CN1367642A - Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment - Google Patents
Heat-pipe radiating device for heat radiation of microcomputer and electronic equipmentDownload PDFInfo
- Publication number
- CN1367642A CN1367642ACN 01102782CN01102782ACN1367642ACN 1367642 ACN1367642 ACN 1367642ACN 01102782CN01102782CN 01102782CN 01102782 ACN01102782 ACN 01102782ACN 1367642 ACN1367642 ACN 1367642A
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- 230000005855radiationEffects0.000titleclaimsabstractdescription26
- 238000010438heat treatmentMethods0.000claimsabstractdescription21
- 229920006351engineering plasticPolymers0.000claimsabstractdescription9
- 230000008020evaporationEffects0.000claimsdescription68
- 238000001704evaporationMethods0.000claimsdescription68
- 238000009833condensationMethods0.000claimsdescription67
- 230000005494condensationEffects0.000claimsdescription67
- 238000010521absorption reactionMethods0.000claimsdescription20
- 239000002184metalSubstances0.000claimsdescription13
- 238000009434installationMethods0.000claimsdescription11
- 238000009413insulationMethods0.000claimsdescription10
- 238000000034methodMethods0.000claimsdescription9
- 230000002787reinforcementEffects0.000claimsdescription7
- 238000004026adhesive bondingMethods0.000claimsdescription6
- 238000004519manufacturing processMethods0.000claimsdescription5
- 238000000465mouldingMethods0.000claimsdescription3
- 238000005728strengtheningMethods0.000claimsdescription3
- 230000008878couplingEffects0.000claimsdescription2
- 238000010168coupling processMethods0.000claimsdescription2
- 238000005859coupling reactionMethods0.000claimsdescription2
- 239000013536elastomeric materialSubstances0.000claimsdescription2
- 238000007789sealingMethods0.000claimsdescription2
- 238000003466weldingMethods0.000claimsdescription2
- 238000010068moulding (rubber)Methods0.000claims1
- 238000005452bendingMethods0.000abstract1
- 238000002955isolationMethods0.000abstract1
- 230000006978adaptationEffects0.000description1
- 230000009286beneficial effectEffects0.000description1
- 238000010586diagramMethods0.000description1
- 238000005516engineering processMethods0.000description1
- 239000011521glassSubstances0.000description1
- 230000005484gravityEffects0.000description1
- 239000000463materialSubstances0.000description1
- 239000007769metal materialSubstances0.000description1
- 238000010992refluxMethods0.000description1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Affiliated technical field:
The present invention relates to be used for the heat-pipe radiating apparatus of microcomputer and electronic installation heat radiation, heat that especially can the efficient absorption heater element can efficiently distribute the heat-pipe radiating apparatus of this heat simultaneously again.
Background technology:
The at present known heat-pipe radiating apparatus that is used for the electronic installation heat radiation; Comprise gravity reflux formula heat pipe and capillary reverse-flow type heat pipe, its evaporation section, adiabatic section, condensation segment are finished by an isometrical body.Can't effectively the fit heating face of electronic component of evaporation section, condensation segment can't large tracts of land paste touch radiating surface, and existing heat-pipe apparatus is by rigid material such as metal, glass, be difficult for adapting to electronics by dress with safeguard.
The purpose of invention:
The purpose of this invention is to provide a kind of heat-pipe radiating apparatus, it can effectively paste the heating face of electric shock sub-element, makes evaporation section fast Absorption heat, and the condensation chamber with an increased area, and heat is distributed fast.
The heat-pipe radiating apparatus that the present invention also provides a kind of 40-100 of adaptation ℃ of temperature heat radiation to require; The soft heat-pipe apparatus that its adiabatic section body is made by engineering plastics or rubber, it can crookedly within the specific limits be installed, and is convenient to installing/dismounting and safeguards, has reduced installation difficulty.Technical scheme:
The object of the present invention is achieved like this: the heat-pipe radiating apparatus that is used for the heat radiation of microcomputer and electronic installation, the evaporation section, adiabatic section, capillary absorbed layer, condensation segment and the heat-conducting work medium that comprise traditional heat pipe, it is characterized in that: the condensation chamber that the condensation segment of heat pipe is made an increased area, the condensation chamber surface has an increased area heat-conducting plate at least, this heat-conducting plate is used for subsides and touches fin, the evaporation section of heat pipe is provided with the evaporation cavity of increased area, and the evaporation cavity outer surface is provided with suitable maximum area subsides and touches in the heat carrier on heater element surface.
A kind of heat-pipe apparatus that is used for electronic element radiating, the housing, evaporation section, adiabatic section, capillary absorbed layer, condensation segment and the heat-conducting work medium that comprise heat pipe, it is characterized in that: the condensation segment of this heat pipe has the condensation chamber of an increased area, there is the heat-conducting plate of an increased area on the condensation chamber surface, this heat-conducting plate is used for subsides and touches fin, the adiabatic section body of heat pipe is engineering plastics or elastomeric material manufacturing, is flexible hose body.The evaporation section of heat pipe is provided with the evaporation cavity of increased area, and the evaporation cavity outer surface is provided with suitable maximum area subsides and touches in the heat carrier on heater element surface.Beneficial effect:
Owing to adopt such scheme, can make more effective absorption of heat-pipe apparatus and the heat that distributes electronic component, owing to adopt soft body to make the installation of heat pipe very convenient.
The drawing explanation:
Fig. 1 is that the present invention uses installation diagram.
Fig. 1 a is a heat-pipe radiating apparatus end view among Fig. 1.
Fig. 2 is the evaporation section external form that is applied to the electric device in heating hole.
Fig. 3 is heat carrier and the evaporation section that is applied to the column type heat-generating electronic elements.
Fig. 3 a is the end view of Fig. 3.
Fig. 4 is heat carrier and the evaporation section that is applied to the square heat-generating electronic elements.
Fig. 4 a is the end view of Fig. 4.
Fig. 5 is heat pipe for thermal conductivity body and the evaporation section that is applied to have the vertical heat transfer plate.
Fig. 5 a is the end view of Fig. 5.
Fig. 6 is the evaporation cavity that has metal conducting strip
Fig. 7 is the heat-pipe radiating apparatus figure that is made of soft body.
Fig. 7 a is the exploded view of soft heat-pipe radiating apparatus.
Fig. 8 is the connection figure of soft heat-pipe apparatus and other shape heat carrier and evaporation cavity.
Embodiment 1:(sees Fig. 1, Fig. 1 a)
A kind of suitable large-area planar mounts the heat-pipe radiating apparatus that heat-generating electronic elements dispels the heat, by strengthening support 3, insulatedthermal insulating layer 4,body 5, heat radiation heat-conducting plate 6, condensation chamber 7 in heat absorption conductive plate 1, evaporation cavity 2, the chamber, strengthen support 8, process duct 9, constituting.
Electronics casing (12), heat insulation support (11), fin (10) are installed example with the application that hot pipe assembly has been expressed this device.
Its condensation chamber (7) profile is a convex globoidal, inside is cavity, cavity sides is along being integral with the fixed seal connection of heat radiation heat-conducting plate (6), in condensation chamber, be structure as a whole and be provided with several and strengthen support (8) with condensation chamber, it is contour and paste with heat radiation heat-conducting plate (6) inner face and to touch with the condensation chamber opening surface to support (8), be fixed with process duct (9) and condensation chamber conducting on condensation chamber (7) outer wall, process duct is used for heat-pipe apparatus and vacuumizes rearward end and shut.
Its evaporation cavity (2) profile is a convex globoidal, inside is cavity, cavity sides is along being integral with heat absorption conductive plate (1) fixed seal connection, in evaporation cavity, be structure as a whole and be provided with several and strengthen support (3) with evaporation cavity, it is contour and paste with heat absorption conductive plate (1) inner face and to touch with the evaporation cavity opening surface to support (3), holds heat-conducting work medium in the evaporation cavity.
Adiabatic section body (5) two ends are communicated with at cavity outside convex globoidal side integral sealing with condensation chamber (7), evaporation cavity (2) respectively, and adiabatic section body (5) outer wall is enclosed with insulation insulated sheath (4).
Said elements is except that overcoat (4), by the metal manufacturing.
Fig. 1 has expressed the mounting structure when heat-pipe radiating apparatus is applied to electronic installation; Be equipped with on the heat insulation support of heat insulation support (11) at electronics casing (12) outer surface fin (10) is installed, fin (10) outside is provided with the rib of projection, this face is a radiating surface, the plane relative with radiating surface is heating surface, and the outer surface of the heat-conducting plate (7) on the condensation chamber of heat pipe (6) pastes and touches the heating surface that is installed in fin.Heat-conducting plate (1) on the evaporation cavity (2) pastes the heating face that the plane mounts heat-generating electronic elements that is installed in that touches.
Embodiment 2:(sees Fig. 2)
A kind of suitable electronic component has the structures such as its condensation chamber of heat-pipe radiating apparatus, adiabatic section body in heating hole identical with embodiment 1, the evaporation cavity (16) that it is characterized in that him is set to the round type of leaning on, it can be the certainly extension of hot arc body, or being fit to the diameter that the heating hole cooperates, its end shuts the other end and the adiabatic section body is tightly connected.
Embodiment 3 (see figure 3)s
Structures such as its condensation chamber of a kind of heat-pipe radiating apparatus of suitable column type heat-generating electronic elements, adiabatic section body are identical with embodiment 1, and the condensation chamber that it is characterized in that it is that the end that extends in body of adiabatic section body is fixed with and bends to round evaporation cavity heat-conducting plate (13).
Embodiment 4 (see figure 4)s
A kind of heat-pipe radiating apparatus of suitable square heat-generating electronic elements; Its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, it is characterized in that; Its condensation chamber is the evaporation cavity heat-conducting plate (15) that the end that extends in body of adiabatic section body is fixed with effective containing square object.
Embodiment 5 (see figure 5)s
A kind of electronic component that is fit to have the vertical heat transfer plate; Heat-pipe radiating apparatus as high power transistor, its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, it is characterized in that: the external face diameter of extended cavity of its adiabatic section body is to being fixed with heat-conducting plate (14), and heat-conducting plate (14) can paste to touch with the heating panel of high power transistor is in the same place.
Embodiment 6 (see figure 6)s
A kind of heat-pipe radiating apparatus of heat radiation of the electronic component that is suitable for having on the small size circuit board several somes heatings; Its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, and it is characterized in that: its evaporation cavity is the extension or the increased area of adiabatic section body, at the evaporation cavity outer surface; The soft thermal conductive metal plate (17) that different length can be set in the radial-axial and the end of body has touched the metal heat-conducting body by maximum area heat conduction subsides on heater element, heat-conducting metal bar and metal heat-conducting body are overall structure.The extending part of the heat carrier from the condensation chamber to the heater element is provided with insulated thermal insulating layer (4).
Embodiment 7 (sees Fig. 7, Fig. 7 a)
A kind of suitable large-area planar mounts the heat-pipe apparatus of heat-generating electronic elements heat radiation, by strengthening supporting (7-3), body (7-5), heat radiation heat-conducting plate (7-6), condensation chamber (7-7) in heat absorption conductive plate (7-1), evaporation cavity (7-2), the chamber, strengthen supporting (7-8), process duct (7-9), constituting.Fig. 1 installs application drawing and also is fit to present embodiment; Electronics casing (12), heat insulation support (11), fin (10) are installed example with the application that hot pipe assembly can be expressed this device.
Condensation chamber (7-7) profile is a convex globoidal structure, and its concave surface periphery is a labyrinth seam, and heat radiation heat-conducting plate (7-6) is the flat board that a periphery has the convex edge, and the convex edge on the heat radiation heat-conducting plate cooperates the labyrinth seam of condensation chamber concave surface periphery with glued fixing.Condensation chamber (7-7) inside is cavity, cavity wall and cavity are structure as a whole and are provided with several reinforcement supports (7-8), the contour face of reinforcement support (7-8) and condensation chamber touches with the subsides of heat radiation heat-conducting plate 7-6 inner face, gluing is fixed with smithcraft pipe (7-9) and condensation chamber conducting on condensation chamber (7-7) outer wall, and process duct vacuumizes rearward end at heat-pipe apparatus and shuts.
Evaporation cavity 7-2 profile is a convex globoidal structure, and its concave surface periphery is a labyrinth seam, and heat absorption conductive plate 7-1 is the flat board that a periphery has the convex edge, and the convex edge on the heat absorption conductive plate cooperates the labyrinth seam of evaporation cavity concave surface periphery with glued even fixing.Evaporation cavity 7-2 inside is cavity, and cavity wall and cavity are structure as a whole and are provided with several reinforcement supports 7-3, and face that reinforcement support end and evaporation cavity are contour and heat absorption conductive plate 7-1 inner face paste and touch, and hold heat-conducting work medium in the chamber.
The adiabatic section body is by the engineering plastics moulding, the inside pipe wall face have one deck spiral type close around wire 8-2 (see figure 8), be used for the bearing capacity of reinforced hose.Body two ends, adiabatic section respectively with heat-absorbing chamber, condensation chamber, utilize labyrinth fixing structure gluing or ultra-sonic welded.
Fig. 1 has expressed the mounting structure when heat-pipe apparatus is applied to electronic installation; Be equipped with on the heat insulation support of heat insulation support (11) at electronics casing (12) outer surface fin (10) is installed, fin (10) outside is provided with the rib of projection, this face is a radiating surface, the plane relative with radiating surface is heating surface, and the outer surface of the heat radiation heat-conducting plate on the condensation chamber of heat pipe pastes and touches the heating surface that is installed in fin.Heat absorption conductive plate on the evaporation cavity pastes the heating face that the plane mounts heat-generating electronic elements that is installed in that touches.
The heat absorption conductive plate of said elements, heat radiation heat-conducting plate, process duct are metal material, and condensation chamber, evaporation cavity can be by metal or engineering plastics manufacturings.
Embodiment 8 (see figure 8)s
The evaporation cavity of a kind of suitable connection embodiment 2-6 and the heat-pipe apparatus of heat absorption conductive body; Comprise that the adiabatic section body connects the port of evaporation section by embodiment 7 described condensation chamber 7-7, by the flexible adiabatic section body 7-5 of engineering plastics moulding etc.; Be connected with adaptable interface (8-3).The end that adaptable interface connects the adiabatic section body is the labyrinth seam, utilizes labyrinth fixing structure and adiabatic section mouth of pipe gluing.The adaptable interface other end is can fix with glued or welding with the hole of evaporation cavity body external diameter coupling.
Claims (15)
1, the heat-pipe radiating apparatus that is used for microcomputer and electronic installation, the evaporation section, adiabatic section, capillary absorbed layer, condensation segment and the heat-conducting work medium that comprise traditional heat pipe, it is characterized in that: the condensation chamber that the condensation segment of heat pipe is made an increased area, the condensation chamber surface has the heat-conducting plate of an increased area at least, this heat-conducting plate is used for subsides and touches fin, the evaporation section of heat pipe is provided with the evaporation cavity of increased area, and the evaporation cavity outer surface is provided with suitable maximum area subsides and touches in the heat carrier on heater element surface
2, heat-pipe radiating apparatus according to claim 1, it is characterized in that: its condensation chamber (7) profile is a convex globoidal, inside is cavity, cavity sides is along being integral with the fixed seal connection of heat radiation heat-conducting plate (6), in condensation chamber, be structure as a whole and be provided with several and strengthen support (8) with condensation chamber, it is contour and paste with heat radiation heat-conducting plate (6) inner face and to touch with the condensation chamber opening surface to support (8), be fixed with process duct (9) and the conducting of condensation heat chamber on condensation chamber (7) outer wall, process duct is used for heat-pipe apparatus and vacuumizes rearward end and shut.
3, heat-pipe radiating apparatus according to claim 1, it is characterized in that: its evaporation cavity (2) profile is a convex globoidal, inside is cavity, cavity sides is along being integral with heat absorption conductive plate (1) fixed seal connection, in evaporation cavity, be structure as a whole and be provided with several and strengthen support (3) with evaporation cavity, it is contour and paste with heat absorption conductive plate (1) inner face and to touch with the evaporation cavity opening surface to support (3), holds heat-conducting work medium in the evaporation cavity.
4, heat-pipe radiating apparatus according to claim 1, it is characterized in that: adiabatic section body (5) two ends are communicated with at cavity outside convex globoidal side integral sealing with condensation chamber (7), evaporation cavity (2) respectively, and adiabatic section body (5) outer wall is enclosed with insulation insulated sheath (4).
5, heat-pipe radiating apparatus according to claim 1 is characterized in that: said elements is except that overcoat (4), by the metal manufacturing.
6, heat-pipe radiating apparatus according to claim 1, a kind of suitable electronic component has the heat-pipe radiating apparatus in heating hole, its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, it is characterized in that: its evaporation cavity (16) is set to circle and leans on type, it can be the extension of adiabatic section body, or being fit to the diameter that the heating hole cooperates, its end shuts the other end and the adiabatic section body is tightly connected.
7, heat-pipe radiating apparatus according to claim 1, be fit to the square heater, its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, it is characterized in that, are fixedly connected with in the evaporation cavity end can contain or part contains the heat-conducting plate (15) of square heater
8, heat-pipe radiating apparatus according to claim 1, suitable heat-generating electronic elements has heating panel, and its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, and it is characterized in that: evaporation cavity is the extension of adiabatic section body, or the increasing volume, the cavity outside radially is fixed with heat-conducting plate (14).
9, heat-pipe radiating apparatus according to claim 1 has the heat-pipe radiating apparatus of the electronic component of several somes heating on a kind of suitable small size circuit board; Its condensation chamber, adiabatic section pipe structure are identical with embodiment 1, and it is characterized in that: its evaporation cavity is the extension or the increased area of adiabatic section body, at the evaporation cavity outer surface; The soft thermal conductive metal plate (17) that different length can be set in the radial-axial and the end of body, on heater element, touched the metal heat-conducting body by maximum area heat conduction subsides, thermal conductive metal plate and metal heat-conducting body are overall structure, and the extending part that touches from the evaporation cavity to subsides between the heat carrier of heater element is provided with insulated thermal insulating layer (4).
10, a kind of heat-pipe radiating apparatus that is used for electronic element radiating, the housing that comprises heat pipe, evaporation section, the adiabatic section, the capillary absorbed layer, condensation segment and heat-conducting work medium, it is characterized in that: the condensation segment of this heat pipe has the condensation chamber of an increased area, there is the heat-conducting plate of an increased area on the condensation chamber surface, this heat-conducting plate is used for subsides and touches fin, the adiabatic section body of heat pipe is engineering plastics or elastomeric material manufacturing, be flexible hose body, the evaporation section of heat pipe is provided with the evaporation cavity of increased area, and the evaporation cavity outer surface is provided with suitable maximum area subsides and touches in the heat carrier on heater element surface.
11, heat-pipe radiating apparatus according to claim 10, it is characterized in that: condensation chamber 7-7 profile is a convex globoidal structure, its concave surface periphery is a labyrinth seam, heat radiation heat-conducting plate (7-6) is the flat board that a periphery has the convex edge, convex edge on the heat radiation heat-conducting plate cooperates the labyrinth seam of condensation chamber concave surface periphery, with glued fixing.Condensation chamber 7-7 inside is cavity, cavity wall and cavity are structure as a whole and are provided with several reinforcement supports 7-8, strengthening the contour face of support 7-8 and condensation chamber touches with the subsides of heat radiation heat-conducting plate 7-6 inner face, gluing is fixed with smithcraft pipe 7-9 and condensation chamber conducting on the condensation chamber 7-7 outer wall, and process duct vacuumizes rearward end at heat-pipe apparatus and shuts.
12, heat-pipe radiating apparatus according to claim 10, it is characterized in that: evaporation cavity 7-2 profile is a convex globoidal structure, its concave surface periphery is a labyrinth seam, heat absorption conductive plate (7-1) is the flat board that a periphery has the convex edge, convex edge on the heat absorption conductive plate cooperates the labyrinth seam of evaporation cavity concave surface periphery, with glued fixing.Evaporation cavity 7-2 inside is cavity, and cavity wall and cavity are structure as a whole and are provided with several reinforcement supports 7-3, and face that reinforcement support end and evaporation cavity are contour and heat absorption conductive plate 7-1 inner face paste and touch, and hold heat-conducting work medium in the chamber.
13, heat-pipe radiating apparatus according to claim 10, it is characterized in that: the adiabatic section body is by engineering plastics or rubber-moulding, the inside pipe wall face have one deck spiral type close around wire 8-2, body two ends, adiabatic section respectively with heat-absorbing chamber, condensation chamber, utilize labyrinth fixing structure gluing or ultra-sonic welded.
14, heat-pipe radiating apparatus according to claim 10, the evaporation cavity of a kind of suitable connection embodiment 2-6 and the heat-pipe apparatus of heat absorption conductive plate; Comprise by embodiment 7 described condensation chamber 7-7, by flexible adiabatic section body 7-5 of engineering plastics moulding etc., it is characterized in that: the adiabatic section body connects evaporation section by adaptable interface (8-3), the end that adaptable interface connects the adiabatic section body is the labyrinth seam, utilize labyrinth fixing structure and adiabatic section mouth of pipe gluing, the adaptable interface other end is set to can fix with glued or welding with the hole of evaporation cavity body external diameter coupling.
15, according to the described heat-pipe radiating apparatus of claim 1-14, the mounting structure when being applied to electronic installation; It is characterized in that: be equipped with on the heat insulation support of heat insulation support (11) at electronics casing (12) outer surface fin (10) is installed, fin (10) outside is provided with the rib of projection, this face is a radiating surface, the plane relative with radiating surface is heating surface, and the outer surface of the heat radiation heat-conducting plate on the condensation chamber of heat pipe pastes and touches the heating surface that is installed in fin.Heat absorption conductive plate on the evaporation cavity pastes the heating face that is installed in electronic component that touches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01102782CN1367642A (en) | 2001-01-23 | 2001-01-23 | Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01102782CN1367642A (en) | 2001-01-23 | 2001-01-23 | Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1367642Atrue CN1367642A (en) | 2002-09-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01102782PendingCN1367642A (en) | 2001-01-23 | 2001-01-23 | Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment |
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| Country | Link |
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| CN (1) | CN1367642A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7258160B2 (en) | 2002-09-25 | 2007-08-21 | Sony Corporation | Heat transfer element, cooling device and electronic device having the element |
| CN100413061C (en)* | 2004-06-07 | 2008-08-20 | 鸿富锦精密工业（深圳）有限公司 | A kind of heat pipe and its manufacturing method |
| CN101103424B (en)* | 2004-11-16 | 2010-09-29 | Abb研究有限公司 | Insulating tubes for cooling elements that can be loaded with high voltage |
| CN104952818A (en)* | 2015-05-25 | 2015-09-30 | 联想(北京)有限公司 | Heat conducting device and electronic equipment |
| CN106524805A (en)* | 2016-12-02 | 2017-03-22 | 廖忠民 | Conformal vertical heat transfer surface heat pipe radiator |
| CN106604608A (en)* | 2016-12-02 | 2017-04-26 | 廖忠民 | Vertical heat transfer surface heat pipe radiator |
| CN111669938A (en)* | 2020-05-22 | 2020-09-15 | 广州大学 | A flexible heat pipe and its processing method |
- 2001
- 2001-01-23CNCN 01102782patent/CN1367642A/enactivePending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7258160B2 (en) | 2002-09-25 | 2007-08-21 | Sony Corporation | Heat transfer element, cooling device and electronic device having the element |
| CN100413061C (en)* | 2004-06-07 | 2008-08-20 | 鸿富锦精密工业（深圳）有限公司 | A kind of heat pipe and its manufacturing method |
| CN101103424B (en)* | 2004-11-16 | 2010-09-29 | Abb研究有限公司 | Insulating tubes for cooling elements that can be loaded with high voltage |
| CN104952818A (en)* | 2015-05-25 | 2015-09-30 | 联想(北京)有限公司 | Heat conducting device and electronic equipment |
| CN104952818B (en)* | 2015-05-25 | 2018-12-14 | 联想(北京)有限公司 | A kind of heat-transfer device and electronic equipment |
| CN106524805A (en)* | 2016-12-02 | 2017-03-22 | 廖忠民 | Conformal vertical heat transfer surface heat pipe radiator |
| CN106604608A (en)* | 2016-12-02 | 2017-04-26 | 廖忠民 | Vertical heat transfer surface heat pipe radiator |
| CN106524805B (en)* | 2016-12-02 | 2018-12-04 | 廖忠民 | Heat pipe radiator with conformal vertical heat conducting surface |
| CN106604608B (en)* | 2016-12-02 | 2019-04-12 | 廖忠民 | Vertical heat-conducting surface heat pipe radiator |
| CN111669938A (en)* | 2020-05-22 | 2020-09-15 | 广州大学 | A flexible heat pipe and its processing method |
| CN111669938B (en)* | 2020-05-22 | 2025-03-04 | 广州大学 | A processing method for a flexible heat pipe |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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