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CN119495588B - Chip production spacing control method and system - Google Patents

Chip production spacing control method and system
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CN119495588B
CN119495588BCN202411605678.2ACN202411605678ACN119495588BCN 119495588 BCN119495588 BCN 119495588BCN 202411605678 ACN202411605678 ACN 202411605678ACN 119495588 BCN119495588 BCN 119495588B
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welding
spacing
threshold
coefficient
time
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CN119495588A (en
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张勇
何冰强
刘志聃
王海涛
李超
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Guangdong Mechanical and Electrical College
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Guangdong Mechanical and Electrical College
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Abstract

The invention relates to the technical field of manufacturing process control and discloses a chip production interval control method and system, wherein the method comprises the steps of extracting corresponding historical welding records from a historical welding record library based on pad state data and welding interval threshold values, analyzing the historical welding records, and calculating historical deviation coefficients of the welding interval threshold values based on analysis results; the method comprises the steps of judging whether the welding distance threshold is required to be corrected according to the historical deviation coefficient, setting a correction coefficient corresponding to the welding distance threshold and obtaining the corrected welding distance threshold if the welding distance threshold is required to be corrected, collecting environment parameters and process parameters in the welding process, analyzing the environment parameters and the process parameters, generating a compensation control algorithm based on analysis results, performing chip welding according to the corrected welding distance threshold, and controlling the welding process based on the compensation control algorithm by using an SPC tool.

Description

Chip production interval control method and system
Technical Field
The invention relates to the technical field of manufacturing process control, in particular to a chip production interval control method and system.
Background
In the semiconductor industry, particularly in the chip manufacturing segment, pad pitch control is important. The accuracy of the pad pitch directly determines the performance and reliability of the chip. If the bond pad spacing is too large or too small, it can negatively impact the proper operation of the chip and even cause the chip to fail. Thus, precise control of the pitch of the pads is an integral part of the chip manufacturing process.
However, the conventional pad pitch control method has many limitations. First, these methods tend to have inadequate control accuracy, and it is difficult to meet the high accuracy requirements of modern chip manufacturing. Secondly, these methods have a low degree of automation and require a large amount of manual intervention, thereby increasing production costs and the probability of errors. In addition, the production efficiency of the traditional method is not high, and the requirement of large-scale production is difficult to meet.
Therefore, it is necessary to design a chip production space control method and system for solving the technical problems existing in the prior art.
Disclosure of Invention
In view of this, the invention provides a chip production space control method and system, which aims to solve the problem that the pad space control method in the prior art is difficult to meet the requirement of modern chip manufacturing on high precision.
In one aspect, the invention provides a chip production interval control method, which comprises the following steps:
s100, determining a pad to be monitored, and acquiring pad state data of the pad to be monitored;
S200, acquiring welding requirement data and component characteristic data, and determining a welding distance threshold according to the welding pad state data, the welding requirement data and the component characteristic data;
s300, extracting corresponding historical welding records from a historical welding record library based on the welding disc state data and the welding distance threshold value, analyzing the historical welding records, and calculating a historical deviation coefficient of the welding distance threshold value based on an analysis result;
S400, judging whether the welding interval threshold needs to be corrected according to the historical deviation coefficient, if so, setting a correction coefficient corresponding to the welding interval threshold, and obtaining a corrected welding interval threshold;
S500, collecting environmental parameters and process parameters in a welding process, analyzing the environmental parameters and the process parameters, and generating a compensation control algorithm based on analysis results, wherein the environmental parameters comprise real-time temperature data and real-time humidity data, and the process parameters comprise welding time, welding temperature and welding pressure;
And S600, performing chip bonding according to the corrected bonding interval threshold value, and controlling the welding process by using an SPC tool and based on a compensation control algorithm.
Further, the determining a solder pitch threshold according to the solder pad state data, the solder requirement data and the component characteristic data includes:
the weld pitch threshold is obtained by:
Wherein D is a soldering pitch threshold, Dp is a pad diameter, Tp is a pad thickness, Cp is a pad surface flatness factor, Tw is a soldering requirement temperature, Pw is a soldering requirement pressure, Tw is a soldering requirement time, Sc is a component size factor, Wc is a component weight factor, K is an empirical coefficient, K includes K1 and K2, K1< K2, D is a first soldering pitch threshold when k=k1, and D is a second soldering pitch threshold when k=k2.
Further, the analyzing the historical welding record, calculating the historical deviation coefficient of the welding distance threshold based on the analysis result, includes:
Determining a welding influence factor corresponding to each abnormal welding behavior, and constructing a welding influence factor sequence;
counting a first number of normal welding behaviors and a second number of abnormal welding behaviors;
Calculating a historical deviation coefficient of the welding interval threshold according to the welding influence factor sequence, the first quantity and the second quantity;
The history deviation coefficient is obtained by the following formula:
Wherein HDC is a history deviation coefficient, Fi is a welding influence factor of the welding influence factor sequence i, ai is the number of i-th abnormal welding behaviors, N is a first number, M is a second number, and λ is a weight coefficient.
Further, the determining the welding impact factor corresponding to each abnormal welding behavior includes:
extracting actual welding time corresponding to abnormal welding behaviors, acquiring preset ideal welding time, and calculating a first welding time difference value according to the actual welding time and the ideal welding time;
analyzing all normal welding behaviors, determining the welding time corresponding to each normal welding behavior, and extracting the minimum welding time;
calculating a second welding time difference value according to the actual welding time and the minimum welding time;
Calculating a welding influence factor corresponding to each abnormal welding behavior based on the first welding time difference value and the second welding time difference value;
the calculation formula of the welding influence factor is as follows:
F=α1×△T1+α2×△T2;
Where F is a welding impact factor, Δt1 is a first welding time difference, Δt2 is a second welding time difference, α1 and α2 are time difference coefficients, and α1+α2=1 is satisfied.
Further, the determining whether the welding distance threshold needs to be corrected according to the historical deviation coefficient includes:
Acquiring a preset historical deviation coefficient, and judging that the welding interval threshold value does not need to be corrected when the historical deviation coefficient is smaller than or equal to the preset historical deviation coefficient;
and when the historical deviation coefficient is larger than the preset historical deviation coefficient, judging that the welding distance threshold value needs to be corrected.
Further, the setting the correction coefficient corresponding to the welding interval threshold value and obtaining the corrected welding interval threshold value includes:
presetting a correction coefficient interval, wherein the correction coefficient interval comprises a first correction coefficient, a second correction coefficient and a third correction coefficient;
calculating a coefficient ratio of the historical deviation coefficient to the preset historical deviation coefficient;
When the coefficient ratio is greater than 1 and less than or equal to 1.2, selecting the first correction coefficient as a correction coefficient corresponding to the welding interval threshold, and taking the product value of the first correction coefficient and the welding interval threshold as a correction welding interval threshold;
When the coefficient ratio is greater than 1.2 and less than or equal to 1.4, selecting the second correction coefficient as a correction coefficient corresponding to the welding interval threshold, and taking the product value of the second correction coefficient and the welding interval threshold as a correction welding interval threshold;
When the coefficient ratio is greater than 1.4, selecting the third correction coefficient as a correction coefficient corresponding to the welding interval threshold, and taking the product value of the third correction coefficient and the welding interval threshold as a correction welding interval threshold;
the corrected welding distance threshold comprises a first corrected welding distance threshold and a second corrected welding distance threshold.
Further, the collecting environmental parameters and process parameters in the welding process, analyzing the environmental parameters and the process parameters, and generating a compensation control algorithm based on the analysis result, including:
Determining a real-time environment standard value, and calculating an environment parameter identification compensation amount according to the environment parameter and the real-time environment standard value, wherein the environment parameter identification compensation amount is obtained by the following formula:
TA=r1×(mn-mr)+r2×(Hn-Hr);
Wherein, TA is the environmental parameter identification compensation amount, mn is the real-time environmental temperature, mr is the environmental temperature standard value, r1 is the temperature compensation coefficient, Hn is the real-time environmental humidity, Hr is the environmental humidity standard value, and r2 is the humidity compensation coefficient;
calculating a welding process parameter identification compensation amount, wherein the welding process parameter identification compensation amount is obtained by the following formula:
TB=g1×9Tn-Tw)+g2×(Pn-Pw);
Wherein, TB is the process parameter identification compensation quantity, Tn is the welding temperature, Tw is the welding required temperature, Pn is the welding pressure, Pw is the welding required pressure, g1 is the welding temperature compensation coefficient, and g2 is the welding pressure compensation coefficient.
Further, the collecting environmental parameters and process parameters in the welding process, analyzing the environmental parameters and the process parameters, generating a compensation control algorithm based on the analysis result, and further comprising:
After correcting the environmental parameter identification compensation quantity and the welding process parameter identification compensation quantity, acquiring real-time pad spacing, comparing the real-time pad spacing with the first corrected welding spacing threshold value and the second corrected welding spacing threshold value, and compensating the real-time pad spacing according to the comparison result;
When the real-time bonding pad spacing is smaller than the first corrected bonding spacing threshold, a first compensation coefficient is selected to compensate the real-time bonding pad spacing;
when the real-time pad pitch is between the first and second modified bond pitch thresholds, not compensating;
And when the real-time bonding pad spacing is larger than the second corrected welding spacing threshold, selecting a second compensation coefficient to compensate the real-time bonding pad spacing.
Further, the performing die bonding according to the corrected bonding pitch threshold, controlling a bonding process using an SPC tool and based on a compensation control algorithm, includes:
Using a sensor to collect the environmental parameters and the process parameters in real time, and inputting data into an SPC tool for analysis;
and setting a control limit, and correcting the environment parameters and the process parameters when the key parameters exceed the control limit, wherein the control limit comprises an upper control limit threshold and a lower control limit threshold of each environment parameter and each process parameter, and the environment parameters and the process parameters are always controlled to be between the upper control limit threshold and the lower control limit threshold.
Compared with the prior art, the chip production space control method has the beneficial effects that the chip production space control method can effectively improve the welding quality in the chip production process and reduce welding defects caused by improper space. In addition, by monitoring and adjusting welding parameters in real time, the method can adapt to the changes of different environments and material conditions, and ensures the stability and reliability of the welding process. Ultimately, this will help to increase overall production efficiency, reduce production costs, and enhance market competitiveness of the product.
On the other hand, the invention also provides a chip production interval control system, which comprises the following steps:
The determining module is configured to determine a pad to be monitored and acquire pad state data of the pad to be monitored;
the interval threshold module is configured to acquire welding requirement data and component characteristic data and determine a welding interval threshold according to the welding pad state data, the welding requirement data and the component characteristic data;
A history deviation coefficient calculation module configured to extract a corresponding history welding record from a history welding record library based on the pad state data and the welding pitch threshold, analyze the history welding record, and calculate a history deviation coefficient of the welding pitch threshold based on an analysis result;
The correction module is configured to judge whether the welding interval threshold needs to be corrected according to the historical deviation coefficient, if so, setting a correction coefficient corresponding to the welding interval threshold, and obtaining a corrected welding interval threshold;
The system comprises an algorithm generation module, a compensation control module and a control module, wherein the algorithm generation module is configured to acquire and analyze environmental parameters and process parameters in a welding process, and generate a compensation control algorithm based on analysis results, wherein the environmental parameters comprise real-time temperature data and real-time humidity data, and the process parameters comprise welding time, welding temperature and welding pressure;
And a control module configured to perform die bonding in accordance with the modified bond pitch threshold, control the bonding process using the SPC tool and based on a compensation control algorithm.
It can be appreciated that the above method and system for controlling the chip production interval have the same beneficial effects, and are not described herein.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flowchart of a chip production pitch control method according to an embodiment of the present invention;
fig. 2 is a block diagram of a chip production pitch control system according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
Referring to fig. 1, in some embodiments of the present application, a method for controlling a chip production pitch is provided, including the following steps:
S100, determining a pad to be monitored, and acquiring pad state data of the pad to be monitored;
In the present embodiment, the pad state data includes a pad diameter, a pad thickness, a pad shape, and a pad surface flatness.
S200, acquiring welding requirement data and component characteristic data, and determining a welding distance threshold according to the welding pad state data, the welding requirement data and the component characteristic data;
In the present embodiment, the soldering requirement data includes soldering requirement temperature, soldering requirement pressure, and soldering requirement time, and the component characteristic data includes component size and component weight.
In this embodiment, the pad pitch threshold includes a first modified bond pitch threshold and a second modified bond pitch threshold. The first modified bond pitch threshold is used to determine if the bond pad pitch is too small and the second modified bond pitch threshold is used to determine if the bond pad pitch is too large. By such arrangement, the pad pitch in the soldering process can be ensured to be kept within an ideal range, thereby improving soldering quality and chip production efficiency.
S300, extracting corresponding historical welding records from a historical welding record library based on the state data of the welding pads and the welding distance threshold value, analyzing the historical welding records, and calculating a historical deviation coefficient of the welding distance threshold value based on an analysis result;
in this embodiment, the history welding record library is a database in which a large amount of history welding data including, but not limited to, key parameters such as pad pitch, welding temperature, welding pressure, etc. under different welding conditions is stored in advance.
S400, judging whether the welding interval threshold is required to be corrected according to the historical deviation coefficient, if so, setting a correction coefficient corresponding to the welding interval threshold, and obtaining a corrected welding interval threshold;
S500, collecting environmental parameters and process parameters in the welding process, analyzing the environmental parameters and the process parameters, and generating a compensation control algorithm based on analysis results, wherein the environmental parameters comprise real-time temperature data and real-time humidity data, and the process parameters comprise welding time, welding temperature and welding pressure;
and S600, performing chip welding according to the corrected welding interval threshold value, and controlling the welding process by using an SPC tool and based on a compensation control algorithm.
In this embodiment SPC (Statistical Process Control) is statistical process control, which is a method for monitoring and controlling the production process to ensure that the product meets quality standards. By monitoring key parameters in real time, the SPC tool can timely find out anomalies in the process, so that measures are taken to adjust, and generation of unqualified products is avoided. In the invention, the SP C tool is combined with the compensation control algorithm, so that the welding process can be controlled more accurately, and the accuracy and consistency of the chip spacing are ensured.
It can be appreciated that the chip production space control method provided by the embodiment can effectively improve the welding quality in the chip production process and reduce the welding defects caused by improper space. In addition, by monitoring and adjusting welding parameters in real time, the method can adapt to the changes of different environments and material conditions, and ensures the stability and reliability of the welding process. Ultimately, this will help to increase overall production efficiency, reduce production costs, and enhance market competitiveness of the product.
Specifically, when determining the solder pitch threshold value based on the pad state data, the solder requirement data, and the component characteristic data, the method includes:
the weld spacing threshold is obtained by:
Wherein D is a soldering pitch threshold, Dp is a pad diameter, Tp is a pad thickness, Cp is a pad surface flatness factor, Tw is a soldering requirement temperature, Pw is a soldering requirement pressure, Tw is a soldering requirement time, Sc is a component size factor, Wc is a component weight factor, K is an empirical coefficient, K includes K1 and K2, K1< K2, D is a first soldering pitch threshold when k=k1, and D is a second soldering pitch threshold when k=k2.
It will be appreciated that the selection of the empirical coefficients K1 and K2 will depend on the particular manufacturing environment and welding process requirements.
Specifically, when analyzing the history welding record and calculating the history deviation coefficient of the welding pitch threshold based on the analysis result, the method includes:
Determining a welding influence factor corresponding to each abnormal welding behavior, and constructing a welding influence factor sequence;
counting a first number of normal welding behaviors and a second number of abnormal welding behaviors;
Calculating a historical deviation coefficient of a welding interval threshold according to the welding influence factor sequence, the first quantity and the second quantity;
The historical deviation coefficient is obtained by:
Wherein HDC is a history deviation coefficient, Fi is a welding influence factor of the welding influence factor sequence i, ai is the number of i-th abnormal welding behaviors, N is a first number, M is a second number, and λ is a weight coefficient.
It will be appreciated that the determination of the weight coefficient lambda is based on an evaluation of the impact on the stability and reliability of the welding process. In practical application, the value of λ may be adjusted according to the production environment and the specific requirements of the welding process, so as to ensure that the historical deviation coefficient HDC can accurately reflect the deviation degree of the welding pitch threshold. In this way, a more accurate correction of the welding pitch threshold can be ensured, thereby improving the welding quality.
Specifically, the determining the welding impact factor corresponding to each abnormal welding behavior includes:
extracting actual welding time corresponding to abnormal welding behaviors, acquiring preset ideal welding time, and calculating a first welding time difference value according to the actual welding time and the ideal welding time;
analyzing all normal welding behaviors, determining the welding time corresponding to each normal welding behavior, and extracting the minimum welding time;
calculating a second welding time difference value according to the actual welding time and the minimum welding time;
Calculating a welding influence factor corresponding to each abnormal welding behavior based on the first welding time difference value and the second welding time difference value;
the calculation formula of the welding influence factor is as follows:
F=α1×△T1+α2×△T2;
Where F is a welding impact factor, Δt1 is a first welding time difference, Δt2 is a second welding time difference, α1 and α2 are time difference coefficients, and α1+α2=1 is satisfied.
It will be appreciated that the selection of the time difference coefficients α1 and α2 will depend on the particular welding process and production environment. In practical application, the values of alpha 1 and alpha 2 can be dynamically adjusted according to real-time feedback in the welding process, so that the welding influence factor can be ensured to accurately reflect the influence degree of abnormal welding behaviors on welding quality. By accurately calculating the welding influence factor, the setting of the welding interval threshold value can be further optimized, so that a higher-quality welding effect is realized in the production process. In addition, by monitoring key parameters in the welding process in real time and combining a compensation control algorithm, welding defects can be effectively reduced, and the overall efficiency and the product quality of chip production are improved.
Specifically, the method for judging whether the welding distance threshold value needs to be corrected according to the historical deviation coefficient comprises the following steps:
Acquiring a preset historical deviation coefficient, and judging that the welding distance threshold value does not need to be corrected when the historical deviation coefficient is smaller than or equal to the preset historical deviation coefficient;
when the historical deviation coefficient is larger than the preset historical deviation coefficient, the welding distance threshold is judged to be needed to be corrected.
It will be appreciated that the setting of the preset historical deviation factor is based on consideration of the long-term stability of the welding process, as well as comprehensive analysis of the historical data. In actual production, the coefficient needs to be set in consideration of factors such as fluctuation of the production environment, variation of material characteristics, and performance of the welding equipment. By setting a reasonable preset history deviation coefficient, the welding interval threshold value can be adjusted neither too frequently nor to be delayed from the actual production requirement, so that the welding quality is ensured, and meanwhile, the production efficiency is improved and the cost is reduced. In addition, through real-time monitoring and analyzing key parameters in the welding process and combining a compensation control algorithm, dynamic adjustment of a welding distance threshold value can be realized, and the accuracy and reliability of chip welding are further improved.
Specifically, when setting a correction coefficient corresponding to the welding pitch threshold and obtaining the corrected welding pitch threshold, the method includes:
presetting a correction coefficient interval, wherein the correction coefficient interval comprises a first correction coefficient, a second correction coefficient and a third correction coefficient;
Calculating a coefficient ratio of the historical deviation coefficient to a preset historical deviation coefficient;
When the coefficient ratio is greater than 1 and less than or equal to 1.2, selecting the first correction coefficient as a correction coefficient corresponding to the welding interval threshold, and taking the product value of the first correction coefficient and the welding interval threshold as a correction welding interval threshold;
when the coefficient ratio is greater than 1.2 and less than or equal to 1.4, selecting the second correction coefficient as the correction coefficient corresponding to the welding interval threshold, and taking the product value of the second correction coefficient and the welding interval threshold as the correction welding interval threshold;
when the coefficient ratio is greater than 1.4, selecting a third correction coefficient as a correction coefficient corresponding to the welding interval threshold, and taking the product value of the third correction coefficient and the welding interval threshold as a correction welding interval threshold;
Wherein the corrected weld spacing threshold includes a first corrected weld spacing threshold and a second corrected weld spacing threshold.
It will be appreciated that the correction factor is selected based on a deep understanding of the impact on weld quality and the need for optimization of production efficiency. In practical application, the values of the first correction coefficient, the second correction coefficient and the third correction coefficient can be dynamically adjusted according to real-time data in the welding process, and the first correction coefficient is the second correction coefficient. The arrangement ensures that the adjustment of the welding interval threshold value can be flexibly handled according to the deviation degree in the actual welding process, so that the welding quality is not influenced by over correction, and the deviation in the welding process cannot be corrected in time due to insufficient correction. In this way, it is ensured that the correction of the welding pitch threshold value meets the actual production requirements without negatively affecting the welding quality. In addition, by monitoring key parameters in the welding process in real time and combining a compensation control algorithm, welding defects can be effectively reduced, and the overall efficiency and the product quality of chip production are improved.
Specifically, the method includes the steps of collecting environmental parameters and process parameters in a welding process, analyzing the environmental parameters and the process parameters, and generating a compensation control algorithm based on analysis results, wherein the method comprises the following steps:
Determining a real-time environment standard value, and calculating an environment parameter identification compensation amount according to the environment parameter and the real-time environment standard value, wherein the environment parameter identification compensation amount is obtained by the following formula:
TA=r1×(mn-mr)+r2×(Hn-Hr);
Wherein, TA is the environmental parameter identification compensation amount, mn is the real-time environmental temperature, mr is the environmental temperature standard value, r1 is the temperature compensation coefficient, Hn is the real-time environmental humidity, Hr is the environmental humidity standard value, and r2 is the humidity compensation coefficient;
calculating a welding process parameter identification compensation amount, wherein the welding process parameter identification compensation amount is obtained by the following formula:
TB=g1×(Tn-Tw)+g2×9Pn-Pw);
Wherein, TB is the process parameter identification compensation quantity, Tn is the welding temperature, Tw is the welding required temperature, Pn is the welding pressure, Pw is the welding required pressure, g1 is the welding temperature compensation coefficient, and g2 is the welding pressure compensation coefficient.
It will be appreciated that by accurately calculating the amount of compensation for the environmental and process parameters, the welding process can be effectively adjusted to accommodate environmental changes and ensure weld quality. The setting of the temperature and humidity compensation coefficients, as well as the compensation coefficients for the welding temperature and pressure, are based on a thorough understanding of the welding process and on stringent requirements for the welding quality. In actual production, these compensation coefficients need to be dynamically adjusted according to the environment and process parameters monitored in real time to ensure the stability of the welding process and consistency of the welding results. By the method, the accuracy and the reliability of chip welding can be further improved, and welding defects caused by environmental changes or improper operation are reduced, so that the overall production efficiency and the product quality are improved.
Specifically, the method includes the steps of collecting environmental parameters and process parameters in the welding process, analyzing the environmental parameters and the process parameters, and generating a compensation control algorithm based on an analysis result, wherein the method further comprises the following steps:
After the environmental parameter identification compensation quantity and the welding process parameter identification compensation quantity are corrected, acquiring real-time pad spacing, comparing the real-time pad spacing with a first corrected welding spacing threshold value and a second corrected welding spacing threshold value, and compensating the real-time pad spacing according to the comparison result;
when the real-time bonding pad spacing is smaller than a first corrected welding spacing threshold, selecting a first compensation coefficient to compensate the real-time bonding pad spacing;
when the real-time pad spacing is between the first corrected solder spacing threshold and the second corrected solder spacing threshold, not compensating;
and when the real-time pad spacing is larger than a second corrected welding spacing threshold, selecting a second compensation coefficient to compensate the real-time pad spacing.
It can be appreciated that by compensating the pitch of the pads in real time, the pitch in the soldering process can be ensured to be always kept within an ideal range, thereby avoiding soldering defects caused by too large or too small pitch. The first compensation coefficient and the second compensation coefficient are selected based on in-depth analysis of the impact on welding quality and optimization requirements on production efficiency. In practical application, the two compensation coefficients can be dynamically adjusted according to the real-time monitored pad spacing data so as to adapt to different production conditions and material characteristics. By the mode, welding defects can be effectively reduced, and the overall efficiency and the product quality of chip production are improved. In addition, through the key parameters in the real-time monitoring welding process and the combination of the compensation control algorithm, the accuracy and the reliability of the chip welding can be further improved, the welding quality is ensured, and meanwhile, the production efficiency is improved and the cost is reduced.
Specifically, performing die bonding according to the corrected bonding pitch threshold, controlling the bonding process using the SPC tool and based on the compensation control algorithm includes:
using a sensor to collect environmental parameters and process parameters in real time, and inputting data into an SPC tool for analysis;
and setting a control limit, and correcting the environmental parameters and the process parameters when the key parameters exceed the control limit, wherein the control limit comprises an upper control limit threshold and a lower control limit threshold of each environmental parameter and each process parameter, and the environmental parameters and the process parameters are always controlled to be between the upper control limit threshold and the lower control limit threshold.
It will be appreciated that the use of SPC tools enables real-time monitoring of key parameters during the welding process, ensuring weld quality stability. The control limits are set to prevent parameter fluctuations during the welding process from exceeding acceptable limits, thereby avoiding producing unacceptable welding results. The upper and lower limit thresholds are set based on in-depth study and historical data analysis of the welding process to ensure that each link of the welding process operates in an optimal state. When the parameters are detected to exceed the control limits, the system automatically adjusts the environmental parameters and the process parameters to quickly restore to the normal working state. The real-time monitoring and automatic adjusting mechanism not only improves the reliability of the welding process, but also reduces the need of manual intervention, and further improves the production efficiency and the product quality.
Referring to fig. 2, in some embodiments of the present application, a chip production pitch control system is provided, including:
The determining module is configured to determine a pad to be monitored and acquire pad state data of the pad to be monitored;
The interval threshold module is configured to acquire welding requirement data and component characteristic data and determine a welding interval threshold according to the welding pad state data, the welding requirement data and the component characteristic data;
A history deviation coefficient calculation module configured to extract a corresponding history welding record from a history welding record library based on the pad state data and the welding pitch threshold, analyze the history welding record, and calculate a history deviation coefficient of the welding pitch threshold based on an analysis result;
The correction module is configured to judge whether the welding interval threshold needs to be corrected according to the historical deviation coefficient, if so, setting a correction coefficient corresponding to the welding interval threshold, and obtaining a corrected welding interval threshold;
The system comprises an algorithm generation module, a compensation control module and a control module, wherein the algorithm generation module is configured to acquire and analyze environmental parameters and process parameters in the welding process, and generate a compensation control algorithm based on analysis results, wherein the environmental parameters comprise real-time temperature data and real-time humidity data, and the process parameters comprise welding time, welding temperature and welding pressure;
a control module configured to perform die bonding in accordance with the corrected bond pitch threshold, the use of the SPC tool and control the bonding process based on the compensation control algorithm.
It can be appreciated that the chip production space control system provided by the embodiment can effectively adapt to various production environments, and ensures the stability of the welding process and the consistency of the welding quality. Through real-time monitoring and dynamic adjustment, welding defects caused by environmental changes or improper operation can be obviously reduced, so that the overall production efficiency and the product quality are improved. In addition, the method can monitor key parameters in the welding process in real time through the use of SPC tools, and ensure the stability of welding quality. The control limits are set to prevent parameter fluctuations during the welding process from exceeding acceptable limits, thereby avoiding producing unacceptable welding results. The upper and lower limit thresholds are set based on in-depth study and historical data analysis of the welding process to ensure that each link of the welding process operates in an optimal state. When the parameters are detected to exceed the control limits, the system automatically adjusts the environmental parameters and the process parameters to quickly restore to the normal working state. The real-time monitoring and automatic adjusting mechanism not only improves the reliability of the welding process, but also reduces the need of manual intervention, and further improves the production efficiency and the product quality.
It will be appreciated by those skilled in the art that embodiments of the application may be provided as methods, systems, or computer program products. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flowchart and/or block of the flowchart illustrations and/or block diagrams, and combinations of flowcharts and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the specific embodiments of the present invention without departing from the spirit and scope of the present invention, and any modifications and equivalents are intended to be included in the scope of the claims of the present invention.

Claims (9)

Translated fromChinese
1.一种芯片生产间距控制方法,其特征在于,包括:1. A chip production spacing control method, characterized by comprising:确定待监测焊盘,获取所述待监测焊盘的焊盘状态数据;Determine a pad to be monitored, and obtain pad status data of the pad to be monitored;获取焊接要求数据和元器件特性数据,并根据所述焊盘状态数据、焊接要求数据和元器件特性数据确定焊接间距阈值;Acquire welding requirement data and component characteristic data, and determine a welding spacing threshold value according to the pad status data, welding requirement data and component characteristic data;根据所述焊盘状态数据、焊接要求数据和元器件特性数据确定焊接间距阈值时,包括:When determining the welding spacing threshold according to the pad status data, welding requirement data and component characteristic data, it includes:所述焊接间距阈值通过下式获得:The welding spacing threshold is obtained by the following formula: ;其中,是焊接间距阈值,是焊盘直径,是焊盘厚度,是焊盘表面平整度因子,是焊接要求温度,是焊接要求压力,是焊接要求时间,是元器件尺寸因子,是元器件重量因子,K是经验系数,K包括K1和K2,K1<K2,当K=K1时,是第一焊接间距阈值,当K=K2时,是第二焊接间距阈值;in, is the weld spacing threshold, is the pad diameter, is the pad thickness, is the pad surface flatness factor, is the welding temperature required, is the welding pressure requirement, Is the welding time required, is the component size factor, is the component weight factor, K is the empirical coefficient, K includes K1 and K2, K1<K2, when K=K1, is the first welding spacing threshold, when K=K2, is the second welding spacing threshold;基于所述焊盘状态数据和所述焊接间距阈值从历史焊接记录库中提取对应的历史焊接记录,并对所述历史焊接记录进行分析,基于分析结果计算所述焊接间距阈值的历史偏离系数;Extracting corresponding historical welding records from a historical welding record library based on the pad status data and the welding spacing threshold, analyzing the historical welding records, and calculating a historical deviation coefficient of the welding spacing threshold based on the analysis result;根据所述历史偏离系数判断是否需要对所述焊接间距阈值进行修正,若是,则设定所述焊接间距阈值对应的修正系数,并得到修正焊接间距阈值;Determining whether the welding spacing threshold needs to be corrected according to the historical deviation coefficient, and if so, setting a correction coefficient corresponding to the welding spacing threshold to obtain a corrected welding spacing threshold;采集焊接过程中的环境参数和过程参数,并对所述环境参数和过程参数进行解析,基于解析结果,生成补偿控制算法;其中,所述环境参数包括实时温度数据和实时湿度数据,所述过程参数包括焊接时间、焊接温度和焊接压力;Collecting environmental parameters and process parameters during the welding process, analyzing the environmental parameters and process parameters, and generating a compensation control algorithm based on the analysis results; wherein the environmental parameters include real-time temperature data and real-time humidity data, and the process parameters include welding time, welding temperature and welding pressure;根据所述修正焊接间距阈值进行芯片焊接,使用SPC工具并基于补偿控制算法对焊接过程进行控制。Chip bonding is performed according to the modified bonding pitch threshold, and the bonding process is controlled using an SPC tool based on a compensation control algorithm.2.根据权利要求1所述的芯片生产间距控制方法,其特征在于,对所述历史焊接记录进行分析,基于分析结果计算所述焊接间距阈值的历史偏离系数时,包括:2. The chip production spacing control method according to claim 1, characterized in that the historical welding records are analyzed, and the historical deviation coefficient of the welding spacing threshold is calculated based on the analysis results, comprising:确定每一个异常焊接行为对应的焊接影响因子,并构建焊接影响因子序列;Determine the welding influencing factors corresponding to each abnormal welding behavior and construct a welding influencing factor sequence;统计正常焊接行为的第一数量和所述异常焊接行为的第二数量;Counting a first number of normal welding behaviors and a second number of abnormal welding behaviors;根据所述焊接影响因子序列、第一数量和第二数量计算所述焊接间距阈值的历史偏离系数;Calculate the historical deviation coefficient of the welding spacing threshold value according to the welding influencing factor sequence, the first quantity and the second quantity;所述历史偏离系数通过下式获得:The historical deviation coefficient is obtained by the following formula: ;其中,是历史偏离系数,是焊接影响因子序列第i个焊接影响因子,是第i个异常焊接行为的数量,是第一数量,是第二数量,是权重系数。in, is the historical deviation coefficient, is the ith welding influence factor in the welding influence factor sequence, is the number of abnormal welding behaviors of the ith type, is the first quantity, is the second quantity, is the weight coefficient.3.根据权利要求2所述的芯片生产间距控制方法,其特征在于,确定每一个异常焊接行为对应的焊接影响因子时,包括:3. The chip production spacing control method according to claim 2, characterized in that when determining the welding influence factor corresponding to each abnormal welding behavior, it includes:提取与异常焊接行为对应的实际焊接时间,获取预先设定的理想焊接时间,根据实际焊接时间和理想焊接时间计算第一焊接时间差值;Extracting the actual welding time corresponding to the abnormal welding behavior, obtaining a preset ideal welding time, and calculating a first welding time difference according to the actual welding time and the ideal welding time;对所有正常焊接行为进行分析,确定每一个正常焊接行为对应的焊接时间,并提取最小焊接时间;Analyze all normal welding behaviors, determine the welding time corresponding to each normal welding behavior, and extract the minimum welding time;根据实际焊接时间和最小焊接时间计算第二焊接时间差值;Calculate a second welding time difference according to the actual welding time and the minimum welding time;基于所述第一焊接时间差值和所述第二焊接时间差值计算每一个异常焊接行为对应的焊接影响因子;Calculating a welding influence factor corresponding to each abnormal welding behavior based on the first welding time difference and the second welding time difference;所述焊接影响因子的计算公式为:The calculation formula of the welding influence factor is: ;其中,是焊接影响因子,是第一焊接时间差值,是第二焊接时间差值,是时间差值系数,且满足α1+α2=1。in, is the welding influencing factor, is the first welding time difference, is the second welding time difference, and is the time difference coefficient and satisfies α1+α2=1.4.根据权利要求3所述的芯片生产间距控制方法,其特征在于,根据所述历史偏离系数判断是否需要对所述焊接间距阈值进行修正时,包括:4. The chip production spacing control method according to claim 3, characterized in that when judging whether the welding spacing threshold needs to be corrected according to the historical deviation coefficient, it includes:获取预设历史偏离系数,当所述历史偏离系数小于或等于所述预设历史偏离系数时,则判断不需要对所述焊接间距阈值进行修正;Obtaining a preset historical deviation coefficient, and when the historical deviation coefficient is less than or equal to the preset historical deviation coefficient, determining that the welding spacing threshold does not need to be corrected;当所述历史偏离系数大于所述预设历史偏离系数时,则判断需要对所述焊接间距阈值进行修正。When the historical deviation coefficient is greater than the preset historical deviation coefficient, it is determined that the welding spacing threshold needs to be corrected.5.根据权利要求4所述的芯片生产间距控制方法,其特征在于,设定所述焊接间距阈值对应的修正系数,并得到修正焊接间距阈值时,包括:5. The chip production spacing control method according to claim 4, characterized in that when setting the correction coefficient corresponding to the welding spacing threshold and obtaining the corrected welding spacing threshold, it includes:预先设定修正系数区间,其中,所述修正系数区间包括第一修正系数、第二修正系数和第三修正系数;Presetting a correction coefficient interval, wherein the correction coefficient interval includes a first correction coefficient, a second correction coefficient and a third correction coefficient;计算所述历史偏离系数和所述预设历史偏离系数的系数比值;Calculating a coefficient ratio of the historical deviation coefficient and the preset historical deviation coefficient;当所述系数比值大于1,且小于或等于1.2时,则选定所述第一修正系数作为所述焊接间距阈值对应的修正系数,并将所述第一修正系数和所述焊接间距阈值的乘积值作为修正焊接间距阈值;When the coefficient ratio is greater than 1 and less than or equal to 1.2, the first correction coefficient is selected as the correction coefficient corresponding to the welding spacing threshold, and the product value of the first correction coefficient and the welding spacing threshold is used as the corrected welding spacing threshold;当所述系数比值大于1.2,且小于或等于1.4时,则选定所述第二修正系数作为所述焊接间距阈值对应的修正系数,并将所述第二修正系数和所述焊接间距阈值的乘积值作为修正焊接间距阈值;When the coefficient ratio is greater than 1.2 and less than or equal to 1.4, the second correction coefficient is selected as the correction coefficient corresponding to the welding spacing threshold, and the product value of the second correction coefficient and the welding spacing threshold is used as the corrected welding spacing threshold;当所述系数比值大于1.4时,则选定所述第三修正系数作为所述焊接间距阈值对应的修正系数,并将所述第三修正系数和所述焊接间距阈值的乘积值作为修正焊接间距阈值;When the coefficient ratio is greater than 1.4, the third correction coefficient is selected as the correction coefficient corresponding to the welding spacing threshold, and the product value of the third correction coefficient and the welding spacing threshold is used as the corrected welding spacing threshold;其中,所述修正焊接间距阈值包括第一修正焊接间距阈值和第二修正焊接间距阈值。The corrected welding spacing threshold includes a first corrected welding spacing threshold and a second corrected welding spacing threshold.6.根据权利要求5所述的芯片生产间距控制方法,其特征在于,采集焊接过程中的环境参数和过程参数,并对所述环境参数和过程参数进行解析,基于解析结果,生成补偿控制算法时,包括:6. The chip production spacing control method according to claim 5 is characterized in that the environmental parameters and process parameters in the welding process are collected, and the environmental parameters and process parameters are analyzed, and the compensation control algorithm is generated based on the analysis results, including:确定实时环境标准值,并根据所述环境参数和实时环境标准值计算环境参数识别补偿量,所述环境参数识别补偿量通过下式获得:Determine the real-time environmental standard value, and calculate the environmental parameter identification compensation amount according to the environmental parameter and the real-time environmental standard value, wherein the environmental parameter identification compensation amount is obtained by the following formula: ;其中,是环境参数识别补偿量,是实时环境温度,是环境温度标准值,是温度补偿系数,是实时环境湿度,是环境湿度标准值,是湿度补偿系数;in, is the compensation amount for environmental parameter identification, is the real-time ambient temperature, is the standard value of ambient temperature, is the temperature compensation coefficient, is the real-time ambient humidity, is the standard value of ambient humidity, is the humidity compensation coefficient;计算焊接过程参数识别补偿量,所述焊接过程参数识别补偿量通过下式获得:Calculate the welding process parameter identification compensation amount, which is obtained by the following formula: ;其中,是过程参数识别补偿量,为焊接温度,是焊接要求温度,是焊接压力,是焊接要求压力,为焊接温度补偿系数,为焊接压力补偿系数。in, is the process parameter identification compensation, is the welding temperature, is the welding temperature required, is the welding pressure, is the welding pressure requirement, is the welding temperature compensation coefficient, is the welding pressure compensation coefficient.7.根据权利要求6所述的芯片生产间距控制方法,其特征在于,采集焊接过程中的环境参数和过程参数,并对所述环境参数和过程参数进行解析,基于解析结果,生成补偿控制算法时,还包括:7. The chip production spacing control method according to claim 6 is characterized in that the environmental parameters and process parameters in the welding process are collected, and the environmental parameters and process parameters are analyzed, and the compensation control algorithm is generated based on the analysis results, and further includes:当对环境参数识别补偿量和焊接过程参数识别补偿量进行修正后,采集实时焊盘间距,将所述实时焊盘间距与所述第一修正焊接间距阈值和第二修正焊接间距阈值进行比对,根据比对结果对所述实时焊盘间距进行补偿;After the environmental parameter identification compensation amount and the welding process parameter identification compensation amount are corrected, the real-time pad spacing is collected, the real-time pad spacing is compared with the first corrected welding spacing threshold and the second corrected welding spacing threshold, and the real-time pad spacing is compensated according to the comparison result;当所述实时焊盘间距小于所述第一修正焊接间距阈值时,选取第一补偿系数对所述实时焊盘间距进行补偿;When the real-time pad spacing is less than the first corrected welding spacing threshold, selecting a first compensation coefficient to compensate the real-time pad spacing;当所述实时焊盘间距在所述第一修正焊接间距阈值和第二修正焊接间距阈值之间时,不进行补偿;When the real-time pad spacing is between the first corrected welding spacing threshold and the second corrected welding spacing threshold, no compensation is performed;当所述实时焊盘间距大于所述第二修正焊接间距阈值时,选取第二补偿系数对所述实时焊盘间距进行补偿。When the real-time pad spacing is greater than the second corrected pad spacing threshold, a second compensation coefficient is selected to compensate for the real-time pad spacing.8.根据权利要求7所述的芯片生产间距控制方法,其特征在于,根据所述修正焊接间距阈值进行芯片焊接,使用SPC工具并基于补偿控制算法对焊接过程进行控制时,包括:8. The chip production spacing control method according to claim 7 is characterized in that when performing chip welding according to the modified welding spacing threshold, using an SPC tool and controlling the welding process based on a compensation control algorithm, it includes:使用传感器,实时采集所述环境参数和过程参数,将数据输入SPC工具进行分析;Using sensors to collect the environmental parameters and process parameters in real time, and inputting the data into the SPC tool for analysis;并设置控制限,当关键参数超出控制限时,修正所述环境参数和过程参数,所述控制限包括每一所述环境参数和过程参数的上控限制阈值和下控限制阈值,始终控制所述环境参数和过程参数处于所述上控限制阈值和下控限制阈之间。And set control limits. When the key parameters exceed the control limits, correct the environmental parameters and process parameters. The control limits include the upper control limit threshold and the lower control limit threshold of each of the environmental parameters and process parameters. Always control the environmental parameters and process parameters to be between the upper control limit threshold and the lower control limit threshold.9.一种芯片生产间距控制系统,应用于如权利要求1-8任一项所述的芯片生产间距控制方法中,其特征在于,包括:9. A chip production spacing control system, applied to the chip production spacing control method according to any one of claims 1 to 8, characterized in that it comprises:确定模块,被配置为确定待监测焊盘,获取所述待监测焊盘的焊盘状态数据;A determination module is configured to determine a pad to be monitored and obtain pad status data of the pad to be monitored;间距阈值模块,被配置为获取焊接要求数据和元器件特性数据,并根据所述焊盘状态数据、焊接要求数据和元器件特性数据确定焊接间距阈值;A spacing threshold module is configured to obtain welding requirement data and component characteristic data, and determine a welding spacing threshold according to the pad state data, welding requirement data and component characteristic data;根据所述焊盘状态数据、焊接要求数据和元器件特性数据确定焊接间距阈值时,包括:When determining the welding spacing threshold according to the pad status data, welding requirement data and component characteristic data, it includes:所述焊接间距阈值通过下式获得:The welding spacing threshold is obtained by the following formula: ;其中,是焊接间距阈值,是焊盘直径,是焊盘厚度,是焊盘表面平整度因子,是焊接要求温度,是焊接要求压力,是焊接要求时间,是元器件尺寸因子,是元器件重量因子,K是经验系数,K包括K1和K2,K1<K2,当K=K1时,是第一焊接间距阈值,当K=K2时,是第二焊接间距阈值;in, is the weld spacing threshold, is the pad diameter, is the pad thickness, is the pad surface flatness factor, is the welding temperature required, is the welding pressure requirement, Is the welding time required, is the component size factor, is the component weight factor, K is the empirical coefficient, K includes K1 and K2, K1<K2, when K=K1, is the first welding spacing threshold. When K=K2, is the second welding spacing threshold;历史偏离系数计算模块,被配置为基于所述焊盘状态数据和所述焊接间距阈值从历史焊接记录库中提取对应的历史焊接记录,并对所述历史焊接记录进行分析,基于分析结果计算所述焊接间距阈值的历史偏离系数;A historical deviation coefficient calculation module is configured to extract corresponding historical welding records from a historical welding record library based on the pad status data and the welding spacing threshold, analyze the historical welding records, and calculate the historical deviation coefficient of the welding spacing threshold based on the analysis result;修正模块,被配置为根据所述历史偏离系数判断是否需要对所述焊接间距阈值进行修正,若是,则设定所述焊接间距阈值对应的修正系数,并得到修正焊接间距阈值;a correction module, configured to determine whether the welding spacing threshold needs to be corrected according to the historical deviation coefficient, and if so, set a correction coefficient corresponding to the welding spacing threshold to obtain a corrected welding spacing threshold;算法生成模块,被配置为采集焊接过程中的环境参数和过程参数,并对所述环境参数和过程参数进行解析,基于解析结果,生成补偿控制算法;其中,所述环境参数包括实时温度数据和实时湿度数据,所述过程参数包括焊接时间、焊接温度和焊接压力;An algorithm generation module is configured to collect environmental parameters and process parameters during the welding process, analyze the environmental parameters and process parameters, and generate a compensation control algorithm based on the analysis results; wherein the environmental parameters include real-time temperature data and real-time humidity data, and the process parameters include welding time, welding temperature and welding pressure;控制模块,被配置为根据所述修正焊接间距阈值进行芯片焊接,使用SPC工具并基于补偿控制算法对焊接过程进行控制。The control module is configured to perform chip bonding according to the modified bonding pitch threshold, and control the bonding process using an SPC tool and based on a compensation control algorithm.
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