本实施例涉及的灯泡形灯100的分解斜视图。图8是本实施例涉及的灯泡形灯100的截面图。Next, the light bulb-shaped lamp 100 which concerns on Example 3 which concerns on this invention is demonstrated using FIGS. 6-8. The light bulb-shaped lamp 100 according to the present embodiment is an application example of the light emitting device according to the first or second embodiment. FIG. 6 is a side view of the light bulb-shaped lamp 100 according to this embodiment. FIG. 7 is an exploded perspective view of the light bulb-shaped lamp 100 according to this embodiment. FIG. 8 is a cross-sectional view of a light bulb-shaped lamp 100 according to this embodiment.
灯泡形灯100是，成为灯泡形荧光灯或白炽灯泡的代替品的灯泡形LED灯，具备：透光性且中空的球形罩110；作为光源的LED模块120；接受用于使LED模块120发光的电力的灯头130；球形罩110内支承(保持)LED模块120的支柱140；支承支柱140的支承台150；树脂外壳160；引线170，与灯头130电连接来从灯头130接受电力，一端与LED模块120的端子53焊接；以及点灯电路180。The bulb-shaped lamp 100 is a bulb-shaped LED lamp as a substitute for a bulb-shaped fluorescent lamp or an incandescent bulb, and includes: a translucent and hollow spherical cover 110; an LED module 120 as a light source; Lamp holder 130 of electric power; Support (maintain) pillar 140 of LED module 120 in spherical cover 110; Support stand 150 of support pillar 140; Resin shell 160; The terminal 53 of the module 120 is soldered; and the lighting circuit 180 .
灯泡形灯100，由球形罩110和树脂外壳160和灯头130构成外围器。对于LED模块120，可以利用实施例1或2的发光装置1或2。以下，对于灯泡形灯100的各构成部件，参照图6至图8进行详细说明。The bulb-shaped lamp 100 has a globe 110 , a resin case 160 , and a base 130 to form a peripheral. For the LED module 120, the light emitting device 1 or 2 of Embodiment 1 or 2 can be utilized. Hereinafter, each component of the lightbulb-shaped lamp 100 will be described in detail with reference to FIGS. 6 to 8 .
[球形罩][dome cover]
球形罩110，收纳LED模块120，并且，将来自LED模块120的光透射到灯外部。球形罩110是，相对于可见光而透明的硅基玻璃制的玻璃灯泡(透明灯泡)。因此，从球形罩110的外侧能够看到被收纳在球形罩110内的LED模块120。The glove 110 accommodates the LED module 120 and transmits light from the LED module 120 to the outside of the lamp. The glove 110 is a glass bulb (transparent bulb) made of silicon-based glass that is transparent to visible light. Therefore, the LED module 120 housed in the glove 110 can be seen from the outside of the glove 110 .
球形罩110的形状是，一端以球状闭塞、在另一端具有开口部的形状。换而言之，球形罩110的形状是，中空的球的一部分，向从球的中心部远离的方向一边延伸一边狭窄的形状，在距球的中心部远离的位置形成有开口部。对于这样的形状的球形罩110，可以利用与一般的白炽灯泡同样的形状的玻璃灯泡。例如，对于球形罩110，可以利用A型、G型或E型等的玻璃灯泡。The shape of the glove 110 is a shape in which one end is closed in a spherical shape and the other end has an opening. In other words, the shape of the glove 110 is a shape in which a part of the hollow ball is narrow while extending away from the center of the ball, and an opening is formed at a position away from the center of the ball. For the glove 110 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, a glass bulb of type A, type G, or type E may be used for the globe 110 .
而且，球形罩110，并不一定需要相对于可见光而透明，球形罩110可以具有光扩散功能。例如，也可以将含有二氧化硅以及碳酸钙等的光扩散材料的树脂以及白色颜料等涂布在球形罩110的内表面或外表面的全面，从而形成乳白色的光扩散膜。并且，球形罩110，并不一定需要是硅基玻璃制。例如，也可以利用由丙烯等的树脂材料制造的球形罩110。Furthermore, the glove 110 does not necessarily need to be transparent to visible light, and the glove 110 may have a light-diffusing function. For example, a resin containing a light-diffusing material such as silica and calcium carbonate, and a white pigment may be coated on the entire inner or outer surface of the glove 110 to form a milky-white light-diffusing film. Also, the glove 110 does not necessarily need to be made of silicon-based glass. For example, the glove 110 made of a resin material such as acrylic may also be used.
[灯头][lamp holder]
灯头130是，从外部接受用于使LED模块120的LED发光的电力的受电部，例如，被装配在照明器具的插座。在灯泡形灯100点灯的情况下，灯头130，从照明器具的插座接受电力。灯头130由双接点接受交流电，由灯头130接受的电力，通过引线输入到点灯电路180的电力输入部。The base 130 is a power receiving unit that externally receives electric power for causing the LEDs of the LED module 120 to emit light, and is mounted, for example, on a socket of a lighting fixture. When the light bulb-shaped lamp 100 is turned on, the base 130 receives electric power from an outlet of the lighting fixture. The base 130 receives alternating current through double contacts, and the electric power received by the base 130 is input to the power input part of the lighting circuit 180 through lead wires.
灯头130是E型，在其外周面形成有用于与照明装置的插座拧合的拧合部。并且，在灯头130的内周面，形成有用于与树脂外壳160拧合的拧合部。而且，灯头130是，金属制的有底筒体形状。The lamp base 130 is E-shaped, and a screwing part for screwing with a socket of the lighting device is formed on its outer peripheral surface. Furthermore, on the inner peripheral surface of the base 130, a screwing portion for screwing with the resin case 160 is formed. Furthermore, the base 130 is a bottomed cylindrical shape made of metal.
对于灯头130的种类，没有特别的限制，但是，例如，可以利用螺旋型的爱迪生螺纹型(E型)的灯头，可以举出E26型或E17型等。The type of the base 130 is not particularly limited, but, for example, a helical Edison screw type (E type) base can be used, and examples include E26 type and E17 type.
[支柱][pillar]
支柱140是，从球形罩110的开口部的近旁向球形罩110的内部延伸设置的金属制的柱芯。支柱140，作为保持LED模块120的保持部件来发挥功能，支柱140的一端与LED模块120连接，支柱140的另一端与支承台150连接。The pillar 140 is a metal column core extending from the vicinity of the opening of the glove 110 toward the inside of the glove 110 . The support 140 functions as a holding member for holding the LED module 120 , and one end of the support 140 is connected to the LED module 120 , and the other end of the support 140 is connected to the supporting base 150 .
支柱140，由金属材料构成，也作为用于使LED模块120发生的热散发的散热部件来发挥功能。支柱140，例如由热导率为237[W/m·K]的铝构成。如此，支柱140由金属材料构成，因此，LED模块120的热通过基板高效率地传导到支柱140。据此，能够将LED模块120的热散发到灯头130侧。其结果为，能够抑制因温度上升而引起的LED的发光效率的降低及寿命的降低。The pillar 140 is made of a metal material and also functions as a heat dissipation member for dissipating heat generated by the LED module 120 . The pillar 140 is made of, for example, aluminum with a thermal conductivity of 237 [W/m·K]. In this way, since the pillar 140 is made of a metal material, the heat of the LED module 120 is efficiently conducted to the pillar 140 through the substrate. Accordingly, the heat of the LED module 120 can be dissipated to the base 130 side. As a result, it is possible to suppress a decrease in luminous efficiency and a decrease in lifetime of the LED due to temperature rise.
支柱140具有，用于与被设置在LED模块120的基板的贯通孔(图1A及图1C的贯通孔12)嵌合的突起部。突起部，被设置为从支柱140的顶部上面突出，作为限制LED模块120的位置的位置限制部来发挥功能。即，突起部被构成为，决定LED模块120的配置方向。The pillar 140 has a protrusion for fitting into a through hole (the through hole 12 in FIGS. 1A and 1C ) provided in the substrate of the LED module 120 . The protrusion is provided to protrude from the upper surface of the top of the pillar 140 , and functions as a position restricting portion for restricting the position of the LED module 120 . That is, the protruding portion is configured to determine the arrangement direction of the LED modules 120 .
而且，对于支柱140，与以往的灯泡形荧光灯同样，可以利用由相对于可见光而透明的软质玻璃或透明树脂构成的柱芯。据此，能够抑制LED模块120产生的光由支柱140损失。并且，也能够防止因支柱140而发生影子。进而，支柱140因LED模块120发出的白光而发光，因此，灯泡形灯100，也能够发挥视觉上良好的美观。Furthermore, as for the pillar 140, a pillar core made of soft glass or transparent resin transparent to visible light can be used, as in a conventional bulb-shaped fluorescent lamp. Accordingly, it is possible to suppress loss of light generated by the LED module 120 through the support 140 . In addition, it is also possible to prevent shadows from being generated by the pillars 140 . Furthermore, since the pillar 140 emits light by the white light emitted by the LED module 120, the light bulb-shaped lamp 100 can also exhibit a visually good appearance.
[支承台][support stand]
支承台(支承板)150是，支承支柱140的支承部件，如图8示出，与球形罩110的开口部的开口端连接。支承台150被构成为，堵塞球形罩110的开口部，且被固定在树脂外壳160。在支承台150，设置有用于使引线170通过的贯通孔。The support stand (support plate) 150 is a support member that supports the support column 140 and is connected to the opening end of the opening of the glove 110 as shown in FIG. 8 . The support base 150 is configured to close the opening of the glove 110 and is fixed to the resin case 160 . The support base 150 is provided with a through-hole through which the lead wire 170 passes.
支承台150，由金属材料构成，与支柱140同样，由铝构成。据此，传导到支柱140的LED模块120的热，高效率地传导到支承台150。其结果为，能够抑制因温度上升而引起的LED的发光效率的降低及寿命的降低。The support stand 150 is made of a metal material, and is made of aluminum like the support 140 . Accordingly, the heat of the LED module 120 conducted to the pillar 140 is efficiently conducted to the support base 150 . As a result, it is possible to suppress a decrease in luminous efficiency and a decrease in lifetime of the LED due to temperature rise.
支承台150，由具有台阶部的圆盘状部件构成。该台阶部，与球形罩110的开口部的开口端抵接，据此，堵塞球形罩110的开口部。并且，在台阶部，支承台150和树脂外壳160和球形罩110的开口部的开口端，由粘合剂粘合。The support stand 150 is constituted by a disk-shaped member having a stepped portion. The stepped portion abuts against the opening end of the opening of the glove 110 , thereby closing the opening of the glove 110 . In addition, at the stepped portion, the support base 150 and the opening ends of the resin case 160 and the opening of the glove 110 are bonded together with an adhesive.
[树脂外壳][resin case]
树脂外壳160是，用于使支柱140和灯头130绝缘，并且收纳并保持点灯电路180的绝缘外壳(电路保持器)。树脂外壳160，由大径圆筒状的第一壳体部、和小径圆筒状的第二壳体部构成。第一壳体部的外表面露出在外部空气，因此，传导到树脂外壳160的热，主要从第一壳体部散发。另外，第二壳体部被构成为，外周面与灯头130的内周面接触，在第二壳体部的外周面形成有用于与灯头130拧合的拧合部。树脂外壳160，例如，能够由聚对苯二甲酸丁二醇酯(PBT)成型。The resin case 160 is an insulating case (circuit holder) for insulating the post 140 and the base 130 and accommodating and holding the lighting circuit 180 . The resin case 160 is composed of a large-diameter cylindrical first case portion and a small-diameter cylindrical second case portion. Since the outer surface of the first case part is exposed to the outside air, the heat conducted to the resin case 160 is mainly dissipated from the first case part. In addition, the second case portion is configured such that its outer peripheral surface is in contact with the inner peripheral surface of the cap 130 , and a screwing portion for screwing into the cap 130 is formed on the outer peripheral surface of the second case portion. The resin case 160, for example, can be molded of polybutylene terephthalate (PBT).
[引线][lead]
两条引线170是，用于将用于使LED模块120点灯的电力从点灯电路180向LED模块120供给的电线。各引线170的一方侧端与作为LED模块120的供电部的端子电连接，各引线170的另一方侧端与点灯电路180的电力输出部电连接。The two lead wires 170 are wires for supplying electric power for lighting the LED module 120 from the lighting circuit 180 to the LED module 120 . One end of each lead wire 170 is electrically connected to a terminal serving as a power supply portion of the LED module 120 , and the other end of each lead wire 170 is electrically connected to a power output portion of the lighting circuit 180 .
[点灯电路][lighting circuit]
点灯电路180是，用于使LED模块120(LED)点灯的电路单元，被收纳在树脂外壳160内。具体而言，点灯电路180具有，多个电路元件、和各电路元件被安装的电路基板。点灯电路180，将从灯头130供给的交流电变换为直流电，将直流电通过两条引线170供给到LED模块120(LED芯片)。The lighting circuit 180 is a circuit unit for lighting the LED module 120 (LED), and is accommodated in the resin case 160 . Specifically, the lighting circuit 180 has a plurality of circuit elements and a circuit board on which each circuit element is mounted. The lighting circuit 180 converts the AC power supplied from the base 130 into DC power, and supplies the DC power to the LED module 120 (LED chip) through the two lead wires 170 .
而且，灯泡形灯100，并不一定需要具备点灯电路180。例如，在从照明器具或电池等直接供给直流电的情况下，灯泡形灯100，可以不具备点灯电路180。并且，点灯电路180，不仅限于平滑电路，也可以适当地选择并组合调光电路或升压电路等。Furthermore, the light bulb-shaped lamp 100 does not necessarily need to include the lighting circuit 180 . For example, when a direct current is directly supplied from a lighting fixture, a battery, or the like, the light bulb-shaped lamp 100 does not need to include the lighting circuit 180 . In addition, the lighting circuit 180 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like may be appropriately selected and combined.
如上所述，本实施例涉及的灯泡形灯100具备：发光装置1或2；收纳发光装置1或2的中空的球形罩110；接受用于使发光装置1或2发光的电力的灯头130；以及球形罩110内支承发光装置1或2的支柱140。灯泡形灯100还具备，与灯头130电连接、且与发光装置1或2的端子53焊接的引线170。因此，对灯泡形灯100，利用实施例1或2涉及的LED模块，因此能够实现能够抑制LED模块的布线图案的剥离的灯泡形灯。As described above, the light bulb-shaped lamp 100 according to this embodiment includes: the light emitting device 1 or 2; the hollow spherical cover 110 for housing the light emitting device 1 or 2; the base 130 for receiving electric power for causing the light emitting device 1 or 2 to emit light; And the pillar 140 supporting the light emitting device 1 or 2 in the spherical cover 110 . The light bulb-shaped lamp 100 further includes a lead wire 170 electrically connected to the base 130 and soldered to the terminal 53 of the light emitting device 1 or 2 . Therefore, since the LED module according to Embodiment 1 or 2 is used for the lightbulb-shaped lamp 100 , it is possible to realize a lightbulb-shaped lamp capable of suppressing peeling of the wiring pattern of the LED module.
以上，对于本实用新型涉及的发光装置及灯，根据实施例进行了说明，但是，本实用新型，不仅限于所述的实施例。As above, the light-emitting device and the lamp according to the present invention have been described based on the embodiments, but the present invention is not limited to the above-described embodiments.
例如，对于所述的实施例1及2涉及的发光装置1及2，示出了适用于灯泡形灯的例子，但是，不仅限于此。例如，所述的实施例涉及的发光装置1及2，也可以适用于由细长筒状的直管构成的直管形灯或由环状的圆管构成的圆管形灯。或者，所述的实施例1及2涉及的发光装置1及2，也可以适用于具有GX53灯头或GH76p灯头等的灯头构造的灯。For example, although the light-emitting devices 1 and 2 according to the above-mentioned embodiments 1 and 2 are applied to light bulb-shaped lamps, the present invention is not limited thereto. For example, the light-emitting devices 1 and 2 according to the above-described embodiments can also be applied to straight tube lamps composed of elongated cylindrical straight tubes or circular tube lamps composed of ring-shaped circular tubes. Alternatively, the light-emitting devices 1 and 2 according to the first and second embodiments described above can also be applied to a lamp having a base structure such as a GX53 base or a GH76p base.
并且，所述的实施例1及2涉及的发光装置1及2，也可以适用于不具有灯头的灯，例如在散热器等的基台配置发光装置(LED模块)的结构的照明单元。进而，所述的实施例1及2涉及的发光装置1及2，也可以适用于其他的照明系统，以作为光源。Furthermore, the light-emitting devices 1 and 2 according to the above-mentioned embodiments 1 and 2 can also be applied to a lamp without a base, for example, a lighting unit in which a light-emitting device (LED module) is arranged on a base such as a heat sink. Furthermore, the light emitting devices 1 and 2 according to the above-mentioned embodiments 1 and 2 can also be applied to other lighting systems as light sources.
并且，对于灯泡形灯的适用例(实施例3)，示出了将所述的实施例1及2涉及的发光装置1及2，适用于白炽灯泡的玻璃灯管的例子，但是，不仅限于此。例如，所述的实施例1及2涉及的发光装置1及2，也可以适用于在球形罩与灯头之间具备金属框体的散热器的灯泡形灯。并且，也可以适用于用于吊灯以及蜡烛型照明装置的具有纵长延伸的长球形状的灯泡的灯泡形灯。In addition, for the application example (embodiment 3) of a light bulb-shaped lamp, an example in which the light-emitting devices 1 and 2 according to the above-mentioned embodiments 1 and 2 are applied to a glass lamp tube of an incandescent light bulb is shown, but it is not limited to this. For example, the light-emitting devices 1 and 2 according to the first and second embodiments described above can also be applied to a light bulb-shaped lamp provided with a heat sink of a metal frame between the globe cover and the base. In addition, the present invention can also be applied to a light bulb-shaped lamp having a prolate-shaped light bulb extending lengthwise, which is used for a chandelier and a candle-type lighting device.
并且，本实用新型，也可以作为具备所述的灯泡形灯等的灯的照明装置来实现。例如，如图9示出，也可以将本实用新型涉及的照明装置3构成为，具备所述的灯泡形灯100、以及用于装配该灯泡形灯100的点灯器具(照明器具)4。在此情况下，点灯器具4，进行灯泡形灯100的熄灯及点灯，例如，具备装配在天花板的器具主体5、以及覆盖灯泡形灯100的灯罩6。其中，器具主体5具有，安装灯泡形灯100的灯头130、且对灯泡形灯100进行供电的插座5a。而且，也可以在灯罩6的开口部设置透光性板。Moreover, this invention can also be realized as the lighting apparatus provided with the lamp, such as the said light bulb-shaped lamp. For example, as shown in FIG. 9 , the lighting device 3 according to the present invention may be configured to include the aforementioned light bulb-shaped lamp 100 and a lighting fixture (lighting fixture) 4 for mounting the light bulb-shaped lamp 100 . In this case, the lighting device 4 performs turning off and lighting of the light bulb-shaped lamp 100 , and includes, for example, a device main body 5 mounted on the ceiling and a shade 6 covering the light bulb-shaped lamp 100 . Among them, the device main body 5 has a socket 5 a for attaching the base 130 of the light bulb-shaped lamp 100 and for supplying power to the light bulb-shaped lamp 100 . Furthermore, a translucent plate may be provided in the opening of the globe 6 .
并且，在所述的实施例中，作为发光元件示出了LED的例子，不过也可以采用半导体激光器等的半导体发光元件、有机EL(ElectroLuminescence)以及无机EL等的EL元件、其他的固体发光元件。In addition, in the above-described embodiments, an example of an LED is shown as a light-emitting element, but semiconductor light-emitting elements such as semiconductor lasers, EL elements such as organic EL (ElectroLuminescence) and inorganic EL, and other solid-state light-emitting elements can also be used. .
并且，在所述实施例中，在玻璃膜形成开口，端子的进行焊接等的部分在表面露出。但是，在通过焊接等将端子与引线连接之后，能够由玻璃膜连续地覆盖连基板及端子的情况下，也可以在玻璃膜不形成这样的开口。在极端的情况下，也可以端子的全部由玻璃膜覆盖。In addition, in the above-described embodiments, openings are formed in the glass film, and portions where soldering and the like of the terminals are exposed on the surface. However, when the connection substrate and the terminals can be continuously covered with the glass film after the terminals and the leads are connected by soldering or the like, such openings may not be formed in the glass film. In extreme cases, it is also possible for the entirety of the terminals to be covered with a glass film.
另外，在不脱离本实用新型的主旨的情况下，将本领域技术人员所能够想到的各种变形执行于本实施例的形态，或者对不同实施例中的构成要素进行组合后构成的形态也包含在本实用新型的范围内。In addition, without departing from the gist of the present invention, various modifications conceivable by those skilled in the art may be implemented in the form of this embodiment, or a form configured by combining components in different embodiments is also possible. included in the scope of the present utility model.
本实用新型，能够广泛地利用于具备LED等的发光元件的发光装置、以及具备该发光装置的灯、照明单元或照明系统等。The present invention can be widely applied to a light-emitting device including a light-emitting element such as an LED, a lamp, a lighting unit, or a lighting system including the light-emitting device.
符号说明：Symbol Description:
1、2 发光装置1, 2 Lighting device
3 照明装置3 Lighting device
4 点灯器具4 lighting fixtures
5 器具主体5 appliance body
5a 插座5a socket
6 灯罩6 shades
10 基板10 Substrate
10a 第一主面10a First main face
10b 第二主面10b second main surface
11、12 贯通孔11, 12 through hole
20 LED20 LEDs
21 蓝宝石基板21 Sapphire substrate
22 氮化物半导体层22 nitride semiconductor layer
23 阴极电极23 cathode electrode
24 阳极电极24 anode electrode
25、26 线接合部25, 26 Wire junction
30 密封部件30 sealing parts
40 荧光体层40 phosphor layers
50 第二金属布线50 second metal wiring
51 第一金属布线51 First metal wiring
52 玻璃膜52 glass film
53 端子53 terminals
60 导线60 wires
70 芯片接合材料70 Die Bonding Materials
100 灯泡形灯100 bulb shaped lights
110 球形罩110 dome cover
120 LED模块120 LED modules
130 灯头130 lamp holder
140 支柱140 pillars
150 支承台150 support table
160 树脂外壳160 resin case
170 引线170 leads
180 点灯电路180 lighting circuit
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-090435 | 2012-04-11 | ||
| JP2012090435 | 2012-04-11 | ||
| PCT/JP2013/001048WO2013153727A1 (en) | 2012-04-11 | 2013-02-25 | Light-emitting device, and lamp |
| Publication Number | Publication Date |
|---|---|
| CN204179108Utrue CN204179108U (en) | 2015-02-25 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201390000393.5UExpired - Fee RelatedCN204179108U (en) | 2012-04-11 | 2013-02-25 | Lighting device and lamp |
| Country | Link |
|---|---|
| JP (1) | JP5681963B2 (en) |
| CN (1) | CN204179108U (en) |
| TW (1) | TW201342572A (en) |
| WO (1) | WO2013153727A1 (en) |
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