A kind of wiring board is with protecting ink by laminationTechnical field
The utility model relates to the protection ink that a kind of printed substrate is used, and the wiring board that especially a kind of thermal conductivity is good is used can lamination protection ink.
Background technology
Printed substrate is material indispensable in electronic product, and computer and ancillary equipment thereof, communication product and consumption electronic products etc. are at present widely used.And along with the sustainable growth of consumption electronic products demand, for the requirement of printed circuit board (PCB), also grow with each passing day.
Printed substrate mainly comprises copper clad laminate (FCCL or CCL) and protection epiphragma or printing-ink and forms.Protection epiphragma is that thin polymer film PET, PEN or PI coating one deck adhesive form, and is mainly used in flexible copper clad foil substrate (FCCL); Printing-ink is all widely used in flexible copper clad foil substrate (FCCL) and hardboard (CCL).
Existing ink, in the process of using, need to pass through a series of courses of processing such as allotment, dilution, silk-screen, oven dry, solvent evaporates contaminated air, workers ' health is impacted, operation is various, and ink for screen printing baking controls and not goodly can cause gross distortion, and the problem such as chap or come off.The long-term adhesive force of ink, without collateral security, causes circuit oxidation, affect electronic product use.
Utility model content
In order to overcome above-mentioned defect, the purpose of this utility model is to provide a kind of wiring board with protecting ink by lamination, and this ink has good thermal diffusivity and pliability simultaneously.Of the present utility model can lamination protection ink can directly by conventional FPC manufacturing procedures such as boring, stamps, carry out production and application.
To achieve these goals; the technical scheme that the utility model adopts is: a kind of wiring board is with protecting ink by lamination; it is characterized in that, comprise successively four-layer structure from top to bottom: heat-resisting lamination protective film layer, compound oil ink layer, adhesive layer and release protective film.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described heat-resisting lamination protective film layer is one deck high molecular polymer film, is heat-resisting PET, PEN, PI, PBT or PPS film.
Aforesaid a kind of wiring board is with protecting ink by lamination; described heat radiation ink layer is mixed and processed by ink and heat sink material; ink is one or more the mixture in epoxy resin, polyacrylic resin, polyimide resin, elastomer, phenolic resins, mylar, polyurethane resin, and heat sink material is one or more the mixture in aluminium oxide, aluminium nitride, carborundum and boron nitride.Heat radiation ink layer is existing in the prior art.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described adhesive layer is epoxy resin, polyacrylic resin, polyimide resin, phenolic resins, elastomer, mylar or polyurethane resin.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described release protective film is the release protective material layer that is coated with silicone oil or non-silicone oil mould release.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described heat-resisting lamination protective film layer is that thickness is 25-200um.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described compound oil ink layer thickness is 5-100um.
Aforesaid a kind of wiring board is with protecting ink by lamination, and described adhesive layer thickness is 5-100um.
The beneficial effects of the utility model are: of the present utility modelly can lamination contain the heat radiation particle with good heat-radiating effect in the compound oil ink layer of protection ink, make to have advantages of that radiating efficiency is high by lamination protection ink; Of the present utility model can lamination in protection ink owing to adding elastomer, whole ink layer is had higher flexible, the problem can not chap, coming off.
Accompanying drawing explanation
Fig. 1 be implementation method one wiring board with can lamination the profile of protection ink;
Fig. 2 be implementation method two wiring board with can lamination the profile of protection ink.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Can comprise four-layer structure by lamination protection ink: the heat-resisting lamination protective film of an one deck layer, one deck has the compound oil ink layer of heat radiation, insulation function, one deck adhesive layer, the release protective film of one deck.
Can protect the related heat-resisting lamination protective film layer of ink by lamination, for one deck high molecular polymer film, mainly compound oil ink layer be played to lamination protective effect and carrier function.This film can be heat-resisting PET, PEN, PI, PBT or PPS film, and thickness is 25-200um.
Can lamination the related one deck heat radiation of protection ink, a heat radiation ink layer for insulation function, can be one or more the mixture in modified epoxy, polyacrylic resin, polyimide resin, elastomer, phenolic resins, mylar, polyurethane resin.The material of selected heat sinking function is one or more the mixture in aluminium oxide, aluminium nitride, carborundum and boron nitride.Also can be the structure of the ink layer that dispels the heat in prior art.The thickness of heat radiation ink layer is 5-100um.
A kind of can lamination the related adhesive layer of protection ink be one or more the mixture in modified epoxy, polyacrylic resin, polyimide resin, phenolic resins, elastomer, mylar, polyurethane resin.The thickness of this layer is 5-100um.
Can lamination the related release protective film of protection ink for thering is a light peel property, be coated with the release protective material of silicone oil or non-silicone oil mould release, a kind of in PET release film, PP release film, PBT release film, release liners.
A kind of can lamination the implementation method one of protection ink:
On heat-resisting lamination protective film layer 11, coating forms the compound oil ink layer 12(ink layer that dispels the heat), on compound oil ink layer 12, coating forms adhesive layer 13, the release protective film 14 of fitting on adhesive layer 13, complete can lamination protection ink production.Structure is as shown in figure mono-.
A kind of can lamination the implementation method two of protection ink:
On heat-resisting lamination protective film layer 11, coating forms compound oil ink layer 12, and on compound oil ink layer 12, coating forms adhesive layer 13, directly rolling, complete can lamination protection ink production.Structure as shown in Figure 2.
Above implementation method one and implementation method two differences having or not at release diaphragm 14; it is one side release material that the heat-resisting lamination protective film layer 11 of implementation method one can be selected inner face, but heat-resisting lamination protective film layer in implementation method two 11 is selected two-sided release material.
Related compound oil ink layer 12 in the utility model, the embodiment of adhesive layer 13 as shown in Table 1.In embodiment, lamination is 180 ℃, preheating in 10 seconds, and pressing in 60 seconds, pressure is 100kgf/cm2.Comparative example is commercially available finished product.As shown in Table 1, add after conductive powder, conductive coefficient significantly increases, and heat conductivility obviously strengthens.
Table one
Above-described embodiment does not limit the utility model in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops on protection range of the present utility model.