技术领域Technical field
本发明涉及定向扬声器技术领域，具体涉及一种定向发声装置及其制作工艺。The present invention relates to the technical field of directional loudspeakers, and in particular to a directional sound emitting device and a manufacturing process thereof.
背景技术Background technique
目前，随着手机、电脑等电子设备超薄化的发展，传统的扬声器因其体积较大而限制了电子设备体积的进一步缩小，而屏幕发声装置能够通过屏幕的振动进行发声，有利于电子设备进一步的小型化。而屏幕定向发声装置能够进一步将屏幕发出的声音朝着特定的区域传播，更有利于保护电子设备使用者的隐私，防止声音干扰他人。At present, with the development of ultra-thin electronic equipment such as mobile phones and computers, traditional speakers limit the further reduction of the size of electronic equipment due to their large size. The screen sounding device can produce sound through the vibration of the screen, which is beneficial to electronic equipment. further miniaturization. The screen directional sound emitting device can further spread the sound emitted by the screen toward specific areas, which is more conducive to protecting the privacy of electronic device users and preventing the sound from disturbing others.
屏幕定向发声装置包括振动层、支撑结构和基材层，振动层和基材层相互贴合，支撑结构支撑于振动层和基材层之间，在振动层与基材层上均至少设置有一个电极层以与外部驱动电路相连，由外部电路进行供电，对基材层和振动层施加电压信号，驱动振动层上下振动发出超声波信号，超声波信号经空气自解调出可听声。The screen directional sound emitting device includes a vibration layer, a support structure and a base material layer. The vibration layer and the base material layer are bonded to each other. The support structure is supported between the vibration layer and the base material layer. Both the vibration layer and the base material layer are provided with at least An electrode layer is connected to an external drive circuit and is powered by the external circuit. It applies voltage signals to the base material layer and the vibration layer, driving the vibration layer to vibrate up and down to emit ultrasonic signals. The ultrasonic signals self-demodulate through the air to produce audible sound.
现有振动层和基材层相贴合后，支撑结构的端部与振动层或者是基材层之间是没有固定的，在振动层向上振动的过程中，会出现振动层与支撑结构相脱离或者支撑结构与基材层相脱离的情况，脱离形成的振动距离为无效振动距离，且该无效振动距离会造成整个定向发声装置发出的声音的失真度增高，还会造成装置驱动功率的增大。After the existing vibration layer and the base material layer are bonded together, the end of the support structure is not fixed to the vibration layer or the base material layer. During the upward vibration of the vibration layer, the vibration layer will be in contact with the support structure. In the case of detachment or the separation of the support structure from the base material layer, the vibration distance caused by the detachment is the invalid vibration distance, and this invalid vibration distance will cause an increase in the distortion of the sound emitted by the entire directional sound-generating device, and will also cause an increase in the drive power of the device. big.
因此，需要解决现有定向发声装置存在的声音失真度高、功率大等问题。Therefore, it is necessary to solve the problems of high sound distortion and high power of existing directional sound-generating devices.
发明内容Contents of the invention
本发明的目的在于提供一种消除了无效振动距离、降低声音失真及功率的定向发声装置及其制作工艺。The object of the present invention is to provide a directional sound emitting device and a manufacturing process that eliminates ineffective vibration distance and reduces sound distortion and power.
为实现上述目的，一方面，本发明提出了一种定向发声装置，所述装置包括基材层、多个支撑结构和振动层，所述支撑结构位于所述基材层和振动层之间，使所述基材层和振动层之间形成供所述振动层振动所需的空气间隙，所述支撑结构的一端形成于所述基材层靠近振动层的表面上，另一端与所述振动层靠近基材层的表面固定，或者所述支撑结构的一端形成于所述振动层靠近基材层的表面上，另一端与所述基材层靠近振动层的表面固定；所述基材层、支撑结构和振动层组合形成多个振动单元，每个所述振动单元的振动层在加载的交流电压作用下振动发出超声波，所述超声波在空气中自解调形成可听声。In order to achieve the above object, on the one hand, the present invention proposes a directional sound emitting device. The device includes a base material layer, a plurality of support structures and a vibration layer. The support structure is located between the base material layer and the vibration layer. An air gap required for the vibration layer to vibrate is formed between the base material layer and the vibration layer. One end of the support structure is formed on the surface of the base material layer close to the vibration layer, and the other end is connected to the vibration layer. The layer is fixed close to the surface of the base material layer, or one end of the support structure is formed on the surface of the vibration layer close to the base material layer, and the other end is fixed to the surface of the base material layer close to the vibration layer; the base material layer The support structure and the vibration layer are combined to form multiple vibration units. The vibration layer of each vibration unit vibrates under the action of a loaded AC voltage to emit ultrasonic waves. The ultrasonic waves self-demodulate in the air to form audible sound.
在一优选实施例中，所述装置还包括固定点，每个所述支撑结构对应一个所述固定点，所述支撑结构通过所述固定点与所述基材层的表面或者所述振动层的表面相固定。In a preferred embodiment, the device further includes a fixed point, and each support structure corresponds to one fixed point. The support structure is connected to the surface of the base material layer or the vibration layer through the fixed point. The surface phase is fixed.
在一优选实施例中，所述支撑结构的一端形成于所述基材层靠近振动层的表面上，另一端与所述振动层靠近基材层的表面固定时，所述固定点形成于所述支撑结构与所述振动层的表面相固定的端部上或者形成于所述振动层靠近基材层的表面上；所述支撑结构的一端形成于所述振动层靠近基材层的表面上，另一端与所述基材层靠近振动层的表面固定时，所述固定点形成于所述支撑结构与所述基材层的表面相固定的端部上或者形成于所述基材层靠近振动层的表面上。In a preferred embodiment, one end of the support structure is formed on the surface of the base material layer close to the vibration layer, and when the other end is fixed to the surface of the vibration layer close to the base material layer, the fixed point is formed on the surface of the base material layer. The end of the support structure that is fixed to the surface of the vibration layer or is formed on the surface of the vibration layer close to the base material layer; one end of the support structure is formed on the surface of the vibration layer close to the base material layer , when the other end is fixed to the surface of the base material layer close to the vibration layer, the fixed point is formed on the end where the support structure is fixed to the surface of the base material layer or is formed on the end of the base material layer close to on the surface of the vibrating layer.
在一优选实施例中，所述装置还包括位于所述基材层和振动层之间的固定层，所述支撑结构通过所述固定层与所述基材层的表面或者所述振动层的表面相固定。In a preferred embodiment, the device further includes a fixed layer located between the base material layer and the vibration layer, and the support structure passes through the surface of the fixed layer and the base material layer or the vibration layer. The surface phase is fixed.
在一优选实施例中，所述支撑结构的一端形成于所述基材层靠近振动层的表面上，另一端与所述振动层靠近基材层的表面固定时，所述固定层整面形成于所述振动层靠近基材层的表面上；所述支撑结构的一端形成于所述振动层靠近基材层的表面上，另一端与所述基材层靠近振动层的表面固定时，所述固定层整面形成于所述基材层靠近振动层的表面上。In a preferred embodiment, one end of the support structure is formed on the surface of the base material layer close to the vibration layer, and when the other end is fixed to the surface of the vibration layer close to the base material layer, the entire fixed layer is formed On the surface of the vibration layer close to the base material layer; one end of the support structure is formed on the surface of the vibration layer close to the base material layer, and the other end is fixed to the surface of the base material layer close to the vibration layer, so The fixed layer is formed on the entire surface of the base material layer close to the vibration layer.
在一优选实施例中，所述支撑结构的端部插入所述固定层与所述基材层的表面或者所述振动层的表面相接触。In a preferred embodiment, the end of the support structure is inserted into the fixed layer and comes into contact with the surface of the base material layer or the surface of the vibration layer.
另一方面，本发明提出了一种定向发声装置的制作工艺，所述工艺采用第一工艺或者第二工艺，所述第一工艺包括：On the other hand, the present invention proposes a manufacturing process of a directional sound emitting device, which process adopts a first process or a second process, and the first process includes:
S1，在基材层靠近振动层的表面上制作形成支撑结构；S1, make a support structure on the surface of the base material layer close to the vibration layer;
S2，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构与所述振动层靠近基材层的表面固定；S2, laminate the base material layer and the vibration layer as frames, and fix the support structure and the surface of the vibration layer close to the base material layer while laminating;
所述第二工艺包括：The second process includes:
S11，在振动层靠近基材层的表面上制作形成支撑结构；S11, make a support structure on the surface of the vibration layer close to the base material layer;
S21，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构与所述基材层靠近振动层的表面固定。S21: Fit the base material layer and the vibration layer as frames, and fix the support structure and the surface of the base material layer close to the vibration layer while joining.
在一优选实施例中，所述第一工艺包括：In a preferred embodiment, the first process includes:
S1a，在基材层上形成所述支撑结构，之后在每个支撑结构与所述振动层的表面相固定的端部上再制作形成固定点；S1a, forming the support structure on the base material layer, and then forming fixed points on the ends of each support structure that are fixed to the surface of the vibration layer;
S2a，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构通过所述固定点与所述振动层靠近基材层的表面固定；S2a, laminate the base material layer and the vibration layer as frames, and while laminating, fix the support structure to the surface of the vibration layer close to the base material layer through the fixing point;
或者所述第一工艺包括：Or the first process includes:
S1b，在基材层上形成所述支撑结构，且在振动层靠近基材层的表面上制作形成固定点，每个支撑结构对应一个固定点；S1b, form the support structure on the base material layer, and make fixed points on the surface of the vibration layer close to the base material layer, and each support structure corresponds to a fixed point;
S2b，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构通过所述固定点与所述振动层靠近基材层的表面固定；S2b, laminate the base material layer and the vibration layer as frames, and while laminating, fix the support structure to the surface of the vibration layer close to the base material layer through the fixing point;
或者所述第一工艺包括：Or the first process includes:
S1c，在基材层上形成所述支撑结构，且在振动层靠近基材层的表面上整面制作形成固定层；S1c, form the support structure on the base material layer, and form a fixed layer on the entire surface of the vibration layer close to the base material layer;
S2c，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构通过所述固定层与所述振动层靠近基材层的表面固定。S2c, laminate the base material layer and the vibration layer as frames, and fix the support structure through the fixing layer and the surface of the vibration layer close to the base material layer while laminating.
在一优选实施例中，所述第二工艺包括：In a preferred embodiment, the second process includes:
S11a，在振动层上形成所述支撑结构，之后在每个支撑结构与所述基材层的表面相固定的端部上再制作形成固定点；S11a, form the support structure on the vibration layer, and then form a fixed point on the end of each support structure that is fixed to the surface of the base material layer;
S21a，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构通过所述固定点与所述基材层靠近振动层的表面固定；S21a, laminate the base material layer and the vibration layer as frames, and while laminating, fix the support structure to the surface of the base material layer close to the vibration layer through the fixing point;
或者所述第二工艺包括：Or the second process includes:
S11b，在振动层上形成所述支撑结构，且在基材层靠近振动层的表面上制作形成固定点，每个支撑结构对应一个固定点；S11b, form the support structure on the vibration layer, and make fixed points on the surface of the base material layer close to the vibration layer, and each support structure corresponds to a fixed point;
S21b，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构通过所述固定点与所述基材层靠近振动层的表面固定；S21b, laminate the base material layer and the vibration layer as frames, and while laminating, fix the support structure to the surface of the base material layer close to the vibration layer through the fixing point;
或者所述第二工艺包括：Or the second process includes:
S11c，在振动层上形成所述支撑结构，且在基材层靠近振动层的表面上整面制作形成固定层；S11c, form the support structure on the vibration layer, and form a fixed layer on the entire surface of the base material layer close to the vibration layer;
S21c，将所述基材层和所述振动层做边框贴合，且贴合的同时将所述支撑结构通过所述固定层与所述基材层靠近振动层的表面固定。S21c, laminate the base material layer and the vibrating layer as frames, and fix the support structure through the fixing layer and the surface of the base material layer close to the vibrating layer while laminating.
在一优选实施例中，所述固定点或固定层采用丝印、曝光显影、转印、旋转喷涂、UV打印、立体喷涂、字符喷印工艺中的任意一种工艺实现，且所述基材层在所述固定点或固定层未固化前与振动层贴合。In a preferred embodiment, the fixed point or fixed layer is realized by any one of silk screen printing, exposure and development, transfer printing, spin spraying, UV printing, three-dimensional spraying, and character spray printing, and the base material layer Before the fixed point or fixed layer is cured, it is bonded to the vibration layer.
与现有技术相比，本发明具有如下有益效果：本发明在将基材层和振动层做边框贴合的同时，将支撑结构的上下两端分别与振动层和基材层固定到一起，使基材层和振动层贴合后，可以形成一个个稳定的振动单元，这样振动层在上下振动时不会与支撑结构相脱离，从而消除了振动层的无效振动距离，不仅可以降低整个定向发声装置的声音失真，还可以降低整个装置的驱动功率。Compared with the prior art, the present invention has the following beneficial effects: while the base material layer and the vibration layer are framed together, the upper and lower ends of the support structure are fixed to the vibration layer and the base material layer respectively. After the base material layer and the vibration layer are bonded, stable vibration units can be formed. In this way, the vibration layer will not be separated from the support structure when vibrating up and down, thus eliminating the ineffective vibration distance of the vibration layer and not only reducing the overall orientation. The sound distortion of the sound-generating device can also reduce the driving power of the entire device.
附图说明Description of drawings
图1为本发明定向发声装置的结构示意图；Figure 1 is a schematic structural diagram of the directional sound emitting device of the present invention;
图2为本发明实施例1的定向发声装置的结构示意图；Figure 2 is a schematic structural diagram of the directional sound emitting device according to Embodiment 1 of the present invention;
图3为本发明实施例2的定向发声装置的结构示意图；Figure 3 is a schematic structural diagram of a directional sound emitting device according to Embodiment 2 of the present invention;
图4为本发明实施例3的定向发声装置的结构示意图；Figure 4 is a schematic structural diagram of a directional sound emitting device according to Embodiment 3 of the present invention;
图5为本发明实施例4的定向发声装置的结构示意图；Figure 5 is a schematic structural diagram of a directional sound emitting device according to Embodiment 4 of the present invention;
图6为本发明实施例5的定向发声装置的结构示意图；Figure 6 is a schematic structural diagram of a directional sound emitting device according to Embodiment 5 of the present invention;
图7为本发明实施例6的定向发声装置的结构示意图；Figure 7 is a schematic structural diagram of a directional sound emitting device according to Embodiment 6 of the present invention;
图8为现有定向发声装置的振动层在振动时与支撑结构脱离的结构示意图；Figure 8 is a structural schematic diagram of the vibration layer of the existing directional sound-generating device detaching from the supporting structure when vibrating;
图9为本发明定向发声装置的振动层在振动时与支撑结构固定的结构示意图；Figure 9 is a schematic structural diagram of the vibration layer of the directional sound emitting device of the present invention being fixed to the supporting structure when vibrating;
图10为频率为100kHz的正弦电压激励时，本发明及现有的振动层位移随时间变化的曲线示意图；Figure 10 is a schematic diagram of the displacement curve of the vibration layer of the present invention and the existing one changing with time when a sinusoidal voltage with a frequency of 100 kHz is excited;
图11为本发明定向发声装置的制作工艺的第一工艺的流程示意图；Figure 11 is a schematic flow chart of the first process of the manufacturing process of the directional sound emitting device of the present invention;
图12为本发明定向发声装置的制作工艺的第二工艺的流程示意图。FIG. 12 is a schematic flowchart of the second process of the manufacturing process of the directional sound emitting device of the present invention.
附图标记为：The reference numbers are:
1、基材层，11、底座层，12、第一导电层，13、下边缘走线层，14、下绝缘层，2、支撑结构，3、振动层，31、振动基层，32、第二导电层，33、上边缘走线层，34、上绝缘层，4、空气间隙，5、固定点，6、固定层。1. Base material layer, 11. Base layer, 12. First conductive layer, 13. Lower edge wiring layer, 14. Lower insulation layer, 2. Support structure, 3. Vibration layer, 31. Vibration base layer, 32. Chapter Two conductive layers, 33, upper edge wiring layer, 34, upper insulating layer, 4, air gap, 5, fixed point, 6, fixed layer.
具体实施方式Detailed ways
下面对本发明的具体实施方式进行详细描述，但应当理解本发明的保护范围并不受具体实施方式的限制。Specific embodiments of the present invention will be described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.
除非另有其它明确表示，否则在整个说明书和权利要求书中，术语“包括”或其变换如“包含”或“包括有”等等将被理解为包括所陈述的元件或组成部分，而并未排除其它元件或其它组成部分。Unless expressly stated otherwise, throughout the specification and claims, the term "comprises" or its variations such as "comprises" or "comprising" will be understood to include the stated elements or components, and to Other elements or other components are not excluded.
结合图1~图7所示，本发明所揭示的一种定向发声装置，包括基材层1、多个支撑结构2和振动层3，其中，支撑结构2位于基材层1和振动层3之间，用于提供振动层3上下振动所需的空气间隙4。实施时，支撑结构2可以形成于基材层1靠近振动层3的表面上，也可以形成于振动层3靠近基材层1的表面上，优选形成于基材层1上，便于加工。As shown in FIGS. 1 to 7 , a directional sound emitting device disclosed in the present invention includes a base material layer 1 , a plurality of support structures 2 and a vibration layer 3 , wherein the support structures 2 are located in the base material layer 1 and the vibration layer 3 between them to provide the air gap 4 required for the vibration layer 3 to vibrate up and down. During implementation, the support structure 2 can be formed on the surface of the base material layer 1 close to the vibration layer 3, or can be formed on the surface of the vibration layer 3 close to the base material layer 1. It is preferably formed on the base material layer 1 to facilitate processing.
实施时，基材层1可以具体包括底座层11、第一导电层12、下边缘走线层13和下绝缘层14，其中，底座层11优选采用透明材质，可以选用玻璃材质，第一导电层12形成于底座层11靠近振动层3的表面上，实施时，优选采用金属导电层，如也可选用纳米银、METAL MESH（金属网格）、石墨烯、碳纳米管、ITO（氧化铟锡）导电层等中的任意一种材质，方阻越低越好，效率越高；下边缘走线层13形成于第一导电层12的靠近振动层3的表面的边沿上，实施时，其可以采用导电银浆，用于增强第一导电层12的导电性，且若第一导电层12导电性足够，可以省略。下绝缘层14整面形成于第一导电层12靠近振动层3的表面上且覆盖住下边缘走线层13，实施时，下绝缘层14可以采用绝缘油墨。当然，本发明对基材层1的具体结构不限，只要具备必要的底座层11和第一导电层12即可，其他可不做限制，且底座层11和第一导电层12的结构及材质也不限于这里所限定的，其他可提供支撑作用的底座层11及可导电的第一导电层12均适用本发明。During implementation, the base material layer 1 may specifically include a base layer 11, a first conductive layer 12, a lower edge wiring layer 13 and a lower insulating layer 14. The base layer 11 is preferably made of a transparent material, and may be made of glass. Layer 12 is formed on the surface of base layer 11 close to vibration layer 3. During implementation, it is preferable to use a metal conductive layer. For example, nano-silver, METAL MESH (metal mesh), graphene, carbon nanotubes, ITO (indium oxide) can also be used. tin) conductive layer, etc., the lower the sheet resistance, the better, and the higher the efficiency; the lower edge wiring layer 13 is formed on the edge of the surface of the first conductive layer 12 close to the vibration layer 3. During implementation, Conductive silver paste can be used to enhance the conductivity of the first conductive layer 12, and if the conductivity of the first conductive layer 12 is sufficient, it can be omitted. The lower insulating layer 14 is formed on the entire surface of the first conductive layer 12 close to the vibration layer 3 and covers the lower edge wiring layer 13. During implementation, the lower insulating layer 14 can use insulating ink. Of course, the present invention is not limited to the specific structure of the base material layer 1 , as long as it has the necessary base layer 11 and the first conductive layer 12 , other restrictions are not required, and the structure and material of the base layer 11 and the first conductive layer 12 are not limited. It is not limited to what is limited here. Other base layers 11 that can provide support and conductive first conductive layers 12 are suitable for the present invention.
实施时，振动层3可以具体包括振动基层31、第二导电层32、上边缘走线层33和上绝缘层34，其中，振动基层31实施时可以采用PET（聚对苯二甲酸乙二醇酯）、CPI（透明聚酰亚胺）、COP（环氧-聚丙烯共聚物）、UTG（超薄柔性玻璃盖板）等中的任意一种材质，第二导电层32形成于振动基层31靠近基材层1的表面上，实施时，同样优选采用金属导电层，如也可选用纳米银、METAL MESH（金属网格）、石墨烯、碳纳米管、ITO（氧化铟锡）导电层等，方阻越低越好，效率越高；上边缘走线层33形成于第二导电层32的靠近基材层1的表面的边沿上，实施时，其也可以采用导电银浆，用于增强第二导电层32的导电性，且若第二导电层32导电性足够，可以省略。上绝缘层34整面形成于第二导电层32靠近基材层1的表面上且覆盖住上边缘走线层33，实施时，上绝缘层34也可以采用绝缘油墨。当然，本发明对振动层3的具体结构不限，只要具备必要的振动基层31和第二导电层32即可，其他可不做限制，且振动基层31和第二导电层32的结构及材质也不限于这里所限定的，其他可提供振动作用的振动基层31及可导电的第二导电层32均适用本发明。实施时，基材层1和振动层3之间也可只设置一层绝缘层，绝缘层的设置位置也不限，只要能将基材层1的第一导电层12和振动层3的第二导电层32绝缘隔离开来即可。振动层3的厚度整体范围可为20um~250um，如优选采用25um、50um、75um、100um、125um、150um、188um厚度。During implementation, the vibration layer 3 may specifically include a vibration base layer 31, a second conductive layer 32, an upper edge wiring layer 33, and an upper insulating layer 34. The vibration base layer 31 may be implemented using PET (polyethylene terephthalate). ester), CPI (transparent polyimide), COP (epoxy-polypropylene copolymer), UTG (ultra-thin flexible glass cover), etc., the second conductive layer 32 is formed on the vibration base layer 31 On the surface close to the base material layer 1, during implementation, it is also preferred to use a metal conductive layer, such as nano-silver, METAL MESH (metal mesh), graphene, carbon nanotubes, ITO (indium tin oxide) conductive layers, etc. , the lower the sheet resistance, the better, and the higher the efficiency; the upper edge wiring layer 33 is formed on the edge of the second conductive layer 32 close to the surface of the base material layer 1. During implementation, it can also use conductive silver paste for The conductivity of the second conductive layer 32 is enhanced, and if the conductivity of the second conductive layer 32 is sufficient, it can be omitted. The upper insulating layer 34 is formed on the entire surface of the second conductive layer 32 close to the base material layer 1 and covers the upper edge wiring layer 33 . During implementation, the upper insulating layer 34 can also use insulating ink. Of course, the present invention is not limited to the specific structure of the vibration layer 3, as long as it has the necessary vibration base layer 31 and the second conductive layer 32, other restrictions are not required, and the structure and material of the vibration base layer 31 and the second conductive layer 32 are also not limited. Not limited thereto, other vibration base layers 31 and conductive second conductive layers 32 that can provide vibration are suitable for the present invention. During implementation, only one insulating layer may be provided between the base material layer 1 and the vibration layer 3, and the location of the insulating layer is not limited as long as the first conductive layer 12 of the base material layer 1 and the third conductive layer 12 of the vibration layer 3 can be connected. The two conductive layers 32 only need to be insulated and isolated. The overall thickness range of the vibration layer 3 can be 20um~250um. For example, the thickness of 25um, 50um, 75um, 100um, 125um, 150um or 188um is preferably used.
支撑结构2设置于基材层1和振动层3之间，实施时，其一端可以形成于基材层1的下绝缘层14靠近振动层3的表面上，或者其一端可以形成于振动层3的上绝缘层34靠近基材层1的表面上。优选形成于下绝缘层14上。实施时，支撑结构2也可以采用绝缘油墨材质。且实施时，支撑结构2也可以是绝缘凸点，振动层3和基材层1相边框贴合后，因支撑结构2的存在，两者之间形成有供振动层3上下振动所需的空气间隙4。且贴合后，振动层3、多个支撑结构2和基材层1形成多个振动单元，振动单元优选按阵列排布，形成参量阵扬声器。The support structure 2 is provided between the base material layer 1 and the vibration layer 3 . During implementation, one end of the support structure 2 can be formed on the surface of the lower insulating layer 14 of the base material layer 1 close to the vibration layer 3 , or one end of the support structure 2 can be formed on the vibration layer 3 The upper insulating layer 34 is close to the surface of the base material layer 1 . It is preferably formed on the lower insulating layer 14 . During implementation, the support structure 2 may also be made of insulating ink. And during implementation, the support structure 2 can also be an insulating bump. After the vibration layer 3 and the base material layer 1 are frame-fitted, due to the existence of the support structure 2, there is a gap required for the vibration layer 3 to vibrate up and down. Air gap 4. After lamination, the vibration layer 3, the plurality of support structures 2 and the base material layer 1 form a plurality of vibration units, and the vibration units are preferably arranged in an array to form a parametric array speaker.
本发明的定向发声装置优选为静电式超声扬声器，其原理简述为，先在基材层1的第一导电层12和振动层3的第二导电层32上加载直流偏置电压，使振动层3向靠近基材层1的方向弯曲吸附，之后再在两个导电层上加载交流电压，振动层3在该交流电压的作用下上下振动发出超声波，超声波在空气中自解调形成可听声。The directional sound emitting device of the present invention is preferably an electrostatic ultrasonic speaker. Its principle is briefly described as follows: first, a DC bias voltage is loaded on the first conductive layer 12 of the base material layer 1 and the second conductive layer 32 of the vibration layer 3 to cause vibration. Layer 3 is bent and adsorbed in the direction close to the base material layer 1, and then an AC voltage is loaded on the two conductive layers. The vibration layer 3 vibrates up and down under the action of the AC voltage to emit ultrasonic waves. The ultrasonic waves self-demodulate in the air to form an audible sound. Voice.
现有将振动层3和基材层1制作好后，是将振动层3和基材层1直接边框贴合的，在将振动层3和基材层1进行边框贴合后，现有的支撑结构2与基材层1的下绝缘层14之间或者与振动层3的上绝缘层34之间是不固定的。如图8所示，现有的定向发声装置在工作时，每个振动单元在振动的时候，支撑结构2和基材层1或者振动层3之间会出现分离的情况，原因是此时振动层3的反弹力大于向下的静电力，所以整个振动层3会脱离基材层1向上做振动距离为B的无效振动，若假设振动层3的上下总振动距离为A，则振动层3的有效振动距离则为A-B，无效振动会造成定向发声装置发出声音的失真度增高，而且还会造成装置的功率增大。Currently, after the vibration layer 3 and the base material layer 1 are made, the vibration layer 3 and the base material layer 1 are directly frame-laminated. After the vibration layer 3 and the base material layer 1 are frame-laminated, the existing The support structure 2 is not fixed to the lower insulating layer 14 of the base material layer 1 or to the upper insulating layer 34 of the vibration layer 3 . As shown in Figure 8, when the existing directional sound emitting device is working, when each vibration unit vibrates, there will be separation between the support structure 2 and the base material layer 1 or the vibration layer 3. The reason is that the vibration occurs at this time. The rebound force of layer 3 is greater than the downward electrostatic force, so the entire vibration layer 3 will separate from the base material layer 1 and vibrate upward with a vibration distance of B. If it is assumed that the total vibration distance of the vibration layer 3 up and down is A, then the vibration layer 3 The effective vibration distance is A-B. Ineffective vibration will cause the distortion of the sound emitted by the directional sound-emitting device to increase, and will also cause the power of the device to increase.
优选地，结合图9所示，本发明将支撑结构2与振动层3或者基材层1相固定。具体地，若支撑结构2形成在基材层1的下绝缘层14上，则将其与振动层3的上绝缘层34相接触的一端与上绝缘层34固定住；若支撑结构2形成在振动层3的上绝缘层34上，则将其与基材层1的下绝缘层14相接触的一端与下绝缘层14相固定住，即支撑结构2的上下端均分别与振动层3和基材层1固定住，使得基材层1、支撑结构2和振动层3之间形成一个个稳定的振动单元。实施时，支撑结构2可以通过多种结构或工艺方式与振动层3或者基材层1相固定。在一具体实施例中，支撑结构2可以通过固定点5与基材层1的表面或者振动层3的表面相固定。如可以在每个支撑结构2的端部上再制作形成一个固定点5，支撑结构2通过该固定点5与基材层1的下绝缘层14或者振动层3的上绝缘层34相固定，当然在其他替换实施例中，如可以在基材层1的下绝缘层14或者振动层3的上绝缘层34上设置固定点5，只要每个支撑结构2对应一固定点5即可。在另一具体实施例中，支撑结构2还可以通过固定层6与基材层1的表面或者振动层3的表面相固定。如可以在基材层1的下绝缘层14或者振动层3的上绝缘层34上再形成一层绝缘的固定层6，支撑结构2通过该固定层6与基材层1的下绝缘层14或者振动层3的上绝缘层34相固定。实施时，上述支撑结构2、固定点5、固定层6均可以采用绝缘油墨实现，且可以采用丝印、曝光显影、转印、旋转喷涂、UV打印、立体喷涂、字符喷印等工艺中的任意一种工艺制作形成。Preferably, as shown in FIG. 9 , the present invention fixes the support structure 2 to the vibration layer 3 or the base material layer 1 . Specifically, if the support structure 2 is formed on the lower insulating layer 14 of the base material layer 1, then its end in contact with the upper insulating layer 34 of the vibration layer 3 is fixed to the upper insulating layer 34; if the support structure 2 is formed on On the upper insulating layer 34 of the vibration layer 3, the end in contact with the lower insulating layer 14 of the base material layer 1 is fixed to the lower insulating layer 14, that is, the upper and lower ends of the support structure 2 are respectively connected to the vibration layer 3 and The base material layer 1 is fixed so that stable vibration units are formed between the base material layer 1, the support structure 2 and the vibration layer 3. During implementation, the support structure 2 can be fixed to the vibration layer 3 or the base material layer 1 through various structures or processes. In a specific embodiment, the support structure 2 can be fixed to the surface of the base material layer 1 or the surface of the vibration layer 3 through the fixing points 5 . For example, a fixed point 5 can be formed on the end of each support structure 2, and the support structure 2 is fixed to the lower insulating layer 14 of the base material layer 1 or the upper insulating layer 34 of the vibration layer 3 through the fixed point 5. Of course, in other alternative embodiments, the fixing points 5 can be provided on the lower insulating layer 14 of the base material layer 1 or the upper insulating layer 34 of the vibration layer 3 , as long as each support structure 2 corresponds to a fixing point 5 . In another specific embodiment, the support structure 2 can also be fixed to the surface of the base material layer 1 or the surface of the vibration layer 3 through the fixing layer 6 . For example, an insulating fixed layer 6 can be formed on the lower insulating layer 14 of the base material layer 1 or the upper insulating layer 34 of the vibration layer 3. The support structure 2 communicates with the lower insulating layer 14 of the base material layer 1 through this fixed layer 6. Or the upper insulating layer 34 of the vibration layer 3 is fixed. During implementation, the above-mentioned support structure 2, fixed point 5, and fixed layer 6 can all be realized using insulating ink, and any process such as silk screen printing, exposure development, transfer printing, rotation spraying, UV printing, three-dimensional spraying, character spray printing, etc. A kind of craftsmanship is formed.
在一种实施案例中：固定点5和固定层6一般采用丝印油墨，工艺固化条件优选低于温度为100°的固化油墨，或者UV固化选用能量低于3000MJ的油墨，该固化条件适用于将本发明的定向发声装置与屏幕组合的模组中，即模组一体化结合屏幕中，在该固化条件下，能够保证模组一体化结合屏幕的显示或触摸效果，也会避免组件会发生黄变老化造成一定程度显示或触摸性能下降的问题。当然，若本发明的定向发声装置独立使用时，也可选用更高温度（如200度以上的温度）或更高能量的固化材料，可以提升定向发声装置的整体可靠性。In one implementation case: the fixed point 5 and the fixed layer 6 generally use screen printing ink, and the process curing conditions are preferably lower than the curing ink with a temperature of 100°, or the UV curing uses an ink with an energy lower than 3000 MJ. The curing conditions are suitable for In the module in which the directional sound emitting device of the present invention is combined with the screen, that is, in the module integrated with the screen, under this curing condition, the display or touch effect of the integrated module combined with the screen can be ensured, and yellowing of the component can also be avoided. Aging causes a certain degree of display or touch performance degradation. Of course, if the directional sound emitting device of the present invention is used independently, higher temperature (such as a temperature above 200 degrees) or higher energy curing materials can also be used, which can improve the overall reliability of the directional sound emitting device.
另外，固定点5和固定层6优选采用极性基团数量少，分子量高，结晶度高的介电材料，以达到系统高稳定性状态及绝缘作用。且固定点5和固定层6的光学性能越佳，可视化效果越好：优选透过率大于90% 的材料。In addition, the fixed point 5 and the fixed layer 6 are preferably made of dielectric materials with a small number of polar groups, high molecular weight, and high crystallinity to achieve high system stability and insulation. Moreover, the better the optical properties of the fixed point 5 and the fixed layer 6 are, the better the visualization effect will be: materials with a transmittance greater than 90% are preferred.
下面以几个具体实施例来阐述本发明定向发声装置的结构。The structure of the directional sound emitting device of the present invention will be described below with several specific embodiments.
实施例1Example 1
如图2所示，本发明实施例1所揭示的一种定向发声装置，包括基材层1、支撑结构2、固定点5和振动层3，其中，基材层1和振动层3的具体结构可参照上述描述，这里不做赘述。As shown in Figure 2, a directional sound emitting device disclosed in Embodiment 1 of the present invention includes a base material layer 1, a support structure 2, a fixed point 5 and a vibration layer 3, where the specific details of the base material layer 1 and the vibration layer 3 are The structure can refer to the above description and will not be described in detail here.
本实施例1的支撑结构2印刷于基材层1的下绝缘层14上，印刷后对支撑结构2进行固化，优选采用UV固化。支撑结构2固化后，再在支撑结构2的端部再形成固定点5，具体可采用印刷技术实现，优选采用高精度的丝印机，确保支撑结构2和固定点5精准对位。在印刷好固定点5后，将基材层1与振动层3对位并边框贴合，之后再在基材层1的第一导电层12和振动层3的第二导电层32之间通电加载直流偏置电压，使振动层3向下吸附，使支撑结构2的末端与振动层3的上绝缘层34相接触并通过固定点5相固定；之后再对固定点5进行固化，也优选采用UV固化，固化后，固定点5的形状固定。也就是说，在固定点5未固化定型时，将支撑结构2的末端通过固定点5与振动层3的上绝缘层34相接触固定，之后再对固定点5固化定型。且本发明在固定点5未固化定型前，将支撑结构2与振动层3的上绝缘层34相接触，在振动层3通电向下吸附后，固定点5被下压至基本与支撑结构2的上端部齐平，所以对发声装置整体的厚度影响几乎可以忽略。The support structure 2 of this embodiment 1 is printed on the lower insulation layer 14 of the base material layer 1. After printing, the support structure 2 is cured, preferably by UV curing. After the support structure 2 is cured, a fixed point 5 is formed at the end of the support structure 2. This can be achieved using printing technology, preferably a high-precision screen printing machine, to ensure accurate alignment of the support structure 2 and the fixed point 5. After the fixed points 5 are printed, the base material layer 1 and the vibration layer 3 are aligned and frame-bonded, and then electricity is passed between the first conductive layer 12 of the base material layer 1 and the second conductive layer 32 of the vibration layer 3 Apply a DC bias voltage to adsorb the vibration layer 3 downward, so that the end of the support structure 2 contacts the upper insulating layer 34 of the vibration layer 3 and is fixed through the fixed point 5; it is also preferred to solidify the fixed point 5 afterwards. UV curing is used. After curing, the shape of the fixed point 5 is fixed. That is to say, when the fixing point 5 is not cured and shaped, the end of the support structure 2 is contacted and fixed with the upper insulating layer 34 of the vibration layer 3 through the fixing point 5, and then the fixing point 5 is cured and shaped. Moreover, in the present invention, before the fixed point 5 is cured and finalized, the support structure 2 is brought into contact with the upper insulating layer 34 of the vibration layer 3. After the vibration layer 3 is energized and attracted downward, the fixed point 5 is pressed down until it is basically in contact with the support structure 2. The upper end is flush, so the impact on the overall thickness of the sound-generating device is almost negligible.
实施例2Example 2
如图3所示，本发明实施例2所揭示的一种定向发声装置，包括基材层1、支撑结构2、固定点5和振动层3，其中，基材层1和振动层3的具体结构可参照上述描述，这里不做赘述。As shown in Figure 3, a directional sound emitting device disclosed in Embodiment 2 of the present invention includes a base material layer 1, a support structure 2, a fixed point 5 and a vibration layer 3, where the specific details of the base material layer 1 and the vibration layer 3 are The structure can refer to the above description and will not be described in detail here.
与实施例1不同的是，本实施例2的固定点5是形成于振动层3的上绝缘层34靠近基材层1的表面上的，每个支撑结构2对应一个振动层3上的固定点5。即在振动层3的上绝缘层34形成后，再在上绝缘层34的表面上再加工固定点5，加工时，固定点5具体也可采用印刷技术形成于振动层3的上绝缘层34上。在印刷好固定点5后，将基材层1与振动层3对位，确保支撑结构2和固定点5精准对位，对位后进行边框贴合。其他结构及加工步骤与实施例1相同，这里不做赘述。Different from Embodiment 1, the fixed points 5 of this Embodiment 2 are formed on the surface of the upper insulating layer 34 of the vibration layer 3 close to the base material layer 1. Each support structure 2 corresponds to a fixed point on the vibration layer 3. Point 5. That is, after the upper insulating layer 34 of the vibration layer 3 is formed, the fixed points 5 are processed on the surface of the upper insulating layer 34. During processing, the fixed points 5 can also be formed on the upper insulating layer 34 of the vibration layer 3 using printing technology. superior. After the fixed points 5 are printed, align the base material layer 1 and the vibration layer 3 to ensure that the support structure 2 and the fixed points 5 are accurately aligned. After alignment, the frame is attached. Other structures and processing steps are the same as those in Embodiment 1 and will not be described again here.
实施例3Example 3
如图4所示，本发明实施例3所揭示的一种定向发声装置，包括基材层1、支撑结构2、固定层6和振动层3，其中，基材层1和振动层3的具体结构可参照上述描述，这里不做赘述。As shown in Figure 4, a directional sound emitting device disclosed in Embodiment 3 of the present invention includes a base material layer 1, a support structure 2, a fixed layer 6 and a vibration layer 3. The specific structure of the base material layer 1 and the vibration layer 3 is The structure can refer to the above description and will not be described in detail here.
与实施例1不同的是，该实施例采用固定层6将支撑结构2与基材层1或者振动层3固定。该实施例中，固定层6形成于振动层3的上绝缘层34靠近基材层1的表面上，即在上绝缘层34上再形成一层固定层6，固定层6具体可采用丝印工艺实现，印刷后在固定层6还未固化前，将振动层3和基材层1对位贴合，贴合后再通电吸附，之后再对固定层6进行固化，其中贴合后如何进行通电吸附可参照实施例1中的描述，这里不做赘述。固定层6可以选用热固或UV固化，优选采用UV固化，易于操作。What is different from Embodiment 1 is that this embodiment uses a fixing layer 6 to fix the support structure 2 and the base material layer 1 or the vibration layer 3 . In this embodiment, the fixed layer 6 is formed on the surface of the upper insulating layer 34 of the vibration layer 3 close to the base material layer 1 , that is, another layer of fixed layer 6 is formed on the upper insulating layer 34 . The fixed layer 6 can specifically adopt a silk screen printing process. To achieve this, after printing and before the fixing layer 6 is cured, the vibration layer 3 and the base material layer 1 are aligned and bonded. After bonding, they are energized for adsorption, and then the fixed layer 6 is cured. How to energize after bonding? For adsorption, please refer to the description in Embodiment 1 and will not be described in detail here. The fixing layer 6 can be heat-cured or UV-cured, preferably UV-cured, which is easy to operate.
优选地，因支撑结构2是在固化层6未固化前通过固定层6与振动层3相固定的，所以，在固定时，支撑结构2的端部会插入固定层6与振动层3的表面相接触，所以在固定层6固化后，支撑结构2的有效高度会减少。为了保证支撑结构2的高度，在制作时，需要结合考虑固定层6的厚度，具体将现有支撑结构2的高度加上固定层6的厚度得到本发明需要设置的支撑结构2的高度，且因增设固定层6，为了不影响振动层3整体的厚度，设置固定层6的厚度和本发明上绝缘层34的厚度之和等于现有上绝缘层34的整个厚度。如在优选案例中，对于50um、100um、125um厚度的振动层3，现有上绝缘层34的厚度一般控制在11um~12um之间，支撑结构2的高度在11um~12um之间。本发明丝印制作固定层6的厚度在3um~4um，所以本发明在制作上绝缘层34时高度要控制在7um~8um。在贴合时由于固定层6还未固化，所以支撑结构2的末端会插入固定层6接触到上绝缘层34的表面，所以固化后支撑结构2的有效高度会减少3um~4um,为了保证支撑结构2的有效高度在11um~12um，所以在制作时要控制支撑结构2的有效高度在14um~16um。Preferably, since the support structure 2 is fixed to the vibration layer 3 through the fixing layer 6 before the solidified layer 6 is solidified, the end of the support structure 2 will be inserted into the surface of the fixing layer 6 and the vibration layer 3 during fixation. contact, so after the fixation layer 6 is cured, the effective height of the support structure 2 will be reduced. In order to ensure the height of the support structure 2, the thickness of the fixed layer 6 needs to be considered during production. Specifically, the height of the existing support structure 2 plus the thickness of the fixed layer 6 is added to obtain the height of the support structure 2 required in the present invention, and Due to the addition of the fixed layer 6, in order not to affect the overall thickness of the vibration layer 3, the sum of the thickness of the fixed layer 6 and the thickness of the upper insulating layer 34 of the present invention is equal to the entire thickness of the existing upper insulating layer 34. For example, in the preferred case, for the vibration layer 3 with thicknesses of 50um, 100um, and 125um, the thickness of the existing upper insulating layer 34 is generally controlled between 11um and 12um, and the height of the support structure 2 is between 11um and 12um. The thickness of the fixed layer 6 produced by silk printing in the present invention is 3um~4um, so the height of the upper insulating layer 34 in the present invention should be controlled at 7um~8um. During lamination, since the fixing layer 6 has not yet solidified, the end of the support structure 2 will be inserted into the fixing layer 6 to contact the surface of the upper insulating layer 34. Therefore, the effective height of the support structure 2 will be reduced by 3um~4um after solidification. In order to ensure support The effective height of structure 2 is between 11um and 12um, so the effective height of support structure 2 must be controlled between 14um and 16um during production.
实施例4Example 4
如图5所示，本发明实施例4所揭示的一种定向发声装置，包括基材层1、支撑结构2、固定点5和振动层3，其中，基材层1和振动层3的具体结构可参照上述描述，这里不做赘述。As shown in Figure 5, a directional sound emitting device disclosed in Embodiment 4 of the present invention includes a base material layer 1, a support structure 2, a fixed point 5 and a vibration layer 3, where the specific details of the base material layer 1 and the vibration layer 3 are The structure can refer to the above description and will not be described in detail here.
与实施例1不同的是，本实施例4的支撑结构2是形成在振动层3的上绝缘层34上的，可采用印刷，对应的，固定点5则是形成于支撑结构2靠近下绝缘层14的端部。Different from Embodiment 1, the support structure 2 of this Embodiment 4 is formed on the upper insulation layer 34 of the vibration layer 3 and can be printed. Correspondingly, the fixed point 5 is formed on the support structure 2 close to the lower insulation layer. end of layer 14.
同样的，本实施例4的支撑结构2是印刷于振动层3的上绝缘层34上，印刷后对支撑结构2进行固化，优选采用UV固化。支撑结构2固化后，再在支撑结构2的端部再形成固定点5，具体可采用印刷技术实现，优选采用高精度的丝印机，确保支撑结构2和固定点5精准对位。在印刷好固定点5后，将基材层1与振动层3对位并边框贴合，之后再在基材层1的第一导电层12和振动层3的第二导电层32之间通电加载直流偏置电压，使振动层3向下吸附，使支撑结构2的末端与基材层1的下绝缘层14相接触并通过固定点5相固定；之后再对固定点5进行固化，也优选采用UV固化，固化后，固定点5的形状固定。也就是说，在固定点5未固化定型时，将支撑结构2的末端通过固定点5与基材层1的下绝缘层14相接触固定，之后再对固定点5固化定型。且本发明在固定点5未固化定型前，将支撑结构2与基材层1的下绝缘层14相接触，在振动层3通电向下吸附后，固定点5被下压至基本与支撑结构2的端部齐平，所以对发声装置整体的厚度影响几乎可以忽略。Similarly, the support structure 2 of this embodiment 4 is printed on the upper insulating layer 34 of the vibration layer 3. After printing, the support structure 2 is cured, preferably by UV curing. After the support structure 2 is cured, a fixed point 5 is formed at the end of the support structure 2. This can be achieved using printing technology, preferably a high-precision screen printing machine, to ensure accurate alignment of the support structure 2 and the fixed point 5. After the fixed points 5 are printed, the base material layer 1 and the vibration layer 3 are aligned and frame-bonded, and then electricity is passed between the first conductive layer 12 of the base material layer 1 and the second conductive layer 32 of the vibration layer 3 Apply a DC bias voltage to adsorb the vibration layer 3 downward, so that the end of the support structure 2 contacts the lower insulating layer 14 of the base material layer 1 and is fixed through the fixed point 5; then the fixed point 5 is solidified, and the UV curing is preferably used. After curing, the shape of the fixed point 5 is fixed. That is to say, when the fixing point 5 is not cured and shaped, the end of the support structure 2 is contacted and fixed with the lower insulation layer 14 of the base material layer 1 through the fixing point 5, and then the fixing point 5 is cured and shaped. Moreover, in the present invention, before the fixed point 5 is cured and finalized, the support structure 2 is brought into contact with the lower insulating layer 14 of the base material layer 1. After the vibration layer 3 is energized and attracted downward, the fixed point 5 is pressed down until it is basically in contact with the support structure. The ends of 2 are flush, so the impact on the overall thickness of the sound-generating device is almost negligible.
实施例5Example 5
如图6所示，本发明实施例5所揭示的一种定向发声装置，包括基材层1、支撑结构2、固定点5和振动层3，其中，基材层1和振动层3的具体结构可参照上述描述，这里不做赘述。As shown in Figure 6, a directional sound emitting device disclosed in Embodiment 5 of the present invention includes a base material layer 1, a support structure 2, a fixed point 5 and a vibration layer 3, where the specific details of the base material layer 1 and the vibration layer 3 are The structure can refer to the above description and will not be described in detail here.
与实施例4不同的是，本实施例5的固定点5是形成于基材层1的下绝缘层14靠近振动层3的表面上的，每个支撑结构2对应一个基材层1上的固定点5。即在基材层1的下绝缘层14形成后，再在下绝缘层14的表面上再加工固定点5，加工时，固定点5具体也可采用印刷技术形成于基材层1的下绝缘层14上。在印刷好固定点5后，将基材层1与振动层3对位，确保支撑结构2和固定点5精准对位，对位后进行边框贴合。其他结构及加工步骤与实施例4相同，这里不做赘述。Different from Embodiment 4, the fixed points 5 of this Embodiment 5 are formed on the surface of the lower insulating layer 14 of the base material layer 1 close to the vibration layer 3. Each support structure 2 corresponds to a point on the base material layer 1. Fixed point 5. That is, after the lower insulating layer 14 of the base material layer 1 is formed, the fixing points 5 are processed on the surface of the lower insulating layer 14. During processing, the fixing points 5 can also be formed on the lower insulating layer of the base material layer 1 using printing technology. 14 on. After the fixed points 5 are printed, align the base material layer 1 and the vibration layer 3 to ensure that the support structure 2 and the fixed points 5 are accurately aligned. After alignment, the frame is attached. Other structures and processing steps are the same as those in Embodiment 4 and will not be described again here.
实施例6Example 6
如图7所示，本发明实施例6所揭示的一种定向发声装置，包括基材层1、支撑结构2、固定层6和振动层3，其中，基材层1和振动层3的具体结构可参照上述描述，这里不做赘述。As shown in Figure 7, a directional sound emitting device disclosed in Embodiment 6 of the present invention includes a base material layer 1, a support structure 2, a fixed layer 6 and a vibration layer 3, where the specific details of the base material layer 1 and the vibration layer 3 are The structure can refer to the above description and will not be described in detail here.
与实施例4不同的是，该实施例采用固定层6将支撑结构2与基材层1或者振动层3固定。该实施例中，固定层6形成于基材层1的下绝缘层14靠近振动层3的表面上，即在下绝缘层14上再形成一层固定层6，固定层6具体可采用丝印工艺实现，印刷后在固定层6还未固化前，将振动层3和基材层1对位贴合，贴合后再通电吸附，之后再对固定层6进行固化，其中贴合后如何进行通电吸附可参照实施例4中的描述，这里不做赘述。固定层6可以选用热固或UV固化，优选采用UV固化，易于操作。What is different from Embodiment 4 is that this embodiment uses a fixing layer 6 to fix the support structure 2 and the base material layer 1 or the vibration layer 3 . In this embodiment, the fixed layer 6 is formed on the surface of the lower insulating layer 14 of the base material layer 1 close to the vibration layer 3 , that is, another layer of fixed layer 6 is formed on the lower insulating layer 14 . The fixed layer 6 can be implemented using a silk screen printing process. After printing, before the fixed layer 6 is solidified, the vibration layer 3 and the base material layer 1 are aligned and bonded. After bonding, they are energized for adsorption, and then the fixed layer 6 is cured. How to perform energized adsorption after bonding? Reference may be made to the description in Embodiment 4, which will not be described again here. The fixing layer 6 can be heat-cured or UV-cured, preferably UV-cured, which is easy to operate.
优选地，因支撑结构2是在固化层6未固化前通过固定层6与基材层1相固定的，所以，在固定时，支撑结构2的端部会插入固定层6与基材层1的表面相接触，所以在固定层6固化后，支撑结构2的有效高度会减少。为了保证支撑结构2的高度，在制作时，需要结合考虑固定层6的厚度，具体将现有支撑结构2的高度加上固定层6的厚度得到本发明需要设置的支撑结构2的高度，且因增设固定层6，为了不影响基材层1整体的厚度，设置固定层6的厚度和本发明下绝缘层14的厚度之和等于现有下绝缘层14的整个厚度。如在优选案例中，对于50um、100um、125um厚度的振动层3，现有下绝缘层14的厚度一般控制在11um~12um之间，支撑结构2的高度在11um~12um之间。本发明丝印制作固定层6的厚度在3um~4um，所以本发明在制作下绝缘层14时高度要控制在7um~8um。在贴合时由于固定层6还未固化，所以支撑结构2的末端会插入固定层6接触到下绝缘层14的表面，所以固化后支撑结构2的有效高度会减少3um~4um,为了保证支撑结构2的有效高度在11um~12um，所以在制作时要控制支撑结构2的有效高度在14um~16umPreferably, since the support structure 2 is fixed to the base material layer 1 through the fixing layer 6 before the cured layer 6 is cured, the end of the support structure 2 will be inserted into the gap between the fixing layer 6 and the base material layer 1 during fixation. The surfaces are in contact, so after the fixation layer 6 has solidified, the effective height of the support structure 2 will be reduced. In order to ensure the height of the support structure 2, the thickness of the fixed layer 6 needs to be considered during production. Specifically, the height of the existing support structure 2 plus the thickness of the fixed layer 6 is added to obtain the height of the support structure 2 required in the present invention, and Due to the addition of the fixed layer 6, in order not to affect the overall thickness of the base material layer 1, the sum of the thickness of the fixed layer 6 and the thickness of the lower insulating layer 14 of the present invention is equal to the entire thickness of the existing lower insulating layer 14. For example, in the preferred case, for the vibration layer 3 with thicknesses of 50um, 100um, and 125um, the thickness of the existing lower insulation layer 14 is generally controlled between 11um and 12um, and the height of the support structure 2 is between 11um and 12um. The thickness of the fixed layer 6 produced by silk printing in the present invention is 3um~4um, so the height of the lower insulating layer 14 should be controlled at 7um~8um when making the lower insulating layer 14 in the present invention. During lamination, since the fixing layer 6 has not yet solidified, the end of the support structure 2 will be inserted into the fixing layer 6 to contact the surface of the lower insulating layer 14. Therefore, the effective height of the support structure 2 will be reduced by 3um~4um after solidification. In order to ensure support The effective height of structure 2 is between 11um and 12um, so the effective height of support structure 2 must be controlled between 14um and 16um during production.
而本发明通过将支撑结构2与振动层3或者基材层1相固定，使基材层1和振动层3贴合后，可以形成一个个稳定的振动单元，使振动层3在上下振动时不会与支撑结构2相脱离，从而消除了振动层3的无效振动距离，不仅可以降低整个定向发声装置的声音失真，还可以降低整个装置的驱动功率。如图10所示，为频率为100kHz的正弦电压激励时，振动层3位移随时间变化的曲线。对比本发明振动层3与支撑结构2固定、现有振动层3与支撑结构2脱离两种情况。从图里可以看出，当振动层3与支撑结构2相脱离时，振动层3的振动就不能形成完整的正弦波，从而造成谐波失真。反之，本发明振动层3的振动可以形成完整的正弦波。In the present invention, by fixing the support structure 2 with the vibration layer 3 or the base material layer 1, after the base material layer 1 and the vibration layer 3 are attached, stable vibration units can be formed, so that the vibration layer 3 vibrates up and down. It will not be separated from the support structure 2, thereby eliminating the ineffective vibration distance of the vibration layer 3, which can not only reduce the sound distortion of the entire directional sound emitting device, but also reduce the driving power of the entire device. As shown in Figure 10, it is a curve of the displacement of the vibrating layer 3 changing with time when the sinusoidal voltage is excited with a frequency of 100kHz. Compare the two situations where the vibration layer 3 of the present invention is fixed to the support structure 2 and the existing vibration layer 3 is separated from the support structure 2. It can be seen from the figure that when the vibration layer 3 is separated from the support structure 2, the vibration of the vibration layer 3 cannot form a complete sine wave, thus causing harmonic distortion. On the contrary, the vibration of the vibration layer 3 of the present invention can form a complete sine wave.
另外，本发明将振动层3与支撑结构2固定到一起，使每个振动单元都相互独立。当在一些可靠性条件下（如高温75℃条件下通电以及高温60℃、湿度90RH%下存储），现有振动层3与支撑结构2之间没有固定，振动层3有轻微松弛，发声装置的整面就会造成褶皱而失效。本发明将振动层3与支撑结构2固定到一起，振动层3发生轻微松弛时，会将松弛量均匀的分摊在每一个振动单元上，每个振动单元分摊到的量就会非常小，从而不会造成褶皱。In addition, the present invention fixes the vibration layer 3 and the support structure 2 together so that each vibration unit is independent of each other. When under some reliability conditions (such as power on at a high temperature of 75°C and storage at a high temperature of 60°C and a humidity of 90RH%), there is no fixation between the existing vibration layer 3 and the support structure 2, and the vibration layer 3 is slightly relaxed, and the sound-generating device The entire surface will cause wrinkles and fail. The present invention fixes the vibration layer 3 and the support structure 2 together. When the vibration layer 3 relaxes slightly, the amount of relaxation will be evenly distributed to each vibration unit, and the amount allocated to each vibration unit will be very small, thus Will not cause wrinkles.
本发明还揭示了一种定向发声装置的制作工艺，可以采用第一工艺或第二工艺实现，其中，如图11所示，第一工艺包括：The present invention also discloses a manufacturing process of a directional sound-generating device, which can be implemented using a first process or a second process, wherein, as shown in Figure 11, the first process includes:
S1，在基材层1靠近振动层3的表面上制作形成支撑结构2；S1, form a support structure 2 on the surface of the base material layer 1 close to the vibration layer 3;
S2，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2与振动层3靠近基材层1的表面固定。S2, laminate the base material layer 1 and the vibration layer 3 as frames, and fix the support structure 2 and the vibration layer 3 close to the surface of the base material layer 1 while laminating.
该工艺可以有三个实施方式，分别是，所述第一工艺包括：This process can have three implementation modes, namely, the first process includes:
所述S1a，在基材层1上形成支撑结构2，之后在每个支撑结构2与振动层3的表面相固定的端部上再制作形成固定点5；In S1a, a support structure 2 is formed on the base material layer 1, and then a fixing point 5 is formed on the end of each support structure 2 that is fixed to the surface of the vibration layer 3;
所述S2a，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2通过固定点5与振动层3靠近基材层1的表面固定；In S2a, the base material layer 1 and the vibration layer 3 are frame-fitted, and while being attached, the support structure 2 is fixed to the surface of the vibration layer 3 close to the base material layer 1 through the fixing point 5;
或者所述第一工艺包括：Or the first process includes:
所述S1b，在基材层1上形成支撑结构2，且在振动层3靠近基材层1的表面上制作形成固定点5，每个支撑结构2对应一个固定点5；In S1b, a support structure 2 is formed on the base material layer 1, and a fixed point 5 is formed on the surface of the vibration layer 3 close to the base material layer 1. Each support structure 2 corresponds to a fixed point 5;
所述S2b，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2通过固定点5与振动层3靠近基材层1的表面固定；In S2b, the base material layer 1 and the vibration layer 3 are frame-fitted, and while being attached, the support structure 2 is fixed to the surface of the vibration layer 3 close to the base material layer 1 through the fixing point 5;
或者所述第一工艺包括：Or the first process includes:
所述S1c，在基材层1上形成支撑结构2，且在振动层3靠近基材层1的表面上整面制作形成固定层6；In S1c, a support structure 2 is formed on the base material layer 1, and a fixed layer 6 is formed on the entire surface of the vibration layer 3 close to the base material layer 1;
所述S2c，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2通过固定层6与振动层3靠近基材层1的表面固定。In step S2c, the base material layer 1 and the vibration layer 3 are frame-fitted together, and while being bonded, the support structure 2 is fixed to the surface of the base material layer 3 by the fixing layer 6 and the vibration layer 3.
如图12所示，第二工艺包括：As shown in Figure 12, the second process includes:
S11，在振动层3靠近基材层1的表面上制作形成支撑结构2；S11, form a support structure 2 on the surface of the vibration layer 3 close to the base material layer 1;
S21，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2与基材层1靠近振动层3的表面固定。S21, laminate the base material layer 1 and the vibration layer 3 as frames, and fix the support structure 2 and the surface of the base material layer 1 close to the vibration layer 3 while laminating.
同样的，该工艺实现也可以有三种实施方式，分别是：Similarly, this process can also be implemented in three ways, namely:
所述第二工艺包括：The second process includes:
S11a，在振动层3上形成支撑结构2，之后在每个支撑结构2与基材层1的表面相固定的端部上再制作形成固定点5；S11a, form a support structure 2 on the vibration layer 3, and then form a fixing point 5 on the end of each support structure 2 that is fixed to the surface of the base material layer 1;
S21a，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2通过固定点5与基材层1靠近振动层3的表面固定；S21a, laminated the base material layer 1 and the vibration layer 3 as frames, and while bonding, fix the support structure 2 to the surface of the base material layer 1 close to the vibration layer 3 through the fixing point 5;
或者所述第二工艺包括：Or the second process includes:
S11b，在振动层3上形成支撑结构2，且在基材层1靠近振动层3的表面上制作形成固定点5，每个支撑结构2对应一个固定点5；S11b, form a support structure 2 on the vibration layer 3, and make fixed points 5 on the surface of the base material layer 1 close to the vibration layer 3. Each support structure 2 corresponds to a fixed point 5;
S21b，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2通过固定点5与基材层1靠近振动层3的表面固定；S21b, laminate the base material layer 1 and the vibration layer 3 as frames, and while laminating, fix the support structure 2 to the surface of the base material layer 1 close to the vibration layer 3 through the fixing point 5;
或者所述第二工艺包括：Or the second process includes:
S11c，在振动层3上形成支撑结构2，且在基材层1靠近振动层3的表面上整面制作形成固定层6；S11c, form the support structure 2 on the vibration layer 3, and form a fixed layer 6 on the entire surface of the base material layer 1 close to the vibration layer 3;
S21c，将基材层1和振动层3做边框贴合，且贴合的同时将支撑结构2通过固定层6与基材层1靠近振动层3的表面固定。S21c, laminate the base material layer 1 and the vibration layer 3 as frames, and fix the support structure 2 through the fixing layer 6 to the surface of the base material layer 1 close to the vibration layer 3 while laminating.
其中，每个步骤的具体实施过程可分别参照上述实施例1~实施例6中的描述，这里不做赘述。For the specific implementation process of each step, reference can be made to the descriptions in the above-mentioned Embodiment 1 to Embodiment 6 respectively, and will not be described again here.
本发明的优点在于，本发明在将基材层1和振动层3做边框贴合的同时，将支撑结构2与振动层3或者基材层1固定到一起，使基材层1和振动层3贴合后，可以形成一个个稳定的振动单元，使振动层3在上下振动时不会与支撑结构2相脱离，从而消除了振动层3的无效振动距离，不仅可以降低整个定向发声装置的声音失真，还可以降低整个装置的驱动功率。The advantage of the present invention is that while the base material layer 1 and the vibration layer 3 are frame-fitted, the support structure 2 and the vibration layer 3 or the base material layer 1 are fixed together, so that the base material layer 1 and the vibration layer 3 are bonded together, each stable vibration unit can be formed, so that the vibration layer 3 will not be separated from the support structure 2 when vibrating up and down, thus eliminating the ineffective vibration distance of the vibration layer 3 and not only reducing the energy consumption of the entire directional sound emitting device. Sound distortion can also reduce the driving power of the entire device.
前述对本发明的具体示例性实施方案的描述是为了说明和例证的目的。这些描述并非想将本发明限定为所公开的精确形式，并且很显然，根据上述教导，可以进行很多改变和变化。对示例性实施例进行选择和描述的目的在于解释本发明的特定原理及其实际应用，从而使得本领域的技术人员能够实现并利用本发明的各种不同的示例性实施方案以及各种不同的选择和改变。本发明的范围意在由权利要求书及其等同形式所限定。The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and illustration. These descriptions are not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teachings. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical applications, thereby enabling others skilled in the art to make and utilize various exemplary embodiments of the invention and various different applications. Choice and change. The scope of the invention is intended to be defined by the claims and their equivalents.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311068858.7ACN116782082B (en) | 2023-08-24 | 2023-08-24 | A directional sound emitting device and its manufacturing process |
| PCT/CN2024/111431WO2025039914A1 (en) | 2023-08-24 | 2024-08-12 | Directional sound production device and manufacturing process therefor |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311068858.7ACN116782082B (en) | 2023-08-24 | 2023-08-24 | A directional sound emitting device and its manufacturing process |
| Publication Number | Publication Date |
|---|---|
| CN116782082Atrue CN116782082A (en) | 2023-09-19 |
| CN116782082B CN116782082B (en) | 2023-11-17 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311068858.7AActiveCN116782082B (en) | 2023-08-24 | 2023-08-24 | A directional sound emitting device and its manufacturing process |
| Country | Link |
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| CN (1) | CN116782082B (en) |
| WO (1) | WO2025039914A1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118550425A (en)* | 2024-07-24 | 2024-08-27 | 苏州清听声学科技有限公司 | A high-reliability touch display directional sound device and its preparation process |
| WO2025039914A1 (en)* | 2023-08-24 | 2025-02-27 | 苏州清听声学科技有限公司 | Directional sound production device and manufacturing process therefor |
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| CN113891232A (en)* | 2021-09-28 | 2022-01-04 | 京东方科技集团股份有限公司 | A sound producing device and its preparation method, and a display device |
| CN115243155A (en)* | 2022-08-03 | 2022-10-25 | 苏州清听声学科技有限公司 | A kind of directional sound-emitting screen and its auxiliary adsorption method of vibration layer |
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| CN109068245A (en)* | 2018-08-01 | 2018-12-21 | 京东方科技集团股份有限公司 | Screen sounding device, singing display screen and its manufacturing method and screen sonification system |
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| CN115243173B (en)* | 2022-08-03 | 2024-07-05 | 苏州清听声学科技有限公司 | Efficient directional sounding ultrasonic screen and manufacturing process thereof |
| CN115567835B (en)* | 2022-10-17 | 2024-02-02 | 苏州清听声学科技有限公司 | Foldable directional sounding device, display device and preparation process |
| CN116782082B (en)* | 2023-08-24 | 2023-11-17 | 苏州清听声学科技有限公司 | A directional sound emitting device and its manufacturing process |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209314099U (en)* | 2018-11-06 | 2019-08-27 | 深圳康佳电子科技有限公司 | One kind being based on OLED screen curtain sounding device |
| CN113891232A (en)* | 2021-09-28 | 2022-01-04 | 京东方科技集团股份有限公司 | A sound producing device and its preparation method, and a display device |
| CN115243155A (en)* | 2022-08-03 | 2022-10-25 | 苏州清听声学科技有限公司 | A kind of directional sound-emitting screen and its auxiliary adsorption method of vibration layer |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025039914A1 (en)* | 2023-08-24 | 2025-02-27 | 苏州清听声学科技有限公司 | Directional sound production device and manufacturing process therefor |
| CN118550425A (en)* | 2024-07-24 | 2024-08-27 | 苏州清听声学科技有限公司 | A high-reliability touch display directional sound device and its preparation process |
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| CN116782082B (en) | 2023-11-17 |
| WO2025039914A1 (en) | 2025-02-27 |
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