CN201966990U - Encapsulating structure for loudspeaker - Google Patents

Abstract

Translated fromChinese

本实用新型涉及了一种扬声器的封装结构，包括电路板、固定于电路板上的壳体及收容于壳体内的扬声器本体，在所述电路板上开设有收容部分扬声器本体的收容槽。因扬声器一部分收容在电路板中，这样安装在手机里更容易实现手机的超薄设计，并且扬声器本体被卡紧在收容槽中不容易脱落。

The utility model relates to a packaging structure of a loudspeaker, which comprises a circuit board, a casing fixed on the circuit board and a loudspeaker body accommodated in the casing, and an accommodating groove for accommodating part of the loudspeaker body is opened on the circuit board. Because part of the speaker is accommodated in the circuit board, it is easier to realize the ultra-thin design of the mobile phone when it is installed in the mobile phone, and the speaker body is locked in the receiving groove and is not easy to fall off.

Description

Translated fromChinese

扬声器的封装结构Package Structure of the Loudspeaker

【技术领域】【Technical field】

本实用新型涉及一种扬声器，尤其涉及一种扬声器的封装结构。The utility model relates to a loudspeaker, in particular to a package structure of the loudspeaker.

【背景技术】【Background technique】

随着通信技术的发展，手机已经得到大量普及，但是人们不单单只要求手机性能更好，功能更多，对其外观形状也提出了更高的要求，于是手机越来越薄，但是，现有的手机里的电子元器件都有自身的厚度，如何实现优化的组合设计就能达到降低手机的整体厚度成了一个亟需解决的问题。With the development of communication technology, mobile phones have been widely popularized, but people not only require better performance and more functions of mobile phones, but also put forward higher requirements for their appearance and shape, so mobile phones are getting thinner and thinner, but now Some electronic components in mobile phones have their own thickness. How to achieve an optimized combination design to reduce the overall thickness of the mobile phone has become an urgent problem to be solved.

而一般扬声器本体都是密封在一壳体内，这样很大程度上受到手机整体高度的影响，而想要把扬声器密封在壳体内就得增加手机的整体高度，这样势必使手机的超薄设计受困扰，并且扬声器安装在手机里的电路板上，手机掉落的时候也可能造成扬声器的脱落，从而影响了手机的质量。The general speaker body is sealed in a shell, which is largely affected by the overall height of the mobile phone. If you want to seal the speaker in the shell, you have to increase the overall height of the mobile phone, which will inevitably affect the ultra-thin design of the mobile phone. Troubled, and the speaker is installed on the circuit board in the mobile phone, when the phone falls, it may also cause the speaker to fall off, thus affecting the quality of the phone.

因此，有必要针对上述扬声器密封在壳体内从而增加手机整体高度，掉落时容易脱落的不足进行改良。Therefore, it is necessary to improve the disadvantages that the speaker is sealed in the housing to increase the overall height of the mobile phone and is easy to fall off when dropped.

【实用新型内容】【Content of utility model】

本实用新型的目的在于解决上述手机超薄设计中因为扬声器密封在壳体中而造成手机厚度难以降低、掉落时容易脱落的不足，而提供一种扬声器的封装结构：The purpose of this utility model is to solve the above-mentioned deficiencies in the ultra-thin design of the mobile phone that the thickness of the mobile phone is difficult to reduce because the speaker is sealed in the casing, and it is easy to fall off when dropped, and provides a packaging structure for the speaker:

一种扬声器的封装结构，包括电路板、固定于电路板上的壳体及收容于壳体内的扬声器本体，在所述电路板上开设有收容部分扬声器本体的收容槽。A packaging structure of a loudspeaker, comprising a circuit board, a casing fixed on the circuit board, and a loudspeaker body accommodated in the casing, and an accommodating groove for accommodating part of the loudspeaker body is opened on the circuit board.

作为本实用新型的一种改进，所述收容槽为切除扬声器被收容部分向电路板的正投影区域而形成的通槽。As an improvement of the utility model, the accommodating groove is a through groove formed by cutting off an orthographic projection area of the accommodated part of the speaker to the circuit board.

作为本实用新型的一种改进，所述收容槽与扬声器被收容的部分形成过渡或者过盈配合。As an improvement of the present invention, the accommodating groove forms a transition or interference fit with the part where the loudspeaker is accommodated.

本实用新型的有益效果在于：通过在电路板上开设收容槽来收容部分扬声器本体，从而降低了发声装置的总高度，并且扬声器本体被收容槽卡紧，增强了发声装置的稳定性。The beneficial effect of the utility model is that: the receiving groove is set on the circuit board to accommodate part of the speaker body, thereby reducing the overall height of the sound generating device, and the speaker body is clamped by the receiving groove, which enhances the stability of the sound generating device.

【附图说明】【Description of drawings】

图1是本实用新型扬声器的封装结构的壳体、扬声器本体、电路板和导电片四者的立体分解图；Fig. 1 is the three-dimensional exploded view of the shell of the package structure of the loudspeaker of the present invention, the loudspeaker body, the circuit board and the conductive sheet;

图2是本实用新型扬声器的封装结构沿图1中电路板上的A-A线的剖视图；Fig. 2 is a sectional view of the packaging structure of the loudspeaker of the present invention along the A-A line on the circuit board in Fig. 1;

图3是本实用新型扬声器的封装结构的剖视图。Fig. 3 is a cross-sectional view of the packaging structure of the loudspeaker of the present invention.

【具体实施方式】【Detailed ways】

下面结合附图和实施方式对本实用新型作进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.

如图1和图2所示，本实用新型提供了一种扬声器的封装结构，该种结构一般用于手机等电子装置中，可以降低手机的整体高度，尤其便于手机的超薄设计，其包括一电路板10、固定于电路板10上的壳体11及收容于壳体11内的扬声器本体12。在所述电路板10上开设有收容部分扬声器本体12的收容槽101，所述收容槽101为切除扬声器本体12被收容部分向电路板10的正投影区域而形成的通槽，这样，所述的扬声器本体12被收容的部分就卡紧在收容槽101中，形成过渡或者过盈配合。从而可以增加扬声器本体12的稳定性，不容易从电路板10上脱落。As shown in Figure 1 and Figure 2, the utility model provides a speaker packaging structure, which is generally used in electronic devices such as mobile phones, can reduce the overall height of the mobile phone, and is especially convenient for the ultra-thin design of the mobile phone, which includes Acircuit board 10 , acasing 11 fixed on thecircuit board 10 , and aspeaker body 12 accommodated in thecasing 11 . Thecircuit board 10 is provided with ahousing groove 101 for accommodating part of thespeaker body 12, and thehousing groove 101 is a through groove formed by cutting out the orthographic projection area of the accommodated part of thespeaker body 12 to thecircuit board 10, so that the The accommodated part of theloudspeaker body 12 is fastened in theaccommodation groove 101 to form a transition or interference fit. Therefore, the stability of thespeaker body 12 can be increased, and it is not easy to fall off from thecircuit board 10 .

如图1和图3所示，所述的扬声器的封装结构还包括一密封泡棉13、泡棉层14、贴紧电路板10的手机显示面板15和导电片16。所述的密封泡棉13夹在扬声器本体12与壳体11之间，用来密封扬声器本体12的前腔的。所述泡棉层14粘接在壳体11与电路板10之间，起到连接和缓冲的作用。所述导电片16嵌设在电路板10上，扬声器本体12的与外界电连接的导线焊接在所述导电片16上从而实现与外界的电信号交流。As shown in FIG. 1 and FIG. 3 , the packaging structure of the speaker further includes asealing foam 13 , afoam layer 14 , a mobilephone display panel 15 and aconductive sheet 16 attached to thecircuit board 10 . The sealingfoam 13 is sandwiched between thespeaker body 12 and thecasing 11 to seal the front cavity of thespeaker body 12 . Thefoam layer 14 is bonded between thehousing 11 and thecircuit board 10 to play the role of connection and buffering. Theconductive sheet 16 is embedded on thecircuit board 10 , and the wires of thespeaker body 12 that are electrically connected to the outside world are welded on theconductive sheet 16 to realize electrical signal communication with the outside world.

在本实用新型中，这种结构是用在手机中，但在实际应用中，这种扬声器的封装结构可以用到各种电子产品中，从而可以减少产品的整体厚度。In this utility model, this structure is used in mobile phones, but in practical applications, this speaker packaging structure can be used in various electronic products, thereby reducing the overall thickness of the product.

以上所述的仅是本实用新型的较佳实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。What has been described above is only a preferred embodiment of the utility model, and it should be pointed out that, for those of ordinary skill in the art, improvements can also be made without departing from the inventive concept of the utility model, but these All belong to the protection scope of the present utility model.

Claims (3)

Translated fromChinese

1.一种扬声器的封装结构，包括电路板、固定于电路板上的壳体及收容于壳体内的扬声器本体，其特征在于：在所述电路板上开设有收容部分扬声器本体的收容槽。1. A packaging structure of a loudspeaker, comprising a circuit board, a housing fixed on the circuit board, and a loudspeaker body accommodated in the housing, characterized in that: the circuit board is provided with a receiving groove for accommodating part of the loudspeaker body.2.根据权利要求1所述的扬声器的封装结构，其特征在于：所述收容槽为切除扬声器被收容部分向电路板的正投影区域而形成的通槽。2 . The packaging structure of the speaker according to claim 1 , wherein the receiving groove is a through groove formed by cutting out an orthographic projection area of the accommodated part of the speaker onto the circuit board. 3 .3.根据权利要求2所述的扬声器的封装结构，其特征在于：所述收容槽与扬声器被收容的部分形成过渡或者过盈配合。3 . The packaging structure of the speaker according to claim 2 , wherein the receiving groove forms a transition or interference fit with the part where the speaker is accommodated. 4 .

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