CN201487849U - Heat sink substrate for AC LED light source - Google Patents

Abstract

Translated fromChinese

本实用新型公开了一种交流LED光源用散热基板，包括底层、设于底层上能够承受机械及热应力的绝缘层、设于绝缘层上表面且分布有导电线路及电极焊盘的导电层，以及嵌设在散热基板固定槽内的LED光源，其特征在于：所述底层为具有尺寸稳定性及散热性的石墨层，或当底层为常规导热基材时在正对于LED光源热沉下方的底层嵌设有石墨层，并且所述LED光源的热沉穿过固定槽底部与石墨层表面相接触，热沉的四周与绝缘层的绝缘介质相贴合，构成三层结构的散热基板。本实用新型能有效解决印刷电路板的导热性能、电气绝缘性能和机械加工性能，广泛应用于电子器件的热传递介质，提高工作稳定性。

The utility model discloses a heat dissipation substrate for an AC LED light source, which comprises a bottom layer, an insulating layer arranged on the bottom layer capable of bearing mechanical and thermal stress, a conductive layer arranged on the upper surface of the insulating layer and distributed with conductive lines and electrode pads, And the LED light source embedded in the fixed groove of the heat dissipation substrate is characterized in that: the bottom layer is a graphite layer with dimensional stability and heat dissipation, or when the bottom layer is a conventional heat-conducting substrate, it is directly below the heat sink of the LED light source. The bottom layer is embedded with a graphite layer, and the heat sink of the LED light source passes through the bottom of the fixing groove and contacts the surface of the graphite layer, and the surroundings of the heat sink are bonded to the insulating medium of the insulating layer to form a heat dissipation substrate with a three-layer structure. The utility model can effectively solve the heat conduction performance, electrical insulation performance and mechanical processing performance of the printed circuit board, and is widely used in the heat transfer medium of electronic devices to improve the working stability.

Description

Translated fromChinese

交流LED光源用散热基板Heat sink substrate for AC LED light source

技术领域technical field

本实用新型涉及印刷电路板，尤其涉及一种交流LED光源用散热基板结构，属于印刷电路板技术领域。The utility model relates to a printed circuit board, in particular to a heat dissipation substrate structure for an AC LED light source, and belongs to the technical field of printed circuit boards.

背景技术Background technique

在封装技术的发展中，功能提升及缩小化造成发热密度越来越高，一些LED产品只靠封装设计已无法散去足够的热，必须藉由PCB的设计来加强散热功能。目前一般的散热材料所使用的散热片基材(如民用高端电子器件、LED用芯片材料、工业装置用换热器等)几乎都是铝合金，但铝并不是导热系数最高的金属。金和银的导热性能比较好，但缺点就是价格太高。纯铜散热效果次之，但铜片除了造价高之外，重量大、不耐腐蚀等，当铜一旦发生氧化，其导热和散热性能将会大大下降，导致温度过高，增加了LED失效的可能性，造成LED光衰加剧、寿命缩短。In the development of packaging technology, function improvement and miniaturization have resulted in higher and higher heat density. Some LED products cannot dissipate enough heat only by packaging design, and the heat dissipation function must be enhanced by PCB design. At present, the heat sink substrates used in general heat dissipation materials (such as civilian high-end electronic devices, LED chip materials, heat exchangers for industrial equipment, etc.) are almost all aluminum alloys, but aluminum is not the metal with the highest thermal conductivity. Gold and silver have better thermal conductivity, but the disadvantage is that the price is too high. The heat dissipation effect of pure copper is second, but in addition to the high cost, the copper sheet is heavy and not resistant to corrosion. Once the copper is oxidized, its thermal conductivity and heat dissipation performance will be greatly reduced, resulting in high temperature and increasing the LED failure. Possibility, resulting in increased LED light decay and shortened life.

现阶段交流LED光源有一个缺点就是有触电的风险，对于高电压来说(即高于36V的交流电压为非安全电压)对LED光源的散热基板要求更加严格，绝缘性能及其它电气性能的好坏，决定了LED的寿命及对人体或周围环境的是否安全，故交流LED光源如果要应用在LED照明灯具上，应避免金属鳍片的裸露。而常规的铝基印制板性能和结构无法满足要求，一但绝缘失效，后果严重。随着LED科学研究的不断发展和芯片工艺生产水平的不断提升，大功率交流LED封装技术日臻成熟，发光效率得以大大提高，其应用领域不断拓展。因此，如何选择印刷电路板材料绝缘及散热研究已成为目前基板设计的一个重要方向。At this stage, one disadvantage of AC LED light sources is the risk of electric shock. For high voltages (that is, AC voltages higher than 36V are unsafe voltages), the requirements for the heat dissipation substrate of LED light sources are more stringent, and the insulation performance and other electrical properties are good. Damage determines the life of the LED and whether it is safe for the human body or the surrounding environment. Therefore, if the AC LED light source is to be used in LED lighting fixtures, the exposed metal fins should be avoided. However, the performance and structure of conventional aluminum-based printed boards cannot meet the requirements. Once the insulation fails, the consequences will be serious. With the continuous development of LED scientific research and the continuous improvement of the production level of chip technology, high-power AC LED packaging technology is becoming more and more mature, the luminous efficiency can be greatly improved, and its application fields are constantly expanding. Therefore, how to choose printed circuit board material insulation and heat dissipation research has become an important direction of substrate design.

发明内容Contents of the invention

为克服上述现有技术的不足，本实用新型的目的在于提供一种交流LED光源用散热基板，利用石墨层平面纹理状的高热传导性，降低发热点的温度、从而提高交流LED光源的散热性和绝缘安全性。In order to overcome the shortcomings of the above-mentioned prior art, the purpose of this utility model is to provide a heat dissipation substrate for an AC LED light source, which uses the high thermal conductivity of the graphite layer to reduce the temperature of the heating point, thereby improving the heat dissipation of the AC LED light source and insulation safety.

本实用新型的目的通过以下技术方案来实现：The purpose of this utility model is achieved through the following technical solutions:

交流LED光源用散热基板，由下向上依次包括底层、绝缘层和导电层，绝缘层用于承受机械及热应力，导电层设于绝缘层上表面且分布有导电线路及电极焊盘，该散热基板设有固定槽，所述固定槽自上而下透过导电层和绝缘层直达底层，LED光源设在固定槽内，其特征在于：所述底层含有具有尺寸稳定性及散热性的石墨层，所述LED光源的热沉穿过固定槽底部与该石墨层相接触，热沉的四周与石墨层及绝缘层的绝缘介质相贴合。The heat dissipation substrate for AC LED light source includes a bottom layer, an insulating layer and a conductive layer from bottom to top. The insulating layer is used to withstand mechanical and thermal stress. The substrate is provided with a fixing groove, and the fixing groove passes through the conductive layer and the insulating layer from top to bottom to the bottom layer, and the LED light source is arranged in the fixing groove, and the feature is that the bottom layer contains a graphite layer with dimensional stability and heat dissipation , the heat sink of the LED light source passes through the bottom of the fixing groove and is in contact with the graphite layer, and the surrounding of the heat sink is bonded to the insulating medium of the graphite layer and the insulating layer.

进一步地，上述的交流LED光源用散热基板，其中，所述底层即为石墨层；或者，所述底层为金属基或非金属基导热基材，石墨层嵌设于该导热基材之中，其位置与固定槽的分布相对应。Further, in the above-mentioned heat dissipation substrate for AC LED light source, wherein, the bottom layer is a graphite layer; or, the bottom layer is a metal-based or non-metal-based heat-conducting substrate, and the graphite layer is embedded in the heat-conducting substrate, Its position corresponds to the distribution of the fixing grooves.

更进一步地，上述的交流LED光源用散热基板，其中，所述石墨层的厚度大于1mm，其横截面形状为任意几何结构或非几何结构。Furthermore, in the heat dissipation substrate for an AC LED light source above, the thickness of the graphite layer is greater than 1mm, and its cross-sectional shape is any geometric structure or non-geometric structure.

更进一步地，上述的交流LED光源用散热基板，其中，所述导电层的导电线路为铺设在绝缘层上表面的金属铜线，且电极焊盘接设有用金、银、钯制成的导电接点；电源电极焊盘局部涂设铟金合金或金锡合金。Furthermore, in the heat dissipation substrate for the above-mentioned AC LED light source, the conductive line of the conductive layer is a metal copper wire laid on the upper surface of the insulating layer, and the electrode pad is connected with a conductive wire made of gold, silver, or palladium. Contacts; power electrode pads are partially coated with indium-gold alloy or gold-tin alloy.

更进一步地，上述的交流LED光源用散热基板，其中，所述绝缘层的绝缘介质为环氧玻纤布粘结片或环氧树脂聚合物。Furthermore, in the above-mentioned heat dissipation substrate for AC LED light sources, the insulating medium of the insulating layer is an epoxy glass fiber cloth bonding sheet or an epoxy resin polymer.

再进一步地，上述的交流LED光源用散热基板，其中，该散热基板为共用一个底层的双面板，所述底层的上下侧分别设置相对独立的绝缘层和导电层；尤其是，所述散热基板为双面板，上下两侧的固定槽及LED光源错位排布，并且，在每一处LED光源安装部位，底层的另一面裸露。Still further, the heat dissipation substrate for the above-mentioned AC LED light source, wherein the heat dissipation substrate is a double-sided board sharing a bottom layer, and the upper and lower sides of the bottom layer are respectively provided with relatively independent insulating layers and conductive layers; especially, the heat dissipation substrate It is a double-sided panel, the fixing grooves on the upper and lower sides and the LED light source are misplaced, and at each LED light source installation position, the other side of the bottom layer is exposed.

实施本实用新型的技术方案，其有益效果体现在：Implement the technical scheme of the utility model, its beneficial effect is reflected in:

(1)选用石墨材料具有比铝材料更好的导热性，石墨的热传导率超过370W/mK，重量也比铜轻70％，以保持散热器的轻便，散热器通过将热量均匀分布在二维平面来达到散热的目的；(1) The choice of graphite material has better thermal conductivity than aluminum material. The thermal conductivity of graphite exceeds 370W/mK, and the weight is 70% lighter than copper, so as to keep the radiator light. The radiator distributes heat evenly in two dimensions plane to achieve the purpose of heat dissipation;

(2)交流LED光源用散热基板结构的热膨胀率小，具有优异的散热性能，其散热效果卓越；原材料厚度方向的热膨胀系数差异小，受热基材膨胀变化差异小，避免铜线路和金属化孔间断裂而造成破坏；(2) The thermal expansion rate of the heat dissipation substrate structure for AC LED light source is small, with excellent heat dissipation performance, and its heat dissipation effect is excellent; the difference in thermal expansion coefficient in the thickness direction of the raw material is small, and the difference in expansion change of the heated substrate is small, avoiding copper lines and metallized holes damage caused by breakage;

(3)抗热应力性强：石墨在常温下使用时能经受住温度的剧烈变化而不致破坏，温度突变时，石墨的体积变化不大，不会产生裂纹及应力突变；(3) Strong resistance to thermal stress: Graphite can withstand drastic temperature changes without damage when used at room temperature. When the temperature suddenly changes, the volume of graphite does not change much, and no cracks and stress mutations will occur;

(4)石墨材料基板具有高机械强度和韧性，在石墨基板上可实现大面积的印制板的制造，能够有效地克服导电层、基板之间因不同膨胀系数而引起的应力效应，可承受钻孔、冲剪、切割、蚀刻等加工；(4) The graphite material substrate has high mechanical strength and toughness, and the manufacture of large-area printed boards can be realized on the graphite substrate, which can effectively overcome the stress effect caused by different expansion coefficients between the conductive layer and the substrate, and can withstand Drilling, punching, cutting, etching and other processing;

(5)电磁屏蔽性能良好，石墨基板可充当屏蔽板，起到屏蔽电磁波的作用，对于交流电的谐波具有屏蔽效果，在改善电子兼容性方面具有较广阔的应用前景；(5) The electromagnetic shielding performance is good. The graphite substrate can act as a shielding plate to shield electromagnetic waves. It has a shielding effect on the harmonics of alternating current and has a broad application prospect in improving electronic compatibility;

(6)防静电性能较好，石墨材质本身，能够有效扩散静电，防止静电击穿电器元件。(6) The anti-static performance is good. The graphite material itself can effectively diffuse static electricity and prevent static electricity from breaking down electrical components.

为使本实用新型的技术特征及应用后的有益效果更清楚、易于理解，以下结合本实用新型一优选实施例及其附图对本实用新型作进一步地详细说明。In order to make the technical features of the utility model and the beneficial effects after application clearer and easier to understand, the utility model will be further described in detail below in conjunction with a preferred embodiment of the utility model and its accompanying drawings.

附图说明Description of drawings

图1是本实用新型LED光源用散热基板的一种实施例的结构示意图；Fig. 1 is a schematic structural view of an embodiment of a heat dissipation substrate for a LED light source of the present invention;

图2是本实用新型LED光源用散热基板的另一种实施例的结构示意图；Fig. 2 is a schematic structural view of another embodiment of the heat dissipation substrate for the LED light source of the present invention;

图3是本实用新型LED光源用散热基板的又一种实施例的结构示意图。Fig. 3 is a structural schematic diagram of another embodiment of the heat dissipation substrate for the LED light source of the present invention.

具体实施方式Detailed ways

实施例一Embodiment one

如图1所示的本实用新型LED光源用散热基板的结构示意图可见，本实用新型设计并提供一种以石墨作为散热座层的交流LED光源用散热基板。该散热基板的基本结构分为三层，如图1所示，包括LED光源1、导电层2、绝缘层3及底层4。其中导电层2上分布有导电线路以及电源电极焊盘21。中间绝缘层3的绝缘介质一般采用高导热的环氧玻纤布粘结片或者特殊的高导热环氧树脂聚合物；热阻小、粘结性能优良、具有抗热老化的能力，并且能够承受机械及热应力。底层导热层为高导热的石墨层4，具有很强的尺寸稳定性和机械加工性能及优良的散热性。LED光源1嵌入在散热基板固定槽6内，LED光源1的热沉11直接与石墨层4表面紧密接触，热沉11的四周与中间绝缘层3的绝缘介质紧密贴合，构成三层结构的基板结构。As can be seen from the structural schematic diagram of the heat dissipation substrate for the LED light source of the present invention as shown in FIG. 1 , the present invention designs and provides a heat dissipation substrate for the AC LED light source with graphite as the heat dissipation seat layer. The basic structure of the heat dissipation substrate is divided into three layers, as shown in FIG. 1 , including an LED light source 1 , aconductive layer 2 , aninsulating layer 3 and abottom layer 4 . Wherein conductive lines andpower electrode pads 21 are distributed on theconductive layer 2 . The insulating medium of the intermediateinsulating layer 3 generally adopts a high thermal conductivity epoxy glass fiber cloth bonding sheet or a special high thermal conductivity epoxy resin polymer; the thermal resistance is small, the bonding performance is excellent, it has the ability to resist thermal aging, and can withstand mechanical and thermal stress. The bottom heat conduction layer is agraphite layer 4 with high heat conduction, which has strong dimensional stability, machinability and excellent heat dissipation. The LED light source 1 is embedded in the heat dissipationsubstrate fixing groove 6, theheat sink 11 of the LED light source 1 is directly in close contact with the surface of thegraphite layer 4, and the surroundings of theheat sink 11 are closely attached to the insulating medium of the intermediate insulatinglayer 3, forming a three-layer structure. Substrate structure.

其中，该作为底层的石墨层4，其厚度大于1mm，其形状为平面板材，也可以柱形、菱形、方形或其他形状，只要可以与LED光源1热沉座层匹配即可。Wherein, thegraphite layer 4 as the bottom layer has a thickness greater than 1mm, and its shape is a flat plate, and can also be cylindrical, rhombus, square or other shapes, as long as it can match the heat sink layer of the LED light source 1 .

该散热基板的中间绝缘层3的绝缘介质一般采用高导热的环氧玻纤布粘结片或者特殊的高导热环氧树脂聚合物。制作时，石墨的材料表面需要采用机械和化学方法进行预处理，经过去油和水洗，形成清洁平整的平面；通常采用厚度为100～1000μm的高导热的环氧玻纤布粘结片或者特殊的高导热环氧树脂聚合物，配置原料板材树脂胶液，然后将进行压制粘结片，基材的压制过程大体分成升温、保温和降温三个阶段。最后，对表面先进行机械和化学方法预处理，形成光洁平整的平面，然后铺覆薄薄一层的环氧玻璃布，再涂复一层特殊的聚合物构成高导热的环氧玻纤布粘结片板材。The insulating medium of the intermediate insulatinglayer 3 of the heat dissipation substrate generally adopts a high thermal conductivity epoxy glass fiber cloth bonding sheet or a special high thermal conductivity epoxy resin polymer. During production, the surface of graphite material needs to be pretreated by mechanical and chemical methods, and after degreasing and washing, a clean and flat plane is formed; usually, a high thermal conductivity epoxy glass fiber cloth bonding sheet with a thickness of 100-1000 μm or a special The high thermal conductivity epoxy resin polymer is used to configure the raw material board resin glue, and then the bonding sheet will be pressed. The pressing process of the base material is roughly divided into three stages: heating, heat preservation and cooling. Finally, the surface is pretreated by mechanical and chemical methods to form a smooth and flat surface, then a thin layer of epoxy glass cloth is spread, and then a layer of special polymer is applied to form a high thermal conductivity epoxy glass fiber cloth Adhesive sheets.

完成了底层与绝缘层3的制造工序，即可在其外层加工导电层，并布置导电线路，采用机械、超声波或者化学方法对上述半成品层材表面进行预处理，去油污、毛刺，杂质，形成清洁平整的绝缘层；在绝缘层的外面全部覆盖导电层，再在导电层上面蚀刻制作导电线路；或者在绝缘层的外面局部涂覆防护膜，再通过溅射或蒸镀的方法直接制作导电线路。其中，该导电层2的导电线路采用金属铜来制作。但是，根据印刷电路板的应用需求，电极焊盘21还可以使用或在铜层上辅助使用金、银、钯等金属来制作导电线路；电极焊盘21的局部还涂有铟金合金或者金锡合金。After completing the manufacturing process of the bottom layer and theinsulating layer 3, the conductive layer can be processed on the outer layer, and the conductive lines are arranged, and the surface of the above-mentioned semi-finished layer is pretreated by mechanical, ultrasonic or chemical methods to remove oil, burrs, and impurities. Form a clean and flat insulating layer; cover the entire outer surface of the insulating layer with a conductive layer, and then etch on the conductive layer to make conductive lines; or partially coat the outer surface of the insulating layer with a protective film, and then directly make it by sputtering or evaporation Conductive lines. Wherein, the conductive circuit of theconductive layer 2 is made of metal copper. However, according to the application requirements of the printed circuit board, theelectrode pad 21 can also use or assist metals such as gold, silver, and palladium on the copper layer to make conductive lines; the part of theelectrode pad 21 is also coated with indium-gold alloy or gold tin alloy.

除上述单导电层的基板结构外，本实用新型的交流LED光源用散热基板的结构还可为双面板，在底层的下面也可设有导电层及LED光源。In addition to the substrate structure of the above-mentioned single conductive layer, the structure of the heat dissipation substrate for the AC LED light source of the present invention can also be a double-sided board, and a conductive layer and an LED light source can also be provided under the bottom layer.

实施例二Embodiment two

如图2所示的是上述交流LED光源用散热基板结构另一种结构组合方式，此基板结构可以以石墨为导热材料，嵌入在其它金属基或非金属基的导热基材5中，组成混合导热结构的座层，石墨层位于LED光源1的热沉正下方，石墨壁与其它金属基或非金属基的导热基材5过孔壁充分接触，热量沿两侧壁均匀传递，通过将热量均匀分布在二维平面来达到散热的目的。As shown in Figure 2 is another structural combination of the heat dissipation substrate structure for the above-mentioned AC LED light source. This substrate structure can use graphite as a heat-conducting material and be embedded in other metal-based or non-metal-based heat-conductingsubstrates 5 to form a mixed The seat layer of the heat-conducting structure, the graphite layer is located directly below the heat sink of the LED light source 1, the graphite wall is fully in contact with the through-hole wall of other metal-based or non-metal-based heat-conductingsubstrate 5, and the heat is evenly transmitted along the two side walls. Evenly distributed in the two-dimensional plane to achieve the purpose of heat dissipation.

实施例三Embodiment three

除上述单导电层的基板结构外，本实用新型的交流LED光源用散热基板的结构还可为双面板，在底层的下面也可设有导电层及LED光源。In addition to the substrate structure of the above-mentioned single conductive layer, the structure of the heat dissipation substrate for the AC LED light source of the present invention can also be a double-sided board, and a conductive layer and an LED light source can also be provided under the bottom layer.

如图3所示的是上述交流LED光源用散热基板结构又一种结构组合方式，此基板结构与实施例一相近似，均是采用石墨层4作为该散热基板的座层。所不同的是，在石墨层相对于上层LED光源的另一侧错位设置有固定槽6、绝缘层3、导电层2及LED光源。所形成错位使得对应每一个LED光源的散热基板另一面石墨层为裸露状，从而能够更好地取得散热效果。As shown in FIG. 3 , another structural combination of the heat dissipation substrate structure for the above-mentioned AC LED light source is shown. The substrate structure is similar to that of the first embodiment, and thegraphite layer 4 is used as the seat layer of the heat dissipation substrate. The difference is that the fixinggroove 6 , insulatinglayer 3 ,conductive layer 2 and LED light source are arranged on the other side of the graphite layer in dislocation relative to the LED light source on the upper layer. The dislocation formed makes the graphite layer on the other side of the heat dissipation substrate corresponding to each LED light source exposed, so that a better heat dissipation effect can be achieved.

综上所述，交流LED光源用散热基板具有良好的导热性能、电气绝缘性能和机械加工性能。可以取代了传统的铝基板、铜基板；同时，大幅度提高LED光源1的导热效果，相对于金属导热，不仅绝缘性能好，且有更好的电子辐射屏蔽作用，提高了产品可靠性和稳定性，延长了产品的使用寿命，广泛应用于电子器件的热传递介质，提高工作效率。To sum up, the heat dissipation substrate for AC LED light source has good thermal conductivity, electrical insulation performance and mechanical processing performance. It can replace the traditional aluminum substrate and copper substrate; at the same time, it greatly improves the heat conduction effect of LED light source 1. Compared with metal heat conduction, it not only has good insulation performance, but also has better electronic radiation shielding effect, which improves product reliability and stability. It can prolong the service life of the product, and is widely used in the heat transfer medium of electronic devices to improve work efficiency.

当然，以上仅是本实用新型的具体应用范例，对本实用新型的保护范围不构成任何限制。凡采用等同变换或者等效替换而形成的技术方案，均落在本实用新型权利保护范围之内。Of course, the above are only specific application examples of the utility model, and do not constitute any limitation to the protection scope of the utility model. All technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the utility model.

Claims (8)

Translated fromChinese

1.交流LED光源用散热基板，由下向上依次包括底层、绝缘层和导电层，绝缘层用于承受机械及热应力，导电层设于绝缘层上表面且分布有导电线路及电极焊盘，该散热基板设有固定槽，所述固定槽自上而下透过导电层和绝缘层直达底层，LED光源设在固定槽内，其特征在于：所述底层含有具有尺寸稳定性及散热性的石墨层，所述LED光源的热沉穿过固定槽底部与该石墨层相接触，热沉的四周与石墨层及绝缘层的绝缘介质相贴合。1. The heat dissipation substrate for AC LED light source includes bottom layer, insulating layer and conductive layer from bottom to top. The insulating layer is used to withstand mechanical and thermal stress. The conductive layer is set on the upper surface of the insulating layer and is distributed with conductive lines and electrode pads. The heat dissipation substrate is provided with a fixing groove, and the fixing groove penetrates the conductive layer and the insulating layer from top to bottom to reach the bottom layer, and the LED light source is arranged in the fixing groove, and it is characterized in that: the bottom layer contains dimensional stability and heat dissipation The graphite layer, the heat sink of the LED light source passes through the bottom of the fixing groove and is in contact with the graphite layer, and the periphery of the heat sink is bonded to the graphite layer and the insulating medium of the insulating layer.2.根据权利要求1所述的交流LED光源用散热基板，其特征在于：所述底层即为石墨层。2. The heat dissipation substrate for an AC LED light source according to claim 1, wherein the bottom layer is a graphite layer.3.根据权利要求1所述的交流LED光源用散热基板，其特征在于：所述底层为金属基或非金属基导热基材，石墨层嵌设于该导热基材之中，其位置与固定槽的分布相对应。3. The heat dissipation substrate for an AC LED light source according to claim 1, characterized in that: the bottom layer is a metal-based or non-metal-based heat-conducting substrate, and the graphite layer is embedded in the heat-conducting substrate, and its position and fixing The slots are distributed accordingly.4.根据权利要求1或2或3所述的交流LED光源用散热基板，其特征在于：所述石墨层的厚度大于1mm，其横截面形状为任意几何结构或非几何结构。4. The heat dissipation substrate for an AC LED light source according to claim 1, 2 or 3, characterized in that: the thickness of the graphite layer is greater than 1mm, and its cross-sectional shape is any geometric structure or non-geometric structure.5.根据权利要求1或2或3所述的交流LED光源用散热基板，其特征在于：所述导电层的导电线路为铺设在绝缘层上表面的金属铜线，且电极焊盘接设有用金、银、钯制成的导电接点；电源电极焊盘局部涂设铟金合金或金锡合金。5. The heat dissipation substrate for an AC LED light source according to claim 1, 2 or 3, characterized in that: the conductive line of the conductive layer is a metal copper wire laid on the upper surface of the insulating layer, and the electrode pad is connected to Conductive contacts made of gold, silver, and palladium; power electrode pads are partially coated with indium-gold alloy or gold-tin alloy.6.根据权利要求1或2或3所述的交流LED光源用散热基板，其特征在于：所述绝缘层的绝缘介质为环氧玻纤布粘结片或环氧树脂聚合物。6. The heat dissipation substrate for an AC LED light source according to claim 1, 2 or 3, wherein the insulating medium of the insulating layer is an epoxy glass fiber cloth adhesive sheet or an epoxy resin polymer.7.根据权利要求1或2或3所述的交流LED光源用散热基板，其特征在于：该散热基板为共用一个底层的双面板，所述底层的上下侧分别设置相对独立的绝缘层和导电层。7. The heat dissipation substrate for an AC LED light source according to claim 1, 2 or 3, characterized in that: the heat dissipation substrate is a double-sided panel sharing a bottom layer, and relatively independent insulating layers and conductive layers are respectively arranged on the upper and lower sides of the bottom layer. layer.8.根据权利要求7所述的交流LED光源用散热基板，其特征在于：所述散热基板为双面板，上下两侧的固定槽及LED光源错位排布，并且，在每一处LED光源安装部位，底层的另一面裸露。8. The heat dissipation substrate for an AC LED light source according to claim 7, characterized in that: the heat dissipation substrate is a double-sided board, the fixing grooves on the upper and lower sides and the LED light source are arranged in a misplaced position, and each LED light source is installed The other side of the bottom layer is exposed.

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