本申请是申请日为2018年4月19日、申请号为201880005535.4的发明专利申请“发光二极管封装件组件以及包括其的发光二极管灯泡”的分案申请。This application is a divisional application of the invention patent application "Light-emitting diode package assembly and light-emitting diode bulb including the same" with application date of April 19, 2018 and application number 201880005535.4.
技术领域Technical Field
本发明涉及发光二极管封装组件以及包括该其的发光二极管灯泡。The invention relates to a light emitting diode package component and a light emitting diode bulb comprising the same.
背景技术Background technique
以往，利用灯丝的白炽灯作为照明装置而被广泛使用。通常，利用灯丝的白炽灯按如下原理工作：在真空的玻璃灯具内放入钨灯丝后，施加电源时，钨灯丝被加热到高温而通过温度辐射获得光。In the past, incandescent lamps using filaments were widely used as lighting devices. Generally, incandescent lamps using filaments work on the following principle: after a tungsten filament is placed in a vacuum glass lamp, when power is applied, the tungsten filament is heated to a high temperature and light is obtained by temperature radiation.
以往的白炽灯由于其大部分的能量以热形式排出，仅有部分能量转换成光，因此热效率极底，并且由于灯丝本身的寿命短，因此难以长时间使用。In the past, incandescent lamps had very low thermal efficiency because most of their energy was discharged as heat and only a portion of the energy was converted into light. In addition, the life of the filament itself was short, so it was difficult to use for a long time.
近来，寿命长且能量效率高的发光发光二极管(LED：Light emitting diode)正在被利用于照明装置。Recently, light emitting diodes (LEDs) having long life and high energy efficiency are being used in lighting devices.
发明内容Summary of the invention
技术问题technical problem
本发明期望解决的课题在于提供一种寿命长、发热低，从而具有高经济效率的发光二极管封装组件和包括其的发光发光二极管灯泡。The problem that the present invention is expected to solve is to provide a light emitting diode package component with long life, low heat generation and high economic efficiency, and a light emitting diode bulb including the same.
本发明期望解决的另一课题在于，提供一种可以通过减少制造工艺、制造时间以及材料成本而提高生产性的发光二极管封装组件以及包括其的发光二极管灯泡。Another problem that the present invention intends to solve is to provide a light emitting diode package assembly and a light emitting diode bulb including the same, which can improve productivity by reducing manufacturing processes, manufacturing time and material costs.
本发明期望解决的又一课题在于，提供一种可以向彼此不同的方向发光而向全方向均匀地发光的发光二极管封装组件和包括其的发光二极管灯泡。Another problem that the present invention aims to solve is to provide a light emitting diode package component that can emit light in different directions and emit light uniformly in all directions, and a light emitting diode bulb including the same.
技术方案Technical solutions
根据本发明的一实施例，一种发光二极管封装件组件，包括：多个发光二极管封装件，分别包括基板、发光二极管阵列和一对电极垫，所述发光二极管阵列由安装在所述基板的至少一表面并且电连接的多个发光二极管芯片构成，所述一对电极垫分别布置在所述基板的两端且与所述发光二极管阵列电连接；以及连接导线，在彼此相邻的两个发光二极管封装件之间，连接一端的电极垫。在所述彼此相邻的两个发光二极管封装件之间，另一端的电极垫彼此分离，所述多个发光二极管封装件电串联连接，所述连接导线与所述电极垫是一体型。According to one embodiment of the present invention, a light-emitting diode package assembly includes: a plurality of light-emitting diode packages, each including a substrate, a light-emitting diode array, and a pair of electrode pads, wherein the light-emitting diode array is composed of a plurality of light-emitting diode chips mounted on at least one surface of the substrate and electrically connected, and the pair of electrode pads are respectively arranged at both ends of the substrate and electrically connected to the light-emitting diode array; and a connecting wire, connecting the electrode pad at one end between two adjacent light-emitting diode packages. Between the two adjacent light-emitting diode packages, the electrode pads at the other end are separated from each other, the plurality of light-emitting diode packages are electrically connected in series, and the connecting wire is integrated with the electrode pad.
根据本发明的另一实施例，一种发光二极管封装件组件，包括：第一发光二极管封装件和第二发光二极管封装件，分别包括透明基板、发光二极管阵列、波长变换层、阳极电极垫和阴极电极垫，所述发光二极管阵列由布置在所述透明基板的一表面上并且串联连接的多个发光二极管芯片构成，所述波长变换层覆盖所述透明基板的一表面和所述发光二极管阵列，所述阳极电极垫连接到所述发光二极管阵列的一端以及所述阴极电极垫连接到所述发光二极管阵列的另一端；以及一个连接导线，连接所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫。所述连接导线与所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫构成为一体型。并且，所述第一发光二极管封装件的阴极电极垫和所述第二发光二极管封装件的阳极电极垫相隔分离。According to another embodiment of the present invention, a light-emitting diode package assembly includes: a first light-emitting diode package and a second light-emitting diode package, each including a transparent substrate, a light-emitting diode array, a wavelength conversion layer, an anode electrode pad and a cathode electrode pad, wherein the light-emitting diode array is composed of a plurality of light-emitting diode chips arranged on a surface of the transparent substrate and connected in series, the wavelength conversion layer covers a surface of the transparent substrate and the light-emitting diode array, the anode electrode pad is connected to one end of the light-emitting diode array and the cathode electrode pad is connected to the other end of the light-emitting diode array; and a connecting wire, connecting the anode electrode pad of the first light-emitting diode package and the cathode electrode pad of the second light-emitting diode package. The connecting wire is integrally formed with the anode electrode pad of the first light-emitting diode package and the cathode electrode pad of the second light-emitting diode package. Moreover, the cathode electrode pad of the first light-emitting diode package and the anode electrode pad of the second light-emitting diode package are separated.
根据本发明的又一实施例，一种发光二极管封装件组件，包括：第一发光二极管封装件至第四发光二极管封装件，分别包括透明基板、发光二极管阵列、波长变换层、阳极电极垫和阴极电极垫，所述发光二极管阵列由布置在所述透明基板的一表面上并且串联连接的多个发光二极管芯片构成，所述波长变换层覆盖所述透明基板的一表面和所述发光二极管阵列，所述阳极电极垫连接到所述发光二极管阵列的一端以及所述阴极电极垫连接到所述发光二极管阵列的另一端；以及第一连接导线，连接所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫；第二连接导线，连接所述第二发光二极管封装件的阳极电极垫和所述第三发光二极管封装件的阴极电极垫；以及第三连接导线，连接第三发光二极管封装件的阳极电极垫和第四发光二极管封装件的阴极电极垫。所述第一连接导线、第二连接导线以及第三连接导线与连接的阳极电极垫和阴极电极垫构成为一体型。并且，所述第一发光二极管封装件的阴极电极垫和所述第四发光二极管封装件的阳极电极垫与其他电极垫相隔分离。According to another embodiment of the present invention, a light emitting diode package assembly includes: first to fourth light emitting diode packages, respectively including a transparent substrate, a light emitting diode array, a wavelength conversion layer, an anode electrode pad and a cathode electrode pad, the light emitting diode array is composed of a plurality of light emitting diode chips arranged on a surface of the transparent substrate and connected in series, the wavelength conversion layer covers a surface of the transparent substrate and the light emitting diode array, the anode electrode pad is connected to one end of the light emitting diode array and the cathode electrode pad is connected to the other end of the light emitting diode array; and a first connecting wire, connecting the anode electrode pad of the first light emitting diode package and the cathode electrode pad of the second light emitting diode package; a second connecting wire, connecting the anode electrode pad of the second light emitting diode package and the cathode electrode pad of the third light emitting diode package; and a third connecting wire, connecting the anode electrode pad of the third light emitting diode package and the cathode electrode pad of the fourth light emitting diode package. The first connecting wire, the second connecting wire and the third connecting wire are integrally formed with the connected anode electrode pad and cathode electrode pad. Moreover, the cathode electrode pad of the first light emitting diode package and the anode electrode pad of the fourth light emitting diode package are separated from other electrode pads.
根据本发明的又一实施例，一种发光二极管灯泡，包括：基础部，形成有与外部电源连接的一对外部电极；至少一个发光二极管封装件组件，包括：多个发光二极管封装件和连接导线，所述多个发光二极管封装件分别包括基板、发光二极管阵列和一对电极垫，所述发光二极管阵列由安装在所述基板的至少一表面并且电连接的多个发光二极管芯片构成，所述一对电极垫分别连接到所述发光二极管阵列的两端，所述连接导线按使所述多个发光二极管封装件电串联连接的方式连接相邻的多个发光二极管封装件；至少一对导入线，电连接所述基础部的外部电极和所述发光二极管封装件组件的没有通过所述连接导线而连接的所述电极垫；以及透光性盖体，围绕所述发光二极管封装件组件和所述一对导入线，并且一端与所述基础部结合。所述连接导线与连接到所述连接导线的所述电极垫是一体型。According to another embodiment of the present invention, a light emitting diode bulb comprises: a base portion, formed with a pair of external electrodes connected to an external power source; at least one light emitting diode package assembly, comprising: a plurality of light emitting diode packages and connecting wires, the plurality of light emitting diode packages respectively comprising a substrate, a light emitting diode array and a pair of electrode pads, the light emitting diode array being composed of a plurality of light emitting diode chips mounted on at least one surface of the substrate and electrically connected, the pair of electrode pads being respectively connected to both ends of the light emitting diode array, the connecting wires connecting adjacent plurality of light emitting diode packages in a manner that the plurality of light emitting diode packages are electrically connected in series; at least one pair of lead-in wires electrically connecting the external electrodes of the base portion and the electrode pads of the light emitting diode package assembly that are not connected by the connecting wires; and a light-transmitting cover body, surrounding the light emitting diode package assembly and the pair of lead-in wires, and having one end combined with the base portion. The connecting wires are integral with the electrode pads connected to the connecting wires.
根据本发明的又一实施例，提供一种包括多个发光二极管封装件和连接导线的发光二极管封装件组件。多个发光二极管封装件分别包括：基板；发光二极管阵列，由安装在所述基板的至少一表面并且电连接的多个发光二极管芯片构成；以及一对电极垫，分别布置在所述基板的两端且与所述发光二极管阵列电连接。并且，连接导线将布置在所述多个发光二极管封装件的一端的所述电极垫电连接。在此，所述连接导线与连接的所述电极垫是一体型。多个发光二极管封装件电并联连接。According to another embodiment of the present invention, there is provided a light-emitting diode package assembly including a plurality of light-emitting diode packages and connecting wires. The plurality of light-emitting diode packages respectively include: a substrate; a light-emitting diode array, which is composed of a plurality of light-emitting diode chips mounted on at least one surface of the substrate and electrically connected; and a pair of electrode pads, which are respectively arranged at both ends of the substrate and electrically connected to the light-emitting diode array. In addition, the connecting wire electrically connects the electrode pads arranged at one end of the plurality of light-emitting diode packages. Here, the connecting wire and the connected electrode pad are integral. The plurality of light-emitting diode packages are electrically connected in parallel.
根据本发明的又一实施例，提供了一种发光二极管灯泡，包括：基础部，形成有与外部电源连接的多个外部电极；至少一个发光二极管封装件组件，包括多个发光二极管封装件和连接导线；多个导入线，电连接所述基础部的所述外部电极和所述发光二极管封装件组件；以及透光性盖体，围绕所述发光二极管封装件组件和所述多个导入线，并且一端与所述基础部结合，According to another embodiment of the present invention, there is provided a light-emitting diode bulb, comprising: a base portion, formed with a plurality of external electrodes connected to an external power source; at least one light-emitting diode package assembly, comprising a plurality of light-emitting diode packages and connecting wires; a plurality of lead-in wires, electrically connecting the external electrodes of the base portion and the light-emitting diode package assembly; and a light-transmitting cover, surrounding the light-emitting diode package assembly and the plurality of lead-in wires, and having one end coupled to the base portion.
发光二极管封装件组件包括多个发光二极管封装件和连接导线。多个发光二极管封装件分别包括：基板；发光二极管阵列，由安装在所述基板的至少一表面并且电连接的多个发光二极管芯片构成；以及一对电极垫，分别布置在所述基板的两端且与所述发光二极管阵列电连接。并且，连接导线将布置在所述多个发光二极管封装件的一端的所述电极垫电连接。在此，所述连接导线与连接的所述电极垫是一体型，所述多个发光二极管封装件被电并联连接。The light-emitting diode package assembly includes a plurality of light-emitting diode packages and connecting wires. The plurality of light-emitting diode packages respectively include: a substrate; a light-emitting diode array, which is composed of a plurality of light-emitting diode chips mounted on at least one surface of the substrate and electrically connected; and a pair of electrode pads, which are respectively arranged at both ends of the substrate and electrically connected to the light-emitting diode array. In addition, the connecting wire electrically connects the electrode pads arranged at one end of the plurality of light-emitting diode packages. Here, the connecting wire and the connected electrode pad are integrated, and the plurality of light-emitting diode packages are electrically connected in parallel.
技术效果Technical Effects
根据本发明的实施例，发光二极管封装件组件以及包括其的发光二极管灯泡通过使用发光二极管封装件替代钨灯丝，由于其寿命长、发热低，可以提高经济效率。According to the embodiments of the present invention, the LED package assembly and the LED bulb including the same can improve economic efficiency due to the long life and low heat generation by using the LED package to replace the tungsten filament.
根据本发明的另一实施例，发光二极管封装件组件通过将以往在独立构成每个发光二极管封装件时丢弃的电极垫之间的金属材料用作发光二极管封装件之间的连接导线，从而可以提高材料利用率。并且，通过将这种发光二极管封装件组件应用于发光二极管灯泡，可以省略发光二极管封装件之间的连接工艺，因此可以通过减少发光二极管灯泡的制造工艺、制造时间以及材料成本而提高生产性。According to another embodiment of the present invention, the LED package assembly can improve material utilization by using metal materials between electrode pads that were previously discarded when each LED package was independently constructed as connecting wires between LED packages. In addition, by applying the LED package assembly to an LED bulb, the connection process between LED packages can be omitted, thereby improving productivity by reducing the manufacturing process, manufacturing time, and material cost of the LED bulb.
根据本发明的又一实施例，发光二极管封装件组件可以利用弯曲部对每个发光二极管封装件的发光方向进行多种改变，从而使发光二极管灯泡可以向全方向均匀地发光。According to another embodiment of the present invention, the LED package assembly can use the bent portion to make various changes to the light emitting direction of each LED package, so that the LED bulb can emit light uniformly in all directions.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1至图6是示出根据本发明的第一实施例的发光二极管封装件组件的制造方法以及根据该制造方法的发光二极管封装件组件的示例图。1 to 6 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a first embodiment of the present invention and a light emitting diode package assembly according to the manufacturing method.
图7是示出根据本发明的第一实施例的发光二极管灯泡的示例图。FIG. 7 is an exemplary diagram showing a light emitting diode bulb according to a first embodiment of the present invention.
图8至图10是示出根据本发明的第二实施例的发光二极管封装件组件的制造方法和根据其的发光二极管封装件组件的示例图。8 to 10 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a second embodiment of the present invention and a light emitting diode package assembly therefor.
图11是示出根据本发明的第二实施例的发光二极管灯泡的示例图。FIG. 11 is an exemplary diagram showing a light emitting diode bulb according to a second embodiment of the present invention.
图12是示出根据本发明的第二实施例的发光二极管封装件组件的另一示例图。FIG. 12 is another exemplary view showing a light emitting diode package assembly according to a second embodiment of the present invention.
图13是示出根据本发明的第二实施例的发光二极管封装件组件的另一示例图。FIG. 13 is another exemplary view showing a light emitting diode package assembly according to a second embodiment of the present invention.
图14是示出根据本发明的第三实施例的发光二极管灯泡的另一示例图。FIG. 14 is another exemplary diagram showing a light emitting diode bulb according to a third embodiment of the present invention.
图15和图16是示出根据本发明的第三实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。15 and 16 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a third embodiment of the present invention and a light emitting diode package assembly according thereto.
图17和图18是示出根据本发明的第四实施例和第五实施例的发光二极管灯泡的示例图。17 and 18 are exemplary views showing a light emitting diode bulb according to a fourth embodiment and a fifth embodiment of the present invention.
图19和图20是示出根据本发明的第四实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。19 and 20 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a fourth embodiment of the present invention and a light emitting diode package assembly according thereto.
图21是示出根据本发明的第六实施例的发光二极管灯泡的示例图。FIG. 21 is an exemplary diagram showing a light emitting diode bulb according to a sixth embodiment of the present invention.
图22至图26是示出根据本发明的第七实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。22 to 26 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a seventh embodiment of the present invention and a light emitting diode package assembly according thereto.
图27是示出根据本发明的第七实施例的发光二极管灯泡的示例图。FIG. 27 is an exemplary diagram showing a light emitting diode bulb according to a seventh embodiment of the present invention.
图28和图29是示出根据本发明的第八实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。28 and 29 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to an eighth embodiment of the present invention and a light emitting diode package assembly according thereto.
图30是示出根据本发明的第八实施例的发光二极管灯泡的示例图。FIG. 30 is an exemplary diagram showing a light emitting diode bulb according to an eighth embodiment of the present invention.
图31和图32是示出根据本发明的第九实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。31 and 32 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a ninth embodiment of the present invention and a light emitting diode package assembly according thereto.
图33是示出根据本发明的第九实施例的发光二极管灯泡的示例图。FIG. 33 is an exemplary diagram showing a light emitting diode bulb according to a ninth embodiment of the present invention.
具体实施方式Detailed ways
通过与附图相关的以下详细的说明和优选实施例，本发明的目的、特定优点以及新颖的特征将变得更加明确。以下所介绍的实施例是为了向本领域技术人员充分传达本发明的思想而作为示例提供的。因此，本发明不限于以下说明的实施例，也可以以其他形态具体化。在本说明书中，应当留意的是，对各个附图的构成要素赋予附图标记时，针对相同的构成要素，即使标记在了不同的附图上，也尽量对其赋予了相同的附图标记。并且，“第一”、“第二”、“一表面”、“另一表面”、“上表面”、“下表面”、“上部”、“下部”等术语用于将一个构成要素与另一构成要素进行区分，构成要素并不受限于所述术语。Through the following detailed description and preferred embodiments related to the drawings, the purpose, specific advantages and novel features of the present invention will become clearer. The embodiments introduced below are provided as examples in order to fully convey the idea of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, and can also be embodied in other forms. In this specification, it should be noted that when the constituent elements of each accompanying drawing are given figure marks, for the same constituent elements, even if they are marked on different drawings, the same figure marks are given to them as much as possible. In addition, the terms such as "first", "second", "one surface", "another surface", "upper surface", "lower surface", "upper part", "lower part" are used to distinguish one constituent element from another constituent element, and the constituent element is not limited to the terms.
以下，将参照附图详细说明本发明的实施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
根据本发明的一实施例，一种发光二极管封装件组件，包括：多个发光二极管封装件，分别包括基板、发光二极管阵列和一对电极垫，所述发光二极管阵列由安装在所述基板的至少一表面并且电连接的多个发光二极管芯片构成，所述一对电极垫分别布置在所述基板的两端且与所述发光二极管阵列电连接；以及连接导线，在彼此相邻的两个发光二极管封装件之间，连接一端的电极垫。在所述彼此相邻的两个发光二极管封装件之间，另一端的电极垫彼此分离，所述多个发光二极管封装件电串联连接，所述连接导线与所述电极垫是一体型。According to one embodiment of the present invention, a light-emitting diode package assembly includes: a plurality of light-emitting diode packages, each including a substrate, a light-emitting diode array, and a pair of electrode pads, wherein the light-emitting diode array is composed of a plurality of light-emitting diode chips mounted on at least one surface of the substrate and electrically connected, and the pair of electrode pads are respectively arranged at both ends of the substrate and electrically connected to the light-emitting diode array; and a connecting wire, connecting the electrode pad at one end between two adjacent light-emitting diode packages. Between the two adjacent light-emitting diode packages, the electrode pads at the other end are separated from each other, the plurality of light-emitting diode packages are electrically connected in series, and the connecting wire is integrated with the electrode pad.
所述发光二极管封装件组件包括两个发光二极管封装件，所述两个发光二极管封装件一端的所述电极垫通过所述连接导线而连接，另一端的所述电极垫彼此分离。The light emitting diode package assembly includes two light emitting diode packages, the electrode pads at one end of the two light emitting diode packages are connected by the connecting wire, and the electrode pads at the other end are separated from each other.
所述发光二极管封装件组件包括三个以上的发光二极管封装件。此时，位于两侧端的两个发光二极管封装件以外的其他发光二极管封装件的两端的电极垫分别通过所述连接导线与相邻的彼此不同的发光二极管封装件连接。并且，位于所述两侧端的两个发光二极管封装件包括不与所述连接导线结合的电极垫。The LED package assembly includes more than three LED packages. At this time, the electrode pads at both ends of the LED packages other than the two LED packages located at the two side ends are respectively connected to adjacent different LED packages through the connecting wires. In addition, the two LED packages located at the two side ends include electrode pads that are not connected to the connecting wires.
还包括用于区分所述多个发光二极管封装件的电极垫的极性的标记(Mark)。Also included is a mark for distinguishing polarities of the electrode pads of the plurality of light emitting diode packages.
所述连接导线还包括：第一弯曲部，按使连接的两个发光二极管封装件彼此接近的方式弯曲。The connecting wire further includes a first bent portion bent in such a manner that the two connected light emitting diode packages are brought closer to each other.
所述发光二极管封装件的电极垫还包括：第二弯曲部，按使连接的连接导线和基板接近的方式弯曲。The electrode pad of the light emitting diode package further includes a second bent portion bent in such a manner that the connected connection wire and the substrate are brought closer together.
所述多个发光二极管封装件中的每一个的所述基板是透光性基板。The substrate of each of the plurality of light emitting diode packages is a light-transmitting substrate.
所述多个发光二极管封装件中的每一个还包括：波长变换部，形成为覆盖所述基板的至少一表面和所述发光二极管阵列。Each of the plurality of light emitting diode packages further includes a wavelength conversion portion formed to cover at least one surface of the substrate and the light emitting diode array.
所述多个发光二极管封装件中的每一个还包括：波长变换部，形成为覆盖所述基板的两表面和所述发光二极管阵列。Each of the plurality of light emitting diode packages further includes a wavelength conversion portion formed to cover both surfaces of the substrate and the light emitting diode array.
所述多个发光二极管封装件中的每一个发出白色光。Each of the plurality of light emitting diode packages emits white light.
根据本发明的另一实施例，一种发光二极管封装件组件，包括：第一发光二极管封装件和第二发光二极管封装件，分别包括透明基板、发光二极管阵列、波长变换层、阳极电极垫和阴极电极垫，所述发光二极管阵列由布置在所述透明基板的一表面上并且串联连接的多个发光二极管芯片构成，所述波长变换层覆盖所述透明基板的一表面和所述发光二极管阵列，所述阳极电极垫连接到所述发光二极管阵列的一端以及所述阴极电极垫连接到所述发光二极管阵列的另一端；以及一个连接导线，连接所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫。所述连接导线与所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫构成为一体型。所述第一发光二极管封装件的阴极电极垫和所述第二发光二极管封装件的阳极电极垫相隔分离。According to another embodiment of the present invention, a light emitting diode package assembly includes: a first light emitting diode package and a second light emitting diode package, each including a transparent substrate, a light emitting diode array, a wavelength conversion layer, an anode electrode pad and a cathode electrode pad, wherein the light emitting diode array is composed of a plurality of light emitting diode chips arranged on a surface of the transparent substrate and connected in series, the wavelength conversion layer covers a surface of the transparent substrate and the light emitting diode array, the anode electrode pad is connected to one end of the light emitting diode array and the cathode electrode pad is connected to the other end of the light emitting diode array; and a connecting wire connecting the anode electrode pad of the first light emitting diode package and the cathode electrode pad of the second light emitting diode package. The connecting wire is integrally formed with the anode electrode pad of the first light emitting diode package and the cathode electrode pad of the second light emitting diode package. The cathode electrode pad of the first light emitting diode package and the anode electrode pad of the second light emitting diode package are separated.
所述连接导线包括：至少一个第一弯曲部，构成为垂直于长轴方向弯曲。The connecting wire includes: at least one first bending portion, configured to be bent perpendicular to the long axis direction.
连接到所述连接导线的所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫分别还形成有垂直于长轴方向弯曲的第二弯曲部。The anode electrode pad of the first light emitting diode package and the cathode electrode pad of the second light emitting diode package connected to the connection wire are respectively formed with a second bent portion bent perpendicularly to the long axis direction.
根据本发明的又一实施例，一种发光二极管封装件组件，包括：第一发光二极管封装件至第四发光二极管封装件，分别包括透明基板、发光二极管阵列、波长变换部、阳极电极垫和阴极电极垫，所述发光二极管阵列由布置在所述透明基板的一表面上并且串联连接的多个发光二极管芯片构成，所述波长变换层覆盖所述透明基板的一表面和所述发光二极管阵列，所述阳极电极垫连接到所述发光二极管阵列的一端以及所述阴极电极垫连接到所述发光二极管阵列的另一端；第一连接导线，连接所述第一发光二极管封装件的阳极电极垫和所述第二发光二极管封装件的阴极电极垫；第二连接导线，连接所述第二发光二极管封装件的阳极电极垫和所述第三发光二极管封装件的阴极电极垫；以及第三连接导线，连接第三发光二极管封装件的阳极电极垫和第四发光二极管封装件的阴极电极垫。所述第一连接导线、第二连接导线以及第三连接导线与连接的阳极电极垫和阴极电极垫构成为一体型。并且，所述第一发光二极管封装件的阴极电极垫和所述第四发光二极管封装件的阳极电极垫与其他电极垫相隔分离。According to another embodiment of the present invention, a light emitting diode package assembly includes: first to fourth light emitting diode packages, each including a transparent substrate, a light emitting diode array, a wavelength conversion portion, an anode electrode pad and a cathode electrode pad, the light emitting diode array is composed of a plurality of light emitting diode chips arranged on a surface of the transparent substrate and connected in series, the wavelength conversion layer covers a surface of the transparent substrate and the light emitting diode array, the anode electrode pad is connected to one end of the light emitting diode array and the cathode electrode pad is connected to the other end of the light emitting diode array; a first connecting wire, connecting the anode electrode pad of the first light emitting diode package and the cathode electrode pad of the second light emitting diode package; a second connecting wire, connecting the anode electrode pad of the second light emitting diode package and the cathode electrode pad of the third light emitting diode package; and a third connecting wire, connecting the anode electrode pad of the third light emitting diode package and the cathode electrode pad of the fourth light emitting diode package. The first connecting wire, the second connecting wire and the third connecting wire are integrally formed with the connected anode electrode pad and cathode electrode pad. Moreover, the cathode electrode pad of the first light emitting diode package and the anode electrode pad of the fourth light emitting diode package are separated from other electrode pads.
所述连接导线分别包括：第一弯曲部，构成为垂直于长轴方向弯曲。The connecting wires respectively include: a first bending portion configured to be bent perpendicularly to the long axis direction.
根据本发明的又一实施例，一种发光二极管灯泡，包括：基础部，形成有与外部电源连接的一对外部电极；至少一个发光二极管封装件组件，包括多个发光二极管封装件和连接导线，所述多个发光二极管封装件分别包括发光二极管阵列和一对电极垫，所述发光二极管阵列由电连接的多个发光二极管芯片构成，所述一对电极垫分别连接在所述发光二极管阵列的两端，所述连接导线按使所述多个发光二极管封装件电串联连接的方式连接相邻的多个发光二极管封装件；至少一对导入线，电连接所述基础部的外部电极和所述发光二极管封装件组件的没有通过所述连接导线而连接的所述电极垫；以及透光性盖体，围绕所述发光二极管封装件组件和所述一对导入线，并且一端与所述基础部结合。所述连接导线和连接到所述连接导线的所述电极垫是一体型。According to another embodiment of the present invention, a light emitting diode bulb includes: a base portion formed with a pair of external electrodes connected to an external power source; at least one light emitting diode package assembly including a plurality of light emitting diode packages and connecting wires, the plurality of light emitting diode packages respectively including a light emitting diode array and a pair of electrode pads, the light emitting diode array is composed of a plurality of light emitting diode chips electrically connected, the pair of electrode pads are respectively connected to the two ends of the light emitting diode array, and the connecting wires connect the adjacent plurality of light emitting diode packages in a manner that the plurality of light emitting diode packages are electrically connected in series; at least one pair of lead-in wires electrically connecting the external electrodes of the base portion and the electrode pads of the light emitting diode package assembly that are not connected by the connecting wires; and a light-transmitting cover body surrounding the light emitting diode package assembly and the pair of lead-in wires, and one end of which is combined with the base portion. The connecting wire and the electrode pad connected to the connecting wire are integral.
所述发光二极管封装件组件包括两个发光二极管封装件。此时，所述两个发光二极管封装件的一端的所述电极垫通过所述连接导线而连接，另一端的所述电极垫彼此分离。The light emitting diode package assembly includes two light emitting diode packages. At this time, the electrode pads at one end of the two light emitting diode packages are connected by the connecting wire, and the electrode pads at the other end are separated from each other.
所述发光二极管封装件组件包括三个以上的发光二极管封装件。此时，除了位于两侧端的两个发光二极管封装件以外的其他发光二极管封装件的两端的所述电极垫分别通过所述连接导线而与相邻的彼此不同的发光二极管封装件连接。并且，位于所述两侧端的两个发光二极管封装件包括不与所述连接导线结合的电极垫。The LED package assembly includes more than three LED packages. At this time, the electrode pads at both ends of the LED packages other than the two LED packages located at the two side ends are connected to adjacent different LED packages through the connecting wires. In addition, the two LED packages located at the two side ends include electrode pads that are not connected to the connecting wires.
还形成有用于区分所述多个发光二极管封装件的电极垫的极性的标记(Mark)。Marks for distinguishing polarities of electrode pads of the plurality of light emitting diode packages are also formed.
所述标记形成在各个发光二极管封装件的至少一个电极垫上。The mark is formed on at least one electrode pad of each light emitting diode package.
所述连接导线还包括按使连接的两个发光二极管封装件彼此接近的方式弯曲的第一弯曲部，从而使所述连接的两个发光二极管封装件向彼此不同的方向照射光。The connecting wire further includes a first bent portion bent in such a manner as to bring the two connected light emitting diode packages closer to each other, thereby causing the two connected light emitting diode packages to irradiate light in different directions from each other.
所述发光二极管封装件的电极垫还包括按使连接的连接导线和基板接近的方式弯曲的第二弯曲部，从而使每个所述发光二极管封装件向所述发光二极管灯泡的上部照射光。The electrode pad of the LED package further includes a second bent portion bent in such a manner as to bring the connected connection wire and the substrate closer together, so that each of the LED packages irradiates light toward an upper portion of the LED bulb.
所述多个发光二极管封装件中的每一个的所述基板是透光性基板。The substrate of each of the plurality of light emitting diode packages is a light-transmitting substrate.
所述多个发光二极管封装件中的每一个还包括：波长变换部，形成为覆盖所述基板的至少一表面和所述发光二极管阵列。Each of the plurality of light emitting diode packages further includes a wavelength conversion portion formed to cover at least one surface of the substrate and the light emitting diode array.
所述多个发光二极管封装件中的每一个还包括：波长变换部，形成为覆盖所述基板的两表面和所述发光二极管阵列。Each of the plurality of light emitting diode packages further includes a wavelength conversion portion formed to cover both surfaces of the substrate and the light emitting diode array.
所述导入线与在所述多个发光二极管封装件的另一端没有与所述连接导线连接的所述电极垫连接。The lead-in wire is connected to the electrode pad at the other end of the plurality of light emitting diode packages that is not connected to the connection wire.
所述发光二极管灯泡，还包括：支撑台，布置在所述透光性盖体的内部，从所述基础部向上部方向延伸。The light emitting diode bulb further includes a support platform, which is arranged inside the translucent cover and extends upward from the base portion.
所述连接导线被所述支撑台的上部或者上表面支撑或者粘结至所述支撑台的上部或者上表面。The connecting wire is supported by or bonded to the upper portion or upper surface of the support platform.
所述发光二极管封装件组件是多个，所述多个发光二极管封装件组件中的每一个被区分而电连接到所述基础部。The light emitting diode package assembly is in a plurality, and each of the plurality of light emitting diode package assemblies is divided and electrically connected to the base portion.
根据本发明的又一实施例，一种发光二极管封装件组件包括多个发光二极管封装件和连接导线。所述多个发光二极管封装件分别包括：基板；发光二极管阵列，由安装在所述基板的至少一表面并且电连接的多个发光二极管芯片构成；以及一对电极垫，分别布置在所述基板的两端且与所述发光二极管阵列电连接。并且，所述连接导线将布置在所述多个发光二极管封装件的一端的所述电极垫电连接。在此，所述连接导线与连接的所述电极垫是一体型，所述多个发光二极管封装件电并联连接。According to another embodiment of the present invention, a light-emitting diode package assembly includes a plurality of light-emitting diode packages and connecting wires. The plurality of light-emitting diode packages respectively include: a substrate; a light-emitting diode array, which is composed of a plurality of light-emitting diode chips mounted on at least one surface of the substrate and electrically connected; and a pair of electrode pads, which are respectively arranged at both ends of the substrate and electrically connected to the light-emitting diode array. In addition, the connecting wire electrically connects the electrode pads arranged at one end of the plurality of light-emitting diode packages. Here, the connecting wire and the connected electrode pad are integrated, and the plurality of light-emitting diode packages are electrically connected in parallel.
布置在所述多个发光二极管封装件的另一端的所述电极垫彼此分离。The electrode pads arranged at the other ends of the plurality of light emitting diode packages are separated from each other.
所述连接导线还包括：第一弯曲部，按使与所述连接导线连接的发光二极管封装件彼此接近的方式弯曲。The connecting wire further includes a first bent portion bent in such a manner that the light emitting diode packages connected to the connecting wire are brought closer to each other.
并且，与所述连接导线连接的所述电极垫还包括：第二弯曲部，按使所述基板和所述连接导线彼此接近的方式弯曲。Furthermore, the electrode pad connected to the connection wire further includes a second bent portion bent in such a manner that the substrate and the connection wire are brought closer to each other.
在所述基板上还形成有用于区分极性的标记(Mark)。A mark for distinguishing polarity is also formed on the substrate.
所述基板是透光性基板。The substrate is a light-transmitting substrate.
所述发光二极管封装件还包括：波长变换部，形成为覆盖所述基板的至少一表面和所述发光二极管阵列。The light emitting diode package further includes a wavelength conversion portion formed to cover at least one surface of the substrate and the light emitting diode array.
所述多个发光二极管封装件发出白色光。The plurality of light emitting diode packages emit white light.
所述发光二极管封装件组件还包括：连接导线，形成在所述多个发光二极管封装件的另一端，将布置在所述多个发光二极管封装件的另一端的所述电极垫电连接。The light emitting diode package assembly further includes: a connecting wire formed at the other end of the plurality of light emitting diode packages to electrically connect the electrode pads arranged at the other end of the plurality of light emitting diode packages.
在此，形成在所述多个发光二极管封装件的另一端的所述连接导线与连接的所述电极垫是一体型。Here, the connection wire formed at the other end of the plurality of light emitting diode packages is integrated with the connected electrode pad.
并且，形成在所述多个发光二极管封装件的另一端的所述连接导线还形成有按使与所述连接导线连接的相邻的发光二极管封装件彼此接近的方式弯曲的第一弯曲部。Furthermore, the connection wire formed at the other end of the plurality of light emitting diode packages further has a first bent portion bent so as to bring adjacent light emitting diode packages connected to the connection wire closer to each other.
根据本发明的又一实施例，一种发光二极管灯泡，包括：基础部，形成有与外部电源连接的多个外部电极；至少一个发光二极管封装件组件，包括多个发光二极管封装件和连接导线；多个导入线，电连接所述基础部的所述外部电极和所述发光二极管封装件组件；以及透光性盖体，围绕所述发光二极管封装件组件和所述多个导入线，并且一端与所述基础部结合。According to another embodiment of the present invention, a light-emitting diode bulb includes: a base portion, formed with a plurality of external electrodes connected to an external power source; at least one light-emitting diode package assembly, including a plurality of light-emitting diode packages and connecting wires; a plurality of lead-in wires, electrically connecting the external electrodes of the base portion and the light-emitting diode package assembly; and a translucent cover body, surrounding the light-emitting diode package assembly and the plurality of lead-in wires, and having one end combined with the base portion.
所述发光二极管封装件组件包括多个发光二极管封装件和连接导线。所述多个发光二极管封装件分别包括：基板，发光二极管阵列，安装在所述基板的至少一表面，并且由电连接的多个发光二极管芯片构成；以及一对电极垫，分别布置在所述基板的两端而与所述发光二极管阵列电连接。并且，所述连接导线，将布置在所述多个发光二极管封装件的一端的所述电极垫电连接。在此，所述连接导线与连接的所述电极垫是一体型，并且所述多个发光二极管封装件电并联连接。The light-emitting diode package assembly includes a plurality of light-emitting diode packages and connecting wires. The plurality of light-emitting diode packages respectively include: a substrate, a light-emitting diode array, which is mounted on at least one surface of the substrate and is composed of a plurality of electrically connected light-emitting diode chips; and a pair of electrode pads, which are respectively arranged at both ends of the substrate and electrically connected to the light-emitting diode array. In addition, the connecting wire electrically connects the electrode pads arranged at one end of the plurality of light-emitting diode packages. Here, the connecting wire and the connected electrode pad are integrated, and the plurality of light-emitting diode packages are electrically connected in parallel.
所述连接导线还包括：第一弯曲部，按使与所述连接导线连接的相邻的发光二极管封装件彼此接近的方式弯曲。The connecting wire further includes a first bent portion bent in such a manner that adjacent light emitting diode packages connected to the connecting wire are brought closer to each other.
与所述连接导线连接的所述电极垫还包括：第二弯曲部，按使所述基板和所述连接导线彼此接近的方式弯曲。The electrode pad connected to the connection wire further includes a second bent portion bent in such a manner that the substrate and the connection wire are brought close to each other.
在所述基板上还形成有用于区分极性的标记(Mark)。A mark for distinguishing polarity is also formed on the substrate.
所述基板是透光性基板。The substrate is a light-transmitting substrate.
所述发光二极管封装件还包括：波长变换部，形成为覆盖所述基板的至少一表面和所述发光二极管阵列。The light emitting diode package further includes a wavelength conversion portion formed to cover at least one surface of the substrate and the light emitting diode array.
所述多个发光二极管封装件发出白色光。The plurality of light emitting diode packages emit white light.
还包括布置在所述透光性盖体的内部且从所述基础部向上部方向延伸的支撑台。所述连接导线被所述支撑台的上部或者上表面支撑或者粘结至所述支撑台的上部或者上表面。The device further includes a support platform arranged inside the translucent cover and extending upward from the base portion. The connecting wire is supported by or bonded to the upper portion or upper surface of the support platform.
布置在所述多个发光二极管封装件的另一端的所述电极垫彼此分离。此时，所述导入线分别连接到布置于所述发光二极管封装件的另一端的所述电极垫。The electrode pads arranged at the other ends of the plurality of light emitting diode packages are separated from each other. At this time, the lead-in wires are respectively connected to the electrode pads arranged at the other ends of the light emitting diode packages.
所述发光二极管封装件组件还包括：连接导线，形成在所述多个发光二极管封装件的另一端，并且将布置在所述多个发光二极管封装件的另一端的所述电极垫电连接。The light emitting diode package assembly further includes a connecting wire formed at the other end of the plurality of light emitting diode packages and electrically connecting the electrode pads arranged at the other end of the plurality of light emitting diode packages.
在此，形成在所述多个发光二极管封装件的另一端的所述连接导线与连接的所述电极垫是一体型。Here, the connection wire formed at the other end of the plurality of light emitting diode packages is integrated with the connected electrode pad.
并且，形成在所述多个发光二极管封装件的另一端的所述连接导线还形成有按使与所述连接导线连接的相邻的发光二极管封装件彼此接近的方式弯曲的第一弯曲部。Furthermore, the connection wire formed at the other end of the plurality of light emitting diode packages further has a first bent portion bent so as to bring adjacent light emitting diode packages connected to the connection wire closer to each other.
并且，所述导入线与形成在所述多个发光二极管封装件的另一端的所述连接导线连接。Furthermore, the lead-in wire is connected to the connection wire formed at the other end of the plurality of light emitting diode packages.
所述发光二极管封装件组件是多个。在此，还包括：连接线，将所述多个发光二极管封装件组件电连接。所述连接线与形成在所述多个发光二极管封装件组件的一端的所述连接导线电连接，从而将所述多个发光二极管封装件组件电串联连接。There are a plurality of light emitting diode package assemblies. Here, it further includes: a connecting wire electrically connecting the plurality of light emitting diode package assemblies. The connecting wire is electrically connected to the connecting wire formed at one end of the plurality of light emitting diode package assemblies, so as to electrically connect the plurality of light emitting diode package assemblies in series.
图1至图6是示出根据本发明的第一实施例的发光二极管封装件组件的制造方法和根据其的发光二极管封装件组件的示例图。1 to 6 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a first embodiment of the present invention and a light emitting diode package assembly according thereto.
参考图1，提供了多个发光二极管封装件40。虽然未在图中示出，但发光二极管封装件40布置在将进行后续工艺的板(plate)上。每个发光二极管封装件40包括发光二极管阵列32和安装有发光二极管阵列32的基板31。并且，发光二极管封装件40还可以包括波长变换部34。虽然图2中发光二极管封装件40没有包括波长变换部34，但此后形成了波长变换部34。Referring to FIG. 1 , a plurality of light emitting diode packages 40 are provided. Although not shown in the figure, the light emitting diode packages 40 are arranged on a plate to be subjected to subsequent processes. Each light emitting diode package 40 includes a light emitting diode array 32 and a substrate 31 on which the light emitting diode array 32 is mounted. And, the light emitting diode package 40 may further include a wavelength conversion portion 34. Although the light emitting diode package 40 does not include the wavelength conversion portion 34 in FIG. 2 , the wavelength conversion portion 34 is formed thereafter.
在本发明的实施例中，发光二极管阵列32由串联连接的多个发光二极管芯片33构成。例如，在多个发光二极管芯片33中的每一个，自身的阳极(anode)电极和相邻的发光二极管芯片33的阴极(cathode)电极通过引线键合(Wire bonding)电连接。此时，在发光二极管阵列32中，布置在一端的发光二极管芯片33的阳极电极和布置在作为一端的反方向的另一端的发光二极管芯片33的阴极电极是没有进行引线键合的状态。在以后的说明中，将发光二极管阵列32中布置在一端的发光二极管芯片33的阳极电极表述为发光二极管阵列32的阳极电极或者发光二极管封装件40的阳极电极。并且，将发光二极管阵列32中布置在另一端的发光二极管芯片33的阴极电极表述为发光二极管阵列32的阴极电极或者发光二极管封装件40的阴极电极。In the embodiment of the present invention, the light emitting diode array 32 is composed of a plurality of light emitting diode chips 33 connected in series. For example, in each of the plurality of light emitting diode chips 33, its own anode electrode and the cathode electrode of the adjacent light emitting diode chip 33 are electrically connected by wire bonding. At this time, in the light emitting diode array 32, the anode electrode of the light emitting diode chip 33 arranged at one end and the cathode electrode of the light emitting diode chip 33 arranged at the other end in the opposite direction of the one end are not in a state of wire bonding. In the following description, the anode electrode of the light emitting diode chip 33 arranged at one end of the light emitting diode array 32 is described as the anode electrode of the light emitting diode array 32 or the anode electrode of the light emitting diode package 40. And, the cathode electrode of the light emitting diode chip 33 arranged at the other end of the light emitting diode array 32 is described as the cathode electrode of the light emitting diode array 32 or the cathode electrode of the light emitting diode package 40.
图1中示出了发光二极管封装件40包括了串联连接的多个发光二极管芯片33的一个发光二极管阵列32。然而，发光二极管封装件40可以包括多个发光二极管阵列32。例如，发光二极管封装件40可以包括多个发光二极管阵列32，多个发光二极管阵列32可以以串联、并联或者串联和并联混用的方式连接。FIG1 shows that the LED package 40 includes a LED array 32 of a plurality of LED chips 33 connected in series. However, the LED package 40 may include a plurality of LED arrays 32. For example, the LED package 40 may include a plurality of LED arrays 32, and the plurality of LED arrays 32 may be connected in series, in parallel, or in a mixed manner of series and parallel.
基板31可以是由透光性材质形成的透光性基板。在基板31是透光性基板的情形下，从发光二极管阵列32发出的光不仅可以通过发光二极管阵列32的前表面，还可以通过基板31的下面而发出。在此，基板31的下面是安装有发光二极管阵列32的面的反面。以后，说明中可以根据构成部的布置形态而将前表面表述为上表面，下表面表述为后表面。例如，基板31的材质可以是玻璃。The substrate 31 may be a translucent substrate formed of a translucent material. In the case where the substrate 31 is a translucent substrate, the light emitted from the LED array 32 may be emitted not only through the front surface of the LED array 32 but also through the bottom of the substrate 31. Here, the bottom of the substrate 31 is the reverse side of the surface on which the LED array 32 is mounted. In the following description, the front surface may be described as the upper surface and the bottom surface may be described as the rear surface according to the arrangement of the components. For example, the material of the substrate 31 may be glass.
根据本发明的实施例，多个发光二极管封装件40布置为与相邻的发光二极管封装件40具有相反的极性位置。即，多个发光二极管封装件40布置为与相邻的发光二极管封装件40和发光二极管阵列32的阳极电极和阴极电极的位置相反。According to an embodiment of the present invention, the plurality of LED packages 40 are arranged to have opposite polarity positions to the adjacent LED packages 40. That is, the plurality of LED packages 40 are arranged to have opposite positions of anode electrodes and cathode electrodes to the adjacent LED packages 40 and the LED array 32.
参考图2，在多个发光二极管封装件40上布置有导线框架10。导线框架10具有在连接导线11上多个电极垫12向一侧或者另一侧突出的结构。例如，导线框架10由铜、铝等导电性金属形成。2 , a lead frame 10 is arranged on a plurality of light emitting diode packages 40. The lead frame 10 has a structure in which a plurality of electrode pads 12 protrude to one side or the other side on a connection wire 11. For example, the lead frame 10 is formed of a conductive metal such as copper or aluminum.
虽然为了便于说明本发明，将导线框架10区分为连接导线11和电极垫12进行说明，但连接导线11和电极垫12是相同材质，并且是通过同一工艺形成的一体型。例如，导线框架10可以通过在金属材质的板上进行冲压(Punching)工艺而形成。或者，导线框架10可以通过在模具(mold)中注入熔化的金属而凝固的方式形成。此外，只要连接导线11和电极垫12形成为一体型，则导线框架10可以根据本领域技术人员的选择而以多种方法形成。Although the lead frame 10 is divided into the connecting wire 11 and the electrode pad 12 for the convenience of explaining the present invention, the connecting wire 11 and the electrode pad 12 are made of the same material and are an integrated type formed by the same process. For example, the lead frame 10 can be formed by a punching process on a plate of a metal material. Alternatively, the lead frame 10 can be formed by injecting molten metal into a mold and solidifying it. In addition, as long as the connecting wire 11 and the electrode pad 12 are formed into an integrated type, the lead frame 10 can be formed in a variety of ways according to the choice of those skilled in the art.
导线框架10分别布置在发光二极管封装件40的一端和另一端。此时，基板31的两端的上表面分别与电极垫12的下表面接触。The lead frames 10 are respectively disposed at one end and the other end of the light emitting diode package 40. At this time, upper surfaces of both ends of the substrate 31 are in contact with lower surfaces of the electrode pads 12, respectively.
电极垫12区分为第一电极垫13和第二电极垫14。第一电极垫13是阳极电极垫，第二电极垫14是阴极电极垫。The electrode pad 12 is divided into a first electrode pad 13 and a second electrode pad 14. The first electrode pad 13 is an anode electrode pad, and the second electrode pad 14 is a cathode electrode pad.
第一电极垫13与发光二极管阵列32的阳极电极连接，第二电极垫14与发光二极管阵列32的阴极电极连接。第一电极垫13和第二电极垫14将在此后成为发光二极管封装件40的部分构成。The first electrode pad 13 is connected to the anode electrode of the light emitting diode array 32, and the second electrode pad 14 is connected to the cathode electrode of the light emitting diode array 32. The first electrode pad 13 and the second electrode pad 14 will constitute a part of a light emitting diode package 40 later.
在多个电极垫12中的至少一部分可以形成有标记(Mark)16。标记16是为了在此后区分作为发光二极管封装件40两端的极性的阳极电极和阴极电极而形成的。即，标记16是为了区分第一电极垫13和第二电极垫14的标识。并且，在此后发光二极管封装件40或者发光二极管封装件组件110与外部电源连接时，标记16也可以起到区分与外部电源的正(+)的电源和负(-)的电源连接的电极垫12的作用。A mark 16 may be formed on at least a portion of the plurality of electrode pads 12. The mark 16 is formed to distinguish the anode electrode and the cathode electrode as the polarity of the two ends of the light-emitting diode package 40. That is, the mark 16 is used to distinguish the first electrode pad 13 from the second electrode pad 14. Moreover, when the light-emitting diode package 40 or the light-emitting diode package assembly 110 is connected to an external power source, the mark 16 may also serve to distinguish the electrode pads 12 connected to the positive (+) power source and the negative (-) power source of the external power source.
在本发明的实施例中，标记16形成在第一电极垫13。因此，导线框架10具有形成有标记16的第一电极垫13和没有形成标记16的第二电极垫14交替布置在连接导线11的结构。In the embodiment of the present invention, the mark 16 is formed on the first electrode pad 13. Therefore, the lead frame 10 has a structure in which the first electrode pad 13 formed with the mark 16 and the second electrode pad 14 not formed with the mark 16 are alternately arranged on the connection wire 11.
可以对形成标记16的位置进行多种改变。作为另一实施例，标记16可以形成在第二电极垫14。作为又一实施例，标记16可以以不同形状分别形成在第一电极垫13和第二电极垫14。Various changes may be made to the position where the mark 16 is formed. As another embodiment, the mark 16 may be formed on the second electrode pad 14. As yet another embodiment, the mark 16 may be formed in different shapes on the first electrode pad 13 and the second electrode pad 14, respectively.
标记16可以以阴刻结构、贯通结构或者用墨水标注等能够以视觉方式确认的任何方法和形态形成。The mark 16 may be formed in any method and form that can be visually confirmed, such as an engraved structure, a through structure, or ink marking.
在多个发光二极管封装件40上布置导线框架10之后，对发光二极管封装件40和导线框架10进行引线键合。各个发光二极管封装件40的阳极电极通过第一电极垫13和引线电连接。并且，各个发光二极管封装件40的阴极电极通过第二电极垫14和引线而电连接。After the lead frame 10 is arranged on the plurality of light emitting diode packages 40, the light emitting diode packages 40 and the lead frame 10 are wire-bonded. The anode electrodes of the light emitting diode packages 40 are electrically connected to the lead wires through the first electrode pads 13. Also, the cathode electrodes of the light emitting diode packages 40 are electrically connected to the lead wires through the second electrode pads 14.
参照图3，波长变换部34形成为围绕发光二极管阵列32。波长变换部34对从发光二极管芯片33发出的光的波长进行变换来发出不同颜色的光。波长变换部34由包括荧光体的树脂形成。3 , the wavelength conversion unit 34 is formed to surround the light emitting diode array 32. The wavelength conversion unit 34 converts the wavelength of light emitted from the light emitting diode chip 33 to emit light of a different color. The wavelength conversion unit 34 is formed of a resin including a fluorescent substance.
图4是图3的侧剖面(A1-A2)。参照图4，波长变换部34形成为围绕布置有发光二极管阵列32的基板31的上表面和下表面。或者，波长变换部34虽然形成为围绕发光二极管阵列32，但可以仅形成在基板31的上表面。即，波长变换部34只要以围绕发光二极管阵列32的方式形成，则可以根据本领域技术人员的选择而形成为任何形态。FIG4 is a side section (A1-A2) of FIG3. Referring to FIG4, the wavelength conversion unit 34 is formed to surround the upper surface and the lower surface of the substrate 31 on which the light emitting diode array 32 is arranged. Alternatively, although the wavelength conversion unit 34 is formed to surround the light emitting diode array 32, it can be formed only on the upper surface of the substrate 31. That is, as long as the wavelength conversion unit 34 is formed in a manner surrounding the light emitting diode array 32, it can be formed in any form according to the choice of those skilled in the art.
在本发明的实施例中，发光二极管封装件40可以发出白色光或者用户期望的其他颜色的光。从发光二极管阵列32发出的光在通过波长变换部34时波长变换，从而可以发出白色光或者用户期望的其他颜色的光。此时，在基板31是透光性基板的情形下，如果波长变换部34形成为围绕基板31的下表面，则发光二极管封装件40通过基板31的下表面也可以发出用户期望的颜色的光。In the embodiment of the present invention, the light emitting diode package 40 can emit white light or light of other colors desired by the user. The light emitted from the light emitting diode array 32 is wavelength-converted when passing through the wavelength conversion unit 34, so that white light or light of other colors desired by the user can be emitted. At this time, if the substrate 31 is a light-transmitting substrate, if the wavelength conversion unit 34 is formed to surround the lower surface of the substrate 31, the light emitting diode package 40 can also emit light of the color desired by the user through the lower surface of the substrate 31.
作为另一实施例，从发光二极管阵列32发出的光可以是白色光或者用户期望的光。在这种情形下，在发光二极管封装件40中可以省略波长变换部34。发光二极管阵列32可按混合发出不同颜色的光的发光二极管芯片33的方式构成，从而发出白色光或者用户期望的颜色的光。或者，每个发光二极管芯片33可以是混合发出不同颜色的光的多个发光二极管芯片的结构，以发出白色光或者用户期望的颜色的光。As another embodiment, the light emitted from the LED array 32 may be white light or light desired by the user. In this case, the wavelength conversion unit 34 may be omitted in the LED package 40. The LED array 32 may be configured in a manner that LED chips 33 that emit light of different colors are mixed, thereby emitting white light or light of a color desired by the user. Alternatively, each LED chip 33 may be a structure that is a mixture of a plurality of LED chips that emit light of different colors, thereby emitting white light or light of a color desired by the user.
图5示出了导线框架10的切割线C。切割线C是表示在进行切割工艺时，导线框架10被切割的部分的线。5 shows a cutting line C of the lead frame 10. The cutting line C is a line indicating a portion where the lead frame 10 is cut when performing a cutting process.
在本发明的实施例中，切割线C形成为使并排布置的多个发光二极管封装件40中分别布置在两侧端的发光二极管封装件40和没有形成电极垫12的导线框架10的两侧分离。并且，切割线C形成为从与彼此相邻的两个发光二极管封装件40的一端相连的电极垫12的外侧切割连接导线11。In the embodiment of the present invention, the cutting line C is formed to separate the light emitting diode packages 40 respectively arranged at both side ends among the plurality of light emitting diode packages 40 arranged side by side and both sides of the lead frame 10 where the electrode pad 12 is not formed. Also, the cutting line C is formed to cut the connection wire 11 from the outer side of the electrode pad 12 connected to one end of two light emitting diode packages 40 adjacent to each other.
将图5所示的6个发光二极管封装件40区分为第一发光二极管封装件41至第六发光二极管封装件46而进行说明。例如，切割线C形成为在第二发光二极管封装件42的第一电极垫13和第三发光二极管封装件43的第二电极垫14之间和在第四发光二极管封装件44的第一电极垫13和第五发光二极管封装件45的第二电极垫14之间切割连接导线11。并且，切割线C形成为切割与两个发光二极管封装件40的另一端连接的电极垫12和连接导线11之间。The six LED packages 40 shown in FIG5 are divided into the first LED package 41 to the sixth LED package 46 for explanation. For example, the cutting line C is formed to cut the connection wire 11 between the first electrode pad 13 of the second LED package 42 and the second electrode pad 14 of the third LED package 43 and between the first electrode pad 13 of the fourth LED package 44 and the second electrode pad 14 of the fifth LED package 45. Furthermore, the cutting line C is formed to cut between the electrode pad 12 connected to the other ends of the two LED packages 40 and the connection wire 11.
如果沿切割线C执行切割工艺，则至少一个发光二极管封装件组件110会从导线框架10分离。If the cutting process is performed along the cutting line C, at least one light emitting diode package assembly 110 may be separated from the lead frame 10 .
图6是沿图5的切割线C进行切割工艺而从导线框架10分离的发光二极管封装件组件110。根据第一实施例的发光二极管封装件组件110包括两个发光二极管封装件40串联连接的结构。发光二极管封装件组件110包括两个发光二极管封装件40、连接导线11以及电极垫12。6 is a light emitting diode package assembly 110 separated from the lead frame 10 by a cutting process along the cutting line C of FIG. 5 . The light emitting diode package assembly 110 according to the first embodiment includes a structure in which two light emitting diode packages 40 are connected in series. The light emitting diode package assembly 110 includes two light emitting diode packages 40, a connecting wire 11, and an electrode pad 12.
发光二极管封装件40的第二电极垫14和另一发光二极管封装件40的第一电极垫13与连接导线11形成为一体型。因此，构成发光二极管封装件组件110的两个发光二极管封装件40串联连接。以后，为了说明的便利，将两个发光二极管封装件40区分为第一发光二极管封装件41和第二发光二极管封装件42而进行说明。The second electrode pad 14 of the LED package 40 and the first electrode pad 13 of the other LED package 40 are formed integrally with the connecting wire 11. Therefore, the two LED packages 40 constituting the LED package assembly 110 are connected in series. Hereinafter, for the convenience of description, the two LED packages 40 are distinguished as a first LED package 41 and a second LED package 42 for description.
以往，将多个发光二极管封装件与导线框架单独分离。因此，为了电连接多个发光二极管封装件，需要如引线等构成部，且该构成部需要单独制造。Conventionally, a plurality of light emitting diode packages are separated from a lead frame and thus components such as leads are required to electrically connect the plurality of light emitting diode packages, and the components need to be manufactured separately.
然而，如果根据本发明的一实施例，第一发光二极管封装件41和第二发光二极管封装件42布置为电极方向彼此相反，并且通过导线框架10的连接导线11而彼此电连接。However, according to an embodiment of the present invention, the first light emitting diode package 41 and the second light emitting diode package 42 are arranged with their electrodes in opposite directions to each other and are electrically connected to each other through the connection wires 11 of the lead frame 10 .
因此，在根据本发明的实施例的发光二极管封装件组件110的制造方法中可以省略制作用于发光二极管封装件40之间的连接的单独的构成部的工艺。并且，在发光二极管封装件组件110的制造方法中可以省略利用单独制造的构成部将发光二极管封装件40电连接的工艺。即，以往为了多个发光二极管封装件40之间的电连接而使用了引线。然而，根据本发明的实施例，不需要用于多个发光二极管封装件40之间的电连接的引线，并且不需要将引线连接到发光二极管封装件40的工艺。由于简化了发光二极管封装件组件110的制造工艺，并且减少了制造时间和材料成本，因此最终也提高了利用发光二极管封装件组件110制造的灯泡的生产性。Therefore, in the manufacturing method of the LED package assembly 110 according to the embodiment of the present invention, the process of making a separate component for connecting the LED packages 40 can be omitted. In addition, in the manufacturing method of the LED package assembly 110, the process of electrically connecting the LED packages 40 using a separately manufactured component can be omitted. That is, in the past, leads were used for electrical connection between multiple LED packages 40. However, according to the embodiment of the present invention, leads for electrical connection between multiple LED packages 40 are not required, and a process for connecting the leads to the LED packages 40 is not required. Since the manufacturing process of the LED package assembly 110 is simplified and the manufacturing time and material costs are reduced, the productivity of the light bulb manufactured using the LED package assembly 110 is ultimately improved.
图7是示出根据本发明的第一实施例的发光二极管灯泡的示例图。FIG. 7 is an exemplary diagram showing a light emitting diode bulb according to a first embodiment of the present invention.
根据第一实施例的发光二极管灯泡100包括基础部120、支撑台130、发光二极管封装件组件110、导入线140和透光性盖体150。The LED bulb 100 according to the first embodiment includes a base 120 , a support stand 130 , an LED package assembly 110 , a lead-in wire 140 , and a translucent cover 150 .
基础部120是为了与外部电源连接而与插座(Socket)结合的结构。在基础部120的外侧面形成有与插座电连接的第一外部电极121和第二外部电极122。The base part 120 is a structure that is combined with a socket in order to be connected to an external power source. A first external electrode 121 and a second external electrode 122 that are electrically connected to the socket are formed on the outer side surface of the base part 120 .
透光性盖体150形成为与基础部120结合，从而覆盖如支撑台130、发光二极管封装件组件110和导入线140等发光二极管灯泡100的内部结构部。The translucent cover 150 is formed to be combined with the base 120 to cover the internal structural parts of the LED bulb 100 such as the support 130 , the LED package assembly 110 , and the lead-in wire 140 .
透光性盖体150由使从发光二极管封装件组件110发出的光透过的透光性材质形成。例如，透光性盖体150由玻璃形成。The translucent cover 150 is formed of a translucent material that transmits light emitted from the LED package 110. For example, the translucent cover 150 is formed of glass.
支撑台130位于基础部120和透光性盖体150的内部，并且支撑发光二极管封装件组件110。支撑台130的下部位于基础部120的内部，支撑台130的上部形成为向基础部120的上部长形地突出。The support 130 is located inside the base 120 and the translucent cover 150 and supports the LED package assembly 110. The lower portion of the support 130 is located inside the base 120 and the upper portion of the support 130 is formed to protrude elongatedly above the base 120.
作为一实施例，支撑台130可以与透光性盖体150一体型地形成。在这种情形下，支撑台130被固定到透光性盖体150。并且，如果透光性盖体150和基础部120结合，则支撑台130的下部将位于基础部120的内部。作为另一实施例，支撑台130可以形成为与透光性盖体150不是一体型的单独构成部。此时，支撑台130的下部可以固定在基础部120的内部。可以根据本领域技术人员的选择而对支撑台130与透光性盖体150是是否一体型还是单独构成部，以及据此的支撑台130固定在基础部120和透光性盖体150的内部的方法进行多种改变。As one embodiment, the support table 130 may be formed integrally with the translucent cover 150. In this case, the support table 130 is fixed to the translucent cover 150. And, if the translucent cover 150 and the base 120 are combined, the lower portion of the support table 130 will be located inside the base 120. As another embodiment, the support table 130 may be formed as a separate component that is not integral with the translucent cover 150. In this case, the lower portion of the support table 130 may be fixed inside the base 120. Whether the support table 130 and the translucent cover 150 are integral or separate components, and the method of fixing the support table 130 inside the base 120 and the translucent cover 150 may be varied according to the choice of those skilled in the art.
支撑台130由透光性的绝缘材质形成。支撑台130可由与透光性盖体150相同的材质形成。例如，支撑台130可以由玻璃形成。The support platform 130 is formed of a light-transmitting insulating material. The support platform 130 may be formed of the same material as the light-transmitting cover 150. For example, the support platform 130 may be formed of glass.
透光性盖体150的内部布置有两个发光二极管封装件组件110。在此，发光二极管封装件组件110包括通过连接导线11而串联连接的两个第一实施例的发光二极管封装件40。Two LED package assemblies 110 are arranged inside the translucent cover 150. Here, the LED package assembly 110 includes two LED packages 40 of the first embodiment connected in series via a connecting wire 11.
发光二极管封装件组件110被粘结到支撑台130并与透光性盖体150的内侧面相对地竖立。发光二极管封装件组件110的连接导线11被粘结到支撑台130的上部。此时，在连接导线11和支撑台130之间存在粘结剂(未示出)。粘结剂由透明粘结物质形成。例如，粘结剂可以是透明胶(Paste)。The LED package assembly 110 is bonded to the support 130 and stands opposite to the inner side of the translucent cover 150. The connecting wire 11 of the LED package assembly 110 is bonded to the upper part of the support 130. At this time, there is an adhesive (not shown) between the connecting wire 11 and the support 130. The adhesive is formed of a transparent adhesive substance. For example, the adhesive can be a transparent paste.
并且，两个发光二极管封装件组件110布置为向彼此不同方向发光。在本发明的实施例中，两个发光二极管封装件组件110布置为彼此对向。并且，两个发光二极管封装件组件110可以布置为借助导入线140而略微向上部方向倾斜。因此。发光二极管灯泡100不仅可以向侧面发光，也可以向上部方向发光。Furthermore, the two LED package assemblies 110 are arranged to emit light in different directions from each other. In the embodiment of the present invention, the two LED package assemblies 110 are arranged to face each other. Furthermore, the two LED package assemblies 110 can be arranged to be slightly tilted upward by means of the lead-in wire 140. Therefore, the LED bulb 100 can emit light not only to the side but also to the upward direction.
虽然在本发明中以两个发光二极管封装件组件110为示例进行说明，但发光二极管封装件组件110的数量并不限于此。发光二极管封装件组件110的数量可以改变，并且发光二极管封装件组件110的布置结构也可以根据发光二极管封装件组件110的数量而改变。Although two LED package assemblies 110 are used as an example in the present invention, the number of LED package assemblies 110 is not limited thereto. The number of LED package assemblies 110 may be changed, and the arrangement structure of the LED package assemblies 110 may also be changed according to the number of LED package assemblies 110.
导入线140分别与发光二极管封装件组件110和基础部120的外部电极连接。通过导入线140，施加到基础部120的外部电极的外部电源施加到发光二极管封装件组件110。例如，外部电源的正(+)的电源通过基础部120的第一外部电极121和导入线140而与发光二极管封装件组件110的第一电极垫13连接。并且，外部电源的负(-)的电源通过基础部120的第二外部电极122和导入线140而与发光二极管封装件组件110的第二电极垫14连接。The lead-in wire 140 is connected to the external electrodes of the LED package assembly 110 and the base 120, respectively. The external power applied to the external electrode of the base 120 is applied to the LED package assembly 110 through the lead-in wire 140. For example, the positive (+) power of the external power is connected to the first electrode pad 13 of the LED package assembly 110 through the first external electrode 121 of the base 120 and the lead-in wire 140. Also, the negative (-) power of the external power is connected to the second electrode pad 14 of the LED package assembly 110 through the second external electrode 122 of the base 120 and the lead-in wire 140.
导入线140的至少一部分贯通支撑台130而将外部电极和发光二极管封装件组件110连接。因此，导入线140可以借助支撑台130而被固定为不移动，并得到保护。At least a portion of the lead-in wire 140 passes through the support 130 to connect the external electrode and the LED package assembly 110. Therefore, the lead-in wire 140 can be fixed by the support 130 so as not to move and be protected.
导入线140可以是以铁-镍合金为中心线而将其表面以铜覆盖的杜美丝(dumetwire)。然而，导入线140并不限于杜美丝，导入线140的材质可以是导电性金属中的任何一个。并且，导入线140可以具有能够将发光二极管封装件组件110支撑为如下程度的强度，即，发光二极管封装件组件110以向上部方向倾斜地状态被固定。The lead-in wire 140 may be a dumet wire having an iron-nickel alloy as the center line and its surface covered with copper. However, the lead-in wire 140 is not limited to the dumet wire, and the material of the lead-in wire 140 may be any conductive metal. In addition, the lead-in wire 140 may have a strength capable of supporting the LED package assembly 110 to the extent that the LED package assembly 110 is fixed in a state tilted upward.
以往的灯丝灯泡发热高，并且由于高的发热温度而使灯丝逐渐变细而结束寿命。并且，灯丝灯泡在关闭的常温状态下突然施加电流时，往往具有灯丝断裂的情况。然而，根据本发明的实施例的发光二极管灯泡100使用应用了寿命长、发热低的发光二极管芯片的发光二极管封装件组件110代替钨灯丝。因此，发光二极管灯泡100由于低发热量和长寿命，比以往的灯丝灯泡在经济方面优势高。Conventional filament bulbs generate high heat, and due to the high heat temperature, the filament gradually becomes thinner and ends its life. In addition, when a current is suddenly applied to a filament bulb in a closed state at room temperature, the filament often breaks. However, the LED bulb 100 according to the embodiment of the present invention uses an LED package assembly 110 that uses a long-life, low-heat LED chip instead of a tungsten filament. Therefore, the LED bulb 100 has a higher economic advantage than conventional filament bulbs due to its low heat generation and long life.
根据本发明的实施例的发光二极管灯泡100使用多个发光二极管封装件40彼此电连接的发光二极管封装件组件110。因此，在发光二极管灯泡100中，与发光二极管封装件40的数量无关地，每一个发光二极管封装件组件110仅需要分别与第一外部电极121和第二外部电极122连接的各一条导入线140。因此，即使发光二极管封装件40的数量增加，根据本发明的实施例的发光二极管灯泡100也不需要追加导入线140，因此在成本方面是有优势的。The LED bulb 100 according to the embodiment of the present invention uses an LED package assembly 110 in which a plurality of LED packages 40 are electrically connected to each other. Therefore, in the LED bulb 100, regardless of the number of the LED packages 40, each LED package assembly 110 only requires one lead-in wire 140 connected to the first external electrode 121 and the second external electrode 122, respectively. Therefore, even if the number of the LED packages 40 increases, the LED bulb 100 according to the embodiment of the present invention does not require additional lead-in wires 140, and is therefore advantageous in terms of cost.
以后，在针对其他实施例的说明中将省略与第一实施例相同的结构或者重复的说明。省略的内容可以参考图1至图7的说明。Hereinafter, in the description of other embodiments, the same structures as those of the first embodiment or repeated descriptions will be omitted. The omitted contents can refer to the descriptions of FIG. 1 to FIG. 7 .
图8至图10是示出根据本发明的第二实施例的发光二极管封装件组件的制造方法和根据其的发光二极管封装件组件的示例图。8 to 10 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a second embodiment of the present invention and a light emitting diode package assembly therefor.
参照图8，在导线框架10安装有多个发光二极管封装件40。此时，发光二极管封装件40在导线框架10布置为，电极位置在每两个发光二极管封装件40相反。例如，相邻的两个发光二极管封装件40布置为阳极电极和阴极电极的位置相同。并且，并排布置在它们的一侧的两个发光二极管封装件40布置为阳极电极和阴极电极的位置与它们相反。为了便于说明，将在图8至图10中布置在导线框架10的多个发光二极管封装件40按顺序区分为第一发光二极管封装件41至第八发光二极管封装件48而进行说明。8 , a plurality of light emitting diode packages 40 are mounted on the lead frame 10. At this time, the light emitting diode packages 40 are arranged on the lead frame 10 so that the electrode positions are opposite between every two light emitting diode packages 40. For example, two adjacent light emitting diode packages 40 are arranged so that the positions of the anode electrode and the cathode electrode are the same. Also, two light emitting diode packages 40 arranged side by side on one side thereof are arranged so that the positions of the anode electrode and the cathode electrode are opposite to them. For ease of explanation, the plurality of light emitting diode packages 40 arranged on the lead frame 10 in FIGS. 8 to 10 are sequentially divided into the first light emitting diode package 41 to the eighth light emitting diode package 48 for explanation.
在本发明的实施例中，切割线C形成为使两个发光二极管封装件组件210彼此错开地分离。例如，切割线C形成在第四发光二极管封装件44和第五发光二极管封装件45的连接导线11，以使第四发光二极管封装件44和第五发光二极管封装件45彼此分离。In the embodiment of the present invention, the cutting line C is formed to separate the two LED package assemblies 210 from each other in a staggered manner. For example, the cutting line C is formed at the connecting wires 11 of the fourth LED package 44 and the fifth LED package 45 to separate the fourth LED package 44 and the fifth LED package 45 from each other.
并且，切割线C形成在第三发光二极管封装件43的第一电极垫13和第四发光二极管封装件44的第一电极垫13之间和第七发光二极管封装件47的第一电极垫13和第八发光二极管封装件48的第一电极垫13之间的连接导线11。Also, the cutting line C forms the connecting wires 11 between the first electrode pads 13 of the third and fourth LED packages 43 and 44 and between the first electrode pads 13 of the seventh and eighth LED packages 47 and 48 .
并且，切割线C形成在第一发光二极管封装件41的第一电极垫13和第二发光二极管封装件42的第一电极垫13之间和第五发光二极管封装件45的第一电极垫13和第六发光二极管封装件46的第一电极垫13之间的连接导线11。Also, the cutting line C forms the connecting wires 11 between the first electrode pads 13 of the first LED package 41 and the second LED package 42 and between the first electrode pads 13 of the fifth LED package 45 and the sixth LED package 46 .
并且，切割线C形成为使第一发光二极管封装件41、第五发光二极管封装件45、第四发光二极管封装件44和第八发光二极管封装件48的第一电极垫13从连接导线11分离。Also, the cutting lines C are formed to separate the first electrode pads 13 of the first LED package 41 , the fifth LED package 45 , the fourth LED package 44 , and the eighth LED package 48 from the connection wires 11 .
并且，切割线C形成为使第二发光二极管封装件42、第三发光二极管封装件43、第六发光二极管封装件46以及第七发光二极管封装件47的第二电极垫14与连接导线11分离。Also, the cutting lines C are formed to separate the second electrode pads 14 of the second LED package 42 , the third LED package 43 , the sixth LED package 46 , and the seventh LED package 47 from the connection wires 11 .
如果沿图8的切割线C执行切割工艺，则如图9所示，发光二极管封装件组件210从导线框架10分离。此时，在分离的发光二极管封装件组件210中，两个发光二极管封装件40通过连接导线11而串联连接。并且，发光二极管封装件组件210不是由相邻的发光二极管封装件40构成的，而是由两个奇数位排列的发光二极管封装件40或者两个偶数位排列的发光二极管封装件40构成。因此，两个发光二极管封装件40之间的间距会比第一实施例长。If the cutting process is performed along the cutting line C of FIG. 8 , as shown in FIG. 9 , the LED package assembly 210 is separated from the lead frame 10. At this time, in the separated LED package assembly 210, the two LED packages 40 are connected in series through the connecting wire 11. In addition, the LED package assembly 210 is not composed of adjacent LED packages 40, but is composed of two LED packages 40 arranged in odd positions or two LED packages 40 arranged in even positions. Therefore, the spacing between the two LED packages 40 will be longer than that of the first embodiment.
并且，本发明的实施例中，在导线框架10形成有弯曲部50。弯曲部50为了将连接导线11和电极垫12以预定角度弯曲而形成。Furthermore, in the embodiment of the present invention, a bent portion 50 is formed on the lead frame 10. The bent portion 50 is formed to bend the connection lead 11 and the electrode pad 12 at a predetermined angle.
弯曲部50只要可以弯曲连接导线11和电极垫12，则可以以任意形态和方法形成。例如，弯曲部50可以通过将连接导线11和电极垫12的一部分进行半蚀刻(half etching)而形成。或者，弯曲部50可以形成为包括贯通连接导线11和电极垫12的一部分的至少一个贯通孔。或者，弯曲部50可以由将连接导线11和电极垫12的一部分用尖锐的物体加压的压痕形成。The bent portion 50 may be formed in any form and by any method as long as it can bend the connecting wire 11 and the electrode pad 12. For example, the bent portion 50 may be formed by half etching a portion of the connecting wire 11 and the electrode pad 12. Alternatively, the bent portion 50 may be formed to include at least one through hole that penetrates a portion of the connecting wire 11 and the electrode pad 12. Alternatively, the bent portion 50 may be formed by an indentation formed by pressing a portion of the connecting wire 11 and the electrode pad 12 with a sharp object.
弯曲部50包括形成在连接导线11的第一弯曲部51和形成在与连接导线11连接的电极垫12的第二弯曲部52。第一弯曲部51可以在连接导线11上形成在电极垫12之间，并且沿发光二极管封装件40的长度方向形成。即，第一弯曲部51以垂直于连接导线11的长轴方向弯曲的方式形成。并且，第二弯曲部52在电极垫12上沿发光二极管封装件40的宽度方向形成。即，第二弯曲部52以垂直于电极垫12的长轴方向弯曲的方式形成。在此，发光二极管封装件40的长度是形成有第一电极垫13和第二电极垫14的两侧面之间的距离。并且，发光二极管封装件40的宽度在第一电极垫13和第二电极垫14之间的发光二极管封装件40的两侧面之间的距离。因此，发光二极管封装件40的长度方向是与发光二极管封装件40的长度平行的直线方向，发光二极管封装件40的宽度方向是与发光二极管封装件40的宽度平行的直线方向。The bent portion 50 includes a first bent portion 51 formed on the connecting wire 11 and a second bent portion 52 formed on the electrode pad 12 connected to the connecting wire 11. The first bent portion 51 can be formed between the electrode pads 12 on the connecting wire 11 and formed along the length direction of the light-emitting diode package 40. That is, the first bent portion 51 is formed in a manner of bending perpendicular to the long axis direction of the connecting wire 11. And, the second bent portion 52 is formed on the electrode pad 12 along the width direction of the light-emitting diode package 40. That is, the second bent portion 52 is formed in a manner of bending perpendicular to the long axis direction of the electrode pad 12. Here, the length of the light-emitting diode package 40 is the distance between the two side surfaces where the first electrode pad 13 and the second electrode pad 14 are formed. And, the width of the light-emitting diode package 40 is the distance between the two side surfaces of the light-emitting diode package 40 between the first electrode pad 13 and the second electrode pad 14. Therefore, the length direction of the LED package 40 is a linear direction parallel to the length of the LED package 40 , and the width direction of the LED package 40 is a linear direction parallel to the width of the LED package 40 .
参照图10，发光二极管封装件组件210中，可以通过第一弯曲部51而使连接导线11在两个发光二极管封装件40之间左右弯曲。由于以第一弯曲部51为基准，连接导线11左右弯曲，因此可以改变两个发光二极管封装件40的位置或者光所朝向的侧面方向。因此，第一发光二极管封装件41和第二发光二极管封装件42可以向彼此不同的侧面方向发光。在此，发光二极管封装件40发光的方向是发光二极管封装件40的基板31的安装面所朝向的方向。即，可以通过第一弯曲部51而使安装有第一发光二极管封装件41和第二发光二极管封装件42的发光二极管芯片33的基板31的安装面朝向彼此不同的侧面方向。在此，侧面方向是发光二极管封装件40的宽度方向。在本发明的实施例中，连接导线11可以通过弯曲使第一发光二极管封装件41和第二发光二极管封装件42的基板31的安装面彼此接近。10 , in the LED package assembly 210 , the connecting wire 11 can be bent left and right between the two LED packages 40 by the first bending portion 51 . Since the connecting wire 11 is bent left and right based on the first bending portion 51 , the positions of the two LED packages 40 or the lateral direction to which the light is directed can be changed. Therefore, the first LED package 41 and the second LED package 42 can emit light in different lateral directions from each other. Here, the direction in which the LED package 40 emits light is the direction in which the mounting surface of the substrate 31 of the LED package 40 is directed. That is, the mounting surface of the substrate 31 on which the LED chips 33 of the first LED package 41 and the second LED package 42 are mounted can be directed to different lateral directions from each other by the first bending portion 51 . Here, the lateral direction is the width direction of the LED package 40 . In the embodiment of the present invention, the connecting wire 11 can be bent so that the mounting surfaces of the substrate 31 of the first LED package 41 and the second LED package 42 are close to each other.
并且，在发光二极管封装件组件210中可以通过第二弯曲部52而使电极垫12向上部方向或者下部方向弯曲。由于电极垫12因第二弯曲部52而向上部方向或者下部方向弯曲，可以改变发光二极管封装件40的基板31的安装面所朝向的上下方向。因此，第一发光二极管封装件41可以向上部方向发出更多的光，第二发光二极管封装件42可以向下部方向发出更多的光。Furthermore, in the LED package assembly 210, the electrode pad 12 can be bent in the upward direction or the downward direction by the second bent portion 52. Since the electrode pad 12 is bent in the upward direction or the downward direction by the second bent portion 52, the upward and downward directions to which the mounting surface of the substrate 31 of the LED package 40 faces can be changed. Therefore, the first LED package 41 can emit more light in the upward direction, and the second LED package 42 can emit more light in the downward direction.
通过这种第一弯曲部51和第二弯曲部52，可以将连接导线11和电极垫12弯曲而使两个发光二极管封装件40向彼此不同的方向发光。因此，发光二极管封装件组件210可以将光分散而使光向上下部方向发出，而不是使光仅在侧面方向集中发出。The first bent portion 51 and the second bent portion 52 can be used to bend the connecting wire 11 and the electrode pad 12 so that the two LED packages 40 emit light in different directions. Therefore, the LED package assembly 210 can disperse light and emit light in the upper and lower directions instead of emitting light only in the side direction.
在本实施例中，为了便于说明，将发光二极管封装件40的基板31的安装面所朝向的方向表述为发光二极管封装件40发光的方向或者发光二极管封装件40所朝向的方向。然而，这种表述仅是为了便于说明，并不是将本发明的发光二极管封装件40限定为仅在一面发光。本发明的发光二极管封装件40在基板31是透光性基板的情形下向全方向发光，这对本领域技术人员是显然的。以后，在其他实施例中也将使用相同的表述。In this embodiment, for the sake of convenience, the direction in which the mounting surface of the substrate 31 of the LED package 40 faces is expressed as the direction in which the LED package 40 emits light or the direction in which the LED package 40 faces. However, this expression is only for the sake of convenience, and does not limit the LED package 40 of the present invention to emitting light only on one side. It is obvious to those skilled in the art that the LED package 40 of the present invention emits light in all directions when the substrate 31 is a light-transmitting substrate. The same expression will be used in other embodiments later.
图11是示出根据本发明的第二实施例的发光二极管灯泡的示例图。FIG. 11 is an exemplary diagram showing a light emitting diode bulb according to a second embodiment of the present invention.
根据第二实施例的发光二极管灯泡200包括两个根据第二实施例的发光二极管封装件组件210。The LED bulb 200 according to the second embodiment includes two LED package assemblies 210 according to the second embodiment.
发光二极管封装件组件210由于连接导线11的下表面粘结到支撑台130的上表面而竖立在透光性盖体150的内部。此时，构成发光二极管封装件组件210的第一发光二极管封装件41和第二发光二极管封装件42布置为通过连接导线11弯曲而朝向彼此不同的侧面方向。并且，由于电极垫12弯曲，第一发光二极管封装件41布置为朝向上部方向，第二发光二极管封装件42布置为朝向下部方向。The LED package assembly 210 is erected inside the translucent cover 150 because the lower surface of the connecting wire 11 is bonded to the upper surface of the support 130. At this time, the first LED package 41 and the second LED package 42 constituting the LED package assembly 210 are arranged to face different lateral directions from each other by bending the connecting wire 11. In addition, because the electrode pad 12 is bent, the first LED package 41 is arranged to face the upper direction, and the second LED package 42 is arranged to face the lower direction.
在发光二极管灯泡200中，这种两个发光二极管封装件组件210布置为彼此对向。结果，四个发光二极管封装件40可以布置为向彼此不同方向发光。因此，根据本发明的实施例的发光二极管灯泡200不仅可以向透光性盖体150的侧面方向发光，还可以向上部方向和下部方向均匀地发光。In the LED bulb 200, the two LED package assemblies 210 are arranged to face each other. As a result, the four LED packages 40 can be arranged to emit light in different directions from each other. Therefore, the LED bulb 200 according to the embodiment of the present invention can emit light not only in the side direction of the translucent cover 150, but also uniformly in the upper and lower directions.
图12是根据本发明的第二实施例的发光二极管封装件组件的示例图。FIG. 12 is an exemplary diagram of a light emitting diode package assembly according to a second embodiment of the present invention.
参考图12，根据第二实施例，发光二极管封装件组件210具有第一发光二极管封装件41和第二发光二极管封装件42彼此朝向不同的侧面方向的结构。此时，可以按使第一发光二极管封装件41和第二发光二极管封装件42各自的基板31的安装面彼此接近的方式，连接导线11在第一弯曲部51弯曲。12, according to the second embodiment, the LED package assembly 210 has a structure in which the first LED package 41 and the second LED package 42 face different lateral directions. At this time, the connection wire 11 can be bent at the first bent portion 51 in such a manner that the mounting surfaces of the substrates 31 of the first LED package 41 and the second LED package 42 are close to each other.
并且，发光二极管封装件组件210具有按使第一发光二极管封装件41和第二发光二极管封装件42均朝向上部方向的方式使与连接导线11连接的电极垫12弯曲的结构。Also, the LED package assembly 210 has a structure in which the electrode pad 12 connected to the connection wire 11 is bent so that both the first LED package 41 and the second LED package 42 face upward.
这种结构的发光二极管封装件组件210被应用到如图11的发光二极管灯泡200时，不仅可以向透光性盖体150的侧面发光，还可以向上部方向发光。When the LED package assembly 210 of this structure is applied to the LED bulb 200 as shown in FIG. 11 , it can emit light not only toward the side of the translucent cover 150 but also toward the upper direction.
图13是示出根据本发明的第二实施例的发光二极管封装件组件的又一实施例。FIG. 13 is a diagram showing still another embodiment of the light emitting diode package assembly according to the second embodiment of the present invention.
参考图13，根据第二实施例的发光二极管封装件组件210中，可按使第一发光二极管封装件41和第二发光二极管封装件42朝向彼此不同的侧面方向的方式，连接导线11在第一弯曲部51弯曲。此时，可按使第一发光二极管封装件41和第二发光二极管封装件42各自的基板31的安装面彼此远离的方式，连接导线11弯曲。13, in the LED package assembly 210 according to the second embodiment, the connection wire 11 may be bent at the first bending portion 51 in such a manner that the first LED package 41 and the second LED package 42 face different lateral directions. At this time, the connection wire 11 may be bent in such a manner that the mounting surfaces of the substrates 31 of the first LED package 41 and the second LED package 42 are separated from each other.
并且，发光二极管封装件组件210中，可按使第一发光二极管封装件41和第二发光二极管封装件42的基板31的安装面朝向上部方向的方式，电极垫12在第二弯曲部52弯曲。在这种情形下，可以向发光二极管封装件组件210的侧面方向和上部方向发出更多的光。Furthermore, in the LED package assembly 210, the electrode pad 12 may be bent at the second bent portion 52 in such a manner that the mounting surfaces of the substrates 31 of the first LED package 41 and the second LED package 42 face upward. In this case, more light may be emitted toward the side and upper directions of the LED package assembly 210.
图14是示出根据本发明的第三实施例的发光二极管灯泡的示例图。FIG. 14 is an exemplary diagram showing a light emitting diode bulb according to a third embodiment of the present invention.
在发光二极管灯泡300应用有图13的发光二极管封装件组件210。The LED bulb 300 is applied with the LED package assembly 210 shown in FIG. 13 .
两个发光二极管封装件组件210通过将连接导线11的后表面粘结到支撑台130的上部，从而竖立在透光性盖体150内部。在此，连接导线11的后表面是连接导线11在如图13地从第一弯曲部51弯曲时，彼此接近的一表面。并且，在两个发光二极管封装件组件210粘结在支撑台时，各个发光二极管封装件组件210的连接导线11布置为后表面彼此相向。The two LED package assemblies 210 are erected inside the light-transmitting cover 150 by bonding the rear surfaces of the connecting wires 11 to the upper portion of the support 130. Here, the rear surfaces of the connecting wires 11 are surfaces that are close to each other when the connecting wires 11 are bent from the first bent portion 51 as shown in FIG13. And, when the two LED package assemblies 210 are bonded to the support, the connecting wires 11 of the respective LED package assemblies 210 are arranged so that the rear surfaces face each other.
这种发光二极管封装件组件210的布置由于连接导线11与支撑台130的上部接触的面积大，因此发光二极管封装件组件210可以稳定地固定在支撑台130。In such an arrangement of the LED package assembly 210 , the LED package assembly 210 can be stably fixed on the support platform 130 because the contact area between the connecting wire 11 and the upper portion of the support platform 130 is large.
并且，根据本发明的实施例，发光二极管灯泡300的支撑台130的上部可以具有大的周长。支撑台130的上部的周长具有在两个发光二极管封装件组件210粘结到支撑台130上部时，可以使各个连接导线11或者各个发光二极管封装件组件210彼此不接触的程度的尺寸。Furthermore, according to an embodiment of the present invention, the upper portion of the support platform 130 of the LED bulb 300 may have a large circumference. The circumference of the upper portion of the support platform 130 has a size such that when two LED package assemblies 210 are bonded to the upper portion of the support platform 130, the respective connection wires 11 or the respective LED package assemblies 210 do not contact each other.
因此，可以提高发光二极管封装件组件210和支撑台130之间的接触面积，从而使发光二极管封装件组件210更稳定地固定在支撑台130。Therefore, the contact area between the LED package assembly 210 and the support table 130 can be increased, so that the LED package assembly 210 can be more stably fixed to the support table 130 .
并且，由于两个发光二极管封装件组件210不彼此接触，因此彼此绝缘。因此，可以省略用于使两个发光二极管封装件组件210之间绝缘的额外的绝缘物质。Also, since the two LED package assemblies 210 are not in contact with each other, they are insulated from each other. Therefore, an additional insulating material for insulating the two LED package assemblies 210 can be omitted.
通过根据第二实施例的发光二极管封装件组件210的多种实施例，说明了可以通过弯曲部50调节各个发光二极管封装件40的发光方向。更进一步，确认了可以通过弯曲部50而调节从发光二极管封装件组件210和发光二极管灯泡200、300发出的光的方向、范围、分布等。Through various embodiments of the LED package assembly 210 according to the second embodiment, it is explained that the light emitting direction of each LED package 40 can be adjusted by the bent portion 50. Furthermore, it is confirmed that the direction, range, distribution, etc. of the light emitted from the LED package assembly 210 and the LED bulbs 200 and 300 can be adjusted by the bent portion 50.
图15和图16是根据本发明的第三实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。15 and 16 are exemplary views of a method for manufacturing a light emitting diode package assembly according to a third embodiment of the present invention and a light emitting diode package assembly according to the same.
参照图15，在导线框架10布置有多个发光二极管封装件40。多个发光二极管封装件40布置为与相邻的发光二极管封装件40的阳极电极和阴极电极的位置相反。15 , a plurality of light emitting diode packages 40 are arranged on a lead frame 10. The plurality of light emitting diode packages 40 are arranged such that positions of anode electrodes and cathode electrodes of adjacent light emitting diode packages 40 are opposite.
例如，在图15中，布置在奇数位的发光二极管封装件40可布置为在导线框架10的一侧方向布置有阴极电极，而在另一侧方向布置有阳极电极。并且，布置在偶数位的发光二极管封装件40可布置为在导线框架10的一侧方向布置有阳极电极，而在另一侧方向布置有阴极电极。For example, in Fig. 15, the LED packages 40 arranged at odd positions may be arranged with cathode electrodes arranged in one direction of the lead frame 10 and anode electrodes arranged in the other direction. Also, the LED packages 40 arranged at even positions may be arranged with anode electrodes arranged in one direction of the lead frame 10 and cathode electrodes arranged in the other direction.
在本发明的实施例中，并排布置的4个发光二极管封装件40成为一个发光二极管封装件组件310。因此，切割线C形成为每四个发光二极管封装件40，导线框架10的一侧和另一侧被切割。并且，切割线C形成为以一个发光二极管封装件组件310为基准而切割第二发光二极管封装件42和第三发光二极管封装件43之间的导线框架10的一侧。并且，切割线C形成为切割第一发光二极管封装件41和第二发光二极管封装件42之间和第三发光二极管封装件43和第四发光二极管封装件44之间的导线框架10的另一侧。并且，切割线C形成为使第一发光二极管封装件41和第四发光二极管封装件44的第一电极垫13与导线框架10分离。In the embodiment of the present invention, four LED packages 40 arranged side by side become one LED package assembly 310. Therefore, the cutting line C is formed so that one side and the other side of the lead frame 10 are cut for every four LED packages 40. Also, the cutting line C is formed so that one side of the lead frame 10 between the second LED package 42 and the third LED package 43 is cut with one LED package assembly 310 as a reference. Also, the cutting line C is formed so that the other side of the lead frame 10 between the first LED package 41 and the second LED package 42 and between the third LED package 43 and the fourth LED package 44 is cut. Also, the cutting line C is formed so that the first electrode pads 13 of the first LED package 41 and the fourth LED package 44 are separated from the lead frame 10.
并且，在本发明的实施例中，在第二发光二极管封装件42和第三发光二极管封装件43之间的导线框架10的一侧形成有第一弯曲部51。并且，在第一发光二极管封装件41和第二发光二极管封装件42之间和第三发光二极管封装件43和第四发光二极管封装件44之间的导线框架10的另一侧形成有第一弯曲部51。如果根据这种切割线C执行切割工艺，则会形成如图16所示的根据第三实施例的发光二极管封装件组件310。在发光二极管封装件组件310中，第一发光二极管封装件41的第二电极垫14和第二发光二极管封装件42的第一电极垫13由连接导线11连接。因此，第一发光二极管封装件41和第二发光二极管封装件42串联连接。Furthermore, in an embodiment of the present invention, a first bent portion 51 is formed on one side of the lead frame 10 between the second light-emitting diode package 42 and the third light-emitting diode package 43. Furthermore, a first bent portion 51 is formed on the other side of the lead frame 10 between the first light-emitting diode package 41 and the second light-emitting diode package 42 and between the third light-emitting diode package 43 and the fourth light-emitting diode package 44. If the cutting process is performed according to such a cutting line C, a light-emitting diode package assembly 310 according to the third embodiment as shown in FIG. 16 is formed. In the light-emitting diode package assembly 310, the second electrode pad 14 of the first light-emitting diode package 41 and the first electrode pad 13 of the second light-emitting diode package 42 are connected by the connecting wire 11. Therefore, the first light-emitting diode package 41 and the second light-emitting diode package 42 are connected in series.
并且，第二发光二极管封装件42的第二电极垫14和第三发光二极管封装件43的第一电极垫13由连接导线11连接。因此，第二发光二极管封装件42和第三发光二极管封装件43串联连接。Also, the second electrode pad 14 of the second light emitting diode package 42 and the first electrode pad 13 of the third light emitting diode package 43 are connected by the connection wire 11. Therefore, the second light emitting diode package 42 and the third light emitting diode package 43 are connected in series.
并且，第三发光二极管封装件43的第二电极垫14和第四发光二极管封装件44的第一电极垫13由连接导线11连接。因此，第三发光二极管封装件43和第四发光二极管封装件44串联连接。Also, the second electrode pad 14 of the third LED package 43 and the first electrode pad 13 of the fourth LED package 44 are connected by the connection wire 11. Therefore, the third LED package 43 and the fourth LED package 44 are connected in series.
因此，发光二极管封装件组件310的第一发光二极管封装件41至第四发光二极管封装件44串联连接。Therefore, the first to fourth LED packages 41 to 44 of the LED package assembly 310 are connected in series.
图17和图18是示出根据本发明的第四实施例和第五实施例的发光二极管灯泡的示例图。17 and 18 are exemplary views showing a light emitting diode bulb according to a fourth embodiment and a fifth embodiment of the present invention.
根据第四实施例和第五实施例的发光二极管灯泡400、500包括根据第三实施例的发光二极管封装件组件310。The LED bulbs 400 and 500 according to the fourth and fifth embodiments include the LED package assembly 310 according to the third embodiment.
发光二极管封装件组件310中，通过第一弯曲部51而使连接导线11弯曲，从而四个发光二极管封装件40布置为四棱柱形态。如果发光二极管封装件组件310包括的发光二极管封装件40的数量改变，则发光二极管封装件40可以布置为其他多棱柱形态。In the LED package assembly 310, the connecting wire 11 is bent by the first bending portion 51, so that the four LED packages 40 are arranged in a quadrangular prism shape. If the number of LED packages 40 included in the LED package assembly 310 is changed, the LED packages 40 can be arranged in other polygonal prism shapes.
可以通过这种结构的发光二极管封装件组件310而使发光二极管灯泡400、500向所有侧面方向均匀地发光。The LED package assembly 310 of this structure can make the LED bulbs 400 and 500 emit light uniformly in all side directions.
在发光二极管封装件组件310中没有与连接导线11连接的第一电极垫13通过导入线140而与基础部120的第一外部电极121连接。并且，在发光二极管封装件组件310中没有与连接导线11连接的第二电极垫14可以通过导入线140而与基础部120的第二外部电极122连接。与导入线140连接的第一电极垫13和第二电极垫14位于发光二极管封装件组件310的下部。The first electrode pad 13 not connected to the connection wire 11 in the light emitting diode package assembly 310 is connected to the first external electrode 121 of the base part 120 through the lead-in wire 140. Also, the second electrode pad 14 not connected to the connection wire 11 in the light emitting diode package assembly 310 may be connected to the second external electrode 122 of the base part 120 through the lead-in wire 140. The first electrode pad 13 and the second electrode pad 14 connected to the lead-in wire 140 are located at the lower part of the light emitting diode package assembly 310.
参考图17，根据第四实施例的发光二极管灯泡400中，发光二极管封装件组件310通过导入线140而竖立在透光性盖体150内部。第一发光二极管封装件41至第四发光二极管封装件44通过发光二极管封装件组件310的位于上部的连接导线11和位于下部的连接导线11而彼此支撑。此时，导入线140可以形成为具有能够支撑发光二极管封装件组件310的强度。可以通过这种发光二极管封装件组件310的结构和导入线140，发光二极管封装件组件310即使没有支撑台130的柱形态的上部也可以竖立在透光性盖体150的内部而被固定。Referring to FIG. 17 , in the LED bulb 400 according to the fourth embodiment, the LED package assembly 310 is erected inside the translucent cover 150 through the lead-in wire 140. The first to fourth LED packages 41 to 44 are supported by each other through the upper connecting wire 11 and the lower connecting wire 11 of the LED package assembly 310. At this time, the lead-in wire 140 can be formed to have a strength capable of supporting the LED package assembly 310. Through such a structure of the LED package assembly 310 and the lead-in wire 140, the LED package assembly 310 can be erected inside the translucent cover 150 and fixed even without the column-shaped upper portion of the support platform 130.
参考图18，在根据第五实施例的发光二极管灯泡500中，发光二极管封装件组件310粘结在支撑台130而竖立在透光性盖体150内部。发光二极管封装件组件310的位于上部的连接导线11通过粘结剂而粘结在支撑台130的上部。18 , in the LED bulb 500 according to the fifth embodiment, the LED package assembly 310 is bonded to the support 130 and stands upright inside the light-transmitting cover 150. The connecting wire 11 located at the upper portion of the LED package assembly 310 is bonded to the upper portion of the support 130 by an adhesive.
并且，发光二极管灯泡500可以如第四实施例一样使用导入线140而支撑发光二极管封装件组件310的下部。在这种情形下，发光二极管封装件组件310的上部通过支撑台130而被固定，下部通过导入线140而被支撑，因此可以更加坚固地固定在透光性盖体150内部。In addition, the LED bulb 500 can support the lower part of the LED package assembly 310 by using the lead-in wire 140 as in the fourth embodiment. In this case, the upper part of the LED package assembly 310 is fixed by the support platform 130, and the lower part is supported by the lead-in wire 140, so that it can be fixed more firmly inside the translucent cover 150.
图19和图20是示出根据本发明的第四实施例的发光二极管封装件组件的制造方法和根据其的发光二极管封装件组件的示例图。19 and 20 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a fourth embodiment of the present invention and a light emitting diode package assembly according thereto.
参照图19，在导线框架10安装有多个发光二极管封装件40。19 , a plurality of light emitting diode packages 40 are mounted on a lead frame 10 .
导线框架10包括布置有多个发光二极管封装件40的两个内部空间15，并且两个内部空间15是共享形成在它们之间的连接导线11的结构。电极垫12分别与在两个内部空间15之间形成的连接导线11和与该连接导线11的一侧和另一侧相对的连接导线11一体地形成。The lead frame 10 includes two inner spaces 15 in which a plurality of light emitting diode packages 40 are arranged, and the two inner spaces 15 are structures that share a connection wire 11 formed therebetween. The electrode pads 12 are formed integrally with the connection wire 11 formed between the two inner spaces 15 and the connection wires 11 opposite to one side and the other side of the connection wire 11, respectively.
多个发光二极管封装件40并排地布置在两个内部空间15。将布置在一个内部空间15的发光二极管封装件40区分为第一发光二极管封装件41，将布置在另一内部空间15的发光二极管封装件40区分为第二发光二极管封装件42而进行说明。多个发光二极管封装件40布置为阳极电极和阴极电极均朝向相同的方向。A plurality of LED packages 40 are arranged side by side in two internal spaces 15. The LED packages 40 arranged in one internal space 15 are classified as first LED packages 41, and the LED packages 40 arranged in the other internal space 15 are classified as second LED packages 42. The plurality of LED packages 40 are arranged such that the anode electrodes and the cathode electrodes face the same direction.
切割线C形成为使第一发光二极管封装件41和第二发光二极管封装件42的电极垫12与导线框架10的两侧分离。并且，切割线C形成为在一个内部空间15中发光二极管封装件40和相邻的发光二极管封装件40之间的连接导线11被切割。此时，通过两个内部空间15而并排布置的第一发光二极管封装件41和第二发光二极管封装件42通过位于两个内部空间15之间的连接导线11而连接。即，切割线C形成为，在相同列的第一发光二极管封装件41和第二发光二极管封装件42在相连的状态下与导线框架10分离。The cutting line C is formed so that the electrode pads 12 of the first LED package 41 and the second LED package 42 are separated from both sides of the lead frame 10. Also, the cutting line C is formed so that the connection wire 11 between the LED package 40 and the adjacent LED package 40 in one internal space 15 is cut. At this time, the first LED package 41 and the second LED package 42 arranged side by side through the two internal spaces 15 are connected by the connection wire 11 located between the two internal spaces 15. That is, the cutting line C is formed so that the first LED package 41 and the second LED package 42 in the same column are separated from the lead frame 10 in a connected state.
并且，两个内部空间15之间的连接导线11和电极垫12之间可以形成有第二弯曲部52。Furthermore, a second bent portion 52 may be formed between the connecting wire 11 and the electrode pad 12 between the two internal spaces 15 .
参考图20，示出了沿切割线C而进行切割工艺，从而与导线框架10分离的根据第四实施例的发光二极管封装件组件410。20 , there is shown a light emitting diode package assembly 410 according to the fourth embodiment which is subjected to a cutting process along a cutting line C and is separated from a lead frame 10 .
根据第四实施例的发光二极管封装件组件410中，第一发光二极管封装件41的第二电极垫14和第二发光二极管封装件42的第一电极垫13通过连接导线11而电连接。据此，根据第四实施例的发光二极管封装件组件410由串联连接并且布置为一列的第一发光二极管封装件41和第二发光二极管封装件42构成。In the light emitting diode package assembly 410 according to the fourth embodiment, the second electrode pad 14 of the first light emitting diode package 41 and the first electrode pad 13 of the second light emitting diode package 42 are electrically connected through the connecting wire 11. Accordingly, the light emitting diode package assembly 410 according to the fourth embodiment is composed of the first light emitting diode package 41 and the second light emitting diode package 42 connected in series and arranged in a row.
图21是示出根据本发明的第六实施例的发光二极管灯泡的示例图。FIG. 21 is an exemplary diagram showing a light emitting diode bulb according to a sixth embodiment of the present invention.
根据第六实施例的发光二极管灯泡600包括根据第四实施例的发光二极管封装件组件410。The LED bulb 600 according to the sixth embodiment includes the LED package assembly 410 according to the fourth embodiment.
发光二极管封装件组件410在与连接导线11的两侧相连的电极垫12分别形成有第二弯曲部52。在发光二极管封装件组件410中，电极垫12在各第二弯曲部52向下部方向弯曲。因此，发光二极管封装件组件410具有两个发光二极管封装件40朝向彼此相反的侧面方向的结构。The LED package assembly 410 has second bent portions 52 formed at the electrode pads 12 connected to both sides of the connection wire 11. In the LED package assembly 410, the electrode pads 12 are bent downward at each second bent portion 52. Therefore, the LED package assembly 410 has a structure in which two LED packages 40 face opposite lateral directions.
在本发明的实施例中，将发光二极管灯泡600包括的两个发光二极管封装件组件410区分为第一发光二极管封装件组件411和第二发光二极管封装件组件412进行说明。In the embodiment of the present invention, the two LED package assemblies 410 included in the LED bulb 600 are divided into a first LED package assembly 411 and a second LED package assembly 412 for description.
第一发光二极管封装件组件411的连接导线11位于支撑台130的上表面并且粘结在支撑台130的上表面。此时，在第一发光二极管封装件组件411的连接导线11和支撑台130之间存在绝缘性粘结剂610。如果第一发光二极管封装件组件411被粘结到支撑台130，则第一发光二极管封装件组件411的两个发光二极管封装件40布置为以支撑台130为基准而向彼此相反的侧面方向发光。The connection wire 11 of the first LED package assembly 411 is located on the upper surface of the support platform 130 and bonded to the upper surface of the support platform 130. At this time, an insulating adhesive 610 exists between the connection wire 11 of the first LED package assembly 411 and the support platform 130. If the first LED package assembly 411 is bonded to the support platform 130, the two LED packages 40 of the first LED package assembly 411 are arranged to emit light in opposite lateral directions to each other with the support platform 130 as a reference.
第二发光二极管封装件组件412的连接导线11位于支撑台130的上表面和第一发光二极管封装件组件411的连接导线11的上表面。此时，第二发光二极管封装件组件412布置为其连接导线11与第一发光二极管封装件组件411的连接导线11错开。第二发光二极管封装件组件412的连接导线11和第一发光二极管封装件组件411的连接导线11的上表面之间存在绝缘性粘结剂610。并且，在第二发光二极管封装件组件412的连接导线11和支撑台130的上表面之间也可以存在绝缘性粘结剂610。第二发光二极管封装件组件412的两个发光二极管封装件40布置为以支撑台130为基准而向彼此相反的侧面方向发光。The connecting wire 11 of the second LED package assembly 412 is located on the upper surface of the support platform 130 and the upper surface of the connecting wire 11 of the first LED package assembly 411. At this time, the second LED package assembly 412 is arranged so that its connecting wire 11 is staggered from the connecting wire 11 of the first LED package assembly 411. An insulating adhesive 610 exists between the upper surfaces of the connecting wire 11 of the second LED package assembly 412 and the connecting wire 11 of the first LED package assembly 411. In addition, an insulating adhesive 610 may also exist between the connecting wire 11 of the second LED package assembly 412 and the upper surface of the support platform 130. The two LED packages 40 of the second LED package assembly 412 are arranged to emit light in opposite lateral directions to each other with the support platform 130 as a reference.
并且，按使发光二极管封装件40不重叠的方式布置第一发光二极管封装件组件411和第二发光二极管封装件组件412。因此，发光二极管灯泡600会包括布置为朝向彼此不同的侧面方向的多个发光二极管封装件40，因此可以通过透光性盖体150的侧面均匀地发光。Furthermore, the first LED package assembly 411 and the second LED package assembly 412 are arranged so that the LED packages 40 do not overlap. Therefore, the LED bulb 600 includes a plurality of LED packages 40 arranged to face different lateral directions from each other, and thus can emit light uniformly through the side of the translucent cover 150.
并且，在发光二极管封装件组件410中可以对电极垫12弯曲的角度进行多种改变。例如，如图21所示，发光二极管封装件组件410可以具有发光二极管封装件40向上部方向倾斜的结构。因此，由于发光二极管灯泡600不仅可以向透光性盖体150的侧面发光，还可以向上部方向发光，最终，可以向透光性盖体150的侧面方向和上部方向均匀地发光。Furthermore, the angle at which the electrode pad 12 is bent can be varied in the LED package assembly 410. For example, as shown in FIG21 , the LED package assembly 410 can have a structure in which the LED package 40 is tilted upward. Therefore, since the LED bulb 600 can emit light not only to the side of the translucent cover 150 but also to the upper direction, it can evenly emit light to the side and upper directions of the translucent cover 150.
图22至图26是示出根据本发明的第七实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。22 to 26 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a seventh embodiment of the present invention and a light emitting diode package assembly according thereto.
根据本发明的实施例，多个发光二极管封装件40布置为与相邻的发光二极管封装件40具有相同的极性位置。即，多个发光二极管封装件40可以布置为所有发光二极管阵列32的阳极电极和阴极电极朝向相同方向。According to an embodiment of the present invention, the plurality of LED packages 40 are arranged to have the same polarity position as adjacent LED packages 40. That is, the plurality of LED packages 40 may be arranged so that the anode electrodes and cathode electrodes of all LED arrays 32 face the same direction.
参考图23，在多个发光二极管封装件40上布置有导线框架20。导线框架20可以具有在多个电极垫12连接导线11上向一侧或者另一侧突出的结构。导线框架20分别布置在发光二极管封装件40的一端和另一端。此时，基板31的两端的上表面将分别与电极垫12的下表面接触。Referring to FIG. 23 , a lead frame 20 is arranged on a plurality of light emitting diode packages 40. The lead frame 20 may have a structure protruding to one side or the other side on a plurality of electrode pads 12 connecting wires 11. The lead frame 20 is respectively arranged at one end and the other end of the light emitting diode package 40. At this time, the upper surfaces of both ends of the substrate 31 will contact the lower surfaces of the electrode pads 12, respectively.
电极垫12区分为第一电极垫13和第二电极垫14。第一电极垫13是阳极电极垫，第二电极垫14是阴极电极垫。即，第一电极垫13与发光二极管阵列32的阳极电极连接，第二电极垫14与发光二极管阵列32的阴极电极连接。The electrode pad 12 is divided into a first electrode pad 13 and a second electrode pad 14. The first electrode pad 13 is an anode electrode pad, and the second electrode pad 14 is a cathode electrode pad. That is, the first electrode pad 13 is connected to the anode electrode of the light-emitting diode array 32, and the second electrode pad 14 is connected to the cathode electrode of the light-emitting diode array 32.
在多个电极垫12中的至少一部分形成有标记(Mark)16。在本发明的实施例中，标记16形成在第一电极垫13。在多个发光二极管封装件40上布置导线框架20后，对发光二极管封装件40和导线框架20执行引线键合。各个发光二极管封装件40的阳极电极通过第一电极垫13和引线而电连接。并且，各个发光二极管封装件40的阴极电极通过第二电极垫14和引线而电连接。A mark 16 is formed on at least a portion of the plurality of electrode pads 12. In an embodiment of the present invention, the mark 16 is formed on the first electrode pad 13. After the lead frame 20 is arranged on the plurality of light-emitting diode packages 40, wire bonding is performed on the light-emitting diode packages 40 and the lead frame 20. The anode electrodes of the respective light-emitting diode packages 40 are electrically connected through the first electrode pad 13 and the lead wire. In addition, the cathode electrodes of the respective light-emitting diode packages 40 are electrically connected through the second electrode pad 14 and the lead wire.
参照图24，按围绕发光二极管阵列32的方式形成有波长变换部34。24 , a wavelength conversion portion 34 is formed to surround the light emitting diode array 32 .
图25示出了导线框架20的切割线C。切割线C是表示在执行切割工艺时，导线框架20被切割的部分的线。25 shows a cutting line C of the lead frame 20. The cutting line C is a line indicating a portion where the lead frame 20 is cut when a cutting process is performed.
为了便于说明，将布置在导线框架20的多个发光二极管封装件40按顺序区分为第一发光二极管封装件41至第六发光二极管封装件46而进行说明。For convenience of description, the plurality of LED packages 40 arranged on the lead frame 20 are sequentially divided into first to sixth LED packages 41 to 46 for description.
在本发明的实施例中，以三个发光二极管封装件40通过连接导线11而并联连接的方式形成切割线C。例如，切割线C以使第三发光二极管封装件43和第四发光二极管封装件44分离的方式形成在第三发光二极管封装件43和第四发光二极管封装件44之间的连接导线11。如果沿切割线C执行切割工艺，则至少一个发光二极管封装件组件710与导线框架20分离。In the embodiment of the present invention, the cutting line C is formed in such a manner that the three LED packages 40 are connected in parallel through the connecting wire 11. For example, the cutting line C forms the connecting wire 11 between the third LED package 43 and the fourth LED package 44 in such a manner that the third LED package 43 and the fourth LED package 44 are separated. If the cutting process is performed along the cutting line C, at least one LED package assembly 710 is separated from the lead frame 20.
图26是沿图25的切割线C执行切割工艺而与导线框架20分离的发光二极管封装件组件710。根据第七实施例的发光二极管封装件组件710具有三个发光二极管封装件40并联连接的结构。发光二极管封装件组件710包括三个发光二极管封装件40、连接导线11和电极垫12。在此，第一电极垫13和第二电极垫14与各自连接的连接导线11是一体型。FIG26 is a light emitting diode package assembly 710 separated from the lead frame 20 by performing a cutting process along the cutting line C of FIG25. The light emitting diode package assembly 710 according to the seventh embodiment has a structure in which three light emitting diode packages 40 are connected in parallel. The light emitting diode package assembly 710 includes three light emitting diode packages 40, connecting wires 11, and electrode pads 12. Here, the first electrode pad 13 and the second electrode pad 14 are integral with the connecting wires 11 connected to each other.
如果沿切割线C切割导线框架20，则如图26所示，第一发光二极管封装件41至第三发光二极管封装件43的第一电极垫13通过一个连接导线11而连接。并且，第一发光二极管封装件41至第三发光二极管封装件43的第二电极垫14通过另一连接导线11而连接。If the lead frame 20 is cut along the cutting line C, as shown in FIG26 , the first electrode pads 13 of the first to third LED packages 41 to 43 are connected by one connecting wire 11. Also, the second electrode pads 14 of the first to third LED packages 41 to 43 are connected by another connecting wire 11.
并且，在第四发光二极管封装件44至第六发光二极管封装件46中，第一电极垫13也都连接到一个连接导线11，并且第二电极垫14也都连接到另一连接导线11。Furthermore, in the fourth to sixth LED packages 44 to 46 , the first electrode pads 13 are also all connected to one connection wire 11 , and the second electrode pads 14 are also all connected to another connection wire 11 .
因此，形成三个发光二极管封装件40并联连接的结构的两个根据第七实施例的发光二极管封装件组件710。Therefore, two light emitting diode package assemblies 710 according to the seventh embodiment are formed in a structure in which three light emitting diode packages 40 are connected in parallel.
以往，将多个发光二极管封装件与多个导线框架单独分离。因此，为了将多个发光二极管封装件电连接，需要引线等构成部，该构成部需要被单独制造。Conventionally, a plurality of light emitting diode packages and a plurality of lead frames are separated individually. Therefore, in order to electrically connect a plurality of light emitting diode packages, components such as leads are required, and these components need to be manufactured separately.
然而，根据本发明的实施例，发光二极管封装件40不是分别与导线框架分离，而是利用导线框架彼此电连接。However, according to an embodiment of the present invention, the light emitting diode packages 40 are not respectively separated from the lead frame but are electrically connected to each other using the lead frame.
因此，在根据本发明的一实施例的发光二极管封装件组件710的制造方法中，可以省略制造用于发光二极管封装件40之间的连接的单独的构成部的工艺。并且，在发光二极管封装件组件710的制造方法中，可以利用单独制造的构成部而省略将发光二极管封装件40电连接的工艺。即，以往为了多个发光二极管封装件40之间的电连接而使用引线。然而，根据本发明的实施例，不需要用于电连接多个发光二极管封装件40的引线，并且不需要将引线连接到发光二极管封装件40的工艺。由于发光二极管封装件组件710的制造工艺被单纯化，制造时间和材料成本减少，最终还提供了利用发光二极管封装件组件710制造的灯泡的生产性。Therefore, in the manufacturing method of the LED package assembly 710 according to an embodiment of the present invention, the process of manufacturing a separate component for connecting the LED packages 40 can be omitted. Also, in the manufacturing method of the LED package assembly 710, the process of electrically connecting the LED packages 40 can be omitted by using the separately manufactured components. That is, in the past, leads were used for electrical connection between a plurality of LED packages 40. However, according to an embodiment of the present invention, leads are not required for electrically connecting a plurality of LED packages 40, and a process of connecting the leads to the LED packages 40 is not required. Since the manufacturing process of the LED package assembly 710 is simplified, the manufacturing time and material costs are reduced, and ultimately the productivity of the light bulb manufactured using the LED package assembly 710 is also improved.
以后，为了说明的便利，将两个发光二极管封装件组件710区分为第一发光二极管封装件组件711和第二发光二极管封装件组件712而进行说明。Hereinafter, for the convenience of description, the two LED package assemblies 710 are divided into a first LED package assembly 711 and a second LED package assembly 712 for description.
图27是示出根据本发明的第七实施例的发光二极管灯泡的示例图。FIG. 27 is an exemplary diagram showing a light emitting diode bulb according to a seventh embodiment of the present invention.
参考图27，根据第七实施例的发光二极管灯泡700包括基础部120、支撑台130、发光二极管封装件组件710、导入线140、透光性盖体150和连接部160。27 , the LED bulb 700 according to the seventh embodiment includes a base 120 , a support 130 , an LED package assembly 710 , a lead-in wire 140 , a light-transmitting cover 150 , and a connection portion 160 .
在透光性盖体150的内部布置有两个发光二极管封装件组件710。在此，两个发光二极管封装件组件710是根据第七实施例的第一发光二极管封装件组件711和第二发光二极管封装件组件712。Two LED package assemblies 710 are arranged inside the translucent cover 150. Here, the two LED package assemblies 710 are a first LED package assembly 711 and a second LED package assembly 712 according to the seventh embodiment.
第一发光二极管封装件组件711和第二发光二极管封装件组件712通过粘结在支撑台130而以发光二极管芯片33与透光性盖体150的内侧面相对的方式被竖立。并且，第一发光二极管封装件组件711和第二发光二极管封装件组件712可以布置为使电极朝向彼此不同的方向。例如，第一发光二极管封装件组件711可以布置为第二电极垫14朝向上部方向，第二发光二极管封装件组件712可以布置为第一电极垫13朝向上部方向。The first LED package assembly 711 and the second LED package assembly 712 are bonded to the support 130 so that the LED chip 33 is opposite to the inner side of the translucent cover 150. In addition, the first LED package assembly 711 and the second LED package assembly 712 can be arranged so that the electrodes face different directions from each other. For example, the first LED package assembly 711 can be arranged so that the second electrode pad 14 faces the upper direction, and the second LED package assembly 712 can be arranged so that the first electrode pad 13 faces the upper direction.
此时，在第一发光二极管封装件组件711和第二发光二极管封装件组件712中，朝向上部方向的各个连接导线11粘结在支撑台130的上部。并且，第一发光二极管封装件组件711和第二发光二极管封装件组件712可以布置为向彼此不同的方向发光。例如，第一发光二极管封装件组件711和第二发光二极管封装件组件712可以布置为彼此对向。并且，第一发光二极管封装件组件711和第二发光二极管封装件组件712可以通过导入线140而布置为略微向上部方向倾斜。因此，发光二极管灯泡700不仅可以向侧面发光，也可以向上部方向发光。At this time, in the first LED package assembly 711 and the second LED package assembly 712, each connecting wire 11 facing the upper direction is bonded to the upper part of the support platform 130. In addition, the first LED package assembly 711 and the second LED package assembly 712 can be arranged to emit light in different directions from each other. For example, the first LED package assembly 711 and the second LED package assembly 712 can be arranged to face each other. In addition, the first LED package assembly 711 and the second LED package assembly 712 can be arranged to be slightly inclined in the upper direction through the introduction line 140. Therefore, the LED bulb 700 can emit light not only to the side but also to the upper direction.
虽然在本发明中以两个发光二极管封装件组件710为示例进行说明，但发光二极管封装件组件710的数量并不限于此。发光二极管封装件组件710的数量可以改变，并且发光二极管封装件组件710的布置结构也可以根据发光二极管封装件组件710的数量而改变。Although two LED package assemblies 710 are used as an example in the present invention, the number of LED package assemblies 710 is not limited thereto. The number of LED package assemblies 710 may be changed, and the arrangement structure of the LED package assemblies 710 may also be changed according to the number of LED package assemblies 710.
连接部160将在第一发光二极管封装件组件711中与第二电极垫14连接的连接导线11和在第二发光二极管封装件组件712中与第一电极垫13连接的连接导线11电连接。因此，第一发光二极管封装件组件711和第二发光二极管封装件组件712电串联连接。The connection part 160 electrically connects the connection wire 11 connected to the second electrode pad 14 in the first LED package assembly 711 and the connection wire 11 connected to the first electrode pad 13 in the second LED package assembly 712. Therefore, the first LED package assembly 711 and the second LED package assembly 712 are electrically connected in series.
第一发光二极管封装件组件711的与第一电极垫13连接的连接导线11通过基础部120的第一外部电极121以及导入线140而与外部电源的正的电源连接。并且，第二发光二极管封装件组件712的与第二电极垫14连接的连接导线11通过基础部120的第二外部电极122和导入线140而与外部电源的负的电源连接。导入线140的至少一部分贯通支撑台130而将第一外部电极121和第一发光二极管封装件组件711相连且将第二外部电极122和第二发光二极管封装件组件712相连。因此，导入线140通过支撑台130而固定为不移动，并且可以得到保护。The connecting wire 11 connected to the first electrode pad 13 of the first LED package component 711 is connected to the positive power supply of the external power source through the first external electrode 121 of the base 120 and the lead-in wire 140. In addition, the connecting wire 11 connected to the second electrode pad 14 of the second LED package component 712 is connected to the negative power supply of the external power source through the second external electrode 122 of the base 120 and the lead-in wire 140. At least a portion of the lead-in wire 140 passes through the support 130 to connect the first external electrode 121 and the first LED package component 711 and the second external electrode 122 and the second LED package component 712. Therefore, the lead-in wire 140 is fixed by the support 130 so as not to move and can be protected.
并且，导入线140可以具有能够将发光二极管封装件组件710支撑为如下程度的强度，即，第一发光二极管封装件组件711和第二发光二极管封装件组件712以向上部方向倾斜地状态被固定。Also, the lead-in wire 140 may have a strength capable of supporting the LED package assembly 710 to such an extent that the first LED package assembly 711 and the second LED package assembly 712 are fixed in a state of being tilted upward.
根据本发明的一实施的发光二极管灯泡700可以通过根据第七实施例的发光二极管封装件组件710的结构、支撑台130、导入线140而向侧面方向和上部方向均匀地发光。The LED bulb 700 according to an embodiment of the present invention can emit light uniformly in the side direction and the upper direction through the structure of the LED package assembly 710 according to the seventh embodiment, the support platform 130, and the introduction wire 140.
以后，在针对其他实施例的说明中将省略与第七实施例相同的结构或者重复的说明。省略的内容可以参考图22至图27的说明。Hereinafter, the same structures as those of the seventh embodiment or repeated descriptions will be omitted in the descriptions of other embodiments. The omitted contents can refer to the descriptions of FIG. 22 to FIG. 27 .
图28和图29是示出根据本发明的第八实施例的发光二极管封装件组件的制造方法以及根据制造方法的发光二极管封装件组件的示例图。28 and 29 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to an eighth embodiment of the present invention and the light emitting diode package assembly according to the manufacturing method.
参照图28，排列的多个发光二极管封装件40与导线框架20连接。发光二极管封装件40和导线框架20的连接方法可以参考图22至图25。多个发光二极管封装件40布置为阳极电极和阴极电极的位置相同。28, the plurality of LED packages 40 are arranged and connected to the lead frame 20. The connection method of the LED package 40 and the lead frame 20 may refer to FIG22 to FIG25. The plurality of LED packages 40 are arranged so that the positions of the anode electrodes and the cathode electrodes are the same.
在本发明的实施例中，切割线C形成为使三个发光二极管封装件40通过连接导线11并联连接。例如，切割线C形成在第三发光二极管封装件43和第四发光二极管封装件44之间的连接导线11。并且，在各个发光二极管封装件40之间的连接导线11形成有第一弯曲部51。In the embodiment of the present invention, the cutting line C is formed so that the three LED packages 40 are connected in parallel through the connecting wire 11. For example, the cutting line C is formed in the connecting wire 11 between the third LED package 43 and the fourth LED package 44. In addition, the connecting wire 11 between the respective LED packages 40 is formed with a first bent portion 51.
第一弯曲部51在连接导线11形成在电极垫12之间，并且沿发光二极管封装件40的长度方向形成。即，第一弯曲部51以垂直于连接导线11的长轴方向弯曲的方式形成。在此，发光二极管封装件40的长度是形成有第一电极垫13和第二电极垫14的两侧面之间的距离。因此，发光二极管封装件40的长度方向是平行于发光二极管封装件40的长度的直线方向。The first bent portion 51 is formed between the connecting wire 11 and the electrode pad 12, and is formed along the length direction of the light emitting diode package 40. That is, the first bent portion 51 is formed in a manner of bending perpendicular to the long axis direction of the connecting wire 11. Here, the length of the light emitting diode package 40 is the distance between the two side surfaces where the first electrode pad 13 and the second electrode pad 14 are formed. Therefore, the length direction of the light emitting diode package 40 is a straight line direction parallel to the length of the light emitting diode package 40.
第一弯曲部51形成为将连接导线11按预定角度弯曲。只要可以弯曲连接导线11，则第一弯曲部51可以以任意形态和方法形成。例如，第一弯曲部51可以将连接导线11的一部分半蚀刻(half etching)而形成。或者，第一弯曲部51可以形成为贯通连接导线11的一部分的至少一个贯通孔。或者，第一弯曲部51可以形成为将连接导线11的一部分用尖锐的物体加压的压痕。The first bent portion 51 is formed to bend the connecting wire 11 at a predetermined angle. The first bent portion 51 may be formed in any form and method as long as the connecting wire 11 can be bent. For example, the first bent portion 51 may be formed by half etching a portion of the connecting wire 11. Alternatively, the first bent portion 51 may be formed as at least one through hole that penetrates a portion of the connecting wire 11. Alternatively, the first bent portion 51 may be formed as an indentation formed by pressing a portion of the connecting wire 11 with a sharp object.
参照图28，第一弯曲部51形成在各个发光二极管封装件40之间的连接导线11，且以使连接导线11左右弯曲的方式形成。28 , the first bent portion 51 is formed on the connection wire 11 between the light emitting diode packages 40 , and is formed in such a manner that the connection wire 11 is bent left and right.
沿切割线C切割导线框架20，则会形成两个发光二极管封装件组件810。Cutting the lead frame 20 along the cutting line C will form two LED package components 810 .
第一发光二极管封装件组件811具有第一发光二极管封装件41至第三发光二极管封装件43借助连接导线11而并联连接的结构。第一发光二极管封装件41至第三发光二极管封装件43的第一电极垫13全部连接到一个连接导线11，并且第二电极垫14连接到另一连接导线11。The first LED package assembly 811 has a structure in which the first to third LED packages 41 to 43 are connected in parallel by means of connecting wires 11. The first electrode pads 13 of the first to third LED packages 41 to 43 are all connected to one connecting wire 11, and the second electrode pads 14 are connected to another connecting wire 11.
并且，在第二发光二极管封装件组件812具有第四发光二极管封装件44至第六发光二极管封装件46借助连接导线11而并联连接的结构。第四发光二极管封装件44至第六发光二极管封装件46的第一电极垫13全部连接到一个连接导线11，并且第二电极垫14连接到另一连接导线11。Furthermore, the second LED package assembly 812 has a structure in which the fourth to sixth LED packages 44 to 46 are connected in parallel by means of the connecting wires 11. The first electrode pads 13 of the fourth to sixth LED packages 44 to 46 are all connected to one connecting wire 11, and the second electrode pads 14 are connected to another connecting wire 11.
如果将与导线框架20分离的两个发光二极管封装件组件810沿着连接导线11的第一弯曲部51弯曲，则成为图29所示的发光二极管封装件组件810。If the two light emitting diode package assemblies 810 separated from the lead frame 20 are bent along the first bent portion 51 of the connection wire 11 , the light emitting diode package assemblies 810 shown in FIG. 29 are obtained.
参照图29，沿第一弯曲部51弯曲连接导线11，则包括于一个发光二极管封装件组件810的三个发光二极管封装件40可以布置为朝向彼此不同的侧面方向。因此，各个发光二极管封装件40可以向彼此不同的侧面方向发光。在此，发光二极管封装件40发光的方向是在发光二极管封装件40中安装有发光二极管阵列32的基板31的安装面所朝向的方向。并且，侧面方向是发光二极管封装件40的宽度方向。发光二极管封装件40的宽度是第一电极垫13和第二电极垫14之间的发光二极管封装件40的两侧面之间的距离。因此，发光二极管封装件40的宽度方向是与发光二极管封装件40的宽度平行的直线方向。Referring to Figure 29, by bending the connecting wire 11 along the first bending portion 51, the three LED packages 40 included in the LED package assembly 810 can be arranged to face different lateral directions from each other. Therefore, each LED package 40 can emit light in different lateral directions from each other. Here, the direction in which the LED package 40 emits light is the direction in which the mounting surface of the substrate 31 on which the LED array 32 is mounted in the LED package 40 is facing. And, the lateral direction is the width direction of the LED package 40. The width of the LED package 40 is the distance between the two side surfaces of the LED package 40 between the first electrode pad 13 and the second electrode pad 14. Therefore, the width direction of the LED package 40 is a straight line direction parallel to the width of the LED package 40.
在根据本发明的第八实施例的发光二极管封装件组件810中，通过第一弯曲部51弯曲连接导线11，使得布置在两端的发光二极管封装件40的后表面彼此接近。在此，后表面是基板31的安装面的反面。In the LED package assembly 810 according to the eighth embodiment of the present invention, the connection wire 11 is bent by the first bending portion 51 so that the rear surfaces of the LED packages 40 arranged at both ends are close to each other. Here, the rear surface is the opposite side of the mounting surface of the substrate 31.
如此，在根据本发明的实施例的发光二极管封装件组件810中，可以通过第一弯曲部51使各个发光二极管封装件40以向彼此不同的侧面方向发光的方式形成。As such, in the LED package assembly 810 according to the embodiment of the present invention, the first bent portion 51 can be used to form each LED package 40 in a manner of emitting light in different lateral directions.
根据本发明的第八实施例的发光二极管封装件组件810具有按使布置在两端的发光二极管封装件40的后表面彼此接近的方式连接导线11弯曲的结构。然而，与此相反地，发光二极管封装件组件810也可以按使布置在两端的发光二极管封装件40的安装面彼此接近的方式连接导线11弯曲的结构。The LED package assembly 810 according to the eighth embodiment of the present invention has a structure in which the connection wires 11 are bent in such a manner that the rear surfaces of the LED packages 40 arranged at both ends are close to each other. However, on the contrary, the LED package assembly 810 may also have a structure in which the connection wires 11 are bent in such a manner that the mounting surfaces of the LED packages 40 arranged at both ends are close to each other.
图30是示出根据本发明的第八实施例的发光二极管灯泡的示例图。FIG. 30 is an exemplary diagram showing a light emitting diode bulb according to an eighth embodiment of the present invention.
参照图30，根据第八实施例的发光二极管灯泡800包括两个根据第八实施例的发光二极管封装件组件810。30 , a light emitting diode bulb 800 according to the eighth embodiment includes two light emitting diode package assemblies 810 according to the eighth embodiment.
第一发光二极管封装件组件811可以布置为使第二电极垫14朝向上部方向，第二发光二极管封装件组件812可以布置为使第一电极垫13朝向上部方向。The first light emitting diode package assembly 811 may be arranged so that the second electrode pad 14 faces the upper direction, and the second light emitting diode package assembly 812 may be arranged so that the first electrode pad 13 faces the upper direction.
此时，在第一发光二极管封装件组件811和第二发光二极管封装件组件812中，朝向上部方向的各个连接导线11粘结到支撑台130的上部。At this time, in the first light emitting diode package assembly 811 and the second light emitting diode package assembly 812 , each connection wire 11 directed toward the upper direction is bonded to the upper portion of the support table 130 .
并且，第一发光二极管封装件组件811和第二发光二极管封装件组件812通过连接部160而彼此串联连接。Also, the first LED package assembly 811 and the second LED package assembly 812 are connected to each other in series through the connection portion 160 .
根据第八实施例，形成为向彼此不同的侧面方向发光的第一发光二极管封装件组件811和第二发光二极管封装件组件812布置为彼此对向。最终，可以布置为6个发光二极管封装件40围绕支撑台130。因此，发光二极管灯泡800可以通过整个侧面，而不是部分侧面而均匀地发光。According to the eighth embodiment, the first LED package assembly 811 and the second LED package assembly 812 formed to emit light in different side directions are arranged to face each other. Finally, six LED packages 40 may be arranged to surround the support 130. Therefore, the LED bulb 800 may emit light uniformly through the entire side instead of a partial side.
并且，导入线140可以支撑发光二极管封装件组件810的下部，使得如图30所示地发光二极管封装件组件810维持向上部方向倾斜的状态。由于发光二极管封装件组件810布置为向上部方向倾斜，发光二极管灯泡800也可以向上部方向发光。Furthermore, the lead-in wire 140 can support the lower portion of the LED package assembly 810 so that the LED package assembly 810 maintains a state of being tilted upward as shown in Fig. 30. Since the LED package assembly 810 is arranged to be tilted upward, the LED bulb 800 can also emit light in the upward direction.
因此，根据本发明的实施例的发光二极管灯泡800可以通过根据第八实施例的发光二极管封装件组件810的结构、支撑台130、导入线140而向侧面方向和上部方向均匀地发光。Therefore, the LED bulb 800 according to the embodiment of the present invention can emit light uniformly in the side direction and the upper direction through the structure of the LED package assembly 810 according to the eighth embodiment, the support table 130, and the introduction wire 140.
作为另一实施例，利用按使布置在两端的发光二极管封装件40的安装面彼此接近的方式连接导线11弯曲的发光二极管封装件组件810，也可以制作仅在预定范围发光的发光二极管灯泡800。As another embodiment, an LED bulb 800 that emits light only in a predetermined range may be manufactured by using an LED package assembly 810 in which the connecting wires 11 are bent in such a way that the mounting surfaces of the LED packages 40 arranged at both ends are close to each other.
图31和图32是示出根据本发明的第九实施例的发光二极管封装件组件的制造方法以及根据其的发光二极管封装件组件的示例图。31 and 32 are exemplary views illustrating a method of manufacturing a light emitting diode package assembly according to a ninth embodiment of the present invention and a light emitting diode package assembly according thereto.
参照图31，多个发光二极管封装件40布置为在每三个发光二极管封装件40相反地布置阳极电极和阴极电极的位置。即，在第一发光二极管封装件41至第三发光二极管封装件43中，沿导线框架20的一侧方向布置有阴极电极，沿另一侧方向布置有阳极电极。并且，在第四发光二极管封装件44至第六发光二极管封装件46中，沿导线框架20的一侧方向布置有阳极电极，另一侧方向布置有阴极电极。31 , the plurality of LED packages 40 are arranged such that the anode electrode and the cathode electrode are oppositely arranged in every three LED packages 40. That is, in the first to third LED packages 41 to 43, the cathode electrode is arranged along one side direction of the lead frame 20, and the anode electrode is arranged along the other side direction. Also, in the fourth to sixth LED packages 44 to 46, the anode electrode is arranged along one side direction of the lead frame 20, and the cathode electrode is arranged along the other side direction.
在导线框架20的一侧，第三发光二极管封装件43和第四发光二极管封装件44之间形成有切割线C。并且，导线框架20的另一侧形成有切割线C，使得所有电极垫12和连接导线11分离。A cutting line C is formed between the third LED package 43 and the fourth LED package 44 on one side of the lead frame 20 . Also, a cutting line C is formed on the other side of the lead frame 20 so that all electrode pads 12 and connection wires 11 are separated.
并且，在导线框架20的一侧的连接导线11，各个发光二极管封装件40之间形成有第一弯曲部51。并且，与连接导线11连接的电极垫12形成有第二弯曲部52。第二弯曲部52在电极垫12沿发光二极管封装件40的宽度方向形成。即，第二弯曲部52形成为沿电极垫12的长轴方向垂直地弯曲。第一弯曲部51形成为用于弯曲连接导线11，并且第二弯曲部52形成为用于弯曲电极垫12。Furthermore, a first bent portion 51 is formed between the connection wire 11 on one side of the lead frame 20 and each light emitting diode package 40. Furthermore, a second bent portion 52 is formed on the electrode pad 12 connected to the connection wire 11. The second bent portion 52 is formed on the electrode pad 12 along the width direction of the light emitting diode package 40. That is, the second bent portion 52 is formed to bend vertically along the long axis direction of the electrode pad 12. The first bent portion 51 is formed to bend the connection wire 11, and the second bent portion 52 is formed to bend the electrode pad 12.
沿切割线C而执行切割，沿第一弯曲部51和第二弯曲部52弯曲连接导线11和电极垫12，则会形成根据图32的发光二极管封装件组件910。Cutting is performed along the cutting line C, and the connecting wire 11 and the electrode pad 12 are bent along the first bending portion 51 and the second bending portion 52 , thereby forming a light emitting diode package assembly 910 according to FIG. 32 .
在根据第九实施例的发光二极管封装件组件910中，三个发光二极管封装件40借助一个连接导线11而并联连接。在第一发光二极管封装件组件911中，一个连接导线11仅连接有第二电极垫14，第一电极垫13彼此分离。并且，在第二发光二极管封装件组件912中，一个连接导线11仅连接有第一电极垫13，第二电极垫14彼此分离。In the light emitting diode package assembly 910 according to the ninth embodiment, three light emitting diode packages 40 are connected in parallel by means of one connecting wire 11. In the first light emitting diode package assembly 911, one connecting wire 11 is only connected to the second electrode pad 14, and the first electrode pads 13 are separated from each other. Also, in the second light emitting diode package assembly 912, one connecting wire 11 is only connected to the first electrode pad 13, and the second electrode pads 14 are separated from each other.
并且，在第一发光二极管封装件组件911和第二发光二极管封装件组件912可以通过第一弯曲部51而使连接导线11左右弯曲。Furthermore, in the first LED package assembly 911 and the second LED package assembly 912 , the connecting wire 11 can be bent left and right by the first bending portion 51 .
在本发明的实施例，第一发光二极管封装件组件911中，以第一发光二极管封装件41和第三发光二极管封装件43的后表面彼此接近的方式使连接导线11弯曲。并且，在第二发光二极管封装件组件912中，以第四发光二极管封装件44和第六发光二极管封装件46的后表面彼此接近的方式使连接导线11弯曲。并且，在第一发光二极管封装件组件911和第二发光二极管封装件组件912中，各自包括的发光二极管封装件40可以朝向彼此不同的方向发光。In the embodiment of the present invention, in the first LED package assembly 911, the connection wire 11 is bent in such a manner that the rear surfaces of the first LED package 41 and the third LED package 43 are close to each other. Also, in the second LED package assembly 912, the connection wire 11 is bent in such a manner that the rear surfaces of the fourth LED package 44 and the sixth LED package 46 are close to each other. Also, in the first LED package assembly 911 and the second LED package assembly 912, the LED packages 40 included in each of them can emit light in different directions from each other.
并且，在第一发光二极管封装件组件911和第二发光二极管封装件组件912中，电极垫12可以借助第二弯曲部52而向上部方向或者下部方向弯曲。Also, in the first LED package assembly 911 and the second LED package assembly 912 , the electrode pad 12 may be bent in an upward direction or a downward direction by means of the second bent portion 52 .
在本发明的实施例，第一发光二极管封装件组件911中，第一发光二极管封装件41至第三发光二极管封装件43的第二电极垫14分别向彼此不同的上下方向弯曲。并且，在第二发光二极管封装件组件912中，第四发光二极管封装件44至第六发光二极管封装件46的第一电极垫13也分别向彼此不同的上下方向弯曲。因此，在第一发光二极管封装件组件911的第二发光二极管封装件组件912中，各自包括的发光二极管封装件40可以向彼此不同的上下方向发光。In the embodiment of the present invention, in the first LED package assembly 911, the second electrode pads 14 of the first LED package 41 to the third LED package 43 are bent in different up and down directions. In addition, in the second LED package assembly 912, the first electrode pads 13 of the fourth LED package 44 to the sixth LED package 46 are also bent in different up and down directions. Therefore, in the first LED package assembly 911 and the second LED package assembly 912, the LED packages 40 included therein can emit light in different up and down directions.
图33是示出根据本发明的第九实施例的发光二极管灯泡的示例图。FIG. 33 is an exemplary diagram showing a light emitting diode bulb according to a ninth embodiment of the present invention.
根据第九实施例的发光二极管灯泡900包括根据第九实施例的发光二极管封装件组件910。The LED bulb 900 according to the ninth embodiment includes the LED package assembly 910 according to the ninth embodiment.
第一发光二极管封装件组件911和第二发光二极管封装件组件912粘结到支撑台130的上部而固定到支撑台130。并且，第一发光二极管封装件组件911和第二发光二极管封装件组件912布置为彼此对向。The first LED package assembly 911 and the second LED package assembly 912 are bonded to the upper portion of the support table 130 and fixed to the support table 130. Also, the first LED package assembly 911 and the second LED package assembly 912 are arranged to face each other.
连接部160将第一发光二极管封装件组件911的连接导线11和第二发光二极管封装件组件912的连接导线11电连接。因此，第一发光二极管封装件组件911和第二发光二极管封装件组件912通过连接部160而串联连接。The connection portion 160 electrically connects the connection wires 11 of the first LED package assembly 911 and the connection wires 11 of the second LED package assembly 912. Therefore, the first LED package assembly 911 and the second LED package assembly 912 are connected in series through the connection portion 160.
第一发光二极管封装件组件911的第一电极垫13通过导入线140而与基础部120的第一外部电极121连接。并且，第二发光二极管封装件组件912的第二电极垫14通过导入线140而与基础部120的第二外部电极122连接。The first electrode pad 13 of the first LED package 911 is connected to the first external electrode 121 of the base 120 through the lead-in wire 140 . Also, the second electrode pad 14 of the second LED package 912 is connected to the second external electrode 122 of the base 120 through the lead-in wire 140 .
第一发光二极管封装件组件911和第二发光二极管封装件组件912的发光二极管封装件40可以均向彼此不同的方向发光。因此，根据第九实施例的发光二极管灯泡900不仅可以向透光性盖体150的侧面发光，还可以像上部方向和下部方向均匀地发光。The LED packages 40 of the first LED package assembly 911 and the second LED package assembly 912 can emit light in different directions. Therefore, the LED bulb 900 according to the ninth embodiment can emit light not only to the side of the light-transmitting cover 150, but also uniformly in the upper and lower directions.
在说明本发明的多种实施例进行时，以发光二极管封装件组件包括三个发光二极管封装件的情形为示例进行了说明。然而，发光二极管封装件组件包括的发光二极管封装件的数量并不限于此，可以根据本领域技术人员的选择而改变发光二极管封装件的数量。When describing various embodiments of the present invention, the LED package assembly includes three LED packages as an example. However, the number of LED packages included in the LED package assembly is not limited thereto, and the number of LED packages can be changed according to the choice of those skilled in the art.
在说明本发明的多个实施例时，以发光二极管封装件组件包括两个至四个发光二极管封装件的情形为例进行了说明。然而，发光二极管封装件组件包括的发光二极管封装件的数量并不限于此。可以根据本领域技术人员的选择而改变发光二极管封装件组件包括的发光二极管封装件的数量。When describing the various embodiments of the present invention, the LED package assembly includes two to four LED packages. However, the number of LED packages included in the LED package assembly is not limited thereto. The number of LED packages included in the LED package assembly can be changed according to the choice of those skilled in the art.
以上，虽然对本发明的多种实施例进行了说明，但本发明并不限于上述多种实施例和特征，在不脱离根据本发明的权利要求书的技术思想的范围内可以进行多种变形和改变。Although various embodiments of the present invention have been described above, the present invention is not limited to the various embodiments and features described above, and various modifications and changes can be made without departing from the technical concept of the claims of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170051796AKR101916371B1 (en) | 2017-04-21 | 2017-04-21 | Led package set and led bulb including the same |
| KR1020170051795AKR101916373B1 (en) | 2017-04-21 | 2017-04-21 | Led package set and led bulb including the same |
| KR10-2017-0051796 | 2017-04-21 | ||
| KR10-2017-0051795 | 2017-04-21 | ||
| PCT/KR2018/004534WO2018194386A1 (en) | 2017-04-21 | 2018-04-19 | Led package set and led bulb comprising same |
| CN201880005535.4ACN110121769B (en) | 2017-04-21 | 2018-04-19 | Light emitting diode package assembly and light emitting diode bulb comprising same |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880005535.4ADivisionCN110121769B (en) | 2017-04-21 | 2018-04-19 | Light emitting diode package assembly and light emitting diode bulb comprising same |
| Publication Number | Publication Date |
|---|---|
| CN118315518Atrue CN118315518A (en) | 2024-07-09 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410413711.5APendingCN118315518A (en) | 2017-04-21 | 2018-04-19 | Lighting device |
| CN201880005535.4AActiveCN110121769B (en) | 2017-04-21 | 2018-04-19 | Light emitting diode package assembly and light emitting diode bulb comprising same |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880005535.4AActiveCN110121769B (en) | 2017-04-21 | 2018-04-19 | Light emitting diode package assembly and light emitting diode bulb comprising same |
| Country | Link |
|---|---|
| CN (2) | CN118315518A (en) |
| WO (1) | WO2018194386A1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10234079B1 (en)* | 2018-05-07 | 2019-03-19 | Ledvance Llc | Self-supporting filament light emitting diode light engine lamp assembly |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070247851A1 (en)* | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
| KR101108984B1 (en)* | 2009-12-03 | 2012-01-31 | (주) 아모엘이디 | Multichip LED Package and Manufacturing Method Thereof |
| JP4932064B2 (en)* | 2010-03-11 | 2012-05-16 | パナソニック株式会社 | Light emitting module, light source device, liquid crystal display device, and method for manufacturing light emitting module |
| KR101781043B1 (en)* | 2010-12-27 | 2017-09-25 | 엘지이노텍 주식회사 | Light-emitting element array |
| TWI464868B (en)* | 2011-09-14 | 2014-12-11 | Lextar Electronics Corp | Solid state light source module and solid state light source array |
| KR101933189B1 (en)* | 2012-01-31 | 2019-04-05 | 서울반도체 주식회사 | Light emitting diode package |
| US9322543B2 (en)* | 2012-04-13 | 2016-04-26 | Cree, Inc. | Gas cooled LED lamp with heat conductive submount |
| Publication number | Publication date |
|---|---|
| CN110121769B (en) | 2024-04-26 |
| WO2018194386A1 (en) | 2018-10-25 |
| CN110121769A (en) | 2019-08-13 |
| Publication | Publication Date | Title |
|---|---|---|
| JP7015278B2 (en) | Light emitting diode module and its manufacturing method | |
| US9761775B2 (en) | Semiconductor light source | |
| US10249807B2 (en) | Pre-rotated overmoulded bidirectional spreading lens for stretched leadframe architecture | |
| KR100604469B1 (en) | Light emitting device, package structure and manufacturing method | |
| CN110121772B (en) | Light emitting diode package assembly and light emitting diode bulb comprising same | |
| JP5883270B2 (en) | LED lamp | |
| JP5562383B2 (en) | Lamp and lighting device | |
| EP3480510B1 (en) | Led lighting apparatus | |
| CN110121769B (en) | Light emitting diode package assembly and light emitting diode bulb comprising same | |
| US20140321109A1 (en) | Light emitting diode (led) light tube | |
| KR101916373B1 (en) | Led package set and led bulb including the same | |
| KR101916371B1 (en) | Led package set and led bulb including the same | |
| JP2014186825A (en) | Led bulb | |
| WO2014013671A1 (en) | Bulb-type lamp and illumination device | |
| JP5420124B1 (en) | Light bulb shaped lamp, lighting device, and method of manufacturing light bulb shaped lamp | |
| JP3186004U (en) | Chip unsealed LED lighting | |
| JP5417556B1 (en) | Light bulb shaped lamp and lighting device | |
| JP5465364B1 (en) | Light bulb shaped lamp and lighting device | |
| JP2012134306A (en) | Light-emitting device and luminaire using the same | |
| JP2018010800A (en) | Light-emitting device and light source for illumination | |
| KR101937196B1 (en) | Led module, led module array for led bulb and manufacturing method thereof | |
| TWI553384B (en) | Back light | |
| CN203703649U (en) | Light source for illumination | |
| KR20140063922A (en) | Led lighting device | |
| CN204611391U (en) | Bulb-shaped lamp and lighting device |
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |