Detailed Description
Connectors are typically designed to meet a range of mechanical and electrical requirements. As one example, high data rate connectors are often used in backplane applications that require very high conductor densities and data rates. Connectors used in such applications typically include one or more wafer assemblies in order to achieve the required mechanical and electrical requirements. The wafer assembly may include an insulating mesh that supports the terminal conductors in the wafer assembly. The use of wafer assemblies facilitates the use of a range of different assembly processes to manufacture connectors capable of achieving high data rates. In any event, it remains challenging to design wafers and connectors with the conductor densities and small footprints required for high data rate applications in new systems while maintaining the electrical characteristics required for integrity data transmission.
In the context of the foregoing summary, various aspects and embodiments of a connector with enhanced shielding are described herein. An exemplary connector includes a housing and a wafer assembly. The wafer assembly includes a terminal block, a wafer mold insert, and a ground path assembly. The terminal strip includes a plurality of terminal conductors, the ground path assembly includes a ground shield, and a contact surface area of the ground shield terminates at a surface area of a ground terminal in the plurality of terminal conductors in the wafer assembly. In one example, the contact surface area of the ground shield is laser welded to the surface of the ground terminal. The shield extension regions of the ground shield also extend across the signal terminals in the wafer assembly. In some cases, the ground path assembly may also include a rigid ground shield and a flexible ground shield. The ground structure and ground path assembly facilitate higher data rate applications of the connector.
Turning to the drawings, fig. 1A shows a perspective view of an exemplary connector 10 (also referred to as "connector 10") according to various embodiments of the present disclosure. Fig. 1B shows a bottom perspective view of connector 10, and fig. 1C shows a front view of connector 10. Connector 10 is shown having a length, width and height in the orientation shown in fig. 1A. However, the connector 10 is shown as a representative example and is not drawn to any particular scale or dimension. The shape, size, proportions and other features of the connector 10 may vary from those shown. For example, the connector 10 may accommodate larger or smaller terminal rows (e.g., wider or narrower), and other variations are within the scope of the examples described herein. In some cases, multiple connectors similar to connector 10 may be arranged side-by-side for higher data rate interconnections. Further, as shown and described herein, one or more parts or components of the connector 10 may be omitted in some cases. Connector 10 may also include other parts or components not shown.
Referring to fig. 1A-1C, connector 10 includes front port opening 12 and terminal pins 13. The connector 10 is designed to establish and maintain an electrical connection with contacts on the free end interface of the cable assembly. For example, a small form-factor pluggable (Small Form Factor Pluggable, SFP), an eight-channel small form-factor pluggable (Octal Small Form Factor Pluggable, OSFP), a four-channel small form-factor pluggable (Quad Small Form Factor Pluggable, QSFP), or a cable assembly-like Printed Circuit Board (PCB) interface may be inserted into the front port opening 12 of the connector 10.
The connector 10 includes a terminal block of terminal conductors extending from the front port opening 12 to the terminal pins 13 for communication of data signals on the terminal conductors. Connector 10 includes several structural features to maintain alignment and position of terminal conductors within connector 10. The connector 10 is also designed to provide shielding and maintain signal integrity of differential signals on the terminal conductors as they extend from the front port opening 12 to the terminal pins 13. Connector 10 may be designed for use with SFP, OSFP, QSFP and related interconnect systems, but the concepts described herein are not limited to use with any particular type or style of interconnect system. The terminal pins 13 of the connector 10 are designed as Surface Mount Technology (SMT) pins for coupling to contact pads on the surface of a Printed Circuit Board (PCB), but in some cases the connector 10 may also be designed with through hole leads or other lead types at the terminal pins 13.
As shown in fig. 1A-1C, the connector 10 includes a housing 100. In one example, the housing 100 may be formed of plastic or other insulating material, but in some cases the housing may also be formed of a combination of insulating and conductive materials. The housing 100 may be formed by any suitable additive or subtractive manufacturing technique (e.g., molding, injection molding, printing, and other techniques). In some cases, the exterior surface or certain surface areas of the housing 100 may be plated with one or more plating metals for electrical conductivity, and the housing 100 may be implemented as a plated plastic part in some cases.
Housing 100 includes a bottom mounting surface 110, a back surface 112, mounting posts 122 and 124, weld rings 126 and 128, and other features described below. Connector 10 is adapted to receive a PCB-style tip (SFP, OSFP, QSFP) at the end of a cable assembly or an associated connector module. The PCB-type tip of the cable assembly may fit into the front port opening 12 of the connector 10. When inserted, the terminal strip of the wafer assembly within the housing 100 abuts and makes electrical contact with the contacts on the surface of the PCB-type tip.
Mounting posts 122 and 124 extend downwardly from the bottom mounting surface 110 of the housing 100. In one example, the mounting posts 122 and 124 may be integrally formed of the same insulating material as the rest of the housing 100. However, in other cases, the mounting posts 122 and 124 may be formed of a different material (e.g., conductive metal) than the remainder of the housing 100, and the remainder of the housing 100 may be molded around the mounting posts 122 and 124. The mounting posts 122 and 124 may be inserted through openings or holes (e.g., mounting holes, plated through holes, etc.) in the PCB onto which the housing 100 is surface mounted. Weld rings 126 and 128 may be formed (e.g., stamped, sheared, or otherwise formed) from sheet metal and, in some cases, plated. Mounting posts 122 and 124 extend through the central bores of weld rings 126 and 128. The housing 100 may be molded around the weld rings 126 and 128, or the weld rings 126 and 128 may be inserted into the housing 100 after the housing 100 is molded. In examples where the outer surface of the housing 100 is plated to be electrically conductive, the weld rings 126 and 128 may be electrically coupled with the outer conductive surface of the housing 100.
Fig. 1D shows a cross-sectional view of the housing 100 of the connector 10 labeled A-A in fig. 1A. As described above, the connector 10 includes a plurality of wafer assemblies positioned within the housing 100. Those wafer assemblies are omitted from the view of fig. 1D to illustrate internal features within the housing 100. The housing includes an interior space region 102 in which the wafer assembly is positioned and secured when the connector 10 is assembled.
As shown in fig. 1D, the housing 100 includes sheet reference channels 130-132 formed in one side of the housing 100 and sheet reference channels 133-135 formed in the other, opposite side of the housing 100. The housing 100 also includes a wafer reference channel 136 in a side of the housing 100 and a similar wafer reference channel (not shown in fig. 1D) in an opposite side of the housing 100. The wafer reference channels 130-136 (also referred to as "channels 130-136") are formed as recessed channels in the side of the housing 100 within the interior region 102 of the housing 100. The channels 130-136 extend from the rear surface 112 toward the front port opening 12 within the interior region 102 of the housing 100. The length, width, and depth of the channels 130-136 may vary in different embodiments. In some cases, the direction of the channels 130-136 may also be different from that shown. The channels 130-136 are formed to mate with guide and interlocking flanges of the wafer assembly of the connector 10 to locate and secure the wafer assembly in place within the interior region 102 of the housing 100, as described in further detail below.
The housing 100 also includes openings 140 and 142 (see fig. 1A) through the side of the housing 100, and openings 144 and 146 (see fig. 1B) through the other, opposite side of the housing 100. Openings 140, 142, 144, and 146 extend from the exterior of housing 100 to interior region 102 within housing 100. Openings 140, 142, 144, and 146 extend from the exterior of housing 100 to interior region 102 within housing 100. The latch fingers extend in a cantilevered arrangement within each of the openings 140, 142, 144, and 146. In particular, the latch fingers 150, 152, 154, and 156 extend from side edges or walls of the openings 140, 142, 144, and 146, respectively, in a cantilevered arrangement. The latch fingers 150, 152, 154, and 156 are integrally formed with the housing 100 from the same material as the housing 100 in the illustrated example, but the latch fingers 150, 152, 154, and 156 may be formed from other materials and otherwise disposed or assembled with the housing 100.
Since the latch fingers 150, 152, 154, and 156 are cantilevered and formed of a relatively compliant (e.g., polymer) material, they can flex to some extent upon application of force thereto. The latch fingers 150, 152, 154 and 156 are also resilient and will return to the position shown in fig. 1A and 1B when such force is removed. The latching fingers 150, 152, 154, and 156 are designed to mechanically engage and interfere with interlocking flanges of the wafer assembly of the connector 10 to secure the wafer assembly in place within the interior region 102 of the housing 100, as described in further detail below.
The housing 100 also includes openings 147 and 148 (see fig. 1B) through the bottom of the housing 100. Openings 147 and 148 extend from the exterior of housing 100 to interior region 102 within housing 100. The leg latch fingers extend in a cantilevered arrangement within each opening 147 and 148. In particular, leg latch fingers 157 and 158 extend from around the periphery of openings 147 and 148, respectively, in a cantilevered arrangement. The leg latch fingers 157 and 158 are integrally formed with the housing 100 from the same material as the housing 100 in the illustrated example, but the leg latch fingers 157 and 158 may be formed from other materials and otherwise arranged or assembled with the housing 100. Leg latch fingers 157 and 158 mechanically mate and interfere with interlocking legs of the wafer assembly within housing 100 to retain and secure the wafer assembly in place, as described in further detail below with reference to fig. 5.
Fig. 2A illustrates a top perspective view of the exemplary wafer assembly 200, 300, 400, and 500 of the connector 10 illustrated in fig. 1A, with the housing 100 omitted from view. Fig. 2B shows a bottom perspective view of the wafer assemblies 200, 300, 400, and 500, and fig. 2C shows a side view of the wafer assemblies 200, 300, 400, and 500. The wafer assemblies 200, 300, 400, and 500 are shown as representative examples and are not drawn to any particular scale or size. Fig. 3A illustrates a top perspective view of wafer assemblies 200 and 500 of connector 10 shown in fig. 2A. Fig. 3B shows a top perspective view of wafer assemblies 300 and 400, and fig. 3C shows a bottom perspective view of wafer assemblies 300 and 400. The shape, size, proportions, and other features of the wafer assemblies 200, 300, 400, and 500 may vary from those shown. For example, wafer assemblies 200, 300, 400, and 500 may accommodate larger or smaller terminal rows (e.g., wider or narrower), and other variations are within the scope of the examples described herein. Further, in some cases, one or more of the parts or components of the wafer assemblies 200, 300, 400, and 500 shown in the figures and described herein may be omitted. The wafer assemblies 200, 300, 400, and 500 may also include other parts or components not shown. The wafer assemblies 200, 300, 400, and 500 of the connector 10 are described below with reference to fig. 2A-2C and 3A-3C, and then detailed views of the wafer assemblies 200, 300, 400, and 500 are described with reference to fig. 4A-4D.
Referring to fig. 2A-2C and 3A-3C, wafer assembly 200 includes terminal rows 210, wafer mold inserts 230, and other components described below. Wafer assembly 200 supports, separates and aligns terminal conductors in terminal rows 210. The wafer assembly 300 includes a terminal block 310, a wafer mold insert 330, and other components described below. The wafer assembly 300 supports, separates and aligns the terminal conductors in the terminal rows 310. The wafer assembly 400 includes a terminal block 410, a wafer mold insert 430A, and other components described below. Wafer assembly 400 supports, spaces and aligns the terminal conductors in terminal rows 410. The wafer assembly 500 includes a terminal row 510, a wafer mold insert 530A, and other components described below. Wafer assembly 500 supports, separates and aligns terminal conductors in terminal rows 510. Each wafer assembly 200, 300, 400, and 500 also includes a ground path assembly that includes one or more shields. The ground path assemblies of wafer assemblies 200, 300, 400, and 500 will be described in further detail below.
Each of the terminal rows 210, 310, 410, and 510 includes a row of terminal conductors including signal conductors, power conductors, and ground conductors. The signal conductors and power conductors in the terminal rows 210, 310, 410, and 510 each include a lead contact (lead contact) at one distal end (i.e., within the front port opening 12 of the connector 10 shown in fig. 1A-1D), a tail contact (tail contact) at the other distal end (i.e., at the terminal pin 13), and one or more conductor bends between the lead contact and the tail contact. The signal conductors and the power conductors in the terminal rows 210, 310, 410, and 510 are electrically insulated from each other within the connector 10. The signal conductors and power conductors extend from the lead contacts at the front port opening 12 to the tail contacts at the terminal pins 13 of the connector 10. The tail contacts of the signal conductors and the power conductors may be formed as SMT tail contacts (as shown in the example), or vias or other types of contacts. The ground conductors in terminal rows 210, 310, 410, and 510 each include a lead contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the lead contacts within the front port opening 12 to the tail contacts at the terminal feet 13 of the connector 10.
Referring to fig. 2A and 2B, the terminal block 210 includes a first group 210A of terminal conductors, a second group 210B of terminal conductors, and a central group 210C of terminal conductors located between the first group 210A and the second group 210B. Groups 210A and 210B include ground conductors and signal conductors. For example, group 210A includes ground conductor 211, signal conductors 212 and 213 of the differential pair, and ground conductor 214. Conductors 211-214 include lead contacts 211A-214A, respectively, at front port opening 12 of connector 10 and tail contacts 211B-214B, respectively, at terminal pins 13 of connector 10. Conductors 211 and 214 are ground conductors in terminal block 210 and conductors 212 and 213 are signal conductors in terminal block 210. As shown, signal conductors 212 and 213 are located between ground conductors 211 and 214. Each terminal conductor in the terminal block 210 includes a conductor bend between the lead contact and the tail contact.
Referring to fig. 3B and 3C, the terminal block 310 includes a first group 310A of terminal conductors, a second group 310B of terminal conductors, and a central group 310C of terminal conductors located between the first group 310A and the second group 310B. Groups 310A and 310B include ground conductors and signal conductors. For example, referring also to fig. 3B, group 310A includes ground conductor 311, signal conductors 312 and 313 of the differential pair, and ground conductor 314. Conductors 311-314 include lead contacts 311A-314A, respectively, at front port opening 12 of connector 10, and tail contacts 311B-314B, respectively, at terminal feet 13 of connector 10. Conductors 311 and 314 are ground conductors in terminal block 310 and conductors 312 and 313 are signal conductors in terminal block 310. As shown, signal conductors 312 and 313 are located between ground conductors 311 and 314. Each terminal conductor in the terminal block 310 includes a conductor bend between the lead contact and the tail contact.
Referring to fig. 3B and 3C, the terminal block 410 includes a first group 410A of terminal conductors, a second group 410B of terminal conductors, and a central group 410C of terminal conductors between the first group 410A and the second group 410B. Groups 410A and 410B include ground conductors and signal conductors. For example, referring also to fig. 3C, group 410A includes a ground conductor 411, signal conductors 412 and 413 of the differential pair, and a ground conductor 414. Conductors 411-414 include lead contacts 411A-414A, respectively, at front port opening 12 of connector 10 and tail contacts 411B-414B, respectively, at terminal pins 13 of connector 10. Conductors 411 and 414 are ground conductors in terminal block 410 and conductors 412 and 413 are signal conductors in terminal block 410. As shown, signal conductors 412 and 413 are located between ground conductors 411 and 414. Each terminal conductor in the terminal row 410 includes a conductor bend between the lead contact and the tail contact.
Referring to fig. 2A and 2B, the terminal block 510 includes a first group 510A of terminal conductors, a second group 510B of terminal conductors, and a central group 510C of terminal conductors between the first group 510A and the second group 510B. Groups 510A and 510B include ground conductors and signal conductors. For example, group 510A includes a ground conductor 511, signal conductors 512 and 513 of the differential pair, and a ground conductor 514. Conductors 511-514 include lead contacts 511A-514A, respectively, at front port opening 12 of connector 10 and tail contacts 511B-514B, respectively, at terminal feet 13 of connector 10. Conductors 511 and 514 are ground conductors in terminal block 510 and conductors 512 and 513 are signal conductors in terminal block 510. As shown, signal conductors 512 and 513 are located between ground conductors 511 and 514. Each terminal conductor in the terminal block 510 includes a conductor bend between the lead contact and the tail contact.
The set 210A of terminal rows 210 includes four signal conductors and three ground conductors, for a total of seven terminal conductors, with each pair of signal conductors being located side-by-side between two ground conductors. The center group 210C of terminal conductors includes power conductors and, in some cases, may include ground conductors or signal conductors. Group 210B is similar to group 210A, but is located on the other side of central group 210C. In contrast to terminal rows 210, each of terminal rows 310, 410, and 510 includes a similar arrangement of signal conductors, ground conductors, and power conductors. However, the respective lengths, bent shapes, and other features of the terminal conductors in the terminal rows 210, 310, 410, and 510 may be different from each other.
The lead contacts of the terminal block 210 face the lead contacts of the terminal block 510. The lead contacts of the terminal block 310 face the lead contacts of the terminal block 410. In one example, the spacing between the lead contacts is the same in each of the terminal rows 210, 310, 410, and 510. However, the terminal conductors in terminal rows 210 may be offset relative to the terminal conductors in terminal rows 510 such that the lead contacts are offset between the rows. The terminal conductors in terminal rows 310 may also be offset relative to the terminal conductors in terminal rows 410 such that the lead contacts are offset between the rows. In other cases, the terminal conductors in terminal rows 210 and 510 may have the same pitch and be aligned (i.e., not staggered) relative to each other. In other cases, the terminal conductors in terminal rows 210 and 510 may have different lead contact pitches from each other. Similarly, the terminal conductors in terminal rows 310 and 410 may have the same pitch and be aligned with each other, or terminal rows 310 and 410 may have different lead contact pitches from each other.
The wafer mold insert 230 of the wafer assembly 200 may be formed of plastic (e.g., liquid Crystal Polymer (LCP), polyethylene (PE), polytetrafluoroethylene (PTFE), fluoropolymer, or other plastic or insulating material) and molded around the terminal conductors in the terminal rows 210. For example, the lead frame including the terminal rows 210 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and the terminal block 210 may be pressed or bent into the shape of the terminal block 210. The leadframe including the terminal strip 210 may then be placed into a mold, and a plastic material may be injected into the mold to form a sheet molding insert 230 around the terminal strip 210. The terminal strip 210 may then be cut or cut from the leadframe, and the individual terminal conductors of the terminal strip 210 may be further bent or otherwise formed into the shape shown.
The wafer mold insert 230 of the wafer assembly 200 maintains the spacing between and supports the terminal conductors in the terminal block 210. Wafer molding insert 230 also includes structural features for positioning and securing wafer assembly 200 within housing 100 of connector 10. More specifically, wafer mold insert 230 includes guide flanges 232 and 233 for guiding wafer assembly 200 within housing 100 during assembly of connector 10, as described in further detail below. In the example shown, the guide flanges 232 and 233 are formed in the shape of a rectangular cube and include chamfers or edges at the front side, although the size and shape of the guide flanges 232 and 233 may vary in different embodiments. Guide flange 233 is sized to fit and slide with minimal clearance within wafer reference channel 136 (see fig. 1D) of housing 100, and guide flange 232 is also sized to fit and slide within a similar wafer reference channel of housing 100. During assembly of connector 10, wafer assembly 200 is positioned such that guide flanges 232 and 233 are aligned with the wafer reference channels of housing 100. The wafer assembly 200 may then be inserted into the interior region 102 of the housing 100 in the direction "D" shown in fig. 1D, and the guide flanges 232 and 233 may be slid within the wafer reference channels of the housing 100.
The wafer molding insert 230 also includes interlocking legs 234 and 235 for positioning and securing the wafer assembly 200 within the housing 100 of the connector 10. The shape of the interlocking legs 234 and 235 is formed as a rectangular cube, but the size and shape of the interlocking legs 234 and 235 may vary from embodiment to embodiment. The interlocking legs 234 and 235 are designed to mechanically engage leg latch fingers 157 and 158 of the housing 100, as described in further detail below with reference to fig. 5.
The wafer molding insert 230 also includes an interlocking nose 239 for positioning the wafer assembly 200 within the housing 100 of the connector 10. The interlocking noses 239 are located at opposite centers of the wafer assembly 200 and are formed as elongated noses. When the connector 10 is assembled, the interlocking noses 239 fit and extend into corresponding locating recesses 137 (see fig. 1D) within the housing 100. That is, when the connector 10 is assembled, the interlock nose 239 fits within the positioning recess 137 and occupies the positioning recess 137 with a minimum clearance between the outer surface of the interlock nose 239 and the inner surface of the positioning recess 137 within the housing 100.
The wafer mold insert 330 of the wafer assembly 300 may be formed of plastic (e.g., LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material) and molded around the terminal conductors in the terminal rows 310. For example, the lead frame including the terminal rows 310 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and the terminal block 310 may be pressed or bent into the shape of the terminal block 310. The leadframe including the terminal rows 310 may then be placed into a mold, and a plastic material may be injected into the mold to form a sheet molding insert 330 around the terminal rows 310. The terminal strip 310 may then be cut or cut away from the leadframe, and the individual terminal conductors of the terminal strip 310 may be further bent or otherwise formed into the shape shown.
The wafer mold insert 330 of the wafer assembly 300 maintains the spacing between and supports the terminal conductors in the terminal rows 310. Wafer molding insert 330 also includes structural features for positioning and securing wafer assembly 300 within housing 100 of connector 10. More specifically, the sheet molding insert 330 includes interlocking flanges 332 and 333 (see fig. 3C) located at opposite sides of the sheet molding insert 330. In the example shown, the interlocking flanges 332 and 333 are formed in the shape of a rectangular cube and include chamfers or edges, although the size and shape of the interlocking flanges 332 and 333 may vary in different embodiments. The interlocking flanges 332 and 333 are sized to fit and slide within the wafer reference channels 131 and 134, respectively, of the housing 100 with minimal clearance therebetween when the connector 10 is assembled.
The interlocking flanges 332 and 333 are also designed to mechanically engage the latching fingers 152 and 156, respectively, and lock into place within the housing 100. As described above, the latch fingers 152 and 156 will flex to some extent when a force is applied thereto. The latching fingers 152 and 156 are also resilient and will return to the position shown in fig. 1A and 1B when such force is removed. During assembly of connector 10, wafer assembly 300 is positioned such that interlocking flanges 332 and 333 are aligned with wafer reference channels 131 and 134 of housing 100. The wafer assembly 300 may then be inserted into the interior region 102 of the housing 100 in the direction "D" shown in fig. 1D, and the interlocking flanges 332 and 333 may slide within the wafer reference channels 131 and 134 of the housing 100. As the interlock flanges 332 and 333 slide within the sheet datum passages 131 and 134, the interlock flanges 332 and 333 will interfere with the tips or ends of the latch fingers 152 and 156, pushing the latch fingers 152 and 156 out of the openings 142 and 146. When the interlocking flanges 332 and 333 are pushed beyond the tips or ends of the latching fingers 152 and 156, the latching fingers 152 and 156 may snap back behind the interlocking flanges 332 and 333 of the wafer mold insert 330 of the wafer assembly 300, securing the wafer assembly 300 in place within the housing 100.
The wafer mold inserts 430 and 430A of the wafer assembly 400 may be formed of plastic (e.g., LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material) and molded around the terminal conductors in the terminal rows 410. For example, the lead frame including the terminal rows 410 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and the terminal strip 410 may be pressed or bent into the shape of the terminal strip 410. The leadframe including the terminal strip 410 may then be placed into a mold, and a plastic material may be injected into the mold to form the sheet molding inserts 430 and 430A around the terminal strip 410. The terminal strip 410 may then be cut or cut away from the leadframe, and the individual terminal conductors of the terminal strip 410 may be further bent or otherwise formed into the shape shown.
The wafer mold inserts 430 and 430A of the wafer assembly 400 maintain the spacing between and support the terminal conductors in the terminal block 410. The wafer molding inserts 430 and 430A also include structural features for locating and securing the wafer assembly 400 within the housing 100 of the connector 10. More specifically, the sheet molding insert 430 includes interlocking flanges 432 and 433 (see fig. 3B) located at opposite sides of the sheet molding insert 430. In the example shown, the interlocking flanges 432 and 433 are formed in the shape of a rectangular cube and include chamfers or edges, but the size and shape of the interlocking flanges 432 and 433 may vary in different embodiments. The interlocking flanges 432 and 433 are sized to fit and slide within the wafer reference channels 132 and 135, respectively, of the housing 100 with minimal clearance therebetween when the connector 10 is assembled.
The interlocking flanges 432 and 433 are also designed to mechanically engage the latch fingers 150 and 154, respectively, and lock into place within the housing 100. As described above, the latch fingers 150 and 154 will flex to some extent when a force is applied thereto. The latch fingers 150 and 154 are also resilient and will return to the position shown in fig. 1A and 1B when such force is removed. During assembly of connector 10, wafer assembly 400 is positioned such that interlocking flanges 432 and 433 are aligned with wafer reference channels 132 and 135 of housing 100. The wafer assembly 400 may then be inserted into the interior region 102 of the housing 100 in the direction "D" shown in fig. 1D, and the interlocking flanges 432 and 433 may be slid within the wafer reference channels 132 and 135 of the housing 100. As the interlock flanges 432 and 433 slide within the wafer reference channels 132 and 135, the interlock flanges 432 and 433 will interfere with the tips or ends of the latch fingers 150 and 154, pushing the latch fingers 150 and 154 out of the openings 140 and 144. When the interlocking flanges 432 and 433 are pushed beyond the tips or ends of the latching fingers 150 and 154, the latching fingers 150 and 154 may snap back behind the interlocking flanges 432 and 433 of the wafer molding insert 430 of the wafer assembly 400, securing the wafer assembly 400 in place within the housing 100.
In addition, sheet molding insert 430A includes guide flanges 432A and 433A (see FIG. 3C) at opposite ends of sheet molding insert 430A. In the example shown, the guide flanges 432A and 433A are formed in the shape of a rectangular cube and include chamfers or edges, although the size and shape of the guide flanges 432A and 433A may vary in different embodiments. When connector 10 is assembled, guide flanges 432A and 433A are sized to fit and slide within wafer reference channels 130 and 133, respectively, of housing 100 with minimal clearance therebetween. During assembly of connector 10, wafer assembly 400 is positioned such that guide flanges 432A and 433A are aligned with wafer reference channels 130 and 133 of housing 100. The wafer assembly 400 is inserted into the interior region 102 of the housing 100 in the direction "D" shown in fig. 1D, and the guide flanges 432A and 433A are slidable within the wafer reference channels 130 and 133 of the housing 100. In some cases, wafer assembly 400 may be joined or connected (e.g., assembled) with wafer assembly 500, and wafer assemblies 400 and 500 may be inserted together into housing 100. However, in other embodiments, wafer assemblies 400 and 500 may be inserted into interior region 102 of housing 100, respectively.
The wafer mold insert 430 also includes a locating socket. In particular, as shown in FIG. 3B, the sheet molding insert 430 includes locating receptacles 442 and 443 formed in the top surfaces of the interlocking flanges 432 and 433, respectively. The locating receptacles 442 and 443 are formed as recessed receptacles within the interlocking flanges 432 and 433. The positioning posts of wafer assembly 500 may be positioned to extend within positioning receptacles 442 and 443, as described in further detail below.
The wafer mold inserts 530 and 530A of the wafer assembly 500 may be formed of plastic (e.g., LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material) and molded around the terminal conductors in the terminal rows 510. For example, the lead frame including the terminal rows 510 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and the terminal block 510 may be pressed or bent into the shape of the terminal block 510. The leadframe including the terminal strip 510 may then be placed into a mold, and a plastic material may be injected into the mold to form the sheet molding inserts 530 and 530A around the terminal strip 510. The terminal strip 510 may then be cut or cut from the leadframe, and the individual terminal conductors of the terminal strip 510 may be further bent or otherwise formed into the shape shown.
The wafer mold inserts 530 and 530A of the wafer assembly 500 maintain the spacing between and support the terminal conductors in the terminal block 510. The wafer molding inserts 530 and 530A also include structural features for positioning and securing the wafer assembly 500 within the housing 100 of the connector 10. More specifically, the sheet molding insert 530 includes guide flanges 532 and 533 (see fig. 3A) at opposite sides of the sheet molding insert 530. The guide flanges 532 and 533 are sized to fit and slide within the wafer reference channel of the housing 100 with minimal clearance therebetween when the connector 10 is assembled.
Further, the sheet molding insert 530A includes guide flanges 532A and 533A (see fig. 3A) at opposite ends of the sheet molding insert 530A. In the example shown, the guide flanges 532A and 533A are formed as rectangular cubes in shape and include chamfers or edges, although the size and shape of the guide flanges 532A and 533A may be different in different embodiments. The guide flanges 532A and 533A are sized to fit and slide within the wafer reference channels 130 and 133, respectively, of the housing 100 with minimal clearance therebetween when the connector 10 is assembled. During assembly of connector 10, wafer assembly 500 is positioned such that guide flanges 532A and 533A are aligned with wafer reference channels 130 and 133 of housing 100. The wafer assembly 500 is inserted into the interior region 102 of the housing 100 in the direction "D" shown in fig. 1D, and the guide flanges 532A and 533A may slide within the wafer reference channels 130 and 133 of the housing 100.
The wafer molding insert 530 also includes a locator post. In particular, the wafer molding insert 530 includes locating posts 542 and 543 that extend downwardly along the bottom edges of the guide flanges 532 and 533, as shown in fig. 3A. The locating posts 542 and 543 of wafer assembly 500 may be positioned to extend within locating receptacles 442 and 443 of wafer assembly 400. That is, wafer assembly 500 may be positioned over wafer assembly 400 and locating posts 542 and 543 may be inserted into locating receptacles 442 and 443 of wafer assembly 400. The locating posts 542 and 543 and locating receptacles 442 and 443 provide a mechanism for aligning the wafer assemblies 400 and 500 together. The wafer assemblies 400 and 500 may then be inserted together into the interior region 102 of the housing 100, as described herein.
The wafer molding insert 530 also includes an interlocking nose 539 for positioning the wafer assembly 500 within the housing 100 of the connector 10. The interlocking nose 539 is located at the opposite center of the wafer assembly 500 and is formed as an elongated nose. When the connector 10 is assembled, the interlocking noses 539 fit and extend into corresponding locating holes 138 (see fig. 1A) in the housing 100. That is, when the connector 10 is assembled, the interlock nose 539 fits within and occupies the locating hole 137 with a minimum gap between the outer surface of the interlock nose 539 and the inner surface of the locating hole 137.
Turning to other aspects of the embodiments, FIG. 4A illustrates a partially exploded view of the wafer assembly 200 of the connector 10 illustrated in FIG. 1A. Wafer assembly 200 includes flexible shields 250 and 260 and rigid shields 270 and 280. The flexible shields 250 and 260 and the rigid shields 270 and 280 form a ground path assembly for the wafer assembly 200. The ground path assembly is also electrically coupled to and includes ground conductors in the terminal block 210 (including ground conductors 211, 214, etc.). The rigid shields 270 and 280 of the wafer assembly 200 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. The metal plates forming the rigid shields 270 and 280 may be relatively thicker than the metal plates used to form the flexible shields 250 and 260, as described in further detail below. Rigid shields 270 and 280 are designed to secure wafer assembly 200 together and provide strength, support, and additional rigidity to wafer assembly 200 and connector 10.
In the example shown in fig. 4A, the rigid shield 270 includes a first section 270A, a second section 270B, and a third section 270C with bends between the sections 270A-270C. The sections 270A-270C extend in different directions and are angled with respect to each other. The rigid shield 270 is generally formed to follow the bends in the conductor terminal strip 210. The rigid shield 270 also includes a contact surface area 271, a shield extension area 272, and a staking aperture 273. Similar to the rigid shield 270, the rigid shield 280 includes a plurality of sections with bends therebetween. The rigid shield 280 also includes a contact surface area 281, a shield extension area 282, and a staking hole 283.
The rigid shields 270 and 280 are formed separately from the terminal block 210 and the sheet molding insert 230. As shown in fig. 4A, the sheet molding insert 230 includes staking posts, such as staking posts 236 and 237, and the like. When the sheet molding insert 230 is first molded around the terminal block 210, the staking posts 236 and 237 may be cylindrical, as shown in fig. 4A. To assemble wafer assembly 200, rigid shields 270 and 280 are placed with wafer mold insert 230 such that staking posts 236 and 237 extend through staking holes 273 and 283 of rigid shields 270 and 280. A heat staking process is then performed to heat the staking posts 236 and 237 above the melting temperature of the material forming the sheet molding insert 230 and the ends of the staking posts 236 and 237 are pressed and formed into caps with a portion of the caps pressed against the back surfaces of the rigid shields 270 and 280. This process secures the rigid shields 270 and 280 with the sheet molding insert 230.
When wafer assembly 200 is assembled, contact surface area 271 of rigid shield 270 is in contact with the surface of the ground conductor in terminal block 210. For example, the contact surface area 271 of the rigid shield 270 is in contact with the length (length side) of the ground conductors in the first set 210A of the terminal conductors in the terminal block 210 (including the ground conductors 211 and 214, etc.). The shield extension 272 is mechanically and electrically separated from and does not contact the signal conductors in the first set 210A of terminal conductors by a gap. For example, the rigid shield 270 does not contact the signal conductors 212 and 213 or any other signal conductors in the terminal block 210.
When wafer assembly 200 is assembled, contact surface area 281 of rigid shield 280 also contacts the surface of the ground conductor in terminal row 210. For example, the contact surface area 281 of the rigid shield 280 is in contact with the length of the ground conductors in the second set 210B of terminal conductors in the terminal block 210. The shield extension 282 is spaced from and does not contact the signal conductors in the second set 210B of terminal conductors.
In some cases, the contact surface area 271 of the rigid shield 270 and the contact surface area 281 of the rigid shield 280 may be electrically coupled or terminated to the upper surface area of the ground conductor in the terminal block 210 by welding (e.g., laser welding, spot welding, etc.), soldering (soldering), conductive adhesive, or other means. For example, electrical contact and termination may be established by soldering, brazing, adhesive, or other means along the length of the ground conductors and contact surface areas 271 and 281 in the terminal block 210, or at certain points or areas along the ground conductors and contact surface areas 271 and 281 in the terminal block 210.
The flexible shields 250 and 260 of the wafer assembly 200 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. In some cases, the metal plates forming the flexible shields 250 and 260 may be relatively thinner than the metal plates used to form the rigid shields 270 and 280. The flexible shields 250 and 260 are designed to be relatively more compliant than the rigid shields 270 and 280 so that the lead contacts of the terminal block 210 can flex and spring up to some extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and between the terminal blocks 210 and 510.
The flexible shield 250 includes a contact surface region 251 and a shield extension region 252. Similar to the flexible shield 250, the flexible shield 260 includes a contact surface region 261 and a shield extension region 262. When the wafer assembly 200 is assembled, the contact surface region 251 of the flexible shield 250 is in contact with the lower surface of the ground conductor in the terminal block 210. For example, the contact surface region 251 of the flexible shield 250 is in contact with the length of the ground conductors in the first set 210A of terminal conductors (including the ground conductors 211 and 214, etc.) in the terminal block 210. The shield extension region 252 is mechanically and electrically separated from and does not contact the signal conductors in the first set 210A of terminal conductors by a gap. When wafer assembly 200 is assembled, contact surface area 261 of flexible shield 260 also contacts the lower surface of the ground conductor in terminal block 210. For example, the contact surface area 261 of the flexible shield 260 is in contact with the length of the ground conductors in the second set 210B of terminal conductors in the terminal block 210. The shield extension region 262 is mechanically and electrically separated from and does not contact the signal conductors in the second set 210B of terminal conductors by a gap.
In some cases, the contact surface region 251 of the flexible shield 250 and the contact surface region 261 of the flexible shield 260 may be electrically coupled or terminated to the lower surface region of the ground conductor in the terminal block 210 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, electrical contact and termination may be established by soldering, brazing, adhesive, or other means along the length of the ground conductors and contact surface regions 251 and 261 in the terminal block 210, or at certain points or areas along the ground conductors and contact surface regions 251 and 261 in the terminal block 210.
The flexible shields 250 and 260 and the rigid shields 270 and 280 form a ground path assembly for the wafer assembly 200. The flexible shields 250 and 260 and the rigid shields 270 and 280 provide a grounding structure to mitigate crosstalk, electromagnetic interference, and other undesirable effects between the wafer assembly 200 and the wafer assemblies 200,300,400, and 500 also within the connector 10. The ground structure also helps control the impedance of the signal conductors in the terminal block 210, which act as transmission lines for data communications. The grounded structure provided by the flexible shields 250 and 260 and the rigid shields 270 and 280 facilitates higher data rate applications of the connector 10, such as 56 gigabytes/second (Gb/s), 112Gb/s, 224Gb/s, and faster data rates.
Fig. 4B illustrates a partially exploded view of wafer assembly 300 of connector 10 shown in fig. 1A. The wafer assembly 300 includes flexible shields 350 and 360 and rigid shields 370 and 380. The flexible shields 350 and 360 and the rigid shields 370 and 380 form a ground path assembly for the wafer assembly 300. The ground path assembly is also electrically coupled to and includes ground conductors (including ground conductors 311, 314, etc.) in terminal block 310. The rigid shields 370 and 380 of the wafer assembly 300 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. The metal plates forming the rigid shields 370 and 380 may be relatively thicker than the metal plates used to form the flexible shields 350 and 360, as described in further detail below. The rigid shields 370 and 380 are designed to secure with the wafer assembly 300 and provide strength, support, and additional rigidity to the wafer assembly 300 and connector 10.
In the example shown in fig. 4B, the rigid shield 370 includes a first section 370A and a second section 370B with a bend between the sections 370A and 370B. The sections 370A and 370B extend in different directions and are angled relative to each other. The rigid shield 370 is generally formed to follow the bends in the terminal strip 310 of the conductor. The rigid shield 370 further includes a contact surface region 371, a shield extension region 372, and a staking aperture 373. Similar to the rigid shield 370, the rigid shield 380 includes a plurality of sections with bends therebetween. The rigid shield 380 also includes a contact surface area 381, a shield extension area 382, and a staking hole 383.
The rigid shields 370 and 380 are formed separately from the terminal block 310 and the sheet molding insert 330. As shown in fig. 4B, the sheet molding insert 330 includes staking posts, such as staking posts 336 and 337, and the like. When the wafer mold insert 330 is first molded around the terminal block 310, as shown in fig. 4B, the staking posts 336 and 337 may be cylindrical. To assemble wafer assembly 300, rigid shields 370 and 380 are placed with wafer mold insert 330 such that staking posts 336 and 337 extend through staking holes 373 and 383 of rigid shields 370 and 380. A thermal staking process is then performed to heat the staking posts 336 and 337 above the melting temperature of the material forming the sheet molding insert 330 and the ends of the staking posts 336 and 337 are pressed and formed into caps, a portion of which is pressed against the back surfaces of the rigid shields 370 and 380. This process secures the rigid shields 370 and 380 with the sheet molding insert 330.
When wafer assembly 300 is assembled, contact surface area 371 of rigid shield 370 contacts the surface of the ground conductor in terminal block 310. For example, the contact surface area 371 of the rigid shield 370 contacts the length of the ground conductors (including ground conductors 311 and 314, etc.) in the terminal block 310. The shield extension 372 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 310 by a gap. When wafer assembly 300 is assembled, contact surface area 381 of rigid shield 380 also contacts the surface of the ground conductors in terminal row 310. The shield extension region 382 is spaced apart from and does not contact the signal conductors in the terminal block 310.
In some cases, contact surface area 371 of rigid shield 370 and contact surface area 381 of rigid shield 380 may be electrically coupled or terminated to a lower surface area of a ground conductor in terminal block 310 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, electrical contact and termination may be established along the length of the ground conductors and contact surface areas 371 and 381 in the terminal strip 310, or by soldering, brazing, adhesive, or other means at certain points or areas along the contact surface areas 371 and 381.
The flexible shields 350 and 360 of the wafer assembly 300 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. In some cases, the metal plates forming the flexible shields 350 and 360 may be relatively thinner than the metal plates used to form the rigid shields 370 and 380. The flexible shields 350 and 360 are designed to be relatively more compliant than the rigid shields 370 and 380 so that the lead contacts of the terminal strip 310 can flex and spring up to some extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and between the terminal strips 310 and 410.
The flexible shield 350 includes a contact surface region 351 and a shield extension region 352. Similar to flexible shield 350, flexible shield 360 includes a contact surface region 361 and a shield extension region 362. When wafer assembly 300 is assembled, contact surface area 351 of flexible shield 350 is in contact with the lower surface of the ground conductor in terminal row 310. For example, the contact surface area 351 of the flexible shield 350 is in contact with the length of the ground conductors (including the ground conductors 311 and 314, etc.) in the terminal block 310. The shield extension area 352 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 310 by a gap. When wafer assembly 300 is assembled, contact surface area 361 of flexible shield 360 also contacts the lower surface of the ground conductor in terminal block 310. The shield extension region 362 is mechanically and electrically spaced from and does not contact the signal conductors in the terminal block 310.
In some cases, contact surface area 351 of flexible shield 350 and contact surface area 361 of flexible shield 360 may be electrically coupled or terminated to a lower surface area of a ground conductor in terminal strip 310 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, electrical contact or termination may be established along the length of contact surface regions 351 and 361, or by soldering, brazing, adhesive, or other means at certain points or areas along contact surface regions 351 and 361.
The flexible shields 350 and 360 and the rigid shields 370 and 380 form a ground path assembly for the wafer assembly 300. The flexible shields 350 and 360 and rigid shields 370 and 380 provide a grounding structure to mitigate crosstalk, electromagnetic interference, and other undesirable effects between wafer assembly 300 and wafer assemblies 200, 300, 400, and 500 also within connector 10. The ground structure also helps control the impedance of the signal conductors in the terminal block 310, which act as transmission lines for data communications. The grounded structure provided by the flexible shields 350 and 360 and the rigid shields 370 and 380 facilitates higher data rate applications of the connector 10.
Fig. 4C illustrates a partially exploded view of wafer assembly 400 of connector 10 shown in fig. 1A. Wafer assembly 400 includes flexible shields 450 and 460 and rigid shields 470 and 480. The flexible shields 450 and 460 and the rigid shields 470 and 480 form a ground path assembly for the wafer assembly 400. The ground path assembly is also electrically coupled to and includes ground conductors (including ground conductors 411, 414, etc.) in terminal strip 410. The rigid shields 470 and 480 of the wafer assembly 400 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. The metal plates forming the rigid shields 470 and 480 may be relatively thicker than the metal plates used to form the flexible shields 450 and 460, as described in further detail below. Rigid shields 470 and 480 are designed to secure wafer assembly 400 together and provide strength, support, and additional rigidity to wafer assembly 400 and connector 10.
In the example shown in fig. 4C, the rigid shield 470 includes a first section 470A and a second section 470B with a bend between the sections 470A and 470B. Sections 470A and 470B extend in different directions and are angled relative to each other. The rigid shield 470 is generally formed to follow the bends in the terminal strip 410 of the conductor. The rigid shield 470 also includes a contact surface area 471, a shield extension area 472, and a staking hole 473. Similar to the rigid shield 470, the rigid shield 480 includes a plurality of sections with bends therebetween. The rigid shield 480 also includes a contact surface region 481, a shield extension region 482, and a staking hole 483.
The rigid shields 470 and 480 are formed separately from the terminal block 410 and the sheet molding insert 430. As shown in fig. 4C, the sheet molding insert 430 includes staking posts, such as staking posts 436 and 437, and the like. When the sheet molding insert 430 is first molded around the terminal block 410, as shown in fig. 4C, the staking posts 436 and 437 may be cylindrical. To assemble wafer assembly 400, rigid shields 470 and 480 are arranged with wafer mold insert 430 such that staking posts 436 and 437 extend through staking holes 473 and 483 of rigid shields 470 and 480. A heat staking process is then performed to heat the staking posts 436 and 437 to a temperature above the melting temperature of the material forming the sheet molding insert 430, and the ends of the staking posts 436 and 437 are pressed and formed into caps, a portion of which is pressed against the back surfaces of the rigid shields 470 and 480. This process secures the rigid shields 470 and 480 with the sheet molding insert 440.
When wafer assembly 400 is assembled, contact surface area 471 of rigid shield 470 is in contact with the surface of the ground conductor in terminal row 410. For example, the contact surface area 471 of the rigid shield 470 is in contact with the length of the ground conductors (including the ground conductors 411 and 414, etc.) in the terminal strip 410. The shield extension 472 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 410. When wafer assembly 400 is assembled, contact surface area 481 of rigid shield 480 is also in contact with the surface of the ground conductor in terminal block 410. The shield extension 482 is spaced apart from and does not contact the signal conductors in the terminal block 410.
In some cases, the contact surface area 471 of the rigid shield 470 and the contact surface area 481 of the rigid shield 480 may be electrically coupled or terminated to the upper surface area of the ground conductor in the terminal strip 410 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, electrical contact and termination may be established by soldering, brazing, adhesive or other means along the length of the ground conductors and contact surface areas 471 and 481 in terminal strip 410, or at certain points or areas along contact surface areas 471 and 481.
The flexible shields 450 and 460 of the wafer assembly 400 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. In some cases, the metal plates forming the flexible shields 450 and 460 may be relatively thinner than the metal plates used to form the rigid shields 470 and 480. The flexible shields 450 and 460 are designed to be relatively more compliant than the rigid shields 470 and 480 so that the lead contacts of the terminal strip 410 can flex and spring up to some extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and between the terminal strips 410 and 410.
The flexible shield 450 includes a contact surface area and a shield extension area, and the flexible shield 460 also includes a contact surface area and a shield extension area. When wafer assembly 400 is assembled, the contact surface area of flexible shield 450 is in contact with the upper surface of the ground conductor in terminal row 410. The shield extension area of the flexible shield 450 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 410. When wafer assembly 400 is assembled, the contact surface area of flexible shield 460 also contacts the upper surface of the ground conductor in terminal row 410. The shield extension area of the flexible shield 460 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 410 by a gap. In some cases, the contact surface area of the flexible shield 450 and the contact surface area of the flexible shield 460 may be electrically coupled or terminated to the upper surface area of the ground conductor in the terminal strip 410 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, electrical contact and termination may be established along the length of the contact surface area, or by soldering, brazing, adhesive, or other means at certain points or areas along the contact surface area.
The flexible shields 450 and 460 and the rigid shields 470 and 480 form a ground path assembly for the wafer assembly 400. The flexible shields 450 and 460 and rigid shields 470 and 480 provide a grounding structure to mitigate crosstalk, electromagnetic interference, and other undesirable effects between the wafer assembly 400 and the wafer assemblies 200, 300, 400, and 500 also within the connector 10. The ground structure also helps control the impedance of the signal conductors in the terminal strip 410, which act as transmission lines for data communications. The grounded structure provided by the flexible shields 450 and 460 and the rigid shields 470 and 480 facilitates higher data rate applications of the connector 10.
Fig. 4D illustrates a partially exploded view of wafer assembly 500 of connector 10 shown in fig. 1A. Wafer assembly 500 includes flexible shields 550 and 560 and rigid shields 570 and 580. The flexible shields 550 and 560 and the rigid shields 570 and 580 form a ground path assembly for the wafer assembly 500. The ground path assembly is also electrically coupled to and includes ground conductors (including ground conductors 511, 514, etc.) in the terminal block 510. The rigid shields 570 and 580 of the wafer assembly 500 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. The metal plates forming the rigid shields 570 and 580 may be relatively thicker than the metal plates used to form the flexible shields 550 and 560, as described in further detail below. Rigid shields 570 and 580 are designed to secure together wafer assembly 500 and provide strength, support, and additional rigidity to wafer assembly 500 and connector 10.
In the example shown in fig. 4D, the rigid shield 570 includes a first section 570A, a second section 570B, and a third section 570C with bends between the sections 570A-570C. Sections 570A-570C extend in different directions and are angled with respect to each other. The rigid shield 570 is generally formed to follow the bends in the terminal strip 510 of the conductor. The rigid shield 570 further includes a contact surface region 571, a shield extension region 572, and a staking hole 573. Similar to the rigid shield 570, the rigid shield 580 includes a plurality of sections with bends therebetween. The rigid shield 580 also includes a contact surface region 581, a shield extension region 582, and a staking hole 583.
The rigid shields 570 and 580 are formed separately from the terminal block 510 and the sheet molding insert 530. As shown in fig. 4D, the sheet molding insert 530 includes staking posts, such as staking posts 536 and 537. When the wafer molding insert 530 is first molded around the terminal strip 510, the staking posts 536 and 537 may be cylindrical as shown in fig. 4D. To assemble wafer assembly 500, rigid shields 570 and 580 are arranged with wafer mold insert 530 such that staking posts 536 and 537 extend through staking holes 573 and 583 of rigid shields 570 and 580. A heat staking process is then performed to heat the staking posts 536 and 537 to above the melting temperature of the material forming the sheet molding insert 530 and the ends of the staking posts 536 and 537 are pressed and formed into caps with a portion of the caps pressed against the back surfaces of the rigid shields 570 and 580. This process secures the rigid shields 570 and 580 together with the sheet molding insert 530.
When the wafer assembly 500 is assembled, the contact surface area 571 of the rigid shield 570 is in contact with the surface of the ground conductor in the terminal block 510. For example, the contact surface region 571 of the rigid shield 570 is in contact with the length of the ground conductors (including the ground conductors 511 and 514, etc.) in the terminal block 510. The shield extension region 572 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 510 by a gap. When the wafer assembly 500 is assembled, the contact surface areas 581 of the rigid shields 580 are also in contact with the surface of the ground conductor in the terminal block 510. The shield extension area 582 is spaced apart from and does not contact the signal conductors in the terminal block 510.
In some cases, the contact surface region 571 of the rigid shield 570 and the contact surface region 581 of the rigid shield 580 may be electrically coupled and terminated to the lower surface region of the ground conductor in the terminal block 510 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, electrical contact and termination may be established by soldering, brazing, adhesive or other means along the length of the ground conductors and the contact surface areas 571 and 581 in the terminal block 510, or at certain points or areas along the contact surface areas 571 and 581.
The flexible shields 550 and 560 of the wafer assembly 500 may be formed (e.g., stamped, sheared, or otherwise formed) from a flat sheet of metal and, in some cases, plated. In some cases, the metal plates forming the flexible shields 550 and 560 may be relatively thinner than the metal plates used to form the rigid shields 570 and 580. The flexible shields 550 and 560 are designed to be relatively more compliant than the rigid shields 570 and 580 so that the lead contacts of the terminal block 510 can flex and spring up to some extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and between the terminal blocks 210 and 510.
The flexible shield 550 includes a contact surface area and a shield extension area, and the flexible shield 560 also includes a contact surface area and a shield extension area. When wafer assembly 500 is assembled, the contact surface area of flexible shield 550 is in contact with the upper surface of the ground conductor in terminal row 510. The shield extension area of the flexible shield 550 is mechanically and electrically separated from and does not contact the signal conductors in the terminal block 510. When wafer assembly 500 is assembled, the contact surface area of flexible shield 560 also contacts the upper surface of the ground conductor in terminal row 510. The shield extension area of the flexible shield 560 is mechanically and electrically spaced from and does not contact the signal conductors in the terminal block 510. In some cases, the contact surface area of flexible shield 550 and the contact surface area of flexible shield 560 may be electrically coupled and terminated to the upper surface area of the ground conductor in terminal block 510 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. Electrical contact and termination may be established, for example, by soldering, brazing, adhesive or other means along the length of the contact surface area or at certain points or areas along the contact surface area.
The flexible shields 550 and 560 and the rigid shields 570 and 580 form a ground path assembly for the wafer assembly 500. The flexible shields 550 and 560 and rigid shields 570 and 580 provide a grounding structure to mitigate crosstalk, electromagnetic interference, and other undesirable effects between wafer assembly 500 and wafer assemblies 200, 300, 400, and 500 also within connector 10. The ground structure also helps control the impedance of the signal conductors in the terminal block 510, which act as transmission lines for data communications. The grounding structure provided by the flexible shields 550 and 560 and the rigid shields 570 and 580 facilitates higher data rate applications of the connector 10.
Fig. 5 illustrates a cross-sectional view of the connector 10 labeled B-B in fig. 1D, in accordance with various embodiments of the present disclosure. As shown in fig. 5, the housing 100 includes openings 147 and 148 extending through the bottom of the housing 100. Openings 147 and 148 extend from the exterior of housing 100 to interior region 102 within housing 100 (see also fig. 1D). The latch fingers extend in a cantilevered arrangement within each opening 147 and 148. In particular, leg latch fingers 157 and 158 extend in a cantilevered arrangement around the periphery of openings 147 and 148, respectively. The tapered edges (TAPERED EDGES ) of the leg latch fingers 157 and 158 also extend partially within the openings 147 and 148.
As also shown in FIG. 2B, the wafer mold insert 230 of the wafer assembly 200 includes interlocking legs 234 and 235 for positioning and securing the wafer assembly 200 within the housing 100. The interlocking legs 234 and 235 are designed to mechanically engage the leg latch fingers 157 and 158 of the housing 100 to hold and secure the wafer assembly 200 in place. More specifically, during assembly of connector 10, wafer assembly 200 is positioned such that guide flanges 232 and 233 (see FIG. 2B) are aligned with the wafer reference channels of housing 100. Then, the wafer assembly 200 is inserted into the interior region 102 of the housing 100 in the direction "D" shown in fig. 1D, and the guide flanges 232 and 233 slide within the wafer reference channels of the housing 100. At this point, the interlocking legs 234 and 235 slide into the openings 148 and 147 of the housing 100 and push against the tapered edges of the leg latch fingers 157 and 158. Interlocking legs 234 and 235 of wafer assembly 200 push leg latch fingers 157 and 158 away from and toward the peripheral edges of openings 148 and 147. When the interlocking legs 234 and 235 are pushed beyond the tips or ends of the latching fingers 157 and 158, the leg latching fingers 157 and 158 may spring back and lie behind the interlocking legs 234 and 235 of the wafer mold insert 230 of the wafer assembly 200, as shown in fig. 5, securing the wafer assembly 200 in place within the housing 100.
Fig. 5 also shows how the contact surface areas of the rigid shields 270, 280, 370, 380, 470, 480, 570, and 580 contact the ground conductors in wafer assemblies 200, 300, 400, and 500 of the connector 10. The shield extension areas of the rigid shields 270, 280, 370, 380, 470, 480, 570, and 580 are mechanically and electrically spaced from and do not contact the signal conductors in the wafer assemblies 200, 300, 400, and 500 of the connector 10.
Next, a connector 10 according to still another embodiment of the present application will be described, in which the same components as those of the above-described respective embodiments are denoted by the same reference numerals, and a repetitive description of the same portions will be omitted for the sake of avoiding redundancy.
Referring to fig. 6 and 7, wherein fig. 6 is a top perspective view illustrating an exemplary connector according to yet another embodiment of the present disclosure, fig. 7 is a bottom perspective view illustrating the connector shown in fig. 6 according to yet another embodiment of the present disclosure, the connector 10 of the yet another embodiment likewise includes a front port opening 12, terminal pins 13 (shown in fig. 7), and a terminal row of terminal conductors extending from the front port opening 12 to the terminal pins 13 for communication of data signals on the terminal conductors. Connector 10 likewise includes a number of structural features to maintain alignment and position of the terminal conductors within connector 10. The connector 10 is also designed to provide shielding and maintain signal integrity of differential signals on the terminal conductors as they extend from the front port opening 12 to the terminal pins 13. Connector 10 likewise includes housing 100, and housing 100 includes bottom mounting surface 110, back surface 112, mounting posts 122 and 124, weld rings 126 and 128, and other features described below
Unlike the previous embodiments, the housing 100 of this further embodiment is formed of two parts, a plastic part 160 and a metal part 170, the front port opening 12 being formed in the plastic part 160, on the one hand to avoid possible scratch when the mating connector is inserted through the front port opening 12, and on the other hand to avoid shorting with the housing during mating, the metal part 170 being formed, for example, by molding, injection molding, die casting, printing or other techniques to increase the overall strength of the housing 100, and the metal part 170 also increasing the resistance to deformation of the housing 100 when the sheet assembly applies a force to the housing 100.
As shown with reference to fig. 8 and 9 in combination, fig. 8 is a top exploded perspective view showing the connector housing shown in fig. 6 according to still another embodiment of the present disclosure, fig. 9 is a bottom exploded perspective view showing the connector housing shown in fig. 6 according to still another embodiment of the present disclosure, the plastic part 160 of the housing 100 includes the first fastening part 162, and accordingly, the metal part 170 of the housing 100 includes the second fastening part 172, and in the example shown in fig. 8 and 9, both the first fastening part 162 and the second fastening part 172 have a substantially U-shape, the first fastening part 162 includes the catching groove part 1621 and the rib 1622 located at one side or both sides within the catching groove part 1621 (only the rib 1622 located at one side is shown in fig. 8 and 9), and the second fastening part 172 includes the catching arm part 1721. However, the first fastening portion 162 and the second fastening portion 172 may take other forms, such as a protrusion and a groove or a fastening hole.
The plastic portion 160 of the housing 100 further includes a connection protrusion 161, where the connection protrusion 161 is shown on the top surface of the plastic portion 160 and is three cylindrical protrusions, but not limited thereto, and the connection protrusion 161 may have other shapes, such as a prism shape. Corresponding to the connection protrusion 161, three connection holes 171 are provided on the top surface of the metal part 170, and the shape of the connection holes 171 may correspond to the shape of the connection protrusion 161. A suitable number of the coupling protrusions 161 and the coupling holes 171 may be provided according to actual needs.
At the time of assembling the plastic part 160 and the metal part 170, the first and second fastening parts 162 and 172 are fastened to each other while the connection protrusion 161 is penetrated through the connection hole 171, and then the end of the connection protrusion 161 may be press-formed into a cap by, for example, hot pressing, thereby fixing the plastic part 160 and the metal part 170 together. Of course, the plastic part 160 and the metal part 170 may be fixed to each other by an interference fit of the coupling protrusion 161 and the coupling hole 171. Alternatively, the cap fixed to the connection hole 171 may be formed by press-fitting the connection protrusion 161 and the connection hole 171, and then hot-pressing the end of the connection protrusion 161. When the first fastening part 162 and the second fastening part 172 are fastened to each other, for example, as shown in fig. 8 and 9, the clamping arm portion 1721 of the second fastening part 172 protrudes into the clamping groove portion 1621 of the first fastening part 162 and presses the rib 1622 located at one side or both sides of the clamping groove portion 1621, thereby forming a tight/interference fit between the first fastening part 162 and the second fastening part 172. The plastic part 160 and the metal part 170 of the case 100 are firmly assembled with each other by the fixed connection between the connection protrusion 161 and the connection hole 171 and the tight fit between the first and second fastening parts 162 and 172.
As with the various embodiments previously described, the housing 100 includes an interior space region 102 within which the wafer assemblies 200, 300, 400, 500 are positioned and secured when the connector 10 is assembled. In order to achieve positioning and fixing of the sheet body assembly 200, 300, 400, 500 within the inner space region 102 of the housing 100, the metal part 170 of this further embodiment further comprises the feature that a second positioning groove 173 is provided on an end of the top surface of the metal part 170 remote from the plastic part 160, a clamping groove 177 is provided on an end of the top surface of the metal part 170 close to the plastic part 160, and a first positioning groove 174 is provided on an end of the bottom surface of the metal part 170 close to the plastic part 160. The second detent 173[BH1 ] may be, for example, in the form of a dovetail slot, and the detent 177 may be, for example, in the form of a [ BH2] slot. A first and a second catching hole 175 and 176 are provided on both sidewalls of the metal part 170, and the first and second catching holes 175 and 176 are respectively shown on both sidewalls in fig. 8 and 9. The mating relationship of the various features described above with the wafer assemblies 200, 300, 400, 500 is described below.
Referring to fig. 10 and 11, fig. 10 and 11 are perspective views at different angles illustrating an internal structure of the connector housing shown in fig. 6 according to still another embodiment of the present disclosure, respectively, the housing 100 includes sheet reference passages 130, 131, 132 (shown in fig. 10) formed in one side wall inside the housing 100 and sheet reference passages 133, 134, 135 (shown in fig. 11) formed in the other opposite side wall inside the housing 100. The sheet reference passages 130 and 133 are disposed opposite to each other to form a reference passage into which the sheet assembly 200 (hereinafter, also referred to as the first sheet assembly 200) is inserted, and ends of the sheet reference passages 130 and 133 near the front port opening 12 or the plastic portion 160 (shown in fig. 6 and 7) are formed with stopper edges 1301 and 1331, respectively, to define a position into which the first sheet assembly 200 is inserted. Likewise, the sheet reference passages 131 and 134 are disposed opposite to each other to form reference passages into which the sheet assemblies 300 and 400 (hereinafter also referred to as the second sheet assembly 300 and the third sheet assembly 400, respectively) are inserted, and the ends of the sheet reference passages 131 and 134 near the front port opening 12 are formed with stopper edges 1311 and 1341, respectively, to define positions into which the second sheet assembly 300 and the third sheet assembly 400 are inserted. The sheet reference passages 132 and 135 are disposed opposite to each other to form a reference passage into which the sheet assembly 500 (hereinafter, also referred to as a fourth sheet assembly 500, respectively) is inserted, and ends of the sheet reference passages 132 and 135 near the front port opening 12 are formed with stopper edges 1321 and 1351, respectively, to define a position into which the fourth sheet assembly 500 is inserted.
Further, as shown in fig. 10 and 11, two insertion grooves 139 are also formed in opposite side walls of the inside of the case 100, respectively, and both ends of a support plate 600 (to be described later) may be inserted into the insertion grooves 139, respectively.
Next, the first sheet assembly 200, the second sheet assembly 300, the third sheet assembly 400, and the fourth sheet assembly 500 according to still another embodiment of the present disclosure will be specifically described with reference to fig. 12 and 13, wherein fig. 12 is a top exploded perspective view showing the sheet assemblies of the connector according to still another embodiment of the present disclosure, and fig. 13 is a bottom exploded perspective view showing the sheet assemblies of the connector according to still another embodiment of the present disclosure.
The first wafer assembly 200 according to still another embodiment of the present disclosure likewise includes a terminal row 210 and a wafer mold insert 230, the wafer mold insert 230 maintaining the spacing between and supporting the terminal conductors in the terminal row 210. Wafer molding insert 230 also includes structural features for positioning and securing wafer assembly 200 within housing 100 of connector 10. More specifically, wafer mold insert 230 includes guide flanges 232 and 233 on either side thereof for guiding wafer assembly 200 within housing 100 during assembly of connector 10, guide flanges 232 and 233 engaging wafer reference channels 130 and 133, respectively (i.e., fitting and sliding with minimal clearance to wafer reference channels 130 and 133), and limiting the extreme positions of insertion of first wafer assembly 200 within housing 100 by stop edges 1301 and 1331, respectively. First detents 2321 (shown in fig. 12) and 2331 (shown in fig. 13) are provided on the guide flanges 232 and 233, respectively, and with reference to fig. 10 and 11, the first detents 2321 and 2331 engage with first detents 175 provided on both side walls of the metal part 170 of the housing 100, respectively, when the first wafer assembly 200 is inserted into place inside the housing 100, to effect positioning of the first wafer assembly 200 in the housing 100. The first locking blocks 2321 and 2331 and the first locking hole 175 may be provided at different positions, and other structures may be used. According to the embodiment shown in fig. 12 and 13, a slope may be further provided on the first latch 2321, 2331 to guide when the first latch 2321, 2331 is engaged into the first latch hole 175. Further, as shown in fig. 13, a first positioning block 2301 is provided on the bottom surface of the sheet molding insert 230, the first positioning block 2301 being provided closer to the front port opening 12 or the plastic portion 160 than the first latch blocks 2321, 2331. When the first sheet member 200 is inserted into place in the interior of the housing 100, the first positioning piece 2301 is engaged with the first positioning groove 174 provided on the bottom surface of the metal portion 170 of the housing 100, and according to an embodiment, the first positioning piece 2301 is a projection, the first positioning groove 174 is a groove, and as shown with reference to fig. 9 and 13, the first positioning piece 2301 is biased to be limited in the first positioning groove 174 by the support plate 600 (described later), so that positioning in the left-right direction and the up-down direction can be achieved, and the first positioning piece 2301 and the first positioning groove 174 can be fitted tightly or loosely. Of course, the first positioning blocks 2301 and the first positioning grooves 174 may also be provided interchangeably, or in other forms.
The second wafer assembly 300 according to still another embodiment of the present disclosure likewise includes a terminal row 310 and a wafer mold insert 330, the wafer mold insert 330 maintaining the spacing between and supporting the terminal conductors in the terminal row 310. Wafer molding insert 330 also includes structural features for positioning and securing wafer assembly 300 within housing 100 of connector 10. More specifically, the sheet molding insert 330 includes interlocking flanges 332 (shown in fig. 12) and 333 (shown in fig. 13).
The third wafer assembly 400 according to still another embodiment of the present disclosure likewise includes a terminal row 410 and a wafer mold insert 430, the wafer mold insert 430 maintaining the spacing between and supporting the terminal conductors in the terminal row 410. The wafer molding insert 430 also includes structural features for locating and securing the wafer assembly 400 within the housing 100 of the connector 10. More specifically, sheet molding insert 430 includes interlocking flanges 432 (shown in FIG. 12) and 433 (shown in FIG. 13).
Further, as shown in fig. 12 and 13, the sheet molding insert 330 of the second sheet assembly 300 is provided with first positioning holes 3301 on both side end surfaces thereof, the sheet molding insert 430 of the third sheet 400 is provided with first positioning posts 4301 on both side end surfaces thereof, and the first positioning posts 4301 of the third sheet 400 may be inserted into the first positioning holes 3301 of the second sheet 300 to achieve positioning between the second sheet 300 and the third sheet 400. The cross section of the first positioning hole 3301 shown in fig. 12 and 13 is semicircular, and correspondingly, the first positioning post 4301 is also in a matched semi-cylindrical shape, but not limited to this, the first positioning post 4301 may also be in a cylindrical shape, a prismatic shape, and the like, and correspondingly, the cross section of the first positioning hole 3301 may also be in a circular shape or a prismatic shape, and the setting positions of the first positioning post 4301 and the first positioning hole 3301 may also be interchanged. The top surface of the sheet molding insert 330 of the second sheet 300 is further provided with a locking post 3302, and correspondingly, the top surface of the sheet molding insert 430 of the third sheet 400 is provided with a locking hole 4302, the locking post 3302 of the second sheet 300 may be inserted into the locking hole 4302 of the third sheet 400, and then may be fused and fixed to the locking hole 4302 by hot pressing or the like, or the locking post 3302 may be fixed to the locking hole 4302 by interference fit, or the locking post 3302 and the locking hole 4302 may be fused and fixed to each other by hot pressing after interference fit. The locking post 3302 shown in fig. 12 and 13 has a quadrangular prism shape, and correspondingly, the cross section of the locking hole 4302 has a matched rectangle, but not limited to this, the locking post 3302 may also have a semi-cylindrical shape, a cylindrical shape, other prisms, and the like, correspondingly, the cross section of the locking hole 4302 may also have a semi-circular shape, a circular shape, other prisms, and the setting positions of the locking post 3302 and the locking hole 4302 may also be interchanged, and the proper number of locking posts 3302 and locking holes 4302 may also be set according to the requirement. The second sheet member 300 and the third sheet member 400 are integrated with each other via the fitting of the first positioning post 4301 and the first positioning hole 3301 and the fitting of the locking post 3302 and the locking hole 4302. After the connector 10 is mounted, the interlocking flanges 332 and 432 and the interlocking flanges 333 and 433, which are coupled to each other, are respectively located in the reference passages 131 and 134 in the housing 100 with a minimum clearance, and are slidable along the reference passages 131 and 134.
As shown in fig. 12 and 13, the sheet molding insert 430 of the third sheet assembly 400 includes guide flanges 432A (shown in fig. 12) and 433A (shown in fig. 13) in addition to the interlocking flanges 432 and 433. The sheet molding insert 430 of the third sheet assembly 400 is provided with second locating holes 4303 at both ends of its top surface.
The fourth wafer assembly 500 according to yet another embodiment of the present disclosure likewise includes a terminal row 510 and a wafer mold insert 530, the wafer mold insert 530 maintaining the spacing between and supporting the terminal conductors in the terminal row 510. The wafer molding insert 530 also includes structural features for locating and securing the wafer assembly 500 within the housing 100 of the connector 10. More specifically, the wafer molding insert 530 includes first guide flanges 532 (shown in fig. 12) and 533 (shown in fig. 13), and second guide flanges 532A (shown in fig. 12) and 533A (shown in fig. 13). Second positioning posts 5302 are provided on both sides of the sheet molding insert 530 of the fourth sheet assembly 500, and the second positioning posts 5302 are correspondingly inserted into the second positioning holes 4303 of the third sheet 400 to achieve positioning fit of the third sheet assembly 400 and the fourth sheet assembly 500. The second positioning post 5302 shown in fig. 12 and 13 is in a quadrangular prism shape, and correspondingly, the cross section of the second positioning hole 4303 is also in a matched rectangle, but not limited to this, the second positioning post 5302 may also be in a semi-cylindrical shape, a cylindrical shape, other prisms, and the like, correspondingly, the cross section of the second positioning hole 4303 may also be in a semi-circular shape, a circular shape, other prisms, and the setting positions of the second positioning post 5302 and the second positioning hole 4303 may also be interchanged, and the proper number of the second positioning post 5302 and the second positioning hole 4303 may also be set according to the requirement. When the second and third wafer assemblies 300 and 400 are integrally and fixedly positioned with respect to the fourth wafer assembly 500 via the engagement of the second locating posts 5302 and the second locating holes 4303, the guide flanges 432A and 433A of the third wafer assembly 400 are aligned with the second guide flanges 532A and 533A of the fourth wafer assembly 500, respectively, and are integrally positioned with minimal clearance in the reference channel 136 (shown in FIGS. 10 and 11) within the housing 100 and are slidably movable along the reference channel 136.
The sheet molding insert 530 of the fourth sheet assembly 500 is provided with second latching blocks 5301 at both sides thereof, and as shown with reference to fig. 8 and 9, the second latching blocks 5301 of the fourth sheet assembly 500 may be correspondingly inserted into the second latching holes 176 provided at both sidewalls of the housing 100. In addition, an end of the top surface of the wafer mold insert 530 of the fourth wafer assembly 500 adjacent the front port opening 12 is provided with a protrusion 5304, which protrusion 5304 is correspondingly inserted into a card slot 177 provided on the top surface of the housing 100. The protrusion 5304 can be an interference fit with the card slot 177.
In order to avoid sagging or buckling of the rear end (i.e., the end away from the front port opening 12) of the fourth wafer assembly 500, in view of the greater length of the fourth wafer assembly 500 and the greater span distance when installed in the housing 100, a second positioning block 5303 is provided at the end of the top surface of the wafer mold insert 530 of the fourth wafer assembly 500 away from the front port opening 12, the second positioning block 5303 preferably being provided at a middle position in the left-right direction. When the fourth wafer assembly 500 is installed in place within the housing 100, the second locating block 5303 mates with the second locating groove 173 provided on the top surface of the metal portion 170 of the housing 100. When the second positioning groove 173 is in the form of a dovetail groove, the second positioning block 5303 is also in the form of a dovetail, but not limited thereto.
Also shown in fig. 12 and 13 is a support plate 600, the middle portion of which supports the bottom of the second sheet 300, both ends of which support plate 600 are respectively inserted into slots 139 (shown in fig. 10 and 11) provided on both inner sidewalls of the case 100, the support plate 600 supports the middle portion under the second sheet 200 to avoid sagging and warping thereof, and on the other hand, the support plate 600 has a certain elasticity, so that the second, third and fourth sheet assemblies 300, 400 and 500 integrally assembled together can be provided with a certain elasticity to compensate for assembly errors thereof, ensure tight fitting of the second, third and fourth sheet assemblies 300, 400 and 500 together, and can also absorb forces when the second, third and fourth sheet assemblies 300, 400 and 500 are interference-fitted.
The assembled structure of the first, second, third and fourth wafer assemblies 200, 300, 400 and 500 is shown in fig. 14 and 15, wherein fig. 14 and 15 are perspective and cross-sectional views, respectively, illustrating the first, second, third and fourth wafer assemblies 200, 300, 400 and 500 of a connector according to yet another embodiment of the present disclosure. The lead contacts of the terminal block 210 of the first wafer assembly 200 face the lead contacts of the terminal block 510 of the fourth wafer 500 and the lead contacts of the terminal block 310 of the second wafer assembly 300 face the lead contacts of the terminal block 410 of the third wafer plastic 400. As shown in fig. 15, the terminal tail structures of the first, second, third and fourth wafer assemblies 200, 300, 400 and 500 are each bent at about 90 ° to improve coplanarity of the terminal tails. Further, the foremost ends (near the front port opening 12) of the guide flanges 232 and 233 of the first wafer assembly 200 are the first edge L1, the foremost ends (near the front port opening 12) of the interlocking flanges 332, 432 and 333, 433 of the second and third wafer assemblies 300 and 400 are the second edge L2, and the foremost ends (near the front port opening 12) of the first guide flanges 532 and 533 of the fourth wafer 500 are the third edge L3, as shown in fig. 15, the first edge L1 being closest to the front port opening 12, followed by the third edge L3, followed by the second edge L2. Accordingly, as shown with reference to fig. 10 and 11, upon installation of the connector 10, the stop edges 1301 and 1331 of the sheet reference channels 130 and 133 engage the first edge L1 and are closest to the front port opening 12, the stop edges 1311 and 1341 of the sheet reference channels 131 and 134 engage the second edge L2 and are furthest from the front port opening 12, and the stop edges 1321 and 1351 of the sheet reference channels 132 and 135 engage the third edge L3 and are slightly further from the front port opening 12 and are closer to the stop edges 1301 and 1331.
Reference is next made again to fig. 16A and 16B, wherein fig. 16A is an overall schematic top view illustrating a connector according to yet another embodiment of the present disclosure, and fig. 16B is a cross-sectional view taken along line A-A of fig. 16A illustrating a connector according to yet another embodiment of the present disclosure. When the connector according to the present disclosure requires belly-to-belly to be soldered, i.e., soldering on both sides of the PCB, four tabs 20 may be provided on the bottom surface of the connector 10 to be soldered to the PCB to assist in the double-sided soldering operation. A support plate 600 supporting the first wafer assembly 200 is shown in the cross-sectional view of fig. 16B, with the support plate 600 abutting a mid-bottom surface location of the first wafer assembly 200, with a particular mounting arrangement and function as described above.
A connector according to yet another embodiment of the present disclosure may be provided with a rigid shield and a flexible shield as described in the various embodiments previously described to form a ground path assembly for each wafer 200, 300, 400, 500. A connector according to still another embodiment of the present disclosure and the connectors of the foregoing embodiments may also be provided with the following flexible shield 290.
Referring to fig. 17, fig. 17 is a schematic diagram illustrating another embodiment of a flexible shield 290 having its contact surface area clampingly terminated to the surface area of a ground terminal in a plurality of terminal conductors of each wafer. Specifically, as shown in fig. 17, the flexible shield 290 includes a plurality of beam portions 291, a plurality of clip portions 292, a plurality of abutting portions 293, a plurality of first shielding portions 294, and a plurality of second shielding portions 295. The plurality of sandwiching portions 292 of each flexible shield 290 are disposed at intervals along the left-right direction Y and are aligned with the plurality of ground terminals of the corresponding sheet, respectively. Each of the clamping portions 292 of each of the flexible shields 290 has a rib 296 extending in the up-down direction Z, and a pair of clamping arms 297 extending in the same direction (i.e., the direction approaching the corresponding ground terminal) from both sides of the rib 296 and curling inward. The clip arms 297 clip to the solder segments of the plurality of ground terminals, respectively. The plurality of beam portions 291 of each flexible shielding member 290 are disposed between two adjacent clamping portions 292 at a vertical interval, and the left and right ends of each beam portion 291 are respectively connected to two adjacent clamping portions 292. In the embodiment shown in fig. 17, the number of the plurality of clamping portions 292 is equal to the number of the plurality of ground terminals, but the number of the plurality of clamping portions 292 may be less than the number of the plurality of ground terminals, not limited to a specific number.
Terms such as "top," "bottom," "side," "front," "back," "right," and "left" are not intended to provide an absolute frame of reference. Rather, these terms are relative and are intended to identify certain features that are related to each other, as the orientation of the structures described herein may change. The terms "comprising," "including," "having," and the like are synonymous, are used in an open-ended fashion, and do not exclude additional elements, features, acts, operations, etc. Furthermore, the term "or" is used in its inclusive sense rather than in its exclusive sense, so that when used, for example, to connect a series of elements, the term "or" means one, some, or all of the elements in a list.
Unless otherwise indicated, a combination language such as "at least one of X, Y and Z" or "at least one of X, Y or Z" is generally used to denote one, a combination of any two, or all three (or more if a larger group is determined) of them, such as X and only X, Y and only Y, Z and only Z, X and Y combinations, X and Z combinations, Y and Z combinations, and all X, Y, Z combinations. Such language combinations are generally not intended, and unless specifically stated otherwise, do not denote or require inclusion of at least one of X, at least one of Y, and at least one of Z. The terms "about" and "substantially," unless otherwise defined herein as relating to a particular range, percentage, or related deviation metric, describe at least some manufacturing tolerances between theoretically designed and manufactured products or components, such as at the American society of mechanical EngineersY14.5 and related International organization for standardizationThe geometric dimensions and tolerance criteria described in the standard. As will be appreciated by those of ordinary skill in the art, such manufacturing tolerances are still contemplated even when theoretical terms such as geometrically "vertical," "orthogonal," "vertex," "collinear," "coplanar," and other terms are used in combination, even if "about," "substantially" or related terms are not explicitly recited.
The above-described embodiments of the present disclosure are merely examples of implementations to provide a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described embodiments without departing substantially from the spirit and principles of the disclosure. Furthermore, components and features described with respect to one embodiment may be included in another embodiment. All such modifications and variations are intended to be included herein within the scope of this disclosure.