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CN201868725U - Surface-mounted solid laser and adjusting device - Google Patents

Surface-mounted solid laser and adjusting device
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Publication number
CN201868725U
CN201868725UCN2010205908886UCN201020590888UCN201868725UCN 201868725 UCN201868725 UCN 201868725UCN 2010205908886 UCN2010205908886 UCN 2010205908886UCN 201020590888 UCN201020590888 UCN 201020590888UCN 201868725 UCN201868725 UCN 201868725U
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CN
China
Prior art keywords
solid laser
chip
type solid
parts
pump light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205908886U
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Chinese (zh)
Inventor
鲍光
张瑛
毕勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Sega law firm
Original Assignee
Optoelectronics Technology Co Ltd Of Beijing Zhongshida and Chinese Academy Of
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optoelectronics Technology Co Ltd Of Beijing Zhongshida and Chinese Academy OffiledCriticalOptoelectronics Technology Co Ltd Of Beijing Zhongshida and Chinese Academy Of
Priority to CN2010205908886UpriorityCriticalpatent/CN201868725U/en
Application grantedgrantedCritical
Publication of CN201868725UpublicationCriticalpatent/CN201868725U/en
Anticipated expirationlegal-statusCritical
Expired - Fee Relatedlegal-statusCriticalCurrent

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Abstract

The utility model discloses a surface-mounted solid laser, which comprises an LD (Laser Diode) pump light source and a resonance cavity, wherein the LD pump light source is formed by shaping and compressing optical fibers; and the resonance cavity comprises an incident part and an emergent part which are parallel to each other and are respectively fixed on the same laser substrate. According to the surface-mounted solid laser provided by the utility model, by adopting a plane-plane cavity structure, the adjusting efficiency is improved; and in addition, by dispensing with a pump focusing system and an adjusting part, the size of the surface-mounted solid laser is reduced, so that the surface-mounted solid laser is more convenient to produce and use. The surface-mounted solid laser has more advantages. Furthermore, the utility model also discloses an adjusting device of the surface-mounted solid laser.

Description

A kind of chip-type solid laser and adjusting device
Technical field
The utility model relates to the solid state laser field, more particularly, relates to a kind of chip-type solid laser.Simultaneously, the utility model also relates to a kind of adjusting device.
Background technology
At present, solid state laser is widely used in numerous areas such as military affairs, industry, medical science, commerce, scientific research.And along with the progress of science and technology, these fields are also more and more higher to the performance requirement of laser, and having the stability of height and good laser quality becomes main demand.Therefore, a greater variety of lasers arise at the historic moment.Wherein, laser diode (Laser Diode, be called for short LD) light-pumped solid state laser is exactly wherein a kind of.The LD light-pumped solid state laser has quantum efficiency height, reliability height, long service life, emission wavelength and characteristics such as the laser medium absworption peak is corresponding easily, the laser output beam quality is good.It has had both the major advantage of LD laser and solid state laser, and has remedied some shortcoming of the other side, makes the LD light-pumped solid state laser be better than conventional lights pump solid state laser and LD laser.
General main LD pump light source and the resonant cavity of comprising of the structure of LD light-pumped solid state laser, at present, comparatively Chang Yong resonant cavity mostly is the flat-concave cavity structure, according to resonant theory, the chamber mirror of resonant cavity is parallel in the section at resonance point place each other, flat-concave cavity promptly has only a point and level crossing resonance for a resonant mode on the concave surface, this wastes time and energy with regard to the adjusting that causes flat-concave cavity.In addition, in the process of making above-mentioned solid state laser, generally all be to carry out the modulation of position by the mode of manual adjustments to crystal in the chamber and optical element by various optical elements at present, thereby reach the purpose of output laser.This manufacture method has increased the complexity of making, and influences production efficiency, can not accomplish that continuous-flow type produces fast, is difficult to accomplish scale production, and has influenced the further popularization and the use of LD light-pumped solid state laser.
The utility model content
At the existing shortcoming of solid state laser, the utility model provides a kind of chip-type solid laser, and this kind solid state laser has characteristics such as volume is less, regulations speed is fast.Simultaneously, the invention also discloses the adjusting device of above-mentioned chip-type solid laser.
The utility model solves the problems of the technologies described above specific as follows of the technical scheme of being taked and describes:
A kind of chip-type solid laser, comprise LD pump light source and resonant cavity, described LD pump light source is the LD pump light source of optical fiber shaping compression, described resonant cavity comprises incident parts parallel to each other and outgoing parts, described incident parts and outgoing parts constitute average chamber, and described incident parts and outgoing parts all are fixed on the same laser substrate.
The depth of parallelism between described incident parts and the outgoing parts is not more than 2.5mrad.
Described incident parts are laser crystal, and, be coated with highly reflecting films on the incidence surface of described laser crystal, be coated with high transmission film on its exiting surface.
Described outgoing parts are frequency-doubling crystal or the flat output mirror that is coated with highly reflecting films on the exiting surface.
A kind of adjusting device of chip-type solid laser, be used to adjust described chip-type solid laser, described adjusting device comprises spectroscope, the plane of reference, imaging system and display system, described imaging system connects display system, and, the pump light that sends in the LD pump light source is divided into two-beam after entering described spectroscope, described two-beam enters into described plane of reference resonant cavity body respectively, after the reflection through the described plane of reference and described resonant cavity, enter into again among the described imaging system.
Also be provided with collimating and beam expanding system between described LD pump light source and described spectroscope, the angle of divergence of the light beam behind described collimator and extender is not more than 1.25mrad.
Described collimating and beam expanding system comprises condenser lens and collimating lens, and the back focus of described condenser lens overlaps with the front focus of described collimating lens.
Also be provided with an aperture diaphragm between described collimating and beam expanding system and the described spectroscope.
Owing to adopted technique scheme, made the utility model compare and have the following advantages and good effect with conventional art:
The chip-type solid laser that the utility model provides has overcome the low shortcoming of flat-concave cavity structure regulations speed of traditional some resonant mode, adopted the average cavity configuration of face resonant mode, be two faces resonance all everywhere of coelosis, reduce the process of mating between pump light and the laser cavity film, regulated fast simply, improved the regulations speed of resonant cavity greatly, and, save the pumping focusing system and regulated parts, dwindled device size, made device be more convenient for producing and using.
Description of drawings
By the description of its exemplary embodiment being carried out below in conjunction with accompanying drawing, the above-mentioned feature and advantage of the utility model will become apparent and understand easily.
Fig. 1 is the structural representation of a kind of chip-type solid laser described in the utility model;
Fig. 2 is the structural representation of another kind of chip-type solid laser described in the utility model;
Below in conjunction with the drawings and specific embodiments the utility model is further described.
Embodiment
Fig. 1 is the structural representation of a kind of chip-type solid laser described in the utility model.As shown in Figure 1, this chip-type solid laser comprises LDpump light source 101 and resonant cavity, LDpump light source 101 is LD pump light sources of optical fiber shaping compression, resonant cavity comprisesincident parts 106 parallel to each other andoutgoing parts 107,incident parts 106 andoutgoing parts 107 constitute average chamber, andincident parts 106 andoutgoing parts 107 all are fixed on the same laser substrate.
In the present embodiment,incident parts 106 are chosen laser crystal, scribble on its incidence surface and scribble high transmission film on highly reflecting films, the exiting surface.Outgoing parts 107 are chosen flat output mirror or frequency-doubling crystal.It is average chamber that the S1 face ofincident parts 106 and the S2 face ofoutgoing parts 107 constitute resonant cavity.And, according to resonance principle, laser crystal and flat output mirror all must have high reflectivity to the light of same wavelength, and therefore selected LDpump light source 101 just must be a certain wavelengths, such as the resonance that will form 1064nm, just must select for use the coherent laser of 1064nm as light source.
The adjusting device that also comprises described chip-type solid laser among Fig. 1 comprisesspectroscope 105, the plane ofreference 108,imaging system 110 anddisplay system 111.
Wherein,imaging system 110 connectsdisplay system 111, the pump light that LDpump light source 101 is sent is divided into two-beam after enteringspectroscope 105, this two-beam enters into the plane ofreference 108 resonant cavity bodies respectively, after the reflection through the plane ofreference 108 and resonant cavity, enter intoimaging system 110 and carry out imaging, show bydisplay system 111 then, like this, just can carry out the adjustment of resonant cavity according to the image in thedisplay system 111.
In the present embodiment, it is 50% spectroscope thatspectroscope 105 can be chosen splitting ratio, also can choose the spectroscope of other splitting ratio according to actual conditions.
Further, between LDpump light source 101 andspectroscope 105, a collimating and beam expanding system can also be set, be used for the pump light that LDpump light source 101 is sent collimated and expand bundle, collimating and beam expanding system comprisescondenser lens 102 and collimatinglens 103, and the back focus ofcondenser lens 102 overlaps with the front focus of collimatinglens 103.
Further, between collimating and beam expanding system andspectroscope 105, anaperture diaphragm 104 can also be set, play the effect of confine optical beam, the diameter of choosing aperture diaphragm in the present embodiment is 1mm, but the diameter that also is not limited to aperture diaphragm is 1mm, can come to determine the diameter of aperture diaphragm as the case may be.
Present embodiment is the multichannel pumping for what increase the integrated level employing, and the chip-type solid laser of this average cavity configuration described in the utility model more is applicable to this multichannel pumping.
Because the depth of parallelism of resonant cavity has the greatest impact to last optical effect, therefore, the depth of parallelism of controlling betweenincident parts 106 and theoutgoing parts 107 is not more than 2.5mrad, just needs to make that the angle of divergence through the light beam behind the collimating and beam expanding system is not more than 1.25mrad.The depth of parallelism of preferredincident parts 106 andoutgoing parts 107 is 2.5mrad in the present embodiment, this kind depth of parallelism can reach best when parallel power 90%.
Below in conjunction with above-mentioned adjusting device the manufacture method of chip-type solid laser of the present invention is carried out a detailed description:
The manufacture method of this kind chip-type solid laser mainly comprises the following steps:
Step S101: the light path according to design in advance is provided with above-mentioned LD pump light source and adjusting device.
Particularly, according to each element of placement shown in Figure 1, for example, LDpump light source 101,condenser lens 102,collimating lens 103,aperture diaphragm 104,spectroscope 105,laser crystal 106,flat output mirror 107, the plane ofreference 108,laser substrate 109,imaging system 110,display system 111.
Step S102:incident parts 106 are fixed on the laser substrate.
Step S103: with the incidence surface ofincident parts 106 as datum level,calibration reference face 108.
Particularly, when adjusting the plane ofreference 108, observe the interference fringe in thedisplay system 111, when interference fringe becomes donut, stop to adjust the plane ofreference 108, the plane ofreference 108 is fixing.
Step S104:outgoing parts 107 are positioned on the laser substrate.
Step S105: as datum level, calibrate the exiting surface ofoutgoing parts 107 with the plane ofreference 108.
Particularly,, observe the interference fringe in thedisplay system 111 simultaneously, when interference fringe becomes donut, stop to adjustoutgoing parts 107 in the direction of adjustingoutgoing parts 107,outgoing parts 107 are fixing.
Wherein, whenoutgoing parts 107 are flat output mirror, can adjust by its anchor clamps (not shown) is regulated; Whenoutgoing parts 107 can directly be regulated for frequency-doubling crystal 212.
Step S106:outgoing parts 107 are fixed on the laser substrate, form the chip-type solid laser at last.
Under above-mentioned instruction of the present utility model, those skilled in the art can carry out various improvement and distortion on the basis of the foregoing description, and these improvement or distortion drop in the protection range of the present utility model.It will be understood by those skilled in the art that top specific descriptions just in order to explain the purpose of this utility model, are not to be used to limit the utility model.Protection range of the present utility model is limited by claim and equivalent thereof.
It should be noted last that above embodiment is only unrestricted in order to the explanation the technical solution of the utility model.Although the utility model is had been described in detail with reference to embodiment, those of ordinary skill in the art is to be understood that, the technical solution of the utility model is made amendment or is equal to replacement, the spirit and scope that do not break away from technical solutions of the utility model, it all should be encompassed in the middle of the claim scope of the present utility model.

Claims (8)

CN2010205908886U2010-10-292010-10-29Surface-mounted solid laser and adjusting deviceExpired - Fee RelatedCN201868725U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN2010205908886UCN201868725U (en)2010-10-292010-10-29Surface-mounted solid laser and adjusting device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN2010205908886UCN201868725U (en)2010-10-292010-10-29Surface-mounted solid laser and adjusting device

Publications (1)

Publication NumberPublication Date
CN201868725Utrue CN201868725U (en)2011-06-15

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CN (1)CN201868725U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102457013A (en)*2010-10-292012-05-16北京中视中科光电技术有限公司Surface mount solid laser, adjusting device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102457013A (en)*2010-10-292012-05-16北京中视中科光电技术有限公司Surface mount solid laser, adjusting device and manufacturing method thereof

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Legal Events

DateCodeTitleDescription
C14Grant of patent or utility model
GR01Patent grant
ASSSuccession or assignment of patent right

Owner name:BEIJING GOODWILL LAW FIRM

Free format text:FORMER OWNER: OPTOELECTRONICS TECHNOLOGY CO., LTD. OF BEIJING ZHONGSHIDA + CHINESE ACADEMY OF

Effective date:20140715

C41Transfer of patent application or patent right or utility model
CORChange of bibliographic data

Free format text:CORRECT: ADDRESS; FROM: 100094 HAIDIAN, BEIJING TO: 100010 DONGCHENG, BEIJING

TR01Transfer of patent right

Effective date of registration:20140715

Address after:100010, D building, Fuhua building, No. 8 North Main Street, Beijing, Dongcheng District, Chaoyangmen, 14A

Patentee after:Beijing Sega law firm

Address before:100094, Beijing, Yongfeng Haidian District industrial base, No. 3 North Wing Road, block B, 4 floor

Patentee before:Optoelectronics Technology Co., Ltd. Of Beijing Zhongshida & Chinese Academy Of

CF01Termination of patent right due to non-payment of annual fee
CF01Termination of patent right due to non-payment of annual fee

Granted publication date:20110615

Termination date:20171029


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