Detailed Description
The technical scheme provided by the application is clearly and completely described below with reference to the accompanying drawings. It should be apparent that the described embodiments of the application are only some embodiments, but not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive effort, based on the embodiments described herein, fall within the scope of the application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art will appreciate explicitly and implicitly that the described embodiments of the application may be combined with other embodiments.
The terms first, second and the like in the description and in the claims, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, an assembly or device incorporating one or more components is not limited to the listed one or more components, but may alternatively include one or more components not listed but inherent to the illustrated product, or one or more components that may be present based on the illustrated functionality.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a coated glass 100 according to an embodiment of the application. Coated glass 100 includes a first glass sheet 10 and a thermally insulating functional layer 20.
The thickness of the first glass plate 10 is not particularly limited in the present application. For example, the thickness of the first glass plate 10 may be 0.7mm to 4.0mm. The shape of the first glass plate 10 is not particularly limited in the present application. For example, the first glass sheet 10 may be a planar glass sheet, or the first glass sheet 10 may be a curved glass sheet having opposite convex and concave surfaces, and the insulating functional layer 20 may be disposed on the convex surface or on the concave surface.
A thermally insulating functional layer 20 is provided on at least one surface of the first glass sheet 10. In one possible embodiment, the insulating-function layer 20 can be deposited directly on at least one surface of the first glass sheet 10. In another possible embodiment, the insulating functional layer 20 may be deposited on another substrate, such as a plastic substrate or a resin substrate, which is laminated with the first glass sheet 10 such that the insulating functional layer 20 is disposed on at least one surface of the first glass sheet 10. The insulating functional layer 20 includes n metal reflective layers and (n+1) dielectric stacks. Wherein n is an integer greater than or equal to 1.
The metal reflecting layer may be made of at least one element selected from silver (Ag), gold (Au), copper (Cu), aluminum (Al), and platinum (Pt), and is used for reflecting infrared rays in sunlight, reducing the infrared rays from entering the interior of the vehicle, and thus improving the heat insulation effect of the coated glass 100. In the present application, the material of the metal reflective layer is preferably silver metal or silver alloy, and the silver alloy is preferably an alloy of silver and at least one of gold, aluminum, copper, indium (In), tin (Sn), titanium (Ti), zinc (Zn), and platinum In the present application.
In one possible embodiment, as shown in FIG. 2, the insulating functional layer 20 may include at least two metal reflective layers and at least three dielectric stacks. Figure 2 shows in particular that the insulating-functional layer 20 comprises two metallic reflective layers and three dielectric stacks. Among them, the two metal reflection layers are described as a first metal reflection layer 201 and a second metal reflection layer 202, respectively, in the following embodiments. The three dielectric stacks are described in the following embodiments as a first dielectric stack 209, a second dielectric stack 208 and a third dielectric stack 207, respectively. In this embodiment, the first dielectric stack 209, the first metal reflective layer 201, the second dielectric stack 208, the second metal reflective layer 202, and the third dielectric stack 207 are sequentially stacked on one of the surfaces of the first glass plate 10, the first dielectric stack 209 is disposed on the surface of the first glass plate 10 in direct contact, the first dielectric stack 209 is the dielectric stack closest to the first glass plate 10 in the insulating functional layer 20, the first metal reflective layer 201 is closer to the first glass plate 10 than the second metal reflective layer 202, and the third dielectric stack 207 is the dielectric stack furthest from the first glass plate 10 in the insulating functional layer 20.
In another possible embodiment, as shown in FIG. 3, the insulating functional layer 20 may comprise at least three metal reflective layers and at least four dielectric stacks. Figure 3 shows in particular that the insulating-functional layer 20 comprises three metallic reflective layers and four dielectric stacks. Among them, three metal reflective layers are described as a first metal reflective layer 201, a second metal reflective layer 202, and a third metal reflective layer 203, respectively, in the following embodiments. The four dielectric stacks are described in the following embodiments as a first dielectric stack 209, a second dielectric stack 208, a third dielectric stack 207 and a fourth dielectric stack 206, respectively. In this embodiment, the first dielectric stack 209, the first metal reflective layer 201, the second dielectric stack 208, the second metal reflective layer 202, the third dielectric stack 207, the third metal reflective layer 203, and the fourth dielectric stack 206 are sequentially stacked on one of the surfaces of the first glass plate 10, the first dielectric stack 209 is disposed on the surface of the first glass plate 10 in direct contact, the first dielectric stack 209 is the dielectric stack closest to the first glass plate 10 in the insulating functional layer 20, the first metal reflective layer 201 is the metal reflective layer closest to the first glass plate 10 in the insulating functional layer 20, the third metal reflective layer 203 is the metal reflective layer furthest from the first glass plate 10 in the insulating functional layer 20, and the fourth dielectric stack 206 is the dielectric stack furthest from the first glass plate 10 in the insulating functional layer 20.
In a third possible embodiment, as shown in fig. 4, the insulating functional layer 20 may comprise at least four metal reflective layers and at least five dielectric stacks. Figure 4 shows in particular that the insulating-functional layer 20 comprises four metallic reflective layers and five dielectric stacks. Among them, four metal reflective layers are described as a first metal reflective layer 201, a second metal reflective layer 202, a third metal reflective layer 203, and a fourth metal reflective layer 204, respectively, in the following embodiments. The five dielectric stacks are described in the following embodiments as a first dielectric stack 209, a second dielectric stack 208, a third dielectric stack 207, a fourth dielectric stack 206 and a fifth dielectric stack 205, respectively. In this embodiment, the first dielectric stack 209, the first metal reflective layer 201, the second dielectric stack 208, the second metal reflective layer 202, the third dielectric stack 207, the third metal reflective layer 203, the fourth dielectric stack 206, the fourth metal reflective layer 204, and the fifth dielectric stack 205 are sequentially stacked on one of the surfaces of the first glass plate 10, the first dielectric stack 209 is disposed on the surface of the first glass plate 10 in direct contact, the first dielectric stack 209 is the dielectric stack closest to the first glass plate 10 in the insulating functional layer 20, the first metal reflective layer 201 is the metal reflective layer closest to the first glass plate 10 in the insulating functional layer 20, the fourth metal reflective layer 204 is the metal reflective layer furthest from the first glass plate 10 in the insulating functional layer 20, and the fifth dielectric stack 205 is the dielectric stack furthest from the first glass plate 10 in the insulating functional layer 20.
Of course, in other possible embodiments, the insulating functional layer 20 may also comprise one metal reflective layer and two dielectric stacks.
Each of the metallic reflective layers is located between two adjacent ones of the dielectric stacks. It will be appreciated that in the embodiments shown in fig. 2, 3 and 4, the first metal reflective layer 201 is located between the first dielectric stack 209 and the second dielectric stack 208, and the second metal reflective layer 202 is located between the second dielectric stack 208 and the third dielectric stack 207. In the embodiment shown in fig. 3 and 4, the third metal reflective layer 203 is located between the third dielectric stack 207 and the fourth dielectric stack 206. In the embodiment shown in fig. 4, a fourth metal reflective layer is located between the fourth dielectric stack 206 and the fifth dielectric stack 205. The application is beneficial to preventing the metal reflecting layer from directly contacting the first glass plate 10 and the external air by enabling the metal reflecting layer to be positioned between two adjacent medium laminated layers, the medium laminated layers can protect the metal reflecting layer in the heat treatment processing and actual use processes, the alkali metal inside the first glass plate 10 can be prevented from diffusing to the metal reflecting layer, and the metal reflecting layer can be prevented from being oxidized, so that the mechanical property, the thermal stability and the chemical stability of the heat insulation functional layer 20 can be ensured, and the optical property and the appearance quality of the heat insulation functional layer 20 can be improved.
At least one of the dielectric stacks includes at least one silicon-based absorber layer. In one possible embodiment, among the plurality of dielectric stacks included in the insulating functional layer 20, a portion of the dielectric stacks may include at least one silicon-based absorber layer and another portion of the dielectric stacks may not include a silicon-based absorber layer. In another possible embodiment, each dielectric stack may include at least one silicon-based absorber layer among the plurality of dielectric stacks included in the insulating functional layer 20. In the following embodiments, each dielectric stack includes at least one silicon-based absorber layer.
Specifically, as shown in fig. 2, the first dielectric stack 209 includes at least one silicon-based absorber layer, the second dielectric stack 208 includes at least one silicon-based absorber layer, and the third dielectric stack 207 includes at least one silicon-based absorber layer. In this embodiment, the number of silicon-based absorption layers included in the second dielectric stack 208 may be greater than the number of silicon-based absorption layers included in the first dielectric stack 209, and the number of silicon-based absorption layers included in the first dielectric stack 209 may be the same as the number of silicon-based absorption layers included in the third dielectric stack 207. Optionally, the first dielectric stack 209 includes a silicon-based absorber layer, in this embodiment depicted as a first silicon-based absorber layer 290, the second dielectric stack 208 includes two silicon-based absorber layers, in this embodiment depicted as a second silicon-based absorber layer 280 and a third silicon-based absorber layer 281, respectively, and the third dielectric stack 207 includes a silicon-based absorber layer, in this embodiment depicted as a fourth silicon-based absorber layer 270.
As shown in fig. 3, the first dielectric stack 209 comprises at least one silicon-based absorber layer, the second dielectric stack 208 comprises at least one silicon-based absorber layer, the third dielectric stack 207 comprises at least one silicon-based absorber layer, and the fourth dielectric stack 206 comprises at least one silicon-based absorber layer. In this embodiment, the number of silicon-based absorption layers included in the second dielectric stack 208 may be greater than the number of silicon-based absorption layers included in the first dielectric stack 209, the number of silicon-based absorption layers included in the third dielectric stack 207 may be greater than the number of silicon-based absorption layers included in the fourth dielectric stack 206, the number of silicon-based absorption layers included in the first dielectric stack 209 may be the same as the number of silicon-based absorption layers included in the fourth dielectric stack 206, and the number of silicon-based absorption layers included in the second dielectric stack 208 may be the same as the number of silicon-based absorption layers included in the third dielectric stack 207. Optionally, the first dielectric stack 209 includes a silicon-based absorber layer, in this embodiment depicted as a first silicon-based absorber layer 290, the second dielectric stack 208 includes two silicon-based absorber layers, in this embodiment depicted as a second silicon-based absorber layer 280 and a third silicon-based absorber layer 281, respectively, the third dielectric stack 207 includes two silicon-based absorber layers, in this embodiment depicted as a fourth silicon-based absorber layer 270 and a fifth silicon-based absorber layer 271, respectively, and the fourth dielectric stack 206 includes a silicon-based absorber layer, in this embodiment depicted as a sixth silicon-based absorber layer 260.
As shown in fig. 4, fig. 4 illustrates an embodiment of fig. 3 in which the fourth dielectric stack 206 includes a seventh silicon-based absorber layer 261 in addition to the sixth silicon-based absorber layer 260, and the fifth dielectric stack 205 further includes a silicon-based absorber layer, which in this embodiment is described as an eighth silicon-based absorber layer 250.
The material of any of the above silicon-based absorber layers may include elemental silicon, and/or a silicon-based compound. The silicon-based absorption layer is capable of absorbing visible light. Of course, the silicon-based absorber layer may absorb both infrared and visible light. Optionally, the silicon-based absorber layer has an absorbance of visible light greater than an absorbance of infrared light. The application can reduce the light transmittance of the coated glass 100 through the design of the silicon-based absorption layer, improve the shading effect of the coated glass 100, use the coated glass 100 to replace a colored PVB film or colored glass, reduce the production cost of the laminated glass, and simultaneously reduce the reflection of the coated glass 100 to external light rays due to the influence of the silicon-based absorption layer on visible light as the main absorption, thereby avoiding causing light pollution, and the silicon-based absorption layer is beneficial to more neutral appearance color of the coated glass 100 while realizing the reduction of the light transmittance of the coated glass 100.
In one possible embodiment, the first glass sheet 10 has a visible light transmittance of TL1, the coated glass 100 has a visible light transmittance of TL2, the TL1 is equal to or greater than 80%, and the TL1 and the TL2 satisfy TL2/TL1 is equal to or less than 0.2.
Alternatively, the visible light transmittance TL1 of the first glass plate 10 is greater than or equal to 80% and less than or equal to 98%. For example, the visible light transmittance TL1 of the first glass plate 10 may be 80%, or 81%, or 82%, or 83%, or 84%, or 85%, or 86%, or 87%, or 88%, or 89%, or 90%, or 91%, or 92%, or 93%, or 94%, or 95%, or 96%, or 97%, or 98%. According to the application, the visible light transmittance of the first glass plate 10 is more than or equal to 80%, so that most of light can penetrate the first glass plate 10 and enter the heat insulation functional layer 20 when the coated glass 100 is irradiated by the light, the heat insulation functional layer 20 can exert the maximum effect on infrared reflection, and the colored glass with higher cost can be avoided.
Optionally, coated glass 100 has a visible light transmittance TL2 of less than or equal to 15%. For example, coated glass 100 may have a visible light transmittance TL2 of 15%, or 14%, or 13%, or 12%, or 11%, or 10%, or 9%, or 8%, or 7%, or 6%, or 5%, or 4%, or 3%. Preferably, coated glass 100 has a visible light transmittance TL2 of less than or equal to 13%. More preferably, coated glass 100 has a visible light transmittance TL2 of less than or equal to 10%. Still more preferably, coated glass 100 has a visible light transmittance TL2 of less than or equal to 8%. The visible light transmittance TL2 of the coated glass 100 is smaller than or equal to 15%, so that the coated glass 100 can replace the colored PVB, and the product cost can be reduced.
In one possible embodiment, referring to fig. 2,3 and 4, at least one of the dielectric stacks comprises at least one of the silicon-based absorber layers and at least two dielectric layers. Each silicon-based absorption layer is positioned between two adjacent dielectric layers. The material of each dielectric layer is independently selected from at least one of oxide, nitride or oxynitride, specifically, zirconium (Zr), niobium (Nb), silicon (Si), antimony (Sb), tin (Sn), zinc (Zn), indium (In), aluminum (Al), nickel (Ni), chromium (Cr), magnesium (Mg), manganese (Mn), vanadium (V), tungsten (W), hafnium (Hf), tantalum (Ta), molybdenum (Mo), gallium (Ga), yttrium (Y), bismuth (Bi), oxide, nitride or oxynitride of at least one element of titanium (Ti), for example, zinc oxide doped with Aluminum (AZO), niobium oxide (NbOx), titanium oxide (TiOx), zinc aluminum oxide (ZnAlOx), zinc oxide (ZnOx), tin oxide (SnOx), zinc tin oxide (ZnSnOx), zirconium nitride (ZrNx), silicon oxide (SiOx), silicon nitride (silicon nitride), silicon nitride (SiOxNy), silicon aluminum nitride (SiAlZrNx), silicon nitride (SiZrNx), silicon nitride (SiNx), zirconium oxide (SiZrOx), zirconium oxide (ITO), indium oxide (ITO), or the like.
Specifically, as shown in fig. 2, the first dielectric stack 209 includes a first silicon-based absorption layer 290 and two dielectric layers, in this embodiment, a first dielectric layer 291 and a second dielectric layer 292 are respectively described, the first silicon-based absorption layer 290 is located between the first dielectric layer 291 and the second dielectric layer 292, the second dielectric stack 208 includes a second silicon-based absorption layer 280, a third silicon-based absorption layer 281 and three dielectric layers, in this embodiment, a third dielectric layer 282, a fourth dielectric layer 283 and a fifth dielectric layer 284 are respectively described, the second silicon-based absorption layer 280 is located between the third dielectric layer 282 and the fourth dielectric layer 283, the third silicon-based absorption layer 281 is located between the fourth dielectric layer 283 and the fifth dielectric layer 284, the third dielectric stack 207 includes a fourth silicon-based absorption layer 270 and two dielectric layers, in this embodiment, a sixth dielectric layer 272 and a seventh dielectric layer 273 are respectively described, and the fourth silicon-based absorption layer 270 is located between the sixth dielectric layer 272 and the seventh dielectric layer 273.
The thicknesses of the first silicon-based absorption layer 290, the second silicon-based absorption layer 280, the third silicon-based absorption layer 281, and the fourth silicon-based absorption layer 270 may be the same or different. The thicknesses of the first dielectric layer 291, the second dielectric layer 292, the third dielectric layer 282, the fourth dielectric layer 283, the fifth dielectric layer 284, the sixth dielectric layer 272 and the seventh dielectric layer 273 may be the same or different. The materials of the first silicon-based absorption layer 290, the second silicon-based absorption layer 280, the third silicon-based absorption layer 281, and the fourth silicon-based absorption layer 270 may be the same or different. The materials of the first dielectric layer 291, the second dielectric layer 292, the third dielectric layer 282, the fourth dielectric layer 283, the fifth dielectric layer 284, the sixth dielectric layer 272 and the seventh dielectric layer 273 may be the same or different.
As shown in fig. 3, the first dielectric stack 209 includes a first silicon-based absorption layer 290 and two dielectric layers, in this embodiment, a first silicon-based absorption layer 290 is disposed between the first dielectric layer 291 and the second dielectric layer 292, the second dielectric stack 208 includes a second silicon-based absorption layer 280, a third silicon-based absorption layer 281 and three dielectric layers, in this embodiment, a third dielectric layer 282, a fourth dielectric layer 283 and a fifth dielectric layer 284, the second silicon-based absorption layer 280 is disposed between the third dielectric layer 282 and the fourth dielectric layer 283, the third silicon-based absorption layer 281 is disposed between the fourth dielectric layer 283 and the fifth dielectric layer 284, the third dielectric stack 207 includes a fourth silicon-based absorption layer 270, a fifth silicon-based absorption layer 271 and three dielectric layers 292, in this embodiment, a sixth dielectric layer 272, a seventh dielectric layer 273 and an eighth dielectric layer 274, a fourth silicon-based absorption layer 272 is disposed between the sixth dielectric layer 272 and the seventh dielectric layer 273, a fifth silicon-based absorption layer 271 is disposed between the seventh dielectric layer 271 and the seventh dielectric layer 273 and the eighth dielectric layer 262 is disposed between the ninth dielectric layer 263 and the ninth dielectric layer 262 is disposed between the fourth dielectric layer and the tenth dielectric layer 263 and the ninth dielectric layer 262 is disposed between the fourth dielectric layer and the eighth dielectric layer.
The thicknesses of the first silicon-based absorber layer 290, the second silicon-based absorber layer 280, the third silicon-based absorber layer 281, the fourth silicon-based absorber layer 270, the fifth silicon-based absorber layer 271, and the sixth silicon-based absorber layer 260 may be the same or different. The thicknesses of the first dielectric layer 291, the second dielectric layer 292, the third dielectric layer 282, the fourth dielectric layer 283, the fifth dielectric layer 284, the sixth dielectric layer 272, the seventh dielectric layer 273, the eighth dielectric layer 274, the ninth dielectric layer 262, and the tenth dielectric layer 263 may be the same or different. The materials of the first silicon-based absorption layer 290, the second silicon-based absorption layer 280, the third silicon-based absorption layer 281, the fourth silicon-based absorption layer 270, the fifth silicon-based absorption layer 271, and the sixth silicon-based absorption layer 260 may be the same or different. The materials of the first dielectric layer 291, the second dielectric layer 292, the third dielectric layer 282, the fourth dielectric layer 283, the fifth dielectric layer 284, the sixth dielectric layer 272, the seventh dielectric layer 273, the eighth dielectric layer 274, the ninth dielectric layer 262, and the tenth dielectric layer 263 may be the same or different.
Also, as shown in fig. 4, fig. 4 is a view of the embodiment of fig. 3, in which a seventh silicon-based absorber layer 261 is located between a tenth dielectric layer 263 and an eleventh dielectric layer 264. The eighth silicon-based absorber layer 250 is located between two adjacent dielectric layers, in this embodiment described as a twelfth dielectric layer 251 and a thirteenth dielectric layer 252.
By including at least one silicon-based absorber layer in at least one dielectric stack, the effect of absorbing visible light by coated glass 100 to reduce light transmittance is advantageously improved, while the effect of color neutralization of the appearance of coated glass 100 is also advantageously improved. Through making every dielectric lamination include two at least dielectric layers, every silicon-based absorbed layer is located between two adjacent dielectric layers, is favorable to making silicon-based absorbed layer and metal reflection layer separate through the dielectric layer to can guarantee the homogeneity of deposit silicon-based absorbed layer, metal reflection layer, make silicon-based absorbed layer and metal reflection layer separate through the dielectric layer simultaneously, also can avoid the phenomenon of the unusual growth of crystal grain of metal reflection layer in the heat treatment in-process, thereby be favorable to guaranteeing the compactness of metal reflection layer. In addition, by having each dielectric stack comprise at least two dielectric layers, each silicon-based absorber layer is located between two adjacent dielectric layers, it is also advantageous to isolate the silicon-based absorber layer from the first glass plate 10 by the dielectric layers, and to isolate the silicon-based absorber layer from outside air by the dielectric layers, thereby helping to ensure the optical and mechanical properties of the respective silicon-based absorber layer.
Optionally, the physical thickness of each silicon-based absorption layer is 4 nm-20 nm. Preferably, the physical thickness of each silicon-based absorption layer is 4 nm-15 nm. More preferably, the physical thickness of each silicon-based absorption layer is 5 nm-10 nm.
The physical thickness of each silicon-based absorption layer is 4-20 nm, specifically 4nm, 5nm, 6nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm and 20nm. The physical thickness of the silicon-based absorption layer is 4-20 nm, so that the reflectivity of the coated glass 100 to external visible light can be effectively reduced, and the light pollution caused by the coated glass 100 is prevented. Meanwhile, when the silicon-based absorption layer is too thin, the effect of low transmittance of the coated glass 100 is not easily achieved, and when the silicon-based absorption layer is too thick, the reflectivity of the coated glass 100 to external visible light is increased, and the risk of light pollution is increased.
In one possible embodiment, referring to fig. 2 to 4, the dielectric stack closest to the first glass plate 10 is an innermost dielectric stack, and the innermost dielectric stack includes at least one silicon-based absorption layer and at least two dielectric layers, and each silicon-based absorption layer is located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 2, the first dielectric stack 209 is the innermost dielectric stack. Wherein the first dielectric stack 209 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 3, the first dielectric stack 209 is the innermost dielectric stack. Wherein the first dielectric stack 209 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 4, the first dielectric stack 209 is the innermost dielectric stack. Wherein the first dielectric stack 209 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
By having the innermost dielectric stack comprise at least one silicon-based absorber layer and at least two dielectric layers, it is advantageous to space the silicon-based absorber layer from the first glass plate 10 by the dielectric layers and to effectively reduce the reflectivity of the coated glass 100.
In one possible embodiment, referring to fig. 2 to 4, n is an integer greater than or equal to 2, and the dielectric stack between two adjacent metal reflective layers is an intermediate dielectric stack, where the intermediate dielectric stack includes at least one silicon-based absorption layer and at least two dielectric layers, and each silicon-based absorption layer is located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 2, the second dielectric stack 208 is an intermediate dielectric stack. Wherein the second dielectric stack 208 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 3, the second dielectric stack 208 and the third dielectric stack 207 are intermediate dielectric stacks. Wherein the second dielectric stack 208 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer is located between two adjacent dielectric layers, and the third dielectric stack 207 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer is located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 4, the second dielectric stack 208, the third dielectric stack 207 and the fourth dielectric stack 206 are intermediate dielectric stacks. Wherein the second dielectric stack 208 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer is located between two adjacent dielectric layers, and the third dielectric stack 207 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer is located between two adjacent dielectric layers, and the fourth dielectric stack 206 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer is located between two adjacent dielectric layers.
By having the intermediate dielectric stack include at least one silicon-based absorber layer and at least two dielectric layers, it is advantageous to space the silicon-based absorber layer from the metal reflective layer by the dielectric layers and to effectively reduce the reflectivity of coated glass 100.
Optionally, at least one of the intermediate dielectric stacks includes at least two of the silicon-based absorber layers and at least three dielectric layers.
It will be appreciated that in the embodiment shown in fig. 2, the second dielectric stack 208 may comprise at least two silicon-based absorber layers and at least three dielectric layers.
It will be appreciated that in the embodiment shown in fig. 3, at least one of the second dielectric stack 208 and the third dielectric stack 207 may comprise at least two silicon-based absorber layers and at least three dielectric layers.
It will be appreciated that in the embodiment shown in fig. 4, at least one of the second dielectric stack 208, the third dielectric stack 207, and the fourth dielectric stack 206 may comprise at least two silicon-based absorber layers and at least three dielectric layers.
In one possible embodiment, the dielectric stack furthest from the first glass plate is an outermost dielectric stack comprising at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent ones of the dielectric layers.
It will be appreciated that in the embodiment shown in fig. 2, the third dielectric stack 207 is the outermost dielectric stack. Wherein the third dielectric stack 207 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 3, the fourth dielectric stack 206 is the outermost dielectric stack. Wherein the fourth dielectric stack 206 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
It will be appreciated that in the embodiment shown in fig. 4, the fifth dielectric stack 205 is the outermost dielectric stack. Wherein the fifth dielectric stack 205 comprises at least one silicon-based absorber layer and at least two dielectric layers, each silicon-based absorber layer being located between two adjacent dielectric layers.
By having the outermost dielectric stack include at least one silicon-based absorber layer and at least two dielectric layers, it is advantageous to isolate the silicon-based absorber layer from outside air by the dielectric layers and to effectively reduce the reflectivity of coated glass 100.
The silicon-based absorption layer is made of at least one of Si simple substance, silicon-based compound Si1-xMx and silicon-based compound Si(1-z-y)MzNy. Optionally, the material of the silicon-based absorption layer is Si simple substance, or silicon-based compound Si1-xMx or silicon-based compound Si(1-z-y)MzNy.
The element M in the silicon-based compound Si1-xMx is one of aluminum (Al), carbon (C), zirconium (Zr), magnesium (Mg), titanium (Ti), zinc (Zn), tin (Sn), nickel (Ni), chromium (Cr), vanadium (V), boron (B) and gallium (Ga). Wherein x is 0< 0.35 or less, or 0.02-0.35, the silicon-based compound can be ensured to have a melting point of more than 800 ℃, and concrete examples are 0.01、0.02、0.03、0.04、0.05、0.06、0.08、0.1、0.12、0.15、0.18、0.2、0.21、0.22、0.25、0.28、0.3、0.31、0.32、0.33、0.34、0.35 and the like.
The element M In the silicon-based compound Si(1-z-y)MzNy is one or more of aluminum (Al), carbon (C), zirconium (Zr), magnesium (Mg), titanium (Ti), zinc (Zn), tin (Sn), nickel (Ni), chromium (Cr), vanadium (V), boron (B) and gallium (Ga), and the element N comprises one or more of aluminum (Al), carbon (C), zirconium (Zr), magnesium (Mg), titanium (Ti), zinc (Zn), tin (Sn), nickel (Ni), chromium (Cr), vanadium (V), boron (B), gallium (Ga), yttrium (Y), niobium (Nb), tantalum (Ta), hafnium (Hf), indium (In), cadmium (Cd), palladium (Pd) and tungsten (W). Wherein y is 0< 0.1 and z is 0< 0.35, and the silicon-based compound can be ensured to have a melting point of more than 800 ℃. Or 0.01.ltoreq.y.ltoreq.0.1, and specific examples thereof include 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, and the like. Or 0.02.ltoreq.z.ltoreq.0.35, concrete examples thereof include 0.01、0.02、0.03、0.04、0.05、0.06、0.08、0.1、0.12、0.15、0.18、0.2、0.21、0.22、0.25、0.28、0.3、0.31、0.32、0.33、0.34、0.35 and the like.
In one possible embodiment, when the insulating functional layer 20 includes a plurality of silicon-based absorption layers, a portion of the silicon-based absorption layers may be elemental Si, and another portion may be silicon-based compound Si1-xMx and/or silicon-based compound Si(1-z-y)MzNy. In another possible embodiment, when the thermal insulation functional layer 20 includes a plurality of silicon-based absorption layers, the material of each silicon-based absorption layer may be Si simple substance, may be silicon-based compound Si1-xMx, or may be silicon-based compound Si(1-z-y)MzNy.
Alternatively, as shown in fig. 3, the material of the first silicon-based absorption layer 290 may be Si1-xAlx, the material of the second silicon-based absorption layer 280 may be Si1-xAlx, the material of the third silicon-based absorption layer 281 may be Si1-xAlx, the material of the fourth silicon-based absorption layer 270 may be Si(1-z-y)AlzMgy, the material of the fifth silicon-based absorption layer 271 may be Si1-xAlx, and the material of the sixth silicon-based absorption layer 260 may be Si1-xAlx. The values of x in the first silicon-based absorber layer 290, the second silicon-based absorber layer 280, the third silicon-based absorber layer 281, the fifth silicon-based absorber layer 271, and the sixth silicon-based absorber layer 260 may be the same or different. The value of z in the fourth silicon-based absorption layer 270 may be the same as or different from the value of x in the first silicon-based absorption layer 290, the second silicon-based absorption layer 280, the third silicon-based absorption layer 281, the fifth silicon-based absorption layer 271, and the sixth silicon-based absorption layer 260.
The silicon-based compound has a higher absorption coefficient in the wavelength range of 300nm-2500nm, and can effectively absorb visible light and infrared rays, and in the embodiment, the material of the silicon-based absorption layer comprises Si simple substance, or the silicon-based compound Si1-xMx or the silicon-based compound Si(1-z-y)MzNy, so that the requirements of 600 ℃ high temperature resistant molding of the silicon-based absorption layer and the coated glass 100 in processing and manufacturing are met. In addition, in the thermal processing process, the silicon-based compound is combined with O element in the adjacent dielectric layers through Si, so that stable chemical bonds can be formed, the content of Si element with certain content can ensure enough chemical bond formation, and therefore the combination between the silicon-based absorption layer and the adjacent dielectric layers is firmer, and each dielectric stack layer has certain mechanical properties.
In one possible embodiment, the thermal insulation functional layer 20 includes at least three metal reflective layers and at least four dielectric stacks, and the total physical thickness of the at least three metal reflective layers is 30nm to 50nm, specifically, 30nm, 31nm, 33nm, 35nm, 36nm, 38nm, 40nm, 42nm, 44nm, 45nm, 48nm, 50nm, and the like can be exemplified. The at least four dielectric stacks comprise at least three of the silicon-based absorber layers. The total physical thickness of all the silicon-based absorption layers is 15nm to 50nm, and specifically 15nm, 18nm, 20nm, 22nm, 23nm, 25nm, 28nm, 30nm, 31nm, 33nm, 35nm, 36nm, 38nm, 40nm, 42nm, 44nm, 45nm, 48nm and 50nm can be exemplified.
Alternatively, as shown in fig. 3, taking an example that the heat insulating functional layer 20 includes three metal reflective layers, the thickness of the first metal reflective layer 201 may be 11nm to 17nm, the thickness of the second metal reflective layer 202 may be 11nm to 17nm, and the thickness of the third metal reflective layer 203 may be 11nm to 17nm. Taking the example that the heat insulating functional layer 20 includes six silicon-based absorption layers, the thickness of the first silicon-based absorption layer 290 may be 2nm to 9nm, the thickness of the second silicon-based absorption layer 280 may be 2nm to 9nm, the thickness of the third silicon-based absorption layer 281 may be 2nm to 9nm, the thickness of the fourth silicon-based absorption layer 270 may be 2nm to 9nm, the thickness of the fifth silicon-based absorption layer 271 may be 2nm to 9nm, and the thickness of the sixth silicon-based absorption layer 260 may be 2nm to 9nm.
According to the application, the heat insulation functional layer 20 comprises at least three metal reflecting layers, and the total thickness of the metal reflecting layers in the heat insulation functional layer 20 is 30-50 nm, so that the effect of reflecting infrared rays by the heat insulation functional layer 20 is ensured, and the high heat insulation effect of the coated glass 100 is realized. When the total thickness of the metal reflective layer in the heat insulating functional layer 20 is too thin, that is, less than 30nm, the reflection performance on infrared rays is weaker, the coated glass 100 cannot achieve the required heat insulating effect, when the total thickness of the metal reflective layer in the heat insulating functional layer 20 is too thick, that is, more than 50nm, the color of the heat insulating functional layer 20 is reddish, the color difference of the reflection color of the light incident at 40-80 degrees is larger, the appearance color of the coated glass 100 is difficult to realize to be neutral, and the appearance of the coated glass 100 can be influenced.
According to the application, the heat insulation functional layer 20 comprises at least three silicon-based absorption layers, and the total thickness of the silicon-based absorption layers in the heat insulation functional layer 20 is 15-50 nm, so that the effect of absorbing visible light by the heat insulation functional layer 20 is guaranteed, and the coated glass 100 has lower light transmittance. When the total thickness of the silicon-based absorption layer in the heat insulation functional layer 20 is too thin, that is, less than 15nm, the absorption performance on visible light is weaker, the coated glass 100 cannot achieve the required low-transmittance effect, and when the total thickness of the silicon-based absorption layer in the heat insulation functional layer 20 is too thick, that is, more than 50nm, the color difference of the reflection color of the light incident at 40-80 degrees is larger, the appearance color of the coated glass 100 is difficult to realize to be neutral, and the appearance of the coated glass 100 can be influenced.
In one possible embodiment, as shown in fig. 3, the insulating-functional layer 20 includes an innermost dielectric stack (i.e., a first dielectric stack 209), a first metal reflective layer 201, a first intermediate dielectric stack (i.e., a second dielectric stack 208), a second metal reflective layer 202, a second intermediate dielectric stack (i.e., a third dielectric stack 207), a third metal reflective layer 203, and an outermost dielectric stack (i.e., a fourth dielectric stack 206) stacked in that order. The total physical thickness of all silicon-based absorption layers in the innermost medium lamination is L1, the total physical thickness of all silicon-based absorption layers in the first medium lamination is L2, and the total physical thickness of all silicon-based absorption layers in the second medium lamination is L3, wherein L1< L2+L3 or L1< L2.
Alternatively, L1 may be 5mm to 9mm. L2 may be 5mm to 11mm. L3 may be 5mm to 12mm.
In one possible embodiment, the total physical thickness of all silicon-based absorber layers in the outermost dielectric stack is L4, L4< l2+l3 or L4< L3.
Alternatively, L4 may be less than 10mm.
Alternatively, the thickness ratio of two adjacent metal reflective layers is 0.7-1.2, and specific examples thereof include 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, 1.05, 1.1, 1.15, and 1.2. In other words, when the heat insulating functional layer 20 includes a plurality of metal reflecting layers, the thickness between the plurality of metal reflecting layers is close. For example, the thickness difference of any two metal reflecting layers is less than or equal to 5nm.
In one possible embodiment, as shown in fig. 3, the thermal insulation functional layer 20 includes a first metal reflective layer 201, a second metal reflective layer 202, and a third metal reflective layer 203 sequentially arranged, where the thickness of the first metal reflective layer 201 is A1, the thickness of the second metal reflective layer 202 is A2, and the thickness of the third metal reflective layer 203 is A3, where A1/A2 is 0.7-1.2, and A3/A2 is 0.7-1.2.
It can be appreciated that the thicknesses of the first metal reflective layer 201, the second metal reflective layer 202, and the third metal reflective layer 203 are close. Optionally, A1/A2 is 0.7-1, A3/A2 is 0.7-1, or A1/A2 is 1-1.2, A3/A2 is 1-1.2, or A1/A2 is 0.7-1, A3/A2 is 1-1.2, or A1/A2 is 1-1.2, A3/A2 is 0.7-1. For example, the thicknesses of the first metal reflective layer 201, the second metal reflective layer 202, and the third metal reflective layer 203 may decrease sequentially, or the thicknesses of the first metal reflective layer 201, the second metal reflective layer 202, and the third metal reflective layer 203 may increase sequentially, or the thickness of the first metal reflective layer 201 may be smaller than the thickness of the second metal reflective layer 202, the thickness of the third metal reflective layer 203 may be smaller than the thickness of the second metal reflective layer 202, or the thickness of the first metal reflective layer 201 may be smaller than the thickness of the second metal reflective layer 202, and the thickness of the third metal reflective layer 203 may be larger than the thickness of the second metal reflective layer 202.
According to the embodiment, the thicknesses of the n metal reflecting layers are set according to a certain proportion, so that the heat insulation performance of the heat insulation functional layer 20 is effectively improved, and meanwhile, the color difference of the reflecting color of the coated glass 100 on the incident light rays of 40-80 degrees is smaller, and the appearance of the coated glass 100 is neutral and more attractive.
In one possible embodiment, the coated glass 100 has a solar direct transmittance TE of less than or equal to 12% and the coated glass 100 has a visible light transmittance TL2 of less than or equal to 15%.
In this embodiment, the solar direct transmittance TE of the coated glass 100 and the visible light transmittance TL2 of the coated glass 100 are obtained by measurement and calculation according to standard ISO 9050. Alternatively, the solar direct transmittance TE of coated glass 100 may be less than or equal to 10%, preferably less than or equal to 7%, more preferably less than or equal to 5%, and the visible light transmittance TL2 of coated glass 100 may be less than or equal to 12%, preferably less than or equal to 10%, more preferably less than or equal to 5%.
The coated glass 100 in this embodiment has low solar direct transmittance TE, has good blocking capability in the solar spectrum (300 nm-2500 nm) band, can block ultraviolet and visible light, also can block infrared, has good heat insulation function, and can meet the heat insulation requirement when used as skylight glass. Meanwhile, the coated glass 100 has lower visible light transmittance TL and better sun-shading effect, and can meet the requirements of shading light and protecting privacy when being used as skylight glass. In addition, in this embodiment, the heat-insulating functional layer 20 is provided to replace the colored PVB or the colored glass, so that the low-transmittance and high-heat-insulating effects of the coated glass 100 can be achieved, and in the production and manufacture, the selectivity of the first glass plate 10 is improved, and the production cost can be effectively reduced.
Further, as shown in fig. 5, fig. 5 is a schematic cross-sectional view of a laminated glass 200 according to an embodiment of the present application. Laminated glass 200 includes second glass pane 40, bonding layer 30, and coated glass 100 as described. One of the first glass plate 10 and the second glass plate 40 is an outer glass plate, and the other is an inner glass plate. The outer glass plate comprises a first surface and a second surface which are arranged in a back-to-back mode, the inner glass plate comprises a third surface and a fourth surface which are arranged in a back-to-back mode, the bonding layer 30 is arranged between the second surface and the third surface, and the visible light transmittance of the bonding layer 30 is greater than or equal to 80%.
Wherein the first surface of the outer glass plate faces the exterior of the vehicle, the second surface of the outer glass plate faces the adhesive layer 30, the third surface of the inner glass plate faces the adhesive layer 30, and the fourth surface of the inner glass plate faces the interior of the vehicle.
In one possible embodiment, as shown in FIG. 5, the first glass sheet 10 is an outer glass sheet and the second glass sheet 40 is an inner glass sheet. The insulating functional layer 20 is provided on the second surface of the outer glass pane.
In another possible embodiment, as shown in fig. 6, the first glass sheet 10 is an inner glass sheet and the second glass sheet 40 is an outer glass sheet. The heat insulating functional layer 20 is provided on the third surface of the inner glass sheet.
The thickness of the first glass plate 10 and the thickness of the second glass plate 40 are not particularly limited in the present application. Alternatively, the thickness of the first glass plate 10 may be 1.8mm to 3.5mm, and the thickness of the second glass plate 40 may be 0.7mm to 4mm, and the thickness of the first glass plate 10 may be the same as or different from the thickness of the second glass plate 40. The material of the adhesive layer 30 is not particularly limited in the present application. Alternatively, the material of the adhesive layer 30 may include polyvinyl butyral (PVB), or ethylene-vinyl acetate copolymer (EVA), or an ionic polymer (SGP). The thickness of the adhesive layer 30 is not particularly limited in the present application. Optionally, the thickness of the adhesive layer 30 is smaller than that of the first glass plate 10, and the thickness of the adhesive layer 30 may be 0.38mm to 2.28mm, and specifically may be 0.38mm, 0.5mm, 0.76mm, 1.14mm, 1.52mm, 1.9mm, 2.28mm, and the like. In one possible embodiment, the material of the adhesive layer 30 may be PVB, and the thickness of the adhesive layer 30 may be 0.76mm. The adhesive layer 30 may be rectangular, or wedge-shaped.
The laminated glass 200 is incident on the first surface, and visible light with an incident angle of 40-80 degrees has an external surface reflection color Lab value, a value is-5-1, b value is-5-1, and the maximum chromatic aberration ΔCmax is smaller than 3.
Optionally, the coated glass 100 is incident on the first surface with a value of a reflected color of a light ray with an incidence angle of 40 ° being greater than-5 and less than 1, a value of b being greater than-5 and less than 1, and/or the coated glass 100 is incident on the first surface with a value of a reflected color of a light ray with an incidence angle of 50 ° being greater than-5 and less than 1, a value of b being greater than-5 and less than 1, and/or the coated glass 100 is incident on the first surface with a value of a reflected color of a light ray with an incidence angle of 60 ° being greater than-5 and less than 1, b being greater than-5 and less than 1, and/or the coated glass 100 is incident on the first surface with a value of a reflected color of a light ray with an incidence angle of 70 ° being greater than-5 and less than 1, b being greater than-5 and/or the coated glass 100 is incident on the first surface with a value of a reflected color of a light ray with an incidence angle of 80 ° being greater than-5 and less than 1, b being greater than 1.
In one possible embodiment, the coated glass 100 may have an a value greater than-2 and less than 0.5 and a b value greater than-3 and less than 0.5 for a first surface incident and a reflective color of light having an angle of incidence of 50 may have an a value greater than-2 and less than 0, a b value greater than-3 and less than 0 for a first surface incident and a reflective color of light having an angle of incidence of 60 may have an a value greater than-1 and less than 0.5, a b value greater than-3 and less than 0 for a first surface incident and a reflective color of light having an angle of 70 may have an a value greater than-2 and less than 0.8, b value greater than-2 and less than 0, and a value greater than-1 and less than 0.5, b value greater than-1 for a first surface incident and a reflective color of light having an angle of 80 may have an a value greater than-1 and a value greater than-5 and less than 0.b value of less than 0.
Alternatively, the maximum color difference Δcmax of the laminated glass 200 may be less than or equal to 2, and preferably, may be less than or equal to 1.5. Wherein the maximum color difference Δcmax satisfies the formula:
in this embodiment, the high angle reflection color of the laminated glass 200 is closer to neutral or cool tone, and is more attractive. The color difference deviation is too large, the human eyes can distinguish the severe color change, and the severe color change affects the overall color beauty of the vehicle along with the angle change, so that the demand of the existing market on aesthetic design is not met. The maximum chromatic aberration delta Cmax of the reflection color of 40-80 degrees is less than 3, obvious color difference is not easy to distinguish by human eyes in a wide angle range, and the design space of the skylight glass is improved.
Wherein, in the embodiment in which the first glass plate 10 is an outer glass plate and the second glass plate 40 is an inner glass plate, the second glass plate 40 may be a colored glass, and the mass fraction of total iron in the second glass plate 40 in terms of Fe2O3 is 0.7% to 2.2%.
When the first glass plate 10 is an outer glass plate, the second glass plate 40 is a colored glass, so that external light can be further prevented from entering the interior of the vehicle, and the efficiency of absorbing and reflecting the incident light by the laminated glass 200 can be improved, thereby realizing low-transmittance and high-heat-insulating effects of the laminated glass 200.
The material of the first glass plate 10 may be soda lime glass, high alumina glass, lithium alumina glass or borosilicate glass, and the material of the second glass plate 40 may be soda lime glass, high alumina glass, lithium alumina glass or borosilicate glass.
Wherein, in the embodiment in which the first glass plate 10 is an inner glass plate and the second glass plate 40 is an outer glass plate, the second glass plate 40 may be transparent glass, and the visible light transmittance of the second glass plate 40 is greater than or equal to 80%.
When the first glass plate 10 is an inner glass plate, most of the external incident light can be transmitted through the second glass plate 40 and the adhesive layer 30 by making the visible light transmittance of the second glass plate 40 larger than 80%, and is incident on the heat insulation functional layer 20, so that the light transmittance of the coated glass 100 is reduced by the absorption and reflection effects of the heat insulation functional layer 20 on the light, the high heat insulation effect of the coated glass 100 is realized, and the phenomenon that the second glass plate 40 and the adhesive layer 30 absorb more infrared rays to cause the temperature rise of the coated glass 100 is avoided.
Optionally, as shown in fig. 7, the laminated glass 200 further includes a low emissivity coating 50. The low-emissivity coating 50 is provided on the fourth surface, and the emissivity of the laminated glass 200 is less than or equal to 0.35 as measured from the fourth surface side.
Illustratively, the emissivity of the laminated glass 200 is measured from the fourth surface side as 0.15, or 0.16, or 0.17, or 0.18, or 0.19, or 0.2, or 0.21, or 0.22, or 0.23, or 0.24, or 0.25, or 0.26, or 0.27, or 0.28, or 0.29, or 0.3, or 0.31, or 0.32, or 0.33, or 0.34, or 0.35.
The low-emissivity coating 50 comprises at least one Transparent Conductive Oxide (TCO) layer of a material selected from at least one of doped zinc oxide, indium Tin Oxide (ITO), nickel chromium oxide (NiCrOx), fluorine doped tin oxide (FTO), the doped zinc oxide being zinc oxide doped with one or a combination of two or more of the elements aluminum, tungsten, hafnium, gallium, yttrium, niobium, neodymium. The low-emissivity coating 50 may be deposited on the fourth surface by a magnetron sputtering process or the like, which may further reduce the emissivity of the laminated glass 200.
Optionally, as shown in fig. 8, the laminated glass 200 further includes a mid-emissivity coating 60. The radiation coating 60 is disposed on the fourth surface, and the emissivity of the laminated glass 200 measured from the side of the fourth surface is 0.36-0.5.
Illustratively, the emissivity of the laminated glass 200 is measured from the fourth surface side as 0.36, or 0.37, or 0.38, or 0.39, or 0.40, or 0.41, or 0.42, or 0.43, or 0.44, or 0.45.
The material of the medium radiation coating 60 may be at least one selected from nickel-chromium (NiCr) compound, nickel-aluminum (NiAl) compound, nickel-silicon (NiSi) compound, chromium (Cr), titanium nitride (TiN) compound, niobium nitride (NbN) compound, molybdenum-titanium (MoTi) compound, which may further reduce the emissivity of the laminated glass 200 and may also reduce the visible light transmittance and visible light reflectance of the laminated glass 200.
By providing the low-radiation coating 50 or the medium-radiation coating 60, heat radiation circulation between the inside and the outside of the vehicle can be further blocked, so that the heat insulation effect of the laminated glass 200 can be improved.
Optionally, as shown in fig. 9, the laminated glass 200 further includes a dimming element 70. The light modulation element 70 is disposed between the second surface and the third surface, and the light modulation element 70 includes at least one of a polymer dispersed liquid crystal light modulation film, a suspended particle light modulation film, an electrochromic light modulation film, and a dye liquid crystal light modulation film.
By providing the light adjusting element 70, the switching between the transparency and the opacity of the coated glass 100 can be realized, and the shading effect of the coated glass 100 is further improved.
Comparative examples 1-3 and examples 1-8 of coated glass 100
Coated glasses 100 of comparative examples 1 to 3 and examples 1 to 8 in tables 1 to 3 below were prepared. Coated glass 100 includes a first glass sheet 10 and a thermally insulating functional layer 20. The insulating functional layer 20 includes an innermost dielectric stack, a first metal reflective layer, a first intermediate dielectric stack, a second metal reflective layer, a second intermediate dielectric stack, a third metal reflective layer, and an outermost dielectric stack.
A transparent glass plate having a thickness of 2.1mm and a visible light transmittance TL 1=91% was prepared as the first glass plate 10, and the heat insulating functional layers 20 of comparative examples 1 to 3 were deposited on one of the surfaces of the first glass plate 10 by a magnetron sputtering process to form the coated glass 100 of comparative examples 1 to 3, the specific structures of which are shown in table 1.
TABLE 1 film layer Structure of coated glass 100 in comparative examples 1-3
A transparent glass plate having a thickness of 2.1mm and a visible light transmittance TL 1=91% was prepared as the first glass plate 10, and the heat insulating functional layers 20 of examples 1 to 4 were deposited on one of the surfaces of the first glass plate 10 by a magnetron sputtering process to form the coated glasses 100 of examples 1 to 4, the specific structures of which are shown in table 2.
TABLE 2 film layer Structure of coated glass 100 in examples 1-4
A transparent glass plate having a thickness of 2.1mm and a visible light transmittance TL 1=91% was prepared as the first glass plate 10, and the heat insulating functional layers 20 of examples 5 to 8 were deposited on one of the surfaces of the first glass plate 10 by a magnetron sputtering process to form the coated glass 100 of examples 5 to 8, the specific structures of which are shown in table 3.
TABLE 3 film layer Structure of coated glass 100 in examples 5-8
The visible light transmittance TL2 and the solar direct transmittance TE of the coated glass 100 of comparative examples 1 to 3 and examples 1 to 8 were measured, and the measurement results are shown in table 4.
TABLE 4 test results for comparative examples 1-3 and examples 1-8
| Visible light transmittance TL2 | TE (TE) direct solar transmittance |
| Comparative example 1 | 52.62% | 23.7% |
| Comparative example 2 | 17.81% | 11.45% |
| Comparative example 3 | 13.79% | 10.57% |
| Example 1 | 12.31% | 6.95% |
| Example 2 | 11.65% | 7.4% |
| Example 3 | 10.70% | 11.09% |
| Example 4 | 7.90% | 7.12% |
| Example 5 | 10.06% | 8.2% |
| Example 6 | 5.53% | 6.7% |
| Example 7 | 3.75% | 4.9% |
| Example 8 | 4.83% | 5.22% |
In table 4, the visible light transmittance TL is the visible light transmittance of the coated glass 100 when the incident angle is 8 ° measured according to the standard ISO9050, and the solar direct transmittance TE is the solar direct transmittance of the coated glass 100 when the incident angle is 8 ° measured according to the standard ISO 9050.
As can be seen from table 4, the coated glass 100 of each of comparative examples 1 to 3 has a visible light transmittance TL2 of more than 13%, even more than 50%, and the effect of achieving low light transmittance of the coated glass 100 is poor, and it is not possible to use the colored PVB or the colored glass in a good place.
The visible light transmittance TL2 of the coated glass 100 of examples 1-8 is less than 13%, even less than 10%, and the solar direct transmittance TE of the coated glass 100 is also less, so as to achieve the effect that the solar direct transmittance TE of the coated glass 100 is less than 12%, even less than 8%, i.e. the effect of achieving low transmittance and thermal insulation of the coated glass 100 is better.
Laminated glass 200 coated glass 100 comprising comparative examples 1-3 and examples 1-8
Laminated glasses 200 of comparative examples 1 to 3 and examples 1 to 8 in tables 5 to 7 below were prepared. Coated glass 100 in laminated glass 200 may correspond to tables 1-3 described above.
Transparent PVB having a thickness of 0.76mm and a visible light transmittance of 88% was prepared as a bonding layer, coated glass 100 of comparative examples 1 to 3 was prepared as an outer glass plate, colored glass having a thickness of 2.1mm was prepared as an inner glass plate, and laminated glass 200 comprising coated glass 100 of comparative examples 1 to 3 was formed by an automotive glass manufacturing process, and the specific structure is shown in Table 5.
TABLE 5 laminated glass comprising coated glasses of comparative examples 1-3
A transparent PVB having a thickness of 0.76mm and a visible light transmittance of 88% was prepared as a bonding layer, coated glass 100 of examples 1 to 4 was prepared as an outer glass plate, a colored glass having a thickness of 2.1mm was prepared as an inner glass plate, and laminated glass 200 comprising coated glass 100 of examples 1 to 4 was formed by an automotive glass manufacturing process, and the specific structure is shown in table 6.
TABLE 6 laminated glass comprising coated glasses of examples 1-4
A laminated glass 200 comprising coated glass 100 of example 5 was formed by an automotive glass manufacturing process by preparing a transparent PVB having a thickness of 0.76mm and a visible light transmittance of 88% as an adhesive layer, preparing coated glass 100 of example 5 as an outer glass plate, and preparing a green glass having a thickness of 2.1mm as an inner glass plate, and specific structures are shown in table 7.
A laminated glass 200 comprising coated glass 100 of example 6 was formed by an automotive glass manufacturing process by preparing a transparent PVB having a thickness of 0.76mm and a visible light transmittance of 88% as a bonding layer, preparing coated glass 100 of example 6 as an outer glass plate, and preparing a transparent glass having a thickness of 2.1mm as an inner glass plate, and specific structures are shown in table 7.
A laminated glass 200 comprising coated glass 100 of examples 7 to 8 was formed by an automotive glass manufacturing process by preparing a transparent PVB having a thickness of 0.76mm and a visible light transmittance of 88% as a bonding layer, preparing coated glass 100 of examples 7 to 8 as an inner glass plate, preparing a transparent glass having a thickness of 2.1mm as an outer glass plate, and specifically structured as shown in table 7.
TABLE 7 laminated glass comprising coated glasses of examples 5-8
The test results of the laminated glasses including the coated glasses of comparative examples 1 to 3 in Table 5 and the laminated glasses including the coated glasses of examples 1 to 2 in Table 6 are shown in Table 8.
TABLE 8 test results of laminated glass
The test results of the laminated glasses including the coated glasses of examples 3 to 4 in table 6 and the laminated glasses including the coated glasses of examples 5 to 8 in table 7 are shown in table 9.
TABLE 9 test results of laminated glass
In tables 8 and 9, the visible light transmittance TL is the visible light transmittance of the laminated glass 200 when the incident angle is 8 ° according to the standard ISO9050 measurement, the solar direct transmittance TE is the solar direct transmittance of the laminated glass 200 when the incident angle is 8 ° according to the standard ISO9050 measurement, and the external surface reflection color Lab values are a value and b value of the reflection color Lab of the laminated glass 200 to the visible light emitted from the D65 light source incident at the incident angle of 40 °,50 °, 60 °, 70 °,80 ° according to the CIE1976 measurement.
Wherein the maximum chromatic aberration delta Cmax is according to the formulaThe calculation results show that amax is the maximum value of a values when the incident angle is 40 degrees, 50 degrees, 60 degrees, 70 degrees and 80 degrees, amin is the minimum value of a values when the incident angle is 40 degrees, 50 degrees, 60 degrees, 70 degrees and 80 degrees, bmax is the maximum value of b values when the incident angle is 40 degrees, 50 degrees, 60 degrees, 70 degrees and 80 degrees, and bmin is the minimum value of b values when the incident angle is 40 degrees, 50 degrees, 60 degrees, 70 degrees and 80 degrees.
As can be seen from tables 8 and 9:
The laminated glass of the comparative example 1 has a low light transmittance, but the laminated glass has a visible light transmittance of more than 15%, is difficult to meet the requirement of ultra-low light transmittance of the laminated glass, has an outer surface visible light reflectance R1 of more than 25%, is easy to cause light pollution, has an a value of more than 10 and a b value of more than 10 when the incident angle is 40 degrees, 50 degrees, 60 degrees, 70 degrees and 80 degrees, has a maximum chromatic aberration delta Cmax of more than 25, cannot meet the requirement of appearance color, cannot realize the appearance neutral color, has a color aberration deviation of too large at different incident angles, can distinguish drastic color changes by human eyes, and has the drastic color changes along with the angle changes, thereby influencing the overall color beauty of a vehicle, and being unfavorable for meeting the requirement of aesthetic design in the existing market.
The visible light transmittance of the laminated glass of comparative example 2 is still more than 14%, it is difficult to meet the requirement of ultra-low transmittance of the laminated glass, and the value of a of the external surface reflection color is more than 1.5, even more than 3, the maximum chromatic aberration Δcmax is more than 3 at incidence angles of 40 °, 50 °, 60 °, 70 °, and the apparent color at most incidence angles cannot meet the requirement, so that it is difficult to realize the apparent neutral color.
The laminated glass of comparative example 3 has an outer surface visible light reflectance R1 of more than 11% and may cause light pollution, and has a b value of the outer surface reflected color of more than 3 and a maximum color difference Δcmax of more than 10 at an incident angle of 40 °, and has a color difference deviation of too large at different incident angles, so that the human eyes can recognize a drastic color change, and the drastic color change along with the angle change affects the overall color beauty of the vehicle, and is unfavorable for satisfying the demand of aesthetic design in the existing market.
The laminated glass 200 of examples 1 to 8 has a visible light transmittance TL of 10% or less, further 8% or less, and even 5% or less, and can satisfy the requirement of ultra-low light transmittance.
The laminated glasses 200 of examples 1 to 8 have excellent heat insulating effect with a solar direct transmittance TE of 6% or less, further 4% or less, and even 2% or less.
The laminated glasses 200 of examples 1 to 8 have an outer surface visible light reflectance R1 of 10% or less, further 8% or less, and even 5% or less, without causing light pollution.
The laminated glass 200 of examples 1 to 8 has an external surface reflection color a value of-3 to 1 and b value of-3 to 1, further a value of-2 to 1 and b value of-3 to 0.5, even a value of-1.5 to 0 and b value of-2 to 0 at incidence angles of 40 °, 50 °, 60 °, 70 °, 80 °, and can realize an external neutral color of the laminated glass.
The laminated glasses 200 of examples 1 to 8 each have a maximum color difference Δcmax of 3 or less, further 2 or less, and even 1.5 or less, which can avoid too large color difference deviation at different incident angles and can satisfy the demand for aesthetic design in the existing market.
The features mentioned in the description, the claims and the drawings may be combined with one another at will as far as they are relevant within the scope of the application. The advantages and features described for coated glass 100 apply in a corresponding manner to laminated glass 200.
While embodiments of the present application have been shown and described above, it should be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and alternatives to the above embodiments may be made by those skilled in the art within the scope of the application, which is also to be regarded as being within the scope of the application.