技术领域Technical Field
本发明涉及散热器技术领域，具体是涉及一种主动式电子器件散热器及散热方法。The present invention relates to the technical field of radiators, and in particular to an active electronic device radiator and a heat dissipation method.
背景技术Background Art
随着电子技术的飞速发展，中央处理器等发热电子元件运行速度越来越快，其运行时产生的热量亦相应增加，为了将这些热量散发出去以保障电子元件的正常运行，需要对电子元件进行散热，其散热的好坏直接关系到计算机的寿命及运算的品质；随着电子元件的主频越来越高，发热量也越来越大；如果不能将电子元件工作时产生的大量热量及时发散出去，就严重影响它的工作性能；With the rapid development of electronic technology, the speed of heat-generating electronic components such as central processing units is getting faster and faster, and the heat generated during operation is also increasing accordingly. In order to dissipate this heat to ensure the normal operation of electronic components, it is necessary to dissipate the heat of electronic components. The quality of heat dissipation is directly related to the life of the computer and the quality of calculation. As the main frequency of electronic components increases, the heat generated is also increasing. If the large amount of heat generated by electronic components during operation cannot be dissipated in time, its working performance will be seriously affected.
然而现有的散热器在对电子器件进行散热时多采用风冷散热或液冷的散热方式，但是这两种散热方式分别存在着在通过风冷散热时风扇在高转速下会产生噪音、风扇是机械运动部件，长时间使用后容易出现磨损、故障，导致散热性能下降甚至完全失效以及风扇容易吸附灰尘，长期积累会影响散热效率和通过液冷散热时液冷系统存在漏液风险，特别是在连接处和管路部分，可能会对电子器件造成损害以及在冷却区形成冷凝水的技术问题；However, the existing radiators mostly use air cooling or liquid cooling to dissipate heat for electronic devices. However, these two cooling methods have the following technical problems: when cooling by air, the fan will generate noise at high speed; the fan is a mechanical moving part, which is prone to wear and failure after long-term use, resulting in reduced heat dissipation performance or even complete failure; the fan is prone to absorb dust, and long-term accumulation will affect the heat dissipation efficiency; when cooling by liquid, the liquid cooling system has the risk of leakage, especially at the connection and pipeline parts, which may cause damage to the electronic devices and form condensed water in the cooling area;
尤其是在通过风冷散热时，现有技术中通常采用朝向进风口处导入风源并从出风口处排出裹挟有热能风源的方式来实现散热的效果，但是该方式在实际使用过程中会将原处于热源处的热能在风源的引导下朝向非发热电子器件一侧涌动，使得风源无法的到有效的引导，对其他电子器件造成影响；无法有效分散热能，使其呈均匀散热状态。Especially when heat is dissipated through air cooling, the prior art usually adopts a method of introducing an air source toward the air inlet and discharging the air source carrying heat energy from the air outlet to achieve the heat dissipation effect. However, in actual use, this method will cause the heat energy originally at the heat source to surge toward the side of the non-heat-generating electronic device under the guidance of the wind source, making it impossible for the wind source to be effectively guided, causing an impact on other electronic devices; it is impossible to effectively disperse the heat energy to make it in a uniform heat dissipation state.
发明内容Summary of the invention
针对上述问题，提供一种主动式电子器件散热器，通过提出一种复合型散热设备，使其既能对电子器件进行高效散热又可以高效地对热源进行引导，使得热源多向均匀分散的设备；从而解决现有技术中在对电子器件进行散热时，散热方式单一且无法对电子器件进行主动散热，散热效果差，效率低的技术问题。In view of the above problems, an active electronic device radiator is provided. By proposing a composite heat dissipation device, it can not only efficiently dissipate the heat of the electronic device but also efficiently guide the heat source, so that the heat source is evenly dispersed in multiple directions; thereby solving the technical problems in the prior art that when dissipating heat for electronic devices, the heat dissipation method is single and the electronic device cannot be actively cooled, resulting in poor heat dissipation effect and low efficiency.
为解决现有技术问题，本发明提供一种主动式电子器件散热器，包括散热壳体和设置于散热壳体内的吸热元件；所述散热壳体内部空间通过吸热元件被分割成上散热腔和下散热腔；液冷散热模块设置于上散热腔内用以对上散热腔进行散热；风冷散热模块设置于下散热腔内，用以对下散热腔进行散热；风冷吸热元件设有能够引导风源朝向电子器件中部导入且从散热壳体外侧导出的导流板。To solve the problems of the prior art, the present invention provides an active electronic device radiator, comprising a heat dissipation shell and a heat absorbing element arranged in the heat dissipation shell; the internal space of the heat dissipation shell is divided into an upper heat dissipation cavity and a lower heat dissipation cavity by the heat absorbing element; a liquid-cooled heat dissipation module is arranged in the upper heat dissipation cavity to dissipate heat from the upper heat dissipation cavity; an air-cooled heat dissipation module is arranged in the lower heat dissipation cavity to dissipate heat from the lower heat dissipation cavity; the air-cooled heat absorbing element is provided with a guide plate capable of guiding a wind source to be introduced toward the middle of the electronic device and discharged from the outside of the heat dissipation shell.
优选的，所述吸热元件由隔板以及垂直设置于隔板中部的翅片组成；该翅片沿着隔板的短边方向等距设置有多组，每两个相邻的翅片之间均围合成一个散热通道。Preferably, the heat absorbing element is composed of a partition and fins vertically arranged in the middle of the partition; the fins are arranged in multiple groups at equal intervals along the short side of the partition, and a heat dissipation channel is enclosed between every two adjacent fins.
优选的，风冷散热模块包括供风单元，供风单元设置有两组且相对设置于散热壳体两端，每组供风单元均设有用以对风源进行传导的导风仓以及朝向该导风仓内输入风源的风源发生器。Preferably, the air-cooled heat dissipation module includes an air supply unit, which is provided in two groups and is relatively arranged at two ends of the heat dissipation shell, and each group of air supply units is provided with an air guide bin for conducting the wind source and a wind source generator for inputting the wind source into the air guide bin.
优选的，所述导风仓由依次连通设置的风源传导仓以及高速传导仓组成；该高速传导仓出风口与下散热腔连通设置；所述高速传导仓的传导空腔小于风源传导仓的一半设置。Preferably, the air guide compartment is composed of a wind source conduction compartment and a high-speed conduction compartment which are connected in sequence; the air outlet of the high-speed conduction compartment is connected to the lower heat dissipation cavity; the conduction cavity of the high-speed conduction compartment is smaller than half of the wind source conduction compartment.
优选的，所述导流板设置有两个且呈水平状态相对设置于散热通道中部，该散热通道通过两个导流板被分割成上进风通道和下出风通道；所述两个导流板的相邻端之间还留有供风源传导至下出风通道内的间隙。Preferably, two guide plates are provided and are horizontally arranged relative to each other in the middle of the heat dissipation channel. The heat dissipation channel is divided into an upper air inlet channel and a lower air outlet channel by the two guide plates. A gap is also left between the adjacent ends of the two guide plates for conducting the air source to the lower air outlet channel.
优选的，两个导流板之间还设置有能够将上进风通道内所导入的风源引导至下出风通道内的引导部。Preferably, a guide portion capable of guiding the wind source introduced into the upper air inlet channel to the lower air outlet channel is further provided between the two guide plates.
优选的，液冷散热模块包括能够朝向上散热腔内导入和导出的冷却液的导入管和导出管以及用以循导冷却液的循环泵；导入管和导出管分别与上散热腔的两端连通设置。Preferably, the liquid-cooled heat dissipation module includes an inlet pipe and an outlet pipe for introducing and discharging the coolant into and out of the upper heat dissipation cavity, and a circulation pump for circulating the coolant; the inlet pipe and the outlet pipe are respectively connected to the two ends of the upper heat dissipation cavity.
优选的，所述冷却液为乙二醇水溶液。Preferably, the coolant is an ethylene glycol aqueous solution.
优选的，所述吸热元件还包括有能够沿着翅片纵向滑移的自适应吸热单元，该自适应吸热单元与多组翅片一一对应设置；所述隔板的下表面还垂直设置有沿着隔板短边方向平行设置的限位架。Preferably, the heat absorbing element further comprises an adaptive heat absorbing unit capable of sliding longitudinally along the fins, and the adaptive heat absorbing unit is arranged in one-to-one correspondence with the multiple groups of fins; the lower surface of the partition is also vertically provided with a limit frame arranged parallel to the short side direction of the partition.
一种主动式电子器件散热器的散热方法，应用于一种主动式电子器件散热器，包括以下步骤：A heat dissipation method for an active electronic device radiator is applied to an active electronic device radiator, comprising the following steps:
S1：首先通过第一连接架将散热壳体安装至待散热的电子器件上；S1: First, the heat dissipation housing is mounted on the electronic device to be cooled through a first connecting frame;
S2：此时滑移纵向滑移设置于翅片下端的自适应吸热单元则会在自重下自主与电子器件的散热面接触并吸收经由电子器件所散发出的热能；S2: At this time, the adaptive heat absorption unit disposed at the lower end of the fin will slide longitudinally and contact the heat dissipation surface of the electronic device under its own weight and absorb the heat energy emitted by the electronic device;
S3：随即驱使风源发生器动作朝向传导仓内输入风源，风源经过高速传导仓压缩成高速状态进入至上进风通道内，并穿过两个导流板之间的间隙直接输出至电子器件上对电子器件进行散热，而裹挟着热能的风源则会沿着下出风通道经由引风仓导出进而实现对位于隔板下表面的翅片进行散热的效果；S3: The wind source generator is then driven to input the wind source into the conduction chamber. The wind source is compressed into a high-speed state through the high-speed conduction chamber and enters the upper air inlet channel. It passes through the gap between the two guide plates and is directly output to the electronic device to dissipate the heat of the electronic device. The wind source carrying heat energy is guided along the lower air outlet channel through the induced draft chamber to achieve the effect of dissipating the heat to the fins located on the lower surface of the partition.
S4：当需要对位于隔板上表面的翅片进行散热时，接入外部电源驱使循环泵动作抽取冷却液并经由导入管导入至上散热腔内，从而实现对位于上散热腔内的翅片进行冷却的效果，而带有热能的冷却液在经由导出管从上散热腔内导出，自此循环，从而实现对上散热腔内的翅片进行散热的效果；S4: When the fins on the upper surface of the partition need to be cooled, an external power source is connected to drive the circulation pump to extract the coolant and introduce it into the upper heat dissipation cavity through the introduction pipe, thereby achieving the effect of cooling the fins in the upper heat dissipation cavity, and the coolant with heat energy is discharged from the upper heat dissipation cavity through the outlet pipe, and circulates from then on, thereby achieving the effect of cooling the fins in the upper heat dissipation cavity;
S5：直至散热结束，分别关闭液冷散热模块和风冷散热模块即可。S5: After the heat dissipation is completed, the liquid cooling module and the air cooling module can be turned off respectively.
本发明相比较于现有技术的有益效果是：Compared with the prior art, the present invention has the following beneficial effects:
本发明通过翅片以及可纵向活动设置于翅片底部的自适应吸热单元实现了如何对电子器件发热面的热能进行主动吸收的效果，同时配合风冷散热模块和液冷散热模块对翅片所吸收的热能进行散热；实现了如何对翅片进行快速散热的效果，且由于该风冷散热模块通过导流板对风源进行引流使其直接朝向电子器件进行输出，并采用双向分化的方式将热能导出，高效低提高了对电子器件的散热效果；且散热效果好、效率高。The present invention realizes the effect of actively absorbing the heat energy of the heating surface of the electronic device through the fins and the adaptive heat absorption unit which can be longitudinally movably arranged at the bottom of the fins, and dissipates the heat energy absorbed by the fins in cooperation with the air-cooling heat dissipation module and the liquid-cooling heat dissipation module; realizes the effect of quickly dissipating the heat of the fins, and because the air-cooling heat dissipation module guides the wind source through the guide plate so that it is directly output toward the electronic device, and adopts a two-way differentiation method to export the heat energy, the heat dissipation effect on the electronic device is effectively improved; and the heat dissipation effect is good and the efficiency is high.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是一种主动式电子器件散热器的立体图；FIG1 is a perspective view of an active electronic device heat sink;
图2是一种主动式电子器件散热器的俯视图；FIG2 is a top view of an active electronic device heat sink;
图3是图2的A-A处截面立体剖视图；Fig. 3 is a perspective cross-sectional view of the section A-A in Fig. 2;
图4是图3的B处局部放大图；FIG4 is a partial enlarged view of point B in FIG3 ;
图5是图3的C处局部放大图；FIG5 is a partial enlarged view of point C in FIG3 ;
图6是一种主动式电子器件散热器的侧视图；FIG6 is a side view of an active electronic device heat sink;
图7是图6的D-D处截面剖视图；Fig. 7 is a cross-sectional view of the section taken along line D-D of Fig. 6;
图8是一种主动式电子器件散热器中去除风冷散热模块的部分结构立体图。FIG8 is a three-dimensional diagram of the structure of a partial active electronic device radiator without an air-cooling module.
图中标号为：The numbers in the figure are:
1-散热壳体；11-连接架；1- heat dissipation housing; 11- connection frame;
2-吸热元件；21-隔板；22-翅片；23-上散热腔；24-下散热腔；25-自适应吸热单元；26-限位架；2-heat absorbing element; 21-partition; 22-fin; 23-upper heat dissipation cavity; 24-lower heat dissipation cavity; 25-adaptive heat absorption unit; 26-limiting frame;
3-液冷散热模块；31-导入管；32-导出管；33-循环泵；3-liquid cooling module; 31-inlet pipe; 32-exit pipe; 33-circulation pump;
4-风冷散热模块；41-导流板；42-供风单元；43-导风仓；44-高速传导仓；45-传导仓；46-风源发生器；47-引导部；48-引风仓。4- air cooling module; 41- guide plate; 42- air supply unit; 43- air guide chamber; 44- high-speed conduction chamber; 45- conduction chamber; 46- wind source generator; 47- guide part; 48- air guide chamber.
具体实施方式DETAILED DESCRIPTION
为能进一步了解本发明的特征、技术手段以及所达到的具体目的、功能，下面结合附图与具体实施方式对本发明作进一步详细描述。In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
参见图1至图8所示：一种主动式电子器件散热器，包括散热壳体1和设置于散热壳体1内的吸热元件2；所述散热壳体1内部空间通过吸热元件2被分割成上散热腔23和下散热腔24；液冷散热模块3设置于上散热腔23内用以对上散热腔23进行散热；风冷散热模块4设置于下散热腔24内，用以对下散热腔24进行散热；风冷吸热元件2设有能够引导风源朝向电子器件中部导入且从散热壳体1外侧导出的导流板41。Referring to Figures 1 to 8: an active electronic device heat sink comprises a heat dissipation housing 1 and a heat absorbing element 2 arranged in the heat dissipation housing 1; the internal space of the heat dissipation housing 1 is divided into an upper heat dissipation cavity 23 and a lower heat dissipation cavity 24 by the heat absorbing element 2; a liquid-cooled heat dissipation module 3 is arranged in the upper heat dissipation cavity 23 to dissipate heat from the upper heat dissipation cavity 23; an air-cooled heat dissipation module 4 is arranged in the lower heat dissipation cavity 24 to dissipate heat from the lower heat dissipation cavity 24; the air-cooled heat absorbing element 2 is provided with a guide plate 41 capable of guiding a wind source toward the middle of the electronic device and out of the outer side of the heat dissipation housing 1.
所述散热壳体1为中空且底部开口的矩形壳体；The heat dissipation housing 1 is a hollow rectangular housing with an open bottom;
当需要对电子器件进行散热时，首先通过连接架11将散热器安装至所需散热位置，并将吸热元件2的散热端抵触电子器件设置；此时经由电子器件所产生的热能经由吸热元件2吸收，此时驱使风冷散热模块4动作；对位于下散热腔24内的吸热元件2进行风冷散热，随即驱使液冷散热模块3动作，对位于上散热腔23内的吸热元件2进行散热，从而实现主动式对吸热元件2进行同步散热的效果，保证最终的散热效果；所述导流板41用以引导风源朝向电子器件中部传导并从散热壳体1边缘导出的效果，这样可以使热能从中心向两侧分散，不像传统设备单向风源散热，导致热能朝一侧集中升温，无法有效散热。When it is necessary to dissipate heat for the electronic device, the radiator is first installed to the desired heat dissipation position through the connecting frame 11, and the heat dissipation end of the heat absorption element 2 is set against the electronic device; at this time, the heat energy generated by the electronic device is absorbed by the heat absorption element 2, and the air-cooling heat dissipation module 4 is driven to operate; the heat absorption element 2 located in the lower heat dissipation cavity 24 is air-cooled and dissipated, and then the liquid-cooling heat dissipation module 3 is driven to operate to dissipate heat for the heat absorption element 2 located in the upper heat dissipation cavity 23, thereby achieving the effect of active and synchronous heat dissipation of the heat absorption element 2, and ensuring the final heat dissipation effect; the guide plate 41 is used to guide the wind source to conduct toward the middle of the electronic device and be derived from the edge of the heat dissipation housing 1, so that the heat energy can be dispersed from the center to both sides, unlike the traditional equipment that dissipates heat with a one-way wind source, which causes the heat energy to be concentrated on one side and cannot be effectively dissipated.
参见图5所示：所述吸热元件2由隔板21以及垂直设置于隔板21中部的翅片22组成；该翅片22沿着隔板21的短边方向等距设置有多组，每两个相邻的翅片22之间均围合成一个散热通道。As shown in FIG. 5 , the heat absorbing element 2 is composed of a partition 21 and fins 22 vertically arranged in the middle of the partition 21 ; the fins 22 are arranged in multiple groups equidistantly along the short side direction of the partition 21 , and a heat dissipation channel is enclosed between every two adjacent fins 22 .
所述隔板21和散热壳体1之间呈密封连接设置，所述散热壳体1内部空间通过该隔板21被分割成上散热腔23和下散热腔24；由于所述散热翅片22分别置于隔板21上表面和下表面；当位于隔板21下表面的翅片22在与电子器件接触时，此时电子器件所产生的热能传导至位于隔板21下表面的翅片22上，随后在经由位于隔板21下表面的翅片22将热能传导至位于隔板21上表面的翅片22上；实现对电子器件所产生的热能进行吸收且将热能分别传导至上散热腔23以及下散热腔24内的效果。The partition 21 and the heat dissipation shell 1 are sealed and connected, and the internal space of the heat dissipation shell 1 is divided into an upper heat dissipation cavity 23 and a lower heat dissipation cavity 24 by the partition 21; since the heat dissipation fins 22 are respectively arranged on the upper surface and the lower surface of the partition 21; when the fins 22 located on the lower surface of the partition 21 are in contact with the electronic device, the heat energy generated by the electronic device is conducted to the fins 22 located on the lower surface of the partition 21, and then the heat energy is conducted to the fins 22 located on the upper surface of the partition 21 via the fins 22 located on the lower surface of the partition 21; the effect of absorbing the heat energy generated by the electronic device and conducting the heat energy to the upper heat dissipation cavity 23 and the lower heat dissipation cavity 24 respectively is achieved.
参见图2和图3所示：风冷散热模块4包括供风单元42，供风单元42设置有两组且相对设置于散热壳体1两端，每组供风单元42均设有用以对风源进行传导的导风仓43以及朝向该导风仓43内输入风源的风源发生器46。As shown in Figures 2 and 3: the air-cooled heat dissipation module 4 includes an air supply unit 42, which is provided with two groups and is relatively arranged at both ends of the heat dissipation shell 1, and each group of air supply units 42 is provided with an air guide bin 43 for conducting the wind source and a wind source generator 46 for inputting the wind source into the air guide bin 43.
所述两组供风单元42结构相同；所述风源发生器46嵌入式安装于导风仓43导入口处，该导风仓43的导出口与下散热腔24连通设置；The two groups of air supply units 42 have the same structure; the wind source generator 46 is embedded in the inlet of the air guide bin 43, and the outlet of the air guide bin 43 is connected to the lower heat dissipation cavity 24;
在当需要对下散热腔24体内的翅片22进行散热时，首先接入外部电源驱使风源发生器46工作产生风源，并朝向风源传导仓45内部传导，此时的风源自散热壳体1两端分别朝向下散热腔24内部传导，此时传导至下散热腔24内的风源在导流板41的作用下汇聚至下散热腔24中部，并自下散热腔24中部在分别朝向散热壳体1两侧传导，从而实现对电子器件主动输出风源进行散热，并在导流板41的配合将风源所带离的热能朝向散热壳体1两侧分别传导，实现将热能导出的效果，进而实现对电子器件进行散热的目的。When it is necessary to dissipate heat for the fins 22 in the lower heat dissipation cavity 24, firstly, an external power source is connected to drive the wind source generator 46 to generate a wind source, and conduct it toward the inside of the wind source conduction compartment 45. At this time, the wind source is respectively conducted toward the inside of the lower heat dissipation cavity 24 from both ends of the heat dissipation shell 1. At this time, the wind source conducted into the lower heat dissipation cavity 24 is gathered to the middle of the lower heat dissipation cavity 24 under the action of the guide plate 41, and is respectively conducted toward the two sides of the heat dissipation shell 1 from the middle of the lower heat dissipation cavity 24, thereby realizing the active output of the wind source for heat dissipation of the electronic device, and with the cooperation of the guide plate 41, the heat energy brought away by the wind source is respectively conducted toward the two sides of the heat dissipation shell 1, thereby achieving the effect of exporting the heat energy, and then achieving the purpose of heat dissipation of the electronic device.
参见图2和图7所示：所述导风仓43由依次连通设置的风源传导仓45以及高速传导仓44组成；该高速传导仓44出风口与下散热腔24连通设置；所述高速传导仓44的传导空腔小于风源传导仓45的一半设置。As shown in Figures 2 and 7: the air guide compartment 43 is composed of a wind source conduction compartment 45 and a high-speed conduction compartment 44 which are connected in sequence; the air outlet of the high-speed conduction compartment 44 is connected to the lower heat dissipation cavity 24; the conduction cavity of the high-speed conduction compartment 44 is smaller than half of the wind source conduction compartment 45.
在当需要对下散热腔24体内的翅片22进行散热时，首先接入外部电源驱使风源发生器46工作产生风源，并朝向风源传导仓45内部传导，由于所述高速传导仓44内的传导空腔小于风源传导仓45的一半设置，在经由传导仓45朝向高速传导仓44内部输入风源时，在流体收缩效应和贝努利原理下，可以在一定程度上增加经由高速传导仓44朝向下散热腔24内的局部风压，增强所导出的风源风速，从而呈现更加高效的散热效果。When it is necessary to dissipate heat for the fins 22 in the lower heat dissipation cavity 24, firstly, an external power source is connected to drive the wind source generator 46 to generate a wind source, and conduct it toward the inside of the wind source conduction bin 45. Since the conduction cavity in the high-speed conduction bin 44 is smaller than half of the wind source conduction bin 45, when the wind source is input toward the inside of the high-speed conduction bin 44 through the conduction bin 45, under the fluid contraction effect and the Bernoulli principle, the local wind pressure through the high-speed conduction bin 44 toward the lower heat dissipation cavity 24 can be increased to a certain extent, and the derived wind source wind speed can be enhanced, thereby presenting a more efficient heat dissipation effect.
参见图7所示：所述导流板41设置有两个且呈水平状态相对设置于散热通道中部，该散热通道通过两个导流板41被分割成上进风通道和下出风通道；所述两个导流板41的相邻端之间还留有供风源传导至下出风通道内的间隙。As shown in Figure 7: there are two guide plates 41 and they are horizontally arranged in the middle of the heat dissipation channel. The heat dissipation channel is divided into an upper air inlet channel and a lower air outlet channel by the two guide plates 41; there is also a gap between the adjacent ends of the two guide plates 41 for the air source to be conducted to the lower air outlet channel.
所述高速传导仓44的出风口与上进风通道的进风口对应设置，用以朝向上进风通道内导入风源；所述导流板41为矩形板且两侧分别与相邻的翅片22固定连接；所述导风仓43的正下方还设置有与下出风通道连通设置的引风仓48，引风仓48用以将带有热能的风源从下散热腔24内导出；The air outlet of the high-speed conduction chamber 44 is arranged corresponding to the air inlet of the upper air inlet channel, so as to introduce the wind source into the upper air inlet channel; the guide plate 41 is a rectangular plate and its two sides are respectively fixedly connected to the adjacent fins 22; an air induction chamber 48 connected to the lower air outlet channel is also arranged directly below the air guide chamber 43, and the air induction chamber 48 is used to guide the wind source with heat energy out of the lower heat dissipation cavity 24;
当需要对电子器件进行散热时，首先接入外部电源驱使风冷散热模块4工作，风冷散热模块4朝向下散热腔24内导入冷却风源，由于所述供风单元42设置有两组，此时经由两组供风单元42分别导出的冷却风源自上进风通道的两个进风口进入至上进风通道内并穿过两个导流板41之间所留有的间隙进入至下出风通道内，最终输出至电器元件上，实现对电器元件的冷却效果；由于风源经由上进风通道引导并穿过间隙直接输出至电器元件上，可以实现直接利用风源对电器元件进行输出散热的效果，而吹至电器元件上的风源则会携带热能分别从下出风通道的两个出口处被导出，实现了针对电器元件进行主动散热的同时，实现了电器元件所产生的热能进行分化的效果；使热能从中心向两侧分散，不像传统设备单向风源散热，导致热能朝一侧集中升温，无法有效散热的技术问题。参见图7所示：两个导流板41之间还设置有能够将上进风通道内所导入的风源引导至下出风通道内的引导部47。When it is necessary to dissipate heat for the electronic device, firstly, an external power source is connected to drive the air-cooling heat dissipation module 4 to work, and the air-cooling heat dissipation module 4 introduces a cooling air source into the lower heat dissipation cavity 24. Since the air supply unit 42 is provided with two groups, the cooling air sources respectively derived from the two groups of air supply units 42 enter the upper air inlet channel from the two air inlets of the upper air inlet channel and pass through the gap left between the two guide plates 41 to enter the lower air outlet channel, and are finally output to the electrical components, thereby achieving a cooling effect on the electrical components; since the air source is guided through the upper air inlet channel and directly output to the electrical components through the gap, the effect of directly utilizing the air source to output and dissipate heat for the electrical components can be achieved, and the air source blown onto the electrical components will carry heat energy and be respectively derived from the two outlets of the lower air outlet channel, thereby achieving active heat dissipation for the electrical components and differentiating the heat energy generated by the electrical components; dissipating the heat energy from the center to both sides, unlike the technical problem of traditional equipment with unidirectional air source heat dissipation, which causes the heat energy to be concentrated on one side and cannot be effectively dissipated. As shown in FIG. 7 , a guide portion 47 is provided between the two guide plates 41 , which can guide the wind source introduced into the upper air inlet channel to the lower air outlet channel.
为了保证分别从上进风通道两个进风口所导入的风源在汇聚至两个导流板41之间所留有的间隙处时可以顺利的穿过该间隙进入至下出风通道内；通过设置于该间隙处的引导部47引导，可以使得两股所导入的气流直接与引导部47接触，并在引导部47的引导下分别进入至下出风通道内；并带走电子器件所散发出的热能后分别从散热壳体1两侧排除；所述引导部47为等腰三角块，呈竖直状态固定设置于隔板21下表面且尖端竖直朝向电子器件设置；用以分别引导气流的同时，使得气流可以在尖端汇聚并同步输出至电子器件上。In order to ensure that the wind sources introduced from the two air inlets of the upper air inlet channel can smoothly pass through the gap and enter the lower air outlet channel when they converge at the gap left between the two guide plates 41; through the guidance of the guide part 47 arranged at the gap, the two introduced air flows can directly contact the guide part 47, and enter the lower air outlet channel respectively under the guidance of the guide part 47; and take away the heat energy emitted by the electronic device and then discharge it from both sides of the heat dissipation shell 1; the guide part 47 is an isosceles triangle block, which is fixedly arranged on the lower surface of the partition 21 in a vertical state and the tip is arranged vertically toward the electronic device; it is used to guide the airflow separately, and at the same time, the airflow can converge at the tip and be synchronously output to the electronic device.
参见图2和图3所示：液冷散热模块3包括能够朝向上散热腔23内导入和导出的冷却液的导入管31和导出管32以及用以循导冷却液的循环泵33；导入管31和导出管32分别与上散热腔23的两端连通设置。As shown in Figures 2 and 3: the liquid-cooled heat dissipation module 3 includes an inlet pipe 31 and an outlet pipe 32 that can introduce and export the coolant into the upper heat dissipation cavity 23, and a circulation pump 33 for circulating the coolant; the inlet pipe 31 and the outlet pipe 32 are respectively connected to the two ends of the upper heat dissipation cavity 23.
当需要对经由隔板21上表面的翅片22所吸收的热能进行散热时，首先接入外部电源驱使循环泵33动作，循环泵33抽取外部水源，并经由导入管31将冷却液导入至上散热腔23内对位于上散热腔23内的翅片22进行散热工作；由于分子间能量的传递，为了保证翅片22在对热能进行吸收时的热平衡；经过水冷对翅片22进行散热时，散热效果较高，此时下散热腔24内翅片22所吸收的热能就会经由翅片22加速朝向位于上散热腔23内的翅片22进行传导，从而保证对电子器件的散热效率以及散热效果。When it is necessary to dissipate the heat energy absorbed by the fins 22 on the upper surface of the partition 21, firstly connect an external power supply to drive the circulation pump 33, the circulation pump 33 draws external water source, and introduces the coolant into the upper heat dissipation cavity 23 through the inlet pipe 31 to dissipate the heat of the fins 22 in the upper heat dissipation cavity 23; due to the transfer of energy between molecules, in order to ensure the thermal balance of the fins 22 when absorbing heat energy; when the fins 22 are cooled by water cooling, the heat dissipation effect is higher. At this time, the heat energy absorbed by the fins 22 in the lower heat dissipation cavity 24 will be accelerated through the fins 22 to be conducted toward the fins 22 in the upper heat dissipation cavity 23, thereby ensuring the heat dissipation efficiency and heat dissipation effect of the electronic components.
参见图2和图3所示：所述冷却液为乙二醇水溶液。See Figure 2 and Figure 3: the coolant is an ethylene glycol aqueous solution.
由于乙二醇可以降低水的冰点和沸点，并且在适当的浓度下，可以保持较高的温度，可以在对翅片22进行冷却的过程中最大程度减少冷凝水的产生，不会像传统水冷设备在与电子器件接触冷却的过程中会产生冷凝水，易对电子器件造成损伤等影响的技术问题。Since ethylene glycol can lower the freezing point and boiling point of water and can maintain a relatively high temperature at an appropriate concentration, the generation of condensed water can be minimized during the cooling of the fins 22. Unlike traditional water cooling equipment, which generates condensed water during the cooling process in contact with electronic devices and easily causes damage to the electronic devices, this will not cause technical problems.
参见图4所示：所述吸热元件2还包括有能够沿着翅片22纵向滑移的自适应吸热单元25，该自适应吸热单元25与多组翅片22一一对应设置；所述隔板21的下表面还垂直设置有沿着隔板21短边方向平行设置的限位架26。As shown in Figure 4: the heat absorption element 2 also includes an adaptive heat absorption unit 25 that can slide longitudinally along the fins 22, and the adaptive heat absorption unit 25 is arranged in a one-to-one correspondence with multiple groups of fins 22; the lower surface of the partition 21 is also vertically provided with a limit frame 26 arranged parallel to the short side direction of the partition 21.
所述限位架26设置有两组，两组限位架26相对于位于隔板21下表面的翅片22两端，用以限位多组自适应吸热单元25可以始终沿着翅片22纵向滑移；The limiting frames 26 are provided in two groups, and the two groups of limiting frames 26 are located at two ends of the fins 22 on the lower surface of the partition 21, so as to limit the plurality of groups of adaptive heat absorbing units 25 to always slide longitudinally along the fins 22;
所述自适应吸热单元25由三组呈U字型拼接设置的翅片22组成，从而使得自适应吸收元件可纵向滑移的卡嵌于翅片22下端，从而实现在对电子器件进行散热时，通过多组可纵向滑移设置的自适应吸热单元25与电子器件自主接触，并将热能传导至翅片22上经由翅片22对其进行散热工作，通过采用可自主滑移设置的自适应吸热单元25可以实现在对存在不同高度的电子器件散热面进行接触散热时，可以实现对散热面所散发出的热能进行主动吸收；最大程度提高散热效果；而相对设置于隔板21下表面翅片22两端的限位架26则用以限位多组自适应吸热单元25可以始终保持当前滑移姿态；更进一步的所述自适应吸热单元25的顶部还设置有与限位架26搭接的延伸部，避免自适应吸热单元25与限位架26之间脱离。The adaptive heat absorption unit 25 is composed of three groups of fins 22 that are spliced in a U shape, so that the adaptive absorption element can be longitudinally slidably embedded in the lower end of the fin 22, so that when the electronic device is cooled, the multiple groups of adaptive heat absorption units 25 that can be longitudinally slidably arranged can autonomously contact the electronic device, and transfer the heat energy to the fins 22 to dissipate the heat through the fins 22. By adopting the adaptive heat absorption unit 25 that can be autonomously slidably arranged, when the heat dissipation surface of the electronic device at different heights is contacted and cooled, the heat energy emitted by the heat dissipation surface can be actively absorbed; the heat dissipation effect is maximized; and the limiting frames 26 relatively arranged at both ends of the fins 22 on the lower surface of the partition 21 are used to limit the multiple groups of adaptive heat absorption units 25 so that they can always maintain the current sliding posture; further, the top of the adaptive heat absorption unit 25 is also provided with an extension portion overlapped with the limiting frame 26 to prevent the adaptive heat absorption unit 25 from being separated from the limiting frame 26.
一种主动式电子器件散热器的散热方法，应用于一种主动式电子器件散热器，包括以下步骤：A heat dissipation method for an active electronic device radiator is applied to an active electronic device radiator, comprising the following steps:
S1：首先通过第一连接架11将散热壳体1安装至待散热的电子器件上；S1: First, the heat dissipation housing 1 is mounted on the electronic device to be cooled through the first connecting frame 11;
S2：此时滑移纵向滑移设置于翅片22下端的自适应吸热单元25则会在自重下自主与电子器件的散热面接触并吸收经由电子器件所散发出的热能；S2: At this time, the adaptive heat absorption unit 25 disposed at the lower end of the fin 22 slides longitudinally and will contact the heat dissipation surface of the electronic device under its own weight and absorb the heat energy emitted by the electronic device;
S3：随即驱使风源发生器46动作朝向传导仓45内输入风源，风源经过高速传导仓44压缩成高速状态进入至上进风通道内，并穿过两个导流板41之间的间隙直接输出至电子器件上对电子器件进行散热，而裹挟着热能的风源则会沿着下出风通道经由引风仓48导出进而实现对位于隔板21下表面的翅片22进行散热的效果；S3: The wind source generator 46 is then driven to input the wind source into the conduction chamber 45. The wind source is compressed into a high-speed state through the high-speed conduction chamber 44 and enters the upper air inlet channel. It passes through the gap between the two guide plates 41 and is directly output to the electronic device to dissipate the heat of the electronic device. The wind source carrying the heat energy is guided out along the lower air outlet channel through the induced air chamber 48 to achieve the effect of dissipating the heat to the fins 22 located on the lower surface of the partition 21.
S4：当需要对位于隔板21上表面的翅片22进行散热时，接入外部电源驱使循环泵33动作抽取冷却液并经由导入管31导入至上散热腔23内，从而实现对位于上散热腔23内的翅片22进行冷却的效果，而带有热能的冷却液在经由导出管32从上散热腔23内导出，自此循环，从而实现对上散热腔23内的翅片22进行散热的效果；S4: When the fins 22 on the upper surface of the partition 21 need to be cooled, an external power source is connected to drive the circulation pump 33 to extract the coolant and introduce it into the upper heat dissipation cavity 23 through the introduction pipe 31, thereby achieving the effect of cooling the fins 22 in the upper heat dissipation cavity 23, and the coolant with heat energy is discharged from the upper heat dissipation cavity 23 through the outlet pipe 32, and circulates from then on, thereby achieving the effect of cooling the fins 22 in the upper heat dissipation cavity 23;
S5：直至散热结束，分别关闭液冷散热模块3和风冷散热模块4即可。S5: until the heat dissipation is finished, the liquid cooling heat dissipation module 3 and the air cooling heat dissipation module 4 are closed respectively.
本发明不仅可以对热源进行主动吸附且可以将热源均匀分散、多向散热，散热效果好、效率高。The present invention can not only actively adsorb the heat source but also evenly disperse the heat source and dissipate the heat in multiple directions, thus achieving good heat dissipation effect and high efficiency.
以上实施例仅表达了本发明的一种或几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明的保护范围应以所附权利要求为准。The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411022434.1ACN118553696B (en) | 2024-07-29 | 2024-07-29 | Active electronic device radiator and heat dissipation method |
| Application Number | Priority Date | Filing Date | Title |
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| CN202411022434.1ACN118553696B (en) | 2024-07-29 | 2024-07-29 | Active electronic device radiator and heat dissipation method |
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| CN118553696Atrue CN118553696A (en) | 2024-08-27 |
| CN118553696B CN118553696B (en) | 2024-10-15 |
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| CN202411022434.1AActiveCN118553696B (en) | 2024-07-29 | 2024-07-29 | Active electronic device radiator and heat dissipation method |
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| CN119905610A (en)* | 2025-03-28 | 2025-04-29 | 协氢(上海)新能源科技有限公司 | A high-power hydrogen fuel cell with efficient heat dissipation structure |
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| CN113939166A (en)* | 2021-11-15 | 2022-01-14 | 中国计量大学 | Composite heat sinks for high power luminaires |
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| US20030016497A1 (en)* | 2001-07-13 | 2003-01-23 | International Business Machines Corporation | Heat sink, cooling member, semiconductor-substrate cooling system, computer, and radiation method |
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| CN113939166A (en)* | 2021-11-15 | 2022-01-14 | 中国计量大学 | Composite heat sinks for high power luminaires |
| CN218160355U (en)* | 2022-08-25 | 2022-12-27 | 北京微焓科技有限公司 | Heat abstractor and IGBT system |
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| SE01 | Entry into force of request for substantive examination | ||
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| TR01 | Transfer of patent right | Effective date of registration:20250228 Address after:518000, Tower B, Hongrongyuan North Station Center, Minzhi Street North Station Community, Longhua District, Shenzhen City, Guangdong Province 1808 Patentee after:SHENZHEN YIKU TECHNOLOGY CO.,LTD. Country or region after:China Address before:No.59 Cangwu Road, Haizhou District, Lianyungang City, Jiangsu Province 222000 Patentee before:Jiangsu Ocean University Country or region before:China |