CN1971260A - Testing method of thermal resistance of heat-conducting material and testing clamp - Google Patents
Testing method of thermal resistance of heat-conducting material and testing clampDownload PDFInfo
- Publication number
- CN1971260A CN1971260ACN 200510101731CN200510101731ACN1971260ACN 1971260 ACN1971260 ACN 1971260ACN 200510101731CN200510101731CN 200510101731CN 200510101731 ACN200510101731 ACN 200510101731ACN 1971260 ACN1971260 ACN 1971260A
- Authority
- CN
- China
- Prior art keywords
- heat
- thermal resistance
- test
- sink unit
- generating units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
Translated fromChinese
Description
Technical field
The present invention relates to technical field of measurement and test, relate in particular to a kind of thermal resistance of heat-conducting material method of testing and test fixture.
Background technology
The high-power day by day and miniaturization along with electron device has brought stern challenge for the heat radiation and the insulation of electron device.The Treatment Design at hot interface is extremely important for the life-span that prolongs heater members and its reliability of enhancing.
When thermal design designs at the heat sink conception analog simulation, often the performance with Heat Conduction Material is to regard invariant as, but in fact Heat Conduction Material is in the condition of high temperature or high low temperature circulation use down basically always, Heat Conduction Material for a long time in the condition of high temperature use meeting too much occur because of silicone oil oozes out driedly exhausting, problem such as heat conduction particle separation, thereby cause the thermal resistance of Heat Conduction Material to increase, and then influence the reliability of electron device.So the unfailing performance test that Heat Conduction Material is carried out under the various environmental baselines seems more and more important.
As shown in Figure 1, the great majority measurement instrument and equipment that temperature conductivity adopted is an integral body that can not be split in the prior art, during test with heat conductive pad, Heat Conduction Material such as heat conducting film or heat-conducting silicone grease 40 places on worktable 30 planes, downwards heat block 20 is pressed onto on the Heat Conduction Material 40 by fixed mechanism 10, give heat block 20 heating then, heat is delivered to Heat Conduction Material 40 by heat block 20, Heat Conduction Material with thermal conduction characteristic is again with the worktable 30 of heat transferred to its underpart, behind the temperature stabilization of to be heated 20 and worktable 30, last point for measuring temperature A that is positioned at heat block and the following point for measuring temperature B that is positioned at worktable are carried out temperature test, and write down the temperature data of going up point for measuring temperature A and following point for measuring temperature B, calculate the heat conductivility of Heat Conduction Material by the power consumption of surveying heat block 20.
Thermal resistance R computing method are: R=Δ T (temperature difference)/P (power consumption)
Temperature conductivity K computing method are: K=h (material thickness)/(thermal resistance R * material area S)
The shortcoming of prior art is:
1, because the thermo-resistance measurement device of Heat Conduction Material is the integral body that can't split, therefore heat block and worktable can not be separated, Heat Conduction Material can't be put environmental test chamber into after fixing on the worktable of testing tool, cause proving installation can only act under the normal temperature, Heat Conduction Material can not be through the test of various environmental baselines such as excess temperature, time, so can not assess the long-term reliability of Heat Conduction Material.
2, because test process carries out under calm condition,, operating temperature is assembled raise, cause the test result low precision if the lower table heat can not loose in time.
Summary of the invention
The invention provides a kind of thermal resistance of heat-conducting material method of testing and test clip anchor clamps, to realize that Heat Conduction Material is carried out thermo-resistance measurement under the varying environment condition.
The present invention solves the problems of the technologies described above the technical scheme that is adopted to be:
This thermal resistance of heat-conducting material method of testing may further comprise the steps:
The test fixture that setting is made up of heat-generating units and heat-sink unit is clamped in Heat Conduction Material between described heat-generating units and the heat-sink unit;
The test fixture of clamping Heat Conduction Material is placed in the environmental test chamber, and the parameter that environmental test chamber is set is carried out environmental test;
To test fixture,, conduct heat to heat-sink unit by Heat Conduction Material, and the temperature of heat-generating units and heat-sink unit is measured respectively by the heat-generating units heating through environmental test;
When temperature stabilization, calculate the power consumption of heat-generating units and the temperature difference of heat-generating units and heat-sink unit, thereby calculate thermal resistance.
Described environmental test chamber parameter comprises the environmental test chamber temperature parameter at least, perhaps further comprises time parameter.
Described environmental test is undertaken by in described environmental test chamber parameter different parameter values being set, and tests and calculate the thermal resistance of Heat Conduction Material respectively, and test result is compared the thermal resistance reliability of estimating Heat Conduction Material.
Described heat-generating units can adopt and comprise heat-conducting metal body and the heat-generating electronic elements that is fixed on this heat-conducting metal body.Described heat-generating electronic elements can adopt voltage stabilizing diode, and described heat-conducting metal body can adopt copper billet, and the voltage stabilizing diode bottom is welded on the described copper billet.
Described heat-sink unit can be made up of a heat-conducting metal body and the heat radiator that is installed in this heat-conducting metal body bottom.When carrying out temperature test, can adopt the cooling of lowering the temperature of external refrigeration mode to described heat-sink unit.The external refrigeration mode can be to adopt fan that heat-sink unit is cooled off.
Corresponding a kind of thermal resistance of heat-conducting material test fixture, comprise heat-generating units and heat-sink unit, heat-generating units and heat-sink unit have the heat-conducting metal body that is used for the clamping Heat Conduction Material respectively, on the heat-conducting metal body of described heat-generating units heat-generating electronic elements is set, the heat-conducting metal body bottom of described heat-sink unit is provided with heat radiator.
Described heat-generating electronic elements can adopt voltage stabilizing diode, and the heat-conducting metal body of described heat-generating units can adopt copper billet, and described voltage stabilizing diode bottom is welded on the described copper billet.
Beneficial effect of the present invention is: the invention provides a kind of test thermal resistance of heat-conducting material method, and a kind of test fixture that can satisfy hot environment is provided; Heat Conduction Material actual application environment condition can be provided, Heat Conduction Material is carried out testing its thermal resistance again after the hot test in environmental test chamber, thereby record the performance change behind the Heat Conduction Material process varying environment condition test, assessing for the long-term reliability of Heat Conduction Material provides a kind of feasible method of testing and anchor clamps.And, utilize heat-sink unit of the present invention soon heat to be loose, can not cause temperature to assemble, improved measuring accuracy.
Description of drawings
Fig. 1 is existing testing tool principle of work synoptic diagram;
Fig. 2 is a test philosophy synoptic diagram of the present invention;
Fig. 3 is a heating unit heater circuit synoptic diagram of the present invention;
Fig. 4 is a heating unit structural representation of the present invention;
Fig. 5 is a heating unit plan structure synoptic diagram of the present invention;
Fig. 6 is a test fixture structural representation of the present invention;
Fig. 7 tests the syndeton synoptic diagram for the present invention.
Embodiment
With embodiment the present invention is described in further detail with reference to the accompanying drawings below:
As Fig. 2 and shown in Figure 7, the invention provides a kind of thermal resistance of heat-conducting material method for testing reliability, may further comprise the steps:
The test fixture that can put into environmental test chamber that setting is made up of heat-generatingunits 50 and heat-sink unit 60 is clamped in Heat Conduction Material 40 between described heat-generatingunits 50 and the heat-sink unit 60;
The test fixture of clamping Heat Conduction Material 40 is put into environmental test chamber, and the parameter that environmental test chamber is set is carried out environmental test;
From environmental test chamber, take out test fixture, be cooled to begin to test behind the normal temperature, conduct heat to heat-sink unit 60 by heat-generatingunits 50 heating and by Heat Conduction Material 40, and adopt temperature measuring device that the heat-generatingunits 50 and the temperature of heat-sink unit 60 are measured respectively;
When temperature stabilization, calculate the power consumption of heat-generatingunits 50 and the temperature difference of heat-generatingunits 50 and heat-sink unit 60, thereby carry out data processing, calculate thermal resistance.
The environmental test chamber parameter can comprise temperature and time, different environmental test chamber parameters is set carries out environmental test respectively, such as 50 ℃ of environmental test chamber temperature are set, time is to carry out environmental test in 2 hours, after environmental test finishes, the test fixture taking-up is cooled to normal temperature, test is also calculated thermal resistance, and then through the environmental test under the different parameters, such as 60 ℃ of environmental test chamber temperature are set, time after being 3 hours takes out test fixture, is cooled to test and calculate thermal resistance again behind the normal temperature, each test result is compared, the thermal resistance that just obtains Heat Conduction Material changes, thereby the performance change behind the assessment Heat Conduction Material process varying environment condition test is assessed the long-term reliability of Heat Conduction Material.
As shown in Figure 4 and Figure 5, heat-generating units 50 comprises heat-generating electronic elements (adopting voltage stabilizing diode 51) and heat-conductingmetal body 53 as copper billet, andvoltage stabilizing diode 51 bottoms are welded on the copper billet, because scoldingtin 52 thermal conductivity ratios are higher, so little to the test result influence.Because the general area of voltage stabilizing diode is all very little, if directly to the Heat Conduction Material heating, the upper and lower temperature difference value that then tests out is very little, for improving measuring accuracy, so the present invention adds the metal that the large tracts of land temperature conductivity is high below voltage stabilizing diode,voltage stabilizing diode 51 bottoms are welded on thecopper billet 53.
Heat-generating units when heating, can adopt circuit as shown in Figure 3voltage stabilizing diode 51 to be powered up according to the load voltage value of load, generate heat after the voltage stabilizing diode work, bycopper billet 53 with thermal conductance to Heat Conduction Material 40.And, calculate the power consumption of heat-generating units according to the voltage of this current value andvoltage stabilizing diode 51 by the galvanometer detected current value.
Heat-sink unit 60 is made up of heat-conductingmetal body 61 and theheat radiator 62 that is installed in heat-conductingmetal body 61 bottoms, is dispelled the heat by heat radiator 62.When carrying out temperature test, can adopt the cooling of lowering the temperature of external refrigeration mode to described heat-sink unit, as adopting the cooling of drying of 70 pairs of heat-sink units 60 of fan.Utilizeheat radiator 62 and fan 70 that following heat can be loose very soon, make upper and lower temperature difference big like this, obtain ideal results easily, otherwise upper and lower temperature difference is too little, thermal behavior can not compare well.
When carrying out temperature test, adopt temperature measurer respectively the temperature of last test point C (voltage stabilizing diode housing) and following test point D (heat-sink unit) to be tested by thermopair 81,82, when temperature stabilization, read temperature value, carry out the calculating of thermal resistance according to the temperature difference and power consumption.
Thermal resistance R=Δ T (temperature difference)/P (power consumption)
Temperature conductivity K=h (material thickness)/(thermal resistance R * material area S)
As shown in Figure 6, the present invention also provides a kind of thermal resistance of heat-conducting material reliability testing anchor clamps, comprise heat-generatingunits 50 and heat-sink unit 60, heat-generatingunits 50 and heat-sink unit 60 have the heat-conductingmetal body metal body 53 of heat-generatingunits 50 heat-generating electronic elements is set, heat-conductingmetal body 61 bottoms of heat-sink unit 60 are provided withheat radiator 62, and the size of heat-generatingunits 50 and heat-sink unit 60 can be put into environmental test chamber after making its clamping Heat Conduction Material 40.Heat-generating electronic elements can adoptvoltage stabilizing diode 51, and the heat-conductingmetal body 53 of heat-generatingunits 50 can adopt copper billet, andvoltage stabilizing diode 51 bottoms are welded on the described copper billet.
Heat Conduction Material 40 has a variety of forms, and as materials such as heat conductive pad, heat conducting film, heat-conducting glue, heat-conducting silicone greases, size can be selected and heat-conductingmetal body 53 bottom area equal and opposite in directions.Different Heat Conduction Material mounting meanss is different, and heat conductive pad, heat conducting film can directly stick, and heat-conducting glue, heat-conducting silicone grease then need coating method.
Utilize test process of the present invention can adopt following form:
1) at first the voltage stabilizing diode bottom is welded on the copper billet of heat-generating units;
2) Heat Conduction Material is installed in heat-sink unit derby surface;
3) will weld good copper billet bottom again and be pressed onto the Heat Conduction Material surface, form a test fixture;
4) then test fixture is put in the environmental test chamber;
5) parameter (temperature, time) that environmental test chamber is set is carried out environmental test;
6) by the time setting-up time test fixture is taken out;
7) connect input signal (offering the voltage of voltage stabilizing diode), temperature measuring device, fan power supply etc. and start working, promptly energising back voltage stabilizing diode, fan are started working, and temperature measurer begins to collect data.
8) treat that the monitoring temperature of upper and lower monitoring point is stable after, note data;
9) calculate thermal resistance;
10), repeat 4 again according to different environmental baselines)～9 step, compare after calculating thermal resistance respectively, if find at environmental test chamber greatlyyer, this thermal resistance of heat-conducting material poor reliability is described then through hot test after heat resistiveization.
The invention provides the reliability method of a kind of test thermal resistance of heat-conducting material, and a kind of test fixture that can satisfy hot environment is provided; Heat Conduction Material actual application environment condition can be provided, can in environmental test chamber, carry out testing its thermal resistance after the hot test to Heat Conduction Material, thereby record Heat Conduction Material through the performance change after testing under the varying environment condition, assessing for the long-term reliability of Heat Conduction Material provides a kind of feasible method of testing and anchor clamps.Utilize heat-sink unit of the present invention soon heat to be loose, can not cause temperature to assemble like this, improved measuring accuracy.
Those skilled in the art do not break away from essence of the present invention and spirit, can there be the various deformation scheme to realize the present invention, the above only is the preferable feasible embodiment of the present invention, be not so limit to interest field of the present invention, the equivalence that all utilizations instructions of the present invention and accompanying drawing content are done changes, and all is contained within the interest field of the present invention.
Claims (10)
1, a kind of thermal resistance of heat-conducting material method of testing is characterized in that, may further comprise the steps:
The test fixture that setting is made up of heat-generating units and heat-sink unit is clamped in Heat Conduction Material between described heat-generating units and the heat-sink unit;
The test fixture of clamping Heat Conduction Material is placed in the environmental test chamber, and the parameter that environmental test chamber is set is carried out environmental test;
To test fixture,, conduct heat to heat-sink unit by Heat Conduction Material, and the temperature of heat-generating units and heat-sink unit is measured respectively by the heat-generating units heating through environmental test;
When temperature stabilization, calculate the power consumption of heat-generating units and the temperature difference of heat-generating units and heat-sink unit, thereby calculate thermal resistance.
2, thermal resistance of heat-conducting material method of testing according to claim 1 is characterized in that: described environmental test chamber parameter comprises the environmental test chamber temperature parameter at least, perhaps further comprises time parameter.
3, thermal resistance of heat-conducting material method of testing according to claim 2, it is characterized in that: described environmental test is undertaken by in described environmental test chamber parameter different parameter values being set, test and calculate the thermal resistance of Heat Conduction Material respectively, and test result is compared the thermal resistance reliability of estimating Heat Conduction Material.
4, according to claim 1,2 or 3 described thermal resistance of heat-conducting material method of testings, it is characterized in that: described heat-generating units comprises heat-conducting metal body and the heat-generating electronic elements that is fixed on this heat-conducting metal body.
5, thermal resistance of heat-conducting material method of testing according to claim 4 is characterized in that: described heat-generating electronic elements adopts voltage stabilizing diode, and described heat-conducting metal body adopts copper billet, and the voltage stabilizing diode bottom is welded on the described copper billet.
6, thermal resistance of heat-conducting material method of testing according to claim 4 is characterized in that: described heat-sink unit is made up of a heat-conducting metal body and the heat radiator that is installed in this heat-conducting metal body bottom.
7, thermal resistance of heat-conducting material method of testing according to claim 6 is characterized in that: when carrying out temperature test, described heat-sink unit is adopted the cooling of lowering the temperature of external refrigeration mode.
8, thermal resistance of heat-conducting material method of testing according to claim 7 is characterized in that: described external refrigeration mode is cooled off heat-sink unit for adopting fan.
9, a kind of thermal resistance of heat-conducting material test fixture, it is characterized in that: comprise heat-generating units and heat-sink unit, heat-generating units and heat-sink unit have the heat-conducting metal body that is used for the clamping Heat Conduction Material respectively, on the heat-conducting metal body of described heat-generating units heat-generating electronic elements is set, the heat-conducting metal body bottom of described heat-sink unit is provided with heat radiator.
10, thermal resistance of heat-conducting material test fixture according to claim 9, it is characterized in that: described heat-generating electronic elements adopts voltage stabilizing diode, the heat-conducting metal body of described heat-generating units adopts copper billet, and described voltage stabilizing diode bottom is welded on the described copper billet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510101731ACN100578206C (en) | 2005-11-21 | 2005-11-21 | A thermal resistance test method and test fixture of a thermally conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510101731ACN100578206C (en) | 2005-11-21 | 2005-11-21 | A thermal resistance test method and test fixture of a thermally conductive material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1971260Atrue CN1971260A (en) | 2007-05-30 |
| CN100578206C CN100578206C (en) | 2010-01-06 |
Family
ID=38112180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510101731AExpired - Fee RelatedCN100578206C (en) | 2005-11-21 | 2005-11-21 | A thermal resistance test method and test fixture of a thermally conductive material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100578206C (en) |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373179B (en)* | 2007-08-22 | 2010-12-22 | 精英电脑股份有限公司 | Heat resistance detection device for heat dissipation module |
| CN102221566A (en)* | 2011-03-31 | 2011-10-19 | 北京大学 | Method for testing thermal boundary resistance between different materials by utilizing DC source |
| CN102297760A (en)* | 2010-06-25 | 2011-12-28 | 康佳集团股份有限公司 | Test method and design method of cooling fin of power device, and analog resistor |
| CN102621182A (en)* | 2012-04-12 | 2012-08-01 | 北京大学 | One-dimensional boundary to three-dimensional boundary thermal resistance test structure and method thereof |
| CN102621179A (en)* | 2012-03-20 | 2012-08-01 | 北京航空航天大学 | Device and method for measuring heat conductivity coefficient of barred body material |
| CN102636477A (en)* | 2012-04-18 | 2012-08-15 | 北京大学 | Testing method of one-dimension to three-dimensional thermal boundary resistance caused by dimension saltation |
| CN102680512A (en)* | 2012-05-10 | 2012-09-19 | 北京工业大学 | Method for measuring interface contact heat resistance |
| CN102735707A (en)* | 2011-03-30 | 2012-10-17 | 财团法人工业技术研究院 | Test unit and measurement method thereof |
| CN102759544A (en)* | 2012-07-06 | 2012-10-31 | 东南大学 | Method for testing thermal resistance of high-power silicon carbide diode |
| CN103364431A (en)* | 2012-04-10 | 2013-10-23 | 中兴通讯股份有限公司 | Thermal resistance testing method and thermal resistance testing device |
| CN103454568A (en)* | 2013-09-03 | 2013-12-18 | 南京华鼎电子有限公司 | Method for monitoring running state of LED illuminating lamp through temperature measurement |
| CN103543174A (en)* | 2013-10-30 | 2014-01-29 | 工业和信息化部电子第五研究所 | Testing method and system of junction-loop thermal resistance |
| CN104237300A (en)* | 2014-08-27 | 2014-12-24 | 北京时代民芯科技有限公司 | Fixture and method for testing steady state thermal resistance of glass sealed surface-mount diode |
| CN104470114A (en)* | 2014-12-01 | 2015-03-25 | 苏州立瓷电子技术有限公司 | Power supply circuit of LED lamp thermal resistance measurement system |
| CN104582426A (en)* | 2013-10-28 | 2015-04-29 | 联合汽车电子有限公司 | Modularized heat dissipation source device, thermal resistance measurement system with same and measurement method |
| CN105301049A (en)* | 2015-11-18 | 2016-02-03 | 东华大学 | Textile structure heat dissipator thermal resistance testing apparatus and textile structure heat dissipator thermal resistance testing method |
| CN105606647A (en)* | 2016-03-23 | 2016-05-25 | 华南理工大学 | Device and method for detecting thermal migration performance of interconnected welding spots |
| CN106872898A (en)* | 2017-02-06 | 2017-06-20 | 中国第汽车股份有限公司 | Electrokinetic cell monomer interface thermal resistance method for rapidly testing |
| CN106970109A (en)* | 2017-05-05 | 2017-07-21 | 核工业理化工程研究院 | A kind of equipment for measuring thermal conductivity of material |
| CN108072680A (en)* | 2018-01-19 | 2018-05-25 | 林荣铨 | A kind of use for laboratory heat conductivity of heat-conduction silicone grease evaluating apparatus |
| CN108242884A (en)* | 2016-12-23 | 2018-07-03 | 北京天诚同创电气有限公司 | Photovoltaic inverter system grid-connected single channel MPPT and its short-circuit protection method |
| CN105241921B (en)* | 2015-11-07 | 2018-09-04 | 北京工业大学 | A kind of method and device of nondestructive measurement travelling-wave tubes thermal resistance |
| CN109030552A (en)* | 2018-07-10 | 2018-12-18 | 西南交通大学 | Thermoelectricity parameter test device and system |
| CN109211963A (en)* | 2017-06-30 | 2019-01-15 | 上海新微技术研发中心有限公司 | System and method for detecting thermal resistance of heat-conducting material |
| CN109406567A (en)* | 2018-09-29 | 2019-03-01 | 珠海格力电器股份有限公司 | Testing device for thermal resistance of heat dissipation material |
| CN109570811A (en)* | 2019-01-02 | 2019-04-05 | 北京工业大学 | A kind of method and device detecting trapezium structure workpiece welding quality |
| CN109975352A (en)* | 2019-04-18 | 2019-07-05 | 重庆大学 | Defect detection device based on thermal resistance |
| CN110687159A (en)* | 2019-09-12 | 2020-01-14 | 无锡江南计算技术研究所 | Thermal resistance measuring device and method for thermal grease |
| CN114878634A (en)* | 2022-06-17 | 2022-08-09 | 珠海格力电器股份有限公司 | Thermal resistance detection system and method for heat conduction material |
- 2005
- 2005-11-21CNCN200510101731Apatent/CN100578206C/ennot_activeExpired - Fee Related
Cited By (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101373179B (en)* | 2007-08-22 | 2010-12-22 | 精英电脑股份有限公司 | Heat resistance detection device for heat dissipation module |
| CN102297760A (en)* | 2010-06-25 | 2011-12-28 | 康佳集团股份有限公司 | Test method and design method of cooling fin of power device, and analog resistor |
| CN102297760B (en)* | 2010-06-25 | 2015-06-17 | 康佳集团股份有限公司 | Test method and design method of cooling fin of power device, and analog resistor |
| CN102735707A (en)* | 2011-03-30 | 2012-10-17 | 财团法人工业技术研究院 | Test unit and measurement method thereof |
| CN102221566B (en)* | 2011-03-31 | 2013-04-10 | 北京大学 | Method for testing thermal boundary resistance between different materials by utilizing DC source |
| CN102221566A (en)* | 2011-03-31 | 2011-10-19 | 北京大学 | Method for testing thermal boundary resistance between different materials by utilizing DC source |
| CN102621179A (en)* | 2012-03-20 | 2012-08-01 | 北京航空航天大学 | Device and method for measuring heat conductivity coefficient of barred body material |
| CN103364431A (en)* | 2012-04-10 | 2013-10-23 | 中兴通讯股份有限公司 | Thermal resistance testing method and thermal resistance testing device |
| CN102621182A (en)* | 2012-04-12 | 2012-08-01 | 北京大学 | One-dimensional boundary to three-dimensional boundary thermal resistance test structure and method thereof |
| CN102636477A (en)* | 2012-04-18 | 2012-08-15 | 北京大学 | Testing method of one-dimension to three-dimensional thermal boundary resistance caused by dimension saltation |
| CN102680512A (en)* | 2012-05-10 | 2012-09-19 | 北京工业大学 | Method for measuring interface contact heat resistance |
| CN102759544A (en)* | 2012-07-06 | 2012-10-31 | 东南大学 | Method for testing thermal resistance of high-power silicon carbide diode |
| CN102759544B (en)* | 2012-07-06 | 2014-04-16 | 东南大学 | Method for testing thermal resistance of high-power silicon carbide diode |
| CN103454568A (en)* | 2013-09-03 | 2013-12-18 | 南京华鼎电子有限公司 | Method for monitoring running state of LED illuminating lamp through temperature measurement |
| CN103454568B (en)* | 2013-09-03 | 2015-09-09 | 南京华鼎电子有限公司 | A method for monitoring the operating state of LED lighting lamps through temperature measurement |
| CN104582426A (en)* | 2013-10-28 | 2015-04-29 | 联合汽车电子有限公司 | Modularized heat dissipation source device, thermal resistance measurement system with same and measurement method |
| CN104582426B (en)* | 2013-10-28 | 2017-09-12 | 联合汽车电子有限公司 | Utilize the method for testing of the thermo-resistance measurement system with modularization radiating source device |
| CN103543174A (en)* | 2013-10-30 | 2014-01-29 | 工业和信息化部电子第五研究所 | Testing method and system of junction-loop thermal resistance |
| CN103543174B (en)* | 2013-10-30 | 2015-05-13 | 工业和信息化部电子第五研究所 | Testing method and system of junction-loop thermal resistance |
| CN104237300A (en)* | 2014-08-27 | 2014-12-24 | 北京时代民芯科技有限公司 | Fixture and method for testing steady state thermal resistance of glass sealed surface-mount diode |
| CN104470114A (en)* | 2014-12-01 | 2015-03-25 | 苏州立瓷电子技术有限公司 | Power supply circuit of LED lamp thermal resistance measurement system |
| CN105241921B (en)* | 2015-11-07 | 2018-09-04 | 北京工业大学 | A kind of method and device of nondestructive measurement travelling-wave tubes thermal resistance |
| CN105301049A (en)* | 2015-11-18 | 2016-02-03 | 东华大学 | Textile structure heat dissipator thermal resistance testing apparatus and textile structure heat dissipator thermal resistance testing method |
| CN105301049B (en)* | 2015-11-18 | 2018-11-13 | 东华大学 | Textile structural heat radiator thermal resistance test device and method |
| CN105606647B (en)* | 2016-03-23 | 2018-06-22 | 华南理工大学 | A kind of apparatus and method for detecting interconnection solder joint thermal mobility energy |
| CN105606647A (en)* | 2016-03-23 | 2016-05-25 | 华南理工大学 | Device and method for detecting thermal migration performance of interconnected welding spots |
| CN108242884A (en)* | 2016-12-23 | 2018-07-03 | 北京天诚同创电气有限公司 | Photovoltaic inverter system grid-connected single channel MPPT and its short-circuit protection method |
| CN108242884B (en)* | 2016-12-23 | 2020-03-10 | 北京天诚同创电气有限公司 | Photovoltaic inverter system for one-way MPPT grid connection and short-circuit protection method thereof |
| CN106872898A (en)* | 2017-02-06 | 2017-06-20 | 中国第汽车股份有限公司 | Electrokinetic cell monomer interface thermal resistance method for rapidly testing |
| CN106970109A (en)* | 2017-05-05 | 2017-07-21 | 核工业理化工程研究院 | A kind of equipment for measuring thermal conductivity of material |
| CN106970109B (en)* | 2017-05-05 | 2024-01-05 | 核工业理化工程研究院 | Equipment for measuring heat conduction property of material |
| CN109211963A (en)* | 2017-06-30 | 2019-01-15 | 上海新微技术研发中心有限公司 | System and method for detecting thermal resistance of heat-conducting material |
| CN109211963B (en)* | 2017-06-30 | 2021-03-26 | 上海新微技术研发中心有限公司 | System and method for detecting thermal resistance of heat-conducting material |
| CN108072680A (en)* | 2018-01-19 | 2018-05-25 | 林荣铨 | A kind of use for laboratory heat conductivity of heat-conduction silicone grease evaluating apparatus |
| CN109030552A (en)* | 2018-07-10 | 2018-12-18 | 西南交通大学 | Thermoelectricity parameter test device and system |
| CN109030552B (en)* | 2018-07-10 | 2024-03-08 | 西南交通大学 | Thermoelectric parameter testing device and system |
| CN109406567A (en)* | 2018-09-29 | 2019-03-01 | 珠海格力电器股份有限公司 | Testing device for thermal resistance of heat dissipation material |
| CN109570811A (en)* | 2019-01-02 | 2019-04-05 | 北京工业大学 | A kind of method and device detecting trapezium structure workpiece welding quality |
| CN109975352A (en)* | 2019-04-18 | 2019-07-05 | 重庆大学 | Defect detection device based on thermal resistance |
| CN110687159A (en)* | 2019-09-12 | 2020-01-14 | 无锡江南计算技术研究所 | Thermal resistance measuring device and method for thermal grease |
| CN110687159B (en)* | 2019-09-12 | 2022-06-10 | 无锡江南计算技术研究所 | Thermal resistance measuring device and method for thermal grease |
| CN114878634A (en)* | 2022-06-17 | 2022-08-09 | 珠海格力电器股份有限公司 | Thermal resistance detection system and method for heat conduction material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100578206C (en) | 2010-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100578206C (en) | A thermal resistance test method and test fixture of a thermally conductive material | |
| CN101290299B (en) | Variable thermal conductivity factor measuring apparatus and method | |
| CN103076551B (en) | A kind of LED lamp thermal resistance forms proving installation and method | |
| CN102297877B (en) | Device and method for measuring thermoelectric parameters of film | |
| JP7121953B2 (en) | Board evaluation chip and board evaluation device | |
| CN201016946Y (en) | A thermal conductivity material parameter testing device | |
| CN107490736B (en) | A method and device for non-destructively measuring the internal temperature and thermal resistance of an electronic function module | |
| CN104730295A (en) | Clamp for thermal resistance test of SMD packaged semiconductor device | |
| CN109490355A (en) | A kind of method of test device of thermal conductivity coefficient and heat conducting coefficient measuring | |
| Barako et al. | A reliability study with infrared imaging of thermoelectric modules under thermal cycling | |
| CN110879623A (en) | Single-particle test temperature control device with correction function and temperature control method | |
| JPS62267676A (en) | Semiconductor device evaluation equipment | |
| CN108387601B (en) | Device and method for measuring thermal resistance of high-heat-conducting-piece-metal heat sink interface | |
| CN204479621U (en) | A kind of SMD encapsulated semiconductor device thermo-resistance measurement fixture | |
| CN114544699B (en) | Method for testing thermal resistance and thermal conductivity coefficient of material | |
| CN104076265B (en) | A kind of method and apparatus of quick measurement semiconductor devices electrical parameter temperature varying coefficient | |
| TW200900961A (en) | Method for simulating thermal resistance value of thermal test die | |
| JP7229575B1 (en) | test equipment | |
| CN218782224U (en) | Testing device for evaluating performance of corrugated ribbon heat transfer device | |
| Bosch et al. | Accurate measurement of interface thermal resistance by means of a transient method | |
| CN116183662A (en) | A heat dissipation performance testing device and a heat dissipation performance testing method of thermal conductive silicone grease | |
| CN114878634A (en) | Thermal resistance detection system and method for heat conduction material | |
| CN219065346U (en) | A heat dissipation performance testing device | |
| Shtennikov et al. | Optimization of the required temperature of contact soldering of electronic devices | |
| CN117451388B (en) | Experimental instrument for measuring conversion performance of large-size thermoelectric chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee | Granted publication date:20100106 Termination date:20161121 |