技术领域Technical Field
本申请是有关于一种电路板及其制造方法，且特别是有关于一种传输太赫兹频率信号的电路板及其制造方法。The present application relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof.
背景技术Background Art
传统发射/接收电路与天线之间的信号传输都是通过有线的方式传输，传输的方法包括使用微带线、带状线、同轴电缆等。然而，即使发射/接收电路小型化制成为芯片，芯片与天线以有线传输还是会占据较多空间，不利于行动装置(例如手机或平板)小型化的发展。目前还有通过天线封装技术(Antenna in Package,AiP)将天线与发射/接收电路整合成集成电路(芯片)，成为完整的收发器模组。但天线封装技术的工艺仍具有相当的困难度，导致目前天线封装的良率仍不理想。Traditionally, signal transmission between the transmitting/receiving circuit and the antenna is done by wired transmission, including the use of microstrip lines, strip lines, coaxial cables, etc. However, even if the transmitting/receiving circuit is miniaturized into a chip, the wired transmission of the chip and the antenna will still take up more space, which is not conducive to the miniaturization of mobile devices (such as mobile phones or tablets). Currently, the antenna and the transmitting/receiving circuit are integrated into an integrated circuit (chip) through the antenna packaging technology (Antenna in Package, AiP) to form a complete transceiver module. However, the process of antenna packaging technology is still quite difficult, resulting in the current unsatisfactory yield of antenna packaging.
发明内容Summary of the invention
本发明至少一实施例提供一种传输太赫兹频率信号的电路板及其制造方法，其能使发射/接收电路与天线之间以无线传输的方式进行信号传输。At least one embodiment of the present invention provides a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof, which can enable signal transmission between a transmitting/receiving circuit and an antenna in a wireless transmission manner.
本发明至少一实施例所提供的传输太赫兹频率信号的电路板包括介电层、第一金属图案层、第二金属图案层、至少一收发天线以及至少一电磁波收发模组。第一金属图案层具有至少一辐射孔。第一金属图案层、第二金属图案层与介电层堆叠，且介电层设置在第一金属图案层和第二金属图案层之间。收发天线设置于介电层对应辐射孔处，且垂直投影与辐射孔重叠。电磁波收发模组设置于介电层内，且电磁波收发模组与收发天线之间具有传输距离。在电磁波收发模组产生电磁波信号时，其中电磁波信号的频率在太赫兹频段的范围内，收发天线接收电磁波信号而辐射电磁波，电磁波从辐射孔向外辐射，其中电磁波的频率与电磁波信号的频率相同。在收发天线接收到从辐射孔外传来的电磁波时，收发天线将电磁波辐射至电磁波收发模组。A circuit board for transmitting terahertz frequency signals provided by at least one embodiment of the present invention includes a dielectric layer, a first metal pattern layer, a second metal pattern layer, at least one transceiver antenna and at least one electromagnetic wave transceiver module. The first metal pattern layer has at least one radiation hole. The first metal pattern layer, the second metal pattern layer and the dielectric layer are stacked, and the dielectric layer is arranged between the first metal pattern layer and the second metal pattern layer. The transceiver antenna is arranged at the dielectric layer corresponding to the radiation hole, and the vertical projection overlaps with the radiation hole. The electromagnetic wave transceiver module is arranged in the dielectric layer, and there is a transmission distance between the electromagnetic wave transceiver module and the transceiver antenna. When the electromagnetic wave transceiver module generates an electromagnetic wave signal, wherein the frequency of the electromagnetic wave signal is within the range of the terahertz frequency band, the transceiver antenna receives the electromagnetic wave signal and radiates the electromagnetic wave, and the electromagnetic wave radiates outward from the radiation hole, wherein the frequency of the electromagnetic wave is the same as the frequency of the electromagnetic wave signal. When the transceiver antenna receives the electromagnetic wave transmitted from outside the radiation hole, the transceiver antenna radiates the electromagnetic wave to the electromagnetic wave transceiver module.
在本发明至少一实施例中，辐射孔的长度在电磁波的波长的四分之一倍至二分之一倍的范围。In at least one embodiment of the present invention, the length of the radiation hole is in a range from one quarter to one half of the wavelength of the electromagnetic wave.
在本发明至少一实施例中，传输距离在电磁波的波长的四分之一倍至二分之一倍的范围。In at least one embodiment of the present invention, the transmission distance is in a range from one quarter to one half of the wavelength of the electromagnetic wave.
在本发明至少一实施例中，收发天线为阵列天线，且包括多个天线单元，天线单元间隔排列，且任两相邻的天线单元之间的间距在电磁波的波长的八分之一倍至四分之一倍的范围。In at least one embodiment of the present invention, the transceiver antenna is an array antenna and includes a plurality of antenna units. The antenna units are arranged at intervals, and the distance between any two adjacent antenna units is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave.
在本发明至少一实施例中，电路板包括多个电磁波收发模组，任两相邻的电磁波收发模组之间的间距为大于电磁波的波长的二倍。In at least one embodiment of the present invention, the circuit board includes a plurality of electromagnetic wave transceiver modules, and the distance between any two adjacent electromagnetic wave transceiver modules is greater than twice the wavelength of the electromagnetic wave.
在本发明至少一实施例中，电路板包括多个电磁波收发模组与至少一屏蔽结构，屏蔽结构设置在任两相邻的电磁波收发模组之间。In at least one embodiment of the present invention, the circuit board includes a plurality of electromagnetic wave transceiver modules and at least one shielding structure, and the shielding structure is disposed between any two adjacent electromagnetic wave transceiver modules.
本发明至少一实施例所提供的制造传输太赫兹频率信号的电路板的方法包括：提供第一基板，第一基板包括第一基板介电层及第一基板金属层，其中第一基板介电层和第一基板金属层堆叠，第一基板金属层具有至少一辐射孔，至少一收发天线设置于第一基板介电层对应辐射孔处，且其垂直投影与辐射孔重叠；提供第二基板，第二基板包括第二基板介电层及第二基板金属层，其中第二基板介电层和第二基板金属层堆叠，至少一电磁波收发模组设置于第二基板介电层内；以及将第一基板和第二基板层叠设置，并使电磁波收发模组对准收发天线。The method for manufacturing a circuit board for transmitting terahertz frequency signals provided by at least one embodiment of the present invention includes: providing a first substrate, the first substrate including a first substrate dielectric layer and a first substrate metal layer, wherein the first substrate dielectric layer and the first substrate metal layer are stacked, the first substrate metal layer has at least one radiation hole, and at least one transceiver antenna is arranged at the first substrate dielectric layer corresponding to the radiation hole, and its vertical projection overlaps with the radiation hole; providing a second substrate, the second substrate including a second substrate dielectric layer and a second substrate metal layer, wherein the second substrate dielectric layer and the second substrate metal layer are stacked, and at least one electromagnetic wave transceiver module is arranged in the second substrate dielectric layer; and stacking the first substrate and the second substrate, and aligning the electromagnetic wave transceiver module with the transceiver antenna.
在本发明至少一实施例中，形成第一基板的步骤包括：提供第一单面板；图案化第一单面板的金属层，以形成辐射孔；提供双面板；图案化双面板的其中一金属层，以形成收发天线；图案化双面板的另一金属层，以形成至少一孔洞，其中收发天线的垂直投影与孔洞重叠；以及将第一单面板与双面板压合，使第一单面板与双面板结合，其中收发天线的垂直投影与辐射孔重叠。In at least one embodiment of the present invention, the step of forming a first substrate includes: providing a first single-sided board; patterning a metal layer of the first single-sided board to form a radiation hole; providing a double-sided board; patterning one of the metal layers of the double-sided board to form a transceiver antenna; patterning another metal layer of the double-sided board to form at least one hole, wherein a vertical projection of the transceiver antenna overlaps with the hole; and laminating the first single-sided board and the double-sided board to combine the first single-sided board and the double-sided board, wherein a vertical projection of the transceiver antenna overlaps with the radiation hole.
在本发明至少一实施例中，收发天线为多个收发天线时，提供第一基板的步骤之后还包括：在第一基板的任两相邻的收发天线之间形成屏蔽孔；将屏蔽结构填入屏蔽孔。In at least one embodiment of the present invention, when there are multiple transceiver antennas, the step of providing the first substrate further includes: forming a shielding hole between any two adjacent transceiver antennas of the first substrate; and filling the shielding hole with a shielding structure.
在本发明至少一实施例中，形成第二基板的步骤包括：提供第一介电层、接合介电层、第二单面板和电磁波收发模组，其中接合介电层位于第一介电层和第二单面板的第二介电层之间，且接合介电层形成至少一穿孔，并电磁波收发模组位于穿孔内；以及将第一介电层、接合介电层和第二单面板压合，使第一介电层、接合介电层和第二单面板结合。In at least one embodiment of the present invention, the step of forming the second substrate includes: providing a first dielectric layer, a bonding dielectric layer, a second single-sided board and an electromagnetic wave transceiver module, wherein the bonding dielectric layer is located between the first dielectric layer and the second dielectric layer of the second single-sided board, and the bonding dielectric layer forms at least one through-hole, and the electromagnetic wave transceiver module is located in the through-hole; and pressing the first dielectric layer, the bonding dielectric layer and the second single-sided board to combine the first dielectric layer, the bonding dielectric layer and the second single-sided board.
基于上述，在以上实施例所揭示的电路板中，通过设置在介质层内的电磁波收发模组能发出太赫兹频段范围的电磁波信号以及接收电磁波，而此太赫兹频段范围与收发天线所辐射的毫米波的频率范围重叠，因而使电磁波收发模组与收发天线之间能进行无线信号传输，以达到缩小电路板布局空间的优点。Based on the above, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module arranged in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band and receive electromagnetic waves, and this terahertz frequency band overlaps with the frequency range of millimeter waves radiated by the transceiver antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiver antenna, thereby achieving the advantage of reducing the layout space of the circuit board.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更完整了解实施例及其优点，现参照结合所附附图所做的下列描述，其中：For a more complete understanding of the embodiments and their advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, in which:
图1A是本申请至少一实施例的传输太赫兹频率信号的电路板的剖面示意图；FIG1A is a cross-sectional schematic diagram of a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application;
图1B是图1A的收发天线的放大示意图；FIG1B is an enlarged schematic diagram of the transceiver antenna of FIG1A ;
图2A是收发天线与电磁波收发模组之间进行无线信号传输的示意图；FIG2A is a schematic diagram of wireless signal transmission between a transceiver antenna and an electromagnetic wave transceiver module;
图2B是收发天线与电磁波收发模组之间进行无线信号传输的方框图；FIG2B is a block diagram of wireless signal transmission between a transceiver antenna and an electromagnetic wave transceiver module;
图3A至图3C是本申请至少一实施例的制造传输太赫兹频率信号的电路板的方法中，形成第一基板的剖面示意图；3A to 3C are cross-sectional schematic diagrams of forming a first substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application;
图4是本申请至少一实施例的制造传输太赫兹频率信号的电路板的方法中，形成第二基板的剖面示意图；以及4 is a cross-sectional schematic diagram of forming a second substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application; and
图5是本申请至少一实施例的制造传输太赫兹频率信号的电路板的方法中，结合第一基板与第二基板的剖面示意图。FIG. 5 is a cross-sectional schematic diagram of combining a first substrate and a second substrate in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application.
具体实施方式DETAILED DESCRIPTION
在以下的内文中，为了清楚呈现本案的技术特征，附图中的元件(例如层、膜、基板以及区域等)的尺寸(例如长度、宽度、厚度与深度)会以不等比例的方式放大，而且有的元件数量会减少。因此，下文实施例的说明与解释不受限于附图中的元件数量以及元件所呈现的尺寸与形状，而应涵盖如实际工艺及/或公差所导致的尺寸、形状以及两者的偏差。例如，附图所示的平坦表面可以具有粗糙及/或非线性的特征，而附图所示的锐角可以是圆的。所以，本案附图所呈示的元件主要是用于示意，并非旨在精准地描绘出元件的实际形状，也非用于限制本案的权利要求。In the following text, in order to clearly present the technical features of this case, the dimensions (such as length, width, thickness and depth) of the elements (such as layers, films, substrates and regions, etc.) in the drawings will be enlarged in unequal proportions, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes and deviations of the two caused by actual processes and/or tolerances. For example, the flat surface shown in the drawings may have rough and/or nonlinear features, while the acute angles shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this case are mainly for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they used to limit the claims of this case.
其次，本案内容中所出现的“约”、“近似”或“实质上”等这类用字不仅涵盖明确记载的数值与数值范围，而且也涵盖发明所属技术领域中技术人员所能理解的可允许偏差范围，其中此偏差范围可由测量时所产生的误差来决定，而此误差例如是起因于测量系统或工艺条件两者的限制。此外，“约”可表示在上述数值的一个或多个标准偏差内，例如±30％、±20％、±10％或±5％内。本案文中所出现的“约”、“近似”或“实质上”等这类用字可依光学性质、蚀刻性质、机械性质或其他性质来选择可以接受的偏差范围或标准偏差，并非单以一个标准偏差来套用以上光学性质、蚀刻性质、机械性质以及其他性质等所有性质。Secondly, the words "about", "approximately" or "substantially" that appear in the content of this case not only cover the numerical values and numerical ranges that are clearly recorded, but also cover the permissible deviation range that can be understood by technicians in the technical field to which the invention belongs, wherein this deviation range can be determined by the error generated during measurement, and this error is caused by, for example, the limitations of the measurement system or process conditions. In addition, "about" can mean within one or more standard deviations of the above numerical values, such as ±30%, ±20%, ±10% or ±5%. The words "about", "approximately" or "substantially" that appear in this text can select an acceptable deviation range or standard deviation based on the optical properties, etching properties, mechanical properties or other properties, and not just one standard deviation can be applied to all properties such as the above optical properties, etching properties, mechanical properties and other properties.
在本案内容中所使用的用语仅是为了描述特定实施例，非用以限制权利要求。除非另有限制，否则单数形式的“一”或“该”用语也可用来表示多数形式。The terms used in this case are only for describing specific embodiments and are not intended to limit the claims. Unless otherwise limited, the singular forms "a", "an" or "the" may also be used to refer to the plural forms.
本申请的传输太赫兹频率信号的电路板可用于任何具有无线通信功能的电子装置，其能使发射/接收电路与天线之间以无线传输的方式进行信号传输。The circuit board for transmitting terahertz frequency signals of the present application can be used in any electronic device with wireless communication function, which can enable signal transmission between the transmitting/receiving circuit and the antenna in a wireless transmission manner.
图1A是本申请至少一实施例的传输太赫兹频率信号的电路板100的剖面示意图。请参阅图1A，电路板100包括多层介电层111和112、第一金属图案层121、第二金属图案层122、第三金属图案层123、至少一收发天线130与至少一电磁波收发模组140。以图1A为例，电路板100包括多个收发天线130与多个电磁波收发模组140。而在其他实施例中，电路板100所包括的收发天线130与电磁波收发模组140两者个别的数量可以仅为一个。FIG1A is a cross-sectional schematic diagram of a circuit board 100 for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A , the circuit board 100 includes multiple dielectric layers 111 and 112, a first metal pattern layer 121, a second metal pattern layer 122, a third metal pattern layer 123, at least one transceiver antenna 130, and at least one electromagnetic wave transceiver module 140. Taking FIG1A as an example, the circuit board 100 includes a plurality of transceiver antennas 130 and a plurality of electromagnetic wave transceiver modules 140. In other embodiments, the number of the transceiver antenna 130 and the electromagnetic wave transceiver module 140 included in the circuit board 100 may be only one.
本申请在图1A以两层介电层111和112为例，但不以此为限。介电层111与介电层112位于第一金属图案层121、第二金属图案层122和第三金属图案层123之间，且所述介电层111和112、第一金属图案层121、第二金属图案层122与第三金属图案层123皆堆叠结合在一起。需注意的是，电路板100的板材材料并无限制，可使用软性基材或硬性基材。In FIG. 1A , the present application uses two dielectric layers 111 and 112 as an example, but the present invention is not limited thereto. The dielectric layers 111 and 112 are located between the first metal pattern layer 121, the second metal pattern layer 122, and the third metal pattern layer 123, and the dielectric layers 111 and 112, the first metal pattern layer 121, the second metal pattern layer 122, and the third metal pattern layer 123 are stacked and combined together. It should be noted that the board material of the circuit board 100 is not limited, and a soft substrate or a hard substrate can be used.
第一金属图案层121具有多个辐射孔124，使介电层111的上方部分暴露，此外第一金属图案层121上还具有走线(trace)或/及接地图案。第二金属图案层122上也具有走线或/及接地图案。第三金属图案层123具有多个孔洞125，且所述孔洞125在朝向第一金属图案层121垂直投影时分别与辐射孔124重叠。此外，第三金属图案层123上也具有走线或/及接地图案。The first metal pattern layer 121 has a plurality of radiation holes 124, exposing the upper portion of the dielectric layer 111. In addition, the first metal pattern layer 121 also has a trace or/and a ground pattern. The second metal pattern layer 122 also has a trace or/and a ground pattern. The third metal pattern layer 123 has a plurality of holes 125, and the holes 125 overlap with the radiation holes 124 when vertically projected toward the first metal pattern layer 121. In addition, the third metal pattern layer 123 also has a trace or/and a ground pattern.
在本示例中，所述辐射孔124及所述孔洞125两者个别的数量皆与所述收发天线130的数量相同，且所述收发天线130的位置分别对应且对准所述辐射孔124及所述孔洞125。每一个辐射孔124的长度l在电磁波的波长的四分之一倍至二分之一倍的范围，其中前述电磁波为经由对应的收发天线130所辐射，以使对应的收发天线130得到较大的增益。In this example, the number of the radiation holes 124 and the holes 125 is the same as the number of the transceiver antennas 130, and the positions of the transceiver antennas 130 correspond to and align with the radiation holes 124 and the holes 125. The length l of each radiation hole 124 is in the range of one quarter to one half of the wavelength of the electromagnetic wave, wherein the electromagnetic wave is radiated via the corresponding transceiver antenna 130, so that the corresponding transceiver antenna 130 obtains a greater gain.
图1B是图1A的收发天线130的放大示意图。请参阅图1A和图1B，所述收发天线130设置于介电层111内，且位于所述辐射孔124及所述孔洞125之间。每一个收发天线130朝向对应的辐射孔124方向垂直投影时与对应的辐射孔124重叠，且朝向对应的孔洞125方向垂直投影时与对应的孔洞125重叠。每一个收发天线130为阵列天线，且包括多个天线单元131。所述天线单元131间隔排列，且任两相邻的所述天线单元131之间具有间距d，其中间距d的长度在对应的收发天线130所辐射的电磁波的波长的八分之一倍至四分之一倍的范围，以提高所述收发天线130的带宽。FIG1B is an enlarged schematic diagram of the transceiver antenna 130 of FIG1A . Referring to FIG1A and FIG1B , the transceiver antenna 130 is disposed in the dielectric layer 111 and is located between the radiation hole 124 and the hole 125 . Each transceiver antenna 130 overlaps with the corresponding radiation hole 124 when vertically projected toward the direction of the corresponding radiation hole 124 , and overlaps with the corresponding hole 125 when vertically projected toward the direction of the corresponding hole 125 . Each transceiver antenna 130 is an array antenna and includes a plurality of antenna units 131 . The antenna units 131 are arranged at intervals, and there is a spacing d between any two adjacent antenna units 131 , wherein the length of the spacing d is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave radiated by the corresponding transceiver antenna 130 , so as to improve the bandwidth of the transceiver antenna 130 .
所述天线单元131为贴片天线(patch antenna)。在本示例中，收发天线130为将所述天线单元131排列成1行4列(1x4)的阵列天线，但不以此为限，收发天线130也可为将所述天线单元131排列成4行4列(4x4)或8行8列(8x8)的阵列天线。所述收发天线130可受控制以波束成型(beamforming)的方式形成预定天线场型，并所述收发天线130发出的波束可自所述辐射孔124向电路板100外进行波束扫描(beam scanning)。The antenna unit 131 is a patch antenna. In this example, the transceiver antenna 130 is an array antenna in which the antenna units 131 are arranged in 1 row and 4 columns (1x4), but the invention is not limited thereto. The transceiver antenna 130 may also be an array antenna in which the antenna units 131 are arranged in 4 rows and 4 columns (4x4) or 8 rows and 8 columns (8x8). The transceiver antenna 130 may be controlled to form a predetermined antenna pattern in a beamforming manner, and the beam emitted by the transceiver antenna 130 may be beam scanned from the radiation hole 124 to the outside of the circuit board 100.
所述电磁波收发模组140设置于介电层112内，且分别与所述收发天线130之间具有传输距离D。所述电磁波收发模组140分别通过所述孔洞125来对准所述收发天线130，以使各个收发天线130对准一个辐射孔124与一个孔洞125。The electromagnetic wave transceiver module 140 is disposed in the dielectric layer 112 and has a transmission distance D with the transceiver antenna 130 . The electromagnetic wave transceiver module 140 is aligned with the transceiver antenna 130 through the hole 125 , so that each transceiver antenna 130 is aligned with a radiation hole 124 and a hole 125 .
图2A是收发天线130与电磁波收发模组140之间进行无线信号传输的示意图，且图2B是收发天线130与电磁波收发模组140之间进行无线信号传输的方框图。请参阅图1A、图2A和图2B，在本示例中，所述电磁波收发模组140可制作成芯片，例如集成电路(IntegratedCircuit,IC)。每一个电磁波收发模组140具有处理器141、发射电路142、接收电路143、电磁波发射器144与电磁波接收器145。FIG2A is a schematic diagram of wireless signal transmission between the transceiver antenna 130 and the electromagnetic wave transceiver module 140, and FIG2B is a block diagram of wireless signal transmission between the transceiver antenna 130 and the electromagnetic wave transceiver module 140. Referring to FIG1A, FIG2A and FIG2B, in this example, the electromagnetic wave transceiver module 140 can be made into a chip, such as an integrated circuit (IC). Each electromagnetic wave transceiver module 140 has a processor 141, a transmitting circuit 142, a receiving circuit 143, an electromagnetic wave transmitter 144 and an electromagnetic wave receiver 145.
处理器141用以处理电子信号以执行运算、识别、特征值取样等功能。发射电路142用以处理控制收发天线130辐射的电子信号。接收电路143用以处理根据收发天线130辐射的电磁波所转换的电子信号。电磁波发射器144用以产生电磁波信号，电磁波发射器144可以是激光二极管(laser diode)或激微波(microwave amplification by stimulatedemission of radiation,maser)二极管(maser diode)。电磁波接收器145用以将接收到的电磁波转换为电子信号，电磁波接收器145可以是光电二极管(photodiode)。The processor 141 is used to process electronic signals to perform functions such as calculation, recognition, and feature value sampling. The transmitting circuit 142 is used to process the electronic signal radiated by the transceiver antenna 130. The receiving circuit 143 is used to process the electronic signal converted according to the electromagnetic wave radiated by the transceiver antenna 130. The electromagnetic wave transmitter 144 is used to generate electromagnetic wave signals. The electromagnetic wave transmitter 144 can be a laser diode or a microwave amplification by stimulated demission of radiation, maser diode. The electromagnetic wave receiver 145 is used to convert the received electromagnetic wave into an electronic signal. The electromagnetic wave receiver 145 can be a photodiode.
电磁波信号的频率在太赫兹频段的范围内。太赫兹频段为100GHz(0.1THz)至10000GHz(10THz)的频率范围，其中太赫兹频段内的低频部分与收发天线130辐射的电磁波的毫米波的频段重叠。因此本申请通过电磁波收发模组140产生电磁波信号，其频率位于太赫兹频段内的低频部分，而与收发天线130辐射的电磁波的频率相同，因而使所述电磁波收发模组140与所述收发天线130之间能进行无线信号传输。The frequency of the electromagnetic wave signal is within the range of the terahertz frequency band. The terahertz frequency band is a frequency range of 100 GHz (0.1 THz) to 10000 GHz (10 THz), wherein the low frequency portion within the terahertz frequency band overlaps with the frequency band of the millimeter wave of the electromagnetic wave radiated by the transceiver antenna 130. Therefore, the present application generates an electromagnetic wave signal through the electromagnetic wave transceiver module 140, the frequency of which is located in the low frequency portion within the terahertz frequency band, and is the same as the frequency of the electromagnetic wave radiated by the transceiver antenna 130, thereby enabling wireless signal transmission between the electromagnetic wave transceiver module 140 and the transceiver antenna 130.
进一步，所述电磁波收发模组140与所述收发天线130之间的传输距离D在电磁波的波长的四分之一倍至二分之一倍的范围，而电磁波为经由对应的收发天线130所辐射。在此范围的传输距离D可减少电磁波信号和电磁波传输的损耗。Furthermore, the transmission distance D between the electromagnetic wave transceiver module 140 and the transceiver antenna 130 is in the range of one quarter to one half of the wavelength of the electromagnetic wave, and the electromagnetic wave is radiated via the corresponding transceiver antenna 130. The transmission distance D in this range can reduce the loss of electromagnetic wave signals and electromagnetic wave transmission.
在所述收发天线130辐射电磁波的过程为：电子信号经由发射电路142调变，电磁波发射器144根据调变的电子信号产生且发射电磁波信号至所述收发天线130，所述收发天线130根据接收到的电磁波信号而辐射电磁波，电磁波可从辐射孔124向外辐射。在所述收发天线130接收电磁波的过程为：所述收发天线130接收到从辐射孔124外传来的电磁波且将电磁波辐射而传至所述电磁波收发模组140，电磁波接收器145将接收到的电磁波转换为电子信号而传输给接收电路143，接收电路143解调电子信号后传给处理器141。The process of radiating electromagnetic waves at the transceiver antenna 130 is as follows: the electronic signal is modulated by the transmitting circuit 142, the electromagnetic wave transmitter 144 generates and transmits an electromagnetic wave signal to the transceiver antenna 130 according to the modulated electronic signal, and the transceiver antenna 130 radiates electromagnetic waves according to the received electromagnetic wave signal, and the electromagnetic waves can be radiated outward from the radiation hole 124. The process of receiving electromagnetic waves at the transceiver antenna 130 is as follows: the transceiver antenna 130 receives the electromagnetic waves transmitted from the outside of the radiation hole 124 and radiates the electromagnetic waves to the electromagnetic wave transceiver module 140, the electromagnetic wave receiver 145 converts the received electromagnetic waves into electronic signals and transmits them to the receiving circuit 143, and the receiving circuit 143 demodulates the electronic signals and transmits them to the processor 141.
需补充说明的是，任两相邻的所述电磁波收发模组140之间的间距L为大于电磁波波长的二倍，以避免相邻的所述电磁波收发模组140之间彼此的干扰。进一步，电路板100还包括多个屏蔽结构150，所述屏蔽结构150可以是金属结构，例如铜柱。所述屏蔽结构150可设置在任两相邻的所述电磁波收发模组140之间，可让所述电磁波收发模组140之间的屏蔽效果更好。此外，所述屏蔽结构150也可设置在任两相邻的所述收发天线130之间，以屏蔽所述收发天线130之间的干扰。It should be noted that the spacing L between any two adjacent electromagnetic wave transceiver modules 140 is greater than twice the wavelength of the electromagnetic wave to avoid interference between adjacent electromagnetic wave transceiver modules 140. Further, the circuit board 100 also includes a plurality of shielding structures 150, and the shielding structures 150 may be metal structures, such as copper columns. The shielding structure 150 may be disposed between any two adjacent electromagnetic wave transceiver modules 140 to provide a better shielding effect between the electromagnetic wave transceiver modules 140. In addition, the shielding structure 150 may also be disposed between any two adjacent transceiver antennas 130 to shield interference between the transceiver antennas 130.
图3A至图3C是本申请至少一实施例的制造传输太赫兹频率信号的电路板的方法中，形成第一基板400的剖面示意图。请参阅图3A，首先，提供第一单面板200，其中第一单面板200包括介电层210及金属层220。介电层210与金属层220堆叠。接着，图案化金属层220以形成多个辐射孔124使介电层210暴露，例如通过光刻与蚀刻来图案化金属层220。请参阅图3B，之后，提供双面板300，其中双面板300包括介电层310及两个金属层320和330。所述金属层320和330分别堆叠在介电层310的上下两面。接着，图案化金属层320以形成所述收发天线130。进一步，图案化金属层330以形成所述孔洞125，其中所述收发天线130分别朝向所述孔洞125方向垂直投影时与所述孔洞125重叠。图案化金属层320和330的方式例如包括光刻与蚀刻。FIG. 3A to FIG. 3C are cross-sectional schematic diagrams of forming a first substrate 400 in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG. 3A , first, a first single-sided board 200 is provided, wherein the first single-sided board 200 includes a dielectric layer 210 and a metal layer 220. The dielectric layer 210 and the metal layer 220 are stacked. Next, the metal layer 220 is patterned to form a plurality of radiation holes 124 to expose the dielectric layer 210, for example, by patterning the metal layer 220 through photolithography and etching. Referring to FIG. 3B , thereafter, a double-sided board 300 is provided, wherein the double-sided board 300 includes a dielectric layer 310 and two metal layers 320 and 330. The metal layers 320 and 330 are stacked on the upper and lower surfaces of the dielectric layer 310, respectively. Next, the metal layer 320 is patterned to form the transceiver antenna 130. Furthermore, the metal layer 330 is patterned to form the hole 125, wherein the transceiver antennas 130 overlap with the hole 125 when vertically projected toward the hole 125. The metal layers 320 and 330 are patterned by, for example, photolithography and etching.
请参阅图3C，接着，以介电层210与金属层320彼此面对面的方式，将第一单面板200与双面板300压合，使第一单面板200与双面板300结合，其中这些收发天线130朝向辐射孔124的垂直投影分别与所述辐射孔124重叠。辐射孔124和孔洞125分别位于结合后的第一单面板200和双面板300的相对两侧。Referring to FIG. 3C , the first single-sided board 200 and the double-sided board 300 are then pressed together in a manner that the dielectric layer 210 and the metal layer 320 face each other, so that the first single-sided board 200 and the double-sided board 300 are combined, wherein the vertical projections of the transceiver antennas 130 toward the radiation holes 124 overlap with the radiation holes 124. The radiation holes 124 and the holes 125 are respectively located on opposite sides of the combined first single-sided board 200 and the double-sided board 300.
结合后的第一单面板200和双面板300成为第一基板400，其中第一基板400包括第一基板介电层410及两个第一基板金属层420和430，且第一基板金属层420和430分别堆叠在第一基板介电层410的上下两面。所述收发天线130设置于第一基板介电层410内。The first single-sided board 200 and the double-sided board 300 are combined to form a first substrate 400, wherein the first substrate 400 includes a first substrate dielectric layer 410 and two first substrate metal layers 420 and 430, and the first substrate metal layers 420 and 430 are respectively stacked on the upper and lower surfaces of the first substrate dielectric layer 410. The transceiver antenna 130 is disposed in the first substrate dielectric layer 410.
配合参阅图1A，第一基板介电层410即为电路板100的介电层111。第一基板金属层420可经由图案化形成走线或/及接地图案，从而成为第一金属图案层121。第一基板金属层430可经由图案化形成走线或/及接地图案，从而成为第三金属图案层123。接着，在第一基板400的任两相邻的所述收发天线130之间形成多个屏蔽孔，其中例如使用激光钻孔以形成所述屏蔽孔。之后，将所述屏蔽结构150填入所述屏蔽孔。Referring to FIG. 1A , the first substrate dielectric layer 410 is the dielectric layer 111 of the circuit board 100. The first substrate metal layer 420 can be patterned to form a routing or/and grounding pattern, thereby becoming a first metal pattern layer 121. The first substrate metal layer 430 can be patterned to form a routing or/and grounding pattern, thereby becoming a third metal pattern layer 123. Next, a plurality of shielding holes are formed between any two adjacent transceiver antennas 130 of the first substrate 400, wherein the shielding holes are formed by, for example, laser drilling. Thereafter, the shielding structure 150 is filled into the shielding holes.
图4是本申请至少一实施例的制造传输太赫兹频率信号的电路板的方法中，形成第二基板600的剖面示意图。请参阅图1A和图4，首先，提供第一介电层510、接合介电层520、第二单面板530和电磁波收发模组140。第二单面板530包括第二介电层531及金属层532，其中第二介电层531与金属层532堆叠。接合介电层520位于第一介电层510和第二介电层531之间，且形成至少一穿孔521。在本示例中，接合介电层520形成两个穿孔521，且所述电磁波收发模组140分别位于所述穿孔521内。上述第一介电层510、接合介电层520和第二介电层531的材料例如是液晶聚合物(liquid crystal polymer,LCP)。FIG4 is a cross-sectional schematic diagram of forming a second substrate 600 in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A and FIG4, first, a first dielectric layer 510, a bonding dielectric layer 520, a second single-sided board 530 and an electromagnetic wave transceiver module 140 are provided. The second single-sided board 530 includes a second dielectric layer 531 and a metal layer 532, wherein the second dielectric layer 531 and the metal layer 532 are stacked. The bonding dielectric layer 520 is located between the first dielectric layer 510 and the second dielectric layer 531, and forms at least one through-hole 521. In this example, the bonding dielectric layer 520 forms two through-holes 521, and the electromagnetic wave transceiver module 140 is respectively located in the through-holes 521. The materials of the first dielectric layer 510, the bonding dielectric layer 520 and the second dielectric layer 531 are, for example, liquid crystal polymers (LCP).
接着，将第一介电层510、接合介电层520和第二单面板530压合，使第一介电层510、接合介电层520和第二单面板530结合而形成第二基板600，其中第二基板600包括第二基板介电层610及第二基板金属层620，且第二基板介电层610与第二基板金属层620堆叠。第二基板介电层610即为电路板100的介电层112。第二基板金属层620可经由图案化形成走线或/及接地图案，从而成为第二金属图案层122。所述电磁波收发模组140设置于第二基板介电层610内。Next, the first dielectric layer 510, the bonding dielectric layer 520 and the second single-sided board 530 are pressed together to form a second substrate 600, wherein the second substrate 600 includes a second substrate dielectric layer 610 and a second substrate metal layer 620, and the second substrate dielectric layer 610 and the second substrate metal layer 620 are stacked. The second substrate dielectric layer 610 is the dielectric layer 112 of the circuit board 100. The second substrate metal layer 620 can be patterned to form a routing or/and a grounding pattern, thereby becoming a second metal pattern layer 122. The electromagnetic wave transceiver module 140 is disposed in the second substrate dielectric layer 610.
之后，在第二基板600的任两相邻的所述电磁波收发模组140之间形成多个屏蔽孔。接着，将所述屏蔽结构150填入所述屏蔽孔。Afterwards, a plurality of shielding holes are formed between any two adjacent electromagnetic wave transceiver modules 140 on the second substrate 600. Next, the shielding structure 150 is filled into the shielding holes.
图5是本申请至少一实施例的制造传输太赫兹频率信号的电路板的方法中，结合第一基板400与第二基板600的剖面示意图。请参阅图1A及图5，以第一基板金属层430与第二基板介电层610彼此面对面的方式，将第一基板400和第二基板600层叠设置(假压)，并使所述电磁波收发模组140对准所述收发天线130以制造出电路板100。第一基板介电层410即为介电层111，且第二基板介电层610即为介电层112。第一基板金属层420可形成第一金属图案层121、第二基板金属层620可形成第二金属图案层122，且第一基板金属层430可形成第三金属图案层123。FIG5 is a cross-sectional schematic diagram of a first substrate 400 and a second substrate 600 in a method for manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Referring to FIG1A and FIG5, the first substrate 400 and the second substrate 600 are stacked (falsely pressed) in a manner that the first substrate metal layer 430 and the second substrate dielectric layer 610 face each other, and the electromagnetic wave transceiver module 140 is aligned with the transceiver antenna 130 to manufacture the circuit board 100. The first substrate dielectric layer 410 is the dielectric layer 111, and the second substrate dielectric layer 610 is the dielectric layer 112. The first substrate metal layer 420 can form a first metal pattern layer 121, the second substrate metal layer 620 can form a second metal pattern layer 122, and the first substrate metal layer 430 can form a third metal pattern layer 123.
综上所述，在以上实施例所揭示的电路板中，通过设置在介质层内的电磁波收发模组能发出太赫兹频段范围的电磁波信号以及接收电磁波，而此太赫兹频段范围与所述收发天线辐射的毫米波的频率范围重叠，因而使所述电磁波收发模组与所述收发天线之间能进行无线信号传输，以达到缩小电路板布局空间的优点。To sum up, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module arranged in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band and receive electromagnetic waves, and this terahertz frequency band overlaps with the frequency range of millimeter waves radiated by the transceiver antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiver antenna, thereby achieving the advantage of reducing the layout space of the circuit board.
虽然本发明已以实施例揭露如上，然其并非用以限定本发明，本发明所属技术领域中技术人员，在不脱离本发明精神和范围内，当可作些许更动与润饰，因此本发明保护范围当视后附的权利要求所界定者为准。Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the appended claims.
【符号说明】【Explanation of symbols】
100:电路板100: Circuit board
111:介电层111: Dielectric layer
112:介电层112: Dielectric layer
121:第一金属图案层121: first metal pattern layer
122:第二金属图案层122: second metal pattern layer
123:第三金属图案层123: third metal pattern layer
124:辐射孔124: Radiant hole
125:孔洞125: Holes
130:收发天线130: Transceiver antenna
131:天线单元131: Antenna unit
140:电磁波收发模组140:Electromagnetic wave transceiver module
141:处理器141: Processor
142:发射电路142: Transmitter circuit
143:接收电路143: Receiving circuit
144:电磁波发射器144:Electromagnetic wave transmitter
145:电磁波接收器145:Electromagnetic wave receiver
150:屏蔽结构150: Shielding structure
200:第一单面板200: The first single-sided board
210:介电层210: Dielectric layer
220:金属层220:Metal layer
300:双面板300: Double-sided board
310:介电层310: Dielectric layer
320,330:金属层320,330:Metal layer
400:第一基板400: first substrate
410:第一基板介电层410: first substrate dielectric layer
420,430:第一基板金属层420, 430: first substrate metal layer
510:第一介电层510: first dielectric layer
520:接合介电层520: Bonding dielectric layer
521:穿孔521:Piercing
530:第二单面板530: Second single panel
531:第二介电层531: Second dielectric layer
532:金属层532:Metal layer
600:第二基板600: Second substrate
610:第二基板介电层610: Second substrate dielectric layer
620:第二基板金属层620: Second substrate metal layer
l:长度l: length
d:间距d: Spacing
D:传输距离D: Transmission distance
L:间距。L: Spacing.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310152400.3ACN118510146A (en) | 2023-02-16 | 2023-02-16 | Circuit board for transmitting terahertz frequency signals and manufacturing method thereof |
| TW112107150ATWI841264B (en) | 2023-02-16 | 2023-02-24 | Circuit board for transmitting signals in frequency band of terahertz and method of manufacturing the same |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310152400.3ACN118510146A (en) | 2023-02-16 | 2023-02-16 | Circuit board for transmitting terahertz frequency signals and manufacturing method thereof |
| Publication Number | Publication Date |
|---|---|
| CN118510146Atrue CN118510146A (en) | 2024-08-16 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310152400.3APendingCN118510146A (en) | 2023-02-16 | 2023-02-16 | Circuit board for transmitting terahertz frequency signals and manufacturing method thereof |
| Country | Link |
|---|---|
| CN (1) | CN118510146A (en) |
| TW (1) | TWI841264B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016092084A1 (en)* | 2014-12-12 | 2016-06-16 | Sony Corporation | Microwave antenna apparatus, packing and manufacturing method |
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