CN1753611A - Electronic component assembly device - Google Patents

Abstract

To provide an electronic component mounting apparatus capable of more precisely mounting and identifying electronic components. The electronic component mounting apparatus images each reference mark by an imaging means to calculate a predetermined correction amount from a displacement amount between the image position of the imaged reference mark and the proper imaging position of a predetermined reference mark. The electronic component mounting apparatus comprises a detection means 133 for detecting the temperature of a measurement jig 130; a thermoregulator 132 for regulating the temperature of the measurement jig; and a control means 10 for controlling the thermoregulator based on a detection signal from the detection means, and when the imaging means images the reference mark, the measurement jig is controlled to be set at a predetermined temperature.

Description

Device for assembling electronic device

Technical field

The present invention relates to being arranged on suction nozzle attract electrons parts on the installation head, the device for assembling electronic device of assembling on substrate particularly relates to and uses the measured material of having printed reference mark, when calculating component-assembled and the device of the correcting value during component identification.

Background technology

So far, proposed electronic unit is assembled in device for assembling electronic device on the substrate.In these devices, use the measured material of the glass printed reference mark, when calculating component-assembled and the correcting value during component identification.

In addition, open in the device for assembling electronic device of flat 8-16787 (patent documentation 1), will be configured on the assembling operation position with plate with the measurement of a plurality of reference marks, with each reference mark of camera the spy.And, based on the corresponding error information of a plurality of reference marks of surrounding the target installation site, carry out the correction of the target installation site of electronic unit.

[patent documentation 1] spy opens flat 8-16787

But, because the device for assembling electronic device of above-mentionedpatent documentation 1 etc. are not measured the temperature treatment with plate, when the kludge temperature inside changes, measure and thermal expansion also takes place with plate, produce small error.

Recently, the miniaturization of parts further makes progress, and so far, the measurement of being let slip also becomes and can not ignore with the small error of plate.

Summary of the invention

The present invention carries out in order to address the above problem, its purpose is: provide can prevent to change the slight error that the measured material of using plate is measured in the conduct that causes by the kludge temperature inside, carry out the device for assembling electronic device of more high-precision component-assembled and component identification.

In order to solve above-mentioned problem, the described invention in the 1st aspect is equipped with:

Absorption is assembled in the suction nozzle (111) of the electronic unit on the substrate;

Keep said suction nozzle, the installation head that along continuous straight runs moves (110);

The glass measured material (130,140) of having a plurality of reference marks from the teeth outwards; And

With above-mentioned measured material arranged opposite, take the shooting member (111,112,125) of said reference mark.

And, utilizing above-mentioned each reference mark of above-mentioned shooting member shooting, calculate according to the side-play amount of the appropriate camera position of the picture position of the said reference mark that photographs and predefined reference mark in the device for assembling electronic device of correcting value of regulation, be equipped with:

Detect the temperature detection member (133,146) of the temperature of above-mentioned measured material;

Regulate the thermoregulator (132,147) of the temperature of above-mentioned measured material; And

Based on detection signal from the said temperature detection means, the control member (10) of control said temperature adjuster,

When above-mentioned shooting member is taken the said reference mark, above-mentioned measured material is controlled the temperature that makes it to reach regulation.When the correcting value of so-called regulation means component-assembled and the correcting value during component identification.

The described invention in the 2nd aspect is provided with said temperature detection means and said temperature adjuster and above-mentioned measured material aspect the 1st in the described device for assembling electronic device integratedly.The so-called setting is meant said temperature detection means and thermoregulator is attached on the above-mentioned measured material that the heater wire that perhaps will constitute the said temperature adjuster is built in the measured material integratedly.

Invention according to the 1st aspect, when above-mentioned shooting member is taken the said reference mark, because above-mentioned measured material is controlled the temperature that makes it to reach regulation, thereby the not influence of expanded by heating of measured material, so can carry out that parts are installed and the calculating of correcting value during component identification with higher precision.

According to the described invention in the 2nd aspect, because with temperature detection member and thermoregulator and measured material integrated setting, so moving freely of measured material can be shortened the activity duration.

Description of drawings

Fig. 1 is the perspective view of the device for assembling electronic device of embodiment of the present invention.

Fig. 2 is the vertical view of the X-Y stand announced in Fig. 1.

Fig. 3 is the vertical view as the measured material of the mark display part of announcing in Fig. 1.

Fig. 4 is the block diagram of the control system of expression device for assembling electronic device.

Fig. 5 is the key diagram that (Z-direction) observes the X-Y stand from the top.

Fig. 6 is the key diagram that (Y direction) observes the X-Y stand from the place ahead.

Fig. 7 is the key diagram of expression to the coordinate system of each reference mark expansion of measured material.

The key diagram of the side-play amount of Fig. 8 reference mark that to be expression photograph from the camera center position in when shooting.

Fig. 9 is the key diagram that is illustrated in the checking list T that uses in the various corrections.

Figure 10 is each camera and the configuration of each suction nozzle and the key diagram of distance relation separately in the expression installation head.

Figure 11 is a chart of representing respectively each reference mark with the relation of the camera position side-play amount of the X-direction that in this reference mark produce corresponding with 2 cameras.

Figure 12 is the key diagram of the corresponding relation of each camera of expression and each suction nozzle and reference mark.

Figure 13 is the key diagram that is used for obtaining according to the position of 2 cameras the position offset that produces at suction nozzle.

Figure 14 is the key diagram of the corresponding relation of expression the 1st camera and each suction nozzle and reference mark.

Figure 15 is the front view of other measured material.

Wherein:

111: suction nozzle; 110: installation head; 130: measured material; 140: measured material; 112: the 1 cameras (shooting member); 113: the 2 cameras (shooting member); 125: component identification camera (shooting member); 133: glass fixture temperature sensor (detection means); 146: glass fixture temperature sensor (detection means); 132: thermoregulator: 147: thermoregulator: 10: control member

Embodiment

Based on Fig. 1 to Figure 15, embodiments of the present invention are described.

Device for assembling electronic device 100 is the devices that carry out the assembling of various electronic units on substrate, as shown in Figure 1, possesses: the machine frame 104 that supports each structure of aftermentioned; A plurality of electronic unit feed appliances 101 of the electronic unit that supply is to be assembled (in Fig. 1, only represented a feed appliance, and in fact, along a plurality of feed appliances of alignment arrangements on the X-direction described later); Feed appliance accumulator 102 with a plurality of electronic unit feed appliances 101 arrangements and maintenance; The substrate that transports substrate on constant direction transports member 103; Transport path substrate midway and carry out the substrate in batch holding position that the electronic unit assembling operation is used being arranged on substrate that this substrate transports member 103; Keep loading and unloading a plurality ofsuction nozzles 111 freely, the assembledhead 110 of carrying out the maintenance of electronic unit; As assembledhead 110 is driven theX-Y stand 120 that is transported to the locational arbitrarily installation head mobile member in the prescribed limit; And the control member 10 that carries out the work control of above-mentioned each structure.

Have again, in the following description, will be along the mutually orthogonal direction of horizontal plane as X-direction, as Y direction, direction is called Z-direction vertically with other direction.

(substrate transports member)

Substrate transports member 103 outfits does not have illustrated moving belt, transports substrate by this moving belt along X-direction.

In addition, as mentioned above, the substrate that transports member 103 at substrate transports in the way in path, is provided with electronic unit is assembled into substrate in batch holding position on the substrate.Substrate transports member 103 to be stopped when substrate is transported to the substrate in batch holding position, does not carry out the maintenance of substrate by there being illustrated maintaining body.That is to say, at the assembling operation that by maintaining body substrate has been carried out carrying out under the state that keeps stable electronic unit.

Have again, because main in the present embodiment explanation and the relevant technology of position correction that is used for thesuction nozzle 111 of substrate in batch electronic parts, therefore in Fig. 1, illustrate the state that the measured material 130 that will use by maintaining body remains on the substrate in batch holding position in this position correction.

(electronic unit feed appliance)

Feed appliance accumulator 102 is equipped with a plurality of pars along X-Y plane, on this par, enumerates a plurality of electronic unit feed appliances 101 along X-direction and equips with mounting.

In addition, be equipped with linking part on the X-Y plane that feed appliance accumulator 102 joins along the leading section with each electronic unit feed appliance 101, the direction of enumerating at this linking part upper edge electronic unit feed appliance 101 is provided with a plurality of location holes (diagram slightly), and the mosaic process that is arranged on the leading section of electronic unit feed appliance 101 is inserted in these location holes.

And then, on each electronic unit feed appliance 101, be equipped with the bolt lock mechanism that carries out clamping with elastic force, by outboard end in the par that makes feed appliance accumulator 102 and bolt lock mechanism engagement, keep that above-mentioned mosaic process is inserted into state in the location hole, this electronic unit feed appliance 101 can be fixed with desirable attitude feed appliance accumulator 102.

Electronic unit feed appliance 101 the rearward end side keep around on enclosed the control tep reel of the control band of countless electronic units with even interval, simultaneously, near leading section, form the electronic unit junction that electronic unit is provided to installation head 110.And, under the state that is installed on the feed appliance accumulator 102, control band to the transporting of the junction of electronic unit, in this junction,oriented installation head 110 is carried out the supply of electronic unit.

(X-Y stand)

Fig. 2 is the vertical view of X-Y stand 120.As shown in Figure 2, have: 2 Y-axis guide rails 122 of being equipped by mounting abreast with this upper surface of the machine frame 104 that its upper surface is parallel with X-Y plane as Y-axis guiding; To be erected at the supportedX-axis guide rail 121 of state on these 2 Y-axis guide rails 122, makeinstallation head 110 alonginstallation head 110 is moved on the X-direction of Y direction guiding with thisX-axis guide rail 121 as the X-axis guiding.And, be equipped with X-axis motor 123 and the Y-axis motor 124 thatinstallation head 110 is moved by X-axisguide rail 121 in Y direction as drive source as its drive source.And, by the driving of each motor 123,124, can transportinstallation head 110 in the almost whole zone between 2 Y-axis guide rails 122.

In addition, according to the needs of electronic unit assembling operation, above-mentioned feed appliance accumulator 102, substrate in batch holding position 104 all are configured in the zone that can transport ofinstallation head 110 ofX-Y stand 120.

Above-mentioned Y-axis guide rail 122 supports the both ends ofX-axis guide rail 121 respectively all along the Y direction configuration by line slideway.In view of the above,X-axis guide rail 121 can be slided along Y direction.

In addition, Y-axis motor 124 can makeX-axis guide rail 121 along Y direction running fix by well-known transmission mechanism (conveyer mechanism, ball screw framework etc.).

Above-mentionedX-axis guide rail 121 supportsinstallation head 110 along the X-direction configuration by line slideway.In view of the above,installation head 110 can be slided along X-direction.

In addition, X-axis motor 123 can makeinstallation head 110 along X-direction running fix by well-known transmission mechanism (conveyer mechanism, ball screw framework etc.).

Have again, each motor 123,124 is not respectively by there being illustrated detection means to detect its rotation amount, and output to control member 10, and make it become desirable rotation amount by control, carry out the location ofsuction nozzle 111 and the described later the 1st and the 2nd camera 112,113 byinstallation head 110.

In addition, each motor 123,124 also can not be a revolvingly driven type and use linear motor.

(installation head)

As shown in Figure 2,installation head 110 is provided with: 4suction nozzles 111 that attract to keep electronic unit at its leading section by air; Z axle motor 114 (with reference to Fig. 4) as the drive source that these suction nozzles are driven on Z-direction; And to make bysuction nozzle 111 maintained electronic unit be the turning motor 115 (with reference to Fig. 4) as rotary driving source that the center rotation drives with the Z-direction.

Eachsuction nozzle 111 is arranged along X-direction and is mounted 110 support, separately so that its long side direction is supported along the state of Z-direction.

In addition, eachsuction nozzle 111 is connected with source of negative pressure, by the attraction of bleeding in the leading section of thissuction nozzle 111, carries out the absorption and the maintenance of electronic unit.

That is to say, by these structures, when carrying out assembling operation, leading section atsuction nozzle 111, from the electronic unit feed appliance 101 attract electrons parts of regulation, byinstallation head 110mobile suction nozzle 111 is descended to substrate in the position of regulation, simultaneously, makesuction nozzle 111 rotations, one side is carried out the direction adjustment of electronic unit and is simultaneously carried out assembling operation.

First and second eachsuction nozzle 111 of camera 112,113 clampings is configured in respectively on the X-direction both ends in the installation head 110.And each camera 112,113 to be positioned at the state on the assigned position, is used to carry out the specifically labelled shooting to original point position of substrate byX-Y stand 120 so that its optical axis towards the state of Z-direction, is assembled on the installation head 110.In addition, for eachsuction nozzle 111 location, use be used fordiscerning installation head 110 below the various shootings of state.And then, also use shooting in the measured material 130 of the position correction that is used forsuction nozzle 111 described later.

Fixing component identification camera 125 on machine frame 104 as the shooting member.Component identification camera 125 its optical axises dispose along Z-direction, can take the object of top.And, behindsuction nozzle 111 attract electrons parts, wheninstallation head 110 is mobile on component identification camera 125, makes a video recording and carry out the identification of component shape.In addition, aftersuction nozzle 111 had adsorbed measured material shown in Figure 15 140,125 pairs of these measured material of component identification camera were made a video recording and are discerned.

(measured material)

Fig. 3 is the vertical view of measured material 130 of display part of serving as a mark.This measured material 130 only when the preparation work of the position correction of carrying out suction nozzle 111 (details aftermentioned) just be assembled on the substrate in batch holding position that substrate transports member 103, when the assembling operation of electronic unit, be removed.

Measured material 130 portion in the central shows reference mark M1～Mn along straight line with uniform interval.Though wish this each reference mark M1～Mn with high accuracy more along linear array, form precision according to it and can produce some skews strictly speaking.Therefore, carry out the accurate measurement of each position of each reference mark M1～Mn in advance with three-dimensional measuring apparatus, obtain relative position relation in advance.Promptly, reference mark M1 with end is an initial point, obtain with the straight line of the reference mark M1, the Mn that link two ends coordinate data by above-mentioned measurement, prepare as the status data that can in the processing of control member 10, use as a reference axis of rectangular coordinate system.But, if specific temperature is then printed this reference mark M1～Mn with best precision.For example, when Celsius 35 spend, make making reference mark at interval near 5.000mm.

In addition, at the bottom of measured material 130 bonding configuration heating base plate 131, make it to stick on the measured material lower surface.On this heating base plate 131, built-in temperature adjuster 132 and glass fixture temperature sensor 133 as the temperature detection member.The test side of glass fixture temperature sensor 133 contacts with the measured material of glass 130.Like this, thermoregulator 132 and glass fixture temperature sensor 133 and measured material 130 integrated configurations.

In addition, be under the situation of black at heating base plate 131, when reference mark is printed as silver color, the clean cut of reference mark, identification easily.

Have again, when measured material 130 is used at it, be assembled on the substrate in batch holding position that substrate transports member 103, make the row of each reference mark M1～Mn generally along X-direction.In addition, when mounted, the length of the row of each the reference mark M1～Mn on the X-direction is set to such length: can both include the scope that substrate is carried out the scope of the assembling of electronic unit, carries out the reception of electronic unit from each electronic unit feed appliance 101 at X-direction, and component identification camera 125.That is to say that measured material 130 is used for the correction of the position of the location of carrying out eachsuction nozzle 111, thereby need include at X-direction can be with all positions ofsuction nozzle 111 location.

(control member)

Fig. 4 is the block diagram of the control system of expression device for assembling electronic device 100.As shown in Figure 4, control member 10 mainly is connected with following parts: the X-axis motor 123 ofX-Y stand 120; Y-axis motor 124; Oninstallation head 110, carry out the Z axle motor 114 (in fact, be to be arranged on individually on eachsuction nozzle 111, in Fig. 4, only illustrate) of the lifting of eachsuction nozzle 111; Carry out the turning motor 115 (in fact, be to be arranged on individually on eachsuction nozzle 111, in Fig. 4, only illustrate) of the rotation ofsuction nozzle 111; And the thermoregulator heater formula thermoregulator 132 that carries out measured material 130.In addition, in control member 10, also connect the glass fixture temperature sensor 133 of the temperature of measuring the glass measured material.Based on detection signal from this glass fixture temperature sensor 133, the output of control member 10 control thermoregulators 132.

In addition, control member 10 is arranged on the work control offirst camera 112 on theinstallation head 110 andsecond camera 113, simultaneously, utilizes the temperature sensor 106 that is arranged on theX-Y stand 120, carries out the detection of the operating ambient temperature ofX-Y stand 120.

And control member 10 has: control program is according to the rules carried out the CPU11 of various processing and control; Storage is used to carry out the system ROM12 of the program of various processing and control; Become the RAM13 of the operation area of various processing by store various kinds of data; Realize the I/F that is connected (interface) 14 of CPU11 and various device; The guidance panel 15 that is used to the input carrying out various settings and operate necessary data; The data that are used to carry out various processing and control have been stored, for example the nonvolatile memory 17 that constitutes by EEPROM etc.; And the display monitor 18 that shows the content of various settings and check result described later etc.In addition, above-mentioned each motor 114,115,123,124 is not connected with I/F14 by there being illustrated motor driver with thermoregulator 132, glass fixture temperature sensor 133.

In above-mentioned memory 17, each electronic unit of storage representation is to the assembling position coordinate data of the assembling position of substrate and the position coordinate data of the receiving position of the electronic unit of representing assemble.

And, when substrate being remained on substrate when transporting on the substrate in batch holding position of member 103, CPU11 assembly program according to the rules carries outinstallation head 110 is moved on the predefined position, takes the work control of the fiducial value mark of substrate with any camera 112,113.And then, CPU11 calculates the origin position of substrate according to photographed images, obtain the position coordinates of this origin position in the coordinate system of device for assembling electronic device 100, simultaneously, each position coordinate data that is stored in the assembling position in the memory 17 is transformed into the coordinate system of device for assembling electronic device 100.And CPU11 drives X-axis motor 123 and Y-axis motor 124 with the driving amount of regulation, and the suction nozzle on theinstallation head 110 111 is positioned on each assembling position, carries out the assembling operation of electronic unit successively.

In addition, when the reception of carrying out electronic unit and assembling, CPU11 carries out the work control of Z axle motor 114, carries out the leading section ofsuction nozzle 111 is adjusted to the control of suitable height.

And then, though in Fig. 1 diagram not, on the assigned position in the movable range of the uppersurface installation head 110 of machine frame 104, be provided with and take the component identification camera 125 that remains on the electronic unit on eachsuction nozzle 111 towards the top from the below.This component identification camera 125 is taken the electronic unit that remains on thesuction nozzle 111 from the below, output in the control member 10.

In contrast, before electronic unit receives the back assembling, CPU11 withsuction nozzle 111 be positioned at component identification camera 125 directly over, carry out the shooting of electronic unit by component identification camera 125, obtain the direction of electronic unit according to photographed images, simultaneously, carry out the drive controlling of turning motor 115, make it to become appropriate direction.

(reason of the offset of suction nozzle)

Based on Fig. 5 and Fig. 6, the occurrence cause of the position error ofsuction nozzle 111 is described here.

The problem ofX-Y stand 120 at first, is described.Fig. 5 is the key diagram that (Z-direction) observes X-Y stand 120 from the top, and Fig. 6 is the key diagram that (Y direction) observes X-Y stand 120 from the place ahead.

BecauseX-axis guide rail 121 carries out in order to make its material light weight, using aluminium alloy to the moving of Y direction.On the other hand, because machine frame 104 and Y-axis guide rail 122 use iron and ferroalloy, along with the rising of the ambient temperature around the device for assembling electronic device 100, because the difference of the coefficient of thermal expansion of each one often produces the bending to Y direction as shown in Figure 5 onX-axis guide rail 121.

Wheninstallation head 110 moved along theX-axis guide rail 121 that has produced such bending, Δ Y as shown in Figure 5 was such, and in each position of X-direction, the mouth position produces offset to Y direction.

In addition, according to the weight of reason same as described above andinstallation head 110, onX-axis guide rail 121, often produce bending as shown in Figure 6 to Z-direction.Wheninstallation head 110 moves along theX-axis guide rail 121 that has produced such bending, as shown in Figure 6θ 1, θ 2 are such, and in each position of X-direction, the mouth position produces angular deflection from vertical direction, consequently, the front position ofsuction nozzle 111 is offset the X-direction occurrence positions.

In addition, because the crooked situation ofX-axis guide rail 121 changes because of the environment for use temperature of device for assembling electronic device 100, obtain side-play amount in advance and finish at the preliminary stage that begins to assemble that to proofread and correct be difficult.And then, because variations intemperature installation head 110 expands in X-direction, often produce offset.

In order to suppress so various skews, carry out the whole bag of tricks shown below.

(temperature treatment of measured material)

At first, behind the engaging means power supply, measured material 130 is arranged on the substrate in batch holding position.

Control member 10 detects the temperature of measured material 130, based on this detection signal, and control thermoregulator 132.

For example,, calculating correcting value described later (checking list) before, connecting power supply, temperature is risen to till the design temperature, keeping this temperature with thermoregulator as the heating base plate of heater if design temperature is 35 degree Celsius.In this state, carry out the calculating of correcting value.

(making of the checking list that in various corrections, uses)

Based on Fig. 7 to Fig. 9, illustrate that the making of the checking list T that uses is handled in various corrections.Fig. 7 is the key diagram of expression to the coordinate system of each reference mark M1～Mn expansion of measured material 130, the key diagram of the side-play amount of Fig. 8 reference mark M1～Mn that to be expression photograph from the camera center position in when shooting, Fig. 9 is the key diagram that is illustrated in the checking list T that uses in the various corrections.This processing is to carry out before the assembling operation of electronic unit in advance.

[1] at first, when measured material 130 is installed in substrate when transporting on the substrate in batch holding position of member 103, CPU11 treatment for correcting program according to the rules carries out the1st camera 112 ofinstallation head 110 is positioned on the approximate location, and shooting is positioned at the work control of the reference mark M1 and the Mn at two ends.

[2] and, CPU11 discerns their accurate position according to the side-play amount of each reference mark M1, Mn and camera center position, forming with reference mark M1 is initial point, is the X-Y coordinate system of X-axis with the straight line of concatenating group quasi-mark M1 and Mn.

[3] and then, the coordinate data that CPU11 will represent to be stored in advance the relative position relation of each the reference mark M1～Mn in the memory 17 is transformed into above-mentioned X-Y coordinate system, as (X1, Y1) among the checking list T, (X2, Y2), (X3, Y3) ... (Xn, Yn) is stored among the RAM13.Have, owing to be initial point with reference mark M1, reference mark M1 and Mn are positioned on the X-axis again, so X1=0, Y1=0, Yn=0.

[4] then, CPU11 based on the position coordinate data (X1, Y1) of above-mentioned each reference mark M1～Mn, (X2, Y2), (X3, Y3) ... (Xn, Yn) carries outfirst camera 112 is positioned at the work control of making a video recording among each reference mark M1～Mn.

[5] and then, CPU11 calculates the side-play amount (with reference to Fig. 8) of each reference mark M1～Mn and camera center position C respectively from the photographs of each reference mark M1～Mn by X component and Y component, as (XL1, YL1) among the checking list T, (XL2, YL2), (XL3, YL3) ... (XLn, YLn) is stored among the RAM13.

That is to say, if inX-axis guide rail 121, do not produce the perfect condition of warpage, then (XL1, YL1), (XL2, YL2), (XL3, YL3) ... (XLn, YLn) is (0,0), but with the warpage ofX-axis guide rail 121, the expansion ofinstallation head 110 etc. is reason, the position offset that produces infirst camera 112 ininstallation head 110 be represented as (XL1, YL1) ... (XLn, YLn).

[6] then, CPU11 based on the position coordinate data (X1, Y1) of above-mentioned each reference mark M1～Mn, (X2, Y2), (X3, Y3) ... (Xn, Yn) carries outsecond camera 113 is positioned at the work control of making a video recording on each reference mark M1～Mn.

[7] and then, with the situation offirst camera 112 similarly, under the situation ofsecond camera 113, CPU11 also calculates the side-play amount of the X-Y of each reference mark M1～Mn, as (XR1, YR1) among the checking list T, (XR2, YR2), (XR3, YR3) ... (XRn, YRn) is stored among the RAM13.

In view of the above, the position offset that produces insecond camera 113 ininstallation head 110 be represented as (XR1, YR1) ... (XRn, YRn).

[8] and then, CPU11 carries out the processing of above-mentioned [1]～[7] in the temperature of each regulation (for example, every 1 degree Celsius), obtains checking list T in each temperature.In order to obtain checking list T in each temperature, though also can in device, temperature adjusting member be set, but in the present embodiment, after main power source is connected, CPU11 carries out the warming up ofX-Y stand 120, carries out work control, the detected temperatures of monitor temperature sensor 106 with this, the every rising oftemperature 1 degree is all carried out [1]～processing of [7].

(to the flexible treatment for correcting of installation head)

Use is at the obtained checking list T of each temperature, and calculating with flexible in theinstallation head 110 that causes because of variations in temperature isdistance D 0 between the camera center offirst camera 112 of reason andsecond camera 113,distance D 1 from the camera center offirst camera 112 to the mouth center offirst suction nozzle 111a, distance D 2 from the mouth center of camera center to thesecond suction nozzle 111b offirst camera 112, distance D 3 from the mouth center of threesuction nozzle 111c of camera center to the offirst camera 112, the variation delta D0 that each produced～Δ D4 from the distance D 4 at the mouth center of foursuction nozzle 111d of camera center to the of first camera 112.And, based on Figure 10 this processing is described.Figure 10 is each camera 112,113 of expression in theinstallation head 110 and the key diagram of the relation of the configuration of eachsuction nozzle 111a～111d anddistance D 0～D4 separately.

[1] at first, be prerequisite with micrometric measurement in advance in memory 17 and the initial value of storing eachdistance D 0～D4.In addition, the measurement of eachdistance D 0～D4 preferably uses the same method under the environment identical with the measurement of each reference mark M1～Mn in the measured material 130 and obtains.

And, obtaining under the situation of the variable quantity of above-mentioned eachdistance D 0～D4 under a certain temperature, CPU11 treatment for correcting program according to the rules, select group { M1, M (α+1) }, { M2, M (α+2) }, { M3, M (α+3) } of 2 reference marks of (perhaps approaching the most distance D 0) distance that equalsdistance D 0 ... processing (wherein, the interval of each reference mark of α=D0/).

Have, the number of the reference mark group of selecting is arbitrarily, according to predefined number again.Minimum one group also passable.

[2] and, CPU11 is from the checking list T of target temperature, read the offset X L1 of the X component offirst camera 112 among offset X R (α+1) and the opposing party's of group the reference mark M1 of X component ofsecond camera 113 among a side's of group the reference mark M (α+1), calculate their difference.That is, carry out the computing that right component from the chart of Figure 11 cuts the amount of parting on the left side.

Have again, all reference mark groups of selecting are all carried out above-mentioned computing.The difference that each batch total is calculated all is equivalent to the variation delta D0 of the distance between centers of each camera 112,113.

[3] and, CPU11 is to a plurality of averaging of variation delta D0 computing of the distance between centers of each camera 112,113 of calculating.And then the variation delta D0 of resulting equalization be multiply by ratio D1/D0 at interval calculate Δ D1.In addition, similarly calculate other variation delta D2, Δ D3, Δ D4 (calculating the side-play amount of the X-direction of eachmouth 111a～111d according to the relative position relation of each camera 112,113 and eachmouth 111a～111d).

Like this, obtain the variation delta D0～Δ D4 under a certain temperature, and then, calculate at needs under the situation of the distance D 0 '～D4 ' under the uniform temp, carry out deducting the computing of Δ D0～Δ D4 from D0～D4.

Have again, also can calculate variation delta D0～Δ D4 to each thermometer, be stored in advance in the memory 17 as the variation scale that is illustrated in variation delta D0～Δ D4 at each temperature in the moment of obtaining at each temperature checking list T.In addition, whenever necessary, also can only calculate the processing of variation delta D0～Δ D4 to the temperature of necessity at every turn.

(to the treatment for correcting of the Y direction warpage of X-axis guide rail)

Based on Figure 12 and Figure 13, illustrate to result from the treatment for correcting of the Y component in the location ofsuction nozzle 111 of Y direction warpage of X-axis guide rail 121.Figure 12 is the key diagram of the corresponding relation of each camera 112,113 of expression and eachsuction nozzle 111 and reference mark M1～Mn, and Figure 13 is the key diagram that is used for obtaining according to the position of two cameras 112,113 position offset that produces atsuction nozzle 111a.

When the assembling operation of the electronic unit of reality, when being positioned, the receiving position of 111 pairs of electronic units of each suction nozzle, assembling position, component identification camera 125 etc. carry out this treatment for correcting.

[1] at first, any one suction nozzle (being example with 111a) is positioned under the situation of position coordinates (Xa, Ya) here, CPU11 detects Current Temperatures by the predetermined process program.

[2] then, CPU11 calculates at the X coordinate thatsuction nozzle 111a is positioned at each camera 112,113 under position coordinates (Xa, the Ya) situation.

That is,first camera 112 is calculated Xa-D1, and then, carry out the correction of the correction value delta D1 under the Current Temperatures, calculate the X component of the center offirst camera 112.

Similarly,, Xa+D0-D1 is carried out the correction value delta D1 under the Current Temperatures, the correction of Δ D0, calculate the X component of the center ofsecond camera 113second camera 113.

[3] then, the immediate reference mark Mi of X component offirst camera 112 of selecting the checking list T of CPU11 under detected temperatures and obtaining in above-mentioned [2] reads the Y component YLi of the side-play amount of this reference mark Mi from tableT.Suction nozzle 111a is being positioned under the situation of target location, this YLi value becomes on the position offirst camera 112 in theinstallation head 110 side-play amount of the Y direction that will take place.

Similarly, select the checking list T of CPU11 under detected temperatures that (α+i) reads this reference mark M (the Y component YR of the side-play amount of α+i) (α+i) from table T with the immediate reference mark M of X component ofsecond camera 113 obtained in above-mentioned [2].Suction nozzle 111a is being positioned under the situation of target location, (value of α+i) becomes on the position ofsecond camera 113 in theinstallation head 110 side-play amount of the Y direction that will take place to this YR.

[4] then, CPU11 is according to the side-play amount of the Y direction of each center offirst camera 112 in the installation head of obtaining in above-mentioned [3] 110 andsecond camera 113, based on the relative position relation of each camera 112,113 andsuction nozzle 111a, calculate the Y direction offset Y that insuction nozzle 111a, produces.

That is, as shown in figure 13, can calculate the Y direction offset Y ofsuction nozzle 111a based on its allocation ratio by following formula.

ΔY＝{YR(α+i)-YLi}*{(D1+ΔD1)/(D0+ΔD0)}

[5] and, CPU11 is with the Δ Y that obtains in above-mentioned [4] and Ya addition as the Y component of the target location coordinate ofsuction nozzle 111a, the driving amount of control Y-axis motor 124 makes the Y component of target location coordinate become Ya+ Δ Y.

Have again,,, similarly, also can obtain offset Y by service range D2～D4 and variation delta D2～Δ D4 toother suction nozzle 111b～111d.

(to the treatment for correcting of the Z-direction warpage of X-axis guide rail)

Based on Figure 14, illustrate to result from the treatment for correcting of the X component in the location ofsuction nozzle 111 of Z-direction warpage of X-axis guide rail 121.Figure 14 is the key diagram of the corresponding relation of expressionfirst camera 112 and eachsuction nozzle 111 and reference mark M1～Mn.

When the assembling operation of the electronic unit of reality, when being positioned, the receiving position of 111 pairs of electronic units of each suction nozzle, assembling position, component identification camera 125 etc. carry out this treatment for correcting.That is to say, before and after the treatment for correcting of above-mentioned Y component or simultaneously, carry out abreast.

[1] at first, any one suction nozzle (here being example with 111a) is being positioned under the situation of position coordinates (Xa, Ya), CPU11 handling procedure according to the rules detects Current Temperatures.

[2] then, CPU11 calculates the X coordinate thatsuction nozzle 111a is positioned atfirst camera 112 under the situation of position coordinates (Xa, Ya).

That is,first camera 112 is calculated Xa-D1, and then, carry out the correction of the correction value delta D1 under the Current Temperatures, calculate the X component of the center offirst camera 112.

Have, processing up to now is identical with the treatment for correcting of above-mentioned Y component again.Therefore, seek commonization handled, also can in the treatment for correcting of the treatment for correcting of Y component and X component, separately carry out later processing.

[3] then, CPU11 selects the immediate reference mark Mi of X component with first camera of obtaining 112 in above-mentioned [2] from the checking list T of detected temperatures, reads the X component XLi of the side-play amount of this reference mark Mi from tableT.Suction nozzle 111a is being positioned under the situation of target location, this XLi value becomes on the center offirst camera 112 in theinstallation head 110 side-play amount of the Y direction that will take place.

The offset X Li of the X-direction of thisfirst camera 112 can be similar to the X-direction offset X that produces insuction nozzle 111a.

[4] therefore, CPU11 with the Δ X that obtains in above-mentioned [3] (=XLi) with Xa addition as the X component of the target location coordinate ofsuction nozzle 111a, carry out addition process, make the X component of target location coordinate become Xa+ Δ X.And CPU11 also reflects the offset D1 of X-direction of theflexible suction nozzle 111a that causes of above-mentioned installation head, and the driving amount of control X-axis motor 123 makes it to become Xa+ Δ X+ Δ D1.

Have again,, also can reflect offset X and Δ D2～Δ D4, the driving amount of control X-axis motor 123other suction nozzle 111b～111d.

In addition, employed camera is not limited tofirst camera 112, also can besecond camera 113.

(effect of device for assembling electronic device)

In above-mentioned device for assembling electronic device 100, by take each position coordinates with 2 cameras 112,113 is the known a plurality of reference mark M1～Mn that arranges along X-direction, can obtain approx along the Y direction side-play amount that produces in each position of 2 cameras 112,113 arbitrarily of X-direction.And then, owing to obtain the Y direction side-play amount ofmouth 111, can obtain the attitude ofinstallation head 110 and the site error that the direction change causes more accurately based on the Y direction side-play amount that in 2 ofinstallation head 110, produces.Therefore, by proofreading and correct this error, can carry out the assembling of electronic unit with better precision.

And then, take above-mentioned a plurality of reference mark M1～Mn by usingfirst camera 112 that is arranged on thesame installation head 110 withmouth 111, can obtain the X-direction side-play amount that produces along in the position of camera arbitrarily of X-direction approx.And then, result fromX-axis guide rail 121 under the situation of the warpage of Z-direction in the side-play amount of X-direction, the camera position side-play amount of X-direction can be regarded approx as the side-play amount of the X-direction that in the leading section ofmouth 111, produces.In view of the above, the attitude ofinstallation head 110 and the site error that the direction change causes can be obtained more accurately,, the assembling of electronic unit can be carried out with better precision by proofreading and correct this error.

And then, leaving 2 reference mark Mi, M of equidistance (among the α+i) with 2 cameras 112,113, obtain the X-direction stroke of theinstallation head 110 that between 2 cameras, produces based on the camera position side-play amount that in each camera 112,113, produces, simultaneously, similarly (group of α+i) is obtained several strokes, and averages from a plurality of reference mark Mi, M.Therefore, can more critically obtain the stroke of theinstallation head 110 in the X-direction.

In addition, by carrying out the shooting at each temperature, each temperature is obtained checking list T, the camera position side-play amount that produces in this each temperature can be reflected in the calculating of the calculating of calculating, X-axis side-play amount of Y-axis side-play amount or the distance between the camera in the installation head 110.Therefore, can consider the correction of the various side-play amounts after the Temperature Influence, can carry out assembling with higher precision at each temperature electronic unit.

In addition, when the shooting member is taken reference mark, owing to the temperature that measured material is controlled to regulation, thereby the not influence of expanded by heating of measured material, the calculating of the correcting value in the time of can carrying out component-assembled and component identification with higher precision.

In addition because detection means and thermoregulator and measured material are provided with integratedly, thereby measured material mobile freely, can shorten the activity duration.

The present invention is not limited to above-mentioned execution mode, can carry out various changes.

For example, in the above-described embodiment, use 2 cameras of installation head to calculate side-play amount.Also can replace the calculating of the correcting value when carrying out component-assembled and component identification with 1 camera.For example,, take the reference mark on the face that is dispersed in measured material, obtain the camera position error of each reference mark by being installed in a camera on the installation head.And, when carrying out the assembling of electronic unit, regard the camera position error of reference mark that approaches to assemble the position coordinates of target as in the location that is similar to mouth error, carry out the correction of the camera position margin of error.

In addition, also can easily consider to use measured material shown in Figure 15 140 to replace measured material 130.

Measured material 140 is foursquare glass plates.4 reference marks of printing on except the position of the central portion of outer surface.Mark the 141, the 142nd is used to calculate the mark of the side-play amount of directions X, Y direction, and mark the 143, the 144th calculates the mark of side-play amount of the direction of rotation ofsuction nozzle 111.

Inmeasured material 140, disposeheater wire 145 radially from thecenter.Heater wire 145 is imbedded the measured material inside of glass.In addition, at the sidepiece of measuredmaterial 140, set up temperature sensor 146, thermoregulator 147.And, 145 pairs of connecting portion 149 wirings from thermoregulator 147 towards lead.

With the temperature of temperature sensor 146 detection measured material, based on this testing result, control member 10 control thermoregulators 147 make it to become design temperature.

According to said structure, because temperature sensor 146 and thermoregulator 147 are integrated with measuredmaterial 140, so can make device miniaturization more.

And then in the above-described embodiment, thermoregulator 147 is integrated with measuredmaterial 140, but also can replace thermoregulator 150 is arranged near the component identification camera of machine frame.And the measuredmaterial 140 that remains in theadsorption head 110 contacts with this thermoregulator 150, after making the measured material temperature constant, also can easily consider to carry out the calculating of correcting value.

Claims (2)

Translated fromChinese

1.一种电子部件组装装置，配备：1. An electronic component assembly device, equipped with:吸附组装在基板上的电子部件的吸嘴；Suction nozzles that absorb electronic components assembled on substrates;保持上述吸嘴，沿水平方向移动的安装头；Hold the above-mentioned suction nozzle and move the installation head in the horizontal direction;在表面上附有多个基准标记的玻璃制测量夹具；以及A measuring fixture made of glass with multiple fiducial marks attached to the surface; and与上述测量夹具对置配置，拍摄上述基准标记的摄像构件，an imaging member disposed opposite to the measuring jig to photograph the fiducial mark,利用上述摄像构件拍摄上述各基准标记，根据拍摄到的上述基准标记的图像位置与预先设定的基准标记的恰当摄像位置的偏移量计算出规定的校正量，其特征在于，配备：Utilize the above-mentioned imaging member to photograph each of the above-mentioned fiducial marks, and calculate the specified correction amount according to the offset between the captured image position of the above-mentioned fiducial mark and the proper imaging position of the pre-set fiducial mark, and it is characterized in that it is equipped with:检测上述测量夹具的温度的温度检测构件；a temperature detecting member for detecting the temperature of the measuring jig;调节上述测量夹具的温度的温度调节器；以及a temperature regulator that adjusts the temperature of the above-mentioned measuring jig; and基于来自上述温度检测构件的检测信号，控制上述温度调节器的控制构件，based on a detection signal from the temperature detection means, a control means for controlling the temperature regulator,当上述摄像构件拍摄上述基准标记时，对上述测量夹具进行控制使之达到规定的温度。When the imaging means captures the image of the reference mark, the measurement jig is controlled to have a predetermined temperature.2.如权利要求1所述的电子部件组装装置，其特征在于：2. The electronic component assembly device according to claim 1, characterized in that:将上述温度检测构件和上述温度调节器与上述测量夹具一体化地设置。The above-mentioned temperature detection member and the above-mentioned temperature regulator are provided integrally with the above-mentioned measurement jig.

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