技术领域Technical Field
本发明涉及一种处理例如半导体晶片之类的晶片状物件的装置。The present invention relates to an apparatus for processing wafer-shaped objects such as semiconductor wafers.
背景技术Background Art
诸如半导体晶片之类的晶片可能会受到例如蚀刻、清洗、抛光以及材料沉积等各种表面处理工艺的影响。在进行这类表面处理工艺时，通常使用卡盘夹住晶片。Wafers such as semiconductor wafers may be subjected to various surface treatment processes such as etching, cleaning, polishing, and material deposition. During such surface treatment processes, a chuck is typically used to hold the wafer.
这些表面处理工艺中的至少一些涉及将液体施加至晶片的表面。例如，可通过将诸如氢氟酸之类的处理液体施加至晶片表面上的选定位置来蚀刻晶片的表面。替代地，可通过将诸如异丙醇或去离子水之类的清洗液体或冲洗液体施加至晶片表面来清洗晶片的表面。At least some of these surface treatment processes involve applying a liquid to the surface of the wafer. For example, the surface of the wafer can be etched by applying a treatment liquid such as hydrofluoric acid to selected locations on the surface of the wafer. Alternatively, the surface of the wafer can be cleaned by applying a cleaning liquid or rinse liquid such as isopropyl alcohol or deionized water to the surface of the wafer.
当液体被施加至晶片表面时，晶片可被旋转，例如使用可旋转的卡盘(转动卡盘(spin chuck))，以帮助液体在晶片表面的分布。As the liquid is applied to the wafer surface, the wafer may be rotated, such as using a rotatable chuck (spin chuck), to aid in the distribution of the liquid over the wafer surface.
此外，随后可通过加热晶片以使晶片表面上的液体蒸发来干燥晶片的表面，例如通过使用卡盘中的诸如LED等加热元件来加热晶片的底面。Additionally, the surface of the wafer may then be dried by heating the wafer to evaporate the liquid on the surface of the wafer, such as by heating the bottom surface of the wafer using a heating element such as an LED in a chuck.
在斜面蚀刻工艺中，晶片表面的薄膜被蚀刻至晶片的径向外缘附近。可使用转动卡盘来进行这种斜面蚀刻工艺。In the bevel etching process, the thin film on the wafer surface is etched to near the radial outer edge of the wafer. This bevel etching process can be performed using a rotating chuck.
申请人以前所使用的转动卡盘包含固定(非旋转的)板组件，其包含气体喷嘴以及液体喷嘴，该板组件位于转动卡盘所接收的晶片的下方。申请人以前所使用的转动卡盘还包含旋转卡盘组件(rotary chuck assembly)，其位于固定板组件的径向外侧以及转动卡盘所接收的晶片的下方。与旋转卡盘组件连接的多个销用于抓取晶片的径向外缘，使晶片与旋转卡盘组件一起旋转。固定板组件的气体喷嘴从下方将晶片支撑在气体垫上(根据伯努利原理(Bernoulli's principle))。液体喷嘴将蚀刻液体或清洗液体导向晶片的底表面(晶片的面向转动卡盘的表面)的边缘。旋转卡盘组件使晶片相对于固定板的气体及液体喷嘴旋转。The rotating chuck previously used by the applicant includes a fixed (non-rotating) plate assembly, which includes a gas nozzle and a liquid nozzle, and the plate assembly is located below the wafer received by the rotating chuck. The rotating chuck previously used by the applicant also includes a rotary chuck assembly, which is located radially outside the fixed plate assembly and below the wafer received by the rotating chuck. A plurality of pins connected to the rotary chuck assembly are used to grasp the radial outer edge of the wafer so that the wafer rotates with the rotary chuck assembly. The gas nozzle of the fixed plate assembly supports the wafer on a gas cushion from below (according to Bernoulli's principle). The liquid nozzle directs etching liquid or cleaning liquid to the edge of the bottom surface of the wafer (the surface of the wafer facing the rotating chuck). The rotating chuck assembly rotates the wafer relative to the gas and liquid nozzles of the fixed plate.
为了蚀刻或清洁晶片的边缘，液体喷嘴位于靠近晶片边缘的位置，并指向晶片底表面的期望位置。当晶片旋转时，处理液体撞击到底切(undercut)区域，并由于旋转的离心力而被旋开。撞击位置、晶片旋转、流速、喷嘴角度以及其它设计参数的组合决定了在晶片底表面上所形成的底切大小。To etch or clean the edge of a wafer, a liquid nozzle is located near the edge of the wafer and is directed to a desired location on the bottom surface of the wafer. As the wafer rotates, the process liquid impacts the undercut area and is spun away due to the centrifugal force of the rotation. The combination of the impact location, wafer rotation, flow rate, nozzle angle, and other design parameters determines the size of the undercut formed on the bottom surface of the wafer.
这样的布置例如在US2018/0040502A1和US2018/0096879A1中公开，其全部内容通过引用并入本文。Such arrangements are disclosed, for example, in US 2018/0040502 A1 and US 2018/0096879 A1, the entire contents of which are incorporated herein by reference.
发明内容Summary of the invention
本发明可提供一种处理晶片状物件的替代装置，以替代US2018/0040502A1以及US2018/0096879A1所公开的装置。The present invention can provide an alternative device for processing wafer-shaped objects to replace the devices disclosed in US2018/0040502A1 and US2018/0096879A1.
例如，本发明的装置可使非旋转板以及由非旋转板所支撑的晶片之间的距离得到更精确的控制。For example, the apparatus of the present invention allows for more precise control of the distance between a non-rotating plate and a wafer supported by the non-rotating plate.
在最一般的情况下，本发明提供了一种处理晶片状物件的装置，其中晶片状物件通过从非旋转板所提供的气体供应根据伯努利原理从上方支撑，且其中晶片状物件的径向外缘通过旋转卡盘(rotary chuck)从下方抓取，以使晶片状物件旋转。In the most general case, the present invention provides an apparatus for processing a wafer-like article, wherein the wafer-like article is supported from above according to the Bernoulli principle by a gas supply provided from a non-rotating plate, and wherein the radial outer edge of the wafer-like article is gripped from below by a rotary chuck so as to rotate the wafer-like article.
根据本发明的一方面，提供了一种处理晶片状物件的装置，装置包含：旋转卡盘，其被配置为接收晶片状物件，其中该旋转卡盘包含多个接触元件，每一接触元件能在抓取位置和非抓取位置之间移动，其中该接触元件在该抓取位置被配置为接触该晶片状物件的径向外缘；以及非旋转板，当该晶片状物件被该旋转卡盘接收时，该非旋转板被配置为位于该晶片状物件的与该旋转卡盘相对的一侧，其中该非旋转板包含气体供应机构，其被配置为供应气体以根据伯努利原理支撑该晶片状物件。According to one aspect of the present invention, there is provided an apparatus for processing a wafer-shaped object, the apparatus comprising: a rotating chuck configured to receive the wafer-shaped object, wherein the rotating chuck comprises a plurality of contact elements, each of which is movable between a gripping position and a non-gripping position, wherein the contact element is configured to contact a radial outer edge of the wafer-shaped object at the gripping position; and a non-rotating plate, wherein when the wafer-shaped object is received by the rotating chuck, the non-rotating plate is configured to be located at a side of the wafer-shaped object opposite to the rotating chuck, wherein the non-rotating plate comprises a gas supply mechanism configured to supply gas to support the wafer-shaped object according to the Bernoulli principle.
因此，在本发明的第一方面，晶片状物件可根据伯努利原理通过从非旋转板所提供的气体供应从上方支撑。此外，晶片状物件的径向外缘可由旋转卡盘从下方抓取，从而使晶片状物件与旋转卡盘可一起相对于非旋转板旋转。Thus, in a first aspect of the invention, the wafer-shaped object can be supported from above by a gas supply provided from a non-rotating plate according to the Bernoulli principle. In addition, the radial outer edge of the wafer-shaped object can be gripped from below by a rotating chuck so that the wafer-shaped object and the rotating chuck can rotate together relative to the non-rotating plate.
本发明的第一方面可具有以下可选特征中的任何一个，或者在兼容的情况下，具有以下可选特征的任何组合。The first aspect of the present invention may have any one of the following optional features, or, where compatible, any combination of the following optional features.
晶片状物件可为晶片，例如半导体晶片。晶片状物件可包含半导体衬底。The wafer-shaped object may be a wafer, such as a semiconductor wafer. The wafer-shaped object may include a semiconductor substrate.
处理晶片状物件可包含蚀刻和/或清洗晶片状物件。Processing the wafer-shaped article may include etching and/or cleaning the wafer-shaped article.
处理晶片状物件可包含将液体，例如蚀刻液体或清洁液体分配至晶片状物件的表面。Processing the wafer-shaped article may include dispensing a liquid, such as an etching liquid or a cleaning liquid, onto a surface of the wafer-shaped article.
装置可包含液体分配器，其用于将液体分配至晶片状物件的表面。The apparatus may comprise a liquid dispenser for dispensing the liquid onto the surface of the wafer-shaped article.
处理晶片状物件可包含对晶片状物件进行斜面蚀刻处理。Processing the wafer-shaped article may include performing a bevel etching process on the wafer-shaped article.
旋转卡盘为可旋转的。旋转卡盘可替代地被称为转动卡盘(spin chuck)或可旋转卡盘(rotatable chuck)。A rotary chuck is rotatable. A rotary chuck may alternatively be referred to as a spin chuck or a rotatable chuck.
旋转卡盘被配置为或适于旋转或可旋转的。The spin chuck is configured or adapted to rotate or is rotatable.
装置可包含驱动机构，例如马达，其用于驱动旋转卡盘的旋转。The apparatus may include a drive mechanism, such as a motor, for driving rotation of the rotary chuck.
旋转卡盘被配置为从晶片状物件的下方或下面接收晶片状物件。因此，当晶片状物件被旋转卡盘接收时，旋转卡盘被定位在晶片状物件的下方或下面。The rotary chuck is configured to receive the wafer-shaped object from below or under the wafer-shaped object. Therefore, when the wafer-shaped object is received by the rotary chuck, the rotary chuck is positioned below or under the wafer-shaped object.
旋转卡盘也可被称为旋转卡盘组件。A spin chuck may also be referred to as a spin chuck assembly.
当晶片状物件被旋转卡盘接收时，接触元件可环绕晶片状物件。The contact element may surround the wafer-shaped article when the wafer-shaped article is received by the spin chuck.
当晶片状物件被旋转卡盘接收时，接触元件可围绕晶片状物件呈圆形布置。When the wafer-shaped article is received by the rotary chuck, the contact elements may be arranged in a circle around the wafer-shaped article.
当接触元件在抓取位置接触到晶片状物件的径向外缘时，接触元件在其间抓取或夹住晶片状物件。因此，晶片状物件相对于旋转卡盘和/或非旋转板的横向(例如水平)运动被防止或限制。When the contact element contacts the radial outer edge of the wafer-shaped article in the gripping position, the contact element grips or clamps the wafer-shaped article therebetween. Thus, lateral (eg, horizontal) movement of the wafer-shaped article relative to the rotating chuck and/or the non-rotating plate is prevented or limited.
接触元件与旋转卡盘一起旋转。因此，当接触元件处于抓取位置并抓取晶片状物件时，晶片状物件也与旋转卡盘一起旋转。因此，晶片状物件相对于非旋转板旋转。The contact element rotates together with the rotating chuck. Therefore, when the contact element is in the gripping position and grips the wafer-shaped object, the wafer-shaped object also rotates together with the rotating chuck. Therefore, the wafer-shaped object rotates relative to the non-rotating plate.
接触元件可被配置为随着旋转卡盘的旋转而在一个圆内旋转。The contact element may be configured to rotate in a circle as the rotary chuck rotates.
接触元件可以(直接或间接地)连接至旋转卡盘的卡盘主体，或者安装在旋转卡盘的卡盘主体上或卡盘主体内，以便接触元件与卡盘主体一起旋转。卡盘主体可为旋转卡盘主体，或可旋转卡盘主体。The contact element may be connected (directly or indirectly) to a chuck body of a rotating chuck, or mounted on or in a chuck body of a rotating chuck, so that the contact element rotates with the chuck body. The chuck body may be a rotating chuck body, or a rotatable chuck body.
旋转卡盘可从晶片状物件的下方或下面抓取或夹住晶片状物件。The rotating chuck can grab or clamp the wafer-like article from below or underneath the wafer-like article.
旋转卡盘可保持晶片状物件。The rotating chuck can hold the wafer-like object.
在抓取位置，接触元件可在其间抓取晶片状物件。In the gripping position, the contact elements can grip the wafer-shaped object therebetween.
可有至少三个接触元件，例如六个接触元件。There may be at least three contact elements, for example six contact elements.
当晶片状物件被旋转卡盘接收时，接触元件可围绕晶片状物件分布。例如，当晶片状物件被旋转卡盘接收时，接触元件可均匀地围绕晶片状物件分布。When the wafer-shaped object is received by the rotating chuck, the contact elements can be distributed around the wafer-shaped object. For example, when the wafer-shaped object is received by the rotating chuck, the contact elements can be evenly distributed around the wafer-shaped object.
在非抓取位置，每一接触元件被配置为不接触晶片状物件的径向外缘。例如，在非抓取位置，每一接触元件可与晶片状物件的径向外缘间隔开来。In the non-grasping position, each contact element is configured not to contact the radial outer edge of the wafer-shaped object. For example, in the non-grasping position, each contact element may be spaced apart from the radial outer edge of the wafer-shaped object.
在非抓取位置，每一接触元件可不接触晶片状物件。In the non-grasping position, each contact element may not contact the wafer-shaped object.
非抓取位置可被称为晶片装载位置。The non-grab position may be referred to as a wafer loading position.
在非抓取位置，接触元件可不抓取其间的晶片状物件。In the non-grasping position, the contact elements may not grasp the wafer-shaped object therebetween.
晶片状物件被旋转卡盘接收可意指晶片状物件被旋转卡盘的接触元件抓取或夹住。The wafer-shaped article being received by the rotary chuck may mean that the wafer-shaped article is gripped or clamped by contact elements of the rotary chuck.
晶片状物件被旋转卡盘接收可意指接触元件接触晶片状物件的径向外缘。The wafer-shaped article being received by the rotary chuck may mean that the contact element contacts the radial outer edge of the wafer-shaped article.
因此，晶片状物件可通过接触元件移动至抓取位置，使晶片状物件被接触元件抓取而被旋转卡盘接收。Therefore, the wafer-shaped object can be moved to the gripping position by the contact element, so that the wafer-shaped object is gripped by the contact element and received by the rotary chuck.
晶片状物件可具有预定或特定直径。例如，晶片状物件的直径可为200mm，或300mm，或450mm。The wafer-shaped object may have a predetermined or specific diameter. For example, the diameter of the wafer-shaped object may be 200 mm, or 300 mm, or 450 mm.
例如，晶片状物件的径向外缘可意指晶片状物件的径向外周长、或径向外限、或径向外端、或圆周边缘、或周边边缘。For example, the radially outer edge of the wafer-shaped object may refer to the radially outer circumference, or the radially outer limit, or the radially outer end, or the circumferential edge, or the peripheral edge of the wafer-shaped object.
例如，晶片状物件的径向外缘可意指晶片状物件的径向外表面、或圆周表面。For example, the radially outer edge of the wafer-shaped object may refer to the radially outer surface, or the circumferential surface, of the wafer-shaped object.
接触元件可替代性地被称为抓取元件(gripping element)，或接触构件(contactmember)，或抓取构件(gripping member)，或接触部分(contact part)，或抓取部分(gripping part)。The contact element may alternatively be referred to as a gripping element, or a contact member, or a gripping member, or a contact part, or a gripping part.
一般来说，例如，本文所使用的术语元件可意指构件(member)、部分(part)或部件(component)。Generally speaking, for example, the term element as used herein may mean a member, a part, or a component.
接触元件可包含或成为可在抓取位置以及非抓取位置之间移动的接触表面。The contact element may include or be a contact surface that is movable between a gripping position and a non-gripping position.
在抓取位置以及非抓取位置之间移动接触元件可意指或包含在抓取位置以及非抓取位置之间旋转接触元件。因此，术语移动包含接触元件的旋转。Moving the contact element between the gripping position and the non-gripping position may mean or include rotating the contact element between the gripping position and the non-gripping position. Thus, the term moving includes the rotation of the contact element.
接触元件的位置可为接触元件的旋转位置。因此，术语位置包含旋转位置。The position of the contact element may be a rotational position of the contact element. Thus, the term position includes the rotational position.
非旋转板可替代性地称为固定板。A non-rotating plate may alternatively be referred to as a fixed plate.
非旋转板是指该板不与旋转卡盘一起旋转。相反，旋转卡盘(以及因此由旋转卡盘所接收的晶片状物件)相对于非旋转板旋转。A non-rotating plate is one that does not rotate with the rotating chuck. Instead, the rotating chuck (and thus the wafer-shaped article received by the rotating chuck) rotates relative to the non-rotating plate.
非旋转板可改称为非旋转板组件。The non-rotating plate may be alternatively referred to as a non-rotating plate assembly.
非旋转板可被称为伯努利板(Bernoulli plate)，或伯努利板组件(Bernoulliplate assembly)。The non-rotating plate may be referred to as a Bernoulli plate, or a Bernoulli plate assembly.
非旋转板可为圆形或基本上圆形。The non-rotating plate may be circular or substantially circular.
非旋转板(non-rotating plate)可替代地被称为不可旋转板(non-rotatableplate)。A non-rotating plate may alternatively be referred to as a non-rotatable plate.
非旋转板被配置为位于晶片状物件的与旋转卡盘相对的一侧，其可意指非旋转板以及旋转卡盘各自面向晶片状物件的相对主面或主侧。The non-rotating plate is configured to be located on a side of the wafer-shaped article opposite the rotating chuck, which may mean that the non-rotating plate and the rotating chuck each face opposite major faces or sides of the wafer-shaped article.
旋转卡盘可被配置为在晶片状物件被非旋转板支撑的同时接收晶片状物件，例如在同一时间和/或同时。The rotating chuck may be configured to receive the wafer-shaped article while the wafer-shaped article is supported by the non-rotating plate, such as at the same time and/or simultaneously.
因此，在晶片状物件的径向外缘被旋转卡盘从下方抓取的同时，晶片状物件可从上方被非旋转板支撑。Thus, the wafer-shaped article can be supported from above by the non-rotating plate while its radially outer edge is gripped from below by the rotating chuck.
非旋转板的直径可小于晶片状物件的直径，或者等于晶片状物件的直径，或者大于晶片状物件的直径。The diameter of the non-rotating plate may be smaller than the diameter of the wafer-shaped object, equal to the diameter of the wafer-shaped object, or larger than the diameter of the wafer-shaped object.
当晶片状物件被旋转卡盘接收时，旋转卡盘被定位在晶片状物件的下方或下面。相反，当晶片状物件被旋转卡盘接收时，非旋转板被定位在晶片状物件的上方。因此，当晶片状物件被旋转卡盘接收时，旋转卡盘以及非旋转板被定位在晶片状物件的相对两侧。When the wafer-shaped article is received by the rotating chuck, the rotating chuck is positioned below or under the wafer-shaped article. Conversely, when the wafer-shaped article is received by the rotating chuck, the non-rotating plate is positioned above the wafer-shaped article. Thus, when the wafer-shaped article is received by the rotating chuck, the rotating chuck and the non-rotating plate are positioned on opposite sides of the wafer-shaped article.
因此，非旋转板从晶片状物件的上方支撑晶片状物件。Thus, the non-rotating plate supports the wafer-shaped article from above the wafer-shaped article.
晶片状物件面向旋转卡盘的面可称为晶片状物件的底表面。The surface of the wafer-shaped article that faces the spin chuck may be referred to as the bottom surface of the wafer-shaped article.
晶片状物件面向非旋转板的面可称为晶片状物件的顶表面。The side of the wafer-shaped article that faces the non-rotating plate may be referred to as the top surface of the wafer-shaped article.
通常，晶片状物件被旋转卡盘接收，晶片状物件的设备面远离旋转卡盘朝向非旋转板。Typically, a wafer-shaped article is received by a rotating chuck with the device face of the wafer-shaped article facing away from the rotating chuck toward the non-rotating plate.
气体供应机构可意指一或多个气体喷嘴和/或气体管道和/或气体路径，其用于从独立于非旋转板(在其外部)的气体源供应气体。The gas supply mechanism may mean one or more gas nozzles and/or gas conduits and/or gas paths for supplying gas from a gas source independent of (external to) the non-rotating plate.
气体供应机构可供应压缩气体，例如压缩的氮气。The gas supply mechanism may supply compressed gas, such as compressed nitrogen.
气体供应机构供应气体至非旋转板的面向由非旋转板所支撑的晶片状物件的表面。The gas supply mechanism supplies gas to a surface of the non-rotating plate facing the wafer-shaped article supported by the non-rotating plate.
由于伯努利原理，气体的供应在非旋转板的表面以及晶片状物件之间造成了真空或低压。这种真空或低压会使晶片状物件向非旋转板方向产生作用力。这个作用力可被控制，例如通过控制气体供应的流速和/或分布，和/或当开始供应气体时控制晶片状物件与非旋转板的间距，以平衡或抵消晶片状物件的重量作用力，从而使晶片状物件(晶片状物件的重量)由非旋转板从上方支撑。这种效应被称为伯努利原理，且在本技术领域为公知的。Due to Bernoulli's principle, the supply of gas creates a vacuum or low pressure between the surface of the non-rotating plate and the wafer-like object. This vacuum or low pressure causes the wafer-like object to exert a force in the direction of the non-rotating plate. This force can be controlled, for example, by controlling the flow rate and/or distribution of the gas supply and/or controlling the spacing between the wafer-like object and the non-rotating plate when the gas supply is started, to balance or offset the weight force of the wafer-like object so that the wafer-like object (the weight of the wafer-like object) is supported from above by the non-rotating plate. This effect is called Bernoulli's principle and is well known in the art.
在开始供应气体时，晶片状物件可被定位在与面向晶片状物件的非旋转板的表面相距0.3至5.0mm范围内的距离处。When the supply of gas is started, the wafer-shaped article may be positioned at a distance ranging from 0.3 to 5.0 mm from the surface of the non-rotating plate facing the wafer-shaped article.
通常情况下，晶片状物件被支撑而不与非旋转板发生物理接触。因此，晶片状物件可由非旋转板支撑，使其与非旋转板间隔预定距离。Typically, the wafer-shaped article is supported without physical contact with the non-rotating plate. Thus, the wafer-shaped article may be supported by the non-rotating plate so that it is spaced a predetermined distance from the non-rotating plate.
根据伯努利原理支撑晶片状物件可意指或包含保持或托起晶片状物件。Supporting a wafer-shaped object according to Bernoulli's principle may mean or include holding or lifting the wafer-shaped object.
根据伯努利原理支撑晶片状物件意指支撑晶片状物件的重量。Supporting a wafer-shaped object according to Bernoulli's principle means supporting the weight of the wafer-shaped object.
气体供应机构被配置为从非旋转板的表面以相对于旋转卡盘的旋转轴的径向向外方向与非旋转板的表面至少部分成一定角度供应气体，该表面被配置为面向晶片状物件。The gas supply mechanism is configured to supply gas from a surface of the non-rotating plate at least partially at an angle to the surface of the non-rotating plate in a radially outward direction relative to the rotation axis of the rotary chuck, the surface being configured to face the wafer-shaped article.
该角度为斜角(即不是0度，也不是90度)。The angle is an oblique angle (ie, not 0 degrees, nor 90 degrees).
该角度可为锐角(即大于0度且小于90度)。The angle may be an acute angle (ie, greater than 0 degrees and less than 90 degrees).
气体供应机构可被配置为从面向晶片状物件的非旋转板的表面在非旋转板的表面的周边或外部区或区域供应气体。The gas supply mechanism may be configured to supply gas from a surface of the non-rotating plate facing the wafer-shaped article at a peripheral or outer zone or area of the surface of the non-rotating plate.
气体供应机构可包含环形气体供应机构，其至少部分地相对于旋转卡盘的旋转轴径向向外定向。The gas supply may include an annular gas supply that is at least partially oriented radially outward relative to an axis of rotation of the spin chuck.
包含环形气体供应机构的气体供应机构可意指气体供应机构具有环形形状。The gas supply mechanism comprising an annular gas supply mechanism may mean that the gas supply mechanism has an annular shape.
环形气体供应机构可包含单一环形气体供应喷嘴，或多个以环形或环状布置的气体供应喷嘴。The annular gas supply mechanism may include a single annular gas supply nozzle, or a plurality of gas supply nozzles arranged in an annular or ring-like shape.
气体供应机构可位于较非旋转板的中心更靠近非旋转板的外缘。The gas supply mechanism may be located closer to the outer edge of the non-rotating plate than to the center of the non-rotating plate.
气体供应机构可位于非旋转板的周边或外部区或区域。The gas supply mechanism may be located at the periphery or outer zone or area of the non-rotating plate.
气体供应机构包含环形阵列的气体供应喷嘴，其包含在非旋转板的表面上开口的多个孔洞，该表面被配置为面向晶片状物件，其中多个孔洞中的每一个与非旋转板的表面至少部分地在相对于旋转卡盘的旋转轴的径向向外方向上成一定角度布置。The gas supply mechanism includes an annular array of gas supply nozzles including a plurality of holes opening on a surface of the non-rotating plate, the surface being configured to face the wafer-shaped article, wherein each of the plurality of holes is arranged at an angle to the surface of the non-rotating plate at least partially in a radially outward direction relative to a rotation axis of the rotating chuck.
该角度为斜角(例如不是0度，也不是90度)。The angle is an oblique angle (eg, not 0 degrees, nor 90 degrees).
该角度可为锐角(例如大于0度且小于90度)。The angle may be an acute angle (eg, greater than 0 degrees and less than 90 degrees).
多个孔洞的开口可在非旋转板的表面上布置成圆形系列(呈圆形)。The openings of the plurality of holes may be arranged in a circular series (in a circular shape) on the surface of the non-rotating plate.
与非旋转板的表面的中心相比，多个孔洞的开口可布置成更靠近非旋转板的表面的外缘。The openings of the plurality of holes may be arranged closer to an outer edge of the surface of the non-rotating plate than to a center of the surface of the non-rotating plate.
多个孔洞的开口可布置在非旋转板的表面的周边或外部区或区域。The openings of the plurality of holes may be arranged in a peripheral or outer zone or region of the surface of the non-rotating plate.
多个孔洞的开口可布置在非旋转板的表面上，以便当晶片状物件被非旋转板支撑时，被晶片状物件的外围或外部区或区域覆盖。The openings of the plurality of holes may be arranged on the surface of the non-rotating plate so as to be covered by the periphery or outer region or area of the wafer-shaped article when the wafer-shaped article is supported by the non-rotating plate.
装置可包含气体源，其连接至气体供应机构(例如经由一或多个气体供应路径或管线)，用于向气体供应机构供应气体。The device may comprise a gas source connected to a gas supply mechanism (eg via one or more gas supply paths or lines) for supplying gas to the gas supply mechanism.
气体供应机构可包含非旋转板内的气体分配室，且多个孔洞中的每一个可与气体分配室连接。因此，气体可经由分配室同时分配至多个孔洞中的每一个。The gas supply mechanism may include a gas distribution chamber in the non-rotating plate, and each of the plurality of holes may be connected to the gas distribution chamber. Therefore, the gas may be distributed to each of the plurality of holes simultaneously via the distribution chamber.
装置可包含气体源，其与气体分配室连接(例如经由一或多个气体供应路径或管道连接)，以用于向气体分配室供应气体。The device may comprise a gas source connected to the gas distribution chamber (eg connected via one or more gas supply paths or pipes) for supplying gas to the gas distribution chamber.
非旋转板可包含液体分配喷嘴，其用于在晶片状物件的表面分配液体。The non-rotating plate may include liquid dispensing nozzles for dispensing liquid onto the surface of the wafer-shaped article.
非旋转板可包含液体分配喷嘴，其定位在气体供应机构的径向外侧。液体分配喷嘴可被配置为指向由非旋转板所支撑的晶片状物件的边缘区域。The non-rotating plate may include a liquid dispensing nozzle positioned radially outwardly of the gas supply mechanism. The liquid dispensing nozzle may be configured to be directed toward an edge region of a wafer-shaped article supported by the non-rotating plate.
因此，液体分配喷嘴可用于在晶片状物件的边缘区域分配液体。Thus, the liquid dispensing nozzle can be used to dispense liquid in the edge region of a wafer-shaped article.
例如，液体分配喷嘴可用于在晶片状物件的边缘区域分配蚀刻液体，以在晶片状物件的边缘区域形成斜面或底切。For example, the liquid dispensing nozzle may be used to dispense etching liquid at an edge region of a wafer-shaped article to form a bevel or an undercut at the edge region of the wafer-shaped article.
此外，或者替代地，液体分配喷嘴可用于在晶片状物件的边缘区域分配清洁液体，以清洁边缘区域，例如在晶片状物件的边缘区域形成斜面或底切之后。Additionally, or alternatively, the liquid dispensing nozzle may be used to dispense a cleaning liquid at an edge region of the wafer-shaped article to clean the edge region, for example after a bevel or undercut has been formed at the edge region of the wafer-shaped article.
装置可包含液体源，其与液体分配喷嘴连接(例如经由一或多个液体供应路径或管道连接)，以用于向液体分配喷嘴供应液体。The device may comprise a liquid source connected to the liquid dispensing nozzle (eg connected via one or more liquid supply paths or conduits) for supplying liquid to the liquid dispensing nozzle.
如上所述，晶片状物件通过旋转卡盘相对于非旋转板进行旋转。因此，晶片状物件相对于非旋转板的液体分配喷嘴旋转。例如，液体分配喷嘴因此可通过在从液体分配喷嘴分配液体的同时旋转晶片状物件来将液体施加至晶片状物件的整个边缘区域。As described above, the wafer-shaped object is rotated relative to the non-rotating plate by the rotating chuck. Therefore, the wafer-shaped object is rotated relative to the liquid dispensing nozzle of the non-rotating plate. For example, the liquid dispensing nozzle can thus apply liquid to the entire edge area of the wafer-shaped object by rotating the wafer-shaped object while dispensing liquid from the liquid dispensing nozzle.
由于液体分配喷嘴位于气体供应机构的径向外侧，因此，气体供应可将液体径向向外吹，并防止液体径向向内移动。Since the liquid dispensing nozzle is located radially outside the gas supply mechanism, the gas supply can blow the liquid radially outward and prevent the liquid from moving radially inward.
非旋转板可包含多个液体分配喷嘴。例如，非旋转板可包含三个液体分配喷嘴。The non-rotating plate may comprise a plurality of liquid dispensing nozzles. For example, the non-rotating plate may comprise three liquid dispensing nozzles.
当液体分配喷嘴有一个以上时，液体分配喷嘴可围绕以非旋转板的中心为中心的圆均匀分布。When there is more than one liquid dispensing nozzle, the liquid dispensing nozzles may be evenly distributed around a circle centered about the center of the non-rotating plate.
液体分配喷嘴的位置和/或方向可为可调整的。例如，这可使其有可能可控地调整在晶片状物件的表面所形成的斜面或底切的大小。The position and/or orientation of the liquid dispensing nozzle may be adjustable. This may make it possible, for example, to controllably adjust the size of the bevel or undercut formed on the surface of the wafer-shaped article.
例如，液体分配喷嘴的位置和/或方向可经由调整螺丝或经由诸如电子或电气致动器(例如马达)之类的致动器进行调整。For example, the position and/or orientation of the liquid dispensing nozzle may be adjusted via an adjustment screw or via an actuator such as an electronic or electrical actuator (eg, a motor).
液体分配喷嘴可在径向方向上移动。例如，相对于非旋转板的面向晶片状物件的表面，液体分配喷嘴可在径向方向上移动。这种径向调整可经由可旋转的调整螺丝来实现，以使液体分配喷嘴在径向方向上移动，或者经由致动器(如电子或电气致动器，例如马达)移动。The liquid dispensing nozzle can be moved in a radial direction. For example, the liquid dispensing nozzle can be moved in a radial direction relative to a surface of the non-rotating plate facing the wafer-shaped article. Such radial adjustment can be achieved via a rotatable adjustment screw to move the liquid dispensing nozzle in a radial direction, or via an actuator (such as an electronic or electrical actuator, such as a motor).
非旋转板和/或液体分配喷嘴可包含致动器，其被配置为调整液体分配喷嘴的位置和/或方向。The non-rotating plate and/or the liquid dispensing nozzle may include an actuator configured to adjust the position and/or orientation of the liquid dispensing nozzle.
例如，致动器可被配置为在径向方向上移动液体分配喷嘴。For example, the actuator may be configured to move the liquid dispensing nozzle in a radial direction.
致动器可为电子或电气致动器，例如马达。The actuator may be an electronic or electrical actuator, such as a motor.
装置可包含控制器，其被配置为控制致动器以调整液体分配喷嘴的位置和/或方向。例如，控制器可被配置为根据针对正在对晶片状物件进行处理的处理计划或处理配方来控制液体分配喷嘴的位置和/或方向。The device may include a controller configured to control the actuator to adjust the position and/or orientation of the liquid dispensing nozzle. For example, the controller may be configured to control the position and/or orientation of the liquid dispensing nozzle according to a process plan or process recipe for processing the wafer-shaped object being processed.
非旋转板可包含多个限制元件，每一限制元件可在限制位置和非限制位置之间移动，其中限制元件在限制位置被配置为限制由非旋转板所支撑的晶片状物件的横向(例如水平)运动。The non-rotating plate may include a plurality of restraining elements, each restraining element being movable between a restraining position and a non-restraining position, wherein the restraining element in the restraining position is configured to restrict lateral (eg, horizontal) movement of a wafer-shaped article supported by the non-rotating plate.
在限制位置中，限制元件被定位和/或布置为限制或限定由非旋转板所支撑的晶片状物件的横向(例如水平)运动。In the restraining position, the restraining element is positioned and/or arranged to restrict or limit lateral (eg, horizontal) movement of the wafer-shaped article supported by the non-rotating plate.
相反，在非限制位置中，限制元件的定位和/或布置不是为了限制或限定或约束晶片状物件的横向(例如水平)运动。In contrast, in the non-restrained position, the restraining element is positioned and/or arranged so as not to restrict or limit or constrain lateral (eg, horizontal) movement of the wafer-shaped article.
例如，限制元件可替代地被称为横向移动限制元件，或限制部件，或横向移动限制部件。For example, a limiting element may alternatively be referred to as a lateral movement limiting element, or a limiting component, or a lateral movement limiting component.
例如，术语元件可意指部分(part)、构件(member)或部件(component)。For example, the term element may mean a part, a member, or a component.
在晶片状物件被非旋转板支撑时以及晶片状物件被旋转卡盘接收之前，限制元件可用于限制或限定或约束晶片状物件相对于非旋转板的横向(例如水平)运动。The restraining element may be used to limit or restrict or constrain lateral (eg, horizontal) movement of the wafer-shaped article relative to the non-rotating plate while the wafer-shaped article is supported by the non-rotating plate and before the wafer-shaped article is received by the rotating chuck.
限制元件可被定位或配置为当晶片状物件位于非旋转板的中心且限制元件处于限制位置时不与晶片状物件接触。因此，只有当晶片状物件相对于非旋转板横向(例如水平)移动，使其不在非旋转板的中心时，限制元件才会在其位于限制位置时与晶片状物件接触。The restraining element may be positioned or configured to not contact the wafer-shaped object when the wafer-shaped object is centered on the non-rotating plate and the restraining element is in the restraining position. Thus, the restraining element will only contact the wafer-shaped object when it is in the restraining position if the wafer-shaped object is laterally (e.g., horizontally) moved relative to the non-rotating plate so that it is not centered on the non-rotating plate.
限制元件各自可在限制位置和非限制位置之间旋转。因此，移动限制元件可意指或包含旋转限制元件。因此，术语移动包含旋转限制元件。The restriction elements can each be rotated between a restriction position and an unrestricted position. Thus, a movement restriction element may mean or include a rotation restriction element. Thus, the term movement includes a rotation restriction element.
限制位置和非限制位置可以是限制元件的旋转位置。因此，术语位置包含旋转位置。The restraining position and the non-restraining position may be rotational positions of the restraining element. Thus, the term position encompasses rotational positions.
限制元件可为或包含限制销，每一限制销可在限制位置和非限制位置之间旋转。The restraining elements may be or include restraining pins, each restraining pin being rotatable between a restraining position and an unrestrained position.
限制元件各自可为或包含臂(arm)、或构件、或突出部、或长形部件，其可在限制位置和非限制位置之间移动，例如可旋转。The restraining elements may each be or comprise an arm, or a member, or a protrusion, or an elongated part, which is movable, for example rotatable, between a restraining position and a non-restraining position.
限制元件可各自包含臂或销，其可旋转以使臂或销在限制位置与晶片状物件的径向外缘重叠，或在非限制位置不与晶片状物件的径向外缘重叠。The restraining elements may each comprise an arm or a pin which is rotatable so that the arm or the pin overlaps the radially outer edge of the wafer-shaped article in the restraining position or does not overlap the radially outer edge of the wafer-shaped article in the non-restraining position.
如上所述，通常当限制元件处于限制位置时(取决于晶片状物件相对于非旋转板的横向或水平位置)，晶片状物件的径向外缘与部分或全部限制元件之间存在间隙。As described above, typically when the restraining element is in the restraining position (depending on the lateral or horizontal position of the wafer-shaped article relative to the non-rotating plate), there is a gap between the radial outer edge of the wafer-shaped article and part or all of the restraining element.
优选地，至少有三个限制元件。可以有三个(正好或只有三个)限制元件。然而，限制元件可以有三个以上。Preferably, there are at least three restraining elements. There may be three (exactly or only three) restraining elements. However, there may be more than three restraining elements.
当晶片状物件被非旋转板支撑且限制元件处于限制位置时，限制元件可围绕晶片状物件。When the wafer-shaped article is supported by the non-rotating plate and the restraining element is in the restraining position, the restraining element may surround the wafer-shaped article.
当晶片状物件被非旋转板支撑且限制元件处于限制位置时，限制元件可围绕晶片状物件呈圆形布置。When the wafer-shaped article is supported by the non-rotating plate and the restraining elements are in the restraining position, the restraining elements may be arranged in a circle around the wafer-shaped article.
在晶片状物件被旋转卡盘接收之前或之后，限制元件被移动至非限制位置。特别是，在以装置对晶片状物件进行处理期间，晶片状物件被接触元件抓取或夹住，且限制元件不用于限制晶片状物件的横向(例如水平)运动。Before or after the wafer-shaped object is received by the rotary chuck, the restraining element is moved to a non-restraining position. In particular, during processing of the wafer-shaped object by the device, the wafer-shaped object is grasped or clamped by the contact element, and the restraining element is not used to restrict lateral (e.g., horizontal) movement of the wafer-shaped object.
接触元件可为或包含抓取销组件，每一抓取销件可在抓取位置和非抓取位置之间旋转。因此，接触元件可被称为可旋转抓取销组件。因此，在抓取位置和非抓取位置之间移动接触元件可包含在抓取位置(第一旋转位置)和非抓取位置(第二旋转位置)之间旋转抓取销组件。The contact element may be or include a grab pin assembly, each grab pin being rotatable between a grab position and a non-grasp position. Thus, the contact element may be referred to as a rotatable grab pin assembly. Thus, moving the contact element between the grab position and the non-grasp position may include rotating the grab pin assembly between the grab position (first rotational position) and the non-grasp position (second rotational position).
抓取销组件可围绕抓取销组件的纵轴在抓取位置和非抓取位置之间旋转。The grab pin assembly is rotatable about a longitudinal axis of the grab pin assembly between a grab position and a non-grab position.
替代地，接触元件可各自为销或突出部，其可在抓取位置和非抓取位置之间移动。例如，接触元件可各自为抓取销组件的销或突出部，抓取销组件可旋转以在抓取位置和非抓取位置之间移动突出部或销。Alternatively, the contact elements may each be a pin or a projection that can be moved between a gripping position and a non-gripping position. For example, the contact elements may each be a pin or a projection of a gripping pin assembly that can be rotated to move the projection or the pin between the gripping position and the non-gripping position.
每一可旋转抓取销组件可具有偏心(相对于抓取销组件的纵轴而言偏离中心)的突出部，其从可旋转抓取销组件的顶部突出，以便突出进入包含晶片状物件的平面。可旋转抓取销组件围绕其纵轴旋转，导致偏心突出部向旋转卡盘的顶表面的中心靠近或远离。因此，通过同步旋转多个可旋转抓取销组件，可使可旋转抓取销组件抓取晶片状物件的径向外缘(周边边缘或圆周边缘)，从而使晶片状物件通过旋转卡盘旋转。Each rotatable grab pin assembly may have an eccentric (off-center relative to the longitudinal axis of the grab pin assembly) protrusion that protrudes from the top of the rotatable grab pin assembly so as to protrude into a plane containing the wafer-shaped object. The rotatable grab pin assembly rotates about its longitudinal axis, causing the eccentric protrusion to move closer to or farther from the center of the top surface of the rotating chuck. Therefore, by synchronously rotating the plurality of rotatable grab pin assemblies, the rotatable grab pin assemblies can be caused to grab the radial outer edge (peripheral edge or circumferential edge) of the wafer-shaped object, thereby causing the wafer-shaped object to rotate through the rotating chuck.
可旋转抓取销组件或可旋转抓取销组件的突出部可被视为对应于权利要求1中的接触元件。The rotatable grab pin assembly or the protrusion of the rotatable grab pin assembly may be regarded as corresponding to the contact element in claim 1 .
可旋转抓取销组件可各自包含齿轮，其与旋转卡盘中所提供的公共环形齿轮相啮合，以使环形齿轮的旋转导致每一可旋转抓取销组件同时旋转。The rotatable grab pin assemblies may each include a gear that meshes with a common ring gear provided in the rotary chuck such that rotation of the ring gear causes each rotatable grab pin assembly to rotate simultaneously.
可旋转抓取销组件可位于旋转卡盘的顶表面的周边区或区域中。The rotatable grab pin assembly may be located in a peripheral region or area of the top surface of the rotary chuck.
当旋转卡盘旋转时，抓取销组件与旋转卡盘一起旋转，且因此被抓取销组件所抓取的晶片状物件也与旋转卡盘一起旋转。例如，随着旋转卡盘的旋转，抓取销组件可在一圆内旋转。When the rotary chuck rotates, the grab pin assembly rotates with the rotary chuck, and therefore the wafer-shaped object grabbed by the grab pin assembly also rotates with the rotary chuck. For example, as the rotary chuck rotates, the grab pin assembly can rotate in a circle.
旋转卡盘可包含边缘环，边缘环限定出径向内表面，其被配置为在包含晶片状物件的平面上方和下方沿轴向方向延伸，其中边缘环被配置为环绕晶片状物件的径向外缘。因此，对于晶片状物件的整个径向外缘，边缘环的径向内表面与晶片状物件的径向外缘相对(当晶片状物件被旋转卡盘接收时)。The rotary chuck may include an edge ring defining a radially inner surface configured to extend in an axial direction above and below a plane containing the wafer-shaped article, wherein the edge ring is configured to surround a radially outer edge of the wafer-shaped article. Thus, the radially inner surface of the edge ring is opposite the radially outer edge of the wafer-shaped article (when the wafer-shaped article is received by the rotary chuck) for the entire radially outer edge of the wafer-shaped article.
边缘环的径向内表面可包括多个凹槽，多个凹槽用于在接触元件处于抓取位置时接收每一接触元件的至少一部分。The radially inner surface of the edge ring may include a plurality of grooves for receiving at least a portion of each contact element when the contact element is in the captured position.
旋转卡盘可包含非旋转液体分配喷嘴，其用于将液体分配至面向旋转卡盘的晶片状物件的表面上。晶片状物件面向旋转卡盘的表面可被称为晶片状物件的底表面。The spin chuck may include a non-rotating liquid dispensing nozzle for dispensing liquid onto a surface of the wafer-shaped article that faces the spin chuck. The surface of the wafer-shaped article that faces the spin chuck may be referred to as the bottom surface of the wafer-shaped article.
液体分配喷嘴不旋转是意指液体分配喷嘴不与旋转卡盘一起旋转。The liquid dispensing nozzle does not rotate means that the liquid dispensing nozzle does not rotate with the rotating chuck.
装置可包含液体源，其与液体分配喷嘴连接(例如经由一或多个液体供应路径或管道连接)，以用于向液体分配喷嘴供应液体。The device may comprise a liquid source connected to the liquid dispensing nozzle (eg connected via one or more liquid supply paths or conduits) for supplying liquid to the liquid dispensing nozzle.
旋转卡盘可包含多个非旋转液体分配喷嘴。The rotating chuck may contain a plurality of non-rotating liquid dispensing nozzles.
非旋转液体分配喷嘴可连接至和/或设置在旋转卡盘的固定支柱上。例如，可在固定支柱中设置液体供应路径或管道，以向液体分配喷嘴供应液体。固定支柱可为固定的中央支柱。The non-rotating liquid dispensing nozzle may be connected to and/or disposed on a fixed support of the rotating chuck. For example, a liquid supply path or conduit may be disposed in the fixed support to supply liquid to the liquid dispensing nozzle. The fixed support may be a fixed central support.
固定支柱可被称为非旋转支柱。支柱可为杆或轴。A fixed strut may be referred to as a non-rotating strut. A strut may be a rod or a shaft.
支柱固定是意指支柱不与旋转卡盘一起旋转。The pillar is fixed in the sense that the pillar does not rotate with the rotating chuck.
旋转卡盘可包含卡盘主体，其安装成围绕固定支柱旋转。The rotary chuck may include a chuck body mounted for rotation about a stationary post.
接触元件可(直接或间接地)连接至卡盘主体，或安装在卡盘主体上或卡盘主体中，以便接触元件与卡盘主体一起旋转。The contact element may be connected (directly or indirectly) to the chuck body, or mounted on or in the chuck body so that the contact element rotates with the chuck body.
旋转卡盘可包含形成旋转卡盘的顶表面的圆盘或平板，其面向旋转卡盘所接收的晶片状物件。The spin chuck may include a disk or a plate forming a top surface of the spin chuck that faces the wafer-shaped article received by the spin chuck.
圆盘或平板可与旋转卡盘一起旋转。The disc or plate can rotate with the rotary chuck.
接触元件可围绕圆盘或平板的周边布置。The contact elements may be arranged around the circumference of the disk or plate.
装置可包含马达，例如电动马达，其用于驱动卡盘主体相对于固定支柱旋转。The apparatus may include a motor, such as an electric motor, for driving the chuck body in rotation relative to the fixed support post.
装置可包含致动器，其用于使非旋转板朝向以及远离旋转卡盘移动，和/或用于使旋转卡盘朝向以及远离非旋转板移动。The apparatus may include an actuator for moving the non-rotating plate toward and away from the rotating chuck and/or for moving the rotating chuck toward and away from the non-rotating plate.
致动器可被操作以改变非旋转板在装置的底座上方的高度。The actuator may be operable to vary the height of the non-rotating plate above the base of the device.
致动器可被操作以改变非旋转板在旋转卡盘上方的高度(或间距)。The actuator may be operated to vary the height (or spacing) of the non-rotating plate above the rotating chuck.
例如，致动器可包含可伸展杆、部件或元件，其直接或间接地连接至非旋转板。致动器也可直接或间接地连接至旋转卡盘上，或连接至装置中相对于旋转卡盘具有固定位置的部件。For example, the actuator may comprise an extendable rod, component or element that is directly or indirectly connected to a non-rotating plate. The actuator may also be directly or indirectly connected to a rotating chuck, or to a component in the device that has a fixed position relative to the rotating chuck.
装置还可包含致动器，致动器用于(同步，或同时，例如以相同速度和/或相同距离)一起移动非旋转板以及旋转卡盘，例如，使旋转卡盘以及非旋转板可在竖直方向上被提升或降低，例如，改变旋转卡盘相对于装置的周围处理室的高度。The device may also include an actuator for moving the non-rotating plate and the rotating chuck together (synchronously, or simultaneously, such as at the same speed and/or the same distance), for example, so that the rotating chuck and the non-rotating plate can be raised or lowered in a vertical direction, for example, to change the height of the rotating chuck relative to the surrounding processing chamber of the device.
例如，旋转卡盘可固定在可移动支撑件(或可移动支撑部件)，其可相对于装置的另一部件，例如装置的处理室移动。因此，旋转卡盘与可移动支撑件(例如以相同速度和/或相同距离)一起移动。For example, the spin chuck can be fixed to a movable support (or movable support member) that is movable relative to another component of the device, such as a processing chamber of the device. Thus, the spin chuck moves together with the movable support (e.g., at the same speed and/or the same distance).
例如，可移动支撑件可在竖直方向上向上和向下移动，以便使旋转卡盘在竖直方向上向上和向下移动。For example, the movable support may be movable upward and downward in the vertical direction to move the spin chuck upward and downward in the vertical direction.
装置可包含第一致动器，例如电动马达和/或线性致动器，其用于移动可移动支撑件。The device may comprise a first actuator, such as an electric motor and/or a linear actuator, for moving the movable support.
可移动支撑件可被称为可移动支撑框架，或可移动支撑台(scaffold)，或位移支撑件，或线性平移机构，或位移机构。The movable support may be referred to as a movable support frame, or a movable support scaffold, or a displacement support, or a linear translation mechanism, or a displacement mechanism.
非旋转板可经由第二致动器连接至可动支撑件，第二致动器可被操作以使非旋转板相对于可动支撑件移动。The non-rotating plate may be connected to the movable support via a second actuator, the second actuator being operable to move the non-rotating plate relative to the movable support.
例如，第二致动器可被操作以使非旋转板相对于可动支撑件在竖直方向上向上和向下移动。For example, the second actuator may be operable to move the non-rotating plate upward and downward in a vertical direction relative to the movable support.
装置可包含可动支撑件，旋转卡盘固定在可动支撑件上，且非旋转板可经由致动器(第二致动器)连接至可动支撑件上，致动器可被操作以使非旋转板相对于可动支撑件移动。The device may comprise a movable support to which the rotating chuck is fixed, and the non-rotating plate may be connected to the movable support via an actuator (second actuator) operable to move the non-rotating plate relative to the movable support.
例如，第二致动器可包含线性致动器。For example, the second actuator may include a linear actuator.
当可动支撑件在竖直方向上向上或向下移动，且第二致动器未被操作时，非旋转板与可动支撑件一起在竖直方向上向上或向下移动。因此，非旋转板以及旋转卡盘都一起(即以相同速度和/或相同距离)在竖直方向上向上或向下移动。When the movable support moves upward or downward in the vertical direction and the second actuator is not operated, the non-rotating plate moves upward or downward in the vertical direction together with the movable support. Therefore, the non-rotating plate and the rotating chuck move upward or downward in the vertical direction together (i.e., at the same speed and/or the same distance).
当第二致动器被操作时，非旋转板相对于可动支撑件移动，从而使非旋转板相对于旋转卡盘移动。When the second actuator is operated, the non-rotating plate moves relative to the movable support, thereby causing the non-rotating plate to move relative to the rotating chuck.
通过这样的布置，非旋转板以及旋转卡盘可一起移动，或者非旋转板可相对于旋转卡盘移动。With such an arrangement, the non-rotating plate and the rotating chuck may move together, or the non-rotating plate may move relative to the rotating chuck.
可动支撑件可包含底座部件，例如底板，以及顶部部件，例如顶板，它们被连接或固定在一起，例如通过一或多个连接器，例如杆子进行。因此，底座部件以及顶部部件一起移动(即以相同速度和/或相同距离一起移动)。The movable support may include a base member, such as a bottom plate, and a top member, such as a top plate, which are connected or fixed together, such as by one or more connectors, such as rods. Therefore, the base member and the top member move together (i.e., move together at the same speed and/or the same distance).
致动器，例如线性致动器，可连接至底座部件，并被配置为在竖直方向上移动底座部件。An actuator, such as a linear actuator, may be coupled to the base member and configured to move the base member in a vertical direction.
旋转卡盘可直接或间接地连接或固定在底座部件上，从而使旋转卡盘与底座部件一起移动(即以相同速度和/或相同距离一起移动)。The rotary chuck may be directly or indirectly connected or fixed to the base member so that the rotary chuck moves together with the base member (ie, moves together at the same speed and/or the same distance).
非旋转板可通过致动器连接至顶部部件。具体而言，非旋转板可位于顶部部件的下方，且经由致动器与顶部部件的底侧连接。致动器可被配置为在竖直方向上相对于可动支撑件移动非旋转板，从而使非旋转板在竖直方向上相对于旋转卡盘移动。The non-rotating plate may be connected to the top component via an actuator. Specifically, the non-rotating plate may be located below the top component and connected to the bottom side of the top component via the actuator. The actuator may be configured to move the non-rotating plate relative to the movable support in a vertical direction, thereby moving the non-rotating plate relative to the rotating chuck in a vertical direction.
如上所述，非旋转板可用于支撑晶片状物件。然后，非旋转板可以通过(第二)致动器朝向旋转卡盘移动，从而使晶片状物件可被旋转卡盘接收(即被旋转卡盘的接触元件抓取或夹住)，同时晶片状物件从上方被非旋转板支撑。As described above, the non-rotating plate can be used to support the wafer-shaped article. The non-rotating plate can then be moved toward the rotating chuck by the (second) actuator so that the wafer-shaped article can be received by the rotating chuck (i.e., grasped or clamped by the contact elements of the rotating chuck) while the wafer-shaped article is supported from above by the non-rotating plate.
如上所述，在晶片状物件被旋转卡盘接收之前，非旋转板上的限制元件可用于限制晶片状物件相对于非旋转板的横向(例如水平)运动。当晶片状物件被旋转卡盘接收时，限制元件不再用于限制晶片状物件的横向(例如水平)运动。As described above, before the wafer-shaped object is received by the rotating chuck, the limiting elements on the non-rotating plate can be used to limit the lateral (e.g., horizontal) movement of the wafer-shaped object relative to the non-rotating plate. When the wafer-shaped object is received by the rotating chuck, the limiting elements are no longer used to limit the lateral (e.g., horizontal) movement of the wafer-shaped object.
装置可进一步包含加热器，加热器用于在晶片状物件被旋转卡盘接收时加热晶片状物件。The apparatus may further include a heater for heating the wafer-shaped article when the wafer-shaped article is received by the rotary chuck.
例如，加热器可包含一或多个发光加热元件，例如LED。加热器可包含发光加热元件的阵列。For example, the heater may comprise one or more light emitting heating elements, such as LEDs. The heater may comprise an array of light emitting heating elements.
当晶片状物件被旋转卡盘接收时，加热器可被配置为位于晶片状物件的上方，并加热晶片状物件的顶表面。When the wafer-shaped article is received by the spin chuck, the heater may be configured to be positioned above the wafer-shaped article and to heat a top surface of the wafer-shaped article.
替代地，当晶片状物件被旋转卡盘接收时，加热器可被配置为位于晶片状物件的下方，并加热晶片状物件的底表面。Alternatively, the heater may be configured to be positioned below the wafer-shaped article and heat a bottom surface of the wafer-shaped article when the wafer-shaped article is received by the spin chuck.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
现在将参照附图，仅以举例的方式讨论本发明的实施方案，其中：Embodiments of the present invention will now be discussed, by way of example only, with reference to the accompanying drawings, in which:
图1为可用于本发明的一实施方案中的第一配置的非旋转板的局部剖面视图的示意图；FIG1 is a schematic diagram of a partial cross-sectional view of a first configuration of a non-rotating plate that may be used in one embodiment of the present invention;
图2为图1的非旋转板在第二配置中的局部剖面视图的示意图；FIG2 is a schematic diagram of a partial cross-sectional view of the non-rotating plate of FIG1 in a second configuration;
图3为可用于本发明的一实施方案的非旋转板的底表面的示意图；FIG3 is a schematic diagram of the bottom surface of a non-rotating plate that can be used in one embodiment of the present invention;
图4为可用于本发明的一实施方案的旋转卡盘的示意图；FIG4 is a schematic diagram of a spin chuck that may be used in one embodiment of the present invention;
图5为图4的旋转卡盘的示意图，旋转卡盘上接收有半导体晶片；FIG5 is a schematic diagram of the rotary chuck of FIG4 , with a semiconductor wafer received on the rotary chuck;
图6为可用于本发明的一实施方案的旋转卡盘的局部剖面视图的示意图；FIG6 is a schematic diagram of a partial cross-sectional view of a spin chuck that may be used in one embodiment of the present invention;
图7为根据本发明的一实施方案的装置的局部剖面视图的示意图；以及FIG. 7 is a schematic diagram of a partial cross-sectional view of an apparatus according to an embodiment of the present invention; and
图8为根据本发明的一实施方案的装置的示意图。FIG. 8 is a schematic diagram of an apparatus according to an embodiment of the present invention.
具体实施方式DETAILED DESCRIPTION
现在将参照附图来讨论本发明的方面以及实施方案。对于本领域的技术人员而言，进一步的方面以及实施方案将是显而易见的。本文中所提到的所有文件通过参考而并入本文。Aspects and embodiments of the present invention will now be discussed with reference to the accompanying drawings. Further aspects and embodiments will be apparent to those skilled in the art. All documents mentioned herein are incorporated herein by reference.
图1为可用于本发明的一实施方案的非旋转板1的局部剖面视图的示意图。FIG. 1 is a schematic diagram of a partial cross-sectional view of a non-rotating plate 1 that may be used in one embodiment of the present invention.
图2为图1的非旋转板1在第二配置中的局部剖面视图的示意图。FIG. 2 is a schematic diagram of a partial cross-sectional view of the non-rotating plate 1 of FIG. 1 in a second configuration.
图3为可用于本发明的一实施方案的非旋转板1的底表面的示意图。FIG. 3 is a schematic diagram of the bottom surface of a non-rotating plate 1 that can be used in one embodiment of the present invention.
根据本发明的实施方案，非旋转板1可用于处理晶片状物件的装置。According to an embodiment of the present invention, the non-rotating plate 1 may be used in an apparatus for processing wafer-shaped objects.
非旋转板1可替代地被称为非旋转板组件，或伯努利板，或伯努利板组件。The non-rotating plate 1 may alternatively be referred to as a non-rotating plate assembly, or a Bernoulli plate, or a Bernoulli plate assembly.
根据伯努利原理，非旋转板1被配置为利用气体供应从上方支撑半导体晶片W的重量。The non-rotating plate 1 is configured to support the weight of the semiconductor wafer W from above using a gas supply according to Bernoulli's principle.
如图3所示，当从底表面(非旋转板1的面向由非旋转板1所支撑的半导体晶片W的表面)观察时，非旋转板1可具有圆形形状。As shown in FIG. 3 , the non-rotating plate 1 may have a circular shape when viewed from a bottom surface (a surface of the non-rotating plate 1 facing the semiconductor wafer W supported by the non-rotating plate 1 ).
如图1所示，非旋转板1容纳气体分配室2。气体分配室2经由气体供应路径3(例如管道或管子)与外部气体源连接。因此，气体可经由气体供应路径3从外部气源体供应至气体分配室2。As shown in Fig. 1, the non-rotating plate 1 accommodates a gas distribution chamber 2. The gas distribution chamber 2 is connected to an external gas source via a gas supply path 3 (e.g., a pipe or tube). Therefore, gas can be supplied to the gas distribution chamber 2 from an external gas source body via the gas supply path 3.
如图1所示，非旋转板1进一步包含多个气体喷嘴4，其在非旋转板1的底表面具有出口5。气体喷嘴4都与非旋转板1内的气体分配室2连接。因此，供应至气体分配室2的气体经由气体喷嘴4从出口5分配至非旋转板1的底表面。As shown in Fig. 1, the non-rotating plate 1 further comprises a plurality of gas nozzles 4 having outlets 5 at the bottom surface of the non-rotating plate 1. The gas nozzles 4 are all connected to the gas distribution chamber 2 in the non-rotating plate 1. Therefore, the gas supplied to the gas distribution chamber 2 is distributed from the outlets 5 to the bottom surface of the non-rotating plate 1 via the gas nozzles 4.
如图3所示，气体喷嘴4的出口5在非旋转板1的底表面上围绕非旋转板1的底表面中心呈圆形布置。As shown in FIG. 3 , the outlets 5 of the gas nozzles 4 are arranged in a circle around the center of the bottom surface of the non-rotating plate 1 on the bottom surface of the non-rotating plate 1 .
此外，气体喷嘴4的出口5都布置在非旋转板1的底表面的周边或外部区域或地区。Furthermore, the outlets 5 of the gas nozzles 4 are arranged at the periphery or outer area or region of the bottom surface of the non-rotating plate 1 .
气体喷嘴4的出口5都较非旋转板1的底表面中心更靠近非旋转板1的底表面外缘。The outlets 5 of the gas nozzles 4 are all located closer to the outer edge of the bottom surface of the non-rotating plate 1 than to the center of the bottom surface of the non-rotating plate 1 .
此外，如图1所示，每一气体喷嘴4相对于非旋转板1的底表面至少部分地在径向向外的方向上呈斜角。具体而言，每一气体喷嘴4的角度是使气体相对于非旋转板1的底表面至少部分地在径向向外的方向上以锐角离开出口5。1 , each gas nozzle 4 is at least partially angled in a radially outward direction relative to the bottom surface of the non-rotating plate 1. Specifically, the angle of each gas nozzle 4 is such that the gas leaves the outlet 5 at an acute angle at least partially in a radially outward direction relative to the bottom surface of the non-rotating plate 1.
气体喷嘴4的出口5布置在非旋转板1的底表面上，以便在半导体晶片W被非旋转板1支撑时被半导体晶片W的周边区域或地区所覆盖。The outlets 5 of the gas nozzles 4 are arranged on the bottom surface of the non-rotating plate 1 so as to be covered by the peripheral area or region of the semiconductor wafer W when the semiconductor wafer W is supported by the non-rotating plate 1 .
气体喷嘴4和出口5的这种配置意味着，当半导体晶片W靠近非旋转板1的底表面时，例如在距离非旋转板1的底表面0.3mm至5mm的距离，且经由气体喷嘴4从出口5供应压缩气体，例如氮气，通过从出口5离开的气体，由于伯努利原理在非旋转板1的底表面和半导体晶片W之间产生真空或低压，晶片在平衡状态下与非旋转板1以非接触的方式保持。This configuration of the gas nozzle 4 and the outlet 5 means that when the semiconductor wafer W is close to the bottom surface of the non-rotating plate 1, for example at a distance of 0.3 mm to 5 mm from the bottom surface of the non-rotating plate 1, and compressed gas, such as nitrogen, is supplied from the outlet 5 via the gas nozzle 4, a vacuum or low pressure is generated between the bottom surface of the non-rotating plate 1 and the semiconductor wafer W due to the Bernoulli principle by the gas leaving from the outlet 5, and the wafer is held in a non-contact manner with the non-rotating plate 1 in a balanced state.
因此，半导体晶片W以自由漂浮的方式保持在非旋转板1的底表面下方，且不与非旋转板1的底表面发生物理接触。Therefore, the semiconductor wafer W is held below the bottom surface of the non-rotating plate 1 in a free-floating manner without coming into physical contact with the bottom surface of the non-rotating plate 1 .
如图1所示，为了在半导体晶片W被非旋转板1支撑时限制半导体晶片W相对于非旋转板1的横向移动，非旋转板1可包含多个晶片限制销6，其可移动至晶片限制位置。As shown in FIG. 1 , in order to restrict lateral movement of the semiconductor wafer W relative to the non-rotating plate 1 when the semiconductor wafer W is supported by the non-rotating plate 1 , the non-rotating plate 1 may include a plurality of wafer restricting pins 6 that are movable to wafer restricting positions.
如图1所示，每一晶片限制销6包含销、杆或臂7(在下文中称为销7)，其可旋转地安装在非旋转板1上的枢轴8。销7可围绕枢轴8旋转至限制位置，其中销7沿非旋转板的侧表面(圆周表面)向下延伸，且突出于非旋转板的底表面，在这里它们与非旋转板1所支撑的半导体晶片W的径向外缘重叠。As shown in Fig. 1, each wafer restraining pin 6 comprises a pin, a rod or an arm 7 (hereinafter referred to as pin 7), which is rotatably mounted on a pivot 8 on the non-rotating plate 1. The pin 7 can be rotated around the pivot 8 to a restraining position, wherein the pin 7 extends downward along the side surface (circumferential surface) of the non-rotating plate and protrudes from the bottom surface of the non-rotating plate, where they overlap with the radial outer edge of the semiconductor wafer W supported by the non-rotating plate 1.
如图1所示，当晶片W相对于非旋转板1的底表面处于中心位置时，晶片W的径向外缘与处于限制位置的每一销7之间存在间隙。因此，当晶片W相对于非旋转板1的底表面处于中心位置时，销7不会接触晶片W的径向外缘。然而，如果晶片W相对于非旋转板1的底表面横向(例如水平)移动，晶片的径向外缘将与一或多个销7接触。因此，当销7处于限制位置时，销7限制(即约束(restrict))晶片W的横向移动。As shown in FIG1 , when the wafer W is in the center position relative to the bottom surface of the non-rotating plate 1, there is a gap between the radial outer edge of the wafer W and each pin 7 in the limiting position. Therefore, when the wafer W is in the center position relative to the bottom surface of the non-rotating plate 1, the pins 7 do not contact the radial outer edge of the wafer W. However, if the wafer W moves laterally (e.g., horizontally) relative to the bottom surface of the non-rotating plate 1, the radial outer edge of the wafer will contact one or more pins 7. Therefore, when the pins 7 are in the limiting position, the pins 7 limit (i.e., restrict) the lateral movement of the wafer W.
此外，销7可围绕枢轴8旋转至非限制位置，在此销7不突出于非旋转板1的底表面，且不限制由非旋转板1所支撑的半导体晶片W的横向移动。Furthermore, the pins 7 can be rotated about the pivots 8 to a non-restricting position where the pins 7 do not protrude from the bottom surface of the non-rotating plate 1 and do not restrict lateral movement of the semiconductor wafer W supported by the non-rotating plate 1 .
图2显示了晶片限制销6的销7旋转至非限制位置的情况。FIG. 2 shows the state where the pin 7 of the wafer restraining pin 6 is rotated to the non-restraining position.
此外，如图1所示，非旋转板1进一步包含多个液体分配喷嘴9，其位于气体喷嘴4的径向外侧。液体分配喷嘴9被指向由非旋转板1所支撑的半导体晶片W的边缘区域。液体分配喷嘴9在非旋转板1的底表面具有出口10。1 , the non-rotating plate 1 further comprises a plurality of liquid dispensing nozzles 9 located radially outside the gas nozzles 4. The liquid dispensing nozzles 9 are directed toward the edge region of the semiconductor wafer W supported by the non-rotating plate 1. The liquid dispensing nozzles 9 have outlets 10 at the bottom surface of the non-rotating plate 1.
如图3所示，在一实施方案中，在非旋转板1的底表面上可有三个具有出口10的液体分配喷嘴9。出口10可均匀地分布在以非旋转板1的底表面中心为中心的圆周上。As shown in Figure 3, in one embodiment, there may be three liquid dispensing nozzles 9 having outlets 10 on the bottom surface of the non-rotating plate 1. The outlets 10 may be evenly distributed on a circumference centered on the center of the bottom surface of the non-rotating plate 1.
如图1所示，液体分配喷嘴9(或邻近非旋转板底表面的至少一部分液体分配喷嘴9)可相对于非旋转板1的底表面成斜角，至少部分在径向向外的方向上。As shown in FIG. 1 , the liquid dispensing nozzles 9 (or at least a portion of the liquid dispensing nozzles 9 adjacent the bottom surface of the non-rotating plate) may be angled relative to the bottom surface of the non-rotating plate 1 , at least partially in a radially outward direction.
液体分配喷嘴9(或邻近非旋转板底表面的至少一部分液体分配喷嘴9)相对于非旋转板1的底表面可呈锐角(角度小于90度)。The liquid dispensing nozzles 9 (or at least a portion of the liquid dispensing nozzles 9 adjacent to the bottom surface of the non-rotating plate) may be at an acute angle (angle less than 90 degrees) relative to the bottom surface of the non-rotating plate 1 .
液体分配喷嘴9经由液体供应路径11(例如管道或管子)各自与外部液体源连接。因此，液体可从外部液体源经由液体供应路径11供应至液体分配喷嘴9。The liquid dispensing nozzles 9 are each connected to an external liquid source via a liquid supply path 11 (eg, a pipe or a tube). Therefore, liquid can be supplied from the external liquid source to the liquid dispensing nozzles 9 via the liquid supply path 11.
液体可为蚀刻液体或清洗液体。The liquid may be an etching liquid or a cleaning liquid.
每一液体分配喷嘴9的位置和/或方向都可调整。例如，每一液体分配喷嘴9可相对于非旋转板1的底表面在径向方向上移动，以改变液体分配喷嘴9的出口10的径向位置。例如，每一液体分配喷嘴9可具有调整螺丝，其可旋转以调整液体分配喷嘴9的径向位置。替代地，每一液体分配喷嘴9和/或非旋转板1可具有电动致动器，例如马达，其被配置为在径向方向上移动液体分配喷嘴9。这可使形成在半导体晶片W的表面上的斜面或底切的尺寸得到可控的调整。The position and/or direction of each liquid dispensing nozzle 9 can be adjusted. For example, each liquid dispensing nozzle 9 can be moved in a radial direction relative to the bottom surface of the non-rotating plate 1 to change the radial position of the outlet 10 of the liquid dispensing nozzle 9. For example, each liquid dispensing nozzle 9 can have an adjustment screw that can be rotated to adjust the radial position of the liquid dispensing nozzle 9. Alternatively, each liquid dispensing nozzle 9 and/or the non-rotating plate 1 can have an electric actuator, such as a motor, which is configured to move the liquid dispensing nozzle 9 in a radial direction. This can make the size of the bevel or undercut formed on the surface of the semiconductor wafer W controllably adjustable.
例如，每一液体分配喷嘴可被包含在液体分配模块中，其连接至非旋转板1，且可相对于非旋转板1调整其位置和/或方向。For example, each liquid dispensing nozzle may be included in a liquid dispensing module, which is connected to the non-rotating plate 1 and whose position and/or orientation may be adjusted relative to the non-rotating plate 1 .
在以该装置处理半导体晶片W期间，半导体晶片W根据伯努利原理从上方被非旋转板1支撑。此外，半导体晶片W的径向外缘还同时被旋转卡盘从下方抓取，并通过旋转卡盘相对于非旋转板1进行旋转。以下将讨论旋转卡盘的配置。During processing of the semiconductor wafer W by the apparatus, the semiconductor wafer W is supported from above by the non-rotating plate 1 according to the Bernoulli principle. In addition, the radial outer edge of the semiconductor wafer W is also simultaneously grasped from below by the rotating chuck and rotated by the rotating chuck relative to the non-rotating plate 1. The configuration of the rotating chuck will be discussed below.
非旋转板1不随着旋转卡盘旋转。因此，被旋转卡盘所抓取的半导体晶片W相对于非旋转板1旋转，因此也相对于非旋转板1上的液体分配喷嘴9旋转。The non-rotating plate 1 does not rotate with the rotating chuck. Therefore, the semiconductor wafer W grasped by the rotating chuck rotates relative to the non-rotating plate 1, and thus also rotates relative to the liquid dispensing nozzle 9 on the non-rotating plate 1.
图4为可用于本发明的一实施方案的旋转卡盘(rotary chuck)12的示意图。FIG. 4 is a schematic diagram of a rotary chuck 12 that may be used in one embodiment of the present invention.
图5为图4的旋转卡盘12的示意图，旋转卡盘12上接收有半导体晶片W。FIG. 5 is a schematic diagram of the spin chuck 12 of FIG. 4 , where a semiconductor wafer W is received on the spin chuck 12 .
图6为可用于本发明的一实施方案的旋转卡盘12的局部剖面视图的示意图。FIG. 6 is a schematic diagram of a partial cross-sectional view of a spin chuck 12 that may be used in one embodiment of the present invention.
根据本发明的实施方案，旋转卡盘12(或转动(spin)卡盘)可用于处理晶片状物件的装置。According to an embodiment of the present invention, a rotary chuck 12 (or a spin chuck) may be used in an apparatus for processing wafer-shaped objects.
如上所述，旋转卡盘12抓取并旋转半导体晶片W，同时经由伯努利原理，半导体晶片W被非旋转板1从上方支撑。As described above, the rotation chuck 12 grasps and rotates the semiconductor wafer W while the semiconductor wafer W is supported from above by the non-rotating plate 1 via the Bernoulli principle.
如图4所示，当从上方(旋转卡盘12的面向半导体晶片W的表面)观察时，旋转卡盘12具有圆形的形状。As shown in FIG. 4 , the spin chuck 12 has a circular shape when viewed from above (the surface of the spin chuck 12 facing the semiconductor wafer W).
旋转卡盘12包含顶表面13，其面向由旋转卡盘12所接收的半导体晶片W。然而，顶表面13通常不与半导体晶片W接触，因为半导体晶片W被非旋转板1从上方支撑。顶表面13可包含圆盘或平板。The spin chuck 12 includes a top surface 13 that faces the semiconductor wafer W received by the spin chuck 12. However, the top surface 13 is generally not in contact with the semiconductor wafer W because the semiconductor wafer W is supported from above by the non-rotating plate 1. The top surface 13 may include a disk or a flat plate.
旋转卡盘12包含一系列圆形的可旋转抓取销组件14，其设置在旋转卡盘12中，以便环绕由旋转卡盘12所接收的半导体晶片W的周边边缘(圆周边缘)。The spin chuck 12 includes a series of circular, rotatable grab pin assemblies 14 disposed in the spin chuck 12 so as to surround the peripheral edge (circumferential edge) of a semiconductor wafer W received by the spin chuck 12 .
可旋转抓取销组件14可旋转以抓取半导体晶片W的周边边缘。The rotatable grab pin assembly 14 is rotatable to grab the peripheral edge of the semiconductor wafer W.
具体而言，如图4至图6所示，多个可旋转抓取销组件14中的每一个具有偏心(相对于抓取销组件14的纵轴而言偏离中心)突出部(14a)，其从可旋转抓取销组件14的顶部突出，高于旋转卡盘12的顶表面13。突出部14a垂直于旋转卡盘12的顶表面13延伸。4 to 6, each of the plurality of rotatable grab pin assemblies 14 has an eccentric (off-center relative to the longitudinal axis of the grab pin assembly 14) protrusion (14a) protruding from the top of the rotatable grab pin assembly 14, higher than the top surface 13 of the rotary chuck 12. The protrusion 14a extends perpendicularly to the top surface 13 of the rotary chuck 12.
可旋转抓取销组件14围绕其纵轴的旋转导致偏心突出部(14a)向旋转卡盘12的顶表面13的中心靠近或远离。因此，通过同步旋转多个可旋转抓取销组件14，可旋转抓取销组件14可通过突出部(14a)与半导体晶片W的周边边缘接触而导致抓取半导体晶片W的周边边缘。The rotation of the rotatable grab pin assembly 14 about its longitudinal axis causes the eccentric protrusion (14a) to move closer to or farther from the center of the top surface 13 of the rotary chuck 12. Therefore, by synchronously rotating a plurality of rotatable grab pin assemblies 14, the rotatable grab pin assemblies 14 can cause the peripheral edge of the semiconductor wafer W to be grabbed by contacting the protrusion (14a) with the peripheral edge of the semiconductor wafer W.
可旋转抓取销组件14位于旋转卡盘12的顶表面13的周边区域或地区。例如，顶表面13可包含圆盘或平板，且可旋转抓取销组件可围绕圆盘或平板的周边或圆周边缘布置。The rotatable grab pin assembly 14 is located at a peripheral area or region of the top surface 13 of the rotary chuck 12. For example, the top surface 13 may include a disk or a plate, and the rotatable grab pin assembly may be arranged around the peripheral or circumferential edge of the disk or plate.
如图6所示，可旋转抓取销组件14各自包含齿轮15，其与旋转卡盘12中所提供的公共环形齿轮16啮合，这样，环形齿轮16的旋转导致每一可旋转抓取销组件14同时旋转。As shown in FIG. 6 , the rotatable grab pin assemblies 14 each include a gear 15 that meshes with a common ring gear 16 provided in the rotary chuck 12 such that rotation of the ring gear 16 causes each rotatable grab pin assembly 14 to rotate simultaneously.
齿轮15位于或邻近抓取销组件14的底端(与偏心突出部相对的一端)。The gear 15 is located at or adjacent to the bottom end of the grab pin assembly 14 (the end opposite the eccentric protrusion).
环形齿轮16可旋转地安装在旋转卡盘12中，例如通过一或多个轴承17安装。The ring gear 16 is rotatably mounted in the rotary chuck 12 , for example by one or more bearings 17 .
环形齿轮16可相对于旋转卡盘12旋转，例如通过电动马达旋转。Ring gear 16 is rotatable relative to rotary chuck 12 , such as by an electric motor.
可旋转抓取销组件14可各自通过一或多个轴承可旋转地安装在旋转卡盘12中。The rotatable grab pin assemblies 14 may each be rotatably mounted in the rotary chuck 12 via one or more bearings.
旋转卡盘12可包含固定(非旋转的)支柱18，例如，其安装在旋转卡盘12的非旋转支撑件上。固定支柱18可位于旋转卡盘的中心位置。固定支柱可沿着旋转卡盘12的旋转轴延伸。The spin chuck 12 may include a fixed (non-rotating) post 18, for example, mounted on a non-rotating support of the spin chuck 12. The fixed post 18 may be located at a central location of the spin chuck. The fixed post may extend along the spin chuck 12's axis of rotation.
旋转卡盘12可进一步包含定子19，其也安装在支撑件上。定子安装在固定支柱18的周围。The rotary chuck 12 may further include a stator 19 which is also mounted on the support. The stator is mounted around the fixed support 18.
此外，旋转卡盘12可进一步包含转子20，其可被驱动以围绕定子19旋转，从而使转子20围绕固定支柱18旋转。Additionally, the spin chuck 12 may further include a rotor 20 that may be driven to rotate about the stator 19 , thereby causing the rotor 20 to rotate about the fixed support post 18 .
旋转卡盘主体21连接至转子20，且因此可通过转子20围绕固定支柱18旋转。旋转卡盘主体21包围或容纳可旋转抓取销组件14以及环形齿轮16，从而使这些可与旋转卡盘主体21一起围绕固定支柱18旋转。旋转卡盘12的顶表面13与旋转卡盘主体21一起旋转。例如，当顶表面13包含圆盘或平板时，圆盘或平板与旋转卡盘主体21连接，使得圆盘或平板与旋转卡盘主体21一起旋转。The rotating chuck body 21 is connected to the rotor 20 and can therefore be rotated around the fixed pillar 18 by the rotor 20. The rotating chuck body 21 surrounds or houses the rotatable grab pin assembly 14 and the ring gear 16 so that these can rotate around the fixed pillar 18 together with the rotating chuck body 21. The top surface 13 of the rotating chuck 12 rotates together with the rotating chuck body 21. For example, when the top surface 13 includes a disk or a plate, the disk or plate is connected to the rotating chuck body 21 so that the disk or plate rotates together with the rotating chuck body 21.
如图4和图6所示，固定支柱18可伸入或穿过形成在旋转卡盘12的顶表面13中的开口，例如形成在圆盘或平板中的开口。As shown in FIGS. 4 and 6 , the fixed post 18 may extend into or through an opening formed in the top surface 13 of the spin chuck 12 , such as an opening formed in a disk or a plate.
当操作抓取销组件14以抓取半导体晶片W且旋转卡盘主体21围绕固定支柱18旋转时，半导体晶片W与旋转卡盘主体21一起旋转。When the grab pin assembly 14 is operated to grab the semiconductor wafer W and the rotary chuck body 21 is rotated about the fixed support column 18 , the semiconductor wafer W is rotated together with the rotary chuck body 21 .
如图4和图6所示，旋转卡盘12包含固定支柱18上的多个液体分配喷嘴22。由于液体分配喷嘴22被设置在固定支柱18上，因此它们不会与旋转卡盘主体21一起旋转。4 and 6, the spin chuck 12 includes a plurality of liquid dispensing nozzles 22 on the fixed support 18. Since the liquid dispensing nozzles 22 are disposed on the fixed support 18, they do not rotate together with the spin chuck body 21.
液体分配喷嘴18可用于将液体分配至面向旋转卡盘12的半导体晶片W的表面。例如，液体可为蚀刻液体或清洁液体。The liquid dispensing nozzle 18 may be used to dispense liquid to the surface of the semiconductor wafer W facing the spin chuck 12. For example, the liquid may be an etching liquid or a cleaning liquid.
液体分配喷嘴18被配置为将一或多种液体分配至面向旋转卡盘12的半导体晶片W的表面上。例如，液体分配喷嘴18可被配置为在不同时间分配不同的液体。替代地或附加地，液体分配喷嘴可被配置为在同一时间分配一种以上的液体。The liquid dispensing nozzle 18 is configured to dispense one or more liquids onto the surface of the semiconductor wafer W facing the spin chuck 12. For example, the liquid dispensing nozzle 18 may be configured to dispense different liquids at different times. Alternatively or additionally, the liquid dispensing nozzle may be configured to dispense more than one liquid at the same time.
例如，液体分配喷嘴18可用于在一段时间内单独分配清洁液体，随后同时(从不同的液体分配喷嘴18)分配清洁液体和蚀刻液体。然后，液体分配喷嘴18可被配置为随后只分配清洁液体。这种安排对预湿以及去除化学残留物是有利的。For example, the liquid dispensing nozzles 18 can be used to dispense cleaning liquid alone for a period of time, and then dispense cleaning liquid and etching liquid simultaneously (from different liquid dispensing nozzles 18). The liquid dispensing nozzles 18 can then be configured to dispense only cleaning liquid. This arrangement is advantageous for pre-wetting and removing chemical residues.
如图6所示，在固定支柱18中设有多个液体供应路径23，其用于将液体从液体源供应至液体分配喷嘴22。每一液体供应路径23可连接至不同的各自的液体源。As shown in Fig. 6, a plurality of liquid supply paths 23 are provided in the fixed support 18 for supplying liquid from a liquid source to the liquid dispensing nozzle 22. Each liquid supply path 23 may be connected to a different respective liquid source.
图7为根据本发明一实施方案的装置24的局部剖面视图的示意图，其包含根据本发明一实施方案的非旋转板1和旋转卡盘12的示意图。非旋转板1可具有上述和/或图1至图3中所示的非旋转板的任何特征。旋转卡盘12可具有上述和/或图4至图6中所示的旋转卡盘12的任何特征。FIG7 is a schematic diagram of a partial cross-sectional view of an apparatus 24 according to an embodiment of the present invention, which includes a schematic diagram of a non-rotating plate 1 and a rotating chuck 12 according to an embodiment of the present invention. The non-rotating plate 1 can have any of the features of the non-rotating plate described above and/or shown in FIGS. 1 to 3. The rotating chuck 12 can have any of the features of the rotating chuck 12 described above and/or shown in FIGS. 4 to 6.
如图7所示，装置24包含非旋转板1，其用于根据伯努利原理通过气体供应从上方支撑半导体晶片W的重量。As shown in FIG. 7 , the apparatus 24 includes a non-rotating plate 1 for supporting the weight of a semiconductor wafer W from above by a gas supply according to the Bernoulli principle.
此外，装置24进一步包含旋转卡盘12，其用于从下方抓取或夹住半导体晶片W的径向外缘，以旋转半导体晶片W。In addition, the apparatus 24 further includes a rotation chuck 12 for grasping or clamping the radial outer edge of the semiconductor wafer W from below to rotate the semiconductor wafer W.
在操作中，首先通过将半导体晶片W定位在离非旋转板的底表面适当的距离处，并通过气体喷嘴4提供适当流量的气体(例如氮气)，以使半导体晶片W从上方被非旋转板1支撑。In operation, semiconductor wafer W is first supported from above by non-rotating plate 1 by positioning semiconductor wafer W at an appropriate distance from the bottom surface of the non-rotating plate and providing an appropriate flow of gas (eg nitrogen) through gas nozzle 4 .
此外，非旋转板1的晶片限制销6可旋转至限制位置，以限制半导体晶片相对于非旋转板的横向或水平移动。因此，半导体晶片W相对于非旋转板1的横向移动可被限制。In addition, the wafer limiting pins 6 of the non-rotating plate 1 can be rotated to a limiting position to limit the lateral or horizontal movement of the semiconductor wafer relative to the non-rotating plate. Therefore, the lateral movement of the semiconductor wafer W relative to the non-rotating plate 1 can be limited.
然后，使用致动器(下文将参照图8讨论其示例)将支撑半导体晶片W的非旋转板1向旋转卡盘12移动。Then, the non-rotating plate 1 supporting the semiconductor wafer W is moved toward the rotating chuck 12 using an actuator (an example of which will be discussed below with reference to FIG. 8 ).
致动器可被操作以改变非旋转板1在旋转卡盘12上方的高度(或间距)。The actuator may be operated to vary the height (or spacing) of the non-rotating plate 1 above the rotating chuck 12 .
当半导体晶片W足够靠近旋转卡盘12的顶表面13时，旋转卡盘12的可旋转抓取销组件14可旋转，以便抓取半导体晶片W的径向外缘，同时半导体晶片W由非旋转板1从上方支撑。When the semiconductor wafer W is sufficiently close to the top surface 13 of the spin chuck 12 , the rotatable grab pin assembly 14 of the spin chuck 12 can be rotated to grab the radial outer edge of the semiconductor wafer W while the semiconductor wafer W is supported from above by the non-rotating plate 1 .
在半导体晶片W被旋转卡盘12的可旋转抓取销组件14抓取之前或之后，非旋转板1的晶片限制销6可旋转至非限制位置。Before or after the semiconductor wafer W is gripped by the rotatable gripping pin assembly 14 of the rotating chuck 12, the wafer restraining pins 6 of the non-rotating plate 1 may be rotated to a non-restraining position.
因此，根据伯努利原理，半导体晶片W随后被非旋转板1通过气体供应从上方支撑，而半导体晶片W的径向外缘同时被旋转卡盘12从下方抓取。Thus, according to Bernoulli's principle, the semiconductor wafer W is then supported from above by the non-rotating plate 1 through the gas supply, while the radially outer edge of the semiconductor wafer W is simultaneously gripped from below by the rotating chuck 12 .
当旋转卡盘12旋转时，因为它被旋转卡盘12的可旋转抓取销组件14抓取，半导体晶片W也被旋转。因此，半导体晶片W相对于非旋转板1旋转。When the rotary chuck 12 rotates, the semiconductor wafer W is also rotated because it is gripped by the rotatable gripping pin assembly 14 of the rotary chuck 12. Therefore, the semiconductor wafer W rotates relative to the non-rotating plate 1.
在半导体晶片W被旋转的同时，液体可从液体分配喷嘴22供应至面向旋转卡盘12的半导体晶片W的表面上。例如，液体可为蚀刻液体或清洗液体。因此，面对旋转卡盘12的半导体晶片W的整个表面可被液体处理或清洗。While the semiconductor wafer W is rotated, liquid may be supplied from the liquid dispensing nozzle 22 onto the surface of the semiconductor wafer W facing the spin chuck 12. For example, the liquid may be an etching liquid or a cleaning liquid. Thus, the entire surface of the semiconductor wafer W facing the spin chuck 12 may be treated or cleaned by the liquid.
此外，或者替代地，在半导体晶片W被旋转的同时，可使用非旋转板1的液体分配喷嘴9将液体分配至面向非旋转板1的半导体晶片W的表面的边缘区域。Additionally or alternatively, the liquid dispensing nozzles 9 of the non-rotating plate 1 may be used to dispense liquid to an edge region of the surface of the semiconductor wafer W facing the non-rotating plate 1 while the semiconductor wafer W is rotated.
通常，面向非旋转板1的半导体晶片W的表面将是半导体晶片W的设备侧。Typically, the surface of the semiconductor wafer W facing the non-rotating plate 1 will be the device side of the semiconductor wafer W.
液体可为蚀刻液体，其用于在面向非旋转板1的半导体晶片W的表面上产生斜面或底切。替代地，液体可为清洁液体。The liquid may be an etching liquid for producing a bevel or an undercut on the surface of the semiconductor wafer W facing the non-rotating plate 1. Alternatively, the liquid may be a cleaning liquid.
如上所述，诸如清洗液体和蚀刻液体之类的不同的液体可在不同时间分配。替代地或附加地，可以同时和/或在重叠的时间段内分配一种以上的液体。例如，可在一段时间内单独分配清洁液体，然后在同一时间分配清洁液体和蚀刻液体。随后，可只分配清洁液体。例如，这种安排对于预湿和化学残留物的清除是有利的。As described above, different liquids such as cleaning liquid and etching liquid can be dispensed at different times. Alternatively or additionally, more than one liquid can be dispensed simultaneously and/or in overlapping time periods. For example, cleaning liquid can be dispensed alone for a period of time, and then cleaning liquid and etching liquid can be dispensed at the same time. Subsequently, only cleaning liquid can be dispensed. For example, this arrangement is advantageous for pre-wetting and chemical residue removal.
如图7所示，旋转卡盘12可包含边缘环25，其限定径向内表面26，径向内表面26被配置为在包含半导体晶片W的平面的上方和下方沿轴向方向延伸。边缘环25被配置为环绕半导体晶片W的径向外缘。7 , the spin chuck 12 may include an edge ring 25 defining a radially inner surface 26 configured to extend in an axial direction above and below a plane containing the semiconductor wafer W. The edge ring 25 is configured to surround a radially outer edge of the semiconductor wafer W.
边缘环25的径向内表面26可包括多个凹槽，其用于在可旋转抓取销组件14处于抓取位置时接收每一可旋转抓取销组件14的至少一部分。The radially inner surface 26 of the edge ring 25 may include a plurality of grooves for receiving at least a portion of each rotatable grab pin assembly 14 when the rotatable grab pin assemblies 14 are in the grab position.
图8中说明了用于相对于旋转卡盘12移动非旋转板1，以及用于一起移动非旋转板1和旋转卡盘12的示例性布置。为了清楚起见，在图8中只包含参考数字1和12来参照非旋转板1和旋转卡盘12。然而，非旋转板1和旋转卡盘12可具有上述非旋转板1和旋转卡盘12的任何特征，例如，参照其它任何图。An exemplary arrangement for moving the non-rotating plate 1 relative to the rotating chuck 12, and for moving the non-rotating plate 1 and the rotating chuck 12 together, is illustrated in FIG8 . For clarity, only reference numerals 1 and 12 are included in FIG8 to refer to the non-rotating plate 1 and the rotating chuck 12. However, the non-rotating plate 1 and the rotating chuck 12 may have any of the features of the non-rotating plate 1 and the rotating chuck 12 described above, for example, with reference to any other figure.
如图8所示，旋转卡盘12被固定在可动支撑件27上。例如，旋转卡盘12的底部或底座部件可固定在可动支撑件27上。8 , the spin chuck 12 is fixed to the movable support 27. For example, the bottom or base member of the spin chuck 12 may be fixed to the movable support 27.
可动支撑件27包含底座部件28、顶部部件29以及多个连接器30，连接器30将底座部件28和顶部部件29连接在一起。底座部件28、顶部部件29以及连接器30作为一个整体一起移动。The movable support 27 includes a base member 28, a top member 29, and a plurality of connectors 30, which connect the base member 28 and the top member 29. The base member 28, the top member 29, and the connectors 30 move together as a whole.
一或多个第一线性致动器31与底座部件28连接，以用于使底座部件28在竖直方向上，即向上或向下线性位移。当底座部件28线性位移时，底座部件28、顶部部件29以及连接器30作为一个整体线性位移。One or more first linear actuators 31 are connected to the base member 28 to linearly displace the base member 28 in a vertical direction, ie, upward or downward. When the base member 28 is linearly displaced, the base member 28, the top member 29 and the connector 30 are linearly displaced as a whole.
如上所述，旋转卡盘12固定在可动支撑件27上。例如，如图8所示，旋转卡盘12可直接或间接地固定在底座部件28上。因此，当底座部件28线性位移时，旋转卡盘12也会线性位移。As described above, the spin chuck 12 is fixed to the movable support 27. For example, as shown in Fig. 8, the spin chuck 12 may be directly or indirectly fixed to the base member 28. Therefore, when the base member 28 is linearly displaced, the spin chuck 12 is also linearly displaced.
如图8所示，非旋转板1位于可动支撑件27的顶部部件29的下方。非旋转板1通过第二线性致动器32连接至顶部部件29的底侧。8 , the non-rotating plate 1 is located below the top part 29 of the movable support 27 . The non-rotating plate 1 is connected to the bottom side of the top part 29 via a second linear actuator 32 .
第二线性致动器32被操作以在竖直方向上，即向上和向下，相对于可动支撑件27移动非旋转板1，且因而相对于旋转卡盘12移动。The second linear actuator 32 is operated to move the non-rotating plate 1 in the vertical direction, ie upwards and downwards, relative to the movable support 27 , and thus relative to the rotating chuck 12 .
因此，第二线性致动器32可被操作以使非旋转板1靠近或远离旋转卡盘12。Thus, the second linear actuator 32 may be operated to move the non-rotating plate 1 closer to or further away from the rotating chuck 12 .
此外，当第二线性致动器32未被操作时，非旋转板1与可动支撑件27一起移动，因此非旋转板1和旋转卡盘12一起移动。Furthermore, when the second linear actuator 32 is not operated, the non-rotating plate 1 moves together with the movable support 27 , and thus the non-rotating plate 1 and the rotating chuck 12 move together.
因此，通过此布置，非旋转板1和旋转卡盘12可一起移动，或者非旋转板1可相对于旋转卡盘12移动。Thus, with this arrangement, the non-rotating plate 1 and the rotating chuck 12 can be moved together, or the non-rotating plate 1 can be moved relative to the rotating chuck 12 .
可动支撑件27可相对于装置的另一部分，例如装置的底座和/或装置的室33移动。The movable support 27 may be movable relative to another part of the device, such as a base of the device and/or a chamber 33 of the device.
在上述说明中，或以下的权利要求中，或在附图中，以其具体形式或以执行所公开的功能的手段，或以获得所公开的结果的方法或工艺所表示的所公开特征可视情况单独地或以这些特征的任何组合来用于以其各种形式实现本发明。The disclosed features in the above description, or in the following claims, or in the accompanying drawings, represented in their specific form or as a means of performing the disclosed function, or a method or process for obtaining the disclosed results, may be used alone or in any combination of these features to realize the invention in its various forms.
虽然本发明已结合上述的示例性实施方案进行了描述，但对于本领域的技术人员而言，在得到本公开内容后，许多等同的修改以及变化将是显而易见的。因此，上文所述的本发明的示例性实施方案被认为是说明性的，而不是限制性的。在不背离本发明的精神以及范围的情况下，可对所述的实施方案进行各种改变。Although the present invention has been described in conjunction with the exemplary embodiments described above, it will be apparent to those skilled in the art that many equivalent modifications and variations will be apparent after obtaining the present disclosure. Therefore, the exemplary embodiments of the present invention described above are considered to be illustrative rather than restrictive. Various changes may be made to the described embodiments without departing from the spirit and scope of the present invention.
为了避免任何疑问，本文所提供的任何理论解释是为了提高读者的理解。本发明人不希望受这些理论解释的任何约束。In order to avoid any doubt, any theoretical explanations provided herein are intended to enhance the reader's understanding. The inventors do not wish to be bound by any of these theoretical explanations.
本文所使用的任何章节标题仅用于组织目的，不应解释为限制所述的主题。Any section headings used herein are for organizational purposes only and are not to be construed as limiting the subject matter described.
在本说明书中，包含以下的权利要求，除非上下文另有要求，否则“包含(comprise)”以及“包含(include)”一词，以及诸如“包含(comprises)”、“包含(comprising)”以及“包含(including)”之类的变体将被理解为暗示包含所述的整数或步骤或一组整数或步骤，但不排除任何其它整数或步骤或一组整数或步骤。In this specification, including the following claims, unless the context requires otherwise, the words "comprise" and "include", and variations such as "comprises", "comprising" and "including", will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps.
需注意的是，在本说明书以及所附权利要求中所使用的单数形式“一(a)”、“一(an)”以及“该(the)”包括复数指代物，除非上下文有明确规定。这里的范围可表示为从“约(about)”一个特定值，和/或至“约”另一特定值。当表达这种范围时，另一实施方案包含从一特定值和/或至另一特定值。同样，当数值通过使用前置词“约(about)”被表达为近似值时，可以理解为该特定值构成了另一实施方案。与数值有关的术语“约(about)”是可选的，例如表示±10％。It should be noted that the singular forms "a", "an", and "the" used in this specification and the appended claims include plural referents unless the context clearly dictates otherwise. Ranges herein may be expressed as from "about" one particular value, and/or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when a value is expressed as an approximation by using the preposition "about", it is understood that the particular value constitutes another embodiment. The term "about" in relation to a value is optional, for example, meaning ±10%.
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|---|---|---|---|
| GB2203589.3 | 2022-03-15 | ||
| GBGB2203589.3AGB202203589D0 (en) | 2022-03-15 | 2022-03-15 | Apparatus for processing a wafer-shaped article |
| PCT/EP2023/055702WO2023174750A1 (en) | 2022-03-15 | 2023-03-07 | Apparatus for processing a wafer-shaped article |
| Publication Number | Publication Date |
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| CN118891711Atrue CN118891711A (en) | 2024-11-01 |
| Application Number | Title | Priority Date | Filing Date |
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| CN202380027728.0APendingCN118891711A (en) | 2022-03-15 | 2023-03-07 | Device for processing wafer-shaped objects |
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| CN (1) | CN118891711A (en) |
| GB (1) | GB202203589D0 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6669808B2 (en)* | 2001-03-22 | 2003-12-30 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP4018958B2 (en)* | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| US20180040502A1 (en) | 2016-08-05 | 2018-02-08 | Lam Research Ag | Apparatus for processing wafer-shaped articles |
| US20180096879A1 (en) | 2016-10-05 | 2018-04-05 | Lam Research Ag | Spin chuck including edge ring |
| Publication number | Publication date |
|---|---|
| WO2023174750A1 (en) | 2023-09-21 |
| GB202203589D0 (en) | 2022-04-27 |
| TW202401650A (en) | 2024-01-01 |
| KR20240163106A (en) | 2024-11-18 |
| Publication | Publication Date | Title |
|---|---|---|
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| US10825713B2 (en) | Substrate processing apparatus and substrate processing method | |
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