Disclosure of Invention
The embodiment of the disclosure provides a manifold microchannel heat dissipation device, which comprises a base plate, a plurality of fins, a heat dissipation structure and a cover plate. The fins and the heat dissipation structure are located between the base plate and the cover plate. The plurality of fins are uniformly distributed about a central axis perpendicular to the base plate. The heat dissipation structure is provided with an inlet manifold channel, a plurality of split manifold channels, a plurality of annular micro-channels and a plurality of outlet manifold channels. The inlet manifold channel is opposite the plurality of fins along the central axis. The plurality of manifold channels are evenly distributed about the central axis, each manifold channel being disposed radially of the central axis, each manifold channel being in communication with the inlet manifold channel. The plurality of annular micro-channels are uniformly distributed around the central axis from inside to outside, and the plurality of annular micro-channels are communicated with the plurality of split manifold channels. The plurality of outlet manifold channels are uniformly distributed around the central axis and are communicated with the plurality of annular micro-channels. The cover plate is provided with a fluid inlet and a plurality of fluid outlets, the fluid inlet is communicated with the inlet manifold channel, and the fluid outlets are communicated with the outlet manifold channels in a one-to-one correspondence manner.
According to the manifold microchannel heat dissipation device provided by the embodiment of the disclosure, the fins are uniformly distributed around the central axis perpendicular to the substrate, the inlet manifold channels and the fluid inlets are opposite to the fins along the central axis, and after the fluid enters the inlet manifold channels through the fluid inlets, the fluid is uniformly distributed into the plurality of distribution manifold channels through the distribution of the fins, so that the fluid uniformly flows into the plurality of annular microchannels. The annular micro-channels are matched with the annular chip in shape, and the plurality of fins and the plurality of annular micro-channels can be used for realizing uniform distribution of fluid, so that the uniformity of heat dissipation is improved, and the heat dissipation effect is better.
In some embodiments, the heat dissipating structure includes a microchannel layer and a manifold layer. The manifold layer is located between the cover plate and the microchannel layer along the central axis. The manifold layer comprises an inlet manifold channel, a plurality of branch manifold channels and a plurality of outlet manifold channels, the micro-channel layer comprises a plurality of annular micro-channels connected to the base plate, and each branch manifold channel is communicated with the plurality of annular micro-channels.
By the arrangement, fluid entering from the inlet manifold channels can be uniformly distributed into the plurality of split manifold channels along the radial direction of the central axis, and the fluid of the plurality of split manifold channels enters into the plurality of annular micro-channels along the axial direction of the central axis, so that the flow path of the fluid is shortened and the pressure drop is reduced while the uniform distribution of the fluid is realized.
In some embodiments, the heat dissipating structure includes a microchannel layer and a manifold layer, the manifold layer being located between the cover plate and the microchannel layer along a central axis. The manifold layer comprises an inlet manifold channel and a plurality of outlet manifold channels, the micro-channel layer comprises a plurality of annular micro-channels and a plurality of split manifold channels, the annular micro-channels are connected to the base plate, the split manifold channels are connected to the base plate, and each split manifold channel is communicated with the annular micro-channels.
By the arrangement, fluid entering from the inlet manifold channels can be uniformly distributed into the plurality of split manifold channels along the axial direction of the central axis, and the fluid of the plurality of split manifold channels enters into the plurality of annular micro-channels along the radial direction of the central axis, so that the flow path of the fluid is shortened and the pressure drop is reduced while the uniform distribution of the fluid is realized.
In some embodiments, the heat dissipating structure includes a microchannel layer and a manifold layer, the manifold layer being located between the cover plate and the microchannel layer along a central axis. The manifold channels include a first manifold channel and a second manifold channel. The manifold layer comprises an inlet manifold channel, a plurality of first split manifold channels and a plurality of outlet manifold channels, wherein each first split manifold channel is communicated with a plurality of annular micro-channels. The microchannel layer comprises a plurality of annular microchannels and a plurality of second shunt manifold channels, the microchannel layer is connected to the substrate, the plurality of second shunt manifold channels are connected to the substrate, and each second shunt manifold channel is communicated with the plurality of annular microchannels.
By the arrangement, fluid entering from the inlet manifold channels can be uniformly distributed into the first manifold channels along the radial direction of the central axis, and the fluid of the first manifold channels enters into the second manifold channels and the annular micro-channels along the axial direction of the central axis, so that the flow path of the fluid is shortened and the pressure drop is reduced while the uniform distribution of the fluid is realized.
In some embodiments, the plurality of fins are uniformly distributed in three layers around the central axis from inside to outside, and the fins are in a quadrangular or cylindrical shape.
The fin can play a role in guiding the entering positioning fluid while playing a role in heat dissipation, adjusts the flowing direction of the fluid, is favorable for uniform distribution of the fluid, and improves the uniformity of heat dissipation. Meanwhile, the heat exchange area of the central jet flow area is enlarged, and the heat dissipation effect of the radial tail end area of the micro-channel layer is improved.
In some embodiments, the radial dimension of each annular microchannel along the central axis ranges from 0.02mm to 1mm, and the axial dimension of each annular microchannel along the central axis is 3-10 times the radial dimension along the central axis. The axial dimension of the inlet manifold channel along the central axis is 10-30 times of the axial dimension of the annular microchannel width along the central axis. The dimension of the fins along the central axis is 20% -60% of the dimension of the inlet manifold channels along the central axis.
By the arrangement, the heat dissipation effect of the annular micro-channel is improved. The uniformity of the chip surface temperature is increased. The disadvantage of large flow pressure drop of the micro-channel is reduced.
In some embodiments, the split manifold channel is radially opposite the central axis at an inlet end and a blocking end, the inlet end being connected to the inlet manifold channel. The size of the inlet end is 0.5-3 times of the size of the blocking end.
By the arrangement, the flow speed of the fluid in each split manifold channel from inside to outside is improved, the consistency of the flow of the fluid in each micro channel is ensured, and the heat dissipation uniformity is improved.
In some embodiments, the substrate is provided with a plurality of first positioning holes, the plurality of first positioning holes are uniformly distributed around the central axis, and the plurality of first positioning holes are located in an edge region of the substrate. The cover plate is provided with a plurality of second positioning holes which are uniformly distributed around the central axis, and the second positioning holes are communicated with the first positioning holes in a one-to-one correspondence manner.
The arrangement is beneficial to improving the mounting accuracy of the base plate and the cover plate, so that the fluid inlet, the inlet manifold channel and the fins correspond to each other, and the communication between the fluid inlet and the micro-channels is prevented from being blocked.
Embodiments of the present disclosure provide a method for manufacturing a manifold microchannel heat sink that includes forming a plurality of fins uniformly distributed about a central axis perpendicular to a base plate. The heat dissipation structure is formed and provided with an inlet manifold channel, a plurality of split manifold channels, a plurality of annular micro-channels and a plurality of outlet manifold channels, wherein the inlet manifold channel is opposite to the fins along the central axis, the split manifold channels are uniformly distributed around the central axis, each split manifold channel is arranged along the radial direction of the central axis and communicated with the inlet manifold channel, the annular micro-channels are distributed around the central axis from inside to outside and communicated with the split manifold channels, the outlet manifold channels are distributed around the central axis, and the outlet manifold channels are communicated with the annular micro-channels. A cover plate having a fluid inlet and a plurality of fluid outlets is formed. And the cover plate is arranged on one side of the fins and the heat dissipation structure, which is opposite to the base plate, the fluid inlet is communicated with the inlet manifold channel, and the fluid outlets are communicated with the outlet manifold channels in a one-to-one correspondence manner.
The method for manufacturing the manifold microchannel heat dissipating device is simple in processing and improves production efficiency. The manifold microchannel heat dissipation device manufactured by the method can realize uniform distribution of fluid, improves heat dissipation uniformity and has better heat dissipation effect.
The embodiment of the disclosure provides a method for radiating heat, and the method comprises the steps of introducing a heat-conducting medium into a fluid inlet in a jet flow mode, enabling the heat-conducting medium to flow into a plurality of split manifold channels after being uniformly distributed through a plurality of fins by the inlet manifold channels, enabling the heat-conducting medium in the plurality of split manifold channels to flow into a plurality of annular micro-channels, and enabling the heat-conducting medium in the plurality of annular micro-channels to flow and be converged into a plurality of outlet manifold channels. And the heat conducting medium in the plurality of outlet manifold channels flows out through the plurality of fluid outlets respectively.
According to the method for heat dissipation provided by the embodiment of the disclosure, fluid enters the fluid inlet in a jet flow mode, flows in the annular micro-channels through the manifold split-flow channels, and shortens the fluid flow while realizing uniform distribution of the fluid, and reduces the pressure drop, so that the uniformity of heat dissipation is improved, and a better heat dissipation effect is achieved.
Detailed Description
In order to make the above objects, features and advantages of the embodiments of the present disclosure more comprehensible, a detailed description of specific embodiments of the present disclosure is provided below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. The disclosed embodiments may be embodied in many other forms other than described herein and similar modifications may be made by those skilled in the art without departing from the spirit of the disclosed embodiments, so that the disclosed embodiments are not limited to the specific examples of embodiments described below.
In the description of the embodiments of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the embodiments of the present disclosure and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present disclosure.
In the presently disclosed embodiments, unless expressly stated and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediary. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. For example, the first positioning hole may also be referred to as a second positioning hole, and the second positioning hole may also be referred to as a first positioning hole. In the description of the embodiments of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.
In the embodiments of the present disclosure, unless explicitly specified and limited otherwise, the terms "connected," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, flexibly connected, rigidly connected in at least one direction, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or directly connected with an intervening medium present, or communicating between two elements internally or interacting between two elements unless explicitly limited otherwise. The terms "mounted," "disposed," "secured," and the like may be construed broadly as connected. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.
As used herein, the terms "layer," "region" and "regions" refer to portions of material that include regions having a certain thickness. The layers can extend horizontally, vertically and/or along a tapered surface. The layer can be a region of uniform or non-uniform continuous structure, whose thickness perpendicular to the direction of extension may be no greater than the thickness of the continuous structure. The layers can include multiple layers, which can be stacked multiple layers, or may be a plurality of layers extending discretely. The various regions in the figures, the shapes of the layers and their relative sizes and positional relationships are exemplary only, as may be subject to variations due to manufacturing tolerances or technical limitations, and may be adjusted to actual requirements.
Referring to fig. 1, fig. 1 illustrates an overall structure of a manifold microchannel heat sink 100 in an embodiment of the present disclosure. The present disclosure relates to the field of semiconductor power device manufacturing technology.
Referring to fig. 2, a manifold microchannel heat sink 100 provided in an embodiment of the disclosure includes a base plate 1, a plurality of fins 2, a heat dissipating structure 3, and a cover plate 4. A plurality of fins 2 and heat dissipating structure 3 are each located between base plate 1 and cover plate 4. Illustratively, the cover plate 4 and the substrate 1 are both disposed in the horizontal direction, and the cover plate 4 and the substrate 1 are stacked in the vertical direction.
A plurality of fins 2 are located on the base plate 1, the plurality of fins 2 being evenly distributed around a central axis perpendicular to the base plate 1. Illustratively, the central axis perpendicular to the base plate 1 is a vertical direction, and the plurality of fins 2 are fixed to the base plate 1 in the vertical direction and are disposed around the central axis of the base plate 1 from inside to outside in the horizontal direction.
The heat dissipation structure 3 has an inlet manifold channel 310, a plurality of split manifold channels 320, a plurality of annular micro-channels 340, and a plurality of outlet manifold channels. The inlet manifold channel 310 is located above the plurality of fins 2 and is directly opposite the plurality of fins 2.
The plurality of manifold channels 320 are evenly distributed around the central axis in a horizontal direction, each manifold channel 320 communicating with the inlet manifold channel 310. Radially of the central axis, each split manifold channel 320 extends outwardly from the junction of the inlet manifold channels 310. Illustratively, each split manifold channel 320 communicates with the inlet manifold channel 310 in a horizontal direction. Illustratively, each split manifold channel 320 communicates with the inlet manifold channel 310 in a vertical direction.
The plurality of annular micro-channels 340 are uniformly distributed around the central axis in a horizontal direction from inside to outside, and the plurality of annular micro-channels 340 are in communication with the plurality of manifold channels 320. Illustratively, the plurality of split manifold channels 320 communicate vertically with the plurality of annular micro-channels 340. Illustratively, the plurality of split manifold channels 320 communicate horizontally with the plurality of annular micro-channels 340.
The plurality of outlet manifold channels are uniformly distributed around the central axis in the horizontal direction, and the plurality of outlet manifold channels are communicated with the plurality of annular micro-channels 340 in the vertical direction.
The cover plate 4 has a fluid inlet 41 and a plurality of fluid outlets 42, wherein the fluid inlet 41 is vertically communicated with the inlet manifold channels 310, and the plurality of fluid outlets 42 are vertically communicated with the plurality of outlet manifold channels in a one-to-one correspondence manner. Illustratively, the fluid inlet 41 and the fluid outlet 42 are both disposed in a vertical direction.
The manifold microchannel heat sink 100 provided in the embodiments of the present disclosure uses a fluid as the heat transfer medium. The heat conducting medium can flow into the plurality of split manifold channels 320 after being uniformly distributed through the plurality of fins 2 from the fluid inlet 41, the heat conducting medium in the plurality of split manifold channels 320 flows into the plurality of annular micro channels 340, and the heat conducting medium in the plurality of annular micro channels 340 flows and is converged into the plurality of outlet manifold channels to flow out through the plurality of fluid outlets 42.
According to the manifold microchannel heat dissipation device 100 provided by the embodiment of the disclosure, the annular microchannel 340 is matched with the annular chip in shape, so that excessive processing is not needed, and meanwhile, the production efficiency of the microchannel is improved. The arrangement of the fins 2 and the annular micro-channels 340 can realize uniform distribution of fluid, improve the uniformity of heat dissipation, better utilize the heat dissipation capacity of the fluid and have better heat dissipation effect.
Illustratively, both the base plate 1 and the cover plate 4 are square. The fluid inlet 41 is located at the center of the cover plate 4 and the plurality of fins 2 are connected to the center of the base plate 1.
Illustratively, the radial dimension of the inlet manifold channel 310 is greater than the radial dimension of the fluid inlet 41.
Illustratively, there are 8 manifold channels 320, each two manifold channels 320 forming a 45 ° angle therebetween. It is understood that the number of manifold channels 320 ranges from 4 to 12.
Illustratively, the number of outlet manifold channels 330 is 2, 3, or 4. It is understood that the outlet manifold channel 330 may be a multiple of 4. For example 8 or 12.
In other embodiments, the fluid outlet 42 may be provided in the peripheral wall of the cover plate 4 in the horizontal direction. It will be appreciated that the number of fluid outlets 42 matches the number of outlet manifold channels 330.
Illustratively, both the fluid outlet 42 and the fluid inlet 41 may be externally connected for delivering the heat transfer medium.
In some embodiments, the heat dissipating structure 3 includes a microchannel layer and a manifold layer 31. The manifold layer 31 is located between the cover plate 4 and the microchannel layer in the vertical direction. The manifold layer 31 includes an inlet manifold channel 310, a plurality of manifold channels 320, and a plurality of outlet manifold channels. A plurality of annular micro-channels 340 are connected to the substrate 1 and belong to the micro-channel layer, and each of the manifold channels 320 vertically communicates with the plurality of annular micro-channels 340.
By the arrangement, the fluid entering from the inlet manifold channel 310 can be uniformly distributed into the plurality of split manifold channels 320 along the horizontal direction, and the fluid of the plurality of split manifold channels 320 enters the plurality of annular micro-channels 340 along the vertical direction, so that the fluid flow is shortened and the pressure drop is reduced while the uniform distribution of the fluid is realized.
In some embodiments, the heat dissipation structure 3 comprises a microchannel layer and a manifold layer 31, the manifold layer 31 being located between the cover plate 4 and the microchannel layer in the vertical direction. The manifold layer 31 includes an inlet manifold channel 310 and a plurality of outlet manifold channels. The micro-channel layer includes a plurality of annular micro-channels 340 and a plurality of manifold channels 320, the plurality of annular micro-channels 340 are connected to the substrate 1, the plurality of manifold channels 320 are connected to the substrate 1, and each manifold channel 320 is connected to the plurality of annular micro-channels 340 along a horizontal direction.
By the arrangement, the fluid entering from the inlet manifold channel 310 can be uniformly distributed into the plurality of split manifold channels 320 along the vertical direction, the fluid of the plurality of split manifold channels 320 enters the plurality of annular micro-channels 340 along the horizontal direction, the fluid flow is shortened while the uniform distribution of the fluid is realized, and the pressure drop is reduced.
In some embodiments, the heat dissipation structure 3 comprises a microchannel layer and a manifold layer 31, the manifold layer 31 being located between the cover plate 4 and the microchannel layer in the vertical direction. The manifold channel 320 includes a first manifold channel 321 and a second manifold channel 322. The manifold layer 31 includes an inlet manifold channel 310, a plurality of first split manifold channels 321, and a plurality of outlet manifold channels, each first split manifold channel 321 communicating with a plurality of annular micro-channels 340 in a vertical direction. The microchannel layer comprises a plurality of annular microchannels 340 and a plurality of second manifold channels 322, the microchannel layer is connected to the substrate 1, the plurality of second manifold channels 322 are connected to the substrate 1, and each second manifold channel 322 is communicated with the plurality of annular microchannels 340 along the horizontal direction.
By the arrangement, the fluid entering from the inlet manifold channel 310 can be uniformly distributed into the first manifold channels 321 along the horizontal direction, and the fluid of the first manifold channels 321 enters the second manifold channels 322 and the annular micro-channels 340 along the vertical direction, so that the fluid flow is shortened and the pressure drop is reduced while the uniform distribution of the fluid is realized.
Illustratively, the first and second split manifold channels 321, 322 are disposed in vertical alignment. In other embodiments, the first split manifold channels 321 are staggered with the second split manifold channels 322 in the vertical direction.
Referring to fig. 3 to 6, the shape of the outlet manifold channel 330 may be fan-shaped or petal-shaped, and the area of the outlet manifold channel 330 may be adjusted according to the actual circumstances.
Referring to fig. 7-9, illustratively, the length of the second split manifold channel 322 in the radial direction cannot be greater than the outer diameter dimension of the outermost annular microchannel 340. It will be appreciated that the radial length of the second split manifold channel 322 may be adjusted according to the actual circumstances.
Illustratively, the number of second split manifold channels 322 is less than or equal to the number of annular micro-channels 340.
The solid materials of the manifold layer 31 and the microchannel layer are illustratively metallic materials. Illustratively, the solid material of the manifold layer 31 and the microchannel layer is copper. Copper has higher heat conductivity coefficient, and is beneficial to heat dissipation. It is understood that the solid materials of the cover plate 4, the manifold layer 31, the micro channel layer and the substrate 1 may be organic non-organic solid materials such as metal, glass, etc.
Illustratively, a turbulator column may be included within the plurality of annular microchannels to enhance the heat transfer effect.
Referring to fig. 10 and 11, in some embodiments, the plurality of fins 2 are uniformly distributed with three layers around the central axis from inside to outside, and the fins 2 have a quadrangular or cylindrical shape.
So set up, fin 2 can play the guide effect to getting into the location fluid when playing the heat dissipation effect, adjusts the flow direction of fluid, is favorable to the even reposition of redundant personnel of fluid, has improved the homogeneity of heat dissipation. Meanwhile, the heat exchange area of the central jet flow area is enlarged, and the heat dissipation effect of the radial tail end area of the micro-channel layer is improved.
Illustratively, the innermost layer is evenly distributed with 4 fins 2, the middle layer is evenly distributed with 10 fins 2, and the outermost layer is evenly distributed with 16 fins 2.
In some embodiments, the radial dimension of each annular microchannel 340 along the central axis ranges from 0.02mm to 1mm, and the axial dimension of each annular microchannel 340 along the central axis is 3-10 times the radial dimension along the central axis. The axial dimension of the inlet manifold channel 310 along the central axis and the axial dimension of the outlet manifold channel 330 along the central axis are 10-30 times the axial dimension of the annular microchannel 340 width along the central axis. The dimension of the fin 2 along the central axis is 20% -60% of the dimension of the inlet manifold channel 310 along the central axis.
Thus, the heat dissipation effect of the annular micro-channel 340 is improved. The uniformity of the chip surface temperature is increased. The disadvantage of large flow pressure drop of the micro-channel is reduced.
Illustratively, the radial dimension along the central axis is a width and the axial dimension along the central axis is a height.
Illustratively, the width of the annular microchannel 340 is 0.3mm. The height of the annular microchannel 340 is 1.5mm.
Illustratively, the spacing between adjacent annular microchannels 340 is a wall thickness. The wall thickness was 0.3mm.
Illustratively, the height of the fins 2 is greater than the height of the annular micro-channels 340 and the height of the fins 2 is less than the height of the inlet manifold channels 310.
Referring again to fig. 7-9, in some embodiments, the split manifold channel 320 is radially opposite the central axis from an inlet end 3211 and a blocking end 3212, the inlet end 3211 being connected to the inlet manifold channel 310. The size of the inlet end 3211 is 0.5 to 3 times the size of the blocking end 3212.
By the arrangement, the flow speed of the fluid in each split manifold channel 320 from inside to outside is improved, the consistency of the flow of the fluid in each micro channel is ensured, and the heat dissipation uniformity is improved.
Illustratively, the size of the inlet end 3211 is 0.8 times the size of the blocking end 3212.
Referring to fig. 4 and 12, in some embodiments, the substrate 1 is provided with a plurality of first positioning holes 11, the plurality of first positioning holes 11 are uniformly distributed around the central axis, and the plurality of first positioning holes 11 are located in an edge region of the substrate 1. The cover plate 4 is provided with a plurality of second positioning holes 43, the second positioning holes 43 are uniformly distributed around the central axis, and the second positioning holes 43 are communicated with the first positioning holes 11 in a one-to-one correspondence manner.
The arrangement is beneficial to improving the installation accuracy of the base plate 1 and the cover plate 4, so that the fluid inlet 41 and the inlet manifold channel 310 correspond to the fins 2, and the communication between the fluid inlet 41 and the micro-channels is prevented from being blocked.
For example, the number of the first positioning holes 11 and the number of the second positioning holes 43 are 4, the 4 first positioning holes 11 are uniformly distributed at four corners of the substrate 1, and the second positioning holes 43 are uniformly distributed at four corners of the cover plate 4.
Illustratively, the manifold layer 31 further includes a partition 5, where the partition 5 is square, and the inlet manifold channel 310, the manifold channel 320, and the outlet manifold channel 330 are located in the partition 5, and four corners of the partition 5 are further provided with 4 third positioning holes 51, where each third positioning hole 51 is located between one first positioning hole 11 and one second positioning hole 43, and each third positioning hole 51 is opposite to one first positioning hole 11 and one second positioning hole 43.
Illustratively, the manifold microchannel heat sink 100 further comprises a direct copper-clad ceramic substrate (DBC plate) disposed on the lower side of the substrate 1 and connected to the substrate 1, wherein the direct copper-clad ceramic substrate comprises a copper layer, an aluminum nitride layer and a copper layer in this order along the vertical direction, the thickness of the copper layer is 0.1mm, and the thickness of the aluminum nitride layer is 0.635mm.
The disclosed embodiments provide a method 1000 for manufacturing a manifold microchannel heat sink, the method 1000 comprising the following steps S101 to S104.
In step S101, a plurality of fins 2 are formed which are uniformly distributed around a central axis perpendicular to the base plate 1.
Step S102, a heat dissipation structure 3 is formed, wherein the heat dissipation structure 3 is provided with an inlet manifold channel 310, a plurality of split manifold channels 320, a plurality of annular micro-channels 340 and a plurality of outlet manifold channels, the inlet manifold channel 310 faces the fins 2 along a central axis, the split manifold channels 320 are uniformly distributed around the central axis, each split manifold channel 320 is arranged along the radial direction of the central axis, each split manifold channel 320 is communicated with the inlet manifold channel 310, the annular micro-channels 340 are distributed around the central axis from inside to outside, the annular micro-channels 340 are communicated with the split manifold channels 320, the outlet manifold channels are distributed around the central axis, and the outlet manifold channels are communicated with the annular micro-channels 340.
In step S103, the cover plate 4 having the fluid inlet 41 and the plurality of fluid outlets 42 is formed.
In step S104, the cover plate 4 is disposed on the side of the fins 2 and the heat dissipation structure 3 facing away from the base plate 1, the fluid inlets 41 are connected to the inlet manifold channels 310, and the fluid outlets 42 are correspondingly connected to the outlet manifold channels.
The method 1000 for manufacturing the manifold microchannel heat sink provided by the embodiment of the disclosure is simple to process and improves the production efficiency. The manifold microchannel heat dissipation device 100 manufactured by the method can realize uniform distribution of fluid, improves heat dissipation uniformity and has better heat dissipation effect.
Illustratively, the method further comprises step S105 of forming a DBC board, which is arranged to be connected to the side of the substrate 1 facing away from the cover plate 4. The connection process can be soldering tin, silver sintering, copper sintering, TLP sintering and other sintering modes or glue, solid glue and other bonding modes.
Illustratively, step S106 is also included, connecting the power chip to a side of the DBC board facing away from the substrate 1. The connection process can be soldering tin, silver sintering, copper sintering, TLP sintering and other sintering modes or glue, solid glue and other bonding modes.
The inlet and outlet ducts may be attached to the cover plate 4 by means of bonding or welding, for example.
Illustratively, the inlet manifold channel 310, the plurality of split manifold channels 320, and the plurality of outlet manifold channels 330 are integrally machined.
For example, the connection mode of the cover plate 4 layer and the manifold layer 31 and the connection mode of the manifold layer 31 and the substrate 1 may be solder, silver sintering, copper sintering, TLP sintering, or bonding mode such as glue or solid glue.
Illustratively, step S104 may be performed first, followed by step S101.
The embodiment of the disclosure provides a method 2000 for heat dissipation, using the manifold microchannel heat dissipation device 100 described above, the method 2000 includes steps S201 to S202.
In step S201, a heat-conducting medium is introduced into the fluid inlet 41 in a jet manner, so that the heat-conducting medium is uniformly distributed through the plurality of fins 2 via the inlet manifold channel 310 and flows into the plurality of manifold channels 320, wherein the heat-conducting medium in the plurality of manifold channels 320 flows into the plurality of annular micro-channels 340, and the heat-conducting medium in the plurality of annular micro-channels 340 flows and is converged into the plurality of outlet manifold channels.
In step S202, the heat-conducting medium in the plurality of outlet manifold channels 330 is flowed out through the plurality of fluid outlets 42, respectively.
According to the method 2000 for heat dissipation provided by the embodiment of the disclosure, fluid enters the fluid inlet 41 in a jet flow manner, flows into the plurality of annular micro-channels 340 through the plurality of manifold diversion channels, shortens the flow path of the fluid while realizing uniform distribution of the fluid, and reduces the pressure drop, so that the uniformity of heat dissipation is improved, and a better heat dissipation effect is achieved.
Taking a ring power chip with a diameter of 20mm as an example, the peripheral area is 30 x 30mm. The microchannel width was set to 0.3mm and the wall thickness of the microchannel was also set to 0.3mm. The diameter of the fluid inlet 41 is set to 4.2mm. The inner diameter of the innermost annular microchannel 340 is 5.4mm, and a jet buffer is formed between the plurality of fins 2 of the outermost layer and the inner diameter of the innermost annular microchannel 340. By numerical simulation, the processing amounts of the straight manifold microchannels, fluidic channels and the annular microchannels 340 of the present disclosure are compared, and specific values are shown in table 1:
TABLE 1
As can be seen from the numerical comparison of Table 1, the number of the annular micro-channels 340 is reduced by 26.4% and the processing length is reduced by 27.3% compared with the straight channels, thereby reducing the processing amount of the micro-channels and improving the production efficiency.
When the heat of the power chip is 500W/cm2, the jet flow velocity is set to be 30g/s, and the common manifold micro-channel, the jet flow radial micro-channel and the annular micro-channel 340 provided by the disclosure are used for heat dissipation, and the obtained values of the highest temperature and the lowest temperature of the chip surface are shown in table 2:
TABLE 2
As can be seen from the numerical comparison of table 2, compared with the jet radial micro-channel solution, the manifold micro-channel heat dissipation device 100 provided by the present disclosure has a maximum temperature of 28.03% on the chip surface, and a temperature uniformity of 41.09% on the chip surface.
Compared with the manifold microchannel scheme, the manifold microchannel heat dissipation device 100 provided by the present disclosure reduces the highest temperature of the chip surface by 15.16% and improves the temperature uniformity of the chip surface by 58.38%.
The technical features of the embodiments disclosed above may be combined in any way, and for brevity, all of the possible combinations of the technical features of the embodiments described above are not described, however, they should be considered as the scope of the description provided in this specification as long as there is no contradiction between the combinations of the technical features.
In the embodiments disclosed above, the order of execution of the steps is not limited, and may be performed in parallel, or performed in a different order, unless explicitly stated and defined otherwise. The sub-steps of the steps may also be performed in an interleaved manner. Various forms of procedures described above may be used, and steps may be reordered, added, or deleted as long as the desired results of the technical solutions provided by the embodiments of the present disclosure are achieved, which are not limited herein.
The above disclosed examples represent only a few embodiments of the invention, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the inventive concept, which falls within the scope of the invention as claimed. The scope of the invention should, therefore, be determined with reference to the appended claims.