技术领域Technical Field
本发明涉及离子注入技术领域，具体为一种用于半导体芯片制造离子注入机。The invention relates to the technical field of ion implantation, in particular to an ion implantation machine used for manufacturing semiconductor chips.
背景技术Background technique
离子注入是一种在半导体制造过程中广泛应用的技术，主要用于向衬底中引入可控数量的杂质，以改变其电学性能。这是一个物理过程，不涉及化学反应。离子注入可以精确控制杂质的浓度和深度，对于现代硅片制造尤为重要。Ion implantation is a widely used technique in semiconductor manufacturing, mainly used to introduce a controlled amount of impurities into a substrate to change its electrical properties. This is a physical process and does not involve chemical reactions. Ion implantation can precisely control the concentration and depth of impurities, which is particularly important for modern silicon wafer manufacturing.
在离子注入过程中，有两种主要的阻滞机制：原子核阻滞和电子阻滞。原子核阻滞是指注入的离子与晶格原子的原子核发生碰撞，而电子阻滞则是入射离子与晶格电子产生碰撞。离子的能量范围可以从极浅结（Ultra-Shallow Junction，USJ）的0.1keV低能量到阱区注入的1MeV高能量。There are two main blocking mechanisms during ion implantation: nuclear blocking and electron blocking. Nuclear blocking refers to the collision of the injected ions with the nuclei of the lattice atoms, while electron blocking refers to the collision of the incident ions with the lattice electrons. The energy of the ions can range from a low energy of 0.1keV in the ultra-shallow junction (USJ) to a high energy of 1MeV in the well region.
离子注入的优点包括精确控制杂质含量、良好的杂质均匀性、对杂质穿透深度的良好控制、产生单一离子束、低温工艺等。然而，它也有缺点，如可能对晶体结构产生损伤，设备复杂性高等。The advantages of ion implantation include precise control of impurity content, good impurity uniformity, good control of impurity penetration depth, generation of a single ion beam, low temperature process, etc. However, it also has disadvantages, such as possible damage to the crystal structure and high equipment complexity.
公告号CN116387223B公开了一种用于离子注入机的晶片缺口定位结构，通过在离子注入机本体一侧设置第一电机，第一电机通过第一转轴对放置组件进行转动，而第一转轴通过第一支撑板对放置盘、调整组件和下压组件进行支撑，放置组件与调整组件配合，放置盘和下压组件配合，且两者通过皮带进行传动，便可稳定的对晶片进行支撑，避免在对晶片缺口定位时由于晃动等情况导致位置发生偏斜，影响对晶片的加工。Announcement No. CN116387223B discloses a wafer notch positioning structure for an ion implanter, wherein a first motor is arranged on one side of the ion implanter body, the first motor rotates the placement assembly through a first rotating shaft, and the first rotating shaft supports the placement disk, the adjustment assembly and the pressing assembly through a first supporting plate, the placement assembly cooperates with the adjustment assembly, the placement disk cooperates with the pressing assembly, and the two are driven by a belt, so that the wafer can be stably supported, avoiding the position deviation caused by shaking when positioning the wafer notch, thereby affecting the processing of the wafer.
在离子注入机中，硅片装卸终端台通常设计有真空锁功能，这允许新的硅片被安装进机器而不破坏主真空腔的真空状态。真空锁是一种特殊的装置，它可以在不影响主真空系统的情况下，将硅片从大气环境转移到真空环境中。In ion implanters, the wafer loading and unloading terminal is usually designed with a vacuum lock function, which allows new wafers to be installed into the machine without destroying the vacuum state of the main vacuum chamber. The vacuum lock is a special device that can transfer the wafer from the atmospheric environment to the vacuum environment without affecting the main vacuum system.
具体来说，当新的硅片需要被安装时，它们首先被放置在真空锁中。然后，真空锁内部的空气被抽出，直到达到与主真空腔相同的压力水平。一旦真空锁内部的压力与主真空腔相匹配，就可以打开通往主真空腔的门，将硅片安全地转移到注入区域，整个过程中主真空腔保持不受干扰的真空状态。Specifically, when new silicon wafers need to be installed, they are first placed in the vacuum lock. Then, the air inside the vacuum lock is pumped out until it reaches the same pressure level as the main vacuum chamber. Once the pressure inside the vacuum lock matches the main vacuum chamber, the door to the main vacuum chamber can be opened and the silicon wafers can be safely transferred to the implantation area. The main vacuum chamber remains in an undisturbed vacuum state throughout the process.
而离子注入机内部的靶盘与硅片装卸终端台之间设置机械手用于进行硅片的输送，输送效率不高，而靶盘在承托不同规格的硅片时，硅片的与靶盘接触稳定性较差，靶盘无法根据硅片规格做出自适应调节。A robot is installed between the target plate inside the ion implanter and the silicon wafer loading and unloading terminal to transport the silicon wafers. The transportation efficiency is low, and when the target plate supports silicon wafers of different specifications, the contact stability between the silicon wafer and the target plate is poor, and the target plate cannot make adaptive adjustments according to the specifications of the silicon wafers.
发明内容Summary of the invention
本发明的目的之一在于提供一种用于半导体芯片制造离子注入机，通过设置能够对接靶盘的对接结构，使硅片在对接的过程中保持真空，而在硅片运动的过程中，直接将硅片输送至靶盘所对应的承托位置，保证硅片的稳定对中，而靶盘能够根据硅片规格做出自适应调节。One of the purposes of the present invention is to provide an ion implanter for semiconductor chip manufacturing. By setting a docking structure that can dock with a target plate, the silicon wafer can maintain a vacuum during the docking process. During the movement of the silicon wafer, the silicon wafer is directly transported to the supporting position corresponding to the target plate to ensure the stable alignment of the silicon wafer, and the target plate can make adaptive adjustments according to the specifications of the silicon wafer.
为实现以上目的，本发明通过以下技术方案予以实现：一种用于半导体芯片制造离子注入机，包括：To achieve the above objectives, the present invention is implemented through the following technical solutions: an ion implanter for semiconductor chip manufacturing, comprising:
机体，置于地面；The body is placed on the ground;
离子注入系统，设置于机体内部，该离子注入系统用于进行硅片的离子注入；An ion implantation system is arranged inside the machine body and is used for implanting ions into silicon wafers;
注入腔，位于机体内部，且该注入腔设置真空系统，真空系统连通注入腔并控制真空腔的真空度，注入腔内部设置可承载硅片的靶盘，该靶盘实现轴向转动，且离子注入系统朝向靶盘；An injection cavity is located inside the machine body, and a vacuum system is provided in the injection cavity. The vacuum system is connected to the injection cavity and controls the vacuum degree of the vacuum cavity. A target plate capable of carrying a silicon wafer is provided inside the injection cavity. The target plate realizes axial rotation, and the ion implantation system faces the target plate.
装载腔体，位于该机体内部，其内部设置多个用于装载硅片的硅片装载台，硅片装载台在装载和拆卸过程中进行两种状态的切换，装载过程中硅片装载台内部的空气排出与注入腔真空度一致，拆卸过程中的硅片装载台连通装载过程中的硅片装载台并导流装载过程中硅片装载台内部的空气；A loading cavity is located inside the machine body, and a plurality of wafer loading platforms for loading wafers are arranged inside the loading cavity. The wafer loading platforms switch between two states during loading and unloading. During loading, the air inside the wafer loading platforms is discharged in accordance with the vacuum degree of the injection cavity. The wafer loading platforms during unloading are connected to the wafer loading platforms during loading and guide the air inside the wafer loading platforms during loading.
其中，靶盘配置多个用于固定硅片的承载台，硅片装载台与承载台轴线重合设置，且靶盘可转动实现对硅片位置的调整，硅片装载台控制硅片改变位置，在硅片向外运动时接触承载台，在硅片离子注入完成后，硅片装载台回收硅片；The target plate is equipped with multiple carriers for fixing silicon wafers. The silicon wafer loading platform is arranged to coincide with the axis of the carrier, and the target plate can be rotated to adjust the position of the silicon wafer. The silicon wafer loading platform controls the silicon wafer to change its position and contacts the carrier when the silicon wafer moves outward. After the ion implantation of the silicon wafer is completed, the silicon wafer loading platform recycles the silicon wafer.
对接组件，配置于硅片装载台与注入腔之间，形成硅片装载台以及注入腔的密封，对接组件处于开启状态时硅片装载台与注入腔连通。The docking assembly is arranged between the silicon wafer loading platform and the injection cavity to form a seal between the silicon wafer loading platform and the injection cavity. When the docking assembly is in an open state, the silicon wafer loading platform is connected to the injection cavity.
在本发明一或多个实施方式中，上述的靶盘还包括：In one or more embodiments of the present invention, the target plate further comprises:
盘体，其底部配置旋转电机用于驱动该盘体转动，旋转电机固定于机体内部，承载台位于盘体内部且均匀分布，承载台延伸至该盘体内部，且盘体与承载台之间配置多个电磁铁形成对承载台位置的控制；The tray body has a rotating motor at its bottom for driving the tray body to rotate, the rotating motor is fixed inside the body, the bearing platforms are located inside the tray body and are evenly distributed, the bearing platforms extend into the tray body, and a plurality of electromagnets are arranged between the tray body and the bearing platforms to control the position of the bearing platforms;
啮合盘，套设于盘体外侧并固定连接机体，啮合盘内侧开设环槽，环槽内部配置插杆，插杆延伸至承载台内部并形成对承载台的定位。The meshing disc is sleeved on the outside of the disc body and fixedly connected to the machine body. An annular groove is arranged on the inside of the meshing disc. An insertion rod is arranged inside the annular groove. The insertion rod extends to the inside of the bearing platform and forms a positioning for the bearing platform.
在本发明一或多个实施方式中，上述的靶盘还包括：In one or more embodiments of the present invention, the target plate further comprises:
调节头，可滑动设置于该盘体内侧，承载台内侧设置用于限制调节头运动路径的槽体，该调节头外侧设置夹块，夹块可转动安装于该调节头内侧，调节头内侧为弹性滚轮；The adjusting head can be slidably arranged inside the plate body, a groove body for limiting the movement path of the adjusting head is arranged inside the bearing platform, a clamping block is arranged outside the adjusting head, the clamping block can be rotatably installed inside the adjusting head, and the inside of the adjusting head is an elastic roller;
弹性滚轮延伸至夹块内部一端设置压片组，压片组控制弹性滚轮摆动，且压片组与夹块之间配置弹簧形成对压片组的支撑，压片组背离弹性滚轮的一端延伸至夹块与调节头的连接位置，且该压片组被弹性滚轮支撑后脱离与调节头的接触。The elastic roller extends to one end inside the clamping block and a pressure sheet group is set. The pressure sheet group controls the swing of the elastic roller, and a spring is arranged between the pressure sheet group and the clamping block to form support for the pressure sheet group. The end of the pressure sheet group away from the elastic roller extends to the connection position between the clamping block and the adjusting head, and the pressure sheet group is separated from the contact with the adjusting head after being supported by the elastic roller.
在本发明一或多个实施方式中，上述的靶盘还包括：In one or more embodiments of the present invention, the target plate further comprises:
导槽，开设于该盘体内部，插杆延伸至该导槽内部，导槽一侧设置介质腔，介质腔内部填充介质，且插杆在导槽内部运动能够推动介质腔内部的介质运动；A guide groove is provided inside the disk body, the insertion rod extends into the guide groove, a medium cavity is provided on one side of the guide groove, the medium cavity is filled with a medium, and the movement of the insertion rod inside the guide groove can promote the movement of the medium inside the medium cavity;
推杆，可滑动安装于该盘体内侧，调节头固定于该推杆延伸至盘体外侧的一端。The push rod can be slidably installed inside the disc body, and the adjusting head is fixed to one end of the push rod extending to the outside of the disc body.
在本发明一或多个实施方式中，上述的硅片装载台包括：In one or more embodiments of the present invention, the above-mentioned silicon wafer loading station includes:
滑台，固定于该装载腔体内部，且该滑台内侧设置装载架，滑台内侧设置定位架并驱动定位架改变位置，装载架位于该定位架内侧，装载架内部设置真空泵用于改变装载架内部的真空状态；A slide is fixed inside the loading cavity, and a loading frame is arranged inside the slide, a positioning frame is arranged inside the slide and drives the positioning frame to change position, the loading frame is located inside the positioning frame, and a vacuum pump is arranged inside the loading frame to change the vacuum state inside the loading frame;
嵌合块，固定于该装载架内部，定位架通过嵌合块推动装载架运动；The engaging block is fixed inside the loading frame, and the positioning frame drives the loading frame to move through the engaging block;
引导架，可转动设置于该装载架内部，且引导架内侧设置卡盘并驱动卡盘运动；A guide frame is rotatably arranged inside the loading frame, and a chuck is arranged inside the guide frame and drives the chuck to move;
驱动电机，固定于该装载架内部，该驱动电机与引导架之间设置传动组件用于驱动引导架运动。The driving motor is fixed inside the loading frame, and a transmission assembly is arranged between the driving motor and the guide frame to drive the guide frame to move.
在本发明一或多个实施方式中，上述的硅片装载台还包括：In one or more embodiments of the present invention, the above-mentioned silicon wafer loading platform further includes:
弹片，弹性设置于该卡盘内侧；A spring sheet, elastically arranged inside the chuck;
夹板，可摆动设置于该卡盘外侧，夹板内侧靠近卡盘的位置设置夹头，夹头为弹性设置且为半球状凸起；A clamping plate is swingably arranged outside the chuck, and a clamping head is arranged inside the clamping plate near the chuck, and the clamping head is elastically arranged and is a hemispherical protrusion;
电磁片，固定于夹板与卡盘之间，电磁片磁吸控制夹板的摆动角度；An electromagnetic sheet is fixed between the clamping plate and the chuck, and the electromagnetic sheet magnetically controls the swing angle of the clamping plate;
调节架，设置于承载架内部，该调节架调整引导架之间的间隙，引导架之间的间隙变化改变卡盘的凸起位置。The adjusting frame is arranged inside the bearing frame, and the adjusting frame adjusts the gap between the guide frames. The change of the gap between the guide frames changes the protruding position of the chuck.
在本发明一或多个实施方式中，上述的对接组件包括：In one or more embodiments of the present invention, the docking assembly includes:
安装盘，可拆卸安装于该装载架内侧，安装盘内侧设置第一密封板，第一密封板组合形成对装载架的密封；A mounting plate is detachably mounted on the inner side of the loading rack, a first sealing plate is arranged on the inner side of the mounting plate, and the first sealing plate is assembled to form a seal for the loading rack;
第二密封板，设置于机体内部形成对注入腔的密封，第一密封板与第二密封板贴合，且第一密封板与第二密封板贴合后没有缝隙；A second sealing plate is arranged inside the body to form a seal for the injection cavity, the first sealing plate is fitted with the second sealing plate, and there is no gap between the first sealing plate and the second sealing plate after fitting;
啮合块与卡槽，分别设置于第一密封板和第二密封板外侧，啮合块与卡槽适配，啮合块插入卡槽内部后第一密封板和第二密封板同步运动。The engaging block and the card slot are respectively arranged on the outside of the first sealing plate and the second sealing plate. The engaging block is adapted to the card slot. After the engaging block is inserted into the card slot, the first sealing plate and the second sealing plate move synchronously.
在本发明一或多个实施方式中，上述的对接组件还包括：In one or more embodiments of the present invention, the above-mentioned docking assembly further includes:
伸缩杆，固定于该机体内部，伸缩杆伸缩端设置齿条并驱动齿条运动；A telescopic rod is fixed inside the body, and a rack is arranged at the telescopic end of the telescopic rod to drive the rack to move;
转盘，可转动安装于该机体内侧，且第二密封板延伸至转盘内侧，齿条啮合转盘并驱动转盘转动，转盘转动控制第二密封板的开启和关闭。The turntable is rotatably mounted inside the body, and the second sealing plate extends to the inside of the turntable. The rack engages with the turntable and drives the turntable to rotate. The rotation of the turntable controls the opening and closing of the second sealing plate.
在本发明一或多个实施方式中，上述的装载腔体包括：In one or more embodiments of the present invention, the loading chamber comprises:
滑动腔体，开设于该机体内侧，滑台固定于该滑动腔体，且装载架在滑动腔体内部运动；A sliding cavity is provided inside the body, a slide is fixed to the sliding cavity, and a loading frame moves inside the sliding cavity;
电控阀，安装于滑动腔体之间，电控阀开启状态下滑动腔体连通，电控阀关闭时滑动腔体相互独立；The electric control valve is installed between the sliding cavities. When the electric control valve is open, the sliding cavities are connected, and when the electric control valve is closed, the sliding cavities are independent of each other.
连通管，固定于该装载架外侧并与装载架连通设置，连通管可与电控阀对中。The connecting pipe is fixed on the outside of the loading rack and connected with the loading rack. The connecting pipe can be aligned with the electric control valve.
在本发明一或多个实施方式中，上述的装载腔体还包括：In one or more embodiments of the present invention, the above-mentioned loading chamber further includes:
密封套，安装于该滑动腔体内壁，连通管连通电控阀的一端与密封套接触，密封套中部设置通孔，通孔贯穿密封套，连通管在通孔位置连通电控阀；A sealing sleeve is installed on the inner wall of the sliding cavity, one end of the connecting pipe connected to the electric control valve contacts the sealing sleeve, a through hole is arranged in the middle of the sealing sleeve, the through hole passes through the sealing sleeve, and the connecting pipe is connected to the electric control valve at the position of the through hole;
单向阀，固定于连通管中部位置。The one-way valve is fixed in the middle of the connecting pipe.
通过上述技术方案，本发明具备以下有益效果：Through the above technical solution, the present invention has the following beneficial effects:
1、本发明针对靶盘与硅片装载台之间的连接方式，使硅片装载台直接对接靶盘，靶盘运动时硅片装载台将硅片输送至靶盘承托位置，而硅片装载台与靶盘的承托位置对中，在硅片被输送至靶盘承托位置时，靶盘能够自适应完成对不同规格硅片的限位，保证硅片的稳定。1. The present invention aims at the connection mode between the target plate and the silicon wafer loading platform, so that the silicon wafer loading platform is directly connected to the target plate. When the target plate moves, the silicon wafer loading platform transports the silicon wafer to the target plate supporting position, and the silicon wafer loading platform and the target plate supporting position are aligned. When the silicon wafer is transported to the target plate supporting position, the target plate can adaptively complete the limitation of silicon wafers of different specifications to ensure the stability of the silicon wafer.
2、多个硅片装载台被设置于多个相互连通的装载腔体内部，装载过程中的硅片装载台与靶盘对接时，能够首先利用拆卸过程中的硅片装载台来抽取装载过程中硅片装载台内部的空气，使装载过程中硅片装载台和拆卸硅片状态内部的气压相同，来提高装载硅片装载台抽真空的速度。2. Multiple silicon wafer loading platforms are arranged inside multiple interconnected loading cavities. When the silicon wafer loading platform during the loading process is docked with the target plate, the silicon wafer loading platform during the disassembly process can be used to first extract the air inside the silicon wafer loading platform during the loading process, so that the air pressure inside the silicon wafer loading platform during the loading process and the silicon wafer disassembly state is the same, thereby increasing the speed of vacuuming the silicon wafer loading platform.
3、硅片装载台实现对硅片的装卸，靶盘位于开启状态，在该状态下靶盘仅能够起到对硅片的承托作用，使硅片能够由硅片装载台驱动，从而改变硅片的位置，完成对硅片的装卸，由硅片装载台直接实现对硅片的装卸，从而提高硅片的装卸效率。3. The silicon wafer loading platform realizes the loading and unloading of silicon wafers. The target plate is in the open state. In this state, the target plate can only support the silicon wafer, so that the silicon wafer can be driven by the silicon wafer loading platform, thereby changing the position of the silicon wafer and completing the loading and unloading of the silicon wafer. The silicon wafer loading platform directly realizes the loading and unloading of the silicon wafer, thereby improving the loading and unloading efficiency of the silicon wafer.
4、硅片由硅片装载台被安装于靶盘上，靶盘根据硅片规格做出自适应改变，从而改变对硅片的夹持位置，不同规格均能够稳定的被靶盘夹持，保证硅片在靶盘上的稳定，确保硅片的位置精准，进一步的保证离子注入的精度。4. The silicon wafer is mounted on the target plate by the silicon wafer loading platform. The target plate makes adaptive changes according to the specifications of the silicon wafer, thereby changing the clamping position of the silicon wafer. Different specifications can be stably clamped by the target plate, ensuring the stability of the silicon wafer on the target plate, ensuring the accurate position of the silicon wafer, and further ensuring the accuracy of ion implantation.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明的立体图；Fig. 1 is a perspective view of the present invention;
图2为本发明的剖视图；Fig. 2 is a cross-sectional view of the present invention;
图3为本发明的硅片装载台示意图；FIG3 is a schematic diagram of a silicon wafer loading platform of the present invention;
图4为本发明的装载架示意图；FIG4 is a schematic diagram of a loading rack of the present invention;
图5为本发明的装载架剖视图；FIG5 is a cross-sectional view of a loading rack of the present invention;
图6为本发明的装载架内部结构示意图；FIG6 is a schematic diagram of the internal structure of the loading rack of the present invention;
图7为本发明的装载架底部结构示意图；FIG7 is a schematic diagram of the bottom structure of the loading rack of the present invention;
图8为本发明的装载架内部结构平面图；FIG8 is a plan view of the internal structure of the loading rack of the present invention;
图9为本发明的卡盘结构示意图；FIG9 is a schematic diagram of the chuck structure of the present invention;
图10为本发明的靶盘结构示意图；FIG10 is a schematic diagram of the target plate structure of the present invention;
图11为本发明的靶盘结构剖示图一；FIG11 is a cross-sectional view of a target plate structure of the present invention;
图12为本发明的靶盘结构剖视图二；FIG12 is a second cross-sectional view of the target plate structure of the present invention;
图13为本发明的插杆与承载台结构示意图；FIG13 is a schematic diagram of the structure of the insertion rod and the bearing platform of the present invention;
图14为本发明的承载台结构示意图；FIG14 is a schematic diagram of the structure of the carrier platform of the present invention;
图15为本发明的夹块内部结构剖视图；FIG15 is a cross-sectional view of the internal structure of the clamp block of the present invention;
图16为本发明的第一密封板和第二密封板结构示意图；FIG16 is a schematic structural diagram of a first sealing plate and a second sealing plate of the present invention;
图17为本发明的第一密封板结构示意图；FIG17 is a schematic structural diagram of a first sealing plate of the present invention;
图18为本发明的转盘与齿条结构示意图。FIG. 18 is a schematic diagram of the turntable and rack structure of the present invention.
图中：1机体、2离子注入系统、3注入腔、5靶盘、6硅片装载台、7对接组件、8装载腔体；In the figure: 1 body, 2 ion implantation system, 3 implantation chamber, 5 target plate, 6 silicon wafer loading platform, 7 docking assembly, 8 loading chamber;
501盘体、502承载台、503电磁铁、505啮合盘、506环槽、507插杆、508导槽、509介质腔、510推杆、511调节头、512夹块、513弹簧、514压片组、516弹性滚轮；501 disk body, 502 bearing platform, 503 electromagnet, 505 engaging disk, 506 annular groove, 507 insert rod, 508 guide groove, 509 medium cavity, 510 push rod, 511 adjusting head, 512 clamping block, 513 spring, 514 pressing sheet group, 516 elastic roller;
601滑台、602定位架、603装载架、604嵌合块、605驱动电机、606引导架、607卡盘、609夹头、610夹板、611电磁片、612调节架、613真空泵；601 slide table, 602 positioning frame, 603 loading frame, 604 fitting block, 605 driving motor, 606 guide frame, 607 chuck, 609 chuck, 610 clamping plate, 611 electromagnetic sheet, 612 adjusting frame, 613 vacuum pump;
701安装盘、702第一密封板、703第二密封板、704啮合块、705卡槽、706滑槽、707转盘、708齿条、709伸缩杆；701 mounting plate, 702 first sealing plate, 703 second sealing plate, 704 engagement block, 705 slot, 706 slide slot, 707 rotating plate, 708 rack, 709 telescopic rod;
801滑动腔体、802电控阀、803连通管、804通孔、805密封套、806单向阀。801 sliding cavity, 802 electric control valve, 803 connecting pipe, 804 through hole, 805 sealing sleeve, 806 one-way valve.
具体实施方式Detailed ways
以下将以附图揭露本发明的多个实施方式，为明确说明起见，许多实务上的细节将在以下叙述中一并说明。然而，应了解到，这些实务上的细节不应用以限制本发明。也就是说，在本发明部分实施方式中，这些实务上的细节是非必要的。且若实施上为可能，不同实施例的特征是可以交互应用。The following will disclose multiple embodiments of the present invention with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not necessary. And if it is possible to implement, the features of different embodiments can be applied interchangeably.
除非另有定义，本文所使用的所有词汇（包括技术和科学术语）具有其通常的意涵，其意涵能够被熟悉此领域者所理解。更进一步的说，上述的词汇在普遍常用的字典中的定义，在本说明书的内容中应被解读为与本发明相关领域一致的意涵。除非有特别明确定义，这些词汇将不被解释为理想化的或过于正式的意涵。Unless otherwise defined, all words (including technical and scientific terms) used herein have their usual meanings, which can be understood by those familiar with this field. Furthermore, the definitions of the above words in commonly used dictionaries should be interpreted in the content of this specification as consistent with the meanings of the relevant fields of the present invention. Unless otherwise clearly defined, these words will not be interpreted as idealized or overly formal meanings.
请参阅图1-图18，本发明提供一种用于半导体芯片制造离子注入机，能够对硅片进行离子注入，且调整硅片到靶盘5之间的路径，提高硅片到靶盘5的输送效率。Please refer to FIG. 1 to FIG. 18 , the present invention provides an ion implanter for semiconductor chip manufacturing, which can implant ions into silicon wafers and adjust the path from the silicon wafers to the target plate 5 , thereby improving the transportation efficiency from the silicon wafers to the target plate 5 .
在一种实施例中，离子注入机包括：In one embodiment, an ion implanter comprises:
机体1，置于地面；A body 1 is placed on the ground;
离子注入系统2，设置于机体1内部，该离子注入系统2用于进行硅片的离子注入。The ion implantation system 2 is disposed inside the machine body 1 and is used for implanting ions into silicon wafers.
可选的，离子注入系统2包括：离子源、磁分析仪、加速电极、末端分析器，离子源：离子源是离子注入系统2中主要部件之一，离子源将需要注入的元素气态粒子电离成离子形式，形成离子束；注入离子的种类和束流强度取决于离子源的性能；Optionally, the ion implantation system 2 includes: an ion source, a magnetic analyzer, an accelerating electrode, and a terminal analyzer. The ion source is one of the main components of the ion implantation system 2. The ion source ionizes the gaseous particles of the element to be implanted into ions to form an ion beam. The type of implanted ions and the beam intensity depend on the performance of the ion source.
磁分析仪：磁分析仪用于分离不同质量的离子，通过磁场将离子束分成不同的能量和质量组分，以确保只有所需的离子进入加速管，提高注入的精度和效率；Magnetic analyzer: The magnetic analyzer is used to separate ions of different masses. It uses a magnetic field to separate the ion beam into different energy and mass components to ensure that only the required ions enter the acceleration tube, improving the accuracy and efficiency of injection.
加速电极：加速电极将离子束加速到所需的能量，加速电极为实现掺杂的关键步骤，决定离子在半导体材料中的深度和分布；Accelerating electrode: The accelerating electrode accelerates the ion beam to the required energy. The accelerating electrode is a key step in achieving doping and determines the depth and distribution of ions in the semiconductor material.
末端分析器：末端分析器用于检测和分析注入后的半导体材料，测量掺杂浓度、分布和其他性能参数，以确保工艺的准确性和一致性。End-point analyzer: The end-point analyzer is used to detect and analyze the semiconductor material after implantation, measuring the doping concentration, distribution and other performance parameters to ensure the accuracy and consistency of the process.
注入腔3，位于机体1内部，且该注入腔3设置真空系统，真空系统连通注入腔3并控制真空腔的真空度，注入腔3内部设置可承载硅片的靶盘5，该靶盘5实现轴向转动，且离子注入系统2朝向靶盘5；An injection chamber 3 is located inside the body 1, and a vacuum system is provided in the injection chamber 3. The vacuum system is connected to the injection chamber 3 and controls the vacuum degree of the vacuum chamber. A target plate 5 capable of carrying a silicon wafer is provided inside the injection chamber 3. The target plate 5 realizes axial rotation, and the ion implantation system 2 faces the target plate 5.
装载腔体8，位于该机体1内部，其内部设置多个用于装载硅片的硅片装载台6，硅片装载台6在装载和拆卸过程中进行两种状态的切换，装载过程中硅片装载台6内部的空气排出与注入腔3真空度一致，拆卸过程中的硅片装载台6连通装载过程中的硅片装载台6并导流装载过程中硅片装载台6内部的空气；The loading chamber 8 is located inside the machine body 1, and a plurality of wafer loading platforms 6 for loading wafers are arranged inside the loading chamber 8. The wafer loading platforms 6 are switched between two states during loading and unloading. During loading, the air inside the wafer loading platforms 6 is discharged to be consistent with the vacuum degree of the injection chamber 3. During unloading, the wafer loading platforms 6 are connected to the wafer loading platforms 6 during loading and guide the air inside the wafer loading platforms 6 during loading.
其中，靶盘5配置多个用于固定硅片的承载台502，硅片装载台6与承载台502轴线重合设置，且靶盘5可转动实现对硅片位置的调整，硅片装载台6控制硅片改变位置，在硅片向外运动时接触承载台502，在硅片离子注入完成后，硅片装载台6回收硅片；The target plate 5 is equipped with a plurality of carriers 502 for fixing silicon wafers. The silicon wafer loading platform 6 is arranged to coincide with the axis of the carrier 502. The target plate 5 can rotate to adjust the position of the silicon wafer. The silicon wafer loading platform 6 controls the silicon wafer to change its position and contacts the carrier 502 when the silicon wafer moves outward. After the ion implantation of the silicon wafer is completed, the silicon wafer loading platform 6 recycles the silicon wafer.
对接组件7，配置于硅片装载台6与注入腔3之间，形成硅片装载台6以及注入腔3的密封，对接组件7处于开启状态时硅片装载台6与注入腔3连通。The docking assembly 7 is disposed between the wafer loading platform 6 and the injection cavity 3 to form a seal between the wafer loading platform 6 and the injection cavity 3. When the docking assembly 7 is in an open state, the wafer loading platform 6 is connected to the injection cavity 3.
在本实施例中，硅片放置于硅片装载台6内部，硅片装载台6通过对接组件7实现与注入腔3的对接，从而来保证注入腔3内部的真空度稳定，而在对接组件7未连通硅片装载台6和注入腔3之前，硅片装载台6首先将其内部的真空度调整为与注入腔3内部真空度一致，避免在对接组件7开启时，注入腔3内部的真空度波动影响离子注入的稳定性。In this embodiment, the silicon wafer is placed inside the silicon wafer loading platform 6, and the silicon wafer loading platform 6 is docked with the injection chamber 3 through the docking assembly 7, so as to ensure the stability of the vacuum degree inside the injection chamber 3. Before the docking assembly 7 connects the silicon wafer loading platform 6 and the injection chamber 3, the silicon wafer loading platform 6 first adjusts the vacuum degree inside it to be consistent with the vacuum degree inside the injection chamber 3, so as to avoid the vacuum degree fluctuation inside the injection chamber 3 affecting the stability of ion implantation when the docking assembly 7 is opened.
其中，装载中的硅片装载台6进行装载时，会与拆卸中的硅片装载台6连通，而由于装载中的硅片装载台6内部存在空气，而拆卸中的硅片装载台6内部真空，因此，装载过程中的硅片装载台6内部空气会进入到拆卸中的硅片装载台6内部，从而降低装载过程中硅片装载台6内部的空气含量，能够更快的调整装载硅片装载台6内部的状态。Among them, when the silicon wafer loading platform 6 being loaded is loaded, it will be connected with the silicon wafer loading platform 6 being disassembled. Since there is air inside the silicon wafer loading platform 6 being loaded, and there is vacuum inside the silicon wafer loading platform 6 being disassembled, the air inside the silicon wafer loading platform 6 during the loading process will enter into the silicon wafer loading platform 6 being disassembled, thereby reducing the air content inside the silicon wafer loading platform 6 during the loading process, and the state inside the loaded silicon wafer loading platform 6 can be adjusted more quickly.
在一种实施例中，靶盘5还包括：In one embodiment, the target plate 5 further comprises:
盘体501，其底部配置旋转电机用于驱动该盘体501转动，旋转电机固定于机体1内部，承载台502位于盘体501内部且均匀分布，承载台502延伸至该盘体501内部，且盘体501与承载台502之间配置多个电磁铁503形成对承载台502位置的控制；The tray 501 has a rotating motor at its bottom for driving the tray 501 to rotate. The rotating motor is fixed inside the machine body 1. The carrying platforms 502 are located inside the tray 501 and are evenly distributed. The carrying platforms 502 extend into the tray 501. A plurality of electromagnets 503 are arranged between the tray 501 and the carrying platforms 502 to control the position of the carrying platforms 502.
啮合盘505，套设于盘体501外侧并固定连接机体1，啮合盘505内侧开设环槽506，环槽506内部配置插杆507，插杆507延伸至承载台502内部并形成对承载台502的定位。The engaging disk 505 is sleeved on the outside of the disk body 501 and fixedly connected to the body 1. The inner side of the engaging disk 505 is provided with an annular groove 506. The inner side of the annular groove 506 is provided with an insertion rod 507. The insertion rod 507 extends to the inside of the supporting platform 502 to form a positioning for the supporting platform 502.
在本实施例中，啮合盘505内侧形状为凸轮状，而环槽506的形状与啮合盘505内侧形状一致，插杆507延伸至环槽506内部的一端被限制在环槽506内部，与电磁铁503形成对承载台502的双重固定，且插杆507跟随盘体501转动，并在运动至啮合盘505内侧凸轮状的凸起位置时脱离对承载台502的限制。In this embodiment, the inner shape of the engaging disk 505 is cam-shaped, and the shape of the annular groove 506 is consistent with the inner shape of the engaging disk 505. The end of the insertion rod 507 extending to the inside of the annular groove 506 is restricted inside the annular groove 506, forming a double fixation of the support platform 502 with the electromagnet 503, and the insertion rod 507 rotates with the disk body 501, and when it moves to the cam-shaped raised position on the inner side of the engaging disk 505, it disengages from the restriction on the support platform 502.
在插杆507脱离对承载台502的限制时，电磁铁503产生相斥的力会使承载台502向外凸起，以便于能够使硅片与硅片装载台6对接，硅片装载台6设置在啮合盘505内侧凸轮状凸起位置。When the insertion rod 507 is free from the restriction on the carrier 502, the electromagnet 503 generates a repulsive force to cause the carrier 502 to bulge outward, so that the silicon wafer can dock with the silicon wafer loading platform 6, which is set at the cam-shaped protrusion position inside the engaging disk 505.
在一种实施例中，靶盘5还包括：In one embodiment, the target plate 5 further comprises:
调节头511，可滑动设置于该盘体501内侧，承载台502内侧设置用于限制调节头511运动路径的槽体，该调节头511外侧设置夹块512，夹块512可转动安装于该调节头511内侧，调节头511内侧为弹性滚轮516；The adjusting head 511 is slidably arranged inside the plate 501. A groove body for limiting the movement path of the adjusting head 511 is arranged inside the supporting platform 502. A clamping block 512 is arranged outside the adjusting head 511. The clamping block 512 is rotatably installed inside the adjusting head 511. An elastic roller 516 is arranged inside the adjusting head 511.
弹性滚轮516延伸至夹块512内部一端设置压片组514，压片组514控制弹性滚轮516摆动，且压片组514与夹块512之间配置弹簧513形成对压片组514的支撑，压片组514背离弹性滚轮516的一端延伸至夹块512与调节头511的连接位置，且该压片组514被弹性滚轮516支撑后脱离与调节头511的接触。The elastic roller 516 extends to one end inside the clamping block 512 and a pressing plate group 514 is set. The pressing plate group 514 controls the swing of the elastic roller 516, and a spring 513 is arranged between the pressing plate group 514 and the clamping block 512 to form a support for the pressing plate group 514. The pressing plate group 514 extends to the connection position between the clamping block 512 and the adjusting head 511 at one end away from the elastic roller 516, and the pressing plate group 514 is supported by the elastic roller 516 and then separated from the contact with the adjusting head 511.
在本实施例中，通过设置能够改变状态的压片组514，在使用时能够通过弹性滚轮516被挤压从而使压片组514的状态改变，利用改变状态的压片组514来使压片组514脱离与调节头511的接触，从而能够使夹块512能够相对于调节头511转动，进而能够根据硅片的大小来调整夹块512的位置，使夹块512能够适用于不同规格尺寸的硅片。In this embodiment, a pressing plate group 514 that can change its state is provided. When in use, the elastic roller 516 can be squeezed to change the state of the pressing plate group 514. The pressing plate group 514 that changes its state is utilized to separate the pressing plate group 514 from the contact with the adjusting head 511, so that the clamping block 512 can be rotated relative to the adjusting head 511, and the position of the clamping block 512 can be adjusted according to the size of the silicon wafer, so that the clamping block 512 can be suitable for silicon wafers of different specifications and sizes.
其中，由于硅片的大小规格不同，在使用时，调节头511收缩，从而带动夹块512改变位置，而夹块512在改变位置之后能够围绕调节头511摆动，而由于调节头511不处于硅片的中心位置，因此，在夹块512摆动后，弹性滚轮516距离中心的位置产生变化，从而来适应不同的硅片。Among them, due to the different sizes of silicon wafers, when in use, the adjusting head 511 contracts, thereby driving the clamping block 512 to change its position, and the clamping block 512 can swing around the adjusting head 511 after changing its position. Since the adjusting head 511 is not at the center of the silicon wafer, after the clamping block 512 swings, the position of the elastic roller 516 from the center changes, thereby adapting to different silicon wafers.
在另一种实施例中，为了便于在夹块512夹持硅片之后复位，夹块512与调节头511之间设置扭簧，在扭簧的作用下，没有外力限制弹性滚轮516时，夹块512能够复位，而在调节头511复位后，在调节头511连接夹块512的位置对应设置磁块，磁块磁吸压片组514的一端，在位置下，压片组514脱离与调节头511的接触，从而便于在扭簧的作用下复位。In another embodiment, in order to facilitate resetting after the clamping block 512 clamps the silicon wafer, a torsion spring is arranged between the clamping block 512 and the adjusting head 511. Under the action of the torsion spring, when there is no external force restricting the elastic roller 516, the clamping block 512 can be reset. After the adjusting head 511 is reset, a magnetic block is arranged corresponding to the position where the adjusting head 511 connects the clamping block 512. The magnetic block magnetically attracts one end of the pressure sheet group 514. When the pressure sheet group 514 is in the position, the pressure sheet group 514 is separated from the contact with the adjusting head 511, thereby facilitating resetting under the action of the torsion spring.
在一种实施例中，靶盘5还包括：In one embodiment, the target plate 5 further comprises:
导槽508，开设于该盘体501内部，插杆507延伸至该导槽508内部，导槽508一侧设置介质腔509，介质腔509内部填充介质，且插杆507在导槽508内部运动能够推动介质腔509内部的介质运动；A guide groove 508 is provided inside the disk body 501, and the insertion rod 507 extends into the guide groove 508. A medium cavity 509 is provided on one side of the guide groove 508. The medium cavity 509 is filled with a medium, and the movement of the insertion rod 507 inside the guide groove 508 can promote the movement of the medium inside the medium cavity 509.
推杆510，可滑动安装于该盘体501内侧，调节头511固定于该推杆510延伸至盘体501外侧的一端。The push rod 510 is slidably mounted on the inner side of the disk body 501 , and the adjustment head 511 is fixed to one end of the push rod 510 extending to the outer side of the disk body 501 .
在本实施例中，设置推杆510来进行调节头511的驱动，在盘体501转动的过程中，插杆507被环槽506限制，从而来改变插杆507的位置，插杆507位置改变从而使介质腔509内部的介质带动推杆510改变位置，从而能够控制调节头511的位置。In this embodiment, a push rod 510 is provided to drive the adjusting head 511. During the rotation of the disk body 501, the insertion rod 507 is restricted by the annular groove 506, thereby changing the position of the insertion rod 507. The change in the position of the insertion rod 507 causes the medium inside the medium cavity 509 to drive the push rod 510 to change its position, thereby being able to control the position of the adjusting head 511.
其中，调节头511在收缩状态下不限制承载台502的运动，而调节头511在被插杆507向外推出时，位于槽体内部，限制承载台502的位置。The adjusting head 511 does not restrict the movement of the supporting platform 502 in the retracted state, and when the adjusting head 511 is pushed outward by the insertion rod 507 , it is located inside the groove body and restricts the position of the supporting platform 502 .
在一种实施例中，硅片装载台6包括：In one embodiment, the silicon wafer loading station 6 comprises:
滑台601，固定于该装载腔体8内部，且该滑台601内侧设置装载架603，滑台601内侧设置定位架602并驱动定位架602改变位置，装载架603位于该定位架602内侧，装载架603内部设置真空泵613用于改变装载架603内部的真空状态；The slide 601 is fixed inside the loading chamber 8, and a loading frame 603 is arranged inside the slide 601. A positioning frame 602 is arranged inside the slide 601 and drives the positioning frame 602 to change its position. The loading frame 603 is located inside the positioning frame 602. A vacuum pump 613 is arranged inside the loading frame 603 to change the vacuum state inside the loading frame 603.
嵌合块604，固定于该装载架603内部，定位架602通过嵌合块604推动装载架603运动；The engaging block 604 is fixed inside the loading frame 603, and the positioning frame 602 pushes the loading frame 603 to move through the engaging block 604;
引导架606，可转动设置于该装载架603内部，且引导架606内侧设置卡盘607并驱动卡盘607运动；A guide frame 606 is rotatably disposed inside the loading frame 603, and a chuck 607 is disposed inside the guide frame 606 and drives the chuck 607 to move;
驱动电机605，固定于该装载架603内部，该驱动电机605与引导架606之间设置传动组件用于驱动引导架606运动。The driving motor 605 is fixed inside the loading frame 603 , and a transmission assembly is arranged between the driving motor 605 and the guide frame 606 for driving the guide frame 606 to move.
在本实施例中，滑台601能够驱动装载架603运动，从而改变卡盘607的位置，而硅片放置在卡盘607内侧，在使用时由卡盘607带动硅片运动，卡盘607改变位置从而使硅片的位置改变，进而能够使硅片运动至承载台502位置，或进行回收。In this embodiment, the slide 601 can drive the loading frame 603 to move, thereby changing the position of the chuck 607, and the silicon wafer is placed on the inner side of the chuck 607. When in use, the chuck 607 drives the silicon wafer to move. The chuck 607 changes its position, thereby changing the position of the silicon wafer, and then the silicon wafer can be moved to the position of the support platform 502, or recovered.
在一种实施例中，硅片装载台6还包括：In one embodiment, the silicon wafer loading station 6 further includes:
弹片608，弹性设置于该卡盘607内侧；A spring piece 608, elastically disposed inside the chuck 607;
夹板610，可摆动设置于该卡盘607外侧，夹板610内侧靠近卡盘607的位置设置夹头609，夹头609为弹性设置且为半球状凸起；A clamping plate 610 is swingably arranged outside the chuck 607, and a clamping head 609 is arranged inside the clamping plate 610 near the chuck 607. The clamping head 609 is elastically arranged and is a hemispherical protrusion;
电磁片611，固定于夹板610与卡盘607之间，电磁片611磁吸控制夹板610的摆动角度；The electromagnetic sheet 611 is fixed between the clamping plate 610 and the chuck 607, and the electromagnetic sheet 611 magnetically controls the swing angle of the clamping plate 610;
调节架612，设置于承载架内部，该调节架612调整引导架606之间的间隙，引导架606之间的间隙变化改变卡盘607的凸起位置。The adjustment frame 612 is disposed inside the carrier frame, and the adjustment frame 612 adjusts the gap between the guide frames 606 . The change of the gap between the guide frames 606 changes the protruding position of the chuck 607 .
在本实施例中，调节架612调整引导架606的间隙能够改变引导架606间隔位置，而卡盘607可摆动的连接引导架606，在引导架606的间隙被改变时，卡盘607被顶起，从而缩小所夹持硅片的规格，进而能够根据硅片规格的不同来进行相应的调整，相应的，由于硅片在进行加工之前的规格被确定，因此，在调整时装载架603内部为非真空状态，调节架612设置为人工调节的方式。In this embodiment, the adjustment frame 612 adjusts the gap of the guide frame 606 to change the spacing position of the guide frame 606, and the chuck 607 is swingably connected to the guide frame 606. When the gap of the guide frame 606 is changed, the chuck 607 is lifted up, thereby reducing the specifications of the clamped silicon wafer, and then corresponding adjustments can be made according to the different specifications of the silicon wafer. Accordingly, since the specifications of the silicon wafer are determined before processing, the interior of the loading frame 603 is in a non-vacuum state during adjustment, and the adjustment frame 612 is set to be manually adjusted.
在一种实施例中，对接组件7包括：In one embodiment, the docking assembly 7 comprises:
安装盘701，可拆卸安装于该装载架603内侧，安装盘701内侧设置第一密封板702，第一密封板702组合形成对装载架603的密封；The mounting plate 701 is detachably mounted on the inner side of the loading rack 603. A first sealing plate 702 is disposed on the inner side of the mounting plate 701. The first sealing plate 702 is assembled to form a seal for the loading rack 603.
第二密封板703，设置于机体1内部形成对注入腔3的密封，第一密封板702与第二密封板703贴合，且第一密封板702与第二密封板703贴合后没有缝隙；The second sealing plate 703 is arranged inside the body 1 to form a seal for the injection cavity 3. The first sealing plate 702 is fitted with the second sealing plate 703, and there is no gap between the first sealing plate 702 and the second sealing plate 703.
啮合块704与卡槽705，分别设置于第一密封板702和第二密封板703外侧，啮合块704与卡槽705适配，啮合块704插入卡槽705内部后第一密封板702和第二密封板703同步运动。The engagement block 704 and the slot 705 are respectively arranged on the outside of the first sealing plate 702 and the second sealing plate 703. The engagement block 704 is adapted to the slot 705. After the engagement block 704 is inserted into the slot 705, the first sealing plate 702 and the second sealing plate 703 move synchronously.
在本实施例中，设置第一密封板702和第二密封板703的配合，来保证装载架603与注入腔3的密封稳定，而在使用时，第一密封板702与第二密封板703贴合没有间隙，不会出现缝隙，因此，进一步的保证注入腔3和装载架603内部的真空度稳定。In this embodiment, the first sealing plate 702 and the second sealing plate 703 are provided to ensure the stable sealing between the loading rack 603 and the injection chamber 3. When in use, the first sealing plate 702 and the second sealing plate 703 fit together without any gap, and no cracks will appear, thereby further ensuring the stability of the vacuum degree inside the injection chamber 3 and the loading rack 603.
其中，为了保证第一密封板702在安装时的稳定性，第一密封板702相接触位置设置为凸起与凹槽的配合，凸起与凹槽均设置为球形，通过挤压力使凸起进入到凹槽内部，保证第一密封板702之间的稳定性。Among them, in order to ensure the stability of the first sealing plate 702 during installation, the contact position of the first sealing plate 702 is set to cooperate with a protrusion and a groove, and the protrusion and the groove are both set to be spherical. The protrusion is entered into the groove through the extrusion force to ensure the stability between the first sealing plates 702.
在一种实施例中，对接组件7还包括：In one embodiment, the docking assembly 7 further comprises:
伸缩杆709，固定于该机体1内部，伸缩杆709伸缩端设置齿条708并驱动齿条708运动；A telescopic rod 709 is fixed inside the body 1, and a rack 708 is provided at the telescopic end of the telescopic rod 709 to drive the rack 708 to move;
转盘707，可转动安装于该机体1内侧，且第二密封板703延伸至转盘707内侧，齿条708啮合转盘707并驱动转盘707转动，转盘707转动控制第二密封板703的开启和关闭。The turntable 707 is rotatably mounted on the inner side of the machine body 1 , and the second sealing plate 703 extends to the inner side of the turntable 707 . The rack 708 engages with the turntable 707 and drives the turntable 707 to rotate. The rotation of the turntable 707 controls the opening and closing of the second sealing plate 703 .
在本实施例中，转盘707内侧的滑槽706为弧形设置，且该转盘707外侧设置齿牙与齿条708配合，从而在齿条708运动的过程中能够驱动转盘707转动，利用转盘707的转动来开启第一密封板702和第二密封板703对于注入腔3和装载架603之间的密封。In this embodiment, the slide groove 706 on the inner side of the turntable 707 is arranged in an arc shape, and teeth are arranged on the outer side of the turntable 707 to cooperate with the rack 708, so that the turntable 707 can be driven to rotate during the movement of the rack 708, and the rotation of the turntable 707 is utilized to open the first sealing plate 702 and the second sealing plate 703 to seal between the injection chamber 3 and the loading frame 603.
在一种实施例中，装载腔体8包括：In one embodiment, the loading chamber 8 comprises:
滑动腔体801，开设于该机体1内侧，滑台601固定于该滑动腔体801，且装载架603在滑动腔体801内部运动；A sliding cavity 801 is provided inside the body 1, the slide 601 is fixed to the sliding cavity 801, and the loading frame 603 moves inside the sliding cavity 801;
电控阀802，安装于滑动腔体801之间，电控阀802开启状态下滑动腔体801连通，电控阀802关闭时滑动腔体801相互独立；The electric control valve 802 is installed between the sliding cavities 801. When the electric control valve 802 is open, the sliding cavities 801 are connected. When the electric control valve 802 is closed, the sliding cavities 801 are independent of each other.
连通管803，固定于该装载架603外侧并与装载架603连通设置，连通管803可与电控阀802对中。The connecting pipe 803 is fixed to the outside of the loading frame 603 and is connected to the loading frame 603 . The connecting pipe 803 can be aligned with the electric control valve 802 .
在本实施例中，设置连通管803形成装载架603与电控阀802之间的对中，在电控阀802开启后，既能够通过连通管803来连通两个滑动腔体801内部的装载架603，从而能够平衡装载架603内部的气体，从而降低装载过程中的装载架603内部气体，提高真空效率。In this embodiment, a connecting pipe 803 is provided to form an alignment between the loading rack 603 and the electric control valve 802. After the electric control valve 802 is opened, the loading racks 603 inside the two sliding cavities 801 can be connected through the connecting pipe 803, so that the gas inside the loading rack 603 can be balanced, thereby reducing the gas inside the loading rack 603 during the loading process and improving the vacuum efficiency.
在一种实施例中，装载腔体8还包括：In one embodiment, the loading chamber 8 further comprises:
密封套805，安装于该滑动腔体801内壁，连通管803连通电控阀802的一端与密封套805接触，密封套805中部设置通孔804，通孔804贯穿密封套805，连通管803在通孔804位置连通电控阀802；The sealing sleeve 805 is installed on the inner wall of the sliding cavity 801. One end of the connecting pipe 803 connected to the electric control valve 802 contacts the sealing sleeve 805. A through hole 804 is arranged in the middle of the sealing sleeve 805. The through hole 804 penetrates the sealing sleeve 805. The connecting pipe 803 is connected to the electric control valve 802 at the position of the through hole 804.
单向阀806，固定于连通管803中部位置。The one-way valve 806 is fixed at the middle position of the connecting pipe 803 .
在本实施例中，密封套805的设置能够增加连接管的密封性，而密封套805为弹性设置，在使用时，装载架603内部的空气被排出，而由于密封套805与连通管803的接触，能够保证连通管803位置的密封状态。In this embodiment, the setting of the sealing sleeve 805 can increase the sealing performance of the connecting pipe, and the sealing sleeve 805 is elastically set. When in use, the air inside the loading rack 603 is discharged, and due to the contact between the sealing sleeve 805 and the connecting pipe 803, the sealing state of the connecting pipe 803 can be ensured.
其中，单向阀806的设置能够在多个硅片装载台6之间形成单向的连通环境。The setting of the one-way valve 806 can form a one-way communication environment between the multiple silicon wafer loading platforms 6 .
综上所述，本发明上述实施方式所揭露的技术方案至少具有以下优点：In summary, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages:
1、本发明针对靶盘5与硅片装载台6之间的连接方式，使硅片装载台6直接对接靶盘5，靶盘5运动时硅片装载台6将硅片输送至靶盘5承托位置，而硅片装载台6与靶盘5的承托位置对中，在硅片被输送至靶盘5承托位置时，靶盘5能够自适应完成对不同规格硅片的限位，保证硅片的稳定。1. The present invention aims at the connection mode between the target plate 5 and the silicon wafer loading platform 6, so that the silicon wafer loading platform 6 is directly connected to the target plate 5. When the target plate 5 moves, the silicon wafer loading platform 6 transports the silicon wafer to the supporting position of the target plate 5, and the supporting position of the silicon wafer loading platform 6 and the target plate 5 are aligned. When the silicon wafer is transported to the supporting position of the target plate 5, the target plate 5 can adaptively complete the limiting of silicon wafers of different specifications to ensure the stability of the silicon wafer.
2、多个硅片装载台6被设置于多个相互连通的装载腔体8内部，装载过程中的硅片装载台6与靶盘5对接时，能够首先利用拆卸过程中的硅片装载台6来抽取装载过程中硅片装载台6内部的空气，使装载过程中硅片装载台6和拆卸硅片状态内部的气压相同，来提高装载硅片装载台6抽真空的速度。2. Multiple silicon wafer loading platforms 6 are arranged inside multiple interconnected loading cavities 8. When the silicon wafer loading platform 6 during the loading process is docked with the target plate 5, the silicon wafer loading platform 6 during the disassembly process can be used to first extract the air inside the silicon wafer loading platform 6 during the loading process, so that the air pressure inside the silicon wafer loading platform 6 during the loading process and the silicon wafer disassembly state is the same, thereby increasing the speed of vacuuming the silicon wafer loading platform 6.
3、硅片装载台6实现对硅片的装卸，靶盘5位于开启状态，在该状态下靶盘5仅能够起到对硅片的承托作用，使硅片能够由硅片装载台6驱动，从而改变硅片的位置，完成对硅片的装卸，由硅片装载台6直接实现对硅片的装卸，从而提高硅片的装卸效率。3. The silicon wafer loading platform 6 realizes the loading and unloading of silicon wafers. The target plate 5 is in the open state. In this state, the target plate 5 can only support the silicon wafer, so that the silicon wafer can be driven by the silicon wafer loading platform 6, thereby changing the position of the silicon wafer and completing the loading and unloading of the silicon wafer. The silicon wafer loading platform 6 directly realizes the loading and unloading of the silicon wafer, thereby improving the loading and unloading efficiency of the silicon wafer.
4、硅片由硅片装载台6被安装于靶盘5上，靶盘5根据硅片规格做出自适应改变，从而改变对硅片的夹持位置，不同规格均能够稳定的被靶盘5夹持，保证硅片在靶盘5上的稳定，确保硅片的位置精准，进一步的保证离子注入的精度。4. The silicon wafer is mounted on the target plate 5 by the silicon wafer loading platform 6. The target plate 5 makes adaptive changes according to the specifications of the silicon wafer, thereby changing the clamping position of the silicon wafer. Different specifications can be stably clamped by the target plate 5, ensuring the stability of the silicon wafer on the target plate 5, ensuring the accurate position of the silicon wafer, and further ensuring the accuracy of ion implantation.
虽然结合以上实施方式公开了本发明，然而其并非用以限定本发明，任何熟悉此技艺者，在不脱离本发明的精神和范围内，可作各种的更动与润饰，因此本发明的保护范围应当以所附的权利要求所界定的为准。Although the present invention is disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the attached claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410519142.2ACN118299316B (en) | 2024-04-28 | 2024-04-28 | Ion implanter for manufacturing semiconductor chip |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410519142.2ACN118299316B (en) | 2024-04-28 | 2024-04-28 | Ion implanter for manufacturing semiconductor chip |
| Publication Number | Publication Date |
|---|---|
| CN118299316Atrue CN118299316A (en) | 2024-07-05 |
| CN118299316B CN118299316B (en) | 2024-10-29 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410519142.2AActiveCN118299316B (en) | 2024-04-28 | 2024-04-28 | Ion implanter for manufacturing semiconductor chip |
| Country | Link |
|---|---|
| CN (1) | CN118299316B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118983253A (en)* | 2024-08-02 | 2024-11-19 | 无锡诚承电子科技有限公司 | A semiconductor ion implantation machine wafer precision positioning device |
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| JP2008124481A (en)* | 2007-11-26 | 2008-05-29 | Canon Anelva Corp | Method of conveying object to be processed in vacuum processing apparatus |
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| CN108735563A (en)* | 2017-04-25 | 2018-11-02 | 北京中科信电子装备有限公司 | A kind of ion implanting terminal installation |
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| CN118983253A (en)* | 2024-08-02 | 2024-11-19 | 无锡诚承电子科技有限公司 | A semiconductor ion implantation machine wafer precision positioning device |
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