技术领域Technical field
本发明涉及薄膜制备技术领域，具体涉及一种导电薄膜的生产方法和导电薄膜。The invention relates to the technical field of film preparation, and in particular to a production method of a conductive film and a conductive film.
背景技术Background technique
导电薄膜是一种复合型材料，包括不导电的无机或者有机材料，然后在这之上形成一层金属。现有技术中一般是通过多次真空镀膜的方式在有机或者无机材料上形成金属层的。现有技术中的导电膜主要是铜膜或者铝膜，但是当前的镀膜方法生产的导电膜上面的金属层与金属层之间以及金属层与薄膜之间的粘结力不够。Conductive film is a composite material that includes non-conductive inorganic or organic materials, and then forms a layer of metal on top of it. In the prior art, a metal layer is generally formed on an organic or inorganic material through multiple vacuum coatings. The conductive films in the prior art are mainly copper films or aluminum films. However, the adhesion between the metal layer on the conductive film produced by the current plating method and the metal layer and between the metal layer and the film are insufficient.
发明内容Contents of the invention
有鉴于此，本发明实施例的目的在于提供一种导电薄膜的生产方法和导电薄膜，以解决现有技术中采用的镀膜方法生产的导电膜上面的金属层与金属层之间以及金属层与薄膜之间的粘结力不够的技术问题。In view of this, the purpose of embodiments of the present invention is to provide a method for producing a conductive film and a conductive film to solve the problems between the metal layer and the metal layer on the conductive film produced by the coating method used in the prior art, and between the metal layer and the metal layer. Technical problem of insufficient adhesion between films.
为达上述目的，本发明实施例提供了一种导电薄膜的制备方法，所述方法包括：To achieve the above objectives, embodiments of the present invention provide a method for preparing a conductive film, which method includes:
取薄膜基材；Take the film base material;
在所述薄膜基材上真空镀上第一金属层，所述第一金属层具有第一密度；vacuum plating a first metal layer on the film substrate, where the first metal layer has a first density;
在镀有所述第一金属层的薄膜基材上真空镀上第二金属层，所述第二金属层具有第二密度；Vacuum plating a second metal layer on the film substrate plated with the first metal layer, where the second metal layer has a second density;
其中，所述第一密度大于或者小于所述第二密度。Wherein, the first density is greater than or less than the second density.
在一些可能的实施方式中，当所述第一密度大于所述第二密度时，在所述的在蒸镀有第一金属层的薄膜基材上蒸镀第二金属层之前，还包括：In some possible implementations, when the first density is greater than the second density, before evaporating the second metal layer on the film substrate on which the first metal layer is evaporated, the method further includes:
对所述第一金属层进行加热退火处理。The first metal layer is subjected to heat annealing treatment.
在一些可能的实施方式中，当所述第一密度小于所述第二密度时，在所述的在蒸镀有第一金属层的薄膜基材上蒸镀第二金属层之前，还包括：In some possible implementations, when the first density is less than the second density, before evaporating the second metal layer on the film substrate on which the first metal layer is evaporated, the method further includes:
检测所述第一金属层的密度是否在第一阈值范围内，如果所述第一金属层的密度不在所述第一阈值范围内，则调整所述薄膜基材的走膜速度和蒸发速率，或者在密度小于第一阈值范围内的薄膜基材的位置重新镀膜。Detect whether the density of the first metal layer is within the first threshold range, and if the density of the first metal layer is not within the first threshold range, adjust the film running speed and evaporation rate of the film substrate, Or re-coating the film at a location where the density is smaller than that of the film substrate within the first threshold range.
在一些可能的实施方式中，当所述第一密度小于所述第二密度时，在所述的在蒸镀有第一金属层的薄膜基材上蒸镀第二金属层之后，还包括：In some possible implementations, when the first density is less than the second density, after the evaporation of the second metal layer on the film substrate on which the first metal layer is evaporated, the method further includes:
检测所述第二金属层的密度是否在第二阈值范围内，如果所述第二金属层的密度不在所述第二阈值范围内，则调整所述薄膜基材的走膜速度和蒸发速率，或者在密度小于第二阈值范围内的薄膜基材的位置重新镀膜。Detect whether the density of the second metal layer is within the second threshold range, and if the density of the second metal layer is not within the second threshold range, adjust the film running speed and evaporation rate of the film substrate, Or re-coating the film at a location where the density is smaller than the film substrate within the second threshold range.
在一些可能的实施方式中，当所述第一密度小于所述第二密度时，所述第二密度是所述第一密度的1倍至1.5倍。In some possible implementations, when the first density is smaller than the second density, the second density is 1 to 1.5 times the first density.
在一些可能的实施方式中，所述第一金属层采用悬浮式的镀膜方式或者辊贴式的镀膜方式蒸镀在所述薄膜基材的表面。In some possible implementations, the first metal layer is evaporated on the surface of the film substrate using a suspension coating method or a roll coating method.
在一些可能的实施方式中，所述第二金属层采用悬浮式的镀膜方式或者辊贴式的镀膜方式蒸镀在所述第一金属层的表面。In some possible implementations, the second metal layer is evaporated on the surface of the first metal layer using a suspension coating method or a roll coating method.
在一些可能的实施方式中，所述第一金属层为合金层，所述第二金属层为纯金属层。In some possible implementations, the first metal layer is an alloy layer, and the second metal layer is a pure metal layer.
在一些可能的实施方式中，所述第二金属层的金属种类与所述第一金属层的金属种类相同。In some possible implementations, the metal type of the second metal layer is the same as the metal type of the first metal layer.
第二方面，本发明实施例提供了一种导电薄膜，所述导电薄膜包括：In a second aspect, embodiments of the present invention provide a conductive film, which includes:
薄膜基材；film substrate;
第一金属层，设置在所述薄膜基材上下的一个表面或者两个表面；The first metal layer is provided on one or both surfaces of the upper and lower surfaces of the film substrate;
第二金属层，设置在所述第一金属层上不与所述薄膜基材接触的表面；A second metal layer is provided on a surface of the first metal layer that is not in contact with the film substrate;
所述第一金属层的密度大于或者小于所述第二金属层的密度。The density of the first metal layer is greater than or less than the density of the second metal layer.
上述技术方案的有益技术效果在于：The beneficial technical effects of the above technical solution are:
本发明实施例提供的一种导电薄膜的生产方法和导电薄膜，该方法包括：取薄膜基材；在薄膜基材上蒸镀第一金属层，第一金属层具有第一密度；在蒸镀有第一金属层的薄膜基材上蒸镀第二金属层，第二金属层具有第二密度；其中，第一密度大于或者小于第二密度。本发明实施例中，第一导金属层的密度大于或小于第二金属层的密度，当第一金属层的密度较小，可以在第一金属层的金属原子之间具有一定的间歇，当第二金属层层积在第一金属层上时，第二金属层的金属原子就会层积在第一金属层的间歇内，使得第一金属层和第二金属层之间的金属原子的结合力大大增加，从而防止金属从薄膜基材上脱离，而当第一密度大于第二密度时，不仅可以降低导电薄膜的质量，而且，当导电薄膜应用于电池中时，需要在本导电薄膜上涂覆活性材料，由于第二金属层中的金属原子之间密度较低，可以在第二金属层的金属原子之间具有一定的间歇，可以更好的与活性材料结合，从而使得活性材料不容易脱落。Embodiments of the present invention provide a method for producing a conductive film and a conductive film. The method includes: taking a film base material; evaporating a first metal layer on the film base material, where the first metal layer has a first density; A second metal layer is evaporated on the film substrate with the first metal layer, and the second metal layer has a second density; wherein the first density is greater than or less than the second density. In the embodiment of the present invention, the density of the first conductive metal layer is greater or smaller than the density of the second metal layer. When the density of the first metal layer is small, there can be a certain interval between the metal atoms of the first metal layer. When When the second metal layer is stacked on the first metal layer, the metal atoms of the second metal layer will be stacked in the gaps of the first metal layer, so that the metal atoms between the first metal layer and the second metal layer The bonding force is greatly increased, thereby preventing the metal from detaching from the film substrate. When the first density is greater than the second density, not only can the quality of the conductive film be reduced, but also, when the conductive film is used in batteries, it is necessary to The active material is coated on the second metal layer. Since the density between the metal atoms in the second metal layer is low, there can be a certain interval between the metal atoms in the second metal layer, which can better combine with the active material, thereby making the active material Not easy to fall off.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.
图1是本发明实施例的第一种导电薄膜的制备方法的流程图；Figure 1 is a flow chart of a first method for preparing a conductive film according to an embodiment of the present invention;
图2是本发明实施例的第二种导电薄膜的制备方法的流程图；Figure 2 is a flow chart of a second method for preparing a conductive film according to an embodiment of the present invention;
图3是本发明实施例的第三种导电薄膜的制备方法的流程图；Figure 3 is a flow chart of a third method for preparing a conductive film according to an embodiment of the present invention;
图4是本发明实施例的一种导电薄膜的整体结构示意图。Figure 4 is a schematic diagram of the overall structure of a conductive film according to an embodiment of the present invention.
具体实施方式Detailed ways
下面将详细描述本发明的各个方面的特征和示例性实施例。在下面的详细描述中，提出了许多具体细节，以便提供对本发明的全面理解。但是，对于本领域技术人员来说很明显的是，本发明可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本发明的示例来提供对本发明的更好的理解。在附图和下面的描述中，至少部分的公知结构和技术没有被示出，以便避免对本发明造成不必要的模糊；并且，为了清晰，可能夸大了部分结构的尺寸。此外，下文中所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by illustrating examples of the invention. In the drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the present invention; and, the dimensions of some structures may be exaggerated for clarity. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.
图1是本发明实施例的第一种导电薄膜的制备方法的流程图，如图1所示，该方法包括如下步骤：Figure 1 is a flow chart of a first method for preparing a conductive film according to an embodiment of the present invention. As shown in Figure 1, the method includes the following steps:
步骤S1，取薄膜基材11；Step S1, take the film substrate 11;
步骤S2，在薄膜基材11上真空镀上第一金属层12，第一金属层12具有第一密度；Step S2, vacuum plate the first metal layer 12 on the film substrate 11, and the first metal layer 12 has the first density;
步骤S3，在镀有第一金属层12的薄膜基材11上真空镀上第二金属层13，第二金属层13具有第二密度；其中，第一密度大于或者小于第二密度。In step S3, a second metal layer 13 is vacuum-plated on the film substrate 11 coated with the first metal layer 12. The second metal layer 13 has a second density; wherein the first density is greater than or less than the second density.
本实施例中的真空镀可以为磁控溅射镀膜，也可以为真空蒸镀，具体的，可以在一个真空镀膜腔室内在薄膜基材11上沉积第一金属层12，然后再在这个腔室中将沉积有第一金属层12的薄膜基材11上沉积第二金属层13，为了使得第一金属层12的第一密度不等于第二金属层13的第二密度，可以在每次蒸镀过程中控制蒸镀材料的蒸发速率和/或控制薄膜基材11的走膜速度来实现。例如，当第一密度大于第二密度时，在沉积第一金属层12时，可以增大蒸镀材料的蒸发速率或者减慢薄膜基材11的走膜速度，或者以正常的走膜速度和蒸发速率，此时，在沉积第二金属层13时可以降低蒸镀材料的蒸发速率或者提高薄膜基材11的走膜速度，反之亦然。The vacuum plating in this embodiment can be magnetron sputtering coating or vacuum evaporation. Specifically, the first metal layer 12 can be deposited on the film substrate 11 in a vacuum coating chamber, and then the first metal layer 12 can be deposited in this chamber. The second metal layer 13 will be deposited on the film substrate 11 on which the first metal layer 12 is deposited in the chamber. In order to make the first density of the first metal layer 12 not equal to the second density of the second metal layer 13, each time This is achieved by controlling the evaporation rate of the evaporation material and/or controlling the film running speed of the film substrate 11 during the evaporation process. For example, when the first density is greater than the second density, when depositing the first metal layer 12, the evaporation rate of the evaporation material can be increased or the film traveling speed of the film substrate 11 can be slowed down, or the film traveling speed can be normal and Evaporation rate. At this time, when depositing the second metal layer 13, the evaporation rate of the evaporation material can be reduced or the film running speed of the film substrate 11 can be increased, and vice versa.
本发明实施例中，第一导金属层的密度大于或小于第二金属层13的密度，当第一金属层12的密度较小，可以在第一金属层12的金属原子之间具有一定的间歇，当第二金属层13层积在第一金属层12上时，第二金属层13的金属原子就会层积在第一金属层12的间歇内，使得第一金属层12和第二金属层13之间的金属原子的结合力大大增加，从而防止金属从薄膜基材11上脱离，而当第一密度大于第二密度时，不仅可以降低导电薄膜的质量，而且，当导电薄膜应用于电池中时，需要在本导电薄膜上涂覆活性材料，由于第二金属层13中的金属原子之间密度较低，可以在第二金属层13的金属原子之间具有一定的间歇，可以更好的与活性材料结合，从而使得活性材料不容易脱落。In the embodiment of the present invention, the density of the first conductive metal layer is greater than or less than the density of the second metal layer 13. When the density of the first metal layer 12 is small, there can be a certain gap between the metal atoms of the first metal layer 12. Intermittent, when the second metal layer 13 is stacked on the first metal layer 12, the metal atoms of the second metal layer 13 will be stacked in the intervals of the first metal layer 12, so that the first metal layer 12 and the second The binding force of the metal atoms between the metal layers 13 is greatly increased, thereby preventing the metal from detaching from the film substrate 11. When the first density is greater than the second density, not only can the quality of the conductive film be reduced, but also, when the conductive film is applied When used in a battery, active material needs to be coated on the conductive film. Since the density between metal atoms in the second metal layer 13 is low, there can be a certain interval between the metal atoms in the second metal layer 13. Better combined with active materials, making the active materials less likely to fall off.
在一些实施例中，当第一密度大于第二密度时，在的在蒸镀有第一金属层12的薄膜基材11上蒸镀第二金属层13之前，还包括：对第一金属层12进行加热退火处理。本发明实施例通过对第一金属层12进行加热退火处理，加热退火主要是给第一金属层12以能量，让第一金属层12的原子获得能量，更容易与第二金属层13的原子结合，即可以将第一层金属上面的金属原子以活化，让嵌入的第二金属层13的原子更好的和第一金属层12的原子结合，极大提高第一金属层12的金属原子与第二金属层13的金属原子之间的结合力。In some embodiments, when the first density is greater than the second density, before evaporating the second metal layer 13 on the film substrate 11 on which the first metal layer 12 is evaporated, the method further includes: 12 Perform heat annealing treatment. In the embodiment of the present invention, the first metal layer 12 is heated and annealed. The heating annealing mainly provides energy to the first metal layer 12 so that the atoms of the first metal layer 12 can obtain energy and more easily interact with the atoms of the second metal layer 13 . Combining means that the metal atoms on the first layer of metal can be activated, so that the atoms of the embedded second metal layer 13 can better combine with the atoms of the first metal layer 12, which greatly improves the metal atoms of the first metal layer 12. The binding force between the metal atoms of the second metal layer 13 .
图2是本发明实施例的第二种导电薄膜的制备方法的流程图，如图2所示，在一些实施例中，当第一密度小于第二密度时，在蒸镀有第一金属层12的薄膜基材11上蒸镀第二金属层13之前，还包括：步骤S21，检测第一金属层12的第一密度是否在第一阈值范围内，如果第一金属层12的密度不在第一阈值范围内，则调整薄膜基材11的走膜速度和蒸发速率，或者在密度小于第一阈值范围内的薄膜基材11的位置重新镀膜。Figure 2 is a flow chart of a method for preparing a second conductive film according to an embodiment of the present invention. As shown in Figure 2, in some embodiments, when the first density is less than the second density, a first metal layer is evaporated Before evaporating the second metal layer 13 on the thin film substrate 11 of 12, it also includes: step S21, detecting whether the first density of the first metal layer 12 is within the first threshold range. If the density of the first metal layer 12 is not within the first threshold range, Within a threshold range, the film traveling speed and evaporation rate of the film substrate 11 are adjusted, or the film is re-coated at a location where the density is smaller than that of the film substrate 11 within the first threshold range.
当然，本实施例中，第一金属层12的密度不能过于小，过小就没办法和第二金属层13的金属形成足够强的力了。所以在蒸镀第二金属层13之前，要检测第一金属层12的第一密度是否在第一阈值范围内，如果检测到第一金属层12的密度不在第一阈值范围内，则可以通调整薄膜基材11的走膜速度，或者蒸发舟的蒸发速率来增加第一金属层12的密度，如果是在镀膜之后检测出来的，就需要在密度小于第一阈值范围内的薄膜基材11的位置重新镀膜。本实施例中，通过试验获取不同走速但是相同的蒸发速率所获得的材料，通过将镀有第一金属层12的两种或者多种材料进行检测，获得每块材料的第一金属层12的密度，具体方法为分别取一块的镀有第一金属层12的材料，将每块材料表面的第一金属层12进行溶解，获得第一金属层12的金属质量，将金属质量除以第一金属层12覆盖的薄膜的面积，即可得出每块薄膜的密度，然后将镀有不同密度的第一金属层12的薄膜基材分别采用相同的走速和蒸发速率进行镀膜，获得具有相同密度的第二金属层13，然后在分别进行试验，试验表明，第一阈值范围为1g/m2至2g/m2时，第一金属层12与第二金属层13之间的粘合力最强。检测第一金属层12的密度是否过小的方法，可以用扫描电镜扫描第一金属层12和薄膜基材11的界面，比较方便的一种方法可以是通过肉眼，将薄膜基材11放在灯光下看薄膜基材11上面的金属是否有亮点，这个亮点是因为薄膜基材11上面没有沉积金属所致，而沉积了金属的地方由于有金属，其亮度不及没有沉积金属的地方。Of course, in this embodiment, the density of the first metal layer 12 cannot be too small. If it is too small, it will not be able to form a strong enough force with the metal of the second metal layer 13 . Therefore, before evaporating the second metal layer 13, it is necessary to detect whether the first density of the first metal layer 12 is within the first threshold range. If it is detected that the density of the first metal layer 12 is not within the first threshold range, then the Adjust the film running speed of the thin film substrate 11 or the evaporation rate of the evaporation boat to increase the density of the first metal layer 12. If it is detected after coating, the thin film substrate 11 needs to have a density less than the first threshold range. The position should be re-coated. In this embodiment, materials obtained with different traveling speeds but the same evaporation rate are obtained through experiments. By testing two or more materials plated with the first metal layer 12, the first metal layer 12 of each piece of material is obtained. The specific method is to take a piece of material plated with the first metal layer 12, dissolve the first metal layer 12 on the surface of each piece of material, obtain the metal mass of the first metal layer 12, divide the metal mass by the The density of each film can be obtained by the area of the film covered by the metal layer 12, and then the film substrates coated with the first metal layer 12 of different densities are coated using the same travel speed and evaporation rate to obtain a film with The second metal layer 13 of the same density is then tested separately. The test shows that when the first threshold range is 1g/m2 to 2g/m2 , the adhesion between the first metal layer 12 and the second metal layer 13 The strongest. To detect whether the density of the first metal layer 12 is too low, you can use a scanning electron microscope to scan the interface between the first metal layer 12 and the film substrate 11. A more convenient method can be to place the film substrate 11 on the Look under the light to see if there are bright spots on the metal on the thin film substrate 11. This bright spot is because there is no metal deposited on the thin film substrate 11, and the places where metal is deposited are not as bright as the places where metal is not deposited because of the presence of metal.
图3是本发明实施例的第三种导电薄膜的制备方法的流程图，如图3所示，当第一密度小于第二密度时，在蒸镀有第一金属层12的薄膜基材11上蒸镀第二金属层13之后，还包括：步骤S31，检测第二金属层13的密度是否在第二阈值范围内。Figure 3 is a flow chart of a third method for preparing a conductive film according to an embodiment of the present invention. As shown in Figure 3, when the first density is less than the second density, the first metal layer 12 is evaporated on the film substrate 11 After the second metal layer 13 is evaporated, step S31 is also included to detect whether the density of the second metal layer 13 is within the second threshold range.
本实施例中，为了保证薄膜基材11与第一金属层12和第二金属层13之间的粘结力的同时，还要保证导电薄膜的生成质量，所以在沉积第二金属层13之后，还要检测第二金属层13的第二密度是否在第二阈值范围内，如果检测到第一金属层13的密度不在第二阈值范围内，则可以通调整薄膜基材11的走膜速度，或者蒸发舟的蒸发速率来增加第二金属层13的密度，如果是在镀膜之后检测出来的，就需要在密度小于第二阈值范围内的薄膜基材11的位置重新镀膜。试验表面，当第二阈值为2g/m2-3.5g/m2时，既可以保证导电薄膜的粘结力，还可以保证导电薄膜的生产质量。检测第二金属层13是否将第一金属层12的间歇填满的方法也可以通过肉眼来判断，比如也可以将镀上第二金属层13的薄膜基材11放在聚光灯下观看是否有没镀上的部分即可，当然还可以使用其他可以判断第一金属层12和第二金属层13的密度的方法，本实施例不做具体限制。In this embodiment, in order to ensure the adhesion between the film substrate 11 and the first metal layer 12 and the second metal layer 13 while also ensuring the production quality of the conductive film, after depositing the second metal layer 13 , it is also necessary to detect whether the second density of the second metal layer 13 is within the second threshold range. If it is detected that the density of the first metal layer 13 is not within the second threshold range, the film running speed of the film substrate 11 can be adjusted. , or the evaporation rate of the evaporation boat increases the density of the second metal layer 13. If it is detected after coating, it is necessary to re-coat the position of the film substrate 11 where the density is less than the second threshold range. On the test surface, when the second threshold is 2g/m2 -3.5g/m2 , it can not only ensure the adhesive force of the conductive film, but also ensure the production quality of the conductive film. The method of detecting whether the second metal layer 13 fills the intermittently of the first metal layer 12 can also be judged by the naked eye. For example, the film substrate 11 coated with the second metal layer 13 can also be placed under a spotlight to see whether there is any The plated part is sufficient. Of course, other methods that can determine the density of the first metal layer 12 and the second metal layer 13 can also be used. This embodiment is not specifically limited.
在一些实施例中，当第一密度小于第二密度时，第二密度是第一密度的1倍至1.5倍。本实施例中，当嵌入密度较低的第二金属层13的金属的质量是第一金属层12层的金属质量的(每平方米)1-1.5倍的时候，此时，整体金属层(即第一金属层12的金属和第二金属层13的金属)与薄膜基材11的粘结力达到最佳。In some embodiments, when the first density is less than the second density, the second density is 1 to 1.5 times the first density. In this embodiment, when the mass of the metal embedded in the second metal layer 13 with a lower density is 1-1.5 times (per square meter) of the metal mass of the first metal layer 12, at this time, the entire metal layer ( That is, the bonding force between the metal of the first metal layer 12 and the metal of the second metal layer 13 and the film base material 11 is optimal.
在一些实施例中，第一金属层12采用悬浮式的镀膜方式或者辊贴式的镀膜方式蒸镀在薄膜基材11的表面，第二金属层13采用悬浮式的镀膜方式或者辊贴式的镀膜方式蒸镀在第一金属层12的表面。In some embodiments, the first metal layer 12 is evaporated on the surface of the film substrate 11 using a suspended coating method or a roll-on coating method, and the second metal layer 13 uses a suspended coating method or a roll-on coating method. The plating method is evaporation deposited on the surface of the first metal layer 12 .
本实施例中，第一金属层12和第二金属层13都可以采用采用悬浮式的镀膜方式或者辊贴式的镀膜方式来镀膜。例如，以第一金属层12为镍铝合金、第二金属层13为金属铝为例，采用悬浮式的镀膜方式进行镀膜时，如果想要第一金属层12的密度较小，可以在蒸发速率不变的情况下，通过增加薄膜基材11的走速，例如将薄膜基材11的走速从200m/min-300m/min增加到300m/min-400m/min，如果是采用贴辊式的镀膜方式，由于贴辊式镀膜的镀膜区上部有冷却装置，因此其薄膜基材11走速可以稍微降低。例如将薄膜基材11的走速从正常情况下的50m/min-150m/min提高到120m/min-200m/min，此时金属可以布满整个薄膜基材11，层积在薄膜基材11表面的每平方米第一金属层的镍铝合金质量则达到1g/m2-2g/m2，而第二金属层13可以采用正常的走速例如200m/min-300m/min，此时，层积在薄膜基材11表面的每平方米第二金属层13的铝的质量则达到2g/m2-3.5g/m2，反之亦然。In this embodiment, both the first metal layer 12 and the second metal layer 13 can be coated by a suspended coating method or a roller coating method. For example, assuming that the first metal layer 12 is made of nickel-aluminum alloy and the second metal layer 13 is made of metallic aluminum, when using a suspended coating method for coating, if you want the density of the first metal layer 12 to be smaller, you can evaporate When the speed remains unchanged, by increasing the traveling speed of the film substrate 11, for example, increasing the traveling speed of the film substrate 11 from 200m/min-300m/min to 300m/min-400m/min, if the roller type is used For the coating method, since there is a cooling device on the upper part of the coating area of the roller coating, the traveling speed of the film substrate 11 can be slightly reduced. For example, if the traveling speed of the film substrate 11 is increased from 50m/min-150m/min under normal conditions to 120m/min-200m/min, then the metal can cover the entire film substrate 11 and be laminated on the film substrate 11 The nickel-aluminum alloy mass of the first metal layer per square meter on the surface reaches 1g/m2 -2g/m2 , and the second metal layer 13 can adopt a normal walking speed, such as 200m/min-300m/min. At this time, The mass of aluminum per square meter of the second metal layer 13 laminated on the surface of the film substrate 11 reaches 2g/m2 -3.5g/m2 , and vice versa.
另外，在一些实施例中，为了获得金属层密度较低的导电薄膜，可以通过调节蒸汽浓度，如可以让其蒸发速度为10mol/min-50mol/min，其中，检测蒸发速率的方法为，通过检测1min内，靶材或者蒸发舟里面的蒸发材料消失的mol量，这样就可以减少第一金属层的密度，使得薄膜上每平方米的金属质量为1g-2g。实验表面，嵌入密度较低的第二金属层13的金属质量是第一金属层的金属质量(每平方米)的1-1.5倍的时候，其整体金属与薄膜的粘结力达到最佳。In addition, in some embodiments, in order to obtain a conductive film with a lower metal layer density, the steam concentration can be adjusted, for example, the evaporation rate can be 10 mol/min-50 mol/min, wherein the method for detecting the evaporation rate is: Detect the number of moles of evaporation material that disappear in the target or evaporation boat within 1 minute. This can reduce the density of the first metal layer so that the metal mass per square meter on the film is 1g-2g. Experimental results show that when the metal mass of the second metal layer 13 embedded with a lower density is 1-1.5 times the metal mass (per square meter) of the first metal layer, the adhesion between the overall metal and the film is optimal.
本发明实施例中，由于导电薄膜1使用的金属质量较少，在增加金属层与薄膜基材11之间粘结力的同时，还可以减少导电薄膜1的重量，以及节约成本。In the embodiment of the present invention, since the conductive film 1 uses less metal mass, while increasing the adhesion force between the metal layer and the film substrate 11, it can also reduce the weight of the conductive film 1 and save costs.
在一些实施例中，薄膜基材11为表面粗糙的无机薄膜或有机薄膜。无机薄膜的材质为(聚丙烯薄膜)、PE膜(聚乙烯薄膜)、PET膜(聚酯基片薄膜)、PI膜(聚酰亚胺薄膜)或BOPP膜(双向拉伸聚丙烯薄膜)中的任意一种，有机薄膜的材质为橡胶。本实用性实施例中，薄膜基材11的表面具有一定的粗糙度，可以增加第一金属层12与薄膜基材11之间的粘结力。本实施例中，薄膜基材11主要起着支撑和绝缘作用。In some embodiments, the film substrate 11 is an inorganic film or an organic film with a rough surface. The material of the inorganic film is (polypropylene film), PE film (polyethylene film), PET film (polyester substrate film), PI film (polyimide film) or BOPP film (biaxially oriented polypropylene film) Any one of them, the material of the organic film is rubber. In this practical embodiment, the surface of the film base material 11 has a certain roughness, which can increase the bonding force between the first metal layer 12 and the film base material 11 . In this embodiment, the film base material 11 mainly plays a supporting and insulating role.
在一些实施例中，第一金属层12为合金层，第二金属层13为纯金属层。优选的，第二金属层13的金属种类与第一金属层12的金属种类相同，即当第一金属层12为镍铜合金时，第二金属层13为铜层；当第一金属层12镍铝合金时，第二金属层13为铝层。In some embodiments, the first metal layer 12 is an alloy layer, and the second metal layer 13 is a pure metal layer. Preferably, the metal type of the second metal layer 13 is the same as the metal type of the first metal layer 12 , that is, when the first metal layer 12 is a nickel-copper alloy, the second metal layer 13 is a copper layer; when the first metal layer 12 In the case of nickel-aluminum alloy, the second metal layer 13 is an aluminum layer.
本实施例中，第一金属层12可以为合金层或者为纯金属层，例如第一金属层12可以为金属铜或者金属铝，第一金属层12也可以为合金层如镍合金层等，当第一金属层12为镍铜合金时，第二金属层13可以为铜，这样组合使得铜原子会和镍铜合金形成更加紧密的粘结，大大增加了第一金属层12和第二金属层13之间的粘结力。当第二金属层13为铝时，第一金属层12可以为镍铝合金，这样也可以增大第一金属层12和第二金属层13的粘结力。In this embodiment, the first metal layer 12 can be an alloy layer or a pure metal layer. For example, the first metal layer 12 can be metal copper or metal aluminum. The first metal layer 12 can also be an alloy layer such as a nickel alloy layer, etc. When the first metal layer 12 is a nickel-copper alloy, the second metal layer 13 can be copper. This combination allows the copper atoms to form a closer bond with the nickel-copper alloy, which greatly increases the number of connections between the first metal layer 12 and the second metal. Adhesion between layers 13. When the second metal layer 13 is aluminum, the first metal layer 12 can be a nickel-aluminum alloy, which can also increase the bonding force between the first metal layer 12 and the second metal layer 13 .
图4是本发明实施例的一种导电薄膜的整体结构示意图，如图4所示，该导电薄膜包括：薄膜基材11；第一金属层12，设置在薄膜基材11上下的一个表面或者两个表面；第二金属层13，设置在第一金属层12上不与薄膜基材11接触的表面；第一金属层12的密度大于或者小于第二金属层13的密度。Figure 4 is a schematic diagram of the overall structure of a conductive film according to an embodiment of the present invention. As shown in Figure 4, the conductive film includes: a film substrate 11; a first metal layer 12, which is disposed on a surface above and below the film substrate 11 or Two surfaces; the second metal layer 13 is provided on the surface of the first metal layer 12 that is not in contact with the film substrate 11; the density of the first metal layer 12 is greater or less than the density of the second metal layer 13.
本发明实施例中，当第一金属层12的金属密度小于第二金属层13的金属密度时，由于第一金属层12的密度较小，可以在第一金属层12的金属之间具有一定的间歇，当第二金属层13层积在第一金属层12上时，第二金属层13的金属就会层积在第一金属层12的缝隙内，使得第一金属层12和第二金属层13之间的金属结合力大大增加，从而防止金属从薄膜基材11上脱离。In the embodiment of the present invention, when the metal density of the first metal layer 12 is smaller than the metal density of the second metal layer 13 , since the density of the first metal layer 12 is smaller, there can be a certain gap between the metals of the first metal layer 12 . interval, when the second metal layer 13 is stacked on the first metal layer 12, the metal of the second metal layer 13 will be stacked in the gap of the first metal layer 12, so that the first metal layer 12 and the second metal layer 12 The metal bonding force between the metal layers 13 is greatly increased, thereby preventing the metal from detaching from the film substrate 11 .
而当第二金属层13的密度小于第一金属层12的密度，不仅可以降低导电薄膜的质量，节省成本，而且，当导电薄膜1应用于电池中时，需要在本导电薄膜1上涂覆活性材料，由于第二金属层13中的金属之间密度较低，可以更好的与活性材料结合，从而使得活性材料不容易脱落。When the density of the second metal layer 13 is smaller than the density of the first metal layer 12, not only can the quality of the conductive film be reduced and costs saved, but also, when the conductive film 1 is used in a battery, it needs to be coated on the conductive film 1 The active material, due to the lower density between metals in the second metal layer 13, can be better combined with the active material, so that the active material is not easy to fall off.
当然，通过本发明实施例所述的方法制作的导电薄膜应用于离子电池中时，由于在制作正极极片和负极极片时，由于导电薄膜使用的金属质量较少，所以导电薄膜的重量较轻，这样就可以提高离子电池的重量，在电池中使用后，能量密度更高；另外，本申请不只是可以用于电池，也可以用于抗电磁屏蔽膜。Of course, when the conductive film produced by the method described in the embodiment of the present invention is used in an ion battery, the conductive film uses less metal mass when making the positive electrode plate and the negative electrode plate, so the weight of the conductive film is relatively small. Light, this can increase the weight of the ion battery, and after use in the battery, the energy density is higher; in addition, this application can not only be used for batteries, but also can be used for anti-electromagnetic shielding films.
在本发明实施例的描述中，需要说明的是，术语中的“上、下、内和外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一、第二或第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper, lower, inner and outer" are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description. The present invention and simplified description are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore are not to be construed as limitations of the present invention. Furthermore, the terms "first, second or third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
本发明实施例中除非另有明确的规定和限定，术语“安装、相连、连接”应做广义理解，例如：可以是固定连接、可拆卸连接或一体式连接；同样可以是机械连接、电连接或直接连接，也可以通过中间媒介间接相连，也可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installation, connection, and connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can also be a mechanical connection or an electrical connection. Either directly, indirectly through an intermediary, or internally between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
虽然已经参考优选实施例对本发明进行了描述，但在不脱离本发明的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本发明并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。While the invention has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for parts thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any way. The invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310419887.7ACN116752093A (en) | 2023-04-19 | 2023-04-19 | Production method of conductive film and conductive film |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310419887.7ACN116752093A (en) | 2023-04-19 | 2023-04-19 | Production method of conductive film and conductive film |
| Publication Number | Publication Date |
|---|---|
| CN116752093Atrue CN116752093A (en) | 2023-09-15 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310419887.7APendingCN116752093A (en) | 2023-04-19 | 2023-04-19 | Production method of conductive film and conductive film |
| Country | Link |
|---|---|
| CN (1) | CN116752093A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200714546A (en)* | 2005-10-05 | 2007-04-16 | Kinik Co | Production of thin sliced diamond film |
| US20160226065A1 (en)* | 2015-01-29 | 2016-08-04 | Board Of Trustees Of The University Of Arkansas | Density modulated thin film electrodes, methods of making same, and applications of same |
| CN112435776A (en)* | 2020-09-08 | 2021-03-02 | 浙江长宇新材料股份有限公司 | Flexible conductive film and preparation method thereof |
| CN114551607A (en)* | 2022-02-25 | 2022-05-27 | 陕西迪泰克新材料有限公司 | A kind of shading layer, composite film layer and preparation method thereof |
| CN219832210U (en)* | 2023-04-19 | 2023-10-13 | 重庆金美新材料科技有限公司 | Conductive film and ion battery |
| CN219959045U (en)* | 2023-04-19 | 2023-11-03 | 重庆金美新材料科技有限公司 | A composite current collector and ion battery |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200714546A (en)* | 2005-10-05 | 2007-04-16 | Kinik Co | Production of thin sliced diamond film |
| US20160226065A1 (en)* | 2015-01-29 | 2016-08-04 | Board Of Trustees Of The University Of Arkansas | Density modulated thin film electrodes, methods of making same, and applications of same |
| CN112435776A (en)* | 2020-09-08 | 2021-03-02 | 浙江长宇新材料股份有限公司 | Flexible conductive film and preparation method thereof |
| CN114551607A (en)* | 2022-02-25 | 2022-05-27 | 陕西迪泰克新材料有限公司 | A kind of shading layer, composite film layer and preparation method thereof |
| CN219832210U (en)* | 2023-04-19 | 2023-10-13 | 重庆金美新材料科技有限公司 | Conductive film and ion battery |
| CN219959045U (en)* | 2023-04-19 | 2023-11-03 | 重庆金美新材料科技有限公司 | A composite current collector and ion battery |
| Publication | Publication Date | Title |
|---|---|---|
| KR20180116096A (en) | Negative electrode current collector, methods of preparation thereof, and use thereof | |
| CN103459676B (en) | Porous metal forming and manufacture method thereof | |
| JP4762368B2 (en) | Porous metal foil and method for producing the same | |
| TWI566458B (en) | Composite metal foil and its manufacturing method | |
| CN113622008A (en) | A kind of conductive film and preparation method thereof | |
| WO2021208542A1 (en) | Conductive film and pole piece | |
| CN219959045U (en) | A composite current collector and ion battery | |
| TW202302340A (en) | Metallized film for secondary battery positive electrodes and method for producing same | |
| TWI524822B (en) | A metal foil having a resistive layer and a method for manufacturing the same | |
| IL194505A0 (en) | Electroplating device and method | |
| CN114015994A (en) | A kind of preparation method of ultrathin composite current collector | |
| CN103210112B (en) | Metal foil for base material | |
| CN115763829A (en) | Composite current collector capable of enhancing conductivity | |
| CN219832210U (en) | Conductive film and ion battery | |
| JP2000340911A (en) | Copper foil for printed wiring board | |
| CN118039920A (en) | Composite current collector and preparation method and application thereof | |
| KR20240131355A (en) | Method for manufacturing anode for lithium battery | |
| CN116752093A (en) | Production method of conductive film and conductive film | |
| CN116497331A (en) | A kind of preparation method of conductive thin film and conductive thin film | |
| CN116676556A (en) | A kind of preparation method of composite current collector | |
| RU2098878C1 (en) | Method for manufacturing of cathode foil and cathode foil for electrolytic capacitor | |
| JP2005007668A (en) | Metal-coated fluororesin substrate, its evaluation method and its manufacturing method | |
| CN116574998B (en) | A method for enhancing the bonding strength between polymer film and metal coating | |
| CN119786622A (en) | A composite conductive film and preparation method thereof | |
| CN223401620U (en) | Composite current collector, pole piece and battery |
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |