技术领域Technical field
本申请涉及电子设备技术领域，尤其涉及一种光学器件及其制作方法、可穿戴设备。The present application relates to the technical field of electronic equipment, and in particular to an optical device and a manufacturing method thereof, as well as a wearable device.
背景技术Background technique
目前，随着终端技术的发展，终端设备已经成为人们工作生活的一部分。为了满足用户对于自身健康管理的需求，较多终端设备可以支持用户的人体数据监测功能。例如，用户可以利用可穿戴设备，如智能手表等测量人体的心率、呼吸率或血氧等人体特征。At present, with the development of terminal technology, terminal equipment has become a part of people's work and life. In order to meet users' needs for their own health management, many terminal devices can support users' human body data monitoring functions. For example, users can use wearable devices such as smart watches to measure human body characteristics such as heart rate, respiration rate or blood oxygen.
通常情况下，可穿戴设备可以使用光电容积描记法(photo plethysmo graph，PPG)测量人体的心率、血氧、呼吸率等参数，进而获得人体的健康状况。该方法可以由终端内的光电二极管(photo diode，PD)和发光二极管(light emitting diode，LED)实现。具体地，PD接收由LED发射并经由用户皮肤所反射的光信号，并将光信号转换为电信号，终端通过对电信号的分析获取用户的健康状况。Normally, wearable devices can use photoplethysmo graph (PPG) to measure the human body's heart rate, blood oxygen, respiration rate and other parameters to obtain the human body's health status. This method can be implemented by a photodiode (PD) and a light emitting diode (LED) in the terminal. Specifically, the PD receives the light signal emitted by the LED and reflected by the user's skin, and converts the light signal into an electrical signal. The terminal obtains the user's health status by analyzing the electrical signal.
在相关技术中，为了防止PPG模块的光源与光电传感器(如PD，光电二极管)之间发生串扰，通常会在封装时在光源与光电传感器之间设置挡光板进行遮挡。In related technologies, in order to prevent crosstalk between the light source of the PPG module and the photoelectric sensor (such as PD, photodiode), a light baffle is usually installed between the light source and the photoelectric sensor for blocking during packaging.
然而，由于挡光板自身厚度以及相关固定结构的限制，导致光学器件封装结构体积较大，无法适应器件小型化的要求。However, due to the limitations of the thickness of the light baffle itself and related fixed structures, the optical device packaging structure is relatively large and cannot meet the requirements of device miniaturization.
发明内容Contents of the invention
为了解决上述技术问题，本申请提供一种光学器件及其制作方法、可穿戴设备。该光学器件通过将光学器件嵌入在电路板中来降低光学器件模组的整体厚度，从而利于可穿戴设备的轻薄化。In order to solve the above technical problems, this application provides an optical device, a manufacturing method thereof, and a wearable device. This optical device reduces the overall thickness of the optical device module by embedding the optical device in the circuit board, thereby facilitating the thinning and thinning of the wearable device.
第一方面，本申请提供一种光学器件，包括：In a first aspect, this application provides an optical device, including:
电路板，所述电路板具有相对的正面和背面，在所述电路板的正面形成有第一容纳孔和第二容纳孔；A circuit board, the circuit board has an opposite front and a back, and a first receiving hole and a second receiving hole are formed on the front of the circuit board;
光发射元件，所述光发射元件嵌入所述第一容纳孔中；a light emitting element, the light emitting element is embedded in the first receiving hole;
光接收元件，所述光接收元件嵌入所述第二容纳孔中；a light receiving element, the light receiving element is embedded in the second receiving hole;
所述光发射元件和所述光接收元件与所述电路板电气互连。The light emitting element and the light receiving element are electrically interconnected with the circuit board.
根据第一方面，本申请的光学器件通过将光发射元件和光接收元件嵌入在电路板中，从而使得器件整体高度大大降低，从而利于可穿戴设备的轻薄化。According to the first aspect, the optical device of the present application embeds the light emitting element and the light receiving element in the circuit board, thereby greatly reducing the overall height of the device, thereby facilitating the thinning and lightness of the wearable device.
根据第一方面，或者以上第一方面的任意一种实现方式，基板，所述光发射元件和所述光接收元件固定在所述基板上。这样设置可以通过将基板装配在电路板上来实现光发射元件和光接收元件的嵌入，结构简单易实现。According to the first aspect, or any implementation of the above first aspect, a substrate, the light emitting element and the light receiving element are fixed on the substrate. With this arrangement, the light emitting element and the light receiving element can be embedded by assembling the substrate on the circuit board, and the structure is simple and easy to implement.
根据第一方面，或者以上第一方面的任意一种实现方式，在所述电路板的背面形成有第三容纳孔，所述光发射元件和所述光接收元件各自的基板分别嵌入对应的所述第三容纳孔，According to the first aspect, or any implementation of the first aspect above, a third receiving hole is formed on the back of the circuit board, and the respective substrates of the light emitting element and the light receiving element are respectively embedded in the corresponding corresponding ones. Describe the third receiving hole,
所述光发射元件的第三容纳孔与所述光发射元件第一容纳孔连通，所述光发射元件穿过所述光发射元件的第三容纳孔而嵌入所述光发射元件的第一容纳孔；The third receiving hole of the light emitting element is connected with the first receiving hole of the light emitting element, and the light emitting element passes through the third receiving hole of the light emitting element and is embedded in the first receiving hole of the light emitting element. hole;
所述光接收元件的第三容纳孔与所述光接收元件第二容纳孔连通，所述光接收元件穿过所述光接收元件的第三容纳孔而嵌入所述光接收元件的第二容纳孔。The third receiving hole of the light receiving element is connected with the second receiving hole of the light receiving element, and the light receiving element passes through the third receiving hole of the light receiving element and is embedded in the second receiving hole of the light receiving element. hole.
这样设置可以通过将基板嵌入电路板来实现光发射元件和光接收元件的嵌入，结构简单易实现。With this arrangement, the light emitting element and the light receiving element can be embedded by embedding the substrate into the circuit board, and the structure is simple and easy to implement.
根据第一方面，或者以上第一方面的任意一种实现方式，所述光发射元件的第三容纳孔和所述光接收元件的第三容纳孔的深度相同。这样设置结构简单，易加工。According to the first aspect, or any implementation of the above first aspect, the depth of the third receiving hole of the light emitting element and the third receiving hole of the light receiving element are the same. This arrangement has a simple structure and is easy to process.
根据第一方面，或者以上第一方面的任意一种实现方式，所述光发射元件的第三容纳孔的边缘位于所述光发射元件的所述第一容纳孔的边缘之外，所述光接收元件的第三容纳孔的边缘位于所述光接收元件的所述第二容纳孔的边缘之外。这样设置使得第三容纳孔和第一容纳孔或第二容纳孔之间形成台阶，从而易于将基板嵌入在第三容纳孔中。According to the first aspect, or any implementation of the above first aspect, the edge of the third receiving hole of the light emitting element is located outside the edge of the first receiving hole of the light emitting element, and the light The edge of the third receiving hole of the receiving element is located outside the edge of the second receiving hole of the light receiving element. This arrangement forms a step between the third receiving hole and the first receiving hole or the second receiving hole, thereby making it easy to embed the substrate in the third receiving hole.
根据第一方面，或者以上第一方面的任意一种实现方式，所述光发射元件和所述光接收元件分别固定在各自的所述基板上，或者共用同一个基板。这样设置结构简单，易实现易安装。According to the first aspect, or any implementation of the above first aspect, the light emitting element and the light receiving element are respectively fixed on the respective substrates, or share the same substrate. This arrangement has a simple structure, is easy to implement and install.
根据第一方面，或者以上第一方面的任意一种实现方式，所述光发射元件包括至少两个发光元件，至少两个所述发光元件分别固定在各自的基板上或共用同一个基板。这样设置结构简单，易实现易安装。According to the first aspect, or any implementation of the above first aspect, the light-emitting element includes at least two light-emitting elements, and the at least two light-emitting elements are fixed on respective substrates or share the same substrate. This arrangement has a simple structure, is easy to implement and install.
根据第一方面，或者以上第一方面的任意一种实现方式，所述光发射元件包括至少两个发光元件，至少两个所述发光元件分别嵌入在各自的所述第一容纳孔中，或者共用同一个第一容纳孔。这样可以实现的更好的隔光，或者降低电路板打孔的数量并提高固晶工艺器件贴装的空间和自由度。According to the first aspect, or any implementation of the above first aspect, the light-emitting element includes at least two light-emitting elements, and at least two of the light-emitting elements are respectively embedded in the respective first receiving holes, or share the same first receiving hole. This can achieve better light isolation, or reduce the number of holes punched in the circuit board and improve the space and freedom of mounting the die-bonding process device.
根据第一方面，或者以上第一方面的任意一种实现方式，所述基板的热膨胀系数小于等于10 ppm/℃，所述基板包括陶瓷基板、可伐合金基板或FR4基板。这样可以降低光发射元件和光接收元件面临较高封装应力的风险。According to the first aspect, or any implementation of the above first aspect, the thermal expansion coefficient of the substrate is less than or equal to 10 ppm/℃, and the substrate includes a ceramic substrate, a Kovar alloy substrate or an FR4 substrate. This reduces the risk of high packaging stresses on the light-emitting and light-receiving components.
根据第一方面，或者以上第一方面的任意一种实现方式，所述光发射元件和所述光接收元件固定在所述电路板上。这样采用一体化设计，可以简化结构并减少了基板材料和电路板的结合步骤以及结合部的应力风险。According to the first aspect, or any implementation of the above first aspect, the light emitting element and the light receiving element are fixed on the circuit board. This integrated design can simplify the structure and reduce the bonding steps of the substrate material and the circuit board as well as the stress risk at the joint.
根据第一方面，或者以上第一方面的任意一种实现方式，所述电路板的热膨胀系数小于等于10 ppm/℃，所述电路板包括陶瓷基板。这样可以降低光发射元件和光接收元件面临较高封装应力的风险。According to the first aspect, or any implementation of the above first aspect, the thermal expansion coefficient of the circuit board is less than or equal to 10 ppm/℃, and the circuit board includes a ceramic substrate. This reduces the risk of high packaging stresses on the light-emitting and light-receiving components.
根据第一方面，或者以上第一方面的任意一种实现方式，在所述电路板上靠近所述第一容纳孔和所述第二容纳孔的位置设置有焊盘；According to the first aspect, or any implementation of the first aspect above, a pad is provided on the circuit board close to the first receiving hole and the second receiving hole;
所述光发射元件和所述光接收元件均包括两个电极，两个电极均设置在所述光发射元件或光接收元件的顶面，且分别通过打线与对应的焊盘连接。The light-emitting element and the light-receiving element each include two electrodes. The two electrodes are arranged on the top surface of the light-emitting element or the light-receiving element, and are respectively connected to the corresponding pads through wire bonding.
这样设置，由于高度差极小的绑定打线，降低光发射元件/光接收元与供电电源之间的互连途径，降低信号传输损耗和功率损耗。With this arrangement, due to the extremely small height difference of the binding wires, the interconnection path between the light emitting element/light receiving element and the power supply is reduced, and the signal transmission loss and power loss are reduced.
根据第一方面，或者以上第一方面的任意一种实现方式，在所述电路板上靠近所述第一容纳孔和所述第二容纳孔的位置设置有焊盘；According to the first aspect, or any implementation of the first aspect above, a pad is provided on the circuit board close to the first receiving hole and the second receiving hole;
所述光发射元件和所述光接收元件均包括两个电极，两个电极分别设置在所述光发射元件或光接收元件的顶面和底面，所述光发射元件和所述光接收元件底面的所述电极与所述电路板连接，所述光发射元件和所述光接收元件顶面的所述电极与对应的焊盘连接。这样设置可以兼容更多的光学器件结构。The light emitting element and the light receiving element each include two electrodes, the two electrodes are respectively arranged on the top surface and the bottom surface of the light emitting element or the light receiving element, and the light emitting element and the light receiving element bottom surface The electrodes are connected to the circuit board, and the electrodes on the top surfaces of the light emitting element and the light receiving element are connected to corresponding pads. This setting can be compatible with more optical device structures.
根据第一方面，或者以上第一方面的任意一种实现方式，所述第一容纳孔的深度大于所述光发射元件的高度，所述第二容纳孔的深度大于所述光接收元件的高度。这样设置，可以避免光发射元件发出的光直接被光接收元件接收。According to the first aspect, or any implementation of the above first aspect, the depth of the first accommodation hole is greater than the height of the light emitting element, and the depth of the second accommodation hole is greater than the height of the light receiving element. . This arrangement can prevent the light emitted by the light emitting element from being directly received by the light receiving element.
根据第一方面，或者以上第一方面的任意一种实现方式，所述第一容纳孔的深度小于所述光发射元件的高度，所述第二容纳孔的深度小于所述光接收元件的高度。这样设置适用于电路板布线较少，厚度可以进一步降低的情形。According to the first aspect, or any implementation of the above first aspect, the depth of the first accommodation hole is less than the height of the light emitting element, and the depth of the second accommodation hole is less than the height of the light receiving element. . This setting is suitable for situations where the circuit board has less wiring and the thickness can be further reduced.
根据第一方面，或者以上第一方面的任意一种实现方式，在所述电路板的正面靠近所述第一容纳孔的位置设置有隔光元件。这样设置，可以避免光发射元件发出的光直接被光接收元件接收。According to the first aspect, or any implementation of the above first aspect, a light-blocking element is provided on the front surface of the circuit board close to the first receiving hole. This arrangement can prevent the light emitted by the light emitting element from being directly received by the light receiving element.
第二方面，提供一种光学器件的制作方法，包括：In a second aspect, a method for manufacturing an optical device is provided, including:
提供电路板，并在所述电路板上制作光学器件容纳孔；providing a circuit board and making optical device receiving holes on the circuit board;
将光学器件附接在基板上；Attach optics to the substrate;
将所述基板装配在所述电路板上，以将所述基板和所述光学器件嵌入所述光学器件容纳孔中；Assembling the substrate on the circuit board to embed the substrate and the optical device into the optical device receiving hole;
通过打线工艺实现所述光学器件与所述电路板的电气互连；The electrical interconnection between the optical device and the circuit board is achieved through a wire bonding process;
通过贴片工艺将其它电子器件安装在所述电路板上。Other electronic components are mounted on the circuit board through a patch process.
根据第二方面的光学器件的制作方法，通过将光学器件嵌入电路板中来降低光学器件的封装高度，利于设备的进一步轻薄化。According to the manufacturing method of the optical device of the second aspect, the packaging height of the optical device is reduced by embedding the optical device in the circuit board, which is conducive to further thinning and thinning of the device.
第三方面，提供一种光学器件的制作方法，包括：In a third aspect, a method for manufacturing an optical device is provided, including:
提供电路板，并在所述电路板上制作光学器件容纳孔；providing a circuit board and making optical device receiving holes on the circuit board;
将光学器件嵌入所述光学器件容纳孔中；Embedding the optical device into the optical device receiving hole;
通过打线工艺实现所述光学器件与所述电路板的电气互连；The electrical interconnection between the optical device and the circuit board is achieved through a wire bonding process;
通过贴片工艺将其它电子器件安装在所述电路板上。Other electronic components are mounted on the circuit board through a patch process.
根据第三方面的光学器件的制作方法，通过将光学器件嵌入电路板中来降低光学器件的封装高度，利于设备的进一步轻薄化。According to the manufacturing method of the optical device in the third aspect, the packaging height of the optical device is reduced by embedding the optical device in the circuit board, which is conducive to further thinning and thinning of the device.
第四方面，提供一种可穿戴设备，包括壳体以及设置在所述壳体内的如第一方面的任意一项所述光学器件。A fourth aspect provides a wearable device, including a housing and an optical device according to any one of the first aspects provided in the housing.
根据第四方面的可穿戴设备，由于采用第一方面的光学器件，因此具有更薄的厚度。A wearable device according to the fourth aspect has a thinner thickness due to the adoption of the optical device of the first aspect.
附图说明Description of the drawings
图1为示例性示出的一种可穿戴设备的使用状态示意图；Figure 1 is a schematic diagram illustrating the use status of a wearable device;
图2为示例性示出的可穿戴设备的PPG模块的测量原理示意图；Figure 2 is a schematic diagram of the measurement principle of the PPG module of the wearable device;
图3为示例性示出目前的一种PPG模组的结构示意图；Figure 3 is a schematic structural diagram illustrating a current PPG module;
图4为本申请实施例提供的PPG模组的示意性俯视图；Figure 4 is a schematic top view of the PPG module provided by the embodiment of the present application;
图5为本申请实施例提供的PPG模组的示意性截面图；Figure 5 is a schematic cross-sectional view of the PPG module provided by the embodiment of the present application;
图6为本申请实施例提供的一种PPG模组的封装方法的示意性流程图；Figure 6 is a schematic flow chart of a PPG module packaging method provided by an embodiment of the present application;
图7至图8为本申请实施例提供的一种PPG模组的封装方法各步骤对应的模组各部件的示意性截面图；Figures 7 to 8 are schematic cross-sectional views of each module component corresponding to each step of a PPG module packaging method provided by an embodiment of the present application;
图9为本申请实施例提供的另一种PPG模组的封装方法的示意性流程图；Figure 9 is a schematic flow chart of another PPG module packaging method provided by an embodiment of the present application;
图10至图12为本申请实施例提供的另一种PPG模组的封装方法各步骤对应的模组各部件的示意性截面图；Figures 10 to 12 are schematic cross-sectional views of each module component corresponding to each step of another PPG module packaging method provided by the embodiment of the present application;
图13为本申请另一实施例提供的PPG模组的示意性截面图；Figure 13 is a schematic cross-sectional view of a PPG module provided by another embodiment of the present application;
图14为本申请另一实施例提供的PPG模组的示意性截面图；Figure 14 is a schematic cross-sectional view of a PPG module provided by another embodiment of the present application;
图15为本申请另一实施例提供的PPG模组的示意性截面图。Figure 15 is a schematic cross-sectional view of a PPG module provided by another embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。The term "and/or" in this article is just an association relationship that describes related objects, indicating that three relationships can exist. For example, A and/or B can mean: A exists alone, A and B exist simultaneously, and they exist alone. B these three situations.
本申请实施例的说明书和权利要求书中的术语“第一”和“第二”等是用于区别不同的对象，而不是用于描述对象的特定顺序。例如，第一目标对象和第二目标对象等是用于区别不同的目标对象，而不是用于描述目标对象的特定顺序。The terms “first” and “second” in the description and claims of the embodiments of this application are used to distinguish different objects, rather than to describe a specific order of objects. For example, the first target object, the second target object, etc. are used to distinguish different target objects, rather than to describe a specific order of the target objects.
在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。In the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concept in a concrete manner.
在本申请实施例的描述中，除非另有说明，“多个”的含义是指两个或两个以上。例如，多个处理单元是指两个或两个以上的处理单元；多个系统是指两个或两个以上的系统。In the description of the embodiments of this application, unless otherwise specified, the meaning of “plurality” refers to two or more. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.
本申请实施例的描述中，术语“上”、“下”、“内”、“外”、“垂直”、“水平”等指示的方位或位置关系为相对于附图中的部件示意放置的方位或位置来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，而不是指示或暗示所指的装置或元器件必须具有的特定的方位、或以特定的方位构造和操作，其可以根据附图中部件所放置的方位的变化而相应地发生变化，因此不能理解为对本申请的限定。In the description of the embodiments of the present application, the terms "upper", "lower", "inner", "outer", "vertical", "horizontal", etc. indicate an orientation or positional relationship that is schematically placed relative to the components in the drawings. It should be understood that these directional terms are relative concepts, and they are used for relative description and clarification, rather than indicating or implying that the device or component referred to must have a specific orientation, or Constructed and operated in a specific orientation, it may change accordingly depending on the orientation in which the components are placed in the drawings, and therefore should not be construed as a limitation of the present application.
需要说明的是，本申请实施例中以同一附图标记表示同一组成部分或同一零部件，对于本申请实施例中相同的零部件，图中可能仅以其中一个零件或部件为例标注了附图标记，应理解的是，对于其他相同的零件或部件，附图标记同样适用。It should be noted that in the embodiments of the present application, the same reference numerals are used to represent the same components or components. For the same components in the embodiments of the present application, only one of the parts or components may be marked in the figure as an example. Reference numerals, it should be understood that the same reference numerals apply to other identical parts or components.
术语解释：Terminology explanation:
固晶又称为Die Bond或装片。固晶即通过胶体（对于LED来说一般是导电胶或绝缘胶）把晶片粘结在支架的指定区域，形成热通路或电通路，为后序的打线连接提供条件的工序。Die bonding is also called die bond or die bonding. Chip bonding is a process in which the chip is bonded to a designated area of the bracket through colloid (generally conductive glue or insulating glue for LEDs) to form a thermal or electrical path, which provides conditions for subsequent wiring connections.
图1为示例性示出的一种可穿戴设备的使用状态示意图。参见图1所示，本申请实施例中的可穿戴设备100可以包括智能手表或智能手环。本申请实施例中对可穿戴设备100的形态不做具体限定。示例性地，本申请实施例中的可穿戴设备100也可以包括智能耳机。下面以智能手表为例对本申请实施例提供的可穿戴设备100实现方式进行阐述。Figure 1 is a schematic diagram illustrating the use status of a wearable device. Referring to FIG. 1 , the wearable device 100 in the embodiment of the present application may include a smart watch or a smart bracelet. In the embodiment of the present application, the form of the wearable device 100 is not specifically limited. By way of example, the wearable device 100 in the embodiment of the present application may also include smart headphones. The following uses a smart watch as an example to describe the implementation of the wearable device 100 provided in the embodiment of the present application.
在一些可实现的方式中，本申请实施例的可穿戴设备100可以包括腕带。例如，可穿戴设备100可以通过腕带佩戴于用户的手腕处。用户可以通过可穿戴设备100获得当前时间、日期、位置或者身体状态等信息。或者，用户可以通过可穿戴设备100进行通话、播放音乐或者查看信息。In some implementable ways, the wearable device 100 of the embodiment of the present application may include a wristband. For example, the wearable device 100 may be worn on the user's wrist through a wristband. The user can obtain information such as the current time, date, location or physical status through the wearable device 100 . Alternatively, the user can make calls, play music, or view information through the wearable device 100 .
在一些可实现的方式中，本申请实施例的可穿戴设备100配置有PPG(photoplethysmo graph，PPG)模块，通过PPG模块来测量人体的心率、血氧、呼吸率等参数，进而获得人体的健康状况。PPG是一种将光照进皮肤并测量因血液流动而产生的光散射的方法。该方法非常简单，光学心率传感器基于以下工作原理：当血流动力发生变化时，例如血脉搏率（心率）或血容积（心输出量）发生变化时，进入人体的光会发生可预见的散射。In some implementable ways, the wearable device 100 of the embodiment of the present application is configured with a PPG (photoplethysmo graph, PPG) module. The PPG module is used to measure the human body's heart rate, blood oxygen, respiration rate and other parameters, thereby obtaining the health of the human body. situation. PPG is a method of shining light into the skin and measuring the light scattering caused by blood flow. The method is very simple, the optical heart rate sensor is based on the following working principle: when there are changes in blood flow forces, such as changes in blood pulse rate (heart rate) or blood volume (cardiac output), the light entering the body undergoes predictable scattering .
图2为示例性示出的可穿戴设备的PPG模块的测量原理示意图。如图2所示，当LED光射向皮肤，透过皮肤组织反射回的光被光敏传感器PD接受并转换成电信号再经过AD转换成数字信号，对数字信号进行分析便可以得到人体的心率、血氧、呼吸率等参数。FIG. 2 is a schematic diagram of the measurement principle of the PPG module of the wearable device. As shown in Figure 2, when the LED light shines on the skin, the light reflected back through the skin tissue is received by the photosensitive sensor PD and converted into an electrical signal and then converted into a digital signal by AD. By analyzing the digital signal, the human body's heart rate can be obtained , blood oxygen, respiratory rate and other parameters.
图3为示例性示出的目前一种PPG模组的结构示意图。如图3所示，目前的一种PPG模组101包括第一电路板102和第二电路板103，第一电路板102和第二电路板103均包括相对的第一面和第二面，第一电路板102的第二面和第二电路板103的第一面通过焊球50彼此连接并实现互连。Figure 3 is a schematic structural diagram of a current PPG module. As shown in Figure 3, a current PPG module 101 includes a first circuit board 102 and a second circuit board 103. Both the first circuit board 102 and the second circuit board 103 include opposite first and second sides. The second side of the first circuit board 102 and the first side of the second circuit board 103 are connected to each other and interconnected through solder balls 50 .
在第一电路板101的第一面上设置有光发射元件10和光接收元件20。光发射元件10可以包括第一发光元件11、第二发光元件12和第三发光元件13。第一发光元件11例如包括红外LED元件，第二发光元件12例如包括红光LED元件，第三发光元件13例如包括绿光LED元件。光接收元件20例如为光电二极管。光发射元件10和光接收元件20可以通过固晶工艺设置在第一电路板102上，并且通过打线工艺（wire bonding）将光发射元件10的电极（阳极和/或阴极）与第一电路板101上的焊盘30实现互连。在第一电路板101上在光发射元件10和光接收元件20之间还设置有隔光元件40，通过隔光元件40可以防止光发射元件10发出光未经皮肤反射直接被光接收元件20接收，从而影响测量结果。A light emitting element 10 and a light receiving element 20 are provided on the first surface of the first circuit board 101 . The light emitting element 10 may include a first light emitting element 11 , a second light emitting element 12 and a third light emitting element 13 . The first light-emitting element 11 includes, for example, an infrared LED element, the second light-emitting element 12 includes, for example, a red LED element, and the third light-emitting element 13 includes, for example, a green LED element. The light receiving element 20 is a photodiode, for example. The light emitting element 10 and the light receiving element 20 can be disposed on the first circuit board 102 through a die bonding process, and the electrodes (anode and/or cathode) of the light emitting element 10 are connected to the first circuit board through a wire bonding process. Pads 30 on 101 provide interconnection. A light-blocking element 40 is also provided on the first circuit board 101 between the light-emitting element 10 and the light-receiving element 20. The light-blocking element 40 can prevent the light emitted by the light-emitting element 10 from being directly received by the light-receiving element 20 without being reflected by the skin. , thus affecting the measurement results.
如图3所示，示例性地，光发射元件10的高度约为0.15mm，隔光元件40的高度约为0.45mm。这样由于隔光元件40与光发射元件10存在一定高度差，可以使得光发射元件10发出的光不会被光接收元件20接收，而是经过被测者或佩戴者皮肤反射后再被光接收元件20接收。As shown in FIG. 3 , for example, the height of the light emitting element 10 is about 0.15 mm, and the height of the light blocking element 40 is about 0.45 mm. In this way, since there is a certain height difference between the light-isolating element 40 and the light-emitting element 10, the light emitted by the light-emitting element 10 will not be received by the light-receiving element 20, but will be reflected by the skin of the subject or wearer and then be received by the light. Element 20 receives.
在图3所示示例中，第一电路板102采用低热膨胀系数高介电常数的材料制作，第一电路板102的热膨胀系数与光发射元件10和光接收元件20的热膨胀系数接近，这样可以减少光发射元件10和光接收元件20与第一电路板102之间的热失配问题，缓解光发射元件10和光接收元件20的应力问题，降低工作过程中因热失配和应力问题导致的封装开裂或脱离问题。In the example shown in FIG. 3 , the first circuit board 102 is made of a material with low thermal expansion coefficient and high dielectric constant. The thermal expansion coefficient of the first circuit board 102 is close to the thermal expansion coefficient of the light emitting element 10 and the light receiving element 20 , which can reduce The thermal mismatch problem between the light emitting element 10 and the light receiving element 20 and the first circuit board 102 alleviates the stress problem of the light emitting element 10 and the light receiving element 20 and reduces package cracking caused by thermal mismatch and stress problems during the working process. Or disengage from the problem.
如图3所示，在第二电路板103的第二面上设置有PPG模组的其它电子器件60，例如AFE（模拟前端芯片）、模拟IC芯片、电容、电阻、电感。光发射元件10、光接收元件20和器件60通过第一电路板102和第二电路板103内的布线彼此互连。As shown in FIG. 3 , other electronic devices 60 of the PPG module are provided on the second surface of the second circuit board 103 , such as AFE (analog front-end chip), analog IC chips, capacitors, resistors, and inductors. The light emitting element 10 , the light receiving element 20 and the device 60 are interconnected with each other through wiring within the first circuit board 102 and the second circuit board 103 .
示例性地，第二电路板103采用常规热膨胀系数的材料制作。For example, the second circuit board 103 is made of a material with a conventional thermal expansion coefficient.
如图3所示，第一电路板102和第二电路板103的高度约为0.57mm（0.17mm+0.4mm），高度较高。As shown in FIG. 3 , the height of the first circuit board 102 and the second circuit board 103 is about 0.57mm (0.17mm+0.4mm), which is relatively high.
对于图3所示的PPG模组而言，虽然降低了热失配问题和应力问题，但是模组高度仍然较高，不利于器件的轻薄化趋势，并且第一电路板102和第二电路板103之间的热失配可能导致焊球50脱落，进而导致模组失效。For the PPG module shown in Figure 3, although the thermal mismatch problem and stress problem are reduced, the height of the module is still high, which is not conducive to the thinning trend of the device, and the first circuit board 102 and the second circuit board The thermal mismatch between 103 may cause the solder balls 50 to fall off, causing module failure.
本申请实施例基于以上描述，提出一种改进的PPG模组及其制作方法，以进一步降低PPG模组的高度/厚度，从而便于试下可穿戴设备的轻薄化，并且进一步光发射元件和光接收元件面对较高封装应力的风险。Based on the above description, the embodiment of the present application proposes an improved PPG module and its manufacturing method to further reduce the height/thickness of the PPG module, thereby facilitating the thinning of wearable devices, and further improving the light emitting element and light receiving Components are at risk of higher packaging stress.
图4为本申请实施例提供的PPG模组的示意性俯视图；图5为本申请实施例提供的PPG模组的示意性截面图。FIG. 4 is a schematic top view of the PPG module provided by the embodiment of the present application; FIG. 5 is a schematic cross-sectional view of the PPG module provided by the embodiment of the present application.
参考图4和图5，本申请实施例提供的PPG模组200包括电路板201以及嵌入在电路板201内的光发射元件10和光接收元件20。光发射元件10可以向用户的皮肤发射光线。光线的一部分被用户的皮肤吸收，另一部分被用户的皮肤反射。光线中发生反射的部分会被光接收元件20接收。经过对光线反射的部分进行分析处理，可以获得用户的体征信息。Referring to FIGS. 4 and 5 , the PPG module 200 provided by the embodiment of the present application includes a circuit board 201 and a light emitting element 10 and a light receiving element 20 embedded in the circuit board 201 . The light emitting element 10 can emit light toward the user's skin. Part of the light is absorbed by the user's skin and part is reflected by the user's skin. The reflected part of the light will be received by the light receiving element 20 . By analyzing and processing the reflected light, the user's physical information can be obtained.
电路板201可以是印制电路板(Printed Circuit Board，PCB)。电路板201的厚度例如为0.41mm-0.42mm。电路板201可以采用常用材料制作，在此不做具体限制。在本申请实施例中，在电路板201的正面中形成有第一容纳孔21和第二容纳孔22。光发射元件10嵌入在第一容纳孔21中。光接收元件20嵌入在第二容纳孔22中。在此我们定义光发射元件10发出光线的一侧为电路板201的正面或第一面，与正面相对的一面称为电路板201的背面或第二面。第一容纳孔21和第二容纳孔22的深度例如为0.4mm，略大于光发射元件10和光接收元件20的高度。即光发射元件10和光接收元件20的顶部略低于电路板201的正面。The circuit board 201 may be a printed circuit board (PCB). The thickness of the circuit board 201 is, for example, 0.41mm-0.42mm. The circuit board 201 can be made of commonly used materials, and is not specifically limited here. In the embodiment of the present application, a first receiving hole 21 and a second receiving hole 22 are formed in the front surface of the circuit board 201 . The light emitting element 10 is embedded in the first receiving hole 21 . The light receiving element 20 is embedded in the second receiving hole 22 . Here we define the side from which the light-emitting element 10 emits light as the front or first side of the circuit board 201, and the side opposite to the front as the back or second side of the circuit board 201. The depth of the first receiving hole 21 and the second receiving hole 22 is, for example, 0.4 mm, which is slightly larger than the height of the light emitting element 10 and the light receiving element 20 . That is, the tops of the light emitting element 10 and the light receiving element 20 are slightly lower than the front surface of the circuit board 201 .
在本申请实施例中，光发射元件10和光接收元件20均设置在基板202上。即光发射元件10和光接收元件20通过固晶工艺设置在基板202上。基板202采用低热膨胀系数和高介电常数的材料，例如基板202可以采用陶瓷基板、可伐合金基板、玻璃填料占比高的FR4基板等low-CTE（低热膨胀系数）基板。示例性地，在本申请实施例中，基板202的热膨胀系数（XY方向）小于等于10 ppm/℃，例如为2、3、4、5、6、7或8 ppm/℃。这样由于基板202的热膨胀系数与光发射元件10和光接收元件20的热膨胀系数接近，可以解决基板202与光发射元件10和光接收元件20热失配问题，降低裸芯片（die，即光发射元件10和光接收元件20）面对较高封装应力的风险，提高器件的可靠性，避免光发射元件10和/或光接收元件20因热失配和应力问题导致脱落。In the embodiment of the present application, both the light emitting element 10 and the light receiving element 20 are arranged on the substrate 202 . That is, the light emitting element 10 and the light receiving element 20 are arranged on the substrate 202 through a crystal bonding process. The substrate 202 is made of a material with low thermal expansion coefficient and high dielectric constant. For example, the substrate 202 can be a low-CTE (low coefficient of thermal expansion) substrate such as a ceramic substrate, a Kovar alloy substrate, an FR4 substrate with a high proportion of glass filler. Illustratively, in the embodiment of the present application, the thermal expansion coefficient (XY direction) of the substrate 202 is less than or equal to 10 ppm/°C, such as 2, 3, 4, 5, 6, 7 or 8 ppm/°C. In this way, since the thermal expansion coefficient of the substrate 202 is close to the thermal expansion coefficient of the light-emitting element 10 and the light-receiving element 20 , the problem of thermal mismatch between the substrate 202 and the light-emitting element 10 and the light-receiving element 20 can be solved, and the bare chip (die, that is, the light-emitting element 10 and light-receiving element 20) face the risk of higher packaging stress, improve the reliability of the device, and prevent the light-emitting element 10 and/or the light-receiving element 20 from falling off due to thermal mismatch and stress problems.
基板202的厚度为0.1-0.2mm，例如为0.1mm、0.15mm或0.2mm。由于光发射元件10和光接收元件20设置在基板202上，为了将光发射元件10和光接收元件20嵌入电路板201中，在电路板201的背面对应基板202的形状和尺寸开设第三容纳孔23。第一容纳孔21和第二容纳孔22均与对应的第三容纳孔23连通。并且第三容纳孔23的孔径大于第一容纳孔21和第二容纳孔22的孔径，且以光发射元件10或光接收元件20为参照，第三容纳孔23的边缘位于第一容纳孔21和第二容纳孔22的外侧。The thickness of the substrate 202 is 0.1-0.2mm, such as 0.1mm, 0.15mm or 0.2mm. Since the light emitting element 10 and the light receiving element 20 are disposed on the substrate 202, in order to embed the light emitting element 10 and the light receiving element 20 into the circuit board 201, a third receiving hole 23 is opened on the back of the circuit board 201 corresponding to the shape and size of the substrate 202. . The first receiving hole 21 and the second receiving hole 22 are both connected with the corresponding third receiving hole 23 . Moreover, the aperture of the third receiving hole 23 is larger than the apertures of the first receiving hole 21 and the second receiving hole 22 , and with the light emitting element 10 or the light receiving element 20 as a reference, the edge of the third receiving hole 23 is located at the first receiving hole 21 and the outside of the second receiving hole 22 .
基板202可以通过粘结剂与电路板201粘结，从而将光发射元件10或光接收元件20嵌入电路板201上对应的容纳孔中。在本申请实施例中，所示PPG模组相比，本申请实施例中的模组仅需要使用一块电路板，无需配置转接板，因此大大降低了模组高度，并且由于将光发射元件10和光接收元件20嵌入电路板201中，因此PPG模组的厚度进一步降低，这使得PPG模组200的总体高度/厚度至少降低约300μm。The substrate 202 can be bonded to the circuit board 201 through an adhesive, thereby embedding the light emitting element 10 or the light receiving element 20 into the corresponding receiving hole on the circuit board 201 . Compared with the PPG module shown in the embodiment of the present application, the module in the embodiment of the present application only needs to use one circuit board and does not need to configure an adapter board. Therefore, the height of the module is greatly reduced, and because the light emitting element is 10 and the light receiving element 20 are embedded in the circuit board 201, so the thickness of the PPG module is further reduced, which reduces the overall height/thickness of the PPG module 200 by at least about 300 μm.
在本申请实施例中，光发射元件10包括发光单元(图中未示出)。发光单元在通电状态下可以发射光线，例如激光、可见光(例如绿光或红光)或红外线等。示例性地，发光单元可以包括但不限于发光二极管(light emitting diode，LED)。在PPG模组200需要采集用户体征信息时，光发射元件10的发光单元可以向用户的皮肤发射光线。光发射元件10的第一容纳孔21可以避让光发射元件10，保证光发射元件10出射的光线不会受到电路板201遮挡。光线的一部分被用户的皮肤吸收，一部分被用户的皮肤反射。光线中反射的部分会被位于第二容纳孔22中的光接收元件20接收。In the embodiment of the present application, the light emitting element 10 includes a light emitting unit (not shown in the figure). The light-emitting unit can emit light, such as laser, visible light (such as green light or red light) or infrared ray when powered on. For example, the light emitting unit may include, but is not limited to, a light emitting diode (LED). When the PPG module 200 needs to collect the user's physical information, the light-emitting unit of the light-emitting element 10 can emit light to the user's skin. The first receiving hole 21 of the light emitting element 10 can avoid the light emitting element 10 to ensure that the light emitted from the light emitting element 10 will not be blocked by the circuit board 201 . Part of the light is absorbed by the user's skin and part is reflected by the user's skin. The reflected part of the light will be received by the light receiving element 20 located in the second receiving hole 22 .
示例性地，在本申请实施例中，光发射元件10包括第一发光元件11、第二发光元件12和第三发光元件13。第一发光元件11例如包括可以发射红外光的发光单元。第二发光元件12例如包括可以发射红光的发光单元。第三发光元件13例如包括可以发射绿光的发光单元。Illustratively, in the embodiment of the present application, the light emitting element 10 includes a first light emitting element 11 , a second light emitting element 12 and a third light emitting element 13 . The first light-emitting element 11 includes, for example, a light-emitting unit that can emit infrared light. The second light-emitting element 12 includes, for example, a light-emitting unit that can emit red light. The third light-emitting element 13 includes, for example, a light-emitting unit that can emit green light.
应当理解的是，对于光发射元件10而言，第一发光元件11、第二发光元件12和第三发光元件13可以共用同一个基板202，也可以单独使用各自的基板202。示例性地，在本申请一实施例中，第一发光元件11、第二发光元件12和第三发光元件13共用同一个基板202。It should be understood that for the light-emitting element 10, the first light-emitting element 11, the second light-emitting element 12 and the third light-emitting element 13 can share the same substrate 202, or can use separate substrates 202. For example, in an embodiment of the present application, the first light-emitting element 11 , the second light-emitting element 12 and the third light-emitting element 13 share the same substrate 202 .
示例性地，在本申请实施例中，光发射元件10和光接收元件20均包括两个电极，例如包括阳极14和阴极15。示例性地，在本申请实施例中，光发射元件10和光接收元件20的两个电极均设置在同一侧，例如均设置在顶部。光发射元件10和光接收元件20的两个电极分别通过互连线与电路板201上的焊盘30连接。并且由于光发射元件10和光接收元件20的两个电极均设置在顶部，其与电路板201上焊盘30距离较短，因此正在本申请实施例中，高度差极小的绑定（wire bonding）打线，可以降低光发射元件10和光接收元件20与供电电源之间的互连路径，降低信号传输损耗和功率损耗，提高模组性能，降低功耗。Illustratively, in the embodiment of the present application, both the light emitting element 10 and the light receiving element 20 include two electrodes, such as an anode 14 and a cathode 15 . Illustratively, in the embodiment of the present application, the two electrodes of the light emitting element 10 and the light receiving element 20 are both disposed on the same side, for example, both are disposed on the top. The two electrodes of the light emitting element 10 and the light receiving element 20 are respectively connected to the pads 30 on the circuit board 201 through interconnection lines. And since the two electrodes of the light emitting element 10 and the light receiving element 20 are both arranged on the top, and the distance between them and the pads 30 on the circuit board 201 is short, in the embodiment of the present application, the height difference is extremely small (wire bonding). ) wiring can reduce the interconnection path between the light emitting element 10 and the light receiving element 20 and the power supply, reduce signal transmission loss and power loss, improve module performance, and reduce power consumption.
示例性地，本申请实施例中，PPG模组200包括3个光发射元件10和4个光接收元件20，其中一个光接收元件20位于电路板201的中心，其余3个光发射元件和3个光接收元件20围绕中心的光接收元件20周向间隔布置。Illustratively, in the embodiment of the present application, the PPG module 200 includes 3 light-emitting elements 10 and 4 light-receiving elements 20. One of the light-receiving elements 20 is located in the center of the circuit board 201, and the remaining 3 light-emitting elements and 3 The light receiving elements 20 are circumferentially spaced around the central light receiving element 20 .
应当理解光发射元件10和光接收元件20的数量是示例性地，在本申请其它实施例中，也可以布置其它合适的数量的光发射元件10和光接收元件20。在本申请实施例中，主要在于在中心布置一个光接收元件20，然后以此为圆心，在周向间隔布置光发射元件10和光接收元件20。It should be understood that the number of the light emitting elements 10 and the light receiving elements 20 is exemplary, and in other embodiments of the present application, other suitable numbers of the light emitting elements 10 and the light receiving elements 20 may also be arranged. In the embodiment of the present application, the main method is to arrange a light-receiving element 20 in the center, and then use this as the center of the circle to arrange the light-emitting element 10 and the light-receiving element 20 at intervals in the circumferential direction.
应当理解的是，对于光发射元件10和光接收元件20而言，其可以共用同一个基板202，也可以单独使用各自的基板202。示例性地，在本申请一实施例中，每个光发射元件10和光接收元件20均布置在各自的基板202上。当然，在其它实施例中，也可以将所有光发射元件10和光接收元件20均布置在同一个基板202上，或者将周向上的光发射元件10和光接收元件20布置在同一个基板202上。It should be understood that the light emitting element 10 and the light receiving element 20 may share the same substrate 202, or they may use separate substrates 202. Illustratively, in an embodiment of the present application, each light emitting element 10 and light receiving element 20 are arranged on a respective substrate 202 . Of course, in other embodiments, all the light emitting elements 10 and the light receiving elements 20 can also be arranged on the same substrate 202 , or the light emitting elements 10 and the light receiving elements 20 in the circumferential direction can be arranged on the same substrate 202 .
请再次参考图5，在本申请实施例中，在电路板201的背面还设置有电子器件60，例如AFE（模拟前端芯片）、模拟IC芯片、电容、电阻、电感。Please refer to Figure 5 again. In the embodiment of the present application, electronic devices 60 are also provided on the back of the circuit board 201, such as AFE (analog front-end chip), analog IC chips, capacitors, resistors, and inductors.
应当理解的是，在本实施例中，基板202内并未设置布线，光发射元件10、光接收元件20和电子器件60通过电路板201内的布线彼此互连。为此相比目前的PPG模组（例如图3所示的模组），需要在设计过程中重构电路板布线层，保证电路板201互连设计时预留光发射元件10（LED模组）和光接收元件20（例如PD器件）的位置，在该位置上禁止布线，同时在光发射元件10（LED模组）和光接收元件20（例如PD器件）附近就近预留绿油开窗焊盘30。It should be understood that in this embodiment, no wiring is provided in the substrate 202 , and the light emitting element 10 , the light receiving element 20 and the electronic device 60 are interconnected with each other through the wiring in the circuit board 201 . For this reason, compared with the current PPG module (such as the module shown in Figure 3), it is necessary to reconstruct the circuit board wiring layer during the design process to ensure that the light emitting element 10 (LED module) is reserved during the circuit board 201 interconnection design. ) and light-receiving element 20 (such as PD device), wiring is prohibited at this position, and green oil window pads are reserved near the light-emitting element 10 (LED module) and light-receiving element 20 (such as PD device). 30.
下面结合图6-图8对本申请实施例提供的一种PPG模组的制作方法进行描述。The following describes a method for manufacturing a PPG module provided by an embodiment of the present application with reference to Figures 6-8.
如图6所示，本申请实施例提供的一种PPG模组的制作方法，包括：As shown in Figure 6, a method for manufacturing a PPG module provided by an embodiment of the present application includes:
步骤S601，提供电路板，并在电路板上制作光学器件容纳孔；Step S601, provide a circuit board and make an optical device receiving hole on the circuit board;
步骤S602，将光学器件附接在基板上；Step S602, attach the optical device to the substrate;
步骤S603，在基板上布置粘结剂，并将基板装配在电路板上；Step S603, arrange adhesive on the substrate and assemble the substrate on the circuit board;
步骤S604，通过打线工艺实现光学器件与电路板的电气互连；Step S604, realize the electrical interconnection between the optical device and the circuit board through the wiring process;
步骤S605，通过贴片工艺将其它电子器件安装在电路板上。Step S605: Install other electronic components on the circuit board through a patch process.
在步骤S601中，在设计过程中重构电路板的布线层，保证电路板201互连设计时预留光发射元件10（LED模组）和光接收元件20（例如PD器件）的位置，在该位置上禁止布线，同时在光发射元件10（LED模组）和光接收元件20（例如PD器件）附近就近预留绿油开窗焊盘30。In step S601, the wiring layer of the circuit board is reconstructed during the design process to ensure that the positions of the light emitting element 10 (LED module) and the light receiving element 20 (such as a PD device) are reserved during the interconnection design of the circuit board 201. Wiring is prohibited at the location, and green oil window pads 30 are reserved nearby the light-emitting element 10 (LED module) and the light-receiving element 20 (such as PD device).
示例性地，可以采用机械转孔或激光打孔的方式在电路板201板上对应光发射元件10和光接收元件20的布置位置打孔，以形成器件容纳孔来供光发射元件10和光接收元件20嵌入其中。对于光接收元件20（例如PD器件）的位置，打孔尺寸略大于器件尺寸，对于光发射元件10（例如LED器件）的位置，先在电路板201背侧打孔，孔径尺寸略大于整个光发射元件10（红/绿/红外）的尺寸，打孔深度为100-200μm，保证基板202的厚度与打孔厚度持平，并正好嵌入在电路板201的背侧，同时在电路板201的正面打通孔至电路板201的背侧，背侧打孔的直径尺寸应该保证基板202边沿略大于正面打孔的边沿位置，方便后续基板202与电路板201的固定和连接。For example, mechanical drilling or laser drilling can be used to drill holes on the circuit board 201 corresponding to the arrangement positions of the light emitting element 10 and the light receiving element 20 to form device receiving holes for the light emitting element 10 and the light receiving element. 20 embedded in it. For the position of the light receiving element 20 (such as a PD device), the hole size is slightly larger than the device size. For the position of the light emitting element 10 (such as an LED device), first drill a hole on the back side of the circuit board 201, and the aperture size is slightly larger than the entire light The size of the emitting element 10 (red/green/infrared), the punching depth is 100-200μm, ensure that the thickness of the substrate 202 is equal to the punching thickness, and is just embedded on the back side of the circuit board 201, and at the same time on the front side of the circuit board 201 Drill the hole to the back side of the circuit board 201. The diameter of the hole on the back side should ensure that the edge of the substrate 202 is slightly larger than the edge of the front hole to facilitate the subsequent fixing and connection of the substrate 202 and the circuit board 201.
如图7所示，在电路板201的正面制作有第一容纳孔21和第二容纳孔22，在电路板201的背面制作有第三容纳孔23。对于光接收元件20而言，其第三容纳孔23的径向尺寸略大于光接收元件20的基板202的径向尺寸，其第二容纳孔22的径向尺寸略大于光接收元件20的径向尺寸，且略小于其第三容纳孔23的径向尺寸。对于光发射元件10而言，其第一容纳孔21的径向尺寸略大于各自对应的发光元件（例如第一发光元件11）的径向尺寸，其第三容纳孔23径向尺寸略大于光发射元件10的基板202（三个发光元件共用一个基板）的径向尺寸，并且第三容纳孔23的边缘位于各发光元件的第一容纳孔的边缘之外。As shown in FIG. 7 , the first receiving hole 21 and the second receiving hole 22 are formed on the front side of the circuit board 201 , and the third receiving hole 23 is formed on the back side of the circuit board 201 . For the light receiving element 20, the radial size of the third receiving hole 23 is slightly larger than the radial size of the substrate 202 of the light receiving element 20, and the radial size of the second receiving hole 22 is slightly larger than the diameter of the light receiving element 20. The radial size is slightly smaller than the radial size of the third receiving hole 23 . For the light-emitting element 10 , the radial size of the first receiving hole 21 is slightly larger than the radial size of the corresponding light-emitting element (for example, the first light-emitting element 11 ), and the radial size of the third receiving hole 23 is slightly larger than the light-emitting element 10 . The radial size of the substrate 202 of the emitting element 10 (three light-emitting elements share one substrate), and the edge of the third receiving hole 23 is located outside the edge of the first receiving hole of each light-emitting element.
在步骤S602中，可以通过固晶工艺光发射元件10（LED模组）和光接收元件20（例如PD器件）附接在陶瓷基板202上，光发射元件10（LED模组）和光接收元件20（例如PD器件）的固定位置要和电路板201上的容纳孔位置匹配，保证陶瓷基板202携带光发射元件10（LED模组）和光接收元件20（例如PD器件）装配在电路板201上时，光发射元件10（LED模组）和光接收元件20（例如PD器件）顺利穿过电路板201上对应的光学器件容纳孔，并与光学器件容纳孔的两侧保持适当距离，保证下一步打线工艺的正常进行。In step S602, the light-emitting element 10 (LED module) and the light-receiving element 20 (for example, a PD device) can be attached to the ceramic substrate 202 through a die-bonding process. The light-emitting element 10 (LED module) and the light-receiving element 20 ( The fixed position (for example, a PD device) must match the position of the receiving hole on the circuit board 201 to ensure that when the ceramic substrate 202 carries the light emitting element 10 (LED module) and the light receiving element 20 (for example, a PD device) and is assembled on the circuit board 201, The light emitting element 10 (LED module) and the light receiving element 20 (such as a PD device) pass smoothly through the corresponding optical device receiving holes on the circuit board 201, and maintain an appropriate distance from both sides of the optical device receiving holes to ensure the next step of wiring. The process proceeds normally.
在步骤S603中，如图7所示，在基板202的外侧一周涂覆粘结剂70，例如3M双面胶预粘贴，然后将带有粘结剂70的基板202从电路板201底部向上装配，光学器件向上穿过光学器件容纳孔，粘结剂70粘接基板202和电路板201的接触位置，从而将光发射元件10（LED模组）和光接收元件20（例如PD器件）嵌入电路板201中。In step S603, as shown in FIG. 7, adhesive 70 is applied around the outside of the substrate 202, such as 3M double-sided tape pre-pasting, and then the substrate 202 with the adhesive 70 is assembled upward from the bottom of the circuit board 201. , the optical device passes upward through the optical device receiving hole, and the adhesive 70 bonds the contact position of the substrate 202 and the circuit board 201, thereby embedding the light emitting element 10 (LED module) and the light receiving element 20 (such as a PD device) into the circuit board 201 in.
在步骤S604中，如图8所示，通过打线工艺将光发射元件10（LED模组）和光接收元件20（例如PD器件）的阳极14和阴极15与电路板201上的对应焊盘连接，从而实现光发射元件10（LED模组）和光接收元件20（例如PD器件）与电路板201的电气互连。In step S604, as shown in Figure 8, the anode 14 and cathode 15 of the light emitting element 10 (LED module) and the light receiving element 20 (such as a PD device) are connected to the corresponding pads on the circuit board 201 through a wiring process. , thereby realizing the electrical interconnection between the light emitting element 10 (LED module) and the light receiving element 20 (such as PD device) and the circuit board 201.
在步骤S605中，如图8所示，通过贴片工艺，例如贴片焊接将电子器件60，例如电容、电阻、电感、AFE安装在电路板201的背面上。光发射元件10（LED模组）和光接收元件20（例如PD器件）通过电路板201内的布线与各个电子器件60互连。In step S605, as shown in FIG. 8, the electronic device 60, such as a capacitor, a resistor, an inductor, and an AFE, is mounted on the back of the circuit board 201 through a patch process, such as patch welding. The light emitting element 10 (LED module) and the light receiving element 20 (eg, PD device) are interconnected with each electronic device 60 through wiring in the circuit board 201 .
应当理解的是，上述各工艺步骤仅是用于说明本申请实施例的PPG模组的制作方法包括的步骤，而不表示这些步骤必须按上述顺序执行，例如步骤S602可以在步骤S601之前执行或同时执行，因为这些步骤可能在不同的厂家执行，例如步骤S602可以由提供光学器件的厂家执行，而步骤S601可以由电路板厂家执行。It should be understood that the above process steps are only used to illustrate the steps included in the manufacturing method of the PPG module according to the embodiment of the present application, and do not mean that these steps must be performed in the above order. For example, step S602 can be performed before step S601 or Performed at the same time, because these steps may be performed by different manufacturers, for example, step S602 may be performed by a manufacturer that provides optical devices, and step S601 may be performed by a circuit board manufacturer.
采用本申请实施例提供的PPG模组，其制作过程中由于不涉及两个电路板之间的连接，因此可以减少PPG模组二次运输和贴装的工艺风险。Using the PPG module provided by the embodiment of the present application, the manufacturing process does not involve the connection between two circuit boards, so the process risks of secondary transportation and mounting of the PPG module can be reduced.
下面结合图9-图12对本申请实施例提供的另一种PPG模组的制作方法进行描述。Another method for manufacturing a PPG module provided by an embodiment of the present application will be described below with reference to Figures 9-12.
如图9所示，本申请实施例提供的另一种PPG模组的制作方法，包括：As shown in Figure 9, another method for manufacturing a PPG module provided by an embodiment of the present application includes:
步骤S901，提供电路板，并在电路板上制作光学器件容纳孔；Step S901, provide a circuit board and make an optical device receiving hole on the circuit board;
步骤S902，将光学器件附接在基板上；Step S902, attach the optical device to the substrate;
步骤S903，在电路板的容纳孔中涂覆结构胶，并将基板装配在电路板上；Step S903, apply structural adhesive to the receiving hole of the circuit board, and assemble the substrate on the circuit board;
步骤S904，通过打线工艺实现光学器件与电路板的电气互连；Step S904, realize the electrical interconnection between the optical device and the circuit board through the wiring process;
步骤S905，通过贴片工艺将其它电子器件安装在电路板上。Step S905: Install other electronic components on the circuit board through a patch process.
本实施例的制作方法中，步骤S901、S902、S904和S905与前述步骤S601、S602、S604和S605相同或类似，在此不再赘述。In the manufacturing method of this embodiment, steps S901, S902, S904 and S905 are the same as or similar to the aforementioned steps S601, S602, S604 and S605, and will not be described again here.
在步骤S903中，首先，如图10所示，将电路板201倒置，即正面朝下背面朝上，通过诸如点胶等工艺将结构胶涂覆在容纳孔中与基板202的对应位置处，例如第三容纳孔23与第一容纳孔21或第二容纳孔22之间的台阶处；然后，如图11所示，将基板202向下装配至电路板201中，使光发射元件10（LED模组）和光接收元件20（例如PD器件）顺利穿过电路板201上对应的光学器件容纳孔并嵌入其中，基板202嵌入在对应的第三容纳孔23中。In step S903, first, as shown in Figure 10, the circuit board 201 is turned upside down, that is, the front side is facing down and the back side is facing up, and structural glue is applied in the receiving hole at a position corresponding to the substrate 202 through a process such as dispensing. For example, at the step between the third receiving hole 23 and the first receiving hole 21 or the second receiving hole 22; then, as shown in FIG. 11, the substrate 202 is assembled downwardly into the circuit board 201, so that the light emitting element 10 ( LED module) and the light receiving element 20 (such as a PD device) smoothly pass through the corresponding optical device receiving hole on the circuit board 201 and are embedded in it, and the substrate 202 is embedded in the corresponding third receiving hole 23.
接着，然后将电路板201正置并进行加固化，使结构胶粘结基板202和电路板201。Next, the circuit board 201 is placed upright and solidified, so that the structural adhesive bonds the substrate 202 and the circuit board 201 .
然后，执行步骤S904和S905，如图12所示，进行打线和贴装其他元器件操作。Then, steps S904 and S905 are executed, as shown in Figure 12, to perform wiring and mounting other components.
应当理解的是，虽然正在上述实施例中采用结构胶或双面胶来连接基板202和电路板201，但是本申请实施例并不限于这种方式，例如在其它实施例中，还可以在基板202与电路板201接触位置分别镀层和预留焊盘，然后通过Sn基钎料回流的方式进行互连。It should be understood that although structural glue or double-sided tape is used to connect the substrate 202 and the circuit board 201 in the above embodiments, the embodiments of the present application are not limited to this method. For example, in other embodiments, the substrate may also be connected The contact positions between 202 and the circuit board 201 are plated and pads are reserved respectively, and then interconnected by Sn-based solder reflow.
图13为本申请另一实施例提供的PPG模组的示意性截面图。Figure 13 is a schematic cross-sectional view of a PPG module provided by another embodiment of the present application.
如图13所示，本申请实施例提供的PPG模组300包括电路板201以及嵌入在电路板201内的光发射元件10和光接收元件20。光发射元件10可以向用户的皮肤发射光线。光线的一部分被用户的皮肤吸收，另一部分被用户的皮肤反射。光线中发生反射的部分会被光接收元件20接收。经过对光线反射的部分进行分析处理，可以获得用户的体征信息。As shown in FIG. 13 , the PPG module 300 provided by the embodiment of the present application includes a circuit board 201 and a light emitting element 10 and a light receiving element 20 embedded in the circuit board 201 . The light emitting element 10 can emit light toward the user's skin. Part of the light is absorbed by the user's skin and part is reflected by the user's skin. The reflected part of the light will be received by the light receiving element 20 . By analyzing and processing the reflected light, the user's physical information can be obtained.
PPG模组300的结构与PPG模组200的结构类似，不同之处在于电路板201由于布线减少，其厚度进一步地降低，例如为0.31-0.32mm，这样导致光发射元件10和/或光接收元件20的顶部高于电路板201的正面，为此为了防止光发射元件10发出的光直接被光接收元件20接收，可以在光发射元件10的周围设置隔光元件40，隔光元件40的高度以满足避免光发射元件10发出的光直接被光接收元件20接收的高度为要求，其具体高度取决于光发射元件10在电路板201中的嵌入深度，也即第一容纳孔21的深度。与图3所示的PPG模组101相比，由于无需转接板且光发射元件10和光接收元件20部分嵌入至电路板201内，因此PPG模组的整体高度/厚度仍然大大降低。The structure of the PPG module 300 is similar to the structure of the PPG module 200 . The difference is that due to the reduction in wiring, the thickness of the circuit board 201 is further reduced, for example, to 0.31-0.32 mm. This causes the light emitting element 10 and/or the light receiving The top of the component 20 is higher than the front of the circuit board 201. To prevent the light emitted by the light emitting component 10 from being directly received by the light receiving component 20, a light isolating component 40 can be set around the light emitting component 10. The light isolating component 40 can be The height is required to prevent the light emitted by the light emitting element 10 from being directly received by the light receiving element 20. The specific height depends on the embedded depth of the light emitting element 10 in the circuit board 201, that is, the depth of the first receiving hole 21. . Compared with the PPG module 101 shown in FIG. 3 , since no adapter board is required and the light emitting element 10 and the light receiving element 20 are partially embedded in the circuit board 201 , the overall height/thickness of the PPG module is still greatly reduced.
图14为本申请另一实施例提供的PPG模组的示意性截面图。Figure 14 is a schematic cross-sectional view of a PPG module provided by another embodiment of the present application.
如图14所示，本申请实施例的PPG模组400包括电路板301以及嵌入在电路板301内的光发射元件10和光接收元件20。光发射元件10可以向用户的皮肤发射光线。光线的一部分被用户的皮肤吸收，另一部分被用户的皮肤反射。光线中发生反射的部分会被光接收元件20接收。经过对光线反射的部分进行分析处理，可以获得用户的体征信息。As shown in FIG. 14 , the PPG module 400 in the embodiment of the present application includes a circuit board 301 and a light emitting element 10 and a light receiving element 20 embedded in the circuit board 301 . The light emitting element 10 can emit light toward the user's skin. Part of the light is absorbed by the user's skin and part is reflected by the user's skin. The reflected part of the light will be received by the light receiving element 20 . By analyzing and processing the reflected light, the user's physical information can be obtained.
PPG模组400的结构与PPG模组200的结构类似，不同之处在于在PPG模组400中，采用一体化设计，光发射元件10和光接收元件20直接嵌入在电路板301上的容纳孔中，并且固定在电路板301上。即在本申请实施例中，不再使用基板202来固定光发射元件10和光接收元件20。第一容纳孔21和第二容纳孔22的深度根据光发射元件10和光接收元件20的高度决定，保证光发射元件10发出的光不会直接被光接收元件20接收。The structure of the PPG module 400 is similar to the structure of the PPG module 200. The difference is that in the PPG module 400, an integrated design is adopted, and the light emitting element 10 and the light receiving element 20 are directly embedded in the receiving holes on the circuit board 301. , and fixed on the circuit board 301. That is, in the embodiment of the present application, the substrate 202 is no longer used to fix the light emitting element 10 and the light receiving element 20 . The depths of the first receiving hole 21 and the second receiving hole 22 are determined according to the heights of the light emitting element 10 and the light receiving element 20 to ensure that the light emitted by the light emitting element 10 will not be directly received by the light receiving element 20 .
在本申请实施例中，电路板301采用采用低热膨胀系数和高介电常数的材料，例如电路板301可以采用陶瓷基板或其它low-CTE（低热膨胀系数）基板。示例性地，在本申请实施例中，电路板301的热膨胀系数（XY方向）小于等于10 ppm/℃，例如为2、3、4、5、6、7或8ppm/℃。这样由于电路板301的热膨胀系数与光发射元件10和光接收元件20的热膨胀系数接近，可以解决电路板301与光发射元件10和光接收元件20热失配问题，降低裸芯片（die，即光发射元件10和光接收元件20）面对较高封装应力的风险，提高器件的可靠性，避免光发射元件10和/或光接收元件20因热失配和应力问题导致脱落。In this embodiment of the present application, the circuit board 301 is made of materials with low thermal expansion coefficient and high dielectric constant. For example, the circuit board 301 can be made of a ceramic substrate or other low-CTE (low coefficient of thermal expansion) substrate. For example, in the embodiment of the present application, the thermal expansion coefficient (XY direction) of the circuit board 301 is less than or equal to 10 ppm/℃, such as 2, 3, 4, 5, 6, 7 or 8 ppm/℃. In this way, since the thermal expansion coefficient of the circuit board 301 is close to the thermal expansion coefficient of the light emitting element 10 and the light receiving element 20, the thermal mismatch problem between the circuit board 301 and the light emitting element 10 and the light receiving element 20 can be solved, and the bare chip (die) can be reduced. The component 10 and the light-receiving component 20) face the risk of higher packaging stress, improve the reliability of the device, and prevent the light-emitting component 10 and/or the light-receiving component 20 from falling off due to thermal mismatch and stress problems.
需要说明的是，在本实施例中，电路板301是需要布线的，因此电路板301的材料需要能够布线或容易布线的low-CTE（低热膨胀系数）基板材料，例如陶瓷。It should be noted that in this embodiment, the circuit board 301 needs to be wired, so the material of the circuit board 301 needs to be a low-CTE (low coefficient of thermal expansion) substrate material that can be wired or is easy to wire, such as ceramics.
对本申请实施例的PPG模组400，其实现过程大致为首先，在设计过程中重构电路板301的布线层，保证电路板301互连设计时光发射元件10和光接收元件20的位置，在该位置上禁止布线，同时光发射元件10和光接收元件20的位置就近预留绿油开窗焊盘。然后采用机械转孔或激光打孔的方式在电路板301正面上打孔，孔径尺寸略大约光电器件的尺寸，打孔深度为400-500μm，保证光电器件可以顺利嵌入在电路板301的内部。接着，通过固晶工艺将光发射元件10和光接收元件20固定在电路板301板对应的容纳孔内，然后通过打线工艺实现光发射元件10和光接收元件20与电路板301的电气连接。For the PPG module 400 in the embodiment of the present application, the implementation process is roughly as follows: first, reconstruct the wiring layer of the circuit board 301 during the design process to ensure the positions of the light emitting element 10 and the light receiving element 20 in the interconnection design of the circuit board 301. Wiring is prohibited at the location, and green oil window pads are reserved nearby the light-emitting element 10 and the light-receiving element 20 . Then use mechanical drilling or laser drilling to drill holes on the front of the circuit board 301. The hole size is slightly about the size of the optoelectronic device, and the drilling depth is 400-500 μm to ensure that the optoelectronic device can be smoothly embedded inside the circuit board 301. Next, the light emitting element 10 and the light receiving element 20 are fixed in the corresponding receiving holes of the circuit board 301 through a die bonding process, and then the light emitting element 10 and the light receiving element 20 are electrically connected to the circuit board 301 through a wire bonding process.
本实施例的PPG模组400与PPG模组200或300相比，由于采用一体化的陶瓷基板或者其它低CTE基板可以进一步提高电路板布线的灵活性，并有助于厚度的进一步降低，在工艺上减少了低CTE基板材料和电路板结合步骤以及结合部的应力风险。Compared with the PPG module 200 or 300, the PPG module 400 of this embodiment uses an integrated ceramic substrate or other low-CTE substrate, which can further improve the flexibility of circuit board wiring and help further reduce the thickness. The process reduces the risk of stress in the bonding steps of low CTE substrate materials and circuit boards as well as the joints.
图15为本申请另一实施例提供的PPG模组的示意性截面图。Figure 15 is a schematic cross-sectional view of a PPG module provided by another embodiment of the present application.
如图15所示，本身器实施例提供的PPG模组包括500包括电路板301以及嵌入在电路板301内的光发射元件10和光接收元件20。光发射元件10可以向用户的皮肤发射光线。光线的一部分被用户的皮肤吸收，另一部分被用户的皮肤反射。光线中发生反射的部分会被光接收元件20接收。经过对光线反射的部分进行分析处理，可以获得用户的体征信息。As shown in FIG. 15 , the PPG module 500 provided by the present embodiment includes a circuit board 301 and a light emitting element 10 and a light receiving element 20 embedded in the circuit board 301 . The light emitting element 10 can emit light toward the user's skin. Part of the light is absorbed by the user's skin and part is reflected by the user's skin. The reflected part of the light will be received by the light receiving element 20 . By analyzing and processing the reflected light, the user's physical information can be obtained.
PPG模组500的结构与PPG模组400的结构类似，不同之处在于光发射元件10和光接收元件20采用垂直结构，即其阳极14和阴极15分别布置在器件的顶部和底部，底部的电机（例如阴极15）直接与电路板301连接，顶部的电极（例如阳极14）还是通过打线与电路板301正面的焊盘30连接。这样可以使PPG模组兼容光学器件更多的发光结构。The structure of PPG module 500 is similar to that of PPG module 400. The difference is that the light emitting element 10 and the light receiving element 20 adopt a vertical structure, that is, the anode 14 and the cathode 15 are respectively arranged at the top and bottom of the device, and the motor at the bottom (for example, the cathode 15) is directly connected to the circuit board 301, and the top electrode (for example, the anode 14) is connected to the pad 30 on the front side of the circuit board 301 through wire bonding. This can make the PPG module compatible with more light-emitting structures of optical devices.
此外，在本实施例中，对于光发射元件10而言，其第一发光元件11、第二发光元件12和第三发光元件13共用同一个第一容纳孔21，这样可以降低电路板301打孔的数量并提高固晶工艺器件贴装的空间和自由度。In addition, in this embodiment, for the light-emitting element 10, the first light-emitting element 11, the second light-emitting element 12 and the third light-emitting element 13 share the same first receiving hole 21, which can reduce the cost of the circuit board 301. The number of holes and improve the space and freedom of device mounting during the die-bonding process.
以上所述，以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。As mentioned above, the above embodiments are only used to illustrate the technical solution of the present application, but not to limit it. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still make the foregoing technical solutions. The technical solutions described in each embodiment may be modified, or some of the technical features may be equivalently replaced; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions in each embodiment of the present application.
| Application Number | Priority Date | Filing Date | Title |
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| CN202311268413.3ACN116991054B (en) | 2023-09-28 | 2023-09-28 | Optical device, manufacturing method thereof and wearable equipment |
| Application Number | Priority Date | Filing Date | Title |
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| CN202311268413.3ACN116991054B (en) | 2023-09-28 | 2023-09-28 | Optical device, manufacturing method thereof and wearable equipment |
| Publication Number | Publication Date |
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| CN116991054Atrue CN116991054A (en) | 2023-11-03 |
| CN116991054B CN116991054B (en) | 2024-03-08 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311268413.3AActiveCN116991054B (en) | 2023-09-28 | 2023-09-28 | Optical device, manufacturing method thereof and wearable equipment |
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| CP03 | Change of name, title or address | Address after:Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after:Honor Terminal Co.,Ltd. Country or region after:China Address before:3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong Patentee before:Honor Device Co.,Ltd. Country or region before:China |