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CN116520575A - A head-mounted digital image source and configuration method - Google Patents

A head-mounted digital image source and configuration method
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Publication number
CN116520575A
CN116520575ACN202310361824.0ACN202310361824ACN116520575ACN 116520575 ACN116520575 ACN 116520575ACN 202310361824 ACN202310361824 ACN 202310361824ACN 116520575 ACN116520575 ACN 116520575A
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pcb assembly
display screen
mesh component
pcb board
digital image
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曾鹏飞
代弼
李昀
张勇
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Hunan Aerospace Jiecheng Electronic Equipment Co ltd
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Hunan Aerospace Jiecheng Electronic Equipment Co ltd
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Abstract

Translated fromChinese

本发明涉及数字成像设备技术领域,具体为一种头戴式数字像源,包括A目部件、B目部件和柔性带;A目部件、B目部件均安装在外部的头盔上,A目部件分别与外部供电设备以及外部信号传输设备电连接;A目部件、B目部件均包括壳体、显示屏;A目部件、B目部件上分别还安装有第一PCB板组件、第二PCB板组件;显示屏安装在对应的壳体上,A目部件上的显示屏、B目部件上的显示屏分别与第一PCB板组件、第二PCB板组件电连接;第一PCB板组件、第二PCB板组件通过柔性带电连接。本发明佩戴在头盔上,用于数字成像,结构简单,功耗低,抗干扰能力强,成像效果好。

The present invention relates to the technical field of digital imaging equipment, in particular to a head-mounted digital image source, comprising A-item components, B-item components and a flexible belt; both A-item components and B-item components are installed on an external helmet, and A-item components They are respectively electrically connected to external power supply equipment and external signal transmission equipment; A-item components and B-item components both include housings and display screens; A-item components and B-item components are respectively installed with a first PCB board assembly and a second PCB board Components; the display screen is installed on the corresponding housing, and the display screen on the A-item component and the B-item component are respectively electrically connected to the first PCB board assembly and the second PCB board assembly; the first PCB board assembly, the second PCB board assembly The two PCB board components are electrically connected through flexible cables. The invention is worn on the helmet and used for digital imaging, and has the advantages of simple structure, low power consumption, strong anti-interference ability and good imaging effect.

Description

Translated fromChinese
一种头戴式数字像源及配置方法A head-mounted digital image source and its configuration method

技术领域technical field

本发明涉及数字成像设备技术领域,特别涉及一种头戴式数字像源及配置方法。The invention relates to the technical field of digital imaging equipment, in particular to a head-mounted digital image source and a configuration method.

背景技术Background technique

随着社会的发展,数字化成像设备已经得到了很大的突破,如:电视剧、投影仪、手机、摄像机、MP4等,数字化成像设备涉及到的领域很多,如:数字化加工制造业、金融业、建筑工程等。With the development of society, digital imaging equipment has made great breakthroughs, such as: TV dramas, projectors, mobile phones, cameras, MP4, etc. Digital imaging equipment involves many fields, such as: digital processing manufacturing, financial industry, construction engineering etc.

然而目前的数字成像设备还存在以下不足,现有的数字化成像设备一般尺寸偏大,能佩戴在头盔上的成像设备比较少,同时,常见的数字化成像设备功耗高,抗干扰能力不佳,成像效果不好。However, the current digital imaging equipment still has the following shortcomings. The existing digital imaging equipment is generally too large in size, and there are relatively few imaging equipment that can be worn on the helmet. At the same time, the common digital imaging equipment has high power consumption and poor anti-interference ability. The imaging effect is not good.

发明内容Contents of the invention

本发明提供了一种头戴式数字像源及配置方法,以解决现有数字成像设备功耗高,抗干扰能力不佳,成像效果不好的技术问题。The invention provides a head-mounted digital image source and a configuration method to solve the technical problems of high power consumption, poor anti-interference ability and poor imaging effect of existing digital imaging equipment.

为达到上述目的,本发明的技术方案是这样实现的:In order to achieve the above object, technical solution of the present invention is achieved in that way:

本发明一方面提供了一种头戴式数字像源,包括A目部件、B目部件和柔性带;One aspect of the present invention provides a head-mounted digital image source, including A component, B component and a flexible belt;

A目部件、B目部件均安装在外部的头盔上,A目部件分别与外部供电设备以及外部信号传输设备电连接;Parts A and B are installed on the external helmet, and parts A are electrically connected to external power supply equipment and external signal transmission equipment respectively;

A目部件、B目部件均包括壳体、显示屏;A目部件、B目部件上分别还安装有第一PCB板组件、第二PCB板组件;显示屏安装在对应的壳体上,A目部件上的显示屏、B目部件上的显示屏分别与第一PCB板组件、第二PCB板组件电连接;第一PCB板组件、第二PCB板组件通过柔性带电连接。The components of item A and item B both include a housing and a display screen; the components of item A and item B are respectively equipped with a first PCB board assembly and a second PCB board assembly; the display screen is installed on the corresponding housing, and A The display screen on the item part and the display screen on the B item part are respectively electrically connected to the first PCB board assembly and the second PCB board assembly; the first PCB board assembly and the second PCB board assembly are electrically connected through flexible charging.

进一步地,所述壳体包括前壳体和后壳体;Further, the casing includes a front casing and a rear casing;

前壳体上开设有成像孔,显示屏安装在前壳体的成像孔内,后壳体可拆卸的安装在前壳体上。An imaging hole is opened on the front casing, the display screen is installed in the imaging hole of the front casing, and the rear casing is detachably installed on the front casing.

进一步地,所述壳体的上部采用倾斜设计,所述壳体上部的倾斜角度在100~120度之间。Further, the upper part of the housing adopts an inclined design, and the inclination angle of the upper part of the housing is between 100 and 120 degrees.

进一步地,所述壳体的材质为铝合金,壳体的壁厚为0.5~2mm。Further, the material of the housing is aluminum alloy, and the wall thickness of the housing is 0.5-2mm.

进一步地,所述显示屏选用OLED屏。Further, the display screen is an OLED screen.

进一步地,所述第一PCB板组件和第二PCB板组件均包括电源板和驱动板;第一PCB板组件上的电源板、第一PCB板组件上的驱动板相互电连接;第二PCB板组件上的电源板、第二PCB板组件上的驱动板相互电连接;Further, the first PCB board assembly and the second PCB board assembly both include a power board and a driver board; the power board on the first PCB board assembly and the driver board on the first PCB board assembly are electrically connected to each other; the second PCB board assembly The power supply board on the board assembly and the driver board on the second PCB board assembly are electrically connected to each other;

第一PCB板组件和第二PCB板组件上的电源板均集成有多颗DC/DC电源芯片;DC/DC电源芯片用于对输入电压进行转换;第一PCB板组件上还安装有连接器,A目部件通过连接器与外部信号传输设备电连接;The power boards on the first PCB board assembly and the second PCB board assembly are integrated with multiple DC/DC power supply chips; the DC/DC power supply chips are used to convert the input voltage; connectors are also installed on the first PCB board assembly , A component is electrically connected to an external signal transmission device through a connector;

第一PCB板组件和第二PCB板组件上的驱动板均集成有屏幕驱动电源芯片和DVI转MIPI芯片;屏幕驱动电源芯片用于向对应的显示屏提供驱动电源;DVI转MIPI芯片用于将输入的DVI信号转换成MIPI信号,并传输给对应的显示屏进行显示;第一PCB板组件上的驱动板上还集成有DVI分配器,用于将外部输入的DVI信号一分为二,并分别传输到第一PCB板组件的DVI转MIPI芯片上以及第二PCB板组件的DVI转MIPI芯片上。The drive boards on the first PCB board assembly and the second PCB board assembly are all integrated with a screen drive power chip and a DVI to MIPI chip; the screen drive power chip is used to provide drive power to the corresponding display screen; the DVI to MIPI chip is used to convert The input DVI signal is converted into a MIPI signal, and transmitted to the corresponding display screen for display; the driver board on the first PCB board assembly is also integrated with a DVI splitter, which is used to divide the externally input DVI signal into two, and They are respectively transmitted to the DVI-to-MIPI chip of the first PCB board assembly and the DVI-to-MIPI chip of the second PCB board assembly.

进一步地,所述头戴式数字像源还包括多个垫柱,多个垫柱均分成两组,其中一组垫柱用于连接第一PCB板组件上的电源板和驱动板,另一组垫柱用于连接第二PCB板组件上的电源板和驱动板;Further, the head-mounted digital image source also includes a plurality of pads, and the plurality of pads are divided into two groups, wherein one group of pads is used to connect the power supply board and the drive board on the first PCB board assembly, and the other The group pads are used to connect the power board and the driver board on the second PCB board assembly;

两块电源板和两块驱动板的边缘位置处均开设有多个圆孔,多个垫柱分别转动连接在多个圆孔内。The edge positions of the two power boards and the two drive boards are provided with a plurality of round holes, and a plurality of pad posts are respectively rotatably connected in the plurality of round holes.

进一步地,所述垫柱的中部设置为圆柱状,且垫柱的中部从电源板和驱动板的边缘位置处向外凸出;所述垫柱的材质为绝缘材料。Further, the middle part of the pad is set in a cylindrical shape, and the middle part of the pad protrudes outward from the edge positions of the power board and the drive board; the material of the pad is insulating material.

进一步地,所述头戴式数字像源还包括两个I2C连接口,两个I2C连接口分别电连接在第一PCB板组件、第二PCB板组件上,分别用于对A目部件上的显示屏、B目部件上的显示屏进行初始化配置。Further, the head-mounted digital image source also includes two I2C connection ports, and the two I2C connection ports are respectively electrically connected to the first PCB board assembly and the second PCB board assembly, and are respectively used to connect the The display screen and the display screen on the item B component are initialized.

本发明另一方面还提供一种头戴式数字像源的配置方法,用于对以上所述的头戴式数字像源进行初始化配置,具体包括如下步骤:Another aspect of the present invention also provides a configuration method for a head-mounted digital image source, which is used for initial configuration of the above-mentioned head-mounted digital image source, which specifically includes the following steps:

步骤S1、向A目部件和/或B目部件发送RST复位信号;Step S1, sending an RST reset signal to the component of item A and/or the component of item B;

步骤S2、通过对应的I2C连接口向A目部件和/或B目部件发送自检信号,A目部件和/或B目部件进行自检,待自检合格后,进入到下一步;Step S2, send a self-test signal to the A-item component and/or B-item component through the corresponding I2C connection port, the A-item component and/or the B-item component perform a self-test, and enter the next step after the self-test is passed;

步骤S3、通过对应的I2C连接口向A目部件和/或B目部件发送DVI转MIPI芯片配置文件,DVI转MIPI芯片对配置文件进行效验和读写;Step S3, sending the DVI-to-MIPI chip configuration file to the A-item component and/or B-item component through the corresponding I2C connection port, and the DVI-to-MIPI chip performs validation and reads and writes the configuration file;

步骤S4、通过对应的I2C连接口向A目部件和/或B目部件发送显示屏唤醒命令和默认亮度命令,显示屏唤醒并常亮;Step S4, send the display screen wake-up command and the default brightness command to the A-item component and/or the B-item component through the corresponding I2C connection port, and the display screen wakes up and is always on;

步骤S5、A目部件和B目部件均安装有自检寄存器和温度寄存器;轮询A目部件和/或B目部件的自检寄存器信息,并检测显示屏的工作信息、DVI转MIPI芯片的工作信息和温度寄存器是否正常;如果正常,初始化配置完成;如果不合格,进入到步骤S6;Step S5, the A item part and the B item part are equipped with a self-check register and a temperature register; poll the self-check register information of the A item part and/or B item part, and detect the working information of the display screen, the DVI to MIPI chip Whether the working information and temperature register are normal; if normal, the initialization configuration is completed; if unqualified, go to step S6;

步骤S6、认定A目部件和/或B目部件异常,并向外反馈设备异常的信息。Step S6, confirming that the component of item A and/or the component of item B is abnormal, and feeding back information about the abnormality of the equipment.

本发明的有益效果:Beneficial effects of the present invention:

1、本发明采用柔性带将A目部件、B目部件电连接,相对常规的电连接方式,减少了A目部件、B目部件的尺寸与重量,A目部件、B目部件之间的DVI信号传输,采用柔性带替代常规连接器线缆传输,解决了传输信号从结构件出线的难题,同时可以压缩壳体侧面的尺寸,柔性带具有重量轻,尺寸小,同时具有较好的电磁屏蔽性能;1. The present invention uses a flexible belt to electrically connect parts A and B. Compared with the conventional electrical connection method, the size and weight of parts A and B are reduced, and the DVI between parts A and B is reduced. For signal transmission, the flexible belt is used to replace the conventional connector cable transmission, which solves the problem of the transmission signal going out from the structural parts, and at the same time can compress the size of the side of the shell. The flexible belt has light weight, small size, and good electromagnetic shielding performance;

2、本发明中的柔性带由聚酰亚胺、胶层、铜箔和保护层组成,具有轻、薄、柔、韧的特性,耐候性好,弯折性能佳,可靠性高。柔性带的外层包裹一层黑色导电布胶带,使柔性带与外界隔离,降低了柔性带的电磁辐射,同时提高了本发明的抗干扰能力;2. The flexible belt in the present invention is composed of polyimide, adhesive layer, copper foil and protective layer, and has the characteristics of lightness, thinness, flexibility and toughness, good weather resistance, good bending performance and high reliability. The outer layer of the flexible belt is wrapped with a layer of black conductive cloth tape, which isolates the flexible belt from the outside world, reduces the electromagnetic radiation of the flexible belt, and improves the anti-interference ability of the present invention at the same time;

3、本发明中的壳体包括前壳体和后壳体,前壳体和后壳体采用7系铝合金整块铣制而成;在便于产品安装的同时,减少了产品零部件数量,提高了产品的整体性,增强了产品刚度、强度,同时有效提高了整机的固有频率,增强了产品的抗振动冲击性能,提高了产品的可装配性和可维修性;3. The casing in the present invention includes a front casing and a rear casing, which are milled from a 7-series aluminum alloy as a whole; while facilitating product installation, the number of product parts is reduced, Improve the integrity of the product, enhance the rigidity and strength of the product, effectively increase the natural frequency of the whole machine, enhance the vibration and shock resistance of the product, and improve the assemblability and maintainability of the product;

4、本发明中的显示屏选用OLED屏;OLED屏具有高对比度、屏幕显示响应时间小,自发光(无需背光膜组)、功耗低、低温无需额外加热、成像效果好等优势。4. The display screen in the present invention is an OLED screen; the OLED screen has the advantages of high contrast, small screen display response time, self-illumination (no need for backlight film group), low power consumption, low temperature without additional heating, and good imaging effect.

附图说明Description of drawings

图1为头戴式数字像源的结构示意图;Fig. 1 is a structural schematic diagram of a head-mounted digital image source;

图2为A目部件的爆炸示意图的放大图;Fig. 2 is an enlarged view of the explosion schematic diagram of the A item part;

图3为第一PCB板组件和第二PCB板组件的工作示意图;Fig. 3 is the schematic diagram of the work of the first PCB board assembly and the second PCB board assembly;

图4为本发明中的DVI转MIPI芯片的原理图;Fig. 4 is the schematic diagram of DVI to MIPI chip among the present invention;

图5为本发明中连接器的防静电原理图;Fig. 5 is the antistatic schematic diagram of the connector in the present invention;

图6为本发明中垫柱的剖面示意图的放大图。Fig. 6 is an enlarged view of a schematic cross-sectional view of a pad column in the present invention.

附图标记说明:Explanation of reference signs:

1、A目部件;2、B目部件;3、柔性带;4、壳体;41、前壳体;42、后壳体;5、显示屏;6、第一PCB板组件;8、垫柱;81、顶块;82、圆筒;83、插杆;84、弹簧;85、缓冲套;9、显示屏散热板;10、板卡散热板。1. Part A; 2. Part B; 3. Flexible belt; 4. Housing; 41. Front housing; 42. Rear housing; 5. Display screen; 6. First PCB board assembly; 8. Pad Column; 81, top block; 82, cylinder; 83, inserting rod; 84, spring; 85, buffer sleeve; 9, display cooling plate; 10, board cooling plate.

具体实施方式Detailed ways

下面结合附图及具体实施例对本发明再作进一步详细的说明。在本发明的描述中,相关方位或位置关系为基于图1所示的方位或位置关系,其中,“上”、“下”是指图1的上下方向,以图1为例,垂直纸面向上为上,垂直纸面向下为下,垂直纸面向左为左,垂直纸面向右为右,垂直纸面向内为前,垂直纸面向外为后,左右方向为横向,上下方向为竖向。需要理解的是,这些方位术语仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. In the description of the present invention, the relevant orientation or positional relationship is based on the orientation or positional relationship shown in Figure 1, wherein "up" and "down" refer to the up and down directions of Figure 1, taking Figure 1 as an example, the vertical paper faces Up is up, vertical paper is down, vertical paper is left, vertical paper is right, vertical paper is front, vertical paper is front, vertical paper is outward, left and right is horizontal, and up and down is vertical. It should be understood that these orientation terms are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as an important aspect of the present invention. limits.

在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以通过具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention based on specific situations.

另外,在本发明中的“第一”、“第二”等描述,仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量或顺序。由此,限定有“第一”、“第二”的特征可以明示或隐含地包括至少一个该特征。在本发明的描述中,“多个”的含义是至少两个,例如两个、三个等,除非另有明确具体的限定。In addition, descriptions such as "first" and "second" in the present invention are only used for description purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity or order of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

第一实施例:First embodiment:

参照图1和图2,本申请实施例提供了一种头戴式数字像源,包括A目部件1、B目部件2和柔性带3;Referring to Fig. 1 and Fig. 2, the embodiment of the present application provides a head-mounted digital image source, including item A part 1, part B part 2 and flexible belt 3;

A目部件1、B目部件2均安装在外部的头盔上,A目部件1分别与外部供电设备以及外部信号传输设备电连接;Both item A component 1 and item B component 2 are installed on the external helmet, and item A component 1 is electrically connected to external power supply equipment and external signal transmission equipment respectively;

A目部件1、B目部件2均包括壳体4、显示屏5;A目部件1、B目部件2上分别还安装有第一PCB板组件6、第二PCB板组件;显示屏5安装在对应的壳体4上,A目部件1上的显示屏5、B目部件2上的显示屏5分别与第一PCB板组件6、第二PCB板组件电连接;Item A component 1 and item B component 2 both include a housing 4 and a display screen 5; the first PCB board assembly 6 and the second PCB board assembly are installed on the item A item 1 and the item B item 2 respectively; the display screen 5 is installed On the corresponding housing 4, the display screen 5 on the A-item component 1 and the display screen 5 on the B-item component 2 are electrically connected to the first PCB board assembly 6 and the second PCB board assembly respectively;

第一PCB板组件6、第二PCB板组件通过柔性带3进行DVI信号传输;本发明采用柔性带3电连接,相对常规的电连接方式,减少了A目部件1、B目部件2的尺寸与重量,A目部件1、B目部件2之间的DVI信号传输,采用柔性带3替代常规连接器线缆传输,解决了传输信号从结构件出线的难题,同时可以压缩壳体4侧面的尺寸,柔性带3具有重量轻,尺寸小,同时具有较好的电磁屏蔽性能。The first PCB board assembly 6 and the second PCB board assembly carry out DVI signal transmission through the flexible belt 3; the present invention adopts the flexible belt 3 to be electrically connected, and compared with the conventional electrical connection method, the size of the A-item component 1 and the B-item component 2 is reduced In terms of weight and weight, the DVI signal transmission between A-item 1 and B-item 2 uses a flexible belt 3 instead of a conventional connector cable for transmission, which solves the problem that the transmission signal goes out from the structural part, and can compress the side of the housing 4 at the same time. size, the flexible belt 3 is light in weight, small in size, and has better electromagnetic shielding performance.

柔性带3由聚酰亚胺、胶层、铜箔和保护层组成,具有轻、薄、柔、韧的特性,耐候性好,弯折性能佳,可靠性高,在市面上得到广泛使用。为提高整机的电磁兼容性能,在柔性带3的外层包裹一层黑色导电布胶带,并使柔性带3与外界隔离,降低了柔性带3的电磁辐射,同时提高了本发明的抗干扰能力。The flexible belt 3 is composed of polyimide, adhesive layer, copper foil and protective layer. It is light, thin, flexible and tough, has good weather resistance, good bending performance and high reliability, and is widely used in the market. In order to improve the electromagnetic compatibility performance of the whole machine, a layer of black conductive cloth tape is wrapped on the outer layer of the flexible belt 3, and the flexible belt 3 is isolated from the outside world, which reduces the electromagnetic radiation of the flexible belt 3 and improves the anti-interference of the present invention at the same time ability.

柔性带3的厚度为0.5mm,与壳体4的连接处有0.7mm的缝隙,导电布的厚度为0.3mm,壳体4内部零部件装入后,在搭接处使用GD414胶进行紧固,柔性带3与壳体4内部零部件不会发生摩擦。The thickness of the flexible belt 3 is 0.5mm, and there is a gap of 0.7mm at the connection with the shell 4. The thickness of the conductive cloth is 0.3mm. After the internal parts of the shell 4 are installed, use GD414 glue to fasten the joint , The flexible belt 3 will not rub against the internal components of the housing 4 .

在本实施例中,所述壳体4包括前壳体41和后壳体42;前壳体41上开设有成像孔,显示屏5安装在前壳体41的成像孔内,后壳体42可拆卸的安装在前壳体41上。In this embodiment, the housing 4 includes a front housing 41 and a rear housing 42; the front housing 41 is provided with an imaging hole, the display screen 5 is installed in the imaging hole of the front housing 41, and the rear housing 42 It is detachably mounted on the front case 41 .

前壳体41和后壳体42采用7系铝合金整块铣制而成;在便于产品安装的同时,减少了产品零部件数量,提高了产品的整体性,增强了产品刚度、强度,同时有效提高了整机的固有频率,增强了产品的抗振动冲击性能,提高了产品的可装配性和可维修性。The front shell 41 and the rear shell 42 are milled from 7-series aluminum alloy as a whole; while facilitating product installation, the number of product parts is reduced, the integrity of the product is improved, and the rigidity and strength of the product are enhanced. It effectively improves the natural frequency of the whole machine, enhances the anti-vibration and shock performance of the product, and improves the assemblability and maintainability of the product.

在本实施例中,前壳体41和后壳体42的表面上设置有倒角,前壳体41和后壳体42的各棱边的倒角为R0.6mm,前壳体41和后壳体42的安装面的倒角为R2mm。壳体4采用倒角设计,能避免用户划伤。In this embodiment, chamfers are provided on the surfaces of the front case 41 and the rear case 42, and the chamfers of the edges of the front case 41 and the rear case 42 are R0.6mm. The front case 41 and the rear case The chamfer of the mounting surface of the case 42 is R2mm. The housing 4 adopts chamfering design, which can prevent users from being scratched.

在本实施例中,所述壳体4的上部采用倾斜设计,所述壳体4上部的倾斜角度在100~120度之间。In this embodiment, the upper part of the housing 4 adopts an inclined design, and the inclination angle of the upper part of the housing 4 is between 100-120 degrees.

优选的,所述壳体4上部的倾斜角度在106.9度,从人机工程学的角度考虑,为避免人头与数字像源的壳体4磕碰,需增大人头与数字像源的壳体4的距离。因此,数字像源后端设计为倾斜布置,经与头盔模型匹配,数字像源壳体4倾斜角度设计为106.9°时,为最大倾斜角度(此时,数字像源与头盔模型的最小距离为0.7mm)。Preferably, the inclination angle of the upper part of the housing 4 is 106.9 degrees. From the perspective of ergonomics, in order to avoid the collision between the human head and the housing 4 of the digital image source, it is necessary to increase the housing 4 of the human head and the digital image source. distance. Therefore, the rear end of the digital image source is designed to be inclined. After matching with the helmet model, when the inclination angle of the digital image source housing 4 is designed to be 106.9°, it is the maximum inclination angle (at this time, the minimum distance between the digital image source and the helmet model is 0.7mm).

在本实施例中,所述壳体4的材质为铝合金,壳体4的壁厚为0.5~2mm。优选的,所述壳体4选用7系铝合金(牌号:7075),其具有较高强度,良好的抗腐蚀性,优异的可加工性、可焊接性,氧化效果好,广泛应用于有较高强度要求和较高的抗腐蚀性要求的各种工业产品中。为提高产品的抗腐蚀性能,壳体4的外表面采用黑色阳极氧化处理,同时,壳体4内侧面采用黄色导电氧化处理,以确保产品的电连续性。In this embodiment, the material of the housing 4 is aluminum alloy, and the wall thickness of the housing 4 is 0.5-2 mm. Preferably, the housing 4 is made of 7-series aluminum alloy (grade: 7075), which has high strength, good corrosion resistance, excellent machinability, weldability, and good oxidation effect, and is widely used in relatively Various industrial products that require high strength and high corrosion resistance. In order to improve the anti-corrosion performance of the product, the outer surface of the housing 4 is treated with black anodic oxidation, and at the same time, the inner surface of the housing 4 is treated with yellow conductive oxidation to ensure the electrical continuity of the product.

优选的,所述壳体4的壁厚为0.6mm,壳体4采用此壁厚可以保证壳体4能满足技术协议环境试验要求的结构刚度和强度,同时又能够尽可能的减轻产品重量,实现整机轻量化设计。由于铝合金相对钢材偏软,屈服强度相对较低,所以壁厚低于0.6mm时,抗变形能力较低,使用风险较大。Preferably, the wall thickness of the housing 4 is 0.6 mm, and the use of this wall thickness of the housing 4 can ensure that the housing 4 can meet the structural rigidity and strength required by the environmental test of the technical agreement, and at the same time reduce the weight of the product as much as possible. Realize the lightweight design of the whole machine. Since aluminum alloy is softer than steel and has relatively low yield strength, when the wall thickness is less than 0.6mm, the deformation resistance is low and the risk of use is high.

在本实施例中,所述显示屏5选用OLED屏。OLED屏具有高对比度、屏幕显示响应时间小,自发光(无需背光膜组)、功耗低、低温无需额外加热(低温LCD显示屏液晶分子响应时间慢容易引起显示拖尾)等优势,广泛应用于头盔显示,AR、VR等场景中。OLED屏表面镀AR减反膜。In this embodiment, the display screen 5 is an OLED screen. OLED screen has the advantages of high contrast, short screen display response time, self-illumination (no need for backlight film group), low power consumption, no additional heating at low temperature (slow liquid crystal molecule response time of low temperature LCD screen is easy to cause display smearing), etc., widely used In helmet display, AR, VR and other scenarios. The surface of the OLED screen is coated with AR anti-reflection film.

在本实施例中,所述第一PCB板组件6和第二PCB板组件均包括电源板和驱动板;In this embodiment, the first PCB assembly 6 and the second PCB assembly both include a power supply board and a drive board;

电源板和驱动板上集成有多种不同的元器件,元器件选型主要优选宇航级、国内普军级、军标级器件电子元器件;阻容器件采用目录内宇航级器件,且电阻功率、电容电压、结温等降额均达到Ⅰ级降额标准以上,提高产品的可靠性。There are many different components integrated on the power supply board and the driver board. The selection of components is mainly aerospace-grade, domestic general military-grade, and military-standard electronic components; resistance capacitor devices use aerospace-grade devices in the catalog, and the resistance power , Capacitor voltage, junction temperature and other deratings all reach above the first-level derating standard, which improves the reliability of the product.

第一PCB板组件6上的电源板、第一PCB板组件6上的驱动板相互电连接;第二PCB板组件上的电源板、第二PCB板组件上的驱动板相互电连接;The power board on the first PCB board assembly 6 and the driving board on the first PCB board assembly 6 are electrically connected to each other; the power board on the second PCB board assembly and the driving board on the second PCB board assembly are electrically connected to each other;

第一PCB板组件6和第二PCB板组件上发热大的元器件底层铺多层铜皮,以增大散热能力;元器件安装时,功耗相对较大的元器件直接贴近壳体4的内壁安装,并在其与壳体4的接合面位置处填涂具有较高导热系数的导热硅脂,以降低接合面的接触热阻。On the first PCB board assembly 6 and the second PCB board assembly, the bottom layer of the components with high heat generation is covered with multiple layers of copper to increase the heat dissipation capacity; when the components are installed, the components with relatively large power consumption are directly close to the shell 4 The inner wall is installed, and the position of the joint surface with the shell 4 is filled with heat-conducting silicone grease with a higher thermal conductivity to reduce the contact thermal resistance of the joint surface.

第一PCB板组件6和第二PCB板组件上的电源板均集成有多颗DC/DC电源芯片;DC/DC电源芯片用于对输入电压进行转换;第一PCB板组件6上还安装有连接器,A目部件1通过连接器与外部信号传输设备电连接;The power boards on the first PCB board assembly 6 and the second PCB board assembly are all integrated with multiple DC/DC power supply chips; the DC/DC power supply chips are used to convert the input voltage; the first PCB board assembly 6 is also installed with Connector, item A component 1 is electrically connected with external signal transmission equipment through the connector;

第一PCB板组件6和第二PCB板组件上的驱动板均集成有屏幕驱动电源芯片和DVI转MIPI芯片;屏幕驱动电源芯片用于向对应的显示屏5提供驱动电源;DVI转MIPI芯片用于将输入的DVI信号转换成MIPI信号,并传输给对应的显示屏5进行显示;第一PCB板组件6上的驱动板上还集成有DVI分配器,用于将外部输入的DVI信号一分为二,并分别传输到第一PCB板组件6的DVI转MIPI芯片上以及第二PCB板组件的DVI转MIPI芯片上。DVI信号的传输距离较远,抗干扰能力强。The drive boards on the first PCB board assembly 6 and the second PCB board assembly are all integrated with a screen drive power chip and a DVI to MIPI chip; the screen drive power chip is used to provide drive power to the corresponding display screen 5; the DVI to MIPI chip is used It is used to convert the input DVI signal into a MIPI signal, and transmit it to the corresponding display screen 5 for display; the driver board on the first PCB board assembly 6 is also integrated with a DVI splitter, which is used to divide the externally input DVI signal are two, and are respectively transmitted to the DVI-to-MIPI chip of the first PCB board assembly 6 and the DVI-to-MIPI chip of the second PCB board assembly. The transmission distance of the DVI signal is relatively long, and the anti-interference ability is strong.

在本实施例中,所述头戴式数字像源还包括多个垫柱8,多个垫柱8均分成两组,其中一组垫柱8用于连接第一PCB板组件6上的电源板和驱动板,另一组垫柱8用于连接第二PCB板组件上的电源板和驱动板;In this embodiment, the head-mounted digital image source further includes a plurality of pads 8, and the plurality of pads 8 are divided into two groups, wherein one group of pads 8 is used to connect the power supply on the first PCB assembly 6 board and the driver board, another set of pads 8 are used to connect the power board and the driver board on the second PCB board assembly;

两块电源板和两块驱动板的边缘位置处均开设有多个圆孔,多个垫柱8分别转动连接在多个对应的圆孔内。The edge positions of the two power supply boards and the two driving boards are provided with a plurality of round holes, and the plurality of spacers 8 are respectively rotatably connected in a plurality of corresponding round holes.

在本实施例中,所述垫柱8的中部设置为圆柱状,且垫柱8的中部从电源板和驱动板的边缘位置处向外凸出;所述垫柱8的材质为绝缘材料。通过设置多组垫柱8,能方便将第一PCB板组件6和第二PCB板组件安装在对应的壳体4的内侧,同时能有效避免第一PCB板组件6上的电源板、驱动板以及第二PCB板组件上的电源板、驱动板短路,提高第一PCB板组件6和第二PCB板组件的使用寿命。In this embodiment, the middle part of the pad 8 is configured as a cylinder, and the middle part of the pad 8 protrudes outward from the edge positions of the power board and the driving board; the material of the pad 8 is insulating material. By arranging multiple sets of pad columns 8, it is convenient to install the first PCB board assembly 6 and the second PCB board assembly on the inner side of the corresponding housing 4, and at the same time, it can effectively prevent the power supply board and the driving board on the first PCB board assembly 6. And the power supply board and the driving board on the second PCB board assembly are short-circuited to improve the service life of the first PCB board assembly 6 and the second PCB board assembly.

参照图6,在本实施例中,垫柱8是一个组件,所述垫柱8包括两个顶块81、圆筒82、两根插杆83、弹簧84和缓冲套85;Referring to FIG. 6 , in this embodiment, the spacer 8 is an assembly, and the spacer 8 includes two top blocks 81 , a cylinder 82 , two insertion rods 83 , a spring 84 and a buffer sleeve 85 ;

两个顶块81插装在所述圆筒82两侧的内孔中,所述顶块81上远离所述圆筒82的一侧设置为半球状,所述顶块81上朝向所述圆筒82的一侧开设有插孔,两根所述插杆83插装在所述圆筒82的两侧,且两根所述插杆83分别从两个所顶块81的插孔内穿过,所述弹簧84设置在圆筒82的内侧,且所述弹簧84的两端分别抵接在两个所述顶块81上,所述缓冲套85套装在所述圆筒82的外圈中部。所述缓冲套85和两个所述顶块81抵接在壳体4的内壁上。Two top blocks 81 are inserted in the inner holes on both sides of the cylinder 82, the side of the top block 81 away from the cylinder 82 is set in a hemispherical shape, and the top block 81 faces the circle. One side of the barrel 82 is provided with jacks, and the two inserting rods 83 are inserted on both sides of the cylinder 82, and the two inserting rods 83 pass through the jacking holes of the two jacking blocks 81 respectively. However, the spring 84 is arranged inside the cylinder 82, and the two ends of the spring 84 abut against the two top blocks 81 respectively, and the buffer sleeve 85 is sleeved on the outer ring of the cylinder 82. middle part. The buffer sleeve 85 and the two top blocks 81 abut against the inner wall of the housing 4 .

由于本发明设置在头盔上,在日常使用的过程中,本发明会频繁的振动,通过设置多组垫柱8,可提高第一PCB板组件6和第二PCB板组件的抗震性能,避免第一PCB板组件6和第二PCB板组件上的元器件在振动过程中脱落受损。同时由于垫柱8与电源板、驱动板转动连接,该设计能便于将第一PCB板组件6和第二PCB板组件装入到所述壳体4的内侧。Since the present invention is arranged on the helmet, in the process of daily use, the present invention will frequently vibrate, and by setting multiple groups of pads 8, the shock resistance of the first PCB board assembly 6 and the second PCB board assembly can be improved, and the second PCB board assembly can be avoided. The components on the first PCB board assembly 6 and the second PCB board assembly fall off and are damaged during vibration. At the same time, because the pad column 8 is rotatably connected with the power supply board and the driving board, this design can facilitate the installation of the first PCB board assembly 6 and the second PCB board assembly into the inner side of the housing 4 .

另外,所述壳体4的高度方向设置为倾斜状,所述壳体4的上层截面积小于下层截面积,由于本发明中A目部件1和B目部件2通过柔性带3进行连接,柔性带3的两端分别电连接在第一PCB板组件6和第二PCB板组件上,该设计,在柔性带3不小心被拉扯时,柔性带3将拖动第一PCB板组件6和第二PCB板组件向上滑动一定距离,然后在柔性带3不受力时,在弹簧84和两个顶块81的作用下,第一PCB板组件6和第二PCB板组件在多组垫柱8的作用下复位,该机构,可起到缓冲和保护作用,能有效避免柔性带3在不小心被拖拽的情况下,直接从第一PCB板组件6和第二PCB板组件脱落。In addition, the height direction of the housing 4 is set in an inclined shape, and the upper cross-sectional area of the housing 4 is smaller than the lower cross-sectional area. Because the A-order part 1 and the B-order part 2 are connected by a flexible belt 3 in the present invention, the flexibility The two ends of the belt 3 are respectively electrically connected to the first PCB board assembly 6 and the second PCB board assembly. In this design, when the flexible belt 3 is accidentally pulled, the flexible belt 3 will drag the first PCB board assembly 6 and the second PCB board assembly. The second PCB board assembly slides upward for a certain distance, and then when the flexible belt 3 is not stressed, under the action of the spring 84 and the two top blocks 81, the first PCB board assembly 6 and the second PCB board assembly 6 and the second PCB board assembly are placed on multiple sets of pad columns 8 Reset under the action of the mechanism, this mechanism can play the role of cushioning and protection, and can effectively prevent the flexible belt 3 from falling off directly from the first PCB board assembly 6 and the second PCB board assembly when the flexible belt 3 is accidentally dragged.

在本实施例中,所述头戴式数字像源还包括两个I2C连接口,两个I2C连接口分别电连接在A目部件1上的显示屏5、B目部件2上的显示屏5上,用于对第一PCB板组件6、第二PCB板组件进行初始化配置。In this embodiment, the head-mounted digital image source also includes two I2C connection ports, and the two I2C connection ports are respectively electrically connected to the display screen 5 on the A-item component 1 and the display screen 5 on the B-item component 2 above, for initial configuration of the first PCB board assembly 6 and the second PCB board assembly.

在本实施例中,所述头戴式数字像源还包括两个信号复位接口,用于进行信号复位;两个信号复位接口分别电连接在第一PCB板组件6、第二PCB板组件上。In this embodiment, the head-mounted digital image source also includes two signal reset interfaces for signal reset; the two signal reset interfaces are electrically connected to the first PCB board assembly 6 and the second PCB board assembly respectively .

头戴式数字像源的原理框图如图3所示,A目部件1的接收DVI信号后,将DVI视频信号一分为二,一路进入A目部件1的驱动板上,通过该驱动板上的DVI转MIPI芯片将DVI信号转换成MIPI信号,并通过A目部件1上的显示屏5显示成像;The principle block diagram of the head-mounted digital image source is shown in Figure 3. After receiving the DVI signal, the A-item component 1 divides the DVI video signal into two, and all the way enters the driver board of the A-item component 1. The DVI-to-MIPI chip converts the DVI signal into a MIPI signal, and displays the image through the display screen 5 on the A-item component 1;

另一路进入B目部件2的驱动板上,通过该驱动板上的DVI转MIPI芯片将DVI信号转换成MIPI信号,并通过B目部件2上的显示屏5显示成像。The other way enters the driver board of the B-item component 2, and the DVI-to-MIPI chip on the drive plate converts the DVI signal into a MIPI signal, and displays the image through the display screen 5 on the B-item component 2.

第一PCB板组件6上的电源板和第二PCB板组件上的电源板用于接收DC5V电源输入,并转换成各元器件所需电压。The power board on the first PCB board assembly 6 and the power board on the second PCB board assembly are used to receive DC5V power input and convert it into the voltage required by each component.

在本实施例中,A目部件1的电源+5V输入口采用大功率1.5kW TVS管J-SMD5.0CA进行吸收,满足系统静电防护等级要求,两个I2C连接口以及两个复位信号接口同样采用TVS管进行静电保护;连接器在进行静电保护的同时采用共模电感与电容匹配进行滤波设计;连接器静电防护电路图如图5所示。In this embodiment, the power supply +5V input port of item A component 1 is absorbed by a high-power 1.5kW TVS tube J-SMD5.0CA, which meets the requirements of the system’s electrostatic protection level. The two I2C connection ports and the two reset signal interfaces are the same Use TVS tubes for electrostatic protection; the connector uses common mode inductance and capacitance matching for filter design while performing electrostatic protection; the circuit diagram of the connector's electrostatic protection is shown in Figure 5.

在本实施例中,所述第一PCB板组件6和第二PCB板组件均还包括复位监控芯片和负载开关芯片,所述复位监控芯片选用SGM706-TYS8G/TR,SGM706-TYS8G/TR通过内部PCB走线,接入3.3V电源进行监控,并产生芯片上电复位信号,以实现信号复位;负载开关芯片选用SGM2554AYN5G/TR,SGM2554AYN5G/TR通过内部PCB走线,接入3.3V,作为3.3V开关以及限流保护使用,输出3.3V供给各内部芯片使用。In this embodiment, both the first PCB board assembly 6 and the second PCB board assembly also include a reset monitoring chip and a load switch chip. The reset monitoring chip is SGM706-TYS8G/TR, and SGM706-TYS8G/TR uses PCB routing, access to 3.3V power supply for monitoring, and generate chip power-on reset signal to realize signal reset; load switch chip uses SGM2554AYN5G/TR, SGM2554AYN5G/TR is connected to 3.3V through internal PCB routing, as 3.3V It is used for switch and current limiting protection, and outputs 3.3V for each internal chip.

在本实施例中,头戴式数字像源还包括两块显示屏散热板9和两块板卡散热板10,两块显示屏散热板9分别安装在A目部件1、B目部件2上的显示屏5的侧面上,两块板卡散热板10分别安装在第一PCB板组件6、第二PCB板组件的侧面上;通过增设两块显示屏散热板9和两块板卡散热板10,可提高本发明的散热性能,提升头戴式数字像源的使用寿命。In this embodiment, the head-mounted digital image source also includes two display screen heat sinks 9 and two board card heat sinks 10, and the two display screen heat sinks 9 are respectively installed on the A item part 1 and the B item part 2 On the side of the display screen 5, two board heat dissipation plates 10 are respectively installed on the sides of the first PCB board assembly 6 and the second PCB board assembly; by adding two display screen heat dissipation plates 9 and two board card heat dissipation plates 10. The heat dissipation performance of the present invention can be improved, and the service life of the head-mounted digital image source can be improved.

第二实施例:Second embodiment:

一种头戴式数字像源的配置方法,用于对以上所述的头戴式数字像源上的显示屏5进行初始化配置,具体包括如下步骤:A method for configuring a head-mounted digital image source, which is used to initialize the display screen 5 on the above-mentioned head-mounted digital image source, specifically comprising the following steps:

步骤S1、向A目部件1和/或B目部件2发送RST复位信号;Step S1, sending an RST reset signal to the component 1 of item A and/or the component 2 of item B;

步骤S2、通过对应的I2C连接口向A目部件1和/或B目部件2发送自检信号,A目部件1和/或B目部件2进行自检,待自检合格后,进入到下一步;Step S2, send a self-inspection signal to A-item component 1 and/or B-item component 2 through the corresponding I2C connection port, A-item component 1 and/or B-item component 2 perform a self-test, and after the self-test passes, enter the next step. step;

步骤S3、通过对应的I2C连接口向A目部件1和/或B目部件2发送DVI转MIPI芯片配置文件,DVI转MIPI芯片对配置文件进行效验和读写;Step S3, sending the DVI-to-MIPI chip configuration file to the A-item component 1 and/or B-item component 2 through the corresponding I2C connection port, and the DVI-to-MIPI chip performs verification, read and write of the configuration file;

步骤S4、通过对应的I2C连接口向A目部件1和/或B目部件2发送显示屏5唤醒命令和默认亮度命令,显示屏5唤醒并常亮;Step S4, send the display 5 wake-up command and the default brightness command to the A-item component 1 and/or B-item component 2 through the corresponding I2C connection port, and the display screen 5 wakes up and is always on;

步骤S5、A目部件1和B目部件2均安装有自检寄存器和温度寄存器;轮询A目部件1和/或B目部件2的自检寄存器信息,并检测显示屏5的工作信息、DVI转MIPI芯片的工作信息和温度寄存器是否正常;如果正常,初始化配置完成;如果不合格,进入到步骤S6;Step S5, A item part 1 and B item part 2 are equipped with self-inspection registers and temperature registers; poll the self-inspection register information of A item part 1 and/or B item part 2, and detect the working information of the display screen 5, Whether the working information and temperature register of the DVI to MIPI chip are normal; if normal, the initialization configuration is completed; if unqualified, enter step S6;

步骤S6、认定A目部件1和/或B目部件2异常,并向外反馈设备异常的信息。Step S6, confirming that the component 1 of item A and/or the component 2 of item B are abnormal, and feeding back information about the abnormality of the equipment.

以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。并且,本发明各个实施方式之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present invention. covered within the protection scope of the present invention. Moreover, the technical solutions of the various embodiments of the present invention can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered as a combination of technical solutions. Does not exist, nor is it within the scope of protection required by the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (10)

CN202310361824.0A2023-04-062023-04-06 A head-mounted digital image source and configuration methodPendingCN116520575A (en)

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