CN202382514U - Mini Refrigerated Cup - Google Patents

Abstract

The utility model discloses a miniature refrigeration cup, including cup, refrigerator, the refrigerator includes semiconductor chip, leads cold drawing, heat radiation fins, semiconductor chip's both ends face respectively with lead cold drawing and heat radiation fins contact heat transfer, still be equipped with radiator fan device in heat radiation fins's below. The utility model discloses install the refrigerating plant who has semiconductor chip at the bottom of the cup, absorb the heat in the cup, reach the effect of freezing beverage in the cup. Compared with the traditional method of putting the cup into a refrigerator or cooling liquid in the cup by using cold water, the cup is more convenient to operate, and the miniature refrigeration cup is small in size and convenient to carry.

Description

Translated fromChinese

微型制冷杯Mini Refrigerated Cup

技术领域technical field

本实用新型涉及半导体制冷技术领域，更具体地说，是涉及一种微型制冷杯。The utility model relates to the technical field of semiconductor refrigeration, in particular to a miniature refrigeration cup.

背景技术Background technique

现有技术中，对杯具内所盛的热饮品快速散热的方法，可以直接将杯具放进冷水或者冰箱进行热交换，但是离开冰箱或冷水之后，时间一长，杯中的饮料很快便升温不够冰爽，喝起来不够爽快。若将剩下的饮料拿回冰箱冰好再喝，则显得很麻烦。In the prior art, the method of quickly dissipating heat from the hot beverage contained in the cup can be directly put the cup into cold water or a refrigerator for heat exchange, but after leaving the refrigerator or cold water, the beverage in the cup will quickly lose heat after a long time. It doesn't heat up enough to be cool enough, and it doesn't taste refreshing enough. If the remaining beverage is taken back to the refrigerator to freeze and drink again, then it seems very troublesome.

实用新型内容Utility model content

本实用新型目的为了克服上述已有技术存在的不足，提供结构简单的微型制冷杯。能够方便携带，且插上电源即可快速冰冻饮料。The purpose of the utility model is to provide a miniature refrigeration cup with a simple structure in order to overcome the shortcomings of the above-mentioned prior art. It is easy to carry, and can quickly freeze drinks when plugged in.

本实用新型采用的技术方案是：微型制冷杯，包括杯体、制冷器，所述制冷器包括半导体芯片、导冷板、散热鳍片，半导体芯片的两端面分别与导冷板和散热鳍片接触换热，在散热鳍片的下方还设有散热风扇装置。The technical solution adopted in the utility model is: a miniature refrigeration cup, including a cup body and a refrigerator, and the refrigerator includes a semiconductor chip, a cold guide plate, and a heat dissipation fin, and the two end faces of the semiconductor chip are connected with the cold guide plate and the heat dissipation fin respectively. Contact heat exchange, and a heat dissipation fan device is also provided under the heat dissipation fins.

所述散热鳍片上表面设有半导体芯片的安装凹槽。The upper surface of the heat dissipation fin is provided with a mounting groove for a semiconductor chip.

所述散热鳍片上表面的边缘处设有竖壁。A vertical wall is provided at the edge of the upper surface of the heat dissipation fin.

所述杯体的底部是平的。The bottom of the cup is flat.

在散热鳍片上表面和竖壁上设有两条过线槽。Two wire passing grooves are arranged on the upper surface of the cooling fins and the vertical wall.

本实用新型的有益效果是：The beneficial effects of the utility model are:

在杯子底部装上带有半导体芯片的制冷装置，吸收杯中的热量，达到冷冻杯中饮料的效果。比起传统把杯子放进冰箱或利用冷水冷却杯中液体，其操作更为方便，而且微型制冷杯子体积小，便于携带。A refrigeration device with a semiconductor chip is installed at the bottom of the cup to absorb the heat in the cup and achieve the effect of freezing the drink in the cup. Compared with traditionally putting the cup into the refrigerator or using cold water to cool the liquid in the cup, its operation is more convenient, and the miniature refrigeration cup is small in size and easy to carry.

附图说明Description of drawings

图1是本实用新型微型制冷杯的结构拆分示意图；Fig. 1 is the structural disassembly schematic diagram of miniature refrigeration cup of the present utility model;

图2是本实用新型微型制冷杯的制冷器结构示意图；Fig. 2 is the structural representation of the refrigerator of the miniature refrigeration cup of the present invention;

图3是本实用新型微型制冷杯的制冷器底部结构示意图；Fig. 3 is a structural schematic diagram of the bottom of the refrigerator of the miniature refrigeration cup of the present invention;

图4是本实用新型微型制冷杯的导冷板结构示意图；Fig. 4 is a structural schematic diagram of the cold guide plate of the miniature refrigeration cup of the present invention;

图5是本实用新型微型制冷杯的散热风扇装置结构示意图。Fig. 5 is a structural schematic diagram of the heat dissipation fan device of the miniature refrigeration cup of the present invention.

具体实施方式Detailed ways

以下通过具体实施方式，并结合附图对本实用新型作进一步说明。The utility model will be further described below through specific embodiments in conjunction with the accompanying drawings.

如图1所示，本实用新型是一种微型制冷杯，包括散热风扇装置1、制冷器2、杯体3。制冷器是半导体制冷装置，杯体与制冷器接触换热，散热风扇装置设置在制冷器的下方，加强制冷效果，加快冷却速度。As shown in FIG. 1 , the utility model is a miniature refrigeration cup, comprising a cooling fan device 1 , a refrigerator 2 , and a cup body 3 . The refrigerator is a semiconductor refrigeration device, the cup body contacts the refrigerator to exchange heat, and the cooling fan device is arranged under the refrigerator to enhance the cooling effect and speed up the cooling speed.

众所周知，半导体制冷原理是由N型半导体材料和P型半导体材料联结成电偶对，在这个电路中接通直流电源后，产生能量的转移，电流由N型元件流向P型元件，在其接头吸收热量，成为冷端；电流由P型元件流向N型元件，在其接头释放热量，成为热端。通过输入电流大小的控制，则可控制产冷、产热量，从而可实现高精度的温度控制；另外，半导体芯片热惯性非常小，制冷、制热时间很快，在热端散热良好冷端空载的情况下，通电很短的时间，芯片就能达到最大温差。由于半导体热电系统具有制冷和制热的特性，在人们生活上具有广泛的应用前景。As we all know, the principle of semiconductor refrigeration is that N-type semiconductor materials and P-type semiconductor materials are connected into galvanic pairs. After the DC power supply is connected in this circuit, energy transfer occurs, and the current flows from N-type components to P-type components. It absorbs heat and becomes a cold end; the current flows from the P-type element to the N-type element, and releases heat at its joint, becoming a hot end. Through the control of the input current, the cooling and heat production can be controlled, so as to achieve high-precision temperature control; in addition, the thermal inertia of the semiconductor chip is very small, the cooling and heating time is very fast, and the heat dissipation is good at the hot end. Under the condition of loading, the chip can reach the maximum temperature difference in a short time after power on. Since the semiconductor thermoelectric system has the characteristics of cooling and heating, it has a wide application prospect in people's life.

本实用新型利用半导体制冷原理，通过在本体的底部设置半导体制冷器，使杯子具有快速冷却饮料的效果。杯体与制冷器的安装结构设计简单实用，制冷器与散热风扇装置的连接通过螺钉实现，整个成本比较低。The utility model utilizes the principle of semiconductor refrigeration, and a semiconductor refrigerator is arranged at the bottom of the main body, so that the cup has the effect of rapidly cooling beverages. The installation structure design of the cup body and the refrigerator is simple and practical, and the connection between the refrigerator and the cooling fan device is realized by screws, and the overall cost is relatively low.

参见图1-4，制冷器由导冷板21、半导体芯片、散热鳍片构成，其中，散热鳍片上表面设有半导体芯片的安装凹槽22，安装凹槽的深度与半导体芯片的厚度相同，使半导体芯片安装后，半导体芯片与散热鳍片上表面平齐。在散热鳍片上表面的边缘处设有竖壁23，竖壁高约20mm，以确保杯子放在上面不会滑落。在散热鳍片上表面和竖壁上还设有两条过线槽24，用于避让半导体芯片的引出线。在散热鳍片的底部设四个风扇螺钉孔25，在散热鳍片的上表面设两个导冷板安装孔26，相应地，在导冷板21上也设置有安装螺钉孔27。半导体芯片安装在散热鳍片上时，需要在半导体芯片的两端面上涂上导热硅脂，再将半导体芯片的热端面放置在安装凹槽22上，然后在冷端面上盖上导冷板21，用螺钉拧紧。由于杯体与导冷板是接触换热的，因此，杯体采用底部为平面的平底杯子。通电后，把杯子直接放在散热片上盖即可。Referring to Figures 1-4, the refrigerator is composed of acold guide plate 21, a semiconductor chip, and heat dissipation fins, wherein the upper surface of the heat dissipation fin is provided with amounting groove 22 for the semiconductor chip, and the depth of the mounting groove is the same as the thickness of the semiconductor chip. After the semiconductor chip is installed, the semiconductor chip is flush with the upper surface of the cooling fin. Avertical wall 23 is provided at the edge of the upper surface of the cooling fins, and the height of the vertical wall is about 20mm, so as to ensure that the cup will not slip off when placed on it. Twowire passing grooves 24 are also arranged on the upper surface and the vertical wall of the heat dissipation fins, which are used to avoid the lead-out wires of the semiconductor chip. Fourfan screw holes 25 are provided at the bottom of the heat dissipation fins, and two cold guideplate installation holes 26 are provided on the upper surface of the heat dissipation fins. Correspondingly,installation screw holes 27 are also provided on thecold guide plate 21 . When the semiconductor chip is installed on the heat dissipation fins, it is necessary to coat the two ends of the semiconductor chip with thermal conductive silicone grease, then place the hot end surface of the semiconductor chip on themounting groove 22, and then cover the cold end surface with a cold conductingplate 21, Tighten with screws. Since the cup body and the cold guide plate are in contact with each other for heat exchange, the cup body adopts a flat-bottomed cup with a flat bottom. After power on, put the cup directly on the heat sink and cover it.

参见图5，所述散热风扇装置包括：风扇电机11、电机固定柱12、底脚13。组合散热风扇装置1和制冷器2时，通过散热风扇装置上的四个固定柱螺钉孔15用螺钉将散热风扇装置1拧紧于散热鳍片上。Referring to FIG. 5 , the cooling fan device includes: afan motor 11 , amotor fixing column 12 , and afoot 13 . When combining the cooling fan device 1 and the refrigerator 2, screw the cooling fan device 1 on the cooling fins with screws through the four fixingcolumn screw holes 15 on the cooling fan device.

通电后，在半导体芯片的冷端面吸热将平底的杯体里面的热量带走，而在另一端的热端面放热，从而达到快速冷却饮料的目的。而制冷器产生的热量通过散热风扇装置1迅速发散出去，风扇电机高速运转时，冷却风流经散热鳍片将热量带走。After electrification, the cold end surface of the semiconductor chip absorbs heat and takes away the heat inside the flat-bottomed cup, while the hot end surface at the other end releases heat, thereby achieving the purpose of rapidly cooling the beverage. And the heat produced by the refrigerator dissipates rapidly through the heat dissipation fan device 1, and when the fan motor runs at high speed, the cooling air flows through the heat dissipation fins to take away the heat.

Claims (5)

Translated fromChinese

1.微型制冷杯，包括杯体、制冷器，其特征在于：所述制冷器包括半导体芯片、导冷板、散热鳍片，半导体芯片的两端面分别与导冷板和散热鳍片接触换热，在散热鳍片的下方还设有散热风扇装置。1. Miniature refrigeration cup, including cup body, refrigerator, it is characterized in that: described refrigerator includes semiconductor chip, cold conduction plate, heat dissipation fin, and the two ends of semiconductor chip contact heat exchange with cold conduction plate and heat dissipation fin respectively , a heat dissipation fan device is also provided under the heat dissipation fins.2.根据权利要求1所述的微型制冷杯，其特征在于：所述散热鳍片上表面设有半导体芯片的安装凹槽。2 . The miniature refrigeration cup according to claim 1 , characterized in that: the upper surface of the heat dissipation fins is provided with a mounting groove for a semiconductor chip. 3 .3.根据权利要求2所述的微型制冷杯，其特征在于：所述散热鳍片上表面的边缘处设有竖壁。3. The miniature refrigeration cup according to claim 2, wherein a vertical wall is provided at the edge of the upper surface of the cooling fins.4.根据权利要求3所述的微型制冷杯，其特征在于：所述杯体的底部是平的。4. The miniature refrigeration cup according to claim 3, wherein the bottom of the cup body is flat.5.根据权利要求4所述的微型制冷杯，其特征在于：在散热鳍片上表面和竖壁上设有两条过线槽。5. The miniature cooling cup according to claim 4, characterized in that two wire passing grooves are arranged on the upper surface of the cooling fins and the vertical wall.

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