CN202308030U

Movatterモバイル変換

Info

Publication number: CN202308030U
Application number: CN2011203081318U
Authority: CN
Inventors: 胡仲孚; 吴永富; 刘奎江
Original assignee: YINGSHENG TECHNOLOGY CO LTD
Current assignee: Ying Guang Photoelectric Technology (shanghai) Co Ltd
Priority date: 2011-08-23
Filing date: 2011-08-23
Publication date: 2012-07-04
Anticipated expiration: 2021-08-23

Abstract

The utility model provides a multilayer formula array type emitting diode photo-engine's structural improvement, wherein the surface of the peripheral region of base plate and lead frame respectively has concave-convex surface structure, and concave-convex surface structure can increase the surface roughness of the peripheral region of base plate and lead frame, therefore in concave point and the concave part can be filled in to liquid packaging material, so the encapsulation that forms after the packaging material solidification can combine and fix an organic whole closely with base plate and lead frame, lens bottom can coat the binder in addition, use the sealed degree of lens that increases, just the utility model discloses more utilize the soldering paste of the excellent material of doping heat conduction efficiency, make the heat energy that the LED crystalline grain produced dispel fast.

Description

Translated fromChinese

多层式阵列型发光二极管光引擎的结构改良Structural Improvement of Multilayer Array Type Light-Emitting Diode Light Engine

技术领域technical field

一种发光二极管光引擎的结构改良，尤其是一种完全阻绝水气进入、坚固耐用及长期维持光学组件效能的一种高强度气密型多层式阵列型发光二极管的封装结构改良。A structural improvement of a light-emitting diode light engine, especially a high-strength airtight multilayer array-type light-emitting diode packaging structure improvement that completely prevents water vapor from entering, is durable, and maintains the performance of optical components for a long time.

背景技术Background technique

按LED的发光原理是利用半导体固有特性，它不同于以往的白炽灯管的放电、发热发光原理，而是将电流顺向流入半导体的PN接面时便会发出光线，所以LED被称为冷光源(cold light)。由于LED具有高耐久性、寿命长、轻巧、耗电量低且不含水银等有害物质等的优点，故可广泛应用于照明设备产业中，且其通常以LED阵列封装方式应用在电子广告牌、交通号志等商业领域。According to the light-emitting principle of LED, it uses the inherent characteristics of semiconductors. It is different from the discharge and heat-emitting principles of incandescent tubes in the past. Instead, it emits light when the current flows into the PN junction of the semiconductor in the forward direction, so LED is called cold. light source (cold light). Due to the advantages of high durability, long life, light weight, low power consumption and no harmful substances such as mercury, LEDs can be widely used in the lighting equipment industry, and they are usually used in electronic billboards in the form of LED array packaging. , traffic signals and other commercial fields.

请参考新型专利公告号M393044的申请案的应用于发光二极管封装结构的具有荧光层的光学透镜，在此仅作一般功能的描述。参考图1，应用于发光二极管封装结构的具有荧光层的光学透镜的剖视图，其包含基板1a、封装体2a、导线架3a、光学透镜4a及透镜罩5a，基板1a位于封装结构的最底层部分，其中基板1a的各面皆形状平整且光滑的面，该基板1a的周边部分会被该封装体1a包覆固定，封装体2a的内壁面并设置有光学反射罩6a，封装体2a并也包覆固定导线架3a，导线架3a的各面皆形状亦为平整且光滑的面。Please refer to the application of New Patent Publication No. M393044 for an optical lens with a fluorescent layer applied to a light-emitting diode packaging structure, which is only described here for general functions. Referring to FIG. 1 , a cross-sectional view of an optical lens with a fluorescent layer applied to a light-emitting diode packaging structure, which includes a substrate 1a, apackage body 2a, alead frame 3a, anoptical lens 4a, and alens cover 5a, and the substrate 1a is located at the bottom part of the packaging structure , wherein each surface of the substrate 1a is flat and smooth, the peripheral part of the substrate 1a will be covered and fixed by the package 1a, and the inner wall of thepackage 2a is provided with an optical reflector 6a, and thepackage 2a is also Covering and fixing thelead frame 3a, each surface of thelead frame 3a is flat and smooth.

光学反射罩6a上配置有光学透镜4a及透镜罩5a，其中透镜罩5a覆盖住光学透镜4a，透镜罩5a藉由黏合方式固定在光学反射罩6a的顶部，以及使透镜罩5a嵌合于封装体2a之中，以使透镜罩5a可紧密固定于封装体2a及光学反射罩6a上。Anoptical lens 4a and alens cover 5a are disposed on the optical reflection cover 6a, wherein thelens cover 5a covers theoptical lens 4a, and thelens cover 5a is fixed on the top of the optical reflection cover 6a by bonding, and thelens cover 5a is fitted into the package In thebody 2a, thelens cover 5a can be tightly fixed on thepackage body 2a and the optical reflection cover 6a.

然而现有技术的缺点在于由于基板的各面是平滑的表面，当封装体将基板封装固定后，会形成一种平面对平面的接触关系，由于平面对平面的接触，使得封装体与基板相互间的摩擦力很少，导致会产生滑动不稳固的情形，此种滑动不稳固的情形也发生于导线架上，且封装体通常是使用液态状的材料包覆在基板或其它欲封装的构件的周围，当液态状的材料固态化以将基板封装起来，但是当基板的各面过于平滑，将难以使液态状的材料平均性的布满于基板各面，此种情形的解决方式，不外乎是增加材料用量或以人工方式去处理，相当耗损成本。However, the disadvantage of the prior art is that since each surface of the substrate is a smooth surface, when the package fixes the substrate, a plane-to-plane contact relationship will be formed. Due to the plane-to-plane contact, the package and the substrate are mutually There is very little friction between them, resulting in unstable sliding, which also occurs on the lead frame, and the package is usually covered with a liquid material on the substrate or other components to be packaged around, when the liquid material is solidified to encapsulate the substrate, but when the surfaces of the substrate are too smooth, it will be difficult to make the liquid material uniformly spread on all surfaces of the substrate. The solution to this situation is not It is nothing more than increasing the amount of materials or handling them manually, which consumes a lot of cost.

现有技术的另一缺点还有透镜罩难以长期固定于光学反射罩上，因为透镜罩的材质是塑料材质，而光学反射罩为了使光线反射高提高，会选用金属材质或在表面上镀上一层金属薄膜，但由于塑料不易与金属的表面接着固定，导致塑料材质的透镜罩会慢慢地脱离于金属材质的光学反射罩。Another shortcoming of the prior art is that the lens cover is difficult to fix on the optical reflector for a long time, because the material of the lens cover is plastic material, and the optical reflector will use metal material or plate it on the surface in order to improve the light reflection. A layer of metal film, but because the plastic is not easy to be fixed with the metal surface, the plastic lens cover will slowly separate from the metal optical reflector.

当基板与封装体发生松动的状况，以及透镜罩无法紧密地固定于光学反射镜时，将导致湿气或水气容易渗入于封装结构内部，导致发光组件及光学单元劣化甚至损毁，因此无法使用于潮湿的环境下，因此必须对此加以改良，并提供一种完全阻绝水气进入、并坚固耐用及长期维持光学组件效能的一种发光二极管的封装结构。When the substrate and package are loose, and the lens cover cannot be tightly fixed to the optical mirror, moisture or water vapor will easily penetrate into the package structure, resulting in deterioration or even damage to the light-emitting component and optical unit, so it cannot be used In a humid environment, it is necessary to improve this, and provide a package structure of light-emitting diodes that completely prevents the entry of water vapor, is durable, and maintains the performance of optical components for a long time.

实用新型内容Utility model content

本实用新型的主要目的在于提供一种多层式阵列型发光二极管光引擎的结构改良，其中基板的周边区块的各面上形成有一表面结构，该表面结构为凹陷部与凸出部相互交隔间错的态样，凹陷部可使液态状态的封装材料填流于表面结构的凹陷部，当封装材料固态化后，封装材料填流于凹陷部的部分以及封装材料对应于凸出部的部分皆与基板形成卡合的关系，如此基板与封装材料固态后所形成的封装体会紧密地结合并固定成一体，进而大幅提升基板对封装体的结构强度及封装密合度。The main purpose of the present utility model is to provide a structural improvement of a multi-layer array type light-emitting diode light engine, wherein a surface structure is formed on each surface of the peripheral block of the substrate, and the surface structure is that the concave part and the protruding part intersect each other. In the case of compartmentalization, the concave part can make the liquid packaging material flow into the concave part of the surface structure. When the packaging material is solidified, the part of the packaging material that fills the concave part and the part of the packaging material corresponding to the protruding part Parts are engaged with the substrate, so that the package formed by the solid state of the substrate and the packaging material is tightly combined and fixed into one body, thereby greatly improving the structural strength of the substrate to the package and the packaging tightness.

为了达到上述目的，本实用新型中的一种多层式阵列型发光二极管光引擎的结构改良，包含有：In order to achieve the above purpose, the structural improvement of a multi-layer array type LED light engine in the present invention includes:

一基板，该基板可区分为一中心区及一周边区，该中心区的顶面为一出光面，该基板并具有一边缘，该中心区涵盖该基板的中间区块，该周边区为在该中心区与该边缘之间的区块，其中该周边区具有一顶面、一侧面及一底面，在该顶面形成有两容置槽；A substrate, the substrate can be divided into a central area and a peripheral area, the top surface of the central area is a light-emitting surface, and the substrate has an edge, the central area covers the middle area of the substrate, and the peripheral area is in the The block between the central area and the edge, wherein the peripheral area has a top surface, a side surface and a bottom surface, and two accommodation grooves are formed on the top surface;

一封装体，该封装体包覆该基板的该周边区部分但不包覆该中心区，该封装体的包覆区域包含有该顶面、该侧面及该底面，该封装体具有一封装腔室，该封装腔室位于该出光面之上；A package body, the package body covers the peripheral area part of the substrate but does not cover the central area, the package body covers the top surface, the side surface and the bottom surface, and the package body has a package cavity chamber, the encapsulation chamber is located on the light-emitting surface;

两导线架，该两导线架皆具有一内端部及一外端部，该两导线架的该内端部分别位于该两容置槽之中，该两导线架的该内端部及该外端部之间部分皆被封埋于该封装体之中，而该内端部及该外端部则露出于该封装体之外；以及Two lead frames, the two lead frames both have an inner end and an outer end, the inner ends of the two lead frames are respectively located in the two accommodating grooves, the inner ends of the two lead frames and the parts between the outer ends are embedded in the package, and the inner end and the outer end are exposed outside the package; and

多个发光二极管晶粒，所述发光二极管晶粒设置于该出光面，所述发光二极管晶粒与该两导线架构成电性连接关系。A plurality of LED crystal grains, the LED crystal grains are arranged on the light-emitting surface, and the LED crystal grains form an electrical connection relationship with the two lead frames.

其中，包覆于封装体中的导线架具有多个第二凹点，所述第二凹点可使液态状态的封装材料填流其中，避免液态状的封装材料从导线架流散出去，当封装材料固态化后，封装材料填流于所述第二凹点的部分会皆与导线架形成卡合的关系，如此导线架与封装材料固态后所形成的封装体会紧密地结合并固定成一体，进而提升导线架对封装体的接合度。Wherein, the lead frame wrapped in the package body has a plurality of second concave points, and the second concave points can fill the packaging material in the liquid state to prevent the liquid packaging material from flowing out from the lead frame. After the material is solidified, the portion of the packaging material that fills the second concave point will form an engaging relationship with the lead frame, so that the lead frame and the package formed after the packaging material is solid are tightly combined and fixed into one body, Further, the bonding degree of the lead frame to the package body is improved.

其中，设置在封装结构最上层的透镜底部可进一步涂布有结合剂，结合剂可使透镜更紧密地与其之下的构件相黏合，藉以阻绝外界湿气侵入于透镜内及封装结构的内部，且透镜浮设于与透镜材质相似的硅胶隔离层上，而非配置于光学反射罩上，进而防止透镜发生松动脱离的情形，且提升透镜在封装结构中的密合性。其中，利用掺杂钻石粉的焊膏，将发光二极管晶粒焊设于基板上，由于钻石粉具有较佳的导热效果，因此可有效将发光二极管晶粒产生的热能导出，其中钻石粉还可镀上具有导热性能优异的材质，如此发光二极管晶粒所产生的热能可被更快地排散至外部环境空间。Wherein, the bottom of the lens disposed on the uppermost layer of the packaging structure can be further coated with a bonding agent, which can make the lens more tightly bonded to the components below it, so as to prevent external moisture from intruding into the lens and the inside of the packaging structure, And the lens floats on the silicone isolation layer similar to the lens material, instead of being arranged on the optical reflector, thereby preventing the lens from loosening and detaching, and improving the tightness of the lens in the packaging structure. Among them, the LED crystal grains are soldered on the substrate by using solder paste doped with diamond powder. Since diamond powder has a better heat conduction effect, it can effectively export the heat energy generated by the LED crystal grains. The diamond powder can also The material with excellent thermal conductivity is plated, so that the heat energy generated by the light-emitting diode crystal grains can be dissipated to the external environment space more quickly.

附图说明Description of drawings

图1为现有技术的应用于发光二极管封装结构的具有荧光层的光学透镜的剖视图；1 is a cross-sectional view of an optical lens with a fluorescent layer applied to a light-emitting diode packaging structure in the prior art;

图2为本实用新型的多层式阵列型发光二极管光引擎的结构改良的第一实施例示意图；Fig. 2 is a schematic diagram of the first embodiment of the structural improvement of the multi-layer array type LED light engine of the present invention;

图3A为本实用新型的多层式阵列型发光二极管光引擎的结构改良的俯视示意图；FIG. 3A is a schematic top view of the structural improvement of the multi-layer array LED light engine of the present invention;

图3B为图2A的区域A的局部剖视放大图；FIG. 3B is an enlarged partial cross-sectional view of area A in FIG. 2A;

图4为本实用新型的多层式阵列型发光二极管光引擎的结构改良的第二实施例示意图；4 is a schematic diagram of a second embodiment of the structural improvement of the multi-layer array type LED light engine of the present invention;

图5为本实用新型的基板的第一实施例示意图；5 is a schematic diagram of a first embodiment of the substrate of the present invention;

图6为本实用新型的基板的第二实施例示意图；6 is a schematic diagram of a second embodiment of the substrate of the present invention;

图7为本实用新型的基板的第三实施例示意图；7 is a schematic diagram of a third embodiment of the substrate of the present invention;

图8为本实用新型的基板的第四实施例示意图；8 is a schematic diagram of a fourth embodiment of the substrate of the present invention;

图9为本实用新型的基板的第五实施例示意图；9 is a schematic diagram of a fifth embodiment of the substrate of the present invention;

图10为本实用新型的基板的第六实施例示意图；10 is a schematic diagram of a sixth embodiment of the substrate of the present invention;

图11为本实用新型的多层式阵列型发光二极管光引擎的结构改良的较佳实施例示意图；FIG. 11 is a schematic diagram of a preferred embodiment of the structural improvement of the multi-layer array type LED light engine of the present invention;

图12A为图10的区域A的局部放大图；Fig. 12A is a partially enlarged view of area A in Fig. 10;

图12B为图10的区域B的局部放大图。FIG. 12B is a partially enlarged view of area B in FIG. 10 .

具体实施方式Detailed ways

以下配合图式对本实用新型的实施方式做更详细的说明，使熟悉本领域的技术人员在研读本说明书后能据以实施。The implementation of the present utility model will be described in more detail below in conjunction with the drawings, so that those skilled in the art can implement it after studying this specification.

参考图2，本实用新型的多层式阵列型发光二极管光引擎的结构改良的第一实施例示意图。本实用新型是有关一种多层式阵列型发光二极管光引擎的结构改良，其可完全杜绝外界的湿气进入多层式阵列型发光二极管光引擎的封装结构的内部，防止内部的各光学组件因受潮而劣化。Referring to FIG. 2 , it is a schematic diagram of the first embodiment of the structural improvement of the multi-layer array LED light engine of the present invention. The utility model relates to a structural improvement of a multi-layer array type light-emitting diode light engine, which can completely prevent external moisture from entering the packaging structure of the multi-layer array type light-emitting diode light engine, preventing internal optical components from Deteriorated by moisture.

多层式阵列型发光二极管光引擎的封装结构至少包含有一基板1、一封装体3、两导线架对5。基板1可区分为中心区11及周边区13，中心区11的顶面为出光面111，中心区11涵盖于基板1的中心区块，较佳地中心区11的涵盖面积大于周边区13的涵盖面积，而周边区13为在中心区11及基板1边缘之间的区块，另周边区13具有顶面131、侧面133及底面135。The packaging structure of the multilayer array type LED light engine at least includes asubstrate 1 , apackaging body 3 , and twolead frame pairs 5 . Thesubstrate 1 can be divided into acentral area 11 and aperipheral area 13. The top surface of thecentral area 11 is a light-emittingsurface 111. Thecentral area 11 covers the central area of thesubstrate 1. Preferably, the covered area of thecentral area 11 is larger than that of theperipheral area 13. Covering an area, theperipheral area 13 is a block between thecentral area 11 and the edge of thesubstrate 1 , and theperipheral area 13 has atop surface 131 , aside surface 133 and abottom surface 135 .

参考图3A，本实用新型的多层式阵列型发光二极管光引擎的结构改良的俯视示意图，参考图3B，图3B为图3A的区域A的局部剖视放大图，并配合图1所示。在顶面131上形成有两容置槽131A及131B及多个第一凹点1315，较佳地两容置槽131A及131B分别设置在顶面131上的相互对应的位置，较佳地两容置槽131A及131B可设置在尽量靠近于出光面111的位置，亦即让两容置槽131A及131B位于靠近出光面111的两侧，所述第一凹点1315可设置成环状，且所述第一凹点1315也可设置于两容置槽131A及131B之中。其中该中心区11的形状可以圆形、椭圆形、四边形、多边形及其它适当形状。Referring to FIG. 3A , it is a schematic top view of the improved structure of the multi-layer array LED light engine of the present invention. Referring to FIG. 3B , FIG. 3B is an enlarged partial cross-sectional view of area A in FIG. 3A , which is also shown in FIG. 1 . Twoaccommodating grooves 131A and 131B and a plurality of firstconcave points 1315 are formed on thetop surface 131. Preferably, the twoaccommodating grooves 131A and 131B are respectively arranged at positions corresponding to each other on thetop surface 131. Theaccommodating grooves 131A and 131B can be arranged as close as possible to the light-emittingsurface 111, that is, the twoaccommodating grooves 131A and 131B are located on both sides of the light-emittingsurface 111, and the firstconcave point 1315 can be arranged in a ring shape. Moreover, the firstconcave point 1315 can also be disposed in the two receivinggrooves 131A and 131B. The shape of thecentral area 11 can be circular, elliptical, quadrangular, polygonal and other suitable shapes.

封装体3包覆住基板1的周边区13的部分，但不包覆住中心区11，封装体3的包覆区域需涵盖顶面131、侧面133及底面135，其中封装体3具有封装腔室31，封装腔室31为封装体3未包覆住中心区11的部分，因此封装体3在中心区11的上方围构出容置空间，容置空间供封装腔室31之中可配置适当的光学构件，封装腔室31的底部恰为出光面111。Thepackage 3 covers theperipheral area 13 of thesubstrate 1, but does not cover thecentral area 11. The package area of thepackage 3 needs to cover thetop surface 131, theside surface 133 and thebottom surface 135, wherein thepackage body 3 has apackage cavity Chamber 31, thepackaging chamber 31 is the part of thepackaging body 3 that does not cover thecentral area 11, so thepackaging body 3 encloses an accommodating space above thecentral area 11, and the accommodating space can be configured in thepackaging chamber 31 With suitable optical components, the bottom of thepackaging chamber 31 is just the light-emittingsurface 111 .

封装腔室31的内壁面311与出光面111相互之间具有一夹角关系，较佳地夹角小于90度，当内壁面311与出光面111之间的夹角小于90度时，内壁面311面向于封装腔室31之外，因此当有光线射向到内壁面311时，将有助于光线被反射至封装腔室31之外，内壁面311之上可进一步设置光学反射罩4，透过在内壁面311之上设置光学反射罩4，更可大幅提升光线反射到封装腔室31之外的机率，使发光的照度得以提高。Theinner wall surface 311 of thepackaging chamber 31 and the light-emittingsurface 111 have an included angle relationship with each other, preferably the included angle is less than 90 degrees. When the included angle between theinner wall surface 311 and the light-emittingsurface 111 is less than 90 degrees, theinner wall surface 311 faces outside thepackaging chamber 31, so when light hits theinner wall surface 311, it will help the light to be reflected to the outside of thepackaging chamber 31, and an optical reflector 4 can be further arranged on theinner wall surface 311, By arranging the optical reflection cover 4 on theinner wall surface 311 , the probability of light reflection to the outside of thepackaging chamber 31 can be greatly increased, so that the illuminance of the light can be improved.

封装体3使用封装材料来包覆住基板1的周边区13的部分，其中封装材料可以是模塑树脂(Mold Resin)，模塑树脂的材质可以是聚邻苯二甲酰胺压模树脂(poly-phthal-amide，PPA)或液晶聚合物(LiquidCrystalline Polymer，LCP)。Thepackage body 3 uses a packaging material to cover the part of theperipheral area 13 of thesubstrate 1, wherein the packaging material can be a molding resin (Mold Resin), and the material of the molding resin can be polyphthalamide molding resin (polyphthalamide molding resin). -phthal-amide, PPA) or Liquid Crystalline Polymer (LCP).

参考图3A及图3B，并配合图2所示，两导线架5皆具有内端部51及外端部53，两导线架5的内端部51分别位于两容置槽131A及131B之中，其中外端部53的水平高度可高于内端部51的水平高度，如图1所示，两导线架5的其中一部分可形成有弯折段，弯折段的两端延伸出去即是两导线架5的内端部51及外端部53。Referring to FIG. 3A and FIG. 3B , and as shown in FIG. 2 , both leadframes 5 have inner ends 51 and outer ends 53 , and the inner ends 51 of the twolead frames 5 are located in the twoaccommodating grooves 131A and 131B respectively. , wherein the level of theouter end 53 can be higher than the level of theinner end 51, as shown in Figure 1, a part of the twolead frames 5 can be formed with a bent section, and the two ends of the bent section extend out that is Theinner end portion 51 and theouter end portion 53 of the two lead frames 5 .

该两导线架5与该基板1之间相隔有该封装体3，且两导线架5的内端部51及外端部53之间的部分被封埋于封装体3之中，而内端部51及外端部53则露出于封装体3之外，其中该两导线架5的一面设置有多个第二凹点511，较佳地可将所述第二凹点设置在两导线架5的内端部51及在内端部51的周围区域。Thepackage body 3 is separated between the twolead frames 5 and thesubstrate 1, and the part between theinner end 51 and theouter end 53 of the twolead frames 5 is embedded in thepackage body 3, and the inner end Theportion 51 and theouter end portion 53 are exposed outside thepackage body 3, wherein a plurality ofsecond recesses 511 are provided on one side of the twolead frames 5, preferably the second recesses can be arranged on the twolead frames 5 and the surrounding area of theinner end 51.

所述第一凹点1315及所述第二凹点511的设置分别在于增加封装体3对基板1及导线架5的接着性，因为导线架5使用具导电性质的金属制成，封装体3则使用塑料或树脂的材质，由于塑料或树脂不易与金属接合，但透过在导线架5设置有所述第二凹点511，可以增加导线架5的表面粗糙度，且所述第二凹点511还可以被液态的塑料或树脂填满，让液态的塑料或树脂可以布满导线架5的表面上，因此当液态的塑料或树脂固化后，可以增加封装体3对导线架5的接着性，使封装体3更加紧密地封合于导线架5。The setting of the firstconcave point 1315 and the secondconcave point 511 is to increase the adhesion of thepackage body 3 to thesubstrate 1 and thelead frame 5, because thelead frame 5 is made of conductive metal, and thepackage body 3 The material of plastic or resin is used, because plastic or resin is not easy to bond with metal, but by setting the secondconcave point 511 on thelead frame 5, the surface roughness of thelead frame 5 can be increased, and the second concave point Thepoint 511 can also be filled with liquid plastic or resin, so that the liquid plastic or resin can cover the surface of thelead frame 5, so when the liquid plastic or resin solidifies, the connection between thepackage body 3 and thelead frame 5 can be increased. property, so that thepackage body 3 is more tightly sealed to thelead frame 5 .

参考图4，本实用新型的多层式阵列型发光二极管光引擎的结构改良的第二实施例示意图。其中在出光面111上可设置有多个发光二极管晶粒6，发光二极管晶粒6可以利用阵列性的排列方式配置在出光面111上，发光二极管晶粒6并与两导线架5构成电性连接，其中发光二极管晶粒6藉由打线接合与两导线架5而形成电性连接关系。Referring to FIG. 4 , it is a schematic diagram of a second embodiment of the improved structure of the multi-layer array LED light engine of the present invention. Wherein, a plurality ofLED crystal grains 6 can be arranged on thelight emitting surface 111, and theLED crystal grains 6 can be arranged on thelight emitting surface 111 in an array arrangement, and theLED crystal grains 6 and twolead frames 5 form an electrical connection. connection, wherein the light emitting diode die 6 is electrically connected to the twolead frames 5 by wire bonding.

其中所述发光二极管晶粒6藉由一焊膏(图未示)被焊设于该基板1的出光面111上，其中该焊膏可以是锡膏或银胶的至少其中之一，其中锡膏还可与碳晶与钻石晶体相混合，该钻石晶体还可镀上镍、银或其它导热性能优异的材质，透过在焊膏加入导热效果较佳的材料，可让焊膏的导热效能有效提升，藉以把发光二极管晶粒6所产生的热能快速地经由基板1传导至外部环境空间。Wherein the light-emittingdiode crystal grain 6 is welded on the light-emittingsurface 111 of thesubstrate 1 by a solder paste (not shown), wherein the solder paste can be at least one of solder paste or silver glue, wherein tin The paste can also be mixed with carbon crystals and diamond crystals. The diamond crystals can also be plated with nickel, silver or other materials with excellent thermal conductivity. By adding materials with better thermal conductivity to the solder paste, the thermal conductivity of the solder paste can be improved. It is effectively improved so that the heat energy generated by the LED die 6 can be quickly conducted to the external environment through thesubstrate 1 .

在所述发光二极管晶粒6之上可进一步形成有晶粒保护层7，晶粒保护层7须包覆所述发光二极管晶粒6，藉以保护所述发光二极管晶粒6免受外界的湿气及外界的污染，其中晶粒保护层7的材质为一硅胶，晶粒保护层7之上可再形成荧光胶层8，荧光胶层8可将所述发光二极管晶粒6所发出的光线予以混色。A grain protection layer 7 may be further formed on theLED grain 6, and the grain protection layer 7 must cover theLED grain 6 to protect theLED grain 6 from external moisture. gas and external pollution, wherein the material of the grain protective layer 7 is a silica gel, and a fluorescent glue layer 8 can be formed on the grain protective layer 7, and the fluorescent glue layer 8 can absorb the light emitted by the light-emittingdiode grain 6 Mix colors.

荧光胶层8之上更可形成硅胶隔离层9，硅胶隔离层9可隔绝外界的湿气侵入至荧光胶层8，如此荧光胶层8不会因受潮而变质。再者，在硅胶隔离层9之上可配置透镜10，且透镜10被底胶层20(underfilling)黏固于硅胶隔离层9之上，其中透镜10浮设于硅胶隔离层9之上，不与光学反射罩4直接接触，且硅胶隔离层9与透镜10都属于塑料材质，透镜10可紧密地固定于硅胶隔离层9之上，再者透过透镜10还可被底胶层20固定住，更可有效防止透镜10发生松动的情形，其中底胶层20的材质可以是环氧树脂或其它适当材质。A silica gel isolation layer 9 can be formed on the fluorescent adhesive layer 8, and the silica gel isolation layer 9 can isolate outside moisture from invading the fluorescent adhesive layer 8, so that the fluorescent adhesive layer 8 will not deteriorate due to moisture. Furthermore, thelens 10 can be configured on the silica gel isolation layer 9, and thelens 10 is glued on the silica gel isolation layer 9 by the underfilling layer 20 (underfilling), wherein thelens 10 floats on the silica gel isolation layer 9, without It is in direct contact with the optical reflector 4, and both the silica gel isolation layer 9 and thelens 10 are made of plastic, thelens 10 can be tightly fixed on the silica gel isolation layer 9, and thelens 10 can also be fixed by theprimer layer 20 through thelens 10 , which can effectively prevent thelens 10 from loosening, wherein the material of theprimer layer 20 can be epoxy resin or other suitable materials.

其中硅胶隔离层9及透镜10之间可涂布有结合剂30(primer)，结合剂30用增加硅胶隔离层9及透镜10之间的封密性，并阻绝外界湿气侵入于透镜10之内及硅胶隔离层9之下的荧光胶层8。A bonding agent 30 (primer) can be coated between the silica gel isolation layer 9 and thelens 10, and thebonding agent 30 is used to increase the sealing between the silica gel isolation layer 9 and thelens 10, and prevent external moisture from intruding into thelens 10. Fluorescent glue layer 8 inside and under the silica gel isolation layer 9.

参考图5，本实用新型的基板的第一实施例示意图，参考图6，本实用新型的基板的第二实施例示意图。其中基板1的顶面131上可形成有第一上沟槽1311，如图5所示。或者，也可如图6所示，在顶面131上进一步形成上凸部1313，其中在顶面131上可单独地设置第一上沟槽1311或上凸部1313，也可在顶面131上同时设置第一上沟槽1311及上凸部1313。Referring to FIG. 5 , a schematic diagram of the first embodiment of the substrate of the present invention, and referring to FIG. 6 , a schematic diagram of the second embodiment of the substrate of the present invention. A firstupper groove 1311 may be formed on thetop surface 131 of thesubstrate 1 , as shown in FIG. 5 . Alternatively, as shown in FIG. 6 , an upperconvex portion 1313 can be further formed on thetop surface 131 , wherein the firstupper groove 1311 or the upperconvex portion 1313 can be separately provided on thetop surface 131 , or thetop surface 131 A firstupper groove 1311 and anupper protrusion 1313 are simultaneously provided on the top.

第一上沟槽1311的形状可以是U型、凹型、V型或其它适当的形状。要注意的是，上述第一上沟槽1311的数目与上凸部1313的数目视实际需要而定，在此仅是说明用的实例而已，并非用以限制本实用新型的范围。The shape of the firstupper groove 1311 may be U-shaped, concave-shaped, V-shaped or other suitable shapes. It should be noted that the number of the above-mentioned firstupper grooves 1311 and the number of theupper protrusions 1313 depends on the actual needs, which are just examples for illustration and are not intended to limit the scope of the present invention.

参考图7，本实用新型的基板的第三实施例示意图。承上所述，在顶面上111可再设置出第二上沟槽1315，第二上沟槽1315设置在上凸部1313与基板1的边缘之间，第二上沟槽1315的形状可以是U型、凹型、V型或其它适当的形状。Referring to FIG. 7 , it is a schematic diagram of a third embodiment of the substrate of the present invention. Based on the above, a secondupper groove 1315 can be provided on thetop surface 111. The secondupper groove 1315 is arranged between the upperconvex portion 1313 and the edge of thesubstrate 1. The shape of the secondupper groove 1315 can be Be U-shaped, concave-shaped, V-shaped or other suitable shapes.

参考图8，本实用新型的基板的第四实施例示意图。在侧面133上可形成有侧沟槽1331，如图8所示。或者，也可如图9所示，在侧面133上设置出侧凸部1333，且侧凸部1333与在侧凸部1333之下的侧面133部分形成L型的结构，其中在侧面133上可单独地设置侧沟槽1331或侧凸部1333，也可在顶面133上同时设置侧沟槽1331及侧凸部1333。侧沟槽1331的形状可以是U型、凹型、V型或其它适当的形状。Referring to FIG. 8 , it is a schematic diagram of a fourth embodiment of the substrate of the present invention. Aside groove 1331 may be formed on theside surface 133, as shown in FIG. 8 . Alternatively, as shown in FIG. 9 ,side protrusions 1333 are provided on theside 133, and theside protrusions 1333 and the part of theside 133 below theside protrusions 1333 form an L-shaped structure, wherein theside 133 can be Theside grooves 1331 or theside protrusions 1333 are provided separately, and theside grooves 1331 and theside protrusions 1333 can also be provided on thetop surface 133 at the same time. The shape of theside groove 1331 may be U-shape, concave-shape, V-shape or other suitable shapes.

参考图10，本实用新型的基板的第六实施例示意图。在底面135上可形成有下沟槽1351，如图10所示。或者，也可在底面135设置出一下凸部(图未示)，其中在底面135上可单独地设置下沟槽1351或下凸部，也可在底面135上同时设置下沟槽1351及下凸部。Referring to FIG. 10 , it is a schematic diagram of a sixth embodiment of the substrate of the present invention. Alower groove 1351 may be formed on thebottom surface 135, as shown in FIG. 10 . Alternatively, a lower convex portion (not shown) can also be set on thebottom surface 135, wherein thelower groove 1351 or the lower convex portion can be separately set on thebottom surface 135, or thelower groove 1351 and the lower groove can be set on thebottom surface 135 at the same time. Convex.

参考图11，本实用新型的多层式阵列型发光二极管光引擎的结构改良的一较佳实施例示意图。其中在本实用新型的较佳实施例中，可在透过周边区13的顶面131上由内至外依序设置两个第一上沟槽1311、一个上凸部1313及一个第二上沟槽1315，其中两个第一上沟槽1311皆设置成凹型状，第二上沟槽1315设置成V形状，而侧面133上形成侧凸部1333，且侧凸部1333与侧面133形成L型的结构，底面135则形成一个下沟槽1351。Referring to FIG. 11 , it is a schematic diagram of a preferred embodiment of the structural improvement of the multi-layer array LED light engine of the present invention. In a preferred embodiment of the present utility model, two firstupper grooves 1311, one upperconvex portion 1313 and one secondupper groove 1311 can be sequentially arranged on thetop surface 131 of the penetratingperipheral area 13 from inside to outside.Grooves 1315, wherein the two firstupper grooves 1311 are all set in a concave shape, the secondupper groove 1315 is set in a V shape, andside protrusions 1333 are formed on theside 133, and theside protrusions 1333 and theside 133 form an L type structure, thebottom surface 135 forms alower groove 1351 .

参考图12A，图12A为图11的区域A的局部放大图，参考图12B，图12B为图11的区域B的局部放大图。其中两个第一上沟槽1311的内壁面上还可形成凸缘1311a，而在第二上沟槽1315的内壁面进一步形成凹缘1315a。Referring to FIG. 12A , FIG. 12A is a partially enlarged view of area A in FIG. 11 , and referring to FIG. 12B , which is a partially enlarged view of area B in FIG. 11 . The inner walls of the two firstupper grooves 1311 can also form flanges 1311a, and the inner walls of the secondupper grooves 1315 can further formconcave edges 1315a.

上述的所述沟槽与所述沟槽可使液态状的封装材料可填流于所述沟槽之中，因此当封装材料形成固态状后，填流于所述沟槽的部分以及封装材料固态后所形成的封装体3的对应于凸部的部分会与基板1形成卡合的关系，如此基板1与封装体3会紧密地结合并固定成一体，不会因松脱而滑动，如此可增加基板与封装体的结构强度及封装密合度。The above-mentioned groove and the groove can make the liquid packaging material flow in the groove, so when the packaging material is in a solid state, the part filled in the groove and the packaging material The portion of thepackage body 3 formed after solidification corresponding to the convex part will form an engaging relationship with thesubstrate 1, so that thesubstrate 1 and thepackage body 3 will be tightly combined and fixed together, and will not slide due to loosening, so It can increase the structural strength and sealing degree of the substrate and the packaging body.

尤其是当所述沟槽的内壁面上形成有凸缘1311a及凹缘1315a的时候，当封装材料形成固态状后，会分别与所述沟槽内壁面的凸缘1311a及凹缘1315a相卡合，使基板1可与封装体3更紧密地结合并固定成一体，使基板对封装体的结构强度及封装密合度更为强化。Especially when the flange 1311a and theconcave edge 1315a are formed on the inner wall of the groove, when the encapsulation material is formed into a solid state, it will engage with the flange 1311a and theconcave edge 1315a on the inner wall of the groove respectively. Together, thesubstrate 1 and thepackage body 3 can be more closely combined and fixed into one body, so that the structural strength of the substrate to the package body and the packaging tightness are further strengthened.

要注意的是，凸缘1311a及凹缘1315a的实际设置位置视实际需要而定，在此仅是说明用的实例而已，并非用以限制本实用新型的范围，亦即上述的任一沟槽及任一凸部都能视实际需要进一步设置凸缘1311a或凹缘1315a的至少其中之一，以提升本实用新型的封装结构的结构强度及封装密合度。It should be noted that the actual installation positions of the flange 1311a and theconcave edge 1315a depend on actual needs, and this is only an example for illustration, and is not intended to limit the scope of the present utility model, that is, any of the above-mentioned grooves And any convex portion can be further provided with at least one of the flange 1311a or theconcave edge 1315a according to the actual needs, so as to improve the structural strength and sealing tightness of the packaging structure of the present invention.

以上所述仅为用以解释本实用新型的较佳实施例，并非企图据以对本实用新型做任何形式上的限制，因此，凡有在相同的发明精神下所作有关本实用新型的任何修饰或变更，皆仍应包括在本实用新型意图保护的范畴。The above descriptions are only preferred embodiments for explaining the utility model, and are not intended to limit the utility model in any form. Therefore, any modification or modification of the utility model made under the same spirit of the invention Changes should still be included in the scope of protection intended by the utility model.