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CN204155931U - A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element - Google Patents

A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element
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Publication number
CN204155931U
CN204155931UCN201420345722.6UCN201420345722UCN204155931UCN 204155931 UCN204155931 UCN 204155931UCN 201420345722 UCN201420345722 UCN 201420345722UCN 204155931 UCN204155931 UCN 204155931U
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CN
China
Prior art keywords
electric conductor
white light
shot type
led chip
extra small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420345722.6U
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Chinese (zh)
Inventor
蔡志嘉
窦鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Dense Grid Photoelectric Polytron Technologies Inc
Original Assignee
AMICC OPTO-ELECTRONICS TECHNOLOGY Co Ltd
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Publication date
Application filed by AMICC OPTO-ELECTRONICS TECHNOLOGY Co LtdfiledCriticalAMICC OPTO-ELECTRONICS TECHNOLOGY Co Ltd
Priority to CN201420345722.6UpriorityCriticalpatent/CN204155931U/en
Application grantedgrantedCritical
Publication of CN204155931UpublicationCriticalpatent/CN204155931U/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Abstract

The utility model relates to a kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element, comprise substrate and at least two emitting LED chip, described at least two emitting LED chip are fixed on substrate, described substrate is provided with some vias penetrating bottom surface on it, electric conductor is filled with in this via, the positive pole of described each emitting LED chip is electrically connected with the electric conductor in wherein at least one via respectively by positive wire, and the negative pole of each emitting LED chip is electrically connected with the electric conductor in remaining via respectively by cathode conductor.The utility model provides a kind of very thin thickness and the extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element of good heat dissipation effect.

Description

A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element
Technical field
The utility model relates to a kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element, particularly relates to a kind of micro side light emitting-type polycrystalline LED element.
Background technology
Present micro side light emitting-type LED light on the market has two large classes:
(1) support class: main with PPA resin+copper stent for substrate, key dimension has 020 (3.8*1.05*0.6mm), 010 (3.8*1.0*0.4mm), 215 (2.8*1.0*0.9mm), 335 (3.8*0.6*1.2mm), its size is relatively large, and support class Quartering shot type LED cannot make the brilliant machine of twin crystal/tri-, cannot meet ultra-thin ultra-small type instruction class double-colored/three-color LED light;
(2) PCB class: mainly with BT resin for substrate, key dimension has 0603 (1.6*1.1*0.6mm), 0805 (2.0*1.1*0.6mm), 1204 (3.0*1.5*1.0mm), in the brilliant LED making of twin crystal/tri-, stock size is also selection 0805/1204, cannot be miniaturized.
Utility model content
The purpose of this utility model is the defect overcoming prior art existence, provides a kind of very thin thickness and the extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element of good heat dissipation effect.
The utility model solves the technical scheme that its technical problem adopts: a kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element, comprise substrate and at least two emitting LED chip, described at least two emitting LED chip are fixed on substrate, described substrate is provided with some vias penetrating bottom surface on it, electric conductor is filled with in this via, the positive pole of described each emitting LED chip is electrically connected with the electric conductor in wherein at least one via respectively by positive wire, the negative pole of each emitting LED chip is electrically connected with the electric conductor in remaining via respectively by cathode conductor.
Described electric conductor is copper post or conducting resinl.
The bottom surface of described substrate is coated with the first metal conducting layer, this metal conducting layer is divided into mutually discrete positive pole zone and negative regions, described negative regions covers below the electric conductor that is connected with cathode conductor, and with this conductive body contact, described positive pole zone covers below the electric conductor that is connected with positive wire, and with this conductive body contact.
The upper bottom surface of described substrate is coated with the second metal conducting layer, this metal conducting layer is divided into mutually discrete positive pole zone and negative regions, described negative regions covers above the electric conductor that is connected with cathode conductor continuously, and with this conductive body contact, described positive pole zone covers above the electric conductor that is connected with positive wire continuously, and with other this conductive body contact, described at least two emitting LED chip are connected on the second metal conducting layer, described each positive wire is electrically connected with positive pole zone, and described each cathode conductor is electrically connected with negative regions.
Described first and second metal conducting layers are Gold plated Layer or silver coating or copper foil layer.
Described substrate is PCB substrate.
Described emitting LED chip is provided with two or three.
A preparation technology for extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element, step is as follows:
A, preparation raw material: in PCB substrate, bore via and adopt copper insert process by bottom surface conducting in PCB substrate, form consent copper post;
B, die bond: emitting LED chip is attached in PCB substrate by crystal-bonding adhesive;
C, baking: emitting LED chip is fixed in PCB substrate by baking;
D, bonding wire: emitting LED chip electrode is passed through gold thread conducting in PCB substrate;
E, pressing mold: use packaging plastic to be molded in PCB substrate by mold die;
F, baking: packaging plastic is solidified by baking;
G, cutting: product is cut into design size.
Beneficial effect:
(1) use in PCB substrate and add brill via, then by the design of plug copper as positive and negative lead wires, can reach and save space, the effect of shorten product sizes.
(2) this product is copper post conductor design, compare with PCB class Quartering shot type LED (hot group is about 200 ~ 500 °/W) with support class Quartering shot type LED (hot group is about 80 ~ 180 °/W) on the market, hot group of this product is lower than 25 °/W, reach fabulous radiating effect, simultaneously when using this product, high-power operation (30mA ~ 600mA) in being also applicable to.
(3) design of product minimization very thinization, by PCB line design, both positive and negative polarity is distributed in the bottom of PCB substrate, avoiding traditional both positive and negative polarity wire uses via to draw the thickness limits needing 0.6mm at two ends, make twin crystal LED product THICKNESS CONTROL at 0.3mm ± 0.1mm, compare conventional 0805 twin crystal and reduce 80%; Three brilliant LED product THICKNESS CONTROL are at 0.4 ± 0.1mm.
(4) this Quartering shot type machine is when client uses, and does not need towards a left side or towards during right luminescence kind of again changing planes, and directly by product commutation when packing, product pad design can reach commonality.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the main TV structure schematic diagram of preferred embodiment one of the present utility model;
Fig. 2 is the main TV structure schematic diagram (too chaotic owing to this view having been drawn wire, therefore omit wire) of preferred embodiment two of the present utility model;
Fig. 3 is the plan structure schematic diagram (band wire) of Fig. 2;
Fig. 4 be the utility model towards left luminous time and the connection diagram of heat-radiating substrate;
Fig. 5 be the utility model towards right luminous time and the connection diagram of heat-radiating substrate.
Embodiment
The extra small ultra-thin specular removal Quartering shot type of one as shown in Fig. 1 ~ 5 highlighted white light polycrystalline LED element, comprises substrate 1 and at least two emitting LED chip 2.Described at least two emitting LED chip 2 are fixing on substrate 1.Described substrate 1 is provided with some vias penetrating bottom surface on it, in this via, is filled with electric conductor 3, preferred implementation: described electric conductor 3 is copper post or conducting resinl.The positive pole of described each emitting LED chip 2 is electrically connected with the electric conductor 3 in one of them via respectively by positive wire 4, and the negative pole of each emitting LED chip 2 is electrically connected with the electric conductor 3 in remaining via respectively by cathode conductor 5.
The bottom surface of described substrate 1 is coated with the first metal conducting layer 6, this metal conducting layer 6 is divided into mutually discrete positive pole zone 61 and negative regions 62, described negative regions 62 covers below the electric conductor 3 that is connected with cathode conductor 5, and contact with this electric conductor 3, described positive pole zone 61 covers below the electric conductor 3 that is connected with positive wire 4, and contacts with this electric conductor 3.
In order to reduce welding difficulty, fix electric conductor 3 simultaneously, the upper bottom surface of described substrate 1 is coated with the second metal conducting layer 7, this metal conducting layer 7 is divided into mutually discrete positive pole zone 71 and negative regions 72, described negative regions 72 covers above the electric conductor 3 that is connected with cathode conductor 5, and contact with this electric conductor 3, described positive pole zone 71 covers above the electric conductor 3 that is connected with positive wire 4, and contact with this electric conductor 3, described at least two emitting LED chip 2 are connected on the second metal conducting layer 7, described each positive wire 4 is electrically connected with positive pole zone 71, described each cathode conductor 5 is electrically connected with negative regions 72.
Described first and second metal conducting layers 6,7 are Gold plated Layer or silver coating or copper foil layer, preferably copper layers of foil.Described substrate 1 is PCB substrate.
Preferred embodiment one: emitting LED chip 2 is provided with two as shown in Figure 1, the positive wire 4 of this two emitting LED chip 2 all welds with the positive pole zone 71 mediated, and separate with two of the both sides respectively negative regions 72 of two cathode conductors 5 is welded.Extra small ultra-thin specular removal Quartering shot type bright white optical twining LED element is rectangular: its length is 1.6 ± 0.2mm, and wide is 0.6 ± 0.2mm, and thickness d is 0.3 ± 0.1mm.Preferred: long 1.6mm, wide 0.6mm, thick 0.3mm.
Preferred embodiment two: emitting LED chip 2 is provided with three as shown in Figure 2,3, the positive wire 4 of these three emitting LED chip 2 all welds with the positive pole zone 71 mediated, and separate with three of the both sides respectively negative regions 72 of three cathode conductors 5 is welded.The brilliant LED element of extra small ultra-thin specular removal Quartering shot type highlighted white light three is rectangular: its length is 1.6 ± 0.2mm, and wide is 0.6 ± 0.2mm, and thickness d is 0.4 ± 0.1mm.Preferred: long 1.6mm, wide 0.6mm, thick 0.4mm.
A preparation technology for extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element, step is as follows:
A, preparation raw material: in PCB substrate 1, bore via and adopt copper insert process by bottom surface conducting in PCB substrate 1, form consent copper post 3;
B, die bond: emitting LED chip 2 is attached in PCB substrate 1 by crystal-bonding adhesive;
C, baking: emitting LED chip 2 is fixed in PCB substrate 1 by baking;
D, bonding wire: emitting LED chip 2 electrode is passed through gold thread conducting in PCB substrate 1;
E, pressing mold: use packaging plastic to be molded in PCB substrate 1 by mold die;
F, baking: packaging plastic is solidified by baking;
G, cutting: product is cut into design size.
Packaging plastic in step e can adopt Epoxy or Silicone.
Should be appreciated that specific embodiment described above only for explaining the utility model, and be not used in restriction the utility model.Still be among protection range of the present utility model by spirit institute's apparent change of extending out of the present utility model or change.

Claims (7)

4. the extra small ultra-thin specular removal Quartering shot type of one according to claim 1 highlighted white light polycrystalline LED element, it is characterized in that: the upper bottom surface of described substrate (1) is coated with the second metal conducting layer (7), this metal conducting layer (7) is divided into mutually discrete positive pole zone (71) and negative regions (72), described negative regions (72) covers electric conductor (3) top be connected with cathode conductor (5), and contact with this electric conductor (3), described positive pole zone (71) covers electric conductor (3) top be connected with positive wire (4), and contact with this electric conductor (3), described at least two emitting LED chip (2) are connected on the second metal conducting layer (7), described each positive wire (4) is electrically connected with positive pole zone (71), described each cathode conductor (5) is electrically connected with negative regions (72).
CN201420345722.6U2014-06-252014-06-25A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED elementExpired - LifetimeCN204155931U (en)

Priority Applications (1)

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CN201420345722.6UCN204155931U (en)2014-06-252014-06-25A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN201420345722.6UCN204155931U (en)2014-06-252014-06-25A kind of extra small ultra-thin specular removal Quartering shot type highlighted white light polycrystalline LED element

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CN204155931Utrue CN204155931U (en)2015-02-11

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN105047789A (en)*2015-08-112015-11-11深圳市聚飞光电股份有限公司Light-emitting diode (LED) package structure and packaging method thereof
CN105280797A (en)*2015-05-282016-01-27江苏欧密格光电科技股份有限公司LED bonding pad conversion module
CN105321937A (en)*2014-06-252016-02-10常州欧密格光电科技有限公司Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element
CN105990507A (en)*2015-03-182016-10-05新世纪光电股份有限公司Side-illuminated light emitting diode structure and manufacturing method thereof
CN108470814A (en)*2018-02-092018-08-31永林电子有限公司A kind of LED component of molding type lateral emitting
US10388838B2 (en)2016-10-192019-08-20Genesis Photonics Inc.Light-emitting device and manufacturing method thereof
US10497681B2 (en)2015-09-182019-12-03Genesis Photonics Inc.Light-emitting device
US10784423B2 (en)2017-11-052020-09-22Genesis Photonics Inc.Light emitting device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN105321937A (en)*2014-06-252016-02-10常州欧密格光电科技有限公司Ultra small and ultrathin high luminous efficiency lateral emission type high light white light polycrystalline LED element
CN105990507A (en)*2015-03-182016-10-05新世纪光电股份有限公司Side-illuminated light emitting diode structure and manufacturing method thereof
CN105280797A (en)*2015-05-282016-01-27江苏欧密格光电科技股份有限公司LED bonding pad conversion module
CN105047789A (en)*2015-08-112015-11-11深圳市聚飞光电股份有限公司Light-emitting diode (LED) package structure and packaging method thereof
US10497681B2 (en)2015-09-182019-12-03Genesis Photonics Inc.Light-emitting device
US10957674B2 (en)2015-09-182021-03-23Genesis Photonics IncManufacturing method
US10388838B2 (en)2016-10-192019-08-20Genesis Photonics Inc.Light-emitting device and manufacturing method thereof
US10784423B2 (en)2017-11-052020-09-22Genesis Photonics Inc.Light emitting device
CN108470814A (en)*2018-02-092018-08-31永林电子有限公司A kind of LED component of molding type lateral emitting

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Legal Events

DateCodeTitleDescription
C14Grant of patent or utility model
GR01Patent grant
CP01Change in the name or title of a patent holder

Address after:Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98

Patentee after:Jiangsu dense grid photoelectric Polytron Technologies Inc.

Address before:Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98

Patentee before:AMICC OPTO-ELECTRONICS TECHNOLOGY Co.,Ltd.

CP01Change in the name or title of a patent holder
CU03Publication of corrected utility model

Correction item:Patentee|Address

Correct:CHANGZHOU AMICC OPTOELECTRONICS TECHNOLOGY Co.,Ltd.|Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98

False:Jiangsu dense grid photoelectric Polytron Technologies Inc.|Hutang town Wujin District Changzhou city Jiangsu province 213000 minhuang ditch South Industrial Zone Wu Nan Road No. 98

Number:16

Volume:33

CU03Publication of corrected utility model
CX01Expiry of patent term

Granted publication date:20150211

CX01Expiry of patent term

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