The present application claims priority and benefit from U.S. patent application Ser. No. 18/295,738 filed 4/2023 and U.S. provisional patent application Ser. No. 63/328,869 filed 4/2022, the disclosures of both of which are incorporated herein by reference in their entireties.
Detailed Description
Summary of electrochemical fabrication
Fig. 1A-1I illustrate side views of various states in an exemplary multilayer multi-material electrochemical fabrication process. Fig. 1A-1G illustrate various stages of monolayer formation of a multilayer fabrication process in which a second metal is deposited over and in openings in a first metal such that the first and second metals form a portion of the layer. In fig. 1A, a side view of a substrate 82 having a surface 88 on which a patternable photoresist 84 is located, as shown in fig. 1B. In fig. 1C, a resist pattern resulting from curing, exposing, and developing of a resist is shown. Patterning of the photoresist 84 results in openings or holes 92 (a) -92 (c) extending from the surface 86 of the photoresist through the thickness of the photoresist to the surface 88 of the substrate 82. In fig. 1D, a metal 94 (e.g., nickel) is shown as having been electroplated into openings 92 (a) -92 (c). In fig. 1E, the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate to expose areas of the substrate 82 not covered by the first metal 94. In fig. 1F, a second metal 96 (e.g., silver) is shown blanket plated over the entire exposed portion of the substrate 82 (which is conductive) and the first metal 94 (which is also conductive). Fig. 1G depicts a completed first layer of the structure formed by planarizing the first and second metals to a height that exposes the first metal and providing the first layer with a thickness. In fig. 1H, the result of repeating the process steps shown in fig. 1B to 1G a plurality of times to form a multilayer structure is shown, wherein each layer is composed of two materials. For most applications, as shown in fig. 1I, one of these materials is removed to produce the desired 3D structure 98 (e.g., device or apparatus) or a plurality of such structures.
Various embodiments of various aspects of the present application relate to forming three-dimensional structures from materials, some or all of which may be electrodeposited or electroless deposited (as shown in the examples of fig. 1A-1I, and discussed in various patent applications incorporated herein by reference). Some of these structures may be formed from a single build level formed from one or more deposited materials, while other structures are formed from multiple build layers, each layer comprising at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers). In some embodiments, the layer thickness may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used, while in other embodiments thicker layers may be used. In some embodiments, the micro-scale structures have lateral features that are positioned with an accuracy on the order of 0.1 to 10 microns, with minimum feature sizes on the order of a few microns to tens of microns. In other embodiments, structures with less precise feature placement and/or larger minimum features may be formed. In still other embodiments, higher accuracy and smaller minimum feature sizes may be desired. In the present application, mesoscale and millimeter scale have the same meaning, referring to devices that may have one or more dimensions that may extend to a range of 0.5 to 50 millimeters or more, features with positioning accuracy in the range of microns to 100 microns, and minimum feature sizes on the order of tens of microns to hundreds of microns.
Various embodiments, alternatives, and techniques disclosed herein may use a single patterning technique on all layers or different patterning techniques on different layers to form a multi-layer structure. For example, various embodiments of the present invention may perform selective patterning operations using conformal contact masks and mask operations (i.e., operations using masks that contact, but do not adhere to, a substrate), proximity masks and mask operations (i.e., operations that at least partially selectively shield a substrate through their proximity to a substrate even without contact), non-conformal masks and mask operations (i.e., operations that do not have a contact surface that is significantly conformal and are based on the mask), and/or adhesion masks and mask operations (i.e., operations that adhere to a substrate and use the mask, selective deposition or etching will occur on a substrate, rather than just contact with a substrate). The conformal contact mask, proximity mask, and non-conformal contact mask share the property that they are preformed and brought into or near the surface to be treated (i.e., the exposed portion of the surface to be treated). These masks can typically be removed without damaging the mask or its contacted or otherwise proximate surfaces receiving the treatment. The adhesion masks are typically formed on the surface to be treated (i.e., the surface portion to be masked) and adhered to the surface such that they cannot be separated from the surface unless completely destroyed or damaged beyond any point of reuse. The adhesion mask may be formed in a variety of ways, including: (1) Selectively exposing the photoresist by applying the photoresist, and then developing the photoresist; (2) selectively transferring the pre-patterned mask material; and/or (3) directly forming a mask by computer controlled deposition of material. In some embodiments, the adhesion mask material may be used as a sacrificial material for the layer, or may be used only as a mask material that is replaced with another material (e.g., a dielectric or conductive material) prior to completion of the formation of the layer, wherein the replacement material is to be considered as a sacrificial material for the respective layer. The mask material may or may not be planarized prior to or after depositing the material into the voids or openings included therein.
Patterning operations may be used to selectively deposit material and/or may be used for selective etching of material. The selectively etched regions may be selectively filled with different desired materials or by blanket deposition or the like. In some embodiments, layer-by-layer build-up may involve forming portions of multiple layers simultaneously. In some embodiments, deposition associated with certain levels may result in deposition to areas related to other levels (i.e., areas within top and bottom boundary levels defining the geometry of different layers). Such use of selective etching and/or staggered material deposition associated with multiple layers is described in U.S. patent application Ser. No. 10/434,519 to Smalley, 5/7/2003, which is currently U.S. patent 7,252,861 entitled "method and apparatus for electrochemical fabrication of structures by staggered layers or by selective etching and filling of voids （Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids）"." which is incorporated herein by reference.
The temporary substrate on which the structure may be formed may be of a sacrificial type (i.e., damaged or destroyed to the extent that it cannot be reused during separation of the deposited material) or non-sacrificial type (i.e., not damaged or excessively destroyed, i.e., not destroyed to the extent that it cannot be reused, e.g., there is a sacrificial or release layer between the substrate and the initial layer of the formed structure). Non-sacrificial substrates may be considered reusable with little or no reworking (e.g., by re-planning one or more selected surfaces or by applying a release layer, etc.) although they may or may not be reused for various reasons.
Those skilled in the art will understand the definitions of the various terms and concepts (whether the apparatus itself, some methods of making the apparatus, or a particular method of using the apparatus) that may be used to understand the embodiments of the application. Some such terms and concepts are discussed herein, while other such terms are referred to in patent applications (e.g., U.S. patent application Ser. No. 16/584,818) that claim priority from the present application and/or are incorporated by reference herein.
As used herein, "longitudinal" refers to the long dimension of the probe, the end-to-end dimension of the probe, or the end-to-end dimension. Longitudinal may refer to a generally straight line extending from one end of the probe to the other end of the probe, as well as a curved or stair stepped path having an incline or even varying direction along the height of the probe. When referring to a probe array or probes to be loaded into an array configuration, the longitudinal dimension may refer to a particular direction in which the probes in the array point or extend, but may also refer simply to the overall height of the array, starting from a plane containing the first ends, ends or bases of a plurality of probes, extending perpendicular to that plane to a plane containing the second ends, ends or tops of the probes. The context in which it is used generally clearly indicates what is meant especially by those skilled in the art. It is intended that the interpretation of the terms used herein be as narrow as possible, provided that the details of the description provided or the context in which the terms are used are warranted. However, if such a narrow interpretation is not justified, then the broadest reasonable interpretation scope should apply.
The term "transverse" as used herein relates to "longitudinal". By stacking of layers, transverse refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions lying in a plane of layers that are substantially perpendicular to the direction of layer stacking). When referring to a probe array, the lateral direction generally has a similar meaning, as the lateral dimension is generally the dimension lying in a plane parallel to the top or bottom plane of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to the probe itself, the lateral dimension may be a dimension perpendicular to the overall longitudinal axis of the probe, a local longitudinal axis of the probe (i.e., a local lateral dimension), or simply a dimension similar to the dimension of the array or layer. The context in which it is used generally clearly indicates what is meant especially by those skilled in the art. It is intended that the interpretation of the terms used herein be as narrow as possible, provided that the details of the description provided or the context in which the terms are used are warranted. However, if such a narrow interpretation is not justified, then the broadest reasonable interpretation scope should apply.
As used herein, "substantially parallel" means parallel or nearly parallel, i.e., within 15 ° of parallel, more preferably within 10 ° of parallel, even more preferably within 5 ° of parallel, and most preferably within 1 ° of parallel. If the term is used without clarification, it should be interpreted to be within 15 ° of parallel. When used with a particular clarification, the term should be interpreted in accordance with the particular clarification.
As used herein, "substantially perpendicular" or "substantially orthogonal" means perpendicular or nearly perpendicular, i.e., within 15 ° of perpendicular, more preferably within 10 ° of perpendicular, even more preferably within 5 ° of perpendicular, and most preferably within 1 ° of perpendicular. If the term is used without clarification, it should be interpreted to be within 15 ° of vertical. When used with a particular clarification, the term should be interpreted in accordance with the particular clarification.
As used herein, when referring to a surface, a "substantially planar" refers to a surface that is intended to be planar, although as will be appreciated by those skilled in the art, there may be some imperfections (i.e., when referring to millimeter and micrometer scale devices (which are the primary device embodiments set forth herein), these imperfections may deviate from planarity by as much as 1 to 5 micrometers, but are typically submicron in nature). If the term is used without clarification, it should be interpreted as having imperfections that deviate by no more than 5 microns from planarity. When used with a particular clarification, the term should be interpreted in accordance with the particular clarification. When referring to a structure, the term does not refer to an infinitely thin structure, but rather to a structure formed from substantially planar top and bottom surfaces, e.g., the top or bottom surface of each layer or a group of sequentially formed layers of a structure formed using a multi-material multi-layer electrochemical fabrication process, particularly when each layer is subjected to a planarization operation such as grinding, fly-cutting, chemical mechanical planarization, spreading by rotation, and the like. In some cases, a substantially planar structure may also mean that the structure or elements of the structure are small in height or thickness (i.e., the ratio of the vertical footprint to the thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200) as compared to the dimensions of the structure in two perpendicular dimensions. If the term is used with respect to a structure without clarification, it should be interpreted as meeting the substantially planar surface criteria of both the upper and lower surfaces. In some cases, the ratio requirement may also apply, i.e. a ratio of at least 25. When used with respect to a structure, the term should be construed in accordance with the particular definition.
As used herein, "relatively rigid" refers to a comparison of stiffness between two structural elements when the two structural elements are subjected to a working load or stress, wherein the relatively rigid structural element should reduce deflection or twist by at least a factor of 2, more preferably a factor of 5, and most preferably a factor of 10, as compared to the other structural element. If this term is used for structural elements without clarification, it should be interpreted to meet the requirement of a factor of 2. When used with respect to structural elements, the term should be construed in accordance with a particular definition.
As used herein, "nonlinear configuration" refers to a configuration that is not a straight rod-like configuration, particularly when applied to a physical structure or element. A nonlinear configuration is essentially a two-dimensional or three-dimensional configuration with features that include one or more bends or curves. For example, the planar nonlinear structure may be a planar spiral structure. As used herein, when referring to a spring, a nonlinear configuration does not refer to a force-deflection relationship unless such relationship is specifically and unambiguously indicated.
Probe with planar spring module:
The planar spring or planar flexible member of the present invention may be formed in a number of different ways and in a number of different configurations. Typically, the flexible element comprises a planar spring having a portion that extends from the stent to the tip or tip arm in a cantilevered or bridged manner over a gap or open area (e.g., two or more springs are connected to a common tip arm, often referred to herein as one or more cantilevered arms, starting from different lateral stent positions) into which the springs may deflect during normal operation. These flexible portions typically have a two-dimensional non-linear configuration in a transverse plane and have a thickness extending perpendicular to the plane (e.g., in a longitudinal direction), wherein the two-dimensional configuration may be in the form of a beam structure having a curved or angled configuration with a length that is substantially greater than its width, e.g., at least 5, 10, 20, or even 50 times or more in some variations, wherein the thickness is typically less than the length of the beam, e.g., at least 5, 10, 20, or even 50 times or more in some variations, or less than the transverse dimension of the spring element, e.g., 2, 5, 10, or even 20 times or more in some variations. In some embodiments, when the probe or module is formed from multiple adhesion layers, the plane of such a configuration may be parallel to the layer plane (e.g., the X-Y plane). The thickness of the spring (e.g., in the Z direction) may be a single layer thickness or may be a multiple layer thickness. In some embodiments, the flexible element comprises a plurality of spaced apart planar spring elements.
In some embodiments, the flexible element may comprise planar spring elements that are coupled to each other not only at the stent or end structures, but also at intermediate locations to the end elements. In some such embodiments, the planar spring element may begin at one end (e.g., a bracket or end arm), as one or more thickened springs having a relatively high spring constant, and then provide a reduced spring constant by removing some intermediate spring material between the top and bottom of the original spring structure, thereby transitioning from a small starting number of thicker planar flexible elements (e.g., 1,2, or 3 elements) to more thinner planar elements, wherein some of the original planar elements are separated into 2, 3, 4, 5, or more planar but thinner elements before reaching the other end (e.g., the end arm of the bracket), whereby, for example, spring constant, force requirements, overstroke, stress, strain, current carrying capacity, overall size, and other operating parameters may be tailored to meet the requirements of a given application.
Reference numerals are included in many of the figures 2 through 5E2, wherein like numerals are used to indicate like structures or features in different embodiments.
An exemplary spring module is shown in fig. 2-3. Fig. 2 depicts an isometric view of an exemplary spring module 200 having two undeflected spring elements 221-1 and 221-2, a base 201 spaced apart from the spring elements, and a connection support (e.g., a bracket or bridge) 211 bridging a longitudinal module gap MG between the spring elements and the base. In the example of fig. 2, each of the two spring elements takes the form of a planar radially extending spiral extending from the radially displaced bridge 211 via a downwardly extending portion of the end structure to a centrally or axially located end element 231. The springs are longitudinally separated by a gap SG. In this example, bridge 211 connects one end of each spring element together, while end element 231 connects the other ends of the spring elements together through an extension of the end structure. The end elements 231 are formed with a desired width TW and a desired end height TH extending above the upper spring, each spring element being formed of a desired material and formed with a desired beam thickness or spring height SH, a beam width or spring width SW, spacing between the spring turns CS, and a coiled beam length that allows the spring to deflect a desired amount without exceeding the elastic deflection limit of the structure and the associated materials forming the structure while providing a desired fixed or variable spring force within its deflection range. In particular, the length of the ends may be such that the module ends are capable of a desired compression towards the base without the base, bridge and spring element interfering with each other. In some embodiments, for example, the maximum travel distance of the end of each module may be as small as 5 μm (μm=micrometers) or less, or may be as large as 500 μm (e.g., 25 μm, 50 μm, 100 μm, or 200 μm) or more. For example, in some embodiments, the maximum travel distance of each module may be 25 μm to 200 μm, while in other example embodiments. The maximum travel distance of each module may be 50 μm to 150 μm. In some embodiments, the maximum travel distance of the tip may be set by a hard stop, such as by a spring or a deflected portion of the tip contacting the base, by a stop structure on the base, or possibly by a surface contacting the tip (e.g., a surface of an adjacent module) contacting an upper portion of the bridge. In other embodiments, the maximum travel distance may be achieved by the flexible spring or end portion contacting a soft stop or a reduced-flexibility structure. The force to achieve maximum deflection (or travel) may be as little as 0.1 gram force, to as much as 20 gram force or more. In some embodiments, a force target of 0.5 grams may be suitable. In other cases, 1 gram, 2 grams, 4 grams, 8 grams, or more may be suitable. In some embodiments, a module height MH (longitudinal dimension) of 50 μm or less may be targeted, while in other embodiments, a module height of 500 μm or greater may be targeted. In some embodiments, the total module radial diameter or width MW may be 100 μm or less, or 400 μm or more (e.g., 150 μm, 200 μm, or 250 μm). One or more spring beam elements of the module may have a spring height SH (e.g., 10, 20, 30, or 40 μm) from 1 μm or less to 100 μm or more, and a beam width or spring width SW (e.g., 10, 20, 30, or 40 μm) from 1 μm or less to 100 μm or more. The tip may have a uniform or varying geometry (e.g., cylindrical, rectangular, conical, multi-pronged, or other configuration, or combination of configurations). The ends (here joined to the spring beams) will typically have a cross-sectional width TW that is greater than the width SW of the beam or beams to which they are connected.
Fig. 3 shows an isometric view of a second exemplary spring module 300, which is similar to the module of fig. 2, except that the two spring elements are thicker, thus providing a greater spring constant than the elements of fig. 2. From another perspective, the example of fig. 3 will require more force for a given deflection, and therefore, will achieve a yield strength of the combined material and structural geometry (e.g., to the elastic deflection limit), which deflection is less than the example of fig. 2.
In other embodiments, the spring module may take a different form than that shown in fig. 2 or 3. For example: (1) The module may have a single spring element or more than two spring elements; (2) Each spring element may have a variation in one or more of width, thickness, length, or range of rotation; (3) the spring element may vary in length of the element; (4) The spring element may have a configuration other than a euler spiral, such as a rectangular spiral, a rectangular spiral with rounded corners, an S-shaped configuration, or a C-shaped configuration; (5) Each spring element may be connected to a plurality of bridge joints, for example to bridge connection points located 180 degrees, 120 degrees or 90 degrees around the module; (6) the bridge fittings may be located on different bridges; (7) The radial extent of the base element may be less than the spring/bridge joint so that when the modules are stacked, the base of a higher module may extend below the upper extent of a lower adjacent module when the ends of the modules are sufficiently compressed; (8) The module base may be replaced with additional springs that allow compression of the module springs from both directions upon deflection; (9) The probe tips may not be laterally centered (i.e., not coincident or even collinear with the compression principal axis or principal building axis when formed layer-by-layer) with respect to the overall lateral configuration of the module.
Fig. 4A-4D 4 provide various views of a probe 3400 or portions of the probe, where the probe is formed from two back-to-back (or base-to-base) modules, where the two modules share a common base having a ring-shaped configuration and comprising many different features: (1) An annular base or frame 3401 holding upper and lower coil spring arrays 3421-UC and 3421-LC by their outermost lateral extent to provide a basic bracing function between the upper and lower spring arrays, wherein the base or frame 3401 has a circular exterior with an interior opening with opposed arcuate sides 3401-a and narrower opposed flat sides 3401-F, wherein the upper and lower surfaces joining the flat sides provide attachment areas for joining with upper and lower supports or brackets 3411-1, 3411-2, 3412-1 and 3412-2 which then support the ends of the coil spring elements, while the arcuate areas provide a gap over which the outermost cantilevered portions of the springs can be located (prior to deformation), wherein the thickness of the base serves as a bracing spacer, wherein the portions of the coil springs can deflect toward each other during probe end compression; (2) Each of the upper and lower spring arrays begin its inward path from the opposite pair of brackets with two longitudinally separated pairs of coplanar coiled spiral cantilevers 3421-1U and 3421-2U (above the base) and 3421-1L and 3421-2L (below the base), each cantilever of each element being split into two longitudinally spaced cantilevers partway through its inward travel such that four upper cantilever elements UC1-UC4 join each side of the upper end arm 3431-UA and four lower cantilever elements LC1-LC4 join either side of the lower end arm 3431-LA, which in turn support contact or joining ends 3431-U and 3431-L, respectively; (3) The rotational orientation of the coil spring element joining the upper contact tips has an opposite rotational orientation relative to the spring element joining the lower contact tips; and (4) brackets 3411-1, 3411-2, 3412-1, and 3412-2 provide an intermediate bracket function only between the plurality of beams of the upper helical array and between the plurality of helical beams of the lower helical array, and not between the two spring sets, as that function is provided directly by base 3401.
Fig. 4A, 4B1, and 4B2 provide side, upper, and lower isometric views, respectively, of a probe 3400, wherein different features of the probe may be seen. Fig. 4B1 provides a view of the uppermost pair of coil springs of the upper spring section of the probe, while fig. 4B2 provides a view of the lowermost pair of coil springs of the lower spring section of the probe. Each of fig. 4A, 4B1, and 4B2 provides a view of the upper end 3431-U and the lower end 3431-L together with the central base 3401. Fig. 4A, 4B1 and 4B2 also provide views of upper brackets 3411-1 and 3411-2 and lower brackets 3412-1 and 3412-2, as well as views of the outer portions of longitudinally spaced apart upper and lower cantilever members 3421-1U and 3421-2U and 3421-1L and 3421-2L. It can also be seen that the staggered paths of the pairs of coplanar cantilever members extend inwardly from their respective brackets, meeting at respective central extremities.
Fig. 4C1 and 4C2 provide exploded isometric views of the probe 3400 from above and below, respectively, so that not only the bottom of the lower cantilever element and the top of the upper cantilever element can be seen, but also the top of the lower cantilever element and the bottom of the upper cantilever element, as well as the interior of the annular base 3401 including flat and arcuate side walls 3401-F and 3401-a. In fig. 4C1 and 4C2, the upper spring section or upper flexible element 3421-UC of the probe is separated from the central frame or base element 3401, which is in turn separated from the lower spring section or lower flexible element 3421-LC of the probe. The upper ends 3431-U, as well as the top of the upper and lower spring sections and the top of the center frame member can be seen in FIG. 4C 1. In fig. 4C2, the lower ends 3431-L can be seen, as well as the bottoms of the upper and lower spring sections 3421-UC and 3421-LC and the bottom of the central frame element 3401. As shown by the dashed lines connecting the break-down elements, the center frame element 3401 supports the outermost lateral extent of the upper and lower spring sections, and more particularly, the center frame element supports brackets 3411-1, 3411-2, 3412-1 and 3412-2 that support the cantilever elements.
Fig. 4D 1-4D 4 provide four different cross-sectional views of the probe 3400 with progressively larger portions of the probe sides cut away to reveal the internal structure of the probe so that cantilever variations are more readily seen and understood. As the spiral element rotates inwardly toward the laterally centered end element, the cantilever elements undergo a transition from two longitudinally spaced apart cantilever elements 3421-2U and 3421-1U above the base 3401 and two longitudinally spaced apart cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally spaced apart cantilever elements UC1-UC4 above the base and four longitudinally spaced apart elements LC1-LC4 below the base, wherein the beams reach their respective longitudinally movable end arm elements 3431-UA and 3431-LA (as best shown in fig. 4D 3) which then join or become ends 3431-U and 3431-L, respectively.
Fig. 4E1 provides a side view of a probe 3400 similar to fig. 4A except that 17 sample layer levels L1 through L17 are defined, each layer having a defined thickness along a longitudinal axis of the probe (i.e., the Z-axis shown), from which the probe can be fabricated, for example, by a multi-layer fabrication process, such as a multi-layer multi-material electrochemical fabrication process using a single or multiple structural materials (along with sacrificial materials) and using a build axis or layer stack axis corresponding to the longitudinal axis of the probe. In such a forming embodiment, although the probes may be formed one at a time, it is generally preferred that the probes are formed in batches by sequentially stacking layer by layer while forming hundreds or even thousands of probes.
Fig. 4E2-a through 4E9-B show cross-sectional configurations of eight unique configurations of layers L1-L17 shown in both top view (-a-view) and isometric view (-B-view).
Fig. 4E2-a and 4E2-B show views of layers L1 and L17, where the ends can be seen, which are the lower end 3431-L of layer L1 and the upper end 3431-U of layer L17.
Fig. 4E3-a and 4E3-B illustrate views of layers L2, L4, L6, and L8 that provide portions of planar spring spirals 3421-1L, 3421-2L and portions thereof forming the innermost region of cantilever sections LC 1-LC 4 (not labeled), portions of lower central end arm 3431-LA, and portions of lower brackets 3412-1 and 3412-2, wherein a double staggered spiral configuration may be seen.
Fig. 4E4-a and 4E4-B show views of layers L3 and L7, where incomplete spiral elements 3421-1L, 3421-2L and stents 3412-1 and 3412-2 (similar to the features of fig. 4E3-a and 4E3-B, but lacking LC1-LC4 portions) can be seen. The spiral portions reflected in these figures, in combination with the overlapping and underlying portions of fig. 4E3-a and 4E3-B, form thickened spiral sections in the outermost lateral portions of the spring, wherein the lower flexible elements 3421-LC comprise only two thickened cantilever elements, as opposed to four thinner cantilever elements LC1-LC4 connecting the end arms at the innermost portions of the spring.
Fig. 4E5-a and 4E5-B illustrate views of layer L5 including a portion of lower end arm 3431-LA and portions of brackets 3412-1 and 3412-2 that provide a connection between cantilever spring portions 3421-1L and 3421-2L.
Fig. 4E6-a and 4E6-B illustrate views of a layer L9 that includes an annular base 3401 that separates and connects the upper and lower flexible elements 3421-UC and 3421-LC by two portions of the base that serve as brackets, with some lateral portions of the base aligned with and engaging the springs in the bracket areas 3411-1, 3411-2, 3412-1 and 3412-2 of the springs. The actual onset of the inward spiral of probe 3400 depends on the interface of the features of layer L8 with the features of layer L9 and also on the interface of the features of layer L9 with the features of layer L10. In particular, the interface is not perpendicular to the local length of the wound helix (e.g., so as to provide a minimum width interface), but is formed at an angle such that the outer portion of the helix beam that interfaces with the base is supported along its length by a different amount than the inner portion. In some variations, the interface may be provided in a manner such that the interface is provided perpendicular to a local length of the beam, such that the support provided by the base (or other brace region) provides a laterally perpendicular or substantially perpendicular transition between the supported and unsupported beam regions. In particular, in the interface formed by layers L4 and L5, L5 and L6, L12 and L13, and L13 and L14, and in other beam dividing regions (such as layers L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16), it can be seen that vertical transitions are provided in other beam-to-bracket regions, with the beam transitions extending along transverse lines that are substantially perpendicular to the instant or local length of the beam. Such perpendicular and non-perpendicular handoffs and their consistent or varying uses may be used to tailor probe performance or operational characteristics. In particular, the outer portion of the cantilever is provided as a single thick beam due to the non-perpendicular interface with the base and due to the interface provided by and between the other beams of the cantilever, while the inner portion of the cantilever structure begins as two medium thickness beams, the cantilever ending as four thinner beams at the probe arm. In some variations, the initial cantilever structures (as they move laterally away from the base) may start with a single thick beam or multiple beams across the width. Other transitions along the length of the beam may also be provided to provide a flat or vertical transition, or may be provided to provide a variable or non-vertical transition. Fig. 4E7-a and 4E7-B illustrate views of layers L10, L12, L14, and L16, which provide: (1) Portions of upper planar spring coils 3421-1U and 3421-2U form the innermost extensions of cantilever portions UC1 through UC4 (not labeled); (2) Portions of the upper central terminal arm 3431-UA and portions of the upper brackets 3411-1 and 3411-2, in which a double interlaced helical configuration can be seen. These are upper flex elements that correspond to the features of the lower flex elements shown in fig. 4E3-a and 4E 3-B. Comparison of these figures shows that the rotational orientation of the spirals of the upper and lower flexible elements have opposite rotational orientations. in some cases, this reversal of direction may be considered beneficial, while in other cases it is unnecessary or even detrimental. Upon compression of the spring element, the tip may tend to rotate in a direction opposite to the inward rotation of the spiral element, which may result in a brushing or scraping effect that may help to crack or damage the oxide coating to the contacted surface. The reversal of the brushing direction between the lower and upper probe ends may or may not be desirable and may therefore be taken into account in the initial probe design. Similarly, a reversal of the relative direction of the separate upper spring elements is possible, and a reversal of the direction of the separate lower spring elements is also possible.
Fig. 4E8-a and 4E8-B show views of layers L11 and L15 where incomplete helical elements 3421-1U and 3421-2U and the connection areas of stents 3411-1 and 3411-2 can be seen bridging the portions of the helix of fig. 4E7-a and 4E7-B to form a thickened helical section in the outermost lateral portion of the spring, where the upper flexible element 3421-UC comprises only two thickened elements as opposed to four thinner elements joining the end arms 3431-UA at the innermost lateral regions of the helix. Fig. 4E8-a and 4E8-B provide an upper flexible element corresponding to the lower flexible element shown in fig. 4E4-a and 4E 4-B.
Fig. 4E9-a and 4E9-B illustrate views of layer L13, which includes a portion of upper end arm 3431-UA and portions of brackets 3411-1 and 3411-2U, which provide a connection between cantilevers 3421-1U and 3421-2U. Fig. 4E9-a and 4E9-B provide images of portions of the upper flexible element corresponding to the lower flexible element counterparts found in fig. 4E5-a and 4E 5-B.
Many additional variations of the probes of fig. 4A-4E 9-B are possible and will be apparent to those skilled in the art upon reading the teachings herein, and include, for example: (1) a change in material; (2) Variations in configuration, including the number of rotations or partial rotations each spring element contains, the number of staggered springs used at each longitudinal stage, the number of longitudinally spaced springs used (e.g., even, odd, etc.), the number and location of longitudinal beam transitions occurring along the length of the spiral, the direction of rotation of successive spirals (e.g., CW-CCW-CW-CCW, CW-CCW-CCW-CW, etc.), the shape of the tip, the width and thickness of the cantilever beam; (3) Using a mount that separates one or both of the upper and lower spring modules from the annular frame, (4) using a mount that is closer to the center portion of the probe than to the outer periphery of the probe; (5) Using different types of frames or base structures and/or openings in the frames and base structures; (6) Using a spring structure that is not a coplanar staggered pair of spirals supported by different stents, but a single spiral at a given longitudinal stage or more than two staggered spirals at a given longitudinal stage; and (7) variations from the features of other embodiments and aspects set forth herein and variations thereof.
Fig. 5 A1-5 A4 provide various views of a probe 3500 having a probe body 3504 and a retaining ring 3501, including two full probe isometric views (fig. 5A1 and 5 A4), a side view (fig. 5 A3) and a cross-sectional view (fig. 5 A2), the cross-sectional view showing the rear half of the probe (i.e., the front of the probe has been removed), including the rear halves of the upper and lower flexible elements as spring assemblies 3521-U and 3521-L, the upper and lower probe arms 3531-UA and 3531-LA, the upper and lower probe ends 3531-U and 3531-L with the right side bracket removed and the upper left side bracket 3511-2 located behind the cut line.
More specifically, the first flexible element 3521-U provides flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first flexible element functionally links the at least one scaffold, a second portion of the first flexible element functionally links the first end arm or upper probe arm 3531-UA, which terminates in a first end or upper probe end 3531-U that is resiliently movable relative to the at least one scaffold, wherein the first end arm 3531-UA directly or indirectly retains the first end that extends longitudinally beyond the first end of the at least one scaffold when the first flexible element 3531-U is unbiased.
Furthermore, the second flexible element 3521-L provides flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second flexible element functionally links the at least one scaffold, a second portion of the second flexible element functionally links the second end arm or lower probe arm 3531-LA, which terminates in a second end or lower probe end 3531-L that is resiliently movable relative to the at least one scaffold, wherein the second end arm 3531-LA directly or indirectly retains the second end that extends longitudinally beyond the second end of the at least one scaffold when the second flexible element 3521-L is unbiased.
According to an embodiment, the first flexible element 3521-U comprises a two-dimensional substantially planar spring when unbiased, such that the first flexible element provides flexibility in a direction substantially perpendicular to the planar configuration, and the second flexible element 3521-L comprises a spring.
Alternatively, both first flexible element 3521-U and second flexible element 3521-L include respective two-dimensional substantially planar springs.
Fig. 5B provides a partially transparent isometric view of an upper array plate portion (i.e., single hole portion) 3540-U, wherein the upper through hole 3541-U is a constant diameter through hole sized to allow the probe body 3504 to pass therethrough, but not the retaining ring 3501.
Fig. 5C provides a partially transparent isometric view of a lower array plate portion (i.e., single hole portion) 3540-L having a stepped lower through hole 3541-L with an upper portion 3541-L1 of the stepped lower through hole being a larger diameter upper portion and a lower portion 3541-L2 being a smaller diameter lower portion, wherein the smaller diameter lower portion 3541-L2 is sized to allow passage of the probe body 3504 but not of the retaining ring 3501, and the larger diameter upper portion 3541-L2 is sized to receive the retaining ring 3501 (laterally and longitudinally).
Fig. 5D1 to 5D3 illustrate a first process of loading probes 3500 into an array plate assembly including upper and lower array plates 3540-U and 3540-L using the probe array part of fig. 5B and 5C and the probes 3500 of fig. 5A1, wherein the probes 3500 are first positioned in the lower array plate 3540-L and then the upper array plate 3540-U is added, wherein fig. 5D1 illustrates two array plates separated from the probes 3500 and loading direction arrows 3545, fig. 5D2 illustrates a process after loading the probes 3500 into upper and lower portions 3541-L1 and 3541-L2 of stepped lower through holes 3541-L in the lower array plate 3540-L, and fig. 5D2 illustrates a completed assembly, before loading the upper array plate 3540-U onto the probe 3500 and lower array plate 3540-L partial assembly. The opening size of the through holes in the plates, and in particular the opening sizes of the upper and lower portions 3541-L1 and 3541-L2 of the stepped lower through holes 3541-L in the lower array plate 3540-L, are determined by the requirements of the capture and retention probes 3500 and by the required positioning and alignment tolerances.
Fig. 5E1 to 5E3 illustrate a second process of loading probes 3500 into an array panel assembly including upper and lower array panels 3540-U and 3540-L using the array portions of fig. 5B and 5C and probes 3500 of fig. 5A1, wherein the probes 3500 are first positioned in openings of respective upper through holes 3541-U in the upper panel 3540-U and then enter openings of upper and lower portions 3541-L1 and 3541-L2 of respective stepped lower through holes 3541-L in the lower array panel 3540-L, wherein fig. 5E1 illustrates upper and lower array panels 3540-U and 3540-L separated from the probes 3500 and loading arrows 3545, fig. 5E2 illustrates a process prior to loading a portion of the assembly of probes 3500 and upper array panel 3540-U into the lower array panel 3540-L after loading the probes 3500 into the upper array panel 3540-U, and fig. 5E3 illustrates a complete stacked assembly.
Various alternatives to the embodiment of fig. 5 A1-5E 3 are possible, including, for example: (1) Patterning a plurality of holes in two plates such that the positions and sizes of the plurality of holes are suitable for the probes to be positioned in each hole, whether or not the sizes of all probes in the array are the same, (2) the configuration of the holes in the plates and the probe body and associated mounting features may be non-circular and/or specifically tailored for selected-direction insertion or even single-direction insertion, and for right-side-up insertion only; (3) The mounting structure, such as an annular base, may be replaced by one or more alternative structures, such as a plurality of individual tabs; (4) Instead of only one plate having an opening with a shoulder or countersink, both plates may have openings in which the depths of the shoulders are similar or different and the depths of the through hole portions are similar or different; (5) Either or both plates may retain alignment features in the form of: through holes, blind holes, channels, patterned dimples, and/or features extending from the planar panel surface and in a pattern complementary to the holes in the mating panel; (6) The probe-mating holes or alignment holes may include tapered sidewalls to aid in probe placement or board mating; (7) The plate extension may include tapered surfaces to aid in the plate mating; and (8) other variations described with respect to other embodiments set forth herein or incorporated by reference herein. In most practical implementations, the array plate will each include a plurality of through holes in a desired array pattern. In some variations, the array plate may be limited to a dielectric and the probes may be limited to a conductive material. In other variations, the array plate may include conductive elements (e.g., traces) that provide electrical contact with some or all of the probes, while the probes include dielectric elements that provide electrical isolation of different elements in a single probe or between adjacent probes.
Further comments and conclusions:
Many embodiments have been set forth above, but many other embodiments are possible without departing from the spirit of the present invention. Some of these additional embodiments may be based on a combination of the teachings herein with the various teachings incorporated by reference herein. Some fabrication embodiments may use a multi-layer electrochemical deposition process, while other fabrication embodiments may not. Some embodiments may use a combination of selective and blanket deposition processes, while other embodiments may not use both, and still other embodiments may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and/or may not use a planarization process in forming successive layers. Some embodiments may use a selective deposition process or a blanket deposition process on some layers that are not electrodeposition processes. For example, some embodiments may use nickel (Ni), nickel-phosphorus (Ni-P), nickel-cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chromium alloy (chrome), chromium copper (CrCu), other palladium alloys, copper silver alloys as structural or sacrificial materials, while other embodiments may use different materials. For example, some of the above materials may be preferentially used for their elastic properties, while others may be used for their enhanced electrical conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength at high temperatures or high thermal conductivity), while some may be selected for their adhesive properties, detachability from other materials, and even other properties of interest for use in a desired application or use. Other embodiments may use different materials or different combinations of materials, including dielectrics (e.g., ceramics, plastics, photoresists, polyimides, glass, ceramics, or other polymers), other metals, semiconductors, etc. as structural, sacrificial, or pattern materials. For example, some embodiments may use copper, tin, zinc, solder, photoresist, or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or different portions of a single layer. Some embodiments may remove the sacrificial material, while other embodiments may not. Some embodiments may form a probe structure, while other embodiments may use the spring module of the present invention for non-probing purposes (e.g., to bias other operating devices with a desired spring force or flexible engagement).
It should also be understood that the probe elements of some aspects of the invention may be formed in processes that are very different from those set forth herein, and that it is not meant that structural aspects of the invention need be formed by only or be apparent from those processes taught herein.
Although headings are provided for each section of this specification, the headings are not meant to limit the teachings in one section of the specification from being applied to other sections of the specification. For example, an alternative that is recognized in association with one embodiment is intended to be adaptable to all embodiments as long as the features of the different embodiments render such applications functional and do not contradict or eliminate all advantages of the embodiments employed.
It is intended that any aspect of the invention described herein represents a separate invention description that applicant regards as a comprehensive and complete invention description that applicant regards as may be presented as a separate claim without introducing additional limitations or elements from other embodiments or aspects set forth herein for purposes of explanation or clarity, and that, once written, it is not necessary to explicitly present in such separate claims. It should also be understood that any variation of the aspects set forth herein represents independent and independent features that may form separate independent claims, be added separately to the independent claims, or be added as dependent claims to further define the invention as claimed by these respective dependent claims, if written.
Many other embodiments, designs, and alternatives in use of the invention will be apparent to those skilled in the art in view of the teachings herein. Thus, the invention is not intended to be limited to the specific illustrative embodiments, alternatives, and uses described above, but is to be limited only by the claims presented below.