CN1759644A - Electronic component mounting apparatus - Google Patents

Abstract

The invention is to prevent the imaging position deviation of the component caused by the imaging device (9), the image distortion caused by the distortion of the reflector (8), and detect the position deviation of the electronic component relative to the head (6) with high precision, which comprises a printed circuit board conveying device (4) for conveying the printed circuit board (2), the head (6) for mounting the electronic component (1) relative to the printed circuit board (2), a mark (7) arranged on the head (6) and moving together with the head (6), the reflector (8) for obtaining the mirror image of the mark (7) and the mirror image of the electronic component, the imaging device (9) for obtaining the image of the mark (7) and the electronic component, and the imaging error related to the position of the head (6) is corrected by detecting the positions of the electronic component (1) and the mark (7) through the image of the imaging device (9), and a detection device (19) for detecting a positional deviation of the electronic component (1) with respect to the head (6).

Description

Translated fromChinese

电子元件安装装置Electronic component mounting device

技术领域technical field

本发明涉及一种在印刷电路板上安装电子元件的电子元件安装装置。The invention relates to an electronic component mounting device for mounting electronic components on a printed circuit board.

背景技术Background technique

作为在印刷电路板上安装电子元件的电子元件安装装置，已知的一般包括，搬送印刷电路板的印刷电路板搬送装置，在保持电子元件并移动的同时相对于上述印刷电路板安装该电子元件的头部，和设置在电子元件安装装置基座上的指定位置的元件识别用照相机，在吸附元件后通过元件识别用照相机摄像，进行元件识别，在检测出吸附位置偏差的同时修正安装位置，并将元件安装到该修正后的位置上。As an electronic component mounting device for mounting an electronic component on a printed circuit board, there is generally known a printed circuit board transport device that transports a printed circuit board, and mounts the electronic component with respect to the above-mentioned printed circuit board while holding and moving the electronic component. The head, and the component recognition camera installed at the specified position on the base of the electronic component mounting device, after absorbing the component, the component recognition camera takes an image to perform component recognition, and correct the mounting position while detecting the deviation of the adsorption position. And install the component to the corrected position.

在这种电子元件安装装置中，由于吸附了元件的头部暂时移至照相机的上方并进行元件的摄像，然后再移往安装位置，所以头部的移动距离变长。因此，可考虑在元件供给部和印刷电路板设置位置之间配备有较长尺寸的反射镜，同时在头部一侧设置照相机，使头部从元件供给部向印刷电路板进行直线移动的过程中从反射镜上方经过，此时使用照相机拍摄反射镜中映射的元件。In such an electronic component mounting apparatus, since the head that has attracted the component is temporarily moved above the camera to image the component, and then moved to the mounting position, the moving distance of the head becomes long. Therefore, it can be considered that a longer mirror is installed between the component supply part and the printed circuit board installation position, and a camera is installed on the head side, and the head is linearly moved from the component supply part to the printed circuit board. pass over the mirror while the camera is used to capture the component mapped in the mirror.

例如，日本专利公开公报特开平6-216568号公开了一种包括元件供给装置、带板状反射镜、元件安装头部单元和CCD照相机的电子元件贴装装置的技术。For example, Japanese Patent Laid-Open Publication No. Hei 6-216568 discloses a technology of an electronic component mounting apparatus including a component supply device, a plate-shaped mirror, a component mounting head unit, and a CCD camera.

另外，日本专利公开公报特开平8-78895号所公开了一种包括一对较长尺寸的带状反射镜、将芯片元件安装在印刷电路板上的吸附保持头部单元和拍摄芯片元件的CCD照相机的电子元件识别装置及电子元件安装装置的技术。但上述公报所公开的技术，存在由于摄像装置的位置偏差，而使元件的位置发生变化的问题。此外，受到镜面弯曲导致图像变形等的影响，还存在元件位置、比例发生变化，难以进行高精度的电子元件摄像、识别处理等问题。In addition, Japanese Patent Laid-Open Publication No. Hei 8-78895 discloses a CCD including a pair of long-sized strip mirrors, a suction-holding head unit for mounting chip components on a printed circuit board, and an imaging chip component. Technologies for electronic component recognition devices and electronic component mounting devices for cameras. However, the technique disclosed in the above publication has a problem that the position of the element changes due to the positional deviation of the imaging device. In addition, due to the influence of image deformation caused by mirror surface bending, there are also problems such as changes in the position and proportion of components, and it is difficult to perform high-precision imaging and recognition processing of electronic components.

本发明是鉴于上述问题而作，其目的在于提供一种，可以防止摄像装置的位置偏差、镜面变形所引起的图像变形等的影响，以高精度检测出电子元件的位置偏差的电子元件安装装置。The present invention was made in view of the above problems, and an object of the present invention is to provide an electronic component mounting device that can detect positional deviation of electronic components with high precision while preventing the influence of positional deviation of the imaging device and image distortion caused by mirror deformation. .

发明内容Contents of the invention

为解决上述课题，本发明的电子元件安装装置，其特征在于包括，搬送印刷电路板的印刷电路板搬送装置；在保持电子元件并移动的同时相对于上述印刷电路板安装该电子元件的头部；设置在上述头部上、与该头部一起移动的标记；用于获得上述标记的镜像和上述电子元件的镜像的反射镜；设置在上述头部上，在上述头部吸附元件后经过反射镜上方时经由透镜和摄像元件获取上述标记的镜像和电子元件的镜像，以获得标记和电子元件的图像的摄像装置；以及通过上述摄像装置拍摄的电子元件图像检测出电子元件的位置，且通过上述摄像画面上的标记的图像检测出标记的位置，修正有关头部的位置的映像误差，并通过上述检测出的电子元件的位置和修正后的头部的位置检测出电子元件相对于头部的位置偏差的检测装置。In order to solve the above-mentioned problems, the electronic component mounting device of the present invention is characterized in that it includes a printed circuit board conveying device that conveys a printed circuit board; and a head that mounts the electronic component to the above-mentioned printed circuit board while holding and moving the electronic component ; a mark arranged on the above-mentioned head and moving together with the head; a reflector for obtaining a mirror image of the above-mentioned mark and a mirror image of the above-mentioned electronic component; When the mirror is above, the mirror image of the above-mentioned mark and the mirror image of the electronic component are obtained through the lens and the imaging element to obtain the image of the mark and the electronic component; The position of the mark is detected from the image of the mark on the imaging screen, the image error related to the position of the head is corrected, and the position of the electronic component relative to the head is detected by the position of the detected electronic component and the position of the head after correction. The detection device of the position deviation.

这样，由于可通过摄像元件上的图像检测出标记的位置，修正有关头部位置的映像误差，同时由该修正后的头部的位置和同样通过摄像元件上的图像检测出的电子元件的位置，检测出电子元件相对于头部的位置偏差，所以可以高精度检测出电子元件相对于头部的位置偏差。In this way, since the position of the mark can be detected through the image on the imaging element, the image error related to the head position can be corrected, and at the same time, the position of the electronic component detected by the corrected head position can also be detected through the image on the imaging element. , to detect the positional deviation of the electronic component relative to the head, so the positional deviation of the electronic component relative to the head can be detected with high precision.

在本发明中，较为理想的是通过在上述反射镜和上述摄像装置之间可设置辅助反射镜，以此变更从反射镜到透镜的光路。In the present invention, it is preferable to change the optical path from the reflection mirror to the lens by providing an auxiliary reflection mirror between the reflection mirror and the imaging device.

这样，由于通过辅助反射镜变更从反射镜到透镜的光路，扩大了摄像装置设置部位的选择范围，提高了头部周边的设计自由度。In this way, since the optical path from the reflector to the lens is changed by the auxiliary reflector, the selection range of the installation position of the imaging device is expanded, and the degree of freedom of design around the head is improved.

此处，较为理想的是，通过变更从上述标记到摄像装置的光路的光路变更装置，使摄像画面上的标记的图像接近电子元件的图像。Here, it is preferable to bring the image of the mark on the imaging screen close to the image of the electronic component by means of an optical path changing device that changes the optical path from the mark to the imaging device.

这样，由于通过光路变更装置变更从标记到摄像元件的光路，使摄像元件上的标记的图像接近电子元件的图像，可在大小受限的画面内放大标记和电子元件的图像，提高清晰度，并改善电子元件相对于头部的位置偏差的检测精度。In this way, since the optical path from the mark to the imaging element is changed by the optical path changing device, the image of the mark on the imaging element is close to the image of the electronic component, and the image of the mark and the electronic component can be enlarged in a size-limited screen to improve the clarity. And the detection accuracy of the positional deviation of the electronic component relative to the head is improved.

上述光路变更装置，较为理想的是包括设置在上述标记和上述摄像装置之间的棱镜，通过该棱镜使摄像元件上的标记的图像接近电子元件的图像。Preferably, the optical path changing device includes a prism provided between the mark and the imaging device, and the image of the mark on the imaging element is brought closer to the image of the electronic component by the prism.

这样，由于通过棱镜变更光路，使摄像元件上的标记的图像接近电子元件的图像，因此标记的清晰度可接近电子元件的清晰度，从而可改善电子元件相对于头部的位置偏差的检测精度。In this way, since the optical path is changed by the prism, the image of the mark on the imaging element is close to the image of the electronic component, so the definition of the mark can be close to that of the electronic component, thereby improving the detection accuracy of the positional deviation of the electronic component relative to the head .

此外，上述光路变更装置，较为理想的是包括设置在上述透镜和上述摄像元件之间的棱镜，通过该棱镜使摄像画面上的标记的图像接近电子元件的图像，并予以拍摄。In addition, the optical path changing device preferably includes a prism provided between the lens and the imaging device, and the image of the mark on the imaging screen is brought close to the image of the electronic device by the prism and captured.

这样，由于通过设置在透镜和摄像元件之间的棱镜，使标记的图像接近电子元件的图像，可使标记的清晰度接近电子元件的清晰度。In this way, since the image of the mark is made close to the image of the electronic component through the prism provided between the lens and the imaging element, the definition of the mark can be made close to that of the electronic component.

此外，上述摄像装置，较为理想的是通过在上述透镜和上述摄像元件之间或在上述透镜和上述标记之间设置光学部件，以此修正从标记到摄像元件的光路差，将标记的图像与摄像元件结合。In addition, the above-mentioned imaging device preferably corrects the optical path difference from the mark to the imaging element by providing an optical component between the above-mentioned lens and the above-mentioned imaging element or between the above-mentioned lens and the above-mentioned mark, and the image of the mark and the image taken by the imager are corrected. Components combined.

这样，由于通过光学部件修正从标记到摄像元件的光路差，即使标记无法与电子元件按相同距离设置时，也能用1个摄像元件来拍摄。In this way, since the optical path difference from the mark to the imaging element is corrected by the optical components, even if the mark cannot be installed at the same distance from the electronic element, images can be captured with one imaging element.

上述摄像元件较为理想的是，在上述透镜的光轴大致通过电子元件中心的状态下，使摄像元件的中心保持偏离透镜光轴的状态，以此将标记的图像与电子元件的图像在透镜的光轴中心附近予以结合。Preferably, the imaging element is kept in a state where the center of the imaging element deviates from the optical axis of the lens when the optical axis of the lens approximately passes through the center of the electronic element, so that the image of the mark and the image of the electronic element are aligned on the lens. near the center of the optical axis to be combined.

这样，由于透镜的变形相对于光轴呈点对称，离光轴越远变形越大，因此可通过尽量使用变形较小的部位来提高识别精度。In this way, since the deformation of the lens is point-symmetrical with respect to the optical axis, the farther away from the optical axis, the greater the deformation. Therefore, the identification accuracy can be improved by using the parts with less deformation as much as possible.

此外，在本发明中，较为理想的是上述电子元件的侧部附近具有辅助反射镜，上述摄像装置可将通过该辅助反射镜和反射镜获得的电子元件侧部的图像成像于摄像画面上与电子元件的图像和标记的图像不同的部位，上述检测装置可通过该摄像画面上的电子元件侧部的图像检测出电子元件在高度方向上的位置。In addition, in the present invention, it is more desirable that there is an auxiliary reflector near the side of the above-mentioned electronic component, and the above-mentioned imaging device can image the image of the side of the electronic component obtained through the auxiliary reflector and the reflector on the imaging screen and Where the image of the electronic component is different from the image of the mark, the detection device can detect the position of the electronic component in the height direction from the image of the side of the electronic component on the imaging screen.

这样，由于通过辅助反射镜可获得电子元件侧部的图像，从而无需另外设置高价的摄像装置，即可检测出电子元件在高度方向上的位置。In this way, since an image of the side of the electronic component can be obtained by the auxiliary mirror, the position of the electronic component in the height direction can be detected without additionally installing an expensive imaging device.

此外，在本发明中，较为理想的是还包括在移动元件供给装置所准备的电子元件的头部的特定位置向摄像装置投影的辅助透镜，使上述辅助透镜可在位于透镜光轴上的摄像姿势和从光轴退避的退避姿势之间变更姿势的辅助透镜姿势变更装置，上述摄像装置可在上述摄像姿势下，将元件供给装置所准备的电子元件的图像成像在摄像元件上，上述检测装置可通过该元件供给装置所准备的电子元件的图像，检测出元件供给装置所准备的电子元件的位置和姿势。In addition, in the present invention, it is more desirable to include an auxiliary lens projecting onto the imaging device at a specific position on the head of the electronic component prepared by the mobile component supply device, so that the auxiliary lens can capture images on the optical axis of the lens. An auxiliary lens posture change device for changing postures between a posture and a retracted posture retracted from the optical axis, the imaging device can image an image of an electronic component prepared by a component supply device on the imaging element in the imaging posture, and the detection device The position and orientation of the electronic component prepared by the component supply device can be detected from the image of the electronic component prepared by the component supply device.

这样，由于辅助透镜姿势变更装置将辅助透镜的姿势从光轴退避的退避姿势变更为位于透镜光轴上的摄像姿势，使摄像元件获得元件供给装置所准备的电子元件的图像，同时检测装置可确认该元件供给装置所准备的电子元件的位置和姿势，所以可以事先检查头部是否获得正确的保持。In this way, since the auxiliary lens posture changing device changes the posture of the auxiliary lens from the retracted posture of the optical axis to the imaging posture positioned on the optical axis of the lens, the imaging element obtains the image of the electronic component prepared by the component supply device, and the detection device can simultaneously The position and posture of the electronic components prepared by this component supply device can be confirmed, so it is possible to check in advance whether the head is held correctly.

此外，在本发明中，较为理想的是可具有多个上述头部，分别设置在其中至少2个相邻头部上的上述摄像装置，可拍摄设置在上述相邻头部之间的1个标记的位置，修正有关各头部的位置的映像误差。In addition, in the present invention, it is preferable to have a plurality of the above-mentioned heads, and the above-mentioned imaging devices respectively installed on at least two of the adjacent heads can capture images of one of the adjacent heads. The position of the mark corrects the image error related to the position of each head.

这样，由于分别设置在头部上的摄像装置，可拍摄设置在上述相邻头部之间的标记的位置，修正有关各头部的位置的映像误差，因此无需为各头部分别设置标记，所以非常经济。Like this, because the camera device that is respectively arranged on the head, can photograph the position of being arranged on the mark between above-mentioned adjacent head, corrects the image error of the relevant position of each head, therefore does not need to set mark respectively for each head, So very economical.

此处，在本发明中，较为理想的是具有多个上述头部，设置在其中至少2个相邻头部之间的1个上述摄像装置，可拍摄对应于上述相邻头部的标记的位置，修正有关各相邻头部的位置的映像误差。Here, in the present invention, it is preferable to have a plurality of the above-mentioned heads, and one of the above-mentioned imaging devices installed between at least two of the adjacent heads can capture images corresponding to the marks of the above-mentioned adjacent heads. position to correct for mapping errors regarding the position of each adjacent head.

这样，由于1个摄像装置可拍摄对应于上述相邻头部的标记的位置，修正有关各相邻头部的位置的映像误差，因此无需为各头部分别设置摄像装置，所以非常经济。In this way, since one imaging device can capture the position of the mark corresponding to the above-mentioned adjacent heads, and correct the image error related to the position of each adjacent head, it is not necessary to separately install an imaging device for each head, so it is very economical.

此外，在本发明中，较为理想的是具有多个上述头部，对应于其中至少2个相邻头部所设置的2个上述摄像装置，设置于在上下方向上互不相同的距离处。In addition, in the present invention, it is preferable to have a plurality of the above-mentioned heads, and to have two of the above-mentioned imaging devices installed corresponding to at least two adjacent heads among them, and to be installed at different distances in the vertical direction.

这样，由于2个摄像装置设置于在上下方向上不同的距离处，尤其在头部周边空间较为狭小时可以有效地利用此空间。In this way, since the two imaging devices are installed at different distances in the vertical direction, especially when the space around the head is narrow, the space can be effectively used.

另外较为理想的是，可具有多个上述头部，对应于其中至少2个相邻头部所设置的2个上述摄像装置中的一方，具有光路变更装置，且通过该光路变更装置设置成相对于反射镜具有不同的角度。In addition, it is more desirable to have a plurality of the above-mentioned heads, corresponding to one of the two above-mentioned imaging devices that are arranged on at least two adjacent heads, there is an optical path changing device, and the optical path changing device is arranged to be opposite to each other. The mirrors have different angles.

这样，由于2个上述摄像装置中的一方，通过该光路变更装置设置成相对于反射镜具有不同的角度，所以尤其在头部周边空间较为狭小时可以有效地利用此空间。In this way, since one of the two above-mentioned imaging devices is set to have a different angle with respect to the reflector by the optical path changing device, the space around the head can be effectively used especially when the space is relatively narrow.

此外，在本发明中，较为理想的是具有多个上述头部，对应于其中至少2个相邻头部所设置的2个摄像装置的双方，分别具有光路变更装置，且通过该光路变更装置，设置成相对于反射镜具有不同的角度。In addition, in the present invention, it is more desirable to have a plurality of the above-mentioned heads, and to have optical path changing devices corresponding to both sides of the two imaging devices installed on at least two of the adjacent heads, and to use the optical path changing devices to , set at different angles relative to the mirror.

这样，由于2个上述摄像装置的双方，分别通过该光路变更装置，设置成相对于反射镜具有不同的角度，所以尤其在头部周边空间较为狭小时可以有效地利用此空间。In this way, since both of the two above-mentioned imaging devices are respectively set to have different angles with respect to the reflector by the optical path changing device, the space around the head can be effectively used especially when the space is relatively narrow.

此外，在本发明中，较为理想的是可具有多个上述头部，对应于其中至少2个相邻头部所设置的2个上述摄像装置的双方，分别具有对所对应的头部的电子元件和标记进行照明的照明装置，上述相邻摄像装置中的一方处于熄灭照明装置的状态时，另一方则点亮照明装置。In addition, in the present invention, it is more desirable to have a plurality of the above-mentioned heads, and corresponding to both sides of the two above-mentioned imaging devices installed on at least two adjacent heads, there are electronic devices for the corresponding heads, respectively. In the lighting device for illuminating components and marks, when one of the above-mentioned adjacent imaging devices is in a state of turning off the lighting device, the other one turns on the lighting device.

这样，由于相邻摄像装置的一方处于熄灭照明装置的状态时，另一方点亮照明装置，从而可以防止2个摄像装置的照明装置相互干扰。In this way, when one of the adjacent imaging devices is in a state where the lighting device is off, the other lighting device is turned on, thereby preventing the lighting devices of the two imaging devices from interfering with each other.

此外，本发明的另一种电子元件安装装置，其特征在于包括，搬送印刷电路板的印刷电路板搬送装置；在保持电子元件并移动的同时相对于上述印刷电路板安装该电子元件的头部；设置在上述头部上、与该头部一起移动的标记；用于获得上述标记的镜像和上述电子元件的镜像的反射镜；具有由透镜与线传感器构成的摄像元件，通过该透镜获取上述标记的镜像和电子元件的镜像，以获得标记和电子元件的图像的线部分的摄像装置；改变上述反射镜的镜面角度的转动机构；检测上述镜面的转动角度的位置偏差的转动角度检测装置；通过控制上述转动机构使其转动，使摄像装置连续获得上述摄像装置所拍摄的标记和电子元件的图像的线部分的控制装置；以及根据连续获得的上述电子元件的图像的线部分的信息检测出电子元件的位置，且根据上述标记的图像的线部分的信息检测出标记的位置，修正有关头部的位置的映像误差，并根据上述检测出的电子元件的位置和修正后的头部的位置检测出电子元件相对于头部的位置偏差的检测装置。In addition, another electronic component mounting device according to the present invention is characterized by comprising: a printed circuit board conveying device for conveying a printed circuit board; and a head for mounting the electronic component with respect to the printed circuit board while holding and moving the electronic component. ; a mark that is arranged on the above-mentioned head and moves together with the head; a mirror for obtaining the mirror image of the above-mentioned mark and the mirror image of the above-mentioned electronic component; an imaging element composed of a lens and a line sensor, through which the above-mentioned A mirror image of the mark and a mirror image of the electronic component, an imaging device for obtaining a line portion of an image of the mark and the electronic component; a rotation mechanism for changing the mirror angle of the above-mentioned mirror; a rotation angle detection device for detecting a positional deviation of the rotation angle of the above-mentioned mirror; By controlling the above-mentioned rotating mechanism to make it rotate, the control device that makes the imaging device continuously obtain the line portion of the image of the mark and the electronic component captured by the above-mentioned imaging device; The position of the electronic component, and the position of the mark is detected based on the information of the line part of the image of the mark, and the image error related to the position of the head is corrected, and the position of the head is corrected according to the position of the detected electronic component and the position of the head after correction A detection device that detects positional deviations of electronic components relative to the head.

这样，根据本发明的另一形态，由于摄像元件由低价的线传感器构成，根据上述标记的图像的线部分的信息可检测出标记的位置，修正有关头部的位置的映像误差，并根据上述检测出的电子元件的位置和修正后的头部的位置检测出电子元件相对于头部的位置偏差，可以高精度并经济地检测出电子元件相对于头部的位置偏差。In this way, according to another aspect of the present invention, since the imaging element is constituted by an inexpensive line sensor, the position of the mark can be detected based on the information of the line part of the image of the mark, and the image error related to the position of the head can be corrected, and based on The position deviation of the electronic component relative to the head is detected by the detected position of the electronic component and the corrected position of the head, and the position deviation of the electronic component relative to the head can be detected with high precision and economically.

附图说明Description of drawings

图1是表示本发明的第1实施例所涉及的电子元件安装装置的结构俯视图。FIG. 1 is a plan view showing the structure of an electronic component mounting device according to a first embodiment of the present invention.

图2是表示本发明的第1实施例所涉及的电子元件安装装置的结构侧视图。Fig. 2 is a side view showing the structure of the electronic component mounting device according to the first embodiment of the present invention.

图3是表示本发明的第1实施例的摄像装置中摄像元件上的图像的示意图。Fig. 3 is a schematic diagram showing an image on an imaging element in the imaging device according to the first embodiment of the present invention.

图4是表示本发明的第2实施例所涉及的电子元件安装装置的结构侧视图。4 is a side view showing the structure of an electronic component mounting device according to a second embodiment of the present invention.

图5是表示本发明的第3实施例所涉及的电子元件安装装置的结构示意图，(a)表示电子元件安装装置的摄像装置的概念图，(b)表示摄像元件的图像。5 is a schematic configuration diagram showing an electronic component mounting device according to a third embodiment of the present invention, (a) showing a conceptual diagram of an imaging device of the electronic component mounting device, and (b) showing an image of an imaging element.

图6是表示本发明的第4实施例所涉及的电子元件安装装置的摄像装置的结构示意图，(a)表示电子元件安装装置的摄像装置的概念图，(b)表示摄像元件的图像。6 is a schematic configuration diagram showing the imaging device of the electronic component mounting device according to the fourth embodiment of the present invention, (a) is a conceptual diagram of the imaging device of the electronic component mounting device, and (b) is an image of the imaging element.

图7是表示本发明的第5实施例所涉及的电子元件安装装置的结构示意图，(a)表示电子元件安装装置的摄像装置的概念图，(b)表示摄像元件的图像。7 is a schematic configuration diagram showing an electronic component mounting device according to a fifth embodiment of the present invention, (a) showing a conceptual diagram of an imaging device of the electronic component mounting device, and (b) showing an image of an imaging device.

图8是表示本发明的第6实施例所涉及的电子元件安装装置的结构侧视图。8 is a side view showing the structure of an electronic component mounting device according to a sixth embodiment of the present invention.

图9是表示本发明的第7实施例所涉及的电子元件安装装置的结构示意图，(a)表示电子元件安装装置的摄像装置的概念图，(b)表示摄像元件的图像。9 is a schematic diagram showing the configuration of an electronic component mounting device according to a seventh embodiment of the present invention, (a) showing a conceptual diagram of an imaging device of the electronic component mounting device, and (b) showing an image of an imaging device.

图10是表示本发明的第8实施例所涉及的电子元件安装装置的结构示意图，(a)表示电子元件安装装置中辅助透镜的退避姿势，(b)表示辅助透镜处于摄像姿势的状态下摄像元件的图像，(c)表示电子元件安装装置中辅助透镜的摄像姿势。10 is a schematic diagram showing the structure of an electronic component mounting device according to an eighth embodiment of the present invention, (a) showing the retracted posture of the auxiliary lens in the electronic component mounting device, and (b) showing an image taken with the auxiliary lens in the imaging posture. The image of the component, (c) shows the imaging posture of the auxiliary lens in the electronic component mounting device.

图11是表示本发明的第9实施例所涉及的电子元件安装装置的图像的示意图。11 is a schematic diagram showing an image of an electronic component mounting device according to a ninth embodiment of the present invention.

图12是表示本发明第10实施例所涉及的电子元件安装装置的结构示意图，(a)表示电子元件安装装置的结构正视图，(b)表示电子元件安装装置的摄像装置的图像。12 is a schematic diagram showing the structure of an electronic component mounting device according to a tenth embodiment of the present invention, (a) showing a front view of the structure of the electronic component mounting device, and (b) showing an image of an imaging device of the electronic component mounting device.

图13是表示本发明的第10实施例所涉及的电子元件安装装置中摄像装置第1变形例的示意图，(a)表示摄像装置第1变形例的结构俯视图，(b)为正视图。13 is a schematic view showing a first modification of the imaging device in the electronic component mounting device according to the tenth embodiment of the present invention, (a) showing a plan view of the structure of the first modification of the imaging device, and (b) a front view.

图14是表示本发明的第10实施例所涉及的电子元件安装装置中摄像装置第2变形例的示意图。14 is a schematic diagram showing a second modification of the imaging device in the electronic component mounting device according to the tenth embodiment of the present invention.

图15是表示本发明的第10实施例所涉及的电子元件安装装置中摄像装置第3变形例的示意图。15 is a schematic diagram showing a third modification of the imaging device in the electronic component mounting device according to the tenth embodiment of the present invention.

图16是表示本发明的第11实施例所涉及的电子元件安装装置的结构俯视图，图16(a)为侧视图，图16(b)是从头部单元116的下方观测的示意图。16 is a plan view showing the structure of the electronic component mounting device according to the eleventh embodiment of the present invention, FIG. 16(a) is a side view, and FIG.

图17是表示本发明的第12实施例所涉及的电子元件安装装置的结构侧视图。Fig. 17 is a side view showing the structure of an electronic component mounting device according to a twelfth embodiment of the present invention.

具体实施方式Detailed ways

以下参照附图对本发明较为理想的实施方式进行详细说明。图1是表示本发明的第1实施例所涉及的电子元件安装装置10的结构俯视图，图2是表示本发明的第1实施例所涉及的电子元件安装装置10的主要部分的结构侧视图。此外，图3是表示摄像装置9中摄像元件9b上的图像的示意图。The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. 1 is a plan view showing the configuration of an electroniccomponent mounting device 10 according to the first embodiment of the present invention, and FIG. 2 is a side view showing the configuration of main parts of the electroniccomponent mounting device 10 according to the first embodiment of the present invention. In addition, FIG. 3 is a schematic diagram showing an image on theimaging element 9 b of theimaging device 9 .

如图1所示，第1实施例所涉及的电子元件安装装置10，是将电子元件1(参照图2、图3)安装在印刷电路板2上的装置，具有设置在基座3上用于搬送印刷电路板2的印刷电路板搬送装置4，设置在该印刷电路板搬送装置4的两侧、提供电子元件1的元件供给装置5，从元件供给装置5接收电子元件1，相对于印刷电路板2进行安装的头部6，用于获得设置在头部6上的标记7(图2)和电子元件1(图2)的镜像的反射镜8，拍摄反射镜8所反射的标记7和电子元件1的镜像，以获得标记7和电子元件1的图像的摄像装置9。As shown in FIG. 1, the electroniccomponent mounting device 10 related to the first embodiment is a device for mounting an electronic component 1 (refer to FIGS. 2 and 3) on a printedcircuit board 2. The printed circuitboard conveying device 4 for conveying the printedcircuit board 2 is arranged on both sides of the printed circuitboard conveying device 4, and thecomponent supply device 5 for supplying theelectronic component 1 receives theelectronic component 1 from thecomponent supply device 5. Thehead 6 where thecircuit board 2 is installed is used to obtain thereflector 8 of the mirror image of the mark 7 ( FIG. 2 ) arranged on thehead 6 and the electronic component 1 ( FIG. 2 ), and themark 7 reflected by thereflector 8 is photographed and the mirror image of theelectronic component 1 to obtain thecamera 9 of the image of themark 7 and theelectronic component 1 .

上述印刷电路板2是预先形成有特定配线模式的电路板，电子元件1被安装在该印刷电路板2的特定位置上，与配线模式电连接。The above-mentioned printedcircuit board 2 is a circuit board on which a specific wiring pattern is formed in advance, and theelectronic component 1 is mounted on a specific position of the printedcircuit board 2 and is electrically connected to the wiring pattern.

上述基座3是台状架台，该基座3上设置有印刷电路板搬送装置4、元件供给装置5、使具有多个头部6的头部装置11在X轴方向(印刷电路板搬送装置4的搬送方向)及Y轴方向上移动的头部单元支撑部件12，以及导轨13。The above-mentioned base 3 is a table-shaped platform, and the base 3 is provided with a printed circuitboard conveying device 4, acomponent supply device 5, and thehead device 11 with a plurality ofheads 6 is arranged in the X-axis direction (the printed circuitboard conveying device 4 conveying direction) and the headunit support member 12 that moves in the Y-axis direction, and theguide rail 13.

上述印刷电路板搬送装置4，由于在将印刷电路板2送入电子元件安装装置10的同时，将已安装电子元件1的印刷电路板2送至外部，所以可保持印刷电路板2进行左右搬送。The above-mentioned printed circuitboard conveying device 4, since the printedcircuit board 2 is sent to the outside while the printedcircuit board 2 is sent into the electroniccomponent mounting device 10, the printedcircuit board 2 can be held and conveyed left and right. .

上述元件供给装置5，是向电子元件安装装置10提供电子元件1的装置，在本实施例中，是将从卷绕有按特定间隔收容、保持有多个电子元件1的带的未图示卷盘中依次取出电子元件1并予以供给的，被称为带式送料器的装置，在印刷电路板搬送装置4的两侧设置多列，由此构成元件供给装置5。The above-mentionedcomponent supply device 5 is a device that supplies theelectronic components 1 to the electroniccomponent mounting device 10. A device called a tape feeder that sequentially takes out and supplieselectronic components 1 from a reel is provided in multiple rows on both sides of the printed circuitboard conveyance device 4 , thereby constituting acomponent supply device 5 .

上述头部6，在从元件供给装置5接收电子元件1的同时，保持所接收的电子元件1并进行移动，将电子元件1安装到印刷电路板搬送装置4所搬送的印刷电路板2的安装位置上，在本实施例中，头部单元11搭载有多个头部6。The above-mentionedhead 6 receives theelectronic components 1 from thecomponent supply device 5 , holds and moves the receivedelectronic components 1 , and mounts theelectronic components 1 on the printedcircuit board 2 conveyed by the printed circuitboard conveying device 4 . Positionally, in this embodiment, thehead unit 11 is equipped with a plurality ofheads 6 .

该头部单元11，在基座3的规定范围内，可沿X轴方向(印刷电路板搬送装置4的搬送方向)及Y轴方向(与X轴方向正交的方向)移动。即，沿X轴方向延伸的头部单元支撑部件12的两端部支撑在Y轴方向的导轨13上，头部单元支撑部件12可沿该导轨13移动，同时头部单元11相对于该头部单元支撑部件12沿X轴移动可能地予以支撑。Thehead unit 11 is movable in the X-axis direction (transfer direction of the printed circuit board transfer device 4 ) and the Y-axis direction (direction perpendicular to the X-axis direction) within a predetermined range of the base 3 . That is, both ends of the headunit support member 12 extending in the X-axis direction are supported on the guide rails 13 in the Y-axis direction, and the headunit support member 12 can move along the guide rails 13, while thehead unit 11 is relative to the head unit. Thesubunit supporting member 12 is supported possibly for movement along the X-axis.

而且，通过Y轴伺服电机15，经滚珠丝杠16执行头部单元支撑部件12的Y轴方向的驱动，同时通过X轴伺服电机17，经滚珠丝杠18进行头部单元11的X轴方向的驱动。Also, the drive of the headunit supporting member 12 in the Y-axis direction is performed via theball screw 16 by the Y-axis servo motor 15, while the drive of thehead unit 11 in the X-axis direction is performed via theball screw 18 by theX-axis servo motor 17. drive.

此外，各个头部6，如图2所示，包括用于吸附元件的吸嘴14、表示头部6基准位置的标记7，和拍摄反射镜8所反射的标记7和电子元件1的镜像而获得标记7和电子元件1的图像的摄像装置9。另外，虽无图示，还可相对于吸嘴14供给用于吸附元件的负压，以及设置升降头部6的Z轴驱动装置和转动头部6的转动驱动装置等。In addition, eachhead 6, as shown in Figure 2, includes asuction nozzle 14 for absorbing components, amark 7 representing the reference position of thehead 6, and a mirror image of themark 7 and theelectronic component 1 reflected by theshooting mirror 8.Camera 9 for obtaining images of marking 7 andelectronic component 1 . In addition, although not shown, a negative pressure for sucking components may be supplied to thesuction nozzle 14, and a Z-axis driving device for the liftinghead 6, a rotation driving device for therotating head 6, and the like may be provided.

上述标记7，分别设置在各个头部6上，是与头部6一起移动的部件，可表示各头部6的基准位置。The above-mentionedmarks 7 are respectively provided on therespective heads 6 , are members that move together with theheads 6 , and can indicate the reference positions of therespective heads 6 .

上述反射镜8，是沿X轴方向延伸的长尺带状镜，设置在设置元件供给装置5的区域和电路板2所在的安装作业区域之间，头部6从元件供给装置5向印刷电路板移动时经过该反射镜8的上方。Above-mentioned reflectingmirror 8 is a long strip mirror extending along the X-axis direction, and is arranged between the area wherecomponent supply device 5 is set and the mounting operation area wherecircuit board 2 is located.Head 6 is directed fromcomponent supply device 5 to the printed circuit board. The plate passes over thismirror 8 as it moves.

上述摄像装置9，例如由CCD照相机(或CMOS传感器)构成，具有透镜9a和摄像元件9b。头部6吸附元件后经过反射镜8上方时，标记7的镜像和电子元件1的镜像经该透镜9a投影在上述摄像元件9b上，获得如图3所示的标记7和电子元件1的图像。此处，图3表示头部6上设有3个标记7的情形。Theimaging device 9 is constituted by, for example, a CCD camera (or a CMOS sensor), and has alens 9a and animaging element 9b. When thehead 6 absorbs the component and passes above themirror 8, the mirror image of themark 7 and the mirror image of theelectronic component 1 are projected on the above-mentionedimaging component 9b through thelens 9a, and the images of themark 7 and theelectronic component 1 are obtained as shown in FIG. 3 . Here, FIG. 3 shows a state where threemarks 7 are provided on thehead 6 .

此外，摄像装置9，具有通过反射镜8对所对应的头部6的电子元件1和标记7进行照明的照明装置9d(图2)。In addition, theimaging device 9 has an illuminatingdevice 9 d ( FIG. 2 ) for illuminating the correspondingelectronic component 1 and themark 7 of thehead 6 through the reflectingmirror 8 .

来自摄像装置9的图像数据，输入设置于安装装置的控制部的检测装置19中。该检测装置19，识别处理摄像装置9所获得的电子元件1的图像以检测出电子元件1的位置，且通过摄像元件9b上标记7的图像以检测出标记7的位置，修正有关头部6的位置的映像误差和获取速度的变化等引起的图像误差等，从而根据上述检测出的电子元件1的位置和修正后的头部6的位置以检测出电子元件1相对于头部6的位置偏差。Image data from theimaging device 9 is input to adetection device 19 provided in a control unit of the mounting device. Thedetection device 19 recognizes and processes the image of theelectronic component 1 obtained by theimaging device 9 to detect the position of theelectronic component 1, and detects the position of themark 7 through the image of themark 7 on theimaging component 9b, and corrects therelevant head 6. The image error caused by the image error of the position and the change of the acquisition speed, etc., so as to detect the position of theelectronic component 1 relative to thehead 6 based on the detected position of theelectronic component 1 and the corrected position of thehead 6 deviation.

根据本实施例，在安装时，首先头部单元11移至对应于元件供给装置5的位置，通过头部6吸附元件后，直线移向印刷电路板2上方。该头部单元11，移动经过反射镜8上方时，通过摄像装置9拍摄反射镜8中所映射的元件，同时通过检测装置19进行元件识别，检测出吸附位置的偏差，并求取关于元件安装位置的修正量。According to this embodiment, during installation, firstly, thehead unit 11 moves to a position corresponding to thecomponent supply device 5 , and after the component is sucked by thehead 6 , it moves linearly above the printedcircuit board 2 . When thehead unit 11 moves over thereflection mirror 8, the components mapped in thereflection mirror 8 are photographed by theimaging device 9, and at the same time, thedetection device 19 is used for component identification to detect the deviation of the adsorption position, and obtain information about the components installed. The amount of correction for the position.

此时，可根据标记7和电子元件1双方的图像，修正映像误差及获取速度的变化等引起的图像误差等，以高精度地检测出吸附位置的偏差。然后，将元件安装在已修正的安装位置上。In this case, based on the images of both themarker 7 and theelectronic component 1 , image errors caused by image errors and changes in acquisition speed, etc. can be corrected, and deviations in the suction positions can be detected with high accuracy. Then, mount the component in the corrected mounting position.

接着，图4是表示本发明的第2实施例所涉及的电子元件安装装置20的结构侧视图。Next, FIG. 4 is a side view showing the configuration of an electroniccomponent mounting apparatus 20 according to a second embodiment of the present invention.

以下，就与第1实施例所涉及的电子安装装置10相同的部分赋予相同的符号，并省略重复说明。Hereinafter, the same parts as those of theelectronic mounting device 10 according to the first embodiment are given the same reference numerals, and redundant descriptions are omitted.

如同图所示，第2实施例所涉及的电子元件安装装置20，通过在反射镜8和透镜9a之间设置辅助反射镜21，来变更从反射镜8到透镜9a的光路。As shown in the drawing, the electroniccomponent mounting apparatus 20 according to the second embodiment changes the optical path from themirror 8 to thelens 9a by providing theauxiliary mirror 21 between themirror 8 and thelens 9a.

根据本实施例，由于通过辅助反射镜21变更从反射镜8到透镜9a的光路，扩大了摄像装置9设置部位的选择范围，可提高头部6周边的设计自由度。According to this embodiment, since the optical path from thereflector 8 to thelens 9a is changed by theauxiliary reflector 21, the selection range of the installation position of theimaging device 9 is expanded, and the degree of freedom of design around thehead 6 can be improved.

图5是表示本发明的第3实施例所涉及的电子元件安装装置30的结构示意图，(a)表示电子元件安装装置30摄像装置9的概念图，(b)表示摄像元件9b的图像。5 is a schematic configuration diagram showing an electronic component mounting device 30 according to a third embodiment of the present invention, (a) showing a conceptual diagram of the electronic component mounting device 30imaging device 9, and (b) showing an image of theimaging device 9b.

本发明的第3实施例所涉及的电子元件安装装置30的摄像装置9，通过变更从上述标记7到摄像元件9b的光路的光路变更装置31(在第3实施例中，设置在标记7与透镜9a之间的棱镜32)，使摄像元件9b上标记7的图像接近电子元件1的图像。Theimaging device 9 of the electronic component mounting apparatus 30 according to the third embodiment of the present invention uses the optical path changing device 31 (in the third embodiment, provided between the marking 7 and The prism 32) between thelenses 9a makes the image of themark 7 on theimaging element 9b approach the image of theelectronic element 1.

根据本实施例，由于通过上述棱镜32变更从标记7到摄像元件9b的光路，使摄像元件9b上标记7的图像接近电子元件1的图像，可在大小受限的画面内放大标记7和电子元件1的图像，提高电子元件1的相对于头部6的位置偏差的检测精度。According to this embodiment, since the optical path from themark 7 to theimaging element 9b is changed by the above-mentioned prism 32, the image of themark 7 on theimaging element 9b is close to the image of theelectronic component 1, and themark 7 and the electronic element can be enlarged in a screen of limited size. The image of thecomponent 1 improves the detection accuracy of the position deviation of theelectronic component 1 relative to thehead 6 .

图6是表示本发明的第4实施例所涉及的电子元件安装装置40摄像装置49的结构示意图，(a)表示摄像装置49的概念图，(b)表示摄像元件49b的图像。6 is a schematic configuration diagram showing animaging device 49 of an electroniccomponent mounting device 40 according to a fourth embodiment of the present invention. (a) shows a conceptual diagram of theimaging device 49, and (b) shows an image of theimaging device 49b.

如图6(a)所示，第4实施例所涉及的电子元件安装装置40的光路变更装置31，包括设置在透镜49a和摄像元件49b之间的棱镜42，通过该棱镜42，如图6(b)所示，使标记7的图像接近电子元件1的图像并予以拍摄。As shown in FIG. 6 (a), the opticalpath changing device 31 of the electroniccomponent mounting device 40 according to the fourth embodiment includes aprism 42 arranged between alens 49a and animaging element 49b. As shown in (b), the image of themark 7 is brought close to the image of theelectronic component 1 and photographed.

根据本实施例，由于通过棱镜42变更从标记7到摄像元件49b的光路，使标记7的图像接近电子元件1的图像，与第3实施例相同，可在大小受限的画面内放大标记和电子元件的图像，增加清晰度，以提高位置偏差的检测精度。According to this embodiment, since the optical path from themark 7 to theimaging element 49b is changed by theprism 42, the image of themark 7 is made close to the image of theelectronic component 1, and the same as the third embodiment, the mark and the image can be enlarged in a screen with a limited size. Images of electronic components with increased clarity to improve the detection accuracy of positional deviations.

图7是表示本发明的第5实施例所涉及的电子元件安装装置50的结构示意图，(a)表示电子元件安装装置50摄像装置59的概念图，(b)表示摄像元件59b的图像。7 is a schematic diagram showing the configuration of an electroniccomponent mounting device 50 according to a fifth embodiment of the present invention, (a) showing a conceptual diagram of animaging device 59 of the electroniccomponent mounting device 50, and (b) showing an image of animaging device 59b.

如图7(a)、(b)所示，第5实施例所涉及的电子元件安装装置50的摄像装置59，通过在透镜59a和摄像元件59b之间设置的光学部件51，修正从标记7到摄像元件59b的光路差，将标记7的图像与摄像元件59b结合。As shown in Fig. 7(a) and (b), theimaging device 59 of the electroniccomponent mounting device 50 according to the fifth embodiment corrects the position from themark 7 through theoptical component 51 provided between thelens 59a and theimaging element 59b. The optical path difference to theimaging element 59b combines the image of themark 7 with theimaging element 59b.

根据本实施例，由于通过光学部件51修正从标记7到摄像元件59b的光路差，即使标记7无法与电子元件1按相同距离设置时，也能用1个摄像元件59b来进行拍摄。According to this embodiment, since the optical path difference from themark 7 to theimaging device 59b is corrected by theoptical member 51, even when the marking 7 cannot be placed at the same distance from theelectronic device 1, images can be taken with oneimaging device 59b.

另外，光学部件51，可设置在透镜59a和上述标记7之间，来代替上述设置在透镜59a和摄像元件59b之间的结构，以此修正光路差，将标记7的图像与摄像元件59b结合，亦可取得相同的效果。In addition, theoptical component 51 can be arranged between thelens 59a and the above-mentionedmark 7 instead of the above-mentioned structure arranged between thelens 59a and theimaging element 59b, so as to correct the optical path difference and combine the image of themark 7 with theimaging element 59b. , can also achieve the same effect.

图8是表示本发明的第6实施例所涉及的电子元件安装装置60的结构侧视图。FIG. 8 is a side view showing the configuration of an electroniccomponent mounting device 60 according to a sixth embodiment of the present invention.

如图8所示，第6实施例所涉及的电子元件安装装置60的摄像元件69b，在透镜69a的光轴69c大致经过电子元件1中心1a的状态下，使摄像元件69b的中心69d保持偏离透镜69a的光轴69c的状态，以此将标记7的图像和电子元件1的图像在透镜69a的光轴中心附近予以结合。As shown in FIG. 8 , in the imaging element 69b of the electroniccomponent mounting apparatus 60 according to the sixth embodiment, thecenter 69d of the imaging element 69b is kept shifted in a state where theoptical axis 69c of thelens 69a approximately passes through thecenter 1a of theelectronic component 1. The state of theoptical axis 69c of thelens 69a is such that the image of themark 7 and the image of theelectronic component 1 are combined near the center of the optical axis of thelens 69a.

根据本实施例，由于透镜69a的变形相对于光轴69c呈点对称，离光轴69c越远变形越大，因此可通过尽量使用变形较小的部位来提高识别精度。According to this embodiment, since the deformation of thelens 69a is point-symmetrical with respect to theoptical axis 69c, the farther away from theoptical axis 69c, the greater the deformation. Therefore, the identification accuracy can be improved by using as little deformation as possible.

图9是表示本发明的第7实施例所涉及的电子元件安装装置70的结构示意图，(a)表示电子元件安装装置70摄像装置79的概念图，(b)表示摄像元件79b的图像。9 is a schematic diagram showing the structure of an electroniccomponent mounting device 70 according to a seventh embodiment of the present invention, (a) showing a conceptual diagram of animaging device 79 of the electroniccomponent mounting device 70, and (b) showing an image of animaging device 79b.

如图9(a)所示，第7实施例所涉及的电子元件安装装置70，在电子元件1的侧部附近具有辅助反射镜71，摄像装置79，如图9(b)所示，将通过该辅助反射镜71和反射镜8获得的电子元件1的侧部1b的图像成像于摄像元件79b上与电子元件1的图像和标记7的图像不同的部分上，检测装置72通过该摄像元件79b上电子元件1的侧部1b的图像检测出电子元件1在高度方向上的位置。As shown in FIG. 9(a), the electroniccomponent mounting device 70 according to the seventh embodiment has anauxiliary mirror 71 near the side of theelectronic component 1, and animaging device 79, as shown in FIG. 9(b), The image of theside portion 1b of theelectronic component 1 obtained by theauxiliary reflector 71 and thereflector 8 is imaged on a portion different from the image of theelectronic component 1 and the image of themark 7 on theimaging element 79b, through which thedetection device 72 The image of theside portion 1b of theelectronic component 1 on 79b detects the position of theelectronic component 1 in the height direction.

根据本实施例，由于通过辅助反射镜71可获得电子元件1的侧部1b的图像，从而无需另外设置高价的摄像装置，即可检测出电子元件1在高度方向上的位置。According to this embodiment, since the image of theside portion 1b of theelectronic component 1 can be obtained by theauxiliary mirror 71, the position of theelectronic component 1 in the height direction can be detected without additionally installing an expensive imaging device.

图10是表示本发明的第8实施例所涉及的电子元件安装装置80的结构示意图，(a)表示电子元件安装装置80中辅助透镜81的退避姿势(81a)，(b)表示辅助透镜81处于摄像姿势81b的状态下摄像元件89b的图像，(c)表示电子元件安装装置80中辅助透镜81的摄像姿势81b。10 is a schematic diagram showing the configuration of an electronic component mounting device 80 according to an eighth embodiment of the present invention, (a) showing a retreat posture (81a) of the auxiliary lens 81 in the electronic component mounting device 80, and (b) showing the auxiliary lens 81 In the image of the imaging element 89b in the state of the imaging posture 81b, (c) shows the imaging posture 81b of the auxiliary lens 81 in the electronic component mounting device 80 .

如图10(a)、(c)所示，第8实施例所涉及的电子元件安装装置80的摄像装置89，包括辅助透镜81，该辅助透镜81通过辅助透镜姿势变更装置81c，可使辅助透镜81在位于透镜89a光轴89c上的摄像姿势81b(图10(c))和从光轴退避的退避姿势81a(图10(a))之间变更姿势。As shown in Fig. 10 (a), (c), the imaging device 89 of the electronic component mounting device 80 according to the eighth embodiment includes an auxiliary lens 81, and the auxiliary lens 81 can make the auxiliary lens 81 change the position of the auxiliary lens 81c. The lens 81 changes its posture between an imaging posture 81b ( FIG. 10( c )) positioned on the optical axis 89c of the lens 89a and a retracted posture 81a ( FIG. 10( a )) retracted from the optical axis.

该辅助透镜81，在头部86吸附元件时位于规定位置的状态下，变更为摄像姿势81b(图10(c))的状态，将元件供给装置5所准备的电子元件1的图像投影在摄像装置89上，如图10(b)所示，通过摄像元件89b拍摄元件供给装置5所准备的电子元件1的图像。此时，可在元件供给装置5设置标记5a，以表示元件供给部5的基准位置。The auxiliary lens 81 changes to the state of the imaging posture 81b ( FIG. 10( c )) in the state where the head 86 is at a predetermined position when the component is picked up, and projects the image of theelectronic component 1 prepared by thecomponent supply device 5 on the imaging position. On the device 89, as shown in FIG. 10(b), an image of theelectronic component 1 prepared by thecomponent supply device 5 is taken by the imaging device 89b. At this time, a mark 5 a may be provided on thecomponent supply device 5 to indicate the reference position of thecomponent supply unit 5 .

进而，在电子元件安装装置80，可设置检测装置82，该检测装置82通过该电子元件1的图像，可检测出元件供给装置5所准备的电子元件1的位置和姿势。Furthermore, the electronic component mounting device 80 may be provided with a detection device 82 capable of detecting the position and orientation of theelectronic component 1 prepared by thecomponent supply device 5 from the image of theelectronic component 1 .

根据本实施例，由于辅助透镜81从退避姿势81a变更为摄像姿势81b，通过摄像元件89b可获得元件供给装置5所准备的电子元件1的图像，同时通过检测装置82可确认电子元件1的位置和姿势，所以可以事先检查电子元件1是否正确地保持在吸嘴14上。According to this embodiment, since the auxiliary lens 81 is changed from the retracted posture 81a to the imaging posture 81b, the image of theelectronic component 1 prepared by thecomponent supply device 5 can be obtained by the imaging device 89b, and the position of theelectronic component 1 can be confirmed by the detection device 82. and posture, so it can be checked in advance whether theelectronic component 1 is correctly held on thesuction nozzle 14.

图11是表示本发明的第9实施例所涉及的电子元件安装装置90的图像示意图。FIG. 11 is a schematic diagram showing an image of an electronic component mounting apparatus 90 according to a ninth embodiment of the present invention.

如图11所示，第9实施例所涉及的电子元件安装装置90，具有多个头部96a、96b、96c、96d，分别设置在头部96a、96b、96c、96d上的摄像装置，拍摄设置在相邻头部96a和96b(96c和96d)之间的标记97a(97b)的位置，修正有关各个头部96a、96b、96c及96d的位置的映像误差。As shown in FIG. 11, the electronic component mounting apparatus 90 related to the ninth embodiment has a plurality of heads 96a, 96b, 96c, and 96d, and imaging devices respectively installed on the heads 96a, 96b, 96c, and 96d take pictures. The position of the mark 97a (97b) provided between the adjacent heads 96a and 96b (96c and 96d) corrects the image errors regarding the positions of the respective heads 96a, 96b, 96c and 96d.

根据本实施例，由于分别设置在头部96a、96b、96c、96d上的摄像装置，拍摄设置在相邻头部96a和96b(96c和96d)之间的标记97a(97b)的位置，修正有关各个头部96a、96b、96c、96d的位置的映像误差，所以可以大幅度削减标记的数量。According to the present embodiment, since the imaging devices respectively provided on the heads 96a, 96b, 96c, 96d capture the positions of the markers 97a (97b) arranged between the adjacent heads 96a and 96b (96c and 96d), the correction Because of the image errors related to the positions of the heads 96a, 96b, 96c, and 96d, the number of marks can be greatly reduced.

图12是表示本发明的第10实施例所涉及的电子元件安装装置100的结构示意图，(a)表示电子元件安装装置100的结构正视图，(b)表示电子元件安装装置100摄像装置109的图像。12 is a schematic diagram showing the structure of an electroniccomponent mounting device 100 according to a tenth embodiment of the present invention, (a) showing a front view of the structure of the electroniccomponent mounting device 100, and (b) showing the structure of the electroniccomponent mounting device 100 of the imaging device 109. image.

如图12(a)所示，第10实施例所涉及的电子元件安装装置100，具有多个头部106a～106h，分别设置在其中相邻的2个头部106a与106b之间、106c与106d之间、106e与106f之间及106g与106h之间的摄像装置109a、109b、109c、109d，拍摄对应于这些相邻头部106a～106h的标记的位置，修正有关各相邻头部106a～106h的位置的映像误差(图12(b)表示其中摄像装置109a的摄像元件109b所拍摄的图像，即对应于相邻头部106a、106b的标记107a和电子元件1的图像)。As shown in FIG. 12(a), the electroniccomponent mounting device 100 according to the tenth embodiment has a plurality ofheads 106a to 106h, which are respectively arranged between twoadjacent heads 106a and 106b, 106c and 106b respectively. Theimaging devices 109a, 109b, 109c, and 109d between 106d, between 106e and 106f, and between 106g and 106h photograph the positions of the marks corresponding to theseadjacent heads 106a-106h, and correct the corresponding positions of theadjacent heads 106a. The image error at the position of ~106h (FIG. 12(b) shows the image captured by theimaging element 109b of theimaging device 109a, that is, the image corresponding to themark 107a and theelectronic component 1 of theadjacent heads 106a, 106b).

根据本实施例，由于摄像装置109a、109b、109c、109d拍摄对应于头部106a～106h的标记的位置，修正有关各头部106a～106h的位置的映像误差，可以大幅度削减拍摄装置的数量。According to this embodiment, since theimaging devices 109a, 109b, 109c, and 109d capture the positions of the marks corresponding to theheads 106a to 106h, and correct image errors related to the positions of theheads 106a to 106h, the number of imaging devices can be greatly reduced. .

图13是表示本发明的第10实施例所涉及的电子元件安装装置100中摄像装置的第1变形例的示意图，(a)表示摄像装置第1变形例的结构俯视图，(b)表示正视图。13 is a schematic view showing a first modified example of the imaging device in the electroniccomponent mounting apparatus 100 according to the tenth embodiment of the present invention, (a) showing a structural plan view of the first modified example of the imaging device, and (b) showing a front view .

如图13(a)、(b)所示，电子元件安装装置100的拍摄装置的第1变形例为，对应于多个头部106a～06h所设置的摄像装置109a～109h，设置于在上下方向上互不相同的距离处。As shown in Fig. 13 (a) and (b), the first modified example of the imaging device of the electroniccomponent mounting device 100 is that theimaging devices 109a to 109h provided corresponding to the plurality ofheads 106a to 06h are installed on the upper and lower sides. different distances in the direction.

根据本实施例，由于摄像装置109a～109h设置于在上下方向上互不相同的距离处，尤其在头部106a～06h的周边空间较为狭小时可以有效地利用此空间。According to this embodiment, since theimaging devices 109a-109h are arranged at different distances in the vertical direction, especially when the space around theheads 106a-06h is narrow, the space can be effectively used.

图14是表示本发明的第10实施例所涉及的电子元件安装装置100中摄像装置第2变形例的示意图。14 is a schematic diagram showing a second modification of the imaging device in the electroniccomponent mounting apparatus 100 according to the tenth embodiment of the present invention.

如图14所示，电子元件安装装置100的摄像装置的第2变形例为，对应于相邻头部106a～106h所设置的摄像装置109a～109h中的一方，即摄像装置109b、109d、109f、109h，具有由镜面构成的光路变更装置121，且通过该光路变更装置121，设置成其相对于反射镜8的角度不同于摄像装置109a、109c、109e、109g相对于反射镜8的角度。As shown in FIG. 14, the second modification example of the imaging device of the electroniccomponent mounting apparatus 100 is that one of theimaging devices 109a to 109h installed corresponding to theadjacent heads 106a to 106h, that is, theimaging devices 109b, 109d, and 109f , 109h have an optical path changing device 121 made of a mirror, and by this optical path changing device 121, it is set so that its angle relative to themirror 8 is different from the angle of theimaging devices 109a, 109c, 109e, 109g relative to themirror 8.

根据本实施例，由于摄像装置109a～109h中一方的摄像装置109b、109d、109f、109h，通过光路变更装置121，设置成其相对于反射镜8的角度不同于摄像装置109a、109c、109e、109g相对于反射镜8的角度，所以尤其在头部106a～106h周边空间较为狭小时可以有效地利用此空间。According to this embodiment, since one of theimaging devices 109a to 109h, theimaging devices 109b, 109d, 109f, and 109h, is set so that its angle with respect to themirror 8 is different from that of theimaging devices 109a, 109c, 109e, The angle of 109g relative to thereflector 8 can effectively use the space especially when the space around theheads 106a-106h is relatively narrow.

图15是表示本发明的第10实施例所涉及的电子元件安装装置100中摄像装置第3变形例的示意图。FIG. 15 is a schematic diagram showing a third modification of the imaging device in the electroniccomponent mounting apparatus 100 according to the tenth embodiment of the present invention.

如图15所示，电子元件安装装置100的摄像装置第3变形例为，对应于相邻头部106a～106h所设置的摄像装置109a～109h，分别具有光路变更装置131，且通过该光路变更装置131，设置成相对于反射镜8具有不同的角度。As shown in FIG. 15, the third modified example of the imaging device of the electroniccomponent mounting apparatus 100 is that theimaging devices 109a-109h installed corresponding to theadjacent heads 106a-106h respectively have an opticalpath changing device 131, and the optical path changing Themeans 131 are arranged at different angles relative to themirror 8 .

根据本实施例，由于摄像装置109a～109h，分别通过该光路变更装置131，设置成相对于反射镜8具有不同的角度，所以与第2变形例相同，尤其在头部106a至106h周边空间较为狭小时可以有效地利用此空间。According to this embodiment, since theimaging devices 109a to 109h are set at different angles with respect to thereflector 8 through the opticalpath changing device 131 respectively, it is the same as the second modified example, especially in the surrounding spaces of theheads 106a to 106h. This space can be effectively used when it is small.

图16是表示本发明的第11实施例所涉及的电子元件安装装置110的结构示意图，图16(a)为侧视图，图16(b)是从头部单元116的下方观测的示意图。16 is a schematic diagram showing the structure of an electroniccomponent mounting device 110 according to an eleventh embodiment of the present invention, FIG. 16(a) is a side view, and FIG.

如图16(a)、(b)所示，第11实施例所涉及的电子元件安装装置110为，具有多个头部116a～116d，对应于头部116a～116d所设置的摄像装置，分别具有在照明范围111a～111d内对所对应的头部116a～116d的电子元件1和标记117a～117d进行照明的照明装置112a～112d(相当于第1实施例所涉及的电子元件安装装置10的照明装置)，上述相邻的摄像装置中的一方的照明范围111a、111c(或111b、111d)处于熄灭照明的状态时，另一方的照明范围111b、111d(或111a、111c)处于点亮照明的状态。As shown in Fig. 16(a) and (b), the electroniccomponent mounting apparatus 110 according to the eleventh embodiment has a plurality ofheads 116a to 116d, corresponding to the imaging devices installed on theheads 116a to 116d, respectively There are illuminatingdevices 112a to 112d (corresponding to the electroniccomponent mounting apparatus 10 according to the first embodiment) that illuminate theelectronic components 1 of the correspondingheads 116a to 116d and themarks 117a to 117d within the illuminatingranges 111a to 111d. lighting device), when thelighting range 111a, 111c (or 111b, 111d) of one of the above-mentioned adjacent imaging devices is in the state of lighting off, thelighting range 111b, 111d (or 111a, 111c) of the other side is in the lighting up state status.

根据本实施例，若采用本发明的第11实施例，由于相邻摄像装置的一方的照明范围处于熄灭照明的状态时，另一方的照明范围处于点亮照明的状态，从而可以防止2个照明范围相互干扰而造成图像品质的下降。According to this embodiment, if the eleventh embodiment of the present invention is adopted, when one of the illumination ranges of adjacent imaging devices is in the state of lighting off, the other lighting range is in the state of lighting up, thereby preventing two lighting ranges interfere with each other causing a degradation in image quality.

图17是表示本发明的第12实施例所涉及的电子元件安装装置120的结构侧视图。FIG. 17 is a side view showing the structure of an electronic component mounting apparatus 120 according to a twelfth embodiment of the present invention.

如同图所示，第12实施例所涉及的电子元件安装装置120包括，搬送印刷电路板2的印刷电路板搬送装置4，在保持电子元件1并移动的同时相对于上述印刷电路板2安装该电子元件1的头部6，设置在上述头部6上、与该头部6一起移动的标记7，用于获得上述标记7的镜像和上述电子元件1的镜像的反射镜127。As shown in the figure, the electronic component mounting device 120 according to the twelfth embodiment includes a printed circuitboard conveying device 4 for conveying the printedcircuit board 2, and mounts theelectronic component 1 on the above-mentioned printedcircuit board 2 while holding and moving it. Thehead 6 of theelectronic component 1 , themark 7 arranged on thehead 6 and moving together with thehead 6 , and the mirror 127 for obtaining the mirror image of themark 7 and the mirror image of theelectronic component 1 .

此外，该电子元件安装装置120包括，由获得上述标记7和电子元件1图像的线部分的线传感器所构成的摄像装128，改变上述反射镜8的镜面127a的角度的转动机构121，检测上述镜面127a的转动角度的位置偏差的转动角度检测装置122，通过控制上述转动机构121使其转动，使摄像装置128连续获得上述摄像装置128所拍摄的标记7及电子元件1的图像的线部分的控制装置123。In addition, the electronic component mounting device 120 includes an imaging device 128 composed of a line sensor that obtains the above-mentionedmark 7 and the line portion of the image of theelectronic component 1, and a rotating mechanism 121 that changes the angle of the mirror surface 127a of the above-mentionedreflector 8 to detect the above-mentioned The rotation angle detecting device 122 of the position deviation of the rotation angle of the mirror surface 127a controls the above-mentioned rotation mechanism 121 to make it rotate, so that the imaging device 128 continuously obtains the line portion of the image of themark 7 and theelectronic component 1 captured by the above-mentioned imaging device 128. Control device 123 .

另外，该摄像装置128中所设置的检测装置129，根据连续获得的上述电子元件1的图像的线部分的信息检测出电子元件1的位置，且根据上述标记7的图像的线部分的信息检测出标记7的位置，修正反射镜127所引起的有关头部6的位置的映像误差。进而，该检测装置129，根据上述检测出的电子元件1的位置和修正后的头部6的位置检测出电子元件1相对于头部6的位置偏差。In addition, the detection device 129 provided in the imaging device 128 detects the position of theelectronic component 1 based on the information of the line portion of the image of the above-mentionedelectronic component 1 obtained continuously, and detects the position of theelectronic component 1 based on the information of the line portion of the image of the above-mentionedmark 7 . The position of themark 7 is obtained, and the image error about the position of thehead 6 caused by the reflector 127 is corrected. Furthermore, the detecting device 129 detects a positional deviation of theelectronic component 1 with respect to thehead 6 based on the detected position of theelectronic component 1 and the corrected position of thehead 6 .

根据本实施例，由于摄像装置128由低价的线传感器构成，可以高精度并经济地检测出电子元件1相对于头部6的位置偏差。According to this embodiment, since the imaging device 128 is constituted by an inexpensive line sensor, it is possible to detect positional deviation of theelectronic component 1 with respect to thehead 6 with high precision and economically.

产业上的利用可能性Industrial Utilization Possibility

如上所述，采用本发明，具有可以防止摄像装置所引起的元件的摄像位置偏差、反射镜变形所引起的图像变形等的影响，以高精度检测出电子元件的位置偏差的显著效果。As described above, according to the present invention, it is possible to detect positional deviations of electronic components with high precision while preventing the influence of imaging device positional deviations of components and image deformation due to mirror deformation.

Claims (16)

1. electronic element installation device is characterized in that comprising:

The printed circuit board (PCB) carrying device of conveyance printed circuit board (PCB);

When keeping electronic component and moving, the head of this electronic component is installed with respect to above-mentioned printed circuit board (PCB);

The mark that is arranged on the above-mentioned head, moves with this head;

Be used to obtain the speculum of the mirror image of the mirror image of above-mentioned mark and above-mentioned electronic component;

Be arranged on the above-mentioned head, behind above-mentioned head absorptive element through speculum above the time, obtain the mirror image of above-mentioned mark and the mirror image of electronic component via lens and imaging apparatus, with the camera head of the image that obtains mark and electronic component; And

Go out the position of electronic component by the image detection of the captured electronic component of above-mentioned camera head, and go out the position of mark by the image detection of the mark on the above-mentioned camera picture, revise the reflection error of the position of relevant head, and go out the checkout gear of electronic component with respect to the position deviation of head by the position of above-mentioned detected electronic component and the position probing of revised head.

2. electronic element installation device according to claim 1 is characterized in that:

By between above-mentioned speculum and above-mentioned camera head, auxiliary mirror being set, change light path from the speculum to lens with this.

3. electronic element installation device according to claim 1 is characterized in that:

Light path change device by the light path of change from above-mentioned mark to imaging apparatus makes the image of the image of the mark on the imaging apparatus near electronic component.

4. electronic element installation device according to claim 3 is characterized in that:

Above-mentioned light path change device comprises the prism that is arranged between above-mentioned mark and the above-mentioned camera head, makes the image of the image of the mark on the imaging apparatus near electronic component by this prism.

5. electronic element installation device according to claim 3 is characterized in that:

Above-mentioned light path change device comprises the prism that is arranged between said lens and the above-mentioned imaging apparatus, makes the image of the image of the mark on the imaging apparatus near electronic component by this prism, and is taken.

6. electronic element installation device according to claim 1 is characterized in that:

By between said lens and the above-mentioned imaging apparatus or between said lens and the above-mentioned mark optics being set, revise path difference from the mark to the imaging apparatus with this, the image of mark is combined with imaging apparatus.

7. according to each described electronic element installation device in the claim 1 to 6, it is characterized in that:

Above-mentioned imaging apparatus roughly passes through under the state at electronic component center at the optical axis of said lens, makes the center of imaging apparatus keep departing from the state of lens axis, with this image of mark and the image of electronic component is given combination near the optical axis center of lens.

8. according to each described electronic element installation device in the claim 1 to 7, it is characterized in that:

Have auxiliary mirror near the sidepiece of above-mentioned electronic component,

Above-mentioned camera head, the image imaging of the electronic component sidepiece that will be obtained by this auxiliary mirror and speculum on camera picture with the different position of image of the image and the mark of electronic component,

Above-mentioned detection device by the image of the electronic component sidepiece on this camera picture, detects the position of electronic component on short transverse.

9. according to each described electronic element installation device in the claim 1 to 8, it is characterized in that:

Comprise that also the ad-hoc location of the head of the electronic component of being prepared at the moving meter feedway is to the attachment lens of camera head projection;

Make the above-mentioned attachment lens can be at shooting posture on the lens axis and the attachment lens posture changing device of keeping out of the way between the posture change posture kept out of the way from optical axis;

Above-mentioned camera head, under above-mentioned shooting posture, the image imaging of the electronic component that component supplying apparatus is prepared on imaging apparatus,

Above-mentioned detection device, the image of the electronic component of preparing by this component supplying apparatus detects the position and the posture of the electronic component that component supplying apparatus prepares.

10. according to each described electronic element installation device in the claim 1 to 9, it is characterized in that:

Have a plurality of above-mentioned heads,

Be separately positioned on wherein the above-mentioned camera head at least 2 adjacent head, take the position that is arranged on the mark between the above-mentioned adjacent head, revise the reflection error of the position of relevant each head.

11., it is characterized in that according to each described electronic element installation device in the claim 1 to 9:

Have a plurality of above-mentioned heads,

Be arranged on wherein 1 above-mentioned camera head between at least 2 adjacent head, take position, revise the reflection error of the position of relevant each adjacent head corresponding to the mark of above-mentioned adjacent head.

12., it is characterized in that according to each described electronic element installation device in the claim 1 to 9:

Have a plurality of above-mentioned heads,

Corresponding at least 22 above-mentioned camera heads that adjacent head is set wherein, be arranged at mutually different distance on above-below direction.

13., it is characterized in that according to each described electronic element installation device in the claim 1 to 9:

Have a plurality of above-mentioned heads,

Side corresponding in set 2 the above-mentioned camera heads of at least 2 adjacent head wherein has the light path change device, and by this light path change device, is arranged to have different angles with respect to speculum.

14., it is characterized in that according to each described electronic element installation device in the claim 1 to 9:

Have a plurality of above-mentioned heads,

Both sides corresponding to 2 set above-mentioned camera heads of at least 2 adjacent head wherein have the light path change device respectively, and by this light path change device, are arranged to have different angles with respect to speculum.

15., it is characterized in that according to each described electronic element installation device in the claim 1 to 9:

Have a plurality of above-mentioned heads,

Corresponding to the both sides of 2 set above-mentioned camera heads of at least 2 adjacent head wherein, have the lighting device that electronic component and mark to pairing head throw light on respectively,

When the side in the above-mentioned adjacent camera head was in the state that extinguishes lighting device, the opposing party then lighted lighting device.

16. an electronic element installation device is characterized in that comprising:

The printed circuit board (PCB) carrying device of conveyance printed circuit board (PCB);

When keeping electronic component and moving, the head of this electronic component is installed with respect to above-mentioned printed circuit board (PCB);

The mark that is arranged on the above-mentioned head, moves with this head;

Be used to obtain the speculum of the mirror image of the mirror image of above-mentioned mark and above-mentioned electronic component;

Constitute by line sensor, obtain the line camera head partly of the image of mark and electronic component;

Change the rotating mechanism of the mirror angle of above-mentioned speculum;

Detect the rotation angle detecting device of position deviation of the rotational angle of above-mentioned minute surface;

By controlling above-mentioned rotating mechanism it is rotated, make camera head obtain the line control device partly of the image of captured mark of above-mentioned camera head and electronic component continuously; And

Detect the position of electronic component according to the information of the line part of the image of the above-mentioned electronic component of continuous acquisition, and detect the position of mark according to the information of the line part of the image of above-mentioned mark, revise the reflection error of the position of relevant head, and go out the checkout gear of electronic component with respect to the position deviation of head according to the position of above-mentioned detected electronic component and the position probing of revised head.

Images