CN202795324U - Touch sensing layer - Google Patents

Abstract

The utility model provides a touch sensing layer, which includes at least one electrode made of a first conductive layer, and at least one peripheral lead wire electrically connected to the electrodes respectively, wherein the peripheral lead wires are of a dual-layer conductive structure made of the first conductive layer and a second conductive layer. The peripheral lead wires in the touch sensing layer are better in conductivity.

Description

The touch-control sensing layer

Technical field

The utility model system is about a kind of contact panel.

Background technology

The inductive layer of contact panel comprises electrode and periphery lead-in wire at least, and its manufacture method relates to a plurality of steps, please refer to Fig. 1, is the method flow diagram of traditional fabrication electrode and periphery lead-in wire, and its step comprises: step S1 forms a transparency conducting layer on a substrate; Step S2 forms a photoresist layer on this transparency conducting layer; Step S3 obtains the transparency conducting layer of patterning, i.e. electrode by front oven dry, exposure, development, post-drying, etching, stripping; Step S4 forms a metal level on this electrode; Step S5 forms a photoresist layer on this metal level; Step S6 obtains the metal level of patterning by front oven dry, exposure, development, post-drying, etching, stripping, i.e. the periphery lead-in wire.

In the conventional process, electrode and peripheral lead-in wire need separately carry out patterning, and this processing procedure action of patterning itself has comprised complicated process, such as oven dry, exposure, development, etching, stripping, so so that making technology is complicated, cause processing procedure efficient to promote.

The utility model content

In view of above-mentioned, the utility model provides a kind of touch-control sensing layer, comprises: at least one electrode pattern is to be made by one first conductive layer; And at least one periphery lead-in wire, be electrically connected at respectively those electrode patterns, wherein those periphery lead-in wires double-deck conductive structure that this first conductive layer and one second conductive layer are made of serving as reasons.

Description of drawings

Fig. 1 is the method for making process flow diagram of traditional touch-control sensing layer.

Fig. 2 A is the structural representation of a kind of touch-control sensing layer among the utility model one embodiment.

Fig. 2 B is that Fig. 2 A is along the sectional view of A-A ' direction.

Fig. 3 is the method for making process flow diagram of the touch-control sensing layer of the utility model one embodiment.

Fig. 4 A is the structural representation in the method for making process of the utility model one embodiment.

Fig. 4 B is the sectional view of Fig. 4 A along continuous straight runs.

Fig. 5 A is the structural representation in the method for making process of the utility model one embodiment.

Fig. 5 B is the sectional view of Fig. 5 A along continuous straight runs.

Fig. 6 A is the structural representation in the method for making process of the utility model one embodiment.

Fig. 6 B is that Fig. 6 A is along the sectional view of B-B ' direction.

Fig. 7 A is the structural representation in the method for making process of the utility model one embodiment.

Fig. 7 B is that Fig. 7 A is along the sectional view of C-C ' direction.

Fig. 8 is the method for making process flow diagram of the utility model one embodiment.

Fig. 9 A is the structural representation in the method for making process of the utility model one embodiment.

Fig. 9 B is that Fig. 9 A is along the sectional view of D-D ' direction.

[main element symbol description]

10 touch-control sensing layers

1 electrode

2 periphery lead-in wires

20 substrates

21 first conductive layers

22 second conductive layers

23 patterning composite conducting layers

24 protective seams

The VA viewing area

The SA neighboring area

S1 forms a transparency conducting layer on a substrate

S2 forms a photoresist layer on this transparency conducting layer

S3 obtains by front oven dry, exposure, development, post-drying, etching, stripping

The transparency conducting layer of patterning, i.e. electrode

S4 forms a metal level on this electrode

S5 forms a photoresist layer on this metal level

S6 obtains by front oven dry, exposure, development, post-drying, etching, stripping

The metal level of patterning, i.e. periphery lead-in wire

A forms one first conductive layer on a substrate

B forms one second conductive layer on this first conductive layer

This first conductive layer of c synchronization patternization and this second conductive layer are with difference shape

Become a patterning composite conducting layer and at least one periphery lead-in wire

D removes this second conductive layer in this patterning composite conducting layer to be formed to

A few electrode, wherein those periphery lead-in wires are electrically connected to corresponding those

Electrode

E forms protective seam on the periphery lead-in wire, and makes the patterning composite bed exposed

F removes above-mentioned protective seam

Embodiment

Each embodiment of this case below will be described in detail in detail, and cooperate diagram as illustration.Except these were described in detail, the utility model can also be implemented among other the embodiment widely, the substituting easily of any described embodiment, revise, equivalence changes and is included in the scope of this case, and with after claim be as the criterion.In the description of instructions, in order to make the reader the utility model there is more complete understanding, many specific detail are provided; Yet the utility model may at clipped or all under the prerequisite of these specific detail, still can be implemented.In addition, well-known step or element are not described in the details, with the restriction of avoiding causing the utility model unnecessary.Assembly identical or similar in the diagram will represent with identical or simileys.What pay special attention to is that diagram only is the usefulness of signal, is not size or the quantity of representation element reality, unless otherwise specified.

Fig. 2 A and Fig. 2 B are the touch-control sensing layer structural representation among the utility model one embodiment, and wherein Fig. 2 B is that Fig. 2 A is along the sectional view of A-A ' direction.In the present embodiment, touch-control sensing layer 10 comprises theelectrode 1 that is positioned at visible area VA and the periphery lead-inwire 2 that is positioned at non-visible area VS, and wherein periphery lead-inwire 2 is electrically connected electrode 1.Electrode 1 is made by the first conductive layer 21.Periphery lead-inwire 2 is made by the firstconductive layer 21 and the secondconductive layer 22,2 is a kind of double-deck conductive structure so periphery goes between.

Among the utility model one embodiment,electrode 1 and periphery lead-inwire 2 are made by the firstconductive layer 21, soelectrode 1 is own by the firstconductive layer 21 with the electric connection of periphery lead-inwire 2, so need not to carry out conducting by other overlapping overlapping modes betweenelectrode 1 and the periphery lead-inwire 2, in other words, the junction zero lap ofelectrode 1 and periphery lead-in wire, thus avoided because of problems such as overlapping opening circuit of having that difference in height causes.

Fig. 3 is for making the method flow diagram of above-mentioned touch-control sensing layer.Please refer to Fig. 3, the method for making of touch-control sensing layer may further comprise the steps: (a) form one first conductive layer on a substrate; (b) form one second conductive layer on this first conductive layer; (c) this first conductive layer of synchronization patternization and this second conductive layer are to form respectively a patterning composite conducting layer and at least one periphery lead-in wire; And (d) remove this second conductive layer in this patterning composite conducting layer to form at least one electrode, wherein those periphery lead-in wires are electrically connected to those corresponding electrodes.

Please merge with reference to figure 4A and Fig. 4 B, wherein Fig. 4 A is the structural representation that illustrates above-mentioned steps (a), and Fig. 4 B is the sectional view of Fig. 4 A along continuous straight runs.Step (a) forms the firstconductive layer 21 onsubstrate 20, and shown in Fig. 4 A to Fig. 4 B, the mode that wherein forms can be deposition, evaporation, printing, coating, sputter etc.

Please merge with reference to figure 5A and Fig. 5 B, wherein Fig. 5 A is the structural representation that illustrates above-mentioned steps (b), and Fig. 5 B is the sectional view of Fig. 5 A along continuous straight runs.Step (b) forms the secondconductive layer 22 on the firstconductive layer 21, and shown in Fig. 5 A and Fig. 5 B, the mode that wherein forms can be deposition, evaporation, printing, coating, sputter etc.

Please merge with reference to figure 6A and Fig. 6 B, wherein Fig. 6 A is the structural representation that illustrates above-mentioned steps (c), and Fig. 6 B is that Fig. 6 A is along the sectional view of B-B ' direction.Step (c), synchronization patternization the firstconductive layer 21 and the secondconductive layer 22 are to form respectively patterning composite conductinglayer 23 and periphery lead-inwire 2, shown in Fig. 6 A and Fig. 6 B.Wherein, periphery lead-inwire 2 is electrically connected at respectively patterning composite conductinglayer 23, and patterning composite conductinglayer 23 is positioned at the viewing area VA ofsubstrate 20 haply, and periphery lead-inwire 2 is positioned at the neighboring area SA ofsubstrate 20 haply.

In present embodiment, preferably, be to adopt a laser etching mode simultaneously patterning the firstconductive layer 21 and the second conductive layer 22.According to the pattern that will form, utilize laser line etching machine, control suitable laser etching parameter, simultaneously that the secondconductive layer 22 is complete with the firstconductive layer 21 required etched part etchings of its below, and avoid etching into thesubstrate 20 under the firstconductive layer 21, for example plastic substrate.In one embodiment, the thunder laser beam of wavelength 1064nm is selected in the laser etching, and the collocation following parameters: power 3W, and laser frequency 70K, line speed 1000mm/s, according to above-mentioned parameter, can etch live width and line-spacing is the periphery lead-inwire 2 of 30 ± 5 μ m.In another embodiment, the thunder laser beam of wavelength 355nm is selected in the laser etching, and the collocation following parameters: power 0.7W, and laser frequency 100K, line speed 1000mm/s, according to above-mentioned parameter, can etch live width and line-spacing is the periphery lead-inwire 2 of 15 ± 5 μ m.So employed wavelength and other correlation parameters during by the radium-shine etching of adjustment, can obtain live width is the periphery lead-in wire of 10 μ m to 35 μ m.Owing to be easier to control on the laser etching precision, use the method for making of present embodiment, the line-spacing of periphery lead-inwire 2 can reach about 10 μ m to 35 μ m.

In another embodiment of the utility model, be mode synchronization patternization the firstconductive layer 21 and the secondconductive layer 22 that adopts lithography.In the present embodiment, after above-mentioned steps (b) is finished, form first a photoresist layer on the secondconductive layer 22, form patterning composite conductinglayer 23 and periphery lead-inwire 2 through operations such as front oven dry, exposure, development, post-drying, etching, strippings again.

Please merge with reference to figure 7A and Fig. 7 B, wherein Fig. 7 A is the structural representation that illustrates above-mentioned steps (d), and Fig. 7 B is that Fig. 7 A is along the sectional view of C-C ' direction.Step (d) removes the secondconductive layer 22 in the patterningcomposite conducting layer 23 to formelectrode 1, and wherein those periphery lead-inwires 2 are electrically connected to thosecorresponding electrodes 1, shown in Fig. 7 A and Fig. 7 B.For example, utilize dry ecthing or wet etching to remove the second conductive layer 22.In present embodiment, the secondconductive layer 22 among the VA of viewing area in the patterningcomposite conducting layer 23, can remove by an etching solution etching, wherein because the firstconductive layer 21 and the secondconductive layer 22 have different etch properties, therefore can select suitable etching solution, make this etching solution only can etching action be arranged to the secondconductive layer 22, but can etching action not arranged to the first conductive layer 21.Therefore, selecting of etching solution needs to determine according to the material of the secondconductive layer 22, for example, if the material of the secondconductive layer 22 is molybdenum-aluminium-molybdenum (Mo-Al-Mo) alloy, then uses acetic acid-nitric acid-phosphoric acid solution as etching solution; If the material of the secondconductive layer 22 is copper, then use ferric chloride solution as etching solution.

Fig. 8 is for making the other method process flow diagram of above-mentioned touch-control sensing layer.The difference part of present embodiment and said method embodiment is: more comprise a step (e) between step (c) and step (d), namely form aprotective seam 24 on periphery lead-inwire 2, and make patterningcomposite conducting layer 23 exposed.Please merge with reference to figure 9A and Fig. 9 B, wherein Fig. 9 A is the structural representation that illustrates above-mentioned steps (e), and Fig. 9 B is that Fig. 9 A is along the sectional view of D-D ' direction.In one embodiment,protective seam 24 is an anti-etching ink lay that adopts screen printing mode to form, and to cover and to protect the periphery lead-inwire 2 of neighboring area SA, exposes simultaneously the patterningcomposite conducting layer 23 that is positioned at viewing area VA; Then, solidify the anti-etching ink lay of processing with heating or UV-irradiation mode.In another embodiment, with method for printing screen, print peelable glue-line 24 to protect periphery lead-inwire 2 at neighboring area SA, expose simultaneously the patterningcomposite conducting layer 23 that is positioned at viewing area VA; Then, by ultraviolet light or type of heating peelable glue-line is solidified.After formingprotective seam 24, secondconductive layer 22 that removes that carries out again step (d) moves, and is corroded in the process of step (d) to prevent periphery lead-inwire 2.

In the utility model one embodiment, more comprise afterwards a step (f) in step (d), namely remove above-mentioned protective seam 24.In present embodiment, use a stripper solution to removeprotective seam 24, potassium hydroxide (KOH) solution for example will prevent that etching printing ink 24 or adhesive 24 peel off.

In the present embodiment, all the other steps and use material are all similar with said method embodiment, do not repeat them here.

By said method, can form touch-control sensing layer 10 atsubstrate 20.

In addition, preferably, described touch-control sensing layer 10 is a kind of touch-control sensing structures for capacitance type touch-control panel, and its form is not limited to the individual layer single-shaft configuration shown in Fig. 2 A, also can be an individual layer cross-compound arrangement, pair of lamina cross-compound arrangement etc.

Need to prove that in aforementioned each embodiment,substrate 20 can be a transparent inorganic substrate, for example a glass substrate; An or transparent organic substrate, a plastic substrate for example, its material is polyethylene terephthalate (Polyethylene terephthalate for example, PET), polycarbonate (Poly Carbonate, PC), tygon (Po1yethylene, PE) or polymethylmethacrylate (Polymethylmethacrylate, PMMA) etc.The firstconductive layer 21 is transparent conductive material, and its material can be selected from one of them or its combination of following group: tin indium oxide (ITO), antimony tin (AT0), zinc paste (ZnO), zinc oxide (ZnO₂), tin ash (SnO₂), indium sesquioxide (In₂O₃).The secondconductive material 22 is metal material, and its material comprises any metal or alloy that can conduct electricity, for example copper, aldary, molybdenum-aluminium-molybdenum alloy, silver, silver alloy etc.

Touch-control sensing layer that the utility model embodiment provides and preparation method thereof, be to utilize the fabrication steps of synchronization pattern to form electrode and periphery lead-in wire, thereby can simplify production procedure to promote processing procedure efficient, if use in addition radium-shine etched mode in patterning step, produced periphery lead-in wire is meticulousr.

The above is the preferred embodiment of the utility model only, is not the claim that limits the utility model; All other do not break away from lower the equivalence of finishing change of spirit or the modification that invention is disclosed, and all should be included in the following claim.

Claims (5)

1. touch-control sensing layer comprises:

At least one electrode is to be made by one first conductive layer; And

At least one periphery lead-in wire is electrically connected at respectively those electrodes, wherein those periphery lead-in wires double-deck conductive structure that this first conductive layer and one second conductive layer are made of serving as reasons.

2. touch-control sensing layer as claimed in claim 1 is characterized in that, the material of this first conductive layer is transparent conductive material, and the material of this second conductive layer is metal material.

3. touch-control sensing layer as claimed in claim 1 is characterized in that, the junction zero lap of those electrodes and those periphery lead-in wires.

4. touch-control sensing layer as claimed in claim 1 is characterized in that, those periphery lead-in wires line-spacing to each other is 10 μ m to 35 μ m.

5. touch-control sensing layer as claimed in claim 1 is characterized in that, the live width of those periphery lead-in wires is 10 μ m to 35 μ m.

Images