Disclosure of Invention
The application provides a display panel, a display device and a preparation method of the display panel, so as to improve the service performance of the display panel at least to a certain extent.
In order to achieve the above purpose, the technical scheme includes that in a first aspect, a display panel is provided, the display panel is provided with a display area and a non-display area, the non-display area is arranged on the periphery side of the display area in a surrounding mode, the non-display area comprises an array substrate, an isolation structure, a lifting layer, a first filling layer and a first packaging layer, the isolation structure is located on the array substrate, the isolation structure is limited with a plurality of isolation openings, one end of the isolation structure, which is away from the array substrate, is a first end face, the lifting layer is located on the array substrate, the lifting layer comprises a first lifting portion located on one side, away from the array substrate, of the isolation structure, the first filling layer is located on one side, away from the array substrate, of the lifting portion, orthographic projection of the first filling layer on the array substrate covers orthographic projection of the first lifting portion on the array substrate, and the first packaging layer is located on one side, away from the array substrate, of the first filling layer.
In the display panel provided by the embodiment of the application, the height of the corresponding area of the array substrate can be effectively raised through the lifting layer, so that a structure similar to a baffle wall is formed in the non-display area, moisture in the external environment is prevented from invading the display area to influence the display effect of the display panel, and the purpose of improving the service performance of the display panel is achieved.
Optionally, the lifting layer further comprises a second lifting portion located in the isolation opening, and the second lifting portion is connected with the adjacent first lifting portion.
Optionally, the non-display area further includes a filling layer, and the filling layer is located between the first packaging layer and the array substrate.
Optionally, the orthographic projection of the first filling layer on the array substrate covers the orthographic projection of the isolation opening correspondingly arranged on the array substrate, and the isolation opening correspondingly arranged is located at one side of the first filling layer close to the array substrate.
Optionally, at least two of the isolation openings are disposed adjacent to each other.
Optionally, orthographic projections of at least one isolation opening adjacent to the isolation opening correspondingly arranged on the array substrate and orthographic projections of the first filling layer on the array substrate are arranged at intervals.
Optionally, the first filling layer includes a first filling sub-portion, a second filling sub-portion and a third filling sub-portion, where the first filling sub-portion is disposed corresponding to the lifting layer and is located at a side of the lifting layer away from the array substrate, the second filling sub-portion covers the first end surface, and the third filling sub-portion connects the first filling sub-portion and the second filling sub-portion.
Optionally, a cavity is provided between the first filling layer, the lifting layer and the first end face.
Optionally, the display panel further includes a second filling layer, where the second filling layer is disposed in the corresponding isolation opening and is located at a side of the lifting layer, which is close to the array substrate.
Optionally, the display panel further includes a third filling layer, where the third filling layer and the second filling layer are respectively disposed in two adjacent isolation openings and disposed in the same layer in a direction parallel to a plane where the array substrate is located.
Optionally, the display area of the display panel includes a light emitting element, and the second filling layer and the light emitting element are made of the same material.
Optionally, the third filling layer is the same material as the first filling layer.
Optionally, the second filling layer is of a different material than the third filling layer.
Optionally, the second filling layer, the first filling layer and the third filling layer each include a light emitting material layer and a first electrode layer stacked in order.
Optionally, a portion of the first electrode layer is connected to a side of the isolation structure facing the isolation opening.
Optionally, the first electrode layer is a cathode layer.
Optionally, the non-display area further includes a pixel defining layer, the pixel defining layer is located between the array substrate and the isolation structure, the pixel defining layer defines a plurality of pixel openings, and the pixel openings are arranged corresponding to and communicated with the isolation openings.
Optionally, the non-display area further includes a second electrode layer, where the second electrode layer is located between the array substrate and the pixel defining layer, and a portion of the second electrode layer is exposed through the pixel opening.
Optionally, the second electrode layer is an anode layer.
Optionally, the isolation structure comprises a first isolation part and a second isolation part which are sequentially overlapped on the array substrate, the first end face is located at one end, away from the first isolation part, of the second isolation part, and orthographic projection of the first isolation part on the array substrate is located in orthographic projection range of the second isolation part on the array substrate.
Optionally, the first isolation part is a conductive structure.
Optionally, the first isolation part includes at least two sub-supporting parts, and the sub-supporting parts far from the array substrate are in orthographic projection on the array substrate, and the sub-supporting parts near to the array substrate are in orthographic projection range on the array substrate.
Optionally, the orthographic projection of the sub-supporting portion on the array substrate near the array substrate is located in the orthographic projection range of the second isolation portion on the array substrate.
Optionally, the first packaging layer comprises a first packaging part and a second packaging part which are connected, the first packaging part is located at one side of the first filling layer, which is away from the array substrate, the second packaging part is connected with the adjacent first packaging part, the orthographic projection of the first packaging part on the array substrate covers the orthographic projection of the isolation opening which is correspondingly arranged on the array substrate, and the isolation opening which is correspondingly arranged is located at one side of the first packaging part, which is close to the array substrate.
Optionally, at least two of the isolation openings are disposed adjacent to each other.
Optionally, the orthographic projection of the second packaging part on the array substrate covers the orthographic projection of at least one isolation opening adjacent to the corresponding isolation opening on the array substrate.
Optionally, the second packaging part includes a first packaging sub-part and a second packaging sub-part, the first packaging sub-part is located the first end face deviates from the one side of array substrate and the first packaging sub-part with the first end face interval sets up, the second packaging sub-part is connected the first packaging sub-part with the first packaging part.
Optionally, the non-display area further includes a second encapsulation layer covering the first encapsulation layer.
Optionally, the non-display region further includes a planarization layer located between the first encapsulation layer and the second encapsulation layer.
Optionally, the material of the planarization layer includes an organic material.
Optionally, the planarization layer includes a plurality of planarization units disposed at intervals, and two adjacent planarization units are separated by the first encapsulation layer.
Optionally, orthographic projections of the first lifting part on the array substrate and orthographic projections of the flattening unit on the array substrate are arranged at intervals.
In a second aspect, the present application provides a method for manufacturing a display panel, including:
Forming an isolation structure on one side of the array substrate, wherein the isolation structure is enclosed to form a plurality of isolation openings, and one end of the isolation structure, which is away from the array substrate, is a first end face;
Forming a lifting layer on one side of a part of the isolation structure, which is away from the array substrate, wherein the lifting layer comprises a first lifting part, and the first lifting part covers the first end face close to the isolation opening;
forming a filling material layer and a first packaging layer on one side of the isolation opening and one side of the isolation structure, which are away from the array substrate;
And the filling material layer covers the part of the lifting layer, which is away from the array substrate, to form a first filling layer.
Optionally, the isolation opening includes adjacent first and second openings;
The step of forming a lifting layer on one side of a part of the isolation structure, which is away from the array substrate, wherein the lifting layer comprises a first lifting part, and the first lifting part covers the first end face close to the isolation opening, and comprises the following steps:
And preparing a lifting layer in the first opening and on the surface of one side, facing away from the array substrate, of the first end face, which is close to the first opening.
Optionally, before the step of preparing the lifting layer in the first opening and on a surface of the first end face, facing away from the array substrate, near the first opening, the method further includes:
And preparing a second filling layer in the first opening.
Optionally, a portion of the filling material layer located at the second opening forms a third filling layer.
In a third aspect, the present application further provides a display device, including a display panel, where the display panel is any one of the display panels described above, or a display panel prepared by the preparation method described above.
The display device provided by the embodiment of the application comprises the display panel, so that the display device at least comprises any one or more of the beneficial effects of the display panel, and the specific effects are described above and are not repeated herein.
Compared with the prior art, the display panel, the display device and the preparation method of the display panel have the advantages that the thickness of the film layer at part of the position in the non-display area can be increased through the lifting layer, the first filling layer and the like, so that a structure with a certain blocking function is formed outside the display area, the overflow risk of the flattening layer is reduced, the water vapor invasion resistance of the display panel can be improved, and the packaging effect and the service performance of the display panel are improved.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or communicable with each other, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interactive relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The term "layer" as used herein may refer to a portion of material that includes regions having a certain thickness. The layer may extend over the entire underlying or overlying structure, or may have a range that is less than the range of the underlying or overlying structure. Further, the layer may be a region of a continuous structure, either homogenous or non-homogenous, having a thickness less than the thickness of the continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layers may extend laterally, vertically and/or along a tapered surface. The array substrate may be a layer, may include one or more layers therein, and/or may have one or more layers located thereon, and/or thereunder. The layer may comprise a plurality of layers. For example, the interconnect layer may include one or more conductors and contact layers (within which contacts, interconnect lines, and/or vias are formed) and one or more dielectric layers.
The display panel 10 may be an Organic LIGHT EMITTING Diode (OLED) display panel 10. The display panel 10 has a display area AA and a non-display area NA located at the outer peripheral side of the display area AA, wherein the display area AA is provided with an organic light emitting material, and the organic light emitting material emits light under the action of current for realizing the display of pictures, and the non-display area NA is generally located at the outer peripheral side of the display area AA or used for connecting the display area AA and a perforated area located in the display area AA, and besides being used for providing certain package protection and supporting fixation for the display area AA, the non-display area NA can also be used for realizing the electrical connection between the display area AA and an external driving circuit and other electronic elements so as to transmit electrical signals and realize the normal display function of the display area AA. Generally, the non-display area NA is disposed around the display area AA, i.e. the edge portion of the display panel 10, and forms a frame-like area around the display area AA.
In the process of realizing the present application, the inventor found that there is a problem in the related art that the display abnormality exists in part of the pixel units, which affects the display effect of the display panel 10 to some extent and eventually affects the usability thereof, reducing the reliability of the display panel 10.
Based on this, the embodiment of the present application provides a display panel 10 to at least alleviate or improve the above-mentioned technical problems to some extent.
Referring to fig. 1-3, the display panel 10 has a display area AA and a non-display area NA, wherein the non-display area NA is disposed around the periphery of the display area AA.
Specifically, the non-display area NA includes an array substrate 1, an isolation structure 2, a lifting layer 3, a first filling layer 52 and a first packaging layer 4, where the isolation structure 2 is located on the array substrate 1, the isolation structure 2 defines a plurality of isolation openings 201, one end of the isolation structure 2, which is away from the array substrate 1, is a first end face 202, the lifting layer 3 is located on the array substrate 1, the lifting layer 3 includes a first lifting portion 31 located on a side, which is away from the array substrate 1, of the isolation structure 2, the first filling layer 52 is located on a side, which is away from the array substrate 1, of the lifting layer 3, an orthographic projection of the first filling layer 52 on the array substrate 1 covers an orthographic projection of the first lifting portion 31 on the array substrate 1, the first packaging layer 4 is located on a side, which is away from the array substrate 1, of the isolation structure 2, and the first lifting portion 31 is located between the first end face 202 and the first packaging layer 4.
The content of the isolation structure 23, referred to below, is further described in patent CN118251982A、202410864269.8、PCT/CN2024/098407、PCT/CN2024/102783、PCT/CN2024/098217、PCT/CN2024/099419、PCT/CN2024/099072、CN117979755A、CN117998900A、CN117062489A、CN117580403A、CN116583155A、CN116669477A、CN117396039A、CN116669480A、CN116600606A、CN117500332A for reference.
The first elevations 31 arranged on part of the first end face 202 of the isolation structure 2 can effectively raise the film thickness in this region. The isolation structure 2, the lifting layer 3, the first filling layer 52 and the first packaging layer 4 are matched with each other, a special structure with a larger height difference is formed on the surface of one side of the non-display area NA, which is away from the array substrate 1, so that the thickness of a partial area in the non-display area NA is increased, a structure similar to a blocking wall is formed in the non-display area NA, the blocking capacity of the non-display area NA to external water vapor is enhanced, the water vapor in the external environment is prevented from invading the display area AA to influence the display effect of the display panel 10, and the purpose of improving the service performance of the display panel 10 is achieved.
In some embodiments, at least part of the isolation openings 201 are arranged at intervals along the first direction and/or the second direction, and the lifting layers 3 are sequentially and correspondingly arranged along the extending direction of the corresponding isolation openings 201, so as to form first lifting parts 31 sequentially arranged along the first direction and/or the second direction. The number of first filling layers 52 is the same as the number of lifting layers 3 and is arranged in a one-to-one correspondence. The first filling layer 52 is located at a side of the first lifting portion 31 away from the array substrate 1, and the front projection of the first filling layer 52 on the array substrate 1 can cover the front projection of the first lifting portion 31 on the array substrate 1.
The first direction and the second direction are parallel to the surface of the array substrate 1, and may be orthogonal to each other or may have a certain included angle. The first raised portion 31 can form a raised, dam-like structure on the first end face 202 of the isolation structure 2. When the first lifting parts 31 are sequentially arranged in the first direction and/or the second direction, they may be arranged around the outer circumferential side of the display area AA and form a closed or semi-closed area that may surround the display area AA.
The above-mentioned multiple first lifting portions 31 are similar to retaining walls in structure formed along the distribution positions of the non-display area NA and capable of surrounding the display area AA, and not only can be matched with the isolation structure 2 and the first packaging layer 4 to improve the effect of the packaging portion of the display panel 10, isolate the display area AA from the external environment better, avoid water and oxygen in the external environment from invading the display area AA, so as to improve the packaging reliability of the display panel 10, but also can be used for limiting the flow and diffusion ranges of other film layers covered on the first packaging layer 4 on the side facing away from the array substrate 1 in the preparation process, help limit the corresponding film layer structure in the design range, and avoid material overflowing to an unnecessary area, thereby improving the processing yield of the display panel 10, and improving the reliability and the use effect of the display panel 10 to a certain extent.
Specifically, referring to fig. 2 and 3, the direction indicated by X in the drawing is a first direction, the direction indicated by Y is a second direction, and the first direction and the second direction are orthogonal to each other. The partial isolation openings 201 are arranged at intervals along the first direction, correspondingly, partial first lifting parts 31 are arranged at intervals along the first direction and positioned in the same row, the partial isolation openings 201 are arranged at intervals along the second direction, and correspondingly, partial first lifting parts 31 are arranged at intervals along the second direction and positioned in the same column.
The first lifting parts 31 located in the same row or column are matched with each other, so that the function of preventing the corresponding film layer arranged in the display area AA from overflowing during the preparation process can be achieved. The above-described lifting layer 3 having the first lifting portion 31 is disposed to extend in the first direction and the second direction at different positions, respectively, and forms a rectangular or rectangular-like structure surrounding the display area AA, so that the anti-overflow function of the display panel 10 can be further improved.
The first filling layer 52 disposed on the side of the first lifting portion 31 facing away from the array substrate 1 can further improve the anti-overflow effect of the display panel 10.
Specifically, the orthographic projection of the first filling layer 52 on the array substrate 1 covers the orthographic projection of the isolation opening 201 correspondingly disposed on the array substrate 1, and the isolation opening 201 correspondingly disposed is located at one side of the first filling layer 52 close to the array substrate 1.
In some embodiments, referring to fig. 3, the orthographic projection of at least one isolation opening 201 adjacent to the corresponding isolation opening 201 on the array substrate 1 is spaced apart from the orthographic projection of the first filling layer 52 on the array substrate 1.
In other embodiments, referring to fig. 4, at least two corresponding isolation openings 201 are disposed adjacent to each other, and two first filling layers 52 are disposed adjacent to each other.
The structures shown in fig. 3 and fig. 4 may be simultaneously present in the same display panel 10, and may be different structures of the display panel 10 disposed in different areas, or may be structures of the display panel 10 in different viewing angles in the same area.
The front projection of the first encapsulation layer 4 on the array substrate 1 covers the isolation structures 2 and the isolation openings 201.
Specifically, the non-display area NA further includes a planarization layer 9, where the planarization layer 9 is located on a side of the first encapsulation layer 4 facing away from the array substrate 1. Referring to fig. 3, the structure similar to the wall formed by the plurality of first lifting portions 31 can block the planarization layer 9, reduce the possibility of overflow of the planarization layer 9 during the manufacturing process, and further improve the packaging effect of the display panel 10.
In some embodiments, the material of the planarization layer 9 includes an organic material. When the planarizing layer 9 is made of an organic material, the above-described planarizing layer 9 may be formed by a technique such as IJP (Ink-Jet Printing).
The planarization rete that forms through the preparation of IJP technique can accurate control the rete thickness in different positions to make the rete that finally prepares comparatively flat in one side surface that deviates from array substrate 1, with the surface smoothness who improves first encapsulation layer 4, through the mode of filling the depressed part, make the surface of display panel 10 more level and smooth, avoid influencing display panel 10's display effect, help improving display panel 10's performance.
Referring to fig. 3, the planarization layer 9 can be separated by the first encapsulation layer 4.
Specifically, the planarization layer 9 includes a plurality of planarization units 91 disposed at intervals, and two adjacent planarization units 91 are separated by the first encapsulation layer 4.
The orthographic projection of the first lifting portion 31 on the array substrate 1 and the orthographic projection of the planarization unit 91 on the array substrate 1 are arranged at intervals, and at this time, the first packaging portion 41 can separate the planarization layer 9 under the lifting action of the first lifting portion 31, so as to reduce the overflow risk of the planarization layer 9 in the processing process.
Referring to fig. 3, the first lifting portion 31 may cover the first end surface 202 of the isolation structure 2 at a corresponding position.
The above-mentioned lifting layer 3 comprises, in addition to the first lifting portion 31, a second lifting portion 32. The second raised portion 32 is located within the isolation opening 201 and is connected to the adjacent first raised portion 31.
Referring to fig. 3, the display panel 10 has a plurality of isolation openings 201 arranged at intervals, wherein the isolation opening 201 at the middle is filled with the second lifting portion 32, the first end surface 202 of the isolation structure 2 at the periphery of the isolation opening 201 at the middle is covered with the first lifting portion 31, and the first lifting portion 31 is connected with the second lifting portion 32.
Specifically, the above-mentioned lifting layer 3 formed by the cooperation of the first lifting portion 31 and the second lifting portion 32 forms a package for the corresponding isolation opening 201.
In some embodiments, the non-display area NA further includes a second filling layer 51 in addition to the first filling layer 52, see fig. 3.
Specifically, the second filling layer 51 is located between the lift-off layer 3 and the array substrate 1. The second filling layers 51 are plural in number and sequentially arranged at intervals in the corresponding isolation openings 201. Along the thickness direction of the display panel 10, the second filling layer 51 and the first filling layer 52 are sequentially arranged, and the second filling layer 51 is located at one side of the lifting layer 3 close to the array substrate 1.
The structure of the first filling layer 52 is shown in fig. 3.
Specifically, the first filling layer 52 includes a first filling sub-portion 521, where the first filling sub-portion 521 is disposed corresponding to the lifting layer 3 and is located on a side of the lifting layer 3 away from the array substrate 1.
That is, the second filling layer 51 is provided with a lifting layer 3 and a first filling sub-portion 521 on a side facing away from the array substrate 1, i.e., the first filling sub-portion 521 and the lifting layer 3 are sequentially stacked on a part of the second filling layer 51.
Referring to fig. 3, in addition to the first filler sub-portion 521, the first filler layer 52 further includes a second filler sub-portion 522, and the second filler sub-portion 522 covers the first end surface 202.
It should be noted that the second filling sub-portion 522 and the corresponding first lifting portion 31 cover the same first end face 202 of the isolation structure 2.
Specifically, in the lifting layer 3 and the first filling layer 52 sequentially arranged corresponding to the same isolation opening 201, the front projection of the second filling sub-portion 522 on the array substrate 1 and the front projection of the first lifting portion 31 on the array substrate 1 are arranged at intervals, or the front projection outline of the second filling sub-portion 522 on the array substrate 1 and the front projection outline of the first lifting portion 31 on the array substrate 1 are just overlapped.
In some embodiments, the first filling layer 52 further includes a third filling sub-portion 523, and the third filling sub-portion 523 connects the first filling sub-portion 521 and the second filling sub-portion 522, so that the first filling layer 52 forms a continuous film structure.
In the thickness direction of the display panel 10, a height difference exists between an end of the first filling sub-portion 521, which is close to the second filling sub-portion 522, and an end of the second filling sub-portion 522. The third filling sub-portion 523 extends along the outer edge of the lift layer 3 to connect the above-described first filling sub-portion 521 and second filling sub-portion 522.
It should be noted that, the adjacent first lifting portions 31 and the first end surface 202 are spaced apart, and the first lifting portions 31 are suspended relative to the adjacent isolation structures 2.
Since the first filling layer 52 covers a part of the area of the first end surface 202, the first filling layer 52 and the lifting layer 3 enclose a cavity S on the first end surface 202 of the isolation structure 2, see fig. 3. The cavity S is a closed chamber and is not connected to the external environment.
During the preparation of the first filling layer 52, the second filling sub-portion 522 in the first filling layer 52 is used to cover the first end face 202 of the isolation structure 2, and the third filling sub-portion 523 in the first filling layer 52 is used to connect the second filling sub-portion 522 and the first filling sub-portion 521. In this way, during the preparation of the first filling layer 52, the first filling layer 52 is in contact with the first elevation 31 of the elevation 3 and covers the first end face 202 of the isolation structure 2, and the space between the first elevation 31 and the first end face 202 is closed and forms a closed chamber.
In some embodiments, referring to fig. 3, the display panel further includes a third filling layer 53, where the third filling layer 53 and the second filling layer 51 are respectively disposed in two adjacent isolation openings 201 and are disposed in the same layer in a direction parallel to the plane of the array substrate 1.
The display area AA of the display panel 10 includes light emitting elements, and the second filling layer 51 is made of the same material as the light emitting elements. Correspondingly, the third filling layer 53 is also the same material as the light emitting element.
In a state in which one or more of the third filling layers 53 disposed adjacent to the display area AA can be energized, the corresponding third filling layer 53 can emit light. In the unpowered state, the corresponding third filling layer 53 does not emit light.
It should be noted that the materials of the first filling layer 52 and the third filling layer 53 are the same, please refer to fig. 3.
In some embodiments, the first filling layer 52 and the second filling layer 51 are of different materials, and in special cases, the first filling layer 52 may be of the same material as the second filling layer 51.
Specifically, the second filling layer, the first filling layer and the third filling layer are any one of a first light emitting unit, a second light emitting unit and a third light emitting unit which emit different colors under the power-on condition.
In some embodiments, the exit color of at least one third filling layer 53 adjacent to the first filling layer 52 is the same as the exit color of the corresponding first filling layer 52 and the film material is consistent.
The second filling layer 51 and the third filling layer 53 arranged at the same layer between the first filling layer 52 and the array substrate 1 are prepared by different processes, so that the emergent color of the second filling layer 51 can be different from that of the third filling layer 53, and correspondingly, the first filling layer 52 and the third filling layer in the adjacent partial isolation opening 201 are prepared by the same process, so that the emergent color is the same.
In the preparation process, the effect of lifting the thickness of the film layer at a part of the position in the non-display area NA can be achieved on the basis of the film layer obtained in the previous step, and at this time, the film layers obtained in the subsequent process cover different areas of the display panel 10 respectively and form the first filling layer 52 and the third filling layer 53 respectively.
In some embodiments, each of the filling layers may be prepared by evaporation.
Specifically, the second filling layer 51 may be formed in the isolation opening 201 by evaporation, and the first filling layer 52 and the third filling layer may be formed on the sides of the isolation structure 2 and the lifting layer 3 facing away from the array substrate 1 by evaporation, respectively.
Specifically, the second filling layer 51, the first filling layer 52, and the third filling layer 53, which have different emission colors under the power-on condition, each include a light emitting material layer 501 and a first electrode layer 502 stacked in order.
The materials of the light emitting material layer 501 and the first electrode layer 502 in the adjacent third filling layer 53 and first filling layer 52 are the same in the direction parallel to the plane in which the array substrate 1 is located.
In some embodiments, the light emitting wavelength of the first light emitting unit may be set to be smaller than the light emitting wavelength of the second light emitting unit, and the light emitting wavelength of the second light emitting unit may be set to be smaller than the light emitting wavelength of the third light emitting unit.
The luminescent material layer 501 may be made of organic small molecule luminescent material, complex luminescent material, or polymer. The different luminescent material layers 501 are capable of emitting different colors of light in the energized state. That is, the materials of the luminescent material layers 501 in the first, second and third light emitting units are different, and the colors of the emitted light are different.
Specifically, the light emitting wavelength of the light emitting material layer 501 in the first light emitting unit under the energization condition may be set smaller than the light emitting wavelength of the light emitting material layer 501 in the second light emitting unit under the energization condition. The light emitting wavelength of the light emitting material layer 501 in the second light emitting unit under the energization condition is smaller than the light emitting wavelength of the light emitting material layer 501 in the third light emitting unit under the energization condition.
In general, the light emitting material layer 501 in the first light emitting unit may be configured to emit blue light under an energized condition, the light emitting material layer 501 in the second light emitting unit may be configured to emit green light under an energized condition, and the light emitting material layer 501 in the third light emitting unit may be configured to emit red light under an energized condition.
Referring to fig. 3, the third light emitting unit forms a first filling layer 52 and a third filling layer 53, and the first light emitting unit forms a second filling layer 51 between the first filling layer 52 and the array substrate 1.
In other embodiments, a second filling layer 51 between the first filling layer 52 and the array substrate 1 may be provided to be composed of a second light emitting unit.
Referring to fig. 4, two adjacent isolation openings 201 are respectively filled with a second filling layer 51 and a third filling layer 53, wherein the second filling layer 51 and the third filling layer 53 are respectively composed of a first light emitting unit and a second light emitting unit. In addition, the side of the second filling layer 51 facing away from the array substrate 1 is provided with a lifting layer 3 and a first filling layer 52.
The second filling layer 51 is arranged in the isolation opening 201 and is connected to the isolation structure 2 on the side facing the isolation opening 201.
Referring to fig. 3, a first electrode layer 502 of the second filling layer 51 is connected to a sidewall of the isolation structure 2 facing the isolation opening 201.
Specifically, the first electrode layer 502 is a cathode layer. The first electrode layer 502 is overlapped with one side of the isolation structure 2 close to the array substrate 1.
In some embodiments, the isolation structure 2 includes a first isolation portion 21 and a second isolation portion 22 stacked in sequence, where the second isolation portion 22 is located on a side of the first isolation portion 21 facing away from the array substrate 1, and the first end surface 202 is located on an end of the second isolation portion 22 facing away from the first isolation portion 21.
Specifically, the front projection of the first isolation portion 21 on the array substrate 1 is located within the front projection range of the second isolation portion 22 on the array substrate 1, and the isolation structure 2 is in a form of being "wide in top and narrow in bottom" as a whole.
In some embodiments, the first isolation portion 21 of the isolation structure 2 is a conductive structure, and the first isolation portion 21 may be a single-layer structure or a multi-layer structure.
When the first separator 21 is a multi-layered structure, it may be provided that the first separator 21 includes at least two sub-supporting portions 211 stacked one on another.
Specifically, the sub-support 211 far from the array substrate 1 is projected forward on the array substrate 1, and the sub-support 211 near to the array substrate 1 is positioned within the range of the forward projection on the array substrate 1.
In some embodiments, the front projection of the sub-support 211 on the array substrate 1 near the array substrate 1 is located within the front projection range of the second isolation portion 22 on the array substrate 1.
The side wall of the sub-support 211 far from the array substrate 1 facing the isolation opening 201 is offset toward the direction away from the isolation opening 201 with respect to the side wall of the sub-support 211 near to the array substrate 1 facing the isolation opening 201, so that the cross-sectional side wall of the isolation structure 2 takes on an eave-like shape.
Of course, in other similar embodiments, the dimensions and projection relationship between the first isolation portion 21 and the second isolation portion 22 may be adaptively adjusted according to actual processing requirements.
In some embodiments, the first isolation portion 21 and the second isolation portion 22 are similar to rectangular or trapezoidal in cross-section.
In some embodiments, the first isolation portion 21 and the second isolation portion 22 may be integrally formed, or may be formed by stacking different materials.
Specifically, the material of the second isolation portion 22 includes a titanium metal layer, the material of the sub-support portion 211 far from the array substrate 1 includes aluminum metal layer, and the material of the sub-support portion 211 near to the array substrate 1 includes at least one of molybdenum and molybdenum nitride, and is a molybdenum metal layer.
The first electrode layer 502 in the second filling layer 51 overlaps the sidewall of the first separator 21 in the separator 2. Specifically, the first electrode layer 502 may overlap only the sub-supporting portions 211 near the array substrate 1, see fig. 3, or overlap both sub-supporting portions 211, see fig. 5.
The non-display area NA further includes a second electrode layer 7, where the second electrode layer 7 is disposed corresponding to the isolation opening 201, and the second filling layer 51 may be connected to the second electrode layer 7 through the light emitting material layer 501.
When the first electrode layer 502 is a cathode layer, the second electrode layer 7 is an anode layer, and the first electrode layer 502 may be an anode layer, or the second electrode layer 7 may be a cathode layer, as required.
The preparation and processing manners of the first electrode layer 502, the light emitting material layer 501 and the second electrode layer 7 are conventional techniques, and are not described herein.
A pixel defining layer 6 is also provided in the non-display area NA.
Referring to fig. 3-4, the pixel defining layer 6 is located between the array substrate 1 and the isolation structure 2. The pixel defining layer 6 defines a plurality of pixel openings 601, and the pixel openings 601 are disposed in correspondence with and communicate with the isolation openings 201.
The pixel definition layer 6 is an inorganic layer, and can be used for defining a pixel range, ensuring mutual independence among pixels, and simultaneously blocking water vapor in the array substrate 1, and preventing erosion of related film layers on one side of the pixel definition part away from the array substrate 1 by external factors such as water, oxygen and the like.
Referring to fig. 3, the second electrode layer 7 is located between the array substrate 1 and the pixel defining layer 6 and can be exposed with respect to the pixel opening 601 and is adhered to the light emitting material layer 501.
The following describes the structure of the first encapsulation layer 4:
specifically, the first encapsulation layer 4 includes a first encapsulation portion 41 and a second encapsulation portion 42 connected to each other, where the first encapsulation portion 41 is located at a side of the first filling layer 52 facing away from the array substrate 1, and the second encapsulation portion 42 is used to connect adjacent first encapsulation portions 41, refer to fig. 3.
Specifically, the front projection of the first package portion 41 on the array substrate 1 covers the front projection of the isolation opening 201 disposed correspondingly on the array substrate 1, and the isolation opening 201 disposed correspondingly is located at a side of the first package portion 41 close to the array substrate 1.
Referring to fig. 3, at this time, the front projection of the second package portion 42 on the array substrate 1 covers the front projection of at least one isolation opening 201 adjacent to the corresponding isolation opening 201 on the array substrate 1, and in other embodiments, referring to fig. 4, at least two isolation openings 201 are adjacent to each other, and two first filling layers 52 are adjacent to each other.
The second package portion 42 includes a first package sub-portion 421 and a second package sub-portion 422, where the first package sub-portion 421 is spaced from the first end surface 202 of the adjacent isolation structure 2, i.e. is suspended relative to the first end surface 202, and the second package sub-portion 422 is used for connecting the first package sub-portion 421 and the first package portion 41.
Specifically, the first package sub-portion 421 is located at a side of the first end surface 202 facing away from the array substrate 1 and is suspended relative to the first end surface 202, the second package sub-portion 422 covers the third filling layer 53 located in the corresponding isolation opening 201, one end of the second package sub-portion 422 extends to be connected with the first package sub-portion 421 through a sidewall of the isolation structure 2, and the other end of the second package sub-portion 422 extends to be connected with the first package portion 41 through a sidewall of the isolation structure 2.
It should be noted that the first encapsulation layer 4 may be a thin film layer prepared by chemical vapor deposition (Chemical Vapor Deposition, CVD) technology.
The first encapsulation layer 4 may be prepared from at least one of an organic material and an inorganic material by CVD technique.
Under the action of the second package sub-portion 422, the second package portion 42 is connected to the first package portion 41 and forms a continuous film structure, i.e. the first package layer 4. The first encapsulation layer 4 may be used to achieve a preliminary encapsulation of the NA film layer of the non-display area.
The first encapsulation layer 4 may be used to enhance the sealability of the non-display area NA, reduce the possibility of intrusion of water oxygen, etc. in the external environment into the display area AA through the non-display area NA, and simultaneously help to improve the structural stability and mechanical strength of the display panel 10, so that the display panel 10 can better withstand the pressure and stress from the outside without deformation damage, thereby improving the reliability and use effect of the display panel 10.
In some embodiments, the lifting layer 3 and the first encapsulation layer 4 may be manufactured by the same process.
It should be noted that, in this embodiment and other similar embodiments, a frame area is further provided outside the non-display area NA, and a retaining wall is provided in the frame area. The structure of the blocking wall is disclosed in the related art and will not be described herein.
After the first encapsulation layer 4 is applied to encapsulate the surface of the non-display area NA, the planarization layer 9 and other film structures may be further disposed on a surface of the first encapsulation layer 4 facing away from the array substrate 1, so as to further encapsulate the display panel 10.
Specifically, the non-display area NA further includes a second encapsulation layer 8 covering the first encapsulation layer 4.
Referring to fig. 3-4, the second encapsulation layer 8 covers the planarization layer 9, and the planarization layer 9 is located between the first encapsulation layer 4 and the second encapsulation layer 8.
In other embodiments, the second encapsulation layer 8 may have a single-layer structure or a multi-layer structure. The second encapsulation layer 8 may be an organic encapsulation film or an inorganic encapsulation film. Of course, when the second encapsulation layer 8 has a multi-layered structure, the second encapsulation layer 8 may also include an organic encapsulation film layer and an inorganic encapsulation film layer, respectively.
In this embodiment or other similar embodiments, at least one film structure of the touch layer, the organic adhesive layer, and the cover plate may be further disposed on a side of the second encapsulation layer 8 facing away from the array substrate 1.
It can be understood that, in the display panel 10 provided by the embodiment of the application, the thickness of the corresponding position of the display panel 10 can be increased by arranging the first lifting portion 31 outside the first end face 202 of the partial isolation structure 2 of the non-display area NA, so that a structure similar to a wall is formed in the non-display area NA, thereby increasing the possibility that the non-display area NA blocks water oxygen and the like in the external environment from invading the display area AA, improving the reliability of the display panel 10, and enabling the display panel 10 to have a better display effect.
In a second aspect, an embodiment of the present application provides a method for manufacturing a display panel 10, where the display panel 10 includes a display area AA and a non-display area NA, and the non-display area NA has an array substrate 1, the method includes:
step S1, forming an isolation structure 2 on one side of an array substrate 1, wherein the isolation structure 2 is enclosed to form a plurality of isolation openings 201, and one end of the isolation structure 2, which is away from the array substrate 1, is a first end face 202;
Step S2, forming a lifting layer 3 on one side of a part of the isolation structure 2, which is away from the array substrate 1, wherein the lifting layer 3 comprises a first lifting part 31, and the first lifting part 31 covers a first end face 202 close to the isolation opening 201;
in step S3, a filling material layer and a first encapsulation layer 4 are formed on the isolation opening 201 and the isolation structure 2 on a side facing away from the array substrate 1.
The part of the filling material layer covering the lifting layer 3, which faces away from the array substrate 1, forms a first filling layer 52, and the first packaging layer 4 covers the filling material layer.
The preparation method is shown in fig. 6.
In the method for manufacturing the display panel 10 according to the embodiment of the present application, a structure similar to a barrier wall can be formed on the non-display area NA by covering the first lifting portion 31 and the first filling layer 52 of the first end face 202 of the array substrate 1. The retaining wall structure can help to improve the break difference of the first encapsulation layer 4 covering the first lifting portion 31, the first filling layer 52 and the isolation structure 2 at different positions, so as to improve the difficulty of water vapor in the external environment entering the display area AA of the display panel 10 through the non-display area NA, improve the reliability of the display panel 10, and enable the display panel 10 to have better use performance.
In some embodiments, the side facing away from the array substrate 1 with the first encapsulation layer 4 is covered with a planarization layer 9.
At this time, the structure similar to the wall formed by the first lifting portion 31, the first filling layer 52 and the first packaging layer 4 helps to improve the overflow problem of the planarization layer 9, helps to improve the display effect of the display panel 10, further prevents the display area AA from being corroded by water and oxygen, and achieves the purpose of improving the service performance of the display panel 10.
The isolation opening 201 includes a first opening and a second opening, wherein the lifting layer 3 covers the first opening. The front projection of the lifting layer 3 on the array substrate 1 covers the front projection of the first opening on the array substrate 1, and meanwhile, the front projection of the lifting layer 3 on the array substrate 1 and the front projection of the second opening on the array substrate 1 are arranged at intervals.
In some embodiments, a lifting layer 3 is formed on a side of a portion of the isolation structure 2 facing away from the array substrate 1, where the lifting layer 3 includes a first lifting portion 31, and the step of covering the first end surface 202 near the isolation opening 201 with the first lifting portion 31 includes:
A lifting layer 3 is prepared in the first opening and on the surface of the first end face 202 close to the first opening, which faces away from the array substrate 1.
Before performing the above steps, the method further comprises preparing a second filling layer 51 in the first opening.
Specifically, the preparation process of the second filling layer 51 and the lifting layer 3 is as follows:
Sequentially preparing a luminescent material layer 501, a first electrode layer 502 and a CVD layer to the isolation structure 2 and the isolation opening 201 on the side facing away from the array substrate 1;
the light emitting material layer 501, the first electrode layer 502 and the CVD layer are patterned to form the second filling layer 51 and the lifting layer 3 located in the corresponding isolation opening 201, where the first lifting portion 31 of the lifting layer 3 is located on a side of the isolation structure 2 facing away from the array substrate 1.
The intermediate structure of the display panel 10 prepared as described above is shown in fig. 7A.
In some embodiments, between the step S2 and the step S3, a filling material layer is further prepared in the non-display area NA, that is, the light emitting material layer 501 and the first electrode layer 502 described above, the filling material layer in the second opening forms a third filling layer 53, and the filling material layer on the side of the lifting layer 3 facing away from the array substrate 1 forms a first filling layer 52.
After the first filling layer 52 and the third filling layer 53 are prepared, the first encapsulation layer 4 is formed on the side, facing away from the array substrate 1, of the isolation structure 2, and the first encapsulation layer 4 covers the first filling layer 52, the third filling layer 53 and the isolation structure 2.
In some embodiments, after step S3, the planarization layer 9 and the second encapsulation layer 8 are sequentially stacked on the side of the first encapsulation layer 4 facing away from the array substrate 1, so as to planarize the surface of the display panel 10 and further improve the encapsulation effect of the display panel 10.
In this manufacturing method, the specific structure of the display panel 10 may refer to the structure of any embodiment of the display panel 10 described above, and will not be described herein.
The following specifically describes the preparation process of the non-display area NA of the display panel 10, taking the example that the luminescent color of the first filling layer 52 and the third filling layer 53 is red (that is, the third luminescent unit is prepared to form the first filling layer 52 and the third filling layer 53), and the luminescent color of the second filling layer 51 is blue (that is, the first luminescent unit is prepared to form the second filling layer 51), so as to intuitively demonstrate the influence of the lifting layer 3, the second filling layer 51, the first filling layer 52, and the like on the film thickness of the non-display area NA by matching with the first packaging layer 4, and realize the principle of improving the packaging performance and the anti-overflow effect of the display panel 10.
In preparing the lifting layer 3, each of the isolation openings 201 and the first end face 202 of the isolation structure 2 is provided with the first light emitting unit for forming the second filling layer 51, and one side of the first light emitting unit facing away from the array substrate 1 is covered with the CVD layer. The first light emitting cells and CVD layer located in the first end face 202 and part of the isolation openings 201 (referred to as isolation openings 201 for accommodating light emitting cells of other colors) are then removed. In this process, the first light emitting unit and the CVD layer formed in the correct position may remain in the corresponding isolation opening 201 under the protection of the photoresist and form the second filling layer 51, and at this time the CVD layer may be used to protect the first light emitting unit located in the isolation opening 201 from being etched away. The CVD layer forms a lift-off layer 3.
In this manner, the structure of the display panel 10 shown in fig. 7A can be obtained.
Again, a third light emitting unit is prepared on the isolation structure 2 covering all the isolation openings 201 and the first end face 202 of the isolation structure 2. Subsequently, a CVD layer is covered on the side of the third light emitting unit facing away from the array substrate 1, resulting in the structure of the display panel 10 shown in fig. 7B. In this process, the third light emitting units are separated by the isolation structure 2, wherein the third light emitting units located at the side of the lifting layer 3 away from the array substrate 1 are used for forming the first filling layer 52, the third light emitting units located in the isolation opening 201 and attached to the second electrode layer 7 are used for forming the third filling layer 53, and the CVD layer covers the first filling layer 52 and the third filling layer 53 and forms the first encapsulation layer 4.
Finally, the first encapsulation layer 4 may be covered with the planarization layer 9 and the second encapsulation layer 8 in sequence on a side facing away from the array substrate 1, and a display panel 10 meeting design requirements may be obtained. The structure of the display panel 10 is shown in fig. 7C.
It should be noted that fig. 7A to 7C are only for explaining the processing process, and the arrangement positions and arrangement order of the respective light emitting units and the light transmitting openings in the drawings are only schematic, and are not intended to limit the arrangement and layout of the respective structures described above.
The method for manufacturing the display panel 10 according to the present embodiment may increase the thickness of a partial area in the non-display area NA by patterning only the front pixels, thereby forming a retaining wall-like effect in the non-display area NA and forming a structure with a certain blocking function in the display area AA. The structure can achieve the effects of reducing the overflow risk of the planarization layer 9 and improving the water vapor intrusion resistance of the display panel 10, and can improve the packaging effect and the service performance of the display panel 10.
In a fourth aspect, the present application further provides a display device 100, including the display panel 10 described in any one of the above, referring to fig. 8. The display device 100 includes the display panel 10 as described in any one of the above. The display panel 10 may be the display panel 10 described above, or may be the display panel 10 prepared by the preparation method described above.
The display device 100 provided in this embodiment may be a product or a component with a display function, such as a mobile phone, a notebook, a tablet computer, a smart watch, a smart bracelet, a navigator, a display, a Personal Digital Assistant (PDA) or the like. Since the display device 100 provided in the embodiment of the present application includes the display panel 10, the display device 100 includes at least any one or more of the above-mentioned advantages of the display panel 10, and specific effects are described with reference to the foregoing embodiments and are not repeated here.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.