CN1364053A - Improved package structure and package method of image sensor - Google Patents
Improved package structure and package method of image sensorDownload PDFInfo
- Publication number
- CN1364053A CN1364053ACN01100755ACN01100755ACN1364053ACN 1364053 ACN1364053 ACN 1364053ACN 01100755 ACN01100755 ACN 01100755ACN 01100755 ACN01100755 ACN 01100755ACN 1364053 ACN1364053 ACN 1364053A
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- CN
- China
- Prior art keywords
- circuit board
- image sensor
- flexible circuit
- signal input
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
The present invention relates to a kind of packaging structure and method for packing thereof of image sensor, refer in particular to a kind ofly, can simplify procedure for producing and reduce manufacturing cost to cover the packaging structure of the image sensor that crystalline form makes.
Press, general sensor is to be used for measuring signal, and this signal can be light signal or sound signal, and sensor of the present invention is to be used for receiving an image signal, and this image signal is converted to electric signal is passed on the printed circuit board (PCB).
See also the cutaway view of Fig. 1 for known image sensor, it includes:
Onesubstrate 10 is arranged, and this substrate is a pottery magnetic material, and its periphery is provided with asignal input end 12 and asignal output end 14, andsignal output end 14 is in order to be electrically connected on the printed circuit board (PCB) 16.
Onespacer 18 is to be arranged on thesubstrate 10, makessubstrate 10 be formed with anaccommodation chamber 20;
Oneimage sensing wafer 22 is to be arranged on thesubstrate 10, and be positioned at theaccommodation chamber 20 thatsubstrate 10 andspacer 18 form, on theweld pad 26 that is electrically connected onimage sensing wafer 22 byplural wires 24 and thesignal input end 12 ofsubstrate 10,substrate 10 is electrically connected withimage sensing wafer 22 formation.
Onetransparent glass 28 is fixed in product ondevice 18, makeimage sensing wafer 22 be seen throughtransparent glass 28 and receive image signal, and it is fast to thesignal input end 12 ofsubstrate 10 that image signal is converted to the electric signal biography,signal input end 12 bysubstrate 10 is passed tosignal output end 14 with electric signal, is passed on the printed circuit board (PCB) 16 bysignal output end 14.
The packaging structure of above-mentioned image sensor, the more and processing procedure that produce of its element relatively be a complexity, moreover,substrate 10 is made with pottery magnetic material material, the costliness that its price is suitable, and when making since the ceramics material cutting be difficult for, therefore necessary single manufacturing, relatively its manufacturing cost is quite high.
Main purpose of the present invention is to provide a kind of improvement encapsulating structure of image sensor, directly be packaged in image sensing wafer on the flexible circuit board to cover crystal type, and do not need with the transmission medium of substrate as signal, have the effect that reduces packing component, packaging cost is reduced.
Another object of the present invention is to provide a kind of improvement method for packing of image sensor, have the simplification procedure for producing, it is made now on the facility.
The object of the present invention is achieved like this: a kind of improvement packaging structure of image sensor, it is in order to be electrically connected on the printed circuit board (PCB), it is characterized in that: include an image sensing wafer, be formed with a plurality of electronic circuits on it, each electronic circuit all is provided with a weld pad; One flexible circuit board, it is provided with a upper surface and a lower surface, this lower surface is formed with a signal input end with respect to each bond pad locations of this image sensing wafer, in order to be electrically connected on the corresponding weld pad of this image sensor, reach this each signal input and be electrically connected on a signal output end, in order to be electrically connected on this printed circuit board (PCB); And a photic zone, it is covered in the upper surface of this flexible circuit board, and the number of which is provided with input and signal output end, and this news output is in order to be electrically connected this printed circuit board (PCB).
Described photic zone is a transparent glass.
Described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.
Each bond pad locations of described image sensing wafer is formed with metallic contact, in order to be electrically connected with the signal input end of this flexible circuit board.
Be formed with adhesive layer between described image sensing wafer and this photic zone, and seal this flexible circuit board and be electrically connected the place with image sensing wafer.
A kind of improvement method for packing of image sensor, the step of its feature is:
(1) provides an image sensing wafer, have a plurality of electronic circuits on it, on this each electronic circuit, have a weld pad;
(2) provide a flexible circuit board, machine is formed with signal input end corresponding to each bond pad locations of this image sensing wafer on it, and the signal input end of this flexible circuit board is electrically connected on the weld pad of this image sensing wafer;
(3) provide a photic zone to be covered on this image sensing wafer, make this image sensing wafer receive image signal via photic zone.
Described flexible circuit board is electrically connected on this image sensing wafer, and fixes with sticker.
Described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.
Each bond pad locations of described image sensing wafer is formed with metallic contact, and in order to be electrically connected with the signal input end of this flexible circuit board.
Described photic zone is a transparent glass.
Because adopt such scheme: it is more convenient to make in the manufacturing, can significantly reduce production costs.
The present invention must be able to more deep understanding by following graphic and detailed description:
Fig. 1 is the cutaway view that known image is surveyed the packaging structure of device.
Fig. 2 surveys the analysing and observe of improvement packaging structure of device for image of the present invention.
Fig. 3 surveys the exploded view of the improvement packaging structure of device for image of the present invention.
Fig. 4 surveys the enforcement figure of the improvement packaging structure of device for invention image picture.
See also the cutaway view of Fig. 2 for the improvement packaging structure of image sensor of the present invention, it includes:
Oneimage sensing wafer 30 which is provided with aupper surface 32 and alower surface 34, andupper surface 32 is formed with many electronic circuits (figure does not show), and each electronic circuit all is provided with aweld pad 36, is formed with metallic contact 38 (Gold Bump) on eachweld pad 36.
Oneflexible circuit board 40, it is provided with aupper surface 42 and alower surface 44,lower surface 44 is formed with asignal input end 46 with respect to eachweld pad 36 position ofimage sensing wafer 30, in order to themetallic contact 38 on theweld pad 36 that is electrically connected onimage sensing wafer 30, eachsignal input end 46 is electrically connected on asignal output end 48 that is formed at thelower surface 44 offlexible circuit board 40;Flexible circuit board 40 central parts have one and are littlehollow slots 50 thanimage sensing wafer 30,signal input end 46 then is positioned athollow slots 50 peripheries, make thatimage sensing wafer 30 is able to be exposed byhollow slots 50 when themetallic contact 38 ofimage sensing wafer 30 is electrically connected on thesignal input end 46 offlexible circuit board 40.
Onephotic zone 52 is transparent glass, and it is adhered to theupper surface 42 offlexible circuit board 40, thehollow slots 50 offlexible circuit board 40 is covered, andimage sensing wafer 30 is seen throughphotic zone 52 and receives image signals, and image signal is converted to electric signal.
Please cooperate and consult Fig. 3, the present invention is when encapsulation, at firstimage sensing wafer 30 is connected toflexible circuit board 40 to cover the crystal type electricity, themetallic contact 38 on it is electrically connected mutually with thesignal input end 46 offlexible circuit board 40, and can it be adhesively fixed viscose glue.Thenphotic zone 52 is adhered on theflexible circuit board 40 withviscose glue 54; be filled in image sensingwafer 30 andphotic zone 52 peripheries with anencapsulated layer 56 again; andflexible circuit board 40 andimage sensing wafer 30 are sealed up, be electrically connected the place with protectionflexible circuit board 40 with image sensing wafer 30.Soimage sensing wafer 30 must see throughphotic zone 52 and receive image signal, and image signal is converted to the signalinput end end 46 that electric signal is passed toflexible circuit board 40, is passed tosignal output end 48 bysignal input end 46 again.
See also Fig. 4, the image sensor of finishing is placed in the printed circuit board (PCB) 58 formedbreach 60, thesignal output end 48 offlexible circuit board 40 then is electrically connected on the printed circuit board (PCB) 58, make that seeing throughphotic zone 52 withimage sensing wafer 30 receives image signal, and after image signal is converted to electric signal, electric signal is passed to thesignal input end 36 offlexible circuit board 40, is passed on the printed circuit board (PCB) 58 byflexible circuit board 40 signal output ends 48 again.
Borrow tectonic association as above, the improvement packaging structure and the method for packing thereof of the brilliant device of image sensing of the present invention, it has following advantage:
1. with the signal transmission medium offlexible circuit board 40, can save the member of knownsubstrate 10, can reduce production costs asimage sensing wafer 30.
2. owing to save the member ofknown substrate 10, therefore, the encapsulation volume of image sensor reached gently, approach, short and small demand.
3. becauseflexible circuit board 40 can be convenient to cut, therefore, a plurality of image sensor can be encapsulated simultaneously, be cut into single packaging body again, therefore, its a large amount of manufacturing costs are lower.
The specific embodiment that in the detailed description of preferred embodiment, is proposed, in order to be easy to illustrate technology contents of the present invention, be not that invention narrow sense is limited to embodiment, all situations according to spirit of the present invention and following claim, the many variations of doing implements all to belong to scope of the present invention.
Claims (10)
Translated fromChinesePriority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011007559ACN1201649C (en) | 2001-01-09 | 2001-01-09 | Improved package structure of image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011007559ACN1201649C (en) | 2001-01-09 | 2001-01-09 | Improved package structure of image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1364053Atrue CN1364053A (en) | 2002-08-14 |
| CN1201649C CN1201649C (en) | 2005-05-11 |
Family
ID=4651858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011007559AExpired - Fee RelatedCN1201649C (en) | 2001-01-09 | 2001-01-09 | Improved package structure of image sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1201649C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1302541C (en)* | 2003-07-08 | 2007-02-28 | 敦南科技股份有限公司 | Chip packaging substrate with flexible circuit board and manufacturing method thereof |
| CN1306575C (en)* | 2003-01-17 | 2007-03-21 | 胜开科技股份有限公司 | Injection molding image sensor packaging method |
| CN100362666C (en)* | 2004-03-24 | 2008-01-16 | 宏齐科技股份有限公司 | Package structure of light sensing chip and manufacturing method thereof |
| CN100383938C (en)* | 2003-06-09 | 2008-04-23 | 三洋电机株式会社 | Semiconductor device and method for manufacturing the same |
| CN101461701B (en)* | 2007-12-21 | 2010-11-03 | 华晶科技股份有限公司 | Minitype sensor and method for producing the same |
- 2001
- 2001-01-09CNCNB011007559Apatent/CN1201649C/ennot_activeExpired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306575C (en)* | 2003-01-17 | 2007-03-21 | 胜开科技股份有限公司 | Injection molding image sensor packaging method |
| CN100383938C (en)* | 2003-06-09 | 2008-04-23 | 三洋电机株式会社 | Semiconductor device and method for manufacturing the same |
| CN1302541C (en)* | 2003-07-08 | 2007-02-28 | 敦南科技股份有限公司 | Chip packaging substrate with flexible circuit board and manufacturing method thereof |
| CN100362666C (en)* | 2004-03-24 | 2008-01-16 | 宏齐科技股份有限公司 | Package structure of light sensing chip and manufacturing method thereof |
| CN101461701B (en)* | 2007-12-21 | 2010-11-03 | 华晶科技股份有限公司 | Minitype sensor and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1201649C (en) | 2005-05-11 |
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| CF01 | Termination of patent right due to non-payment of annual fee | Granted publication date:20050511 Termination date:20190109 | |
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