技术领域Technical field
本申请涉及元件转移设备技术领域，尤其涉及一种元件拾取机构及元件转移系统。The present application relates to the technical field of component transfer equipment, and in particular, to a component pickup mechanism and a component transfer system.
背景技术Background technique
随着科学技术水平的发展，电子设备的复杂程度也逐渐增大，并且设备内部的电器元件也逐渐向微型化发展。通过减少电器元件的尺寸大小从而能够在有限空间内集成更多电器元件，以此提高使用体验。With the development of science and technology, the complexity of electronic equipment has gradually increased, and the electrical components inside the equipment have gradually developed toward miniaturization. By reducing the size of electrical components, more electrical components can be integrated in a limited space, thereby improving the user experience.
而微型化的电器元件集成通常需要进行转移，但是现有的拾取结构容易出现故障，其可靠性不足。The integration of miniaturized electrical components usually requires transfer, but the existing pickup structure is prone to failure and its reliability is insufficient.
发明内容Contents of the invention
本申请实施例提供了一种元件拾取机构及元件转移系统，能够实现巨量转移。Embodiments of the present application provide a component picking-up mechanism and component transfer system, which can realize large-volume transfer.
第一方面，本申请实施例提供了一种元件拾取机构，元件拾取机构包括基底、吸附功能层以及调节机构，基底包括位于自身厚度方向上的第一面，以及连接于第一面边缘处的第二面，第二面相对于第一面倾斜设置。In a first aspect, embodiments of the present application provide a component pickup mechanism. The component pickup mechanism includes a base, an adsorption functional layer, and an adjustment mechanism. The base includes a first surface located in its thickness direction, and a first surface connected to the edge of the first surface. The second surface is inclined relative to the first surface.
吸附功能层设置于基底的第一面，调节机构包括设置于第一面的调节单元，以及连接于调节单元的连接线，调节单元通过连接线与控制机构电连接设置，调节单元被配置为在控制机构的控制下，能够调节吸附功能层对待转移元件的吸附能力。其中，第二面相对第一面向远离吸附功能层的方向倾斜，连接线经由第二面延伸至第一面。The adsorption functional layer is provided on the first surface of the substrate. The adjustment mechanism includes an adjustment unit provided on the first surface and a connection line connected to the adjustment unit. The adjustment unit is electrically connected to the control mechanism through the connection line. The adjustment unit is configured to Under the control of the control mechanism, the adsorption capacity of the adsorption functional layer for the element to be transferred can be adjusted. The second surface is inclined relative to the first surface in a direction away from the adsorption functional layer, and the connecting line extends to the first surface through the second surface.
在一些实施例中，基底包括支撑结构以及设置于支撑结构上的衬底，第一面位于衬底背离支撑结构的一侧。在平行于第一面方向上，第二面位于衬底的至少一侧。In some embodiments, the base includes a support structure and a substrate disposed on the support structure, and the first surface is located on a side of the substrate facing away from the support structure. The second surface is located on at least one side of the substrate in a direction parallel to the first surface.
在一些实施例中，元件拾取机构还包括设置于连接线背离第二面一侧的传导部，传导部的一端连接于连接线，另一端连接于控制机构，以实现连接线以及控制机构之间的信号传递。In some embodiments, the component pick-up mechanism further includes a conductive part disposed on a side of the connection line away from the second surface. One end of the conductive part is connected to the connection line, and the other end is connected to the control mechanism to realize the connection between the connection line and the control mechanism. signal transmission.
在一些实施例中，在平行于第一面方向上，支撑结构至少部分超出衬底设置，以使控制机构中的至少部分设置于支撑结构上。In some embodiments, the support structure is at least partially disposed beyond the substrate in a direction parallel to the first surface, such that at least a portion of the control mechanism is disposed on the support structure.
在一些实施例中，元件拾取机构还包括传导部以及设于支撑结构朝向衬底一侧的支撑部，在平行于第一面方向上，支撑部位于衬底与控制机构之间。传导部位于控制机构背离支撑结构的一侧并与控制机构电连接设置，传导部经由支撑部背离支撑结构的一侧延伸至第二面并与连接线电连接设置。In some embodiments, the component pickup mechanism further includes a conductive portion and a support portion provided on a side of the support structure facing the substrate. The support portion is located between the substrate and the control mechanism in a direction parallel to the first surface. The conductive part is located on a side of the control mechanism facing away from the support structure and is electrically connected to the control mechanism. The conductive part extends to the second surface through the side of the support part facing away from the support structure and is electrically connected to the connecting wire.
在一些实施例中，连接线包括位于第一面上的第一部分，以及连接第一部分和控制机构的第二部分。其中，第二部分覆盖控制机构的至少部分并延伸至第二面。In some embodiments, the connection line includes a first portion located on the first side and a second portion connecting the first portion to the control mechanism. Wherein, the second part covers at least part of the control mechanism and extends to the second side.
在一些实施例中，第二部分的平均宽度大于第一部分的平均宽度。In some embodiments, the average width of the second portion is greater than the average width of the first portion.
在一些实施例中，在平行于第一面方向上，支撑结构包括第三面，第二面与第三面位于同一平面，控制机构被配置设置于第三面上。In some embodiments, in a direction parallel to the first surface, the support structure includes a third surface, the second surface and the third surface are located on the same plane, and the control mechanism is configured and disposed on the third surface.
在一些实施例中，调节单元至少部分位于吸附功能层与第一面之间；和/或，调节单元在第一面的正投影至少部分位于吸附功能层在第一面的正投影外，以使至少部分调节单元相对于吸附功能层暴露。In some embodiments, the adjustment unit is at least partially located between the adsorption functional layer and the first surface; and/or the orthographic projection of the adjustment unit on the first surface is at least partially located outside the orthographic projection of the adsorption functional layer on the first surface, so that At least part of the adjustment unit is exposed relative to the adsorption functional layer.
在一些实施例中，吸附功能层包括间隔设置的多个吸附功能块，至少部分调节单元位于相邻吸附功能块之间；和/或，In some embodiments, the adsorption functional layer includes a plurality of adsorption functional blocks arranged at intervals, and at least part of the adjustment unit is located between adjacent adsorption functional blocks; and/or,
至少部分调节单元还可以设于吸附功能块与第一面之间。At least part of the adjustment unit may also be provided between the adsorption functional block and the first surface.
在一些实施例中，第二面的数量为多个，多个第二面分设在第一面的不同边缘，至少部分连接线经由不同第二面延伸至第一面。In some embodiments, there are multiple second surfaces, the plurality of second surfaces are located at different edges of the first surface, and at least part of the connecting lines extend to the first surface through different second surfaces.
在一些实施例中，第一面包括第一中心区域，多个第二面以及多个连接线相对于第一中心区域对称分布。In some embodiments, the first surface includes a first central area, and the plurality of second surfaces and the plurality of connection lines are symmetrically distributed relative to the first central area.
在一些实施例中，调节单元包括第一连接端与第二连接端，第一连接端与第二连接端分别与不同连接线电连接。In some embodiments, the adjustment unit includes a first connection end and a second connection end, and the first connection end and the second connection end are electrically connected to different connection lines respectively.
在一些实施例中，至少部分不同调节单元的第一连接端与同一连接线电连接设置，即至少部分连接线可以同时与多个调节单元进行连接。In some embodiments, at least some of the first connection ends of different adjustment units are electrically connected to the same connection line, that is, at least some of the connection lines can be connected to multiple adjustment units at the same time.
第二方面，本申请实施例提供了一种元件转移系统，元件转移系统包括供体基板、目标基板、元件拾取机构、转移机构以及控制机构，供体基板上设置有待转移元件。元件拾取机构为前述任一实施方式中的元件拾取机构。供体基板、目标基板以及元件拾取机构中至少一者设置于转移机构，转移机构被配置为能够调节元件拾取机构相对于供体基板以及目标基板之间的距离。控制机构被配置为能够调节吸附功能层的环境条件，以改变吸附功能层对于待转移元件的吸附能力。In a second aspect, embodiments of the present application provide a component transfer system. The component transfer system includes a donor substrate, a target substrate, a component pickup mechanism, a transfer mechanism and a control mechanism. The components to be transferred are arranged on the donor substrate. The component pickup mechanism is the component pickup mechanism in any of the aforementioned embodiments. At least one of the donor substrate, the target substrate and the component pickup mechanism is provided on the transfer mechanism, and the transfer mechanism is configured to be able to adjust the distance between the component pickup mechanism relative to the donor substrate and the target substrate. The control mechanism is configured to adjust the environmental conditions of the adsorption functional layer to change the adsorption capacity of the adsorption functional layer for the element to be transferred.
本申请实施例提供一种元件拾取机构及元件转移系统，通过将第二面相对于第一面向远离吸附功能层的方向倾斜设置，并将连接线从第二面延伸至第一面中，这样既可以满足控制机构与调节单元之间电连接的需要，同时还可以降低在元件拾取或释放过程中，连接线中位于第二面上的走线结构与对应转移基板发生物理干涉的风险，降低连接线发生破损的概率，提高连接线的使用可靠性，有助于提高元件拾取机构的使用寿命以及对于待转移元件的转移可靠性。Embodiments of the present application provide a component pickup mechanism and component transfer system. By slanting the second surface relative to the first surface in a direction away from the adsorption functional layer, and extending the connecting line from the second surface to the first surface, both It can meet the needs of electrical connection between the control mechanism and the adjustment unit, and at the same time, it can also reduce the risk of physical interference between the wiring structure on the second surface of the connecting line and the corresponding transfer substrate during the component pickup or release process, reducing the connection It reduces the probability of wire breakage, improves the reliability of the connection wire, and helps improve the service life of the component pickup mechanism and the transfer reliability of the components to be transferred.
附图说明Description of drawings
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单的介绍，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the technical solutions of the embodiments of the present application more clearly, the drawings required to be used in the embodiments of the present application will be briefly introduced below. For those of ordinary skill in the art, without exerting creative efforts, they can also Additional drawings can be obtained from these drawings.
图1是本申请实施例提供的一种元件拾取机构的剖面结构示意图；Figure 1 is a schematic cross-sectional structural diagram of a component pickup mechanism provided by an embodiment of the present application;
图2是本申请实施例提供的一种元件转移系统的结构示意图；Figure 2 is a schematic structural diagram of a component transfer system provided by an embodiment of the present application;
图3是本申请实施例提供的又一种元件拾取机构的剖面结构示意图；Figure 3 is a schematic cross-sectional structural diagram of yet another component pickup mechanism provided by an embodiment of the present application;
图4是本申请实施例提供的又一种元件拾取机构的剖面结构示意图；Figure 4 is a schematic cross-sectional structural diagram of yet another component pickup mechanism provided by an embodiment of the present application;
图5是本申请实施例提供的又一种元件拾取机构的剖面结构示意图；Figure 5 is a schematic cross-sectional structural diagram of yet another component pickup mechanism provided by an embodiment of the present application;
图6是本申请实施例提供的又一种元件拾取机构的剖面结构示意图；Figure 6 is a schematic cross-sectional structural diagram of yet another component pickup mechanism provided by an embodiment of the present application;
图7是本申请实施例提供的又一种元件拾取机构的结构示意图；Figure 7 is a schematic structural diagram of yet another component pickup mechanism provided by an embodiment of the present application;
图8是本申请实施例提供的又一种元件拾取机构的剖面结构示意图；Figure 8 is a schematic cross-sectional structural diagram of yet another component pickup mechanism provided by an embodiment of the present application;
图9是本申请实施例提供的又一种元件拾取机构的剖面结构示意图。FIG. 9 is a schematic cross-sectional structural diagram of yet another component pickup mechanism provided by an embodiment of the present application.
标记说明：Tag description:
100、元件拾取机构；200、供体基板；300、目标基板；400、转移机构；500、调平机构；600、控制机构；100. Component picking mechanism; 200. Donor substrate; 300. Target substrate; 400. Transfer mechanism; 500. Leveling mechanism; 600. Control mechanism;
10、基底；11、支撑结构；12、衬底；10. Base; 11. Support structure; 12. Substrate;
20、吸附功能层；21、吸附功能块；20. Adsorption functional layer; 21. Adsorption functional block;
30、调节机构；31、调节单元；32、连接线；321、第一部分；322、第二部分；30. Adjustment mechanism; 31. Adjustment unit; 32. Connecting wire; 321. First part; 322. Second part;
40、传导部；40. Transmission Department;
50、支撑部；50. Support part;
J、待转移元件；J. Components to be transferred;
A、第一中心区域；A. The first central area;
D1、第一连接端；D2、第二连接端；D1, first connection end; D2, second connection end;
M1、第一面；M2、第二面；M3、第三面；M1, first side; M2, second side; M3, third side;
X、第一方向；Y、厚度方向。X, first direction; Y, thickness direction.
具体实施方式Detailed ways
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅意在解释本申请，而不是限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。Features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only intended to explain the application, but not to limit the application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in a process, method, article, or device that includes the stated element.
随着科技的进步，电器设备的复杂程度也逐渐增大，以MicroLED显示技术为例，MicroLED显示装置是一种基于微型LED(微型发光二极管)的先进显示技术。它是指将微型LED作为发光元件定址巨量转移到电路基板上，形成具有超小间距的自发光像素点阵。通过对每个发光元件亮度的精确控制，可实现具有高亮度、高对比度和高分辨率的图像显示。With the advancement of technology, the complexity of electrical equipment has gradually increased. Take MicroLED display technology as an example. MicroLED display device is an advanced display technology based on micro LED (micro light-emitting diode). It refers to transferring a large amount of micro-LEDs as light-emitting elements to a circuit substrate to form a self-luminous pixel matrix with ultra-small spacing. By precisely controlling the brightness of each light-emitting element, image display with high brightness, high contrast and high resolution can be achieved.
MicroLED显示装置中每一个像素可定址、单独驱动点亮，可看成是户外LED显示屏的微缩版，即将像素点距离从毫米级降低至微米级。相比现有显示技术，MicroLED显示装置具有高亮度、低功耗、超高解析度与色彩饱和度等方面的优点；同时还具备可透明、柔性可拉伸以及能与微传感器深度集成从而突破传统显示应用场景的众多优点，被认为是未来革命性的显示技术。Each pixel in the MicroLED display device can be addressed and driven to light independently. It can be regarded as a miniature version of the outdoor LED display, that is, the distance between pixels is reduced from millimeter level to micron level. Compared with existing display technologies, MicroLED display devices have the advantages of high brightness, low power consumption, ultra-high resolution and color saturation; they are also transparent, flexible and stretchable, and can be deeply integrated with micro-sensors to achieve breakthroughs. The many advantages of traditional display application scenarios are considered to be a revolutionary display technology in the future.
在MicroLED显示装置制备过程中，需要对微型LED进行转移处理，在转移处理中，通常需要借助拾取机构实现对微型LED的拾取以及释放，在这个过程中，拾取机构容易与对应的转移基板发生物理干涉，从而导致自身部分结构出现故障，影响转移可靠性。In the preparation process of MicroLED display devices, micro LEDs need to be transferred. During the transfer process, it is usually necessary to use a pickup mechanism to pick up and release the micro LEDs. In this process, the pickup mechanism is prone to physical interactions with the corresponding transfer substrate. Interference may cause failure of some of its own structures, affecting transfer reliability.
鉴于此，第一方面，请参阅图1，本申请实施例提供了一种元件拾取机构100，元件拾取机构100包括基底10、吸附功能层20以及调节机构30，基底10包括位于自身厚度方向Y上的第一面M1，以及连接于第一面M1边缘处的第二面M2，第二面M2相对于第一面M1倾斜设置。In view of this, firstly, please refer to FIG. 1 . An embodiment of the present application provides a component pickup mechanism 100 . The component pickup mechanism 100 includes a substrate 10 , an adsorption functional layer 20 and an adjustment mechanism 30 . The substrate 10 includes a component located in the thickness direction Y of the substrate 10 . The first surface M1 on the first surface M1 and the second surface M2 connected to the edge of the first surface M1. The second surface M2 is inclined relative to the first surface M1.
吸附功能层20设置于基底10的第一面M1，调节机构30包括设置于第一面M1的调节单元31，以及连接于调节单元31的连接线32，调节单元31通过连接线32与控制机构600电连接设置，调节单元31被配置为在控制机构600的控制下，能够调节吸附功能层20对待转移元件J的吸附能力。其中，第二面M2相对第一面M1向远离吸附功能层20的方向倾斜，连接线32经由第二面M2延伸至第一面M1。The adsorption functional layer 20 is provided on the first surface M1 of the base 10. The adjustment mechanism 30 includes an adjustment unit 31 provided on the first surface M1, and a connection line 32 connected to the adjustment unit 31. The adjustment unit 31 communicates with the control mechanism through the connection line 32. 600 is electrically connected and configured, and the adjustment unit 31 is configured to be able to adjust the adsorption capacity of the adsorption functional layer 20 of the element J to be transferred under the control of the control mechanism 600 . The second surface M2 is inclined in a direction away from the adsorption functional layer 20 relative to the first surface M1, and the connecting line 32 extends to the first surface M1 through the second surface M2.
结合图2可以看出，本申请实施例提供的元件拾取机构100适用于元件转移系统。元件拾取机构100用于拾取以及释放待转移元件J，以满足待转移元件J的转移需要。其中待转移元件J包括但不限于发光元件以及驱动控制元件，为了方便表述，本申请实施例后续以待转移元件J为发光元件为例进行说明，其中发光元件包括但不限于MicroLED显示装置中的微型LED。It can be seen from FIG. 2 that the component pickup mechanism 100 provided by the embodiment of the present application is suitable for component transfer systems. The component picking mechanism 100 is used to pick up and release the components J to be transferred to meet the transfer needs of the components J to be transferred. The element J to be transferred includes, but is not limited to, a light-emitting element and a driving control element. For convenience of explanation, the embodiment of the present application will be described later by taking the element J to be transferred as a light-emitting element. The light-emitting element includes, but is not limited to, a light-emitting element in a MicroLED display device. Micro LED.
元件拾取机构100包括有基底10，基底10主要起到支撑承载的作用，其中，基底10可以包括层叠设置的多种膜层结构，本申请实施例对此不作限制。基底10包括第一面M1以及第二面M2，第一面M1位于基底10厚度方向Y上的一侧，第二面M2连接于第一面M1的边缘位置，且相对第一面M1倾斜设置。对于第一面M1与第二面M2的具体形状尺寸，本申请实施例不作限制。可选地，第一面M1可以呈方形结构，即第一面M1具有四个直线边缘。在此基础上，第二面M2的数量可以一个也可以为多个，当第二面M2的数量为多个时，多个第二面M2可以分别连接于第一面M1的不同直线边缘，并且不同第二面M2相对于第一面M1的倾斜角度可以相同，或者也可以不同。The component pick-up mechanism 100 includes a base 10, which mainly plays a supporting role. The base 10 may include a plurality of film layer structures stacked on top of each other, which is not limited in the embodiments of the present application. The base 10 includes a first surface M1 and a second surface M2. The first surface M1 is located on one side in the thickness direction Y of the base 10. The second surface M2 is connected to the edge of the first surface M1 and is inclined relative to the first surface M1. . The embodiment of the present application does not limit the specific shapes and dimensions of the first surface M1 and the second surface M2. Alternatively, the first surface M1 may have a square structure, that is, the first surface M1 has four straight edges. On this basis, the number of the second surface M2 may be one or multiple. When the number of the second surface M2 is multiple, the multiple second surfaces M2 may be connected to different linear edges of the first surface M1, And the inclination angles of different second surfaces M2 relative to the first surface M1 may be the same, or may be different.
吸附功能层20与调节机构30均位于基底10第一面M1一侧，吸附功能层20至少具有两种状态，在其中一种状态下，吸附功能层20可以对待转移元件J具有较大的吸附强度，以使待转移元件J被吸附功能层20拾取。在另一种状态下，吸附功能层20对待转移元件J不具备吸附能力，或者吸附功能层20对待转移元件J仅具有少量的吸附能力，以使待转移元件J在重力等因素的影响下，脱离吸附功能层20。The adsorption functional layer 20 and the adjustment mechanism 30 are both located on the first surface M1 of the substrate 10. The adsorption functional layer 20 has at least two states. In one of the states, the adsorption functional layer 20 can have a greater adsorption capacity for the element J to be transferred. Strength, so that the element J to be transferred is picked up by the adsorption functional layer 20. In another state, the adsorption functional layer 20 has no adsorption capacity for the element J to be transferred, or the adsorption functional layer 20 has only a small amount of adsorption capacity for the element J to be transferred, so that the element J to be transferred is affected by gravity and other factors. The adsorption functional layer 20 is detached.
调节机构30用于调节吸附功能层20对待转移元件J的吸附能力，具体地说，调节机构30包括有调节单元31，调节单元31可以在控制机构600的管控下，改变吸附功能层20所处的环境条件，以使吸附功能层20所对应的吸附能力发生改变。这里提到的环境条件包括吸附功能层20所在的电场环境、磁场环境、光学环境以及温度环境等。The adjustment mechanism 30 is used to adjust the adsorption capacity of the adsorption functional layer 20 to the element J to be transferred. Specifically, the adjustment mechanism 30 includes an adjustment unit 31. The adjustment unit 31 can change the position of the adsorption functional layer 20 under the control of the control mechanism 600. Environmental conditions, so that the corresponding adsorption capacity of the adsorption functional layer 20 changes. The environmental conditions mentioned here include the electric field environment, magnetic field environment, optical environment, temperature environment, etc. where the adsorption functional layer 20 is located.
具体地说，当吸附功能层20包括粘附可调的温敏材料时，基底10上可以设置有可编程加热器阵列。其中，加热器为具有微米级尺寸和电阻率的微电阻器。当控制机构600向加热器阵列输入电平信号时，至少部分加热器被激活，并对吸附功能层20上的温敏材料进行加热，使其表面粘附能力发生变化，从而满足对待转移元件J的拾取或释放需要。Specifically, when the adsorption functional layer 20 includes a temperature-sensitive material with adjustable adhesion, the substrate 10 may be provided with a programmable heater array. Among them, the heater is a microresistor with micron-scale size and resistivity. When the control mechanism 600 inputs a level signal to the heater array, at least some of the heaters are activated and heat the temperature-sensitive material on the adsorption functional layer 20 to change its surface adhesion ability to meet the requirements of the element to be transferred J of pickup or release required.
或者，当吸附功能层20包括磁力大小可调的磁性材料时，基底10上可设置有可编程磁驱动阵列。其中，磁驱动阵列具有微米级尺寸的线圈。当控制机构600向磁驱动阵列输入电平信号时，至少部分磁驱动单元激活，并对吸附功能层20上的磁性材料进行磁化，使其表面吸附能力发生变化，从而满足对待转移元件J的拾取或释放需要。Alternatively, when the adsorption functional layer 20 includes a magnetic material with adjustable magnetic force, a programmable magnetic drive array can be provided on the substrate 10 . Among them, the magnetic drive array has micron-sized coils. When the control mechanism 600 inputs a level signal to the magnetic drive array, at least part of the magnetic drive unit is activated and magnetizes the magnetic material on the adsorption functional layer 20 to change its surface adsorption capacity, thereby satisfying the pickup of the element J to be transferred. or release needs.
需要说明的是，对于调节单元31与吸附功能层20之间的相对位置关系，本申请实施例不作限制。可选地，调节单元31可以位于吸附功能层20与基底10之间，或者吸附功能层20内设有对应的凹槽结构，调节单元31至少部分嵌入至凹槽结构内；或者吸附功能层20内设有对应的通孔结构，调节单元31至少部分位于通孔结构内，并通过通孔结构相对于吸附功能层20露出。It should be noted that the embodiment of the present application does not limit the relative positional relationship between the adjustment unit 31 and the adsorption functional layer 20 . Alternatively, the adjustment unit 31 can be located between the adsorption functional layer 20 and the substrate 10 , or the adsorption functional layer 20 is provided with a corresponding groove structure, and the adjustment unit 31 is at least partially embedded in the groove structure; or the adsorption functional layer 20 A corresponding through-hole structure is provided therein, and the adjustment unit 31 is at least partially located within the through-hole structure and is exposed relative to the adsorption functional layer 20 through the through-hole structure.
连接线32用于电连接控制机构600以及调节单元31，控制机构600可以借助连接线32实现对调节单元31的管控。进一步地，控制机构600并不位于第一面M1上，而调节单元31设置在第一面M1上，为了满足连接线32的电连接需要，连接线32需要从第二面M2延伸至第一面M1上，以实现与调节单元31的连接。进一步地，连接线32中位于第二面M2上的走线结构还可以延伸至外部，以实现与控制机构600之间的电连接。或者，控制机构600还可以借助外部其他走线实现与连接线32中位于第二面M2上的走线结构之间的电连接。在此基础上，若第二面M2与第一面M1共面设置，或者第二面M2相对第一面M1向靠近吸附功能层20的方向倾斜。则在元件拾取机构100对待转移元件J进行拾取或释放过程中，元件拾取机构100与对应转移基板之间的距离较近，连接线32中位于第一面M1上的走线结构由于吸附功能层20的存在，可以降低其与对应转移基板之间发生物理干涉的风险。但是由于第二面M2上并未设置有吸附功能层20，因此连接线32中位于第二面M2上的走线结构会被暴露，从而容易引发其与对应转移基板发生物理干涉的风险。The connecting wire 32 is used to electrically connect the control mechanism 600 and the adjusting unit 31 . The control mechanism 600 can control the adjusting unit 31 with the help of the connecting wire 32 . Further, the control mechanism 600 is not located on the first surface M1, but the adjustment unit 31 is provided on the first surface M1. In order to meet the electrical connection requirements of the connecting wire 32, the connecting wire 32 needs to extend from the second surface M2 to the first surface M1. on the surface M1 to achieve connection with the adjustment unit 31. Furthermore, the wiring structure located on the second surface M2 of the connecting lines 32 can also be extended to the outside to achieve electrical connection with the control mechanism 600 . Alternatively, the control mechanism 600 can also achieve electrical connection with the wiring structure located on the second surface M2 of the connecting wires 32 by means of other external wirings. On this basis, if the second surface M2 and the first surface M1 are coplanar, or the second surface M2 is inclined toward the adsorption functional layer 20 relative to the first surface M1. When the component pick-up mechanism 100 picks up or releases the component J to be transferred, the distance between the component pick-up mechanism 100 and the corresponding transfer substrate is relatively close. The presence of 20 can reduce the risk of physical interference between it and the corresponding transfer substrate. However, since the adsorption functional layer 20 is not provided on the second surface M2, the wiring structure of the connecting lines 32 on the second surface M2 will be exposed, which may easily cause the risk of physical interference with the corresponding transfer substrate.
鉴于此，本申请实施例将第二面M2相对于第一面M1向远离吸附功能层20的方向倾斜设置，并将连接线32从第二面M2延伸至第一面M1中，这样既可以满足控制机构600与调节单元31之间电连接的需要，同时还可以降低在元件拾取或释放过程中，连接线32中位于第二面M2上的走线结构与对应转移基板发生物理干涉的风险，降低连接线32发生破损的概率，提高连接线32的使用可靠性，有助于提高元件拾取机构100的使用寿命以及对于待转移元件J的转移可靠性。In view of this, in the embodiment of the present application, the second surface M2 is inclined in a direction away from the adsorption functional layer 20 relative to the first surface M1, and the connecting line 32 is extended from the second surface M2 to the first surface M1, so that both It satisfies the need for electrical connection between the control mechanism 600 and the adjustment unit 31 and at the same time reduces the risk of physical interference between the wiring structure located on the second surface M2 of the connection line 32 and the corresponding transfer substrate during the component pickup or release process. , reducing the probability of damage to the connecting wire 32 and improving the use reliability of the connecting wire 32, which helps to improve the service life of the component pickup mechanism 100 and the transfer reliability of the component J to be transferred.
需要说明的是，对于连接线32在第一面M1以及第二面M2上的走线方式，本申请实施例不作限制。其中，若元件拾取机构100内包括有多个调节单元31时，连接线32的数量也可以是多个，多个连接线32分别与多个调节单元31对应连接设置。It should be noted that the embodiment of the present application does not limit the routing manner of the connecting wires 32 on the first surface M1 and the second surface M2. Wherein, if the component pickup mechanism 100 includes multiple adjustment units 31 , the number of connecting wires 32 may also be multiple, and the multiple connecting wires 32 are connected to the multiple adjusting units 31 respectively.
此外，对于元件拾取机构100的制备以及形成过程，本申请实施例不作限制。可选地，首先利用微加工技术在衬底12上制备形成可编程驱动器阵列，即制备形成调节单元31。然后利用划片设备对衬底12一侧进行切换，形成一定角度的倾斜面，即形成第二面M2。之后利用薄膜沉积技术，在衬底12的第一面M1部分区域和第二面M2上形成连续的导电薄膜。之后利用激光切割技术将连续的导电薄膜划分为不同的导电焊接区，即形成连接线32。之后在衬底12上方形成吸附功能层20，最后利用外接引线或气溶胶打印技术实现连接线32与控制机构600之间的电连接。In addition, the embodiment of the present application does not limit the preparation and forming process of the component pickup mechanism 100 . Optionally, micromachining technology is first used to prepare and form a programmable driver array on the substrate 12 , that is, the adjustment unit 31 is prepared and formed. Then, a dicing device is used to switch one side of the substrate 12 to form an inclined surface at a certain angle, that is, the second surface M2 is formed. Then, thin film deposition technology is used to form a continuous conductive film on the partial area of the first surface M1 and the second surface M2 of the substrate 12 . Then, laser cutting technology is used to divide the continuous conductive film into different conductive welding areas, that is, connecting lines 32 are formed. Then, the adsorption functional layer 20 is formed on the substrate 12 , and finally the electrical connection between the connecting wire 32 and the control mechanism 600 is realized using external leads or aerosol printing technology.
在一些实施例中，如图1和图2所示，基底10包括支撑结构11以及设置于支撑结构11上的衬底12，第一面M1位于衬底12背离支撑结构11的一侧。在平行于第一面M1方向上，第二面M2位于衬底12的至少一侧。In some embodiments, as shown in FIGS. 1 and 2 , the substrate 10 includes a support structure 11 and a substrate 12 disposed on the support structure 11 , and the first surface M1 is located on a side of the substrate 12 facing away from the support structure 11 . In a direction parallel to the first surface M1 , the second surface M2 is located on at least one side of the substrate 12 .
支撑结构11与衬底12层叠设置，两者均可以起到支撑承载的作用，并且支撑结构11还可以起到固定衬底12的作用。可选地，支撑结构11可以为刚性结构，衬底12可以为柔性结构。对于支撑结构11与衬底12之间形状以及尺寸关系，本申请实施例不作限制。可选地，在平行于第一面M1的至少一个方向上，支撑结构11可以与衬底12平齐设置，或者支撑结构11可以超出衬底12设置。The support structure 11 and the substrate 12 are stacked and both can play a supporting role, and the support structure 11 can also play a role in fixing the substrate 12 . Alternatively, the support structure 11 may be a rigid structure, and the substrate 12 may be a flexible structure. The embodiment of the present application does not limit the shape and size relationship between the support structure 11 and the substrate 12 . Alternatively, the support structure 11 may be disposed flush with the substrate 12 in at least one direction parallel to the first surface M1 , or the support structure 11 may be disposed beyond the substrate 12 .
第一面M1为衬底12背离支撑结构11的表面，吸附功能层20设置于第一面M1上，即吸附功能层20位于衬底12背离支撑结构11的一侧。在平行于第一面M1方向上，第二面M2位于衬底12的至少一侧。其中，第二面M2的数量可以为一个，也可以为多个。当第二面M2的数量仅有一个时，第二面M2仅沿平行于第一面M1的其中一个方向位于第一面M1的一侧。当第二面M2的数量为多个时，多个第二面M2可以沿平行于第一面M1的不同方向分设位于第一面M1的不同侧。The first surface M1 is the surface of the substrate 12 facing away from the support structure 11 , and the adsorption functional layer 20 is disposed on the first surface M1 , that is, the adsorption functional layer 20 is located on the side of the substrate 12 facing away from the support structure 11 . In a direction parallel to the first surface M1 , the second surface M2 is located on at least one side of the substrate 12 . The number of the second surface M2 may be one or multiple. When there is only one second surface M2, the second surface M2 is only located on one side of the first surface M1 along one of the directions parallel to the first surface M1. When the number of the second surfaces M2 is multiple, the plurality of second surfaces M2 may be located on different sides of the first surface M1 along different directions parallel to the first surface M1.
进一步地，当第二面M2数量为多个时，多个连接线32可以分布设置在不同第二面M2上，即至少部分不同连接线32经由不同第二面M2延伸至第一面M1上，以此降低单一第二面M2上走线密度过大的风险，降低连接线32在第二面M2上的走线布局难度，具有较强实用性。Furthermore, when the number of second surfaces M2 is multiple, multiple connection lines 32 can be distributed and arranged on different second surfaces M2, that is, at least some of the different connection lines 32 extend to the first surface M1 through different second surfaces M2. , thereby reducing the risk of excessive wiring density on a single second surface M2 and reducing the difficulty of wiring layout of the connecting wires 32 on the second surface M2, which has strong practicability.
在一些实施例中，请参阅图3，元件拾取机构100还包括设置于连接线32背离第二面M2一侧的传导部40，传导部40的一端连接于连接线32，另一端连接于控制机构600，以实现连接线32以及控制机构600之间的信号传递。In some embodiments, please refer to FIG. 3 . The component pickup mechanism 100 further includes a conductive portion 40 disposed on the side of the connection line 32 away from the second surface M2 . One end of the conduction portion 40 is connected to the connection line 32 and the other end is connected to the control line 32 . Mechanism 600 to realize signal transmission between the connection line 32 and the control mechanism 600 .
考虑到连接线32至少部分位于第一面M1以及第二面M2上，而控制机构600并不位于第一面M1或第二面M2上，为了提高元件拾取机构100的灵活性，本申请实施例将连接线32与控制机构600分离设置，即连接线32不直接与控制机构600接触连接。这样可以在不考虑控制机构600位置的情况下，自由调节元件拾取机构100的具体位置，以提高元件拾取机构100的灵活度。并且这样还可以降低由于元件拾取机构100与控制机构600相对移动，导致连接线32受力出现损坏的风险，提高元件拾取机构100的可靠性以及使用寿命Considering that the connection line 32 is at least partially located on the first surface M1 and the second surface M2, but the control mechanism 600 is not located on the first surface M1 or the second surface M2, in order to improve the flexibility of the component pickup mechanism 100, this application implements For example, the connecting wire 32 is separated from the control mechanism 600 , that is, the connecting wire 32 is not directly connected to the control mechanism 600 . In this way, the specific position of the component pickup mechanism 100 can be freely adjusted without considering the position of the control mechanism 600 to improve the flexibility of the component pickup mechanism 100 . In addition, this can also reduce the risk of damage to the connecting wire 32 due to relative movement between the component pick-up mechanism 100 and the control mechanism 600, and improve the reliability and service life of the component pick-up mechanism 100.
在此基础上，为了实现连接线32与控制机构600之间的电连接，本申请实施例还增设了传导部40，传导部40位于连接线32背离第二面M2的一侧。示例性地，传导部具有相对的两端，其中一端与连接线32中位于第二面M2上的走线结构接触连接，另一端与元件拾取机构100外部的控制机构600接触连接。On this basis, in order to realize the electrical connection between the connecting wire 32 and the control mechanism 600, the embodiment of the present application also adds a conductive part 40. The conductive part 40 is located on the side of the connecting wire 32 away from the second surface M2. For example, the conductive part has two opposite ends, one end of which is in contact connection with the wiring structure located on the second surface M2 of the connection line 32 , and the other end in contact connection with the control mechanism 600 outside the component pickup mechanism 100 .
传导部40的设置可以满足连接线32与控制机构600之间电连接的需要，并且即使传导部40因外力等因素发生损坏，由于传导部40并未与衬底12接触，因此相较于更换连接线32而言，更换传导部40的难度以及成本更低，从而有助于降低元件拾取机构100的维护难度以及成本。The arrangement of the conductive part 40 can meet the need for electrical connection between the connecting wire 32 and the control mechanism 600 , and even if the conductive part 40 is damaged due to external force or other factors, since the conductive part 40 is not in contact with the substrate 12 , it is easier to replace than to replace the conductive part 40 . As for the connecting wire 32 , it is less difficult and costly to replace the conductive part 40 , thereby helping to reduce the difficulty and cost of maintaining the component pickup mechanism 100 .
在一些实施例中，请参阅图4，在平行于第一面M1方向上，支撑结构11至少部分超出衬底12设置，以使控制机构600中的至少部分设置于支撑结构11上。示例性地，第一方向X为平行于第一面M1的一个方向，在第一方向X上，支撑结构11超出衬底12设置。In some embodiments, please refer to FIG. 4 , in a direction parallel to the first surface M1 , the support structure 11 is at least partially disposed beyond the substrate 12 , so that at least a portion of the control mechanism 600 is disposed on the support structure 11 . Exemplarily, the first direction X is a direction parallel to the first surface M1 , and in the first direction X, the support structure 11 is disposed beyond the substrate 12 .
在本申请实施例中，支撑结构11除了可以对衬底12起到支撑承载作用外，还可以对控制机构600起到支撑承载的作用，并且支撑结构11的存在还可以对衬底12以及控制机构600起到相对位置固定的作用，以降低两者在元件转移过程中，产生相对位移的风险，提高元件转移过程的可靠性。In the embodiment of the present application, in addition to supporting the substrate 12 , the support structure 11 can also play a supporting role for the control mechanism 600 , and the existence of the support structure 11 can also support the substrate 12 and the control mechanism 600 . The mechanism 600 serves to fix relative positions, thereby reducing the risk of relative displacement between the two during the component transfer process and improving the reliability of the component transfer process.
需要说明的是，控制机构600与衬底12可以分别位于支撑结构11在厚度方向Y上的同一侧，或者也可以位于支撑结构11在厚度方向Y上的不同侧，本申请实施例对此不作限制。It should be noted that the control mechanism 600 and the substrate 12 may be located on the same side of the support structure 11 in the thickness direction Y, or may be located on different sides of the support structure 11 in the thickness direction Y. This is not the case in the embodiment of the present application. limit.
在一些实施例中，元件拾取机构100还包括传导部40以及设于支撑结构11朝向衬底12一侧的支撑部50，在平行于第一面M1方向上，支撑部50位于衬底12与控制机构600之间。传导部40位于控制机构600背离支撑结构11的一侧并与控制机构600电连接设置，传导部40经由支撑部50背离支撑结构11的一侧延伸至第二面M2并与连接线32电连接设置。In some embodiments, the component pickup mechanism 100 further includes a conductive portion 40 and a support portion 50 provided on the side of the support structure 11 facing the substrate 12 . In a direction parallel to the first surface M1 , the support portion 50 is located between the substrate 12 and the substrate 12 . Control mechanism between 600. The conductive part 40 is located on the side of the control mechanism 600 away from the support structure 11 and is electrically connected to the control mechanism 600 . The conductive part 40 extends to the second surface M2 through the support part 50 on the side away from the support structure 11 and is electrically connected to the connecting wire 32 set up.
结合前述内容以及附图可知，第二面M2与第一方向X相交，而控制机构600沿第一方向X位于衬底12的一侧。在这种情况下，若借助传导部40实现连接线32与控制机构600之间的电连接，则传导部40需要从第二面M2延伸至支撑结构11朝向控制机构600的表面。但是由于衬底12与控制结构在第一方向X上的间隙，传导部40在第二面M2与支撑结构11表面交界位置处可能会出现损坏的风险。It can be seen from the foregoing content and the accompanying drawings that the second surface M2 intersects the first direction X, and the control mechanism 600 is located on one side of the substrate 12 along the first direction X. In this case, if the electrical connection between the connecting wire 32 and the control mechanism 600 is achieved by means of the conductive part 40 , the conductive part 40 needs to extend from the second surface M2 to the surface of the support structure 11 facing the control mechanism 600 . However, due to the gap between the substrate 12 and the control structure in the first direction X, the conductive part 40 may be damaged at the interface between the second surface M2 and the surface of the support structure 11 .
鉴于此，本申请实施例在支撑结构11上增设了支撑部50，支撑部50位于衬底12与控制机构600之间，支撑部50可以填充由衬底12以及控制机构600所形成的至少部分间隙。进而位于第二面M2上的传导部40可以借助支撑部50背离支撑结构11的表面延伸至控制机构600中，从而实现传导部40与控制机构600之间的接触连接，满足连接线32与控制机构600之间电连接的需要。In view of this, the embodiment of the present application adds a support part 50 on the support structure 11. The support part 50 is located between the substrate 12 and the control mechanism 600. The support part 50 can fill at least part of the space formed by the substrate 12 and the control mechanism 600. gap. Furthermore, the conductive part 40 located on the second surface M2 can extend into the control mechanism 600 with the support part 50 away from the surface of the support structure 11, thereby realizing the contact connection between the conductive part 40 and the control mechanism 600, and satisfying the requirements between the connection line 32 and the control mechanism 600. Electrical connections between mechanisms 600 are required.
需要说明的是，对于支撑部50的材料组成以及形成方式，本申请实施例不作限制。可选地，支撑部50可以利用聚合物等绝缘材料填充在控制机构600以及衬底12之间。然后利用气溶胶打印技术，在连接线32背离第二面M2一侧打印导电油墨，并使其经由支撑部50延伸至控制机构600上，以此实现传导部40的制备。It should be noted that the embodiment of the present application does not limit the material composition and formation method of the support portion 50 . Optionally, the support part 50 may be filled between the control mechanism 600 and the substrate 12 with an insulating material such as polymer. Then, aerosol printing technology is used to print conductive ink on the side of the connecting line 32 facing away from the second surface M2, and extend it to the control mechanism 600 through the support part 50, thereby completing the preparation of the conductive part 40.
在一些实施例中，请参阅图5，连接线32包括位于第一面M1上的第一部分321，以及连接第一部分321和控制机构600的第二部分322。其中，第二部分322覆盖控制机构600的至少部分并延伸至第二面M2。In some embodiments, please refer to FIG. 5 , the connecting line 32 includes a first part 321 located on the first surface M1 , and a second part 322 connecting the first part 321 and the control mechanism 600 . The second part 322 covers at least part of the control mechanism 600 and extends to the second surface M2.
连接线32包括第一部分321和第二部分322，第一部分321位于第一面M1上，第二部分322部分位于第二面M2上，第一部分321与第二部分322可以在不同工序中分别制备形成。可选地，第二部分322可以部分位于第一面M1上，以实现与第一部分321的连接。其中，第一部分321与第二部分322可以采用相同材料制成，或者也可以采用不同材料制成，本申请实施例对此不作限制。The connecting line 32 includes a first part 321 and a second part 322. The first part 321 is located on the first surface M1, and the second part 322 is partially located on the second surface M2. The first part 321 and the second part 322 can be prepared in different processes. form. Alternatively, the second part 322 may be partially located on the first surface M1 to achieve connection with the first part 321 . The first part 321 and the second part 322 may be made of the same material, or may be made of different materials, which is not limited in the embodiment of the present application.
可选地，第一部分321与第二部分322中的材料包括但不限于金属(金、银、铜、铝等)、半导体(如ITO等)、导电聚合物(如PEDOT等)、导电二维材料、复合导电材料等。对于第一部分321与第二部分322的厚度，本申请实施例也不作限制。可选地，第一部分321以及第二部分322中至少一者的厚度小于10μm。Optionally, the materials in the first part 321 and the second part 322 include but are not limited to metals (gold, silver, copper, aluminum, etc.), semiconductors (such as ITO, etc.), conductive polymers (such as PEDOT, etc.), conductive two-dimensional materials, composite conductive materials, etc. The embodiment of the present application also does not limit the thickness of the first part 321 and the second part 322. Optionally, at least one of the first part 321 and the second part 322 has a thickness less than 10 μm.
在本申请实施例中，连接线32中的第一部分321与第二部分322分别在不同工序中制备形成，以此降低连接线32在第一面M1与第二面M2上的制备难度。同时第二部分322需要与控制机构600连接设置，以将对应电信号传递至第一部分321上。In the embodiment of the present application, the first part 321 and the second part 322 of the connecting line 32 are prepared and formed in different processes, thereby reducing the difficulty of preparing the connecting line 32 on the first surface M1 and the second surface M2. At the same time, the second part 322 needs to be connected to the control mechanism 600 to transmit corresponding electrical signals to the first part 321 .
进一步地，为了降低第二部分322的延伸难度，提高第二部分322的可靠性。在一些可选实施例中，支撑结构11上设置有支撑部50，第二部分322可以借助支撑部50从第二面M2延伸至控制机构600上，以实现与控制机构600之间的连接。当然在另一些实施例中，也可以不设置有支撑部50，即第二部分322直接从第二面M2延伸至控制机构600上。Further, in order to reduce the difficulty of extending the second part 322, the reliability of the second part 322 is improved. In some optional embodiments, a support portion 50 is provided on the support structure 11 , and the second portion 322 can extend from the second surface M2 to the control mechanism 600 by means of the support portion 50 to achieve connection with the control mechanism 600 . Of course, in other embodiments, the supporting part 50 may not be provided, that is, the second part 322 directly extends from the second surface M2 to the control mechanism 600 .
在一些实施例中，请参阅图5和图7，第二部分322的平均宽度大于第一部分321的平均宽度。其中，第二部分322在不同位置处的厚度可以相同，也可以不同。同时第一部分321在不同位置处的厚度可以相同，也可以不同。In some embodiments, referring to Figures 5 and 7, the average width of the second portion 322 is greater than the average width of the first portion 321. The thickness of the second part 322 at different positions may be the same or different. At the same time, the thickness of the first part 321 at different positions can be the same or different.
结合前述内容可知，位于第一面M1上的第一部分321可以得到吸附功能层20的遮挡保护，而位于第二面M2上的第二部分322无法得到吸附功能层20的保护。在此基础上，为了降低第二部分322因外力等因素出现损坏的风险，本申请实施例将第二部分322的平均宽度设置大于第一部分321的平均宽度，以此降低元件拾取机构100在释放或拾取待转移元件J过程中，导致第二部分322出现损坏的风险，提高第二部分322的结构可靠性。Based on the foregoing, it can be seen that the first part 321 located on the first surface M1 can be shielded and protected by the adsorption functional layer 20 , while the second part 322 located on the second surface M2 cannot be protected by the adsorption functional layer 20 . On this basis, in order to reduce the risk of damage to the second part 322 due to external forces and other factors, the embodiment of the present application sets the average width of the second part 322 to be greater than the average width of the first part 321, thereby reducing the risk of the component pickup mechanism 100 being released. Or during the process of picking up the component J to be transferred, there is a risk of damage to the second part 322, thereby improving the structural reliability of the second part 322.
在一些实施例中，请参阅图6，在平行于第一面M1方向上，支撑结构11包括第三面M3，第二面M2与第三面M3位于同一平面，控制机构600被配置为设置于第三面M3上。In some embodiments, please refer to FIG. 6 , in a direction parallel to the first surface M1 , the support structure 11 includes a third surface M3 , the second surface M2 and the third surface M3 are located on the same plane, and the control mechanism 600 is configured to set On the third side M3.
在本申请实施例中，支撑结构11上的第三面M3与衬底12上的第二面位于同一平面，并且控制机构600可以位于第三面M3上。在此基础上，位于第二面M2上的第二部分322可以很容易延伸至第三面M3上，并实现与控制机构600之间的连接，这种设计可以在不额外增加支撑部50的情况下，很容易地实现连接线32与控制机构600之间的电连接。In the embodiment of the present application, the third surface M3 on the support structure 11 and the second surface on the substrate 12 are located on the same plane, and the control mechanism 600 may be located on the third surface M3. On this basis, the second part 322 located on the second surface M2 can be easily extended to the third surface M3 and connected to the control mechanism 600 . This design can be achieved without adding an additional supporting part 50 . In this case, the electrical connection between the connecting wire 32 and the control mechanism 600 is easily achieved.
在一些实施例中，如图5所示，调节单元31至少部分位于吸附功能层20与第一面M1之间。In some embodiments, as shown in FIG. 5 , the adjustment unit 31 is at least partially located between the adsorption functional layer 20 and the first surface M1 .
在本申请实施例中，调节单元31夹设在吸附功能层20与衬底12之间，以调节单元31可以改变吸附功能层20所在环境温度为例。调节单元31在控制机构600电信号的控制下可以产生一定的热量，产生的热量可以传递至吸附功能层20朝向第一面M1的表面，然后从该表面向吸附功能层20背离第一面M1的一侧进行传递，从而使得吸附功能层20中至少部分结构所对应的温度升高，并在温度条件改变的作用下，吸附功能层20中至少部分结构所对应的吸附能力发生改变，以此实现对待转移元件J的吸附或释放。In the embodiment of the present application, the adjustment unit 31 is sandwiched between the adsorption functional layer 20 and the substrate 12 . For example, the adjustment unit 31 can change the ambient temperature where the adsorption functional layer 20 is located. The adjustment unit 31 can generate a certain amount of heat under the control of the electrical signal of the control mechanism 600. The generated heat can be transferred to the surface of the adsorption functional layer 20 facing the first surface M1, and then from this surface to the adsorption functional layer 20 away from the first surface M1. transfer to one side, thereby causing the temperature corresponding to at least part of the structure in the adsorption functional layer 20 to increase, and under the influence of the change in temperature conditions, the adsorption capacity corresponding to at least part of the structure in the adsorption functional layer 20 changes, thereby Realize the adsorption or release of the element J to be transferred.
当然在另一些实施例中，请参阅图8，调节单元31在第一面M1的正投影至少部分位于吸附功能层20在第一面M1的正投影外，以使至少部分调节单元31相对于吸附功能层20暴露。进一步可选地，吸附功能层20内可以是由通孔结构，通孔结构沿吸附功能层20的厚度方向Y贯穿吸附功能层20设置，调节单元31部分位于通孔结构内，以使其相对于吸附功能层20暴露。Of course, in other embodiments, please refer to FIG. 8 , the orthographic projection of the adjustment unit 31 on the first surface M1 is at least partially located outside the orthographic projection of the adsorption function layer 20 on the first surface M1 , so that at least part of the adjustment unit 31 is relative to The adsorption functional layer 20 is exposed. Further optionally, the adsorption functional layer 20 may be provided with a through-hole structure, which is disposed through the adsorption functional layer 20 along the thickness direction Y of the adsorption functional layer 20 , and the adjustment unit 31 is partially located within the through-hole structure so that they are opposite to each other. exposed to the adsorption functional layer 20 .
在一些实施例中，如图8所示，吸附功能层20包括间隔设置的多个吸附功能块21，至少部分调节单元31位于相邻吸附功能块21之间。In some embodiments, as shown in FIG. 8 , the adsorption functional layer 20 includes a plurality of adsorption functional blocks 21 arranged at intervals, and at least part of the adjustment unit 31 is located between adjacent adsorption functional blocks 21 .
吸附功能层20包括多个吸附功能块21，对于吸附功能块21的数量，本申请实施例不作限制。吸附功能块21的数量可以大于调节单元31的数量，或者也可以小于或等于调节单元31的数量。并且多个吸附功能块21可以沿单一方向间隔排布，或者也可以沿多个不同方向间隔排布。The adsorption functional layer 20 includes a plurality of adsorption functional blocks 21, and the embodiment of the present application does not limit the number of adsorption functional blocks 21. The number of adsorption functional blocks 21 may be greater than the number of adjustment units 31 , or may be less than or equal to the number of adjustment units 31 . And the plurality of adsorption functional blocks 21 can be arranged at intervals along a single direction, or can also be arranged at intervals along multiple different directions.
至少部分调节单元31位于相邻吸附功能块21之间，以使调节单元31可以相对于吸附功能层20暴露。在此基础上，调节单元31可以在控制机构600的控制下改变周围相邻吸附功能块21所对应的环境条件，从而改变吸附功能块21所对应的吸附能力，实现对待转移元件J的吸附或释放。At least part of the adjustment unit 31 is located between adjacent adsorption functional blocks 21 so that the adjustment unit 31 can be exposed relative to the adsorption function layer 20 . On this basis, the adjustment unit 31 can change the environmental conditions corresponding to the surrounding adjacent adsorption functional blocks 21 under the control of the control mechanism 600, thereby changing the adsorption capacity corresponding to the adsorption functional blocks 21 to achieve adsorption or adsorption of the element J to be transferred. freed.
或者在另一些实施例中，至少部分调节单元31还可以设于吸附功能块21与第一面M1之间。这样调节单元31也可以改变对应吸附功能块21所在的环境条件，以此改变吸附功能块21所对应的吸附能力。进一步可选地，调节单元31的数量为多个，部分调节单元31位于相邻吸附功能块21之间，部分调节单元31位于吸附功能块21与第一面M1之间。Or in other embodiments, at least part of the adjustment unit 31 may also be provided between the adsorption functional block 21 and the first surface M1. In this way, the adjustment unit 31 can also change the environmental conditions where the corresponding adsorption functional block 21 is located, thereby changing the corresponding adsorption capacity of the adsorption functional block 21 . Further optionally, the number of adjustment units 31 is multiple, some of the adjustment units 31 are located between adjacent adsorption functional blocks 21 , and some of the adjustment units 31 are located between the adsorption functional blocks 21 and the first surface M1 .
在一些实施例中，请参阅图9，第二面M2的数量为多个，多个第二面M2分设在第一面M1的不同边缘，至少部分连接线32经由不同第二面M2延伸至第一面M1。In some embodiments, please refer to FIG. 9 , there are multiple second surfaces M2 , the plurality of second surfaces M2 are located at different edges of the first surface M1 , and at least some of the connecting lines 32 extend through the different second surfaces M2 to The first side is M1.
在本申请实施例中，第二面M2数量为多个，各第二面M2均可以布置走线结构，在此基础上，通过将至少部分连接线32设置在不同第二面M2，从而减少单一第二面M2上对应的走线密度，降低连接线32在第二面M2上发生物理干涉以及信号串扰的风险，提高可靠性。In the embodiment of the present application, there are multiple second surfaces M2, and wiring structures can be arranged on each second surface M2. On this basis, at least part of the connection lines 32 are arranged on different second surfaces M2, thereby reducing The corresponding wiring density on the single second surface M2 reduces the risk of physical interference and signal crosstalk of the connecting wires 32 on the second surface M2 and improves reliability.
需要说明的是，对于不同第二面M2的形状尺寸以及相对于第一面M1的具体布置位置以及倾斜角度，本申请实施例不作限制。在一些实施例中，第一面M1包括第一中心区域A，多个第二面M2以及多个连接线32相对于第一中心区域A对称分布。It should be noted that the embodiment of the present application does not limit the shape and size of the different second surfaces M2 as well as the specific arrangement positions and inclination angles relative to the first surface M1. In some embodiments, the first surface M1 includes a first central area A, a plurality of second surfaces M2 and a plurality of connecting lines 32 are symmetrically distributed relative to the first central area A.
第一中心区域A为第一面M1所对应的几何中心区域，多个第二面M2以及多个连接线32可以相对于第一中心区域A对称设置。示例性地，第二面M2的数量为两个，两个第二面M2沿第一方向X对称分布在第一中心区域A的两侧，或者第二面M2的数量为四个，四个第二面M2环绕设置在第一中心区域A的四周，且四个第二面M2两两对称设置。The first central area A is the geometric center area corresponding to the first surface M1, and the plurality of second surfaces M2 and the plurality of connecting lines 32 can be arranged symmetrically with respect to the first central area A. For example, the number of the second faces M2 is two, and the two second faces M2 are symmetrically distributed on both sides of the first central area A along the first direction X, or the number of the second faces M2 is four, four The second surface M2 is arranged around the first central area A, and the four second surfaces M2 are arranged symmetrically in pairs.
在本申请实施例中，通过将第二面M2与连接线32设置成相对第一中心区域A对称设置，从而能够降低第二面M2的制备难度以及连接线32在第二面M2上的走线难度，以此降低元件拾取机构100对应的制备难度以及成本，具有较强实用性。In the embodiment of the present application, by arranging the second surface M2 and the connecting wire 32 symmetrically with respect to the first central area A, the preparation difficulty of the second surface M2 and the routing of the connecting wire 32 on the second surface M2 can be reduced. line difficulty, thereby reducing the corresponding preparation difficulty and cost of the component pickup mechanism 100, and has strong practicability.
在一些实施例中，如图7所示，调节单元31包括第一连接端D1与第二连接端D2，第一连接端D1与第二连接端D2分别与不同连接线32电连接。In some embodiments, as shown in FIG. 7 , the adjustment unit 31 includes a first connection end D1 and a second connection end D2. The first connection end D1 and the second connection end D2 are electrically connected to different connection lines 32 respectively.
各调节单元31均具有两个电连接端口，分别用于与不同连接线32向连接。在此基础上，若想要单一调节单元31可以运行工作，则控制机构600至少需要控制两条连接线32向调节单元31施加电信号。鉴于此，控制机构600可以选择性地控制部分连接线32输送对应电信号，部分连接线32不输送电信号，以此使得部分调节单元31运行工作，部分调节单元31不运行工作，这样可以根据实际情况选择地改变吸附功能层20中部分或全部区域中的吸附能力，以此提高元件拾取机构100对于待转移元件J拾取或释放过程的灵活性。Each adjustment unit 31 has two electrical connection ports, respectively used for connecting to different connection lines 32 . On this basis, if you want a single adjustment unit 31 to operate, the control mechanism 600 needs to control at least two connection lines 32 to apply electrical signals to the adjustment unit 31 . In view of this, the control mechanism 600 can selectively control some connection lines 32 to transmit corresponding electrical signals, and some connection lines 32 not to transmit electrical signals, so that some adjustment units 31 operate and some adjustment units 31 do not operate. In this way, according to The actual situation is to selectively change the adsorption capacity in part or all areas of the adsorption functional layer 20, thereby improving the flexibility of the component pickup mechanism 100 in the process of picking up or releasing the component J to be transferred.
进一步地，在一些可选实施例中，至少部分调节单元31的第一端与同一连接线32电连接设置，即至少部分连接线32可以同时与多个调节单元31进行连接。Furthermore, in some optional embodiments, at least part of the first end of the adjustment unit 31 is electrically connected to the same connection line 32 , that is, at least part of the connection line 32 can be connected to multiple adjustment units 31 at the same time.
这种设计有助于降低连接线32的数量，以此降低连接线32在第一面M1以及第二面M2上的布线密度以及布线难度，并且由于连接线32数量减少，控制机构600对于不同连接线32之间的控制精度以及对应的编程难度同样可以降低，因而具有较强实用性。This design helps to reduce the number of connection lines 32 , thereby reducing the wiring density and wiring difficulty of the connection lines 32 on the first surface M1 and the second surface M2 . Moreover, due to the reduction in the number of connection lines 32 , the control mechanism 600 has different requirements for different functions. The control accuracy between the connecting lines 32 and the corresponding programming difficulty can also be reduced, so it has strong practicability.
第二方面，如图2所示，本申请实施例提供了一种元件转移系统，元件转移系统包括供体基板200、目标基板300、元件拾取机构100、转移机构400以及控制机构600，供体基板200上设置有待转移元件J。元件拾取机构100为前述任一实施方式中的元件拾取机构100。供体基板200、目标基板300以及元件拾取机构100中至少一者设置于转移机构400，转移机构400被配置为能够调节元件拾取机构100相对于供体基板200以及目标基板300之间的距离。控制机构600被配置为能够调节吸附功能层20的环境条件，以改变吸附功能层20对于待转移元件J的吸附能力。In the second aspect, as shown in Figure 2, the embodiment of the present application provides a component transfer system. The component transfer system includes a donor substrate 200, a target substrate 300, a component pickup mechanism 100, a transfer mechanism 400 and a control mechanism 600. The donor The component J to be transferred is disposed on the substrate 200 . The component pickup mechanism 100 is the component pickup mechanism 100 in any of the aforementioned embodiments. At least one of the donor substrate 200 , the target substrate 300 and the component pick-up mechanism 100 is provided on the transfer mechanism 400 , and the transfer mechanism 400 is configured to be able to adjust the distance between the component pick-up mechanism 100 relative to the donor substrate 200 and the target substrate 300 . The control mechanism 600 is configured to adjust the environmental conditions of the adsorption functional layer 20 to change the adsorption capacity of the adsorption functional layer 20 for the element J to be transferred.
元件转移系统用于将待转移元件J由供体基板200转移至目标基板300中，可选地，供体基板200可以为待转移元件J的生长基板，目标基板300可以为包含阵列基板在内的显示模组中的部分结构即元件转移系统可以将待转移元件J由生长基板转移至目标基板300中，以形成对应的显示装置。The element transfer system is used to transfer the element J to be transferred from the donor substrate 200 to the target substrate 300. Alternatively, the donor substrate 200 can be a growth substrate of the element J to be transferred, and the target substrate 300 can include an array substrate. Part of the structure in the display module, that is, the element transfer system can transfer the element J to be transferred from the growth substrate to the target substrate 300 to form a corresponding display device.
元件拾取机构100用于拾取以及释放待转移元件J，元件拾取机构100包括基底10以及位于基底10一侧的吸附功能层20，基底10主要起到支撑承载的作用，吸附功能层20能够起到对待转移元件J的拾取或释放功能。The component pick-up mechanism 100 is used to pick up and release the component J to be transferred. The component pick-up mechanism 100 includes a base 10 and an adsorption functional layer 20 located on one side of the base 10. The base 10 mainly plays a supporting role, and the adsorption functional layer 20 can Pick or release function for element J to be transferred.
转移机构400用于带动供体基板200、目标基板300以及元件拾取机构100中至少一者的转移。可选地，控制机构600既可以控制转移机构400的运行，也可以控制吸附功能层20所在的环境条件。具体地说，可选地，转移机构400可以仅控制元件拾取机构100移动，而供体基板200以及目标基板300始终处于位置固定的状态。在这种情况下，转移机构400可以在控制机构600的控制下，带动元件拾取机构100靠近供体基板200，然后控制机构600调节吸附功能层20的环境条件，以改变吸附功能层20的状态使其可以吸取供体基板200上的待转移元件J。然后转移机构400控制元件拾取机构100移动离开供体基板200，并靠近目标基板300。之后控制机构600控制调节吸附功能层20的环境条件，以改变吸附功能层20的状态使其无法继续吸附待转移元件J，待转移元件J在重力等因素的作用下落入目标基板300，完成元件的转移过程。The transfer mechanism 400 is used to drive the transfer of at least one of the donor substrate 200 , the target substrate 300 and the component pickup mechanism 100 . Optionally, the control mechanism 600 can control the operation of the transfer mechanism 400 and the environmental conditions where the adsorption functional layer 20 is located. Specifically, optionally, the transfer mechanism 400 may only control the component pickup mechanism 100 to move, while the donor substrate 200 and the target substrate 300 are always in a fixed position. In this case, the transfer mechanism 400 can drive the component pickup mechanism 100 close to the donor substrate 200 under the control of the control mechanism 600 , and then the control mechanism 600 adjusts the environmental conditions of the adsorption functional layer 20 to change the state of the adsorption functional layer 20 This allows it to absorb the component J to be transferred on the donor substrate 200 . The transfer mechanism 400 then controls the component pickup mechanism 100 to move away from the donor substrate 200 and approach the target substrate 300 . The control mechanism 600 then controls and adjusts the environmental conditions of the adsorption functional layer 20 to change the state of the adsorption functional layer 20 so that it cannot continue to adsorb the component J to be transferred. The component J to be transferred falls into the target substrate 300 under the action of gravity and other factors, and the component is completed. transfer process.
或者，在另一些可选实施例中，转移机构400还可以同时控制供体基板200以及目标基板300移动，而元件拾取机构100始终处于位置固定的状态。在这种情况下，转移机构400可以在控制机构600的控制下，带动供体基板200靠近元件拾取机构100，然后控制机构600调节吸附功能层20的环境条件，以改变吸附功能层20的状态使其可以吸取供体基板200上的待转移元件J。然后转移机构400控制供体基板200远离元件拾取机构100，并控制目标基板300靠近元件拾取机构100。之后控制机构600控制调节吸附功能层20的环境条件，以改变吸附功能层20的状态使其无法继续吸附待转移元件J，待转移元件J在重力等因素的作用下落入目标基板300，完成元件的转移过程。Or, in other optional embodiments, the transfer mechanism 400 can also control the movement of the donor substrate 200 and the target substrate 300 at the same time, while the component pickup mechanism 100 is always in a fixed position. In this case, the transfer mechanism 400 can drive the donor substrate 200 close to the component pickup mechanism 100 under the control of the control mechanism 600 , and then the control mechanism 600 adjusts the environmental conditions of the adsorption functional layer 20 to change the state of the adsorption functional layer 20 This allows it to absorb the component J to be transferred on the donor substrate 200 . The transfer mechanism 400 then controls the donor substrate 200 to move away from the component pickup mechanism 100 and controls the target substrate 300 to approach the component pickup mechanism 100 . The control mechanism 600 then controls and adjusts the environmental conditions of the adsorption functional layer 20 to change the state of the adsorption functional layer 20 so that it cannot continue to adsorb the component J to be transferred. The component J to be transferred falls into the target substrate 300 under the action of gravity and other factors, and the component is completed. transfer process.
当然在另一些可选实施例中，转移机构400还可以同时对元件拾取机构100、供体基板200以及目标基板300三者均起到控制作用，本申请实施例对此不作限制。Of course, in other optional embodiments, the transfer mechanism 400 can also control the component pickup mechanism 100, the donor substrate 200, and the target substrate 300 at the same time. This is not limited in the embodiments of the present application.
此外，元件转移系统还可以包括有调平机构500，调平机构500能够检测供体基板200、目标基板300以及元件拾取机构100中至少两者之间的平面度关系。以供体基板200以及元件拾取机构100为例，调平机构500可以检测供体基板200朝向元件拾取机构100表面，相对于元件拾取机构100朝向供体基板200表面的倾斜角度，然后可以根据倾斜角度对两者进行调节。以确保在元件拾取机构100拾取供体基板200上待转移元件J的过程中，元件拾取机构100朝向供体基板200的表面可以平行于供体基板200朝向元件拾取机构100的表面，进而可以提高元件拾取机构100对于待转移元件J的拾取精度，实现对待转移元件J的巨量拾取。In addition, the component transfer system may further include a leveling mechanism 500 , which can detect the flatness relationship between at least two of the donor substrate 200 , the target substrate 300 and the component pickup mechanism 100 . Taking the donor substrate 200 and the component pickup mechanism 100 as an example, the leveling mechanism 500 can detect the inclination angle of the donor substrate 200 toward the component pickup mechanism 100 surface relative to the component pickup mechanism 100 toward the donor substrate 200 surface, and then can detect the tilt angle according to the inclination. Angle adjusts both. This is to ensure that when the component pickup mechanism 100 picks up the component J to be transferred on the donor substrate 200, the surface of the component pickup mechanism 100 facing the donor substrate 200 can be parallel to the surface of the donor substrate 200 facing the component pickup mechanism 100, thereby improving the The component picking-up mechanism 100 has high picking accuracy for the components J to be transferred, enabling it to pick up a large amount of the components J to be transferred.
同理，调平机构500还可以检测目标基板300朝向元件拾取机构100表面，相对于元件拾取机构100朝向目标基板300表面的倾斜角度，然后可以根据倾斜角度对两者进行调节。以确保在元件拾取机构100释放待转移元件J的过程中，元件拾取机构100朝向目标基板300的表面可以平行于目标基板300朝向元件拾取机构100的表面，进而可以提高元件拾取机构100对于待转移元件J的释放精度，实现对待转移元件J的巨量释放。Similarly, the leveling mechanism 500 can also detect the inclination angle of the surface of the target substrate 300 facing the component pickup mechanism 100 relative to the surface of the component pickup mechanism 100 facing the target substrate 300, and then adjust both according to the inclination angle. To ensure that during the process of the component pickup mechanism 100 releasing the component J to be transferred, the surface of the component pickup mechanism 100 facing the target substrate 300 can be parallel to the surface of the target substrate 300 facing the component pickup mechanism 100, thereby improving the ability of the component pickup mechanism 100 to be transferred. The release accuracy of component J enables the release of large quantities of component J to be transferred.
综上，在本申请实施例中，元件转移系统集成了元件拾取机构100以及移动机构。在此基础上，控制机构600可以对元件拾取机构100中吸附功能层20的吸附能力进行控制，同时还可以借助移动机构实现对元件拾取机构100相对于供体基板200以及目标基板300之间相对位置的控制，从而实现对整个元件转移过程的集中管控，有助于实现转移过程的智能协调，以此提高元件转移过程的效率。并且调平机构500的设置可以提高元件转移的精度，以使元待转移元件J可以高效精确的进行巨量转移。In summary, in the embodiment of the present application, the component transfer system integrates the component picking mechanism 100 and the moving mechanism. On this basis, the control mechanism 600 can control the adsorption capacity of the adsorption functional layer 20 in the component pick-up mechanism 100, and can also use the moving mechanism to realize the relative position between the component pick-up mechanism 100 relative to the donor substrate 200 and the target substrate 300. Position control, thereby achieving centralized management and control of the entire component transfer process, helps realize intelligent coordination of the transfer process, thereby improving the efficiency of the component transfer process. Moreover, the setting of the leveling mechanism 500 can improve the accuracy of component transfer, so that large quantities of components J to be transferred can be transferred efficiently and accurately.
此外，需要说明的是，本申请实施例提供的元件转移系统，具有前述任一实施方式中元件拾取机构100的有益效果，具体详见前述对于元件拾取机构100有益效果的描述，本申请实施例对此不作限制。In addition, it should be noted that the component transfer system provided by the embodiment of the present application has the beneficial effects of the component pickup mechanism 100 in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the component pickup mechanism 100. The embodiment of the present application There are no restrictions on this.
虽然本申请所公开的实施方式如上，但所述的内容只是为了便于理解本申请而采用的实施方式，并非用以限定本发明。任何本申请所属技术领域内的技术人员，在不脱离本申请所公开的精神和范围的前提下，可以在实施的形式上及细节上作任何的修改与变化，但本申请的保护范围，仍须以所附的权利要求书所界定的范围为准。Although the embodiments disclosed in this application are as above, the described contents are only used to facilitate the understanding of this application and are not intended to limit the present invention. Any skilled person in the technical field to which this application belongs can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this application. However, the protection scope of this application remains The scope defined by the appended claims shall prevail.
以上所述，仅为本申请的具体实施方式，所属领域的技术人员可以清楚地了解到，为了描述的方便和简洁，上述描述的其他连接方式的替换等，可以参考前述方法实施例中的对应过程，在此不再赘述。应理解，本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。The above is only a specific implementation mode of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, for the replacement of other connection methods described above, please refer to the corresponding ones in the foregoing method embodiments. The process will not be described in detail here. It should be understood that the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and these modifications or substitutions should be covered. within the protection scope of this application.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311291185.1ACN117326327A (en) | 2023-10-07 | 2023-10-07 | Component picking mechanism and component transfer system |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311291185.1ACN117326327A (en) | 2023-10-07 | 2023-10-07 | Component picking mechanism and component transfer system |
| Publication Number | Publication Date |
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| CN117326327Atrue CN117326327A (en) | 2024-01-02 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311291185.1APendingCN117326327A (en) | 2023-10-07 | 2023-10-07 | Component picking mechanism and component transfer system |
| Country | Link |
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| CN (1) | CN117326327A (en) |
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