技术领域Technical Field
本发明涉及半导体技术领域，具体为一种半导体制冷片键合用吸附模具。The invention relates to the field of semiconductor technology, in particular to an adsorption mold for bonding semiconductor refrigeration sheets.
背景技术Background technique
在半导体制冷片键合前，需要通过模具对待键合的半导体制冷片进行定位。传统模具上的夹持组件难以满足对不同尺寸的半导体制冷片的夹持键合，所以针对于半导体制冷片的键合工作，大多的模具采用的是真空孔吸附定位的，但是现有的吸附定位的模具均需要手动对板进行对准定位，针对尺寸不同的半导体制冷片定位的位置不同，手动定位的方式误差存在，且与半导体制冷片不接触的其他真空孔在吸附定位期间处于无效吸附，会减弱剩余孔对半导体制冷片的吸附力度，同时在长时间的试用下，真空腔内过滤的网塞会被吸附的毛絮、颗粒等杂质堵塞，堵塞后会大大削弱吸附力度，影响半导体制冷片的键合工作，鉴于此，我们提出一种半导体制冷片键合用吸附模具。Before bonding the semiconductor refrigeration sheet, the semiconductor refrigeration sheet to be bonded needs to be positioned by the mold. The clamping components on the traditional mold are difficult to meet the clamping and bonding of semiconductor refrigeration sheets of different sizes. Therefore, for the bonding work of semiconductor refrigeration sheets, most molds use vacuum hole adsorption positioning, but the existing adsorption positioning molds all require manual alignment and positioning of the plate. The positioning positions of semiconductor refrigeration sheets of different sizes are different, and there are errors in the manual positioning method. In addition, other vacuum holes that are not in contact with the semiconductor refrigeration sheet are in invalid adsorption during adsorption positioning, which will weaken the adsorption strength of the remaining holes on the semiconductor refrigeration sheet. At the same time, after a long period of trial, the mesh plug filtered in the vacuum chamber will be blocked by impurities such as adsorbed fluff and particles. After clogging, the adsorption strength will be greatly weakened, affecting the bonding work of the semiconductor refrigeration sheet. In view of this, we propose an adsorption mold for bonding semiconductor refrigeration sheets.
发明内容Summary of the invention
针对现有技术的不足，本发明提供了一种半导体制冷片键合用吸附模具，解决了上述背景技术中提出的问题。为实现以上目的，本发明通过以下技术方案予以实现：一种半导体制冷片键合用吸附模具，包括模具底座，所述模具底座的内部通过螺栓固定连接有吸附电机，所述吸附电机的输出轴卡接有风扇，所述模具底座的顶部固定连接有真空孔吸附面板；多尺寸自动定位装置；自动闭孔装置；防堵塞清理装置。In view of the shortcomings of the prior art, the present invention provides an adsorption mold for bonding semiconductor refrigeration sheets, which solves the problems raised in the above background technology. To achieve the above purpose, the present invention is implemented through the following technical scheme: an adsorption mold for bonding semiconductor refrigeration sheets, comprising a mold base, the interior of the mold base is fixedly connected to an adsorption motor by bolts, the output shaft of the adsorption motor is clamped with a fan, the top of the mold base is fixedly connected to a vacuum hole adsorption panel; a multi-size automatic positioning device; an automatic hole closing device; and an anti-blocking cleaning device.
优选的，所述多尺寸自动定位装置包括有主动电机、纵双向往复丝杆、横双向往复丝杆和横纵定位装置，所述主动电机的表面通过螺栓固定连接模具底座的内部，所述主动电机的输出轴卡接有主动辊，所述主动辊的表面通过齿皮带传动连接有被动辊，所述纵双向往复丝杆和横双向往复丝杆的表面均固定连接有啮合齿轮。Preferably, the multi-size automatic positioning device includes an active motor, a longitudinal and bidirectional reciprocating screw, a transverse and bidirectional reciprocating screw and a transverse and longitudinal positioning device. The surface of the active motor is fixedly connected to the inside of the mold base by bolts, the output shaft of the active motor is clamped with an active roller, the surface of the active roller is connected to a passive roller through a toothed belt drive, and the surfaces of the longitudinal and bidirectional reciprocating screw and the transverse and bidirectional reciprocating screw are fixedly connected with meshing gears.
优选的，所述主动辊的端部转动连接模具底座的内部，所述被动辊的内部转动连接纵双向往复丝杆的表面，所述纵双向往复丝杆和横双向往复丝杆的端部均转动连接模具底座的内部。Preferably, the end of the active roller is rotatably connected to the inside of the mold base, the inside of the passive roller is rotatably connected to the surface of the longitudinal and bidirectional reciprocating screw rod, and the ends of the longitudinal and bidirectional reciprocating screw rod and the transverse and bidirectional reciprocating screw rod are both rotatably connected to the inside of the mold base.
优选的，所述横纵定位装置包括有限位滑座一和限位滑座二，所述限位滑座一和限位滑座二的内部分别滑动连接纵双向往复丝杆和横双向往复丝杆的表面，所述限位滑座一的顶部固定连接有底板，所述底板的顶部固定连接有连接座，所述连接座的表面通过弹簧弹性连接有夹块一，所述限位滑座二的表面通过弹簧弹性连接有移动板。Preferably, the transverse and longitudinal positioning device includes a limit slide one and a limit slide two, the interiors of the limit slide one and the limit slide two are respectively slidably connected to the surfaces of the longitudinal bidirectional reciprocating screw and the transverse bidirectional reciprocating screw, the top of the limit slide one is fixedly connected to a base plate, the top of the base plate is fixedly connected to a connecting seat, the surface of the connecting seat is elastically connected to a clamping block one via a spring, and the surface of the limit slide two is elastically connected to a movable plate via a spring.
优选的，所述限位滑座一和限位滑座二的表面分别滑动连接模具底座的内部，所述底板、连接座和移动板的表面分别滑动连接模具底座的内壁，所述移动板的表面通过长杆固定连接有夹块二。Preferably, the surfaces of the limiting slide one and the limiting slide two are respectively slidably connected to the inside of the mold base, the surfaces of the bottom plate, the connecting seat and the movable plate are respectively slidably connected to the inner wall of the mold base, and the surface of the movable plate is fixedly connected to the clamp block two through a long rod.
优选的，所述自动闭孔装置包括有滑杆和孔档条，所述滑杆的一端固定连接夹块一的表面，所述滑杆的另一端固定连接有连板，所述连板的表面固定连接有连杆，所述连杆的端部固定连接有孔挡板。Preferably, the automatic hole closing device includes a sliding rod and a hole stopper strip, one end of the sliding rod is fixedly connected to the surface of a clamping block, the other end of the sliding rod is fixedly connected to a connecting plate, the surface of the connecting plate is fixedly connected to a connecting rod, and the end of the connecting rod is fixedly connected to a hole stopper.
优选的，所述滑杆的表面滑动连接连接座的内部，所述连杆的表面滑动连接底板的内部，所述孔挡板的表面滑动连接模具底座的内壁，所述孔档条的内部通过弹簧弹性连接移动板的表面，且孔档条的表面滑动连接模具底座的内部。Preferably, the surface of the sliding rod is slidably connected to the inside of the connecting seat, the surface of the connecting rod is slidably connected to the inside of the bottom plate, the surface of the hole stop plate is slidably connected to the inner wall of the mold base, the inside of the hole stop strip is elastically connected to the surface of the movable plate through a spring, and the surface of the hole stop strip is slidably connected to the inside of the mold base.
优选的，所述模具底座的内部开设有收纳槽，所述防堵塞清理装置包括有过滤网、轴杆和密封板，所述轴杆的一端固定连接底板的表面，所述轴杆的另一端固定连接有清理刷板，所述轴杆的表面固定连接有带动板。Preferably, a storage groove is opened inside the mold base, and the anti-clogging cleaning device includes a filter screen, a shaft rod and a sealing plate, one end of the shaft rod is fixedly connected to the surface of the bottom plate, the other end of the shaft rod is fixedly connected to a cleaning brush plate, and the surface of the shaft rod is fixedly connected to a driving plate.
优选的，所述过滤网的表面固定连接模具底座的内部，所述轴杆的表面滑动连接孔挡板的内部，所述密封板的表面通过弹簧弹性连接模具底座的内部。Preferably, the surface of the filter screen is fixedly connected to the inside of the mold base, the surface of the shaft rod is slidably connected to the inside of the hole baffle, and the surface of the sealing plate is elastically connected to the inside of the mold base via a spring.
有以上技术方案可见，本说明书实施例提供的一种半导体制冷片键合用吸附模具，至少具备以下有益效果：It can be seen from the above technical solutions that the semiconductor refrigeration sheet bonding adsorption mold provided in the embodiments of this specification has at least the following beneficial effects:
(1)、本发明通过多尺寸自动定位装置带动自动闭孔装置，整体达到对不同尺寸的半导体制冷片四侧均进行对准定位、弹性夹持和密封多余真空孔的效果，避免手动定位产生误差的问题，同时结合吸附定位，具有双重固定的效果，提高对不同尺寸的半导体制冷片定位的稳定性，也进一步的避免因多余的真空孔的使用，导致半导体制冷片吸附不稳定的问题，通过防堵塞清理装置对过滤网上杂质进行自动清理的同时对清理后的杂质进行密封处理，进一步达到避免过滤网堵塞的同时避免吸附的力影响杂质收纳的问题的效果，避免因滤网堵塞导致吸力受影响等问题。(1) The present invention uses a multi-size automatic positioning device to drive an automatic closing device, thereby achieving the overall effect of aligning and positioning, elastically clamping and sealing redundant vacuum holes on the four sides of semiconductor refrigeration plates of different sizes, avoiding the problem of errors caused by manual positioning, and combining adsorption positioning with a double fixing effect, thereby improving the stability of positioning of semiconductor refrigeration plates of different sizes, and further avoiding the problem of unstable adsorption of semiconductor refrigeration plates due to the use of redundant vacuum holes. The anti-clogging cleaning device automatically cleans impurities on the filter screen and seals the cleaned impurities, thereby further achieving the effect of avoiding clogging of the filter screen and avoiding the problem of adsorption force affecting the collection of impurities, and avoiding the problem of suction being affected due to clogging of the filter screen.
(2)、本发明中孔挡板受连杆上连板与滑杆的影响，与夹块一的运动保持一致，孔挡板在移动期间覆盖相应位置的真空孔，达到对半导体制冷片两侧外不接触板的孔进行密封处理的效果，同时因夹块能够根据不同尺寸的半导体制冷片进行位置调节，所以孔挡板也能够根据不同尺寸的半导体制冷片进行位置调节，进一步达到对不同尺寸的半导体制冷片两侧外不接触板的真空孔进行密封处理的效果，夹块二能够根据不同尺寸的半导体制冷片进行位置调节，所以孔档条也能够根据不同尺寸的半导体制冷片进行位置调节，进一步达到对不同尺寸的半导体制冷片两侧外不接触板的真空孔进行密封处理的效果。(2) In the present invention, the hole baffle is affected by the connecting plate and the sliding rod on the connecting rod and keeps consistent with the movement of the clamp block 1. The hole baffle covers the vacuum holes at the corresponding position during the movement, so as to achieve the effect of sealing the holes on both sides of the semiconductor refrigeration plate that do not contact the outside of the plate. At the same time, because the clamp block can be adjusted according to the position of semiconductor refrigeration plates of different sizes, the hole baffle can also be adjusted according to the position of semiconductor refrigeration plates of different sizes, further achieving the effect of sealing the vacuum holes on both sides of the semiconductor refrigeration plates of different sizes that do not contact the outside of the plate. The clamp block 2 can be adjusted according to the position of semiconductor refrigeration plates of different sizes, so the hole baffle can also be adjusted according to the position of semiconductor refrigeration plates of different sizes, further achieving the effect of sealing the vacuum holes on both sides of the semiconductor refrigeration plates of different sizes that do not contact the outside of the plate.
(3)、本发明通过底板移动复位的力带动轴杆上的清理刷板进行移动，刷板移动期间实现对过滤网上杂质进行清理的效果，轴杆在移动期间通过带动板带动密封板进行移动让位并漏出收纳槽，移动期间的刷板将滤网上的杂质扫至收纳槽的内部进行收纳，达到对过滤网上杂质进行自动清理的效果，同时对清理后的杂质进行收纳处理。(3) The present invention drives the cleaning brush plate on the shaft rod to move through the force of the bottom plate moving and resetting, and the impurities on the filter screen are cleaned during the movement of the brush plate. During the movement of the shaft rod, the sealing plate is driven by the driving plate to move out of the way and leak out of the receiving groove. During the movement, the brush plate sweeps the impurities on the filter screen into the interior of the receiving groove for storage, thereby achieving the effect of automatically cleaning the impurities on the filter screen and storing the cleaned impurities at the same time.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
此处所说明的附图用来提供对本发明的进一步理解，构成本申请的一部分:The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:
图1为本发明的整体结构示意图；FIG1 is a schematic diagram of the overall structure of the present invention;
图2为本发明中模具底座内部结构示意图；FIG2 is a schematic diagram of the internal structure of the mold base in the present invention;
图3为本发明中多尺寸自动定位装置结构示意图；FIG3 is a schematic diagram of the structure of the multi-size automatic positioning device of the present invention;
图4为本发明中横纵定位装置结构示意图；FIG4 is a schematic diagram of the structure of the horizontal and vertical positioning device in the present invention;
图5为本发明中收纳槽处结构示意图；FIG5 is a schematic diagram of the structure of the storage slot in the present invention;
图6为本发明中防堵塞清理装置结构示意图；FIG6 is a schematic diagram of the structure of the anti-clogging cleaning device of the present invention;
图7为本发明中滤网处结构示意图。FIG. 7 is a schematic diagram of the structure of the filter screen in the present invention.
图中：1、模具底座；2、吸附电机；3、真空孔吸附面板；4、多尺寸自动定位装置；41、主动电机；42、主动辊；43、齿皮带；44、被动辊；45、纵双向往复丝杆；46、横双向往复丝杆；47、啮合齿轮；48、横纵定位装置；481、限位滑座一；482、底板；483、连接座；484、夹块一；485、限位滑座二；486、移动板；487、夹块二；5、自动闭孔装置；51、滑杆；52、连板；53、连杆；54、孔挡板；55、孔档条；6、防堵塞清理装置；61、过滤网；62、轴杆；63、密封板；64、清理刷板；65、带动板；7、收纳槽。In the figure: 1. mold base; 2. adsorption motor; 3. vacuum hole adsorption panel; 4. multi-size automatic positioning device; 41. active motor; 42. active roller; 43. toothed belt; 44. passive roller; 45. longitudinal and bidirectional reciprocating screw; 46. transverse and bidirectional reciprocating screw; 47. meshing gear; 48. transverse and longitudinal positioning device; 481. limit slide one; 482. bottom plate; 483. connecting seat; 484. clamp one; 485. limit slide two; 486. moving plate; 487. clamp two; 5. automatic hole closing device; 51. slide rod; 52. connecting plate; 53. connecting rod; 54. hole baffle plate; 55. hole baffle strip; 6. anti-blocking cleaning device; 61. filter screen; 62. shaft rod; 63. sealing plate; 64. cleaning brush plate; 65. driving plate; 7. storage groove.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
请参阅图1-图7所示，本发明提供的技术方案：Please refer to Figures 1 to 7, the technical solution provided by the present invention:
一种半导体制冷片键合用吸附模具，包括模具底座1，模具底座1的内部通过螺栓固定连接有吸附电机2，吸附电机2的输出轴卡接有风扇，模具底座1的顶部固定连接有真空孔吸附面板3，通过启动吸附电机2带动风扇实现吸附功能，吸附的风力通过真空腔作用在真空孔吸附面板3上的半导体制冷片底部，达到对半导体制冷片底部进行真空吸附的效果；多尺寸自动定位装置4；自动闭孔装置5；防堵塞清理装置6。A semiconductor refrigeration sheet bonding adsorption mold, including a mold base 1, the interior of the mold base 1 is fixedly connected to an adsorption motor 2 by bolts, the output shaft of the adsorption motor 2 is clamped with a fan, the top of the mold base 1 is fixedly connected to a vacuum hole adsorption panel 3, the adsorption function is achieved by starting the adsorption motor 2 to drive the fan, the adsorption wind force acts on the bottom of the semiconductor refrigeration sheet on the vacuum hole adsorption panel 3 through the vacuum chamber, so as to achieve the effect of vacuum adsorption of the bottom of the semiconductor refrigeration sheet; a multi-size automatic positioning device 4; an automatic hole closing device 5; an anti-clogging cleaning device 6.
本实施例中，多尺寸自动定位装置4包括有主动电机41、纵双向往复丝杆45、横双向往复丝杆46和横纵定位装置48，纵双向往复丝杆45和横双向往复丝杆46相同，往复丝杆为现有结构，一般搭配滑块进行运动，利用丝杆的转动带动滑块的往复移动，这里的双向往复丝杆其实是两端均设置有往复丝槽的杆，主动电机41的表面通过螺栓固定连接模具底座1的内部，主动电机41的输出轴卡接有主动辊42，主动辊42的表面通过齿皮带43传动连接有被动辊44，如图2-4和图7所示，齿皮带43上设置有两组齿牙，两组齿牙成交错分布，齿皮带43的传动受两个动辊的转动影响，两组齿牙在传动期间用于依次带动纵双向往复丝杆45和横双向往复丝杆46上齿轮转动，纵双向往复丝杆45和横双向往复丝杆46的表面均固定连接有啮合齿轮47，两个啮合齿轮47用于被传动期间的齿皮带43进行依次带动，从而实现依次带动纵双向往复丝杆45和横双向往复丝杆46转动的目的。In this embodiment, the multi-size automatic positioning device 4 includes an active motor 41, a longitudinal and bidirectional reciprocating screw rod 45, a transverse and bidirectional reciprocating screw rod 46 and a transverse and longitudinal positioning device 48. The longitudinal and bidirectional reciprocating screw rod 45 is the same as the transverse and bidirectional reciprocating screw rod 46. The reciprocating screw rod is an existing structure, which is generally matched with a slider for movement, and the reciprocating movement of the slider is driven by the rotation of the screw rod. The bidirectional reciprocating screw rod here is actually a rod with reciprocating wire grooves at both ends. The surface of the active motor 41 is fixedly connected to the inside of the mold base 1 by bolts, and the output shaft of the active motor 41 is clamped with an active roller 42, and the surface of the active roller 42 is connected by a toothed belt 43. The transmission is connected with a passive roller 44, as shown in Figures 2-4 and 7, and two groups of teeth are arranged on the toothed belt 43, and the two groups of teeth are staggered. The transmission of the toothed belt 43 is affected by the rotation of the two movable rollers, and the two groups of teeth are used to drive the gears on the longitudinal and bidirectional reciprocating screw 45 and the transverse and bidirectional reciprocating screw 46 to rotate in turn during the transmission. The surfaces of the longitudinal and bidirectional reciprocating screw 45 and the transverse and bidirectional reciprocating screw 46 are fixedly connected with meshing gears 47, and the two meshing gears 47 are used to be driven in turn by the toothed belt 43 during the transmission, so as to achieve the purpose of driving the longitudinal and bidirectional reciprocating screw 45 and the transverse and bidirectional reciprocating screw 46 to rotate in turn.
进一步的是，主动辊42的端部转动连接模具底座1的内部，被动辊44的内部转动连接纵双向往复丝杆45的表面，纵双向往复丝杆45和横双向往复丝杆46的端部均转动连接模具底座1的内部。Furthermore, the end of the active roller 42 is rotatably connected to the inside of the mold base 1, the inside of the passive roller 44 is rotatably connected to the surface of the longitudinal and bidirectional reciprocating screw rod 45, and the ends of the longitudinal and bidirectional reciprocating screw rod 45 and the transverse and bidirectional reciprocating screw rod 46 are both rotatably connected to the inside of the mold base 1.
更进一步的是，横纵定位装置48包括有限位滑座一481和限位滑座二485，限位滑座一481和限位滑座二485的内部分别滑动连接纵双向往复丝杆45和横双向往复丝杆46的表面，根据图中所示可知，限位滑座的数量设置为两个且对称分布在往复丝杆上，利用丝杆的转动带动其上两个限位滑座进行相对运动，限位滑座一481的顶部固定连接有底板482，底板482的顶部固定连接有连接座483，连接座483的表面通过弹簧弹性连接有夹块一484，弹性连接的夹块一484能够达到被连接座483带动夹持的同时进行自动让位，避免继续移动的限位滑座一481带动夹块移动导致硬性夹伤半导体制冷片的问题，同时能够达到对不同尺寸的半导体制冷片两侧进行对准、夹持的效果，限位滑座二485的表面通过弹簧弹性连接有移动板486。Furthermore, the horizontal and vertical positioning device 48 includes a limit slide 1 481 and a limit slide 2 485. The insides of the limit slide 1 481 and the limit slide 2 485 are respectively slidably connected to the surfaces of the longitudinal bidirectional reciprocating screw 45 and the horizontal bidirectional reciprocating screw 46. As shown in the figure, the number of limit slides is set to two and is symmetrically distributed on the reciprocating screw. The rotation of the screw drives the two limit slides thereon to move relative to each other. The top of the limit slide 1 481 is fixedly connected to a bottom plate 482. The bottom plate 482 A connecting seat 483 is fixedly connected to the top, and a clamping block 484 is elastically connected to the surface of the connecting seat 483 through a spring. The elastically connected clamping block 484 can automatically give way while being driven and clamped by the connecting seat 483, to avoid the problem of the clamping block being driven by the continued movement of the limiting slide 481 and causing hard clamping of the semiconductor cooling plate. At the same time, it can achieve the effect of aligning and clamping the two sides of semiconductor cooling plates of different sizes. The surface of the limiting slide 485 is elastically connected to a movable plate 486 through a spring.
值得注意的是，限位滑座一481和限位滑座二485的表面分别滑动连接模具底座1的内部，利用底座内部的滑槽对两个限位滑座进行限位，使其只能进行直线运动，两个滑座的内部分别设置有与该处往复丝杆上丝槽相对应的滑块，用于受丝槽的限制进行往复运动，底板482、连接座483和移动板486的表面分别滑动连接模具底座1的内壁，移动板486的表面通过长杆固定连接有夹块二487，夹块二487的数量也设置有两个，用于对半导体制冷片的另外两侧进行对准、夹持工作，从而实现对半导体制冷片的四侧均进行对准夹持工作的目的。It is worth noting that the surfaces of the limit slide 1 481 and the limit slide 2 485 are respectively slidably connected to the inside of the mold base 1, and the two limit slides are limited by the sliding groove inside the base so that they can only move in a straight line. The interiors of the two slides are respectively provided with sliding blocks corresponding to the wire grooves on the reciprocating screw rod, which are used to reciprocate under the restriction of the wire grooves. The surfaces of the bottom plate 482, the connecting seat 483 and the movable plate 486 are respectively slidably connected to the inner wall of the mold base 1, and the surface of the movable plate 486 is fixedly connected to the clamp block 2 487 through a long rod. The number of the clamp block 2 487 is also set to two, which are used to align and clamp the other two sides of the semiconductor refrigeration plate, thereby achieving the purpose of aligning and clamping the four sides of the semiconductor refrigeration plate.
值得说明的是，自动闭孔装置5包括有滑杆51和孔档条55，孔档条55的数量设置与真空孔吸附面板3上真空孔的横向数相对应，且各个孔档条55利用弹簧连接在移动板486上，能够达到单个的孔档条55能够进行独立让位的目的，当部分孔档条55受到孔挡板54的影响时，能够进行弹性让位，而其余不受阻挡的孔档条55能够受移动板486的影响进行移动覆盖，覆盖相应位置的真空孔，滑杆51的一端固定连接夹块一484的表面，滑杆51的另一端固定连接有连板52，连板52的表面固定连接有连杆53，连杆53的端部固定连接有孔挡板54，孔挡板54受连杆53上连板52与滑杆51的影响，与夹块一484的运动保持一致，孔挡板54在移动期间覆盖相应位置的真空孔，达到对半导体制冷片两侧外不接触板的孔进行密封处理的效果，同时因夹块能够根据不同尺寸的半导体制冷片进行位置调节，所以孔挡板54也能够根据不同尺寸的半导体制冷片进行位置调节，进一步达到对不同尺寸的半导体制冷片两侧外不接触板的真空孔进行密封处理的效果。It is worth noting that the automatic hole closing device 5 includes a slide bar 51 and a hole stop bar 55. The number of the hole stop bars 55 is set to correspond to the horizontal number of vacuum holes on the vacuum hole adsorption panel 3, and each hole stop bar 55 is connected to the movable plate 486 by a spring, so that a single hole stop bar 55 can make way independently. When part of the hole stop bars 55 are affected by the hole stop plate 54, they can make way elastically, and the remaining unobstructed hole stop bars 55 can be moved and covered by the movable plate 486 to cover the vacuum holes at the corresponding positions. One end of the slide bar 51 is fixedly connected to the surface of the clamping block 484, and the other end of the slide bar 51 is fixedly connected to the connecting plate 52. A connecting rod 53 is fixedly connected to the surface of the connecting plate 52, and a hole baffle 54 is fixedly connected to the end of the connecting rod 53. The hole baffle 54 is affected by the connecting plate 52 and the sliding rod 51 on the connecting rod 53 and keeps consistent with the movement of the clamping block 484. The hole baffle 54 covers the vacuum holes at corresponding positions during the movement, thereby achieving the effect of sealing the holes on both sides of the semiconductor refrigeration plate that do not contact the plates outside. At the same time, since the clamping block can be adjusted in position according to semiconductor refrigeration plates of different sizes, the hole baffle 54 can also be adjusted in position according to semiconductor refrigeration plates of different sizes, thereby further achieving the effect of sealing the vacuum holes on both sides of semiconductor refrigeration plates of different sizes that do not contact the plates outside.
此外，滑杆51的表面滑动连接连接座483的内部，连杆53的表面滑动连接底板482的内部，孔挡板54的表面滑动连接模具底座1的内壁，孔档条55的内部通过弹簧弹性连接移动板486的表面，且孔档条55的表面滑动连接模具底座1的内部，进一步达到对半导体制冷片剩余两侧外不接触板的孔进行密封处理的效果，同时因夹块能够根据不同尺寸的半导体制冷片进行位置调节，所以孔档条55也能够根据不同尺寸的半导体制冷片进行位置调节，进一步达到对不同尺寸的半导体制冷片两侧外不接触板的真空孔进行密封处理的效果。In addition, the surface of the slide rod 51 is slidably connected to the inside of the connecting seat 483, the surface of the connecting rod 53 is slidably connected to the inside of the bottom plate 482, the surface of the hole stop plate 54 is slidably connected to the inner wall of the mold base 1, the inside of the hole stop strip 55 is elastically connected to the surface of the movable plate 486 through a spring, and the surface of the hole stop strip 55 is slidably connected to the inside of the mold base 1, further achieving the effect of sealing the holes on the remaining two sides of the semiconductor refrigeration plate that do not contact the plate. At the same time, because the clamping block can be adjusted in position according to semiconductor refrigeration plates of different sizes, the hole stop strip 55 can also be adjusted in position according to semiconductor refrigeration plates of different sizes, further achieving the effect of sealing the vacuum holes on both sides of semiconductor refrigeration plates of different sizes that do not contact the plate.
除此以外，模具底座1的内部开设有收纳槽7，用于对滤网上堵塞的杂质进行集中收纳，防堵塞清理装置6包括有过滤网61、轴杆62和密封板63，轴杆62的一端固定连接底板482的表面，过滤网61用于对吸附的气体进行过滤处理，轴杆62的另一端固定连接有清理刷板64，轴杆62的表面固定连接有带动板65。图4、5、7中防堵塞清理装置6均为清理后的状态图，在吸附键合期间，清理刷板64位于过滤网61的另一端，密封板63位于收纳槽7的正上方并对其进行密封处理，主要用于对槽内的杂质进行密封处理，避免吸附的力影响杂质收纳的问题，过滤网61的表面固定连接模具底座1的内部，轴杆62的表面滑动连接孔挡板54的内部，密封板63的表面通过弹簧弹性连接模具底座1的内部。In addition, a storage groove 7 is provided inside the mold base 1 for centrally storing impurities blocked on the filter screen. The anti-blocking cleaning device 6 includes a filter screen 61, a shaft 62 and a sealing plate 63. One end of the shaft 62 is fixedly connected to the surface of the bottom plate 482. The filter screen 61 is used to filter the adsorbed gas. The other end of the shaft 62 is fixedly connected to a cleaning brush plate 64. The surface of the shaft 62 is fixedly connected to a driving plate 65. The anti-blocking cleaning device 6 in Figures 4, 5 and 7 are all diagrams of the state after cleaning. During the adsorption bonding period, the cleaning brush plate 64 is located at the other end of the filter screen 61. The sealing plate 63 is located directly above the storage groove 7 and seals it. It is mainly used to seal the impurities in the groove to avoid the problem that the adsorption force affects the impurity storage. The surface of the filter screen 61 is fixedly connected to the inside of the mold base 1, the surface of the shaft 62 is slidably connected to the inside of the hole baffle 54, and the surface of the sealing plate 63 is elastically connected to the inside of the mold base 1 through a spring.
本发明的一种半导体制冷片键合用吸附模具在使用时，半导体制冷片放置在真空孔吸附面板3上，模具底座1上设置有键合组件，用于对吸附固定后的半导体制冷片进行键合，在吸附定位前启动主动电机41，主动电机41的输出轴通过主动辊42带动其上利用齿皮带43传动连接的被动辊44同步转动，齿皮带43进行相应的传动工作，在传动期间依次带动纵双向往复丝杆45和横双向往复丝杆46上啮合齿轮47转动，从而实现依次带动纵双向往复丝杆45和横双向往复丝杆46转动的目的，纵双向往复丝杆45转动时带动其上滑动连接且被直线限位的两个限位滑座一481进行相对运动，限位滑座一481在相对靠近时通过底板482带动连接座483上弹性连接的夹块一484移动，两个夹块一484进行相对靠近运动期间对吸附面板上的半导体制冷片进行两侧夹持，在夹持期间接触半导体制冷片两侧并产生辅助的移动对准，实现自动对准与夹持，当半导体制冷片位于纵向的中心区域后两个夹块难以实现继续的相对运动，此时的夹块会通过弹力实现让位，避免继续移动的限位滑座一481带动夹块移动导致硬性夹伤半导体制冷片的问题，同时对不同尺寸的半导体制冷片两侧进行对准、夹持的效果。让位的夹块一484通过滑杆51端部的连板52带动连杆53上的孔挡板54进行相应的移动，孔挡板54受限制与夹块一484的位置保持一致，孔挡板54在随着夹块一484进行通过移动期间实现对真空孔吸附面板3上孔进行移动封闭的效果，达到对半导体制冷片两侧外不接触板的孔进行密封处理的效果，同时因夹块能够根据不同尺寸的半导体制冷片进行位置调节，所以孔挡板54也能够根据不同尺寸的半导体制冷片进行位置调节，进一步达到对不同尺寸的半导体制冷片两侧外不接触板的真空孔进行密封处理的效果。纵双向往复丝杆45转动结束后，横双向往复丝杆46转动，丝杆带动该处的两个限位滑座二485进行相对运动，限位滑座通过弹簧带动移动板486上长杆固定的夹块二487进行相对移动，在两个夹块相对移动期间实现对半导体制冷片另外两侧进行自动对准与夹持的效果，同时，当半导体制冷片位于横向的中心区域后两个夹块难以实现继续的相对运动，此时的夹块会通过弹力实现让位，避免继续移动的限位滑座二485带动夹块移动导致硬性夹伤半导体制冷片的问题，同时能够达到对不同尺寸的半导体制冷片剩余两侧进行对准、夹持的效果。孔档条55受弹簧的影响随着移动板486的移动进行运动，运动期间部分孔档条55受到孔挡板54的影响时，能够进行弹性让位，而其余不受阻挡的孔档条55能够受移动板486的影响进行移动覆盖，覆盖相应位置的真空孔，进一步达到对半导体制冷片剩余两侧外不接触板的孔进行密封处理的效果，同时因夹块能够根据不同尺寸的半导体制冷片进行位置调节，所以孔档条55也能够根据不同尺寸的半导体制冷片进行位置调节，进一步达到对不同尺寸的半导体制冷片剩余两侧外不接触板的真空孔进行密封处理的效果。整体达到对不同尺寸的半导体制冷片四侧均进行对准定位、弹性夹持和密封多余真空孔的效果，避免手动定位产生误差的问题，同时结合吸附定位，具有双重固定的效果，提高对不同尺寸的半导体制冷片定位的稳定性，也进一步的避免因多余的真空孔的使用，导致半导体制冷片吸附不稳定的问题。When the semiconductor refrigeration plate bonding adsorption mold of the present invention is in use, the semiconductor refrigeration plate is placed on the vacuum hole adsorption panel 3, and a bonding component is provided on the mold base 1 for bonding the semiconductor refrigeration plate after adsorption and positioning. The active motor 41 is started before adsorption and positioning, and the output shaft of the active motor 41 drives the passive roller 44 connected thereto by the toothed belt 43 to rotate synchronously through the active roller 42. The toothed belt 43 performs corresponding transmission work, and during the transmission, the meshing gears 47 on the longitudinal and bidirectional reciprocating screw 45 and the transverse and bidirectional reciprocating screw 46 are driven to rotate in turn, thereby achieving the purpose of driving the longitudinal and bidirectional reciprocating screw 45 and the transverse and bidirectional reciprocating screw 46 to rotate in turn. When the longitudinal and bidirectional reciprocating screw 45 rotates, it drives the sliding connection thereon and is linearly limited. The two limit slides 481 perform relative movement, and when the limit slide 481 is relatively close, it drives the elastically connected clamping block 484 on the connecting seat 483 to move through the bottom plate 482. The two clamping blocks 484 clamp the semiconductor refrigeration plate on the adsorption panel on both sides during the relative approach movement. During the clamping period, they contact both sides of the semiconductor refrigeration plate and produce auxiliary movement alignment to achieve automatic alignment and clamping. When the semiconductor refrigeration plate is located in the longitudinal center area, it is difficult for the two clamping blocks to achieve continued relative movement. At this time, the clamping blocks will give way through elastic force to avoid the problem of the limit slide 481 that continues to move driving the clamping blocks to move, resulting in hard clamping of the semiconductor refrigeration plate. At the same time, the two sides of the semiconductor refrigeration plates of different sizes are aligned and clamped. The clamping block 484 that gives way drives the hole baffle plate 54 on the connecting rod 53 to move accordingly through the connecting plate 52 at the end of the slide rod 51. The hole baffle plate 54 is restricted to keep consistent with the position of the clamping block 484. The hole baffle plate 54 can achieve the effect of moving and closing the holes on the vacuum hole adsorption panel 3 during the movement of the clamping block 484, thereby achieving the effect of sealing the holes on both sides of the semiconductor refrigeration plate that do not contact the plate outside. At the same time, because the clamping block can be adjusted in position according to semiconductor refrigeration plates of different sizes, the hole baffle plate 54 can also be adjusted in position according to semiconductor refrigeration plates of different sizes, thereby further achieving the effect of sealing the vacuum holes on both sides of semiconductor refrigeration plates of different sizes that do not contact the plate outside. After the rotation of the longitudinal and bidirectional reciprocating screw rod 45 is completed, the transverse and bidirectional reciprocating screw rod 46 rotates, and the screw rod drives the two limit slides 485 at that location to move relative to each other. The limit slide drives the clamp block 487 fixed by the long rod on the movable plate 486 to move relative to each other through the spring, and during the relative movement of the two clamp blocks, the other two sides of the semiconductor refrigeration film are automatically aligned and clamped. At the same time, when the semiconductor refrigeration film is located in the horizontal center area, it is difficult for the two clamp blocks to continue to move relative to each other. At this time, the clamp blocks will give way through elastic force to avoid the problem of the limit slide 485 continuing to move and driving the clamp blocks to move, causing hard clamping of the semiconductor refrigeration film. At the same time, it can achieve the effect of aligning and clamping the remaining two sides of semiconductor refrigeration films of different sizes. The hole stop bar 55 is affected by the spring and moves with the movement of the moving plate 486. During the movement, when part of the hole stop bar 55 is affected by the hole stop plate 54, it can elastically give way, and the remaining hole stop bar 55 that is not blocked can be affected by the moving plate 486 to move and cover the vacuum holes at the corresponding positions, further achieving the effect of sealing the holes on the remaining two sides of the semiconductor cooling plate that do not contact the plate. At the same time, because the clamping block can be adjusted according to the position of semiconductor cooling plates of different sizes, the hole stop bar 55 can also be adjusted according to the position of semiconductor cooling plates of different sizes, further achieving the effect of sealing the vacuum holes on the remaining two sides of the semiconductor cooling plates of different sizes that do not contact the plate. The overall effect of aligning and positioning the four sides of semiconductor cooling plates of different sizes, elastically clamping and sealing the redundant vacuum holes can be achieved, avoiding the problem of manual positioning errors. At the same time, combined with adsorption positioning, it has a double fixing effect, improves the stability of positioning semiconductor cooling plates of different sizes, and further avoids the problem of unstable adsorption of semiconductor cooling plates due to the use of redundant vacuum holes.
当多尺寸自动定位装置4和自动闭孔装置5实现对半导体制冷片四侧进行对准定位、弹性夹持和密封多余真空孔后，启动吸附电机2带动风扇实现吸附功能，吸附的风力通过真空腔作用在真空孔吸附面板3上的半导体制冷片底部，达到对半导体制冷片底部进行真空吸附的效果，便于吸附定位后的半导体制冷片进行键合工作，键合工作完成后通过主动电机41控制主动辊42上的齿皮带43传动被动辊44，齿皮带43传动期间再次依次啮合纵双向往复丝杆45和横双向往复丝杆46上齿轮转动，两个丝杆实现继续的转动，并在转动期间带动其上的两个限位滑座进行依次的复位移动，移动后夹块失去对半导体制冷片的夹持，孔挡板54和孔档条55均移动复位，多余真空孔失去密封效果，在底板482进行移动复位期间，底板482通过轴杆62上的清理刷板64进行移动，刷板移动期间实现对过滤网61上杂质进行清理的效果，轴杆62在移动期间通过带动板65带动密封板63进行移动让位并漏出收纳槽7，移动期间的刷板将滤网上的杂质扫至收纳槽7的内部进行收纳，达到对过滤网61上杂质进行自动清理的效果，同时对清理后的杂质进行收纳处理，在多尺寸自动定位装置4进行再次的夹持工作时，移动的底板482通过轴杆62带动清理刷板64与带动板65移动至滤网的另一侧，密封板63失去带动板65的限制后通过弹力复位至收纳槽7上，密封板63位于收纳槽7的正上方并对其进行密封处理，主要用于对槽内的杂质进行密封处理，避免吸附的力影响杂质收纳的问题。对过滤网61上杂质进行自动清理的同时对清理后的杂质进行密封处理，进一步达到避免过滤网61堵塞的同时避免吸附的力影响杂质收纳的问题的效果，避免因滤网堵塞导致吸力受影响等问题。After the multi-size automatic positioning device 4 and the automatic hole closing device 5 have achieved alignment, positioning, elastic clamping and sealing of the four sides of the semiconductor refrigeration plate, the adsorption motor 2 is started to drive the fan to realize the adsorption function. The adsorption wind force acts on the bottom of the semiconductor refrigeration plate on the vacuum hole adsorption panel 3 through the vacuum chamber, so as to achieve the effect of vacuum adsorption of the bottom of the semiconductor refrigeration plate, so as to facilitate the bonding of the semiconductor refrigeration plate after adsorption and positioning. After the bonding work is completed, the toothed belt 43 on the active roller 42 is controlled by the active motor 41 to drive the passive roller 44. During the transmission of the toothed belt 43, the gears on the longitudinal and bidirectional reciprocating screw 45 and the transverse and bidirectional reciprocating screw 46 are meshed again in turn to rotate, and the two screws continue to rotate, and during the rotation, the two limit slides thereon are driven to reset in turn. After the movement, the clamp loses its clamping of the semiconductor refrigeration plate, the hole baffle 54 and the hole baffle bar 55 are both moved and reset, and the redundant vacuum holes lose their sealing effect. During the movement and resetting of 482, the bottom plate 482 is moved by the cleaning brush plate 64 on the shaft 62. During the movement of the brush plate, the impurities on the filter screen 61 are cleaned. During the movement of the shaft 62, the sealing plate 63 is driven by the driving plate 65 to move out of the way and leak out of the storage groove 7. During the movement, the brush plate sweeps the impurities on the filter screen to the inside of the storage groove 7 for storage, thereby achieving the effect of automatically cleaning the impurities on the filter screen 61, and at the same time, the cleaned impurities are stored. When the multi-size automatic positioning device 4 performs the clamping work again, the moving bottom plate 482 drives the cleaning brush plate 64 and the driving plate 65 to move to the other side of the filter screen through the shaft 62. After losing the restriction of the driving plate 65, the sealing plate 63 is reset to the storage groove 7 by elastic force. The sealing plate 63 is located directly above the storage groove 7 and is sealed thereon. It is mainly used to seal the impurities in the groove to avoid the problem that the adsorption force affects the impurity storage. The impurities on the filter 61 are automatically cleaned and sealed at the same time, so as to further avoid the clogging of the filter 61 and the problem of the adsorption force affecting the collection of impurities, and avoid the problem of the suction force being affected due to the clogging of the filter.
以上实施方式仅用于说明本发明实施例，而并非对本发明实施例的限制，有关技术领域的普通技术人员，在不脱离本发明实施例的精神和范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本发明实施例的范畴，本发明实施例的专利保护范围应由权利要求限定。The above implementation methods are only used to illustrate the embodiments of the present invention, and are not limitations of the embodiments of the present invention. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present invention. The patent protection scope of the embodiments of the present invention should be defined by the claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310624190.3ACN118431141A (en) | 2023-05-29 | 2023-05-29 | An adsorption mold for bonding semiconductor refrigeration chips |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310624190.3ACN118431141A (en) | 2023-05-29 | 2023-05-29 | An adsorption mold for bonding semiconductor refrigeration chips |
| Publication Number | Publication Date |
|---|---|
| CN118431141Atrue CN118431141A (en) | 2024-08-02 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310624190.3APendingCN118431141A (en) | 2023-05-29 | 2023-05-29 | An adsorption mold for bonding semiconductor refrigeration chips |
| Country | Link |
|---|---|
| CN (1) | CN118431141A (en) |
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| JPH10209249A (en)* | 1997-01-24 | 1998-08-07 | Miyazaki Oki Electric Co Ltd | Wafer alignment device |
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| CN109860332A (en)* | 2018-12-19 | 2019-06-07 | 北京铂阳顶荣光伏科技有限公司 | A kind of cell piece Acetabula device |
| CN210393176U (en)* | 2019-08-21 | 2020-04-24 | 诸暨航丰针纺织有限公司 | Doubling machine with adsorption equipment |
| CN212735121U (en)* | 2020-04-09 | 2021-03-19 | 江苏新鼎新材料有限公司 | Negative pressure fixing jig for thin aluminum plate machining |
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| CN216672722U (en)* | 2021-11-04 | 2022-06-03 | 昆山旭锐通精密机械有限公司 | A new energy vehicle drive water-cooled motor base |
| CN114583875A (en)* | 2022-03-21 | 2022-06-03 | 梁志文 | A permanent magnet motor with good waterproof and sealing performance |
| CN114594663A (en)* | 2022-03-29 | 2022-06-07 | 合肥芯碁微电子装备股份有限公司 | Adsorption device and lithography apparatus having the same |
| CN217263212U (en)* | 2022-03-09 | 2022-08-23 | 上海致领半导体科技发展有限公司 | Vacuum adsorption switching gasket |
| CN114975223A (en)* | 2022-08-01 | 2022-08-30 | 江苏京创先进电子科技有限公司 | Holding device compatible with wafers of multiple sizes |
| CN115312439A (en)* | 2022-09-08 | 2022-11-08 | 马一平 | Semiconductor wafer high-efficiency packaging equipment convenient for taking and placing crystal grains |
| CN115662912A (en)* | 2022-09-21 | 2023-01-31 | 安徽光智科技有限公司 | Accurate measuring device for wafer processing |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62208842A (en)* | 1986-03-11 | 1987-09-14 | Canon Inc | Vacuum suction device |
| JPH10209249A (en)* | 1997-01-24 | 1998-08-07 | Miyazaki Oki Electric Co Ltd | Wafer alignment device |
| CN201405209Y (en)* | 2009-05-06 | 2010-02-17 | 大量科技股份有限公司 | a vacuum suction cup |
| CN109860332A (en)* | 2018-12-19 | 2019-06-07 | 北京铂阳顶荣光伏科技有限公司 | A kind of cell piece Acetabula device |
| CN210393176U (en)* | 2019-08-21 | 2020-04-24 | 诸暨航丰针纺织有限公司 | Doubling machine with adsorption equipment |
| CN212735121U (en)* | 2020-04-09 | 2021-03-19 | 江苏新鼎新材料有限公司 | Negative pressure fixing jig for thin aluminum plate machining |
| CN216672722U (en)* | 2021-11-04 | 2022-06-03 | 昆山旭锐通精密机械有限公司 | A new energy vehicle drive water-cooled motor base |
| CN216250681U (en)* | 2021-11-15 | 2022-04-08 | 无锡芯智光精密科技有限公司 | Be used for general type base structure in many vacuum adsorption holes of bonding wire machine |
| CN217263212U (en)* | 2022-03-09 | 2022-08-23 | 上海致领半导体科技发展有限公司 | Vacuum adsorption switching gasket |
| CN114583875A (en)* | 2022-03-21 | 2022-06-03 | 梁志文 | A permanent magnet motor with good waterproof and sealing performance |
| CN114594663A (en)* | 2022-03-29 | 2022-06-07 | 合肥芯碁微电子装备股份有限公司 | Adsorption device and lithography apparatus having the same |
| CN114975223A (en)* | 2022-08-01 | 2022-08-30 | 江苏京创先进电子科技有限公司 | Holding device compatible with wafers of multiple sizes |
| CN115312439A (en)* | 2022-09-08 | 2022-11-08 | 马一平 | Semiconductor wafer high-efficiency packaging equipment convenient for taking and placing crystal grains |
| CN115662912A (en)* | 2022-09-21 | 2023-01-31 | 安徽光智科技有限公司 | Accurate measuring device for wafer processing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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