Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, an object of the present application is to provide a display panel, which includes:
a substrate;
A pixel defining layer located on one side of the substrate, the pixel defining layer surrounding a plurality of pixel openings;
The isolation structure is positioned on one side of the pixel defining layer far away from the substrate, a plurality of isolation openings are formed by surrounding the isolation structure, orthographic projections of the pixel openings on the substrate are positioned in orthographic projections of the corresponding isolation openings on the substrate, the isolation structure comprises a supporting part and a shielding part positioned on one side of the supporting part far away from the substrate, the isolation structure further comprises an extending part positioned on one side of at least part of the supporting part facing the isolation openings, the extending part is positioned on one side of the pixel defining layer far away from the substrate, and the extending lengths of the extending parts at different positions in the direction facing the isolation openings are different in at least one isolation opening;
The light emitting devices at least partially are positioned in the corresponding pixel openings, each light emitting device comprises a first electrode, a light emitting functional layer and a second electrode, wherein the first electrode, the light emitting functional layer and the second electrode are stacked in a direction away from the substrate, and the second electrode of each light emitting device is overlapped with the extending part with a longer extending length.
In some possible implementations, the support has electrical conductivity, the support includes a first side and a second side disposed opposite to and facing the isolation opening, the extension within at least a portion of the isolation opening includes a first extension proximate the first side and a second extension proximate the second side, the second extension having an extension length less than an extension length proximate the first extension;
At least a portion of the second electrode of the light emitting device overlaps the second extension portion and/or the second electrode of the light emitting device overlaps the second side surface.
In some possible implementations, the material of the first extension includes a conductive material;
at least a portion of the second electrode of the light emitting device is in contact with the corresponding first extension;
Preferably, the light emitting functional layer is spaced apart from the first extension portion.
In some possible implementations, the support portion includes a first sub-layer and a second sub-layer located on a side of the first sub-layer away from the substrate, the first extension portion is connected to the first sub-layer, and the first extension portion and the first sub-layer are arranged in the same layer and are made of the same material;
Preferably, under the same etching conditions, the etching resistance of the second sub-layer is weaker than that of the shielding part;
Preferably, the orthographic projection of the supporting part on the substrate is positioned in the orthographic projection of the shielding part on the substrate;
Preferably, the material of the first sub-layer and the first extension comprises molybdenum and the material of the second sub-layer comprises aluminum;
Preferably, the material of the shielding part comprises titanium.
In some possible implementations, the first extension 1431 and the support are of the same material and are connected to each other;
preferably, the material of the support portion and the first extension portion 1431 comprises aluminum.
In some possible implementations, the first extension includes a first portion and a second portion, the first portion being located on a side of the pixel defining layer away from the substrate, the second portion extending along a side of the support;
Preferably, the material of the first extension is different from the material of the support.
In some possible implementations, the material of the first extension includes an insulating material;
preferably, the material of the first extension comprises an organic material or an inorganic material.
In some possible implementations, the thickness of the extension portions corresponding to at least two of the isolation openings is different;
Preferably, the thickness of the extension portion in the isolation opening corresponding to the light emitting device of different colors is different.
In some possible implementations, the extension lengths of the extension portions corresponding to at least two isolation openings are different;
Preferably, the extending lengths of the extending portions in the isolation openings corresponding to the light emitting devices of different colors are different.
In some possible implementations, the isolation openings include a first isolation opening and a second isolation opening, the light emitting devices include a first light emitting device and a second light emitting device, the light emitting devices having different colors of emission, the first light emitting device being located within the first isolation opening and the second light emitting device being located within the second isolation opening;
The extension lengths of the extension parts at different positions in the direction towards the second isolation opening are different in the same second isolation opening;
Preferably, the isolation opening further comprises a third isolation opening, the light emitting device further comprises a third light emitting device, the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are different, and the third light emitting device is located in the third isolation opening;
The extension portions at different positions within the same third isolation opening have different extension lengths in a direction toward the third isolation opening.
In some possible implementations, the pixel-defining layer includes a first face proximate to a side of the substrate and a second face distal to the side of the substrate, an orthographic projection of the second face onto the substrate being within an orthographic projection of the first face onto the substrate;
Preferably, the distance between the orthographic projection of the edge of the extended portion, which is longer, near the pixel opening on the substrate and the orthographic projection of the edge of the second face, which is near the pixel opening, on the substrate is less than or equal to 2 micrometers.
In some possible implementations, the display panel further includes:
the packaging units are positioned on one side, away from the substrate, of the corresponding light-emitting device;
preferably, at least part of the packaging unit extends to a side of the isolation structure away from the substrate;
preferably, adjacent packaging units are arranged at intervals;
preferably, the display panel further comprises a first packaging layer and a second packaging layer which are positioned on one side of the packaging unit and the isolation structure away from the substrate;
Preferably, the materials of the encapsulation unit and the second encapsulation layer comprise inorganic materials, and the materials of the first encapsulation layer comprise organic materials.
Another object of the present application is to provide a method of manufacturing a display panel, the method including:
Providing a substrate;
Forming a pixel defining layer and an isolation structure which are stacked on one side of the substrate, wherein the pixel defining layer is surrounded to form a plurality of pixel openings, the isolation structure is surrounded to form a plurality of isolation openings, the orthographic projection of the pixel openings on the substrate is positioned in the orthographic projection of the corresponding isolation openings on the substrate, the isolation structure comprises a supporting part and a shielding part positioned on one side of the supporting part far away from the substrate, at least part of the isolation structure also comprises an extension part positioned on one side of at least part of the supporting part facing the isolation openings, and the extension lengths of the extension parts at different positions in the direction facing the isolation openings are different in at least one isolation opening;
And forming a plurality of light emitting devices, wherein at least part of the light emitting devices are positioned in the corresponding pixel openings, the light emitting devices comprise a first electrode, a light emitting functional layer and a second electrode which are stacked in a direction away from the substrate, and the second electrode of the light emitting devices is overlapped with the extension part with longer extension length.
In some possible implementations, the step of forming the pixel defining layer and the isolation structure that are stacked on one side of the substrate includes:
Providing a first material layer on one side of the substrate;
Providing a second material layer on one side of the first material layer;
Etching the second material layer to form the shielding part and the supporting part of the isolation structure;
Etching the first material layer to form a pixel defining layer comprising the pixel opening;
A first one of the extensions is deposited within at least a portion of the isolation opening.
Another object of the present application is to provide an electronic device including the display panel provided by the present application, or a display panel manufactured by the manufacturing method of the display panel provided by the present application.
Compared with the prior art, the application has the following beneficial effects:
The application provides a display panel, a manufacturing method of the display panel and electronic equipment, wherein in the display panel with an isolation structure, the risk that pits are generated by etching the part of pixel defining layer in the subsequent etching operation can be reduced by extending an extension part to cover at least part of exposed pixel defining layer, the packaging quality of a subsequent packaging unit is ensured, and the risk that the light-emitting functional layer is damaged due to invasion of etching liquid to the light-emitting functional layer in the subsequent etching process is further reduced.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
It should be noted that, in the case of no conflict, different features in the embodiments of the present application may be combined with each other.
In some related display panels, referring to fig. 1, an isolation structure 140' having isolation openings 910' is disposed over a pixel defining layer 130', and when forming a light emitting functional layer 150' and a second electrode 160' of a light emitting device 810' by vapor deposition of a light emitting material layer and a conductive material layer, the light emitting material layer and the conductive material layer between the different isolation openings 910' may be disconnected, so that the light emitting functional layer 150' and the second electrode 160' may be formed by etching after vapor deposition of the entire layer. In some of these display panels, the second electrode 160' is only one-sided overlapping with the isolation structure 140', so as to avoid the occurrence of visual character bias caused by the excessive thickness of the second electrode 160'.
The inventor found that, in the above-mentioned case, since the second electrode 160' is only overlapped on one side, a part of the pixel defining layer 130' is not covered by the conductive material layer (as shown by the dotted circle in fig. 1) during vapor deposition to form the conductive material layer of the second electrode 160', and the part of the pixel defining layer 130' is directly damaged by etching during the subsequent etching process, which results in pit defects of the pixel defining layer 130', and affects the performance of the real panel.
In view of this, the present embodiment provides a solution that can reduce pit defects in the pixel defining layer, and the solution provided in the present embodiment is described in detail below.
Referring to fig. 2, fig. 2 is a schematic diagram of a display panel according to the present embodiment, where the display panel may include a substrate 111, a pixel defining layer 130, an isolation structure 140, and a plurality of light emitting devices 810.
In this embodiment, the material of the substrate 111 may include a rigid material, such as glass. Or the material of the substrate 111 may include a flexible material, such as Polyimide (Pi).
Optionally, one side of the substrate 111 may be further provided with an array functional layer 112, and the array functional layer 112 may include a plurality of film structures, such as a buffer layer, an active layer, a plurality of conductive layers, a plurality of insulating layers, a planarization layer, and the like. The multiple film structures of the array functional layer 112 may form multiple thin film transistors (Thin Film Transistor, TFTs) at different positions, and the thin film transistors cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structures provide signals or voltages for the circuits.
Referring to fig. 3, the pixel defining layer 130 is located on one side of the substrate 111, for example, the pixel defining layer 130 may be located on a side of the array functional layer 112 away from the substrate 111. The pixel defining layer 130 surrounds to form a plurality of pixel openings 1301, and the plurality of pixel openings 1301 are spaced apart.
The isolation structure 140 is located on a side of the pixel defining layer 130 away from the substrate 111, and the isolation structure 140 surrounds a plurality of isolation openings 910, and an orthographic projection of the pixel opening 1301 on the substrate 111 is located in an orthographic projection of the corresponding isolation opening 910 on the substrate 111. That is, the isolation opening 910 communicates with the pixel opening 1301. Wherein, one isolation opening 910 is disposed corresponding to at least one pixel opening 1301.
The isolation structure 140 includes a support portion 141 and a shielding portion 142 located at a side of the support portion 141 away from the substrate 111. The isolation structure 140 further comprises an extension portion 143 located at least on a portion of the support portion 141 facing the isolation opening 910, the extension portion 143 being located at a side of the pixel defining layer 130 away from the substrate 111, i.e. in the present embodiment, the extension portion 143 is disposed to cover at least a portion of the pixel defining layer 130 not covered by the support portion 141.
Within at least one of the isolation openings 910, the extension 143 at different locations has different extension lengths in the direction toward the isolation opening 910.
For example, referring to fig. 4, the supporting portion 141 includes a first side 1401 and a second side 1402 facing the isolation opening 910 and disposed opposite to each other, and the extending portion 143 includes a first extending portion 1431 adjacent to the first side 1401 and a second extending portion 1432 adjacent to the second side 1402. The extension length W1 of the first extension 1431 is different from the extension length W2 of the second extension 1432.
In one example, referring to fig. 4, an extension length W2 of the second extension portion 1432 is smaller than an extension length W1 of the first extension portion 1431. In another example, referring to fig. 5, the length of the extension length W2 of the second extension portion 1432 may be 0.
Alternatively, the thickness of the extension portion 143 is smaller than the thickness of the support portion 141 in a direction away from the substrate 111.
A plurality of light emitting devices 810, at least a portion of the light emitting devices 810 being located within the corresponding isolation openings 910. The light emitting device 810 includes a first electrode 120, a light emitting functional layer 150, and a second electrode 160 stacked in a direction away from the substrate 111. In the same isolation opening 910, the extension lengths of the extension portions 143 at different positions in the direction toward the isolation opening 910 are different, and the second electrode 160 provided corresponding to the isolation opening 910 overlaps at least the extension portion 143 having the longest extension length.
For example, referring to fig. 6, in the case where the extension length of the first extension 1431 is greater than the extension length of the second extension 1432, the second electrode 160 may overlap the first extension 1431.
Based on the above design, in the scheme of single-side lapping of the second electrode 160, by extending the extension portion 143 on the non-lapping side to cover at least part of the exposed pixel defining layer 130, the risk that the part of the pixel defining layer 130 is etched to generate pits in the subsequent etching operation can be reduced, the packaging quality of the subsequent packaging unit 170 is ensured, and the risk that the light emitting functional layer 150 is damaged due to invasion of the etching liquid into the light emitting functional layer 150 in the subsequent etching process is further reduced.
In some possible implementations, the pixel defining layer 130 includes a first face proximate to a side of the substrate 111 and a second face distal to the side of the substrate 111, an orthographic projection of the second face onto the substrate 111 being located within an orthographic projection of the second face onto the substrate 111. The orthographic projection of the extension 143 on the substrate 111 is located within the orthographic projection of the second face on the substrate 111.
That is, in the present embodiment, the extension 143 does not extend into the pixel opening 1301, thereby avoiding the extension 143 from shielding the light emitting effect of the light emitting device 810.
Optionally, a distance between an orthographic projection of the edge of the first extension 1431 near the pixel opening 1301 on the substrate 111 and an orthographic projection of the edge of the second face near the pixel opening 1301 on the substrate 111 is less than or equal to 2 micrometers.
In some possible implementations, the second extension 1432 has electrical conductivity, at least a portion of the second electrode 160 of the light emitting device 810 overlaps the second extension 1432, and/or the second electrode 160 of the light emitting device 810 overlaps the second face 1402.
Alternatively, the light emitting functional layer 150 and the second electrode 160 have a space between the front projection on the substrate 111 and the front projection of the first side 1401 on the substrate 111.
That is, in the present embodiment, the second electrode 160 of the light emitting device 810 directly overlaps the second side 1402 of the supporting part 141 while there is a space between the second electrode and the first side 1401 of the supporting part 141.
On the side near the first side 1401, a longer first extension 1431 is provided to cover the pixel defining layer 130, so as to avoid the pixel defining layer 130 from being directly exposed to damage and generating pits in the subsequent etching process.
Alternatively, the first electrode 120 may be connected to a pixel driving circuit in the array functional layer 112, and the second electrode 160 may be connected to a common voltage supply circuit through the isolation structure 140, and the light emitting functional layer 150 between the first electrode 120 and the second electrode 160 is driven to emit light when there is a potential difference between the first electrode 120 and the second electrode 160.
Alternatively, in the present embodiment, the supporting portion 141 includes a first side 1401 and a second side 1402 that face the isolation opening 910 in a first direction and are disposed opposite to each other, wherein the first direction is the same as a moving direction of the evaporation source when the light emitting device 810 is fabricated. For example, in manufacturing the light emitting device 810, a linear vapor deposition source is used, the direction of a stripe-shaped opening of the vapor deposition source is perpendicular to the first direction, and the moving direction of the vapor deposition source is parallel to the first direction.
In some possible implementations, the material of the first extension 1431 includes a conductive material. At least a portion of the second electrode 160 of the light emitting device 810 contacts the corresponding first extension 1431.
That is, in the present embodiment, at least part of the second electrode 160 of the light emitting device 810 is in contact with the first extension 1431, which may be electrically conductive, while being in direct contact with the second side 1402 of the supporting part 141, thereby also being in electrical connection with the first side 1401 of the supporting part 141 through the first extension 1431. In this way, the impedance of the electrical connection of the second electrode 160 of the portion of the light emitting device 810 and the isolation structure 140 may be reduced, thereby reducing the light emission power consumption.
Alternatively, in this case, the light emitting function layer 150 is disposed at a distance from the first extension 1431. That is, the light emitting functional layer 150 does not contact the first extension 1431, and lateral leakage is avoided. For example, in the present embodiment, the light emitting function layer 150 can be prevented from contacting the first extension 1431 by controlling the evaporation angle.
In some possible implementations, referring to fig. 7, the supporting portion 141 includes a first sub-layer 1411 and a second sub-layer 1412 located on a side of the first sub-layer 1411 away from the substrate 111, the first extending portion 1431 is connected to the first sub-layer 1411, and the first extending portion 1431 is disposed in the same layer and the same material as the first sub-layer 1411. For example, the first sub-layer 1411 and the first extension 1431 may be etched from the same film layer.
That is, in the present embodiment, the first extension portion 1431 may be regarded as the first sub-layer 1411 extending in the direction of the isolation opening 910.
Alternatively, the second sub-layer 1412 has a weaker etching resistance than the shielding portion 142 under the same etching conditions.
Alternatively, the orthographic projection of the supporting portion 141 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111. That is, the supporting portion 141 is retracted to form an undercut structure as compared to the shielding portion 142 at a side facing the isolation opening 910.
Optionally, the material of the first sub-layer 1411 includes molybdenum and the material of the second sub-layer 1412 includes aluminum.
Optionally, the material of the shielding portion 142 includes titanium.
Optionally, in this case, the second extension 1432 is co-layer and of the same material as the first sub-layer 1411. For example, the first sub-layer 1411 and the second extension 1432 may be etched from the same film layer.
In other possible implementations, referring to fig. 8, the first extension portion 1431 and the support portion 141 are made of the same material and are connected to each other.
That is, in the present embodiment, the first extension portion 1431 may be regarded as a portion of the support portion 141 extending in the direction of the partition opening 910.
Alternatively, the orthographic projection of the supporting portion 141 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111. That is, the supporting portion 141 is retracted to form an undercut structure as compared to the shielding portion 142 at a side facing the isolation opening 910.
Optionally, the material of the support portion 141 and the first extension portion 1431 includes aluminum. In this way, the surface of the first extension portion 1431 may be formed of alumina, reducing the conductivity of the first extension portion 1431, and a large amount of lateral leakage may not occur even if the light emitting function layer 150 is in contact with the first extension portion 1431.
Optionally, the material of the shielding portion 142 includes titanium.
Alternatively, in this case, the extension length of the second extension 1432 may be 0.
In other possible implementations, referring to fig. 9, the first extension portion 1431 includes a first portion 701 and a second portion 702, the first portion 701 is located on a side of the pixel defining layer 130 away from the substrate 111, and the second portion 702 extends along the first side 1401 of the support portion 141.
For example, in the present embodiment, the first extension portion 1431 may be formed by deposition through a separate process after the fabrication of the supporting portion 141 and the shielding portion 142 is completed, in which case a portion (i.e., the first portion 701) of the first extension portion 1431 is located at a side of the pixel defining layer 130 away from the substrate 111, and another portion (i.e., the second portion 702) may cover the first side 1401 of the supporting portion 141.
Alternatively, the material of the first extension portion 1431 is different from that of the support portion 141.
In some possible implementations, the material of the first extension 1431 includes an insulating material. For example, the material of the first extension 1431 includes an organic material or an inorganic material. In this way, the light emitting function layer 150 can be prevented from being electrically connected to the supporting portion 141 of the isolation structure 140 through the extension portion 143, thereby preventing lateral leakage.
Alternatively, referring to fig. 10, in the case where the material of the first extension portion 1431 is an insulating material, the light emitting function layer 150 may contact the first extension portion 1431, and the first extension portion 1431 may extend toward the isolation opening 910 as much as possible, for example, the first extension portion 1431 may extend to the boundary of the pixel defining layer 130 near the pixel opening 1301, thereby better covering and protecting the pixel defining layer 130.
In some possible implementations, the thickness of the corresponding extensions 143 of the at least two isolation openings 910 is different.
For example, referring to fig. 11, the isolation openings 910 may include a first isolation opening 911, a second isolation opening 912, and a third isolation opening 913, wherein if the extension portions 143 are disposed in the second isolation opening 912 and the third isolation opening 913, the thickness H1 of the extension portion 143 corresponding to the second isolation opening 912 may be different from the thickness H2 of the extension portion 143 corresponding to the third isolation opening 913.
Alternatively, the thickness of the extension 130 within the isolation opening 910 corresponding to the different color light emitting device 810 is different.
Specifically, the light emitting device 810 may include a first light emitting device 811, a second light emitting device 812, and a third light emitting device 813, the light emitting colors of the first light emitting device 811, the second light emitting device 812, and the third light emitting device 813 are different, the first light emitting device 811 is located in the first isolation opening 911, the second light emitting device 812 is located in the second isolation opening 912, and the third light emitting device 813 is located in the third isolation opening 913.
Wherein the first light emitting device 811, the second light emitting device 812, and the third light emitting device 813 are sequentially formed in different etching processes. In this case, the extension portion 143 corresponding to the third isolation opening 913 may be more damaged by etching than the extension portion 143 corresponding to the second isolation opening 912, and thus, the thickness H1 of the extension portion 143 corresponding to the second isolation opening 912 may be set to be different from the thickness H2 of the extension portion 143 corresponding to the third isolation opening 913, for example, the thickness H2 of the extension portion 143 corresponding to the third isolation opening 913 may be greater than the thickness H1 of the extension portion 143 corresponding to the second isolation opening 912, so as to offset the more damage by etching of the extension portion 143 corresponding to the third isolation opening 913, thereby ensuring the protection effect of each extension portion 143 on the pixel defining layer 130.
In some possible implementations, the extension lengths of the corresponding extensions 143 of the at least two isolation openings 910 are different. Optionally, the maximum extension lengths of the corresponding extensions 143 of the at least two isolation openings 910 are different.
For example, referring to fig. 11, the isolation openings 910 may include a first isolation opening 911, a second isolation opening 912, and a third isolation opening 913, wherein if the extension portions 143 are disposed in the second isolation opening 912 and the third isolation opening 913, the extension length W11 of the extension portion 143 corresponding to the second isolation opening 912 may be different from the extension length W12 of the extension portion 143 corresponding to the third isolation opening 913.
Optionally, the extension lengths of the extension portions 130 within the isolation openings 910 corresponding to the different color light emitting devices 810 are different.
Specifically, the light emitting device 810 may include a first light emitting device 811, a second light emitting device 812, and a third light emitting device 813, the light emitting colors of the first light emitting device 811, the second light emitting device 812, and the third light emitting device 813 are different, the first light emitting device 811 is located in the first isolation opening 911, the second light emitting device 812 is located in the second isolation opening 912, and the third light emitting device 813 is located in the third isolation opening 913.
Wherein the first light emitting device 811, the second light emitting device 812, and the third light emitting device 813 are sequentially formed in different etching processes. In this case, the extension portion 143 corresponding to the third isolation opening 913 may be more damaged by etching than the extension portion 143 corresponding to the second isolation opening 912, and thus, the maximum extension length W11 of the extension portion 143 corresponding to the second isolation opening 912 may be set to be different from the maximum extension length W12 of the extension portion 143 corresponding to the third isolation opening 913, for example, the maximum extension length W12 of the extension portion 143 corresponding to the third isolation opening 913 may be greater than the maximum extension length W11 of the extension portion 143 corresponding to the second isolation opening 912, so as to cancel out the more damage by etching to which the extension portion 143 corresponding to the third isolation opening 913 is subjected, thereby ensuring the protection effect of the respective extension portions 143 on the pixel defining layer 130.
In some possible implementations, referring again to fig. 2, isolation opening 910 includes a first isolation opening 911 and a second isolation opening 912. The light emitting device 810 includes a first light emitting device 811 and a second light emitting device 812, the light emitting colors of the first light emitting device 811 and the second light emitting device 812 are different, the first light emitting device 811 is located in the first isolation opening 911, and the second light emitting device 812 is located in the second isolation opening 912.
Within the same second isolation opening 920, the extension lengths of the extensions 14 at different locations in the direction toward the second isolation opening 920 are different.
Optionally, the isolation opening 910 further includes a third isolation opening 913, the light emitting device 810 further includes a third light emitting device 813, the light emitting colors of the first light emitting device 811, the second light emitting device 812, and the third light emitting device 813 are different, and the third light emitting device 813 is located in the third isolation opening 913.
Within the same third isolation opening 930, the extension lengths of the extensions 14 at different positions in the direction toward the third isolation opening 930 are different.
For example, in the present embodiment, the extension portion 143 in the first isolation opening 911 may not be provided in an elongated manner, and the extension portions 143 in the second isolation opening 912 and the third isolation opening 913 may be provided in an elongated manner.
Specifically, in the present embodiment, the light emitting device 810 of the first isolation opening 911 may be the first fabricated light emitting device 810, in which case, the pixel defining layer 130 corresponding to the first isolation opening 911 is not damaged by etching, and thus the extension portion 143 may not be required to protect the pixel defining layer 130. And the second light emitting device 812 and the third light emitting device 813 are manufactured later, so that damage may be caused to the corresponding pixel defining layer 130 within the second isolation opening 912 and the third isolation opening 913 during etching to form the first light emitting device 811, and thus the extension portions 143 of the second isolation opening 912 and the third isolation opening 913 may be extended to protect the pixel defining layer 130.
In other possible implementations, the extensions 143 within the first isolation opening 911, the second isolation opening 912, and the third isolation opening 913 may all be elongated.
In some possible implementations, referring to fig. 13, the display panel further includes a plurality of encapsulation units 170, and the encapsulation units 170 are located on a side of the corresponding light emitting devices 810 away from the substrate 111.
Optionally, at least part of the encapsulation unit 170 extends to a side of the isolation structure 140 remote from the substrate 111.
Alternatively, adjacent encapsulation units 170 are spaced apart.
Optionally, the display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 111.
Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials. The material of the first encapsulation layer 180 includes an organic material.
In some possible implementations, the display panel provided in this embodiment may further include a film structure such as an optical film (e.g. a polarizer), a transparent adhesive layer (e.g. an optical adhesive layer), and a cover plate, which are located on a side of the second encapsulation layer 190 away from the substrate 111, which is not described in detail in this embodiment.
Referring to fig. 14, the present embodiment also provides a method for manufacturing a display panel, which may include the following steps.
In step S110, a substrate 111 is provided.
In step S120, the pixel defining layer 130 and the isolation structure 140 are formed on the substrate 111 side. The pixel defining layer 130 surrounds a plurality of pixel openings 1301. The isolation structures 140 surround to form a plurality of isolation openings 910, and the orthographic projection of the pixel opening 1301 on the substrate 111 is located in the orthographic projection of the corresponding isolation opening 910 on the substrate 111. The isolation structure 140 includes a support portion 141 and a shielding portion 142 located at a side of the support portion 141 away from the substrate 111. At least part of the isolation structure 140 further comprises an extension 143 located at least on a side of the support portion 141 facing the isolation opening 910, and in at least one isolation opening 910, the extension 143 at different positions has different extension lengths in the direction facing the isolation opening 910.
In step S130, a plurality of light emitting devices 810 are formed, at least a portion of the light emitting devices 810 being located within the corresponding isolation openings 910. The light emitting device 810 includes a first electrode 120, a light emitting functional layer 150, and a second electrode 160 stacked in a direction away from the substrate 111. The second electrode 160 of the light emitting device 810 is overlapped with the extension 143 having a long extension length.
In some possible implementations, referring to fig. 15, in step S120, a first material layer 1300 may be disposed on one side of the substrate 111, and then a second material layer 1400 may be disposed on one side of the first material layer 1300.
Next, referring to fig. 16, the second material layer 1400 is etched to form the shielding portion 142 and the supporting portion 141 of the isolation structure 140. And the first material layer 1300 is etched to form the pixel defining layer 130 including the pixel opening 1301.
Alternatively, in the case where the extension length of the second extension 1432 is not 0, the second extension 1432 may be formed when the second material layer 1400 is etched.
Then, referring to fig. 17, a first extension 1431 forming extension 143 is deposited within at least a portion of isolation opening 910.
In other possible implementations, in step S120, the second material layer 1400 may include a plurality of sub-layers, and after the second material layer 1400 is formed, the shielding portion 142, the supporting portion 141, and the first extending portion 1431 of the isolation structure 140 may be formed by different sub-layers in the second material layer 1400 by controlling an etching range and/or etching time.
Alternatively, in the case where the extension length of the second extension 1432 is not 0, the second extension 1432 may be formed when the second material layer 1400 is etched.
The application also provides electronic equipment, which comprises the display panel provided by the application or a display panel manufactured by the manufacturing method of the display panel. The electronic device can comprise a mobile phone, a tablet computer, an intelligent wearable device, a television, a notebook computer, a display and other devices with display functions.
In summary, in the display panel with the isolation structure, the extension portion covers at least part of the exposed pixel defining layer, so that the risk of generating pits by etching the pixel defining layer in the subsequent etching operation can be reduced, the packaging quality of the subsequent packaging unit is ensured, and the risk of damaging the light-emitting functional layer due to invasion of etching liquid to the light-emitting functional layer in the subsequent etching process is reduced.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.