Disclosure of Invention
The embodiment of the application provides a slot base, a mainboard, a production method thereof and electronic equipment, which can solve the problem of circuit board design difficulty caused by the fact that the size of a chip is increased and pins of the slot base are increased.
For this purpose, the following technical scheme is adopted in the embodiment of the application:
the embodiment of the application provides a slot base, which comprises a base body, a first pin, a second pin, a solder ball and a solder ball, wherein the base body is provided with a first surface and a second surface which are oppositely arranged in a first direction, the first pin penetrates through the base body along the first direction, the first end of the first pin protrudes out of the first surface, the second end of the first pin protrudes out of the second surface, the second pin penetrates through the base body along the first direction, the first end of the second pin protrudes out of the first surface, the length of the second pin is smaller than that of the first pin, the second pin is arranged at intervals with the first pin, and the solder ball is arranged on the second surface and is electrically connected with the second end of the second pin.
In this embodiment, the length of the first pin in the socket base is lengthened, so that the first pin may protrude from the second surface of the substrate base, thereby further penetrating or embedding into the circuit board connected to the socket base. The signal transmitted by the first pin can realize interconnection of signals without passing through the wiring or copper sheet in the board of the circuit board, so as to solve the problem of circuit board design difficulty caused by the increase of the chip size and the pins of the socket base.
As an embodiment, the first pin and the second pin protrude from the first surface to be flush.
In this embodiment, the second end of the first pin is conveniently inserted through the circuit board connected to the socket base.
As an implementation manner, the first pin is used for transmitting a low-impedance signal, and the second pin is used for transmitting a high-impedance signal.
In this embodiment, the first pin is a low impedance signal pin, that is, the signal transmitted through the first pin is a signal that does not require strict control of impedance uniformity, such as a power signal, a control signal, a low speed data signal, a broadcast signal, a monitoring signal, and the like. The pins of the signals with relaxed requirements on impedance consistency control for the power supply signals and the like are lengthened, so that the length of the first pins can penetrate through the PCB or be embedded into the PCB, and signal through-flow connection from the far end of the power supply to the load is realized. Therefore, the power supply signal does not need to be transmitted through an internal metal layer or a wiring of the PCB, so that the number of power supply outgoing line layers on the PCB is reduced.
In a second aspect, the embodiment of the application provides a main board, which comprises a circuit board, a slot base and an external connection carrier, wherein the circuit board is provided with a via hole, the slot base is arranged on the circuit board, the external connection carrier is arranged on one side, away from the slot base, of the circuit board, the slot base comprises a first pin, a second pin, a first end of the first pin penetrates through the via hole and is electrically connected with the external connection carrier, the first end of the second pin is electrically connected with the electronic device, and the second end of the second pin is electrically connected with the circuit board, and the length of the second pin is smaller than that of the first pin.
In this embodiment, the length of the first pin, such as the power signal pin, for transmitting the low-impedance signal in the motherboard of the socket base may be through the via hole of the circuit board and electrically connected to the external connection carrier, so as to realize the signal through-flow connection from the remote end to the load of the power supply. Because the power pins do not need to conduct wires through the circuit board, the number of layers of the PCB design can be reduced, and the complexity and the design difficulty of the PCB design are reduced.
As an implementation manner, in response to the circuit board not having a filter capacitor disposed thereon, the second end of the first pin penetrates the circuit board.
In this embodiment, for the motherboard on the circuit board that does not need a filter capacitor, the second end of the first pin is designed to penetrate the via hole, so that noise and interference can be reduced, design and layout can be simplified, reliability of the system can be improved, and performance and stability of the circuit board can be improved.
As an implementation manner, the portion of the second end of the first pin penetrating the circuit board is fixed to the circuit board and/or the external connection carrier by dispensing.
In this embodiment, the portion of the first pin penetrating the penetration hole is fixed by dispensing, so that it can be securely attached to the circuit board, and the stability and reliability of connection can be increased.
As an embodiment, the portion of the second end of the first pin penetrating the circuit board has a fold welded to a side of the external connection carrier close to the circuit board or to a side of the external connection carrier facing away from the circuit board.
In this embodiment, a strong electrical connection can be established by soldering the bent portion with the external connection carrier, reducing the risk of loosening or breaking the connection.
As an implementation manner, the dispensing is a thermosetting adhesive or a photo-curing adhesive.
As an embodiment, the thermosetting adhesive is selected from any one of epoxy adhesive, phenolic adhesive, polyimide adhesive, silicone rubber adhesive, and polyurethane adhesive.
As one possible embodiment, the photo-curable adhesive is selected from any one of UV epoxy photo-curable adhesive, photo-curable acrylate adhesive, photo-curable polyurethane adhesive, or photo-curable urea-formaldehyde resin adhesive.
In this embodiment, a heat curable adhesive or a photo curable adhesive is an adhesive that is capable of hardening upon exposure to heat or light of a specific wavelength. They may provide a strong physical anchoring capability ensuring a secure connection between the first pin and the external connection carrier.
As an implementation manner, the second end of the first pin is embedded in the via hole of the circuit board in response to the circuit board being provided with a filter capacitor.
In this embodiment, for the motherboard on the circuit board that needs the filter capacitor, through embedding the second end of the first pin into the via hole and welding and conducting with the external connection carrier, the filter capacitor and the power line can be directly connected, so as to reduce noise and interference on the power line, provide better filter effect, and ensure stability and reliability of the circuit. Meanwhile, the structure of embedding the first pins into the through holes can effectively layout the filter capacitor and other elements on the circuit board, so that more compact circuit design is realized, and the integration level and layout flexibility of the circuit board are improved.
As an implementation manner, the external connection carrier is any one of a flexible circuit board, a rigid circuit board, a copper bar or a cable.
In this embodiment, the external connection carrier mode such as a flexible circuit board, a rigid circuit board, a copper bar or a cable is adopted, and the most suitable wire form can be selected according to different design requirements. The scheme has advantages in space utilization, wiring flexibility, reliability, production cost and the like, so that the reliability and stability of the circuit board design can be improved.
The embodiment of the application provides a production method of a mainboard, which is applied to the mainboard and comprises the steps of printing solder paste on a position, where a slot base is arranged, of a circuit board, placing the slot base at the position so that a second end of a first pin penetrates through a through hole of the circuit board and is welded, and welding an external connection carrier on one side, away from the slot base, of the circuit board.
In this embodiment, through the via hole of locating the circuit board with the first stitch of slot base for the signal that first stitch transmitted can go on the wiring and switch on through the circuit board, has avoided carrying out complicated wiring overall arrangement on the circuit board, realizes the signal through-flow connection of power supply distal end to load, reduces the circuit board like PCB board design layer number, reduces the PCB board design degree of difficulty, has simplified manufacturing flow, has reduced manufacturing cost.
As one implementation, the printing of solder paste on the circuit board at the locations for placement of the socket base includes printing solder paste on pads at the locations other than the vias in response to the absence of a filter capacitor on the circuit board. So that the first pin protruding through holes are soldered with the external connection carrier.
As an implementation mode, after the slot base is placed at the position so that the second end of the first pin penetrates through the through hole of the circuit board and is welded, the production method further comprises the steps of dispensing and fixing the portion, penetrating through the through hole, of the second end of the first pin, bending the dispensed first pin to form a bending portion, and welding the bending portion and the external connection carrier.
In the embodiment, the first pin in the slot base is lengthened, glued and bent, so that good fixing and welding effects are achieved. The stitch can be fixed by dispensing to prevent the stitch from falling off or moving, and the welding area can be increased by bending the stitch to improve the welding firmness. This ensures the stability and reliability of the connection between the power pins and the load.
As an implementation manner, the slot base is placed at the position so that the second end of the first pin penetrates through the through hole of the circuit board, and the welding comprises reflow welding in a nitrogen environment or an atmospheric environment.
As an achievable embodiment, the method further comprises, before the step of dispensing and fixing the portion of the second end of the first pin penetrating the via hole, further penetrating the second end of the first pin through the external connection carrier. In this embodiment, the second end of the first pin can penetrate through the via hole of the circuit board and the external connection carrier, the first pin is fixed with the circuit board and/or the external connection carrier by dispensing, and then the first pin forms a bending part and is welded with the external connection carrier.
As an embodiment, the bending part is welded to the external connection carrier by laser welding.
In this embodiment, the laser welding has the characteristics of high efficiency, no contact and no pollution, and the quality and reliability of the welded connection can be ensured. The high-precision connection between the external connection carrier and the circuit board can be realized by a laser welding technology.
As one implementation, the printing of solder paste on the circuit board at the location for placement of the socket base includes printing solder paste at the via and pad at the location in response to placement of a filter capacitor on the circuit board.
In this embodiment, the solder paste may be printed at the via hole to facilitate the construction of the metallized via hole, so that the first pin may be electrically connected to the filter capacitor on the circuit board through the metallized via hole after being embedded in the via hole.
In a fourth aspect, an embodiment of the present application provides an electronic device, including the motherboard as described above.
In this embodiment, the electronic device adopting the above motherboard technical scheme has advantages of high performance, reliability, high manufacturing efficiency, simplified design, reduced cost, etc., so that the electronic device has competitiveness in terms of performance and manufacturing, and can meet market demands.
Detailed Description
For convenience of understanding, terms involved in the embodiments of the present application will be explained first.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "exemplarily," "specific examples," or "some examples," etc., means that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.
In the related art, in order to facilitate the replacement of chips, a CPU chip of a server electronic device product is generally mounted on a PCB through a socket base. Specifically, the socket base is mounted on the PCB, pins of the chip are inserted into pins of the socket base, and electric connection between the chip and the PCB is achieved. The pins in the conventional socket base are consistent in length and are generally fixed on the PCB by welding or crimping. After the signals of the CPU chip are connected to the PCB through the socket base, the fan-out is interconnected with signals of other chips, power supplies and the like.
With the increase of the computing power of the chip, the pins of the socket base gradually develop to high-density multi-pins so as to meet the computing power requirement of the chip. The socket base has a plurality of pins, and the fan-out fanout has to be one-to-one corresponding to the pins on the PCB, which increases the size of the chip and the number of pins. However, when the chip size becomes larger, resulting in an increase in the number of socket base pins, the socket base pins need to be laid out and wired correctly to avoid signal interference and errors, and if the number of the original PCB outgoing lines is kept unchanged, the density of wires on each layer is increased, thereby increasing the signal interference and the blocking problem of power/ground wires. If the number of the outgoing line layers of the PCB is increased, in the complex PCB design, the more number of layers also increases the manufacturing cost and the technical difficulty, and meanwhile, higher technical requirements and more complex process flows are required to ensure the electrical connection quality. That is, the increasing chip size and pin number make the design processing of the PCB more difficult, especially in the case that the number of outgoing lines cannot be increased arbitrarily due to the fixed design thickness of the PCB.
In order to solve the problem of the design difficulty of the PCB caused by the fact that the chip size is enlarged and pins of the slot base are increased, the number of outgoing line layers of the PCB is reduced. The embodiment of the application provides a slot base, a main board, a production method thereof and electronic equipment, wherein the lengths of signal pins of a part of the slot base are lengthened, the pins penetrate or are embedded into a PCB (printed circuit board) according to different application scenes, and the interconnection and intercommunication of signals are realized without passing through PCB wires or copper sheets through an external connection structure (flexible board/hard board/copper strip/cable and the like).
In the design of the PCB, the "PCB outlet layer" refers to a metal layer on the PCB board, that is, a signal layer, a power layer, a ground layer, and the like. Each metal layer contains wires and power/ground for signal transmission, power supply and grounding. In general, the greater the number of outgoing line layers of a PCB board means that more signal line tracking and power/ground plane area can be accommodated, thereby providing a more complex and high density circuit layout.
Next, an electronic device provided by the embodiment of the present application is specifically described.
By way of example, an electronic device provided by an embodiment of the present application may be, but is not limited to, a server, a personal computer, a router, a switch, a supercomputer, an artificial intelligence (ARTIFICIAL INTELLIGENCE, AI) device, and the like. For ease of understanding, the following description will be given taking an electronic device as a server as an example, but it should be understood that the application is not limited thereto.
Fig. 1 is an exploded view of a socket base and an electronic device according to an embodiment of the present application. Fig. 2 is a schematic structural diagram of a motherboard according to an embodiment of the present application. As shown in fig. 1 and 2, an exemplary electronic device includes a motherboard. The motherboard may include an electronic device 1, a socket base 2, a circuit board 3, and an external connection carrier 4. The socket base 2 is disposed on the circuit board 3. The external connection carrier 4 is arranged on the side of the circuit board 3 facing away from the socket base 2.
Pins 21 on the socket base 2 are electrically connected with the circuit board 3 and the external connection carrier 4, respectively, so that the electronic device 1 on the circuit board 3 transmits signals through the socket base 2 mounted on the circuit board 3 and realizes corresponding functions thereof.
It should be noted that the number of the electronic devices 1 may be plural, and the plural electronic devices 1 are disposed on the circuit board to realize functions such as data exchange or processing of the electronic apparatus. Illustratively, the electronic device 1 may be, but is not limited to being, a processor. Specifically, the processor may be, for example, a central processing unit (central processing unit, CPU), a graphics processor (graphic processing unit, GPU), a tensor processor (tensor processing unit, TPU), or the like. In case the electronic device is a switch, the electronic device 1 may also be a switch chip. The embodiment of the application does not limit the types of electronic equipment and electronic devices.
It should be noted that, the number of processors may be configured as one or more according to needs, and the number of memories may be configured as one or more according to needs, which are not strictly limited by the embodiments of the present application.
Referring to fig. 1 and 2, an exemplary socket base 2 may include pins 21, a base body 22, and solder balls 23. The pins 21 include a first pin 211 and a second pin 212. The base body 22 is a main portion of the socket base 2, which may be made of plastic, and is used for mounting and supporting the first pins 211 and the second pins 212, so as to facilitate the mounting of the electronic device 1 (such as a processor chip). It will be appreciated that for clarity, various elements in the drawings have not been drawn to scale and that certain features may be exaggerated or omitted to more clearly illustrate and explain the present application. For example, the base body 22 in fig. 2 is used as a schematic structure only, and the base body 22 in fig. 2 is mounted on the circuit board 3, but in order to show the structure of the solder balls 23, the proportion of the solder balls 23 is enlarged so that the space between the base body 22 and the circuit board 3 is large, and the actual structural proportion is smaller than that shown in fig. 2. Further, the base body 22 has a first surface 221 and a second surface 222 disposed opposite to each other in the first direction. The first direction may be an extending direction of pins of the socket base. Taking the socket base 2 in fig. 2 as an example, the first direction is the F1 direction in fig. 2, the first surface 221 of the base body 22 is the top surface of the base body 22, and the second surface 222 is the bottom surface of the base body 22.
With continued reference to fig. 1 and 2, the first pins 211 and the second pins 212 penetrate the base body 22 along the first direction. The first pins 211 and the second pins 212 are spaced apart. Specifically, the first pins 211 and the second pins 212 may be vertically penetrating the base body 22, for example. The first ends and the second ends of the first pins 211 protrude from the first surface 221 and the second surface 222, respectively. The first ends of the second pins 212 protrude from the first surface 221 of the base body 22. The length of the first stitch 211 is greater than the length of the second stitch 212. The first pins 211 and the second pins 212 protrude from the first surface 221 of the base body 22 to be flush with each other so that the first ends of the first pins 211 and the second pins 212 are electrically connected to the electronic device 1. The solder balls 23 are disposed on the second surface 222, and may be soldered on the second surface 222, for example. The solder balls 23 may be electrically connected to the second ends of the second pins 212, for example, the second ends of the second pins 212 may be soldered to the circuit board 3 and electrically connected to the circuit board 3. Solder balls are planted below the second pins 212, and corresponding pads 32 with corresponding sizes are processed at the positions of the circuit board 3. The socket base 2 is heated through auxiliary equipment, the solder balls 23 are melted and connected with the bonding pads 32, signals are fanned out to other areas of the surface layer and the inner layer through the surface layer wiring of the PCB, and interconnection is achieved. The second pin 212 is used for transmitting high-impedance signals of the electronic device 1 after the electronic device 1 is turned on with the circuit board 3. The high-impedance signal is a signal having strict requirements for impedance uniformity control, and may be, but is not limited to, a high-speed data signal (e.g., a high-speed differential signal (e.g., PCI Express, USB3.0, etc.) or a high-speed serial communication signal (e.g., ethernet, HDMI, etc.), a high-precision analog signal (e.g., an audio signal or a sensor signal), or a high-sensitivity signal (e.g., an optical sensor, a temperature sensor, etc.).
The circuit board 3 is provided with a via hole 31. The second ends of the first pins 211 are inserted through the through holes 31 on the circuit board 3, so that the first pins 211 can be electrically connected with the external connection carrier 4 located at the bottom of the circuit board 3. It is understood that the second end of the first pin 211 penetrating the via hole 31 may include that the second end of the first pin 211 penetrates the circuit board 3 and protrudes from the via hole 31, or that the second end of the first pin 211 does not penetrate the circuit board 3 and is embedded in the via hole 31. Illustratively, after the first pins 211 penetrate the circuit board 3 and pass through the vias 31, the second ends of the first pins 211 may be soldered directly to the external connection carrier 4. The portion of the second end of the first pin 211 penetrating the circuit board 3 is fixed to the circuit board 3 and/or the external connection carrier 4 by dispensing 380. In another possible implementation manner, referring to fig. 3, fig. 3 is a schematic structural diagram of another motherboard provided in an embodiment of the present application, and as shown in fig. 3, in order to reinforce the first pins 211, a portion penetrating the circuit board 3 at the second end of the first pins 211 is fixed to the circuit board 3 by dispensing 380. It should be appreciated that, in another possible implementation manner, the dispensing 380 may further fix a portion of the first pin 211 penetrating the circuit board 3 at the second end of the first pin 211 on the external connection carrier 4, so as to enable reinforcement of the second end portion of the first pin 211, which is not strictly limited herein. Illustratively, the first pin 211 is used to transmit a low impedance signal of the electronic device 1 after the electronic device 1 and the external connection carrier 4 are turned on. Based on the above description, it should be understood that, in this embodiment, the first pin 211 is a signal that is transmitted as a low-impedance signal pin and has less strict requirements for impedance consistency control, and may be, but is not limited to, a power signal, a control signal (such as a switch signal, a register control signal, etc.), a low-speed data signal (such as serial communication, sensor data, etc.), a broadcast signal (such as a clock signal, a reset signal, etc.), a monitoring signal (such as a power monitoring signal, a sensor monitoring signal, etc.
With continued reference to fig. 1, for protecting the first pins 211 and the second pins 212, the base body is provided with a protective cover 6, and the protective cover 4 has a central window 61, where the central window 61 is used for giving way to the installation of the electronic device 1, and a cover plate (not shown) is covered on the central window to protect the first pins 211, the second pins 212 and the electronic device 1. One side of the protective cover 6 is pivotally connected to the base body 22, such as by a pivot 62, such that the protective cover 6 is adapted to rotate between a snap-fit position and an open position such that the protective cover 6 can overlie the base body 22 to avoid exposing the first and second pins 211, 212. Wherein, in the snap-fit position, the protective cover 6 is snapped and pressed against the base body 22, for example, by a snap-fit lever 5, to avoid the protective cover 6 from being opened or separated from the base body 22 during or after production, transportation, testing or assembly. In this embodiment, the locking bar 5 is disposed on the circuit board 3 and is adapted to be locked and engaged with one hook 311 on the circuit board 3, but the present application is not limited thereto, and for example, the protection cover 1 and the base body 22 may be fixed relative to each other by other fixing means, such as screws, locking means, and the like.
It should be noted that the circuit board 3 functions to provide a connection channel for signal transmission between the electronic devices 1. It should be understood that the circuit board 3 may be manufactured as a board structure having a plurality of outgoing line layers (e.g., the number of outgoing line layers is greater than ten), and the number of specific circuit layer layers of the circuit board 3 may be selected according to the actual application requirements of the circuit board 3, which is not strictly limited by the embodiment of the present application. In addition, each outgoing line layer can be etched into a corresponding circuit pattern according to the requirement so as to have a corresponding function. For example, the outlet layer may be used as a ground layer to achieve isolation or ground protection. Or the outlet layer may be used as a power plane to enable powering of the electronic device 1. Or the outgoing line layer may be used as a control layer to control signals such as clock signals (CLK), chip Select (CSB), etc. Or the wire-out layer may be used as a strip line layer to perform the function of feeding the antenna radiating element. Or the wire-out layer may be used as an antenna switching layer. In other words, in the circuit board 3, the respective roles of the plurality of outgoing line layers and the specific arrangement positions thereof may be selected and arranged according to the application scenario, and the embodiments of the present application are not limited strictly.
The circuit board 3 may be any one of a printed circuit board (printed circuit board, PCB), a carrier-like board (SubstrateLike-PCB, SLP), and a carrier board (Sub), for example. The following description will take the circuit board as a PCB board as an example, but it should be understood that the invention is not limited thereto.
The external connection carrier 4 may be any one of a flexible circuit board, a rigid circuit board, a copper bar, or a cable. Illustratively, in this implementation, the external connection carrier 4 is a flexible circuit board, and a voltage regulation module (voltage regulator module, VRM) may be disposed on the flexible circuit board, so that the electronic device 1 (e.g., a CPU chip) can obtain a stable, suitable voltage through the first pins 211 for normal operation.
Therefore, socket pins of signals with relaxed requirements on impedance consistency control such as power supply signals are lengthened, so that the length of the pins can penetrate through a PCB or be embedded into the PCB, and the pins are led out of the PCB through the external connection carrier 4, so that signal through-flow connection from the far end of the power supply to a load is realized. Therefore, the power supply signal does not need to be transmitted through an internal metal layer or a wiring of the PCB, so that the number of power supply outgoing line layers on the PCB is reduced, and the problem of circuit board design difficulty caused by the fact that pins of a socket base become large in chip size is solved.
Next, the low impedance signal is exemplified as the power signal, but it should be understood that the invention is not limited thereto.
For example, in a scenario where the circuit board side is not provided with a filter capacitor, that is, the power supply signal does not need a filter capacitor on the PCB board side, for example, in a scenario where high-frequency noise in a circuit working environment is relatively low or tolerance to the high-frequency noise is relatively high, at the same time, the stability requirement of the electronic device on the power supply signal is not high, and at this time, the second end of the first pin may penetrate through the circuit board. Referring to fig. 4, fig. 4 is a schematic structural diagram of another motherboard according to an embodiment of the present application. As shown in fig. 4, exemplary slot mount 2 may include a first pin 430 and a second pin 440. In this implementation, the portion of the first pin 430 penetrating the via hole 450 is fixed on the circuit board 410 by dispensing 460 and then bent to form a bending portion 470, and the bending portion 470 is soldered with the external connection carrier 420 toward one side of the PCB board 410. Thus, the partial securing of the first pins 430 to the external connection carrier 420 through the vias 450 by the dispensing 460 may provide a more secure and reliable physical connection. The bending portion 470 can reduce the size of the connection portion while increasing the soldering area, and reduce the space occupation in layout, thereby realizing a more compact circuit board design.
Illustratively, the spot-on glue 460 is a heat curable glue or a photo curable glue. For example, the thermosetting adhesive is selected from any one of epoxy adhesive, phenolic adhesive, polyimide adhesive, silicone rubber adhesive, or polyurethane adhesive. The photo-curing adhesive is selected from any one of UV epoxy resin photo-curing adhesive, photo-curing acrylic ester adhesive, photo-curing polyurethane adhesive or photo-curing urea-formaldehyde resin adhesive.
In another possible implementation manner, referring to fig. 5, fig. 5 shows a schematic structural diagram of still another motherboard provided in an embodiment of the present application. As shown in fig. 5, the socket base 2 may include a first pin 530 and a second pin 540, as examples. In this implementation, the portion of the first pin 530 penetrating the via 550 is fixed on the external connection carrier 520 by dispensing 560, and then the first pin 530 penetrates the external connection carrier 520 and is bent at the portion of the first pin 530 penetrating the external connection carrier 520 to form the bending portion 570. That is, the bent portion 570 is formed at a side of the outer connection carrier 520 facing away from the PCB 510, and then the bent portion 570 is soldered to the outer connection carrier 520. Thus, the partial securing of the first pins 530 to the outer bond carrier 520 through the vias 550 by dispensing 560 may provide a more secure and reliable physical bond that may reduce the risk of loosening and breakage, increasing the stability of the overall bond. The first pins 530 penetrate through the outer connection carrier 520 and are bent to form the bending portions 570, and then soldered, so that a firm electrical connection can be established, and the available space can be effectively utilized, so that the size of the connection portion is reduced, the space occupation during layout is reduced, and a more compact circuit board design is realized. Also, the types of the dispensing 560 and the external connection carrier 520 are the same as described above, and will not be repeated here.
In general, in order to ensure stability and reliability of power signal transmission, power signal transmission lines may need to be laid in different metal layers of a circuit board, and when the current of a power signal is large, even more copper sheet wirings may need to be laid so as to be of a more complex multilayer wire-out layer design. The first pins directly penetrate the circuit board, so that power signals can be directly led out to an external connection carrier outside the circuit board, the requirement of laying multiple layers of power lines inside the circuit board is avoided, and the number of layers of power outgoing lines on the circuit board is reduced.
Fig. 6 shows a schematic structural diagram of yet another motherboard according to an embodiment of the present application. Referring to fig. 6, the socket base 2 may include a first pin 630 and a second pin 640, for example. In the implementation shown in the figure, the circuit board 610 is provided with a filter capacitor 660, that is, the power signal needs the filter capacitor 660 on the PCB board side, for example, high-frequency noise exists in the circuit working environment, and needs to be effectively suppressed in the power signal transmission process, meanwhile, the electronic device 1 has a high requirement on stability of the power signal, and then the first pin 630 is embedded into the via 650 and is soldered to the external connection carrier 620. That is, if the power signal needs the filter capacitor 660 on the PCB board side, a hole can be drilled on the PCB board side and plated with copper to form a metallized via 650, the pin is lengthened but does not penetrate the PCB board, the first pin 630 and the metallized via 650 are soldered by copper rings, and the pin of the filter capacitor 660 is interconnected with the metallized via 650 through the PCB metal layer wiring, so as to realize connection between the filter capacitor 660 and the first pin 630. It is understood that in this embodiment, the metallized via 650 is an electrical connection structure formed by electroplating metal copper on the inner wall of the via 650, and the electrical connection structure may also be a metal pillar. It should be understood that the location of the filter capacitor 660 in fig. 6 is only schematically illustrated, and the location and arrangement of the embodiment of the present application are not limited.
Since the first pins 630 are embedded in the via holes 650 and can be used for electrically connecting with the filter capacitors 660 on the circuit board 610, the power signals can be connected with the wire-out layer of the filter capacitors 660 on the circuit board 610, and a large amount of power signals still flow through the first pins 630 to the electronic device 1 through the external connection carrier 620 (such as a flexible circuit board), so that after the first pins 630 are embedded in the circuit board 610, most of the power signals can be directly led out of the circuit board 610 without paving a complex copper wire-laying layer inside the circuit board 610 to transmit the power signals. In this way, the need for a large amount of power through-flow copper sheet space is reduced, a plurality of layers of power lines are avoided being laid inside the circuit board 610, wiring on the inner metal layer or copper sheet of the circuit board 610 is not needed, a power transmission path with complex design is avoided, and the overall circuit layout is simplified, so that the number of layers of power lines on the circuit board 610 is reduced.
Based on the above description, the following description will exemplify the production method of the motherboard using the above-mentioned various socket bases 2, and it should be understood that the invention is not limited thereto. The socket base 2 may be any socket base in the foregoing implementations.
Fig. 7 is a flowchart illustrating a method for manufacturing a motherboard according to an embodiment of the present application. As shown in FIG. 7, a method for producing a motherboard using the above-mentioned socket base 2 includes S710 printing solder paste on a circuit board at a position for disposing the socket base.
Specifically, S710 includes two cases:
Fig. 8 is a schematic diagram illustrating a production process of a motherboard according to an embodiment of the present application, referring to step a in fig. 8, in which no filter capacitor is disposed on a circuit board 810, and solder paste 830 is printed on a pad 820 except a via 840 at a position for disposing a socket base 2 in response to the filter capacitor not being disposed on the circuit board.
Fig. 9 is a schematic diagram illustrating a production process of another motherboard according to an embodiment of the present application, referring to step a in fig. 9, in another case, a filter capacitor 990 is disposed on the circuit board 910, and in response to the filter capacitor 990 being disposed on the circuit board 910, solder paste 930 is printed at the via 940 and the pad 920 for setting the position of the socket base 2.
In this step, the printing screen is designed according to the PCB pads 820, 920. The printing screen is a template for surface mount technology (surface mount technology, SMT), which is a special die for SMT, and has the main function of printing accurate amounts of solder paste on accurate positions on the circuit boards 810, 910 by matching a doctor blade on a solder paste printer with pre-grooves or holes on the printing screen.
S720, placing the slot base at the installation position so that the second ends of the first pins penetrate through the through holes of the circuit board, and welding.
Illustratively, referring to b in fig. 8 and b in fig. 9, two local optical points 860, 960 are disposed in the direction of extension of the diagonal of the circuit board 810, 910 corresponding to the mounting slot mount 2 locations 850, 950. After the slot base 2 is sucked by a chip mounter, accurate alignment of the slot base 2 is completed through the local optical points 860 and 960, and then the slot base 2 is placed at the designated positions 850 and 950 (error is +/-35 mu m), so that device placement is completed. That is, the pin-in-hole error was.+ -. 0.035mm.
Illustratively, the circuit boards 810, 910 after placement of the socket base 2 are placed in a reflow oven (not shown) to complete the reflow soldering. Wherein, the reflux environment can be a nitrogen environment or an atmospheric environment.
In one case, referring to c in fig. 8, in response to the filter capacitor not being disposed on the circuit board 810, the first pin 870 of the socket penetrates the via 840 and protrudes from the bottom surface of the circuit board 810. The second pins 880 are SMT normal surface mount with the surface mount device (surface mount device, SMD) pads 820. In order to ensure the strength of the first pin 870 after being inserted into the through hole 840, the first pin 870 is fixed by dispensing through the through hole 840 after reflow soldering, the dispensing mode may be manual or automatic, and the type of the dispensing 890 may be thermosetting or photo-curing. With continued reference to d1 and d2 in fig. 8, d1 shows a structure in which the first pin 870 is bent and then soldered to a surface pad (not shown) of the external connection carrier (flexible printed circuit board) 811, and d2 shows a structure in which the first pin 870 is bent and then soldered after passing through the external connection carrier (flexible printed circuit board) 811. d1 and d2 illustrate a structural schematic of bending the first stitch 870 after dispensing and fixing to form a bent portion 871 so as to enlarge the welding area. It should be noted that, the dispensing 890 may fix the first pin 870 on the circuit board 810, or may fix the first pin 870 on the external connection carrier 811, so as to facilitate processing and production. In addition, the bending portion 871 is configured by a bending tool (e.g., a bending machine).
In another case, referring to c in fig. 9, c shows that the soldering of the socket base 2 is completed by reflow, and the first pins 970 do not penetrate the bottom surface of the circuit board 910. In response to the filter capacitor 990 being disposed on the circuit board 910, the first pin 970 is embedded in the via hole 940 without protruding out of the bottom surface of the circuit board 910, and the via hole 940 is soldered with the first pin 970 by a via reflow method, and the via hole 940 is electrically connected with the filter capacitor 990. And the second pin 980 and the SMD pad 920 are subjected to SMT normal surface mounting.
And S730, welding the external connection carrier on one side of the circuit board away from the slot base.
Illustratively, the circuit boards 810, 910 and the external connection carriers 811, 911 are fixed by a tooling, and laser welding of the external connection carriers 811, 911 and the first pins 870, 970 is performed using a laser welding apparatus.
From this, slot base 2 power pin (first stitch 770) extension pierces through circuit board 810, does not carry out the line conduction through circuit board 810, has avoided carrying out complicated wiring overall arrangement on circuit board 810 like the PCB board, realizes the signal through-flow connection of power supply distal end to load, reduces the PCB board design layer number, reduces the PCB board design degree of difficulty, has simplified manufacturing flow, has reduced manufacturing cost. Meanwhile, the socket base 2 is provided with power pins which are lengthened, dispensed and bent, so that good fixing and welding effects are achieved.
The power pins of the socket base 2 are lengthened but do not penetrate through the PCB, and are subjected to reflow soldering with the PCB, so that the socket base is only used for being connected with the filter capacitor 990 on the PCB (a large amount of power through-flow copper sheet space is not needed), and the overall layer number of the PCB is reduced.
Finally, the above embodiments are only used to illustrate the technical solution of the present application. It will be appreciated by those skilled in the art that, although the application has been described in detail with reference to the foregoing embodiments, various modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof. Such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions in the various embodiments of the application.