Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without making any inventive effort are within the scope of the present application.
It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or communicate between the two elements. The terms "parallel", "perpendicular", "equal" include the stated case as well as the case similar to the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the range of acceptable deviation of approximately parallel may be, for example, within 5 ° of deviation, and "perpendicular" includes absolute perpendicular and approximately perpendicular, where the range of acceptable deviation of approximately perpendicular may also be, for example, within 5 ° of deviation. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
The present application will be further described in detail below with reference to the drawings and detailed description for the purpose of enabling those skilled in the art to better understand the aspects of the present application.
The server provided by the application comprises a chassis 3, a motherboard 6, a memory expansion module 1 and a switching component, and particularly reference is made to fig. 1 and 2.
The main board 6 is disposed in the chassis 3, and specifically includes a processor and a main board memory 7, which are responsible for distributing management power and executing system control and management. The specific motherboard 6 comprises a circuit board and a motherboard tray 9, the motherboard memory 7 is in communication connection with the processor through wiring of the circuit board, and the motherboard tray 9 is supported on the circuit board and can be fixed on the chassis 3 through a fastener. The circuit board is specifically, but not limited to, a PCB (Printed Circuit Board ) or a PCBA (Printed Circuit Board Assembly, printed circuit board assembly).
The memory expansion modules 1 are disposed in a front window area 50 of the chassis 3, and the front window area 50 is opposite to a rear window area 51, as shown in fig. 1 and 2. By arranging a plurality of memory expansion modules 1 by utilizing the front window area 50 of the chassis 3, the high-density expansion of the system can be realized in a compact space, and the total memory capacity of the system is improved, so that large-scale data processing is supported.
The number of the memory expansion modules 1 can be one, two or more, and the memory expansion modules 1 can be determined according to the size of the front window area 50 corresponding to the server, so that the upper limit of memory expansion can be raised by arranging the memory expansion modules 1 by using the front window area 50 to the maximum.
The switching component is connected to the chassis 3 and located between the motherboard 6 and the memory expansion module 1, and can realize communication connection between the motherboard 6 and the memory expansion module 1. The memory expansion module 1 is connected with the switching assembly in a pluggable manner, and through the setting of pluggable connection, a plurality of memory expansion modules 1 can be subjected to rapid lossless plug, so that the maintenance complexity and the downtime are remarkably reduced, the switching assembly is not required to be disassembled, the overhaul and maintenance of a single memory expansion module 1 can be completed in a short time, and the operation and maintenance cost is reduced.
The switching assembly specifically comprises a mounting plate 4 arranged in the chassis 3 and a plurality of connectors 16 arranged in the mounting plate 4, wherein the connectors 16 and the memory expansion module 1 are arranged in one-to-one correspondence, and the specific correspondence arrangement refers to correspondence in number and position. Each connector 16 is used for signal connection between one memory expansion module 1 and the motherboard 6.
As shown in fig. 1, the mounting plate 4 is located between the memory expansion module 1 and the motherboard 6, the mounting plate 4 is perpendicular to the inner bottom surface S of the chassis 3, the mounting plate 4 may be fixed in the chassis 3 by means of a fastener, and the specific fastener may be a mounting plate fixing screw 14, but not limited thereto, so long as the reliable fastening effect is ensured.
Through the mounting panel 4 perpendicular to the inner bottom wall surface S of the chassis 3, as shown in fig. 1, the plurality of memory expansion modules 1, the mounting panel 4 and the motherboard 6 are sequentially arranged along the front-to-back direction of the chassis 3, the mounting panel 4 does not occupy the height space of the front window area 50, so that the memory expansion modules 1 can be maximally arranged by utilizing the front window area 50, memory expansion is maximally performed in a more compact space, and the total memory capacity of the system is improved. Wherein, from front to back, the direction is the same as the front window area 50 to the rear window area 51.
The connector 16 is parallel to the bottom wall surface S in the chassis 3, one side of the connector 16 facing away from the front window area 50 is in signal connection with the main board 6, and one side of the connector 16 facing towards the front window area 50 is in pluggable connection with the memory expansion module 1, so that the single memory expansion module 1 can complete hot plug or cold maintenance operation in a short time, the connector 16 is connected to one side of the main board 6 without processing or dismantling other components, the maintenance time can be greatly shortened, and the operation and maintenance cost is reduced. If the memory expansion modules 1 are provided with a plurality of memory expansion modules, one memory expansion module 1 needs to be overhauled and maintained, only a single memory expansion module 1 needs to be disassembled, other memory expansion modules 1 do not need to be disassembled, and the switching assembly does not need to be disassembled, so that the maintenance complexity is reduced, and the overhauling and maintaining efficiency is improved.
As illustrated in fig. 2, the insertion and extraction direction of the memory expansion module 1 is parallel to the inner bottom surface S of the chassis 3, and specifically, the insertion and extraction direction may be the front-rear direction of the chassis 3, where the front-rear direction corresponds to the front-rear direction in the front window area 50 and the rear window area 51. When the disassembly and maintenance are required, the connection between the memory expansion module 1 and the connector 16 is disconnected from the rear to the front in the front window area 50 of the chassis 3, so that the single memory expansion module 1 is relatively independent, and then the memory expansion module 1 is moved out of the chassis 3 for disassembly and maintenance.
In the present embodiment, the specific connector 16 is a high-speed connector, and is capable of supporting the communication connection between the memories of each memory expansion module 1 and the motherboard 6. The specific communication signal transmission path is a memory-memory expansion module wiring-connector 16-motherboard wiring-processor.
According to the server, the memory expansion modules 1 can be arranged in a relatively pluggable mode through the arrangement of the switching assembly, so that maintenance complexity is reduced, maintenance efficiency is improved, the memory expansion modules 1 are arranged in the front window area 50 of the chassis 3, the mounting plate 4 of the switching assembly is perpendicular to the inner bottom wall surface S of the chassis, the memory expansion modules 1 can be arranged in a compact space in a mode that the front window area 50 is utilized to the maximum extent, and the memory capacity of the system is improved.
On the basis of the above embodiment, referring to fig. 3, the connector 16 includes a socket, the socket is plugged with the memory expansion module 1 on the side facing the front window area 50, the transmission cable 12 is led out from the side of the socket facing away from the front window area 50, and the transmission cable 12 is penetrated through the mounting board 4 and connected to the motherboard 6 by signals.
As shown in fig. 3, the plurality of connectors 16 are disposed on the mounting board 4, and the positions of the plurality of connectors 16 corresponding to the mounting board 4 are set according to the positions of the plurality of memory expansion modules 1, so that each memory expansion module 1 can be reliably plugged into and plugged out of its corresponding connector 16.
The connector 16 comprises a socket, from which a transmission cable 12 is led out towards the side of the motherboard 6, where the transmission cable 12 corresponds to the high-speed transmission cable 12 of the high-speed connector 16 for communication connection between the connector 16 and the motherboard 6.
Specifically, the side of the transmission cable 12 facing the front window area 50 is in communication connection with the plug interface, and the side of the transmission cable 12 facing away from the front window area 50 is connected with the signal connector 61 on the motherboard 6, and the signal connector 61 on the motherboard 6 can be in signal connection with the processor through the internal wiring of the motherboard. The signal Connector 61 on the motherboard 6 may be a MCIO Connector (Multi-Channel I/O Connector), and each memory expansion module 1 is correspondingly connected to the MCIO Connector through a transmission cable 12, and the signal connection between the memory expansion module 1 and the processor of the motherboard 6 can be realized by combining the communication connection between the memory expansion module 1 and the socket.
In this embodiment, the transmission cable 12 can be arranged according to the space condition in the actual chassis 3 due to its bendable arrangement, so as to avoid interference with other components.
The transmission cable 12 is arranged by penetrating through the mounting plate 4, specifically, the mounting plate 4 is provided with the outlet 11, the outlet 11 can be provided with protective measures, abrasion to the transmission cable 12 is avoided, and the operation reliability of the transmission cable 12 is ensured. Specific safeguards can be applied to reduce friction to the transmission cable 12 by coating the inner walls of the outlet 11 with a protective layer. The specific protection measures can also be realized by arranging a protection pad in the outlet 11, and the protection pad provides protection for the transmission cable 12, so that the reliable use of the transmission cable 12 is ensured.
In the present embodiment, the plug connection with the memory expansion module 1 is completed through the plug interface of the connector 16, and the signal connection with the signal connector 61 on the motherboard 6 is completed through the transmission cable 12 connected to the plug interface. When the memory expansion module 1 is plugged and unplugged, the memory expansion module 1 is an independent detachable module, a transmission cable 12 at the end of the main board 6 is not required to be touched, other components are not required to be detached, the maintenance complexity can be reduced, the overhaul and maintenance efficiency is improved, and the operation and maintenance cost is reduced.
In this embodiment, the communication signal transmission path is a memory-memory expansion module trace-socket-transmission cable 12-signal connector 61-motherboard trace-processor.
On the basis of any of the above embodiments, referring to fig. 2, the mounting plate 4 includes a body, a plurality of support frames 13 connected to the body, the plurality of support frames 13 are disposed on a side of the body facing the front window area 50 and/or a side facing away from the front window area 50, and the support frames 13 are connected to an inner bottom wall of the chassis 3 so as to be capable of being supported on the body.
As illustrated in fig. 2, the mounting plate 4 comprises a body capable of providing an outlet 11 for the transmission cable 12 to pass through, and a support bracket 13 to which a connector 16 is secured by means of a fastener, which may be, but is not limited to, a screw.
The support frame 13 is connected with the inner bottom wall of the case 3, and is arranged on one side of the body facing the front window area 50 and/or one side deviating from the front window area 50 through the plurality of support frames 13, so that reliable support can be provided for the body through the support frame 13 on at least one side of the body, the structural strength of the mounting plate 4 can be ensured, the mounting plate 4 is ensured to have better reliable stability when the memory expansion module 1 is plugged and unplugged, and bending or deformation conditions of the mounting plate 4 are avoided. The specific support frame 13 can be provided with an edge beam which is obliquely arranged and a plane part which is connected with the inner bottom wall of the case 3, wherein the edge beam is connected with the body, and the plane part is reliably and stably connected with the case 3 through a screw. In addition, both sides of the body are fixed with the chassis 3 by mounting plate fixing screws 14, and the mounting plate fixing screws 14 can extend into and be connected to the body from the outside of the chassis 3. Through the setting of body both sides and quick-witted case 3 fixed connection to and the fixed setting of a plurality of support frame 13 and interior bottom wall of machine case 3, guarantee that mounting panel 4 is restricted to remove from a plurality of directions, guarantee the mounting panel 4 and be fixed in the reliable stability on the machine case 3.
In this embodiment, it should be noted that, the processing of the mounting board 4 adopts an integral die casting process, and the body can be provided with the support frame 13 by means of bracket processing, so that welding or assembly is not required, the integrity and the structural strength of the mounting board 4 are improved, and the disassembly and assembly efficiency of the mounting board 4 relative to the chassis 3 is improved.
The reliable mounting of the mounting plate 4 and the reliable mounting of the connector 16 relative to the body are closely related to the reliable plugging of the memory expansion module 1, and the reliable plugging of the memory expansion module 1 is closely related to the long-term operation reliability of the system in high-density deployment.
In a specific embodiment, the opposite two side walls of the chassis 3 are provided with guide grooves for installing the body, the body is slidably connected with the guide grooves, the guide grooves can provide installation guiding effects, limit effects can also be provided, movement of the mounting plate 4 is avoided, reliable stability of the mounting plate 4 in the chassis 3 is guaranteed, and reliable plugging and unplugging of the memory expansion module 1 is guaranteed. The specific guide groove can be formed integrally through the inner wall of the case 3, and can also be formed by connecting auxiliary parts to the inner wall of the case 3, and the specific guide groove is specifically combined with the actual space situation to be set.
In a specific embodiment, the inner bottom wall of the case 3 is provided with a positioning groove, the groove wall of the positioning groove and the bottom of the supporting frame 13 are attached to provide a mounting guiding effect, a limiting effect can be provided, the movement of the mounting plate 4 is avoided, the reliable mounting of the mounting plate 4 relative to the case 3 is ensured, and the stability is ensured. In this way, reliable mounting of the mounting plate 4 can be ensured by means of the chassis 3, so as to ensure reliable plugging of the memory expansion module 1.
In a specific embodiment, the location and installation part can be arranged at the position on the body for connecting to the connector 16, so as to ensure the reliable installation of the connector 16, and the specific location and installation part is a structure formed by integrally forming the mounting plate 4, so as to ensure the reliable strength of the mounting plate 4 during plugging.
Through the above three embodiments, the reinforcement can be performed from multiple directions of the mounting board 4, and the specific multiple directions are front and back, left and right, up and down, so that the mounting board 4 can be ensured to be reliably and stably mounted in the chassis 3, the connector 16 is ensured to be reliably mounted relative to the mounting board 4, and the reliable plugging and unplugging of the memory expansion module 1 is ensured.
On the basis of any of the above embodiments, referring to fig. 3 and 5, the memory expansion module 1 includes an expansion card 17 parallel to the inner bottom surface S of the chassis 3, and an adapter card 15 perpendicular to the inner bottom surface S of the chassis 3, the expansion card 17 is plugged into the adapter card 15 along a first direction, the adapter card 15 is plugged into the connector 16 along a second direction, and the first direction and the second direction are perpendicular and are both parallel to the inner bottom surface S of the chassis 3.
As illustrated in fig. 2 and 3, the switch card 15 is disposed perpendicularly to the inner bottom wall surface S of the chassis 3, and each memory expansion module 1 realizes communication connection with the corresponding signal connector 61 on the motherboard 6 through a single switch card 15 and the connector 16 corresponding to this switch card 15. The adapter cards 15 are disposed perpendicularly to the inner bottom wall surface S of the chassis 3, and the expansion cards 17 are disposed parallel to the inner bottom wall surface S of the chassis 3, so that the number of the expansion cards 17 can be maximally disposed in the limited compact space of the front window area 50, and the total memory capacity of the system can be maximally improved.
Specifically, the expansion card 17 may be a CXL (Compute Express Link, computing fast link) card, and each CXL card may integrate N1 DIMM (Dual-Inline Memory Modules, dual in-line memory module) slots on its circuit board, so that the product of the number N2 and N1 of expansion cards 17 disposed in the front window area 50 is the number of slots that can be increased, and the slots are plugged with memory, that is, the effect of improving the expansion capability of the system memory is achieved by increasing the number of slots.
Taking a specific embodiment as an example, if the server is a 2U server, 3 memory expansion modules 1 can be integrated in the front window area 50, each memory expansion module 1 corresponds to 2 expansion cards 17 and one riser card 15, and each expansion card 17 corresponds to 4 slots, so that the system can implement additional memory expansion capacity of up to 24 DIMM slots in the front window area 50 of the server. By maximizing the increase in the number of installed expansion cards 17 in the front window area 50, the upper limit of memory expansion can be effectively raised, and high-density expansion can be realized.
In this embodiment, the riser card 15 is used to implement signal connection between the expansion card 17 and the motherboard 6, where the riser card 15 is a riser card 15 based on PCIe (PERIPHERAL COMPONENT INTERCONNECT EXPRESS, high-speed peripheral component interconnect standard) and is capable of establishing a high-speed communication link between the expansion card 17 and a processor of the motherboard 6. Referring to fig. 10, the signal communication links between the memory of the memory expansion module 1 and the processor of the motherboard 6 are memory-DIMM socket-expansion card inner trace-riser card 15-connector 16-signal connector 61-motherboard inner trace-processor.
In this embodiment, the expansion card 17 is plugged into the adapter card 15 along a first direction, the adapter card 15 is plugged into the connector 16 along a second direction, and the first direction and the second direction are perpendicular. The plurality of expansion cards 17 are firstly plugged onto the adapter card 15 along the first direction to form communication connection, then the adapter card 15 is plugged onto the connector 16 on the mounting board 4 along the second direction, and the transmission cable 12 led out by the connector 16 is connected to the signal connector 61 on the main board 6, so that the communication connection between the expansion cards 17 and the processor of the main board 6 can be realized. The second direction is the insertion and extraction direction of the memory expansion module 1 with respect to the mounting board 4, and specifically, the front-rear direction formed by the front window area 50 and the rear window area 51 is the first direction, i.e., the left-right direction. The specific first direction and the second direction correspond to the x and y schematic directions in fig. 5, respectively.
The extension card 17 and the adapter card 15 can be integrated first and then connected with the connector 16 on the mounting plate 4, when maintenance is needed, the adapter card 15 and the extension card 17 can be detached together through the insertion and extraction of the adapter card 15 relative to the mounting plate 4, other parts are not interfered, the quick-detachment effect is achieved, and the convenience of maintenance is improved.
On the basis of any of the above embodiments, referring to fig. 5, a golden finger 24 is disposed on a side of the adapter card 15 facing the connector 16, a plurality of inserting grooves 38 corresponding to the expansion cards 17 one by one are disposed on a side of the adapter card 15 facing the expansion cards 17, and openings of the inserting grooves 38 are parallel to the first direction.
The adapter card 15 is provided with a golden finger 24 on one side facing the connector 16, the golden finger 24 is arranged in a second direction, the golden finger 24 is inserted into the insertion port of the connector 16 to realize quick insertion, and the insertion slot 38 of the adapter card 15 is inserted into the insertion part of the expansion card 17 to realize quick insertion, wherein the insertion part is a golden finger component corresponding to the insertion slot 38. The plugging slot 38 of the adapter card 15 is an onboard slot of the adapter card 15, and the onboard slot can be fixed on the board body of the adapter card 15 through the slot fixing screws 37, so that the number and the positions of the slot fixing screws 37 are not limited, and the slot fixing screws are set according to the positions of the expansion cards 17 in practical application scenes.
The opening of the insertion slot 38 is arranged parallel to the first direction, corresponding to the insertion of the expansion card 17 onto the adapter card 15 in the first direction. The socket 38 is connected to the processor via the interface of the cable connector 16 and the signal connector 61 of the connector cable 16 inside the adapter card 15, so that the expansion card 17 connected to the socket 38 can form a communication connection with the processor of the motherboard 6.
As shown in fig. 8, taking a specific embodiment as an example, each adapter card 15 is provided with two plugging slots 38, the two plugging slots 38 are respectively and correspondingly connected with two expansion cards 17, and the communication connection between the two expansion cards 17 and the motherboard 6 is realized through the connection between the golden finger 24 of the adapter card 15 and the plugging port of the connector 16 and the connection between the transmission cable 12 correspondingly penetrated out through the plugging port and the signal connector 61 on the motherboard 6, that is, the communication connection between a plurality of memories on the expansion cards 17 and the processor of the motherboard 6 is realized, and the high-density expansion memory is realized.
In this embodiment, through the grafting of the interface of adapter card 15 and connector 16, the technical effect of quick plug can be realized, can realize the quick effective maintenance of every memory expansion module 1 promptly, reduces the fortune dimension cost, need not to touch transmission cable 12 or dismantle other parts, guarantees the reliable installation of memory expansion module 1 after the maintenance, guarantees the reliability of long-term operation of system.
On the basis of any of the above embodiments, please refer to fig. 8, the memory expansion module 1 includes a module support 18, the module support 18 is provided with an enclosed cavity 181, the expansion card 17 and the adapter card 15 are both disposed in the enclosed cavity 181, the expansion card 17 is slidably connected to the enclosed cavity 181 and can be plugged with the adapter card 15 in the enclosed cavity 181, and the golden finger 24 of the adapter card 15 extends out of the enclosed cavity 181 and is plugged with the connector 16.
The surrounding cavity 181 of the module support 18 can specifically provide reliable protection for the adapter card 15 and the expansion card 17, and the surrounding cavity 181 can specifically be U-shaped or L-shaped, and is determined according to specific situations without specific limitation.
As illustrated in fig. 8, the module support 18 is a sheet metal part, and the module support 18 specifically includes a sheet metal body 33 and a mailer 32 disposed at the top of the sheet metal body 33, so as to avoid false touch and ensure safety during use. The maillard film 32 is coated on the top of the metal plate body 33, and the thickness of the maillard film 32 can be set according to actual conditions, so that a good protection effect is ensured.
In this embodiment, the expansion card 17 is slidably connected to the enclosed cavity 181 and can be plugged with the adapter card 15 in the enclosed cavity 181, the expansion card 17 can slide relative to the enclosed cavity 181, the sliding direction is the first direction, that is, the opening direction of the plugging slot 38 provided on the adapter card 15, after the adapter card 15 is installed in the enclosed cavity 181, the expansion card 17 can be simply and quickly installed in place through the sliding connection between the expansion card 17 and the enclosed cavity 181, and if the expansion card 17 needs to be disassembled and replaced, the quick replacement can be realized by utilizing the sliding connection relationship, so that the maintenance efficiency is improved.
In addition, the slidable arrangement of the expansion card 17 can also ensure reliable and accurate installation of the expansion card 17 relative to the adapter card 15 and ensure the reliability of the signal link.
The slidable arrangement of the expansion card 17 can be realized by means of a guiding structure arranged on the module support 18, and the guiding structure can be arranged on one side or two sides of the module support 18 without limitation. The guide structure can be in the forms of guide bars, guide blocks and the like, and is integrally formed on the module support 18, so that the production and manufacturing cost is reduced, and the module support 18 is convenient to mount and dismount.
The connection between the adapter card 15 and the mounting cavity can be realized by means of a fixing nut 34, a fixing screw hole 35 and an adapter card fixing screw 36. For example, in one embodiment, the fixing nut 34 is fixed to the wall of the mounting cavity, and the adapter card fixing screw 36 passes through the fixing screw hole 35 on the adapter card 15 and is in threaded connection with the fixing nut 34, so that the reliable fixing of the adapter card 15 relative to the module support 18 can be completed.
The golden finger 24 of the adapter card 15 extends out of the surrounding cavity 181 and is spliced with the connector 16, and along the second direction, the golden finger 24 extends out of the surrounding cavity 181 to be reliably spliced with the connector 16, so that the influence of the module support 18 on the plugging operation is avoided, the reliability of signal transmission is ensured, and the long-term operation reliability and stability of the system under high-density deployment are ensured.
On the basis of any of the above embodiments, please refer to fig. 5 and 6, the memory expansion module 1 includes a tail support 27, the tail support 27 is provided with a first connection portion 271, a second connection portion 272 and a third connection portion 273, the first connection portion 271, the second connection portion 272 and the third connection portion 273 are vertically arranged in pairs, the tail support 27 is specifically located at the tail of the module support 18, and the tail of the tail support is the rear position corresponding to the front window and the rear window. The tail bracket 27 is a sheet metal part, and the corresponding first connecting portion 271, second connecting portion 272 and third connecting portion 273 are actually integrally formed, so that the manufacturing cost can be effectively controlled by means of a mature sheet metal process.
The first connecting portion 271 is connected to the module bracket 18 and is parallel to the adapter card 15, a limit space is formed between the side walls of the first connecting portion 271 and the surrounding cavity 181 corresponding to the position of the adapter card 15, the limit space is used for limiting the offset of the adapter card 15, the first connecting portion 271 is attached to the adapter card 15, or a certain gap is formed between the first connecting portion 271 and the adapter card 15, after the adapter card 15 and the surrounding cavity 181 are installed, the adapter card 15 is limited in the limit space formed by the surrounding cavity 181 and the first connecting portion 271, so that the expansion card 17 can have better reliability and stability when being inserted and pulled relative to the adapter card 15.
The second connection portion 272 is connected to the module holder 18 and disposed parallel to the expansion card 17, and the third connection portion 273 is connected to the expansion card 17 so as to be able to collectively restrict the offset of the expansion card 17. The connection between the second connection portion 272 and the module support 18 is achieved by means of the tail support fixing screw 28, specifically, the tail support fixing screw 28 penetrates through the module support 18 and the second connection portion 272, so that reliable connection between the tail support 27 and the module support 18 can be achieved.
Wherein, the connection of the third connection portion 273 and the expansion card 17, the third connection portion 273 is provided with a positioning pin 40, the corresponding expansion card 17 is provided with a positioning hole site 42, the guiding positioning during connection is realized through the cooperation of the positioning hole site 42 and the positioning pin 40, and the reliable and stable connection of the tail support 27 and the expansion card 17 is realized through the stud 43 in the connection hole connected by the tail support fixing screw 28.
Through the setting of second connecting portion 272 and third connecting portion 273, combine afterbody support set screw 28 and the setting of connecting screw 26, can connect afterbody support 27, expansion card 17, module support 18 and adapter card 15 as an organic wholely, strengthen holistic structural strength, guarantee reliable stability.
In this embodiment, the module support 18, the tail support 27, the expansion card 17 and the adapter card 15 can be preassembled offline, so as to improve the assembly efficiency, if the assembly and disassembly are required, the tail support 27 is disassembled first, and then the expansion card 17 and the adapter card 15 are disassembled, so that the assembly and disassembly are simple and convenient, and the detection and maintenance efficiency is improved.
On the basis of any of the above embodiments, referring to fig. 6, two sides of the expansion card 17 along the first direction are respectively provided with a first hanging tab 171 and a second hanging tab 172, the first hanging tab 171 is bent in the cavity of the expansion card 17, and a plurality of first hanging tabs 171 are connected to the third connecting portion 273. The first suspension loop 171 and the second suspension loop 172 are integral components of the expansion card 17, and the chamber of the expansion card 17 can be used as a chamber for ventilation, thereby facilitating heat dissipation of the system. The first suspension loop 171 is bent into the cavity, so that the expansion card 17 and the tail support 27 can be reliably connected without occupying the space of the chassis 3. The number of the first suspension loops 171 specifically connected to the third connection portion 273 is set according to the actual situation, if two third connection portions 273 are set, two first suspension loops 171 corresponding to each expansion card 17 can be correspondingly set, reliable installation of each expansion card 17 and the tail support 27 is guaranteed, overall reliable structural strength of the memory expansion module 1 is guaranteed, bending resistance, torsion resistance and vibration resistance of the module are guaranteed, and long-term operation reliability under high-density deployment is guaranteed.
The second hanging lugs 172 are extended out of the cavity of the expansion card 17, the second hanging lugs 172 are parallel to the first connecting portion 271, and the second hanging lugs 172 are connected to the side wall of the module support 18 away from the tail support 27. The expansion card 17 can be fixed in the first direction by the expansion card fastening screw 44 penetrating through the side wall of the tail bracket 27, and the second connection portion 272 and the third connection portion 273, combined with the tail bracket fixing screw 28 and the connection screw 26, are arranged to fix the expansion card 17 from the second direction and the third direction, wherein the cooperation of the tail bracket fixing screw 28 on the third connection portion 273 and the stud 43 on the expansion card 17 is used to fix the expansion card 17 from the second direction. By fixing the expansion card 17 from a plurality of directions, the reliability of the whole memory expansion module 1 can be ensured, and the reliability of communication cable transmission can be ensured.
In addition, the module tray 22 and the module support 18 are respectively and correspondingly provided with a first reinforcing convex hull 23 and a second reinforcing convex hull 25 for reinforcing the structure of the memory expansion module 1, further guaranteeing the bending resistance, torsion resistance and vibration resistance of the module and guaranteeing the long-term operation reliability under high-density deployment. The first reinforcing convex hull 23 and the second reinforcing convex hull 25 are formed by utilizing the space of the memory expansion module 1, so that the space of the chassis 3 is not occupied any more, the memory expansion module 1 can be arranged in the front window area 50 to the maximum extent, and the memory capacity of the system is improved.
On the basis of any of the above embodiments, referring to fig. 7 and 9, the memory expansion module 1 includes a module tray 22, the module tray 22 is supported by a module bracket 18, the module bracket 18 is slidably disposed in the module tray 22, and a sliding direction of the module bracket 18 is perpendicular to an inner bottom wall surface S of the chassis 3. The module tray 22 can specifically provide support, for the module support 18, install in the afterbody support 27 of module support 18 and adapter card 15 and expansion card 17 provide reliable support, can be with expansion card 17, the integrated memory expansion module 1 that forms into single of adapter card 15 through module tray 22, module support 18, afterbody support 27, single memory expansion module 1 independently can dismantle, need not the transmission cable 12 that touches mainboard 6 end during the maintenance, and the modularized design promotes maintenance and repair efficiency, is favorable to batch production and spare part management.
The module tray 22 is supported by the tail support 27, the tail support 27 is provided with a fourth connecting portion 274 parallel to the second connecting portion 272, and the fourth connecting portion 274 is connected to the module tray 22. The fourth connecting portion 274 is specifically connected with the tray nut 45 on the module tray 22 through the hand-turning screw 30 to eliminate assembly gaps, and when the module tray 22 needs to be disassembled and maintained, the connection between the module tray 22 and the tail support 27 can be released by manually turning the hand-turning screw 30, so that the tail support 27, the expansion card 17, the adapter card 15 and the like can be disassembled, and the operation is simple and convenient.
As illustrated in fig. 5 and 9, the module tray 22 is further provided with a plurality of mounting portions 41 for securing with the module bracket 18, particularly by means of fasteners, including but not limited to screws. Wherein, the installation department 41 sets up with the integrated into one piece of module tray 22, and module tray 22 is sheet metal component equally, reduces manufacturing cost. The mounting portion 41 is positioned and mounted by the module bracket fixing screw 19 and the module bracket 18, and the fourth connecting portion 274 is positioned and mounted by the hand turning screw 30 and the tail bracket 27, so that reliable mounting among the tail bracket 27, the module tray 22 and the module bracket 18 is realized.
Specifically, during installation, the tail support 27, the module support 18, the expansion card 17 and the adapter card 15 are firstly installed in place to form a support assembly, then the support assembly is integrally slid into the module tray 22 by utilizing the sliding connection of the module support 18 and the module tray 22, and then the fourth connecting part 274 and the module tray 22 are connected, and the installation part and the module support 18 are connected, so that the installation of the support assembly and the module tray 22 is completed, namely the assembly of the memory expansion module 1 is completed. The memory expansion module 1 forms a module independently, can be convenient for the installation and disassembly of switching subassembly, be convenient for batch production and spare part management.
On the basis of any of the above embodiments, referring to fig. 9, the module tray 22 includes a supporting portion 221, a limiting portion 222, and a front window portion 223, where the limiting portion 222 and the front window portion 223 are perpendicular to the supporting portion 221, and the front window portion 223 is specifically a portion near the front window position of the module tray 22.
At least one of the limiting part 222 and the front window part 223 is provided with a guiding part 21, and the guiding part 21 is in sliding connection with the sliding lug 39 on the module bracket 18 so as to provide guiding for the module bracket 18 to be mounted on the module tray 22. As shown in fig. 5, the module tray 22 is further provided with a guide hole 31 corresponding to the guide portion 21, and can provide a guiding function of sliding up and down.
The sliding connection of the guide portion 21 and the sliding lug 39 can facilitate the assembly and disassembly of the module bracket 18 relative to the module tray 22, and can improve the assembly and disassembly efficiency. In order to ensure the effect of free clamping stagnation sliding, the sliding device can be realized by arranging a fit clearance of 0.2mm between the guide part 21 and the sliding lug 39, particularly when the sliding lug 39 is connected to the guide part 21, the front edge and the rear edge of the sliding lug 39 can form a clearance of 0.2mm with the inner wall of the guide part 21 in the front-rear direction, so that the sliding lug 39 can move in and out smoothly and reliably relative to the guide part 21, namely, the quick and reliable dismounting operation of the module bracket 18 relative to the module tray 22 can be ensured.
The supporting part 221 is supported in the module support 18, afterbody support 27 sets up, spacing portion 222 locates the both sides of supporting part 221 along the second direction and is used for encircleing in the module support 18 in order to spacing, can guarantee the reliable installation of the expansion card of installing on module support 18 and the module support 18 through this kind of spacing form, and specific spacing portion 222 can be established to L type structure, and the vertical part of L type structure is spacing from one direction, and the horizontal part is spacing from another direction, can guarantee more reliable spacing effect and can not block up expansion card 17, the operating personnel of being convenient for carries out relevant operation.
The front window 223 is provided with a plurality of status indicator lamps 46 corresponding to the expansion slots of the expansion card 17 one by one, if the expansion card 17 is a CXL card, one CXL card can provide 4 slots for installing the memory, then the status indicator lamps 46 are corresponding to the four slots, status monitoring can be carried out at the front window position, the operators can acquire fault information in time, quick fault positioning is facilitated, and the installation and maintenance efficiency is improved. The specific quick fault location is an expansion card 17 capable of quickly knowing the position of the slot and the fault so as to quickly perform maintenance.
On the basis of any of the above embodiments, referring to fig. 9, a positioning hole 29 is provided on a side of the module tray 22 adjacent to the mounting plate 4, an opening of the positioning hole 29 is disposed towards the mounting plate 4, and the positioning hole 29 is connected with an i-pin disposed on the chassis 3 to limit a moving distance of the module tray 22 relative to the front window area 50.
The specific locating hole 29 is in a U-shaped hole form, the opening of the locating hole faces the mounting plate 4, the whole memory expansion module 1 is installed and removed relative to the chassis 3 through sliding of the module tray 22 in the front window area 50, the module tray 22 is located through the locating hole 29 and the I-shaped nail when sliding, the moving distance of the module tray 22 is limited, the situation that the connector 16 is damaged due to the fact that the adapter card 15 moves too far is avoided, reliable plugging and unplugging of the memory expansion module 1 relative to the connector 16 is guaranteed, and reliable stability of system operation is guaranteed.
In this embodiment, in order to ensure smooth and reliable sliding of the module tray 22, a slide way is further disposed at the inner bottom wall of the chassis 3, and a sliding block is disposed at the bottom of the corresponding module tray 22, so as to ensure reliable disassembly and assembly of the memory expansion module 1 through a sliding fit relationship and a limiting relationship between the positioning hole 29 and the i-pin.
On the basis of any of the above embodiments, referring to fig. 1 and 2, the front window area 50 is provided with a front window blocking net 2, and the front window blocking net 2 is connected to the chassis 3 and disposed between the plurality of memory expansion modules 1, so as to limit the displacement of the memory expansion modules 1 along the first direction.
As illustrated in fig. 1, the front window barrier 2 can partition the space of the front window area 50 to form a plurality of placement spaces, and the memory expansion modules 1 can be respectively disposed in the plurality of placement spaces. Through the setting of front window screen 2, can make between a plurality of memory expansion module 1 of front window region 50 can be relatively stable in first direction, can not produce the skew, avoid memory expansion module 1's rocking, guarantee the reliable plug of each memory expansion module 1 and connector 16, guarantee the reliable stability of system.
The size of the front window blocking net 2 can be set through the set size of the memory expansion module 1 and the position size of the front window area 50, and the front window blocking net 2 is fixedly connected to the case 3. If in the 2U server scenario, the front window blocking net 2 is provided with one, the front window area 50 can be provided with three memory expansion modules 1, and the three memory expansion modules 1 are divided into two groups by the front window blocking net 2, so that the first direction gap can be supplemented, and the movement of each memory expansion module 1 in the first direction is limited.
Under one embodiment, the front window baffle net 2 is provided with a vent hole, and the arrangement of the vent hole can not influence the normal air inlet operation of the fan module 5 arranged in the chassis 3, not influence the heat dissipation operation of the chassis 3, and ensure the operation reliability of the system.
With reference to fig. 1, the device further includes an upper cover 10 located in the front window area 50, where the upper cover 10 is detachably connected to the chassis 3. The specific detachable connection manner can be by a fastener, such as a screw, etc., but is not limited thereto. After the upper cover 10 is connected to the chassis 3, it can cover at least part of the positions of the plurality of memory expansion modules 1, as illustrated in fig. 1. When the memory expansion module 1 needs to be disassembled, the upper cover 10 can be disassembled and then related operations can be performed.
The memory expansion module 1 is provided with a handle 20 at a side close to the upper cover 10, the handle 20 is located in the height space of the memory expansion module 1, and the handle 20 can lift the memory expansion module 1 separated from the adapter component out of the front window area 50. The handle 20 is arranged in the height space of the memory expansion module 1, the space of the chassis 3 is not occupied, the memory expansion module 1 can be arranged in the compact space to the maximum extent, the handle 20 is positioned in the height space of the memory expansion module 1 in the initial state, and the handle is pulled in the working state so that an operator can lift the memory expansion module 1 in a portable mode to carry out dismounting operation. The specific handle can be in a drawstring form or in a plastic handle 20 form, can be positioned in the height space of the memory expansion module 1, provides a power assisting effect of disassembly and assembly, and improves the overhaul and maintenance efficiency.
When the memory expansion module 1 is pulled by the handle, the memory expansion module 1 is already separated from the connector 16, and the memory expansion module 1 can be reliably removed or installed from or into the chassis 3 directly by the handle.
On the basis of any of the above embodiments, referring to fig. 1 and 3, a plurality of memory expansion modules 1 disposed along a first direction are disposed in the front window area 50, and any of the memory expansion modules 1 includes a plurality of expansion cards 17 distributed along a third direction, where the third direction, the second direction, and the first direction are perpendicular to each other. Wherein the first direction, the second direction and the third direction are x direction, y direction and z direction in fig. 1 respectively.
As illustrated in fig. 1, the server provided by the present application can set a plurality of memory expansion modules 1 in the front window area 50, each memory expansion module 1 can include a plurality of expansion cards 17 set along a third direction, where the third direction is a height direction of the chassis 3, and by using this setting form, the space of the front window area 50 can be fully utilized, and the plurality of expansion cards 17 can be arranged, so as to maximize the system memory capacity.
If each memory expansion module 1 corresponds to two expansion cards 17 in the 2U server, and three memory expansion modules 1 are disposed in the front window area 50, 6 expansion cards 17 can be integrated in the front window area 50, 4 slots for inserting memory can be provided on the premise that the expansion cards 17 are CXL cards, and 24 expansion slots can be provided to realize high density expansion.
On the basis of any of the above embodiments, please refer to fig. 1, further comprising a fan module 5 located between the mounting board 4 and the motherboard 6, and a radiator 8 located in a rear window area 51 of the chassis 3, wherein the mounting board 4 is provided with a first ventilation hole 47, two sides of the memory expansion module 1 along the plugging direction are respectively provided with a second ventilation hole 48 and a third ventilation hole 49, and the fan module 5 is used for taking air flow passing through the third ventilation hole 49, the second ventilation hole 48 and the first ventilation hole 47 out of the chassis 3 through the radiator 8. The third ventilation hole 49 is located at the edge closest to the outer side in the front window area 50, and is slightly smaller to filter impurities in air, external airflow passes through the inner cavity of the memory expansion module 1 and then reaches the position of the fan module 5 through the second ventilation hole 48 after passing through the third ventilation hole 49, so that the air inlet channel of the fan module 5 is smooth, the fan module 5 sends the airflow to the position of the main board 6 for heat dissipation, then the hot airflow formed after heat exchange is sent to the radiator 8, and the hot airflow is reliably sent out of the machine through the rear window area 51 through the radiating fins of the radiator 8, so that the reliable heat dissipation effect of the server under the memory expansion module 1 is ensured to be deployed in a high density.
The total area of the plurality of first ventilation holes 47 is greater than or equal to 40% of the total area of the mounting plate 4, so that smooth air flow in the rear area of the memory expansion module 1 is ensured, smoothness of an air inlet channel of the fan module 5 is ensured, and the influence on system heat dissipation can be avoided under the condition that a plurality of memory expansion modules 1 are arranged in the front window area 50.
Along the axial direction of the first vent hole 47, a plurality of reinforcing ribs are arranged on two sides of the mounting plate 4. Through the setting of strengthening rib, can carry out the structural reinforcement to mounting panel 4, under the condition of setting up the first ventilation hole 47 of large tracts of land, can guarantee mounting panel 4 intensity through the setting of a plurality of strengthening ribs, can guarantee the reliability of connector 16 on the mounting panel 4 promptly, guarantee memory expansion module 1 for the reliable plug of connector 16, guarantee the reliability of memory expansion module 1 dismouting.
The above describes a server provided by the present application in detail. The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present application and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.