CN1890779B - Exposure apparatus, exposure method and device manufacturing method - Google Patents

Abstract

The exposure apparatus is an apparatus that irradiates Exposure Light (EL) onto a substrate (P) via a projection optical system (PL) and a liquid (1) to expose the substrate (P). The exposure apparatus has a substrate stage (PT) for holding the substrate (P). A plate member (30) having a liquid-repellent flat surface (30A) is replaceably attached to the substrate stage (PT) to prevent liquid from remaining and maintain good exposure accuracy.

Description

Translated fromChinese

曝光装置、曝光方法和器件制造方法Exposure apparatus, exposure method and device manufacturing method

技术领域technical field

本发明涉及经液体在基片上照射曝光光以对基片曝光的曝光装置、曝光方法和器件制造方法。此外，本发明涉及使用了液浸法的投影曝光装置中使用的光学部件和使用了该光学部件的投影曝光装置。再者，本发明涉及适合于在与液体或气体接触的环境下使用的光学部件。The present invention relates to an exposure device, an exposure method and a device manufacturing method for exposing a substrate by irradiating exposure light through a liquid. Moreover, this invention relates to the optical member used for the projection exposure apparatus which used the liquid immersion method, and the projection exposure apparatus using this optical member. Furthermore, the present invention relates to optical components suitable for use in environments in contact with liquids or gases.

背景技术Background technique

利用将在掩模上形成的图案转印到感光性的基片上的所谓的光刻的方法来制造半导体器件或液晶显示器件。在该光刻工序中使用的曝光装置具有支撑掩模的掩模台和支撑基片的基片台，一边逐次移动掩模台和基片台，一边经投影光学系统将掩模的图案转印到基片上。近年来，为了与器件图案的进一步的高集成化相对应，希望实现投影光学系统的进一步的高解像度化。所使用的曝光波长越短，此外投影光学系统的数值孔径越大，投影光学系统的解像度越高。因此，在曝光装置中使用的曝光波长逐年缩短，投影光学系统的数值孔径也越来越增大。而且，现在主流的曝光波长是KrF准分子激光器的248nm，而波长更短的ArF准分子激光器的193nm也正在实现实用化。此外，在进行曝光时，与解像度同样，聚焦深度(DOF)也变得重要。解像度R和聚焦深度δ分别用以下的式来表示。A semiconductor device or a liquid crystal display device is manufactured by a so-called photolithography method of transferring a pattern formed on a mask to a photosensitive substrate. The exposure apparatus used in this photolithography process has a mask stage that supports the mask and a substrate stage that supports the substrate, and transfers the pattern of the mask through the projection optical system while moving the mask stage and the substrate stage sequentially. onto the substrate. In recent years, in order to cope with the further high integration of device patterns, it is desired to achieve further high resolution of projection optical systems. The shorter the exposure wavelength used, and the larger the numerical aperture of the projection optical system, the higher the resolution of the projection optical system. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. Moreover, the current mainstream exposure wavelength is 248nm of KrF excimer laser, and 193nm of ArF excimer laser with shorter wavelength is also being put into practical use. In addition, when performing exposure, the depth of focus (DOF) becomes important as well as the resolution. The resolution R and the depth of focus δ are represented by the following equations, respectively.

R＝k₁·λ/NA      ...(1)R=k₁ ·λ/NA...(1)

δ＝±k₂·λ/NA²  ...(2)δ=±k₂ ·λ/NA² ...(2)

在此，λ是曝光波长，NA是投影光学系统的数值孔径，k₁、k₂ 是工艺系数。根据(1)式、(2)式可知，如果为了提高解像度R而 缩短曝光波长λ及增大数值孔径NA，则聚焦深度δ变窄。Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k₁ and k₂ are process coefficients. It can be seen from equations (1) and (2) that if the exposure wavelength λ is shortened and the numerical aperture NA is increased to increase the resolution R, the depth of focus δ becomes narrow.

如果聚焦深度δ太窄，则难以使基片表面与投影光学系统的像面一致，存在曝光工作时的容限不足的危险。此外，使对于短波长化的曝光光可使用的光学部件材料受到限定。根据这样的观点，作为实质上缩短通过投影光学系统后的曝光光的波长且扩展聚焦深度的方法，例如提出了在国际公开第99/49504号公报或特开平10-303114号公报中公开的液浸法。该液浸法是下述的方法：在投影光学系统的下面与基片表面之间充满水或有机溶媒等的液体以形成液浸区域，利用液体中的曝光光的波长为空气中的1/n(n是液体的折射率，通常约为1.2～1.6)这一点来提高解像度，同时将聚焦深度扩大约n倍。If the depth of focus δ is too narrow, it will be difficult to align the substrate surface with the image plane of the projection optical system, and there is a risk of insufficient margin at the time of exposure operation. In addition, optical component materials that can be used for short-wavelength exposure light are limited. From such a point of view, as a method of substantially shortening the wavelength of the exposure light passing through the projection optical system and extending the depth of focus, for example, the liquid light disclosed in International Publication No. 99/49504 or Japanese Patent Application Laid-Open No. Hei 10-303114 has been proposed. Dip method. This liquid immersion method is the following method: between the bottom of the projection optical system and the surface of the substrate, liquids such as water or organic solvents are filled to form a liquid immersion area, and the wavelength of the exposure light in the liquid is 1/2 that in the air. n (n is the refractive index of the liquid, usually about 1.2 to 1.6) to improve the resolution and expand the depth of focus by about n times.

但是，如图18中示出的示意图中所示，即使在采用液浸法的曝光装置中，有时也对基片P的边缘区域E曝光。在该情况下，投影区域100的一部分伸出到基片P的外侧，曝光光也照射到保持基片P的基片台120上。在液浸曝光的情况下，形成液体的液浸区域，使其覆盖投影区域100，但在对边缘区域E曝光时，液体的液浸区域的一部分伸出到基片P的外侧，在基片台120上形成。此外，在基片台120上的基片P的周围配置各种检测构件或检测用传感器的情况下，为了使用这些检测构件或检测传感器，也有在基片台120上形成液浸区域的情况。如果在基片台120上形成液浸区域的一部分，则液体残留在基片台120上的可能性提高了，因其气化的缘故，例如放置基片P的环境(温度、湿度)发生变动或基片台120发生热变形或检测基片P的位置信息等的各种检测光的光路的环境发生变动等，存在曝光精度下降的可能性。此外，在残留的气体气化后，留下水迹，也存在成为基片P或液体等的污染的主要因素或成为各种检测的误差的主要因素的可能性。However, as shown in the schematic diagram shown in FIG. 18, even in the exposure apparatus employing the liquid immersion method, the edge region E of the substrate P is sometimes exposed. In this case, a part of theprojection area 100 protrudes outside the substrate P, and the exposure light is also irradiated onto thesubstrate stage 120 holding the substrate P. As shown in FIG. In the case of liquid immersion exposure, the liquid immersion area of the liquid is formed so as to cover theprojection area 100, but when the edge area E is exposed, a part of the liquid immersion area of the liquid protrudes to the outside of thesubstrate P. stage 120 is formed. Also, when various detection members or detection sensors are arranged around the substrate P on thesubstrate stage 120 , a liquid immersion region may be formed on thesubstrate stage 120 in order to use these detection members or detection sensors. If a part of the liquid immersion area is formed on thesubstrate stage 120, the possibility that the liquid remains on thesubstrate stage 120 increases, and the environment (temperature, humidity) where the substrate P is placed, for example, changes due to its vaporization. Or thesubstrate stage 120 is thermally deformed, or the environment of the optical path of various detection lights, such as detecting the position information of the substrate P, changes, etc., and the exposure accuracy may decrease. In addition, after the residual gas vaporizes, water marks are left, which may become a factor of contamination of the substrate P, liquid, or the like, or a factor of errors in various detections.

发明内容Contents of the invention

本发明是鉴于这样的情况而进行的，其第1目的在于提供可防止液体残留并可维持良好的曝光精度、检测精度的曝光装置、曝光方法 和器件制造方法。The present invention is made in view of such circumstances, and its first object is to provide an exposure apparatus, an exposure method, and a device manufacturing method that can prevent liquid residue and maintain good exposure accuracy and detection accuracy.

此外，本发明的第2目的在于提供具有具备紫外激光照射耐久性的疏水性膜的光学部件和安装了该光学部件的投影曝光装置。Moreover, the 2nd object of this invention is to provide the optical member which has the hydrophobic film which has ultraviolet laser irradiation durability, and the projection exposure apparatus equipped with this optical member.

为了解决上述的课题，本发明采用了与实施形态中示出的图1～图21对应的以下的结构。但是，对各要素所附的带有括号的符号不过是该要素的例示，不限定各要素。In order to solve the above-mentioned problems, the present invention employs the following configurations corresponding to FIGS. 1 to 21 shown in the embodiment. However, the symbols in parentheses attached to each element are merely illustrations of the element, and do not limit each element.

按照本发明的第1形态，提供下述的曝光装置(EX)：经液体(1)对基片(P)照射曝光光(EL)以对基片(P)曝光，具备：将图案的像投影在基片(P)上的投影光学系统(PL)；以及用于保持基片(P)的基片台(PT)，在基片台(PT)上以可更换的方式设置有其表面(30A)的至少一部分呈疏液性的构件(30)。According to the first aspect of the present invention, there is provided the following exposure apparatus (EX): irradiating exposure light (EL) to the substrate (P) through the liquid (1) to expose the substrate (P), comprising: a projection optical system (PL) projected on the substrate (P); and a substrate stage (PT) for holding the substrate (P), on which the surface is replaceably provided (30A) A member (30) in which at least a part is lyophobic.

此外，在本发明中，提供其特征在于使用上述形态的曝光装置的器件制造方法。Moreover, in this invention, the device manufacturing method characterized by using the exposure apparatus of the said aspect is provided.

按照本发明，由于以可更换的方式设置在基片台上设置的疏液性的构件，故在该构件的疏液性恶化时，可与新的疏液性的构件更换。因而，可抑制液体残留，例如即使发生残留，也能顺利地回收该液体。因而，可防止因残留的液体引起的曝光精度、检测精度的恶化，可制造能发挥所希望的性能的器件。According to the present invention, since the lyophobic member provided on the substrate stage is replaceable, when the lyophobic property of the member deteriorates, it can be replaced with a new lyophobic member. Therefore, it is possible to suppress the liquid from remaining, for example, even if it remains, the liquid can be recovered smoothly. Therefore, deterioration of exposure accuracy and detection accuracy due to remaining liquid can be prevented, and a device capable of exhibiting desired performance can be manufactured.

按照本发明的第2形态，提供下述的曝光方法：在经投影光学系统(PL)和液体(1)在基片(P)上照射曝光光(EL)以对上述基片(P)进行液浸曝光，用基片保持构件(30)保持基片(P)，基片保持构件(30)在基片(P)的周围具有其表面与该基片(P)表面大致为同一面的平坦部(30A)，将保持基片(P)的基片保持构件(30)运入到基片台(PST、PT)上，对运入到基片台(PST、PT)上的基片(P)进行液浸曝光，在液浸曝光的结束后，从基片台(PST、PT)运出保持基片(P)的基片保持构件(30)。According to the second aspect of the present invention, the following exposure method is provided: irradiating exposure light (EL) on the substrate (P) through the projection optical system (PL) and the liquid (1) to perform the above-mentioned substrate (P) For liquid immersion exposure, the substrate (P) is held by a substrate holding member (30). The flat part (30A) transports the substrate holding member (30) holding the substrate (P) onto the substrate stage (PST, PT), and carries the substrate onto the substrate stage (PST, PT). (P) Liquid immersion exposure is performed, and after the liquid immersion exposure is completed, the substrate holding member (30) holding the substrate (P) is carried out from the substrate stage (PST, PT).

此外，在本发明中，提供其特征在于使用上述曝光方法的器件制造方法。Furthermore, in the present invention, there is provided a device manufacturing method characterized by using the above-mentioned exposure method.

按照本发明，通过对基片台与基片一起运入和运出在基片的周围 具有平坦部的基片保持构件，可对基片台与基片一起容易地更换基片保持构件，例如在基片保持构件的疏液性恶化时，可容易地更换。此外，由于基片保持构件在基片的周围具有平坦部，故在与基片一起将该基片保持构件运入到基片台上对基片的边缘区域进行液浸曝光时，即使液体的液浸区域的一部分在基片的外侧伸出，也可利用平坦部维持液浸区域的形状，可在投影光学系统之下良好地保持液体的状态下进行液浸曝光而不导致液体的流出等。因而，可防止曝光精度的恶化，可制造能发挥所希望的性能的器件。According to the present invention, by carrying in and out the substrate holding member having a flat portion around the substrate together with the substrate stage, the substrate holding member can be easily replaced together with the substrate, for example When the liquid repellency of the substrate holding member deteriorates, it can be easily replaced. In addition, since the substrate holding member has a flat portion around the substrate, when carrying the substrate holding member together with the substrate onto the substrate stage to perform liquid immersion exposure on the edge region of the substrate, even if the liquid A part of the liquid immersion area protrudes from the outside of the substrate, and the shape of the liquid immersion area can also be maintained by the flat part, and liquid immersion exposure can be performed in a state where the liquid is kept well under the projection optical system without causing the liquid to flow out, etc. . Therefore, deterioration of exposure accuracy can be prevented, and a device capable of exhibiting desired performance can be manufactured.

按照本发明的第3形态，提供下述的曝光装置(EX)，经液体(1)对基片(P)照射曝光光(EL)以对基片(P)曝光，具备：将图案的像投影在基片(P)上的投影光学系统(PL)；以及对于投影光学系统(PL)可移动的移动台(PST)，在移动台(PST)上设置有至少一部分呈疏液性的疏液性构件(30、PH、300、400、500)，该疏液性构件可更换。According to a third aspect of the present invention, the following exposure apparatus (EX) is provided, which exposes the substrate (P) by irradiating exposure light (EL) to the substrate (P) through the liquid (1), comprising: projection optical system (PL) projected on the substrate (P); Liquid member (30, PH, 300, 400, 500), the liquid repellent member is replaceable.

在本发明的第3形态的曝光装置中，由于以可更换的方式设置在移动台上设置的疏液性的构件，故在该构件的疏液性恶化时，可与新的构件更换。移动台可以是具备保持基片而移动的基片台或各种基准构件或检测传感器等的检测构件的检测系统。或者，作为移动台可具备基片台和检测台这两者。进而，作为移动台，可具备多个基片台或多个检测台。In the exposure apparatus according to the third aspect of the present invention, since the lyophobic member provided on the moving table is replaceably provided, when the lyophobic property of the member deteriorates, it can be replaced with a new member. The moving stage may be a detection system that includes a substrate stage that moves while holding a substrate, various reference members, and detection means such as detection sensors. Alternatively, both the substrate stage and the detection stage may be provided as the mobile station. Furthermore, as a mobile station, a plurality of substrate stages or a plurality of detection stages may be provided.

按照本发明的第4形态，提供下述步骤的曝光方法，经液体(1)对基片(P)照射曝光光(EL)以对上述基片(P)进行液浸曝光包含以下工序：对基片(P)上的至少一部分供给上述液体(1)；经液体对基片(P)照射曝光光(EL)以对基片进行液浸曝光；与被供给液体的基片不同的曝光装置的部分(30、300、400、500)具有疏液性；以及根据该疏液性的恶化来更换具有该疏液性的曝光装置的部分(30、300、400、500)。According to a fourth aspect of the present invention, there is provided an exposure method in the following steps, wherein the substrate (P) is irradiated with exposure light (EL) via a liquid (1) to perform liquid immersion exposure on the substrate (P), including the following steps: At least a part of the substrate (P) is supplied with the above-mentioned liquid (1); the substrate (P) is irradiated with exposure light (EL) through the liquid to perform liquid immersion exposure on the substrate; an exposure device different from the substrate to which the liquid is supplied The part (30, 300, 400, 500) of the liquid repellency has liquid repellency; and the part (30, 300, 400, 500) of the exposure device having the liquid repellency is replaced according to the deterioration of the liquid repellency.

在本发明的第4形态的曝光方法中，由于即使具有疏液性的曝光装置的部分因紫外光的照射而性能恶化，也可根据其恶化来更换该部 分，故可防止因恶化导致的液体的残留或漏泄等。可定期地或根据对各个部分推断或观察恶化状况的结果进行上述部分的更换。In the exposure method of the fourth aspect of the present invention, even if the part of the exposure device having liquid repellency deteriorates due to the irradiation of ultraviolet light, the part can be replaced according to the deterioration, so that the damage caused by the deterioration can be prevented. Liquid residue or leakage, etc. The replacement of the above-mentioned parts may be performed periodically or based on the result of inferring or observing the deterioration condition of each part.

按照本发明的第5形态，提供一种在投影曝光装置(EX)的基片台上安装的光学部件(650、652、654)，上述投影曝光装置(EX)用曝光束(EL)照明掩模(M)，利用投影光学系统将掩模(M)的图案经液体(1)转印到由基片台上保持的基片(P)上，所述光学部件具备：被上述曝光束照射的光照射面(660)；利用由在光照射面(660)的表面上形成的二氧化硅、氟化镁和氟化钙中的至少一种构成的微粒子层构成的粘接微粒子层(662)；以及利用在粘接微粒子层的表面上形成的非晶质氟树脂构成的疏水性膜(664)。According to a fifth aspect of the present invention, there is provided an optical component (650, 652, 654) mounted on a substrate stage of a projection exposure apparatus (EX) that illuminates a mask with an exposure beam (EL). A mold (M) for transferring the pattern of the mask (M) via the liquid (1) to the substrate (P) held on the substrate stage by means of a projection optical system, said optical component having: being irradiated by the above-mentioned exposure beam The light irradiation surface (660); the adhesive particle layer (662) composed of a particle layer composed of at least one of silicon dioxide, magnesium fluoride and calcium fluoride formed on the surface of the light irradiation surface (660) ); and a hydrophobic film (664) made of an amorphous fluororesin formed on the surface of the adhesive fine particle layer.

本发明者在分析氟烷基硅烷与基体材料玻璃的密接性时，得知由于氟烷基硅烷末端基-CF₃在化学上稳定，故在与基体材料玻璃之间不能预期氢结合或缩合反应等的化学的结合。因此，本发明者研究了不依靠化学的结合而是使分子间引力增大的方法。其结果，在下述方面取得成功：通过增加与基体材料玻璃粘接的粘接层的表面积，以首尾良好的方式使附着能量增大。按照本发明的光学部件，由形成粘接微粒子层的二氧化硅(SiO₂)、氟化镁(MgF₂)和氟化钙(CaF₂)中的至少一种构成的微粒子层可得到与基体材料的玻璃(主要成分SiO₂)的亲和性良好、与基体材料玻璃恰好的密接性。此外，在表面上产生来源于粒子的直径的凹凸。再者，由于二氧化硅等是紫外线透射率非常高的材料，故其本身的激光照射耐久性也高。因而，如果在形成了由二氧化硅(SiO₂)、氟化镁(MgF₂)和氟化钙(CaF₂)中的至少一种构成的微粒子层后形成由非晶质氟树脂构成的疏水性膜，则以非晶质氟树脂进入二氧化硅等的微粒子的空隙中而将其包围的方式干燥、固化。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。When the present inventors analyzed the adhesiveness between fluoroalkylsilane and the base material glass, it was found that since the end group of fluoroalkylsilane_-CF3 is chemically stable, hydrogen bonding or condensation reaction with the base material glass cannot be expected. etc. chemical combination. Therefore, the present inventors studied a method of increasing the attractive force between molecules without relying on chemical bonding. As a result, success has been achieved in that the adhesion energy can be increased in an end-to-end manner by increasing the surface area of the adhesive layer bonded to the base material glass. According to the optical part of the present invention, the fine particle layer composed of at least one of silicon dioxide (SiO₂ ), magnesium fluoride (MgF₂ ) and calcium fluoride (CaF₂ ) forming the bonding fine particle layer can be obtained in contact with the substrate. The material glass (main component SiO₂ ) has good affinity and good adhesion to the base material glass. In addition, irregularities derived from the diameter of the particles are generated on the surface. Furthermore, since silicon dioxide and the like are materials with very high ultraviolet transmittance, their durability against laser irradiation is also high. Therefore, if a hydrophobic layer made of amorphous fluororesin is formed after forming a fine particle layer made of at least one of silicon dioxide (SiO₂ ), magnesium fluoride (MgF₂ ) and calcium fluoride (CaF₂ ), In the case of a permanent film, the amorphous fluororesin is dried and cured in such a way that the amorphous fluororesin enters the voids of fine particles such as silica and surrounds them. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high.

此外，按照本发明的第6形态，提供一种在投影曝光装置的基片台(PST)上安装的光学部件(650、652、654)，上述投影曝光装置用曝光束(EL)照明掩模(M)，利用投影光学系统(PL)将上述掩 模的图案经液体(1)转印到由基片台(PST)上保持的基片上，所述光学部件具备：被上述曝光束照射的光照射面(660)；在上述光照射面的表面上形成的粘接面(668)；以及由在上述粘接面的表面上形成的非晶质氟树脂构成的疏水性膜(664)。在该形态的光学部件中，上述粘接面最好是利用氟化氢刻蚀的面。Furthermore, according to a sixth aspect of the present invention, there is provided an optical component (650, 652, 654) mounted on a substrate stage (PST) of a projection exposure apparatus for illuminating a mask with an exposure beam (EL). (M), using the projection optical system (PL) to transfer the pattern of the above-mentioned mask to the substrate held by the substrate stage (PST) through the liquid (1), the optical component has: a light irradiation surface (660); an adhesive surface (668) formed on the surface of the light irradiation surface; and a hydrophobic film (664) made of amorphous fluororesin formed on the surface of the adhesion surface. In the optical component of this aspect, it is preferable that the bonding surface is a surface etched with hydrogen fluoride.

按照第6形态的光学部件，由于在光照射面上具有由利用氟化氢刻蚀的刻蚀面构成的粘接面，故如果在粘接面上形成由非晶质氟树脂构成的疏水性膜，则以非晶质氟树脂进入粘接面的空隙中而将其包围的方式干燥、固化。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。According to the optical component of the sixth aspect, since the light irradiation surface has an adhesive surface composed of an etched surface etched with hydrogen fluoride, if a hydrophobic film composed of an amorphous fluororesin is formed on the adhesive surface, Then, the amorphous fluororesin is dried and cured so that it enters and surrounds the voids on the bonding surface. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high.

此外，上述形态的光学部件的上述光照射面可具有基体材料玻璃。此外，上述形态的光学部件的上述光照射面可具有在基体材料玻璃的至少一部分上形成的金属膜。按照这些光学部件，因为在光照射面上形成的疏水性膜具有激光照射耐久性，故可在长时间内维持在投影曝光装置的基片台上安装的光学部件的光照射面的疏水性。Moreover, the said light irradiation surface of the optical component of the said aspect may have base material glass. Moreover, the said light irradiation surface of the optical component of the said aspect may have the metal film formed on at least a part of base material glass. According to these optical components, since the hydrophobic film formed on the light-irradiated surface has laser irradiation durability, the hydrophobicity of the light-irradiated surface of the optical component mounted on the substrate stage of the projection exposure apparatus can be maintained over a long period of time.

此外，在本发明中，也提供具备上述任一形态的光学部件的投影曝光装置。按照该投影曝光装置，由于在基片台上安装了能在长时间内维持光照射面的疏水性的光学部件，故即使在重复进行液浸曝光的情况下，也能可靠地进行光学部件的光照射面上的排水。Moreover, in this invention, the projection exposure apparatus provided with the optical member of any of said aspects is also provided. According to this projection exposure apparatus, since the optical member capable of maintaining the hydrophobicity of the light irradiation surface for a long period of time is mounted on the substrate table, even in the case of repeated liquid immersion exposure, the optical member can be reliably removed. Drainage on the light exposure face.

此外，按照本发明的第7形态，提供一种投影曝光装置(EX)，用曝光束(EL)照明掩模(M)，利用投影光学系统(PL)将上述掩模的图案经液体转印到由基片台(PST)保持的基片上，上述基片台上：被上述曝光束照射的光照射面(660)；在上述光照射面的表面上形成的粘接微粒子层(662)；以及由在上述粘接微粒子层的表面上形成的非晶质氟树脂构成的疏水性膜(664)。In addition, according to a seventh aspect of the present invention, there is provided a projection exposure apparatus (EX) for illuminating a mask (M) with an exposure beam (EL), and transferring the pattern of the mask through a liquid using a projection optical system (PL). On the substrate held by the substrate stage (PST), on the substrate stage: the light irradiation surface (660) irradiated by the above-mentioned exposure beam; the adhesive fine particle layer (662) formed on the surface of the above-mentioned light irradiation surface; And a hydrophobic film (664) made of amorphous fluororesin formed on the surface of the above-mentioned adhesive fine particle layer.

按照第7形态的投影曝光装置，由于在基片台上安装的光学部件在光照射面上具有粘接微粒子层，故由非晶质氟树脂构成的疏水性膜与粘接微粒子层密接。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。According to the projection exposure apparatus of the seventh aspect, since the optical component mounted on the substrate stage has the adhesive fine particle layer on the light irradiation surface, the hydrophobic film made of amorphous fluororesin is in close contact with the adhesive fine particle layer. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high.

此外，第7形态的投影曝光装置的上述光照射面可具有基体材料玻璃。此外，第7形态的投影曝光装置的上述光照射面可具有在基体材料玻璃的至少一部分上形成的金属膜。按照这些投影曝光装置，因为在基片台上安装的光学部件的光照射面上形成的疏水性膜具有激光照射耐久性，故可在长时间内维持在投影曝光装置的基片台上安装的光学部件的光照射面的疏水性。Moreover, the said light irradiation surface of the projection exposure apparatus of a seventh aspect may have base material glass. In addition, the above-mentioned light irradiation surface of the projection exposure apparatus of the seventh aspect may have a metal film formed on at least a part of the base material glass. According to these projection exposure apparatuses, since the hydrophobic film formed on the light irradiation surface of the optical component mounted on the substrate stage has laser irradiation durability, it can be maintained for a long time on the substrate stage of the projection exposure apparatus. The hydrophobicity of the light-irradiated surface of an optical component.

按照本发明的第8形态，提供一种光学部件(300、400、500、650、652、654)，具备：具有光照射面的部件主体(660)；利用从由在上述光照射面的表面上形成的二氧化硅、氟化镁和氟化钙构成的一组中选择的至少一种微粒子形成的微粒子层(662)；以及利用非晶质氟树脂形成的疏水性膜(664)。由于疏水性膜经微粒子层与光照射面牢固地连接，故本发明在液体或蒸汽气氛中使用的光学传感器或透镜等的用途中是极为有用的。According to an eighth aspect of the present invention, an optical component (300, 400, 500, 650, 652, 654) is provided, comprising: a component body (660) having a light irradiation surface; A fine particle layer (662) formed of at least one fine particle selected from the group consisting of silicon dioxide, magnesium fluoride, and calcium fluoride formed on the surface; and a hydrophobic film (664) formed of an amorphous fluororesin. Since the hydrophobic film is firmly connected to the light-irradiated surface through the fine particle layer, the present invention is extremely useful for applications such as optical sensors and lenses used in a liquid or vapor atmosphere.

按照本发明的第8形态，是提供一种光学部件(300、400、500、650、652、654)，具备：具有光照射面的部件主体(660)；在上述光照射面的表面上利用刻蚀形成的粘接面(668)；以及利用非晶质氟树脂在上述粘接面的表面上形成的疏水性膜(664)。由于疏水性膜经微粒子层与光照射面牢固地连接，故本发明在液体或蒸汽气氛中使用的光学传感器或透镜等的用途中是极为有用的。According to an eighth aspect of the present invention, an optical component (300, 400, 500, 650, 652, 654) is provided, comprising: a component body (660) having a light irradiation surface; an adhesive surface (668) formed by etching; and a hydrophobic film (664) formed on the surface of the adhesive surface using an amorphous fluororesin. Since the hydrophobic film is firmly connected to the light-irradiated surface through the fine particle layer, the present invention is extremely useful for applications such as optical sensors and lenses used in a liquid or vapor atmosphere.

附图说明Description of drawings

图1是示出本发明的曝光装置的一实施形态的概略结构图。FIG. 1 is a schematic configuration diagram showing an embodiment of the exposure apparatus of the present invention.

图2是示出液体供给机构和液体回收机构的概略平面图。Fig. 2 is a schematic plan view showing a liquid supply mechanism and a liquid recovery mechanism.

图3是基片台的平面图。Fig. 3 is a plan view of a substrate stage.

图4是示出保持了基片的状态的基片台的平面图。Fig. 4 is a plan view showing a substrate stage holding a substrate.

图5是基片台的剖面图。Fig. 5 is a cross-sectional view of a substrate table.

图6是示出各构件对基片台可装卸的示意图。Fig. 6 is a schematic view showing that each member can be attached to and detached from the substrate stage.

图7(a)～(d)是示出本发明的曝光装置的工作的一例的示意图。7( a ) to ( d ) are schematic diagrams showing an example of the operation of the exposure apparatus of the present invention.

图8(a)～(d)是示出本发明的曝光装置的工作的一例的示意图。8( a ) to ( d ) are schematic diagrams showing an example of the operation of the exposure apparatus of the present invention.

图9是示出运送到运送装置上的基片保持构件的平面图。Fig. 9 is a plan view showing the substrate holding member transported onto the transport device.

图10是示出基片台的另一实施形态的剖面图。Fig. 10 is a cross-sectional view showing another embodiment of the substrate stage.

图11(a)和(b)是示出本发明的曝光装置的另一实施形态的概略结构图。11( a ) and ( b ) are schematic configuration diagrams showing another embodiment of the exposure apparatus of the present invention.

图12(a)和(b)是示出基片保持构件的另一实施形态的图。12( a ) and ( b ) are diagrams showing another embodiment of the substrate holding member.

图13(a)～(d)是示出本发明的曝光装置的工作的另一例的示意图。13( a ) to ( d ) are schematic diagrams showing another example of the operation of the exposure apparatus of the present invention.

图14是示出本发明的曝光装置的另一实施形态的概略结构图。Fig. 14 is a schematic configuration diagram showing another embodiment of the exposure apparatus of the present invention.

图15是示出本发明的曝光装置的另一实施形态的概略结构图。Fig. 15 is a schematic configuration diagram showing another embodiment of the exposure apparatus of the present invention.

图16是示出本发明的曝光装置的另一实施形态的概略结构图。Fig. 16 is a schematic configuration diagram showing another embodiment of the exposure apparatus of the present invention.

图17是示出半导体器件的制造工序的一例的流程图。FIG. 17 is a flowchart showing an example of a manufacturing process of a semiconductor device.

图18是用于说明以前的课题的示意图。FIG. 18 is a schematic diagram for explaining a conventional problem.

图19是示出在与实施形态有关的晶片台上安装的光学部件的图。Fig. 19 is a diagram showing optical components mounted on the wafer stage according to the embodiment.

图20是在与实施形态有关的晶片台上安装的光学部件的结构图。Fig. 20 is a structural diagram of optical components mounted on the wafer stage according to the embodiment.

图21是在与实施形态有关的晶片台上安装的光学部件的结构图。Fig. 21 is a structural diagram of optical components mounted on the wafer stage according to the embodiment.

具体实施方式Detailed ways

以下，一边参照附图，一边说明本发明的曝光装置，但本发明不限定于此。Hereinafter, although the exposure apparatus of this invention is demonstrated referring drawings, this invention is not limited to this.

<第1实施形态><First Embodiment>

图1是示出本发明的曝光装置的一实施形态的概略结构图。在图1中，曝光装置EX具备：支撑掩模M的掩模台MST；经基片架PT支撑基片P的基片台PST；用曝光光EL照明由掩模台MST支撑的掩模M的照明光学系统IL；将用曝光光EL照明的掩模M的图案像投影到由基片台PST支撑的基片P上以进行曝光的投影光学系统PL；以及总括地控制曝光装置EX整体的工作的控制装置CONT。FIG. 1 is a schematic configuration diagram showing an embodiment of the exposure apparatus of the present invention. In FIG. 1 , the exposure apparatus EX includes: a mask stage MST supporting a mask M; a substrate stage PST supporting a substrate P via a substrate holder PT; and illuminating the mask M supported by the mask stage MST with exposure light EL. the illumination optical system IL; the projection optical system PL for projecting the pattern image of the mask M illuminated with the exposure light EL onto the substrate P supported by the substrate stage PST for exposure; and collectively controlling the overall operation of the exposure apparatus EX Working control device CONT.

为了在实质上缩短曝光波长以提高解像度的同时实质上扩展聚焦深度，将液浸法应用于本实施形态的曝光装置EX。该液浸曝光装置具备向基片P供给液体1的液体供给机构10和回收基片P上的液体1的液体回收机构20。在本实施形态中，使用纯水作为液体1。至少在将掩模M的图案像转印到基片P上的期间内，曝光装置EX利用从液体供给机构10供给的液体1在包含投影光学系统PL的投影区域AR1的基片P上的至少一部分(局部地)上形成液浸区域AR2。具体地说，对于曝光装置EX来说，在投影光学系统PL的前端部的光学元件2与基片P的表面(曝光面)之间充满液体1，经该投影光学系统PL与基片P之间的液体1和投影光学系统PL将掩模M的图案像投影到基片P上，对基片P曝光。In order to substantially expand the depth of focus while substantially shortening the exposure wavelength to improve the resolution, a liquid immersion method is applied to the exposure apparatus EX of this embodiment. This liquid immersion exposure apparatus includes a liquid supply mechanism 10 for supplying a liquid 1 to a substrate P, and aliquid recovery mechanism 20 for recovering the liquid 1 on the substrate P. As shown in FIG. In this embodiment, pure water is used as the liquid 1 . At least during the period of transferring the pattern image of the mask M onto the substrate P, the exposure device EX utilizes liquid 1 supplied from the liquid supply mechanism 10 on the substrate P including the projection area AR1 of the projection optical system PL. A liquid immersion area AR2 is formed on a part (partially). Specifically, in the exposure apparatus EX, the liquid 1 is filled between the optical element 2 at the front end of the projection optical system PL and the surface (exposure surface) of the substrate P. Between the liquid 1 and the projection optical system PL, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed.

在此，在本实施形态中，作为曝光装置EX，以一边在扫描方向上的彼此不同的方向(反方向)上同步地移动掩模M和基片P、一边在基片P上对在掩模M上形成的图案曝光的扫描型曝光装置(所谓扫描步进器)的情况为例来说明。在以下的说明中，将与投影光学系统PL的光轴AX一致的方向定为Z轴方向，将在与Z轴方向垂直的平面内掩模M和基片P的同步移动方向(扫描方向)定为X轴方向，将与Z轴方向和X轴方向垂直的方向(非扫描方向)定为Y轴方向。此外，分别将以X轴、Y轴和Z轴为中心进行的旋转(倾斜)方向定为θX、θY、θZ方向。再有，这里所谓的「基片」包含在半导体晶片上涂敷了作为感光性材料的光刻胶的基片，「掩模」包含在基片上形成了缩小投影的器件图案的中间掩模。Here, in the present embodiment, as the exposure apparatus EX, the mask M and the substrate P are moved synchronously in directions different from each other (reverse directions) in the scanning direction, and the mask M is aligned on the substrate P. The case of a scanning type exposure apparatus (so-called scanning stepper) for exposing a pattern formed on a mold M will be described as an example. In the following description, the direction coincident with the optical axis AX of the projection optical system PL is defined as the Z-axis direction, and the synchronous moving direction (scanning direction) of the mask M and the substrate P in a plane perpendicular to the Z-axis direction is defined as The X-axis direction is defined as the X-axis direction, and the direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction. In addition, the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis are defined as θX, θY, and θZ directions, respectively. Here, the term "substrate" includes a substrate coated with photoresist as a photosensitive material on a semiconductor wafer, and "mask" includes a reticle on which a reduced projection device pattern is formed on the substrate.

照明光学系统IL是用曝光光EL照明由掩模台MST支撑的掩模M的光学系统，具有：曝光用光源；使从曝光用光源射出的光束的照度变得均匀的光积分器(均质器)；对来自光积分器的曝光光EL进行聚光的聚光透镜；中继透镜系统；以及将由曝光光EL产生的掩模M上的照明区域设定为狭缝状的可变视野光圈等。利用照明光学系统IL并用均匀的照度分布的曝光光EL照明掩模M上的规定的照明区域。作为从照明光学系统IL射出的曝光光EL，例如可使用从水银灯 射出的亮线(g线、h线、i线)和KrF准分子激光(波长248nm)等的远紫外光(DUV光)或ArF准分子激光(波长193nm)和F₂激光(波长157nm)等的真空紫外光(VUV光)等。在本实施形态中使用ArF准分子激光。如上所述，本实施形态中的液体1是纯水，即使曝光光EL是ArF准分子激光也能透过。此外，纯水也能透过亮线(g线、h线、i线)和KrF准分子激光(波长248nm)等的远紫外光(DUV光)。The illumination optical system IL is an optical system for illuminating the mask M supported by the mask stage MST with the exposure light EL, and includes: a light source for exposure; device); a condensing lens that condenses the exposure light EL from the light integrator; a relay lens system; and a variable field of view diaphragm that sets the illuminated area on the mask M generated by the exposure light EL into a slit shape wait. A predetermined illumination region on the mask M is illuminated with exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, bright lines (g-line, h-line, i-line) emitted from a mercury lamp and extreme ultraviolet light (DUV light) such as KrF excimer laser (wavelength 248nm) or Vacuum ultraviolet light (VUV light) such as ArF excimer laser (wavelength 193nm) and F₂ laser (wavelength 157nm), etc. In this embodiment, an ArF excimer laser is used. As mentioned above, the liquid 1 in this embodiment is pure water, and can transmit even if the exposure light EL is ArF excimer laser light. In addition, pure water can also pass through bright lines (g-line, h-line, i-line) and deep ultraviolet light (DUV light) such as KrF excimer laser (wavelength 248nm).

掩模台MST一边支撑掩模M、一边能在与投影光学系统PL的光轴AX垂直的平面内、即XY平面内作2维移动，此外，在θZ方向上可进行微小旋转。利用直线电机等的掩模台驱动装置MSTD来驱动掩模台MST。利用控制装置CONT来控制掩模台驱动装置MSTD。在掩模台MST上设置移动镜50。此外，在与移动镜50对置的位置上设置激光干涉计51。利用激光干涉计51实时地检测掩模台MST上的掩模M的2维方向的位置和旋转角，将检测结果输出给控制装置CONT。控制装置CONT通过根据激光干涉计51的检测结果驱动掩模台驱动装置MSTD，进行由掩模台MST支撑的掩模M的定位。Mask stage MST supports mask M and can move two-dimensionally in a plane perpendicular to optical axis AX of projection optical system PL, that is, in XY plane, and can also perform minute rotation in the θZ direction. Mask stage MST is driven by mask stage drive device MSTD such as a linear motor. The mask table driving device MSTD is controlled by the control device CONT. A movingmirror 50 is provided on the mask stage MST. In addition, alaser interferometer 51 is provided at a position facing the movingmirror 50 . The two-dimensional position and rotation angle of the mask M on the mask stage MST are detected by thelaser interferometer 51 in real time, and the detection result is output to the control device CONT. Control device CONT positions mask M supported by mask stage MST by driving mask stage drive device MSTD based on the detection result oflaser interferometer 51 .

投影光学系统PL将掩模M的图案以规定的投影倍率β投影到基片P上并进行曝光。投影光学系统PL由包含在基片P一侧的前端部上设置的光学元件(透镜)2的多个光学元件构成，用镜筒PK支撑这些光学元件。在本实施形态中，投影光学系统PL是投影倍率β例如为1/4或1/5的缩小系统。再有，投影光学系统PL可以是等倍系统和放大系统的任一种。此外，投影光学系统PL可以是不包含折射元件的反射系统、不包含反射元件的折射系统、包含折射元件和反射元件的反射折射系统的任一种。此外，本实施形态的投影光学系统PL的前端部的光学元件2对于镜筒PK以可装卸(更换)的方式来设置，液浸区域AR2的液体1与光学元件2接触。The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β. The projection optical system PL is constituted by a plurality of optical elements including an optical element (lens) 2 provided on the front end portion on the side of the substrate P, and these optical elements are supported by the lens barrel PK. In the present embodiment, projection optical system PL is a reduction system in which projection magnification β is, for example, 1/4 or 1/5. In addition, projection optical system PL may be any of an equal magnification system and a magnification system. In addition, projection optical system PL may be any of a reflective system not including a refractive element, a refractive system not including a reflective element, or a catadioptric system including a refractive element and a reflective element. In addition, the optical element 2 at the front end of the projection optical system PL according to the present embodiment is provided detachably (replaceable) with respect to the lens barrel PK, and the liquid 1 in the liquid immersion area AR2 contacts the optical element 2 .

用萤石形成光学元件2。由于水与萤石的亲和性高，故可使液体1与光学元件2的液体接触面2a的大致整个面密接。即，在本实施形态中，由于将与光学元件2的液体接触面2a的亲和性高的水作为液体 1来供给，故光学元件2的液体接触面2a与液体1的密接性高，能用液体1可靠地充满光学元件2与基片P之间的光路。再有，光学元件2的材料也可以是与水的亲和性高的石英。此外，也可对光学元件2的液体接触面2a进行亲水化(亲液化)处理，进一步提高与液体1的亲和性。此外，由于镜筒PK的前端附近与液体(水)1相接，故用Ti(钛)等的具有抗锈性能的金属至少形成前端附近。The optical element 2 is formed from fluorite. Since water has a high affinity with fluorite, the liquid 1 can be brought into close contact with substantially the entire liquid contact surface 2 a of the optical element 2 . That is, in the present embodiment, since water having a high affinity with the liquid contact surface 2a of the optical element 2 is supplied as the liquid 1, the liquid contact surface 2a of the optical element 2 has high adhesion to the liquid 1, enabling The optical path between the optical element 2 and the substrate P is reliably filled with the liquid 1 . In addition, the material of the optical element 2 may be quartz having a high affinity with water. In addition, the liquid contact surface 2 a of the optical element 2 may be subjected to a hydrophilization (lyophilization) treatment to further increase the affinity with the liquid 1 . In addition, since the vicinity of the front end of the lens barrel PK is in contact with the liquid (water) 1, at least the vicinity of the front end is formed of a metal having rust resistance such as Ti (titanium).

基片台PST支撑基片P，具备：经基片架PT保持基片P的Z台52；支撑Z台52的XY台53；以及支撑XY台53的基座54。基片架PT保持基片P，设置在基片台PST(Z台52)上。利用直线电机等的基片台驱动装置PSTD来驱动基片台PST。利用控制装置CONT来控制基片台驱动装置PSTD。通过驱动Z台52来控制由基片架PT保持的基片P的Z轴方向上的位置(聚焦位置)和θX、θY方向上的位置。此外，通过驱动XY台53来控制基片P的XY方向上的位置(与投影光学系统PL的像面实质上平行的方向的位置)。即，Z台52控制基片P的聚焦位置和倾斜角，用自动聚焦方式和自动矫正方式使基片P的表面与投影光学系统PL的像面重合，XY台53进行基片P的X轴方向和Y轴方向的定位。再有，当然可与Z台一体地设置，XY台。再有，作为自动聚焦、矫正检测系统的结构，可使用例如在特开平8-37149号公报中公开的结构。The substrate stage PST supports the substrate P, and includes aZ stage 52 holding the substrate P via the substrate holder PT, anXY stage 53 supporting theZ stage 52 , and a base 54 supporting theXY stage 53 . The substrate holder PT holds the substrate P, and is set on the substrate stage PST (Z stage 52). The substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor. The substrate table drive device PSTD is controlled by the control device CONT. The position in the Z-axis direction (focus position) and the positions in the θX, θY directions of the substrate P held by the substrate holder PT are controlled by driving theZ stage 52 . Further, the position in the XY direction of the substrate P (the position in the direction substantially parallel to the image plane of the projection optical system PL) is controlled by driving theXY stage 53 . That is, theZ stage 52 controls the focus position and the inclination angle of the substrate P, and the surface of the substrate P coincides with the image plane of the projection optical system PL by means of an automatic focusing method and an automatic correction method, and theXY stage 53 controls the X axis of the substrate P. orientation and positioning in the Y-axis direction. In addition, of course, the Z stage and the XY stage can be installed integrally. In addition, as the configuration of the autofocus and correction detection system, for example, the configuration disclosed in JP-A-8-37149 can be used.

在基片台PST(基片架PT)上设置与基片台PST一起相对于投影光学系统PL移动的移动镜55。此外，在与移动镜55对置的位置上设置激光干涉计56。利用激光干涉计56实时地检测基片台PST(基片架PT)上的基片P的2维方向的位置和旋转角，将检测结果输出给控制装置CONT。控制装置CONT通过根据激光干涉计56的检测结果驱动基片台驱动装置PSTD，进行由基片台PST支撑的基片P的定位。Amovable mirror 55 that moves relative to the projection optical system PL together with the substrate stage PST is provided on the substrate stage PST (substrate holder PT). In addition, alaser interferometer 56 is provided at a position facing the movingmirror 55 . The position and rotation angle of the substrate P on the substrate stage PST (substrate holder PT) in the two-dimensional direction are detected in real time by thelaser interferometer 56, and the detection result is output to the control device CONT. The control device CONT drives the substrate stage drive device PSTD based on the detection result of thelaser interferometer 56 to position the substrate P supported by the substrate stage PST.

在基片台PST(基片架PT)的附近上方配置了检测基片P上的对准标记或在基片台PST(基片架PT)上设置的基准标记(后述)的基片对准系统350。此外，在掩模台MST的附近，设置了使用与曝 光光EL为同一的波长的光经掩模M和投影光学系统PL检测基片台PST(基片架PT)上的的基准标记的掩模对准系统360。再有，作为基片对准系统350的结构，可使用在特开平4-65603号公报(对应的美国专利第5,493,403号)中公开的结构，作为掩模对准系统360的结构，可使用在特开平7-176468号公报(对应的美国专利第5,646,413号)中公开的结构。A pair of substrates in which an alignment mark on the detection substrate P or a reference mark (described later) provided on the substrate stage PST (substrate holder PT) is arranged above the vicinity of the substrate stage PST (substrate holder PT).Barebone 350. In addition, in the vicinity of the mask stage MST, there is provided a device for detecting reference marks on the substrate stage PST (substrate holder PT) through the mask M and the projection optical system PL using light having the same wavelength as the exposure light EL.Mask alignment system 360 . Furthermore, as the structure of thesubstrate alignment system 350, the structure disclosed in JP-A-4-65603 (corresponding to U.S. Patent No. 5,493,403) can be used, and as the structure of themask alignment system 360, it can be used in The structure disclosed in JP-A-7-176468 (corresponding to US Patent No. 5,646,413).

在基片架PT上设置了包围由该基片架PT保持的基片P的板构件30。板构件30是与基片架PT分开的构件，设置成对于基片架PT可装卸、可更换。板构件30具有与由基片架PT保持的基片P的表面大致为同一面的平坦面(平坦部)30A。在由基片架PT保持的基片P的周围配置了平坦面30A。再者，在基片架PT上并在板构件30的外侧设置了具有与板构件30的平坦面30A大致为同一面的平坦面32A的第2板构件32。第2板构件32也设置成对于基片架PT可装卸、可更换。Aplate member 30 surrounding the substrate P held by the substrate holder PT is provided on the substrate holder PT. Theplate member 30 is a member separate from the substrate holder PT, and is provided so as to be detachable and replaceable with respect to the substrate holder PT. Theplate member 30 has a flat surface (flat portion) 30A that is substantially flush with the surface of the substrate P held by the substrate holder PT. Aflat surface 30A is arranged around the substrate P held by the substrate holder PT. Furthermore, asecond plate member 32 having aflat surface 32A substantially flush with theflat surface 30A of theplate member 30 is provided on the substrate holder PT outside theplate member 30 . Thesecond plate member 32 is also provided so as to be detachable and replaceable with respect to the substrate holder PT.

向基片P供给规定的液体1的液体供给机构10具备：可供给液体1的第1液体供给部11和第2液体供给部12；经在第1液体供给部11中具有流路的供给管11A连接的、具有向基片P供给从该第1液体供给部11送出的液体1的供给13A的第1供给构件13；以及经在第2液体供给部12中具有流路的供给管12A连接的、具有向基片P供给从该第2液体供给部12送出的液体1的供给口14A的第2供给构件14。接近于基片P的表面配置了第1、第2供给构件13、14，设置在基片P的面方向上互不相同的位置上。具体地说，液体供给机构10的第1供给构件13相对于投影区域AR1扫描方向的一侧(-X侧)，第2供给构件14相对于投影区域AR1设置在扫描方向的另一侧(+X侧)。The liquid supply mechanism 10 for supplying a predetermined liquid 1 to the substrate P includes: a firstliquid supply part 11 and a secondliquid supply part 12 capable of supplying the liquid 1; 11A is connected to thefirst supply member 13 having asupply 13A for supplying the liquid 1 sent out from the firstliquid supply unit 11 to the substrate P; Thesecond supply member 14 has asupply port 14A for supplying the liquid 1 sent from the secondliquid supply unit 12 to the substrate P. The first andsecond supply members 13 and 14 are arranged close to the surface of the substrate P, and are provided at positions different from each other in the surface direction of the substrate P. As shown in FIG. Specifically, thefirst supply member 13 of the liquid supply mechanism 10 is disposed on one side (-X side) in the scanning direction of the projection area AR1, and thesecond supply member 14 is disposed on the other side (+X side) in the scanning direction relative to the projection area AR1. X side).

第1、第2液体供给部11、12分别具备容纳液体1的容器和加压泵等(都未图示)，分别经供给管11A、12A和供给构件13、14向基片P供给液体1。此外，利用控制装置CONT来控制第1、第2液体供给部11、12的液体供给工作，控制装置CONT可独立地控制由第 1、第2液体供给部11、12对于基片P上的每单位时间的液体供给量。此外，第1、第2液体供给部11、12分别具有液体的温度调整机构，利用该温度调整机构，可向基片P供给与容纳装置的箱体内的温度大致相同的温度(例如23℃)的液体1。再有，曝光装置EX不一定需要具备第1、第2液体供给部11、12的容器、加压泵、温度调整机构，也可代替使用设置曝光装置EX的工厂等的设备。The first and secondliquid supply units 11 and 12 are respectively equipped with a container for containing the liquid 1, a pressure pump, etc. (both not shown), and supply the liquid 1 to the substrate P through thesupply pipes 11A and 12A and thesupply members 13 and 14, respectively. . In addition, the liquid supply operations of the first and secondliquid supply parts 11 and 12 are controlled by the control device CONT, and the control device CONT can independently control the feeding of each liquid on the substrate P by the first and secondliquid supply parts 11 and 12. Liquid supply per unit time. In addition, the first and secondliquid supply units 11 and 12 each have a liquid temperature adjustment mechanism, and by using this temperature adjustment mechanism, the substrate P can be supplied to the substrate P at a temperature (for example, 23° C.) substantially the same as the temperature in the housing of the storage device. of liquid 1. In addition, the exposure apparatus EX does not necessarily need to include the containers of the first and secondliquid supply units 11 and 12, a pressurizing pump, and a temperature adjustment mechanism, and equipment such as a factory where the exposure apparatus EX is installed may be used instead.

液体回收机构20回收基片P上的液体1，具备：具有接近于基片P的表面配置的回收口23A、24A的第1、第2回收构件23、24；以及分别经在该第1、第2回收构件23、24中具有流路的回收管21A、22A连接的第1、第2液体回收部21、22。第1、第2液体回收部21、22具备例如真空泵等的真空系统(吸引装置)、气液分离器和容纳回收的液体1的容器等(都未图示)，经第1、第2回收构件23、24和回收管21A、22A回收基片P上的液体1。利用控制装置CONT来控制第1、第2液体回收部21、22的液体回收工作。控制装置CONT可独立地控制由第1、第2液体回收部21、22的每单位时间的液体回收量。再有，曝光装置EX不一定需要具备第1、第2液体回收部21、22的真空系统、气液分离器、容器，也可代替使用设置曝光装置EX的工厂等的设备。Theliquid recovery mechanism 20 recovers the liquid 1 on the substrate P, and comprises: the first andsecond recovery members 23, 24 havingrecovery ports 23A, 24A disposed close to the surface of the substrate P; Thesecond recovery members 23 and 24 have the first and secondliquid recovery parts 21 and 22 connected to therecovery pipes 21A and 22A of flow paths. The first and secondliquid recovery parts 21 and 22 are provided with vacuum systems (suction devices) such as vacuum pumps, gas-liquid separators and containers for containing recovered liquid 1 (not shown), and are recovered through the first and second liquid recovery units. Themembers 23, 24 and therecovery pipes 21A, 22A recover the liquid 1 on the substrate P. The liquid recovery operations of the first and secondliquid recovery parts 21 and 22 are controlled by the control device CONT. The control device CONT can independently control the liquid recovery amounts per unit time by the first and secondliquid recovery parts 21 and 22 . In addition, the exposure apparatus EX does not necessarily need to be equipped with the vacuum system of the 1st, 2ndliquid recovery part 21, 22, a gas-liquid separator, and a container, You may replace and use the equipment of the factory etc. which install the exposure apparatus EX.

图2是示出液体供给机构10和液体回收机构20的概略结构的平面图。如图2中所示，将投影光学系统PL的投影区域AR1设定为以Y轴方向(非扫描方向)定为长度方向的狭缝状(矩形)，在基片P的一部分上形成充满液体1的液浸区域AR2，使其包含投影区域AR1。而且，用于形成投影区域AR1的液浸区域AR2的液体供给机构10的第1供给构件13相对于投影区域AR1设置在扫描方向的一侧(-X侧)，第2供给构件14设置在另一侧(+X侧)。FIG. 2 is a plan view showing a schematic configuration of the liquid supply mechanism 10 and theliquid recovery mechanism 20 . As shown in FIG. 2, the projection area AR1 of the projection optical system PL is set as a slit shape (rectangular) whose longitudinal direction is defined as the Y-axis direction (non-scanning direction), and a liquid-filled layer is formed on a part of the substrate P. The liquid immersion area AR2 of 1 includes the projected area AR1. Furthermore, thefirst supply member 13 of the liquid supply mechanism 10 for forming the liquid immersion area AR2 of the projection area AR1 is provided on one side (-X side) of the scanning direction relative to the projection area AR1, and thesecond supply member 14 is provided on the other side. One side (+X side).

将第1、第2供给构件13、14分别形成为平面视图上呈大致圆弧状，将其供给口13A、14A的Y轴方向上的尺寸设定为至少比投影区域AR1的Y轴方向上的尺寸大。而且，将形成为平面视图上呈大致圆弧状供给口13A、14A配置成在扫描方向(X轴方向)上夹住投影 区域AR1。液体供给机构10经第1、第2供给构件13、14的供给口13A、14A在投影区域AR1的两侧同时供给液体1。The first andsecond supply members 13, 14 are each formed in a substantially circular arc shape in plan view, and the dimension in the Y-axis direction of thesupply ports 13A, 14A is set to be at least larger than that in the Y-axis direction of the projection area AR1. The size is large. Furthermore, thesupply ports 13A, 14A formed in a substantially circular arc shape in plan view are arranged so as to sandwich the projection area AR1 in the scanning direction (X-axis direction). The liquid supply mechanism 10 simultaneously supplies the liquid 1 to both sides of the projection area AR1 through thesupply ports 13A and 14A of the first andsecond supply members 13 and 14 .

液体回收机构20的第1、第2回收构件23、24分别具有连续地形成为圆弧状使之朝向基片P的表面的回收口23A、24A。而且，利用配置成彼此相对的第1、第2回收构件23、24形成了大致圆环状的回收口。将第1、第2回收构件23、24各自的回收口23A、24A配置成包围液体供给机构10的第1、第2供给构件13、14和投影区域AR1。The first andsecond recovery members 23 and 24 of theliquid recovery mechanism 20 respectively haverecovery ports 23A and 24A continuously formed in an arc shape so as to face the surface of the substrate P. As shown in FIG. Furthermore, a substantially annular recovery port is formed by the first andsecond recovery members 23 and 24 arranged to face each other. Therespective recovery ports 23A and 24A of the first andsecond recovery members 23 and 24 are arranged so as to surround the first andsecond supply members 13 and 14 of the liquid supply mechanism 10 and the projection area AR1 .

以下述的方式供给从第1、第2供给构件13、14的供给口13A、14A向基片P供给的液体1，使其在投影光学系统PL的前端部(光学元件2)的下端面与基片P之间润湿扩展。此外，由相对于投影区域AR1配置在该第1、第2供给构件13、14外侧的第1、第2回收构件23、24的回收口23A、24A回收相对于投影区域AR1流到第1、第2供给构件13、14的外侧的液体1。The liquid 1 supplied from thesupply ports 13A, 14A of the first andsecond supply members 13, 14 to the substrate P is supplied in the following manner so that it is placed between the lower end surface of the front end (optical element 2) of the projection optical system PL and Wetting spread between substrates P. In addition, therecovery ports 23A and 24A of the first andsecond recovery members 23 and 24 arranged outside the first andsecond supply members 13 and 14 with respect to the projection region AR1 recover the flow to the first and second supply members relative to the projection region AR1. The liquid 1 outside thesecond supply members 13 and 14 .

在本实施形态中，在对基片P进行扫描曝光时，将在扫描方向上从投影区域AR1的跟前供给的每单位时间的液体供给量设定为比在其相反一侧供给的液体供给量多。例如，在一边在+X方向上移动基片P、一边进行曝光处理的情况下，控制装置CONT使对于投影区域AR1来自-X一侧(即供给口13A)的液体量比来自+X一侧(即供给口14A)的液体量多，另一方面，在一边在-X方向上移动基片P、一边进行曝光处理的情况下，使对于投影区域AR1来自+X一侧的液体量比来自-X一侧的液体量多。此外，在扫描方向上，将在投影区域AR1的跟前的每单位时间的液体回收量设定为比在其相反一侧的液体回收量少。例如，在+X方向上移动了基片P时，使对于投影区域AR1来自+X一侧(即回收口24A)的回收量比来自-X一侧(即回收口23A)的回收量多。In this embodiment, when performing scanning exposure on the substrate P, the liquid supply amount per unit time supplied from the front of the projection area AR1 in the scanning direction is set to be larger than the liquid supply amount supplied from the opposite side. many. For example, in the case of performing exposure processing while moving the substrate P in the +X direction, the control device CONT sets the ratio of the amount of liquid from the -X side (that is, thesupply port 13A) to the projection area AR1 from the +X side. (That is, the amount of liquid in thesupply port 14A) is large. On the other hand, in the case of performing exposure processing while moving the substrate P in the -X direction, the amount of liquid from the +X side with respect to the projection area AR1 is set to be larger than the amount of liquid from the +X side. There is a lot of liquid on the -X side. In addition, in the scanning direction, the amount of liquid recovery per unit time in front of the projection area AR1 is set to be smaller than the amount of liquid recovery on the opposite side. For example, when the substrate P is moved in the +X direction, the recovery amount from the +X side (that is, therecovery port 24A) is larger than the recovery amount from the -X side (that is, therecovery port 23A) with respect to the projected area AR1.

再有，在基片P(基片台PST)上用于局部地形成液浸区域AR2的机构不限于上述，也可采用例如在美国专利公开第2004/020782号公报或国际公开第2004/055803号公报中公开了的机构，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容， 作为本文的记载的一部分。In addition, the mechanism for locally forming the liquid immersion region AR2 on the substrate P (substrate stage PST) is not limited to the above, and for example, the mechanism described in U.S. Patent Publication No. 2004/020782 or International Publication No. 2004/055803 may be used. As long as the institutions disclosed in the Publication No. 1 are permitted by the laws and regulations of the countries designated or selected in this international application, the contents described in these documents are cited as part of the description herein.

图3是从上方看基片架PT的平面图，图4是从上方看保持了基片P的基片架PT的平面图。在图3和图4中，在平面视图为矩形的基片架PT的互相垂直的2个边缘部配置了移动镜55。此外，在基片架PT的大致中央部形成了凹部31，在该凹部31中配置了构成基片架PT的一部分的基片托PH，基片P由基片托PH来保持。在基片P(基片托PH)的周围，设置了具有与基片P的表面大致为同一面的平坦面30A的板构件30。板构件30是环状构件，配置成包围基片托PH(基片P)。利用例如聚四氟乙烯(特富隆(登录商标))那样的氟化物等的具有疏液性的材料形成板构件30。由于在基片P的周围设置了具有与基片P表面大致为同一面的平坦面30A的板构件30，故即使在对基片P的边缘区域E进行液浸曝光时，在投影光学系统PL的像面一侧也能良好地形成液浸区域AR2。FIG. 3 is a plan view of the substrate holder PT seen from above, and FIG. 4 is a plan view of the substrate holder PT holding the substrate P seen from above. In FIGS. 3 and 4 ,movable mirrors 55 are disposed on two mutually perpendicular edge portions of a rectangular substrate holder PT in plan view. Further, a recessedportion 31 is formed substantially in the center of the substrate holder PT, and a substrate holder PH constituting a part of the substrate holder PT is disposed in the recessedportion 31, and the substrate P is held by the substrate holder PH. Around the substrate P (substrate holder PH), aplate member 30 having aflat surface 30A substantially flush with the surface of the substrate P is provided. Theplate member 30 is an annular member disposed so as to surround the substrate holder PH (substrate P). Theplate member 30 is formed of a liquid-repellent material such as fluoride such as polytetrafluoroethylene (Teflon (registered trademark)), for example. Since theplate member 30 having theflat surface 30A substantially flush with the surface of the substrate P is provided around the substrate P, even when liquid immersion exposure is performed on the edge region E of the substrate P, the projection optical system PL The liquid immersion region AR2 can be formed well also on the image plane side of .

再有，如果能以用液体1充满投影光学系统PL的像面一侧的光路空间的方式形成液浸区域AR2，则在基片P的表面与板构件30的平坦面30A中可存在台阶差，例如，在Z方向上，可使平坦面30A比基片P的表面低。Furthermore, if the liquid immersion region AR2 can be formed so that the optical path space on the image plane side of the projection optical system PL is filled with the liquid 1, there may be a step difference between the surface of the substrate P and theflat surface 30A of theplate member 30. For example, theflat surface 30A may be made lower than the surface of the substrate P in the Z direction.

如图1、3和4中所示，在基片架PT上的板构件30(基片托PH)的外侧设置了第2板构件32。第2板构件32具有与基片P的表面或板构件30的平坦面30A大致为同一面的平坦面32A，设置成覆盖基片托PH(基片P)和板构件30以外的基片架PT的上面的大致整个区域。也利用例如聚四氟乙烯等的具有疏液性的材料形成了第2板构件32。As shown in FIGS. 1, 3 and 4, asecond plate member 32 is provided on the outer side of the plate member 30 (substrate holder PH) on the substrate holder PT. Thesecond plate member 32 has aflat surface 32A substantially on the same plane as the surface of the substrate P or theflat surface 30A of theplate member 30, and is provided to cover the substrate holder PH (substrate P) and the substrate holder other than theplate member 30. Almost the entire area above the PT. Thesecond plate member 32 is also formed of a liquid-repellent material such as polytetrafluoroethylene.

再有，板构件30的平坦面30A表面中的液体1的接触角和第2板构件32的平坦面32A表面中的液体1的接触角在照射曝光光EL前的初始状态下，分别大于等于110°。Furthermore, the contact angle of the liquid 1 on the surface of theflat surface 30A of theplate member 30 and the contact angle of the liquid 1 on the surface of theflat surface 32A of thesecond plate member 32 are respectively greater than or equal to 110°.

此外，在第2板构件32的规定的位置上形成了多个开口部32K、32L、32N。在开口部32K中配置了基准构件300。在基准构件300中以规定的位置关系设置了利用基片对准系统350检测的基准标记PFM 和利用掩模对准系统360检测的基准标记MFM。此外，基准构件300的上面301A大致成为平坦面，可作为聚焦、矫正检测系统的基准面来使用。再者，将基准构件300的上面301A设置成与基片P表面、板构件30的表面(平坦面)30A和第2板构件32的表面(平坦面)32A为大致同一面。此外，将基准构件300形成为在平面视图中呈矩形，在开口部32K中配置的基准构件300与第2板构件32之间形成间隙K。在本实施形态中，间隙K例如约为0.3mm。In addition, a plurality ofopenings 32K, 32L, and 32N are formed at predetermined positions of thesecond plate member 32 . Thereference member 300 is disposed in theopening 32K. The fiducial mark PFM detected by thesubstrate alignment system 350 and the fiducial mark MFM detected by themask alignment system 360 are provided in thefiducial member 300 in a predetermined positional relationship. In addition, theupper surface 301A of thereference member 300 is substantially a flat surface, and can be used as a reference surface of a focusing and correction detection system. Furthermore, theupper surface 301A of thereference member 300 is provided substantially flush with the surface of the substrate P, the surface (flat surface) 30A of theplate member 30 , and the surface (flat surface) 32A of thesecond plate member 32 . In addition, thereference member 300 is formed to have a rectangular shape in plan view, and a gap K is formed between thereference member 300 arranged in theopening 32K and thesecond plate member 32 . In this embodiment, the gap K is about 0.3 mm, for example.

作为光传感器，在开口部32L中配置了照度不匀传感器400。照度不匀传感器例如在特开昭57-117238号公报(对应的美国专利第4,465,368号)中公开了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。照度不匀传感器400的上板401的上面401A大致成为平坦面，设置成与基片P表面、板构件30的表面30A和第2板构件32的表面32A为大致同一面。在照度不匀传感器400的上面401A中设置了可通过光的针孔部470。用铬等遮光性材料覆盖了光透过性的上板401的上面401A中针孔部470以外的部分。此外，将照度不匀传感器400(上板401)形成为在平面视图中呈矩形，在开口部32L中配置的照度不匀传感器400(上板401)与第2板构件32之间形成间隙L。在本实施形态中，间隙L例如约为0.3mm。As an optical sensor, anilluminance unevenness sensor 400 is arranged in theopening 32L. The uneven illuminance sensor is disclosed, for example, in Japanese Patent Laid-Open No. 57-117238 (corresponding U.S. Patent No. 4,465,368). As long as it is permitted by the laws and regulations of the country designated or selected in this international application, the contents of these documents are cited. as part of this document. Theupper surface 401A of theupper plate 401 of theilluminance unevenness sensor 400 is substantially flat, and is provided substantially flush with the surface of the substrate P, thesurface 30A of theplate member 30 , and thesurface 32A of thesecond plate member 32 . Apinhole portion 470 through which light can pass is provided on theupper surface 401A of theilluminance unevenness sensor 400 . The portion other than thepinhole portion 470 of theupper surface 401A of the light-transmittingupper plate 401 is covered with a light-shielding material such as chrome. In addition, the uneven illuminance sensor 400 (upper plate 401 ) is formed in a rectangular shape in plan view, and a gap L is formed between the uneven illuminance sensor 400 (upper plate 401 ) arranged in theopening 32L and thesecond plate member 32 . . In this embodiment, the gap L is, for example, about 0.3 mm.

在开口部32N中配置了空间像检测传感器500。空间像检测传感器500例如在特开2002-14005号公报(对应的美国专利公开2002/0041377号)中公开了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。空间像检测传感器500的上板501的上面501A大致成为平坦面，可作为聚焦、矫正检测系统的基准面来使用。而且，设置成与基片P表面、板构件30的表面30A和第2板构件32的表面32A为大致同一面。在空间像检测传感器500的上面501A中设置了可通过光的狭缝部570。用铬等遮光性材料覆盖了光透过性的上板501的上面501A中狭缝部570以外的部分。此外，将空间像检测传感器500(上板501)形 成为在平面视图中呈矩形，在空间像检测传感器500(上板501)与开口部32N之间形成间隙N。在本实施形态中，间隙N与基片P的外形的制造公差为同等程度，例如约为0.3mm。这样，保持基片P的基片架PT的上面在整个面上大致为同一面。The aerialimage detection sensor 500 is disposed in theopening 32N. The aerialimage detection sensor 500 is disclosed, for example, in JP-A-2002-14005 (corresponding U.S. Patent Publication No. 2002/0041377). As long as it is permitted by the laws and regulations of the country designated or selected in this international application, the descriptions of these documents are cited Content, as part of the description of this article. Theupper surface 501A of theupper plate 501 of the aerialimage detection sensor 500 is substantially a flat surface, and can be used as a reference plane for focusing and correction detection systems. And, it is provided so as to be substantially flush with the surface of the substrate P, thesurface 30A of theplate member 30 , and thesurface 32A of thesecond plate member 32 . Aslit portion 570 through which light can pass is provided on theupper surface 501A of the aerialimage detection sensor 500 . The portion other than theslit portion 570 of theupper surface 501A of the light-transmittingupper plate 501 is covered with a light-shielding material such as chrome. In addition, the aerial image detection sensor 500 (upper plate 501) is formed in a rectangular shape in plan view, and a gap N is formed between the aerial image detection sensor 500 (upper plate 501) and theopening 32N. In this embodiment, the gap N is on the same level as the manufacturing tolerance of the outer shape of the substrate P, for example, about 0.3 mm. In this way, the upper surface of the substrate holder PT holding the substrate P is substantially uniform over the entire surface.

再有，如果能以用液体1充满投影光学系统PL的像面一侧的光路空间的方式形成液浸区域AR2，则在板构件30的平坦面30A与第2板构件32的表面32A与基准构件300的上面301A与照度不匀传感器400的上面401A与空间像检测传感器500的上面501A之间彼此可存在台阶差。Furthermore, if the liquid immersion region AR2 can be formed so that the optical path space on the image plane side of the projection optical system PL is filled with the liquid 1, theflat surface 30A of theplate member 30 and thesurface 32A of thesecond plate member 32 and the reference There may be a step difference between theupper surface 301A of thecomponent 300 , theupper surface 401A of theillumination unevenness sensor 400 , and theupper surface 501A of the aerialimage detection sensor 500 .

此外，虽然未图示，但在基片架PT中也设置了照射量传感器(照度传感器)，配置在第2板构件32中形成的开口部中。照射量传感器例如在特开平11-16816号公报(对应的美国专利公开2002/0061469号)中公开了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。In addition, although not shown, an irradiation amount sensor (illuminance sensor) is also provided in the substrate holder PT, and is arranged in the opening formed in thesecond plate member 32 . The exposure sensor is disclosed in, for example, Japanese Patent Laid-Open No. 11-16816 (corresponding U.S. Patent Publication No. 2002/0061469). As long as it is permitted by the laws and regulations of the country designated or selected in this international application, the contents of these documents are cited. as part of this document.

再有，在基片架PT上安装的检测器不限于上述的传感器，可根据需要按照各种检测器。例如，可在基片架PT上配置波面像差检测器。波面像差检测器例如在国际公开99/60361号公报(对应的欧洲专利公开1,079,223号公报)或美国专利第6,650,399号中公开了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。当然，也可不在基片架PT上安装检测器。In addition, the detectors mounted on the substrate holder PT are not limited to the above-mentioned sensors, and various detectors may be used as needed. For example, a wavefront aberration detector may be disposed on the substrate holder PT. The wavefront aberration detector is disclosed, for example, in International Publication No. 99/60361 (corresponding European Patent Publication No. 1,079,223) or U.S. Patent No. 6,650,399, as long as it is permitted in the laws of the country designated or selected in this international application, The description contents of these documents are cited as a part of the description herein. Of course, the detector may not be mounted on the substrate holder PT.

此外，将板构件30中以圆环状形成的平坦面30A的宽度形成为至少比投影区域AR1大(参照图4)。因此，在对基片P的边缘区域E曝光时，曝光光EL不会照射到第2板构件32上。由此，可抑制起因于曝光光的照射的第2板构件32的疏液性的恶化，可使第2板构件32的更换频度少于板构件30的更换频度。再者，最好将平坦面30A的宽度形成得比在投影光学系统PL的像面一侧形成的液浸区域AR2大。由此，在对基片P的边缘区域E进行液浸曝光时，由于在板构件30的平坦面30A上配置液浸区域AR2而不在第2板构件32上配置液 浸区域AR2，故可防止液浸区域AR2的液体1侵入到作为板构件30与第2板构件32的间隙的间隙G中的不良情况。再有，板构件30的平坦面30A的宽度不限定于此，当然也可比液浸区域AR2小。In addition, the width of theflat surface 30A formed in an annular shape in theplate member 30 is formed to be larger than at least the projected area AR1 (see FIG. 4 ). Therefore, when exposing the edge region E of the substrate P, the exposure light EL is not irradiated onto thesecond plate member 32 . Thereby, deterioration of the lyophobic property of thesecond plate member 32 due to irradiation of exposure light can be suppressed, and the replacement frequency of thesecond plate member 32 can be made less than that of theplate member 30 . Furthermore, it is preferable to form the width of theflat surface 30A larger than the liquid immersion area AR2 formed on the image plane side of the projection optical system PL. Thus, when liquid immersion exposure is performed on the edge region E of the substrate P, since the liquid immersion region AR2 is arranged on theflat surface 30A of theplate member 30 and the liquid immersion region AR2 is not arranged on thesecond plate member 32, it is possible to prevent The disadvantage is that the liquid 1 in the liquid immersion area AR2 intrudes into the gap G which is the gap between theplate member 30 and thesecond plate member 32 . In addition, the width of theflat surface 30A of theplate member 30 is not limited to this, and of course may be smaller than the liquid immersion area AR2.

如图3和作为保持基片P的基片架PT的主要部分放大剖面图的图5中所示，构成基片架PT的一部分的基片托PH具备：大致圆环状的周壁部33；在该周壁部33的内侧的基座部35上设置的、支撑基片P的多个支撑部34；以及在支撑部34之间配置的、用于吸附保持基片P的多个吸引口41。在周壁部33的内侧一样地配置了支撑部34和吸引口41。再有，在图5中，周壁部33的上端面具有比较宽的宽度，但实际上只有约1～2mm的宽度。此外，在基座部35上设置了配置由升降基片P的销钉构件构成的升降构件70的孔部71。在本实施形态中，在3个部位上设置了升降构件70。利用未图示的驱动装置来升降升降构件70，控制装置CONT经驱动装置控制升降构件70的升降工作。As shown in FIG. 3 and FIG. 5 which is an enlarged sectional view of the main part of the substrate holder PT holding the substrate P, the substrate holder PH constituting a part of the substrate holder PT has: a substantially annularperipheral wall portion 33; A plurality of support parts 34 for supporting the substrate P provided on the base part 35 inside theperipheral wall part 33; . The support portion 34 and the suction port 41 are uniformly arranged inside theperipheral wall portion 33 . In addition, in Fig. 5, the upper end surface of theperipheral wall portion 33 has a relatively wide width, but actually only has a width of about 1 to 2 mm. Furthermore, a hole portion 71 in which an elevatingmember 70 constituted by a pin member for elevating and elevating the substrate P is disposed is provided in the base portion 35 . In this embodiment, the elevatingmembers 70 are provided at three places. The elevatingmember 70 is raised and lowered by a driving device not shown, and the control device CONT controls the elevating operation of the elevatingmember 70 via the driving device.

此外，如图5中所示，在基片架PT上面中与板构件30的下面对置的位置上设置了多个用于对于基片架PT吸附保持该板构件30的吸附孔72。再者，在基片架PT中，在多个位置(在此是3个部位)上设置了由对于基片架PT升降板构件30的销钉构件构成的升降构件74。利用未图示的驱动装置来升降升降构件74，控制装置CONT经驱动装置控制升降构件74的升降工作(参照图7(d))。再者，虽然未图示，但在基片架PT上面中与第2板构件32的下面对置的位置上设置了多个用于对于基片架PT吸附保持该第2板构件32的吸附孔。再者，在基片架PT中，在多个位置上设置了对于基片架PT升降第2板构件32的升降构件。In addition, as shown in FIG. 5 , a plurality of adsorption holes 72 for adsorbing and holding theplate member 30 to the substrate holder PT are provided at positions facing the lower surface of theplate member 30 in the upper surface of the substrate holder PT. Furthermore, in the substrate rack PT,lift members 74 constituted by pin members for thelift plate member 30 of the substrate rack PT are provided at a plurality of positions (three positions in this case). The elevatingmember 74 is raised and lowered by a driving device not shown, and the control device CONT controls the elevating operation of the elevatingmember 74 via the driving device (see FIG. 7( d )). In addition, although not shown in the figure, a plurality of holes for sucking and holding thesecond plate member 32 to the substrate holder PT are provided at positions facing the lower surface of thesecond plate member 32 on the upper surface of the substrate holder PT. adsorption hole. Furthermore, in the substrate rack PT, elevating members for elevating and lowering thesecond plate member 32 with respect to the substrate rack PT are provided at a plurality of positions.

再有，由于如前面所述，第2板构件32的更换频度少，故也可不将其吸附保持在基片架PT上，而是利用螺钉拧紧等来固定，用手动方式进行更换作业。此外，也可不使第2板构件32成为能更换的构件。In addition, since the frequency of replacement of thesecond plate member 32 is low as described above, it may be fixed by screwing or the like instead of being adsorbed and held on the substrate holder PT, and the replacement operation may be performed manually. In addition, thesecond plate member 32 does not need to be a replaceable member.

但是，在使用基准构件300或照度不匀传感器400等时，在对第 2板构件32照射了曝光光EL或与曝光光为同一波长的光的情况下，存在第2板构件32的表面的疏液性恶化的危险，存在与板构件30同样的更换频度为必要的可能性。However, when using thereference member 300 or theilluminance unevenness sensor 400, etc., when thesecond plate member 32 is irradiated with the exposure light EL or light having the same wavelength as the exposure light, there is a gap on the surface of thesecond plate member 32. There is a risk that liquid repellency may deteriorate, and there is a possibility that the same replacement frequency as that of theplate member 30 will be necessary.

此外，如图4和图5中所示，在由基片托PH(基片架PT)保持的基片P的侧面PB与板构件30之间形成了规定的间隙A。Further, as shown in FIGS. 4 and 5 , a prescribed gap A is formed between the side surface PB of the substrate P held by the substrate holder PH (substrate holder PT) and theplate member 30 .

在图5中，在基片架PT的凹部31内部配置了保持基片P的基片托PH。在凹部31中配置了基片托PH时，将基片架PT形成为该基片托PH的上端面34A比基片架PT的对于板构件30和第2板构件32的放置面PTa高。在构成基片托PH的一部分的大致圆板状的基座部35上设置了周壁部33和支撑部34。支撑部34各自的剖面为梯形，由多个支撑部34的上端面34A保持基片P的背面PC。此外，周壁部33的上面33A为平坦面。周壁部33的高度比支撑部34的高度低。在基片P与周壁部33之间形成了间隙B。间隙B比板构件30与基片P的侧面PB之间的间隙A小。此外，在凹部31的内侧面36与对置于该内侧面36的基片托PH的侧面37之间形成了间隙C。在此，将基片托PH的直径形成得比基片P的直径小，间隙A比间隙C小。再有，在本实施形态中，在基片P中未形成位置对准用的缺口部(定位边、定位槽)，基片P大致呈圆形，由于在其全部的圆周上间隙A为0.1mm～1.0mm，在本实施形态中约为0.3mm，故可防止液体的流入。再有，在基片P中形成缺口部的情况下，根据该缺口部在板构件30或周壁部33中设置凸起部等使板构件30或周壁部33成为与缺口部对应的形状即可。通过这样做，即使在基片P的缺口部中，在基片P与板构件30之间也能确保间隙A。In FIG. 5 , a substrate holder PH holding a substrate P is arranged inside theconcave portion 31 of the substrate holder PT. When the substrate holder PH is arranged in therecess 31, the substrate holder PT is formed such that the upper end surface 34A of the substrate holder PH is higher than the placement surface PTa of the substrate holder PT on theplate member 30 and thesecond plate member 32. Aperipheral wall portion 33 and a support portion 34 are provided on a substantially disc-shaped base portion 35 constituting a part of the substrate holder PH. Each of the support portions 34 has a trapezoidal cross section, and the back surface PC of the substrate P is held by the upper end surfaces 34A of the plurality of support portions 34 . Moreover, the upper surface 33A of the surroundingwall part 33 is a flat surface. The height of theperipheral wall portion 33 is lower than that of the support portion 34 . A gap B is formed between the substrate P and theperipheral wall portion 33 . The gap B is smaller than the gap A between theplate member 30 and the side surface PB of the substrate P. As shown in FIG. Furthermore, a gap C is formed between the inner surface 36 of theconcave portion 31 and the side surface 37 of the substrate holder PH that is opposed to the inner surface 36 . Here, the diameter of the substrate holder PH is formed smaller than that of the substrate P, and the gap A is smaller than the gap C. Furthermore, in this embodiment, no notches (positioning edges, positioning grooves) for position alignment are formed in the substrate P, and the substrate P is approximately circular, and the gap A is 0.1 on its entire circumference. mm to 1.0 mm, and in this embodiment is about 0.3 mm, so that the inflow of liquid can be prevented. Furthermore, in the case of forming a notch in the base sheet P, it is sufficient to provide a protrusion or the like in theplate member 30 or theperipheral wall portion 33 according to the notch so that theplate member 30 or theperipheral wall portion 33 has a shape corresponding to the notch. . By doing so, even in the notch portion of the substrate P, the gap A can be ensured between the substrate P and theplate member 30 .

在板构件30的内侧形成了内侧台阶部30D，利用该内侧台阶部30D形成了与基片下面PC的边缘部对置的支撑面30S。板构件30可利用支撑面30S支撑基片下面PC的边缘部。在此，如图5中所示，在由基片托PH保持的基片下面PC的边缘部与由基片架PT的放置面PTa保持的板构件30的支撑面30S之间形成间隙D。由此，可避免因板构件30(支撑面30S)与基片下面PC的边缘部接触而使该基片P 的边缘部向上侧翘曲的不良情况的发生。An inner stepped portion 30D is formed on the inner side of theplate member 30 , and asupport surface 30S facing the edge portion of the substrate lower surface PC is formed by the inner stepped portion 30D. Theplate member 30 can support the edge portion of the PC under the substrate with thesupport surface 30S. Here, as shown in FIG. 5 , a gap D is formed between the edge portion of the substrate lower face PC held by the substrate holder PH and thesupport surface 30S of theplate member 30 held by the placement surface PTa of the substrate holder PT. Thereby, it is possible to avoid the inconvenience that the edge portion of the substrate P is warped upward due to the contact of the plate member 30 (support surface 30S) with the edge portion of the substrate lower surface PC.

此外，在第2板构件32的内侧形成了内侧台阶部32D，在板构件30的外侧形成了外侧台阶部30F，使其与第2板构件32的内侧台阶部32D的形状相对应。由此，成为在第2板构件32的一部分上放置板构件30的一部分的状态。此外，在板构件30的外侧面与第2板构件32的内侧面之间形成规定的间隙G。本实施形态中的间隙G例如约为0.3mm，由于用表面具有疏液性的聚四氟乙烯制的板构件30和第2板构件32来夹住，故即使在板构件30与第2板构件32的边界上形成了液浸区域，也可防止液体对间隙G的侵入。In addition, an inner steppedportion 32D is formed inside thesecond plate member 32 , and an outer steppedportion 30F is formed outside theplate member 30 so as to correspond to the shape of the inner steppedportion 32D of thesecond plate member 32 . As a result, a part of theplate member 30 is placed on a part of thesecond plate member 32 . In addition, a predetermined gap G is formed between the outer surface of theplate member 30 and the inner surface of thesecond plate member 32 . The gap G in this embodiment is, for example, about 0.3mm. Since theplate member 30 and thesecond plate member 32 made of polytetrafluoroethylene having liquid repellency on the surface are sandwiched, even if theplate member 30 and the second plate member A liquid immersion area is formed on the boundary of themember 32, which can also prevent the intrusion of liquid into the gap G.

在作为基片P的曝光面的表面PA上涂敷了光刻胶(感光材料)90。在本实施形态中，感光材料90是ArF准分子激光器用的感光材料(例如，东京应化工业株式会社制TARF-P6100)，具有疏液性(疏水性)，其接触角约为70～80°。On the surface PA which is the exposure side of the substrate P, a photoresist (photosensitive material) 90 is coated. In this embodiment, the photosensitive material 90 is a photosensitive material for an ArF excimer laser (for example, TARF-P6100 manufactured by Tokyo Ohka Industry Co., Ltd.), has liquid repellency (hydrophobic property), and its contact angle is about 70 to 80. °.

此外，在本实施形态中，对基片P的侧面PB进行了疏液处理(疏水处理)。具体地说，在基片P的侧面PB上也涂敷了具有疏液性的上述感光材料90。由此，可防止来自表面呈疏液性的板构件30与基片P侧面PB的间隙A的液体的侵入。再者，在基片P的背面PB上也涂敷上述感光材料90，进行了疏液处理。In addition, in this embodiment, the side surface PB of the substrate P is subjected to a liquid-repellent treatment (hydrophobic treatment). Specifically, the above-mentioned photosensitive material 90 having liquid repellency is also coated on the side surface PB of the substrate P. As shown in FIG. Thus, intrusion of liquid from the gap A between theplate member 30 having a lyophobic surface and the side surface PB of the substrate P can be prevented. Furthermore, the above-mentioned photosensitive material 90 is also coated on the back surface PB of the substrate P, and subjected to a liquid-repellent treatment.

在本实施形态中，在基片架PT中，放置面PTa和内侧面36具有疏液性。再者，在基片托PH的一部分上也进行疏液处理，呈疏液性。在本实施形态中，基片托PH中周壁部33的上面33A和侧面37具有疏液性。作为基片架PT和基片托PH的疏液处理，例如涂敷氟树脂材料或丙烯酸树脂材料等的疏液性材料或粘贴由上述疏液性材料构成的薄膜。作为用于使之呈疏液性的疏液性材料，可疏液非溶解性的材料。再有，也可用具有疏液性的材料(氟树脂等)形成基片架PT和基片托PH的整体。In the present embodiment, in the substrate holder PT, the mounting surface PTa and the inner surface 36 have liquid repellency. Furthermore, a part of the substrate holder PH is also subjected to a liquid-repellent treatment, so that it becomes liquid-repellent. In this embodiment, the upper surface 33A and the side surface 37 of theperipheral wall portion 33 in the substrate holder PH have liquid repellency. As the liquid-repellent treatment of the substrate holder PT and the substrate holder PH, for example, a liquid-repellent material such as a fluororesin material or an acrylic resin material is applied or a film made of the above-mentioned liquid-repellent material is pasted. As the lyophobic material for making it lyophobic, a lyophobic and insoluble material may be used. Furthermore, the substrate holder PT and the substrate holder PH may be integrally formed of a liquid-repellent material (fluororesin, etc.).

利用吸引装置40使由基片托PH的周壁部33包围的第1空间38呈负压。吸引装置40具备：在基片托PH的基座部35上面设置的多个吸引口41；包含在基片架PT外部设置的真空泵的真空部42；以及 在基座部35内部形成的、连接多个吸引口41的每一个与真空部42的流路43。分别在基座部35上面中支撑部34以外的多个规定位置上设置了吸引口41。吸引装置40通过吸引在周壁部33、基座部35与由支撑部34支撑的基片P之间形成的第1空间38内部的气体(空气)使该第1空间38呈负压，将基片P吸附保持在支撑部34上。再有，由于基片P的背面PC与周壁部33上面33A的间隙B很微小，故维持了第1空间38的负压。The first space 38 surrounded by theperipheral wall portion 33 of the substrate holder PH is negatively pressured by the suction device 40 . The suction device 40 is provided with: a plurality of suction ports 41 provided on the base portion 35 of the substrate holder PH; a vacuum portion 42 including a vacuum pump provided outside the substrate holder PT; Each of the plurality of suction ports 41 is connected to the flow path 43 of the vacuum unit 42 . Suction openings 41 are provided at a plurality of predetermined positions on the upper surface of the base portion 35 other than the support portion 34 . The suction device 40 makes the first space 38 negative pressure by sucking gas (air) inside the first space 38 formed between theperipheral wall portion 33, the base portion 35, and the substrate P supported by the support portion 34, and the substrate P The sheet P is adsorbed and held on the support portion 34 . Furthermore, since the gap B between the back surface PC of the substrate P and the upper surface 33A of theperipheral wall portion 33 is very small, the negative pressure of the first space 38 is maintained.

此外，流入到凹部31的内侧面36与基片托PH的侧面37之间的第2空间39中的液体1被回收部60回收。在本实施形态中，回收部60具有：可容纳液体1的容器61；以及在基片架PT内部设置的、连接空间39与外部的容器61的流路62。而且，在该流路62的内壁面上也进行了疏液处理。再有，也可在基片台PST(基片架PT)中暂时地保持流入到空间39中的液体，在规定的定时将其排出到与基片台PST分开地设置的外部容器等中。Furthermore, the liquid 1 that has flowed into the second space 39 between the inner surface 36 of theconcave portion 31 and the side surface 37 of the substrate holder PH is recovered by the recovery unit 60 . In the present embodiment, the recovery unit 60 has a container 61 capable of containing the liquid 1 , and a flow path 62 provided inside the substrate holder PT to connect the space 39 and the external container 61 . Furthermore, the liquid-repellent treatment is also performed on the inner wall surface of the flow path 62 . In addition, the liquid flowing into the space 39 may be temporarily held in the substrate stage PST (substrate holder PT), and discharged to an external container or the like provided separately from the substrate stage PST at a predetermined timing.

在基片架PT中形成了连接凹部31的内侧面36与基片托PH的侧面37之间的第2空间39与基片架PT外部的空间(大气空间)的流路45。气体(空气)可经流路45在第2空间39和基片架PT外部流通，将第2空间39的气压大致设定为大气压。A flow path 45 connecting the second space 39 between the inner surface 36 of theconcave portion 31 and the side surface 37 of the substrate holder PH to the space outside the substrate holder PT (atmospheric space) is formed in the substrate holder PT. Gas (air) can flow through the flow path 45 between the second space 39 and the outside of the substrate holder PT, and the gas pressure in the second space 39 is set to approximately atmospheric pressure.

如图6中所示，基片托PH、板构件30和第2板构件32是独立的部件，设置成对于基片架PT可装卸。而且，对基片架PT中与基片托PH的接触面57进行疏液处理，使其呈疏液性，同时也对作为对于基片架PT的接触面的基片托PH的背面58进行疏液处理，使其具有疏液性。作为对于接触面57或背面58的疏液处理，如上所述，可涂敷氟树脂材料或丙烯酸树脂材料等的疏液性材料等来进行。As shown in FIG. 6, the substrate holder PH, theplate member 30, and thesecond plate member 32 are independent components, and are provided so as to be detachable from the substrate holder PT. Moreover, thesurface 57 of the substrate holder PT in contact with the substrate holder PH is subjected to a lyophobic treatment to make it liquid-repellent, and at the same time, theback surface 58 of the substrate holder PH, which is the contact surface with the substrate holder PT, is subjected to a lyophobic treatment. Lyophobic treatment to make it liquid repellent. The liquid-repellent treatment on thecontact surface 57 or theback surface 58 may be performed by coating a liquid-repellent material such as a fluororesin material or an acrylic resin material, as described above.

其次，一边参照图7和图8的示意图，一边说明使用具有上述的结构的曝光装置EX对基片P曝光的方法。Next, a method of exposing the substrate P using the exposure apparatus EX having the above-mentioned configuration will be described with reference to the schematic diagrams of FIGS. 7 and 8 .

如图7(a)中所示，由基片架PT的放置面PTa吸附保持板构件30，同时也由基片架PT的放置面PTa吸附保持第2板构件32。而且，利用运送臂(运送装置)80将作为曝光处理对象的基片P运入到 基片架PT上。此时，升降构件70上升，运送臂80将基片P交给上升了的升降构件70。再有，升降构件74未上升。升降构件70保持由从运送臂80交给的基片P并使其下降。如图7(b)中所示，在板构件30的内侧配置基片P，由基片架PT(基片托PH)来保持。然后，如图7(c)中所示，控制装置CONT利用液体供给机构10和液体回收机构20进行液体1的供给和回收，在由基片架PT保持的基片P与投影光学系统PL之间形成液体1的液浸区域AR2。然后，控制装置CONT经投影光学系统PL和液体1对基片P照射曝光光EL，一边移动支撑了基片P的基片台PST，一边进行液浸曝光。As shown in FIG. 7( a ), theplate member 30 is sucked and held by the placement surface PTa of the substrate rack PT, and thesecond plate member 32 is also sucked and held by the placement face PTa of the substrate rack PT. Then, the substrate P to be subjected to exposure processing is carried into the substrate holder PT by a transport arm (transport device) 80. At this time, the elevatingmember 70 rises, and thetransport arm 80 delivers the substrate P to the elevatingmember 70 that has been raised. In addition, the elevatingmember 74 does not ascend. The elevatingmember 70 holds and descends the substrate P delivered from thetransport arm 80 . As shown in FIG. 7(b), the substrate P is disposed inside theplate member 30 and held by a substrate holder PT (substrate holder PH). Then, as shown in FIG. 7(c), the control device CONT uses the liquid supply mechanism 10 and theliquid recovery mechanism 20 to supply and recover the liquid 1, between the substrate P held by the substrate holder PT and the projection optical system PL. The liquid immersion area AR2 of the liquid 1 is formed between them. Then, the control device CONT irradiates the substrate P with the exposure light EL via the projection optical system PL and the liquid 1, and performs liquid immersion exposure while moving the substrate stage PST supporting the substrate P.

通过对基片P的边缘区域E曝光，曝光光EL照射到板构件30的平坦面30A上，由于该曝光光EL的照射的缘故，存在平坦面30A的疏液性恶化的可能性。如果平坦面30A的疏液性恶化，则在平坦面30A上配置的液浸区域AR2的液体1容易残留，产生引起放置了基片P的环境变动等的不良情况。因此，控制装置CONT根据板构件30(平坦面30A)的疏液性的恶化，将该疏液性恶化了的板构件30与新的(充分地具有疏液性)板构件30更换。When the edge region E of the substrate P is exposed, theflat surface 30A of theplate member 30 is irradiated with the exposure light EL, and the liquid repellency of theflat surface 30A may deteriorate due to the irradiation of the exposure light EL. If the liquid repellency of theflat surface 30A is deteriorated, the liquid 1 in the liquid immersion region AR2 disposed on theflat surface 30A tends to remain, causing problems such as changes in the environment where the substrate P is placed. Therefore, the control device CONT replaces theplate member 30 having deteriorated liquid repellency with a new (sufficiently liquid repellent)plate member 30 according to the deterioration of the liquid repellency of the plate member 30 (flat surface 30A).

具体地说，在液浸曝光处理的结束后，在使用液体回收机构20等回收了在基片P上或平坦面30A上残留的液体1后，如图7(d)中所示，控制装置CONT在解除了对于板构件30的吸附保持后，使升降构件74上升。此时，也解除由基片托PH进行的基片P的吸附保持。升降构件74在支撑了板构件30的下面的状态下上升。再有，此时，升降构件70未上升。由此，板构件30离开基片架PT。此时，由于板构件30的支撑面30S支撑了基片下面PC的边缘部，故基片P与板构件30一起上升，离开基片架PT。这样，构成对于基片架PT装卸板构件30的装卸机构的升降构件74可与基片P一起从基片架PT取下板构件30。然后，运送臂80进入利用升降构件74上升了的板构件30与基片架PT之间，支撑板构件30的下面。然后，运送臂80从基片架PT(基片台PST)运出保持了基片P的板构件30。Specifically, after the liquid immersion exposure process is finished, after the liquid 1 remaining on the substrate P or on theflat surface 30A is recovered using theliquid recovery mechanism 20 or the like, as shown in FIG. 7( d), the control device CONT raises the liftingmember 74 after releasing the adsorption and holding of theplate member 30 . At this time, the suction holding of the substrate P by the substrate holder PH is also released. The elevatingmember 74 ascends while supporting the lower surface of theplate member 30 . Note that, at this time, the elevatingmember 70 is not raised. Thus, theplate member 30 is separated from the substrate holder PT. At this time, since the supportingsurface 30S of theplate member 30 supports the edge portion of the lower surface PC of the substrate, the substrate P rises together with theplate member 30 and leaves the substrate holder PT. Thus, the elevatingmember 74 constituting the attaching and detaching mechanism for attaching and detaching theplate member 30 to the substrate rack PT can remove theplate member 30 from the substrate rack PT together with the substrate P. Then, thetransfer arm 80 enters between theplate member 30 raised by the elevatingmember 74 and the substrate rack PT, and supports the lower surface of theplate member 30 . Then, thetransport arm 80 transports theplate member 30 holding the substrate P from the substrate rack PT (substrate stage PST).

已运出的板构件30与新的板构件30更换。然后，如图8(a)中 所示，控制装置CONT使用运送臂80将保持了作为曝光处理对象的基片P的新的板构件30运入到基片架PT(基片台PST)上。此时，升降构件74上升，运送臂80将保持了基片P的板构件30交给上升了的升降构件74。再有，升降构件70未上升。升降构件74保持由从运送臂80交给的基片P并使其下降。由此，如图8(b)中所示，在板构件30的内侧配置保持了基片P的板构件30，由基片架PT(基片托PH)来保持。然后，如图8(c)中所示，控制装置CONT利用液体供给机构10和液体回收机构20进行液体1的供给和回收，在由基片架PT保持的基片P与投影光学系统PL之间形成液体1的液浸区域AR2。然后，控制装置CONT经投影光学系统PL和液体1对基片P照射曝光光EL，一边移动支撑了基片P的基片台PST，一边进行液浸曝光。Theplate member 30 that has been shipped out is replaced with anew plate member 30 . Then, as shown in FIG. 8(a), the control device CONT uses thetransport arm 80 to transport thenew plate member 30 holding the substrate P to be subjected to exposure processing onto the substrate holder PT (substrate stage PST). . At this time, the liftingmember 74 rises, and thetransport arm 80 hands theplate member 30 holding the substrate P to the raised liftingmember 74 . In addition, the elevatingmember 70 does not ascend. The elevatingmember 74 holds and descends the substrate P delivered from thetransport arm 80 . Thus, as shown in FIG. 8( b ), theplate member 30 holding the substrate P is disposed inside theplate member 30 and held by the substrate holder PT (substrate holder PH). Then, as shown in FIG. 8(c), the control device CONT uses the liquid supply mechanism 10 and theliquid recovery mechanism 20 to supply and recover the liquid 1 between the substrate P held by the substrate holder PT and the projection optical system PL. The liquid immersion area AR2 of the liquid 1 is formed between them. Then, the control device CONT irradiates the substrate P with the exposure light EL via the projection optical system PL and the liquid 1, and performs liquid immersion exposure while moving the substrate stage PST supporting the substrate P.

然后，在板构件30的疏液性还未恶化时，在液浸曝光的结束后，在使用液体回收机构20等回收了在基片P上或板构件30的平坦面30A等上残留的液体1后，控制装置CONT在解除了对于基片P的吸附保持后，如图8(d)中所示，使升降构件70上升。此时，板构件30由基片架PT进行了吸附保持。升降构件70在支撑了基片P的下面的状态下上升。再有，此时，升降构件74不上升。由此，基片P从基片架PT离开。然后，运送臂80进入利用升降构件70上升了的基片P与基片架PT之间，支撑基片P的下面。然后，运送臂80从基片架PT(基片台PST)运出基片P。Then, when the liquid repellency of theplate member 30 has not deteriorated, the liquid remaining on the substrate P or theflat surface 30A of theplate member 30 or the like is recovered using theliquid recovery mechanism 20 or the like after the liquid immersion exposure is completed After 1, the control device CONT lifts the elevatingmember 70 as shown in FIG. At this time, theplate member 30 is sucked and held by the substrate holder PT. The elevatingmember 70 ascends while supporting the lower surface of the substrate P. As shown in FIG. In addition, at this time, the elevatingmember 74 does not ascend. Thereby, the substrate P is separated from the substrate holder PT. Then, thetransfer arm 80 enters between the substrate P raised by the elevatingmember 70 and the substrate holder PT, and supports the lower surface of the substrate P. As shown in FIG. Then, thetransport arm 80 carries out the substrate P from the substrate rack PT (substrate stage PST).

再有，作为运送臂80，可分别地设置用于运送板构件30的运送臂和用于运送基片P的运送臂，但如图9中所示，通过将运送臂80的支撑面80A形成得较大，可与基片P和板构件30这两者接触，由于可支撑基片P和板构件30这两者，故可用1个运送臂80运送基片P和板构件30这两者。Furthermore, as thetransport arm 80, a transport arm for transporting theplate member 30 and a transport arm for transporting the substrate P may be provided separately, but as shown in FIG. It is large enough to be in contact with both the substrate P and theplate member 30. Since both the substrate P and theplate member 30 can be supported, both the substrate P and theplate member 30 can be transported by onetransport arm 80. .

如以上已说明的那样，由于设置成可更换在基片架PT上设置的疏液性的板构件30、32，故在该板构件30、32的疏液性恶化了时，只通过与新的板构件30、32更换，就可维持基片架PT上的疏液性。As described above, since the liquid-repellent plate members 30, 32 provided on the substrate holder PT are replaceable, when the liquid-repellent properties of theplate members 30, 32 have deteriorated, the The liquid repellency on the substrate holder PT can be maintained by replacing theplate members 30, 32.

在为了使基片架PT上的板构件30、32的上面呈疏液性而涂敷疏液性材料或用疏液性材料形成板构件30、32的情况下，如果照射曝光光，则有时其疏液性恶化。特别是在使用氟树脂作为疏液性材料、使用紫外光作为曝光光的情况下，该板构件30、32的疏液性容易恶化(容易亲液化)。于是，液体容易残留在板构件30、32上。In order to make the upper surface of theplate members 30, 32 on the substrate holder PT lyophobic and apply a lyophobic material or form theplate members 30, 32 with a lyophobic material, if exposure light is irradiated, sometimes Its liquid repellency deteriorates. In particular, when a fluororesin is used as the lyophobic material and ultraviolet light is used as the exposure light, the lyophobic property of theplate members 30 and 32 tends to deteriorate (easy to become lyophilic). Then, the liquid easily remains on theplate members 30 , 32 .

对次，在本实施形态中，在板构件30、32的疏液性恶化了时，与新的板构件30、32更换。On the other hand, in this embodiment, when the liquid repellency of theplate members 30 and 32 deteriorates, they are replaced withnew plate members 30 and 32 .

因而，可抑制液体1残留在基片架PT上，例如即使残留，也可使用液体回收机构20等顺利地回收该液体1。因而，可防止起因于残留的液体1的曝光精度的恶化，制造出具有所需性能的器件。Therefore, it is possible to suppress the liquid 1 from remaining on the substrate holder PT, and even if it remains, the liquid 1 can be recovered smoothly by using theliquid recovery mechanism 20 or the like. Therefore, deterioration of exposure accuracy due to the remaining liquid 1 can be prevented, and a device having desired performance can be manufactured.

此外，通过与基片P一起相对基片架PT运入和运出在基片P的周围具有平坦面30A的板构件30，可容易地与基片P一起对基片架PT更换板构件30。此外，由于板构件30在基片P的周围具有平坦面30A，故在与基片P一起将该板构件30运入到基片架PT上对基片P的边缘区域E进行液浸曝光时，即使液体1的液浸区域AR2的一部分在基片P的外侧伸出，也可利用平坦面30A维持液浸区域AR2的形状，可在投影光学系统PL的像面一侧良好地保持液体1的状态下进行液浸曝光而不导致液体1的流出等。In addition, by carrying in and out theplate member 30 having theflat surface 30A around the substrate P relative to the substrate holder PT together with the substrate P, theplate member 30 can be easily replaced with the substrate P to the substrate holder PT. . In addition, since theplate member 30 has theflat surface 30A around the substrate P, when carrying theplate member 30 together with the substrate P onto the substrate holder PT to perform liquid immersion exposure on the edge region E of the substrate P, Even if part of the liquid immersion region AR2 of the liquid 1 protrudes outside the substrate P, the shape of the liquid immersion region AR2 can be maintained by theflat surface 30A, and the liquid 1 can be well retained on the image plane side of the projection optical system PL. The liquid immersion exposure is performed in the state without causing the liquid 1 to flow out or the like.

而且，由于在板构件30的内侧设置内侧台阶部30D，形成支撑面30S，可支撑基片下面PC的边缘部，故只保持并移动板构件30，就可与该板构件30一起也移动基片P。此外，由于因内侧台阶部30D的缘故，在板构件30与基片P之间的间隙中，在剖面视图中形成弯曲的角部，故即使假定液体1侵入到板构件30与基片P之间的间隙A中，弯曲的角部也起到密封部的功能，可防止该液体1侵入到基片P的背面PC一侧或基片台PST(基片托PH)内部的不良情况。再者，由于对基片P的侧面PB也进行了疏液处理，故可更良好地防止来自基片P的侧面PB与板构件30之间的间隙A的液体1的侵入。Moreover, since the inside step portion 30D is provided inside theplate member 30 to form thesupport surface 30S, the edge portion of the PC under the substrate can be supported, so only theplate member 30 is held and moved, and the substrate can also be moved together with theplate member 30. Piece P. In addition, since the gap between theplate member 30 and the substrate P forms a curved corner in cross-sectional view due to the inner step portion 30D, even if the liquid 1 intrudes into the gap between theplate member 30 and the substrate P In the gap A between them, the curved corner also functions as a sealing portion, which can prevent the liquid 1 from invading into the back side PC side of the substrate P or the inside of the substrate stage PST (substrate holder PH). Furthermore, since the side surface PB of the substrate P is also subjected to the lyophobic treatment, the intrusion of the liquid 1 from the gap A between the side surface PB of the substrate P and theplate member 30 can be prevented better.

此外，通过使基片P的背面PC和与其对置的周壁部33的上面33A呈疏液性，可防止液体1经间隙B侵入到第1空间38中的不良 情况。因而，可避免液体1流入到吸引口41中的不良情况的发生，可在良好地吸附保持基片P的状态下进行曝光处理。In addition, by making the back surface PC of the substrate P and the upper surface 33A of theperipheral wall portion 33 opposite thereto lyophobic, it is possible to prevent the inconvenience that the liquid 1 intrudes into the first space 38 through the gap B. Therefore, it is possible to prevent the liquid 1 from flowing into the suction port 41, and the exposure process can be performed in a state where the substrate P is satisfactorily adsorbed and held.

此外，在本实施形态中，通过对可对于基片架PT装卸的基片托PH的背面58或基片架PT中与基片托PH的接触面57进行疏液处理，即使在液体1流入到第2空间39中的情况下，也可抑制液体1对于基片托PH的背面58与Z台52的接触面57之间的流入。因而，可防止基片托PH的背面58或基片架PT的接触面57中的锈蚀的发生等。此外，如果液体1流入到基片托PH的背面58与基片架PT的接触面57之间，则产生基片托PH与Z台52粘接而难以分离的状况，但通过使其呈疏液性而容易分离。In addition, in this embodiment, by performing liquid-repellent treatment on theback surface 58 of the substrate holder PH that can be attached to and detached from the substrate holder PT or thecontact surface 57 of the substrate holder PT with the substrate holder PH, even when the liquid 1 flows into the Even when entering the second space 39 , the inflow of the liquid 1 between theback surface 58 of the substrate holder PH and thecontact surface 57 of theZ stage 52 can be suppressed. Thus, the occurrence of rust and the like in theback surface 58 of the substrate holder PH or thecontact surface 57 of the substrate holder PT can be prevented. In addition, if the liquid 1 flows between theback surface 58 of the substrate holder PH and thecontact surface 57 of the substrate holder PT, the substrate holder PH and theZ stage 52 will be stuck and difficult to separate. Liquid and easy to separate.

此外，作为用于对基片架PT装卸板构件30的装卸机构，由于设置了作为升降装置的升降构件74及作为吸附保持板构件30的吸附保持装置的吸附孔72，故可顺利地进行板构件30的更换作业，可在基片架PT上良好地保持更换后的新的板构件30。In addition, as an attachment and detachment mechanism for attaching and detaching theplate member 30 to the substrate holder PT, since the elevatingmember 74 as an elevating device and the suction hole 72 as an absorbing and holding device for absorbing and holding theplate member 30 are provided, the plate can be carried out smoothly. In the replacement operation of themember 30, the replacednew plate member 30 can be satisfactorily held on the substrate holder PT.

此外，通过在第2板构件32的内侧形成内侧台阶部32D，在板构件30的外侧形成外侧台阶部30F，由于在板构件30与第2板构件32之间的间隙中在剖面视图中也形成弯曲的角部，故即使液体1从间隙G侵入，弯曲的角部也起到密封部的功能，可防止液体1到达基片架PT内部的不良情况。Furthermore, by forming the inner steppedportion 32D inside thesecond plate member 32 and forming the outer steppedportion 30F outside theplate member 30, since the gap between theplate member 30 and thesecond plate member 32 is also seen in cross-sectional view, Since the curved corner is formed, even if the liquid 1 enters from the gap G, the curved corner functions as a sealing portion, preventing the liquid 1 from reaching the inside of the substrate holder PT.

此外，由于用第2板构件32的内侧台阶部32D支撑板构件30的外侧台阶部30F，故如果用基片架PT吸附保持第2板构件32，则因板构件30由第2板构件32来支撑，故可不由基片架PT来保持。因此，如图10中示出的示意图那样，可在基片架PT中与板构件30对置的区域中形成空间部(槽)130，可谋求基片架PT(基片台PST)的轻量化。In addition, since the outer steppedportion 30F of theplate member 30 is supported by the inner steppedportion 32D of thesecond plate member 32, if thesecond plate member 32 is sucked and held by the substrate holder PT, theplate member 30 is held by thesecond plate member 32. To support, it can not be held by the substrate holder PT. Therefore, as shown schematically in FIG. 10, a space portion (groove) 130 can be formed in a region of the substrate holder PT facing theplate member 30, and the weight of the substrate holder PT (substrate stage PST) can be achieved. Quantify.

此外，由于是在用板构件30保持了基片P的状态下用运送臂80运送的结构，故用板构件30支撑基片P的比较宽的区域。因而，即使例如基片P的尺寸较大，通过在用板构件30保持了的状态下来运送，也可抑制基片P的挠曲(翘曲)。In addition, since the substrate P is transported by thetransport arm 80 while the substrate P is held by theplate member 30 , a relatively wide area of the substrate P is supported by theplate member 30 . Therefore, even if the size of the substrate P is large, for example, deflection (warping) of the substrate P can be suppressed by being transported while being held by theplate member 30 .

再有，在第2板构件32的平坦面32A的疏液性恶化、更换第2板构件32的情况下，由于第2板构件32支撑板构件30，故可在基片P的液浸曝光结束后使用运送臂80一起运出基片P和板构件30。在该情况下，也可与升降构件74同样地设置用于升降第2板构件32的升降构件。此外，也可分别运出和运入板构件30和第2板构件32而不设置第2板构件32的内侧台阶部32D。在该情况下，可再设置用于运出和运入第2板构件32的运送机构。In addition, when the liquid repellency of theflat surface 32A of thesecond plate member 32 deteriorates and thesecond plate member 32 is replaced, since thesecond plate member 32 supports theplate member 30, the liquid immersion exposure of the substrate P can be performed. After completion, the substrate P and theplate member 30 are carried out together using the carryingarm 80 . In this case, a lifting member for raising and lowering thesecond plate member 32 may be provided similarly to the liftingmember 74 . In addition, theplate member 30 and thesecond plate member 32 may be carried out and carried in separately without providing theinner step portion 32D of thesecond plate member 32 . In this case, a conveyance mechanism for carrying out and carrying in thesecond plate member 32 may be provided again.

再有，如上所述，根据平坦面30A、32A的疏液性的恶化来决定板构件30、32的更换的定时。作为更换板构件30、32的定时，例如可按每规定基片处理片数或每规定时间间隔等预先确定的规定间隔更换板构件30、32。或者，可利用实验或模拟预先求出曝光光EL的照射量(照射时间、照度)与板构件30、32的疏液性水平的关系，根据该已求出的结果，设定更换板构件30、32的定时。例如可通过用显微镜或目视来观察平坦面30A、32A等、在评价面上垂下液滴，用目视或显微镜观察液滴的状态、或测定液滴的接触角来进行疏液性的恶化的评价。通过用与曝光光等的紫外线的累积照射量的关系预先在控制装置CONT中记录了这样的评价，根据该关系，控制装置CONT可决定板构件30、32等的寿命、即更换时间(时期)。In addition, as mentioned above, the timing of replacement of theplate members 30 and 32 is determined according to deterioration of the liquid repellency of theflat surfaces 30A and 32A. As the timing for replacing theplate members 30, 32, for example, theplate members 30, 32 may be replaced at predetermined intervals such as every predetermined number of substrates to be processed or every predetermined time interval. Alternatively, the relationship between the irradiation amount (irradiation time, illuminance) of the exposure light EL and the liquid repellency level of theplate members 30, 32 can be obtained in advance by experiments or simulations, and thereplacement plate member 30 can be set based on the obtained results. , 32 timing. For example, the degradation of liquid repellency can be carried out by observing theflat surfaces 30A, 32A, etc. with a microscope or visual observation, hanging a droplet on the evaluation surface, observing the state of the droplet visually or through a microscope, or measuring the contact angle of the droplet. evaluation of. By recording such an evaluation in advance in the control device CONT in relation to the cumulative exposure amount of ultraviolet rays such as exposure light, the control device CONT can determine the life of theplate members 30, 32, etc., that is, the replacement time (period) based on the relationship. .

此外，曝光装置EX使用可检测在投影光学系统PL的一侧照射的曝光光EL的强度的积分传感器(未图示)，可求出对板构件30、32照射的曝光光EL的累积照射量。由于控制装置CONT根据使用激光干涉计56检测的基片台PST的位置信息和使用积分传感器检测的曝光光EL的强度信息，可检测对板构件30或第2板构件32照射的曝光光EL的强度与照射时间(照射脉冲数)，故根据该检测结果可求出对板构件30或第2板构件32照射的曝光光EL的累积照射量。再有，检测曝光光EL的强度的积分传感器，例如在美国专利第5,728,495号公报或美国专利第5,591,958号公报中公开了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。In addition, the exposure apparatus EX uses an integrating sensor (not shown) capable of detecting the intensity of the exposure light EL irradiated on the side of the projection optical system PL, and can obtain the cumulative irradiation amount of the exposure light EL irradiated on theplate members 30 and 32 . Since the control device CONT can detect the position of the exposure light EL irradiated on theplate member 30 or thesecond plate member 32 based on the position information of the substrate stage PST detected by thelaser interferometer 56 and the intensity information of the exposure light EL detected by the integrating sensor. Intensity and irradiation time (number of irradiation pulses), so the cumulative irradiation amount of the exposure light EL irradiated to theplate member 30 or thesecond plate member 32 can be obtained from the detection result. In addition, the integral sensor that detects the intensity of the exposure light EL is disclosed in, for example, U.S. Patent No. 5,728,495 or U.S. Patent No. 5,591,958. As long as it is allowed in the laws and regulations of the country designated or selected in this international application, these The documented contents are regarded as a part of this article.

在本实施形态中，控制装置CONT根据板构件30、32的上面30A、32A中的液体的接触角来判断是否需要更换板构件30、32。例如，根据板构件30、32的使用时间或紫外光的累积照射量等，在推断为液体的接触角下降到小于等于规定角度(例如100°)的情况下，判断为必须更换板构件30、32。或者，根据板构件30、32的使用时间或紫外光的累积照射量等，在推断为板构件30、32的表面30A、32A中的液体1的接触角比初始状态下降了大于等于规定角度(例如10°)的情况下，判断为必须更换板构件30、32。In the present embodiment, the control device CONT determines whether or not theplate members 30, 32 need to be replaced based on the contact angle of the liquid on theupper surfaces 30A, 32A of theplate members 30, 32. For example, when it is inferred from the usage time of theplate members 30, 32 or the cumulative irradiation amount of ultraviolet light, etc., that the contact angle of the liquid has dropped to a predetermined angle (for example, 100°), it is determined that theplate members 30, 32 must be replaced. 32. Alternatively, it is estimated that the contact angle of the liquid 1 on thesurfaces 30A, 32A of theplate members 30, 32 is lower than the initial state by a predetermined angle ( For example, in the case of 10°), it is determined that theplate members 30 and 32 must be replaced.

再有，也可不用曝光装置EX的控制装置CONT来判断板构件30、32等的疏液性的恶化，例如将设置了曝光装置EX的工厂等的主计算机和曝光装置EX连接成可交换各种数据，用该主计算机来判断。Furthermore, it is not necessary to determine the degradation of the liquid repellency of theplate members 30, 32, etc. without the control device CONT of the exposure device EX, for example, a host computer such as a factory where the exposure device EX is installed and the exposure device EX are connected so as to be interchangeable. This kind of data is judged by the host computer.

此外，在液体回收机构20的液体回收能力高的情况下，由于存在即使板构件30、32的疏液性恶化也可充分地回收液体的可能性，因此在决定板构件30、32等的更换时期时，也可以考虑液体回收机构20的液体回收能力与疏液性的恶化(接触角的下降)的关系。In addition, when the liquid recovery ability of theliquid recovery mechanism 20 is high, since there is a possibility that the liquid can be recovered sufficiently even if the liquid repellency of theplate members 30, 32 deteriorates, it is necessary to determine the replacement of theplate members 30, 32, etc. The relationship between the liquid recovery capability of theliquid recovery mechanism 20 and the deterioration of the liquid repellency (decrease in the contact angle) may also be considered for the timing.

此外，由于疏液性的恶化的速度或恶化的程度不仅随曝光光EL的照射时间而不同，而且随付与疏液性的材料、液体、曝光波长温度等的要素而不同，故最好与这些要素一起准备评价数据。关于以下所述的被赋予疏液性的其它的构件的更换时期，也是同样的。In addition, since the speed or degree of deterioration of the liquid repellency is not only different with the irradiation time of the exposure light EL, but also varies with factors such as the material, the liquid, and the exposure wavelength temperature that impart the liquid repellency, it is preferable to use these elements together to prepare evaluation data. The same applies to the replacement timing of other members provided with liquid repellency described below.

再有，在本实施形态中，利用作为疏液性材料的聚四氟乙烯形成板构件30、32，但当然也可利用其它的具有疏液性的材料来形成。此外，也可例如用规定的金属等形成板构件30、32，在该金属制的板构件30的表面上涂敷具有疏液性的疏液性材料(聚四氟乙烯等的氟化物)。此外，作为疏液性材料的覆盖区域，可涂敷在板构件30、32的全部表面，也可只涂敷例如平坦面30A等必须有疏液性的一部分的区域。In addition, in the present embodiment, theplate members 30 and 32 are formed using polytetrafluoroethylene which is a liquid-repellent material, but of course they may be formed using other liquid-repellent materials. In addition, for example, theplate members 30 and 32 may be formed of a predetermined metal, and the surface of themetal plate member 30 may be coated with a lyophobic material (fluoride such as polytetrafluoroethylene). In addition, the coating area of the liquid repellent material may be applied to the entire surface of theplate members 30, 32, or may be applied only to a part of the area that must be liquid repellent, such as theflat surface 30A.

当然，可用不同的构件设置板构件30和第2板构件32，也可使用不同的疏液性材料来涂敷。此外，板构件30和第2板构件32的全部的表面没有必要以均匀的水平具有疏液性，可部分地设置疏液性强 的部分。此外，板构件30和第2板构件32的全部的表面没有必要具有同样的疏液性的恶化耐久性，与其它的部分相比，可强化曝光光的照射量多的部分的恶化耐久性。例如，板构件30的表面的恶化耐久性最好比第2板构件32的表面的恶化耐久性强。Of course, theplate member 30 and thesecond plate member 32 may be provided with different members, and may be coated with different liquid-repellent materials. In addition, the entire surface of theplate member 30 and thesecond plate member 32 does not need to have liquid repellency at a uniform level, and a portion with strong liquid repellency may be partially provided. In addition, the entire surface of theplate member 30 and thesecond plate member 32 does not necessarily have the same lyophobic deterioration durability, and the deterioration durability of the portion with a large amount of exposure light can be strengthened compared with other portions. For example, the deterioration durability of the surface of theplate member 30 is preferably stronger than the deterioration durability of the surface of thesecond plate member 32 .

在本实施形态中，说明了在更换板构件30时与基片P一起运出板构件30，当然也可对于基片架PT只运入和运出板构件30。In this embodiment, it has been described that theplate member 30 is carried out together with the substrate P when theplate member 30 is replaced, but of course only theplate member 30 may be carried in and out with respect to the substrate rack PT.

此外，在本实施形态中可使用升降构件74和运送臂80来更换板构件30，但升降构件74或能运送板构件30的运送臂80不是必须的，操作者可用手动来更换板构件30。此外，在上述的实施形态中，分别一体地设置了板构件30和第2板构件32，但也可分割该板构件30和第2板构件32，可部分地更换。由此，也可频繁地只更换疏液性的恶化剧烈的部分。In addition, in this embodiment, the liftingmember 74 and the conveyingarm 80 can be used to replace theplate member 30, but the liftingmember 74 or the conveyingarm 80 capable of conveying theplate member 30 is not necessary, and the operator can manually replace theplate member 30. In addition, in the above-mentioned embodiment, theplate member 30 and thesecond plate member 32 are respectively integrally provided, but theplate member 30 and thesecond plate member 32 may be divided and partially replaced. Thereby, only the part whose liquid repellency deteriorates rapidly can be replaced frequently.

或者，也可将板构件30和第2板构件32作为一个板构件来形成，保持在基片架PT上。Alternatively, theplate member 30 and thesecond plate member 32 may be formed as one plate member and held on the substrate holder PT.

再有，在本实施形态中，从图5可明白，基片托PH和基片架PT可装卸，但也可与基片架PT一体地设置基片托PH。In this embodiment, as is clear from FIG. 5, the substrate holder PH and the substrate holder PT are detachable, but the substrate holder PH may be provided integrally with the substrate holder PT.

再有，在本实施形态中，在基片P的表面PA、侧面PB和背面PC的整个面上为了进行疏液处理而涂敷了感光材料90，但也可以是只对形成间隙A的区域、即基片P的侧面PB和形成间隙B的区域、即基片P的背面PC中与周壁部33的上面33A对置的区域进行疏液处理的结构。再者，如果间隙A充分小，此外为了进行疏液处理而涂敷的材料的疏液性(接触角)充分大，则由于液体1经间隙A流入到第2空间39中的可能性进一步降低，故也可以是不对形成间隙B的基片P的背面PC进行疏液处理而只对基片P的侧面PB进行疏液处理的结构。当然，也可使用对表面PA、侧面PB和背面PC全都未进行疏液处理的基片P。Furthermore, in this embodiment, the photosensitive material 90 is coated on the entire surface of the surface PA, the side surface PB, and the back surface PC of the substrate P in order to perform a liquid repellent treatment, but it is also possible to apply the photosensitive material 90 only to the region where the gap A is formed. That is, the side surface PB of the substrate P and the region forming the gap B, that is, the region of the back surface PC of the substrate P facing the upper surface 33A of theperipheral wall portion 33 is subjected to a liquid repellent treatment. Furthermore, if the gap A is sufficiently small, and the lyophobicity (contact angle) of the material coated for the lyophobic treatment is sufficiently large, the possibility of the liquid 1 flowing into the second space 39 through the gap A is further reduced. Therefore, it is also possible to perform liquid-repellent treatment only on the side surface PB of the substrate P without performing the liquid-repellent treatment on the back surface PC of the substrate P forming the gap B. Of course, it is also possible to use the substrate P in which none of the surface PA, the side surface PB, and the back surface PC are subjected to the liquid-repellent treatment.

再有，在本实施形态中，周壁部33的高度比支撑部34的高度低、在基片P的背面PC与周壁部33的上面33A之间形成了间隙B，但基片P的背面PC与周壁部33的上面33A也可接触。Furthermore, in this embodiment, the height of theperipheral wall portion 33 is lower than the height of the support portion 34, and a gap B is formed between the back surface PC of the substrate P and the upper surface 33A of theperipheral wall portion 33, but the back surface PC of the substrate P It is also possible to contact the upper surface 33A of theperipheral wall portion 33 .

在本实施形态中，作为基片P的侧面PB和背面PC的疏液处理，涂敷了具有疏液性的感光材料90，但也可涂敷感光材料90以外的具有疏液性(疏水性)的规定的材料。例如，有时在作为基片P的曝光面的表面PA上涂敷的感光材料90的上层涂敷称为顶部涂层的保护层(保护感光材料90使之不受液体的影响的膜)，而该顶部涂层的形成材料(例如氟树脂材料)例如以接触角约110°具有疏液性(疏水性)。因而，也可在基片P的侧面PB和背面PC上涂敷该顶部涂层形成材料。当然，也可涂敷感光材料90或顶部涂层形成用材料以外的具有疏液性的材料。In this embodiment, as the lyophobic treatment of the side PB and the back PC of the substrate P, the photosensitive material 90 with lyophobicity is applied, but it is also possible to apply a lyophobic (hydrophobic) material other than the photosensitive material 90. ) of the specified material. For example, sometimes the upper layer of the photosensitive material 90 coated on the surface PA which is the exposure side of the substrate P is coated with a protective layer (a film that protects the photosensitive material 90 from liquid) called a top coat layer, and The material for forming the top coat layer (for example, a fluororesin material) has lyophobicity (water repellency) at a contact angle of about 110°, for example. Thus, the top coat-forming material can also be applied on the side PB and back PC of the substrate P. As shown in FIG. Of course, a liquid-repellent material other than the photosensitive material 90 or the material for forming the top coat layer may be applied.

此外，在本实施形态中，作为基片架PT或基片托PH的疏液处理，涂敷氟树脂材料或丙烯酸树脂材料等，但也可在基片架PT或基片托PH上涂敷上述感光材料或顶部涂层形成材料，相反，也可在基片P的侧面PB或背面PC上涂敷在基片台PST或基片托PH的疏液处理中使用的材料。In addition, in this embodiment, a fluororesin material, an acrylic resin material, etc. are applied as the liquid-repellent treatment of the substrate holder PT or the substrate holder PH, but it is also possible to coat the substrate holder PT or the substrate holder PH. The above-mentioned photosensitive material or topcoat layer forming material, conversely, may be coated on the side surface PB or the back surface PC of the substrate P, which is used for the lyophobic treatment of the substrate stage PST or substrate holder PH.

为了防止液浸区域AR2的液体1浸透到感光材料90中而设置上述顶部涂层的情况较多，但例如即使在顶部涂层上形成液体1的附着痕迹(所谓水迹)，通过在液浸曝光后除去该顶部涂层，也可在与顶部涂层一起除去了水迹后进行显影处理等的规定的工艺处理。在此，在由氟树脂材料形成顶部涂层的情况下，可使用氟类溶剂来除去。由此，不需要用于除去水迹的装置(例如水迹除去用基片清洗装置)等，用由溶剂除去顶部涂层这样的简易的方式，就可在除去了水迹后良好地进行规定的工艺处理。In order to prevent the liquid 1 in the liquid immersion area AR2 from penetrating into the photosensitive material 90, the above-mentioned top coat layer is often provided. After the exposure, the top coat layer is removed, and a predetermined process such as a development treatment may be performed after water stains are removed together with the top coat layer. Here, when the top coat layer is formed of a fluororesin material, it can be removed using a fluorine-based solvent. Thereby, do not need to be used for removing the device of water mark (such as the substrate cleaning device that water mark removes) etc., with the simple mode that removes top coating by solvent, just can after removing water mark, can carry out good specification. process treatment.

再有，在上述的实施形态中，用真空吸附方式在基片架PT上保持了板构件30、32，但也可使用电磁夹持机构等其它的夹持机构。In addition, in the above-mentioned embodiment, theplate members 30, 32 are held on the substrate holder PT by vacuum suction, but other clamping mechanisms such as electromagnetic clamping mechanisms may be used.

<第2实施形态><Second Embodiment>

其次，说明本发明的其它的实施形态。在以下的说明中，对于与上述的实施形态为同一或同等的结构部分附以同一符号，简化或省略其说明。Next, other embodiments of the present invention will be described. In the following description, the same reference numerals are attached to the same or equivalent components as those of the above-mentioned embodiment, and the description thereof is simplified or omitted.

图11是示出对基片架PT(基片台PST)装卸的基片托PH的图， 图11(a)是侧剖面图，图11(b)是从上方看取下了基片托PH后的基片架PT的平面图。Fig. 11 is a figure showing the substrate holder PH for loading and unloading the substrate rack PT (substrate table PST), Fig. 11(a) is a side sectional view, and Fig. 11(b) is viewed from above with the substrate holder taken off Plan view of substrate holder PT after PH.

如图11中所示，基片架PT在其上面(对于基片托PH的保持面)具备：可嵌合基片托PH的凹部157；在凹部157内部设置的、吸附保持在凹部157中配置的基片托PH的多个真空吸附孔158；以及在凹部157内部设置的后述的流路159。通过将基片托PH嵌合到凹部157中，对基片架PT和基片托PH进行定位。真空吸附孔158构成了保持在凹部157中配置的基片托PH的夹持机构的一部分，连接到未图示的真空装置上。利用控制装置CONT来控制真空装置的驱动。控制装置CONT控制真空装置，经真空吸附孔158进行基片架PT的对于基片托PH的吸附保持和解除保持。通过解除保持，可进行基片托PH与基片架PT的分离，可更换基片托PH。As shown in FIG. 11 , the substrate holder PT has on its upper surface (for the holding surface of the substrate holder PH): a recess 157 into which the substrate holder PH can be fitted; A plurality of vacuum suction holes 158 of the arranged substrate holder PH; By fitting the substrate holder PH into the concave portion 157, the substrate holder PT and the substrate holder PH are positioned. The vacuum suction hole 158 constitutes a part of the clamping mechanism for holding the substrate holder PH disposed in the concave portion 157, and is connected to a vacuum device (not shown). The drive of the vacuum device is controlled by the control device CONT. The control device CONT controls the vacuum device, and performs suction holding and release holding of the substrate holder PT for the substrate holder PH through the vacuum suction hole 158 . By releasing the hold, the substrate holder PH can be separated from the substrate holder PT, and the substrate holder PH can be replaced.

再有，在此，说明了基片架PT对基片托PH进行真空吸附保持，但也可利用电磁夹持机构等其它的夹持机构来保持基片托PH和解除基片托PH的保持。此外，在此，说明了使用凹部157进行基片架PT和基片托PH的定位，但例如也可作成以光学的方式检测基片托PH和基片架PT的位置关系、根据该检测结果对于基片架PT将基片托PH定位在规定的位置上的结构。In addition, here, it has been described that the substrate holder PT holds the substrate holder PH by vacuum suction, but it is also possible to use other clamping mechanisms such as an electromagnetic clamping mechanism to hold the substrate holder PH and release the holding of the substrate holder PH. . In addition, although it has been described here that the positioning of the substrate holder PT and the substrate holder PH is performed using the concave portion 157, for example, it is also possible to optically detect the positional relationship between the substrate holder PH and the substrate holder PT, and based on the detection result, The substrate holder PT is configured to position the substrate holder PH at a predetermined position.

此外，基片托PH具有：用于配置基片P的凹部150；以及与在凹部157中配置的基片P的表面大致为同一面的平坦面30A。在基片P的周围以环状设置了平坦面30A。在平坦面30A的周围，形成了比该平坦面30A高的侧壁部151。在平坦面30A的周围连续地以环状形成了侧壁部151，在该侧壁部151的内侧(基片P上或平坦面30A上)可保持液体1。Further, the substrate holder PH has: arecess 150 for arranging the substrate P; and aflat surface 30A substantially flush with the surface of the substrate P arranged in the recess 157 . Around the substrate P, aflat surface 30A is provided in a ring shape. Around theflat surface 30A, aside wall portion 151 higher than theflat surface 30A is formed. Theside wall portion 151 is continuously formed in a ring shape around theflat surface 30A, and the liquid 1 can be held inside the side wall portion 151 (on the substrate P or on theflat surface 30A).

例如利用聚四氟乙烯等具有疏液性的材料形成了基片托PH。再有，也可例如用规定的金属形成基片托PH，在该金属制的基片托PH中至少对于平坦面30A涂敷具有疏液性的疏液性材料(聚四氟乙烯等)。当然，也可在金属制的基片托PH的表面的整个区域中涂敷疏液性材料。For example, the substrate holder PH is formed of a liquid-repellent material such as polytetrafluoroethylene. Furthermore, for example, the substrate holder PH may be formed of a predetermined metal, and a liquid-repellent material (polytetrafluoroethylene, etc.) having liquid repellency may be applied to at least theflat surface 30A of the metal substrate holder PH. Of course, a lyophobic material may be applied over the entire surface of the metal substrate holder PH.

运送臂80可运送从基片架PT取下的基片托PH。例如，运送臂80从基片架PT(基片台PST)运出(卸载)保持进行了曝光处理后的基片P的基片托PH，在将基片托PH与另外的基片托PH进行了更换后，将该基片托PH运入(装载)到基片架PT上。此外，运送臂80在将基片托PH运入到基片架PT上时，可只运入基片托PH，也可运入保持了曝光处理之前的基片P的基片托PH。Thetransport arm 80 can transport the substrate holder PH removed from the substrate rack PT. For example, thetransfer arm 80 carries out (unloads) the substrate holder PH holding the exposed substrate P from the substrate rack PT (substrate stage PST), and when the substrate holder PH is combined with another substrate holder PH, After replacement, the substrate holder PH is carried (loaded) onto the substrate holder PT. In addition, when thetransport arm 80 transports the substrate tray PH onto the substrate rack PT, it may transport only the substrate tray PH, or may transport the substrate tray PH holding the substrate P before exposure processing.

图12是示出基片托PH的图，图12(a)是侧剖面图，图12(b)是从上方看的平面图。Fig. 12 is a diagram showing the substrate holder PH, Fig. 12(a) is a side sectional view, and Fig. 12(b) is a plan view seen from above.

在图12中，基片托PH具备：可保持上述的液体1的侧壁部151；在凹部150的底面部PHT上形成的多个凸部161；以及在凸部161的上端面上形成的真空吸附孔162。凸部161的上端面是平坦面，基片托PH在用多个凸部161的上端面支撑基片P的同时，经真空吸附孔162吸附保持基片P。在此，在基片托PH的凹部150的底面部PHT的多个规定位置上分别设置了凸部161，以使基片P不挠曲。通过用凸部161支撑基片P，在基片P与基片托PH的底面部PHT之间形成分离部164。再有，在本实施形态中，基片托PH的平面视图形状是大致圆形，但也可以是矩形。In FIG. 12 , the substrate holder PH is provided with: aside wall portion 151 capable of holding the above-mentioned liquid 1; a plurality ofconvex portions 161 formed on the bottom portion PHT of theconcave portion 150;Vacuum suction hole 162. The upper end surfaces of theprotrusions 161 are flat, and the substrate holder PH supports the substrate P by the upper end surfaces of the plurality ofprotrusions 161 , and holds the substrate P by suction through the vacuum suction holes 162 . Here,protrusions 161 are provided at a plurality of predetermined positions on the bottom surface PHT of therecess 150 of the substrate holder PH so that the substrate P does not bend. By supporting the substrate P by theconvex portion 161, aseparation portion 164 is formed between the substrate P and the bottom portion PHT of the substrate holder PH. In addition, in this embodiment, the plan view shape of the substrate holder PH is substantially circular, but it may be rectangular.

此外，在连接基片架PT与基片托PH时，基片托PH的真空吸附孔162经在基片托PH中形成的流路162A连接到在基片架PT的上面设置的流路159(参照图11(b))上。流路159连接到真空装置上，控制装置CONT通过驱动真空装置，经基片架PT的流路159、基片托PH的流路162A和真空吸附孔162吸附保持由凸部161支撑的基片P。在此，在流路162A中分别设置了由根据控制装置CONT的控制来驱动的电磁阀等构成的阀部162B，可对流路162A的打开、关闭工作进行遥控操作。控制装置CONT在驱动了真空装置时控制阀部162B打开流路162A，在停止了真空装置时关闭流路162A。因而，在经真空吸附孔162的对于基片P的吸引工作后，通过在停止真空装置的驱动的同时利用阀部162B关闭流路162A，维持流路162A的负压。因而，在分离了基片架PT与基片托PH时，通过使流路162A为负压， 也可维持基片托PH对于基片P的吸附保持。In addition, when connecting the substrate holder PT and the substrate holder PH, thevacuum suction hole 162 of the substrate holder PH is connected to the flow passage 159 provided on the upper surface of the substrate holder PT via theflow passage 162A formed in the substrate holder PH. (Refer to Figure 11(b)). The flow path 159 is connected to the vacuum device, and the control device CONT drives the vacuum device to absorb and hold the substrate supported by theprotrusion 161 through the flow path 159 of the substrate holder PT, theflow path 162A of the substrate holder PH, and thevacuum suction hole 162. p. Here,valve units 162B constituted by solenoid valves or the like driven under the control of the control device CONT are respectively provided in theflow paths 162A, and the opening and closing operations of theflow paths 162A can be operated remotely. The control device CONT controls thevalve portion 162B to open theflow path 162A when the vacuum device is driven, and closes theflow path 162A when the vacuum device is stopped. Therefore, after the suction operation of the substrate P through the vacuum suction holes 162, the negative pressure of theflow path 162A is maintained by closing theflow path 162A with thevalve portion 162B while stopping the driving of the vacuum device. Therefore, even when the substrate holder PT and the substrate holder PH are separated, the adsorption and holding of the substrate P by the substrate holder PH can be maintained by making theflow path 162A a negative pressure.

其次，一边参照图13的示意图，一边说明具有上述的结构的曝光装置EX的工作。Next, the operation of the exposure apparatus EX having the above-mentioned configuration will be described with reference to the schematic diagram of FIG. 13 .

如图13(a)中所示，利用运送臂(运送装置)80将保持了作为曝光处理对象的基片P的基片托PH与基片P一起运入到基片架PT上。如图13(b)中所示，将基片托PH配置成与在基片架PT上设置的凹部157嵌合，保持在具有真空吸附孔158(图11)的夹持机构上。然后，控制装置CONT驱动真空装置，经流路159、流路162A和真空吸附孔162对基片P进行真空吸附保持(再有，在图13中未图示)。此时，阀部162B打开流路162A。然后，如图13(c)中所示，控制装置CONT利用液体供给机构10和液体回收机构20进行液体1的供给和回收，在基片架PT上经基片托PH保持的基片P与投影光学系统PL之间形成液体1的液浸区域AR2。然后，控制装置CONT经投影光学系统PL和液体1在基片P上照射曝光光EL，一边移动在基片架PT(基片台PST)上经基片托PH保持的基片P，一边进行液浸曝光。此时，由于利用吸附保持了的基片P堵塞真空吸附孔162，故即使供给液体1，也不会侵入到真空吸附孔162中。此外，由于基片托PH的侧壁部151的缘故，基片P上或平坦面30A上的液体1也不会流出到基片托PH的外侧。As shown in FIG. 13( a ), the substrate holder PH holding the substrate P to be subjected to exposure processing is carried into the substrate rack PT together with the substrate P by a transport arm (transport device) 80 . As shown in FIG. 13(b), the substrate holder PH is arranged to fit into the concave portion 157 provided on the substrate holder PT, and is held by a clamping mechanism having a vacuum suction hole 158 (FIG. 11). Then, the control device CONT drives the vacuum device to carry out vacuum adsorption and holding of the substrate P through the flow path 159, theflow path 162A, and the vacuum suction holes 162 (not shown in FIG. 13 ). At this time, thevalve portion 162B opens theflow path 162A. Then, as shown in FIG. 13(c), the control device CONT uses the liquid supply mechanism 10 and theliquid recovery mechanism 20 to supply and recover the liquid 1, and the substrate P held by the substrate holder PH on the substrate rack PT and the A liquid immersion area AR2 of the liquid 1 is formed between the projection optical systems PL. Then, the control device CONT irradiates the exposure light EL on the substrate P via the projection optical system PL and the liquid 1, and moves the substrate P held by the substrate holder PH on the substrate holder PT (substrate stage PST). Liquid immersion exposure. At this time, since thevacuum suction hole 162 is blocked by the substrate P held by suction, even if the liquid 1 is supplied, it does not intrude into thevacuum suction hole 162 . Also, the liquid 1 on the substrate P or theflat surface 30A does not flow out to the outside of the substrate holder PH due to theside wall portion 151 of the substrate holder PH.

基片P的液浸曝光结束后，控制装置CONT使用液体回收机构20(参照图2)等回收在基片P上或平坦面30A上残留的液体1。其次，控制装置CONT解除由包含真空吸附孔158的夹持机构进行的对于基片托PH的保持，同时使用阀部162B堵塞流路162A。然后，如图13(d)中所示，控制装置CONT利用运送臂80从基片架PT与基片P一起运出(卸载)保持了结束曝光处理的基片P的状态的基片托PH。在分离基片托PH与基片架PT时，如参照图12已说明的那样，由于利用阀部162B堵塞连接到吸附保持基片P的真空吸附孔162上的流路162A而维持了负压状态，故维持由凸部161的上端面进行的对于基片P的吸附保持。此外，在与基片托PH一起运送基片P时， 即使假定液体1残留在基片P上或平坦面30A上，该残留的液体1也不会经流路162A流出。此外，由于残留的液体1保持在侧壁部151内部，故也不会流出到基片托PH的外侧而在运送路径中飞散。After the liquid immersion exposure of the substrate P is completed, the control device CONT recovers the liquid 1 remaining on the substrate P or theflat surface 30A using the liquid recovery mechanism 20 (see FIG. 2 ) or the like. Next, the control device CONT releases the holding of the substrate holder PH by the chuck mechanism including the vacuum suction holes 158, and simultaneously blocks theflow path 162A using thevalve portion 162B. Then, as shown in FIG. 13( d ), the control device CONT uses thetransport arm 80 to transport (unload) the substrate holder PH holding the state of the substrate P whose exposure process has been completed from the substrate rack PT together with the substrate P. . When the substrate holder PH and the substrate rack PT are separated, as described with reference to FIG. state, the adsorption and holding of the substrate P by the upper end surface of theconvex portion 161 is maintained. In addition, even if the liquid 1 remains on the substrate P or theflat surface 30A when the substrate P is transported together with the substrate holder PH, the remaining liquid 1 does not flow out through theflow path 162A. In addition, since the remaining liquid 1 is held inside theside wall portion 151, it does not flow out to the outside of the substrate holder PH and scatter in the transport path.

已运出的基片托PH与新的基片托PH更换。然后，控制装置CONT使用运送臂80将保持了作为曝光处理对象的基片P的新的基片托PH与基片P一起运入到基片架PT(基片台PST)上(参照图13)。The substrate holder PH that has been shipped is replaced with a new substrate holder PH. Then, the control device CONT uses thetransport arm 80 to transport a new substrate holder PH holding the substrate P to be subjected to exposure processing, together with the substrate P, onto the substrate rack PT (substrate stage PST) (see FIG. 13 ). ).

这样，即使在本实施形态中，由于更换基片托PH，故也可用表面呈疏液性的基片托PH保持基片P。Thus, even in this embodiment, since the substrate holder PH is replaced, the substrate P can be held by the substrate holder PH whose surface is liquid-repellent.

<第3实施形态><Third Embodiment>

但是，在上述实施形态中，说明了根据其疏液性的恶化来更换在基片P的周围具有平坦面30A的构件(板构件30、第2板构件32、基片托PH)，但优选在基片架PT上设置的板构件30、第2板构件32和基片托PH以外的构件的表面也呈疏液性，最好根据其疏液性的恶化可更换。特别是希望与液体1接触的构件的表面呈疏液性，最好根据其疏液性的恶化可更换。具体地说，在表面上形成液浸区域使用的基准构件300的结构构件、光学传感器400、500的结构构件也可更换。However, in the above-mentioned embodiment, it has been described that the members (theplate member 30, thesecond plate member 32, the substrate holder PH) having theflat surface 30A around the substrate P are replaced according to the deterioration of the liquid repellency, but it is preferable Surfaces of members other than theplate member 30, thesecond plate member 32, and the substrate holder PH provided on the substrate holder PT are also liquid-repellent, and it is preferable to replace them according to deterioration of the liquid repellency. In particular, it is desired that the surface of the member in contact with the liquid 1 is lyophobic, and preferably replaceable according to the deterioration of its lyophobicity. Specifically, the structural members of thereference member 300 and the structural members of theoptical sensors 400 and 500 used to form the liquid immersion region on the surface can also be replaced.

图14是示出在基片架PT上设置的基准构件300的剖面图。在图14中，基准构件300具备由玻璃构成的光学构件301和在光学构件301的上面301A上形成的基准标记MFM、PFM。基准构件300安装在基片架PT上，如上所述，配置在第2板构件32上设置的开口部32K中，露出上面301A。而且，基准构件300(光学构件301)对于基片架PT可装卸，可更换。可在基准构件300和基片架PT上设置将基准构件300再次安装在基片架PT的规定位置上时为了对于基片架PT使基准构件300定位而互相嵌合的凹凸或雌雄构件。或者，也可在基准构件300与基片架PT中埋入磁铁和被其吸引的材料，以便能用磁力使基准构件300对于基片架PT定位。或者，也可用真空吸引力使基准构件定位在基片架PT上。再有，也可使用石英作为光学构件301。FIG. 14 is a cross-sectional view showing thereference member 300 provided on the substrate holder PT. In FIG. 14 , areference member 300 includes an optical member 301 made of glass and reference marks MFM and PFM formed on anupper surface 301A of the optical member 301 . Thereference member 300 is attached to the substrate holder PT, and is disposed in theopening 32K provided in thesecond plate member 32 as described above, exposing theupper surface 301A. Furthermore, the reference member 300 (optical member 301 ) is detachable and replaceable with respect to the substrate holder PT. Thereference member 300 and the substrate holder PT may be provided with concavo-convex or male-female members that fit into each other in order to position thereference member 300 with respect to the substrate holder PT when thereference member 300 is mounted again at a predetermined position on the substrate holder PT. Alternatively, a magnet and a material attracted thereto may be embedded in thereference member 300 and the substrate holder PT so that thereference member 300 can be positioned relative to the substrate holder PT by magnetic force. Alternatively, the reference member may be positioned on the substrate holder PT by vacuum suction. In addition, quartz can also be used as the optical member 301 .

在基准构件300与开口部32K之间设置了例如约为0.3mm的间隙K。光学构件301(基准构件300)的上面301A大致为平坦面，将基片P表面、板构件30的表面30A和第2板构件32的表面32A设置成大致为同一面。A gap K of, for example, about 0.3 mm is provided between thereference member 300 and theopening portion 32K. Theupper surface 301A of the optical member 301 (reference member 300 ) is substantially flat, and the surface of the substrate P, thesurface 30A of theplate member 30 , and thesurface 32A of thesecond plate member 32 are arranged to be substantially on the same plane.

第2板构件32中的基准构件300附近的厚度减薄了，该厚度减薄了的厚度薄的部分32S中的基准构件300一侧的端部向下方弯曲形成了弯曲部32T。此外，在基片架PT上形成了向上方突出的壁部310。壁部310对于基准构件300与弯曲部32T相比设置在外侧，连续地形成为包围基准构件300(弯曲部32T)。而且，弯曲部32T的外侧面32Ta与壁部310的内侧面310A对置，弯曲部32T的内侧面32Tb与光学构件301(基准构件300)的侧面301B对置。光学构件301的侧面301B、弯曲部32T的内侧面32Tb和外侧面32Ta、壁部310的内侧面310A和上端面310B分别是平坦面。此外，包含第2板构件32的弯曲部32T的厚度薄的部分32S与壁部310稍微地分离，在其间形成了规定的间隙。The thickness near thereference member 300 of thesecond plate member 32 is reduced, and the end portion on thereference member 300 side of the reducedthickness portion 32S is bent downward to form abent portion 32T. In addition, awall portion 310 protruding upward is formed on the substrate holder PT. Thewall portion 310 is provided on the outer side of thereference member 300 than thebent portion 32T, and is continuously formed to surround the reference member 300 (thebent portion 32T). Furthermore, the outer surface 32Ta of thecurved portion 32T faces theinner surface 310A of thewall portion 310 , and the inner surface 32Tb of thecurved portion 32T faces the side surface 301B of the optical member 301 (reference member 300 ). The side surface 301B of the optical member 301 , the inner surface 32Tb and the outer surface 32Ta of thecurved portion 32T, and theinner surface 310A and theupper end surface 310B of thewall portion 310 are flat surfaces, respectively. In addition, thethin portion 32S including thebent portion 32T of thesecond plate member 32 is slightly separated from thewall portion 310 , and a predetermined gap is formed therebetween.

对光学构件301的上面301A、侧面301B中至少与弯曲部32T对置的区域、壁部310的内侧面310A和上端面310B进行疏液处理，使其呈疏液性。作为疏液处理，如上所述，可涂敷氟树脂材料或丙烯酸树脂材料等的疏液性材料等来进行。Theupper surface 301A and the side surface 301B of the optical member 301 at least face thecurved portion 32T, and theinner surface 310A andupper end surface 310B of thewall 310 are subjected to a liquid repellent treatment to make them liquid repellent. As the lyophobic treatment, as described above, a lyophobic material such as a fluororesin material or an acrylic resin material can be applied.

此外，流入到第2板构件32的弯曲部32T(壁部310)与基准构件301之间的空间370中的液体1由回收部380回收。在本实施形态中，回收部380具备：真空系统383；包含可容纳液体1的容器的气液分离器381；以及在基片架PT内部设置的、连接空间370与气液分离器381的流路382。对流路382的内壁面也进行了疏液处理。Furthermore, the liquid 1 that has flowed into the space 370 between thebent portion 32T (wall portion 310 ) of thesecond plate member 32 and the reference member 301 is recovered by the recovery unit 380 . In this embodiment, the recovery unit 380 includes: a vacuum system 383; a gas-liquid separator 381 including a container capable of holding the liquid 1; Road 382. The inner wall surface of the flow path 382 is also subjected to a liquid-repellent treatment.

在上述的基准构件300中，可考虑在例如在其上面301A上形成了液体1的液浸区域AR2的状态下进行基准标记检测工作的结构，而由于上面301A上呈疏液性，故在基准标记检测工作结束后，可良好地进行上面301A上的液浸区域AR2的液体1的回收，可防止液体1残留的不良情况。此外，由于光学构件301的侧面301B呈疏液性， 同时与该侧面301B对置的弯曲部32T的内侧面32Tb也呈疏液性，故液体1难以侵入到间隙K中。因此，可防止液体1侵入到空间370中的不良情况。此外，即使假定液体1侵入到空间370中，也可利用回收部380良好地回收液体1。再者，即使液体1侵入到空间370中，由于壁部310的内侧面310A和上端面310B呈疏液性，同时与该壁部310对置的第2板构件32(弯曲部32T)也呈疏液性，故可防止侵入到空间370中的液体1越过壁部310侵入到基片架PT内部而产生锈蚀等的不良情况。这样，壁部310具有作为防止液体1的扩散的液体扩散防止壁的功能。此外，在第2板构件32与壁部310的间隙中，利用弯曲部32T形成了在剖面视图中为弯曲的角部，由于该弯曲的角部起到密封部的功能，故能可靠地防止液体1对于基片架PT内部的侵入。In the above-mentionedreference member 300, for example, a structure in which the reference mark detection operation is performed in a state where the liquid immersion region AR2 of the liquid 1 is formed on theupper surface 301A is conceivable. After the mark detection work is completed, the liquid 1 in the liquid immersion area AR2 on theupper surface 301A can be recovered satisfactorily, and the problem of liquid 1 remaining can be prevented. In addition, since the side surface 301B of the optical member 301 is liquid-repellent, and the inner surface 32Tb of thecurved portion 32T opposite to the side surface 301B is also liquid-repellent, the liquid 1 hardly penetrates into the gap K. Therefore, it is possible to prevent the liquid 1 from intruding into the space 370 . In addition, even if the liquid 1 intrudes into the space 370 , the liquid 1 can be recovered well by the recovery unit 380 . Furthermore, even if the liquid 1 invades into the space 370, since theinner surface 310A and theupper end surface 310B of thewall portion 310 are lyophobic, the second plate member 32 (curved portion 32T) facing thewall portion 310 is also liquid repellent. Liquid repellency, so that the liquid 1 intruded into the space 370 can be prevented from intruding into the substrate holder PT through thewall portion 310 to cause corrosion and other disadvantages. In this way, thewall portion 310 functions as a liquid diffusion prevention wall that prevents the liquid 1 from spreading. In addition, in the gap between thesecond plate member 32 and thewall portion 310, a corner portion that is curved in cross-sectional view is formed by thecurved portion 32T, and since the curved corner portion functions as a sealing portion, it is possible to reliably prevent leakage. Intrusion of liquid 1 into the interior of the substrate holder PT.

而且，由于基准构件300(光学构件301)可更换，故在其疏液性恶化了的情况下，与板构件30同样，与新的(具有充分的疏液性的)基准构件300更换即可。Furthermore, since the reference member 300 (optical member 301) is replaceable, if its lyophobicity deteriorates, it can be replaced with a new (sufficiently lyophobic)reference member 300 in the same way as theplate member 30. .

再有，在使用基准构件300的情况下，由于对标记部分局部地照射检测光，故在基准构件300上预先形成了多个同一的基准标记，如果标记部分的表面的疏液性恶化了，就可使用其它的基准标记，为了降低疏液性的恶化速度，也可在每次检测中交替地使用这些标记。由此，可减少基准构件300的更换频度。由于包含使用与曝光波长为同一的检测光的基准标记MFM的部分的疏液性的恶化快，故这样做特别有效。Furthermore, in the case of using thereference member 300, since the detection light is locally irradiated to the mark portion, a plurality of identical reference marks are formed in advance on thereference member 300, and if the liquid repellency of the surface of the mark portion deteriorates, Other fiducial markers can then be used, and in order to reduce the rate of degradation of lyophobicity, these markers can also be used alternately in each test. Thus, the frequency of replacement of thereference member 300 can be reduced. This is particularly effective because the portion including the fiducial mark MFM using the same detection light as the exposure wavelength deteriorates rapidly in liquid repellency.

图15是示出在基片架PT上设置的照度不匀传感器400的剖面图。在图15中，照度不匀传感器400具备由石英玻璃等构成的上板401和在上板401下设置的由石英玻璃等构成的光学元件402。在本实施形态中，一体地设置了上板401和光学元件402。在以下的说明中，将上板401和光学元件402合在一起适当地称为「光学构件404」。此外，经支撑部403在基片架PT上支撑了上板401和光学元件402。支撑部403具有包围光学构件404的连续的壁部。照度不匀传感器400 如上所述，配置在第2板构件32上设置的开口部32L中，露出上面401A。包含上板401和光学元件402的光学构件404对于基片架PT可装卸，可更换。可在光学构件404和基片架PT上设置将光学构件404再次安装在基片架PT的规定位置上时为了对于基片架PT使光学构件404定位而互相嵌合的凹凸或雌雄构件。或者，也可在光学构件404与基片架PT中埋入磁铁和被其吸引的材料，以便能用磁力使光学构件404对于基片架PT定位。或者，也可用真空吸引力使基准构件定位在基片架PT上。FIG. 15 is a cross-sectional view showing theilluminance unevenness sensor 400 provided on the substrate holder PT. In FIG. 15 , theilluminance unevenness sensor 400 includes anupper plate 401 made of quartz glass or the like, and anoptical element 402 made of quartz glass or the like provided under theupper plate 401 . In this embodiment, theupper plate 401 and theoptical element 402 are integrally provided. In the following description, theupper plate 401 and theoptical element 402 are collectively referred to as "optical member 404" as appropriate. Furthermore, theupper plate 401 and theoptical element 402 are supported on the substrate holder PT via thesupport portion 403 . Thesupport portion 403 has a continuous wall portion surrounding theoptical member 404 . Theuneven illuminance sensor 400 is disposed in theopening 32L provided in thesecond plate member 32 as described above, and exposes theupper surface 401A. Theoptical member 404 including theupper plate 401 and theoptical element 402 is detachable and replaceable with respect to the substrate holder PT. Theoptical member 404 and the substrate holder PT may be provided with concavo-convex or male-female members that fit into each other to position theoptical member 404 with respect to the substrate holder PT when theoptical member 404 is mounted again at a predetermined position on the substrate holder PT. Alternatively, a magnet and a material attracted thereto may be embedded in theoptical member 404 and the substrate holder PT so that theoptical member 404 can be positioned with respect to the substrate holder PT by magnetic force. Alternatively, the reference member may be positioned on the substrate holder PT by vacuum suction.

在上板401上设置了可通过光的针孔部470。此外，在上板401上的针孔部470以外的部分上设置了包含铬等的遮光性材料的薄膜460。在本实施形态中，在针孔部470内部也设置了由石英玻璃等构成的光学构件，由此，薄膜460与针孔部470为同一面，上面401A成为平坦面。Apinhole portion 470 through which light can pass is provided on theupper plate 401 . In addition, athin film 460 made of a light-shielding material such as chrome is provided on theupper plate 401 other than thepinhole portion 470 . In this embodiment, an optical member made of quartz glass or the like is also provided inside thepinhole portion 470 , whereby thethin film 460 and thepinhole portion 470 are on the same surface, and theupper surface 401A becomes a flat surface.

在光学构件404的下方配置了接受通过了针孔部470的光的光传感器450。在基片架PT上安装了光传感器450。光传感器450对控制装置CONT输出受光信号。在此，用支撑部403、基片架PT和光学构件404包围的空间405是大致密闭的空间，液体1不侵入到空间405中。再有，也可在光学构件404与光传感器450之间配置光学系统(光学元件)。A photosensor 450 that receives light passing through thepinhole portion 470 is disposed below theoptical member 404 . Aphotosensor 450 is mounted on the substrate holder PT. The photosensor 450 outputs a light reception signal to the control device CONT. Here, thespace 405 surrounded by thesupport portion 403 , the substrate holder PT, and theoptical member 404 is a substantially airtight space, and the liquid 1 does not enter thespace 405 . In addition, an optical system (optical element) may be disposed between theoptical member 404 and theoptical sensor 450 .

在包含光学构件404和支撑部403的照度不匀传感器400与开口部32L之间，设置了例如约为0.3mm的间隙L。照度不匀传感器400的上面401A大致为平坦面，将基片P表面、板构件30的表面30A和第2板构件32的表面32A设置成大致为同一面。Between theilluminance unevenness sensor 400 including theoptical member 404 and thesupport portion 403 and theopening portion 32L, a gap L of, for example, about 0.3 mm is provided. Theupper surface 401A of theilluminance unevenness sensor 400 is substantially flat, and the surface of the substrate P, thesurface 30A of theplate member 30 , and thesurface 32A of thesecond plate member 32 are arranged to be substantially flush with each other.

第2板构件32中的照度不匀传感器400附近的厚度减薄了，该厚度减薄了的厚度薄的部分32S中的照度不匀传感器400一侧的端部向下方弯曲形成了弯曲部32T。此外，在基片架PT上形成了向上方突出的壁部310。壁部310对于照度不匀传感器400与弯曲部32T相比设置在外侧，连续地形成为包围照度不匀传感器400(弯曲部32T)。而且，弯曲部32T的外侧面32Ta与壁部310的内侧面310A对置，弯 曲部32T的内侧面32Tb与照度不匀传感器400的光学构件404和支撑部403的侧面401B对置。侧面401B、弯曲部32T的内侧面32Tb和外侧面32Ta、壁部310的内侧面310A和上端面310B分别是平坦面。此外，包含第2板构件32的弯曲部32T的厚度薄的部分32S与壁部310稍微地分离，在其间形成了规定的间隙。In thesecond plate member 32, the thickness near theuneven illuminance sensor 400 is reduced, and the end portion on the side of the illuminanceuneven sensor 400 in the thinnedportion 32S is bent downward to form abent portion 32T. . In addition, awall portion 310 protruding upward is formed on the substrate holder PT. Thewall portion 310 is provided on the outer side of theuneven illuminance sensor 400 than thebent portion 32T, and is continuously formed to surround the uneven illuminance sensor 400 (thebent portion 32T). In addition, the outer surface 32Ta of thecurved portion 32T faces theinner surface 310A of thewall portion 310, and the inner surface 32Tb of thecurved portion 32T faces theoptical member 404 of theuneven illuminance sensor 400 and theside surface 401B of thesupport portion 403. Theside surface 401B, the inner surface 32Tb and the outer surface 32Ta of thebent portion 32T, and theinner surface 310A and theupper end surface 310B of thewall portion 310 are flat surfaces, respectively. In addition, thethin portion 32S including thebent portion 32T of thesecond plate member 32 is slightly separated from thewall portion 310 , and a predetermined gap is formed therebetween.

对照度不匀传感器400的上面401A、侧面401B中至少与弯曲部32T对置的区域、壁部310的内侧面310A和上端面310B进行疏液处理，使其呈疏液性。作为疏液处理，如上所述，可涂敷氟树脂材料或丙烯酸树脂材料等的疏液性材料等来进行。Theupper surface 401A and theside surface 401B of theilluminance unevenness sensor 400 at least face thecurved portion 32T, and theinner surface 310A andupper end surface 310B of thewall 310 are subjected to lyophobic treatment to make them lyophobic. As the lyophobic treatment, as described above, a lyophobic material such as a fluororesin material or an acrylic resin material can be applied.

此外，流入到第2板构件32的弯曲部32T(壁部310)与照度不匀传感器400之间的空间470中的液体1由回收部480回收。在本实施形态中，回收部480具备：真空系统483；包含可容纳液体1的容器的气液分离器481；以及在基片架PT内部设置的、连接空间470与气液分离器481的流路482。对流路482的内壁面也进行了疏液处理。In addition, the liquid 1 that has flowed into thespace 470 between thebent portion 32T (wall portion 310 ) of thesecond plate member 32 and theilluminance unevenness sensor 400 is recovered by therecovery unit 480 . In this embodiment, therecovery unit 480 includes: avacuum system 483; a gas-liquid separator 481 including a container capable of holding the liquid 1;Road 482. The liquid-repellent treatment was also performed on the inner wall surface of theflow path 482 .

在上述的照度不匀传感器400中，在例如在其上面401A上形成了液体1的液浸区域AR2的状态下，在照射曝光光EL的照射区域(投影区域)内的多个位置上依次使针孔部470移动。由于上面401A呈疏液性，故在照度不匀检测结束后，可良好地进行上面401A上的液浸区域AR2的液体1的回收，可防止液体1残留的不良情况。此外，由于照度不匀传感器400(光学构件404、支撑部403)的侧面401B呈疏液性，同时与该侧面401B对置的弯曲部32T的内侧面32Tb也呈疏液性，故液体1难以侵入到间隙L中。因此，可防止液体1侵入到空间470中的不良情况。此外，即使假定液体1侵入到空间470中，也可利用回收部480良好地回收液体1。再者，即使液体1侵入到空间470中，由于壁部310的内侧面310A和上端面310B呈疏液性，同时与该壁部310对置的第2板构件32(弯曲部32T)也呈疏液性，故可防止侵入到空间470中的液体1越过壁部310侵入到基片架PT内部而产生锈蚀等的不良情况。此外，在第2板构件32与壁部310的间 隙中，利用弯曲部32T形成了在剖面视图中为弯曲的角部，由于该弯曲的角部起到密封部的功能，故能可靠地防止液体1对于基片架PT内部的侵入。In theuneven illuminance sensor 400 described above, for example, in the state where the liquid immersion area AR2 of the liquid 1 is formed on theupper surface 401A, a plurality of positions in the irradiation area (projection area) where the exposure light EL is irradiated are sequentially used. Thepinhole part 470 moves. Since theupper surface 401A is lyophobic, the liquid 1 in the liquid immersion area AR2 on theupper surface 401A can be recovered satisfactorily after the detection of uneven illumination is completed, and the problem of liquid 1 remaining can be prevented. In addition, since theside surface 401B of the uneven illumination sensor 400 (theoptical member 404 and the supporting part 403) is liquid-repellent, and the inner surface 32Tb of thecurved portion 32T opposite to theside surface 401B is also liquid-repellent, it is difficult for the liquid 1 to into the gap L. Therefore, it is possible to prevent the liquid 1 from intruding into thespace 470 . In addition, even if the liquid 1 intrudes into thespace 470 , the liquid 1 can be favorably recovered by therecovery unit 480 . Furthermore, even if the liquid 1 invades into thespace 470, since theinner surface 310A and theupper end surface 310B of thewall portion 310 are lyophobic, the second plate member 32 (curved portion 32T) facing thewall portion 310 is also liquid repellent. Liquid repellency, so that the liquid 1 intruding into thespace 470 can be prevented from intruding into the interior of the substrate holder PT through thewall portion 310 and causing disadvantages such as rust. In addition, in the gap between thesecond plate member 32 and thewall portion 310, thecurved portion 32T forms a curved corner in cross-sectional view, and since the curved corner functions as a sealing portion, it can be reliably sealed. Intrusion of the liquid 1 into the interior of the substrate holder PT is prevented.

而且，由于光学构件404可更换，故与板构件30同样，在其疏液性恶化了的情况下，与新的(具有充分的疏液性的)光学构件404更换即可。Furthermore, since theoptical member 404 is replaceable, similarly to theplate member 30 , when the liquid repellency deteriorates, it may be replaced with a new (having sufficient liquid repellency)optical member 404 .

再有，由于空间像检测传感器500具有与照度不匀传感器400大致同等的结构，故省略其详细的说明，但空间像检测传感器500也具有在基片架PT上经支撑部支撑的上板和由光学元件构成的光学构件，在其上面501A上设置了可通过光的狭缝部570和覆盖该狭缝部以外的部分的由遮光性材料构成的薄膜。而且，在光学构件下配置了接受通过了狭缝部570的光的光传感器。具有狭缝部570的光学构件根据其疏液性的恶化可更换。Furthermore, since the aerialimage detection sensor 500 has substantially the same structure as theilluminance unevenness sensor 400, its detailed description is omitted, but the aerialimage detection sensor 500 also has an upper plate supported by a support portion on the substrate holder PT and a The optical member composed of optical elements has aslit portion 570 through which light can pass and a thin film made of a light-shielding material covering the portion other than the slit portion on itsupper surface 501A. Furthermore, a photosensor for receiving light passing through theslit portion 570 is arranged under the optical member. The optical member having theslit portion 570 can be replaced according to deterioration of its liquid repellency.

再有，在参照上述的图14、图15已说明的实施形态中，通过使形成间隙K、L的构件表面具有疏液性来防止液体1的侵入，但不限于检测构件或传感器周围的间隙，通过使在基片架PT的上面存在的间隙同样地具有疏液性，可防止液体1对该间隙的侵入。此外，在间隙K、L中配置由树脂等形成的密封构件，可防止液体1的侵入，也可在间隙K、L中充填液体(例如真空油或磁性流体等)使之具有液体密封剂的功能来防止液体1的侵入。在该情况下，密封用的液体最好是难以在液体1中溶出的液体。当然，也可合并使用这些防止液体侵入的对策。Furthermore, in the embodiments described above with reference to FIGS. 14 and 15, the intrusion of the liquid 1 is prevented by making the surfaces of the members forming the gaps K and L lyophobic, but it is not limited to the gaps around the detection members or sensors. , by making the gap existing on the upper surface of the substrate holder PT similarly lyophobic, the intrusion of the liquid 1 into the gap can be prevented. In addition, a sealing member made of resin or the like is arranged in the gaps K and L to prevent the intrusion of the liquid 1, and it is also possible to fill the gaps K and L with a liquid (such as vacuum oil or magnetic fluid, etc.) to have the effect of a liquid sealant. function to prevent the intrusion of liquid 1. In this case, the sealing liquid is preferably a liquid that is difficult to dissolve into the liquid 1 . Of course, these countermeasures against liquid intrusion can also be used in combination.

此外，没有必要使在基片台PST(基片架PT)上安装的全部的检测构件(基准构件300的光学构件301、光学传感器400的上板401、光学传感器500的上板501等)的表面(液体接触面)呈疏液性，可只使这些表面的一部分具有疏液性。In addition, it is not necessary to make all detection members (the optical member 301 of thereference member 300, theupper plate 401 of theoptical sensor 400, theupper plate 501 of theoptical sensor 500, etc.) mounted on the substrate stage PST (substrate holder PT) The surfaces (liquid contact surfaces) are rendered lyophobic, and only a portion of these surfaces can be rendered lyophobic.

此外，在上述的实施形态中，在构件表面的疏液性恶化了的情况下进行更换，但也可在更换某一个构件时，同时也更换更换时期接近的构件。In addition, in the above-mentioned embodiment, replacement is performed when the liquid repellency of the surface of the member deteriorates, but when replacing one of the members, the member whose replacement time is close may also be replaced at the same time.

此外，为了更可靠地进行液体(水)的回收，希望基片架PT的表面、即板构件30和第2板构件32的表面、基准构件300等的表面的对于液体(水)的接触角比80°大，最好大于等于100°(上述的四氟乙烯的对于液体(水)的接触角约为110°)。In addition, in order to recover the liquid (water) more reliably, it is desirable that the contact angle of the surface of the substrate holder PT, that is, the surface of theplate member 30 and thesecond plate member 32, the surface of thereference member 300 and the like with respect to the liquid (water) It is greater than 80°, preferably 100° or greater (the contact angle of tetrafluoroethylene with respect to liquid (water) is about 110°).

此外，关于在基片P的表面上涂敷的感光材料(ArF曝光光用的光刻胶)，也希望使用对于液体(水)的接触角比80°大的材料。当然，在使用KrF准分子激光作为曝光光的情况下，希望使用对于液体的接触角比80°大的光刻胶作为KrF曝光光用的光刻胶。In addition, regarding the photosensitive material (resist for ArF exposure light) coated on the surface of the substrate P, it is also desirable to use a material having a contact angle with liquid (water) larger than 80°. Of course, when using a KrF excimer laser as exposure light, it is desirable to use a photoresist having a contact angle with liquid larger than 80° as a photoresist for KrF exposure light.

在上述的具体例中例示了同时具备基片架、基准构件300、照度不匀传感器400或空间像检测传感器500等的检测工具的基片台，但也可将本发明适用于保持基片并进行曝光的台和检测用的台不在一起的曝光装置。即，本发明也可应用于具备保持晶片等的被处理基片并可移动的曝光台和备有各种基准构件或检测传感器等的检测构件的检测台的曝光装置。在该情况下，可将在上述的实施形态中在基片台PST上配置了的基准构件或各种检测传感器中的至少一部分配置在检测台上。具备曝光台和检测台的曝光装置例如在特开平11-135400号公报中记载了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。In the above-mentioned specific example, the substrate stage provided with detection tools such as the substrate holder, thereference member 300, theilluminance unevenness sensor 400, and the aerialimage detection sensor 500 is illustrated, but the present invention can also be applied to holding a substrate and An exposure device in which the stage for exposure and the stage for detection are separated. That is, the present invention can also be applied to an exposure apparatus including a movable exposure stage holding a substrate to be processed such as a wafer, and a detection stage equipped with detection means such as various reference members and detection sensors. In this case, at least a part of the reference member or various detection sensors disposed on the substrate stage PST in the above-described embodiment may be disposed on the detection stage. An exposure apparatus including an exposure stage and a detection stage is described, for example, in Japanese Patent Laid-Open No. 11-135400, and as long as it is permitted by the laws and regulations of the countries designated or selected in this international application, the contents of these documents are cited as the contents of this document. part.

在本实施形态中，也可适用于安装了2个保持基片P的基片台(基片架)的双台型的曝光装置。双台型的曝光装置的结构和曝光工作，例如在特开平10-163099号和特开平10-214783号(对应的美国专利6,341,007、6,400,441、6,549,269和6,590,634)、特表2000-505958号(对应的美国专利5,969,441)或美国专利6,208,407中公开了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。The present embodiment can also be applied to a double-stage type exposure apparatus in which two substrate stages (substrate holders) holding the substrate P are mounted. The structure and exposure work of the double-stage exposure device are, for example, disclosed in JP 10-163099 and JP 10-214783 (corresponding to U.S. Patents 6,341,007, 6,400,441, 6,549,269 and 6,590,634), JP 2000-505958 (corresponding to As disclosed in US Patent No. 5,969,441) or US Patent No. 6,208,407, as long as it is permitted by the laws and regulations of the countries designated or selected in this international application, the description content of these documents is cited as a part of the description herein.

<第4实施形态><Fourth Embodiment>

图16是应用了本发明的双台型曝光装置的概略结构图。双台型曝光装置具备可在共同的基座54上分别独立地移动的第1、第2基片台PST1、PST2。第1、第2基片台PST1、PST2是具备用与图1～15 的关系说明了的那样的结构和功能的基片台，分别具有第1、第2基片架PT1、PT2，在第1、第2基片架PT1、PT2上分别以可更换的方式设置了板构件30和第2板构件32。此外，双台型曝光装置具有曝光工位ST1和检测、更换工位ST2，在曝光工位ST1上设置投影光学系统PL，在检测、更换工位ST2上安装了基片对准系统、聚焦、矫正检测系统等(在图16中未图示)。而且，在曝光工位ST1中在对在第1基片架PT1上保持的基片P进行液浸曝光的期间内，在检测、更换工位ST2中对于第2基片台PST2(第2基片架PT2)与板构件30一起装载、卸载基片P。此外，在检测、更换工位ST2中，与曝光工位ST1中的液浸曝光并行地进行第2基片台PST2上的对于基片P的检测工作(聚焦检测工作、对准工作)，在该检测工作结束了后，第2基片台PST2移动到曝光工位ST2上，对第2基片台PST上的基片P进行液浸曝光处理。Fig. 16 is a schematic configuration diagram of a dual-stage exposure apparatus to which the present invention is applied. The dual-stage exposure apparatus includes first and second substrate stages PST1 and PST2 that are independently movable on acommon base 54 . The 1st, the 2nd substrate stage PST1, PST2 is to possess the structure and the function described with the relation of Fig. 1～15, respectively have the 1st, the 2nd substrate stage PT1, PT2, 1. Aplate member 30 and asecond plate member 32 are provided in a replaceable manner on the second substrate holders PT1 and PT2, respectively. In addition, the double-stage exposure device has an exposure station ST1 and a detection and replacement station ST2. The projection optical system PL is installed on the exposure station ST1, and a substrate alignment system, focusing, Correction detection system etc. (not shown in FIG. 16 ). Furthermore, during the liquid immersion exposure of the substrate P held on the first substrate holder PT1 at the exposure station ST1, the second substrate stage PST2 (second substrate stage PST2) The wafer rack PT2 ) loads and unloads the substrate P together with theplate member 30 . In addition, in the detection and exchange station ST2, the detection work (focus detection work and alignment work) on the substrate P on the second substrate stage PST2 is performed in parallel with the liquid immersion exposure in the exposure station ST1. After the detection work is completed, the second substrate stage PST2 is moved to the exposure station ST2, and the liquid immersion exposure process is performed on the substrate P on the second substrate stage PST.

这样，在双台型曝光装置的情况下，由于在一个台上的液浸曝光处理中，在另一个台上不仅可进行基片更换或检测处理，而且可进行板构件30的更换，故可提高曝光处理的单位时间的产量。In this way, in the case of a double-stage exposure apparatus, since the liquid immersion exposure process on one stage can not only replace the substrate or detect processing, but also replace theplate member 30 on the other stage, it is possible to Improve the throughput per unit time of exposure processing.

再有，在上述的各实施形态中，说明了根据其疏液性来更换板构件30等，但在例如因某种原因损伤了或污染了的情况下等，当然也可根据疏液性的恶化以外的其它的理由来更换。例如，在板构件30等在长时间内与液体1接触的情况下，由于存在其表面的性能恶化、物质溶出从而污染液体1的可能性，故也可考虑伴随物质溶出的板构件30等的表面性能恶化来决定更换时期。In addition, in each of the above-mentioned embodiments, it has been described that theplate member 30 is replaced according to its liquid repellency, but it is of course possible to replace theplate member 30 according to the liquid repellency, for example, in the case of damage or contamination for some reason. Replacement for reasons other than deterioration. For example, when theplate member 30 and the like are in contact with the liquid 1 for a long period of time, there is a possibility that the performance of the surface deteriorates and the substance is eluted to contaminate the liquid 1, so it is also conceivable that theplate member 30 etc. are accompanied by the elution of the substance. Deterioration of surface properties determines the replacement period.

在上述实施形态中，用萤石形成了光学元件2，但例如可使用该萤石的表面的结晶方位为(111)面的萤石。此外，在图1中示出的光学元件2的前端部2a、即与液体1接触的部分中，可利用真空蒸镀法形成氟化镁(MgF₂膜作为由单层膜构成的防止溶解膜。In the above embodiment, the optical element 2 is formed of fluorite, but for example, a fluorite whose crystal orientation on the surface of the fluorite is the (111) plane can be used. In addition, in the front end portion 2a of the optical element 2 shown in FIG. 1 , that is, the portion in contact with the liquid 1, a magnesium fluoride (MgF₂ film can be formed as a single-layer film to prevent dissolution by vacuum evaporation. .

<第5实施形态><Fifth Embodiment>

如在上述的第1实施形态中已说明的那样，在基片台PST上安装了构成照射量监视器、照度不匀传感器等的装置的光学部件、空间 像检测装置的指标板、中间掩模的对准时使用的基准标记(基准构件)的情况下，希望这些光学部件的光照射面(液体接触面)具有疏液性。在不能完全地进行照射量监视器、照度不匀传感器等的光照射面上的排水的情况下，存在不能准确地进行光照射量或光照度的检测的危险。此外，在不能完全地进行空间像检测装置的指标板上的排水的情况下，存在由于指标板上的液体蒸发、指标板的面形状变化从而在由空间像检测装置进行的检测中产生误差的可能性。此外，在不能完全地进行基准标记上的排水的情况下，存在由于基准标记上的液体蒸发、基准标记的形状变化从而不能准确地进行中间掩模对准的可能性。因此，要求在基片台上配置的光学部件的表面在长时间内具有疏水性。As described in the above-mentioned first embodiment, optical components constituting devices such as an irradiation dose monitor and an illuminance unevenness sensor, an index plate of an aerial image detection device, and a reticle are mounted on the substrate stage PST. In the case of fiducial marks (reference members) used for alignment, it is desirable that the light irradiation surface (liquid contact surface) of these optical components have liquid repellency. If the drainage cannot be completely performed on the light-irradiated surface of the irradiated amount monitor, the illuminance unevenness sensor, etc., there is a possibility that the detection of the light irradiated amount or the illuminance cannot be accurately performed. In addition, in the case where the drainage on the index plate of the aerial image detection device cannot be completely performed, errors may occur in the detection by the aerial image detection device due to the evaporation of the liquid on the index plate and the change in the surface shape of the index plate. possibility. Also, if the water on the fiducial marks cannot be completely drained, the liquid on the fiducial marks evaporates and the shape of the fiducial marks changes, so that the reticle alignment may not be accurately performed. Therefore, the surface of the optical component placed on the substrate stage is required to be hydrophobic for a long time.

在该情况下，可考虑通过在光学部件的表面上涂敷非晶质氟树脂并形成薄膜来作成光学性能高的疏水性光学薄膜。即，非晶质氟树脂是树脂中特别透明且紫外线透射率高的材料，而且，由于因树脂表面上配位的-CF₃键的缘故，是在有机物中显示出最小的表面张力的树脂，故是具有优良的疏水性能的材料。In this case, it is conceivable to form a hydrophobic optical film with high optical performance by coating an amorphous fluororesin on the surface of the optical member to form a film. That is, amorphous fluororesin is a material that is particularly transparent and has a high ultraviolet transmittance among resins, and is a resin that exhibits the smallest surface tension among organic substances due to the_-CF bond coordinated on the surface of the resin, Therefore, it is a material with excellent hydrophobic properties.

但是，如果对在光学部件的表面上施加的疏水性光学薄膜在液浸状态下照射能量高的紫外激光，则薄膜吸收的微量的光的能量变换为温度，在比较短的期间内薄膜膨胀，水侵入到膜中。在该情况下，如果氟树脂薄膜与光学部件表面的密接性恶化，则膜剥离，对光学性能产生不良影响，由于疏水性能恶化，存在水滴残留在基片台上的危险。However, if a hydrophobic optical film applied on the surface of an optical component is irradiated with a high-energy ultraviolet laser in a liquid immersion state, the energy of a small amount of light absorbed by the film is converted into temperature, and the film expands in a relatively short period of time. Water intrudes into the membrane. In this case, if the adhesion between the fluororesin film and the surface of the optical component deteriorates, the film will peel off, adversely affecting the optical performance, and water droplets may remain on the substrate stage due to the deterioration of the hydrophobic performance.

一般来说，已知如果使氟烷基硅烷那样的偶合剂与光学部件表面反应来形成粘接层并在其上形成氟树脂薄膜，则可得到密接性良好的薄膜，但按照本发明者的调查，由于氟烷基硅烷吸收紫外激光而分解，故可知不能得到激光照射后的密接性。Generally, it is known that if a coupling agent such as fluoroalkylsilane is reacted with the surface of an optical part to form an adhesive layer and a fluororesin film is formed thereon, a film with good adhesion can be obtained, but according to the present inventors' According to investigation, since fluoroalkylsilane absorbs ultraviolet laser light and decomposes, it turns out that the adhesiveness after laser irradiation cannot be obtained.

在本实施形态中，一边参照附图，一边说明适合于在长时间内可维持疏水性的液浸型投影曝光装置的光学部件。图19是示出在晶片台上安装的光学部件的图。图20是示出在晶片台上安装的光学部件的结构的图。In this embodiment, optical components suitable for a liquid immersion projection exposure apparatus capable of maintaining hydrophobicity over a long period of time will be described with reference to the drawings. FIG. 19 is a diagram showing optical components mounted on a wafer stage. FIG. 20 is a diagram showing the configuration of optical components mounted on a wafer stage.

在图19中示出的晶片台609上安装了用于监视曝光光的照射量 的照射量监视器的光入射窗(光照射面)650和用于检测曝光光的照度不匀的照度不匀传感器的光入射窗(光照射面)652等的光学部件。此外，安装了进行投影光学系统的光学特性等的检测的空间像检测装置(AIS系统)的指标板(光照射面)654和中间掩模的对准时使用的基准标记(FM)(光照射面)656等的光学部件。在此，如图20中所示，利用石英玻璃660构成照射量监视器的光入射窗(光照射面)650(和照度不匀传感器的光入射窗(光照射面)652)，在其表面上形成由二氧化硅(SiO₂)形成的微粒子层(粘接微粒子层)662，在微粒子层的表面上形成由非晶质氟树脂构成的疏水性膜664。On thewafer stage 609 shown in FIG. 19, a light incident window (light irradiation surface) 650 of an irradiation monitor for monitoring the irradiation amount of the exposure light and an illumination unevenness for detecting the illumination unevenness of the exposure light are installed. Optical components such as the light incident window (light irradiation surface) 652 of the sensor. In addition, the index plate (light irradiation surface) 654 of the aerial image detection device (AIS system) for detecting the optical characteristics of the projection optical system and the fiducial mark (FM) (light irradiation surface) used for alignment of the reticle are installed. ) 656 and other optical components. Here, as shown in FIG. 20, the light incident window (light irradiation surface) 650 (and the light incident window (light irradiation surface) 652 of the illuminance unevenness sensor) of the irradiance monitor is constituted byquartz glass 660, and on its surface A fine particle layer (bonding fine particle layer) 662 made of silicon dioxide (SiO₂ ) is formed on the surface, and ahydrophobic film 664 made of amorphous fluororesin is formed on the surface of the fine particle layer.

此外，利用石英玻璃和在该石英玻璃的表面上形成的铬(金属)图案构成空间像检测装置(AIS系统)的指标板654和基准标记(FM)656，在其表面上形成由二氧化硅(SiO₂)形成的微粒子层(粘接微粒子层)，在微粒子层的表面上形成由非晶质氟树脂构成的疏水性膜。In addition, theindex plate 654 and the fiducial mark (FM) 656 of the aerial image detection device (AIS system) are formed by using quartz glass and a chromium (metal) pattern formed on the surface of the quartz glass, and the surface is formed on the surface by silicon dioxide. The fine particle layer (bonding fine particle layer) formed of (SiO₂ ) forms a hydrophobic film made of amorphous fluororesin on the surface of the fine particle layer.

按照与本实施形态有关的光学部件，由形成粘接微粒子层的二氧化硅(SiO₂)构成的的微粒子层与基体材料的玻璃(主要成分SiO₂)的亲和性良好，可得到与基体材料的玻璃良好的密接性。此外，在表面上产生来源于粒子的直径的凹凸。再者，二氧化硅等是紫外线透射率非常高的材料，其本身的激光照射耐久性也高。在本实施形态中，在形成了由二氧化硅(SiO₂)构成的微粒子层后在该微粒子层上形成由非晶质氟树脂构成的疏水性膜。以非晶质氟树脂进入二氧化硅等的微粒子的空隙中而将其包围的方式干燥、固化。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。According to the optical component of this embodiment, the fine particle layer composed of silicon dioxide (SiO₂ ) forming the bonding fine particle layer has good affinity with the glass (main component SiO₂ ) of the base material, and can obtain a good affinity with the base material. Material glass has good adhesion. In addition, irregularities derived from the diameter of the particles are generated on the surface. In addition, silicon dioxide and the like are materials with very high ultraviolet transmittance, and their durability against laser irradiation is also high. In this embodiment, after forming a fine particle layer made of silicon dioxide (SiO₂ ), a hydrophobic film made of an amorphous fluororesin is formed on the fine particle layer. The amorphous fluororesin is dried and cured so that it enters the voids of fine particles such as silica and surrounds them. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high.

此外，因为在光照射面上形成的疏水性膜具有高的激光照射耐久性，故可在长时间内维持在投影曝光装置上安装的光学部件的光照射面的疏水性。In addition, since the hydrophobic film formed on the light-irradiated surface has high laser irradiation durability, the hydrophobicity of the light-irradiated surface of the optical component mounted on the projection exposure apparatus can be maintained for a long period of time.

此外，按照与本实施形态有关的投影曝光装置，由于在基片台上安装了可在长时间内维持光照射面的疏水性的光学部件，故即使在重复进行液浸曝光的情况下，也能可靠地进行光学部件的光照射面上的排水。In addition, according to the projection exposure apparatus related to this embodiment, since the optical member capable of maintaining the hydrophobicity of the light-irradiated surface for a long period of time is attached to the substrate table, even in the case of repeated liquid immersion exposure, Drainage can be reliably performed on the light irradiation surface of the optical member.

再有，在上述的实施形态中，在光学部件的光照射面上形成了由用二氧化硅(SiO₂)构成的微粒子层构成的粘接微粒子层的基础上形成了由非晶质氟树脂构成的疏水性膜，但也可在光照射面上代替二氧化硅(SiO₂)形成了由氟化镁(MgF₂)或氟化钙(CaF₂)构成的粘接微粒子层的基础上形成由非晶质氟树脂构成的疏水性膜。或者，可混合或层叠二氧化硅(SiO₂)、氟化镁(MgF₂)和氟化钙(CaF₂)中的任意的二种来构成粘接微粒子层，也可混合或层叠这些材料的三种来构成粘接微粒子层。即使在该情况下，与在形成了由周二氧化硅(SiO₂)构成的微粒子层构成的粘接微粒子层的基础上形成了由非晶质氟树脂构成的疏水性膜的情况同样，可作成在激光照射耐久性方面优良的疏水性膜。Furthermore, in the above-mentioned embodiment, an adhesive fine particle layer composed of a fine particle layer composed of silicon dioxide (SiO₂ ) is formed on the light irradiation surface of the optical member, and an amorphous fluororesin is formed. Hydrophobic film_{composed of magnesium fluoride (MgF 2)} or CaF₂ Hydrophobic film made of amorphous fluororesin. Alternatively, any two of silicon dioxide (SiO₂ ), magnesium fluoride (MgF₂ ) and calcium fluoride (CaF₂ ) may be mixed or laminated to form the adhesive fine particle layer, or a combination of these materials may be mixed or laminated. Three kinds are used to form the adhesive particle layer. Even in this case, as in the case where a hydrophobic film made of amorphous fluororesin is formed on the basis of forming an adhesive fine particle layer composed of a fine particle layer composed of silicon dioxide (SiO₂ ), it can be made Hydrophobic film excellent in laser irradiation durability.

此外，在上述的实施形态中，在光学部件(例如光入射窗650)的光照射面上形成了由用二氧化硅(SiO₂)构成的微粒子层构成的粘接微粒子层的基础上形成了由非晶质氟树脂构成的疏水性膜，但也可如图21中所示，通过例如使用氟化氢(或将氟化氢溶解于水的氢氟酸)刻蚀由石英玻璃666形成的光照射面的表面来形成粘接面(刻蚀面)668，在粘接面668的表面上形成由非晶质氟树脂构成的疏水性膜670。在该情况下，由于具有用在光照射面上使用氟化氢刻蚀了的刻蚀面构成的粘接面，故如果在粘接面上形成由非晶质氟树脂构成的疏水性膜，则以非晶质氟树脂进入微粒子的空隙中而将其包围的方式干燥、固化。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。In addition, in the above-mentioned embodiment, an adhesive fine particle layer composed of a fine particle layer made of silicon dioxide (SiO₂ ) is formed on the light irradiation surface of the optical member (for example, the light incident window 650). A hydrophobic film made of an amorphous fluororesin, but as shown in FIG. An adhesive surface (etched surface) 668 is formed on the surface, and a hydrophobic film 670 made of amorphous fluororesin is formed on the surface of the adhesive surface 668 . In this case, since there is an adhesive surface composed of an etched surface etched with hydrogen fluoride on the light irradiation surface, if a hydrophobic film made of amorphous fluororesin is formed on the adhesive surface, then The amorphous fluororesin is dried and cured so as to penetrate into the voids of fine particles and surround them. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high.

此外，在本实施形态中，光照射面在基体材料玻璃和基体材料玻璃的表面的一部分上具有用于形成图案的金属膜(铬等)，在其上形成了由非晶质氟树脂构成的疏水性膜，但也可具有在基体材料玻璃和基体材料玻璃的整个面上形成的金属膜，在其上形成由非晶质氟树脂构成的疏水性膜。这样的光学部件用作在监视投影透镜的透射率等时使用的高反射片。In addition, in this embodiment, the light-irradiating surface has a metal film (chromium, etc.) for patterning on the base material glass and a part of the surface of the base material glass, and the film made of amorphous fluororesin is formed thereon. The hydrophobic film may have a base material glass and a metal film formed on the entire surface of the base material glass, and a hydrophobic film made of an amorphous fluororesin may be formed thereon. Such an optical component is used as a high reflection sheet used when monitoring the transmittance of a projection lens or the like.

此外，在本实施形态中，使用了以石英玻璃作为基体材料玻璃， 但也可使用低膨胀的玻璃。In addition, in this embodiment, quartz glass is used as the base material glass, but low-expansion glass may also be used.

以下，利用实施例具体地说明本实施形态的光学部件的制造方法。Hereinafter, the manufacturing method of the optical component of this embodiment is demonstrated concretely using an Example.

实施例AExample A

通过利用照射超声波的自动清洗装置清洗或通过用浸透乙醇的布等擦拭进行成膜的光学部件(石英玻璃)的光照射面的表面，将表面清洗成高度清洁的表面。The surface is cleaned to a highly clean surface by cleaning with an automatic cleaning device that irradiates ultrasonic waves or by wiping the surface of the light-irradiated surface of the optical member (quartz glass) where film formation is performed with a cloth soaked in ethanol or the like.

其次，在光学部件的表面上滴下相当量的将平均粒径为80nm的MgF₂的微粒子稳定地分散在碱溶液中的涂液，用高速旋转装置进行旋转涂敷。干燥到涂液丧失流动性为止后，从高速旋转装置取下光学部件，为了使涂液完全干燥，使其在约150℃的干燥炉中进行1～2小时的干燥。进而在冷却到室温的光学部件上滴下相当量的溶解了非晶质氟树脂(旭硝子(株)的「サイトツプ」)的涂液，用高速旋转装置进行旋转涂敷。干燥到涂液丧失流动性为止后，从高速旋转装置取下光学部件，为了使涂液完全干燥，使其在约100℃的干燥炉中进行1～2小时的干燥。利用上述的工序，制造在基体材料玻璃(石英玻璃)上具有MgF₂膜和非晶质氟树脂膜的光学部件。Next, a considerable amount of coating liquid in which fine particles of MgF₂ with an average particle diameter of 80 nm are stably dispersed in an alkaline solution was dropped on the surface of the optical component, and spin coating was performed with a high-speed rotary device. After drying until the fluidity of the coating liquid is lost, the optical component is removed from the high-speed rotating device, and dried in a drying oven at about 150° C. for 1 to 2 hours in order to completely dry the coating liquid. Furthermore, a considerable amount of a coating liquid in which an amorphous fluororesin ("Sittop" of Asahi Glass Co., Ltd.) was dissolved was dropped on the optical member cooled to room temperature, and spin coating was performed using a high-speed spinner. After drying until the fluidity of the coating liquid is lost, the optical component is removed from the high-speed rotating device, and dried in a drying oven at about 100° C. for 1 to 2 hours in order to completely dry the coating liquid. Through the above-mentioned steps, an optical component having a MgF₂ film and an amorphous fluororesin film on a base material glass (quartz glass) was manufactured.

实施例BExample B

通过利用照射超声波的自动清洗装置清洗或通过用浸透乙醇的布等擦拭进行成膜的光学部件(石英玻璃)的光照射面的表面，将表面清洗成高度清洁的表面。The surface is cleaned to a highly clean surface by cleaning with an automatic cleaning device that irradiates ultrasonic waves or by wiping the surface of the light-irradiated surface of the optical member (quartz glass) where film formation is performed with a cloth soaked in ethanol or the like.

其次，在光学部件的表面上滴下相当量的将平均粒径为80nm的SiO₂的微粒子稳定地分散在碱溶液中的涂液，用高速旋转装置进行旋转涂敷。干燥到涂液丧失流动性为止后，从高速旋转装置取下光学部件，为了使涂液完全干燥，使其在约150℃的干燥炉中进行1～2小时的干燥。进而在冷却到室温的光学部件上滴下相当量的溶解了非晶质氟树脂(旭硝子(株)的「サイトツプ」)的涂液，用高速旋转装置进行旋转涂敷。干燥到涂液丧失流动性为止后，从高速旋转装置取下光学部件，为了使涂液完全干燥，使其在约100℃的干燥炉中进行1～ 2小时的干燥。利用上述的工序，制造在基体材料玻璃(石英玻璃)上具有SiO₂膜和非晶质氟树脂膜的光学部件。Next, a considerable amount of coating liquid in which fine particles of SiO₂ with an average particle diameter of 80 nm are stably dispersed in an alkaline solution is dropped on the surface of the optical component, and spin coating is performed with a high-speed rotating device. After drying until the fluidity of the coating liquid is lost, the optical component is removed from the high-speed rotating device, and dried in a drying oven at about 150° C. for 1 to 2 hours in order to completely dry the coating liquid. Furthermore, a considerable amount of a coating liquid in which an amorphous fluororesin ("Sittop" of Asahi Glass Co., Ltd.) was dissolved was dropped on the optical member cooled to room temperature, and spin coating was performed using a high-speed spinner. After drying until the coating liquid loses fluidity, remove the optical component from the high-speed rotating device, and dry the coating liquid in a drying oven at about 100° C. for 1 to 2 hours in order to completely dry the coating liquid. An optical component having a SiO₂ film and an amorphous fluororesin film on a substrate glass (quartz glass) was produced by the above-mentioned steps.

实施例CExample C

在将高精度地研磨到约0.2nmRMS的粗糙度的光学部件(石英玻璃)的表面在5秒间浸渍于稀释为5％的氢氟酸中后，用纯水洗涮氢氟酸，用浸透乙醇的布等擦拭。在该表面上滴下相当量的溶解了非晶质氟树脂(旭硝子(株)的「サイトツプ」)的涂液，用高速旋转装置进行旋转涂敷。干燥到涂液丧失流动性为止后，从高速旋转装置取下光学部件，为了使涂液完全干燥，使其在约100℃的干燥炉中进行1～2小时的干燥。利用上述的工序，制造在基体材料玻璃(石英玻璃)上具有非晶质氟树脂膜的光学部件。After immersing the surface of an optical component (quartz glass) that has been ground to a roughness of about 0.2nmRMS with high precision in hydrofluoric acid diluted to 5% for 5 seconds, rinse the hydrofluoric acid with pure water and soak it with ethanol. cloth etc. to wipe. A considerable amount of a coating liquid in which an amorphous fluororesin ("Sittop" of Asahi Glass Co., Ltd.) was dissolved was dropped on the surface, and spin coating was performed using a high-speed spinner. After drying until the fluidity of the coating liquid is lost, the optical component is removed from the high-speed rotating device, and dried in a drying oven at about 100° C. for 1 to 2 hours in order to completely dry the coating liquid. An optical component having an amorphous fluororesin film on a substrate glass (quartz glass) was manufactured by the above-mentioned steps.

比较例comparative example

通过利用照射超声波的自动清洗装置清洗或通过用浸透乙醇的布等擦拭进行成膜的光学部件(石英玻璃)的光照射面的表面，将表面清洗成高度清洁的表面。其次，滴下相当量的溶解了非晶质氟树脂(旭硝子(株)的「サイトツプ」)的涂液，用高速旋转装置进行旋转涂敷。The surface is cleaned to a highly clean surface by cleaning with an automatic cleaning device that irradiates ultrasonic waves or by wiping the surface of the light-irradiated surface of the optical member (quartz glass) where film formation is performed with a cloth soaked in ethanol or the like. Next, a considerable amount of a coating solution in which an amorphous fluororesin ("Sittop" of Asahi Glass Co., Ltd.) was dissolved was dropped, and spin coating was performed using a high-speed spinner.

干燥到涂液丧失流动性为止后，从高速旋转装置取下光学部件，为了使涂液完全干燥，使其在约100℃的干燥炉中进行1～2小时的干燥。利用上述的工序，制造在基体材料玻璃(石英玻璃)上具有非晶质氟树脂膜的光学部件。After drying until the fluidity of the coating liquid is lost, the optical component is removed from the high-speed rotating device, and dried in a drying oven at about 100° C. for 1 to 2 hours in order to completely dry the coating liquid. An optical component having an amorphous fluororesin film on a substrate glass (quartz glass) was manufactured by the above-mentioned steps.

(剥离测试)(peel test)

对于用上述的实施例A～C和比较例得到的光学部件，进行了使用透明绞带的剥离测试(带测试)。关于带测试，使用宽度为18mm的ニチバン株式会社的透明绞带，在粘贴带时，用手指用力地抹平3次，通过迅速地垂直地剥离，判断了膜的剥离的程度。将在各例子中得到的光学部件作为样品，各准备3个样品，分别进行了测试。A peeling test (tape test) using a transparent twisted tape was performed on the optical components obtained in Examples A to C and Comparative Example described above. Regarding the tape test, a transparent twisted tape made by Nichiban Co., Ltd. with a width of 18 mm was used. When the tape was pasted, it was smoothed three times with fingers, and the degree of peeling of the film was judged by quickly peeling off vertically. The optical components obtained in each example were used as samples, and three samples were prepared and tested respectively.

作为评价值的基准，将在疏水层中有大于等于φ5mm的剥离的情况定为「发生剥离」，将除此以外的情况定为「没有剥离」。3/3表示 3个样品中都剥离了。As a criterion of the evaluation value, when there was peeling of φ5 mm or more in the water-repellent layer, it was defined as “peeling occurred”, and in other cases, it was defined as “no peeling”. 3/3 means peeling in all 3 samples.

(试验结果)(test results)

实施例A 0/3个 没有剥离Embodiment A 0/3 No stripping

实施例B 0/3个 没有剥离Embodiment B 0/3 No stripping

实施例C 0/3个 没有剥离Example C 0/3 No stripping

比较例  3/3个 发生剥离Comparative example 3/3 peeled off

从该试验结果可明白，对于实施例A～实施例C的疏水性膜来说，由于设置了粘接层或刻蚀面，故牢固地粘接到基体材料玻璃上。因而，可知本发明的光学构件在液浸曝光那样的与液体接触的环境下，耐液性(耐水性)高。From the test results, it is clear that the hydrophobic films of Examples A to C are firmly bonded to the base material glass because of the provision of an adhesive layer or an etched surface. Therefore, it turns out that the optical member of this invention has high liquid resistance (water resistance) in the environment which contacts a liquid, such as liquid immersion exposure.

在本实施例中，以疏水性膜粘接到基体材料玻璃上的情况为例进行了说明，根据该结果可知，能将本发明使用于任意的广泛的光学部件。即，不限定于使用于在液浸曝光装置的基片台上设置的基准构件或各种传感器，也可使用于在与液体或气体接触那样的环境下使用的所有的光学透镜、光学传感器。此外，也可适用于在曝光装置中使用的投影光学系统、特别是在基片一侧的前端安装的透镜或照明光学系统中使用的透镜或传感器。In the present example, the case where the hydrophobic film is bonded to the base material glass was described as an example. From the results, it can be seen that the present invention can be applied to any wide variety of optical components. That is, it is not limited to the reference member or various sensors provided on the substrate stage of the liquid immersion exposure apparatus, and it can be used for all optical lenses and optical sensors used in environments where they come into contact with liquid or gas. In addition, it is also applicable to a lens or a sensor used in a projection optical system used in an exposure apparatus, especially a lens mounted on the front end of the substrate side, or an illumination optical system.

再有，在上述的实施形态中记载的「接触角」，不仅包含静态的接触角，而且包含动态的接触角。In addition, the "contact angle" described in the above-mentioned embodiment includes not only a static contact angle but also a dynamic contact angle.

在上述曝光装置的实施形态中使用了纯水作为液体1。纯水具有下述的优点：在半导体制造工厂等中可容易地大量地得到，同时没有对于基片P上的光刻胶或光学元件(透镜)等的不良影响。此外，由于纯水没有对于环境的不良影响，同时杂质的含量极低，故也可预期清洗基片P的表面和投影光学系统PL的前端面上设置的光学元件的表面的作用。再有，在从工厂等供给的纯水的纯度低的情况下，也可使曝光装置具有超纯水制造器。In the embodiment of the exposure apparatus described above, pure water was used as the liquid 1 . Pure water has the advantage of being easily available in large quantities in semiconductor manufacturing plants and the like, while having no adverse effects on photoresists on the substrate P or optical elements (lenses) and the like. In addition, since the pure water has no adverse effect on the environment and has an extremely low content of impurities, it can also be expected to clean the surface of the substrate P and the surface of the optical elements provided on the front end face of the projection optical system PL. In addition, when the purity of pure water supplied from a factory or the like is low, an ultrapure water generator may be provided in the exposure apparatus.

上述各实施形态的液体1是水，但也可以是水以外的液体。例如，在曝光光EL的光源是F₂激光的情况下，由于该F₂激光不透过水，故可以是能透过F₂激光的例如过氟化聚醚(PFPE)或氟油等氟类流体 作为液体1。在该情况下，通过例如用包含氟的极性小的分子结构的物质形成薄膜，对与液体1接触的部分进行亲液化处理。除此以外，也可使用具有对曝光光EL的透过性且折射率尽可能高、对投影光学系统PL或在基片P的表面上涂敷的光刻胶稳定的液体(例如雪松油)作为液体1。在该情况下，可根据所使用的液体1的极性来进行表面处理。The liquid 1 in each of the above-mentioned embodiments is water, but it may be a liquid other than water. For example, in the case where the light source of the exposure light EL is an_F2 laser, since the_F2 laser does not pass through water, it may be fluorine such as perfluorinated polyether (PFPE) or fluorine oil, which can pass through the_F2 laser. Fluid-like as Liquid 1. In this case, for example, the portion in contact with the liquid 1 is subjected to a lyophilic treatment by forming a thin film of a substance with a low polar molecular structure including fluorine. In addition to this, it is also possible to use a liquid (such as cedar oil) that is transparent to the exposure light EL and has a refractive index as high as possible and is stable to the projection optical system PL or the photoresist coated on the surface of the substrate P. as liquid 1. In this case, surface treatment may be performed according to the polarity of the liquid 1 used.

纯水(水)对于波长约为193nm的曝光光EL的折射率n可以说大致约为1.44，在使用了ArF准分子激光(波长193nm)作为曝光光EL的光源的情况下，在基片P上波长降低为1/n、即约134nm，可得到高的解像度。再者，由于与空气中相比，聚焦深度扩大为约n倍、即约1.44倍，故在能确保与在空气中使用的情况为同等程度的聚焦深度即可的情况下，可进一步增加投影光学系统PL的数值孔径，在这一点上，解像度也提高了。The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of approximately 193 nm can be said to be approximately 1.44. The upper wavelength is reduced to 1/n, that is, about 134nm, and a high resolution can be obtained. Furthermore, since the depth of focus is expanded by about n times compared to air, that is, about 1.44 times, it is possible to further increase the projection as long as the depth of focus is equivalent to the case of use in air. The numerical aperture of the optical system PL, at this point, the resolution is also improved.

再有，在如上所述那样使用液浸法的情况下，投影光学系统的数值孔径NA有时为0.9～1.3。这样，在投影光学系统的数值孔径NA变大的情况下，由于在迄今为止作为曝光光使用的随机偏振光中成像性能有时因偏振效应而恶化，故希望使用偏振光照明。在该情况下，最好进行与掩模(中间掩模)的「线和间隔」图案的线图案的长边方向一致的直线偏振光照明，从掩模(中间掩模)的图案较多地射出S偏振光分量(TE偏振光分量)、即沿线图案的长边方向的偏振光方向分量的衍射光。在用液体充满投影光学系统PL与在基片P的表面上涂敷的光刻胶之间的情况下，与用空气充满投影光学系统PL与在基片P的表面上涂敷的光刻胶之间的情况相比，由于有助于对比度的提高的S偏振光分量(TE偏振光分量)的衍射光的在光刻胶表面上的透射率变高，故即使在投影光学系统的数值孔径NA超过1.0的情况下，也能得到高的成像性能。此外，如果适当地组合移相掩模或在特开平6-188169号公报中公开了那样的与线图案的长边方向一致的斜入射照明法(特别是偶极照明法)等，则会更加有效。In addition, when using the liquid immersion method as described above, the numerical aperture NA of the projection optical system may be 0.9 to 1.3. As described above, when the numerical aperture NA of the projection optical system becomes large, it is desirable to use polarized light illumination because imaging performance may deteriorate due to polarization effects in randomly polarized light conventionally used as exposure light. In this case, it is preferable to perform linearly polarized light illumination consistent with the long side direction of the line pattern of the "line and space" pattern of the mask (reticle), and the pattern of the mask (reticle) is more The diffracted light of the S polarized light component (TE polarized light component), that is, the polarized light direction component along the long side direction of the line pattern is emitted. In the case of filling the space between the projection optical system PL and the photoresist coated on the surface of the substrate P with liquid, the same as filling the projection optical system PL and the photoresist coated on the surface of the substrate P with air Compared with the situation between, since the transmittance on the photoresist surface of the diffracted light of the S polarized light component (TE polarized light component) that contributes to the improvement of the contrast becomes high, even at the numerical aperture of the projection optical system When NA exceeds 1.0, high imaging performance can be obtained. In addition, if a phase shift mask is properly combined or the oblique incident illumination method (especially the dipole illumination method) consistent with the long-side direction of the line pattern disclosed in JP-A-6-188169, it will be more effective. efficient.

此外，例如在将ArF准分子激光作为曝光光、使用约1/4的缩小 倍率的投影光学系统PL、在基片P上曝光微细的「线和间隔」图案(例如约25～50nm的「线和间隔」)那样的情况下，根据掩模M的结构(例如图案的微细度或铬的厚度)，由于利用波导(Wave guide)效应掩模M起到偏振片的作用，与使对比度下降的P偏振光分量(TM偏振光分量)的衍射光相比，从掩模M较多地射出S偏振光分量(TE偏振光分量)的衍射光，故希望使用上述的直线偏振光照明，但即使用随机偏振光照明掩模M，即使在投影光学系统PL的数值孔径NA大到0.9～1.3的情况下，也能得到高的成像性能。此外，在基片P上曝光掩模M上的极微细的「线和间隔」图案那样的情况下，由于WireGrid效应的缘故，也存在P偏振光分量(TM偏振光分量)比S偏振光分量(TE偏振光分量)大的可能性，但在将ArF准分子激光作为曝光光、使用约1/4的缩小倍率的投影光学系统PL、在基片P上曝光比25nm大的「线和间隔」图案那样的情况下，由于从掩模M射出比P偏振光分量(TM偏振光分量)的衍射光多的S偏振光分量(TE偏振光分量)的衍射光，故即使在投影光学系统的数值孔径NA为0.9～1.3那样大的情况下，也能得到高的成像性能。In addition, for example, ArF excimer laser is used as exposure light, and a projection optical system PL with a reduction ratio of about 1/4 is used to expose a fine "line and space" pattern (for example, a "line and space" pattern of about 25 to 50 nm) on the substrate P. and spacing"), depending on the structure of the mask M (such as the fineness of the pattern or the thickness of chromium), since the mask M acts as a polarizer using the wave guide effect, it is different from the one that reduces the contrast. Compared with the diffracted light of the P polarized light component (TM polarized light component), the diffracted light of the S polarized light component (TE polarized light component) is emitted from the mask M more, so it is desirable to use the above-mentioned linearly polarized light illumination, but that is Using the random polarized light illumination mask M, high imaging performance can be obtained even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3. In addition, in the case of exposing the extremely fine "line and space" pattern on the mask M on the substrate P, due to the WireGrid effect, there are also more P-polarized light components (TM-polarized light components) than S-polarized light components. (TE polarized light component) is likely to be large, but when the ArF excimer laser is used as the exposure light, the projection optical system PL with a reduction ratio of about 1/4 is used, and the "line and space" larger than 25nm is exposed on the substrate P In the case of a pattern like that, since the diffracted light of the S polarized light component (TE polarized light component) is more than the diffracted light of the P polarized light component (TM polarized light component) from the mask M, even in the projection optical system Even when the numerical aperture NA is as large as 0.9 to 1.3, high imaging performance can be obtained.

再者，不仅与掩模(中间掩模)的线图案的长边方向一致的直线偏振光照明(S偏振光照明)是有效的，而且如在特开平6-53120号公报中公开了的那样，在以光轴为中心的圆的切线(周)方向上呈直线偏振光的偏振光照明法与斜入射照明法的组合也是有效的。特别是，不仅是掩模(中间掩模)的图案在规定的一个方向上延伸的线图案、而且在混合地存在在多个不同的方向上延伸的线图案的情况下，如在相同的特开平6-53120号公报中公开了的那样，通过合并使用在以光轴为中心的圆的切线(周)方向上呈直线偏振光的偏振光照明法和轮带照明法，即使在投影光学系统的数值孔径NA大的情况下，也能得到高的成像性能。Furthermore, not only is linearly polarized light illumination (S polarized light illumination) aligned with the long side direction of the line pattern of the mask (reticle) effective, but also as disclosed in JP-A-6-53120 A combination of a polarized illumination method in which light is linearly polarized in the tangential (circumferential) direction of a circle centered on the optical axis and an oblique incidence illumination method is also effective. In particular, not only the pattern of the mask (reticle) is a line pattern extending in a predetermined direction, but also when there are line patterns extending in a plurality of different directions mixedly, as in the same characteristic As disclosed in Kaihei No. 6-53120, by combining the polarized light illumination method and the wheel illumination method that use linearly polarized light in the tangential (circumferential) direction of a circle centered on the optical axis, even in the projection optical system Even when the numerical aperture NA is large, high imaging performance can be obtained.

在上述各实施形态中，在投影光学系统PL的前端安装了光学元件2，利用该透镜，可进行投影光学系统PL的光学特性、例如像差(球面像差、彗形像差等)的调整。再有，作为在投影光学系统PL的前 端安装的光学元件，可以是在投影光学系统PL的光学特性的调整中使用的光学板。或者可以是能透过曝光光EL的平行平面板。通过将与液体1接触的光学元件作成比透镜廉价的平行平面板，即使在曝光装置EX的运输、组装、调整时等使投影光学系统PL的透射率、基片P上的曝光光EL的照度和照度分布的均匀性下降的物质(例如硅类有机物)附着于该平行平面板上，在供给液体1之前只更换该平行平面板也就可以了，与将与液体1接触的光学元件作成透镜的情况相比，具有其更换成本降低的优点。即，由于因曝光光EL的照射的缘故，起因于从光刻胶发生的飞散粒子或液体1中的杂质的附着等，与液体1接触的光学元件的表面受到污染，必须定期地更换该光学元件，但通过将该光学元件作成廉价的平行平面板，与透镜相比，更换部件的成本降低而且可缩短在更换中需要的时间，可抑制维护成本(运行成本)的上升或单位时间产量的下降。In each of the above embodiments, the optical element 2 is attached to the front end of the projection optical system PL, and the optical characteristics of the projection optical system PL, such as aberrations (spherical aberration, coma, etc.) can be adjusted by using this lens. . In addition, as an optical element attached to the front end of projection optical system PL, an optical plate used for adjusting the optical characteristics of projection optical system PL may be used. Alternatively, it may be a parallel plane plate that transmits exposure light EL. By making the optical element in contact with the liquid 1 a parallel plane plate that is less expensive than a lens, even if the transmittance of the projection optical system PL and the illuminance of the exposure light EL on the substrate P are changed during transportation, assembly, and adjustment of the exposure apparatus EX, etc. Substances that reduce the uniformity of illumination distribution (such as silicon-based organic substances) adhere to the parallel plane plate, and it is sufficient to replace the parallel plane plate before supplying the liquid 1. The optical element that will be in contact with the liquid 1 is used as a lens. It has the advantage of reducing its replacement cost compared to the case of That is, due to the irradiation of the exposure light EL, the surface of the optical element in contact with the liquid 1 is polluted due to the scattering particles generated from the photoresist or the adhesion of impurities in the liquid 1, and the optical element must be replaced periodically. However, by making this optical element an inexpensive parallel plane plate, the cost of replacement parts can be reduced compared with lenses, and the time required for replacement can be shortened, which can suppress an increase in maintenance costs (running costs) or a decrease in output per unit time. decline.

再有，在因液体1的流动产生的投影光学系统PL的前端的光学元件与基片P之间的压力大的情况下，不将该光学元件作成可更换的元件，而是可将其牢固地固定，以免光学元件因该压力而移动。Furthermore, when the pressure between the optical element at the front end of the projection optical system PL and the substrate P due to the flow of the liquid 1 is large, the optical element can be firmly fixed instead of being replaceable. securely so that the optic does not move due to this pressure.

再有，在上述的各实施形态中，投影光学系统PL与基片P的表面之间是用液体1充满的结构，但例如也可以是在基片P的表面上安装了由平行平面板构成的覆盖玻璃的状态下充满液体1的结构。Furthermore, in each of the above-mentioned embodiments, the projection optical system PL and the surface of the substrate P are filled with the liquid 1, but for example, it is also possible to install on the surface of the substrate P a The state of the cover glass is filled with liquid 1 structure.

此外，应用了上述的液浸法的曝光装置成为用液体(纯水)充满投影光学系统PL的终端光学元件2的射出侧的光路空间来曝光基片P的结构，但也可如国际公开第2004/019128号中公开了的那样，也可用液体(纯水)充满投影光学系统PL的终端光学元件2的入射侧的光路空间。In addition, the exposure apparatus to which the above-mentioned liquid immersion method is applied is configured to fill the optical path space on the exit side of the terminal optical element 2 of the projection optical system PL with liquid (pure water) to expose the substrate P. As disclosed in No. 2004/019128, the optical path space on the incident side of the terminal optical element 2 of projection optical system PL may be filled with liquid (pure water).

再有，作为上述各实施形态的基片P，不仅可应用半导体器件制造用的半导体晶片，而且可应用于显示器件用的玻璃基片或薄膜磁头用的陶瓷晶片或在曝光装置中使用的掩模或中间掩模的原版(合成石英、硅晶片)等。Furthermore, as the substrate P of each of the above-mentioned embodiments, not only semiconductor wafers for manufacturing semiconductor devices, but also glass substrates for display devices, ceramic wafers for thin-film magnetic heads, or masks used in exposure equipment can be applied. Master plates of molds or reticles (synthetic quartz, silicon wafers), etc.

作为曝光装置EX，除了同步移动掩模M和基片P以对掩模M 的图案进行扫描曝光的「步进和扫描」方式的扫描型曝光装置(扫描步进器)外，也可适用于在使掩模M和基片P静止了的状态下一并曝光掩模M的图案、依次使基片步进地移动的「步进和重复」方式的投影曝光装置(步进器)。本发明也可适用于在基片上部分地重复至少2个图案来转印的「步进和重叠」方式的曝光装置。As the exposure apparatus EX, in addition to the scanning type exposure apparatus (scanning stepper) of the "step and scan" method in which the mask M and the substrate P are moved synchronously to scan and expose the pattern of the mask M, it is also applicable to The projection exposure apparatus (stepper) of the "step and repeat" system which exposes the pattern of the mask M in a state where the mask M and the substrate P are stationary, and sequentially moves the substrate in steps. The present invention can also be applied to an exposure apparatus of a "step and overlap" method that partially repeats and transfers at least two patterns on a substrate.

此外，在上述的实施形态中，采用了用液体局部地充满投影光学系统PL与基片P之间的曝光装置，但也可将本发明适用于用液体覆盖曝光对象的基片的全部表面的液浸曝光装置。用液体覆盖曝光对象的基片的全部表面的液浸曝光装置的结构和曝光工作，例如在特开平6-124873号公报、特开平10-303114号公报、美国专利第5,825,043号中详细地记载了，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。In addition, in the above-mentioned embodiment, the exposure apparatus in which the space between the projection optical system PL and the substrate P is partially filled with the liquid is used, but the present invention can also be applied to the one in which the entire surface of the substrate to be exposed is covered with the liquid. Liquid immersion exposure device. The structure and exposure operation of a liquid immersion exposure apparatus that covers the entire surface of a substrate to be exposed with a liquid are described in detail in, for example, JP-A-6-124873, JP-A-10-303114, and U.S. Patent No. 5,825,043 , as long as it is permitted by the laws and regulations of the countries designated or selected in this international application, the contents described in these documents are cited as part of the description herein.

作为曝光装置EX的种类，不限于在基片P上曝光半导体元件图案的制造半导体元件用的曝光装置，也可广泛地适用于液晶显示元件制造用或显示器制造用的曝光装置或用于制造薄膜磁头、摄像元件(CCD)或中间掩模或掩模等的曝光装置等。The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing semiconductor elements for exposing a pattern of semiconductor elements on a substrate P, but can be widely applied to exposure apparatuses for liquid crystal display element manufacturing or display manufacturing, or for manufacturing thin films. Exposure devices such as a magnetic head, an imaging device (CCD), a reticle, or a mask, etc.

在基片台PST(晶片台609)或掩模台MST中使用直线电机的情况下，可使用采用了空气轴承的空气上浮型和采用了洛仑兹力或电抗力的磁浮型的任一种。此外，关于各台PST(609)、MST，可以是沿导轨移动的类型，也可以是不设置导轨的无导轨的类型。在台中使用了直线电机的例子，在美国专利5,623,853和5,528,118中公开了，只要在本国际申请中指定或选择的国的法令中容许，分别引用这些文献的记载内容，作为本文的记载的一部分。When using a linear motor for the substrate stage PST (wafer stage 609) or mask stage MST, either the air-floating type using air bearings or the magnetic levitation type using Lorentz force or reactive force can be used . In addition, each PST (609) and MST may be a type that moves along a guide rail, or may be a guide-less type that does not provide a guide rail. Examples of linear motors used in Taichung are disclosed in U.S. Patent Nos. 5,623,853 and 5,528,118. As long as they are permitted by the laws and regulations of countries designated or selected in this international application, the contents of these documents are cited as part of the description herein.

作为各台PST(609)、MST的驱动机构，可使用以二维方式配置了磁铁的磁铁单元、利用与以二维方式配置了线圈的电枢单元对置的电磁力来驱动台PST(609)、MST的平面电机。在该情况下，将磁铁单元和电枢单元的某一方连接到台PST(609)、MST上、在台PST(609)、MST的移动面一侧设置磁铁单元和电枢单元的另一方即可。As the driving mechanism of each PST (609) and MST, a magnet unit in which magnets are two-dimensionally arranged, and an electromagnetic force facing an armature unit in which coils are two-dimensionally arranged can be used to drive the stage PST (609 ), MST planar motor. In this case, one of the magnet unit and the armature unit is connected to the table PST (609), MST, and the other of the magnet unit and the armature unit is provided on the moving surface side of the table PST (609), MST. Can.

可使用框构件以机械的方式将因基片台PST(609)的移动而发生的反力散逸到地面(大地)，以免传递给投影光学系统PL。例如在美国专利5,528,118(特开平8-166475号公报)中详细地公开了该反力的处理方法，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。A frame member can be used to mechanically dissipate the reaction force generated by the movement of the substrate stage PST (609) to the ground (earth) so as not to be transmitted to the projection optical system PL. For example, U.S. Patent No. 5,528,118 (Japanese Unexamined Patent Application Publication No. Hei 8-166475) discloses the processing method of this reaction force in detail, as long as it is allowed in the laws and regulations of the country designated or selected in this international application, the contents of these documents are cited as part of the record of this article.

也可使用框构件以机械的方式将因掩模台MST的移动而发生的反力散逸到地面(大地)，以免传递给投影光学系统PL。例如在美国专利5,874,820(特开平8-330224号公报)中详细地公开了该反力的处理方法，只要在本国际申请中指定或选择的国的法令中容许，引用这些文献的记载内容，作为本文的记载的一部分。A frame member may also be used to mechanically dissipate the reaction force generated by the movement of mask stage MST to the ground (earth) so as not to be transmitted to projection optical system PL. For example, U.S. Patent No. 5,874,820 (Japanese Unexamined Patent Publication No. 8-330224) discloses the processing method of the reaction force in detail, as long as it is allowed in the laws and regulations of the country designated or selected in this international application, the contents of these documents are cited as part of the record of this article.

如上所述，通过组装包含在本申请的权利要求的范围内举出的各构成要素的各种子系统来制造本申请的实施形态的曝光装置EX，以便保证规定的机械的精度、电的精度、光学的精度。为了确保这些各种精度，在该组装的前后，关于各种光学系统进行用于达到光学的精度的调整、关于各种机械系统进行用于达到机械的精度的调整、关于各种电的系统进行用于达到电的精度的调整。从各种子系统到曝光装置的组装工序包含各种子系统相互的机械的连接、电路的布线连接、气压管路的管线连接等。在从该各种子系统到曝光装置的组装工序之前，当然有各子系统各自的组装工序。若各种子系统到曝光装置的组装工序结束后，进行综合调整，以确保作为曝光装置整体的各种精度。再有，希望在温度和清洁度得到管理的清洁室中进行曝光装置的制造。As described above, the exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems including the constituent elements listed in the scope of the claims of the present application so as to ensure predetermined mechanical precision and electrical precision. , Optical precision. In order to ensure these various precisions, before and after the assembly, various optical systems are adjusted to achieve optical precision, various mechanical systems are adjusted to achieve mechanical precision, and various electrical systems are adjusted. Used to achieve electrical precision adjustments. The assembly process from various subsystems to the exposure device includes the mechanical connection of various subsystems, the wiring connection of the circuit, the pipeline connection of the pneumatic pipeline, and the like. Before the assembly process from these various subsystems to the exposure apparatus, there are, of course, individual assembly processes for each subsystem. After the assembly process of various subsystems to the exposure device is completed, comprehensive adjustments are performed to ensure various precisions of the exposure device as a whole. Furthermore, it is desirable to perform exposure apparatus fabrication in a clean room in which temperature and cleanliness are managed.

如图17中所示，经过进行微器件的功能、性能设计的步骤201、制作基于该设计步骤的掩模(中间掩模)的步骤202、制造作为器件的基体材料的基片的步骤203、利用上述的实施形态的曝光装置EX在基片上曝光掩模的图案的曝光处理步骤204、器件组装步骤(包含划片工序、键合工序、封装工序)205和检查步骤206等来制造半导体器件等的微器件。As shown in Figure 17, through the step 201 of performing the function and performance design of the micro-device, the step 202 of making a mask (reticle) based on the design step, the step 203 of manufacturing the substrate as the base material of the device, Semiconductor devices, etc. are manufactured by using the exposure apparatus EX of the above-mentioned embodiment to expose the pattern of the mask on the substrate in the exposure processing step 204, device assembly step (including dicing step, bonding step, and packaging step) 205, and inspection step 206. of micro devices.

产业上利用的可能性Possibility of industrial use

按照本发明的曝光装置，由于可抑制液体的流出来进行曝光处理，可防止液体的残留，故能以高的曝光精度来进行液浸曝光。According to the exposure apparatus of the present invention, since the outflow of liquid can be suppressed for exposure processing, and the residue of liquid can be prevented, so that liquid immersion exposure can be performed with high exposure accuracy.

按照本发明的光学部件，由形成粘接微粒子层的二氧化硅(SiO₂)、氟化镁(MgF₂)和氟化钙(CaF₂)中的至少一种构成的微粒子层可得到与基体材料的玻璃(主要成分SiO₂)的亲和性良好、与基体材料玻璃恰好的密接性。此外，在表面上产生来源于粒子的直径的凹凸。再者，由于二氧化硅等是紫外线透射率非常高的材料，故其本身的激光照射耐久性也高。因而，在形成了由二氧化硅(SiO₂)、氟化镁(MgF₂)和氟化钙(CaF₂)中的至少一种构成的微粒子层后形成由非晶质氟树脂构成的疏水性膜。以非晶质氟树脂进入二氧化硅等的微粒子的空隙中而将其包围的方式干燥、固化。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。因此，可适用于与液体相接的广泛的环境中使用的光学部件或光学传感器。According to the optical part of the present invention, the fine particle layer composed of at least one of silicon dioxide (SiO₂ ), magnesium fluoride (MgF₂ ) and calcium fluoride (CaF₂ ) forming the bonding fine particle layer can be obtained in contact with the substrate. The material glass (main component SiO₂ ) has good affinity and good adhesion to the base material glass. In addition, irregularities derived from the diameter of the particles are generated on the surface. Furthermore, since silicon dioxide and the like are materials with very high ultraviolet transmittance, their durability against laser irradiation is also high. Therefore, after forming a fine particle layer composed of at least one of silicon dioxide (SiO₂ ), magnesium fluoride (MgF₂ ) and calcium fluoride (CaF₂ ), a hydrophobic layer composed of amorphous fluororesin is formed. membrane. The amorphous fluororesin is dried and cured so that it enters the voids of fine particles such as silica and surrounds them. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high. Therefore, it is applicable to optical components and optical sensors used in a wide range of environments in contact with liquids.

此外，按照本发明的光学部件，由于在光照射面上具有由利用氟化氢刻蚀的刻蚀面构成的粘接面，故如果在粘接面上形成由非晶质氟树脂构成的疏水性膜，则以非晶质氟树脂进入粘接面的空隙中而将其包围的方式干燥、固化。由于非晶质氟树脂本身的机械的强度高，故与基体材料密接的疏水性膜的强度高。因此，可适用于与液体相接的广泛的环境中使用的光学部件或光学传感器。In addition, according to the optical component of the present invention, since the light-irradiating surface has an adhesive surface composed of an etched surface etched with hydrogen fluoride, if a hydrophobic film composed of an amorphous fluororesin is formed on the adhesive surface, , the amorphous fluororesin is dried and cured in such a way that the amorphous fluororesin enters and surrounds the voids on the bonding surface. Since the mechanical strength of the amorphous fluororesin itself is high, the strength of the hydrophobic film in close contact with the base material is high. Therefore, it is applicable to optical components and optical sensors used in a wide range of environments in contact with liquids.

此外，按照本发明的投影曝光装置，由于在基片台上安装了能在长时间内维持光照射面的疏水性的光学部件，故即使在重复进行液浸曝光的情况下，也能可靠地进行光学部件的光照射面上的排水。In addition, according to the projection exposure apparatus of the present invention, since the optical member capable of maintaining the hydrophobicity of the light-irradiated surface for a long period of time is mounted on the substrate stage, even in the case of repeated liquid immersion exposure, it can reliably Perform drainage on the light-irradiated surface of the optical component.

Claims (36)

1. One kind through liquid to substrate irradiation exposure light with exposure device to the substrate exposure, it is characterized in that:

   Possess:

   The picture of pattern is projected in on-chip projection optical system; And

   Face the chip bench that is used to keep substrate of the image planes setting of above-mentioned projection optical system, this chip bench has the substrate holder,

   Be maintained at the mode of the above-mentioned substrate in the above-mentioned substrate holder and be arranged on member on the chip bench in removable mode with encirclement, at least a portion on the surface of this member is lyophobicity.
2. 2. the exposure device described in claim 1 is characterized in that:

   Have according to deterioration with its lyophobicity the exposure sheet number of the above-mentioned substrate of corresponding relation, above-mentioned member service time and the exposure light exposure at least one change above-mentioned member.
3. 3. the exposure device described in claim 1 is characterized in that:

   Above-mentioned member has its surface and is the par with one side with the substrate surface that is kept by above-mentioned chip bench.
4. 4. the exposure device described in claim 3 is characterized in that:

   Around above-mentioned substrate, disposed above-mentioned par.
5. 5. the exposure device described in claim 4 is characterized in that:

   Possesses the charging crane that is used for above-mentioned chip bench is loaded and unloaded above-mentioned member.
6. 6. the exposure device described in claim 5 is characterized in that:

   Above-mentioned charging crane can take off with above-mentioned substrate above-mentioned member from above-mentioned chip bench.
7. 7. the exposure device described in claim 1 is characterized in that:

   Its lyophobicity part at least of above-mentioned member is formed by teflon.
8. 8. device making method is characterized in that:

   Use the exposure device described in the claim 1 to expose,

   Device is assembled.
9. 9. one kind shines exposure light above-mentioned substrate is carried out the exposure method of immersion exposure through projection optical system and liquid on substrate, it is characterized in that:

   Keep above-mentioned substrate with the substrate retaining member,

   Above-mentioned substrate retaining member has its surface and is the par with one side with this substrate surface around above-mentioned substrate,

   To keep the above-mentioned substrate retaining member of above-mentioned substrate to be transported on the chip bench,

   The above-mentioned substrate that is transported on the above-mentioned chip bench is carried out immersion exposure,

   After above-mentioned immersion exposure finishes, transport the above-mentioned substrate retaining member that keeps above-mentioned substrate from above-mentioned chip bench,

   Wherein, the surface of the par of above-mentioned substrate retaining member is lyophobicity.
10. 10. device making method is characterized in that:

    Use the exposure method described in the claim 9 to expose,

    Device is assembled.
11. 11. one kind through liquid to substrate irradiation exposure light with exposure device to the substrate exposure, it is characterized in that:

    Possess:

    The picture of pattern is projected in on-chip projection optical system; And

    The transfer table that can move relative to projection optical system,

    Be arranged on the lyophobicity member on the above-mentioned transfer table, its have by moving and with above-mentioned projection optical system facing surfaces, at least a portion on above-mentioned surface is lyophobicity, and is formed with liquid soaks the zone between above-mentioned projection optical system and above-mentioned surface,

    Wherein, this lyophobicity member is removable.
12. 12. the exposure device described in claim 11 is characterized in that:

    Transfer table has the chip bench of maintenance substrate and at least one of monitor station.
13. 13. the exposure device described in claim 11 is characterized in that:

    Transfer table has a plurality of.
14. 14. the exposure device described in claim 11 is characterized in that:

    Have according to deterioration with its lyophobicity the exposure sheet number of the above-mentioned substrate of corresponding relation, above-mentioned lyophobicity member service time and the exposure light exposure at least one change above-mentioned lyophobicity member.
15. 15. the exposure device described in claim 11 is characterized in that:

    Transfer table is the chip bench that keeps substrate, and above-mentioned chip bench possesses the maintaining part that keeps above-mentioned member and the adsorbent equipment of above-mentioned member is installed in mode removably on above-mentioned maintaining part.
16. 16. the exposure device described in claim 15 is characterized in that:

    Above-mentioned lyophobicity member is to have and the back side of substrate opposed the 1st and the 2nd step-like member extending in the substrate outside along the surface of substrate.
17. 17. the exposure device described in claim 16 is characterized in that:

    At least the 2 mask has lyophobicity.
18. 18. the exposure device described in claim 16 is characterized in that:

    Also possess the 3rd of extending in the above-mentioned lyophobicity member outside along the surface of substrate and with the chimeric outer member of above-mentioned lyophobicity member, at least the 3 face is lyophobicity.
19. 19. the exposure device described in claim 16 is characterized in that:

    Also possesses the jacking gear that makes the above-mentioned relatively maintaining part lifting of above-mentioned lyophobicity member.
20. 20. the exposure device described in claim 19 is characterized in that:

    Above-mentioned jacking gear makes above-mentioned lyophobicity member rise from above-mentioned maintaining part under the state of above-mentioned lyophobicity member supports substrate.
21. 21. the exposure device described in claim 15 is characterized in that:

    Above-mentioned lyophobicity member be have supporting substrate the back side edge part support portion, the tabular surface that extends in the substrate outside along the surface of substrate and be connected with tabular surface and the substrate holder of the sidewall higher than tabular surface.
22. 22. the exposure device described in claim 21 is characterized in that:

    Also possess the chip bench of placing the substrate holder, substrate holder and chip bench have the stream that interconnects respectively.
23. 23. the exposure device described in claim 11 is characterized in that:

    The part that is lyophobicity of above-mentioned member is formed by fluoride.
24. 24. the exposure device described in claim 11 is characterized in that:

    The member of above-mentioned lyophobicity comprises at least a portion of reference feature and optical sensor.
25. 25. the exposure device described in claim 24 is characterized in that:

    The photoirradiated surface of at least a portion of reference feature and optical sensor is lyophobicity.
26. 26. the exposure device described in claim 11 is characterized in that:

    Substrate is the circular substrate that does not have breach, applies photosensitive material on the surface of substrate and sidepiece.
27. 27. the exposure device described in claim 11 is characterized in that:

    Decide the replacing period of above-mentioned member according to the decline of the contact angle of the aforesaid liquid in the lyophobicity of the above-mentioned member part.
28. 28. the exposure device described in claim 27 is characterized in that:

    Under dropping to smaller or equal to 100 ° situation, above-mentioned contact angle changes above-mentioned member.
29. 29. the exposure device described in claim 27 is characterized in that:

    Having descended more than or equal to 10 ° situation from original state under, above-mentioned contact angle changes above-mentioned member.
30. 30. the exposure device described in claim 11 is characterized in that:

    Above-mentioned transfer table comprises the chip bench that keeps above-mentioned substrate, and above-mentioned member forms tabular surface around the substrate that is kept by above-mentioned chip bench.
31. 31. the exposure device described in claim 30 is characterized in that:

    The surface of the substrate that is kept by above-mentioned chip bench be simultaneously same with the tabular surface around it.
32. 32. the exposure device described in claim 11 is characterized in that:

    Above-mentioned transfer table has and is used to adsorb the adsorbent equipment that keeps above-mentioned member.
33. 33. the exposure device described in claim 11 is characterized in that:

    The material that can descend because of the irradiation of ultraviolet light with its performance forms the lyophobicity part of above-mentioned member.
34. 34. one kind through liquid to substrate irradiation exposure light above-mentioned substrate is carried out the exposure method of immersion exposure, it is characterized in that, comprise following step:

    On-chip at least a portion is supplied with aforesaid liquid;

    Irradiation exposes light so that above-mentioned substrate is carried out immersion exposure to substrate through aforesaid liquid; And

    The part of the exposure device except that the substrate that has been supplied to liquid has lyophobicity, have according to deterioration with its lyophobicity the exposure sheet number of the above-mentioned substrate of corresponding relation, above-mentioned lyophobicity part service time and the exposure light exposure at least one change above-mentioned part with exposure device of lyophobicity.
35. 35. the exposure method described in claim 34 is characterized in that:

    The part of above-mentioned exposure device is the part of the chip bench that has of above-mentioned exposure device or the part of monitor station, and the part of chip bench or the part of monitor station are at least a portion that the formation liquid of aforesaid liquid soaks the part in zone.
36. 36. the exposure method described in claim 35 is characterized in that:

    Change the part of above-mentioned chip bench with substrate.

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