The present application claims priority and benefit from U.S. patent application Ser. No. 18/295,721, filed 4/2023, and U.S. patent application Ser. No. 63/328,661, filed 4/2022, the disclosures of which are incorporated herein by reference in their entireties.
Detailed Description
General electrochemical fabrication
Fig. 1A-1I illustrate side views of various states in an exemplary multi-layer, multi-material electrochemical fabrication process. Fig. 1A-1G illustrate various stages of single layer formation of a multi-layer fabrication process in which a second metal is deposited over and in openings in a first metal such that the first and second metals form a portion of the layer. In fig. 1A, a side view of a substrate 82 having a surface 88 onto which a patternable photoresist 84 is positioned as shown in fig. 1B. In fig. 1C, a resist pattern resulting from curing, exposing, and developing of a resist is shown. Patterning of the photoresist 84 results in openings or holes 92 (a) -92 (c) extending from the surface 86 of the photoresist through the thickness of the photoresist to the surface 88 of the substrate 82. In fig. 1D, a metal 94 (e.g., nickel) is shown as having been electroplated into openings 92 (a) -92 (c). In fig. 1E, the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate to expose areas of the substrate 82 not covered by the first metal 94. In fig. 1F, a second metal 96 (e.g., silver) is shown as having been blanket plated over the entire exposed portion of the substrate 82 (which is conductive) and over the first metal 94 (which is also conductive). Fig. 1G depicts a completed first layer of the structure, the first layer being obtained by planarizing the first and second metals down to a height that exposes the first metal and sets the thickness of the first layer. In fig. 1H, the result of repeating the process steps shown in fig. 1B to 1G several times to form a multi-layer structure, wherein each layer is composed of two materials, is shown. For most applications, as shown in FIG. 1I, one of these materials is removed to produce the desired 3-D structure 98 (e.g., component or device) or a plurality of such structures.
Various embodiments of aspects of the present application are directed to forming three-dimensional structures from materials, some or all of which may be electrodeposited or electroless deposited (as illustrated in the examples of fig. 1A-1I, and as discussed in various patent applications incorporated herein by reference). Some of these structures may be formed from a single build layer formed from one or more deposited materials, while other structures are formed from multiple build layers, each build layer comprising at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers). In some embodiments, the layer thickness may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used, while in other embodiments thicker layers may be used. In some embodiments, the micro-scale structures have lateral features positioned with 0.1-10 micron scale accuracy, and the minimum feature size is on the order of a few microns to tens of microns. In other embodiments, structures with less precise feature layouts and/or larger minimum features may be formed. In other embodiments, greater precision and smaller minimum feature sizes may be required. In the present application, mesoscale and millimeter scale have the same meaning, meaning that one or more dimensions of the device can extend to the range of 0.5-50 millimeters or more, and the positioning accuracy of the features is in the range of micrometers to 100 micrometers, with minimum feature sizes on the order of tens of micrometers to hundreds of micrometers.
Various embodiments, alternatives, and techniques disclosed herein may use a single patterning technique on all layers or different patterning techniques on different layers to form a multi-layer structure. For example, various embodiments of the present invention may perform selective patterning operations using conformal contact masks and masking operations (i.e., operations using masks that contact but do not adhere to a substrate), proximity masks and masking operations (i.e., operations using masks through which the substrate is at least partially selectively shielded even without contact), non-conformal masks and masking operations (i.e., masks and operations based on masks whose contact surfaces are not significantly conformal), and/or adhesion masks and masking operations (operations using masks and masks that adhere to a substrate, selective deposition or etching occurring on a substrate as opposed to just contacting a substrate). The conformal contact mask, proximity mask, and non-conformal contact mask have a common property in that they are preformed and brought into or near the surface to be treated (i.e., the exposed portion of the surface to be treated). These masks can typically be removed without damaging the masks or the surfaces that they contact or are positioned in close proximity to the surface being treated. The adhesion masks are typically formed on (i.e., portions of) the surface to be treated and adhered to the surface such that they cannot be separated from the surface without being completely destroyed or damaged to be no longer usable. The adhesion mask may be formed in a variety of ways, including: the mask is formed directly (1) by applying a photoresist, selectively exposing the photoresist, and then developing the photoresist, (2) selectively transferring the pre-patterned mask material, and/or (3) by computer controlled deposition of material. In some embodiments, the adhesion mask material may be used as a sacrificial material for a layer, or may be used only as a mask material that is replaced by another material (e.g., dielectric or conductive material) prior to completion of formation of the layer, where the replacement material is to be considered as a sacrificial material for the respective layer. The mask material may or may not be planarized before or after depositing the material into the voids or openings contained therein.
Patterning operations may be used to selectively deposit material and/or may be used to selectively etch material. The selectively etched regions may be selectively filled or filled with different desired materials via blanket deposition or the like. In some embodiments, layer-by-layer build-up may include forming portions of multiple layers simultaneously. In some embodiments, deposition associated with some layer heights may result in deposition to areas associated with other layer heights (i.e., areas located within top and bottom boundary heights defining the geometry of different layers). Such use of selective etching and/or staggered material deposition in connection with multiple layers is described in U.S. patent application Ser. No.10/434,519 to Smalley, 5/7/2003, now U.S. patent 7,252,861, entitled "method and apparatus for electrochemically fabricating structures by staggered layers or by selectively etching and filling voids" (Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids)"., which is incorporated herein by reference.
The temporary substrate on which the structures may be formed may be of a sacrificial type (i.e., damaged or destroyed during separation of the deposited materials to the extent that they cannot be reused) or non-sacrificial type (i.e., not damaged or excessively destroyed, i.e., not destroyed to the extent that they cannot be reused), e.g., with a sacrificial layer or release layer located between the substrate and the initial layer of the formed structure. Non-sacrificial substrates may be considered reusable with little or no rework (e.g., by re-planarizing one or more selected surfaces or applying a release layer, etc.), although they may or may not be reused for various reasons.
Those skilled in the art will understand the definitions of the various terms and concepts that may be used to understand the embodiments of the application (the apparatus itself, some methods of making the apparatus, or some methods of using the apparatus). Some such terms and concepts are discussed herein, while other such terms are set forth in various patent applications (e.g., U.S. patent application Ser. No.16/584,818) for which the present application claims priority and/or which are incorporated herein by reference.
As used herein, "longitudinal" refers to the long dimension of the probe, the end-to-end dimension of the probe, or the end-to-end dimension of the probe. Longitudinal may refer to a generally straight line extending from one end of the probe to the other end of the probe, or it may refer to a curved or stepped path having an incline or even varying direction along the height of the probe. When referring to a probe array or probes to be loaded into an array configuration, the longitudinal dimension may refer to a particular direction in which the probes in the array are pointing or extending, but it may also refer simply to the overall height of the array, starting from a plane containing the first ends, ends or bases of a plurality of probes, and extending perpendicular to that plane to a plane containing the second ends, ends or tops of the probes. In particular, the context of use will generally be clear to those skilled in the art. The term should be interpreted herein in a narrow sense as possible, depending on the details of the description provided or the context in which the term is used. However, if such a narrow interpretation cannot be guaranteed, the broadest reasonable interpretation scope is intended to apply.
As used herein, "transverse" is related to the term longitudinal. By stacking of layers, transverse refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions lying in a layer plane substantially perpendicular to the layer stacking direction). When referring to a probe array, the lateral direction generally has a similar meaning, as the lateral dimension is generally the dimension lying in a plane parallel to the top or bottom plane of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to the probe itself, the lateral dimension may be a dimension perpendicular to the overall longitudinal axis of the probe, the local longitudinal axis of the probe (i.e., the local lateral dimension), or simply a dimension similar to that described in the array or layer. In particular, the context of use will generally be clear to those skilled in the art. The term should be interpreted herein in a narrow sense as possible, depending on the details of the description provided or the context in which the term is used. If such a narrow interpretation cannot be guaranteed, the broadest reasonable interpretation scope is intended to apply.
"Substantially parallel" as used herein means parallel or nearly parallel, i.e., having a parallelism within 15 °, more preferably having a parallelism within 10 °, even more preferably having a parallelism within 5 °, and most preferably having a parallelism within 1 °. If the term is used without clarification, it should be interpreted as having a parallelism of within 15 °. When used with a particular clarification, the terminology should be interpreted in accordance with the particular description.
As used herein, "substantially perpendicular" or "substantially orthogonal" means perpendicular or nearly perpendicular, i.e., perpendicularity is within 15 °, more preferably perpendicularity is within 10 °, even more preferably perpendicularity is within 5 °, and most preferably perpendicularity is within 1 °. If the term is used without clarification, it should be interpreted as having a perpendicularity of less than 15 °. When used with a particular clarification, the terminology should be interpreted in accordance with the particular description.
As used herein, when referring to a surface "substantially planar" it is intended to be a planar surface, although as will be appreciated by those skilled in the art, there may be some imperfections (i.e., imperfections that may deviate from planarity by as much as 1-5 microns, but are typically sub-micron in nature when referring to millimeter-scale and micron-scale devices of the primary device embodiments as described herein). If the term is used without clarification, it should be interpreted as a defect that deviates from planarity by no more than 5 microns. When used with a particular clarification, the terminology should be interpreted in accordance with the particular description. When referring to a structure, the term does not refer to an infinitely thin structure, but rather to a structure formed with substantially planar top and bottom surfaces, e.g., top and bottom surfaces of each layer or a group of continuously formed layers of a structure formed using a multi-material, multi-layer electrochemical fabrication process, particularly when each layer is subjected to planarization operations such as grinding, fly-cutting, chemical mechanical planarization, spin-coating, and the like. In some cases, a substantially planar structure may also mean that the structure or elements of the structure are small in height or thickness (i.e., the ratio of vertical footprint to thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200) as compared to the dimensions of the structure in two perpendicular dimensions. If the term is used for a structure without clarification, it should be interpreted as meeting the substantially planar surface criteria of the upper and lower surfaces. In some cases, the ratio requirement, i.e. a ratio of at least 25, may also be applicable. When used in connection with a particular clarification, the term should be interpreted in accordance with the particular clarification.
As used herein, "relatively rigid" refers to a comparison of rigidity between two structural elements when the two structural elements are subjected to a working load or stress, wherein the relatively rigid structural element should undergo at least 2 times, more preferably 5 times, and most preferably 10 times less deflection or distortion than the other structural element. If this term is used for a structure without clarification, it should be interpreted to fulfill a 2-fold requirement. When used with a particular clarification for structural elements, the terms should be interpreted according to the particular description.
As used herein, "nonlinear configuration" refers to a configuration that is not a straight bar configuration, particularly when applied to a physical structure or element. The nonlinear configuration will be a two-dimensional or three-dimensional configuration in nature having features that include one or more bends or curves. For example, the planar nonlinear structure may be a flat spiral structure. As used herein, when referring to a spring, a non-linear configuration does not refer to a force-deflection relationship unless such relationship is specifically and explicitly noted.
Probe with planar spring module:
The planar spring or planar compliance element of the present invention may be formed in a number of different ways and in a number of different configurations. Typically, the compliant element comprises a planar spring having a portion extending from the bracket to the tip or tip arm in a cantilevered or bridged manner over a gap or opening area (e.g., two or more springs starting at different lateral bracket positions and joined to a common tip arm, generally referred to herein as a cantilever or cantilevers) into which the springs can deflect during normal operation. These compliant portions typically have a two-dimensional non-linear configuration in a transverse plane and a thickness extending perpendicular to the plane (e.g., in a longitudinal direction), wherein the two-dimensional configuration may be in the form of a beam structure having a curved or angled configuration that is much longer than its width, such as at least 5, 10, 20, or even 50 times or more in some variations, wherein the thickness is typically less than the length of the beam, such as at least 5, 10, 20, or even 50 times or more in some variations, or less than the transverse dimension of the spring element, such as 2,5, 10, or even 20 times or more in some variations. In some embodiments, when the probe or module is formed from multiple adhesion layers, the plane of such a configuration may be parallel to the layer plane (e.g., the X-Y plane). The thickness of the spring (e.g., in the Z-direction) may be a single layer thickness or may be a multiple layer thickness. In some embodiments, the compliant element comprises a plurality of spaced apart planar spring elements.
In some embodiments, the compliant element may include planar spring elements that are not only interconnected at the stent or end structure, but also interconnected at intermediate locations of such end elements. In some such embodiments, the planar spring element may begin with one end (e.g., a bracket or end arm) as one or more thickened springs having a relatively high spring constant, and then provide a reduced spring constant by removing some intermediate spring material between the top and bottom of the original spring structure, such that a smaller number of planar compliant elements (e.g., 1,2, or 3 elements) but large in thickness initially transition to a larger number of thinner planar elements, with some of the original planar elements being divided into 2,3,4,5, or more planar but thinner elements before reaching the other end (e.g., end arm of the bracket), whereby, for example, spring constants, force requirements, over travel, stress, strain, current carrying capacity, overall size, and other operating parameters may be tailored to meet the requirements of a given application.
Reference numerals are included in many of the figures 2 through 5E2, where the same reference numerals are used to designate similar structures or features in different embodiments.
An example spring module is shown in fig. 2-3. Fig. 2 depicts an isometric view of an example spring module 200 having two undeflected spring elements 221-1 and 221-2, a base 201 spaced apart from the spring elements, and a connection support (e.g., a bracket or bridge) 211 bridging a longitudinal module gap MG between the spring elements and the base. In the example of fig. 2, each of the two spring elements takes the form of a planar radially extending spiral that extends from the radially displaced bridge 211 to the centrally or axially located end element 231 via a downwardly extending portion of the end structure. The springs are longitudinally separated by a gap SG. In this example, bridge 211 connects one end of each spring element together, while end element 231 connects the other ends of the spring elements together via an extension of the end structure. The end elements 231 are formed with a desired width TW and a desired end height TH extending above the upper springs, and each spring element is formed with a desired material, beam thickness or spring height SH, beam width or spring width SW, spacing CS between spring coils, and coil beam length that allow the springs to deflect a desired amount without exceeding the elastic deflection limits of the structure and the associated materials with which the structure is formed, while providing a desired fixed or variable spring force over its deflection range. in particular, the length of the ends may be such that the desired compression of the module ends towards the base can occur without the base, bridge and spring element interfering with each other. For example, in some embodiments, the maximum travel distance of the end of each module may be as small as 5 μm (μm=micrometers) or less, or as large as 500 μm (e.g., 25 μm, 50 μm, 100 μm, or 200 μm) or more. For example, in some embodiments, the maximum travel distance of each module may be 25 μm to 200 μm, while in other example embodiments, the maximum travel distance of each module may be 50 μm to 150 μm. In some embodiments, the maximum travel distance of the tip may be set by a hard stop, such as by a spring or a deflected portion of the tip contacting the base, by a stop structure on the base, or possibly by contacting a surface of the tip (e.g., a surface of an adjacent module) with an upper portion of the bridge. In other embodiments, the maximum travel distance may be achieved by the compliant spring or end portion contacting a soft stop or compliant structure. The force to achieve maximum deflection (or travel) may be as little as 0.1 gram force to as much as 20 gram force or more. In some embodiments, a force target of 0.5 grams may be suitable. In other embodiments, 1 gram, 2 grams, 4 grams, 8 grams, or more may be suitable. In some embodiments, a module height MH (longitudinal dimension) of 50 μm or less may be targeted, while in other embodiments, a module height of 500 μm or more may be targeted. In some embodiments, the total module radial diameter or width MW may be 100 μm or less or 400 μm or more (e.g., 150 μm, 200 μm, or 250 μm). One or more spring beam elements of the module may have a spring height SH from 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm) and a beam width or spring width SW from 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm). The tips may have a uniform or varying geometry (e.g., having a cylindrical, rectangular, conical, multi-pronged, or other configuration, or a combination of various configurations). The ends, where joined to the spring beams, typically have a cross-sectional width TW that is greater than the width SW of the beam or beams to which they are connected.
Fig. 3 depicts an isometric view of a second example spring module 300, which is similar to the module of fig. 2, except that the two spring elements are thicker and thus provide a greater spring constant than the elements of fig. 2. From another perspective, the example of fig. 3 will require more force for a given deflection, and therefore, will reach the yield strength of the combined material and structure geometry (e.g., reach the elastic deflection limit) with less deflection than the example of fig. 2.
In other embodiments, the spring module may take a form different than that shown in fig. 2 or 3. For example: (1) The module may have a single spring element or more than two spring elements; (2) Each of the spring elements may vary in one or more of width, thickness, length, or degree of rotation; (3) the spring element may vary in length of the element; (4) The spring element may have a configuration other than euler spirals, such as a rectangular spiral, a rectangular spiral with rounded corners, an S-shaped structure or a C-shaped structure; (5) Individual spring elements may be connected to more than one bridge connection point, for example to a bridge connection point located 180 degrees, 120 degrees or 90 degrees around the module; (6) The bridge connection points may be located on different bridges; (7) The base element may have a smaller radial extent than the spring/bridge connection point so that when the modules are stacked, the base of a higher module may extend below the upper extent of a lower adjacent module with the ends of the modules fully compressed; (8) The module base may be replaced with additional springs that allow the module springs to compress from both directions when deflected, (9) the probe tip may not be centered laterally relative to the overall transverse configuration of the module (i.e., not coincident or even collinear with the principal axis of compression or principal building axis when formed on a layer-by-layer basis).
Fig. 4A-4D 4 provide various views of a probe 3400 or portions of such a probe, where the probe is formed from two back-to-back (or base-to-base) modules that share a common base having an annular configuration and include many different features: (1) An annular base or frame 3401 holding upper and lower coil spring arrays 3421-UC and 3421-LC by their outermost lateral extent to provide a basic bracing function between the upper and lower coil spring arrays, wherein the base or frame 3401 has a circular exterior with an interior opening having opposed arcuate sides 3401-a and narrower opposed flat sides 3401-F, wherein the upper and lower surfaces joining the flat sides provide attachment areas for joining with upper and lower supports or brackets 3411-1, 3411-2, 3412-1 and 3412-2 (the upper and lower supports or brackets in turn supporting the ends of the coil spring elements) while the arcuate areas provide clearance over which the outermost cantilevered portions of the springs can lie (prior to deformation), wherein the thickness of the base acts as a bracing spacer into which portions of the coil springs can deflect during compression of the probe ends toward each other; (2) Each of the upper and lower spring arrays begin with opposing pairs of brackets with their inward path as two pairs of longitudinally spaced apart coplanar coiled helical cantilevers 3421-1U and 3421-2U and 3421-1L and 3421-2L above and below the base, with each cantilever of each element divided into two longitudinally spaced apart cantilevers partway through their inward travel such that four upper cantilever elements UC1-UC4 join each side of the upper end arm 3431-UA and four lower cantilever elements LC1-LC4 join either side of the lower end arm 3431-LA, which in turn support contact or joining ends 3431-U and 3431-L, respectively; (3) The rotational orientation of the coil spring element connecting the upper contact tips has an opposite rotational orientation relative to the coil spring element connecting the lower contact tips; and (4) brackets 3411-1, 3411-2, 3412-1, and 3412-2 provide only an intermediate bracket function between the plurality of beams of the upper helical array and between the plurality of helical beams of the lower helical array, and do not provide a bracket function between the two spring sets, as that function is provided directly by base 3401.
Fig. 4A, 4B1, and 4B2 provide side, upper, and lower isometric views, respectively, of a probe 3400, wherein different features of the probe may be seen. Fig. 4B1 provides a view of the uppermost pair of coil springs of the upper spring portion of the probe, while fig. 4B2 provides a view of the lowermost pair of coil springs of the lower spring portion of the probe. Each of FIGS. 4A, 4B1, and 4B2 provides a view of the upper and lower ends 3431-U, 3431-L and the central base 3401. Fig. 4A, 4B1 and 4B2 also provide views of upper brackets 3411-1 and 3411-2 and lower brackets 3412-1 and 3412-2, as well as views of the outer portions of longitudinally separated upper and lower cantilever members 3421-1U and 3421-2U and 3421-1L and 3421-2L. It can also be seen that the staggered paths of the pairs of coplanar cantilever members extend inwardly from their respective brackets, meeting at their respective central ends.
Fig. 4C1 and 4C2 provide exploded isometric views of probe 3400 from above and below angles, respectively, such that not only the bottom of the lower cantilever element and the top of the upper cantilever element, but also the top of the lower cantilever element and the bottom of the upper cantilever element, and the interior of annular base 3401, including flat side walls 3401-F and arcuate side walls 3401-a, can be seen. In fig. 4C1 and 4C2, the upper spring portion or upper compliant element 3421-UC of the probe is separated from the central frame or base element 3401, which in turn is separated from the lower spring portion or lower compliant element 3421-LC of the probe. The top of the upper extremities 3431-U and the upper and lower spring sections and the top of the central frame element can be seen in fig. 4C 1. The bottom of the lower ends 3431-L and the upper and lower spring portions 3421-UC and 3421-LC and the bottom of the central frame element 3401 can be seen in FIG. 4C 2. As can be seen from the dashed lines connecting the break-down elements, the central frame element 3401 supports the outermost lateral extent of the upper and lower spring portions and more specifically supports brackets 3411-1, 3411-2, 3412-1 and 3412-2 which support those cantilever elements.
Fig. 4D 1-4D 4 provide four different cross-sectional views of probe 3400 with progressively larger portions of one side of the probe cut away to reveal the internal structure of the probe so that cantilever variations can be more easily seen and understood. As the spiral element rotates inwardly toward the laterally centered end element, the cantilever elements undergo a transition from two longitudinally separated cantilever elements 3421-2U and 3421-1U above the base 3401 and two longitudinally separated cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally separated cantilever elements UC1-UC4 above the base and four longitudinally separated elements LC1-LC4 below the base, where the beams reach their respective longitudinally movable end arm elements 3431-UA and 3431-LA (best seen in FIG. 4D 3), which in turn join or become ends 3431-U and 3431-L, respectively.
Fig. 4E1 provides a side view of probe 3400 similar to fig. 4A, but identifies 17 sample layer heights L1 through L17, where each layer has an identified thickness along a probe longitudinal axis (i.e., the Z-axis shown), whereby the probe can be fabricated, for example, via a multi-layer fabrication process, such as a multi-layer, multi-material electrochemical fabrication process using a single or multiple structural materials (along with sacrificial materials) and using a build axis or layer stack axis corresponding to the probe longitudinal axis. In such a forming embodiment, although the probes may be formed one at a time, it is generally preferred to form the probes in batches, i.e., hundreds or even thousands of probes are formed simultaneously by successive layer-by-layer stacks.
Fig. 4E2-a through 4E9-B illustrate the cross-sectional configurations shown in top view (-a view) and isometric view (-B view) of eight unique configurations of layers L1-L17.
Fig. 4E2-a and 4E2-B show views of layer L1 and layer L17, where the ends can be seen, which are the lower ends 3431-L of layer L1 and the upper ends 3431-U of layer L17.
Fig. 4E3-a and 4E3-B illustrate views of L2, L4, L6, and L8, which provide portions of planar spring spirals 3421-1L, 3421-2L and portions thereof forming the innermost region of cantilever portions LC 1-LC 4 (not labeled), portions of lower central end arm 3431-LA, and portions of lower brackets 3412-1 and 3412-2, wherein a double staggered spiral configuration may be seen.
Figures 4E4-A and 4E4-B show views of L3 and L7 where incomplete spiral elements 3421-1L, 3421-2L and stents 3412-1 and 3412-2 (similar to the features of figures 4E3-A and 4E3-B, but where the LC1-LC4 portion is absent) can be seen. The spiral portions reflected in these figures, in combination with the overlying and underlying portions of fig. 4E3-a and 4E3-B, form thickened spiral portions in the outermost lateral portions of the spring, with the lower compliant elements 3421-LC comprising only two thickened cantilever elements, as opposed to four thinner cantilever elements LC1-LC4 joining the end arms at the innermost lateral portions of the spring.
Fig. 4E5-a and 4E5-B illustrate views of L5, which include a portion of the lower end arm 3431-LA and portions of the brackets 3412-1 and 3412-2 that provide a connection between the 3421-1L and 3421-2L cantilever spring portions.
Fig. 4E6-a and 4E6-B illustrate views of L9, which include an annular base 3401 that separates and connects the upper and lower compliant elements 3421-UC and 3421-LC via two portions of the base that serve as brackets, with some lateral portions of the base being aligned with and engaged by springs in their bracket areas 3411-1, 3411-2, 3412-1 and 3412-2. The actual onset of the inward spiral of probe 3400 depends on how the L8 features interface with the L9 features and, as such, how the L9 features interface with the L10 features. In particular, the interface is not perpendicular to the local length of the coiled spiral (e.g., such that an interface of minimum width is provided), but is formed at an angle such that the outer portion of the spiral beam that interfaces with the base is supported along its length by an amount different than the inner portion. In some variations, the interface may be provided in such a way that the interface is provided perpendicular to the local length of the beam, such that the support provided by the base (or other brace region) provides a laterally perpendicular or substantially perpendicular transition between the supported and unsupported beam regions. Specifically, the vertical transitions are provided in the areas where other beams are separated from the brackets, as can be seen in the junctions formed by L4 and L5, L5 and L6, L12 and L13, and L13 and L14, and in areas such as L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16, where the beam transitions extend along transverse lines that are substantially perpendicular to the direct or local lengths of the beams. Such perpendicular and non-perpendicular handoffs and their consistent or varying usage may be used to customize probe performance or operational characteristics. In particular, the outer portion of the cantilever is provided as a single thick beam, while the inner portion of the cantilever structure begins as two medium thickness beams, with the end of the cantilever at the probe arm being four thinner beams, due to the non-perpendicular interface with the base and to the interface provided by and between the other beams of the cantilever. In some variations, the initial cantilever structures (as they move laterally away from the base) may begin as a single thick beam or multiple beams and extend through their entire width. Other transitions along the length of the beam may also be configured to provide a flat or vertical transition, or may be configured to provide a variable or non-vertical transition. Fig. 4E7-a and 4E7-B illustrate views of L10, L12, L14, and L16 that provide (1) portions of upper planar spring spirals 3421-1U and 3421-2U and their innermost extensions forming cantilever portions UC 1-UC 4 (not labeled), (2) portions of upper central terminal arm 3431-UA, and portions of upper brackets 3411-1 and 3411-2, where a double staggered spiral configuration can be seen. These are upper compliant elements corresponding to the lower compliant element features shown in fig. 4E3-a and 4E 3-B. A comparison of these figures shows that the rotational orientation of the spirals of the upper and lower compliant elements have opposite rotational orientations. In some cases, this reversal of orientation may be considered beneficial, while in other cases it may be unnecessary or even detrimental. Upon compression of the spring element, the tip may tend to rotate in a direction opposite the inward rotation of the spiral element, which may result in a wiping or scraping effect that may help to break the oxide coating or cause damage to the contacted surface. The reversal of the wiping orientation between the lower and upper probe tips may be desirable or undesirable and thus may be considered during initial probe design. Similarly, a reversal of the relative orientation of the separate upper spring element is possible, and a reversal of the orientation of the separate lower spring element is also possible.
Fig. 4E8-a and 4E8-B show views of layers L11 and L15 where incomplete spiral elements 3421-1U and 3421-2U and the connection areas of stents 3411-1 and 3411-2 can be seen bridging the spiral portions of fig. 4E7-a and 4E7-B to form a thickened spiral portion in the outermost lateral portion of the spring, where the upper compliant element 3421-UC comprises only two thickened elements, as opposed to four thinner elements joining the end arms 3431-UA in the innermost lateral portion of the spiral. Fig. 4E8-a and 4E8-B provide an upper compliant element corresponding to the lower compliant element shown in fig. 4E4-a and 4E 4-B.
Fig. 4E9-a and 4E9-B illustrate views of layer L13, which includes a portion of upper end arm 3431-UA and portions of brackets 3411-1 and 3411-2, which provide a connection between cantilevers 3421-1U and 3421-2U. Fig. 4E9-a and 4E9-B provide images of portions of the upper compliant element corresponding to the lower compliant element in fig. 4E5-a and 4E 5-B.
Many other variations of the probes of fig. 4A-4E 9-B are possible and will be apparent to those skilled in the art upon reading the teachings herein, and these variations include, for example: (1) a change in material; (2) Variations in configuration, including the number of rotations or partial rotations each spring element contains, the number of staggered springs used at each longitudinal height, the number of longitudinally spaced springs used (e.g., even and odd, etc.), the number and location of longitudinal beam transitions that occur along the length of the spiral, the direction of rotation assumed by the continuous spiral (e.g., CW-CCW-CW-CCW-CW, CW-CCW-CCW-CW, etc.), the shape of the tip, the width and thickness of the cantilever beam; (3) Using a bracket separating one or both of the upper and lower spring modules from the annular frame; (4) Using a scaffold closer to the central portion of the probe than the outer periphery of the probe; (5) Using different types of frame or base structures and/or openings in such frame and base structures; (6) Spring structures using a single spiral or more than two staggered spirals at a given longitudinal height, rather than pairs of coplanar staggered spirals supported by different stents; and (7) variations derived from features of other embodiments and aspects set forth herein, and variations thereof.
Fig. 5 A1-5C 5 illustrate an example probe 3500 and single array plate 3540 mounting and retaining configuration in accordance with another embodiment of the invention using retractable spring clips or retaining elements 3503 in combination with longitudinally displaced additional retaining elements in the form of retaining rings or bases 3501 for retaining the probe to the array plate, wherein the spring clips 3503 retract upon insertion into through holes 3541 in the plate and then automatically expand and lock the spring clips together to the plate once threading through the holes is completed.
Probe 3500 includes a compliant structure comprising: a bracket having longitudinally separated first and second ends; a first compliant element comprising a two-dimensional substantially planar spring; and a second compliant element comprising a spring. Alternatively, the first compliant element and the second compliant element each comprise a respective two-dimensional substantially planar spring.
More specifically, the first compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first compliant element functionally links the at least one scaffold, and a second portion of the first compliant element functionally links a first end arm that is resiliently movable relative to the at least one scaffold, wherein the first end arm directly or indirectly retains a first end 3531-U that extends longitudinally beyond a first end of the at least one scaffold when the first compliant element is unbiased.
Furthermore, the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element functionally links the at least one scaffold, and a second portion of the second compliant element functionally links a second end arm that is resiliently movable relative to the at least one scaffold, wherein the second end arm directly or indirectly retains a second end portion 3531-L that extends longitudinally beyond a second end of the at least one scaffold when the second compliant element is unbiased.
Fig. 5 A1-5 A4 provide side views (fig. 5 A1), two isometric views (fig. 5 A2-5 A3) and top views (fig. 5 A4), all from the same rotational orientation about the Z-axis or longitudinal axis of an example probe 3500, which is similar to the probe 3400 of the fig. 4 series, with the main difference being that the central base of the fig. 4 series probe is replaced by two longitudinally spaced apart retaining elements in the form of a lower retaining ring 3501 and a pair of upper retractable spring elements 3503 that can be made through openings 3541 in a retaining plate 3540, then re-deployed and retained to the retaining plate between the longitudinally spaced apart retaining elements. In this way, the lower retaining ring 3501 serves as a lower retaining feature and the upper retractable spring element 3503 serves as an upper retaining feature.
Fig. 5 A5-5 A7 provide a side view (fig. 5 A5) and two isometric views (fig. 5 A6-5 A7) of the same probe 3500 shown in fig. 5 A1-5 A4, but from a different rotational orientation about the Z-axis, while fig. 5 A8-5 a10 provide a similar view from a third rotational orientation about the Z-axis.
The probe 3500 of fig. 5 A1-5 a10 includes a body portion 3504 and mounting or retaining structures 3501 and 3503. The body portion 3504 includes a spring module supporting the contact tips and a bracket supporting the spring module. The retaining ring 3501 in this embodiment serves not only as a probe-to-plate retaining structure, but also as a stabilizing structure that retains the brackets of the spring modules in the desired configuration. In general, the body portion 3504 may be considered to not include laterally extending peripheral features, such as the structure 3503, which is primarily intended for mounting or alignment. Depending on the positioning and use of the loop structure 3501, it may or may not be counted as part of the body portion or independent thereof. In the present embodiment, the base 3501 may be considered to be a part of the probe body for stability of the probe, but it may be considered to be excluded from the probe body for mounting and holding purposes. In this embodiment, during installation, the top of the retaining ring is intended to provide a lower stop against which the bottom of the array plate seats, while the bottom of the retaining springs 3503 acts as an upper stop for the array plate to move once installation has occurred. In this embodiment, the retention spring 3503 includes a base end 3503-B that adheres the spring to the probe body and an opposing resiliently movable end 3503-E that can be conformably compressed laterally toward the probe body to allow the probe to be fully inserted into the array through hole and then resiliently extended to resist accidental release of the probe from the array plate. In this way, when probes 3500 are inserted into openings of corresponding plate guide holes 3541 in array plate 3540, lower retaining ring 3501 engages the bottom of array plate 3540 and retains springs engaging the upper surface area of the array plate, the terms top and bottom being used with reference to the representation of the drawings, in particular, the bottom of the array plate being in opposite directions relative to local axis z, while the top surface of the array plate is disposed in the direction of local axis z.
Fig. 5B 1-5B 3 provide a top view (fig. 5B 1) and two isometric views (fig. 5B 2-5B 3) of an array plate segment with a single through hole 3541 into which the upper portion of the probe of fig. 5 A1-5 a10 can be longitudinally inserted to engage and at least temporarily join the probe and plate, from different rotational orientations about the Z-axis.
Fig. 5C 1-5C 5 provide side (fig. 5C 3), isometric (fig. 5C1, 5C2, and 5C 4) and top (fig. 5C 5) views of the probe of fig. 5 A1-5 a10, loaded into the plate of fig. 5B 1-5B 3 and held together after such loading, wherein loading is accomplished via relative longitudinal and rotational movement.
Fig. 5C1 provides an isometric view of the probe 3500 of fig. 5 A1-5 A6, wherein the orientation (about the z-axis) and tilt (front-to-back) of fig. 5A2 are laterally aligned under the opening 3541 in the array plate 3540 of fig. 5B 1-5B 3 in preparation for loading the probe into the opening by relative movement of the array plate in the direction indicated by arrow 3545, wherein the lateral alignment is such that only longitudinal movement will allow the array plate to slide over the upper portion of the probe body, while the relative rotational movement of the plate and probe, as shown by arrows 3545-CW and 3545-CCW in fig. 5C2, in combination with continued downward pressure, may cause the retaining springs 3503 to contract and thus allow the plate to move under these spring elements, wherein the spring elements may re-expand the plate, as shown, and inhibit accidental movement in the opposite longitudinal direction. In fig. 5C 3-5C 5, the retained probes or bonded probes and plates can be seen from different perspectives. For example, in the side view of fig. 5C3, the plate can be seen longitudinally between the retaining ring 3501 and the retaining springs 3503. In this example, since the body of the probe is substantially circular, as is the opening in the array plate, the probe orientation about the z-axis is not defined; however, in other embodiments, alternative configurations may be used to explicitly set the probe and plate orientations to a set of desired orientation possibilities or a single allowed orientation.
Fig. 6 A1-6 A5 provide side views (fig. 6 A1), three isometric views (fig. 6A2, 6A4, and 6 A5) and top views (fig. 6 A3) of a probe similar to the probe of the fig. 5 series, except that the retaining spring element 3603 is recessed toward the body of the probe 3600 at each end 3603-B, 3603-E with the greatest lateral extension occurring toward the center of the retaining spring 3603, rather than extending all the way to the compressible end of the spring.
Many alternatives to the embodiments of fig. 5 A1-5C 5 and 6 A1-6 A5 are possible and include, for example: (1) Changing the shape of the opening from the presented shape to some other configuration, such as, for example, a symmetrical oblong, square, rectangular, triangular, or some other simple or complex polygonal or closed curve configuration, with or without symmetry, and may or may not limit probe loading to a single rotational orientation, or even an orientation to ensure that the probe and plate are facing upward during loading; (2) Changing the shape of the probe body, retaining springs and/or retaining ring, or even replacing the retaining ring with a plurality of isolated tabs or even another set of retaining springs similar to or different from the other retaining springs; (3) Changing the number of retaining springs while maintaining uniformity of the spacing; (4) Retaining springs of non-uniform spacing or even asymmetric configuration are used; (5) Setting an initial loading orientation or even a final loading orientation using one or more tabs and recesses in the retaining spring engagement plate; (6) Use of a multi-stage retaining spring such as, for example: (a) A retaining spring carrying a transversely inserted longitudinally extending element in a direction opposite to that of the retaining ring, the tool being able to contact and press the element transversely inwardly to move the retaining spring inwardly for loading such that full longitudinal placement requires no rotational movement, after which release of the tool allows the spring to move resiliently outwardly to provide retention, (b) with a slightly transversely inserted auxiliary element which may or may not provide its own compliance, being located between the main retaining spring element and the retaining ring and being retained within the opening of the array plate and providing pressure against the inner wall of the array plate, To provide lateral centering of the probe within the aperture while still allowing the main retaining spring to provide longitudinal locking of the probe with the array plate, (c) an extension similar to (a) but with auxiliary elements extending both toward and away from the retaining ring, such that lateral movement of the probe in one direction of the pressing auxiliary elements may allow sufficient displacement of the retaining spring and the probe itself to allow loading of different or opposite sides of the probe into the array opening, and then different or opposite lateral displacement may be used to complete loading of additional portions or opposite sides of the probe into the array; (7) Using a retaining spring which allows to reduce the lateral dimension via a forced longitudinal displacement instead of a direct lateral displacement, so that when the longitudinal displacement is sufficient, a sufficient lateral displacement has occurred to allow the loading to be completed; (8) The holes or openings in the array plate may not be straight longitudinally extending through holes, but may include steps, ledges, recesses, etc., or include countersunk portions that may provide enhanced engagement for the probes; (9) The probe may include other features for enhancing engagement with the plate, e.g., for improved retention, longitudinal alignment, etc., such as rotation stops, friction elements, positioning bias springs, or spring latches engaging array plate features for fixedly holding the probe; (10) In some embodiments, the retention spring and probe body may be configured to allow for preloaded compression (e.g., latching or bistable compression), which may be released after loading; (11) A single array plate may be replaced by two or more adjacent plates that can be moved laterally relative to each other to provide positional locking, compression, or release of pre-compressed retention springs when the probes or all of the probes in the multi-probe card are properly positioned and oriented; and (12) other variations described with respect to other embodiments set forth herein. In most practical implementations, the array plate will each include a plurality of vias of the desired array pattern. In some variations, the array plate may be limited to a dielectric and the probes may be limited to a conductive material. In other variations, the array plate may include conductive elements (e.g., traces) that provide electrical contact to some or all of the probes, and the probes include dielectric elements that provide electrical isolation for different elements in a single probe or between adjacent probes.
Other comments and conclusions:
Many embodiments have been described above, but many additional embodiments are possible without departing from the spirit of the invention. Some of these additional embodiments may be based on a combination of the teachings herein with the various teachings incorporated by reference herein. Some fabrication embodiments may use a multi-layer electrochemical deposition process, while other embodiments may not. Some embodiments may use a combination of selective deposition and blanket deposition processes, while other embodiments may not use both, and still other embodiments may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and/or they may not use a planarization process in the formation of the continuous layer. Some embodiments may use a selective deposition process or a blanket deposition process on some layers that are not electrodeposition processes. For example, some embodiments may use nickel (Ni), nickel phosphorus (Ni-P), nickel cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chromium copper (CrCu), other palladium alloys, copper silver alloys as structural or sacrificial materials, while other embodiments may use different materials. For example, some of the above materials may be used with preference to their spring properties, while other materials may be used based on their enhanced electrical conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength or high thermal conductivity at high temperatures), while some may be selected based on their bonding properties, their separability from other materials, or even other properties required in a desired application or use. Other embodiments may use different materials or different combinations of materials, including dielectrics (e.g., ceramics, plastics, photoresists, polyimides, glass, ceramics, or other polymers), other metals, semiconductors, etc. as structural, sacrificial, or pattern materials. For example, some embodiments may use copper, tin, zinc, solder, photoresist, or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or different portions of a single layer. Some embodiments may remove the sacrificial material, while other embodiments may not. Some embodiments may form probe structures, while other embodiments may use the spring module of the present invention for non-probing purposes (e.g., to bias other operating devices with a desired spring force or compliant engagement).
It should also be understood that the probe elements of some aspects of the invention may be formed by processes that are very different from those set forth herein, and that it is not meant that structural aspects of the invention need be formed by only or become apparent from those processes taught herein.
Although each portion of this specification is provided with a heading, the headings are not intended to limit the application of the teachings in one portion of this specification to other portions of this specification. For example, alternatives associated with one embodiment are intended to apply to all embodiments such that features of different embodiments cause such applications to function, and do not otherwise contradict or negate all benefits of the embodiments employed.
Any aspect of the invention described herein is intended to represent an independent invention description, which applicant regards as a complete invention description, which applicant regards as an independent claim that may be set forth without introducing additional limitations or elements from other embodiments or aspects described herein for purposes of explanation or clarity, unless explicitly set forth in such independent claims following the writing. It should also be understood that any variation of the aspects set forth herein represents individual and independent features that may form individual independent claims, be added separately to independent claims, or be added as dependent claims to further define the invention as claimed by those respective dependent claims.
Many other embodiments, design alternatives, and embodiments use of the present invention will be apparent to those skilled in the art in view of the teachings herein. As such, this is not intended to limit the invention to the particular illustrative embodiments, alternatives, and uses described above, but rather is limited only by the claims set forth below.