Ultrasonic measurement method for internal temperature of composite material based on enveloping areaTechnical Field
The invention relates to the field of ultrasonic nondestructive detection, in particular to an ultrasonic measurement method for the internal temperature of a composite material based on an envelope area.
Background
The composite material is formed by combining two or more components with different physical or chemical properties through a physical or chemical method, and generally has excellent performances such as high strength, high modulus, high temperature resistance and the like, so that the composite material is widely applied to the fields of aerospace, automobiles, electronics and the like. For composite structures, internal temperature change characteristics play a critical role in thermal safety assessment. The ultrasonic temperature measurement technology is an effective means for evaluating the internal temperature distribution and change of the composite material because the ultrasonic temperature measurement technology can realize nondestructive and online measurement.
The traditional ultrasonic temperature measurement method requires that the measured material is a homogeneous material (pure metal, stainless steel and the like), and the internal temperature can be measured only when the echo sound of ultrasonic waves is required to be extracted, and when the echo signal is disturbed and the sound cannot be extracted for most of heterogeneous composite materials, the internal material components and structures are complex, the characterization of the internal temperature of the structure is considered to be realized by adopting other acoustic sensitivity.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides an ultrasonic measurement method for the internal temperature of a composite material based on an envelope area, and realizes measurement characterization of the internal temperature of a composite material structure by designing a novel ultrasonic temperature measurement method for the internal temperature of the composite material, thereby providing the most accurate reference data and evaluation basis for the safety evaluation of the structure.
The invention aims at realizing the following scheme:
an ultrasonic measurement method of the internal temperature of a composite material based on an envelope area comprises the following steps:
exciting ultrasonic waves above the composite material and receiving reflected echo signals at an excitation position;
Step (2), receiving an ultrasonic echo signal, and taking an envelope curve for an ultrasonic echo waveform;
Step (3), carrying out peak analysis on the first, second and third echo upper envelopes in the upper envelope curve and taking integral values of the areas of the peak analysis;
step (4), repeating the step (1) at different temperatures to obtain a series of ultrasonic echo signals, and obtaining the enveloping peak integration areas of the ultrasonic echo at different temperatures according to the steps (2) to (3);
Fitting the temperature and the peak integral area of the envelope on the ultrasonic echo to obtain an association relation S-T of the temperature and the envelope area;
and (6) measuring an ultrasonic echo signal in the composite material at a certain temperature during subsequent measurement and characterization of the internal temperature of the composite material, taking an envelope to obtain a peak area S, and substituting the peak area S into the S-T to obtain the temperature in the composite material at the certain temperature.
Further, in step (1), the composite material is in a high temperature environment.
Further, in step (2), the received ultrasonic echo signal is an ultrasonic echo signal under the combined influence of the anisotropy and temperature of the composite material.
Further, in step (3), the size reflection of the area represents the effect of temperature.
Further, the composite material comprises a superalloy-based ceramic particle reinforced composite material Ta10W/SiC.
Further, in Ta10W/SiC, the matrix is Ta10W, the reinforcing particles are made of SiC, the SiC particles are round, and the particle size is 10-110 mu m.
The beneficial effects of the invention include:
The method aims at the internal temperature measurement requirement of the structure of the composite material, gets rid of the traditional method for measuring the internal temperature of the structure by extracting the ultrasonic propagation time (during sound), and provides a characterization method of the internal temperature of the composite material based on the envelope area of ultrasonic signals based on ultrasonic detection. The method is suitable for measuring the temperature of typical composite materials commonly used in projects such as particle reinforced composite materials, fiber reinforced composite materials and the like.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic illustration of excitation of ultrasound waves in a composite material;
FIG. 2 is a schematic diagram of a received echo signal and an upper envelope of the echo signal;
FIG. 3 is a schematic diagram of an upper envelope peak area integral of an echo signal;
FIG. 4 is a schematic illustration of excitation of ultrasonic waves above a Ta10W/SiC particle reinforced composite;
FIG. 5 is a graph of temperature versus integrated area of envelope peaks over echoes at different temperatures.
Detailed Description
All of the features disclosed in all of the embodiments of this specification, or all of the steps in any method or process disclosed implicitly, except for the mutually exclusive features and/or steps, may be combined and/or expanded and substituted in any way.
The specific implementation process of the invention is as follows:
The invention adopts the upper envelope peak integral area of the echo signal as a sensitive quantity to realize the temperature measurement inside the composite material, and simultaneously quantitatively characterizes the comprehensive effect of the temperature and the composite material recombination degree on ultrasonic wave propagation from the ultrasonic wave waveform angle. In a specific embodiment, the method of the invention provides a characterization method of the internal temperature of the composite material based on the envelope area of ultrasonic signals based on ultrasonic detection aiming at the measurement requirement of the internal temperature of the structure of the composite material, and the method can realize quantitative characterization measurement of the internal temperature of the composite material, and is suitable for measuring the temperature of the composite material common in typical engineering such as particle reinforced composite material, fiber reinforced composite material and the like.
Further, in a preferred embodiment, the present invention specifically provides an ultrasonic measurement method for an internal temperature of a composite material based on an envelope area, comprising the steps of:
step (1), as shown in fig. 1, excites an ultrasonic wave over a composite material in a high temperature environment and receives a reflected echo signal at the excitation location.
In step (2), as shown in fig. 2, an ultrasonic echo signal under the influence of temperature is received, and considering that the upper envelope generally refers to the upper half of the envelope of the signal waveform, the upper half of the envelope can be used for analyzing and processing the modulated signal to help identify the change trend of the signal. The envelope is thus taken over the echo waveform of the ultrasound.
And (3) performing peak analysis on the first, second and third echo upper envelopes in the upper envelope line and taking integral values of the areas of the peak analysis, as shown in fig. 3. The size reflection of the area represents the effect of temperature. Wherein the dotted circled portions represent the first, second, third echoes, i.e. 1 echo, 2 echo, and 3 echo, respectively, and the darkened portions in the dotted lines represent the peak integral of the upper envelope.
And (4) repeating the step (1) at different temperatures to obtain a series of ultrasonic echo signals, and obtaining the peak integration areas of the ultrasonic echo envelopes at different temperatures according to the steps (2) - (3).
And (5) fitting the temperature and the peak integral area of the envelope on the ultrasonic echo to obtain an association relation S-T of the temperature and the envelope area.
And (6) measuring an ultrasonic echo signal in the composite material at a certain temperature during subsequent measurement and characterization of the internal temperature of the composite material, taking an envelope to obtain a peak area S, and substituting the peak area S into the S-T to obtain the temperature in the composite material at the certain temperature.
In other embodiments of the invention, the following steps are performed:
As shown in FIG. 4, a high-temperature alloy-based ceramic particle reinforced composite material Ta10W/SiC is selected as a study object, a substrate is Ta10W, a reinforced particle material is SiC, and a two-dimensional model with the length of 30mm and the height of 10mm is built in a COMSOL multiple physical field simulation platform. The SiC particles are round, the particle sizes are not equal to 10-110 mu m and are generated randomly by a random function, the SiC particles are uniformly distributed in a 30X 10mm area, the number of the SiC particles is 180, and the agglomeration phenomenon is avoided.
And (2) carrying out signal and data processing according to the method steps (2) to (5) of the invention to finally obtain the total peak integration area of the upper envelope of the first echo to the third echo at different temperatures, wherein the result is shown in table 1, and the correlation between the temperature and the peak integration area of the upper envelope of the ultrasonic echo is obtained at the same time, as shown in fig. 5, formula (1) and formula (2).
TABLE 1 variation of envelope peak integration area with temperature on ultrasonic signals
S= -0.009T2-4.19T+10866.46 （R2=0.98)(1);
S= -9.07T+11268.30 (R2=0.96)(2);
Wherein T is temperature, and R2 is square fitting goodness.
And measuring an ultrasonic echo signal in the Ta10W/SiC composite material at a certain temperature and a certain degree of recombination during subsequent temperature measurement characterization, taking an envelope to obtain a peak area S, and substituting the peak area S into the formula (1) or the formula (2) to obtain a temperature value in the composite material.
The units involved in the embodiments of the present invention may be implemented by software, or may be implemented by hardware, and the described units may also be provided in a processor. Wherein the names of the units do not constitute a limitation of the units themselves in some cases.
According to an aspect of embodiments of the present invention, there is provided a computer program product or computer program comprising computer instructions stored in a computer readable storage medium. The computer instructions are read from the computer-readable storage medium by a processor of a computer device, and executed by the processor, cause the computer device to perform the methods provided in the various alternative implementations described above.
As another aspect, the embodiment of the present invention further provides a computer readable medium, which may be included in the electronic device described in the above embodiment, or may exist alone without being assembled into the electronic device. The computer-readable medium carries one or more programs which, when executed by the electronic device, cause the electronic device to implement the methods described in the above embodiments.