CN1787243A - LED device and packing method thereof - Google Patents

Abstract

Translated fromChinese

本发明公开了一种LED器件封装方法，将LED管芯用充有封装液的透光壳体密封起来，并将其导电端用电极从壳体内引出，所述封装液是具有大电阻率的透光液体，其电阻率远大于LED管芯的导通电阻率。本发明并提供采用上述封装方法的LED器件。本发明的优点在于：突破性地采用液态封装技术来取代常规的全固体结构，使得LED管芯的散热可通过电极传导和封装液对流的双重方式来进行，为大功率LED封装开辟出了一条崭新的发展道路。

The invention discloses a LED device packaging method. The LED tube core is sealed with a light-transmitting shell filled with encapsulation liquid, and its conductive end is led out from the shell with an electrode. The encapsulation liquid has a large resistivity The light-transmitting liquid has a resistivity much larger than the conduction resistivity of the LED tube core. The invention also provides an LED device using the above packaging method. The advantage of the present invention is that: a breakthrough adopts liquid packaging technology to replace the conventional all-solid structure, so that the heat dissipation of the LED tube core can be carried out through the dual methods of electrode conduction and packaging liquid convection, opening up a new path for high-power LED packaging. A new development path.

Description

LED device and method for packing thereof

[technical field]

The present invention relates to the LED encapsulation technology, specifically relate to a kind of LED device and method for packing thereof.

[background technology]

Since Edison's invention electric light in 1879, the creation of this greatness has been brought the mankind into and has been full of the bright and unlimited possible new century, and the appearance of artificial light sources is known as the initial milestone of modern civilization society by International Technology circle.From having only the carbon filament electric light in 8 hour life-span the earliest, the fluorescent lamp that excites to incandescent tungsten lamp, high-pressure fluorescence, the high-pressure sodium lamp that utilizes the atomic spectral line transition luminescence, mercury vapor lamp, spiral energy-saving lamp etc., the lighting based on various principle of luminosity is an A wide selection of colours and designs, of all shapes and colors now.Yet the long-life of lighting, high light quantity and low energy consumption are the research direction of people's unremitting effort forever.

The appearance that integrates the LED (Light-emitting diode light-emitting diode) of various advantages, the arrival that is declaring publicly new solid light source epoch undoubtedly.LED is a kind of semiconductor that electric energy can be converted into visible light, it changed the incandescent lamp tungsten filament luminous with the luminous principle of electricity-saving lamp tricolor powder, and adopt electroluminescence, have long, numerous advantages such as light efficiency is high, radiationless and low-power consumption of life-span.The spectrum of LED almost all concentrates on visible light frequency band, and luminous efficiency can reach 80～90%; Light quality height, essentially no radiation belongs to typical green illumination light source; Life-span, near some 1,000,000 hours, reliability and durability, maintenance cost was very cheap especially.

From the birth of the commercial LED of nineteen sixty-five first item germanium material so far, short four during the decade, and the LED technology has experienced evolution at full speed under powerful application demand promotes, almost can cover whole visible light wave ranges now and be active in various applications.Round the research and development that LED carries out, mainly comprise the content of two aspects:

The one, the design of LED current supply circuit, because early stage LED tube core costs an arm and a leg, therefore for providing stable and pure electric current, it seems very important, from simple current-limiting resistance, transformer, rectifier to first and then complicated Switching Power Supply, it is quite abundant that the work of this respect has been carried out, and can select according to the requirement of effect and cost.In extensive illumination application, the present inventor provides solution preferably in the Chinese patent application (application number is 200410040265.0 and 200420061456.0) that proposes before this.

The one, the lifting of LED device self performance, research about this respect concentrates on two big directions, the innovation of first LED luminescent material, research in this respect is quite arduous but also is the most basic and most important, and it is as if endless, up to now, the big each time leap in the LED field there's no one who doesn't or isn't derives from the initiative and the application of new material.The red-light LED of early stage germanium material and GaAsP material, every watt of luminous flux that 0.1 lumen (lumens) approximately can only be provided; After this, utilize the nitrogen doping process to make the efficient of GaAsP device reach 1 lumens/watt, and can send ruddiness, orange light and sodium yellow,, produced the green nude film LED of the GaP with same efficiency by 1971; And the AlGaAs material LED that the eighties, early development went out can send ruddiness with the luminous efficiency of every watt 10 lumen.Now, the new material of 100 lumens/watt also is born in the laboratory, and the abundant expansion for its application of LED material on raising on the light efficiency and color provides the basis of essence and guaranteed.Other direction is the perfect of LED encapsulation technology, the package design of LED is from simple 2 leaded packages such as early stage column type, pyramid type, straw hat types, experienced very great development to the structures such as Piranha type, PLCC type that are adapted to gradually than the great power LED tube core.Exploitation along with the novel large-power LED chip, its requirement to corresponding encapsulation technology also improves constantly, and the encapsulation technology of LED has shown increasing role and influence to the final illumination effect that shows of LED product, that is to say, adopt same LED tube core and carry out the encapsulation of different structure form, the illumination effect possibility gap that obtains at last is very far away.Bringing into play the luminous power of LED tube core to greatest extent and reducing heat accumulation as much as possible is the unremitting pursuit of package designer all the time.LED from the development at the beginning of till now, continue to use the solid support encapsulation technology always, originally be that simple substrate, spun gold add pin and shell, afterwards along with the rising of power and the continuous increase of caloric value, begin to add various accessory structures, for example be positioned at the heat sink of chip below, and the outside heat sink that extends out from pin etc., number of pins also is increased to three, four even a plurality of from two.Owing to bearing multiple important tasks such as conduction, heat radiation, support structure, the material of making led support has been proposed higher requirement, this inevitably means difficulty in the manufacturing and the lifting on the cost, the almost whole dependence on import of the present led support steel of China can't but be the restriction greatly to industry development.And existing encapsulating structure makes the heat radiation of LED tube core fully based on heat exchange pattern, make the improvement on the effect that structural change brought in this little space of support seem very limited, these difficulties have become obstacle and the bottleneck that encapsulation technology further develops.Though existing state-of-the-art support encapsulating structure can also be competent at the heat radiation work of the following chip of 40 lumens/watt left and right sides 300mW preferably, but along with the more continuous research and development of high-power chip, and needs extensive, intensive, the development of high strength indoor and outdoor lighting, the requirement of internal breakthrough and innovation certainly will be proposed the conventional package technology.

[summary of the invention]

The objective of the invention is to break through the routine of the solid-state encapsulation technology of existing LED, provide a kind of brand-new, can effectively solve the LED device and the method for packing thereof of LED heat dissipation problem.

To achieve these goals, the technical solution used in the present invention is: a kind of LED device package method, the LED tube core is used the printing opacity housing seal that is filled with encapsulation liquid, and its conducting end drawn in housing with electrode, described encapsulation liquid is the light-transmissive fluid with big resistivity, and its resistivity is much larger than the conducting resistance rate of LED tube core.

And a kind of LED device comprises LED tube core, electrode, printing opacity housing and encapsulation liquid, the conducting end of described LED tube core is connected with electrode, described printing opacity housing is with LED tube core and encapsulation liquid enclosed package, and described electrode passes housing, the LED tube core can be inserted in the external circuit.Described encapsulation liquid is the light-transmissive fluid with big resistivity, and its resistivity is much larger than the conducting resistance rate of LED tube core.

Preferably, described LED tube core is " one " font, and described electrode stretches out from the two ends of described printing opacity housing respectively.

Preferably, described LED tube core is " U " font, and described electrode stretches out from the same end of described printing opacity housing.

Preferably, the interior or outer surface of described printing opacity housing has to contain in fluorescent component or its housing in fluorescent material layer or its case material and has the fluorescent material interlayer.

Preferably, in the part of described printing opacity housing or outer surface have in reflective material layer or its partial shell and have the reflectorized material interlayer.

Preferably, described encapsulation liquid is full of the confined space in the printing opacity housing.

Preferably, described printing opacity housing whole clearing.

Further preferably, described printing opacity housing is spherical, elliposoidal or cylindricality.

Adopt technique scheme, beneficial technical effects of the present invention is: 1) adopt liquid encapsulation technology to replace conventional total solids structure breakthroughly, make the heat radiation of LED tube core to be undertaken, for high-power LED encapsulation has hewed out a brand-new road for development by the dual mode of electrode conduction and the convection current of encapsulation liquid.And because the LED tube core is arranged in encapsulation liquid, no longer need conventional solid bottom support, the a large amount of light that blocked by opaque bottom when making conventional package can emit fully, become spherical wave truly, therefore same LED material is under the situation of same power consumption, and luminous efficiency can improve almost one times! This also makes the heat of the phototransformation be blocked in the past not exist, and has alleviated the difficulty of LED heat radiation greatly.2) adopt difform tube core to carry out multi-form being packaged with and be beneficial to the different applied environment of adaptation, " one " font design place that can be used for replacing conventional linear fluorescent tube and need tandem array to install for example, the design of " U " font then can be used for direct insertion application.3) fluorescence coating is set or in material, carries out the fluorescent material interpolation at surface of shell, can adjust and change the final illumination wavelengths scope of LED device, realize purpose such as white-light illuminating.4) in the housing or the reflector layer on surface can the required angle of selectable enhancing or the illumination intensity of direction, light is focused in the desired zone.5) encapsulation liquid is full of housing and can improves support strength and make bright dipping even, but for some special purpose (for example reaching the light effect that of change), also can reserve the space of partial vacuum or gas, but can not be too much, in order to avoid the influence heat radiation.6) adopt the housing of whole clearing effectively to reduce to absorb and the light decay that causes is repeatedly reflected at the interface, further reduce heat waste and improve light efficiency.7) adopt difform housing can make the light that sends have various wavefront shape, for example, spherical lamp housing can obtain the even spherical wave of launching around the court, and the light-ray condensing that sends from the spheroid shape lamp housing is the zone around the ellipsoid major axis (what can be similar to is idealized as point-source of light analysis with the LED tube core), the light area has stronger directivity, and this shape is particularly conducive to as the navigation mark indicator light.

The present invention is described in further detail below in conjunction with the drawings and specific embodiments:

[description of drawings]

Fig. 1 is the structural representation that LED device of the present invention adopts " one " font tube core.

Fig. 2 is the structural representation that LED device of the present invention adopts " U " font tube core.

Fig. 3 is the field of illumination schematic diagram of the bright housing of elliposoidal full impregnated.

[embodiment]

The invention provides a kind of LED device and method for packing thereof with liquid encapsulating structure.The basic structure of described LED device comprises LED tube core, electrode, printing opacity housing and encapsulation liquid.The conducting end of described LED tube core is connected with electrode, described printing opacity housing is with LED tube core and encapsulation liquid enclosed package, described electrode passes housing, the LED tube core can be inserted in the external circuit, described encapsulation liquid is the light-transmissive fluid with big resistivity, and its resistivity is much larger than the conducting resistance rate of LED tube core.

LED tube core among the present invention can adopt existing those materials and structure, can be that an independent tube core also can be the combination of a plurality of tube cores, for example a plurality of homochromy the or heterochromatic tube core that connects with modes such as series and parallels in an encapsulating structure.By the integrated tube core structure that the present inventor describes in the Chinese patent application (application number is 200420105410.4 and 200510020492.1) that proposes before this, be a kind of particularly preferred mode.The luminescent wafer of LED tube core need be grown on the backing material in the prior art, and to consistent in the requirement of backing material and the prior art, promptly the good light decay of light transmission is little in the present invention.In case along with the development of technology and technology makes that LED can substrate and independent the generation then can highlight more and use superiority of the present invention.Tube core can have various concrete shapes, particularly high-power tube core, its shape mostly is its performance service, the external shape that but generally speaking can have rule, for example, " one " font tube core A shown in Fig. 1 and Fig. 2 and " U " font tube core B, they make electrode C stretch out from two ends or the same end of housing D respectively, applicable to different application scenarios.

Based on simple structure of the present invention and space structure characteristics, the extraction electrode of tube core conducting end can occupy bigger spatial volume, for example has flat planar structure, can there be enough areas fully to contact with encapsulation liquid, therefore can give full play of the heat-conductivity conducting performance, its material also thereby needn't select expensive spun gold for use can adopt materials such as cheap copper, aluminium.As long as electrode material has favorable conductive and thermal conduction characteristic, the heat that LED can be sent conducts seal casinghousing effectively, is exactly good selection.

The use of encapsulation liquid is that core of the present invention is created the some place, but also uncomplicated to its requirement, as long as it is just passable to reach the purpose of heat loss through convection, printing opacity.For avoiding that die circuitry is caused interference, its should have much larger than the tube core conducting time resistivity, and for guaranteeing the long-life and the reliability of LED device, selected encapsulation liquid preferably has comparatively stable physicochemical properties.But highly purified water will be an inexpensive and well behaved alternative.Whether can change luminous wave-length coverage of tube core etc. then not at the row of consideration as for institute's topping up body, but this direction being considered when can be used as Application Design.Encapsulation liquid can select to be full of the confined space in the whole housing, consider that from support strength and emitting uniform angle this should be the way of comparatively conventional and standard, but also can stay the space of partial vacuum or gas and so on, to adapt to the occasion that some has special requirement, for example in order to reach the artistic effect of light change.

The selection of outer enclosure housing can be diversified, and its basic demand is a printing opacity, preferably selects the little material of light decay certainly.Can carry out the abundant design of form to housing according to the needs of using, for example fluorescent material layer is set or in its material, adds fluorescent component or the fluorescent material interlayer is set in its housing by interior or outer surface at the printing opacity housing, reach the purpose that changes final emergent ray wave-length coverage, adopt the collocation of suitable LED tube core and fluorescent material can obtain good white-light illuminating effect; Again for example by in the part of printing opacity housing or outer surface reflective material layer is set or the reflectorized material interlayer is set in its partial shell, reach the purpose of directed bright dipping, with the size of controlled target field of illumination.Can realize difform wavefront output by designing different hull shape in addition, for example adopt the bright housing of spherical full impregnated can imitate the sphere illumination effect of conventional bulb; Adopt cylindricality, the bright housing of particularly cylindrical full impregnated then can imitate for example illumination effect of fluorescent lamp of traditional linear light fixture; Adopt the bright housing of elliposoidal full impregnated then can obtain stronger " crusty pancake cheese " field of illumination of directivity, as shown in Figure 3, this shape is particularly conducive to as the navigation mark indicator light.

Enforcement of the present invention and application will cause a revolution in LED field, be that brand-new chapter is opened in the development of high-power high integration LED device.

Claims (10)

Translated fromChinese

1、一种LED器件封装方法，其特征在于：将LED管芯用充有封装液的透光壳体密封起来，并将其导电端用电极从壳体内引出，所述封装液是具有大电阻率的透光液体，其电阻率远大于LED管芯的导通电阻率。1. A LED device packaging method, characterized in that: the LED tube core is sealed with a light-transmitting housing filled with packaging liquid, and its conductive end is drawn out from the housing with an electrode. The packaging liquid has a large resistance High-efficiency light-transmitting liquid, its resistivity is much greater than the conduction resistivity of the LED tube core.2、一种LED器件，包括LED管芯、电极和透光壳体，所述LED管芯的导电端与电极相连接，其特征是：还包括封装液，所述透光壳体将LED管芯和封装液密闭封装，所述电极穿过壳体，能够将LED管芯接入外电路中，所述封装液是具有大电阻率的透光液体，其电阻率远大于LED管芯的导通电阻率。2. An LED device, comprising an LED tube core, an electrode and a light-transmitting housing, the conductive end of the LED tube core is connected to the electrode, and it is characterized in that: it also includes a packaging liquid, and the light-transmitting housing connects the LED tube The core and the packaging liquid are sealed and packaged. The electrodes pass through the shell and can connect the LED die core to the external circuit. On-resistivity.3、根据权利要求2所述的LED器件，其特征在于：所述LED管芯为“一”字型，所述电极分别从所述透光壳体的两端伸出。3. The LED device according to claim 2, wherein the LED die is in the shape of a "one", and the electrodes protrude from both ends of the transparent casing.4、根据权利要求2所述的LED器件，其特征在于：所述LED管芯为“U”字型，所述电极从所述透光壳体的同一端伸出。4. The LED device according to claim 2, wherein the LED die is in a "U" shape, and the electrodes protrude from the same end of the transparent casing.5、根据权利要求2所述的LED器件，其特征在于：所述透光壳体的内或外表面具有荧光材料层或者其壳体材料中含有荧光成分或者其壳体中具有荧光材料夹层。5. The LED device according to claim 2, characterized in that: the inner or outer surface of the light-transmitting housing has a fluorescent material layer or the housing material contains fluorescent components or has a fluorescent material interlayer in the housing.6、根据权利要求2所述的LED器件，其特征在于：所述透光壳体的部分内或外表面具有反光材料层或者其部分壳体中具有反光材料夹层。6. The LED device according to claim 2, characterized in that: a part of the inner or outer surface of the light-transmitting housing has a reflective material layer or a part of the housing has a reflective material interlayer.7、根据权利要求2～6任意一项所述的LED器件，其特征在于：所述封装液充满透光壳体中的密闭空间。7. The LED device according to any one of claims 2-6, characterized in that the sealing liquid fills the sealed space in the light-transmitting casing.8、根据权利要求2～6任意一项所述的LED器件，其特征在于：所述透光壳体整体透明。8. The LED device according to any one of claims 2-6, characterized in that: the light-transmitting shell is transparent as a whole.9、根据权利要求7所述的LED器件，其特征在于：所述透光壳体整体透明。9. The LED device according to claim 7, characterized in that: the transparent shell is transparent as a whole.10、根据权利要求8所述的LED器件，其特征在于：所述透光壳体为球形、椭球形或柱形。10. The LED device according to claim 8, wherein the light-transmitting housing is spherical, ellipsoidal or cylindrical.

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