Disclosure of Invention
The present disclosure provides a three-dimensional morphometric system for materials.
The three-dimensional morphology measurement system of material of this disclosure includes:
the first measuring device can acquire images of the materials to be measured to obtain image information of the materials to be measured;
the second measuring device can emit microwave signals and/or laser signals to the material to be measured and receive return signals;
a swinging device, on which the second measuring device is arranged so that the second measuring device can act to a plurality of angles following the swinging of the swinging device to perform the transmission of the microwave signal and/or the laser signal and the reception of the return signal;
the main control circuit board, the main control circuit board respectively with first measuring device, second measuring device with pendulous device communication connection, the main control circuit board includes:
the signal acquisition module can acquire the image information obtained by the first measuring device and the return signal received by the second measuring device so as to generate final three-dimensional form information of the material to be measured;
The control module can generate a swing control signal to control the swing of the swing device, so that the swing device can act to the plurality of angles;
the first measuring device comprises a plurality of image acquisition devices so that the image information obtained by the first measuring device can be used for generating initial three-dimensional form information of the material to be measured.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes:
a processing device configured with:
the first processing module generates initial three-dimensional form information of the material to be detected based on the image information acquired by the signal acquisition module;
the second processing module is used for acquiring the spatial position information of a plurality of measuring points of the material to be measured relative to the second measuring device based on the return signals acquired by the signal acquisition module;
the calibration module can establish a calibration coordinate system, convert the initial three-dimensional form information into the calibration coordinate system to obtain first three-dimensional coordinate information, convert the spatial position information obtained by the second processing module into the calibration coordinate system to obtain second three-dimensional coordinate information, and conduct coordinate calibration based on the first three-dimensional coordinate information and the second three-dimensional coordinate information to obtain final three-dimensional form information.
According to the three-dimensional morphological measurement system of the material of at least one embodiment of the disclosure, the plurality of image acquisition devices are arranged at equal heights so as to acquire image information of the material to be measured.
According to the three-dimensional morphological measurement system of the material of at least one embodiment of the present disclosure, the number of the second measuring devices is one, and the second measuring devices are radar sensors or laser sensors.
According to at least one embodiment of the present disclosure, the plurality of image acquisition devices includes two infrared cameras that operate synchronously and maintain a consistent imaging angle and field of view range.
According to the three-dimensional morphological measurement system for the material, the plurality of image acquisition devices comprise three infrared cameras, the three infrared cameras are distributed in a triangular shape at the same horizontal height, and at least two infrared cameras are provided with optical filters with different optical filtering capacities, so that the first measurement device can acquire image information of at least two imaging wave bands of the material to be measured, and the first processing module can generate initial three-dimensional morphological information of the material to be measured based on the image information of the at least two imaging wave bands.
According to the three-dimensional material morphology measurement system of at least one embodiment of the disclosure, any two of the three infrared cameras form a group of detection cameras to form three groups of detection cameras, the three groups of detection cameras can work simultaneously to obtain three groups of image information, and an overlapping part exists between every two groups of image information, and the three-dimensional information of the overlapping part is used for coordinate alignment between the two groups of image information, so that the two groups of image information can be subjected to image stitching based on the coordinate alignment.
According to the three-dimensional material morphology measurement system of at least one embodiment of the present disclosure, the plurality of image acquisition devices include two infrared cameras and two visible light cameras, each camera is cross-shaped and distributes, two infrared cameras are as first group detection cameras, two visible light cameras are as second group detection cameras, infrared measurement mode, visible light measurement mode and mixed measurement mode can be formed based on two groups detection cameras, wherein infrared cameras and visible light cameras are set up with interval.
According to the three-dimensional morphological measurement system for the material of at least one embodiment of the present disclosure, in the hybrid measurement mode, the first group of detection cameras obtain first image information, the second group of detection cameras obtain second image information, a superposition portion exists between the first image information and the second image information, and the three-dimensional information of the superposition portion is used for coordinate alignment between the first image information and the second image information, so that the first image information and the second image information can be subjected to image stitching based on the coordinate alignment.
According to the three-dimensional morphological measurement system of the material of at least one embodiment of the present disclosure, the processing device switches the infrared measurement mode, the visible light measurement mode and the hybrid measurement mode based on the received operation instruction.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes:
the first driving device is connected between the first measuring device and the main control circuit board and is used for configuring the first measuring device to be rotatable so as to adjust the rotation angle of the first measuring device;
the second driving device is connected between the first measuring device and the main control circuit board and is used for configuring the first measuring device into an insertion depth and an installation angle which are adjustable so as to control the insertion depth of the first measuring device and adjust the installation angle of the first measuring device.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes:
the third driving device is connected between the first measuring device and the main control circuit board and is used for driving each image acquisition device of the first measuring device to an image acquisition position, and the number of the image acquisition positions is not less than that of the image acquisition devices.
According to the three-dimensional morphological measurement system of the material of at least one embodiment of the present disclosure, when the number of image acquisition positions is consistent with the number of image acquisition devices, each image acquisition device corresponds to one image acquisition position.
According to the three-dimensional material morphology measurement system of at least one embodiment of the present disclosure, when the number of the image acquisition positions is greater than the number of the image acquisition devices, the third driving device drives each image acquisition device according to a preset track, so that each image acquisition device performs image acquisition at least two image acquisition positions.
According to the three-dimensional material morphology measurement system of at least one embodiment of the present disclosure, when the number of the image acquisition positions is greater than the number of the image acquisition devices, the third driving device adjusts the optical path of each of the image acquisition devices, so that each of the image acquisition devices performs image acquisition at least two image acquisition positions.
According to the three-dimensional morphological measurement system of the material of at least one embodiment of the present disclosure, the preset track is a circumferential track or a linear track.
According to at least one embodiment of the present disclosure, the infrared camera has an infrared detector for receiving infrared radiation energy from the material to be measured to generate an infrared thermal imaging image;
The processing device obtains surface temperature distribution information of the material to be detected based on the infrared thermal imaging image.
According to the three-dimensional morphological measurement system of the material of at least one embodiment of the present disclosure, the processing device obtains ranging information based on the spatial position information of the plurality of measurement points of the material to be measured relative to the second measurement device to obtain the image acquisition position.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes: and the cooling device is used for providing a refrigerant medium for the space where the material to be detected is located so as to cool the space where the material to be detected is located.
According to the three-dimensional material morphology measurement system of at least one embodiment of the present disclosure, the main control circuit board generates a control signal based on the surface temperature distribution information of the material to be measured obtained by the processing device, so as to control the cooling device.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes:
the protection tube comprises a protection tube outer wall and a protection tube inner wall, and a heat preservation and insulation layer is arranged in a hollow structure surrounded by the protection tube outer wall and the protection tube inner wall;
The electronic unit cover is fixedly connected with the inner wall of the protection tube, and the main control circuit board is arranged in the electronic unit cover.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes:
the protective cover is fixedly connected with one end, far away from the electronic unit cover, of the protective tube, the protective cover, the inner wall of the protective tube and the electronic unit cover enclose a closed space, and the first measuring device, the second measuring device and the swinging device are arranged in the closed space;
the first measuring device acquires image information of the material to be measured through the protective cover, and the second measuring device transmits microwave signals and/or laser signals through the protective cover and receives the return signals.
According to the three-dimensional material morphology measurement system of at least one embodiment of the present disclosure, the cooling device comprises a refrigerant inlet, a refrigerant outlet and a refrigerant conveying pipeline, the refrigerant conveying pipeline is arranged in the heat insulation layer, and the refrigerant inlet and the refrigerant outlet are both arranged on the outer wall of the protection pipe; the cold medium can enter the refrigerant conveying pipeline through the refrigerant inlet, and is discharged from the refrigerant outlet after being conveyed through the refrigerant conveying pipeline.
A three-dimensional morphometric system for materials according to at least one embodiment of the present disclosure, further includes:
the purging device comprises a purging medium inlet and at least one purging port, the purging medium inlet is arranged on the outer wall of the protection tube, the purging port is arranged on the bottom end face of the protection cover, which is far away from the protection tube, and the purging port and the normal direction of the bottom end face are arranged at an acute angle;
in a first preset time period, a gas purging medium enters through the purging medium inlet and is discharged through the purging port so as to purge the bottom end face;
and in a second preset period of time, liquid purging medium enters through the purging medium inlet and is discharged through the purging port so as to clean the bottom end face.
According to a three-dimensional morphological measurement system of a material of at least one embodiment of the present disclosure, the calibration module performs coordinate calibration based on the first three-dimensional coordinate information and the second three-dimensional coordinate information, including:
for the coincidence point of the first three-dimensional coordinate information and the second three-dimensional coordinate information, the material level information of the coincidence point is based on the material level information in the second three-dimensional coordinate information; or, based on the coordinate point quality of the first three-dimensional coordinate information and the coordinate point quality of the second three-dimensional coordinate information, weight is allocated to each coordinate point in the first three-dimensional coordinate information and each coordinate point in the second three-dimensional coordinate information, so that weighted average is performed to obtain the corrected material level information of the coincident point.
Detailed Description
The present disclosure is described in further detail below with reference to the drawings and the embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant content and not limiting of the present disclosure. It should be further noted that, for convenience of description, only a portion relevant to the present disclosure is shown in the drawings.
In addition, embodiments of the present disclosure and features of the embodiments may be combined with each other without conflict. The technical aspects of the present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Unless otherwise indicated, the exemplary implementations/embodiments shown are to be understood as providing exemplary features of various details of some ways in which the technical concepts of the present disclosure may be practiced. Thus, unless otherwise indicated, features of the various implementations/embodiments may be additionally combined, separated, interchanged, and/or rearranged without departing from the technical concepts of the present disclosure.
The use of cross-hatching and/or shading in the drawings is typically used to clarify the boundaries between adjacent components. As such, the presence or absence of cross-hatching or shading does not convey or represent any preference or requirement for a particular material, material property, dimension, proportion, commonality between illustrated components, and/or any other characteristic, attribute, property, etc. of a component, unless indicated. In addition, in the drawings, the size and relative sizes of elements may be exaggerated for clarity and/or descriptive purposes. While the exemplary embodiments may be variously implemented, the specific process sequences may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in reverse order from that described. Moreover, like reference numerals designate like parts.
When an element is referred to as being "on" or "over", "connected to" or "coupled to" another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. However, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there are no intervening elements present. For this reason, the term "connected" may refer to physical connections, electrical connections, and the like, with or without intermediate components.
For descriptive purposes, the present disclosure may use spatially relative terms such as "under … …," under … …, "" under … …, "" lower, "" above … …, "" upper, "" above … …, "" higher "and" side (e.g., in "sidewall") to describe one component's relationship to another (other) component as illustrated in the figures. In addition to the orientations depicted in the drawings, the spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture. For example, if the device in the figures is turned over, elements described as "under" or "beneath" other elements or features would then be oriented "over" the other elements or features. Thus, the exemplary term "below" … … can encompass both an orientation of "above" and "below". Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when the terms "comprises" and/or "comprising," and variations thereof, are used in the present specification, the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof is described, but the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof is not precluded. It is also noted that, as used herein, the terms "substantially," "about," and other similar terms are used as approximation terms and not as degree terms, and as such, are used to explain the inherent deviations of measured, calculated, and/or provided values that would be recognized by one of ordinary skill in the art.
Fig. 1 is a block schematic diagram of a three-dimensional morphometric system of matter of one embodiment of the present disclosure.
Referring to fig. 1, in some embodiments of the present disclosure, a material three-dimensional morphometric system 1000 of the present disclosure includes:
the first measuring device 100, the first measuring device 100 can perform image acquisition on the material to be measured to obtain image information of the material to be measured.
The second measuring device 200, the second measuring device 200 is capable of transmitting a microwave signal and/or a laser signal to the material to be measured and receiving a return signal (which may be a microwave return signal, a laser return signal).
The swinging device 300, the second measuring device 200 is configured on the swinging device 300, so that the second measuring device 200 can act to a plurality of angles to perform the transmission of the microwave signal and/or the laser signal and the reception of the return signal following the swinging of the swinging device 300.
The main control circuit board 400, the main control circuit board 400 respectively with first measuring device 100, second measuring device 200 and pendulous device 300 communication connection, main control circuit board 400 includes:
the signal acquisition module 401, the signal acquisition module 401 can acquire the image information obtained by the first measurement device 100 and the return signal received by the second measurement device 200 to be used for generating the final three-dimensional form information of the material to be measured.
The control module 402 (belonging to the main control circuit board 400), the control module 402 can generate a swing control signal to control the swing of the swing device 300, so that the swing device 300 can act at a plurality of angles.
The first measuring device 100 includes a plurality of image capturing devices 101 (the image capturing devices 101 may be cameras) so that the image information obtained by the first measuring device 100 can be used to generate the initial three-dimensional form information of the material to be measured.
The three-dimensional form measurement system 1000 for materials of the present disclosure can realize image information collection and microwave return signal/laser return signal collection of the surface of the material to be measured by configuring the first measurement device 100 and the second measurement device 200 to control and collect information based on the same main control circuit board 400, and the signal collection module 401 of the main control circuit board 400 can collect the image information obtained by the first measurement device 100 and the return signal received by the second measurement device 200 to generate final three-dimensional form information of the material to be measured.
The first measuring device 100 of the three-dimensional morphology measurement system 1000 of the material of the present disclosure preferably comprises a plurality of image acquisition devices 101 such that the image information obtained by the first measuring device 100 can be used to generate initial three-dimensional morphology information of the material to be measured, which can be used to generate final three-dimensional morphology information of the material to be measured.
Considering the actual working condition requirements and the characteristics of the image acquisition device and the radar sensor, the present disclosure designs the first measurement device 100 and the second measurement device 200 differently, designs the first measurement device 100 to include a plurality of image acquisition devices 101, designs the second measurement device 200 to be configured on the swinging device 300, so that the second measurement device 200 can move to a plurality of angles following the swinging of the swinging device 300 to perform the transmission of the microwave signal and/or the laser signal and the reception of the return signal.
In some embodiments of the present disclosure, the second measurement device 200 includes a radar sensor or a laser sensor, and in other embodiments of the present disclosure, the second measurement device 200 includes a radar sensor and a laser sensor.
The signal acquisition module 401 and the control module 402 of the main control circuit board 400 of the present disclosure may both employ existing signal acquisition circuits, control circuits/control chips, which are not particularly limited in this disclosure.
The swinging device 300 of the present disclosure may be a swinging device based on a driving motor and a swinging arm, or may be a swinging device with other structural forms, which are not particularly limited in this disclosure, and all fall within the protection scope of the present disclosure.
Fig. 2 is a block schematic diagram of a three-dimensional morphometric system of matter of further embodiments of the present disclosure.
Referring to fig. 2, the three-dimensional morphometric system 1000 of materials of the present disclosure further includes:
processing apparatus 500, processing apparatus 500 is configured with:
the first processing module 501, the first processing module 501 generates initial three-dimensional form information of the material to be tested based on the image information collected by the signal collection module 401.
The second processing module 502, the second processing module 502 obtains the spatial position information of a plurality of measurement points of the material to be measured relative to the second measurement device 200 based on the return signals acquired by the signal acquisition module 401.
The calibration module 503, the calibration module 503 can establish a calibration coordinate system, convert the initial three-dimensional form information into the calibration coordinate system to obtain first three-dimensional form information, convert the spatial position information obtained by the second processing module 502 into the calibration coordinate system to obtain second three-dimensional form information, and perform coordinate calibration based on the first three-dimensional form information and the second three-dimensional form information to obtain final three-dimensional form information.
With continued reference to fig. 2, the processing device 500 of the present disclosure may be a computer (host computer), and the first processing module 501, the second processing module 502, and the calibration module 503 may each be in the form of computer software modules.
The processing device 500 of the present disclosure, by configuring the first processing module 501, the second processing module 502, and the calibration module 503, so that the first processing module 501 generates initial three-dimensional shape information of a material to be measured based on image information acquired by the signal acquisition module 401, the second processing module 502 obtains spatial position information of a plurality of measurement points of the material to be measured relative to the second measuring device 200 based on return signals acquired by the signal acquisition module 401, the calibration module 503 converts the initial three-dimensional shape information into a calibration coordinate system to obtain first three-dimensional coordinate information, converts the spatial position information obtained by the second processing module 502 into a calibration coordinate system to obtain second three-dimensional coordinate information, and performs coordinate calibration based on the first three-dimensional coordinate information and the second three-dimensional coordinate information to obtain final three-dimensional shape information described above.
The processing device 500 of the three-dimensional material morphology measurement system 1000 of the present disclosure performs three-dimensional coordinate calibration by using the first three-dimensional coordinate information obtained based on the initial three-dimensional morphology information described above and the second three-dimensional coordinate information obtained based on the spatial position information described above, so as to obtain final three-dimensional morphology information of the material to be measured, where the position information is more accurate.
The calibration coordinate system established by the calibration module 503 may be a space rectangular coordinate system.
For the three-dimensional morphology measurement system 1000 of a material described above in the present disclosure, in some embodiments of the present disclosure, preferably, a plurality of image capturing devices 101 are disposed at equal heights to capture image information of the material to be measured, and the number of image capturing devices 101 may be two or more than three.
Through setting up a plurality of image acquisition devices 101 of contour, a plurality of cameras (image acquisition devices 101) can work simultaneously in order to take the photo in step, make the shooting angle and the visual field scope of a plurality of cameras unanimous as far as possible, reduce the later use the degree of difficulty that image registration was carried out to the image information that its was shot.
In some embodiments of the present disclosure, the number of second measurement devices 200 of the three-dimensional morphology measurement system 1000 of the material of the present disclosure is one, either a radar sensor or a laser sensor.
In other embodiments of the present disclosure, the number of second measurement devices 200 is a plurality, either a plurality of radar sensors or a plurality of laser sensors.
In other embodiments of the present disclosure, the second measuring device 200 of the three-dimensional morphology material measuring system 1000 of the present disclosure is a plurality of the second measuring device, at least one radar sensor and at least one laser sensor.
In some embodiments of the present disclosure, the plurality of image acquisition devices 101 of the material three-dimensional morphometric system 1000 of the present disclosure include two infrared cameras that operate synchronously and maintain a consistent imaging angle and field of view range.
Taking an infrared camera as an example of an image acquisition device, in some embodiments of the present disclosure, the plurality of image acquisition devices 101 of the first measurement device 100 of the three-dimensional form measurement system 1000 for materials of the present disclosure include three infrared cameras, the three infrared cameras are distributed in a triangle shape (preferably in an equilateral triangle shape, the three cameras are configured at three vertex positions of the triangle) at the same level, and at least two infrared cameras are equipped with optical filters with different filtering capabilities, so that the first measurement device 100 can acquire image information of at least two imaging bands of the materials to be measured, and the first processing module 501 can generate initial three-dimensional form information of the materials to be measured based on the image information of the at least two imaging bands.
The optical filters with different filtering capacities are assembled on the at least two infrared cameras, so that image information in different wavelength ranges can be obtained, the infrared imaging capacity of a wide-band range can be formed by expanding the band range of the infrared cameras, the infrared cameras in the wide-band range can realize the self-adaptive adjustment of imaging (namely image information acquisition) under the condition of abrupt temperature change, the real-time accurate acquisition of distance data of materials to be measured in a visual field is ensured, the three-dimensional form of the materials to be measured can be obtained in a wider band range, and higher accuracy and better environmental adaptability are obtained.
In some embodiments of the present disclosure, any two of the three infrared cameras of the first measurement device 100 of the material three-dimensional morphology measurement system 1000 of the present disclosure form a set of detection cameras to form three sets of detection cameras, the three sets of detection cameras can work simultaneously to obtain three sets of image information, and there is a superposition portion between every two sets of image information, and the three-dimensional information of the superposition portion is used for coordinate alignment between the two sets of image information, so that the two sets of image information can be image-stitched based on the coordinate alignment.
In some embodiments of the present disclosure, the plurality of image capturing devices 101 of the first measurement device 100 of the three-dimensional morphology measurement system 1000 for materials of the present disclosure includes two infrared cameras and two visible light cameras, each camera is distributed in a cross shape, the two infrared cameras are used as a first group of detection cameras, the two visible light cameras are used as a second group of detection cameras, and an infrared measurement mode, a visible light measurement mode and a hybrid measurement mode can be formed based on the two groups of detection cameras, wherein the infrared cameras and the visible light cameras are arranged at intervals.
Wherein, four cameras can dispose respectively in four summit positions of cross. Each group of detection cameras can work independently, and also can work cooperatively with another group of detection cameras simultaneously, so that an infrared measurement mode, a hybrid measurement mode (infrared and visible light measurement modes) and a visible light measurement mode are formed, and the measurement modes are switched according to specific requirements or measurement working conditions, so that the detection accuracy is improved.
Further, in some embodiments of the present disclosure, in the above-described hybrid measurement mode, the first group of detection cameras obtain first image information, the second group of detection cameras obtain second image information, there is a coincidence portion between the first image information and the second image information, and three-dimensional information of the coincidence portion is used for coordinate alignment between the first image information and the second image information, so that the first image information and the second image information can be image-stitched based on the coordinate alignment. In addition, as the positions of the two groups of detection cameras are different, the visual field range shot by the two groups of images is larger than that shot by one group of images, and the two groups of three-dimensional information are registered and spliced by utilizing the three-dimensional information of the overlapping part, so that the measurement range is enlarged.
For example, when the number of cameras is three, the cameras may be distributed in a triangle. The three cameras are all infrared cameras, at least two infrared cameras are provided with optical filters which are not identical, so that the camera device can shoot and obtain picture information in different wave band ranges, every two infrared cameras are a group of detection cameras, three groups of infrared detection cameras can be obtained, three infrared cameras shoot and obtain three groups of image information at the same time, each group of images is provided with two images, three-dimensional information of materials to be detected in each group of images is obtained by utilizing a binocular stereo vision technology, as the three groups of three-dimensional information of the overlapped parts are provided with overlapping parts, the three groups of three-dimensional information of the overlapped parts are mutually compared and calibrated, abrupt points (such as the fact that the abrupt points are not continuous with surrounding points) are taken as abnormal points, the points with little phase difference are averaged or weighted and the like, and the like are processed, so that measurement accuracy is improved, in addition, the visual field range shot by the three groups of images is larger than that shot by one group of pictures, the three groups of three-dimensional information is registered and spliced by utilizing the three-dimensional information of the overlapped parts, and the purpose of enlarging the measurement range can be achieved.
Preferably, imaging wave bands of the first group of detection cameras and the second group of detection cameras are different, first image information obtained by the first group of detection cameras is in an infrared wave band, and second image information obtained by the second group of detection cameras is in a visible wave band; the first image information and the second image information are complementary, and measurement accuracy can be improved.
For example, when the number of cameras is 4, 2 infrared cameras and 2 visible light cameras may be used, 2 infrared cameras are a group of detection cameras, 2 visible light cameras are another group of detection cameras, and each group of detection cameras may work independently or may work simultaneously. The upper computer can select a measurement mode, for example, only one group of infrared cameras is selected to shoot pictures, and when the other group of visible light cameras stops working, an infrared measurement mode is formed; if one group of infrared cameras is selected to shoot images and the other group of visible light cameras also work simultaneously, a hybrid measurement mode (infrared and visible light measurement mode) is formed; if only one group of visible light cameras is selected to shoot images, and the other group of infrared cameras stops working, a visible light measurement mode is formed, an operator can configure and switch the measurement mode according to specific requirements or measurement working conditions, for example, the operator can switch to the visible light measurement mode or the mixed measurement mode under good visual conditions, and can switch to the mixed mode or the infrared measurement mode under bad visual conditions, so that the detection precision is improved.
Referring to fig. 2, in some embodiments of the present disclosure, a processing device 500 (host computer) of a three-dimensional morphology measurement system 1000 of a material of the present disclosure switches an infrared measurement mode, a visible light measurement mode, and a hybrid measurement mode based on a received operation instruction (e.g., a manual click switch instruction).
In other embodiments of the present disclosure, the control module 402 fuses the time information and the weather forecast information to automatically switch the infrared measurement mode, the visible light measurement mode, and the hybrid measurement mode according to the current time period and the weather conditions.
The above-described measurement mode may be switched by an operator manually clicking on the upper computer, or may be combined with time information (such as distinction between day and night), weather forecast information (such as heavy fog weather, clear weather, etc.), and automatically cut according to the distinguished time period and the weather forecast information, so that the self-adaptation degree is improved. In addition, in the same way, in the mixed measurement mode, 2 groups of image information can be obtained by simultaneously shooting 2 groups of detection cameras, each group of images has 2 images, the three-dimensional information of materials to be measured in the measured range in each group of images is obtained by utilizing the binocular stereoscopic vision technology, 2 groups of three-dimensional information of the overlapped part are compared and calibrated with each other because the 2 groups of images have the overlapped part, abrupt points (such as no continuity with surrounding points) are taken as abnormal points to be removed, and points with smaller phase difference (the difference is in the threshold range) are taken as an average value, so that the measurement accuracy is improved; in addition, because the positions of the 2 groups of detection cameras are different, the visual field range shot by the 2 groups of images is larger than that shot by the one group of images, and the 2 groups of three-dimensional information are registered and spliced by utilizing the three-dimensional information of the overlapping part, so that the purpose of expanding the measurement range can be realized. In addition, under the mixed measurement mode, the wave bands of the 2 groups of cameras are different, images with different wave bands can be obtained to play a complementary role, for example, images formed by reflecting the visible light wave band range and images formed by infrared wave bands through the infrared thermal radiation of the material to be measured are complementary, as the imaging principle of the long-wave infrared camera is different from that of the visible light camera, the long-wave infrared camera is mainly sensitive to the infrared thermal radiation of the material to be measured, the gray value of the formed images directly corresponds to the temperature and the infrared radiation degree of the object to be measured, and the object to be measured can be detected in the environment without illumination or smoke. The infrared band camera and the visible light camera can be matched under the same scene to play a good complementary effect, and the precision of three-dimensional information acquired by the camera device can be improved.
The number of radar sensors described above in this disclosure is at least 1 for transmitting microwave signals and receiving microwave echo signals, and/or the number of laser sensors is at least 1 for transmitting laser signals and receiving laser echo signals.
The swinging device 300 described in the present disclosure is independent of the first measuring device 100 (may include a plurality of image capturing devices 101), and the second measuring device 200 (a radar sensor and/or a laser sensor) is fixed on the swinging device 300, where the radar sensor and/or the laser sensor may be installed perpendicular to the swinging device 300, or may be installed with a certain included angle to the swinging device 300, but the initial installation position and the installation angle are known (preset), and the swinging device 300 is controlled by the main control circuit board 400 to drive the radar sensor and/or the laser sensor to swing according to the preset angle to act to the preset position, so that the second measuring device 200 transmits microwave signals from a plurality of angles and receives microwave echo signals and/or the laser sensor transmits laser signals from a plurality of angles and receives laser echo signals, so as to obtain microwave ranging values and/or laser ranging values of a plurality of measuring points.
Fig. 3 and 4 are schematic diagrams of the configuration of a second measurement device 200 on a swing device 300 according to various embodiments of the present disclosure.
The second measuring device 200 shown in fig. 3, which may be a radar sensor or a laser sensor, is also shown in fig. 3 by way of example as four acquisition points of the first measuring device 100.
The second measuring device 200 shown in fig. 4, which may be two radar sensors, two laser sensors, one radar sensor and one laser sensor, is also shown in fig. 4 by way of example as three acquisition points of the first measuring device 100.
Wherein the dotted line is the surface area of the material to be measured.
In some embodiments of the present disclosure, referring to fig. 2, a main control circuit board 400 includes a signal acquisition module 401, a control module 402, a communication module (not shown), and a power module (not shown).
The power module can receive the electric energy of an external power supply system and convert the electric energy into the voltage required by the material three-dimensional morphology measurement system 1000, so as to supply power for the whole system. The signal acquisition module 401 is configured to acquire image information captured by the first measurement device 100 and acquire microwave echo signals and/or laser echo signals received by the second measurement device 200, and transmit the acquired image information to the processing device 500, where the processing device 500 acquires initial three-dimensional measurement information of a material to be measured (an object to be measured) by combining the image information transmitted by the first measurement device 100 and position information of an image acquisition device (a camera) for capturing images, and acquires microwave ranging values of a plurality of measurement points by using microwave echo signals measured by using a plurality of angles transmitted by a radar sensor and/or acquires laser ranging values of a plurality of measurement points by using laser echo signals transmitted by a laser sensor.
The control module 402 performs motion control of the swing device 300 and the like based on instructions of the processing device 500.
Fig. 5 is a schematic block diagram of a three-dimensional morphometric system 1000 of matter of further embodiments of the present disclosure, the three-dimensional morphometric system 1000 of matter of the present disclosure preferably further comprises:
the first driving device 600, the first driving device 600 is connected between the first measuring device 100 and the main control circuit board 400, for configuring the first measuring device 100 to be rotatable to adjust a rotation angle (e.g. a pitching angle of the camera) of the first measuring device 100.
More preferably, the three-dimensional morphometric system 1000 of materials of the present disclosure further comprises:
the second driving device 700, the second driving device 700 is connected between the first measuring device 100 and the main control circuit board 400, and is used for configuring the first measuring device 100 with adjustable insertion depth and installation angle so as to control the insertion depth of the first measuring device 100 and adjust the installation angle of the first measuring device. The insertion depth may be a depth of sinking of the first measuring device (image acquisition device) in a container such as a tank, for example. The insertion depth may refer to the depth of sinking of the camera in a container such as a tank.
More preferably, the three-dimensional morphometric system 1000 of materials of the present disclosure further comprises:
the third driving device 800, the third driving device 800 is connected between the first measuring device 100 and the main control circuit board 400, and the third driving device 800 is configured to drive each image capturing device 101 of the first measuring device 100 to an image capturing position (may be a preset image capturing position, integrally drive positions of each image capturing device 101 in a horizontal direction), where the number of image capturing positions is not less than the number of image capturing devices 101.
For example, the first driving device 600 may control the first driving device 600 to rotate according to a rotation angle of at least one camera (the image capturing device 101) provided on the processing device 500 (the upper computer), and the control module 402 of the main control circuit board 400 may continuously rotate a plurality of angles to a preset angle position (e.g., a pitch angle position), during the continuously rotating a plurality of angles, the rotating camera captures one image at each angle to obtain a plurality of continuous captured images; or may be rotated by an angle to a predetermined angular position. In the rotation process of the camera, the purpose of expanding the shooting range can be achieved, the detection range is expanded, three-dimensional information acquired by a plurality of images is spliced to obtain the three-dimensional information with a larger range, and the angle measurement of the characteristic points is carried out according to the position change of the object characteristic points (material characteristic points) in the shooting image of the camera.
For example, the control instruction may be generated according to the insertion depth of the at least one camera and the installation angle of the camera, which are set on the upper computer, so that the control module 402 of the main control circuit board 400 controls the second driving device 700 to adjust the insertion depth of the at least one camera and/or the installation angle (orientation angle) of the at least one camera. The camera can have a plurality of insertion depths and a plurality of installation angles, and the camera can be continuously adjusted to pass through the plurality of insertion depths or continuously adjusted to pass through the plurality of installation angles; the insertion depth of the camera can be adjusted once or the installation angle can be adjusted once. In the continuous adjustment process, the camera shoots images at a plurality of insertion depths or a plurality of installation angles to obtain a plurality of continuous shooting images. The method comprises the steps of controlling the insertion depth of a camera and the installation angle of the camera, and achieving the purpose of expanding the shooting range, so that the detection range is expanded, comparing, judging and calibrating the overlapping parts of a plurality of images, removing noise and abnormal points, registering and splicing the three-dimensional information of the overlapping parts of the calibrated images to obtain the three-dimensional information in a larger range, and measuring the angles of the characteristic points according to the position change of the characteristic points in the continuous shooting images of the camera.
Referring to fig. 3 and 4, in the present disclosure, a plurality of different location acquisition points may be provided, each of which has a known (preset) location. The number of the acquisition points is greater than or equal to the number of the cameras. When the number of the acquisition points is consistent with that of the cameras, each acquisition point corresponds to one camera, and each camera is arranged at the position corresponding to the acquisition point.
When the number of the acquisition points is greater than the number of the cameras, according to the selected cameras and the acquisition point positions to which the cameras can move, the control module 402 of the main control circuit board 400 controls the third driving device 800 to drive the cameras to the selected acquisition point positions, so that the image acquisition of one camera at the acquisition point at different positions is realized, wherein the movement track of the third driving device 800 can move in a circular or linear manner, and the cameras can reach the designated acquisition point through the third driving device 800. When the movement track of the third driving device 800 is circular movement, the third driving device 800 comprises an angle sensor, and the angle sensor measures the moving angle information so as to obtain the position information of the camera after the movement; when the third driving device 800 moves linearly, the third driving device 800 includes a distance sensor, and the distance sensor measures the moving linear distance information to obtain the position information of the camera after moving.
In addition to the method of moving the camera to the acquisition point by using the third driving device 800, an optical path adjustment module (not shown) may be used to perform optical path adjustment, so that a camera may acquire pictures at the acquisition points at different positions, the number of the optical path adjustment modules is at least 1, and one set of optical path adjustment module at least includes one lens. At this time, the position of the camera is not changed (except for the insertion depth and the installation angle), one camera at least corresponds to one light path adjustment module, each camera at least corresponds to one acquisition point and each camera corresponds to a fixed acquisition point, a switch (not shown) is arranged at the acquisition point, the camera is arranged on the upper computer to acquire images from which acquisition point corresponding to the camera, the switch corresponding to the acquisition point is opened, and the switch of the rest acquisition points is closed so as to prevent the camera from photographing from 2 or more acquisition points at the same time and not distinguishing acquired images.
Wherein, in the three-dimensional material morphology measurement system 1000 of the present disclosure, when the number of image acquisition positions is consistent with the number of image acquisition devices 101, each image acquisition device 101 corresponds to one image acquisition position.
Preferably, in the three-dimensional morphology measurement system 1000 of a material of the present disclosure, when the number of image capturing positions is greater than the number of image capturing devices 101, the third driving device 800 drives (may be integrally driven) each image capturing device 101 according to a preset trajectory, so that each image capturing device 101 (camera) performs image capturing at least two image capturing positions.
In some embodiments of the present disclosure, the three-dimensional morphological measurement system 1000 of the present disclosure adjusts (e.g., by configuring a lens group) the optical path of each image capturing device 101 so that each image capturing device 101 (camera) performs image capturing at least two image capturing positions when the number of image capturing positions is greater than the number of image capturing devices 101.
The preset trajectory of the third driving device 800 described above in the present disclosure may be a circumferential trajectory or a straight trajectory.
In some embodiments of the present disclosure, the infrared camera (image acquisition device 101) of the three-dimensional morphology measurement system 1000 of the material of the present disclosure has an infrared detector for receiving infrared radiant energy from the material to be measured to generate an infrared thermographic image; the processing device 500 (upper computer) obtains surface temperature distribution information (including specific temperature values) of the material to be measured based on the infrared thermal imaging image.
According to a preferred embodiment of the present disclosure, the processing device 500 (the upper computer, specifically, the second processing module 502) of the three-dimensional morphology measurement system 1000 of the material to be measured obtains ranging information (a microwave ranging value or a laser ranging value) based on spatial position information of a plurality of measurement points of the material to be measured with respect to the second measurement device 200 to obtain an image acquisition position.
The communication module of the main control circuit board 400 transmits initial three-dimensional measurement information of the object to be measured detected by the camera device obtained by the main control circuit board 400, position information of the camera for capturing images to obtain the initial three-dimensional measurement information, microwave ranging values of a plurality of measurement points and/or laser ranging values of a plurality of measurement points, position information of the microwave sensor corresponding to the microwave ranging values of the plurality of measurement points and/or position information of the laser sensor corresponding to the laser ranging values of the plurality of measurement points to the processing device 500 (upper computer).
The communication mode adopted by the communication module can be Ethernet, optical fiber, RS485, 4G/5G, wireless and the like.
Illustratively, the host computer includes a computational analysis module (first and second processing modules), a display module (not shown), and an output module (not shown).
The calculation and analysis module of the upper computer is used for receiving initial three-dimensional measurement information acquired by a camera device transmitted by a communication module of the main control circuit board, position information of a camera head used for shooting images to acquire the initial three-dimensional measurement information, microwave ranging values of a plurality of measurement points acquired by a radar sensor and/or laser ranging values of a plurality of measurement points acquired by a laser sensor, position information of a microwave sensor corresponding to the microwave ranging values of the plurality of measurement points and/or position information of a laser sensor corresponding to the laser ranging values of the plurality of measurement points, the camera device and the radar sensor and/or the laser sensor work cooperatively, the calculation and analysis module of the upper computer establishes a coordinate system according to the installation position (comprising the installation position of the first measurement device and the installation position of the second measurement device) of the system, converts the coordinate values of the microwave ranging values of the plurality of measurement points acquired by the radar sensor and/or the laser ranging values of the laser sensor corresponding to the position information of the microwave ranging values of the plurality of the measurement points into coordinate values of the radar sensor and performs coordinate system coordinate value conversion to the coordinate value conversion of the laser ranging of the laser sensor corresponding to the position information of the laser sensor corresponding to the plurality of the laser ranging values, and performs three-dimensional image matching to acquire the initial three-dimensional contrast information (such as coordinate value coordinate information of the initial three-dimensional image, and three-dimensional image matching and the image matching information is obtained at the same time, and analyzing, comparing and correcting the three-dimensional information coordinate values obtained by the camera device by the coordinate values of the radar measuring points and/or the coordinate values of the laser measuring points to obtain more accurate three-dimensional information coordinate values, so that the three-dimensional form of the object to be measured drawn according to the three-dimensional information coordinate values is more accurate, and the mass, the volume and the material level value of each point on the surface of the object to be measured are analyzed and calculated according to the accurate three-dimensional information coordinate values. The distance information of some important outlines or important points is measured by a laser sensor and/or a radar sensor, and the distance information of some important outlines or important points obtained by the camera device is compared and corrected to form a more accurate measurement result. When the radar sensor and the laser sensor exist at the same time, the measured values of the two sensors are used for comparing and correcting the measured values of the camera device, the weights corresponding to the two sensors can be set, the sizes of the weights are determined according to the on-site measuring working conditions, for example, the positions with larger dust, and the weights for laser calibration can be set to be even 0.
In addition, if the first driving device 600 drives the radar sensor and/or the laser sensor to swing sufficiently, the radar sensor and/or the laser sensor can obtain microwave ranging values and/or laser ranging values of enough measuring points, and the microwave ranging values and the corresponding position information of the enough measuring points can be utilized to obtain three-dimensional information coordinate values in a conversion manner, the three-dimensional information coordinate values can be drawn into a three-dimensional image, and the quality, the volume, the material level values of each point on the surface of the object to be measured and the like can be obtained through analysis and calculation.
The output module (not shown) can output the three-dimensional form of the drawn object to be measured, the related mass and volume of the object to be measured and the material level value of each point on the surface of the object to be measured to the display module (not shown) for display or to the field control system so as to play a role in guiding or judging related production processes or subsequent processes. The display module can be a computer display screen, a digital LCD, a billboard screen, an advertisement screen and the like.
In addition, the upper computer can obtain whether the height/thickness distribution of the surface of the object to be measured is uniform or not according to the obtained material level values of each point of the surface of the object to be measured.
The common visible light camera is limited by an imaging device, and the binocular three-dimensional detection technology of the visible light wave band can only be applied to scenes with active visible light sources or better light rays in the daytime, but cannot work well in environments with poor light rays, such as at night. Since any object emits infrared radiation outwards when the temperature is above absolute zero, the higher the object temperature the stronger the radiation. The infrared camera is integrated to this application, have the characteristic that does not rely on the light source imaging, can catch the infrared radiant energy that awaits measuring object self gived off, thereby improve the problem that the ordinary camera of dim environment visible light can't be better shoot and discern, in addition, integrated radar non-contact measurement technique, the microwave signal that measures usefulness does not receive the dust, dim environment, vapor, high temperature, environmental impact such as rain fog, and/or integrated laser non-contact measurement technique, the laser signal directionality that measures usefulness is good, almost discern the object that awaits measuring of any shape, and to the dark place of being on the back sunshine or at night, when the distance is far away, can realize accurate measurement, so radar technique and/or laser technique fuse with the multi-mesh stereoscopic vision technique, make the application range of the three-dimensional form measurement system of material of this disclosure wider, the measuring result is more accurate, can be qualified for the operation all day.
An infrared detector is arranged on the infrared camera and is used for receiving the infrared radiation energy of the object to be detected, carrying out photoelectric information processing and conversion, converting invisible infrared radiation into a visible image and then forming an infrared thermal imaging picture, wherein the gray level of each pixel point in the infrared thermal imaging picture changes the intensity of the radiation energy of each point in the object to be detected, namely the temperature of each point. The upper computer receives and displays the infrared thermal imaging picture transmitted by the infrared camera, so that the overall temperature distribution condition of the object to be measured can be intuitively known, and the temperature values of the object to be measured at all positions can be obtained. In addition, in the measuring environment of the cloth machine cloth, the blanking material flow and the blanking position can be monitored according to the obtained infrared thermal imaging picture, such as the material flow size, the material flow smoothness, the material flow blanking position and the like. In addition, a plurality of infrared cameras, and at least 2 infrared cameras have the not identical light filter, but also enlarge the wave band scope of infrared camera, and the infrared camera of wide wave band scope can realize formation of image self-adaptation regulation under the condition of temperature abrupt change, guarantees then that the real-time accuracy of the object distance data that awaits measuring in the visual field snatchs. So that the three-dimensional form of the object to be measured can be obtained in a wider wave band region, and higher accuracy and better environmental adaptability are achieved.
In some embodiments of the present disclosure, the material three-dimensional morphometric system 1000 of the present disclosure further includes: the protection tube 920, protection tube 920 includes protection tube outer wall 921 and protection tube inner wall 922, sets up thermal-insulated layer 923 in the hollow structure that protection tube outer wall 921 and protection tube inner wall 922 enclose.
The electronic unit cover 930, the electronic unit cover 930 is fixedly connected with the inner wall of the protection tube, and the main control circuit board 400 is disposed in the electronic unit cover 930.
Preferably, the three-dimensional morphometric system 1000 of material of the present disclosure further comprises: the protecting cover 940, the protecting cover 940 is fixedly connected with one end of the protecting tube 920 far away from the electronic unit cover 930 (the electronic unit cover 930 is arranged at one end in the protecting tube 920), the protecting cover 940, the inner wall of the protecting tube and the electronic unit cover 930 enclose a closed space, and the first measuring device 100, the second measuring device 200 and the swinging device 300 are arranged in the closed space.
The first measuring device 100 obtains image information of the material to be measured through the protective cover 940, and the second measuring device 200 transmits microwave signals and/or laser signals through the protective cover 940 and receives return signals.
In some embodiments of the present disclosure, preferably, the apparatus further includes a cooling device, where the cooling device is configured to provide a refrigerant medium (gas, gas-liquid or liquid) to the space where the material to be tested is located, so as to cool the space where the material to be tested is located.
The cooling device comprises a refrigerant inlet 911, a refrigerant outlet 912 and a refrigerant conveying pipeline (not shown), wherein the refrigerant conveying pipeline is arranged in the heat insulation layer, and the refrigerant inlet 911 and the refrigerant outlet 912 are both arranged on the outer wall of the protection pipe; the cold medium can enter the refrigerant conveying pipeline through the refrigerant inlet 911 and is discharged through the refrigerant outlet 912 after being conveyed through the refrigerant conveying pipeline.
In some embodiments of the present disclosure, the material three-dimensional morphometric system 1000 of the present disclosure further includes: the purge device includes a purge medium inlet 951 and at least one purge port (e.g., purge ring) 952 (two purge ports (e.g., purge rings) are shown in fig. 6), the purge medium inlet is disposed on the outer wall of the protection tube, the purge port (e.g., purge ring) 952 is disposed on the bottom end surface of the shield 940 (on the outer end surface of the shield 940) away from the protection tube 920, and the outlet direction of the purge port (e.g., purge ring) 952 is disposed at an acute angle with respect to the normal direction of the bottom end surface.
Preferably, during a first preset period of time, a gaseous purge medium enters through purge medium inlet 951 and exits through purge port (e.g., purge ring) 952 to purge the bottom end face; during a second predetermined period of time, liquid purge medium enters through purge medium inlet 951 and exits through purge port (e.g., purge ring) 952 to clean the bottom end surface.
Because the measuring environment in the industrial field is not unchanged, high-temperature working conditions or volatile media exist in many cases, at the moment, the cooling device, the gas-liquid purging device, the protective cover and the protective pipe play roles in protecting, cooling, prolonging the service life and improving the measuring precision of the whole measuring system.
Referring to fig. 6, the protection tube 920 of the present disclosure is a hollow structure, having a protection tube outer wall 921 and a protection tube inner wall 922, the hollow structure between the protection tube outer wall 921 and the protection tube inner wall 922 is a heat-insulating layer 923, and the heat-insulating layer 923 has an effect of improving and relieving an influence of high temperature on a measurement system.
Those skilled in the art may make appropriate selections of the materials of the thermal insulation layer 923, all falling within the scope of the disclosure.
In some embodiments of the present disclosure, by configuring the cooling device to have an air source inlet 911, an air source outlet 912, and an air source delivery pipe, wherein the air source delivery pipe is disposed in the insulating layer 923, after cooling air enters through the air source inlet 911, the cooling air is delivered by the air source delivery pipe and is removed by the air source outlet 912, so that the inside of the measurement system is cooled to cope with a high-temperature working environment, and the service life of electronic components is prolonged. The air source inlet 911 and the air source outlet 912 are arranged at the upper end and are installed oppositely, the air source conveying pipeline is arranged in the heat insulation layer, and the view range of a plurality of cameras is prevented from being blocked when the pipeline at the bottom is deployed.
The protective cover 940 of the present disclosure may be disposed at the bottom of the measuring system, connected with the bottom of the protective tube 920, the protective cover 940 preferably adopts quartz glass that is resistant to high temperature and transparent, the first measuring device can shoot an image through the protective cover, and the second measuring device emits and receives microwave signals and/or laser signals that can propagate through the protective cover 940.
In some embodiments of the present disclosure, the gas-liquid purging device includes a gas-liquid inlet 951, a plurality of gas-liquid purging ports (e.g., purging rings) 952, the gas-liquid inlet 951 is disposed on the protection tube (below the gas source inlet 911), the plurality of gas-liquid purging ports (e.g., purging rings) 952 are disposed on the periphery of the bottom of the protection cover 940, each gas-liquid purging port (e.g., purging ring) 952 forms an angle with the normal direction of the protection cover 940 (preferably each gas-liquid purging port (e.g., purging ring) forms an angle of 20 to 30 degrees with the normal direction of the protection cover), and during a preset interval, the gas is continuously blown to the surface of the protection cover 940 through the gas-liquid purging ports (e.g., purging rings) 952, so that the gas blown out from the plurality of holes forms a cyclone, and the purging efficiency of the surface of the protection cover 940 is improved; in the preset interval time, liquid is input through the gas-liquid inlet 951 and is discharged through the gas-liquid blowing ports (such as blowing rings) 952, and the liquid is continuously conveyed to the surface of the protective cover 940, so that the liquid sprayed out of the gas-liquid blowing ports (such as blowing rings) is clear for the protective cover 940, the cleanliness of the surface of the protective cover 940 is ensured, volatile media are prevented from adhering to the surface of the protective cover 940 to prevent detection, the shooting precision of a camera is improved, unnecessary interference feature points are avoided, and the detection precision of a measuring system is improved. Wherein, gas-liquid pipeline sets up inside the heat preservation insulating layer, and the deployment of bottom pipeline avoids sheltering from the sight scope of a plurality of cameras.
In fig. 6, a plurality of cameras (image capturing devices 101) are integrated in a structure and installed at an installation position, at least 2 images are captured at a time, and on the basis of the above scheme, it is also possible to integrate 2 cameras into one group in a structure, and install each group of cameras at least 2 installation positions to capture a plurality of images, wherein the types of each group of cameras may not be identical, the wave band ranges may not be identical, and the position information and the angle information of each group of cameras may be recorded for image capturing.
In some embodiments of the present disclosure, preferably, the calibration module 503 of the processing device 500 of the three-dimensional morphology measurement system 1000 of the material of the present disclosure performs coordinate calibration based on the first three-dimensional coordinate information and the second three-dimensional coordinate information, including:
for the coincidence point of the first three-dimensional coordinate information (binocular) and the second three-dimensional coordinate information (radar), the level information (Z value) of the coincidence point is based on the level information (Z value) in the second three-dimensional coordinate information; alternatively, weights are assigned to the respective coordinate points in the first three-dimensional coordinate information (binocular) and the respective coordinate points in the second three-dimensional coordinate information (radar) based on the coordinate point quality (how to judge the quality) of the first three-dimensional coordinate information (binocular) and the coordinate point quality (how to judge the quality) of the second three-dimensional coordinate information (radar), so as to perform weighted average to obtain the corrected level information (Z value) of the coincident point.
And for the non-coincident point, inserting the coordinate point in the second three-dimensional coordinate information (radar) into the first three-dimensional coordinate information (binocular) so as to realize complementation of the coordinate point, improve the whole measurement resolution and ensure the measurement accuracy.
Preferably, the information fusion is performed based on the following method:
global coordinate information fusion:
after the measuring system is fixed, a calibration target object is placed in the scene, first three-dimensional coordinate information (binocular) and second three-dimensional coordinate information (radar) are respectively acquired, and characteristic points of the target object are acquired from the coordinate information. And acquiring the position information of the characteristic points and matching the position information with the corresponding characteristic points to respectively obtain a point cloud matrix Pc and a point cloud matrix Pl which are k 3 matrices.
The coordinate conversion matrix T is calculated such that pl=pc×t. Thereby realizing the conversion of the first three-dimensional coordinate information (binocular) into the second three-dimensional coordinate space and realizing the data fusion.
And (5) local coordinate information fusion:
and on the basis of global coordinate information fusion, projecting the point cloud to an xy plane, and selecting a neighborhood point at a designated point of the xy plane.
Firstly, abnormal points can be removed according to a + -3sigma rule or a manually set threshold value through the distribution condition of the point cloud in the z direction of the neighborhood point cloud; further obtaining normal vector through neighborhood point cloudFurther obtain the inclination angle a formed by the material surface corresponding to the normal vector n and the xy plane, and know the material accumulation angle b, if the angle a>And b, judging that abnormal points exist in the point cloud against the natural law of natural accumulation of materials.
In the normal vectorOn the basis of (a) changing the angle with the xy plane to b to obtain a new normal vector +.>In normal vector->And in the constructed material surface, calculating the distance from the point cloud to the plane of the material surface, and rejecting points with a larger distance (optionally, 95% of the distance is used as a threshold value) as abnormal points.
In the present disclosure, the first measuring device may be implemented by a binocular camera.
After shooting the same object, the binocular camera (two-camera) after binocular calibration needs to perform binocular correction. In the present disclosure, binocular correction preferably uses epipolar constraint to align the same feature point on the same line in the horizontal direction of the two images of the left and right cameras, i.e. "correct two images that are not in actual co-planar line alignment to co-planar line alignment". Of course, some distortion correction will also be performed during this process. After binocular correction is performed by using epipolar constraint, the characteristic points can be located on epipolar lines in two images, so that searching is only needed on the epipolar lines and not on the whole two-dimensional image when characteristic point matching is performed, and the calculated amount is greatly reduced.
In the present disclosure, it is preferable to match corresponding points on the left and right camera images based on stereo matching, thereby calculating parallax. The present disclosure preferably employs the following algorithm for stereo matching:
region stereo matching algorithm: and (3) giving a point on one image, selecting a sub-window in the neighborhood of the point, and searching a window which is most similar to the sub-window image according to certain similarity in one region in the other image, wherein the corresponding pixel point in the obtained matching window is the matching point of the pixel. A dense disparity map may be obtained.
Feature-based cubic matching algorithm: extracting geometric feature points of an image based on geometric feature information (edges, lines, outlines, interest points, angular points, geometric primitives and the like), performing parallax estimation on the geometric feature points, reconstructing a three-dimensional space scene by using the obtained parallax information, obtaining a sparse parallax map, and obtaining a dense parallax map by interpolation. The algorithm is fast, and the application scene is limited because an interpolation algorithm is needed to calculate the parallax value of the missing pixel point.
Based on a phase stereo matching algorithm: the parallax estimation is performed in the frequency range assuming that the local phases are equal in the frequency range in the image corresponding points.
The three-dimensional material form measurement system disclosed by the disclosure adopts a radar measurement technology, can measure based on a 120GHZ frequency modulation continuous wave technology, can solve the measurement problems of dust, oil gas adhesion, crystallization working conditions and dim environments, and is completely unaffected in extreme environments such as water vapor, high dust, ultra-high temperature, strong corrosion, low visibility and the like. The first measuring device (constituted, for example, by one or more binocular vision apparatuses) is flexible in configuration: according to different practical application conditions, parameters such as an included angle of the camera, a distance value of the camera from a window and the like are adjusted in a targeted mode, the binocular system can be calibrated in real time, the resolution of the camera is high, and different detection environments are met. The environment adaptability is strong, is suitable for multiple complex scenes, and the measuring accuracy is high: the radar measurement technology and the binocular vision technology are combined, and high-precision three-dimensional reconstruction can be performed in indoor and outdoor environments, dim environments, backlight environments, light reflection environments, light absorption environments, rain and fog environments, dust environments, water vapor environments and the like. The three-dimensional imaging can accurately reflect the distribution form of the materials: the material measuring surface can be truly displayed in a three-dimensional imaging mode, the material distribution condition is intuitively known, the change condition of the material distribution is monitored at any time, basis is provided for subsequent procedures according to related information, reasonable decisions are made, and the production management level, the economic benefit of enterprises, the product quality and the operation efficiency are improved. The distribution forms of materials with different lengths can be measured: the measuring angle range of the radar scanner can be set/the visual field scanning range of the binocular stereoscopic vision instrument is adjustable, a plurality of radar scanners/a plurality of binocular stereoscopic vision instruments can be installed according to the field condition to adapt to the measurement of the material distribution forms of different lengths, the radar scanners/the binocular stereoscopic vision instruments carry out block scanning on the materials, and the upper computer software automatically synthesizes and splices the materials to realize the measurement and three-dimensional display of the material distribution forms of different lengths.
In the description of the present specification, reference to the terms "one embodiment/manner," "some embodiments/manner," "example," "a particular example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment/manner or example is included in at least one embodiment/manner or example of the present disclosure. In this specification, the schematic representations of the above terms are not necessarily for the same embodiment/manner or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/modes or examples described in this specification and the features of the various embodiments/modes or examples can be combined and combined by persons skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.
It will be appreciated by those skilled in the art that the above-described embodiments are merely for clarity of illustration of the disclosure, and are not intended to limit the scope of the disclosure. Other variations or modifications will be apparent to persons skilled in the art from the foregoing disclosure, and such variations or modifications are intended to be within the scope of the present disclosure.