技术领域technical field
本发明涉及光电信号转换技术领域，尤其涉及一种光收发模块和光收发装置。The invention relates to the technical field of photoelectric signal conversion, in particular to an optical transceiver module and an optical transceiver device.
背景技术Background technique
目前的光收发模块通常采用双密度四通道小型可插拔封装(Quad Small FormFactor Pluggable-Double Density，QSFP-DD)，由于QSFP-DD对于光收发模块的尺寸具有一定限制，而光收发模块的接收端和发射器的信号质量对于光收发模块性能有着十分关键的影响，接收端和发射器之间的串扰是影响信号质量最重要的因素之一。因此，如何在预设尺寸范围内解决光收发模块的接收端和发射器之间信号的串扰问题，成为目前亟需解决的问题。The current optical transceiver modules usually use Quad Small FormFactor Pluggable-Double Density (QSFP-DD), because QSFP-DD has a certain limit on the size of the optical transceiver module, and the receiver of the optical transceiver module The signal quality of the receiver and the transmitter has a critical impact on the performance of the optical transceiver module, and the crosstalk between the receiver and the transmitter is one of the most important factors affecting the signal quality. Therefore, how to solve the problem of signal crosstalk between the receiving end and the transmitter of the optical transceiver module within the predetermined size range has become an urgent problem to be solved at present.
发明内容Contents of the invention
本发明实施例期望提供一种光收发模块和光收发装置，能够在保证光收发模块的尺寸满足预设要求的同时，减小光收发模块的接收端和发送端之间信号的串扰。Embodiments of the present invention expect to provide an optical transceiver module and an optical transceiver device, which can reduce signal crosstalk between the receiving end and the transmitting end of the optical transceiver module while ensuring that the size of the optical transceiver module meets preset requirements.
本发明的技术方案是这样实现的：Technical scheme of the present invention is realized like this:
本发明实施例提供了一种光收发模块，包括：An embodiment of the present invention provides an optical transceiver module, including:
至少一对收发器，所述至少一对收发器中的每对收发器均包括发送端、至少两层电路板和接收端；其中，At least one pair of transceivers, each pair of transceivers in the at least one pair of transceivers includes a transmitting end, at least two layers of circuit boards and a receiving end; wherein,
所述发送端与数字信号处理模块的输出端口连接，用于将待转换电信号转换为对应的目标光信号，并发送所述目标光信号至光器件；The sending end is connected to the output port of the digital signal processing module, and is used to convert the electrical signal to be converted into a corresponding target optical signal, and send the target optical signal to the optical device;
所述接收端与所述数字信号处理模块的输入端口连接，用于将接收到的光信号转换为电信号，并发送所述电信号至所述数字信号处理模块，以便所述数字信号处理模块将所述电信号转换为目标电信号并发送至电器件；The receiving end is connected to the input port of the digital signal processing module, and is used to convert the received optical signal into an electrical signal, and send the electrical signal to the digital signal processing module, so that the digital signal processing module converting the electrical signal into a target electrical signal and sending it to an electrical device;
所述发送端固定在第一电路板上，且与第一接地平面连接，形成发送回路；所述接收端固定在第二电路板上，且与第二接地平面连接，形成接收回路；所述第一接地平面和所述第二接地平面均设置在所述至少两层电路板中不同层的电路板中；The sending end is fixed on the first circuit board and connected to the first ground plane to form a sending loop; the receiving end is fixed on the second circuit board and connected to the second ground plane to form a receiving loop; Both the first ground plane and the second ground plane are arranged in circuit boards of different layers in the at least two-layer circuit boards;
所述至少两层电路板呈层叠结构。The at least two layers of circuit boards are in a laminated structure.
上述方案中，In the above scheme,
所述至少两层电路板还包括：The at least two-layer circuit board also includes:
至少一层隔离板，所述至少一层隔离板重叠固定在所述第一电路板和所述第二电路板之间呈层叠结构。At least one layer of isolation boards, the at least one layer of isolation boards are overlapped and fixed between the first circuit board and the second circuit board to form a stacked structure.
上述方案中，In the above scheme,
所述第一接地平面设于所述第一电路板上，或者设于第一接地板上；所述第二接地平面设于所述第二电路板上，或者设于第二接地板上；其中，所述第一接地板为所述至少两层电路板中与所述第一电路板相邻的电路板；所述第二接地板为所述至少两层电路板中与所述第二电路板相邻的电路板。The first ground plane is set on the first circuit board, or on the first ground plane; the second ground plane is set on the second circuit board, or on the second ground plane; Wherein, the first ground plane is a circuit board adjacent to the first circuit board among the at least two-layer circuit boards; the second ground plane is a circuit board adjacent to the second circuit board among the at least two-layer circuit boards A circuit board adjacent to a circuit board.
上述方案中，In the above scheme,
所述第一接地平面设于所述第一接地板靠近所述第一电路板的一侧；所述第二接地平面设于所述第二接地板靠近所述第二电路板的一侧。The first ground plane is disposed on a side of the first ground plane close to the first circuit board; the second ground plane is disposed on a side of the second ground plane close to the second circuit board.
上述方案中，In the above scheme,
所述至少两层电路板均设有导通孔。The at least two circuit boards are provided with via holes.
上述方案中，In the above scheme,
当所述第一电路板与所述第一接地板之间存在所述至少一层隔离板时，所述发送端利用导线穿过对应的所述导通孔与所述第一接地板连接；When there is the at least one layer of isolation board between the first circuit board and the first ground plate, the sending end is connected to the first ground plate through the corresponding via hole through a wire;
当所述第二电路板与所述第二接地板之间存在所述至少一层隔离板时，所述接收端利用所述导线穿过对应的所述导通孔与所述第二接地板连接。When there is the at least one layer of isolation board between the second circuit board and the second ground plate, the receiving end uses the wire to pass through the corresponding via hole and the second ground plate connect.
上述方案中，In the above scheme,
所述发送端在所述第二电路板上的投影区域与所述接收端所在的区域不重叠。The projection area of the sending end on the second circuit board does not overlap with the area where the receiving end is located.
上述方案中，In the above scheme,
所述第二电路板的外表面上设置有支撑块，所述支撑块贯穿所述第二电路板至所述第一电路板，所述发送端设置在所述第一电路板的所述支撑块上。A support block is provided on the outer surface of the second circuit board, the support block passes through the second circuit board to the first circuit board, and the sending end is provided on the support of the first circuit board on the block.
上述方案中，In the above scheme,
所以发送端的第一侧低于或者平齐于所述第一电路板的外表面；所述发送端的第一侧为平行于所述第一电路板，且远离所述支撑块的一侧。Therefore, the first side of the sending end is lower than or flush with the outer surface of the first circuit board; the first side of the sending end is parallel to the first circuit board and away from the side of the supporting block.
上述方案中，In the above scheme,
所述接收端包括N个端口；The receiving end includes N ports;
所述N个端口分别设置在所述第二电路板上的所述支撑块的两侧，或者，The N ports are respectively arranged on both sides of the support block on the second circuit board, or,
所述N个端口均设置在所述第二电路板上的所述支撑块的一侧。The N ports are all arranged on one side of the supporting block on the second circuit board.
上述方案中，In the above scheme,
所述第一电路板所述至少两层电路板中的第一层电路板，所述第二电路板为所述至少两层电路板中的最后一层电路板。The first circuit board is a first-layer circuit board among the at least two-layer circuit boards, and the second circuit board is a last-layer circuit board among the at least two-layer circuit boards.
上述方案中，In the above scheme,
所述发送端通过第一导线与所述数字信号处理模块连接，所述接收端通过第二导线与所述数字信号处理模块连接；其中，所述第一导线与所述第二导线分别设置在至少两层电路板中不同层的电路板中，或者贯穿所述至少两层电路板上的所述导通孔至所述数字信号处理模块。The sending end is connected to the digital signal processing module through a first wire, and the receiving end is connected to the digital signal processing module through a second wire; wherein, the first wire and the second wire are respectively arranged on In circuit boards of different layers in the at least two-layer circuit boards, or through the via holes on the at least two-layer circuit boards to the digital signal processing module.
上述方案中，In the above scheme,
所述第一导线设置在所述第一电路板的外表面，所述第二导线贯穿所述至少两层电路板上的所述导通孔至所述数字信号处理模块；或者，The first wire is arranged on the outer surface of the first circuit board, and the second wire passes through the via hole on the at least two-layer circuit board to the digital signal processing module; or,
所述第二导线设置在所述第二电路板的外表面，所述第一导线贯穿所述至少两层电路板上的所述导通孔至所述数字信号处理模块。The second wire is arranged on the outer surface of the second circuit board, and the first wire passes through the via hole on the at least two-layer circuit board to the digital signal processing module.
本发明实施例提供一种光收发装置，所述装置包括如本发明实施例所述的光收发模块、数字信号处理模块、电器件和光器件；其中，An embodiment of the present invention provides an optical transceiver device, which includes an optical transceiver module, a digital signal processing module, an electrical device, and an optical device as described in the embodiment of the present invention; wherein,
所述电器件与所述数字信号处理模块耦接，所述数字信号处理模块与所述光收发模块耦接，所述光收发模块与所述光器件耦接；The electrical device is coupled to the digital signal processing module, the digital signal processing module is coupled to the optical transceiver module, and the optical transceiver module is coupled to the optical device;
所述数字信号处理模块，用于将所述电器件发送的电信号进行处理以得到待转换电信号，将所述待转换电信号发送至所述光收发模块中的发送端，以便所述发送端将所述待转换电信号转换为目标光信号；The digital signal processing module is configured to process the electrical signal sent by the electrical device to obtain an electrical signal to be converted, and send the electrical signal to be converted to the sending end in the optical transceiver module, so that the sending The terminal converts the electrical signal to be converted into a target optical signal;
或者，将所述光收发模块中接收端发送的电信号转换为目标电信号，将所述目标电信号发送至所述电器件；Or, converting the electrical signal sent by the receiving end in the optical transceiver module into a target electrical signal, and sending the target electrical signal to the electrical device;
所述光器件，用于接收所述发送端发送的目标光信号，或者发送光信号至所述接收端；The optical device is used to receive the target optical signal sent by the sending end, or send the optical signal to the receiving end;
所述电器件，用于接收所述数字信号处理模块发送的所述目标电信号，或者发送所述电信号至所述数字信号处理模块。The electrical device is configured to receive the target electrical signal sent by the digital signal processing module, or send the electrical signal to the digital signal processing module.
上述方案中，In the above scheme,
所述数字信号处理模块设置在第一电路板上，第二电路板利用第二导线贯穿至少两层电路板上的导通孔至所述第一电路板，与所述数字信号处理模块连接。The digital signal processing module is arranged on the first circuit board, and the second circuit board is connected to the digital signal processing module by passing through the via holes on at least two layers of circuit boards to the first circuit board by means of second wires.
上述方案中，In the above scheme,
所述数字信号处理模块设置在第二电路板上，第一电路板利用第一导线贯穿至少两层电路板上的导通孔至所述第二电路板，与所述数字信号处理模块连接。The digital signal processing module is arranged on the second circuit board, and the first circuit board is connected to the digital signal processing module by passing through the via holes on at least two layers of the circuit boards to the second circuit board.
本发明实施例提供了一种光收发模块和光收发装置，上述光收发模块包括至少一对收发器，其中，每对收发器均包括发送端、至少两层电路板和接收端；发送端与数字信号处理模块的输出端口连接，接收端与数字信号处理模块的输入端口连接，发送端固定在第一电路板的上，且与第一接地平面连接，形成发送回路；接收端固定在第二电路板的上，且与第二接地平面连接，形成接收回路；第一接地平面和第二接地平面均设置在至少两层电路板中不同层的电路板中；至少两层电路板呈层叠结构。An embodiment of the present invention provides an optical transceiver module and an optical transceiver device. The optical transceiver module includes at least one pair of transceivers, wherein each pair of transceivers includes a transmitting end, at least two layers of circuit boards, and a receiving end; the transmitting end and the digital The output port of the signal processing module is connected, the receiving end is connected to the input port of the digital signal processing module, the sending end is fixed on the first circuit board, and connected to the first ground plane to form a sending loop; the receiving end is fixed on the second circuit board The board is connected to the second ground plane to form a receiving loop; both the first ground plane and the second ground plane are arranged in circuit boards of different layers in at least two layers of circuit boards; at least two layers of circuit boards are in a stacked structure.
本发明实施例通过将发送端与第一接地平面连接，接收端与第二接地平面以在不同层电路板中形成的发送回路和接收回路，可以减少接收端和发送端在进行信号的传输和转换时产生的电磁波对彼此的影响，从而减少接收端和发送端之间的信号的串扰，且由于电路板均呈层级固定，可以保证光收发模块的尺寸满足预设要求。In the embodiment of the present invention, by connecting the sending end to the first ground plane, and the receiving end to the second ground plane, the sending loop and the receiving loop formed in different layers of circuit boards can reduce the number of signal transmission and processing between the receiving end and the sending end. The influence of the electromagnetic waves generated during conversion on each other reduces the signal crosstalk between the receiving end and the sending end, and since the circuit boards are fixed in layers, it can ensure that the size of the optical transceiver module meets the preset requirements.
附图说明Description of drawings
图1为本发明实施例提供的一种光收发模块的结构示意图一；FIG. 1 is a schematic structural diagram of an optical transceiver module provided by an embodiment of the present invention;
图2为本发明实施例中提供的一种收发器的结构示意图(图中未示出至少两层电路板)；FIG. 2 is a schematic structural diagram of a transceiver provided in an embodiment of the present invention (at least two circuit boards are not shown in the figure);
图3为本发明实施例提供的一种光收发模块的侧面透视图；Fig. 3 is a side perspective view of an optical transceiver module provided by an embodiment of the present invention;
图4为本发明实施例提供的一种光收发模块的结构示意图二；FIG. 4 is a schematic structural diagram II of an optical transceiver module provided by an embodiment of the present invention;
图5为本发明实施例提供的一种光收发模块的俯视透视图；Fig. 5 is a top perspective view of an optical transceiver module provided by an embodiment of the present invention;
图6为本发明实施例提供的一种光收发模块的结构示意图三；FIG. 6 is a schematic structural diagram III of an optical transceiver module provided by an embodiment of the present invention;
图7为本发明实施例提供的一种光收发装置的结构框图。Fig. 7 is a structural block diagram of an optical transceiver provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
本发明实施例提供一种光收发模块，图1为本发明实施例提供的一种光收发模块的结构示意图一，如图1所示，上述光收发模块1包括：An embodiment of the present invention provides an optical transceiver module. FIG. 1 is a schematic structural diagram of an optical transceiver module provided by an embodiment of the present invention. As shown in FIG. 1 , the above-mentioned optical transceiver module 1 includes:
至少一对收发器11，至少一对收发器11中的每对收发器11均包括发送端111、至少两层电路板12和接收端112；其中，At least one pair of transceivers 11, each pair of transceivers 11 in the at least one pair of transceivers 11 includes a transmitting end 111, at least two layers of circuit boards 12 and a receiving end 112; wherein,
发送端111与数字信号处理模块2的输出端口连接，用于将待转换电信号转换为对应的目标光信号，并发送目标光信号至光器件4；The sending end 111 is connected to the output port of the digital signal processing module 2, and is used to convert the electrical signal to be converted into a corresponding target optical signal, and send the target optical signal to the optical device 4;
接收端112与数字信号处理模块2的输入端口连接，用于将接收到的光信号转换为电信号，并发送电信号至数字信号处理模块2，以便数字信号处理模块2将电信号转换为目标电信号并发送至电器件3；The receiving end 112 is connected to the input port of the digital signal processing module 2, and is used to convert the received optical signal into an electrical signal, and send the electrical signal to the digital signal processing module 2, so that the digital signal processing module 2 converts the electrical signal into a target and send the electrical signal to the electrical device 3;
发送端111固定在第一电路板121的上，且与第一接地平面连接，形成发送回路；接收端112固定在第二电路板122的上，且与第二接地平面连接，形成接收回路；第一接地平面和第二接地平面均设置在至少两层电路板12中不同层的电路板中；The sending end 111 is fixed on the first circuit board 121 and connected to the first ground plane to form a sending loop; the receiving end 112 is fixed on the second circuit board 122 and connected to the second ground plane to form a receiving loop; Both the first ground plane and the second ground plane are arranged in circuit boards of different layers in at least two layers of circuit boards 12;
至少两层电路板12呈层叠结构。At least two layers of circuit boards 12 are in a laminated structure.
本发明实施例中，图2为本发明实施例中提供的一种收发器的结构示意图(图中未示出至少两层电路板12)，如图2所示，收发器11用于实现光电信号的转换，每个光收发模块1中可以设置一个收发器11或多个收发器11。在实际应用过程中，收发器11可以分别与数字信号处理模块2和光器件4连接，而数字信号处理模块2与电器件3连接；当电器件3需要将电信号转换为光信号进行传输时，电器件3将电信号发送至数字信号处理模块2，数字信号处理模块2对电信号进行处理，将电信号构造成符合发送端111要求的待转换电信号，将待转换电信号发送至发送端111；发送端111接收到待转换电信号之后，将待转换电信号转换为对应的目标光信号，并将目标光信号输出至光器件4；接收端112接收到光器件4发送的光信号时，接收端112将上述光信号转换为对应的电信号，并将上述电信号发送至数字信号处理模块2，数字信号处理模块2将上述电信号构造成符合电器件3接收要求的目标电信号后，将目标电信号发送至电器件3，从而实现电器件3与光器件4之间的数据交互。In the embodiment of the present invention, Fig. 2 is a schematic structural diagram of a transceiver provided in the embodiment of the present invention (at least two layers of circuit boards 12 are not shown in the figure), as shown in Fig. 2, the transceiver 11 is used to realize optoelectronic For signal conversion, one transceiver 11 or multiple transceivers 11 can be set in each optical transceiver module 1 . In practical applications, the transceiver 11 can be connected to the digital signal processing module 2 and the optical device 4 respectively, and the digital signal processing module 2 is connected to the electrical device 3; when the electrical device 3 needs to convert an electrical signal into an optical signal for transmission, The electrical device 3 sends the electrical signal to the digital signal processing module 2, and the digital signal processing module 2 processes the electrical signal, constructs the electrical signal into an electrical signal to be converted that meets the requirements of the sending end 111, and sends the electrical signal to be converted to the sending end 111; after receiving the electrical signal to be converted, the transmitting end 111 converts the electrical signal to be converted into a corresponding target optical signal, and outputs the target optical signal to the optical device 4; when the receiving end 112 receives the optical signal sent by the optical device 4 , the receiving end 112 converts the above-mentioned optical signal into a corresponding electrical signal, and sends the above-mentioned electrical signal to the digital signal processing module 2, and the digital signal processing module 2 constructs the above-mentioned electrical signal into a target electrical signal that meets the receiving requirements of the electrical device 3 , to send the target electrical signal to the electrical device 3 , so as to realize data interaction between the electrical device 3 and the optical device 4 .
本发明实施例中，发送端111和接收端112设置在至少两层电路板12中的两层不同的电路板上；其中，发送端111固定在第一电路板121上；接收端112固定在第二电路板122上；发送端111和接收端112分别设置在第一电路板121和第二电路板122相背离的一侧，即发送端111固定在第一电路板121远离第二电路板122的一侧，接收端112固定在第二电路板122远离第一电路板121的一侧；示例性的，第一电路板121为电路板A、第二电路板122为电路板B，则发送端111可以固定在电路板A远离电路板B的一侧，而接收端112可以固定在电路板B远离电路板A的一侧；即发送端111、接收端112、电路板A和电路板B沿垂直方向的位置顺利可以为发送端111-电路板A-电路板B-接收端112。In the embodiment of the present invention, the sending end 111 and the receiving end 112 are arranged on two different circuit boards in at least two layers of circuit boards 12; wherein, the sending end 111 is fixed on the first circuit board 121; the receiving end 112 is fixed on On the second circuit board 122; the sending end 111 and the receiving end 112 are respectively arranged on the side away from the first circuit board 121 and the second circuit board 122, that is, the sending end 111 is fixed on the first circuit board 121 away from the second circuit board 122, the receiving end 112 is fixed on the side of the second circuit board 122 away from the first circuit board 121; for example, the first circuit board 121 is a circuit board A, and the second circuit board 122 is a circuit board B, then The sending end 111 can be fixed on the side of the circuit board A away from the circuit board B, and the receiving end 112 can be fixed on the side of the circuit board B away from the circuit board A; that is, the sending end 111, the receiving end 112, the circuit board A and the circuit board The position of B along the vertical direction can smoothly be the sending end 111 -circuit board A-circuit board B-receiving end 112 .
本发明实施例中，至少两层电路板12呈层叠结构，即至少两层电路板12中的每层电路板与相邻的电路板重叠放置。其中，每层电路板均包括金属涂层和介电层；介电层由绝缘材料制成，用于保持金属涂层上的线路与各层之间的绝缘性，又称为基材。金属涂层由金属材料镀在介电层上的金属形成，发送端111和接收端112可以通过焊接在金属涂层上，实现与对应的电路板的固定。在实际应用中，金属涂层可以是铜、锡等。且每层电路板可以为一层金属涂层和一层介电层，也可以是两层金属涂层和一层介电层，介电层位于两层金属涂层之间。In the embodiment of the present invention, at least two layers of circuit boards 12 are stacked, that is, each layer of circuit boards in at least two layers of circuit boards 12 overlaps with adjacent circuit boards. Wherein, each layer of the circuit board includes a metal coating and a dielectric layer; the dielectric layer is made of insulating material, used to maintain the insulation between the circuit on the metal coating and each layer, and is also called the base material. The metal coating is formed of a metal plated on the dielectric layer by a metal material, and the sending end 111 and the receiving end 112 can be soldered on the metal coating to achieve fixing with the corresponding circuit board. In practical applications, the metal coating can be copper, tin, etc. And each layer of the circuit board can be one metal coating and one dielectric layer, or two metal coatings and one dielectric layer, and the dielectric layer is located between the two metal coatings.
本发明实施例中，发送端111可以通过与第一电路板121的金属涂层焊接，实现与第一电路板121的固定；接收端112可以通过与第二电路板122的金属涂层焊接，实现与第二电路板122的固定。In the embodiment of the present invention, the sending end 111 can be fixed to the first circuit board 121 by welding with the metal coating of the first circuit board 121; the receiving end 112 can be welded with the metal coating of the second circuit board 122, Realize fixing with the second circuit board 122 .
本发明实施例中，发送端111与第一接地平面连接形成发送回路；接收端112与第二接地平面连接形成接收回路；第一接地平面和第二接地平面设置在至少两层电路板12中不同层的电路板中。第一接地平面和第二接地平面均为GND(Ground，电线接地端)平面；在实际应用中，GND平面可以表征电源的负极。其中，第一接地平面和第二接地平面还可以表征一个接地点，本发明实施例不作限定。In the embodiment of the present invention, the sending end 111 is connected to the first ground plane to form a sending loop; the receiving end 112 is connected to the second ground plane to form a receiving loop; the first ground plane and the second ground plane are arranged in at least two layers of circuit boards 12 different layers of the board. Both the first ground plane and the second ground plane are GND (Ground, wire ground terminal) planes; in practical applications, the GND plane may represent a negative pole of the power supply. Wherein, the first ground plane and the second ground plane may also represent a ground point, which is not limited in this embodiment of the present invention.
本发明实施例中，发送端111可以通过发送端导线与第一接地平面连接，接收端112也可以通过接收端导线与第二接地平面连接；其中，发送端导线和接收端导线可以不相交，以避免发送端111和接收端112在传输信号时发生串扰。In the embodiment of the present invention, the transmitting end 111 may be connected to the first ground plane through the transmitting end wire, and the receiving end 112 may also be connected to the second ground plane through the receiving end wire; wherein, the transmitting end wire and the receiving end wire may not intersect, In order to avoid crosstalk between the sending end 111 and the receiving end 112 when transmitting signals.
本发明实施例中，为保证光收发模块1的尺寸符合预设要求，至少两层电路板12中的每层电路板的厚度可以为1mm；其中，光收发模块1尺寸的预设要求可以是符合QSFP-DD对于尺寸的限制。In the embodiment of the present invention, in order to ensure that the size of the optical transceiver module 1 meets the preset requirements, the thickness of each layer of circuit boards in at least two layers of circuit boards 12 can be 1mm; wherein, the preset requirements of the size of the optical transceiver module 1 can be Comply with the size limit of QSFP-DD.
可以理解的是，第一接地平面和第二接地平面设置在至少两层电路中不同层的电路板上，使得发送端111接地形成的发送回路和接收端112接地形成的接收回路具有一定距离，这样发送端111和接收端112在通过进行信号的传输和转换时，可以减少彼此之间信号的串扰；且由于至少两层电路板12呈层叠结构，可以尽可能的减小光收发模块1的尺寸。It can be understood that the first ground plane and the second ground plane are arranged on circuit boards of different layers in at least two layers of circuits, so that there is a certain distance between the sending loop formed by the sending end 111 being grounded and the receiving loop formed by the receiving end 112 being grounded, In this way, the transmitting end 111 and the receiving end 112 can reduce the crosstalk of signals between each other when transmitting and converting signals; size.
本发明的一些实施例中，第一接地平面设于第一电路板121上，或者设于第一接地板123上；第二接地平面设于第二电路板122上，或者设于第二接地板124上；其中，第一接地板123为至少两层电路板12中与第一电路板121相邻的电路板；第二接地板124为至少两层电路板12中与第二电路板122相邻的电路板。In some embodiments of the present invention, the first ground plane is set on the first circuit board 121, or on the first ground plane 123; the second ground plane is set on the second circuit board 122, or on the second ground plane. On the floor 124; Wherein, the first ground plane 123 is the circuit board adjacent to the first circuit board 121 in at least two layers of circuit boards 12; adjacent circuit boards.
在本发明的一些实施例中，当至少两层电路板12为三层时，第一接地板123和第二接地板124为同一块电路板，此时第一接地平面和第二接地平面分别设于上述电路板的两侧；当至少两层电路板12为四层时，第一接地板123为至少两层电路板12中与第一电路板121相邻的电路板；第二接地板124为至少两层电路板12中与第二电路板122相邻的电路板。In some embodiments of the present invention, when the at least two-layer circuit board 12 has three layers, the first ground plane 123 and the second ground plane 124 are the same circuit board, and the first ground plane and the second ground plane are respectively Located on both sides of the above-mentioned circuit board; when at least two layers of circuit boards 12 are four layers, the first grounding plate 123 is a circuit board adjacent to the first circuit board 121 in at least two layers of circuit boards 12; the second grounding plate 124 is a circuit board adjacent to the second circuit board 122 among at least two circuit boards 12 .
本发明的一些实施例中，第一接地平面设于第一接地板123靠近第一电路板121的一侧；第二接地平面设于第二接地板124靠近第二电路板122的一侧。In some embodiments of the present invention, the first ground plane is disposed on a side of the first ground plane 123 close to the first circuit board 121 ; the second ground plane is disposed on a side of the second ground plane 124 close to the second circuit board 122 .
本发明的一些实施例中，示例性的，至少两层电路板12中的第一电路板121为电路板A、第二电路板122为电路板B、第一接地板123为电路板a、第二接地板124为电路板b；则发送端111固定在电路板A远离电路板B的一侧，且发送端111用于接地的引脚与电路板a靠近电路板A侧的第一接地平面连接；接收端112可以固定在电路板B远离电路板A的一侧，且接收端112用于接地的引脚与电路板b靠近电路板B侧的第二接地平面连接；即发送端111、接收端112、电路板A、电路板B、电路板a和电路板b沿垂直方向的层叠方向可以为：发送端111-电路板A-电路板a-电路板b-电路板B-接收端112。In some embodiments of the present invention, exemplary, the first circuit board 121 in at least two layers of circuit boards 12 is circuit board A, the second circuit board 122 is circuit board B, the first ground plane 123 is circuit board a, The second ground plate 124 is the circuit board b; then the sending end 111 is fixed on the side of the circuit board A away from the circuit board B, and the pin of the sending end 111 for grounding is connected with the first grounding of the circuit board a near the side of the circuit board A Planar connection; the receiving end 112 can be fixed on the side of the circuit board B away from the circuit board A, and the pin used for grounding of the receiving end 112 is connected to the second ground plane on the side of the circuit board b close to the circuit board B; that is, the transmitting end 111 , receiving end 112, circuit board A, circuit board B, circuit board a and circuit board b can be stacked along the vertical direction in the following direction: sending end 111-circuit board A-circuit board a-circuit board b-circuit board B-receiving end 112.
可以理解的是，发送端111与第一接地平面连接，接收端112与第二接地平面连接时，形成的发送回路和接收回路位于不同平面；这样发送端111和接收端112在进行信号传输与转换时，可以减少发送回路和接收回路对彼此信号的影响，从而达到减少光收发模块1的信号的串扰。It can be understood that when the transmitting end 111 is connected to the first ground plane and the receiving end 112 is connected to the second ground plane, the formed sending loop and receiving loop are located on different planes; thus, the sending end 111 and the receiving end 112 are performing signal transmission and During the conversion, the influence of the sending loop and the receiving loop on the signals of each other can be reduced, so as to reduce the crosstalk of the signals of the optical transceiver module 1 .
本发明的一些实施例中，至少两层电路板12还包括：In some embodiments of the present invention, at least two-layer circuit board 12 also includes:
至少一层隔离板125，至少一层隔离板125重叠固定在第一电路板121和第二电路板122之间呈层叠结构。At least one layer of isolation board 125 , at least one layer of isolation board 125 is overlapped and fixed between the first circuit board 121 and the second circuit board 122 to form a laminated structure.
本发明的一些实施例中，至少一层隔离板125固定在第一电路板121和第二电路板122之间，用于增加发送端111和接收端112之间的距离，从而提高发送端111和接收端112的隔离效果。In some embodiments of the present invention, at least one layer of isolation board 125 is fixed between the first circuit board 121 and the second circuit board 122 to increase the distance between the sending end 111 and the receiving end 112, thereby improving the and the isolation effect of the receiving end 112.
本发明的一些实施例中，在实际应用中，可以根据实际需求，在隔离板的金属涂层上设计电路，将发送端111和接收端112与上述电路连接，使得上述光收发模块1传输中的信号可以得到进一步的处理。其中，上述电路可以为放大电路、滤波电路等，本发明实施例不作限定。In some embodiments of the present invention, in practical applications, a circuit can be designed on the metal coating of the isolation plate according to actual needs, and the transmitting end 111 and the receiving end 112 can be connected to the above-mentioned circuit, so that the above-mentioned optical transceiver module 1 transmits The signal can be further processed. Wherein, the above-mentioned circuit may be an amplifier circuit, a filter circuit, etc., which are not limited in this embodiment of the present invention.
本发明的一些实施例中，至少一层隔离板125可以为五层隔离板，五层隔离板固定于第一电路板121和第二电路板122之间；其中，五层隔离板中每相邻的两层隔离板之间，介电层和金属涂层的叠放顺序可以对称叠放。示例性的，第一电路板121为电路板A，第二电路板122为电路板B，第一接地板123为电路板a，第二接地板124为电路板b，五层隔离板依次为隔离板C、隔离板D、隔离板E、隔离板F和隔离板G。则上述光收发模块1沿垂直方向的固定顺序可以为：发送端111-电路板A-电路板a-隔离板C-隔离板D-隔离板E-隔离板F-隔离板G-电路板b-电路板B-接收端112。若电路板A由介电层A1和金属涂层A2构成，电路板B由介电层B1和金属涂层B2构成；电路板a由介电层a1和金属涂层a2构成，电路板b由介电层b1和金属涂层b2构成，隔离板C由介电层C1和金属涂层C2构成，隔离板D由介电层D1和金属涂层D2构成，隔离板E由介电层E1和金属涂层E2构成，隔离板F由介电层F1和金属涂层F2构成，隔离板G由介电层G1和金属涂层G2构成。上述光收发模块1中介电层和金属涂层沿垂直方向的顺序可以为：A2-A1-a2-a1-C2-C1-D2-D1-E2-E1-F1-F2-G1-G2-b1-b2-B1-B2In some embodiments of the present invention, at least one layer of isolation board 125 can be a five-layer isolation board, and the five-layer isolation board is fixed between the first circuit board 121 and the second circuit board 122; wherein, each phase in the five-layer isolation board Between two adjacent isolation boards, the stacking sequence of the dielectric layer and the metal coating can be stacked symmetrically. Exemplarily, the first circuit board 121 is a circuit board A, the second circuit board 122 is a circuit board B, the first ground plane 123 is a circuit board a, the second ground plane 124 is a circuit board b, and the five-layer isolation boards are sequentially Isolation Panel C, Isolation Panel D, Isolation Panel E, Isolation Panel F, and Isolation Panel G. Then the fixed sequence of the above-mentioned optical transceiver module 1 along the vertical direction can be: sending end 111-circuit board A-circuit board a-isolation board C-isolation board D-isolation board E-isolation board F-isolation board G-circuit board b - Circuit board B - Receiver 112 . If circuit board A is composed of dielectric layer A1 and metal coating A2, circuit board B is composed of dielectric layer B1 and metal coating B2; circuit board a is composed of dielectric layer a1 and metal coating a2, and circuit board b is composed of Dielectric layer b1 and metal coating b2, isolation plate C is composed of dielectric layer C1 and metal coating C2, isolation plate D is composed of dielectric layer D1 and metal coating D2, isolation plate E is composed of dielectric layer E1 and metal coating C2 The metal coating E2 is composed, the isolation plate F is composed of the dielectric layer F1 and the metal coating F2, and the isolation plate G is composed of the dielectric layer G1 and the metal coating G2. The order of the dielectric layer and metal coating in the above optical transceiver module 1 along the vertical direction can be: A2-A1-a2-a1-C2-C1-D2-D1-E2-E1-F1-F2-G1-G2-b1- b2-B1-B2
可以理解的是，隔离板可以增加发送端111和接收端112之间的距离，起到对发送端111和接收端112隔离的作用，从而减小上述光收发模块1应用中信号的串扰。It can be understood that the isolation board can increase the distance between the transmitting end 111 and the receiving end 112 to isolate the transmitting end 111 and the receiving end 112, thereby reducing the crosstalk of signals in the application of the above-mentioned optical transceiver module 1 .
本发明的一些实施例中，图3为本发明实施例提供的一种光收发模块的侧面透视图，图4为本发明实施例提供的一种光收发模块的结构示意图二；如图3、4所示；本发明实施例提供的光收发模块1中，至少两层电路板12均设有导通孔16。In some embodiments of the present invention, FIG. 3 is a side perspective view of an optical transceiver module provided by an embodiment of the present invention, and FIG. 4 is a structural schematic diagram II of an optical transceiver module provided by an embodiment of the present invention; 4 ; in the optical transceiver module 1 provided by the embodiment of the present invention, at least two layers of circuit boards 12 are provided with via holes 16 .
本发明的一些实施例中，导通孔16可以为金属孔。发送端111可以通过导线贯穿第一电路板121上的导通孔16，至第一接地板123处与第一接地平面连接；接收端112可以通过导线贯穿第二电路板122上的导通孔16，至第二接地板124处与第二接地平面连接。在实际应用中，若至少一层隔离板125中的其中一层隔离板上蚀刻有处理电路，接收端112的输出端可以通过导线贯穿第二电路板122至上述蚀刻有处理电路的电路板，并与上述处理电路电性连接；这样在接收端112接收光信号后，将光信号转换为电信号并输出后，电信号将会经过上述处理电路并被处理。In some embodiments of the present invention, the via hole 16 may be a metal hole. The transmitting end 111 can pass through the via hole 16 on the first circuit board 121 through a wire, and connect to the first ground plane at the first ground plate 123; the receiving end 112 can pass through the via hole on the second circuit board 122 through a wire 16. Connect to the second ground plane at the second ground plane 124 . In practical applications, if a processing circuit is etched on one of the at least one isolation board 125, the output end of the receiving end 112 can pass through the second circuit board 122 to the above-mentioned circuit board with the processing circuit etched by a wire, And it is electrically connected with the above-mentioned processing circuit; in this way, after the receiving end 112 receives the optical signal, converts the optical signal into an electrical signal and outputs it, the electrical signal will pass through the above-mentioned processing circuit and be processed.
本发明的一些实施例中，当第一电路板121与第一接地板123之间存在至少一层隔离板125时，发送端111利用导线穿过对应的导通孔16与第一接地板123连接；当第二电路板122与第二接地板124之间存在至少一层隔离板125时，接收端112利用导线穿过对应的导通孔16与第二接地板124连接。In some embodiments of the present invention, when there is at least one layer of isolation board 125 between the first circuit board 121 and the first ground plate 123, the transmitting end 111 uses a wire to pass through the corresponding via hole 16 and the first ground plate 123 Connection: when there is at least one layer of isolation board 125 between the second circuit board 122 and the second grounding plate 124 , the receiving end 112 is connected to the second grounding plate 124 through the corresponding via hole 16 by a wire.
可以理解的是，在实际应用过程中，当发送端111或接收端112需要与至少两层电路板12中的目标层电路板连接，则可以利用导线贯穿导通孔16至目标层的电路板以实现连接，这样不需要在至少两层电路板12的外侧走线，可以控制导线之间的距离，减少光收发模块1应用中信号的串扰。It can be understood that, in the actual application process, when the sending end 111 or the receiving end 112 needs to be connected to the target layer circuit board in at least two layers of circuit boards 12, then a wire can be used to pass through the via hole 16 to the target layer circuit board In order to realize the connection, there is no need to route wires on the outside of at least two layers of circuit boards 12 , the distance between the wires can be controlled, and the crosstalk of signals in the application of the optical transceiver module 1 can be reduced.
图5为本发明实施例提供的一种光收发模块的俯视透视图，如图5所示，本发明的一些实施例中，发送端111在第二电路板122上的投影区域与接收端112所在的区域不重叠。FIG. 5 is a top perspective view of an optical transceiver module provided by an embodiment of the present invention. As shown in FIG. The regions in which they are located do not overlap.
本发明的一些实施例中，对发送端111向第二电路板122进行投影，得到对应的投影区域，上述投影区域与接收端112所在的区域不重叠。In some embodiments of the present invention, the transmitting end 111 is projected onto the second circuit board 122 to obtain a corresponding projection area, which does not overlap with the area where the receiving end 112 is located.
可以理解的是，这样可以减小接收端112和发送端111在应用过程中的信号的串扰。It can be understood that this can reduce the crosstalk of the signals of the receiving end 112 and the sending end 111 during application.
本发明的一些实施例中，第二电路板122的外表面上设置有支撑块15，支撑块15贯穿第二电路板122至第一电路板121，发送端111设置在第一电路板121的支撑块15上。In some embodiments of the present invention, a support block 15 is provided on the outer surface of the second circuit board 122, the support block 15 runs through the second circuit board 122 to the first circuit board 121, and the sending end 111 is arranged on the first circuit board 121. on the support block 15.
本发明的一些实施例中，如图3-5所示，第二电路板122上设置有支撑块15，支撑块15贯穿第二电路板122与第一电路板121之间的所有电路板，并贯穿第一电路板121，使得发送端111可以设置在第一电路板121的支撑块15上。其中，支撑块15通过焊接的方式固定在第二电路板122上，而发送端111可以放置于支撑块15远离第二电路板122侧的外表面并与支撑块15的外表面没有固定关系，也可以与支撑块15的外表面固定。In some embodiments of the present invention, as shown in FIGS. 3-5 , the second circuit board 122 is provided with a support block 15 , and the support block 15 runs through all the circuit boards between the second circuit board 122 and the first circuit board 121 , And through the first circuit board 121 , so that the sending end 111 can be arranged on the support block 15 of the first circuit board 121 . Wherein, the support block 15 is fixed on the second circuit board 122 by welding, and the sending end 111 can be placed on the outer surface of the support block 15 away from the second circuit board 122 side and has no fixed relationship with the outer surface of the support block 15, It can also be fixed to the outer surface of the support block 15 .
本发明的一些实施例中，发送端111通过固定件与第一电路板121固定。固定件可以是用于封装的金线，金线的一端与发送端111固定、另一端与第一电路板121固定，即可实现发送端111与第一电路板121的固定。In some embodiments of the present invention, the sending end 111 is fixed to the first circuit board 121 through a fixing member. The fixing member can be a gold wire for packaging, one end of the gold wire is fixed to the sending end 111 , and the other end is fixed to the first circuit board 121 , so that the sending end 111 and the first circuit board 121 can be fixed.
本发明的一些实施例中，支撑块15可以是钨铜块，由于钨铜块的散热性能较好，因此，提高收发器11的散热性能。In some embodiments of the present invention, the supporting block 15 may be a tungsten-copper block. Since the tungsten-copper block has better heat dissipation performance, the heat dissipation performance of the transceiver 11 is improved.
可以理解的是，支撑块15可以起到限位作用，使得至少两层电路板12中被支撑块15贯穿的电路板不易发生位移，提高至少两层电路板12的层叠结构的稳定性。It can be understood that the support block 15 can function as a limit, so that the circuit boards penetrated by the support block 15 among the at least two layers of circuit boards 12 are not easy to be displaced, and the stability of the laminated structure of at least two layers of circuit boards 12 is improved.
本发明的一些实施例中，所以发送端111的第一侧低于或者平齐于第一电路板121的外表面；发送端111的第一侧为平行于第一电路板121，且远离支撑块15的一侧。In some embodiments of the present invention, the first side of the sending end 111 is lower than or flush with the outer surface of the first circuit board 121; the first side of the sending end 111 is parallel to the first circuit board 121 and away from the support Block 15 side.
本发明的一些实施例中，支撑块15贯穿第一电路板121时，支撑块15平行于第一电路板121且位于第一电路板121的一面，与第一电路板121被支撑块15贯穿时形成的通槽的侧表面之间将构成一个凹槽，发送端111设置在第一电路板121的支撑块15上时，发送端111将位于凹槽内。其中，上述凹槽的深度大于或者等于发送端111的厚度，使得发送端111的平行于第一电路板121且远离支撑块15的一侧，低于或者平齐于第一电路板121的外表面。In some embodiments of the present invention, when the support block 15 penetrates the first circuit board 121, the support block 15 is parallel to the first circuit board 121 and is located on one side of the first circuit board 121, and the first circuit board 121 is penetrated by the support block 15. A groove will be formed between the side surfaces of the through groove formed during the process, and when the sending end 111 is arranged on the support block 15 of the first circuit board 121, the sending end 111 will be located in the groove. Wherein, the depth of the groove is greater than or equal to the thickness of the transmitting end 111, so that the side of the transmitting end 111 parallel to the first circuit board 121 and away from the support block 15 is lower than or flush with the outer surface of the first circuit board 121. surface.
可以理解的是，发送端111的第一侧面不凸出第一电路板121，一方面可以减小光收发模块1的尺寸，另一方面，在实际应用中，不易碰触到发送端111，可以降低发送端111被毁坏的概率，从而延长发送端111的使用寿命。It can be understood that the first side of the transmitting end 111 does not protrude from the first circuit board 121. On the one hand, the size of the optical transceiver module 1 can be reduced. On the other hand, in practical applications, it is difficult to touch the transmitting end 111. The probability of the sending end 111 being destroyed can be reduced, thereby prolonging the service life of the sending end 111 .
本发明的一些实施例中，接收端112包括N个端口；N个端口分别设置在第二电路板122上的支撑块15的两侧，或者，N个端口均设置在第二电路板122上的支撑块15的一侧。In some embodiments of the present invention, the receiving end 112 includes N ports; the N ports are respectively arranged on both sides of the support block 15 on the second circuit board 122, or, the N ports are all arranged on the second circuit board 122 One side of the support block 15.
本发明的一些实施例中，N可以是任意一个正整数；当N为1时，接收端112包括一个端口，上述一个端口设于第二电路板122上的支撑块15的一侧；当N大于或等于2时，接收端112包括多个端口，上述多个端口设于第二电路板122上的支撑块15的两侧；或者，设于第二电路板122上的支撑块15的任意侧。本发明实施例不作限定。In some embodiments of the present invention, N can be any positive integer; when N is 1, the receiving end 112 includes a port, and the above-mentioned port is set on one side of the support block 15 on the second circuit board 122; when N When greater than or equal to 2, the receiving end 112 includes a plurality of ports, and the above-mentioned multiple ports are arranged on both sides of the support block 15 on the second circuit board 122; side. The embodiments of the present invention are not limited.
本发明的一些实施例中，如图5所示，示例性的，接收端112可以包括2个端口，其中，2个端口中的每个端口均设有个4通道，接收端112可以通过2个端口上的8个通道接收光信号，对应地，发送端111应该设有8个通道用于接收电信号；当接收端112和发送端111共计16个通道中每个通道的信号速率均为100G bit/s，该光收发模块1为800G光收发模块。In some embodiments of the present invention, as shown in FIG. 5 , for example, the receiving end 112 may include 2 ports, wherein each of the 2 ports is provided with 4 channels, and the receiving end 112 may pass through 2 The 8 channels on each port receive optical signals, and correspondingly, the transmitting end 111 should be provided with 8 channels for receiving electrical signals; when the receiving end 112 and the transmitting end 111 have a total of 16 channels, the signal rate of each channel is 100G bit/s, the optical transceiver module 1 is an 800G optical transceiver module.
可以理解的是，接收端112的端口设于支撑块15的侧面，可以达到发送端111在第二电路板122上投影的投影区域，与接收端112在第二电路板122上的区域不重叠的目的，从而减小接收端112和发送端111在应用过程中的信号的串扰。It can be understood that the port of the receiving end 112 is arranged on the side of the support block 15, which can reach the projected area of the transmitting end 111 on the second circuit board 122, and does not overlap with the area of the receiving end 112 on the second circuit board 122. The purpose of this is to reduce the signal crosstalk between the receiving end 112 and the sending end 111 during the application process.
本发明的一些实施例中，第一电路板121为至少两层电路板12中的第一层电路板，第二电路板122为至少两层电路板12中的最后一层电路板。In some embodiments of the present invention, the first circuit board 121 is the first circuit board in the at least two circuit boards 12 , and the second circuit board 122 is the last circuit board in the at least two circuit boards 12 .
本发明的一些实施例中，至少两层电路板12中，除第一电路板121和第二电路板122之外的所有电路板，均设置在第一电路板121和第二电路板122之间。In some embodiments of the present invention, among at least two circuit boards 12, all circuit boards except the first circuit board 121 and the second circuit board 122 are arranged between the first circuit board 121 and the second circuit board 122 between.
可以理解的是，这样可以最大程度的增加发送端111和接收端112之间的距离，减小接收端112和发送端111在应用过程中的信号的串扰。It can be understood that, in this way, the distance between the sending end 111 and the receiving end 112 can be increased to the greatest extent, and the crosstalk of the signals of the receiving end 112 and the sending end 111 in the application process can be reduced.
本发明的一些实施例中，发送端111通过第一导线1111与数字信号处理模块2连接，接收端112通过第二导线1121与数字信号处理模块2连接；其中，第一导线1111与第二导线1121分别设置在至少两层电路板12中不同层的电路板中，或者贯穿至少两层电路板12上的导通孔16至数字信号处理模块2。In some embodiments of the present invention, the sending end 111 is connected to the digital signal processing module 2 through the first wire 1111, and the receiving end 112 is connected to the digital signal processing module 2 through the second wire 1121; wherein, the first wire 1111 is connected to the second wire 1121 are respectively arranged in circuit boards of different layers in the at least two-layer circuit boards 12 , or pass through the via holes 16 on the at least two-layer circuit boards 12 to the digital signal processing module 2 .
本发明的一些实施例中，示例性的，数字信号处理模块2设置在至少两层电路板12中的任意一层电路板上，或者设置在至少两层电路板12之外的电路板上时，发送端111可以通过第一导线1111贯穿导通孔16至数字信号处理模块2所在的电路板，并与数字信号处理模块2连接；接收端112可以通过第二导线1121贯穿导通孔16至数字信号处理模块2所在的电路板，并与数字信号处理模块2连接；其中，第一导线1111与第二导线1121应该贯穿不同层的电路板上的导通孔16至数字信号处理模块2所在的电路板。In some embodiments of the present invention, for example, the digital signal processing module 2 is disposed on any one of the at least two circuit boards 12, or when disposed on a circuit board other than the at least two circuit boards 12 , the sending end 111 can pass through the via hole 16 to the circuit board where the digital signal processing module 2 is located through the first wire 1111, and be connected to the digital signal processing module 2; the receiving end 112 can pass through the via hole 16 to the The circuit board where the digital signal processing module 2 is located, and is connected to the digital signal processing module 2; wherein, the first wire 1111 and the second wire 1121 should pass through the via hole 16 on the circuit board of different layers to where the digital signal processing module 2 is located circuit board.
可以理解的是，这样可以避免第一导线1111与第二导线1121相交，减小接收端112和发送端111的信号的串扰。It can be understood that, in this way, the intersection of the first wire 1111 and the second wire 1121 can be avoided, and the crosstalk of the signals of the receiving end 112 and the sending end 111 can be reduced.
本发明的一些实施例中，第一导线1111设置在第一电路板121的外表面，第二导线1121贯穿至少两层电路板12上的导通孔16至数字信号处理模块2；或者，In some embodiments of the present invention, the first wire 1111 is arranged on the outer surface of the first circuit board 121, and the second wire 1121 runs through the via holes 16 on at least two layers of the circuit board 12 to the digital signal processing module 2; or,
第二导线1121设置在第二电路板122的外表面，第一导线1111贯穿至少两层电路板12上的导通孔16至数字信号处理模块2。The second wire 1121 is disposed on the outer surface of the second circuit board 122 , and the first wire 1111 passes through the via holes 16 on at least two layers of the circuit board 12 to the digital signal processing module 2 .
本发明的一些实施例中，如图3所示，当数字信号处理模块2设置在第一电路板121上时，发送端111通过第一导线1111与数字信号处理模块2连接，接收端112通过第二导线1121贯穿至少两层电路板12上的导通孔16至第一电路板121并与数字信号处理模块2。In some embodiments of the present invention, as shown in FIG. 3, when the digital signal processing module 2 is arranged on the first circuit board 121, the transmitting end 111 is connected to the digital signal processing module 2 through the first wire 1111, and the receiving end 112 is connected to the digital signal processing module 2 through the first wire 1111. The second wire 1121 passes through the via holes 16 on at least two layers of circuit boards 12 to the first circuit board 121 and connects with the digital signal processing module 2 .
本发明的一些实施例中，当数字信号处理模块2设置在第二电路板122上时，接收端112通过第二导线1121与数字信号处理模块2连接，发送端111通过第一导线1111贯穿至少两层电路板12上的导通孔16至第二电路板122并与数字信号处理模块2。In some embodiments of the present invention, when the digital signal processing module 2 is arranged on the second circuit board 122, the receiving end 112 is connected to the digital signal processing module 2 through the second wire 1121, and the sending end 111 passes through at least The via hole 16 on the two-layer circuit board 12 is connected to the second circuit board 122 and connected to the digital signal processing module 2 .
本发明的一些实施例中，第一导线1111可以通过使用夹具或绝缘子固定在第一电路板121上，第二导线1121可以通过使用夹具或绝缘子固定在第二电路板122上，以阻止第一导线1111和第二导线1121的移动。其中，第一电路板121和第二电路板122的外表面可以设置防焊油墨层，避免第一导线1111破损与第一电路板121的金属涂层接触发生短路，或者，第二导线1121破损与第二电路板122的金属涂层接触发生短路。In some embodiments of the present invention, the first wire 1111 can be fixed on the first circuit board 121 by using a clamp or an insulator, and the second wire 1121 can be fixed on the second circuit board 122 by using a clamp or an insulator, so as to prevent the first Movement of the wire 1111 and the second wire 1121. Wherein, the outer surfaces of the first circuit board 121 and the second circuit board 122 can be provided with a solder resist ink layer to prevent the first wire 1111 from being damaged and short-circuited in contact with the metal coating of the first circuit board 121, or that the second wire 1121 is damaged A short circuit occurs in contact with the metal coating of the second circuit board 122 .
可以理解的是，第一导线1111和第二导线1121位于不同的平面，可以减少接收端112和发送端111的信号的串扰。It can be understood that the first conductive wire 1111 and the second conductive wire 1121 are located on different planes, which can reduce the crosstalk of the signals of the receiving end 112 and the sending end 111 .
本发明的一些实施例中，基于图6，图6为本发明实施例提供的一种光收发模块的结构示意图三，如图6所示，本发明实施例提供的光收发模块1包括：In some embodiments of the present invention, based on FIG. 6, FIG. 6 is a schematic structural diagram of an optical transceiver module provided in an embodiment of the present invention III. As shown in FIG. 6, the optical transceiver module 1 provided in the embodiment of the present invention includes:
印制电路板(Printed Circuit Board，PCB)；Printed Circuit Board (PCB);
焊接于PCB的BOTTOM面(第二电路板122)的钨铜块(支撑块15)，钨铜块贯穿PCB至PCB的TOP面(第一电路板121)；PCB的TOP面固定有DSP单元(数字信号处理模块2)；Welded on the tungsten copper block (support block 15) of the BOTTOM face (second circuit board 122) of PCB, the tungsten copper block runs through the TOP face (first circuit board 121) of PCB to PCB; The TOP face of PCB is fixed with DSP unit ( Digital signal processing module 2);
rx(receive，接收)端的rx走线(第二导线1121)，固定在PCB的BOTTOM面；The rx wiring (second wire 1121) at the rx (receive, receiving) end is fixed on the BOTTOM surface of the PCB;
tx(transport,发送)端的tx走线(第一导线1111)，固定在PCB的TOP面；The tx wiring (first wire 1111) at the tx (transport, sending) end is fixed on the TOP surface of the PCB;
tx端(发送端111)，放置于钨铜块上，通过金线(固定件)和tx走线在PCB的TOP面相连；The tx end (sending end 111) is placed on the tungsten copper block, and connected to the TOP surface of the PCB through the gold wire (fixer) and the tx wire;
rx端(接收端112)，固定于PCB的BOTTOM面。The rx end (the receiving end 112 ) is fixed on the BOTTOM surface of the PCB.
在本发明的一些实施例中，PCB的层叠结构包括10层1mm板厚的子PCB，且10层子PCB沿垂直方向依次层叠。其中，第一层子PCB为PCB的TOP面，第十层子PCB为PCB的BOTTOM面；第二层子PCB靠近第一次子PCB一侧，以及第九层子PCB靠近第十层子PCB一侧均设有GND平面(第一接地平面、第二接地平面)，即第二层子PCB为第一接地板123，第九层子PCB均为第二接地板124。In some embodiments of the present invention, the stacked structure of the PCB includes 10 layers of sub-PCBs with a thickness of 1 mm, and the 10 layers of sub-PCBs are stacked in sequence along the vertical direction. Among them, the first sub-PCB is the TOP side of the PCB, the tenth sub-PCB is the BOTTOM side of the PCB; the second sub-PCB is close to the side of the first sub-PCB, and the ninth sub-PCB is close to the tenth sub-PCB Both sides are provided with GND planes (first ground plane, second ground plane), that is, the second sub-PCB is the first ground plane 123 , and the ninth sub-PCB is the second ground plane 124 .
本发明的一些实施例中，tx端放置在钨铜块上与TOP面的外表面平齐，tx走线在PCB的TOP面；rx端放置在PCB的BOTTOM面，rx走线在PCB的BOTTOM面；tx端、rx端在PCB垂直投影方向上无重合且分别属于PCB的TOP面和BOTTOM面，起到减少tx端、rx端的高速信号的串扰的作用。In some embodiments of the present invention, the tx end is placed on the tungsten copper block and is flush with the outer surface of the TOP surface, and the tx wiring is on the TOP surface of the PCB; the rx end is placed on the BOTTOM surface of the PCB, and the rx wiring is on the BOTTOM of the PCB. The tx end and the rx end have no overlap in the vertical projection direction of the PCB and belong to the TOP surface and the BOTTOM surface of the PCB respectively, which can reduce the crosstalk of the high-speed signals at the tx end and the rx end.
可以理解的是，本发明实施例通过将tx端、rx端分别固定在PCB中的TOP面和BOTTOM面，使得tx端和rx端之间具有一定距离，且结合tx端、rx端在PCB垂直投影方向上无重合且分别属于PCB的TOP面和BOTTOM面的布局，以及GND平面的设计，达到在保证光收发模块1的尺寸满足预设尺寸的同时，减少高速信号串扰目的。It can be understood that in the embodiment of the present invention, by fixing the tx end and the rx end on the TOP surface and the BOTTOM surface of the PCB respectively, there is a certain distance between the tx end and the rx end, and the combination of the tx end and the rx end is vertical to the PCB. There is no overlap in the projection direction and the layout of the TOP and BOTTOM planes of the PCB, as well as the design of the GND plane, achieve the purpose of reducing high-speed signal crosstalk while ensuring that the size of the optical transceiver module 1 meets the preset size.
图7为本发明实施例提供的一种光收发装置的结构框图，如图7所示，本发明实施例还提供一种光收发装置5，装置5包括本发明实施例的光收发模块1、数字信号处理模块2、电器件3和光器件4；其中，Fig. 7 is a structural block diagram of an optical transceiver device provided by an embodiment of the present invention. As shown in Fig. 7, an embodiment of the present invention also provides an optical transceiver device 5, and the device 5 includes the optical transceiver module 1, Digital signal processing module 2, electrical device 3 and optical device 4; wherein,
电器件3与数字信号处理模块2耦接，数字信号处理模块2与光收发模块1耦接，光收发模块1与光器件4耦接；The electrical device 3 is coupled to the digital signal processing module 2, the digital signal processing module 2 is coupled to the optical transceiver module 1, and the optical transceiver module 1 is coupled to the optical device 4;
数字信号处理模块2，用于将电器件3发送的电信号进行处理以得到待转换电信号，将待转换电信号发送至光收发模块1中的发送端111，以便发送端111将待转换电信号转换为目标光信号；The digital signal processing module 2 is used to process the electrical signal sent by the electrical device 3 to obtain an electrical signal to be converted, and send the electrical signal to be converted to the sending end 111 in the optical transceiver module 1, so that the sending end 111 converts the electrical signal to be converted The signal is converted into the target optical signal;
或者，将光收发模块1中接收端112发送的电信号转换为目标电信号，将目标电信号发送至电器件3；Or, converting the electrical signal sent by the receiving end 112 in the optical transceiver module 1 into a target electrical signal, and sending the target electrical signal to the electrical device 3;
光器件4，用于接收发送端111发送的目标光信号，或者发送光信号至接收端112；The optical device 4 is used to receive the target optical signal sent by the sending end 111, or send the optical signal to the receiving end 112;
电器件3，用于接收数字信号处理模块2发送的目标电信号，或者发送电信号至数字信号处理模块2。The electrical device 3 is configured to receive the target electrical signal sent by the digital signal processing module 2 , or send the electrical signal to the digital signal processing module 2 .
本发明实施例中，电器件3用于接收或输出电信号，光器件4用于接收或输出光信号，在实际应用中，当电器件3需要进行远距离数据传输时，电器件3将需要发出的信息携带于电信号中，并将电信号输出至数字信号处理模块2，数字信号处理模块2接收到电器件3发送的电信号后，对电信号进行处理以得到待转换电信号，并将待转换电信号发送至光收发模块1中的发送端111，发送端111接收到上述待转换电信号后，将上述待转换电信号转换为对应的目标光信号，即可发送目标光信号至光器件4，光器件4通过目标光信号即可获取到电器件3需要发出的信息。当光器件4需要对电器件3进行信息传输时，光器件4将需要发出的信息携带于光信号中，并将光信号输出至光收发模块1中的接收端112，接收端112接收到光信号后，将上述光信号转换为电信号，并发送电信号至数字信号处理模块2，数字信号处理模块2接收到接收端112发出的电信号后，对电信号进行处理以得到目标电信号，将目标电信号发送至电器件3，电器件3器件通过目标电信号即可获取到光器件4需要发出的信息。In the embodiment of the present invention, the electrical device 3 is used to receive or output electrical signals, and the optical device 4 is used to receive or output optical signals. In practical applications, when the electrical device 3 needs to perform long-distance data transmission, the electrical device 3 will need The sent information is carried in the electrical signal, and the electrical signal is output to the digital signal processing module 2. After the digital signal processing module 2 receives the electrical signal sent by the electrical device 3, it processes the electrical signal to obtain the electrical signal to be converted, and Send the electrical signal to be converted to the transmitting end 111 in the optical transceiver module 1. After receiving the electrical signal to be converted, the transmitting end 111 converts the electrical signal to be converted into a corresponding target optical signal, and then the target optical signal can be sent to The optical device 4, the optical device 4 can obtain the information to be sent by the electrical device 3 through the target optical signal. When the optical device 4 needs to transmit information to the electrical device 3, the optical device 4 carries the information to be sent in the optical signal, and outputs the optical signal to the receiving end 112 in the optical transceiver module 1, and the receiving end 112 receives the light After receiving the signal, the above-mentioned optical signal is converted into an electrical signal, and the electrical signal is sent to the digital signal processing module 2. After the digital signal processing module 2 receives the electrical signal sent by the receiving end 112, it processes the electrical signal to obtain the target electrical signal. The target electrical signal is sent to the electrical device 3, and the electrical device 3 can obtain the information to be sent by the optical device 4 through the target electrical signal.
可以理解的是，由于该光收发模块1的信号的串扰较小，因此，上述光收发装置5通过光收发模块1进行信号传输时，提高了信号传输质量，从而提升光收发装置的性能指标。It can be understood that, since the signal crosstalk of the optical transceiver module 1 is small, when the optical transceiver device 5 transmits signals through the optical transceiver module 1, the signal transmission quality is improved, thereby improving the performance index of the optical transceiver device.
本发明的一些实施例中，数字信号处理模块2设置在第一电路板121上，第二电路板122利用第二导线1121贯穿至少两层电路板12上的导通孔16至第一电路板121，与数字信号处理模块2连接。In some embodiments of the present invention, the digital signal processing module 2 is arranged on the first circuit board 121, and the second circuit board 122 uses the second wire 1121 to pass through the via holes 16 on at least two layers of circuit boards 12 to the first circuit board. 121, connected to the digital signal processing module 2.
本发明的一些实施例中，当数字信号处理模块2设置在第一电路板121上时，通过第一导线1111与数字信号处理端112通过第二导121贯穿至少两层电路板12上的导通孔16至第一电路板121并与数字信号处理模块2。In some embodiments of the present invention, when the digital signal processing module 2 is arranged on the first circuit board 121, the first wire 1111 and the digital signal processing terminal 112 pass through the wires on at least two layers of the circuit board 12 through the second wire 121. The through hole 16 is connected to the first circuit board 121 and connected to the digital signal processing module 2 .
本发明的一些实施例中，数字信号处理模块2设置在第二电路板122上，第一电路板121利用第一导线1111贯穿至少两层电路板12上的导通孔16至第二电路板122，与数字信号处理模块2连接。In some embodiments of the present invention, the digital signal processing module 2 is arranged on the second circuit board 122, and the first circuit board 121 uses the first wire 1111 to penetrate through the via holes 16 on at least two layers of circuit boards 12 to the second circuit board 122, connected to the digital signal processing module 2.
可以理解的是，接收端112和发送端111与数字信号处理模块2连接时，第一导线1111和第二导线1121位于不同的平面，可以减少接收端112和发送端111中信号的串扰。It can be understood that when the receiving end 112 and the transmitting end 111 are connected to the digital signal processing module 2, the first wire 1111 and the second wire 1121 are located on different planes, which can reduce the crosstalk of signals in the receiving end 112 and the sending end 111.
应理解，说明书通篇中提到的“一个实施例”或“一实施例”或“一些实施例”或“另一些实施例”意味着与实施例有关的特定特征、结构或特性包括在本发明的至少一个实施例中。因此，在整个说明书各处出现的“在一个实施例中”或“在一实施例中”或“在一些实施例中”或“在另一些实施例中”未必一定指相同的实施例。此外，这些特定的特征、结构或特性可以任意适合的方式结合在一个或多个实施例中。应理解，在本发明的各种实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本发明实施例的实施过程构成任何限定。上述本发明实施例序号仅仅为了描述，不代表实施例的优劣。上文对各个实施例的描述倾向于强调各个实施例之间的不同之处，其相同或相似之处可以互相参考，为了简洁，本文不再赘述。It should be understood that references throughout this specification to "one embodiment" or "an embodiment" or "some embodiments" or "other embodiments" mean that specific features, structures, or characteristics related to the embodiments are included in the present disclosure. In at least one embodiment of the invention. Thus, appearances of "in one embodiment" or "in an embodiment" or "in some embodiments" or "in other embodiments" throughout this specification are not necessarily referring to the same embodiments. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that in various embodiments of the present invention, the sequence numbers of the above-mentioned processes do not mean the order of execution, and the execution order of each process should be determined by its functions and internal logic, rather than by the embodiment of the present invention. The implementation process constitutes any limitation. The serial numbers of the above embodiments of the present invention are for description only, and do not represent the advantages and disadvantages of the embodiments. The above descriptions of the various embodiments tend to emphasize the differences between the various embodiments, the same or similar points can be referred to each other, and for the sake of brevity, details are not repeated herein.
本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如对象A和/或对象B，可以表示：单独存在对象A，同时存在对象A和对象B，单独存在对象B这三种情况。The term "and/or" in this article is just an association relationship describing associated objects, which means that there can be three relationships, such as object A and/or object B, which can mean: object A exists alone, and object A and object exist at the same time B, there are three situations of object B alone.
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that, in this document, the term "comprising", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article or apparatus comprising that element.
在本发明所提供的几个实施例中，应该理解到，所揭露的设备，可以通过其它的方式实现。以上所描述的实施例仅仅是示意性的，例如，所述模块的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，如：多个模块或组件可以结合，或可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的各组成部分相互之间的耦合、或直接耦合、或通信连接可以是通过一些接口，设备或模块的间接耦合或通信连接，可以是电性的、机械的或其它形式的。In the several embodiments provided by the present invention, it should be understood that the disclosed device can be implemented in other ways. The above-described embodiments are only illustrative. For example, the division of the modules is only a logical function division. In actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or can be Integrate into another system, or some features may be ignored, or not implemented. In addition, the mutual coupling, or direct coupling, or communication connection between the various components shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or modules may be in electrical, mechanical or other forms of.
本发明所提供的几个产品实施例中所揭露的特征，在不冲突的情况下可以任意组合，得到新的产品实施例。The features disclosed in several product embodiments provided by the present invention can be combined arbitrarily without conflict to obtain new product embodiments.
以上所述，仅为本发明的实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。The above is only the embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present invention. covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210016626.6ACN116449505A (en) | 2022-01-07 | 2022-01-07 | Optical transceiver module and optical transceiver device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210016626.6ACN116449505A (en) | 2022-01-07 | 2022-01-07 | Optical transceiver module and optical transceiver device |
| Publication Number | Publication Date |
|---|---|
| CN116449505Atrue CN116449505A (en) | 2023-07-18 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210016626.6APendingCN116449505A (en) | 2022-01-07 | 2022-01-07 | Optical transceiver module and optical transceiver device |
| Country | Link |
|---|---|
| CN (1) | CN116449505A (en) |
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| CN110865441A (en)* | 2018-08-27 | 2020-03-06 | 苏州旭创科技有限公司 | Optical module |
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| US20020033979A1 (en)* | 1999-05-27 | 2002-03-21 | Edwin Dair | Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
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| CN213366570U (en)* | 2018-03-23 | 2021-06-04 | 株式会社村田制作所 | High-frequency module and communication device |
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