技术领域Technical Field
本发明涉及相变散热技术领域，特别涉及一种环路热管相变散热装置及其制造方法。The present invention relates to the technical field of phase change heat dissipation, and in particular to a loop heat pipe phase change heat dissipation device and a manufacturing method thereof.
背景技术Background technique
环路热管属于被动式相变传热装置，由蒸发器、冷凝器、蒸汽管路和液体管路四部分组成。蒸发器内的多孔吸液芯产生的毛细力为驱动源，吸液芯内的液体吸热蒸发，经蒸汽管路进入冷凝器进行放热变成过冷液体，过冷液体在在毛细力的作用下经液体管路回到补偿腔，实现热量的转移。环路热管具有可靠性高、传热距离远、传热量大等优点，在高功率电子设备热管理领域极具应用前景。The loop heat pipe is a passive phase change heat transfer device, which consists of four parts: evaporator, condenser, steam pipeline and liquid pipeline. The capillary force generated by the porous wick in the evaporator is the driving source. The liquid in the wick absorbs heat and evaporates, and enters the condenser through the steam pipeline to release heat and become supercooled liquid. The supercooled liquid returns to the compensation cavity through the liquid pipeline under the action of capillary force to achieve heat transfer. The loop heat pipe has the advantages of high reliability, long heat transfer distance, and large heat transfer capacity, and has great application prospects in the field of thermal management of high-power electronic equipment.
然而，传统平板环路热管的蒸发器一般采用补偿腔、吸液芯和蒸汽槽道垂直布置结构，由于吸液芯自身厚度很薄，只有1-2mm，使得蒸汽槽道内的蒸汽会出现穿过吸液芯跑到补偿腔内的情况，漏热问题严重，并且由于蒸汽的热量聚集在补偿腔，从而影响散热性能，限制环路热管极限散热性能。However, the evaporator of a traditional flat-plate loop heat pipe generally adopts a vertical arrangement structure of a compensation cavity, a liquid wick and a steam channel. Since the liquid wick itself is very thin, only 1-2 mm thick, the steam in the steam channel will pass through the liquid wick and run into the compensation cavity, causing a serious heat leakage problem. In addition, the heat of the steam accumulates in the compensation cavity, which affects the heat dissipation performance and limits the ultimate heat dissipation performance of the loop heat pipe.
发明内容Summary of the invention
基于此，本发明的主要目的是提供一种能够减少漏热、散热可靠的环路热管相变散热装置及其制造方法。Based on this, the main purpose of the present invention is to provide a loop heat pipe phase change heat dissipation device and a manufacturing method thereof that can reduce heat leakage and provide reliable heat dissipation.
为实现上述目的，本发明提供一种环路热管相变散热装置包括：To achieve the above object, the present invention provides a loop heat pipe phase change heat dissipation device comprising:
蒸发器，包括第一盖板、吸液芯及第一底板，所述第一盖板密封盖设于所述第一底板，所述吸液芯设置于所述第一盖板和所述第一底板之间，所述吸液芯的顶部与所述第一盖板的底面贴合，所述吸液芯的底部与所述第一底板的顶面贴合，所述吸液芯将所述第一盖板和所述第一底板围合成的内部空间分隔为横向间隔的补偿腔与蒸发室，所述吸液芯用于储存液体工质，所述液体工质为相变液体，所述第一底板的底面用于与发热源接触贴合；An evaporator, comprising a first cover plate, a liquid wick and a first bottom plate, wherein the first cover plate sealing cover is arranged on the first bottom plate, the liquid wick is arranged between the first cover plate and the first bottom plate, the top of the liquid wick is in contact with the bottom surface of the first cover plate, the bottom of the liquid wick is in contact with the top surface of the first bottom plate, the liquid wick divides the internal space enclosed by the first cover plate and the first bottom plate into a compensation chamber and an evaporation chamber which are laterally spaced, the liquid wick is used to store a liquid working medium, the liquid working medium is a phase-change liquid, and the bottom surface of the first bottom plate is used to contact and fit with a heat source;
冷凝器，包括上翅片、第二盖板、第二底板及下翅片，所述第二盖板密封盖设于所述第二底板，所述第二盖板与所述第二底板围合形成空腔，所述上翅片设置于所述第二盖板的顶面，所述下翅片设置于所述第二底板的底面；A condenser, comprising an upper fin, a second cover plate, a second bottom plate and a lower fin, wherein the second cover plate sealing cover is arranged on the second bottom plate, the second cover plate and the second bottom plate are enclosed to form a cavity, the upper fin is arranged on the top surface of the second cover plate, and the lower fin is arranged on the bottom surface of the second bottom plate;
蒸汽管路，一端与所述第一盖板密封连接，并连通所述蒸发室，所述蒸汽管路的另一端与所述第二底板密封连接，并连通所述空腔；及a steam pipeline, one end of which is sealed and connected to the first cover plate and communicated with the evaporation chamber, and the other end of which is sealed and connected to the second bottom plate and communicated with the cavity; and
液体管路，一端与所述第二底板密封连接，并连通所述空腔，所述液体管路的另一端与所述第一盖板密封连接，并连通所述补偿腔，所述液体管路内具有所述液体工质。A liquid pipeline has one end sealedly connected to the second bottom plate and communicated with the cavity, and the other end of the liquid pipeline is sealedly connected to the first cover plate and communicated with the compensation cavity, and the liquid pipeline contains the liquid working medium.
优选地，所述吸液芯上开设有多个蒸汽槽道，所述蒸汽槽道与所述蒸发室连通。Preferably, a plurality of steam channels are provided on the liquid absorbent core, and the steam channels are communicated with the evaporation chamber.
优选地，所述蒸汽槽道贯穿所述吸液芯。Preferably, the steam channel runs through the absorbent core.
优选地，所述第一盖板开设有内部流道，所述内部流道与所述补偿腔连通，所述液体管路所述内部流道连通。Preferably, the first cover plate is provided with an internal flow channel, the internal flow channel is communicated with the compensation chamber, and the liquid pipeline is communicated with the internal flow channel.
优选地，所述内部流道的底部阵列开设有补液孔，所述补液孔对准所述吸液芯。Preferably, a bottom array of the internal flow channel is provided with liquid replenishment holes, and the liquid replenishment holes are aligned with the liquid absorption core.
优选地，所述第二底板的顶面设置有凸起部，所述凸起部上开设有气孔，所述气孔连通所述空腔和所述蒸汽管路；所述第二底板的侧壁开设有液孔，所述液孔连通所述空腔和所述液体管路，所述液孔的高度低于所述凸起部的高度。Preferably, a raised portion is provided on the top surface of the second bottom plate, an air hole is formed on the raised portion, and the air hole connects the cavity and the steam pipeline; a liquid hole is formed on the side wall of the second bottom plate, and the liquid hole connects the cavity and the liquid pipeline, and the height of the liquid hole is lower than the height of the raised portion.
优选地，环路热管相变散热装置包括如下中的至少一种：Preferably, the loop heat pipe phase change heat dissipation device includes at least one of the following:
所述第一底板的顶面开设有第一环形槽，所述第一盖板的底面开设有与所述第一环形槽适配的第一环形凸起，所述第一环形凸起容置于所述第一环形槽，从而实现所述第一盖板与所述第一底板之间的密封；A first annular groove is formed on the top surface of the first bottom plate, and a first annular protrusion adapted to the first annular groove is formed on the bottom surface of the first cover plate, and the first annular protrusion is accommodated in the first annular groove, thereby achieving sealing between the first cover plate and the first bottom plate;
所述第二盖板的底面开设有第二环形槽，所述第二底板的顶面开设有与所述第二环形槽适配的第二环形凸起，所述第二环形凸起容置于所述第二环形槽，从而实现所述第二盖板与所述第二底板之间的密封。The bottom surface of the second cover plate is provided with a second annular groove, the top surface of the second bottom plate is provided with a second annular protrusion adapted to the second annular groove, and the second annular protrusion is accommodated in the second annular groove, thereby achieving sealing between the second cover plate and the second bottom plate.
优选地，所述吸液芯、所述第一盖板及所述第一底板焊接为一体；所述第二盖板与所述第二底板焊接为一体。Preferably, the wick, the first cover plate and the first bottom plate are welded as one body; and the second cover plate and the second bottom plate are welded as one body.
优选地，环路热管相变散热装置包括如下中的至少一种：Preferably, the loop heat pipe phase change heat dissipation device includes at least one of the following:
所述第一盖板、所述第一底板、所述上翅片、所述第二盖板、所述第二底板、所述下翅片、所述蒸汽管路及所述液体管路由金属材料制成；The first cover plate, the first bottom plate, the upper fin, the second cover plate, the second bottom plate, the lower fin, the steam pipeline and the liquid pipeline are made of metal material;
所述吸液芯为金属材料制成的多孔结构；The liquid wick is a porous structure made of metal material;
所述液体工质为常温高沸点工质或常温低沸点工质，所述常温高沸点工质为水、甲醇或乙醇，所述常温低沸点工质为液氨或丙烯。The liquid working fluid is a working fluid with a high boiling point at room temperature or a working fluid with a low boiling point at room temperature. The working fluid with a high boiling point at room temperature is water, methanol or ethanol, and the working fluid with a low boiling point at room temperature is liquid ammonia or propylene.
为实现上述目的，本发明还提供一种环路热管相变散热装置的制造方法，用于制备上述的环路热管相变散热装置，包括如下步骤：To achieve the above object, the present invention also provides a method for manufacturing a loop heat pipe phase change heat dissipation device, which is used to prepare the above loop heat pipe phase change heat dissipation device, comprising the following steps:
通过机加工制作所述第一盖板、所述第一底板、所述第二盖板、所述第二底板、所述液体管路和所述蒸汽管路；Manufacturing the first cover plate, the first bottom plate, the second cover plate, the second bottom plate, the liquid pipeline and the steam pipeline by machining;
制作所述上翅片和所述下翅片；manufacturing the upper fin and the lower fin;
密封连接所述第二底板和所述第二盖板，并将所述上翅片设置所述第二盖板的顶面，所述下翅片设置于所述第二底板的底面，以得到所述冷凝器；The second bottom plate and the second cover plate are sealed and connected, and the upper fins are arranged on the top surface of the second cover plate, and the lower fins are arranged on the bottom surface of the second bottom plate, so as to obtain the condenser;
通过金属粉末烧结工艺制备所述吸液芯；The liquid absorbent core is prepared by a metal powder sintering process;
将所述吸液芯设置于所述第一底板及所述第一盖板之间，并使所述吸液芯的顶部与所述第一盖板的底面贴合，所述吸液芯的底部与所述第一底板的顶面贴合，且使所述吸液芯将所述第一盖板和所述第一底板围合成的内部空间分隔为横向间隔的补偿腔与蒸发室，然后将所述第一底板及和所述第一盖板密封连接；The wick is arranged between the first bottom plate and the first cover plate, and the top of the wick is fitted with the bottom surface of the first cover plate, the bottom of the wick is fitted with the top surface of the first bottom plate, and the wick divides the internal space enclosed by the first cover plate and the first bottom plate into a compensation chamber and an evaporation chamber which are laterally spaced, and then the first bottom plate and the first cover plate are sealed and connected;
将所述蒸汽管路分别与所述第一盖板、所述第二底板密封连接，所述液体管路分别与所述第二底板、所述第一盖板密封连接。The steam pipeline is sealed and connected to the first cover plate and the second bottom plate respectively, and the liquid pipeline is sealed and connected to the second bottom plate and the first cover plate respectively.
本发明技术方案的优点：当需要给芯片等发热源进行散热时，将蒸发器的第一底板的底面与芯片紧密贴合，芯片工作产生热量经第一底板传导至吸液芯中，吸液芯中的液体工质吸热蒸发相变形成蒸汽，蒸汽工质迅速充满蒸汽区，在压差推动下，蒸汽工质经蒸汽管路快速传输至冷凝器的空腔内，上翅片与下翅片与环境通过对流和辐射进行热量交换，使得蒸汽在第二盖板的内表面快速冷凝释放热量，冷凝后的液体回流至液体管路，在压差驱动下液体工质通过液体管路回流至蒸发器的补偿腔，补偿腔的液体工质在吸液芯的毛细力驱动下回流至吸液芯，从而使得环路热管相变散热装置得以循环工作，不断将芯片热量传递至环境当中，降低芯片温度。此外，由于本发明的吸液芯的顶部与第一盖板的底面贴合，吸液芯的底部与第一底板的顶面贴合，吸液芯将第一盖板和第一底板围合成的内部空间分隔为横向间隔的补偿腔与蒸发室，补偿腔与蒸发室不在吸液芯的厚度方向上，从而本发明的补偿腔、吸液芯及蒸发室是水平布置结构。吸液芯的厚度很薄，吸液芯的长度明显大于吸液芯的厚度，从而蒸发室距离补偿腔的距离较远，从而蒸发室内的蒸汽难以穿过吸液芯跑进补偿腔内，从而保证蒸发室内的蒸汽基本经蒸汽管路传输至冷凝器的空腔内，从而漏热极少；蒸汽基本传输至冷凝器的空腔内进行冷却，使得散热更加可靠，从而使得环路热管极限散热性能更佳。The advantages of the technical solution of the present invention are as follows: when it is necessary to dissipate heat for a heat source such as a chip, the bottom surface of the first bottom plate of the evaporator is tightly fitted to the chip, and the heat generated by the chip is conducted to the liquid wick through the first bottom plate. The liquid working medium in the liquid wick absorbs heat and evaporates and changes phase to form steam. The steam working medium quickly fills the steam area. Driven by the pressure difference, the steam working medium is quickly transmitted to the cavity of the condenser through the steam pipeline. The upper fin and the lower fin exchange heat with the environment through convection and radiation, so that the steam is quickly condensed on the inner surface of the second cover plate to release heat, and the condensed liquid flows back to the liquid pipeline. Driven by the pressure difference, the liquid working medium flows back to the compensation chamber of the evaporator through the liquid pipeline. The liquid working medium in the compensation chamber flows back to the liquid wick under the capillary force of the liquid wick, thereby enabling the loop heat pipe phase change heat dissipation device to work in a cycle, continuously transferring the heat of the chip to the environment, and reducing the chip temperature. In addition, since the top of the wick of the present invention is in contact with the bottom surface of the first cover plate, and the bottom of the wick is in contact with the top surface of the first bottom plate, the wick divides the internal space enclosed by the first cover plate and the first bottom plate into a compensation chamber and an evaporation chamber that are spaced laterally, and the compensation chamber and the evaporation chamber are not in the thickness direction of the wick, so that the compensation chamber, wick and evaporation chamber of the present invention are horizontally arranged structures. The thickness of the wick is very thin, and the length of the wick is significantly greater than the thickness of the wick, so that the evaporation chamber is far away from the compensation chamber, so that it is difficult for the steam in the evaporation chamber to pass through the wick and run into the compensation chamber, thereby ensuring that the steam in the evaporation chamber is basically transmitted to the cavity of the condenser through the steam pipeline, so that there is very little heat leakage; the steam is basically transmitted to the cavity of the condenser for cooling, so that the heat dissipation is more reliable, so that the ultimate heat dissipation performance of the loop heat pipe is better.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的装置获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the devices shown in these drawings without paying creative work.
图1为一实施例的环路热管相变散热装置的结构示意图；FIG1 is a schematic structural diagram of a loop heat pipe phase change heat dissipation device according to an embodiment;
图2为一实施例的蒸发器的爆炸图；FIG2 is an exploded view of an evaporator according to an embodiment;
图3为一实施例的冷凝器的爆炸图；FIG3 is an exploded view of a condenser according to an embodiment;
图4为一实施例的蒸发器的轴侧剖视图；FIG4 is an axial cross-sectional view of an evaporator according to an embodiment;
图5为一实施例的蒸发器的另一朝向的剖视图；FIG5 is a cross-sectional view of an evaporator in another direction according to an embodiment;
图6为一实施例的第一盖板的仰视图；FIG6 is a bottom view of a first cover plate according to an embodiment;
图7为一实施例的第一底板的结构示意图；FIG7 is a schematic structural diagram of a first bottom plate according to an embodiment;
图8为一实施例的冷凝器的剖视图；FIG8 is a cross-sectional view of a condenser according to an embodiment;
图9为一实施例的第二底板的结构示意图；FIG9 is a schematic structural diagram of a second bottom plate according to an embodiment;
图10为一实施例的第二盖板的结构示意图；FIG10 is a schematic structural diagram of a second cover plate according to an embodiment;
其中，100、蒸发器；110、第一盖板；111、内部流道；1111、补液孔；112、第一环形凸起；120、吸液芯；121、蒸汽槽道；122、肋；130、第一底板；131、凹槽；132、凸台；133、第一环形槽；140、补偿腔；150、蒸发室；200、冷凝器；210、上翅片；220、第二盖板；221、第二环形槽；230、第二底板；231、凸起部；2311、气孔；232、液孔；233、第二环形凸起；240、下翅片；250、空腔；300、蒸汽管路；400、液体管路；410、注液口。Among them, 100, evaporator; 110, first cover plate; 111, internal flow channel; 1111, liquid replenishment hole; 112, first annular protrusion; 120, liquid absorption core; 121, steam channel; 122, rib; 130, first bottom plate; 131, groove; 132, boss; 133, first annular groove; 140, compensation cavity; 150, evaporation chamber; 200, condenser; 210, upper fin; 220, second cover plate; 221, second annular groove; 230, second bottom plate; 231, protrusion; 2311, air hole; 232, liquid hole; 233, second annular protrusion; 240, lower fin; 250, cavity; 300, steam pipeline; 400, liquid pipeline; 410, liquid injection port.
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。另外，在本发明中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中的“和/或”包括三个方案，以A和/或B为例，包括A技术方案、B技术方案，以及A和B同时满足的技术方案；另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and/or" in the full text includes three solutions. Taking A and/or B as an example, it includes A technical solution, B technical solution, and A and B technical solutions that meet both requirements. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
如图1-3所示，一种环路热管相变散热装置包括蒸发器100、冷凝器200、蒸汽管路300及液体管路400，蒸发器100包括第一盖板110、吸液芯120及第一底板130，第一盖板110密封盖设于第一底板130，吸液芯120设置于第一盖板110和第一底板130之间，吸液芯120的顶部与第一盖板110的底面贴合，吸液芯120的底部与第一底板130的顶面贴合，吸液芯120将第一盖板110和第一底板130围合成的内部空间分隔为横向间隔的补偿腔140与蒸发室150，吸液芯120用于储存液体工质，液体工质为相变液体，第一底板130的底面用于与发热源接触贴合；冷凝器200包括上翅片210、第二盖板220、第二底板230及下翅片240，第二盖板220密封盖设于第二底板230，第二盖板220与第二底板230围合形成空腔250，上翅片210设置于第二盖板220的顶面，下翅片240设置于第二底板230的底面，蒸汽管路300的一端与第一盖板110密封连接，并连通蒸发室150，蒸汽管路300的另一端与第二底板230密封连接，并连通空腔250，液体管路400的一端与第二底板230密封连接，并连通空腔250，液体管路400的另一端与第一盖板110密封连接，并连通补偿腔140，液体管路400内具有液体工质。在本实施例中，发热源可以但不限于为芯片。As shown in Fig. 1-3, a loop heat pipe phase change heat dissipation device includes an evaporator 100, a condenser 200, a steam pipeline 300 and a liquid pipeline 400. The evaporator 100 includes a first cover plate 110, a liquid wick 120 and a first bottom plate 130. The first cover plate 110 is sealed and arranged on the first bottom plate 130. The liquid wick 120 is arranged between the first cover plate 110 and the first bottom plate 130. The top of the liquid wick 120 is in contact with the bottom surface of the first cover plate 110, and the bottom of the liquid wick 120 is in contact with the top surface of the first bottom plate 130. The liquid wick 120 divides the internal space enclosed by the first cover plate 110 and the first bottom plate 130 into a compensation cavity 140 and an evaporation chamber 150 which are laterally spaced apart. The liquid wick 120 is used to store liquid working medium, and the liquid working medium is a phase change liquid. The bottom surface of the first bottom plate 130 is used to contact with a heat source. The condenser 200 includes an upper fin 210, a second cover plate 220, a second bottom plate 230 and a lower fin 240. The second cover plate 220 is sealed and arranged on the second bottom plate 230. The second cover plate 220 and the second bottom plate 230 enclose a cavity 250. The upper fin 210 is arranged on the top surface of the second cover plate 220. The lower fin 240 is arranged on the bottom surface of the second bottom plate 230. One end of the steam pipeline 300 is sealed and connected to the first cover plate 110 and communicates with the evaporation chamber 150. The other end of the steam pipeline 300 is sealed and connected to the second bottom plate 230 and communicates with the cavity 250. One end of the liquid pipeline 400 is sealed and connected to the second bottom plate 230 and communicates with the cavity 250. The other end of the liquid pipeline 400 is sealed and connected to the first cover plate 110 and communicates with the compensation cavity 140. There is a liquid working medium in the liquid pipeline 400. In this embodiment, the heat source can be, but is not limited to, a chip.
当需要给芯片等发热源进行散热时，将蒸发器100的第一底板130的底面与芯片紧密贴合，芯片工作产生热量经第一底板130传导至吸液芯120中，吸液芯120中的液体工质吸热蒸发相变形成蒸汽，蒸汽工质迅速充满蒸汽区，在压差推动下，蒸汽工质经蒸汽管路300快速传输至冷凝器200的空腔250内，上翅片210与下翅片240与环境通过对流和辐射进行热量交换，使得蒸汽在第二盖板220的内表面快速冷凝释放热量，冷凝后的液体回流至液体管路400，在压差驱动下液体工质通过液体管路400回流至蒸发器100的补偿腔140，补偿腔140的液体工质在吸液芯120的毛细力驱动下回流至吸液芯120，从而使得环路热管相变散热装置得以循环工作，不断将芯片热量传递至环境当中，降低芯片温度。此外，由于本发明的吸液芯120的顶部与第一盖板110的底面贴合，吸液芯120的底部与第一底板130的顶面贴合，吸液芯120将第一盖板110和第一底板130围合成的内部空间分隔为横向间隔的补偿腔140与蒸发室150，补偿腔140与蒸发室150不在吸液芯120的厚度方向上，从而本发明的补偿腔140、吸液芯120及蒸发室150是水平布置结构。吸液芯120的厚度很薄，吸液芯120的长度明显大于吸液芯120的厚度，从而蒸发室150距离补偿腔140的距离较远，从而蒸发室150内的蒸汽难以穿过吸液芯120跑进补偿腔140内，从而保证蒸发室150内的蒸汽基本经蒸汽管路300传输至冷凝器200的空腔250内，从而漏热极少；蒸汽基本传输至冷凝器200的空腔250内进行冷却，使得散热更加可靠，从而使得环路热管极限散热性能更佳。When it is necessary to dissipate heat for a heat source such as a chip, the bottom surface of the first bottom plate 130 of the evaporator 100 is closely attached to the chip. The heat generated by the chip during operation is conducted to the liquid wick 120 through the first bottom plate 130. The liquid working medium in the liquid wick 120 absorbs heat and evaporates to form steam. The steam working medium quickly fills the steam area. Driven by the pressure difference, the steam working medium is quickly transmitted to the cavity 250 of the condenser 200 through the steam pipeline 300. The upper fin 210 and the lower fin 240 are connected to the environment through convection and radiation. Heat exchange is carried out by injection, so that the steam quickly condenses on the inner surface of the second cover plate 220 to release heat, and the condensed liquid flows back to the liquid pipeline 400. Driven by the pressure difference, the liquid working medium flows back to the compensation chamber 140 of the evaporator 100 through the liquid pipeline 400. The liquid working medium in the compensation chamber 140 flows back to the liquid wick 120 driven by the capillary force of the liquid wick 120, so that the loop heat pipe phase change cooling device can work in a cycle, continuously transfer the chip heat to the environment, and reduce the chip temperature. In addition, since the top of the absorbent core 120 of the present invention is in contact with the bottom surface of the first cover plate 110, and the bottom of the absorbent core 120 is in contact with the top surface of the first bottom plate 130, the absorbent core 120 divides the internal space enclosed by the first cover plate 110 and the first bottom plate 130 into a laterally spaced compensation chamber 140 and an evaporation chamber 150, and the compensation chamber 140 and the evaporation chamber 150 are not in the thickness direction of the absorbent core 120, so that the compensation chamber 140, the absorbent core 120 and the evaporation chamber 150 of the present invention are horizontally arranged structures. The thickness of the wick 120 is very thin, and the length of the wick 120 is significantly greater than the thickness of the wick 120, so that the evaporation chamber 150 is far away from the compensation chamber 140, so that the steam in the evaporation chamber 150 is difficult to pass through the wick 120 and run into the compensation chamber 140, thereby ensuring that the steam in the evaporation chamber 150 is basically transmitted to the cavity 250 of the condenser 200 through the steam pipeline 300, so that heat leakage is very small; the steam is basically transmitted to the cavity 250 of the condenser 200 for cooling, making the heat dissipation more reliable, thereby making the ultimate heat dissipation performance of the loop heat pipe better.
现有技术中，补偿腔140、吸液芯120和蒸汽槽道121垂直布置，导致漏热问题严重，限制环路热管极限散热性能，从而可能引起启动脉冲、温度波动甚至启动失败等不稳定性问题。不同的是，采用本发明的结构，漏热少、散热性能好，从而避免引起启动脉冲、温度波动甚至启动失败等不稳定性问题。In the prior art, the compensation cavity 140, the wick 120 and the steam channel 121 are arranged vertically, resulting in serious heat leakage problems, limiting the ultimate heat dissipation performance of the loop heat pipe, which may cause instability problems such as startup pulses, temperature fluctuations, and even startup failures. The difference is that the structure of the present invention has less heat leakage and good heat dissipation performance, thereby avoiding instability problems such as startup pulses, temperature fluctuations, and even startup failures.
在本实施例中，吸液芯120具有毛细孔，能够产生吸力吸取补偿腔140内的液体工质，但是由于吸液芯120内填充着液体工质，从而蒸发室150内的蒸汽是难以穿过吸液芯120进入补偿腔140内的。In this embodiment, the wick 120 has capillaries that can generate suction to absorb the liquid working medium in the compensation chamber 140 . However, since the wick 120 is filled with liquid working medium, it is difficult for the steam in the evaporation chamber 150 to pass through the wick 120 and enter the compensation chamber 140 .
在本实施例中，冷凝器200的设置高度大于蒸发器100的设置高度，从而冷凝器200内冷凝得到的液体工质，能够在压差与重力的共同驱动下通过液体管路400回流至蒸发器100的补偿腔140。In this embodiment, the setting height of the condenser 200 is greater than the setting height of the evaporator 100, so that the liquid working fluid condensed in the condenser 200 can flow back to the compensation chamber 140 of the evaporator 100 through the liquid pipeline 400 under the joint driving of pressure difference and gravity.
现有技术的冷凝器200采用蛇形管结构，蛇形管截面积更小，从而蒸汽和液体受到的阻力更大，且由于蛇形管有多个转弯，进一步增大了蒸汽和液体受到的阻力。不同的是，本发明中冷凝器200为一体式空腔250结构，从而大大减小了蒸汽和液体在冷凝器200内的流动阻力。The condenser 200 of the prior art adopts a serpentine tube structure, and the cross-sectional area of the serpentine tube is smaller, so that the resistance of the steam and liquid is greater, and because the serpentine tube has multiple turns, the resistance of the steam and liquid is further increased. The difference is that the condenser 200 of the present invention is an integrated cavity 250 structure, thereby greatly reducing the flow resistance of the steam and liquid in the condenser 200.
参考图1和图3，上翅片210的长度及宽度与第二盖板220的长度及宽度相同，下翅片240的宽度与第二底板230的宽度相同，下翅片240的长度大于第二底板230的长度的一半。从而上翅片210、下翅片240的设置，极大地拓展了冷凝器200的散热面积，提高了环路热管相变散热装置的冷凝极限。具体地，第二盖板220的底面为蒸汽冷凝面，第二底板230的顶面为液体降温回流面。进入冷凝器200的空腔250内的蒸汽在蒸汽冷凝面冷凝，以使蒸汽从气象转变为液相，即蒸汽冷凝面为两相区，上翅片210的长度及宽度与第二盖板220的长度及宽度相同，增大了两相区的面积，使得气液转换更加可靠。Referring to FIG. 1 and FIG. 3 , the length and width of the upper fin 210 are the same as the length and width of the second cover plate 220 , the width of the lower fin 240 is the same as the width of the second bottom plate 230 , and the length of the lower fin 240 is greater than half the length of the second bottom plate 230 . Thus, the arrangement of the upper fin 210 and the lower fin 240 greatly expands the heat dissipation area of the condenser 200 and improves the condensation limit of the loop heat pipe phase change heat dissipation device. Specifically, the bottom surface of the second cover plate 220 is the steam condensation surface, and the top surface of the second bottom plate 230 is the liquid cooling reflux surface. The steam entering the cavity 250 of the condenser 200 condenses on the steam condensation surface, so that the steam is converted from the gas phase to the liquid phase, that is, the steam condensation surface is a two-phase region, and the length and width of the upper fin 210 are the same as the length and width of the second cover plate 220 , which increases the area of the two-phase region and makes the gas-liquid conversion more reliable.
具体地，第一盖板110、第一底板130、上翅片210、第二盖板220、第二底板230、下翅片240、蒸汽管路300及液体管路400由金属材料制成；此处的金属材料可以但不限于为铝或紫铜。Specifically, the first cover plate 110, the first bottom plate 130, the upper fin 210, the second cover plate 220, the second bottom plate 230, the lower fin 240, the steam pipeline 300 and the liquid pipeline 400 are made of metal materials; the metal material here can be but is not limited to aluminum or copper.
吸液芯120为金属材料制成的多孔结构；此处的金属材料可以但不限于为紫铜、镍、不锈钢或钛。The wick 120 is a porous structure made of metal material; the metal material here can be but is not limited to copper, nickel, stainless steel or titanium.
液体工质为常温高沸点工质或常温低沸点工质，常温高沸点工质为水、甲醇或乙醇，常温低沸点工质为液氨或丙烯。The liquid working fluid is a working fluid with a high boiling point at room temperature or a working fluid with a low boiling point at room temperature. The working fluid with a high boiling point at room temperature is water, methanol or ethanol, and the working fluid with a low boiling point at room temperature is liquid ammonia or propylene.
参考图2和图4，吸液芯120的顶部与第一盖板110的底面贴合，吸液芯120的底部与第一底板130的顶面贴合，且吸液芯120的前后两侧与第一盖板110及第一底板130的前后两侧贴合，即，补偿腔140与蒸发室150位于吸液芯120的左右两端。2 and 4 , the top of the wick 120 is in contact with the bottom surface of the first cover plate 110, the bottom of the wick 120 is in contact with the top surface of the first bottom plate 130, and the front and rear sides of the wick 120 are in contact with the front and rear sides of the first cover plate 110 and the first bottom plate 130, that is, the compensation cavity 140 and the evaporation chamber 150 are located at the left and right ends of the wick 120.
参考图4-5，第一底板130顶面开设有与吸液芯120适配的凹槽131，吸液芯120设置于凹槽131，以实现吸液芯120在与第一底板130顶面平行的面上的定位(即在水平方向的定位)。具体地，凹槽131的截面与吸液芯120的截面适配，使得吸液芯120能够卡持在凹槽131中；凹槽131的深度小于吸液芯120的厚度。Referring to Figures 4-5, the top surface of the first bottom plate 130 is provided with a groove 131 adapted to the absorbent core 120, and the absorbent core 120 is arranged in the groove 131 to achieve the positioning of the absorbent core 120 on a surface parallel to the top surface of the first bottom plate 130 (i.e., positioning in the horizontal direction). Specifically, the cross section of the groove 131 is adapted to the cross section of the absorbent core 120, so that the absorbent core 120 can be clamped in the groove 131; the depth of the groove 131 is less than the thickness of the absorbent core 120.
进一步地，吸液芯120的厚度大于凹槽131的底部到第一盖板110底面的距离，从而保证吸液芯120能够与第一盖板110及第一底板130紧密结合在一起。Furthermore, the thickness of the absorbent core 120 is greater than the distance from the bottom of the groove 131 to the bottom surface of the first cover plate 110 , thereby ensuring that the absorbent core 120 can be tightly combined with the first cover plate 110 and the first bottom plate 130 .
进一步地，吸液芯120、第一盖板110及第一底板130焊接为一体，从而保证了第一盖板110和第一底板130之间的密封性。此外，由于将吸液芯120与第一底板130焊接为一体，使得吸液芯120与第一底板130之间不存在空气，从而大幅降低吸液芯120与底板之间的接触热阻。Furthermore, the wick 120, the first cover plate 110 and the first bottom plate 130 are welded together to ensure the sealing between the first cover plate 110 and the first bottom plate 130. In addition, since the wick 120 and the first bottom plate 130 are welded together, there is no air between the wick 120 and the first bottom plate 130, thereby greatly reducing the contact thermal resistance between the wick 120 and the bottom plate.
进一步地，第二盖板220与第二底板230焊接为一体，从而保证了第二盖板220和第二底板230之间的密封性。在本实施例中，上翅片210焊接于第二盖板220的顶面，下翅片240焊接于第二底板230的底面。Furthermore, the second cover plate 220 and the second bottom plate 230 are welded together to ensure the sealing between the second cover plate 220 and the second bottom plate 230. In this embodiment, the upper fin 210 is welded to the top surface of the second cover plate 220, and the lower fin 240 is welded to the bottom surface of the second bottom plate 230.
参考图2和图4，第一底板130的底面设置有凸台132，凸台132用于与发热源接触贴合。具体地，凸台132的位于与吸液芯120的位置对应，从而使得芯片的热量能够经第一底板130可靠地传递给吸液芯120。2 and 4 , the bottom surface of the first bottom plate 130 is provided with a boss 132 for contacting and fitting with the heat source. Specifically, the boss 132 is located corresponding to the position of the wick 120 , so that the heat of the chip can be reliably transferred to the wick 120 via the first bottom plate 130 .
在本实施例中，通过高导热界面材料将凸台132与芯片紧密贴合。In this embodiment, the boss 132 is closely attached to the chip through a high thermal conductive interface material.
参考图2，吸液芯120上开设有多个蒸汽槽道121，蒸汽槽道121与蒸发室150连通。具体地，蒸汽槽道121的设置，使得吸液芯120中的液体工质吸热蒸发相变形成蒸汽后，蒸汽能够轻松进入蒸汽槽道121，从而流动至蒸发室150。2 , the wick 120 is provided with a plurality of steam channels 121, which are connected to the evaporation chamber 150. Specifically, the arrangement of the steam channels 121 allows the liquid working medium in the wick 120 to absorb heat and evaporate to form steam, and the steam can easily enter the steam channels 121 and flow to the evaporation chamber 150.
蒸汽槽道121贯穿吸液芯120。在本实施例中，蒸汽槽道121贯穿吸液芯120，使得吸液芯120形成“耙”形结构，将蒸汽槽道121和蒸汽槽道121之间的吸液芯120部分称为肋122，具体地，凸台132的设置位置与吸液芯120的肋122的位置对应。在其他实施例中，也可以设置成蒸汽槽道121未贯穿吸液芯120。The steam channel 121 penetrates the liquid absorbent core 120. In this embodiment, the steam channel 121 penetrates the liquid absorbent core 120, so that the liquid absorbent core 120 forms a "rake" structure, and the steam channel 121 and the portion of the liquid absorbent core 120 between the steam channel 121 are called ribs 122. Specifically, the position of the boss 132 corresponds to the position of the ribs 122 of the liquid absorbent core 120. In other embodiments, it can also be arranged that the steam channel 121 does not penetrate the liquid absorbent core 120.
具体地，吸液芯120采用非均匀、异质材料共烧结工艺制作，吸液芯120不是肋122的部分(吸液芯120靠近补偿腔140的一侧)采用小粒径低导热率金属粉末烧结，以实现小孔径和大毛细力，为蒸发区快速补液；吸液芯120的肋122(吸液芯120开设蒸汽槽道121的一侧)采用大粒径高导热率金属粉末与造孔剂烧结而成，既可以减小液体流动阻力，又能够保留蒸汽排出空间，最大限度地提高蒸发效率，降低底板温度。Specifically, the wick 120 is manufactured by a non-uniform, heterogeneous material co-sintering process. The portion of the wick 120 that is not the rib 122 (the side of the wick 120 close to the compensation cavity 140) is sintered with a small-particle-size, low-thermal-conductivity metal powder to achieve a small pore size and a large capillary force, thereby quickly replenishing the evaporation zone. The rib 122 of the wick 120 (the side of the wick 120 where the steam channel 121 is provided) is sintered with a large-particle-size, high-thermal-conductivity metal powder and a pore-forming agent, which can reduce the resistance to liquid flow and reserve space for steam discharge, thereby maximizing the evaporation efficiency and reducing the bottom plate temperature.
参考图5，第一盖板110开设有内部流道111，内部流道111与补偿腔140连通，液体管路400内部流道111连通。5 , the first cover plate 110 is provided with an internal flow channel 111 , and the internal flow channel 111 is communicated with the compensation chamber 140 , and the liquid pipeline 400 is communicated with the internal flow channel 111 .
参考图5-6，内部流道111的底部阵列开设有补液孔1111，补液孔1111对准吸液芯120。具体地，在冷凝器200的空腔250内冷凝得到的液体工质通过液体管路400回流至第一盖板110开设的内部流道111，然后内部流道111内的液体工质一部分流入蒸发器100的补偿腔140，然后吸液芯120通过毛细力吸取液体工质，内部流道111内的液体工质一部分经补液孔1111直接进入吸液芯120，从而能够高效率的为吸液芯120进行补液，加快吸液芯120内的气液更新速率，增强蒸发器100散热功率，降低第一底板130底面温度，进而降低芯片温度。Referring to Figures 5-6, the bottom array of the internal flow channel 111 is provided with a liquid replenishment hole 1111, and the liquid replenishment hole 1111 is aligned with the liquid wick 120. Specifically, the liquid working medium condensed in the cavity 250 of the condenser 200 flows back to the internal flow channel 111 opened in the first cover plate 110 through the liquid pipeline 400, and then a part of the liquid working medium in the internal flow channel 111 flows into the compensation cavity 140 of the evaporator 100, and then the liquid wick 120 absorbs the liquid working medium through the capillary force, and a part of the liquid working medium in the internal flow channel 111 directly enters the liquid wick 120 through the liquid replenishment hole 1111, so that the liquid wick 120 can be replenished efficiently, the gas-liquid renewal rate in the liquid wick 120 can be accelerated, the heat dissipation power of the evaporator 100 can be enhanced, the bottom surface temperature of the first bottom plate 130 can be reduced, and then the chip temperature can be reduced.
在本实施例中，补液孔1111对准吸液芯120的肋122。In this embodiment, the liquid replenishing hole 1111 is aligned with the rib 122 of the liquid absorbent core 120 .
参考图3和图9，第二底板230的顶面设置有凸起部231，凸起部231上开设有气孔2311，气孔2311连通空腔250和蒸汽管路300；第二底板230的侧壁开设有液孔232，液孔232连通空腔250和液体管路400，液孔232的高度低于凸起部231的高度。具体地，由于液孔232的高度低于凸起部231的高度，因此，气孔2311的高度高，因此冷凝得到的液体工质会流到液孔232处，而不会流到气孔2311处，然后液体工质经液孔232流入液体管路400，避免了冷凝得到的液体工质回流至气孔2311内。Referring to FIG. 3 and FIG. 9 , a protrusion 231 is provided on the top surface of the second bottom plate 230, and an air hole 2311 is provided on the protrusion 231, and the air hole 2311 connects the cavity 250 and the steam pipeline 300; a liquid hole 232 is provided on the side wall of the second bottom plate 230, and the liquid hole 232 connects the cavity 250 and the liquid pipeline 400, and the height of the liquid hole 232 is lower than the height of the protrusion 231. Specifically, since the height of the liquid hole 232 is lower than the height of the protrusion 231, the height of the air hole 2311 is high, so the condensed liquid working medium will flow to the liquid hole 232 instead of the air hole 2311, and then the liquid working medium will flow into the liquid pipeline 400 through the liquid hole 232, thereby preventing the condensed liquid working medium from flowing back into the air hole 2311.
参考图8-9，从远离液孔232的一端至靠近液孔232的一端，第二底板230的底面高度逐渐变低，如此设置，使得冷凝器200空腔250内冷凝得到的液体工质会汇聚在液孔232处，便于液体工质的传输。8-9, the bottom surface height of the second bottom plate 230 gradually decreases from the end away from the liquid hole 232 to the end close to the liquid hole 232. This arrangement allows the liquid working fluid condensed in the cavity 250 of the condenser 200 to converge at the liquid hole 232, facilitating the transmission of the liquid working fluid.
参考图2、图4、图7，第一底板130的顶面开设有第一环形槽133，第一盖板110的底面开设有与第一环形槽133适配的第一环形凸起112，第一环形凸起112容置于第一环形槽133，从而实现第一盖板110与第一底板130之间的密封；在其他实施例中，也可以第一盖板110的底面开设第一环形槽133，第一底板130的顶面开设与第一环形槽133适配的第一环形凸起112。2, 4 and 7, a first annular groove 133 is provided on the top surface of the first bottom plate 130, and a first annular protrusion 112 adapted to the first annular groove 133 is provided on the bottom surface of the first cover plate 110. The first annular protrusion 112 is accommodated in the first annular groove 133, thereby achieving sealing between the first cover plate 110 and the first bottom plate 130. In other embodiments, the first annular groove 133 may be provided on the bottom surface of the first cover plate 110, and the first annular protrusion 112 adapted to the first annular groove 133 may be provided on the top surface of the first bottom plate 130.
参考图8-10，第二盖板220的底面开设有第二环形槽221，第二底板230的顶面开设有与第二环形槽221适配的第二环形凸起233，第二环形凸起233容置于第二环形槽221，从而实现第二盖板220与第二底板230之间的密封。在其他实施例中，也可以第二底板230的顶面开设第二环形槽221，第二盖板220的底面开设与第二环形槽221适配的第二环形凸起233。8-10, the second cover plate 220 has a second annular groove 221 formed on the bottom surface, the second bottom plate 230 has a second annular protrusion 233 matched with the second annular groove 221 formed on the top surface, and the second annular protrusion 233 is accommodated in the second annular groove 221, thereby achieving sealing between the second cover plate 220 and the second bottom plate 230. In other embodiments, the second annular groove 221 may be formed on the top surface of the second bottom plate 230, and the second annular protrusion 233 matched with the second annular groove 221 may be formed on the bottom surface of the second cover plate 220.
参考图1，液体管路400开设有注液口410，注液口410用于对空腔250进行抽真空处理，注液口410为液体工质初始供给初始口。具体地，在使用环路热管相变散热装置之前，通过注液口410对冷凝器200的空腔250进行抽真空处理，以得到真空腔250，然后通过注液口410注入液体工质后进行密封处理。1 , the liquid pipeline 400 is provided with a liquid injection port 410, and the liquid injection port 410 is used to evacuate the cavity 250, and the liquid injection port 410 is an initial port for initial supply of liquid working medium. Specifically, before using the loop heat pipe phase change heat dissipation device, the cavity 250 of the condenser 200 is evacuated through the liquid injection port 410 to obtain a vacuum cavity 250, and then the liquid working medium is injected through the liquid injection port 410 and then sealed.
在本实施例中，注液口410在液体管路400上靠近蒸发器100。In this embodiment, the liquid injection port 410 is located on the liquid pipeline 400 and is close to the evaporator 100 .
参考图1-10，本发明还提供一种环路热管相变散热装置的制造方法，用于上述的环路热管相变散热装置，环路热管相变散热装置的制造方法包括如下步骤：1-10, the present invention also provides a method for manufacturing a loop heat pipe phase change heat dissipation device, which is used for the above-mentioned loop heat pipe phase change heat dissipation device. The method for manufacturing the loop heat pipe phase change heat dissipation device comprises the following steps:
S100，通过机加工制作第一盖板110、第一底板130、第二盖板220、第二底板230、液体管路400和蒸汽管路300。S100 , manufacturing the first cover plate 110 , the first bottom plate 130 , the second cover plate 220 , the second bottom plate 230 , the liquid pipeline 400 and the steam pipeline 300 by machining.
S200，制作上翅片210和下翅片240；具体地，使用激光切割工艺制作单片铜片，弯折形成规整翅片，采用钎焊工艺将翅片组合焊接为一个整体，使用激光焊接工艺对第二底板230及第二盖板220配合面进行密封，使用钎焊将上翅片210与第二盖板220、下翅片240与第二底板230进行组装。S200, manufacturing the upper fin 210 and the lower fin 240; specifically, using the laser cutting process to manufacture a single copper sheet, bending it to form regular fins, using the brazing process to weld the fins together into a whole, using the laser welding process to seal the mating surfaces of the second bottom plate 230 and the second cover plate 220, and using brazing to assemble the upper fin 210 and the second cover plate 220, and the lower fin 240 and the second bottom plate 230.
S300，密封连接第二底板230和第二盖板220，并将上翅片210设置第二盖板220的顶面，下翅片240设置于第二底板230的底面，以得到冷凝器200。S300 , sealingly connecting the second bottom plate 230 and the second cover plate 220 , and disposing the upper fins 210 on the top surface of the second cover plate 220 , and disposing the lower fins 240 on the bottom surface of the second bottom plate 230 , so as to obtain the condenser 200 .
S400，通过金属粉末烧结工艺制备吸液芯120；具体地，使用高热导率金属粉末与质量分数为10％～30％的氯化钠混合均匀后置入模具中，在高温箱式气氛炉中进行烧结制备吸液芯120，高热导率金属粉末粒径为1～3μm，氯化钠质量分数为10％～30％，烧结温度为800～900℃，保温时间为40min。S400, preparing the absorbent core 120 by a metal powder sintering process; specifically, using high thermal conductivity metal powder and sodium chloride with a mass fraction of 10% to 30%, the mixture is evenly mixed and placed in a mold, and sintered in a high-temperature box-type atmosphere furnace to prepare the absorbent core 120, the high thermal conductivity metal powder has a particle size of 1 to 3 μm, the mass fraction of sodium chloride is 10% to 30%, the sintering temperature is 800 to 900° C., and the insulation time is 40 minutes.
S500，将吸液芯120设置于第一底板130及第一盖板110之间，并使吸液芯120的顶部与第一盖板110的底面贴合，吸液芯120的底部与第一底板130的顶面贴合，且使吸液芯120将第一盖板110和第一底板130围合成的内部空间分隔为横向间隔的补偿腔140与蒸发室150，然后将第一底板130及和第一盖板110密封连接；具体地，采用焊接工艺对蒸发器100组装密封，焊接温度为700℃，焊接时间为30s，焊接压力为0.2MPa。S500, the wick 120 is disposed between the first base plate 130 and the first cover plate 110, and the top of the wick 120 is fitted with the bottom surface of the first cover plate 110, the bottom of the wick 120 is fitted with the top surface of the first base plate 130, and the wick 120 divides the internal space enclosed by the first cover plate 110 and the first base plate 130 into a compensation chamber 140 and an evaporation chamber 150 which are laterally spaced, and then the first base plate 130 and the first cover plate 110 are sealed and connected; specifically, the evaporator 100 is assembled and sealed using a welding process, the welding temperature is 700°C, the welding time is 30s, and the welding pressure is 0.2MPa.
S600，将蒸汽管路300分别与第一盖板110、第二底板230密封连接，液体管路400分别与第二底板230、第一盖板110密封连接。S600 , the steam pipeline 300 is sealed and connected to the first cover plate 110 and the second bottom plate 230 , respectively, and the liquid pipeline 400 is sealed and connected to the second bottom plate 230 and the first cover plate 110 , respectively.
环路热管相变散热装置的制造方法在步骤S400之后还包括：S410，使用溶剂对烧结后的吸液芯120进行超声震荡，去除吸液芯120内部的造孔剂，形成大小孔结合的孔隙网络，超声时间为10min，重复3～5次，放入真空烘箱烘干，烘干温度为60～75℃，烘干时间为1～2h。The manufacturing method of the loop heat pipe phase change heat dissipation device also includes, after step S400: S410, using a solvent to ultrasonically vibrate the sintered liquid absorbent core 120 to remove the pore-forming agent inside the liquid absorbent core 120 to form a pore network combining large and small pores, the ultrasonic time is 10 minutes, repeated 3 to 5 times, and placed in a vacuum oven for drying, the drying temperature is 60 to 75° C., and the drying time is 1 to 2 hours.
环路热管相变散热装置的制造方法在步骤S410之后还包括：S420，使用酸溶液对吸液芯120进行超声震荡，去除金属吸液芯120表面的氧化膜，提升吸液芯120的吸液性能，超声时间为30min，重复2～3次。The manufacturing method of the loop heat pipe phase change heat dissipation device further includes, after step S410: S420, using an acid solution to ultrasonically vibrate the liquid wick 120 to remove the oxide film on the surface of the metal liquid wick 120 and improve the liquid absorption performance of the liquid wick 120, the ultrasonic time is 30 minutes, and it is repeated 2 to 3 times.
环路热管相变散热装置的制造方法在步骤S600之后还包括：The method for manufacturing a loop heat pipe phase change heat dissipation device further includes, after step S600:
S700，在液体管路400预留注液口410。S700 , a liquid injection port 410 is reserved in the liquid pipeline 400 .
S700，对环路热管相变散热装置通过注液口410进行抽真空处理，以使冷凝器200的空腔250形成为真空腔250，然后通过注液口410注入液体工质后进行密封处理。S700 , the loop heat pipe phase change heat dissipation device is evacuated through the liquid injection port 410 to form the cavity 250 of the condenser 200 into a vacuum cavity 250 , and then a liquid working medium is injected through the liquid injection port 410 and then sealed.
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效装置变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent device transformations made using the contents of the present invention's specification and drawings, or direct/indirect applications in other related technical fields, under the inventive concept of the present invention are included in the patent protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410083822.4ACN117870425B (en) | 2024-01-19 | 2024-01-19 | Loop heat pipe phase-change heat dissipation device and manufacturing method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410083822.4ACN117870425B (en) | 2024-01-19 | 2024-01-19 | Loop heat pipe phase-change heat dissipation device and manufacturing method thereof |
| Publication Number | Publication Date |
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| CN117870425Atrue CN117870425A (en) | 2024-04-12 |
| CN117870425B CN117870425B (en) | 2024-09-17 |
| Application Number | Title | Priority Date | Filing Date |
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| CN202410083822.4AActiveCN117870425B (en) | 2024-01-19 | 2024-01-19 | Loop heat pipe phase-change heat dissipation device and manufacturing method thereof |
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| CN (1) | CN117870425B (en) |
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|---|---|---|---|---|
| CN118640719A (en)* | 2024-05-31 | 2024-09-13 | 西安交通大学 | A loop heat pipe heat dissipation device and preparation method thereof |
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