技术领域Technical field
本申请涉及电子设备技术领域，尤其是指一种电路板组件和电子设备。This application relates to the technical field of electronic equipment, and in particular, to a circuit board assembly and electronic equipment.
背景技术Background technique
随着电子设备的快速发展，越来越多的电子设备配设有无线充电线圈，以实现电子设备的无线充电。电路板结构是实现电子元件的电连接功能的重要部件，为了提升电子设备内部空间的利用率，减小电路板结构占用的面积，越来越多的电路板结构被设计成双层或多层电路板堆叠设置，每层电路板的两侧均可以布设电子元器件。With the rapid development of electronic devices, more and more electronic devices are equipped with wireless charging coils to achieve wireless charging of electronic devices. The circuit board structure is an important component to realize the electrical connection function of electronic components. In order to improve the utilization of the internal space of electronic equipment and reduce the area occupied by the circuit board structure, more and more circuit board structures are designed to be double-layer or multi-layer. The circuit boards are stacked, and electronic components can be arranged on both sides of each layer of circuit boards.
但在实际装配过程中发现，虽然采用堆叠设置的电路板结构能从一定程度上提升电子设备内部空间的利用率，但电路板结构与诸多功能性电子器件在电子设备的内部通常是相互独立的间隔布设，整体需要占据的空间较大，仍然具有不利于提升电子设备内部空间的利用率的缺点。However, during the actual assembly process, it was found that although the stacked circuit board structure can improve the utilization of the internal space of the electronic device to a certain extent, the circuit board structure and many functional electronic devices are usually independent of each other inside the electronic device. Spaced layout requires a larger overall space, which still has the disadvantage of not being conducive to improving the utilization of the internal space of the electronic device.
发明内容Contents of the invention
本申请提供的电路板组件和电子设备，能有效提升电路板组件的集成度，有利于提升电子设备内部空间的利用率。The circuit board assembly and electronic equipment provided by this application can effectively improve the integration of the circuit board assembly and help improve the utilization of the internal space of the electronic equipment.
本申请提供了一种电路板组件，其中，所述电路板组件包括：This application provides a circuit board assembly, wherein the circuit board assembly includes:
电路板结构，包括至少一个第一电路板；a circuit board structure, including at least one first circuit board;
充电线圈，环绕设置于至少一个所述第一电路板的外周侧，且所述充电线圈与所述电路板结构电连接。A charging coil is arranged around the outer peripheral side of at least one of the first circuit boards, and the charging coil is electrically connected to the circuit board structure.
如上所述的电路板组件，其中，所述充电线圈呈螺旋状环绕设置于所述第一电路板的外周侧。In the above circuit board assembly, the charging coil is arranged in a spiral shape around the outer peripheral side of the first circuit board.
如上所述的电路板组件，其中，所述第一电路板的外周面上设有定位结构，所述充电线圈与所述定位结构相接。In the above circuit board assembly, a positioning structure is provided on the outer peripheral surface of the first circuit board, and the charging coil is connected to the positioning structure.
如上所述的电路板组件，其中，所述定位结构为凹设于所述第一电路板外周面上的嵌槽，所述充电线圈嵌设于所述嵌槽中。In the above circuit board assembly, the positioning structure is an embedding groove recessed on the outer peripheral surface of the first circuit board, and the charging coil is embedded in the embedding groove.
如上所述的电路板组件，其中，所述电路板组件还包括至少一个第二电路板及至少一个第三电路板，所述第二电路板与所述第三电路板交替层叠间隔设置，每个所述第二电路板与相邻的所述第三电路板之间通过一个所述第一电路板连接，环绕设置于所述第一电路板的外周侧的所述充电线圈与相邻的所述第二电路板和/或所述第三电路板电连接。The circuit board assembly as described above, wherein the circuit board assembly further includes at least one second circuit board and at least one third circuit board, the second circuit board and the third circuit board are alternately stacked and spaced apart, each Each second circuit board is connected to the adjacent third circuit board through one first circuit board, and the charging coil arranged around the outer peripheral side of the first circuit board is connected to the adjacent third circuit board. The second circuit board and/or the third circuit board are electrically connected.
如上所述的电路板组件，其中，所述第一电路板的上开设有镂空部，所述镂空部沿所述第二电路板与所述第三电路板的层叠方向贯通；所述第一电路板的内部埋设有多条内接线束，各所述内接线束间隔设置，每条所述内接线束分别与相邻的所述第二电路板和/或所述第三电路板电连接，所述充电线圈的一部分贯穿所述第一电路板的外周面并与所述内接线束电连接。The circuit board assembly as described above, wherein the first circuit board is provided with a hollow portion, and the hollow portion penetrates along the stacking direction of the second circuit board and the third circuit board; the first circuit board A plurality of internal wiring harnesses are embedded inside the circuit board. Each of the internal wiring harnesses is arranged at intervals. Each of the internal wiring harnesses is electrically connected to the adjacent second circuit board and/or the third circuit board. , a part of the charging coil penetrates the outer peripheral surface of the first circuit board and is electrically connected to the internal wiring harness.
如上所述的电路板组件，其中，所述电路板组件包括多条外接线束，所述外接线束于所述第二电路板与所述第三电路板之间延伸，所述外接线束的一端固定于其中一个所述第二电路板上，所述外接线束的另一端固定于其中一个所述第三电路板上。The circuit board assembly as described above, wherein the circuit board assembly includes a plurality of external wiring harnesses extending between the second circuit board and the third circuit board, and one end of the external wiring harness is fixed On one of the second circuit boards, the other end of the external wiring harness is fixed on one of the third circuit boards.
如上所述的电路板组件，其中，所述外接线束于所述第二电路板的表面上、所述第三电路板的表面上、所述第一电路板的内侧表面上和/或所述第一电路板的外侧表面上延伸设置。The circuit board assembly as described above, wherein the external wiring is bundled on the surface of the second circuit board, the surface of the third circuit board, the inner surface of the first circuit board and/or the The first circuit board is extended on the outer surface of the circuit board.
如上所述的电路板组件，其中，所述第二电路板与所述第三电路板均设有一个，所述第二电路板包括第一区域与第二区域，所述第二区域环绕所述第一区域，沿垂直于所述第二电路板的方向，所述第三电路板的投影与所述第一区域的投影重合，所述外接线束的一端固定于所述第三电路板背离所述第二电路板的一侧表面上，所述外接线束的另一端固定于所述第二电路板的所述第二区域朝向所述第三电路板的一侧表面上，且所述外接线束于所述第一电路板的外周面上沿平行于所述第二电路板和/或垂直于所述第二电路板的方向延伸。The circuit board assembly as described above, wherein each of the second circuit board and the third circuit board is provided with one, the second circuit board includes a first area and a second area, and the second area surrounds In the first area, along the direction perpendicular to the second circuit board, the projection of the third circuit board coincides with the projection of the first area, and one end of the external wiring harness is fixed to the third circuit board away from On one side surface of the second circuit board, the other end of the external wiring harness is fixed on the side surface of the second area of the second circuit board facing the third circuit board, and the external wiring harness The wire harness extends on the outer peripheral surface of the first circuit board in a direction parallel to the second circuit board and/or perpendicular to the second circuit board.
如上所述的电路板组件，其中，所述电路板组件还包括绝缘层，所述绝缘层包覆所述第一电路板的外周面，所述充电线圈布设于所述绝缘层与所述第一电路板之间，所述外接线束布设于所述绝缘层的外表面上。The circuit board assembly as described above, wherein the circuit board assembly further includes an insulating layer covering the outer peripheral surface of the first circuit board, and the charging coil is arranged between the insulating layer and the third circuit board. Between a circuit board, the external wiring harness is arranged on the outer surface of the insulation layer.
本申请还提供了一种电子设备，其中，电子设备包括如上所述的电路板组件。The present application also provides an electronic device, wherein the electronic device includes the circuit board assembly as described above.
本申请提供的电路板组件和电子设备，通过将充电线圈环绕设置于第一电路板的外周侧，能够对第一电路板周围的空间充分利用，同时省去了现有技术中另外设置充电线圈所需要的空间，能有效提升电路板结构与充电线圈的集成度，有利于提升电子设备内部空间的利用率。The circuit board assembly and electronic equipment provided by the present application can make full use of the space around the first circuit board by arranging the charging coil around the outer circumference of the first circuit board, and at the same time eliminate the need for additional charging coils in the prior art. The required space can effectively improve the integration of the circuit board structure and the charging coil, which is beneficial to improving the utilization of the internal space of electronic equipment.
附图说明Description of drawings
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单的介绍，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the technical solutions of the embodiments of the present application more clearly, the drawings required to be used in the embodiments of the present application will be briefly introduced below. For those of ordinary skill in the art, without exerting creative efforts, they can also Additional drawings can be obtained from these drawings.
图1为本申请提供的电路板组件的立体结构示意图；Figure 1 is a schematic three-dimensional structural diagram of the circuit board assembly provided by this application;
图2为本申请提供的电路板组件的平面结构示意图；Figure 2 is a schematic plan view of the circuit board assembly provided by this application;
图3为本申请提供的电路板组件的电路板结构的结构示意图；Figure 3 is a schematic structural diagram of the circuit board structure of the circuit board assembly provided by this application;
图4为本申请提供的电路板组件的另一立体结构示意图；Figure 4 is another three-dimensional structural schematic diagram of the circuit board assembly provided by the present application;
图5为本申请提供的电路板组件的另一平面结构示意图。FIG. 5 is another schematic plan view of the circuit board assembly provided by the present application.
附图标号说明：Explanation of reference numbers:
1、电路板结构；11、第一电路板；111、内接线束；112、镂空部；12、第二电路板；13第三电路板；2、充电线圈；3、外接线束；4、绝缘层。1. Circuit board structure; 11. First circuit board; 111. Internal wiring harness; 112. Hollow portion; 12. Second circuit board; 13 Third circuit board; 2. Charging coil; 3. External wiring harness; 4. Insulation layer.
具体实施方式Detailed ways
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。Embodiments of the present application will be described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and cannot be understood as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
如图1及图2所示，本申请提供了一种电路板组件，其中，电路板组件包括电路板结构1及充电线圈2。电路板结构1用于进行电子元件的布设，并实现电子元件的电连接，充电线圈2与电路板电连接，且通过充电线圈2为应用有本申请的电路板组件的电子设备提供无线充电能力。As shown in FIGS. 1 and 2 , the present application provides a circuit board assembly, wherein the circuit board assembly includes a circuit board structure 1 and a charging coil 2 . The circuit board structure 1 is used to lay out electronic components and realize electrical connection of the electronic components. The charging coil 2 is electrically connected to the circuit board, and provides wireless charging capability for electronic devices using the circuit board assembly of the present application through the charging coil 2 .
电路板结构1包括至少一个第一电路板11，第一电路板11为转接板(interposer)。The circuit board structure 1 includes at least one first circuit board 11, and the first circuit board 11 is an interposer.
充电线圈2环绕设置于至少一个第一电路板11的外周侧，且充电线圈2与电路板结构1电连接以实现对充电线圈2的供电。The charging coil 2 is arranged around the outer circumference of at least one first circuit board 11 , and the charging coil 2 is electrically connected to the circuit board structure 1 to provide power to the charging coil 2 .
通过将充电线圈2环绕设置于第一电路板11的外周侧实现无线充电，能够对第一电路板11周围的空间充分利用，同时省去了现有技术中另外设置充电线圈2所需要的空间，能有效提升电路板结构1与充电线圈2的集成度，有利于提升电子设备内部空间的利用率，降低电子设备的整机厚度。同时充电线圈的工作频率较低，对电路板结构1内部电路的射频系统项次干扰的风险较低。By arranging the charging coil 2 around the outer circumference of the first circuit board 11 to achieve wireless charging, the space around the first circuit board 11 can be fully utilized, while eliminating the space required for additional charging coil 2 in the prior art. , can effectively improve the integration of the circuit board structure 1 and the charging coil 2, which is conducive to improving the utilization of the internal space of the electronic device and reducing the overall thickness of the electronic device. At the same time, the working frequency of the charging coil is low, and the risk of interference to the radio frequency system items of the internal circuit of the circuit board structure 1 is low.
可选地，本申请提供的电路板组件，其中，充电线圈2呈螺旋状环绕设置于第一电路板11的外周侧。Optionally, in the circuit board assembly provided by this application, the charging coil 2 is arranged in a spiral shape on the outer peripheral side of the first circuit board 11 .
需要说明的是，对于充电线圈2本身的结构本申请不进行限制，只要其环绕设置于第一电路板11的外表面，且能够提供无限充电功能即可。It should be noted that the structure of the charging coil 2 itself is not limited in this application, as long as it is arranged around the outer surface of the first circuit board 11 and can provide unlimited charging functions.
本申请提供的电路板组件，其中，第一电路板11的外周面上设有定位结构，充电线圈2与定位结构相接。通过设置定位结构能对充电线圈2提供支撑固定，以对充电线圈2的位置进行保持，减少充电线圈2在振动环境中产生较大幅度晃动而受力损坏的情况。In the circuit board assembly provided by this application, a positioning structure is provided on the outer peripheral surface of the first circuit board 11, and the charging coil 2 is connected to the positioning structure. By providing a positioning structure, the charging coil 2 can be supported and fixed to maintain the position of the charging coil 2 and reduce the situation where the charging coil 2 is shaken to a large extent in a vibration environment and is damaged by force.
可选地，定位结构为凹设于第一电路板11外周面上的嵌槽，嵌槽的形状与充电线圈2相匹配，充电线圈2嵌设于嵌槽中，通过嵌槽可以均匀地对充电线圈2的各个位置提供支撑固定，从而使得充电线圈2在振动环境中各处受力均匀，从最大程度上减少充电线圈2在振动环境中受力损坏的情况。Optionally, the positioning structure is an embedding groove recessed on the outer peripheral surface of the first circuit board 11. The shape of the embedding groove matches the charging coil 2. The charging coil 2 is embedded in the embedding groove, and the embedding groove can evenly align the charging coil 2 with the charging coil 2. Each position of the charging coil 2 is supported and fixed, so that the charging coil 2 is evenly stressed everywhere in the vibration environment, thereby minimizing the damage to the charging coil 2 due to stress in the vibration environment.
可选地，定位结构也可以为卡扣或其他能对充电线圈起到定位作用的结构部件。Optionally, the positioning structure can also be a buckle or other structural component that can position the charging coil.
如图1至图5所示，本申请提供的电路板组件，包括至少一个第二电路板12及至少一个第三电路板13，每个第二电路板12及每个第三电路板13均是一个单独的电路板，可以为PCB板，第二电路板12与第三电路板13相互平行且交替层叠间隔设置，每个第二电路板12与相邻的第三电路板13之间通过一个第一电路板11连接，每个第二电路板12的两侧表面及每个第三电路板13的两侧表面均可以布设电子元件，能有效提升电子元件与电路板结构1的集成性，同时减少电路板结构1整体于电子设备内部占用的面积。As shown in Figures 1 to 5, the circuit board assembly provided by the present application includes at least one second circuit board 12 and at least one third circuit board 13. Each second circuit board 12 and each third circuit board 13 are It is a separate circuit board, which can be a PCB board. The second circuit board 12 and the third circuit board 13 are parallel to each other and alternately stacked at intervals. Each second circuit board 12 and the adjacent third circuit board 13 are connected by A first circuit board 11 is connected, and electronic components can be arranged on both sides of the surface of each second circuit board 12 and both sides of each third circuit board 13 , which can effectively improve the integration of the electronic components and the circuit board structure 1 , while reducing the area occupied by the entire circuit board structure 1 inside the electronic device.
如图3所示，本申请提供的电路板组件，其中，第一电路板11的上开设有镂空部112，镂空部112沿第二电路板12与第三电路板13的层叠方向贯通，即第一电路板11大致呈框形结构，于镂空部112处对相邻的第二电路板12及相邻的第三电路板13朝向该第一电路板11的一侧进行避让，以保证第二电路板12两侧及第三电路板13的两侧具有充足的供电子元件的布设空间；第一电路板11的内部埋设有多条内接线束111，各内接线束111间隔设置，每条内接线束111分别与相邻的第二电路板12和/或第三电路板13电连接，以形成多条通路，供实现电子元件的电路布设。As shown in Figure 3, in the circuit board assembly provided by the present application, a hollow portion 112 is provided on the first circuit board 11, and the hollow portion 112 penetrates along the stacking direction of the second circuit board 12 and the third circuit board 13, that is, The first circuit board 11 has a substantially frame-shaped structure, and the hollow portion 112 avoids the side of the adjacent second circuit board 12 and the adjacent third circuit board 13 facing the first circuit board 11 to ensure that the first circuit board 11 has a frame-shaped structure. Both sides of the second circuit board 12 and both sides of the third circuit board 13 have sufficient layout space for electronic components; a plurality of internal wiring harnesses 111 are embedded inside the first circuit board 11, and each internal wiring harness 111 is arranged at intervals. The inner wiring harness 111 is electrically connected to the adjacent second circuit board 12 and/or the third circuit board 13 respectively to form multiple paths for circuit layout of electronic components.
可选地，第一电路板11为绝缘材质制成的框形结构，其上开设有多个沿垂直于第二电路板12的方向贯通的通孔，通孔中填充有导电介质以形成内接线束111。Optionally, the first circuit board 11 is a frame-shaped structure made of insulating material, with a plurality of through holes penetrating in a direction perpendicular to the second circuit board 12 , and the through holes are filled with conductive medium to form an internal circuit board. Wiring harness 111.
充电线圈2的一部分贯穿第一电路板11的外周面并与内接线束111电连接，以间接连接的方式实现与第二电路板12和/或第三电路板13的电连接，在其他实施例中，充电线圈2也可以直接与第二电路板12和/或第三电路板13相接以实现电连接。A part of the charging coil 2 penetrates the outer peripheral surface of the first circuit board 11 and is electrically connected to the internal wiring harness 111 to achieve electrical connection with the second circuit board 12 and/or the third circuit board 13 in an indirect connection manner. In other embodiments, In this example, the charging coil 2 may also be directly connected to the second circuit board 12 and/or the third circuit board 13 to achieve electrical connection.
本申请提供的电路板组件，其中，每个第一电路板11与相邻设置的第二电路板12及第三电路板13粘接固定，不仅具有便于加工的优点，且可以保证第一电路板11与相邻的第二电路板12及第三电路板13之间的连接可靠性。In the circuit board assembly provided by this application, each first circuit board 11 is bonded and fixed with the adjacent second circuit board 12 and third circuit board 13, which not only has the advantage of easy processing, but also ensures that the first circuit The connection reliability between the board 11 and the adjacent second circuit board 12 and the third circuit board 13.
如图4及图5所示，本申请提供的电路板组件，其中，电路板组件包括多条外接线束3，外接线束3于第二电路板12与第三电路板13之间延伸，外接线束3的一端固定于其中一个第二电路板12上，外接线束3的另一端固定于其中一个第三电路板13上。可以实现位于第二电路板12上的电子元件与位于第三电路板13上的电子元件之间的电连接，通过设置外接线束3，能充分利用第一电路板11外周面积，增大电路板结构1的布线面积，提供除了内接线束111以外的电连接通道，需要说明的是，外接线束3与充电线圈2相互绝缘，以保证充电线圈2及与外接线束3相接的电子元件的正常电气功能。As shown in FIGS. 4 and 5 , the circuit board assembly provided by the present application includes a plurality of external wiring harnesses 3 extending between the second circuit board 12 and the third circuit board 13 . One end of the external wiring harness 3 is fixed on one of the second circuit boards 12 , and the other end of the external wiring harness 3 is fixed on one of the third circuit boards 13 . The electrical connection between the electronic components located on the second circuit board 12 and the electronic components located on the third circuit board 13 can be realized. By setting the external wiring harness 3, the peripheral area of the first circuit board 11 can be fully utilized and the circuit board can be enlarged. The wiring area of structure 1 provides electrical connection channels other than the internal wiring harness 111. It should be noted that the external wiring harness 3 and the charging coil 2 are insulated from each other to ensure the normal operation of the charging coil 2 and the electronic components connected to the external wiring harness 3. Electrical functions.
本申请提供的电路板组件，其中，外接线束3于第二电路板12的表面上、第三电路板13的表面上、第一电路板11的内侧表面上和/或第一电路板11的外侧表面上延伸设置。以提升外接线束3的灵活布设，提升电路板结构1布局及走线的灵活性。In the circuit board assembly provided by this application, the external wiring harness 3 is on the surface of the second circuit board 12 , the surface of the third circuit board 13 , the inner surface of the first circuit board 11 and/or the first circuit board 11 extended on the outer surface. In order to improve the flexible layout of the external wiring harness 3, the flexibility of the layout and wiring of the circuit board structure 1 is improved.
如图1至图5所示，本申请提供的电路板组件，其中，以第二电路板12及第三电路板13均设有一个为例进行说明，第二电路板12包括第一区域与第二区域，第二区域环绕第一区域，沿垂直于第二电路板12及第三电路板13的方向，第三电路板13的投影与第一区域的投影重合，外接线束3的一端固定于第三电路板13背离第二电路板12的一侧表面上，外接线束3的另一端固定于第二电路板12的第二区域朝向第三电路板13的一侧表面上，以将需要分别布设在第二电路板12上及第三电路板13上且需要电连接的两个电子元件分别设置在第三电路板13背离第二电路板12的表面以及第二电路板12的第二区域朝向第三电路板13的表面，如此设置，使得两电子元件之间仅沿垂直于第二电路板12的方向稍微具有高度差，有利于简化二者之间的电连接走线。As shown in FIGS. 1 to 5 , the circuit board assembly provided by the present application takes an example in which each of the second circuit board 12 and the third circuit board 13 is provided. The second circuit board 12 includes a first area and a third circuit board 13 . The second area surrounds the first area in a direction perpendicular to the second circuit board 12 and the third circuit board 13. The projection of the third circuit board 13 coincides with the projection of the first area. One end of the external wiring harness 3 is fixed. On the side surface of the third circuit board 13 facing away from the second circuit board 12, the other end of the external wiring harness 3 is fixed on the side surface of the second area of the second circuit board 12 facing the third circuit board 13 to connect the required Two electronic components that are respectively arranged on the second circuit board 12 and the third circuit board 13 and need to be electrically connected are respectively provided on the surface of the third circuit board 13 facing away from the second circuit board 12 and the second surface of the second circuit board 12 . The area faces the surface of the third circuit board 13 and is arranged so that there is only a slight height difference between the two electronic components in a direction perpendicular to the second circuit board 12, which is beneficial to simplifying the electrical connection wiring between the two electronic components.
可选地，在实现两电子元件的电连接时，外接线束3于第三电路板13上的延伸方向与外接线束3于第二电路板12上的延伸方向可以相同或不同，且外接线束3于第一电路板11的外周面上沿平行于第二电路板12和/或垂直于第二电路板12的方向延伸，可以根据电路板结构1上电子元件的实际布设情况进行调整，以充分利用各电子元件之间的间隙。Optionally, when realizing the electrical connection between two electronic components, the extension direction of the external wiring harness 3 on the third circuit board 13 and the extension direction of the external wiring harness 3 on the second circuit board 12 may be the same or different, and the external wiring harness 3 Extending on the outer peripheral surface of the first circuit board 11 in a direction parallel to the second circuit board 12 and/or perpendicular to the second circuit board 12 can be adjusted according to the actual layout of the electronic components on the circuit board structure 1 to fully Take advantage of the gaps between electronic components.
可选地，第一区域与第三电路板13均可以根据电子元件的实际布设情况设置多个，每个第三电路板13与一个第一区域相对应；可以在每个第三电路板13与第二电路板12之间的第一电路板11的周缘均设置充电线圈2，以使得电子设备具有多个区域，实现多个区域同时充电，提升充电效率。Optionally, multiple first areas and third circuit boards 13 can be provided according to the actual layout of electronic components, and each third circuit board 13 corresponds to a first area; Charging coils 2 are provided on the periphery of the first circuit board 11 between the first circuit board 11 and the second circuit board 12, so that the electronic device has multiple areas, enabling multiple areas to be charged simultaneously, thereby improving charging efficiency.
如图5所示，本申请提供的电路板组件，其中，电路板组件还包括绝缘层4，绝缘层4包覆第一电路板11的外周面，充电线圈2布设于绝缘层4与第一电路板11之间，且外接线束3布设于绝缘层4的外表面上。以实现充电线圈2与外接线束3之间的绝缘，同时为外接线束3提供贴附基础，从而对外接线束3进行固定。As shown in Figure 5, the circuit board assembly provided by this application further includes an insulating layer 4. The insulating layer 4 covers the outer peripheral surface of the first circuit board 11, and the charging coil 2 is arranged between the insulating layer 4 and the first circuit board 11. between the circuit boards 11 , and the external wiring harness 3 is arranged on the outer surface of the insulating layer 4 . In order to achieve insulation between the charging coil 2 and the external wiring harness 3, and at the same time provide an attachment base for the external wiring harness 3, thereby fixing the external wiring harness 3.
本申请提供的电路板组件，通过将充电线圈2环绕设置于第一电路板11的外周侧，能够对第一电路板11周围的空间充分利用，同时省去了现有技术中另外设置充电线圈2所需要的空间，能有效提升电路板结构1与充电线圈2的集成度，有利于提升电子设备内部空间的利用率。The circuit board assembly provided by the present application can make full use of the space around the first circuit board 11 by arranging the charging coil 2 around the outer peripheral side of the first circuit board 11, while eliminating the need to install an additional charging coil in the prior art. The space required by 2 can effectively improve the integration of the circuit board structure 1 and the charging coil 2, which is beneficial to improving the utilization of the internal space of the electronic device.
本申请还提供了一种电子设备，其中，电子设备包括如上所述的电路板组件。The present application also provides an electronic device, wherein the electronic device includes the circuit board assembly as described above.
本申请提供的电子设备，其电路板组件通过将充电线圈环绕设置于第一电路板的外周侧，能够对第一电路板周围的空间充分利用，同时省去了现有技术中另外设置充电线圈所需要的空间，能有效提升电路板结构与充电线圈的集成度，有利于提升电子设备内部空间的利用率。The circuit board assembly of the electronic device provided by this application can make full use of the space around the first circuit board by arranging the charging coil around the outer circumference of the first circuit board, and at the same time eliminates the need for additional charging coils in the prior art. The required space can effectively improve the integration of the circuit board structure and the charging coil, which is beneficial to improving the utilization of the internal space of electronic equipment.
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”一般表示前后关联对象是一种“或”的关系。The terms "first" and "second" features in the description and claims of this application may include one or more of these features, either explicitly or implicitly. In the description of this application, unless otherwise stated, "plurality" means two or more. In addition, "and/or" in the description and claims indicates at least one of the connected objects, and the character "/" generally indicates that the related objects are in an "or" relationship.
在本申请的描述中，需要理解的是，术语“纵向”、“横向”、“上”、“下”、“前”、“中”、“后”、“左”、“右”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。In the description of this application, it should be understood that the terms "vertical", "transverse", "upper", "lower", "front", "middle", "rear", "left", "right", " The orientation or positional relationship indicated by "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must be Having a specific orientation, being constructed and operating in a specific orientation, and therefore should not be construed as limiting the application.
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.
以上所述，仅为本申请的具体实施方式，所属领域的技术人员可以清楚地了解到，为了描述的方便和简洁，上述描述的系统、模块和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。应理解，本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。The above are only specific implementation modes of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the above-described systems, modules and units can be referred to the foregoing method embodiments. The corresponding process will not be described again here. It should be understood that the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and these modifications or substitutions should be covered. within the protection scope of this application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311645944.XACN117596775A (en) | 2023-11-30 | 2023-11-30 | Circuit board assembly and electronic equipment |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311645944.XACN117596775A (en) | 2023-11-30 | 2023-11-30 | Circuit board assembly and electronic equipment |
| Publication Number | Publication Date |
|---|---|
| CN117596775Atrue CN117596775A (en) | 2024-02-23 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311645944.XAPendingCN117596775A (en) | 2023-11-30 | 2023-11-30 | Circuit board assembly and electronic equipment |
| Country | Link |
|---|---|
| CN (1) | CN117596775A (en) |
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