技术领域Technical field
本发明涉及光通信电子设备结构技术领域，尤其涉及一种适用于多路光纤网络接收机结构散热优化设计方法。The invention relates to the technical field of optical communication electronic equipment structures, and in particular to a structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers.
背景技术Background technique
随着光通信产业的迅速发展，光通信设备越来越复杂化、尖端化和智能化。同时光通信设备小型化，轻量化，定制化和高可靠性的要求，对高热流密度下光通信设备的结构散热提出了更大的挑战；1)光通信设备工作环境复杂：海拔、高温、低温、湿度、温度冲击、太阳热辐射、冲击振动、结冰、各类恶劣环境(真菌、沙漠、灰尘、烟灰等等)均对电子设备结构散热设计有不同程度影响。尤其是碰到短暂的热冲击问题，如果不及时将热量散发，设备将继续升温，器件将过热而失效。2)处理数据多，发热量多：由于日常任务的繁多，势必导致这些电子产品承担较大的数据处理量，同时要求较快的数据处理速度，电子设备的热耗会随之急剧增加。3)轻量化、完美的可靠性增加结构散热设计的难度：对于处于大气层或者外太空环境下的电子设备来说，重量是一个非常重要的要素。重量越轻，产品持续工作的时间就越长，花费的费用就越低。但通信设备的热可靠性设计面临着巨大的设计难度。With the rapid development of the optical communication industry, optical communication equipment is becoming more and more complex, sophisticated and intelligent. At the same time, the requirements for miniaturization, lightweight, customization and high reliability of optical communication equipment pose greater challenges to the structural heat dissipation of optical communication equipment under high heat flux density; 1) The working environment of optical communication equipment is complex: altitude, high temperature, Low temperature, humidity, temperature shock, solar thermal radiation, shock and vibration, icing, and various harsh environments (fungus, desert, dust, soot, etc.) all have varying degrees of impact on the structural heat dissipation design of electronic equipment. Especially when encountering short-term thermal shock problems, if the heat is not dissipated in time, the equipment will continue to heat up, and the device will overheat and fail. 2) Processing a lot of data and generating a lot of heat: Due to the variety of daily tasks, these electronic products will inevitably bear a large amount of data processing and require faster data processing speeds. The heat consumption of electronic devices will increase sharply. 3) Lightweight and perfect reliability increase the difficulty of structural heat dissipation design: For electronic equipment in the atmosphere or outer space environment, weight is a very important factor. The lighter the weight, the longer the product will continue to work and the less it will cost. However, the thermal reliability design of communication equipment faces huge design difficulties.
多路光纤网络光端机为信号光传输设备，该信号光传输设备装在通信车的方舱内，与外界接收设备实时互通；该设备集成度高、耗散功耗高且面临着恶劣的高温热环境，多路光纤网络光端机内部光收发模块对温度极为敏感，因此多路光纤网络光端机结构散热面临着巨大的设计难度；而且该设备项目要求交付周期短、平、快。The multi-channel optical fiber network optical terminal is a signal optical transmission equipment. The signal optical transmission equipment is installed in the cabin of the communication vehicle and communicates with external receiving equipment in real time. This equipment has high integration, high power consumption and faces harsh high temperature and heat. Environment, the internal optical transceiver module of the multi-channel optical fiber network optical transceiver is extremely sensitive to temperature, so the structural heat dissipation of the multi-channel optical fiber network optical transceiver faces huge design difficulties; and the equipment project requires a short, flat and fast delivery cycle.
传统设计方法仅依靠工程师的经验，对多路光纤网络光端机结构散热进行设计，不能保证功率器件热可靠性。The traditional design method only relies on the experience of engineers to design the structural heat dissipation of multi-channel optical fiber network optical terminals, which cannot guarantee the thermal reliability of power devices.
发明内容Contents of the invention
本发明的目的在于提供一种适用于多路光纤网络接收机结构散热优化设计方法，旨在解决传统工程师依靠经验设计多路光纤网络光端机结构散热，不能保证功率器件热可靠性的问题。The purpose of the present invention is to provide a structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers, aiming to solve the problem that traditional engineers rely on experience to design multi-channel optical fiber network optical terminal structural heat dissipation and cannot guarantee the thermal reliability of power devices.
为实现上述目的，本发明提供了一种适用于多路光纤网络接收机结构散热优化设计方法，包括以下步骤：In order to achieve the above objectives, the present invention provides a structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers, which includes the following steps:
S1基于多路光纤网络接收机的工作环境与需求，确定多路光纤网络接收机结构散热设计；S1 determines the structural heat dissipation design of the multi-channel optical fiber network receiver based on the working environment and needs of the multi-channel optical fiber network receiver;
S2建立多路光纤网络接收机数字化样机模型，并基于所述数字化样机模型对多路光纤网络接收机进行温度仿真分析，得到各功率器件温度数据；S2 establishes a digital prototype model of a multi-channel optical fiber network receiver, and conducts temperature simulation analysis on the multi-channel optical fiber network receiver based on the digital prototype model to obtain temperature data of each power device;
S3基于所述各功率器件温度数据，判断关键功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则对单板功率器件布局优化，获取器件布局优化后温度数据；Based on the temperature data of each power device, S3 determines whether the temperature of the key power device meets the thermal reliability requirements. If it meets the requirement, it will output the structural parameters of the multi-channel optical fiber network receiver. If it does not meet the requirement, it will optimize the layout of the single-board power device and obtain the optimized device layout. temperature data;
S4基于所述优化后的温度数据，判断结构散热尺寸优化后功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则对关键功率器件结构散热尺寸进行优化设计，获取结构散热尺寸优化后各功率器件温度数据；Based on the optimized temperature data, S4 determines whether the temperature of the power device after optimizing the structural heat dissipation size meets the thermal reliability requirements. If it meets the requirements, it will output the structural parameters of the multi-channel optical fiber network receiver. If not, it will optimize the structural heat dissipation size of the key power device. Design and obtain the temperature data of each power device after the structural heat dissipation size is optimized;
S5基于所述优化后各功率器件温度数据，判断结构散热尺寸优化后功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则重新对结构散热进行设计，并重复S1至S5，直至满足功率器件热可靠性要求。Based on the temperature data of each power device after optimization, S5 determines whether the temperature of the power device after optimizing the structural heat dissipation size meets the thermal reliability requirements. If it meets the requirements, it will output the structural parameters of the multi-channel optical fiber network receiver. If it does not, it will redesign the structural heat dissipation. And repeat S1 to S5 until the thermal reliability requirements of the power device are met.
其中，所述多路光纤网络接收机工作环境温度为-40℃～55℃。Wherein, the working environment temperature of the multi-channel optical fiber network receiver is -40°C to 55°C.
其中，所述多路光纤网络接收机由1个电源模块、1个电源滤波器、1个多路光收发模块、1个主功能板控制模块、面板指示灯和各类接插件组成。Among them, the multi-channel optical fiber network receiver is composed of a power module, a power filter, a multi-channel optical transceiver module, a main function board control module, panel indicators and various connectors.
其中，所述确定多路光纤网络接收机结构散热设计包括：整机尺寸与材料确定、散热形式与风道设计、风扇选型与风力分配和关键功率器件结构散热选型与设计。Among them, the determination of the structural heat dissipation design of the multi-channel optical fiber network receiver includes: determination of the overall machine size and materials, heat dissipation form and air duct design, fan selection and wind distribution, and structural heat dissipation selection and design of key power devices.
其中，所述数字化样机模型采用三维软件建立，温度仿真分析采用热仿真技术进行。Among them, the digital prototype model is established using three-dimensional software, and the temperature simulation analysis is performed using thermal simulation technology.
本发明的一种适用于多路光纤网络接收机结构散热优化设计方法，通过S1基于多路光纤网络接收机的工作环境与需求，确定多路光纤网络接收机结构散热设计；S2建立多路光纤网络接收机数字化样机模型，并基于所述数字化样机模型对多路光纤网络接收机进行温度仿真分析，得到各功率器件温度数据；S3基于所述各功率器件温度数据，判断关键功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则对单板功率器件布局优化，获取器件布局优化后温度数据；S4基于所述优化后的温度数据，判断结构散热尺寸优化后功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则对关键功率器件结构散热尺寸进行优化设计，获取结构散热尺寸优化后各功率器件温度数据；S5基于所述优化后各功率器件温度数据，判断结构散热尺寸优化后功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则重新对结构散热进行设计，并重复S1至S5，直至满足功率器件热可靠性要求，该方法在多路光纤网络接收机结构散热优化设计中，采用热仿真技术对多路光纤网络接收机温度场进行分析，初步预测多路光纤网络接收机系统热可靠性；引入参数化技术，将温度场和结构散热几何尺寸、性能参数作为优化目标和设计变量，构建了结构散热尺寸优化数学模型；同时结合多目标遗传算法(MOGA)对结构散热尺寸进行优化；获得最优的多路光纤网络接收机结构参数，进而快速指导多路光纤网络接收机结构散热设计，大大缩短了设备研制周期，在多路光纤网络接收机温度场仿真分析中,根据单板功率器件的结构尺寸、各功率器件距机箱进风口的距离，并结合各单板功率器件表面温度和各功率器件周围空气流速数据；对多路光纤网络接收机内部单板功率器件进行优化布局；获得器件布局对单板温度场的影响规律。可快速指导电子工程师对单板功率器件的合理布局，进一步提升了多路光纤网络接收机结构散热能力及板级功率器件的热可靠性，解决传统工程师依靠经验设计多路光纤网络光端机结构散热，不能保证功率器件热可靠性的问题。The present invention is a structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers. Through S1, the structural heat dissipation design of the multi-channel optical fiber network receiver is determined based on the working environment and needs of the multi-channel optical fiber network receiver; S2 establishes the multi-channel optical fiber network receiver. Network receiver digital prototype model, and perform temperature simulation analysis on the multi-channel optical fiber network receiver based on the digital prototype model to obtain the temperature data of each power device; S3 determines whether the temperature of the key power device meets the requirements based on the temperature data of each power device. If the thermal reliability requirements are met, the structural parameters of the multi-channel optical fiber network receiver will be output. If they are not met, the single-board power device layout will be optimized to obtain the temperature data after the device layout is optimized; S4 determines the structural heat dissipation size based on the optimized temperature data. Whether the optimized power device temperature meets the thermal reliability requirements, if so, the multi-channel optical fiber network receiver structural parameters will be output. If not, the structural heat dissipation size of the key power device will be optimized and designed, and the temperature data of each power device after the structural heat dissipation size is optimized will be obtained; Based on the temperature data of each power device after optimization, S5 determines whether the temperature of the power device after optimizing the structural heat dissipation size meets the thermal reliability requirements. If it meets the requirements, it will output the structural parameters of the multi-channel optical fiber network receiver. If it does not, it will redesign the structural heat dissipation. And repeat S1 to S5 until the thermal reliability requirements of the power device are met. This method uses thermal simulation technology to analyze the temperature field of the multi-channel optical fiber network receiver in the structural heat dissipation optimization design of the multi-channel optical fiber network receiver, and initially predicts the multi-channel optical fiber network receiver temperature field. Thermal reliability of the optical fiber network receiver system; introducing parametric technology, taking the temperature field, structural heat dissipation geometric size, and performance parameters as optimization targets and design variables, and constructing a mathematical model for structural heat dissipation size optimization; at the same time, combined with the multi-objective genetic algorithm (MOGA) Optimize the structural heat dissipation size; obtain the optimal structural parameters of the multi-channel optical fiber network receiver, and then quickly guide the structural heat dissipation design of the multi-channel optical fiber network receiver, greatly shortening the equipment development cycle, and simulate the temperature field of the multi-channel optical fiber network receiver In the analysis, based on the structural size of the single-board power device, the distance between each power device and the chassis air inlet, combined with the surface temperature of each single-board power device and the air flow rate data around each power device; for the internal single board of the multi-channel optical fiber network receiver Optimize the layout of power devices; obtain the influence of device layout on the temperature field of the single board. It can quickly guide electronic engineers on the reasonable layout of single-board power devices, further improving the structural heat dissipation capacity of multi-channel optical fiber network receivers and the thermal reliability of board-level power devices, solving the problem of traditional engineers relying on experience to design multi-channel optical fiber network optical transceiver structural heat dissipation. The thermal reliability of power devices cannot be guaranteed.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.
图1为本发明多路光纤网络接收机结构散热优化设计方法技术流程图；Figure 1 is a technical flow chart of the structural heat dissipation optimization design method of a multi-channel optical fiber network receiver according to the present invention;
图2为本发明多路光纤网络接收机内部多路光收发模块、主功能板控制模块功率发热器件布局；Figure 2 is the layout of the power heating device of the multi-channel optical transceiver module and main function board control module inside the multi-channel optical fiber network receiver of the present invention;
图3为本发明多路光纤网络接收机风道设计及结构散热模型图；Figure 3 is a diagram of the air duct design and structural heat dissipation model of the multi-channel optical fiber network receiver of the present invention;
图4为本发明风机选型及性能参数图；Figure 4 is a diagram of fan selection and performance parameters of the present invention;
图5散热器结构尺寸图Figure 5 Radiator structure and dimensions diagram
图6为本发明多路光纤网络接收机温度分布图；Figure 6 is a temperature distribution diagram of the multi-channel optical fiber network receiver of the present invention;
图7为本发明多路光纤网络接收机内部主功能控制板上器件周边速度分布图；Figure 7 is a velocity distribution diagram around the components on the internal main function control board of the multi-channel optical fiber network receiver of the present invention;
图8为本发明多路光纤网络接收机内部风扇工作点图；Figure 8 is a working point diagram of the internal fan of the multi-channel optical fiber network receiver of the present invention;
图9为本发明主功能控制板上器件的布局优化设计图；Figure 9 is a layout optimization design diagram of the components on the main function control board of the present invention;
图10为本发明多路光纤网络接收机内部功能控制板上器件的布局优化后温度分布图；Figure 10 is a temperature distribution diagram after layout optimization of components on the internal function control board of the multi-channel optical fiber network receiver of the present invention;
图11为本发明基于ANSYS Workbench的散热器结构尺寸优化设计平台图；Figure 11 is a platform diagram of the radiator structural size optimization design based on ANSYS Workbench of the present invention;
图12为本发明多路光纤网络接收机内部散热器结构尺寸与峰值温度之间的响应图；Figure 12 is a response diagram between the structural size and peak temperature of the internal radiator of the multi-channel optical fiber network receiver of the present invention;
图13为本发明目标值判定系数和响应面预测值与实验设计值的拟合度精度图；Figure 13 is a fitting accuracy diagram of the target value determination coefficient and response surface prediction value of the present invention and the experimental design value;
图14为本发明优化后多路光纤网络接收机内部散热器结构尺寸优化后的温度分布图；Figure 14 is a temperature distribution diagram after optimizing the structural size of the internal radiator of the optimized multi-channel optical fiber network receiver of the present invention;
图15为本发明多路光纤网络接收机最优的结构散热器模型图。Figure 15 is a diagram of the optimal structural heat sink model of the multi-channel optical fiber network receiver of the present invention.
图16为本发多路光纤网络接收机最终的结构散热设计图。Figure 16 is the final structural heat dissipation design diagram of the multi-channel optical fiber network receiver of the present invention.
具体实施方式Detailed ways
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention and are not to be construed as limiting the present invention.
请参阅图1至图16，本发明提供一种适用于多路光纤网络接收机结构散热优化设计方法，包括以下步骤：Please refer to Figures 1 to 16. The present invention provides a structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers, which includes the following steps:
S1基于多路光纤网络接收机的工作环境与需求，确定多路光纤网络接收机结构散热设计；S1 determines the structural heat dissipation design of the multi-channel optical fiber network receiver based on the working environment and needs of the multi-channel optical fiber network receiver;
具体的，根据多路光纤网络接收机工作环境与具体需求，确定多路光纤网络接收机结构散热设计，包括整机尺寸与材料确定，散热形式与风道设计、风扇选型与风力分配及关键功率器件结构散热选型与设计Specifically, based on the working environment and specific needs of the multi-channel optical fiber network receiver, the structural heat dissipation design of the multi-channel optical fiber network receiver is determined, including the determination of the overall machine size and materials, heat dissipation form and air duct design, fan selection and wind distribution and key Power device structure heat dissipation selection and design
整机结构尺寸与材料确定Determination of overall machine structural dimensions and materials
多路光纤网络接收机主要由1个电源模块、1个电源滤波器，1个多路光收发模块、1个主功能板控制模块、面板指示灯和各类接插件等组成，多路光纤网络接收机工作环境温度为：-40℃～55℃；主要的热源分布在电源模块、多路光收发模块、主功能板控制模块；多路光收发模块、主功能板控制模块热源布局如附图2所示；相关发热器件热耗信息及温度要求如表1所示。The multi-channel optical fiber network receiver is mainly composed of a power module, a power filter, a multi-channel optical transceiver module, a main function board control module, panel indicators and various connectors, etc. The multi-channel optical fiber network receiver The working environment temperature of the receiver is: -40℃~55℃; the main heat sources are distributed in the power module, multi-channel optical transceiver module, and main function board control module; the heat source layout of the multi-channel optical transceiver module and main function board control module is as shown in the attached figure 2; the heat consumption information and temperature requirements of relevant heating devices are shown in Table 1.
根据多路光纤网络接收机工作环境与尺寸要求，多路光纤网络接收机采用标准19英寸3U机箱设计，尺寸为(482.6±0.5)mm×(350±0.5)mm×(122±2)mm。机箱主要由面板、箱体、盖板等零部件组成。主要零件采用6061铝合金材料。上下盖板与侧板结合面开凹槽，放置导电密封条，各部件之间通过螺钉紧固。螺钉材料为不锈钢。整个机箱加工通过铣削、压铆、螺装等工艺制造，体积小、重量轻，零件之间拆卸方便，便于维修。According to the working environment and size requirements of the multi-channel optical fiber network receiver, the multi-channel optical fiber network receiver adopts a standard 19-inch 3U chassis design with dimensions of (482.6±0.5)mm×(350±0.5)mm×(122±2)mm. The chassis is mainly composed of panels, boxes, covers and other components. The main parts are made of 6061 aluminum alloy material. Grooves are opened on the joint surfaces of the upper and lower covers and side plates, conductive sealing strips are placed, and the components are fastened with screws. The screw material is stainless steel. The entire chassis is manufactured through milling, riveting, screw mounting and other processes. It is small in size and light in weight. Parts can be easily disassembled and repaired.
表1相关发热器件热耗信息及温度要求Table 1 Heat consumption information and temperature requirements of relevant heating devices
散热形式与风道设计Heat dissipation form and air duct design
由于该设备要求体积小，内部空间有限，且耗散功耗较高且面临着恶劣的高温热环境，为了让设备有较高的可靠性及适应性，需要对其进行必要的散热设计；该设备采用强迫风冷+热传导散热的方式，机箱采用典型的风道设计-左进右出的方式将内部热量散去，具体结构散热设计形式是将多路光收发模块倒扣在底板上，主功能控制板通过支撑条堆叠固定在多路光收发模块；该设备工作时，多路光收发模块产生的热量经光模块传至机箱底板散去，主功能控制板发热芯片产生的热量经与空气的强迫对流将热量散去。该设备风道设计及结构散热模型如附图3所示。Since the equipment requires a small size, limited internal space, high power dissipation and harsh high-temperature thermal environment, in order to ensure high reliability and adaptability of the equipment, necessary heat dissipation design is required; The equipment adopts forced air cooling + heat conduction heat dissipation. The chassis adopts a typical air duct design - left in and right out to dissipate internal heat. The specific structural heat dissipation design form is to flip the multi-channel optical transceiver module upside down on the bottom plate. The functional control board is stacked and fixed on the multi-channel optical transceiver module through support strips; when the device is working, the heat generated by the multi-channel optical transceiver module is transmitted to the bottom of the chassis through the optical module and dissipated, and the heat generated by the heating chip of the main functional control board passes through the air Forced convection dissipates heat. The air duct design and structural heat dissipation model of the equipment are shown in Figure 3.
风扇选型与风力分配Fan selection and wind distribution
整机热功耗小于等于85.5W，按最大热功耗85.5W计算，根据热平衡方程整机的通风量Qf为：The thermal power consumption of the whole machine is less than or equal to 85.5W. Calculated based on the maximum thermal power consumption of 85.5W, the ventilation volume Qf of the whole machine according to the heat balance equation is:
式中：ρ为空气的密度，kg/m3；Cp为空气的比热，J/(kg·℃)；为总损耗功率，W；Δt为冷却空气的出口与进口温差，℃。In the formula: ρ is the density of air, kg/m3 ; Cp is the specific heat of air, J/(kg·℃); is the total power loss, W; Δt is the temperature difference between the outlet and inlet of the cooling air, °C.
该设备总损耗功率空气的密度ρ＝1.094kg/m3，空气的比热Cp＝1005J/(kg•℃)，冷却空气入口和出口的温升Δt＝10℃，将上述参数值代入式(1)中，得考虑到内部热阻和损耗的空气，按照2倍冗余进行设计，所需风量为33CFM。选定轴流风机的主要参数为：电压为12VDC，功率5.4W，风量为29.4CFM，风压为0.37Inch-H2O(Inch-H2O为压强单位)。由于机箱内部体积较大，并且考虑到热量应均匀排出，机箱内部分配2个风机，且2个风机并联固定在机箱侧板上。2个风机型号为DA06025#12U，尺寸为：60毫米×60毫米×25毫米(长×宽×高)；风机选型及性能参数如附图4所示。The total power loss of the device The density of air ρ = 1.094kg/m3 , the specific heat of air Cp = 1005J/(kg·℃), the temperature rise of the cooling air inlet and outlet Δt = 10℃, substitute the above parameter values into formula (1), have to Taking into account the internal thermal resistance and air loss, the design is based on 2 times redundancy, and the required air volume is 33CFM. The main parameters of the selected axial flow fan are: voltage 12VDC, power 5.4W, air volume 29.4CFM, and wind pressure 0.37Inch-H2 O (Inch-H2 O is the pressure unit). Due to the large internal volume of the chassis and considering that heat should be discharged evenly, 2 fans are allocated inside the chassis, and the two fans are fixed in parallel on the side panels of the chassis. The model of the two fans is DA06025#12U, and the dimensions are: 60 mm × 60 mm × 25 mm (length × width × height); the fan selection and performance parameters are shown in Figure 4.
结构散热选型与设计Structural heat dissipation selection and design
结构散热尺寸设计计算方法：判定依据：Structural heat dissipation size design calculation method: Judgment basis:
Qw＝h×A(Ts-Ta) (2)Qw =h×A(Ts-Ta) (2)
其中Qw：结构散热换热量，W；h：结构散热与空气的表面对流换热系数，W/(m2·k)；A：结构散热的表面积，m2；Ts：结构散热的平均温度，℃；Ta：空气的温度，℃。Among them, Qw : heat transfer amount of structural heat dissipation, W; h: surface convection heat transfer coefficient of heat dissipation of structure and air, W/(m2 ·k); A: surface area of heat dissipation of structure, m2 ; Ts: average heat dissipation of structure Temperature, ℃; Ta: temperature of air, ℃.
结构散热与空气的表面对流换热系数h的计算:对于直径为60mm以下尺寸轴流风机h可近似取20W/(m2·k)。Calculation of the surface convection heat transfer coefficient h between structural heat dissipation and air: For axial flow fans with diameters below 60mm, h can be approximately 20W/(m2 ·k).
结构散热的表面积A的计算：Calculation of the surface area A for heat dissipation of the structure:
A＝2×L×d×n (3)A＝2×L×d×n (3)
其中L:结构散热长度，d:结构散热高度；n:翅片个数。Where L: structural heat dissipation length, d: structural heat dissipation height; n: number of fins.
强迫风冷时，结构散热均稳定性较差，在环境温度为55℃，平均温升要求在30℃，此时结构散热温度为85℃。4个FPGA芯片热量为24W,则When forced air cooling occurs, the structural heat dissipation stability is poor. When the ambient temperature is 55°C, the average temperature rise is required to be 30°C. At this time, the structural heat dissipation temperature is 85°C. The heat of 4 FPGA chips is 24W, then
Qw＝h×A(Ts-Ta)＝20×2×L×d×n(85-55)＝24w；Qw =h×A(Ts-Ta)=20×2×L×d×n(85-55)=24w;
即：A＝2×L×d×n＝40000mm2That is: A=2×L×d×n=40000mm2
L×d×n＝20000mm2L×d×n＝20000mm2
根据4个FPGA发热芯片在主功能控制板布局位置，合理设计选用了如附图5所示结构散热尺寸：L×d×n＝85×27×12＝27540mm2>20000mm2,通过传热及换热理论计算该结构散热可满足4个FPGA发热芯片散热需求。According to the layout position of the four FPGA heating chips on the main function control board, the heat dissipation size of the structure shown in Figure 5 is reasonably designed and selected: L×d×n=85×27×12=27540mm2 >20000mm2. Through heat transfer and The heat exchange theory calculates that the heat dissipation of this structure can meet the heat dissipation needs of four FPGA heating chips.
S2建立多路光纤网络接收机数字化样机模型，并基于所述数字化样机模型对多路光纤网络接收机进行温度仿真分析，得到各功率器件温度数据；S2 establishes a digital prototype model of a multi-channel optical fiber network receiver, and conducts temperature simulation analysis on the multi-channel optical fiber network receiver based on the digital prototype model to obtain temperature data of each power device;
具体的，利用CAXA软件将建模完成的机箱CAD多路光纤网络接收机数字样机导入到ANSYS-SCDM中，转化为Icepak能够识别的对象，在Icepak中对机箱各部分零件及板级器件材料属性进行定义，功率器件热耗及边界条件进行设置等，建立多路光纤网络接收机温度场仿真模型，模拟高热耗、高温条件55℃下最恶劣的工况，即:设备最大热功耗85.5W时散热仿真分析。最终的仿真结果如附图6。从附图6多路光纤网络接收机温度分布可知：Specifically, CAXA software is used to import the modeled chassis CAD multi-channel optical fiber network receiver digital prototype into ANSYS-SCDM and convert it into an object that can be recognized by Icepak. In Icepak, the material properties of each part of the chassis and board-level devices are Define, set the power device heat consumption and boundary conditions, etc., establish a multi-channel optical fiber network receiver temperature field simulation model, and simulate the worst working conditions under high heat consumption and high temperature conditions of 55°C, that is: the maximum thermal power consumption of the equipment is 85.5W Time-based heat dissipation simulation analysis. The final simulation results are shown in Figure 6. It can be seen from the temperature distribution of the multi-channel optical fiber network receiver in Figure 6:
主功能控制板上4个FPGA发热芯片温度81-82℃，FPGA温度满足其设计目标温度85℃的要求；结构散热的平均温度为81.25℃小于理论计算的结构散热温度平均85℃要求，原因在于所设计的结构散热表面积大于理论计算表面积，结构散热表面积大，与空气对流换热能力强，故仿真模拟计算的结构散热的平均温度会比理论计算的结构散热温度平均低。因此结构散热设计满足4个FPGA散热需求；The temperature of the four FPGA heating chips on the main function control board is 81-82°C. The FPGA temperature meets the requirement of its design target temperature of 85°C. The average structural heat dissipation temperature of 81.25°C is lower than the theoretically calculated average structural heat dissipation temperature requirement of 85°C. The reason is that The heat dissipation surface area of the designed structure is larger than the theoretically calculated surface area. The structure has a large heat dissipation surface area and strong convection heat transfer ability with the air. Therefore, the average structural heat dissipation temperature calculated by simulation will be lower on average than the structural heat dissipation temperature calculated theoretically. Therefore, the structural heat dissipation design meets the heat dissipation needs of 4 FPGAs;
通常情况下，系统设计时，对于低阻力系统设计，风扇的工作点设计在风量的1/2～2/3处，从附图7风扇工作点可以看出，该风扇工作点在最高风量1/2～2/3处，风扇选型满足系统阻力需求。Normally, during system design, for low-resistance system design, the working point of the fan is designed to be at 1/2 to 2/3 of the air volume. As can be seen from the fan operating point in Figure 7, the fan operating point is at the maximum air volume of 1 /2~2/3, the fan selection meets the system resistance requirements.
靠近进风口一侧的器件U6、U7、U8、U9和U2温度分别为74.3℃、76.2℃、75.1℃、74℃和82℃满足其设计目标温度85℃的要求。The temperatures of devices U6, U7, U8, U9 and U2 on the side close to the air inlet are 74.3°C, 76.2°C, 75.1°C, 74°C and 82°C respectively, meeting the design target temperature of 85°C.
远离进风口一侧的器件U1、U12、U13、U3温度分别为84.5℃、89.6℃、89.2℃、87.9℃不能满足其设计目标温度85℃的要求。The temperatures of the devices U1, U12, U13, and U3 on the side away from the air inlet are 84.5°C, 89.6°C, 89.2°C, and 87.9°C respectively, which cannot meet the design target temperature of 85°C.
S3基于所述各功率器件温度数据，判断关键功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则对单板功率器件布局优化，获取器件布局优化后温度数据；Based on the temperature data of each power device, S3 determines whether the temperature of the key power device meets the thermal reliability requirements. If it meets the requirement, it will output the structural parameters of the multi-channel optical fiber network receiver. If it does not meet the requirement, it will optimize the layout of the single-board power device and obtain the optimized device layout. temperature data;
其中，单板功率器件布局优化设计，为了让主功能控制板上所有功率器件满足设计目标温度要求，因此需对主控板制板上功率器件布局进行优化设计。结合主功能控制板模型和附图8主功能控制板上器件周边速度数据可知：1)远离进风口一侧的器件U1、U12、U13、U3的高度均低于主功能控制板上的其他器件，再加上FPGA结构散热对强迫风冷遮挡的影响，器件U1、U12、U13、U3周边流速小，大概在0.03m/s～0.2m/s左右，导致器件与空气的对流换热弱；2)靠近进风口一侧的器件周边流速在0.2m/s～0.8m/s，流速较大，对流换强；因此可将器件U1、U12、U13、U3布在最靠进风口一侧。主功能控制板上器件的具体布局如图9所示。单板布局优化设计后，多路光纤网络接收机温度分布如附图10所示。Among them, the single-board power device layout optimization design is to ensure that all power devices on the main function control board meet the design target temperature requirements, so the power device layout on the main control board control board needs to be optimized. Combining the main function control board model and the peripheral speed data of the devices on the main function control board in Figure 8, it can be seen that: 1) The heights of the devices U1, U12, U13, and U3 on the side away from the air inlet are all lower than other devices on the main function control board , coupled with the impact of FPGA structural heat dissipation on forced air cooling shielding, the flow velocity around devices U1, U12, U13, and U3 is small, about 0.03m/s ~ 0.2m/s, resulting in weak convective heat transfer between the device and the air; 2) The flow velocity around the device close to the air inlet is 0.2m/s ~ 0.8m/s. The flow velocity is relatively large and the convection is strong; therefore, devices U1, U12, U13, and U3 can be placed on the side closest to the air inlet. The specific layout of the devices on the main function control board is shown in Figure 9. After the single board layout is optimized and designed, the temperature distribution of the multi-channel optical fiber network receiver is shown in Figure 10.
S4基于所述优化后的温度数据，判断结构散热尺寸优化后功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则对关键功率器件结构散热尺寸进行优化设计，获取结构散热尺寸优化后各功率器件温度数据；Based on the optimized temperature data, S4 determines whether the temperature of the power device after optimizing the structural heat dissipation size meets the thermal reliability requirements. If it meets the requirements, it will output the structural parameters of the multi-channel optical fiber network receiver. If not, it will optimize the structural heat dissipation size of the key power device. Design and obtain the temperature data of each power device after the structural heat dissipation size is optimized;
具体的，从图10单板布局优化设计后多路光纤网络接收机温度分布可知，除了4个FPGA温度在86℃左右，处于临界值外，其余发热器件温度均低于最大工作温度85℃要求，安全裕度在3～6℃；就目前的主控板器件布局和结构散热尺寸，4个FPGA温度过高，结构散热的平均温度也过高，为了满足主控板性能要求，需要在原有的基础上对FPGA结构散热的结构尺寸进行优化设计。Specifically, from Figure 10, the temperature distribution of the multi-channel optical fiber network receiver after the single board layout optimization design can be seen, except for the temperature of 4 FPGAs, which is around 86°C, which is at the critical value, the temperatures of the other heating devices are lower than the maximum operating temperature of 85°C. , the safety margin is 3~6℃; based on the current main control board device layout and structural heat dissipation size, the temperature of the four FPGAs is too high, and the average temperature of the structural heat dissipation is also too high. In order to meet the performance requirements of the main control board, it is necessary to On the basis of the optimization design of the structural size of the FPGA structure heat dissipation.
利用ANSYSDX提供的响应面优化设计模块的多目标优化(MOGA)算法，该算法系统内部采用了特定的实验抽样设计方法LHS和Kriging代理模型，并结合MOGA算法对结构散热尺寸进行优化设计。基于ANSYS Workbench的结构散热优化设计实现方式如附图11所示。Using the multi-objective optimization (MOGA) algorithm of the response surface optimization design module provided by ANSYSDX, the algorithm system uses a specific experimental sampling design method LHS and Kriging proxy model, and combines the MOGA algorithm to optimize the design of the structural heat dissipation size. The implementation of structural heat dissipation optimization design based on ANSYS Workbench is shown in Figure 11.
结构散热优化模型建立Establishment of structural heat dissipation optimization model
设计变量确定：Design variables determined:
确定初始的设计变量：a＝0.003m；b＝0.030m；c＝0.003m；d＝0.085m；L＝0.099m；n＝12；Determine the initial design variables: a=0.003m; b=0.030m; c=0.003m; d=0.085m; L=0.099m; n=12;
约束条件确定：The constraints are determined:
因4个FPGA温度处于临界值，不需要对结构散热尺寸进行大的调整，这里约束结构散热的固定长度L＝0.099m、宽度d＝0.085m和翅片个数n＝12不变。Because the temperatures of the four FPGAs are at critical values, there is no need to make major adjustments to the structural heat dissipation dimensions. The fixed length L = 0.099m, width d = 0.085m, and number of fins n = 12 that constrain structural heat dissipation remain unchanged.
优化目标确定：Optimization goals are determined:
4个FPGA芯片温度最小化，且多路光纤网络接收机峰值温度低于85℃。结构散热优化模型如下表2所示；The temperature of the four FPGA chips is minimized, and the peak temperature of the multi-channel optical fiber network receiver is lower than 85°C. The structural heat dissipation optimization model is shown in Table 2 below;
表2散热器结构尺寸优化模型Table 2 Radiator structural size optimization model
搭建基于ANSYS Workbench的散热器结构尺寸优化设计平台；Build a radiator structural size optimization design platform based on ANSYS Workbench;
通过Icepak与ANSYS DesignXplorer(DX)对散热器结构尺寸进行优化；具体方法是：在多路光纤网络接收机温度场仿真模型中，对步骤(4a)中散热器结构尺寸优化模型进行参数化设置，优化模型通过数据传递接口将散热器结构尺寸参数与优化目标传递给DX提供的响应面优化设计模块中，然后采用特定的实验抽样设计方法超拉丁抽样法(LHS)和Kriging代理模型，构建散热器结构尺寸与关键功率器件峰值温度之间的响应(关系)，如附图12所示；通过目标值判定系数和调整判定系数验证Kriging响应面的拟合精度，如附图13所示，并结合多目标优化(MOGA)算法，对Kriging响应面模型迭代计算，迭代14400次后会给出收敛性最好的3个最优获得最优散热器结构参数。如下表3所示。Optimize the radiator structural size through Icepak and ANSYS DesignXplorer (DX); the specific method is: in the multi-channel optical fiber network receiver temperature field simulation model, parameterize the radiator structural size optimization model in step (4a), The optimization model transfers the radiator structural size parameters and optimization goals to the response surface optimization design module provided by DX through the data transfer interface, and then uses the specific experimental sampling design method Hyper Latin Sampling (LHS) and Kriging surrogate model to construct the radiator The response (relationship) between the structural size and the peak temperature of the key power device is shown in Figure 12; the fitting accuracy of the Kriging response surface is verified through the target value determination coefficient and the adjustment determination coefficient, as shown in Figure 13, and combined with The multi-objective optimization (MOGA) algorithm iteratively calculates the Kriging response surface model. After 14,400 iterations, the three optimal ones with the best convergence will be given to obtain the optimal radiator structural parameters. As shown in Table 3 below.
表3散热器最优设计尺寸Table 3 Optimal design dimensions of radiator
将散热器最优设计尺寸Candidate Point 1代入多路光纤网络交换机热分析模型中，对其进行温度场仿真模拟，得到了多路光纤网络接收机温度分布如附图14所示。表4为优化后的相关发热器件热耗信息及温度数据。Substitute the optimal design size of the radiator, Candidate Point 1, into the thermal analysis model of the multi-channel optical fiber network switch, conduct temperature field simulation on it, and obtain the temperature distribution of the multi-channel optical fiber network receiver as shown in Figure 14. Table 4 shows the optimized heat consumption information and temperature data of the relevant heating devices.
表4相关发热器件热耗信息及温度数据Table 4 Heat consumption information and temperature data of relevant heating devices
从附图14多路光纤网络接收机温度分布和表4相关发热器件热耗信息及温度数据可知，优化后的散热器结构尺寸不仅满足其本身的热阻设计需求，而且满足FPGA芯片在高温下的散热需求。From the temperature distribution of the multi-channel optical fiber network receiver in Figure 14 and the heat consumption information and temperature data of the relevant heating devices in Table 4, it can be seen that the optimized radiator structural size not only meets its own thermal resistance design requirements, but also meets the requirements of the FPGA chip at high temperatures. cooling requirements.
S5基于所述优化后各功率器件温度数据，判断结构散热尺寸优化后功率器件温度是否满足热可靠性要求，满足则输出多路光纤网络接收机结构参数，不满足则重新对结构散热进行设计，并重复S1至S5，直至满足功率器件热可靠性要求。Based on the temperature data of each power device after optimization, S5 determines whether the temperature of the power device after optimizing the structural heat dissipation size meets the thermal reliability requirements. If it meets the requirements, it will output the structural parameters of the multi-channel optical fiber network receiver. If it does not, it will redesign the structural heat dissipation. And repeat S1 to S5 until the thermal reliability requirements of the power device are met.
以上所揭露的仅为本发明一种适用于多路光纤网络接收机结构散热优化设计方法较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。What is disclosed above is only a preferred embodiment of the present invention suitable for the structural heat dissipation optimization design method of a multi-channel optical fiber network receiver. Of course, it cannot be used to limit the scope of the present invention. Those of ordinary skill in the art can understand that the implementation of the above All or part of the processes of the embodiments, and equivalent changes made in accordance with the claims of the present invention, still fall within the scope of the invention.
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| CN202311736290.1ACN117592302A (en) | 2023-12-18 | 2023-12-18 | A structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers |
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| CN202311736290.1ACN117592302A (en) | 2023-12-18 | 2023-12-18 | A structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers |
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| CN202311736290.1APendingCN117592302A (en) | 2023-12-18 | 2023-12-18 | A structural heat dissipation optimization design method suitable for multi-channel optical fiber network receivers |
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| CN118607237A (en)* | 2024-06-13 | 2024-09-06 | 上海频准激光科技有限公司 | A heat dissipation component layout system based on data processing |
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| CN118607237A (en)* | 2024-06-13 | 2024-09-06 | 上海频准激光科技有限公司 | A heat dissipation component layout system based on data processing |
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