CN203339216U - Surface mounting type LED support, LED device and LED display screen - Google Patents
Surface mounting type LED support, LED device and LED display screenDownload PDFInfo
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- CN203339216U CN203339216UCN201320365831XUCN201320365831UCN203339216UCN 203339216 UCN203339216 UCN 203339216UCN 201320365831X UCN201320365831X UCN 201320365831XUCN 201320365831 UCN201320365831 UCN 201320365831UCN 203339216 UCN203339216 UCN 203339216U
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- support
- bowl cup
- type led
- adhered type
- lug boss
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Classifications
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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Abstract
Description
Technical field
The utility model relates to LED Display Technique field, particularly relates to a kind of surface-adhered type LED support, LED device and LED display.
Background technology
Surface mount (Surface Mounted Devices, be called for short SMD) formula light-emitting diode (Light Emitting Diode, be called for short LED) be a kind ofly can directly be converted into electricity the solid-state semiconductor device of light, surface-adhered type LED technology contributes to enhance productivity, and be convenient to different facility application, therefore be used widely.
In prior art, surface-adhered type LED device generally comprises support, a plurality of luminescent wafer and the packing colloid that the pedestal of metal substrate and insulation forms, and described insulating base partly surrounds described metal substrate, to form, take the bowl cup that metal substrate is the end.Described a plurality of luminescent wafer is arranged in the bowl cup of described support, and described packing colloid encapsulates the bowl cup.
Yet, due to the parameters such as production firm, luminescent wafer structure and size, glow color, luminosity or bright dipping light shape of a plurality of luminescent wafers in the LED device incomplete same, and the different luminescent wafer of parameter in identical shaped bowl cup respectively corresponding bright dipping light shape can some or all ofly can't form consistent.Therefore in existing surface-adhered type LED device, a plurality of luminescent wafers are encapsulated in same bowl cup, there will be the inconsistent situation of light shape.When with the inconsistent surface-adhered type LED of light shape device, being assembled into display screen, can cause the flower screen of display screen, affect observation effect.
The utility model content
The technical problem that the utility model mainly solves is to provide a kind of surface-adhered type LED support, LED device and LED display, can independent regulation LED device in the bright dipping light shape of different luminescent wafers, improved the consistency of LED device light shape.
For solving the problems of the technologies described above, the utility model adopts a kind of technical scheme to be: a kind of surface-adhered type LED support is provided, comprise insulating base, described insulating base comprises outer lug boss and at least one inner convex platform, described outer lug boss is arranged on the periphery of described insulating base, the support bowl cup that has accommodation space with formation, described at least one inner convex platform is arranged in described support bowl cup, described support bowl cup is separated into to independently at least two son bowl cups.
Wherein, the peak of described outer lug boss maintains an equal level higher than the peak of described inner convex platform or with the peak of described inner convex platform.
Wherein, the height of described outer lug boss is the numerical value between 0.3 to 2 millimeter.
Wherein, the side towards accommodation space one side of described outer lug boss has the slope between 1 ° to 30 °, and the side of described inner convex platform has the slope between 1 ° to 30 °.
For solving the problems of the technologies described above, the utility model adopts another kind of technical scheme to be: a kind of surface-adhered type LED support is provided, comprise integrated support bowl cup, also comprise at least two son bowl cups that are arranged in described support bowl cup, each described son bowl cup is at least arranging a luminescent wafer.
For solving the problems of the technologies described above, the utility model adopts another technical scheme to be: a kind of surface-adhered type LED device is provided, comprises above-mentioned surface-adhered type LED support, electrically-conductive backing plate, at least two luminescent wafers and packing colloid; Described electrically-conductive backing plate is arranged at the interior bottom of support bowl cup of described surface-adhered type LED support, described at least two luminescent wafers are separately positioned in the difference bowl cup in described LED support, and from the electrically-conductive backing plate in described different son bowl cups, connect respectively, described packing colloid is filled in the support bowl cup of described LED support, in the difference bowl cup that described at least two luminescent wafers is sealed in to described support bowl cup.
Wherein, the electrically-conductive backing plate that is arranged on described son bowl cup bottom comprises first area and the second area of mutually insulated, and the positive pole of the luminescent wafer in described son bowl cup is connected with described first area, and negative pole is connected with described second area.
Wherein, the peak of the outer lug boss of the peak of described packing colloid and described LED support maintains an equal level.
Wherein, described packing colloid comprises encapsulation glue and the spread powder of ratio setting, and described encapsulation glue includes A glue and B glue, and wherein, the ratio of described A glue, B glue and spread powder is 1: (0.7-1.3): (0.03-0.5).
For solving the problems of the technologies described above, the utility model adopts again another technical scheme to be: a kind of display screen is provided, comprise the next item up described surface-adhered type LED device and LED drive circuit, described LED drive circuit is connected with described at least one surface-adhered type LED device.
Be different from prior art, the utility model is provided with independent at least two son bowl cups in the support bowl cup of the LED support of surface-adhered type, by controlling respectively the shape of different described independently son bowl cups, to realize regulating independently the bright dipping light shape that is arranged on the luminescent wafer in different son bowl cups, improve the consistency of LED device light shape, and then improved the luminescence display effect.
The accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of the utility model surface-adhered type LED support one execution mode;
Fig. 2 is the cross section structure schematic diagram of the surface-adhered type LED support shown in Fig. 1 along the A-A direction;
Fig. 3 is the planar structure schematic diagram of the utility model surface-adhered type LED device one execution mode;
Fig. 4 is the cross section structure schematic diagram of the surface-adhered type LED device shown in Fig. 3 along the B-B direction
Fig. 5 is the structural representation of the utility model LED display one execution mode.
Embodiment
Below in conjunction with accompanying drawing and concrete execution mode, describe.
Refer to Fig. 1 and Fig. 2, Fig. 1 is the planar structure schematic diagram of the utility model surface-adhered type LED support one execution mode, and Fig. 2 is the cross section structure schematic diagram of the surface-adhered type LED support shown in Fig. 1 along the A-A direction.In present embodiment, the surface-adhered type LED support comprisesinsulating base 110, describedinsulating base 110 comprisesouter lug boss 111 and at least oneinner convex platform 112, describedouter lug boss 111 is arranged on the periphery of describedinsulating base 110, thesupport bowl cup 113 that there is accommodation space with formation, described at least oneinner convex platform 112 is arranged in describedsupport bowl cup 113, describedsupport bowl cup 113 is separated into to independently at least two son bowl cups 114.Specifically,inner convex platform 112 is strip, the two ends ofinner convex platform 112 respectively withouter lug boss 111 adhesions, so thatouter lug boss 112 is divided into at least two parts,inner convex platform 112 with formedson bowl cup 114 by separatedouter lug boss 111 appropriate sections of at least one inner convex platform 112.Wherein, the peak of describedouter lug boss 111 maintains an equal level higher than the peak of describedinner convex platform 112 or with the peak ofinner convex platform 112, be the height h1 ofouter lug boss 111 be greater than or equal toinner convex platform 112 height h2 so that described LED support is filled packing colloid.
In present embodiment, theson bowl cup 114 insupport bowl cup 113 is for placing the luminescent wafer (not shown) of at least one.Because the parameters such as production firm, luminescent wafer structure and size, glow color, luminosity or bright dipping light shape of different luminescent wafers are also incomplete same, therefore with described LED support assembled LED device the time, the different luminescent wafer of parameters in differentson bowl cups 114, wherein, the shape of everyheight bowl cup 114 is corresponding with the parameter that is arranged on the sub bowl of luminescent wafer incup 114, so that the bright dipping light shape of the luminescent wafer in differentsub bowl glass 114 is consistent.
Particularly, the shape ofson bowl cup 114 is determined by theouter lug boss 111 ofinsulating base 110 and height and the side slope of inner convex platform 112.In present embodiment, the height h1 ofouter lug boss 111 is the numerical value between 0.3 to 2 millimeter (mm), and as the height h1 ofouter lug boss 111 is 1.2 millimeters, inner convex platform height h2 is 0.7.Theside 1121 of theside 1111 towards accommodation space one side ofouter lug boss 111 andinner convex platform 112 both sides all has the slope between 1 ° to 30 °, be that the angle value of theside 1111 towards accommodation space one side ofouter lug boss 111 and the angle α betweensupport bowl cup 113 bottom surface normal directions is between 1 ° to 30 °, theside 1121 ofinner convex platform 112 both sides respectively and and supportbowl cup 113 bottom surface normal directions between the angle value of angle β between 1 ° to 30 °, for example, the slope of theside 1111 towards accommodation space one side ofouter lug boss 111 is 20 °, the slope ofinner convex platform 112 1sides 1121 is 10 °, the slope of anotherside 1121 is 15 °.Wherein, theouter lug boss 111 that forms differentson bowl cups 114 and the height ofinner convex platform 112, the different slope of theside 1121 of the slope of theside 1111 of the interior outer lug boss ofson bowl cup 114 andinner convex platform 112, all can be set to according to the parameter that is placed on the luminescent wafer in correspondingson bowl cup 114 not identically, be arranged on the bright dipping light shape of the luminescent wafer in differentson bowl cups 114 with control.Certainly, the height of the outer lug boss of the utility model surface-adhered type LED support is not limited to above-mentioned height number scope, the slope of the side towards accommodation space one side of outer lug boss and the side of inner convex platform both sides is not limit in above-mentioned slope range yet, above-mentioned height number scope and slope range are only preferable range, in other embodiments, the height of outer lug boss also can be the outer numerical value of above-mentioned number range, the side towards accommodation space one side of outer lug boss and the side of inner convex platform both sides also can have the slope outside above-mentioned slope range, at this, are not construed as limiting.
Further, LED support also comprises themetal pin 120 that quantity is corresponding withson bowl cup 114 numbers, one end of describedmetal pin 120 is arranged on 115 peripheries, bottom ofinsulating base 110, and the other end of describedmetal pin 120 arrives correspondingson bowl cup 114 throughinsulating base 110bottoms 115.
In addition, theouter lug boss 111 ofinsulating base 110 andinner convex platform 112 integrated injection moldings, form at least twoson bowl cups 114 insupport bowl cup 113, perhaps,outer lug boss 111 can be not one-body molded withinner convex platform 112 yet, asouter lug boss 111 andinner convex platform 112 are respectively independent insulating mechanism, by compound mode, combine, be separated at least twoson bowl cups 114 with thesupport bowl cup 113 thatouter lug boss 111 is formed.
In present embodiment,insulating base 110 integral body form by plastic material, certainly, in other embodiments, insulating base also can consist of other insulating material, or the part of insulating base consists of insulating material, for example, the outer lug boss of insulated substrate and the side of inner convex platform are insulating material, therefore be not construed as limiting at this.
It should be noted that in addition, in the utility model surface-adhered type LED support, inner convex platform is not limited to strip.In other application implementation modes, inner convex platform can also meet the bar shaped boss of the arbitrary shape of placement luminescent wafer bright dipping light shape requirement wherein for other, such as being arc, S shape etc., so that outer lug boss is separated, and forms son bowl cup with the corresponding part outer lug boss.Further, inner convex platform also can be close-shaped boss, and as circle, described inner convex platform is arranged in support bowl cup, and not with the outer lug boss adhesion, the interior outside of inner convex platform will be divided into different son bowl cups in support bowl cup.
In present embodiment, utilize inner convex platform that support bowl cup is separated into to independently at least two son bowl cups, carry out independently difference setting by the height of the son bowl cup to different and the side slope of inside and outside boss, can independently accurately control the bright dipping light shape of the luminescent wafer of different son bowl cups, and then the bright dipping light shape of luminescent wafer of different parameters of realizing making being placed on different son bowl cups is as far as possible consistent, improves the luminescence display effect.
Refer to Fig. 3 and Fig. 4, Fig. 3 is the planar structure schematic diagram of the utility model surface-adhered type LED device one execution mode, and Fig. 4 is the cross section structure schematic diagram of the surface-adhered type LED device shown in Fig. 3 along the B-B direction.In present embodiment, surface-adhered type LED device comprises surface-adheredtype LED support 310, electrically-conductive backing plate 320, at least twoluminescent wafers 330 and packing colloids 340.Wherein, surface-adheredtype LED support 310 is the described surface-adhered type LED support of top execution mode, and it illustrates and refers to Fig. 1,2 and top execution mode text description, and therefore not to repeat here.
Electrically-conductive backing plate 320 is metal substrate, it is for example the copper metal substrate, electrically-conductive backing plate 320 is arranged at the interior bottom ofsupport bowl cup 3113 of surface-adheredtype LED support 310, and the electrically-conductive backing plate 320 not one side insupport bowl cup 3113 is attached on theinsulating base bottom 3115 of surface-adheredtype LED support 310, so that electrically-conductive backing plate 320 is supported in insulating base bottom 3115.Described electrically-conductive backing plate 320 is separated at least two parts 321,322,323 by least oneinner convex platform 3112 ofLED support 310, at least two parts 321,322,323 of described electrically-conductive backing plate 320 are the corresponding interior bottom ofdifference bowl cup 3114 that is arranged onsupport bowl cup 3113 respectively, and at least two parts 321,322,323 of electrically-conductive backing plate 320 insulate each other.
Further, correspondence is arranged at least two parts 321,322,323 of the electrically-conductive backing plate 320 of the bottom inson bowl cup 3114, thefirst area 3211 and thesecond area 3212 that comprise respectively mutually insulated, the end that thefirst area 3211 of at least two parts 321,322,323 of electrically-conductive backing plate 320 andsecond area 3212 arrive correspondingson bowl glasss 3114 with themetal pin 312 ofLED support 310 respectively is connected.As shown in Figure 3, thesupport bowl cup 3113 ofLED support 310 is separated into threeson bowl cups 3114 by twoinner convex platforms 3112, threeson bowl cup 3114 bottoms arrange respectively the electrically-conductive backing plate 321,322,323 of mutually insulated, theinsulating base bottom 3115 that isLED support 310 is provided with 6metal pins 312, and described 6metal pins 312 are connected with first,second zone insulating base bottom 3115 respectively.
Described at least twoluminescent wafers 330 are separately positioned in thedifference bowl cup 3114 in describedLED support 310, the shape of at least two of describedLED support 310son bowl cups 3114 is corresponding with the corresponding parameter that is arranged on theluminescent wafer 330 in describedson bowl cup 3114 respectively, be arranged on the bright dipping light shape of theluminescent wafer 330 in differentson bowl cups 3114 with independent regulation, make the bright dipping light shape of theluminescent wafer 330 in differentson bowl cups 3114 consistent.Theluminescent wafer 330 of differentson bowl cups 3114 is connected with the electrically-conductive backing plate 320 in the virgin ofinstitute bowl cup 3114 bottoms respectively.Further, thepositive pole 331 ofluminescent wafer 330 connects with thefirst area 3211 of the electrically-conductive backing plate 320 of correspondingson bowl cup 3114 bottoms by wire, to be connected with one of themmetal pin 312 ofLED support 310, thenegative pole 332 ofluminescent wafer 330 connects with thesecond area 3212 of the electrically-conductive backing plate 320 of correspondingson bowl cup 3114 bottoms by wire, to be connected with wherein anothermetal pin 312 of LED support 310.Themetal pin 312 of describedLED support 310 is connected with power supply circuits respectively, with to described at least twoluminescent wafers 330 power supplies, drives luminous.
Describedpacking colloid 340 is filled in the accommodation space ofsupport bowl cup 3113 of describedLED support 310, in thedifference bowl cup 3114 that described at least twoluminescent wafers 330 is sealed in to described support bowl cup 3113.In present embodiment, the peak of theouter lug boss 3111 of the peak of describedpacking colloid 340 and describedLED support 310 maintains an equal level, can fill the accommodation space of eachson bowl cup 3114 fully to guaranteepacking colloid 340, certainly, packingcolloid 340 is not limit the peak of its peak andouter lug boss 3111 yet, in other embodiments, the peak of packing colloid also can maintain an equal level with the peak of inner convex platform, or the peak of packing colloid is between the peak of inside and outside boss etc.
Particularly,packing colloid 340 comprises encapsulation glue and the spread powder of ratio setting, and described encapsulation glue comprises A glue and B glue, general, and encapsulation glue is epoxy resin or silica gel.In present embodiment, the ratio of A glue and B glue is generally at 1:(0.7-1.3) between, the ratio of the A glue of packingcolloid 340 integral body, B glue and spread powder is 1: (0.7-1.3): (0.03-0.5).It should be noted that, the aforementioned proportion scope be only A glue, B glue and spread powder in packing colloid ratio preferably, in other embodiments, the ratio of the A glue in packing colloid, B glue and spread powder also can be the ratio value outside the aforementioned proportion scope, therefore the aforementioned proportion scope is not as to restriction of the present utility model.
It should be noted that, in present embodiment, at least two parts 321,322,323 of electrically-conductive backing plate 320 insulate each other, but in concrete application, at least two parts 321,322,323 of described electrically-conductive backing plate 320 are not limited to mutual insulation, when the driving voltage of theluminescent wafer 330 in being arranged on differentson bowl cups 3114 is identical, can mutually conduct electricity between the first area of at least two parts 321,322,323 of described electrically-conductive backing plate 320, can mutually conduct electricity between the second area of at least two parts 321,322,323 of described electrically-conductive backing plate 320.
In addition; in another embodiment; the utility model surface-adhered type LED support also can comprise above-mentioned electrically-conductive backing plate; accordingly; electrically-conductive backing plate in surface-adhered type LED device is the electrically-conductive backing plate of surface-adhered type LED support; therefore, on product layout, above-mentioned electrically-conductive backing plate is belonged to the surface-adhered type LED support or surface-adhered type LED device all belongs to the utility model protection range.
Present embodiment is provided with independent at least two son bowl cups in the support bowl cup of surface-adhered type LED support, by controlling respectively the shape of different described independently son bowl cups, to regulate independently the bright dipping light shape of the luminescent wafer that is arranged on the different parameters in different son bowl cups, improve the consistency of the luminescent wafer bright dipping light shape of different parameters in surface-adhered type LED device, improve the luminescence display effect.
Refer to Fig. 5, Fig. 5 is the structural representation of the utility model LED display one execution mode.In present embodiment, LED display comprises at least one surface-adheredtype LED device 510 andLED drive circuit 520,LED drive circuit 520 is connected with described at least one surface-adheredtype LED device 510 respectively, to described at least one surface-adheredtype LED device 510, to provide driving voltage, drive the luminous realization of described at least one surface-adheredtype LED device 510 to show, wherein, surface-adheredtype LED device 510 is the surface-adhered type LED device described in top execution mode, it illustrates the text description that refers to Fig. 1 to 4 and top execution mode, therefore not to repeat here.
Technique scheme is provided with independent at least two son bowl cups in the support bowl cup of the LED support of surface-adhered type, by controlling respectively the shape of different described independently son bowl cups, to realize regulating independently the bright dipping light shape that is arranged on the luminescent wafer in different son bowl cups, improve the consistency of LED device light shape, and then improved the luminescence display effect.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present utility model.
Claims (9)
1. a surface-adhered type LED support, is characterized in that,
Comprise insulating base, described insulating base comprises outer lug boss and at least one inner convex platform, described outer lug boss is arranged on the periphery of described insulating base, the support bowl cup that there is accommodation space with formation, described at least one inner convex platform is arranged in described support bowl cup, described support bowl cup is separated into to independently at least two son bowl cups.
2. surface-adhered type LED support according to claim 1, is characterized in that,
The peak of described outer lug boss maintains an equal level higher than the peak of described inner convex platform or with the peak of described inner convex platform.
3. surface-adhered type LED support according to claim 1, is characterized in that,
The height of described outer lug boss is the numerical value between 0.3 to 2 millimeter.
4. surface-adhered type LED support according to claim 1, is characterized in that,
The side towards accommodation space one side of described outer lug boss has the slope between 1 ° to 30 °, and the side of described inner convex platform has the slope between 1 ° to 30 °.
5. a surface-adhered type LED support, is characterized in that,
Comprise integrated support bowl cup, also comprise at least two son bowl cups that are arranged in described support bowl cup, each described son bowl cup is at least arranging a luminescent wafer.
6. a surface-adhered type LED device, is characterized in that,
Comprise the described surface-adhered type LED support of claim 1 to 5 any one, electrically-conductive backing plate, at least two luminescent wafers and packing colloid;
Described electrically-conductive backing plate is arranged at the interior bottom of support bowl cup of described surface-adhered type LED support, described at least two luminescent wafers are separately positioned in the difference bowl cup in described LED support, and from the electrically-conductive backing plate in described different son bowl cups, connect respectively, described packing colloid is filled in the support bowl cup of described LED support, in the difference bowl cup that described at least two luminescent wafers is sealed in to described support bowl cup.
7. surface-adhered type LED device according to claim 6, is characterized in that,
The electrically-conductive backing plate that is arranged on described son bowl cup bottom comprises first area and the second area of mutually insulated, and the positive pole of the luminescent wafer in described son bowl cup is connected with described first area, and negative pole is connected with described second area.
8. surface-adhered type LED device according to claim 6, is characterized in that,
The peak of the peak of described packing colloid and the outer lug boss of described LED support maintains an equal level.
9. a LED display, is characterized in that,
Comprise at least one surface-adhered type LED device claimed in claim 6 and LED drive circuit, described LED drive circuit is connected with described at least one surface-adhered type LED device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320365831XUCN203339216U (en) | 2013-06-24 | 2013-06-24 | Surface mounting type LED support, LED device and LED display screen |
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| CN201320365831XUCN203339216U (en) | 2013-06-24 | 2013-06-24 | Surface mounting type LED support, LED device and LED display screen |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014205874A1 (en)* | 2013-06-24 | 2014-12-31 | 深圳雷曼光电科技股份有限公司 | Surface mounted led support, led device, and led display screen |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
- 2013
- 2013-06-24CNCN201320365831XUpatent/CN203339216U/ennot_activeExpired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014205874A1 (en)* | 2013-06-24 | 2014-12-31 | 深圳雷曼光电科技股份有限公司 | Surface mounted led support, led device, and led display screen |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
| US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
| US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
| US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
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